Integrated tool lift

Abstract

To provide a novel device and system for moving components of a semiconductor processing tool for maintenance, check, and repair.SOLUTION: A tool 100 includes an upper support framework 114, a plurality of semiconductor processing chambers 104 arranged along a first axis 106, a linear guide system 120 fixedly supported by the upper support framework and extending along a second axis 124 substantially parallel to the first axis, and a carriage 122. The carriage includes a hoist arm 130 configured to pivot about a vertical axis that is substantially perpendicular to the second axis, and the carriage is configured to movably engage with the linear guide system and translate along the second axis relative to the linear guide system. The carriage and the hoist arm are movable such that a hoist feature engagement interface of the hoist arm can be moved to engage with hoisting features of any of the removable top covers 118.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] (Cross - Reference to Related Applications) The PCT application form is submitted simultaneously with this specification as part of this application. Each application for which this application claims benefit or priority, as identified by the PCT application form submitted simultaneously, is hereby incorporated by reference in its entirety as if fully set forth herein.

Background Art

[0002] Many semiconductor processing tools have large and heavy components that are removed during maintenance, inspection, and repair.

Summary of the Invention

[0003] This specification describes novel apparatus and systems for moving components of semiconductor processing tools for maintenance, inspection, and repair. These tools may have a number of semiconductor processing chambers arranged in a linear array, mounted directly or indirectly on the tool's support framework. Many components of the semiconductor processing chambers are conventionally lifted and moved using conventional hoisting equipment, such as cranes or forklifts, which are separate from the tool and fully supported by the floor. However, some tools described herein have a hoisting system for moving removable components integrated within the tool itself. In some implementations, the hoisting system may include a linear guide system that extends along the linear array of semiconductor processing chambers, mounted directly or indirectly on the support framework. Connected to and supported by the linear guide system may be a movable carriage having movable hoisting arms that can contact any of the components of the semiconductor processing chambers and lift and move them, and the carriage and its hoisting arms can move along the linear guide system so that together the hoisting arms can contact any of the removable components in the semiconductor processing chambers and move them. The hoisting arm and removable components may have complementary connection features that allow the hoisting arm to contact the removable components and lift them. When the carriage lifts a removable component, the weight of the removable component is fully transferred to the support framework through the hoisting arm, carriage, and linear guide system. In some embodiments, the carriage may hang down from the linear guide system, for example, below the linear guide system or to the side of the linear guide system.

[0004] In some implementations, a person may move the carriage along a linear guidance system and further move the hoisting arm into a position where it contacts removable components. In some such implementations, motors may power various aspects of the carriage, such as a hoisting mechanism on the carriage that raises and lowers the hoisting arm. In some other embodiments, motors and other moving mechanisms may move the carriage along a linear guidance system and / or move the hoisting arm horizontally and / or vertically. A controller having a processor and memory can control the movement of the carriage and the hoisting arm.

[0005] In some alternative embodiments, the tool may have a hoisting system distinct from the carriage and linear guidance system. These alternative embodiments use a detachable hoisting system connected to one or more attachment points connected to a support framework. This detachable hoisting system has a vertical member positioned on the floor, supported by the floor, and connected to attachment points on the support framework to provide lateral support to the vertical member. The detachable hoisting system also includes a movably attached hoisting arm that, when the vertical member is connected to one or more attachment points, can connect to and lift one of the removable components in the semiconductor processing chamber. In some embodiments, the detachable hoisting system, except for its hoisting arm, is stationary when connected to one or more attachment points, while in some other embodiments, the detachable hoisting system and the attachment points to which it is connected are simultaneously movable along the array of semiconductor processing chambers.

[0006] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include an upper support framework, a first plurality of semiconductor processing chambers arranged along a first axis, a first linear guidance system extending along a second axis substantially parallel to the first axis and fixedly supported by the upper support framework, and a first carriage. Each semiconductor processing chamber may have a base portion fixedly mounted to an upper support framework, and may have a removable upper cover with one or more hoisting features, the first carriage may include a first hoisting arm with one or more links, the first hoisting arm may be configured to pivot about a vertical axis substantially perpendicular to a second axis, the first carriage may be configured to movably engage with a first linear guidance system and to translate along a second axis relative to the first linear guidance system, the first hoisting arm may include a hoisting feature engagement interface configured to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, and the first carriage and the first hoisting arm may be movable so that the hoisting feature engagement interface can be moved to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers.

[0007] In some embodiments, the first carriage may further include a first vertical translation system configured to translate the first hoisting arm perpendicular to the first linear guidance system and parallel to the vertical axis.

[0008] In some such embodiments, the semiconductor processing tool may further include a power supply. The first vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input may translate a first hoisting arm vertically, in a direction parallel to the vertical axis, the first carriage may further include an electrical control cable connected to the power supply and routed along the first hoisting arm and terminated by a connector, each removable upper cover may further include an electrical interface configured to be connectable to a connector, the electrical control cable may be of a length such that the connector and the hoisting feature engagement interface of the first hoisting arm engage with only one electrical interface and hoisting feature in the semiconductor processing chamber at a time.

[0009] In some other such embodiments, the semiconductor processing tool may further include a controller having one or more processors and one or more non-temporary memory elements, the one or more non-temporary memory elements controlling one or more processors to receive information regarding the operating state of each semiconductor processing chamber and storing instructions via an electrical interface to cause one of the semiconductor processing chambers to provide a first actuation signal to operate a first vertical translation system only when the information regarding the operating state of that semiconductor processing chamber indicates that the semiconductor processing chamber is in a human-safe state.

[0010] In some other such embodiments, the semiconductor processing tool may further include a first carriage position sensor configured to generate data relating to the position of a first carriage along a first linear induction system, and a controller comprising one or more processors and one or more non-temporary memory elements, the one or more non-temporary memory elements which control one or more processors to determine the position of the first carriage along the first linear induction system based on the data generated by the first carriage position sensor, and store instructions to supply power to the electrical interface of only one of a first plurality of semiconductor processing chambers at a time, based on the determination of the position of the first carriage.

[0011] In some other embodiments, the semiconductor processing tool may further include an arm position sensor configured to generate data relating to the position of a first hoisting arm relative to a semiconductor processing chamber in a first plurality of semiconductor processing chambers, and one or more non-temporary memory elements further store instructions to control one or more processors to determine the position of the first hoisting arm relative to each of the semiconductor processing chambers in the first plurality of semiconductor processing chambers based on the data generated by the arm position sensor, and to supply power only to the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that is closest to the hoisting feature engagement interface of the first hoisting arm, based on the determination of the position of the first hoisting arm and the determination of the position of the first carriage.

[0012] In some other embodiments, one or more non-temporary memory elements may further store instructions for controlling one or more processors to move the first hoisting arm through the first carriage and only on the first side of a vertical plane parallel to the vertical axis and perpendicular to the second axis.

[0013] In some other such embodiments, the semiconductor processing tool may further include an engagement sensor configured to generate data relating to whether a hoisting feature in a removable upper cover has engaged with a hoisting feature engagement interface of a first hoisting arm, and a controller comprising one or more processors and one or more non-temporary memory elements, the one or more non-temporary memory elements controlling one or more processors to determine, based on the data generated by the engagement sensor, whether a hoisting feature in a removable upper cover of a first plurality of semiconductor processing chambers has engaged with a hoisting feature engagement interface of a first hoisting arm, and storing instructions to supply power only to the electrical interfaces of the semiconductor processing chambers in the first plurality of semiconductor processing chambers encompassing the removable upper cover in response to the determination that a hoisting feature in a removable upper cover of a first plurality of semiconductor processing chambers has engaged with a hoisting feature engagement interface.

[0014] In some other such embodiments, a removable top cover may receive power from a power source through an electrical cable.

[0015] In some such embodiments, the first carriage may further include a first interlock configured to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, so as not to engage with one of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, thereby preventing the first vertical translation system from translating the first hoisting arm vertically.

[0016] In some such embodiments, the first vertical translation system may be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winding device.

[0017] In some such embodiments, the semiconductor processing tool may further include a controller comprising one or more processors and one or more non-temporary memory elements. The first linear induction system may further include a carriage translation system configured to translate a first carriage along a second axis, the first carriage may further include a hoist arm movement system configured to move a first hoist arm in a plane perpendicular to the vertical axis, and one or more non-temporary memory elements control one or more processors to cause the carriage translation system to move the first carriage along the second axis, and the hoist arm translation system and the first vertical translation system to move the first hoist arm to one of the removable upper covers of a first plurality of semiconductor processing chambers. Commands may be stored to engage the hoisting feature with the hoisting feature engagement interface, to move the removable upper cover vertically to the first vertical translation system when one hoisting feature in the removable upper cover engages with the hoisting feature engagement interface, to move the removable upper cover to the first vertical translation system when one hoisting feature in the removable upper cover engages with the hoisting feature engagement interface, and to move the removable upper cover in a plane perpendicular to the vertical axis to the hoisting arm movement system when one hoisting feature in the removable upper cover engages with the hoisting feature engagement interface.

[0018] In some other such embodiments, one or more non-temporary memory elements may further store instructions for controlling one or more processors to move the first hoisting arm to disengage the hoisting feature engagement interface from the hoisting feature of the removable upper cover when the hoisting feature engagement interface engages with a hoisting feature in the removable upper cover.

[0019] In some other such embodiments, one or more non-temporary memory elements may further store instructions for one or more processors to move the removable upper cover in a plane perpendicular to the vertical axis when a hoisting feature in the removable upper cover engages with the hoisting feature engagement interface, to the carriage translation system and the hoisting arm movement system.

[0020] In some embodiments, the semiconductor processing chambers in the first plurality of semiconductor processing chambers may all be located inside the tool envelope surface, and the first hoisting arm may be movable so that any of the removable upper covers of the first plurality of semiconductor processing chambers can be moved outside the tool envelope surface.

[0021] In some embodiments, the first linear guidance system may further include a first rail and a second rail that are parallel to each other and offset from each other in directions parallel to the vertical axis, and the first carriage may be configured to engage simultaneously with the first rail and the second rail and to translate along the second axis relative to the first linear guidance system while engaged simultaneously with the first rail and the second rail.

[0022] In some such embodiments, the first carriage may further include a first vertical translation system configured to translate the first hoisting arm perpendicular to the first linear guidance system and parallel to the vertical axis, below the first linear guidance system and above the first plurality of semiconductor processing chambers.

[0023] In some other such embodiments, the first vertical translation system may be further configured to vertically translate the first hoisting arm above the first linear guidance system.

[0024] In some embodiments, the first linear guidance system may be vertically offset above the first plurality of semiconductor processing chambers in a direction parallel to the vertical axis, and the first carriage may be vertically offset directly below the first linear guidance system.

[0025] In some embodiments, the winch feature engagement interface may be connected to the distal end of the first winch arm using a joint configured to allow the winch feature engagement interface to rotate about two or more axes perpendicular to the vertical axis.

[0026] In some such embodiments, the joint may be a spherical joint.

[0027] In some such embodiments, the joint may be further configured to allow the winch feature engagement interface to rotate about an axis parallel to the vertical axis.

[0028] In some embodiments, the winch feature of each removable upper cover may include a pair of saddle posts, each saddle post including a pair of vertical riser rods and a saddle plate defining an upper limit of the vertical riser rods and extending between the vertical riser rods, each saddle plate may include a first mechanical interface feature, the saddle posts of each winch feature may be positioned to dispose the first mechanical interface features at a first distance apart from each other, the winch feature engagement interface may include a beam with two second mechanical interface features disposed at the first distance apart, and each first mechanical interface feature may be complementary to one of the second mechanical interface features.

[0029] In some embodiments, each semiconductor processing chamber among the first plurality of semiconductor processing chambers may include removable components that may be a radio frequency (RF) generator, a pump, and a cryopump. Each removable component may include one or more second lifting features, and the lifting feature engagement interface of the first lifting arm may be further configured to engage with any of the second lifting features of the removable components of the first plurality of semiconductor processing chambers. The first carriage and the first lifting arm may be movable such that the lifting feature engagement interface can be moved to engage with any of the second lifting features of the removable components of the first plurality of semiconductor processing chambers.

[0030] In some embodiments, the first lifting arm may include a linear section that includes a lifting feature engagement interface perpendicular to a vertical axis.

[0031] In some such embodiments, the first lifting arm may include a pivot section configured to pivot about the vertical axis, and may include a section that forms an angle oriented at an oblique angle with respect to the vertical axis and extends between the pivot section and the linear section.

[0032] In some embodiments, the first plurality of semiconductor processing chambers may include two semiconductor processing chambers.

[0033] In some such embodiments, the first plurality of semiconductor processing chambers may include three semiconductor processing chambers.

[0034] In some other such embodiments, the first plurality of semiconductor processing chambers includes five semiconductor processing chambers.

[0035] In some embodiments, the semiconductor processing tool may further include a second plurality of semiconductor processing chambers arranged along a third axis offset from the first axis and substantially parallel to the first axis; an internal region positioned between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers; a second linear guidance system fixedly supported by an upper support framework and extending along a fourth axis substantially parallel to the third axis; and a second carriage. The first and second linear guidance systems may be positioned outside the internal region, and each semiconductor processing chamber in the second plurality of semiconductor processing chambers may have a second base portion fixedly mounted to the upper support framework and a second removable upper cover with one or more second hoisting features; the second carriage may include a second hoisting arm with one or more links, the second hoisting arm may be configured to pivot about a second vertical axis perpendicular to the fourth axis; and the second carriage may be movably engaged with the second linear guidance system. The second carriage and the second hoisting arm may be configured to translate along a fourth axis with respect to a second linear guidance system, and the second hoisting arm may include a second hoisting feature engagement interface configured to engage with any second hoisting feature in a second removable upper cover of a semiconductor processing chamber in a second plurality of semiconductor processing chambers, and the second carriage and the second hoisting arm may be movable so that the second hoisting feature engagement interface can be moved to engage with any hoisting feature in a second removable upper cover of a semiconductor processing chamber in a second plurality of semiconductor processing chambers.

[0036] In some such embodiments, the base portions of the first plurality of semiconductor processing chambers, the second base portions of the second plurality of semiconductor processing chambers, and the internal regions may all be located inside a second envelope plane, the first hoisting arm may be movable to move any of the removable upper covers in the first plurality of semiconductor processing chambers outside the second envelope plane, and the second hoisting arm may be movable to move any of the second removable upper covers in the second plurality of semiconductor processing chambers outside the second envelope plane.

[0037] In some such embodiments, the second removable upper cover may be of the same type as the removable upper cover, the second hoisting feature engagement interface may be of the same type as the hoisting feature engagement interface, and the second hoisting feature may be of the same type as the hoisting feature.

[0038] In some embodiments, the semiconductor processing tool may further include a bellows that creates a seal at the interface between the first carriage and the first linear guide system when the first carriage engages with the first linear guide system.

[0039] In some embodiments, the semiconductor processing tool may further include a second carriage. The second carriage may include a second hoisting arm with one or more links, the second hoisting arm configured to pivot about a second vertical axis perpendicular to the second axis, the second carriage may be configured to movably engage with the first linear guidance system and to translate along the second axis relative to the first linear guidance system, the second hoisting arm may include a second hoisting feature engagement interface configured to engage with any hoisting feature in any of the removable upper covers of the first plurality of semiconductor processing chambers, the second carriage and the second hoisting arm may be movable so that the second hoisting feature engagement interface of the second hoisting arm can be moved to engage with any of the hoisting features in any of the removable upper covers of the first plurality of semiconductor processing chambers, and the first linear guidance system may be further configured so that the first carriage and the second carriage can be simultaneously engaged with the first linear guidance system and be movable along the second axis.

[0040] In some embodiments, the removable top cover does not have to be a circuit board.

[0041] In some embodiments, the first hoisting arm does not need to be configured to support the substrate.

[0042] In some such embodiments, the winding feature engagement interface does not need to be configured to support the substrate.

[0043] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include a support framework, a first plurality of semiconductor processing chambers arranged along a first axis, a first attachment point connected to the support framework, and a first detachable hoisting system. Each semiconductor processing chamber may have a base portion fixedly mounted to the support framework and a removable upper cover with one or more hoisting features. The first detachable hoisting system may include a vertical member having an upper end with complementary attachment points and a lower end with a moving mechanism, the complementary attachment points may be detachably connected to the first attachment points, the moving mechanism may be supported by a floor, and the first detachable hoisting system may further include a hoisting arm having one or more links connected to the vertical member, the hoisting arm may be configured to pivot about a vertical axis substantially perpendicular to the first axis, and the hoisting arm may include a hoisting feature engagement interface configured to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers.

[0044] In some embodiments, the first separable hoisting system may further include a vertical translation system configured to translate the hoisting arm in a direction perpendicular to the support framework and parallel to the vertical axis.

[0045] In some such embodiments, the first vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input causing a hoisting arm to translate along a vertical member.

[0046] In some such embodiments, the first vertical translation system may be configured to move together with the hoisting arm as a single unit along the vertical member.

[0047] In some embodiments, the moving mechanism may include foldable wheels.

[0048] In some embodiments, a semiconductor processing tool may be provided. The semiconductor processing tool may include a support framework having an upper attachment point, a lower attachment point vertically offset below the upper attachment point, a first plurality of semiconductor processing chambers arranged along a first axis, and a detachable hoisting system. Each semiconductor processing chamber may have a base portion fixedly mounted to the support framework and have a removable component with one or more hoisting features, and the detachable hoisting system may include an upper end having a high attachment point, a lower end having a lowest attachment point, and a vertical member with a moving mechanism, the high attachment point may be detachably connected to the upper attachment point, the lowest attachment point may be detachably connected to the lower attachment point, and the detachable hoisting system may further include a hoisting arm having one or more links configured to pivot about a vertical axis substantially perpendicular to the first axis, and a vertical translation system configured to translate the hoisting arm perpendicular to the support framework and parallel to the vertical axis. The hoisting arm may include a hoisting feature engagement interface configured to engage with a hoisting feature in any of the removable components of a first plurality of semiconductor processing chambers.

[0049] In some embodiments, the vertical translation system may include a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input causing the hoisting arm to translate in a direction parallel to the vertical axis.

[0050] In some such embodiments, the semiconductor processing tool may further include a power supply. The detachable hoisting system may further include an electrical control cable connected to the power supply, routed along the hoisting arm, and terminated by a connector, and each detachable component may further include an electrical interface configured to be connectable to a connector, and the electrical control cable may be of a length such that the connector and the hoisting feature engagement interface of the hoisting arm engage with only one electrical interface and hoisting feature of the semiconductor processing chamber at a time.

[0051] In some other such embodiments, the semiconductor processing tool may further include a controller comprising one or more processors and one or more non-temporary memory elements, the one or more non-temporary memory elements controlling one or more processors to receive information regarding the operating state of each semiconductor processing chamber and storing instructions via an electrical interface to cause one of the semiconductor processing chambers to provide a first actuation signal to operate the vertical translation system only when the information regarding the operating state of that semiconductor processing chamber indicates that the semiconductor processing chamber is in a human-safe state.

[0052] In some other such embodiments, a removable component may receive power from a power source through an electrical cable.

[0053] In some such embodiments, the vertical translation system may be a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winding device.

[0054] In some such embodiments, the separable system may further include a first interlock configured to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, so as not to engage with one of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, thereby preventing the first vertical translation system from translating the first hoisting arm vertically.

[0055] In some embodiments, the moving mechanism may include four wheels.

[0056] In some embodiments, the moving mechanism may include a set of foldable wheels.

[0057] In some embodiments, the first vertical translation system may be configured to move together with the hoisting arm as a single unit along the vertical member.

[0058] In some such embodiments, the vertical member may further include a slide rail configured to move the first vertical translation system.

[0059] In some embodiments, the moving mechanism does not need to be supported by the floor when connected to the lower and upper attachment points.

[0060] In some embodiments, the moving mechanism may be supported by the floor when connected to the lower and upper attachment points.

[0061] In some embodiments, the lower attachment point may be vertically offset below the base portion of the multiple processing chambers.

[0062] In some embodiments, the support framework may further include a plurality of upper attachment points, the tool may further include a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers may include N processing chambers, the plurality of upper attachment points may include N-1 upper attachment points, and the plurality of lower attachment points may include N-1 lower attachment points.

[0063] In some embodiments, the hoisting arm may further include three or more links, a double shoulder joint, and a double elbow joint.

[0064] In some embodiments, the removable component does not have to be a substrate.

[0065] In some embodiments, the hoisting arm does not need to be configured to support the substrate.

[0066] In some such embodiments, the winding feature engagement interface does not need to be configured to support the substrate.

[0067] In this specification, various implementations disclosed herein are illustrated, not as limitations, but as examples, in the form of figures in the accompanying drawings, where similar reference numerals refer to similar elements. [Brief explanation of the drawing]

[0068] [Figure 1] A schematic top view of an example of a semiconductor processing tool including two or more semiconductor processing chambers is drawn.

[0069] [Figure 2] A perspective view of the first example, a portion of the semiconductor processing tool shown in Figure 1, is drawn.

[0070] [Figure 3] A detailed perspective view of a portion of an example semiconductor tool is drawn in Figure 2.

[0071] [Figure 4A] A cross-sectional view of a portion of the first example of the hoisting arm in Figure 3 is drawn. [Figure 4B] Draw an off-angle view of an example of the removable top cover shown in Figure 3.

[0072] [Figure 5] Draw the same detailed perspective view of a portion of the tool in Figure 3.

[0073] [Figure 6A] Figure 2 illustrates the sequence of movement of a removable component example, a part of the semiconductor tool example shown in Figure 2. [Figure 6B] Figure 2 illustrates the sequence of movement of a removable component example, a part of the semiconductor tool example shown in Figure 2. [Figure 6C] Figure 2 illustrates the sequence of movement of a removable component example, a part of the semiconductor tool example shown in Figure 2. [Figure 6D] Figure 2 illustrates the sequence of movement of a removable component example, a part of the semiconductor tool example shown in Figure 2. [Figure 6E] Figure 2 illustrates the sequence of movement of a removable component example, a part of the semiconductor tool example shown in Figure 2.

[0074] [Figure 7] An example of a hoisting arm is shown.

[0075] [Figure 8] Draw a perspective view of a second alternative example, a portion of the tool schematic diagram in Figure 1.

[0076] [Figure 9] Draw an enlarged portion of Figure 8.

[0077] [Figure 10] Figures 6A–6E illustrate an example of a tool similar to those shown, having two first carriages engaged with one linear guidance system.

[0078] [Figure 11] Figure 1 shows a schematic diagram of a semiconductor processing tool, and an example of such a tool is depicted in a top view, illustrating additional details and features.

[0079] [Figure 12] Figure 6E shows a top view of an example of a semiconductor processing tool, along with additional features.

[0080] [Figure 13] A partial configuration diagram of semiconductor processing tool example 1200 is drawn.

[0081] [Figure 14] Let's illustrate another example of a semiconductor processing tool.

[0082] [Figure 15A] Figure 14 shows a side view of another example of the semiconductor processing tool and a first example of a separable hoisting system. [Figure 15B] Figure 14 shows a side view of another example of the semiconductor processing tool and a first example of a separable hoisting system.

[0083] [Figure 16] Draw a perspective view of a second example of a detachable hoisting system.

[0084] [Figure 17] Let's illustrate yet another example of a semiconductor processing tool.

[0085] [Figure 18A] A side view of the adhesion sequence between the tool and a second example of a separable hoisting system in Figures 16 and 17 is drawn. [Figure 18B] A side view of the adhesion sequence between the tool and a second example of a separable hoisting system in Figures 16 and 17 is drawn.

[0086] [Figure 19] Figures 17-18B show perspective views of a second example of a detachable hoisting system connected to the tools.

[0087] [Figure 20A] The sequence of motion of an example of a removable component in a second example of a separable hoisting system is illustrated. [Figure 20B] The sequence of motion of an example of a removable component in a second example of a separable hoisting system is illustrated.

[0088] [Figure 21] Figure 16 illustrates another configuration of the second example of the detachable hoisting system. [Modes for carrying out the invention]

[0089] The following description includes numerous specific details to enable a full understanding of the embodiments presented. The disclosed embodiments may be implemented without some or all of these specific details. In other examples, well-known processing operations were not described in detail to avoid unnecessarily obscuring the disclosed embodiments. While the disclosed embodiments are described in relation to specific embodiments, it should be understood that they are not intended to be limiting.

[0090] A semiconductor processing tool typically has at least one processing chamber in which processing of one or more substrates is carried out, along with other component parts that enable the processing. Examples of substrate processing include not only the deposition of material onto a substrate using chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), and atomic layer deposition (ALD), but also patterning and etching of various materials, including conductors, semiconductors, and dielectrics, using, for example, atomic layer etching (ALE). In this application, the terms “semiconductor wafer,” “wafer,” “substrate,” “wafer substrate,” and “partially fabricated integrated circuit” are used interchangeably. For example, the operation of depositing a film on a semiconductor substrate may be carried out in a substrate processing apparatus having a processing chamber with a single substrate holder in an internal volume which may be maintained under vacuum by a vacuum pump. The substrate holder, for example, a pedestal, may have heating elements which may heat the pedestal and the substrate. Also, a gas delivery system and showerhead are fluidly connected to the chamber for delivering (for example) film precursors, carrier gases and / or purge gases and / or processing gases, secondary reactants, etc. Equipment for generating plasma within the processing chamber, such as an RF power supply and matching network for supplying power to the plasma, may also be included in the apparatus. Plasma energy may be controlled by controlling one or more of the following (e.g., via a system controller having appropriate machine-readable commands): processing station pressure, gas concentration, RF power supply, RF source frequency, and plasma power pulse timing. The RF power supply may provide RF power at any appropriate frequency and may be configured to control high-frequency and low-frequency RF power supplies independently of each other, including frequencies between 50 kHz and 500 kHz and between 1.8 MHz and 2.45 GHz.

[0091] Many substrate processing systems use a single processing chamber, and while film deposition operations that require significant time are involved, it can be advantageous to increase substrate processing throughput by performing multiple substrate operations in parallel on multiple substrates. For this purpose, a multi-station substrate processing system may have a single substrate processing chamber with multiple substrate processing stations within a single internal volume defined by the walls of the processing chamber. Some other multi-station substrate processing systems may have multiple processing chambers, sometimes referred to as a "cluster tool." A cluster tool may have processing chambers with multiple stations, such as two, three, or four stations within each processing chamber. Similarly, a cluster tool may have two, three, four, five, six, seven, eight, nine, ten, eleven, twelfth, thirteen, fourteen, fifteen, or sixteen or more processing chambers.

[0092] With respect to equipment and operating costs, various efficiencies may be further achieved by using a tool that includes multiple chambers, i.e., a cluster tool. For example, a single vacuum pump may be used to create a single high vacuum environment for two or more processing chambers, and a single vacuum pump may also be used to evacuate used processing gases, etc., for two or more chambers. Depending on the embodiment, the processing chambers may share the same gas delivery system, and certain elements of the plasma generator equipment may be shared between the processing chambers (e.g., power supply). In some cluster tools, the multiple processing chambers are connected not only to the wafer transfer system but also to other components for performing deposition, etching, or other operations, such as vacuum pumps and gas delivery systems. The wafer transfer system may include a robotic arm with one or more end effectors configured to select and transfer wafers within the tool, including into and out of the processing chambers, and into and out of wafer containers such as cassettes or FOUPs (Front Opening Unified Pods). A single cluster tool may be able to perform multiple processes simultaneously in multiple chambers while sharing some of the operating systems, such as gas delivery systems and power generators.

[0093] Using cluster tools can also provide various efficiencies, such as space and throughput. Generally speaking, multiple cluster tools are positioned on the floor of a semiconductor manufacturing plant or facility ("Fab"). However, positioning tools on the floor relative to one another is subject to numerous constraints, such as electrical separation zones and inspection zones between tools. Inspection zones for tools may include areas required to remove elements of the tool (e.g., pumps, upper covers of processing chambers), to perform maintenance on the tool, to add or replace parts of the tool, to access areas of the tool, and to inspect the tool, and may be defined at least in part according to ergonomics or other industry standards, such as to comply with OSHA (Occupational Safety and Health Administration) requirements, and electrical separation zones may include areas required for the safety of persons or equipment, and areas required to prevent electrical interference between one or more elements of adjacent tools.

[0094] The numerous chambers of each cluster tool may also be arranged to maximize the number of chambers positioned on the Fab floor, which may further allow for higher throughput of substrates processed. For example, cluster tools may be densely packed so that their components are positioned close to each other, resulting in limited space and spacing between components. Densely packing the components of a cluster tool presents challenges to performing tool maintenance and inspection operations, such as limiting the ability to access and move the tool components, which may be required for many maintenance and inspection operations. For many densely packed tools, the positioning and arrangement of the tool components may prevent conventional hoisting mechanisms from accessing and moving the components. For example, this access may be obstructed by components mounted side by side and close together, by components stacked on top of each other, and by tool support components such as support frames. The denser the arrangement, the more limited the space for accessing and moving the tool components. In some applications, conventional lifting mechanisms must move one or more components of a tool in order to connect to, lift, and move one component of the tool, while accommodating the access and separation distance of conventional lifting mechanisms. For example, it is generally necessary to remove the top cover of a processing chamber in order to inspect, examine, repair, and maintain the internal elements of the processing chamber. For some densely packed tools, some conventional lifting mechanisms cannot reach the top cover without removing other components surrounding the top cover, such as a heavy RF generator mounted above the top cover. Even when access to the top cover is possible, the support frame may further obstruct conventional lifting mechanisms from reaching the top cover.

[0095] Similarly, a tool may not have sufficient space across its entire surface, below, or inside the tool to allow a conventional lifting mechanism to access its components. For example, some conventional lifting mechanisms are supported on the floor by long horizontal support legs that may slide below a semiconductor processing tool (similar to how a pallet jack may slide below a shipping pallet) and be hoisted up using one or more lifting arms, but some tightly packed tools may not have sufficient space to accommodate the support legs or lifting arms of such a mechanism necessary for accessing and moving its removable components.

[0096] Furthermore, the footprint of some conventional lifting mechanisms can negatively impact how close tools can be positioned to each other, i.e., the separation distance between tools. For example, some tools may need to be separated by only a first minimum distance, providing all the necessary space for sufficient spacing, and thus allowing some tools to be positioned as close together as possible to maximize the use of floor space in the Fab. However, some conventional lifting mechanisms that move on and are supported by the floor may have a footprint that can be larger than the first minimum distance. In these examples, tools may need to be separated by a distance greater than the first minimum distance in order for these conventional lifting mechanisms to move and operate, thereby reducing the spatial efficiency of tool placement on the Fab floor.

[0097] These conventional lifting mechanisms may also require additional time and effort to access and move the tool's components, even if it is possible to access and move them. Additionally, when it is necessary to move other components outside of the access path to a component, moving, removing, and reinstalling these other components may require additional realignment and recalibration. This additional time and effort for routine, essential maintenance and inspection results in undesirable tool downtime. Therefore, it is desirable to have a tool with a lifting mechanism that allows easy, rapid, and efficient access to the tool's components without requiring an undesirable amount of time, effort, and tool downtime.

[0098] This specification describes novel apparatuses and systems for moving components of semiconductor processing tools or cluster tools, which are all referred to herein as tools. In some embodiments, features configured to move the components of the tool are integrated into the tool itself. Figure 1 shows a schematic top view of an example of a semiconductor processing tool including two plurality of semiconductor processing chambers. As can be seen in Figure 1, the tool 100 includes a first plurality of semiconductor processing chambers 102 having five semiconductor processing chambers 104 arranged along a first axis 106, and the second plurality of semiconductor processing chambers 108 includes five processing chambers 110 arranged along an axis 112 which is substantially parallel to the first axis 106. The use of “substantially” herein is because the axes or other elements do not actually need to be precisely aligned, and in this example, substantially these axes may be precisely parallel to each other, but furthermore in the example they may be parallel to each other within a range of ±10°, ±5°, or ±1°. Each of the semiconductor processing chambers contains five processing chambers, but in examples there may be two, three, four, five, six, or more processing chambers. Tool 100 also includes an upper support framework 114 to which portions of each of the semiconductor processing chambers 104 and 110 may be fixedly mounted. When one item is “fixedly mounted” to another item, this means that the item is mounted to the other item in a fixed position relative to the other item, either directly or through one or more intermediary components, such as support brackets. For example, portions of each of the semiconductor processing chambers 104 and 110 are fixedly mounted to the upper support framework 114 such that these portions are fixed to the upper support framework 114 in the corresponding positions of those portions. Other portions of the semiconductor processing chamber 104 may be intended to be removable / movable relative to the upper support framework 114 during periodic inspection operations, as will be discussed further below.

[0099] As described above, tool 100 has an inspection area 115 surrounding the area occupied by tool 100, where no part of other tools should be positioned, and a similar inspection area may exist on the opposite side of tool 100 (but this is not shown). This inspection area 115 can also be thought of as a separation distance between other tools, allowing people and equipment to move between them. Some embodiments of the tools described herein do little to no increase in the static area occupied by the tool.

[0100] Tool 100 may also include a linear guidance system and a carriage configured to facilitate and enable the removal and movement of removable components of the semiconductor processing chamber. In some implementations, as will be discussed in more detail below, the linear guidance system may be fixedly connected to a support framework, and the carriage may be movably connected to the linear guidance system and configured to be movably connected to the removable components of the semiconductor processing chamber, thereby enabling the carriage to translate along the linear guidance system to access, connect to, and move the removable components of the semiconductor processing chamber.

[0101] Figure 2 shows a perspective view of a first example, a part of the semiconductor processing tool example shown in Figure 1. In this figure, a first set of semiconductor processing chambers 102 are identified, but for illustrative purposes only, the base portions 116 of each of the five semiconductor processing chambers 104 are shown, in addition to the removable top cover 118 of one semiconductor processing chamber 104A, shown in a removed state (the remaining top covers of the other semiconductor processing chambers 104 are not shown). Although the interface between each base portion 116 and the upper support framework 114 is not visible, each base portion 116 of the semiconductor processing chamber 104 may be mounted to the upper support framework 114 directly or indirectly. The base portions 116 may be mounted to the upper support framework 114 by any known means such as bolts, welds, fasteners, or pins.

[0102] Figure 2 also depicts the first linear guidance system 120 and the first carriage 122, which are further depicted in Figure 3 and discussed below. The first carriage 122 is enclosed by a dotted line for illustrative purposes. The first linear guidance system 120 may be fixed and supported by or mounted on the upper support framework 114, which may involve fixing or connecting the first linear guidance system 120 directly or indirectly to the upper support framework 114 so that the first linear guidance system 120 is fixed to the upper support framework 114 at a certain point. The first linear guidance system 120 may also be arranged to extend along a second axis 124 substantially parallel to the first axis 106 (substantially meaning that these axes may be exactly parallel to each other, or parallel to each other within a range of ±10°, ±5°, or ±1°).

[0103] The first carriage 122 is configured to movably engage with the first linear guide system 120 so that it can translate along the second axis 124. This configuration may include the first linear guide system 120, which supports the first carriage 122 and allows the first carriage 122 to move along the first linear guide system 120 within its range. For example, the first carriage 122 may have wheels or bearings that can be received by one or more rails or slots of the first linear guide system 120, thereby causing the first linear guide system 120 to support the first carriage 122, and allowing the first carriage 122 to move along the first linear guide system 120 and the second axis 124 by rotating or sliding, etc. In some embodiments, the movable engagement between the first carriage 122 and the first linear guidance system 120 may be passive, allowing a person to manually move the first carriage 122 along the first linear guidance system 120. In other embodiments described below, this movable engagement may be powered by a carriage translation system that can push the first carriage 122 along the first linear guidance system 120.

[0104] Figure 3 shows a detailed perspective view of a portion of the semiconductor tool example shown in Figure 2. In Figure 3, a portion of the first linear guide system 120, the first carriage 122, and a removable upper cover 118 are visible. The first linear guide system 120 extends along the second shaft 124 and is visible to include two rails 126A and 126B, within the two rails 126A and 126B, the wheels or bearings of the first carriage 122 are movably engaged so that the first linear guide system 120 supports the first carriage 122 and the first carriage 122 can move along the second shaft 124 as indicated by the double-sided arrows 128.

[0105] Next, we will discuss yet another feature of the first carriage 122. In some implementations, the first carriage may include a first hoisting arm having one or more links and configured to pivot about a vertical axis. In Figure 3, the first carriage 122 includes a first hoisting arm 130 having a single link 132. The first hoisting arm 130 is configured to pivot about a vertical axis 134 with respect to a first linear guide system 120 or upper support framework 114, as indicated by arrow 136 in the example, and the vertical axis 134 is substantially perpendicular to a second axis 124 (substantially perpendicular in this case means that these axes are actually perpendicular, or in the example perpendicular to each other within a range of at least ±10°, ±5°, or ±1°). The ability of the first hoisting arm 130 to pivot makes it possible to move the first hoisting arm 130 into at least partially a number of positions in order to engage with the components of the semiconductor processing chamber so as to move these components. The first hoisting arm 130 is also connected to the first carriage 122 so as to move together with the first carriage 122.

[0106] The first hoisting arm and the removable component are configured to connect to each other so that the removable component can be lifted, lowered, and moved by the first carriage while supported by the first carriage. In some implementations, this configuration includes the first hoisting arm having a hoisting feature engagement interface configured to engage with the hoisting feature of the removable component, and this engagement between the hoisting feature engagement interface and the hoisting feature creates a connection between the first hoisting arm and the removable component, allowing the first hoisting arm and the first carriage to lift, lower, and support the removable component.

[0107] Some examples of suitable hoisting feature engagement interfaces and hoisting features, as well as their physical connections to each other (i.e., engagements to each other), may be conventional lifting and connecting elements, such as lifting hooks or holes, hoisting rings, shackles, screw connections between elements, pins and holes, rotary latches, and cables, straps, or chains. For example, the hoisting feature of a removable component may be a lifting hook connected to the removable component, the hoisting feature engagement interface may be a cable connected to a first hoisting arm, and the engagement between the hoisting feature of the removable component and the hoisting feature engagement interface may be a cable and lifting hook connected together (e.g., by bolts or screws). This connects the first hoisting arm to the removable component, thereby enabling the first hoisting arm to lift, lower, and move the removable component.

[0108] In some embodiments, the hoisting feature engagement interface may have a first structure configured to engage with a hoisting feature, which is a second structure of a removable component connected to the end of a first hoisting arm. For example, as shown in Figure 3, the first hoisting arm 130 includes a hoisting feature engagement interface which is a first structure 138, i.e., a beam 138, connected to the end 140 of the first hoisting arm 130, and the removable component or removable upper end hoisting feature, i.e., a removable upper cover 118 (in some embodiments, this may also be considered a removable upper plate or removable upper end) is a second structure 142A and 142B. The first structure 138 may engage with the second structures 142A and 142B in a variety of ways, such as by pinning, bolting, gripping, or screwing together.

[0109] In some implementations, the hoisting feature engagement interface may have mechanical features configured to engage with complementary mechanical features of the hoisting feature. For example, Figure 4A shows a partial cross-sectional view of an example of the first hoisting arm in Figure 3, and Figure 4B shows an off-angle view of an example of a removable upper cover in Figure 3. In Figure 4A, the beam, i.e., the first structure 138 of the hoisting feature engagement interface, includes two first mechanical interface features, depicted as holes 144A and 144B, spaced apart by a first distance 146. These first mechanical interface features are complementary to the second mechanical interface features of the hoisting feature of the removable upper cover 118. In Figure 4B, the hoisting feature of the removable upper cover 118, i.e., the second structures 142A and 142B, sometimes referred to herein as saddle posts, are enclosed within dashed shapes. Each second structure includes a pair of vertical riser rods 148A and 148B, and saddle plates 150A and 150B that extend between each pair of vertical riser rods 148A and 148B with an upper limit. Each saddle plate 150A and 150B may also include second mechanical interface features 151A and 151B, which are depicted as pins, and these second mechanical interface features 152 may be separated by a first distance 146. Based on these feature configurations, the second mechanical interface features 151A and 151B can be inserted into the first mechanical features of the hoisting feature engagement interface, i.e., holes 144A and 144B in the beam 138, which may be considered as engagement between the hoisting feature engagement interface and the hoisting features of the removable components. Alternatively, the pins may be located on the hoisting beam and the holes on the saddle plates.

[0110] In some embodiments, the first structure 138 of the hoisting feature engagement interface may also include a post perpendicular to the beam, similar to one of the vertical riser rods 148A, which can be connected not only to the beam but also to a removable component using hooks, fasteners, bolts, etc. In some such implementations, the hoisting feature may be a hole, a threaded hole, or other connection feature that can be connected to the hoisting feature engagement interface.

[0111] The first carriage and the first hoisting arm are also movable so as to move the hoisting feature engagement interface and engage with any of the hoisting features among the removable components. This mobility includes, referring back to Figure 2, the mobility of the first carriage 122 along the second axis 124 so that the first carriage 122 may be near or in the vicinity of any one of the semiconductor processing chambers 104, and, referring back to Figure 3, the ability of the first hoisting arm 130 to rotate around the vertical axis 134. By rotating the first hoisting arm 130 about the vertical axis 134, the first hoisting arm 130 is made able to move in a plane perpendicular to the vertical axis 134, as will be discussed in more detail below.

[0112] The mobility of the first hoisting arm 130 may also include the mobility of the hoisting feature engagement interface. The hoisting feature engagement interface may be rotatable about one or more axes. Returning to Figure 4A, the hoisting feature engagement interface is enclosed by a dotted line shape 152 and connected to a single link 132 of the first hoisting arm 130 at a coupling 158. A vertical axis 134, an axis parallel to the vertical axis 160, and two other axes 154 and 156 perpendicular to axis 160 are depicted in Figures 4A and 5. The coupling 158 to which the hoisting feature engagement interface 152 connects to the link 132 of the first hoisting arm 130 may be configured so that the hoisting feature engagement interface 152 can rotate about one or more of these axes, including the vertical axis 134 and the two other axes 154 and 156 in this particular example, with respect to the first link 132. For example, the hoisting feature engagement interface 152 may rotate with respect to link 132 around axis 156 at coupling 158, and further with respect to link 132 around axis 160 parallel to vertical axis 134. In some examples, the coupling to which the hoisting feature engagement interface 152 connects to link 132 of the first hoisting arm 130 may be a spherical coupling. This spherical coupling may facilitate planar alignment and may allow partial gimbling around an axis parallel to the vertical axis. This spherical coupling may be advantageous because it allows alignment of the chamber lid relative to the chamber when the chamber and chamber lid are not aligned. In some examples, some moving axes may be lockable, using spring plungers, pins, screws, or fasteners, to prevent movement around a locked axis.

[0113] In some embodiments, the first carriage may include a vertical translation system configured to translate the hoisting arm perpendicular to a first linear guide system or upper support framework. This vertical movement of the hoisting arm may further enable the first carriage to engage with removable components of a semiconductor processing chamber, lifting and lowering them. In Figure 5, which draws the same detailed perspective view of a portion of the tool in Figure 3, the vertical translation system 162 is enclosed by a dotted line shape. The vertical translation system 162 is configured to translate the first hoisting arm 130 perpendicularly along a second vertical axis parallel to the vertical axis 134, and such translation is illustrated using double arrows 164. Returning to Figures 4A and 4B, the vertical translation system 162 may position the hoisting feature engagement interface 152 directly below the second mechanical interface features 151A and 151B, i.e., the pins, and then allow the second mechanical interface features 151A and 151B to be inserted into the first mechanical interface features, i.e., holes 144A and 144B, respectively, thereby enabling them to move vertically upward to engage the hoisting feature of the removable upper cover 118 with the hoisting feature engagement interface 152. When the hoisting feature engagement interface 152 and the hoisting feature of the removable upper cover are engaged, the hoisting Features The removable upper cover may be raised and lowered by the vertical translation system 162 without risk of the engagement interface 152 being disconnected.

[0114] The vertical translation system 162 may utilize various mechanisms for translating the first hoisting arm 130 in the vertical direction. For example, the vertical translation system 162 may be a linear ball screw actuator, a hydraulic actuator, a screw actuator, a rack and pinion actuator, or a cable hoisting device. The vertical translation system 162 may also include a motor 166 configured to provide mechanical input to the vertical translation system 162. For example, the motor 166 may provide mechanical driving force to one of the actuators, such as a linear ball screw actuator.

[0115] In some embodiments, the tool may include one or more bellows to seal the linear guidance system and some parts of the first carriage to prevent contamination by particulate matter and other substances generated by these movable features, which may be harmful to the substrate and other aspects of the tool. The interface between the linear guidance system and the first carriage may be one of the movable components that may generate contaminants, and it may be advantageous to include bellows surrounding this interface between the linear guidance system and the first carriage to create a seal at this interface. A vertical translation system may also have bellows because this system may generate contaminants.

[0116] The first carriage, the first hoisting arm, or both may also be movable to move a removable component engaged with the first hoisting arm. As described above, when the hoisting feature of the removable component engages with the hoisting feature engagement interface of the first hoisting arm, the first carriage may be configured to translate the removable component vertically in a direction parallel to the vertical axis 134, as illustrated in Figure 5. Additionally, the first carriage may be configured to move the removable component engaged with the first hoisting arm horizontally or in one or more directions within a plane perpendicular to the vertical axis 134. Figures 6A–6E illustrate the sequence of motion of an example of a removable component in a first example, a part of the semiconductor tool example of Figure 2. These figures are simplified top views of the tool in Figure 2 without the upper support framework for illustrative purposes, viewed at an angle parallel to the vertical axis in Figures 3 and 5, so that the vertical axis extends inward perpendicular to the page. In this case, the first linear guidance system 120 includes two rails 126A and 126B and extends along the second axis 124. The first carriage 122 is movably engaged with the first linear guidance system 120 so that it can translate along the second axis 124. The first multiple semiconductor processing chambers 102 are also visible, along with the base portion 116 of these semiconductor processing chambers, the first hoisting arm 130, the link 132, and the first hoisting feature engagement interface 152 engaged with the second structures 142A and 142B of the hoisting features, i.e., the removable upper cover 118.

[0117] As shown in Figures 6A to 6E, the first hoisting arm 130, link 132, first hoisting feature engagement interface 152, first carriage 122, and removable upper cover 118 are movable within a plane perpendicular to the vertical axis. Figure 6A can be considered as the starting position after engagement between the hoisting feature of the removable upper cover 118 and the hoisting feature engagement interface 152 of the first hoisting arm 130. In Figure 6B, the first carriage 122 is translated along the second axis 124 in the direction of arrow 128, and the removable upper cover 118 is moved in a horizontal direction 168 perpendicular to the second axis 124. This movement of the removable upper cover 118 can be considered as movement within a plane perpendicular to the vertical axis. This movement of the upper cover 118 is also made possible by the rotation of the hoisting feature engagement interface 152 with respect to the link 132, as indicated by arrow 169, and by the linear translation of the carriage 122 along the second axis 124, as well as by the rotation of the first hoisting arm 130 about the vertical axis (represented by the "X" labeled 134, proceed to the next page), as indicated by arrow 136. Along with the corresponding movements and rotations of the first hoisting arm 130, the hoisting feature engagement interface 152, the link 132, and the first carriage 122, an additional horizontal movement 168 of the removable upper cover 118 is further seen in Figures 6C–6E.

[0118] The removable components may be moved in ways other than those depicted in Figures 6A to 6E. For example, the carriage 122 may remain in a fixed position on the second axis 124 while one or more of the first hoisting arm 130, the hoisting feature engagement interface 152, the link 132, and the removable upper cover 118 are rotated about an axis parallel to the vertical axis 134. In some examples, only the first hoisting arm 130 may rotate about an axis parallel to the vertical axis 134, as indicated by arrow 136, while the rest of the first carriage remains stationary. The mobility of the removable components engaged with the first carriage is also not limited to linear motion in the horizontal direction 168 or linear motion along the second axis 124. In some embodiments, a removable component may be moved such that its motion has a vector component within the range of the horizontal 168 and the second axis 124, a rotational component about an axis parallel to the vertical axis as shown by arrow 136, and a rotational component about an axis perpendicular to the first axis in a horizontal plane, including but not limited to the horizontal 168 and the second axis 124 as described above.

[0119] The mobility of the first carriage, the first hoisting arm, or both also allows a removable component engaged with the first hoisting arm to move outside the tool's envelope. In some embodiments, referring, for example, to Figure 6E, the base portion of the first set of semiconductor processing chambers may be located inside the envelope 170, and the aforementioned movement of the first carriage 122 allows the removable upper cover 118 to move outside the envelope 170. In some examples, the removable upper cover 118 may be moved outside the envelope 170 and into the inspection area surrounding the tool 100, as illustrated in Figure 1. The envelope 170 may be considered to encompass all of the base portion of the tool's semiconductor processing chambers.

[0120] In some embodiments, the first hoisting arm may have a linear section as shown in Figure 3. This linear section may be the same as a pivot section 133, which is a part of the first hoisting arm 130 that pivots or rotates about a vertical axis 134 as indicated by arrow 136, and a link 132 extending between it and the end 140 of the first hoisting arm 130 to which the hoisting feature engagement interface is connected. In some such embodiments, the first hoisting arm may have a linear section and an angular section. Figure 7 illustrates an example of a hoisting arm. In Figure 7, the example of a hoisting arm includes a linear section 732 having an end 740 to which the hoisting feature engagement interface 752 is connected, and further includes an angular section 772 extending between the pivot section 733 and the linear section 732. The angular section 772 is oriented at an angle 774 inclined with respect to the vertical axis 134, which may be acute or obtuse as shown in Figure 7. This angle may range from approximately 15° to 75°, from approximately 30° to 60°, and include approximately 45°. A hoisting arm with this angle may be advantageous because it allows for a different vertical stroke than a hoisting arm with only a straight section. In some embodiments, the hoisting arm may include two or more links and multiple joints, such as elbow joints and double elbow joints.

[0121] The positioning and alignment of the first linear guide system and the first carriage may vary, which in turn affects the mobility of the first carriage and the first hoisting arm. In some embodiments, the first linear guide system may be positioned above the first plurality of semiconductor processing chambers. For example, referring back to Figure 2, we can see that the first linear guide system 120 is positioned above the first plurality of semiconductor processing chambers 102, or vertically offset above, in a direction parallel to the vertical axis 134. In some implementations, the first carriage 122 may be vertically offset below the first linear guide system 120 in a direction parallel to the vertical axis 134, as seen in Figure 2. In some embodiments, when viewed along a direction parallel to the second axis 124, the first carriage 122 may be considered to be positioned perpendicularly between the first linear guide system 120 and a portion of the first plurality of semiconductor processing chambers 102, such as the base portion 116.

[0122] The first hoisting arm 130 may be connected to or surround the base portion 116 and can engage with various removable components of the semiconductor processing chamber 110 in the first plurality of semiconductor processing chambers 102. These removable components may include, for example, a removable upper cover 118, a radio frequency (RF) generator, a pump, or a cryogenic pump. It may be desirable to remove these components from the semiconductor processing chamber for maintenance or inspection of the removable components or other parts of the semiconductor processing chamber. Each of these removable components may include some of the hoisting features discussed above, such that the hoisting feature engagement interface makes it possible to engage with these removable components so that the removable component can be lifted, lowered, and moved. For example, any of the removable components may have the hoisting features described above with respect to Figure 4B, or they may have conventional hoisting features such as lifting holes, lifting hooks. Regardless of the type of hoisting features arranged on the removable components, the first carriage and the first hoisting arm may be movable so that the hoisting feature engagement interface can be moved to engage with these hoisting features of the removable components.

[0123] In some other embodiments, the linear guide system and the first carriage may be arranged and positioned so that the first carriage can access other aspects of the tool. To consider tools with different component configurations, it may be advantageous to have linear guide systems and carriages with different configurations. For example, the first example of a portion of the tool in Figure 2 has components arranged in a particular manner that may be sufficient for positioning the linear guide and the first carriage as described above. In other examples, the tool may have removable components arranged so that the linear guide and the first carriage as described above may not be able to reach such components. In these examples, tool It may be configured differently from what is described above.

[0124] Figure 8 shows a perspective view of a second alternative example of a portion of the tool schematic diagram in Figure 1. The arrangement of components of tool 800 is similar to, but different from, the arrangement of components of tool 100 described above. In Figure 8, as in Figure 2, the first plurality of semiconductor processing chambers 802, including three semiconductor processing chambers in this example, are arranged along a first axis 806, and each semiconductor processing chamber includes a base portion 816 fixedly mounted on an upper support framework 814. As can be seen further in Figure 8, tool 800 includes components 874 above the first plurality of semiconductor processing chambers 802, some of which may be removable. These components 874 are positioned and arranged such that it may be advantageous to use a different linear guidance system, a first carriage, or both, for example, different from those described above with respect to Figure 2.

[0125] Tool 800 includes a second linear guide system 876 arranged along a second axis 824, which includes a first rail 878A and a second rail 878B substantially parallel to the first axis 806, as described above. These two rails are parallel to each other and offset perpendicularly to each other along a vertical axis 834 perpendicular to the second axis 824, as described above. The second linear guide system 876 is also fixed and supported directly or indirectly by the upper support framework 814, and Figure 8 depicts the second linear guide system 876 fixed and mounted directly to the upper support framework 814. The second carriage 880 is also drawn inside a dotted line shape and is seen in more detail in Figure 9, which depicts an enlarged portion of Figure 8. In Figure 9, the second carriage 880 is movably engaged with the second linear guidance system 876, and as a result, movably engaged simultaneously with both the first rail 878A and the second rail 878B, thereby enabling translation along the second axis 824 in the direction of arrow 828 as described above. The references to the “second” linear guidance system and the “second” carriage are not intended to suggest that there are necessarily “first” examples of each in the same semiconductor processing tool, and it should be understood that the order indicators are simply used to distinguish this linear guidance system and carriage from the examples already discussed.

[0126] The second carriage 880 also includes the elements of the second carriage 880, the ability of the second carriage 880 to rotate about an axis parallel to the vertical axis 834, and a hoisting feature engagement interface configured to engage with the hoisting features of a removable component, and includes a first hoisting arm 830 which may be the same as described above with respect to the first hoisting arm 130. In some examples, the link 832 may be longer or shorter than the link in Figure 2 to reach other components of the tool 800. Also as described above, the second carriage 880 may include a first vertical translation system 862 configured to translate the second hoisting arm 830 in a direction parallel to the vertical axis 834, as indicated by arrow 864. The first vertical translation system 862 includes a motor 866 configured to drive the vertical translation, which may use pulleys and cables or a screw actuator, as described above.

[0127] In some embodiments, the structure of the second linear guide system and the second carriage allows the second hoisting arm to translate below, between, and above the second linear guide system. For example, in Figure 8, the first hoisting arm 830 can translate below the second linear guide system 876 and between the first rail 878A and the second rail 878B of the second linear guide system 876, and in some implementations, the vertical translation system may even extend above the second rail 878B, allowing the second hoisting arm to translate to a location above the second rail 878B. This vertical translation range allows the hoisting feature engagement interface of the first hoisting arm 830 to access and move removable components such as the removable upper cover 818 and removable component 882A below the second linear guidance system 876, as well as removable components such as removable component 882B between the first rail 878A and the second rail 878B (or above the second rail 878B). In some embodiments, the first carriage may be configured so that the first hoisting arm 830 can access and move removable components located above the lowest part of the second linear guidance system 876.

[0128] Some embodiments of the tool may have two or more carriages that are simultaneously movably engaged with the same linear guidance system. For example, the first linear guidance system 120 in Figures 2 and 3 may have two first carriages 122 that are simultaneously movably engaged with itself. These two first carriages 122 may be duplicates of each other in some implementations. For example, Figure 10 depicts a tool similar to Figures 6A to 6E, having two first carriages engaged with one linear guidance system. In this case, both the first carriage 122A and the first carriage 122B (which may be considered a second carriage) are simultaneously movably engaged with the first linear guidance system 120 so that they can both translate along a second axis 124. In these embodiments, the first carriages 122A and the first carriage 122B are duplicates and configured as the first carriage 122 described above. This allows access to and movement of numerous removable components of the semiconductor processing chamber 104, which can increase efficiency and reduce inspection and maintenance time.

[0129] Returning to Figure 1, the tool 100 may have two plurality of semiconductor processing chambers, namely a first plurality of semiconductor processing chambers 102 and a second plurality of semiconductor processing chambers 108. The second plurality of semiconductor processing chambers 108 may be arranged along a third axis which can be considered the same as axis 112, offset from the first axis 106 and substantially parallel to the first axis 106. In Figure 1, the second plurality of semiconductor processing chambers 108 is offset from the first plurality of semiconductor processing chambers 102 in a different direction perpendicular to the first axis, such that the tool has an internal region 184, represented as a translucent cross-hatched dashed line between the plurality of semiconductor processing chambers. The internal region may include not only part of the upper support framework 114 but also components used for semiconductor processing, such as a gas box, manifold, gas supply, electronic circuitry, conduit, etc. This internal region 184 may also include one or more substrate transport robots configured to transport one or more substrates into or out of the processing chambers or other embodiments of the tool. As discussed herein, these substrate transport robots differ from the carriages disclosed. For example, substrate transport robots are typically located in an internal area, which allows such robots to efficiently transport wafers between different processing chambers while still holding the wafers in a controlled environment, such as inside a vacuum transport module.

[0130] The tool 100, which includes multiple semiconductor processing chambers, may have a linear guide system and carriage for each of the multiple semiconductor processing chambers. Figure 11 shows a top view of an example of a semiconductor processing tool similar to the semiconductor processing tool shown in the schematic diagram of the tool in Figure 1, but with additional details and features. The first multiple semiconductor processing chambers 102 may be similar to those described in Figures 2 to 7. These semiconductor processing chambers may be arranged along a second axis 124, and the base portions 116 of these semiconductor processing chambers may be fixedly mounted on an upper support framework 114. As described above in Figures 2 to 7, the first linear guide system 120 and the first carriage 122 may be positioned and configured to access and move removable components, such as a removable upper cover 118, which are only present in the first multiple semiconductor processing chambers 102.

[0131] Additionally, the second set of semiconductor processing chambers 108 may be arranged along a third axis. The second linear guide system 1120 may be positioned along a fourth axis 1185 substantially parallel to the third axis 112 (see Figure 1). The second carriage 1122 may be movably engaged with the second linear guide system 1120 and may be configured to access and move only the removable components of the second set of semiconductor processing chambers 108. The second carriage 1122 may be configured to engage with the winding features of removable components of the second set of semiconductor processing chambers 108, such as a removable upper cover 1118, as described above with respect to the first carriage 122. In some embodiments, the second linear guide system 1120 may be a duplicate of the first linear guide system 120, the second carriage 1122 may be a duplicate of the first carriage 122, and all removable components of the first and second semiconductor processing chambers may be of the same or similar design. In some other embodiments, the first linear guide system 120 may differ from the second linear guide system 1120, and the first carriage 122 may differ from the second carriage 1122, but the first and second carriages may still be configured to engage with the winding features of their corresponding removable components of the semiconductor processing chambers.

[0132] In some embodiments, the first plurality of semiconductor processing chambers 102, the second plurality of semiconductor processing chambers 108, and the internal region may be located inside the envelope surface 170. In some examples, at least a portion of the first carriage and / or linear guide system is positioned outside the envelope surface 170. The first carriage 122 and the second carriage 1122, including the corresponding first and second hoisting arms, may be movable so that removable components from each plurality of semiconductor processing chambers can be moved outside the envelope surface. This is illustrated in Figure 11, where the removable upper covers 118 and 1118 are moved and positioned outside the envelope surface 170.

[0133] The hoisting configurations described herein, such as the linear guide system and the first carriage, may include features that are powered and unpowered to varying degrees. For example, in some implementations of the tool, the movement of the first carriage 122 along the second axis 124, and the horizontal and rotational movements of the first hoisting arm, may be powered by human power without motors, electricity, or mechanical force, so as to move the first carriage 122 and the first hoisting arm horizontally and rotationally. In some examples, mechanical power, such as a motor or hydraulic application, may move one or more configurations of the first carriage 122 and the first hoisting arm 130 vertically, such as a motor moving the first hoisting arm 130 vertically. In some other implementations, the movement of the first carriage along the linear guide system, as well as the horizontal and rotational movements of the first hoisting arm, may be powered by a power source such as a motor, pump, or hydraulic application.

[0134] Some embodiments of the tools described herein may also include a controller for controlling various aspects of the tool. In some implementations, the controller may be part of one or more processing chambers, one or more platforms for processing, and / or specific processing components (such as a wafer pedal or gas flow system). These tools may be integrated with electronic circuits for controlling their operation before, during, and after processing semiconductor wafers or semiconductor substrates. The electronic circuits may be referred to as “controllers” that control various components or sub-components of the tool. Depending on the processing requirements and / or the type of tool, the controller may be programmed to control any of the processing disclosed herein, including, for example, controlling when power may be supplied to the hoisting system disclosed herein, and monitoring the operating state of the semiconductor processing chamber for conditions that allow for safe maintenance. The controller may also control other aspects of tool operation, including the delivery of processing gases, temperature settings (e.g., heating and / or cooling), pressure settings, vacuum settings, output settings, radio frequency (RF) generator settings, RF matching circuit settings, frequency settings, flow rate settings, fluid delivery settings, position and movement settings, wafer transfer into and out of the tool and other transfer tools, and / or load locks connected to or interfaced with specific systems.

[0135] Broadly speaking, a controller may be defined as an electronic circuit having various integrated circuits, logic circuits, memory (including non-temporary media), and / or software that receives and issues instructions, controls operations, enables cleaning operations, enables endpoint measurements, etc. An integrated circuit may include a chip in the form of firmware that stores program instructions, a chip defined as a digital signal processor (DSP), an application-specific integrated circuit (ASIC), and / or one or more microprocessors or microcontrollers that execute program instructions (e.g., software). Program instructions may be instructions that are communicated to the controller in the form of various individual settings (or program files) that define operating parameters for performing specific operations on or for a semiconductor wafer, or for a system. In some embodiments, the operating parameters may be part of a recipe defined by a processing engineer to achieve one or more processing steps while fabricating one or more layers, materials, metals, oxides, silicon, silicon oxide, surfaces, circuits, and / or wafer dies.

[0136] In some implementations, the controller may be part of a computer integrated with, linked to, otherwise networked to, or combined with the tool, or coupled to that computer. For example, the controller may be in the “cloud” or all or part of the Fab’s host computer system, thereby enabling remote access to wafer processing. The computer may monitor the current progress of a fabrication operation, examine the history of past fabrication operations, allow remote access to the system to examine trends or performance metrics from multiple fabrication operations, modify parameters of the current process, set processing steps following the current process, or initiate a new process. In some examples, a remote computer (e.g., a server) may provide processing recipes to the system over a network which may include a local network or the internet. The remote computer may include a user interface that allows input or programming of parameters and / or settings, which are then transmitted from the remote computer to the system. In some examples, the controller receives instructions in the form of data, specifying parameters for each processing step to be performed during one or more operations. It should be understood that the parameters may be specific to the type of processing to be performed and the type of tool the controller is configured to interface with or control. Therefore, as described above, the controller may be distributed, for example, by comprising one or more separate controllers networked together and operating toward a common purpose such as the processing and control described herein. One example of a distributed controller for such purposes is one or more integrated circuits on a chamber that are in communication with one or more remotely located integrated circuits (such as at the platform level or as part of a remote computer) to combine to control the processing on the chamber.

[0137] Examples of tools, without limitation, may include plasma etching chambers or modules, deposition chambers or modules, spin-rinse chambers or modules, metal plating chambers or modules, cleaning chambers or modules, bevel edge etching chambers or modules, physical vapor deposition (PVD) chambers or modules, chemical vapor deposition (CVD) chambers or modules, atomic layer deposition (ALD) chambers or modules, atomic layer etching (ALE) chambers or modules, ion implantation chambers or modules, or track chambers or modules. A tool may have a number of chambers or modules.

[0138] As noted above, depending on one or more processing steps that the tool is to perform, the controller may communicate with one or more of the following: other tool circuits or modules, other tool components, cluster tools, other tool interfaces, nearby tools, adjacent tools, tools located throughout the factory, a main computer, another controller, or tools used for material transport that carry wafer containers between the location of tools and / or load ports within the semiconductor manufacturing plant.

[0139] In some embodiments, the various hoisting modes of the tool may be powered, and the controller may be configured to control a drive system that controls the movement of the carriage relative to a linear induction system and / or the movement of one or more arm links relative to the carriage. Figure 12 shows a top view of an example of the semiconductor processing tool of Figure 6E, but with additional features. For example, tool 1200 is 2The first linear guide system 120 may include a carriage translation system 1288 configured to translate the first carriage 122 along the axis 124. The carriage translation system 1288 may include a moving mechanism (such as a motor) that can push the first carriage 122 along the first linear guide system 120. For example, the first carriage 122 may have one or more motors that power one or more wheels to move the first carriage 122 along the first linear guide system 120. In another example shown in Figure 6A, the first linear guide system 120 may have a linear ball screw actuator with a motor 191 configured to rotate a linear ball screw 189 connected to the first carriage 122 so that the linear ball screw 189 moves the first carriage 122 along the first linear guide system 120 when the motor 191 is actuated by the linear ball screw 189.

[0140] In some implementations, the tool 1200 may further include a first carriage, represented by a box 1290, which is configured to move the first hoisting arm 130 in a plane perpendicular to the vertical axis as described above. This configuration may include the ability to drive one or more pivot points of the first hoisting arm to rotate about a direction parallel to the vertical axis. For example, the first carriage 122 may include a motor connected to the first link 132 in a pivot section 133, which can rotate the first link 132 about the vertical axis 134 in the direction of arrow 136. The first carriage 122 may also include another motor directly or indirectly connected to the hoisting feature engagement interface 152, which can rotate the hoisting feature engagement interface 152 about axis 160, as illustrated above in Figures 6C-6E and as seen in Figure 4A. This additional motor, pneumatic system, or hydraulic system may be located on the first hoisting arm or inside the first carriage 122 and connected to the hoisting feature engagement interface 152 via pulleys, belts, drive chains, drive screws, gears, interlocking mechanisms, etc. In some implementations, the hoisting arm movement system may also be able to rotate the hoisting feature engagement interface 152 about one or more axes perpendicular to the vertical axis, for example, about an axis parallel to the first axis as described above. The tool 1200 also includes the vertical translation system 162 described above, configured to translate the first hoisting arm 130 along the vertical axis 134.

[0141] Tool 1200 also includes a controller 1292, similar to, for example, the controller described above, which is employed to control the carriage translation system and the hoisting arm movement mechanism. Controller 1292 has one or more non-temporary memoryThe 1294 may include one or more processors 1296. The processors 1296 may include one or more CPUs, ASICs, one or more general-purpose computers and / or one or more dedicated computers, one or more analog and / or digital input / output connections, one or more stepper motor controller boards, and so on.

[0142] The controller 1292 may be communicatively connected to the carriage translation system 1288, the hoisting arm movement system 1290, and the vertical translation system 162. Figure 13 shows a partial configuration diagram of an example of a semiconductor processing tool 1200, and as can be understood, the controller 1292 is communicatively connected to each semiconductor processing chamber 104 in the first plurality of semiconductor processing chambers 102, the carriage translation system 1288, the hoisting arm movement system 1290, and the vertical translation system 162. The controller 1292 also controls one or more processors 1296 to store instructions in non-temporary memory 1294 for moving the first carriage 122, including the first hoisting arm 130. This instruction includes causing the carriage translation system 1288 to move the first carriage 122 along the second axis 124, causing the vertical translation system 162 to move the first hoisting arm 130 vertically, including the first link 132 and the hoisting feature engagement interface 152 as described above, and causing the hoisting arm movement system 1290 to move the first hoisting arm 130 in a plane perpendicular to the vertical axis 134 as described above.

[0143] In some implementations, the controller 1292 also stores instructions in non-temporary memory 1294 to control one or more processors 1296 to engage the hoisting feature of one removable component in the semiconductor processing chamber 104 with the hoisting feature engagement interface 152. These instructions produce various movements of the first carriage 122, such as linear translation along the second axis 124, vertical movement of the first hoisting arm 130, and horizontal movement of the first hoisting arm 130, i.e., movement in a plane perpendicular to the vertical axis. For example, returning to Figures 4A and 4B, the command may cause the vertical translation system 162 to move the first hoisting arm 130 in a direction parallel to the vertical axis 134 such that the hoisting feature engagement interface 152, which includes holes 144A and 144B, is below the second mechanical interface features 151A and 151B of the hoisting feature, i.e., the second structures 142A and 142B. The command may also cause the first hoisting arm 130, which may include the hoisting feature engagement interface 152, to rotate in a plane perpendicular to the vertical axis, or in either direction, so as to align the second mechanical interface features 151A and 151B using holes 144A and 144B, respectively. When these features are aligned (which may be determined, for example, based on the output of various sensors configured to detect such alignment), the command may cause the vertical translation system 162 to move the first hoisting arm 130 upward in a direction parallel to the vertical axis 134 so that the second mechanical interface features 151A and 151B are inserted into the holes 144A and 144B, respectively, and, in some embodiments, the saddle plates 150A and 150B are in contact with the hoisting feature engagement interface 152 by manual user input.

[0144] When the hoisting feature of the removable component and the hoisting feature engagement interface of the first hoisting arm engage with each other, instructions may control one or more processors to lift and / or lower the removable component in a direction parallel to the vertical axis, and similarly, instructions may move the removable component in a plane perpendicular to the vertical axis by causing the hoisting arm movement system, the carriage translation system, or both to move the first hoisting arm, as described above. For example, controller 1292 may include instructions that produce the sequence of movements described with respect to Figures 6A to 6E.

[0145] In some implementations, the instruction may cause only the first hoisting arm movement system to move the first hoisting arm while the first carriage remains stationary. In some embodiments, Figures 6A to 6A are shown. 6 With respect to E, for example, as described above with respect to the rotation of one or more hoisting arm links coupled to the simultaneous translation of the carriage, such that a removable component moves along a generally linear axis perpendicular to the translation axis of the carriage, the command may cause both the hoisting arm moving system and the carriage translation system to move the first hoisting arm. In other examples, the command may cause only the carriage translation system to move the first hoisting arm while the hoisting arm moving system is not moving the first hoisting arm. In an exemplary example, referring to Figure 12, the hoisting feature engagement interface 152 engages with the hoisting feature of the removable upper cover 1218, and the carriage translation system 1288 may translate the first carriage 122, and therefore the removable upper cover 1218, along the second axis 124. During this movement, the hoisting arm moving mechanism 1290 and the first vertical translation system 162 do not need to move the first hoisting arm 130.

[0146] The command also causes, for example, the removable component to be returned to its original location and reinstalled, and then to disconnect the hoisting feature of the removable component from the hoisting feature engagement interface of the first hoisting arm. In Figures 4A and 4B, this disconnection may include lowering the first hoisting arm 130 so that the second mechanical interface features 151A and 151B are removed from holes 144A and 144B.

[0147] In some embodiments, the tool may also include a first carriage position sensor configured to generate information regarding the position of the first carriage along the first linear guidance system. Referring back to Figure 13, the first carriage position sensor 1298 appears to be positioned above the first carriage 122 and is communicably connected to the controller 1292 via a wired or wireless connection so that the controller 1292 can receive the data generated by the first carriage position sensor 1298. From this data, the controller 1292 can also interpret and determine the position of the first carriage 122 along the first linear guidance system 120, including data regarding which of the semiconductor processing chambers 104 is closest to the first carriage 122 and which are in immediate vicinity of or next to the first carriage 122. For example, in Figure 13, the first carriage position sensor 1298 may generate data indicating that the first carriage 122 is closest to semiconductor processing chamber 104A and adjacent to semiconductor processing chamber 104B. The carriage position may allow for a determination of which semiconductor processing chamber the hoisting arm can access. In the example in Figure 6A, the carriage position sensor 1298 may indicate that a given first carriage 122 is adjacent to both semiconductor processing chambers 104A and 104B, and that the first hoisting arm can access the removable components of both of these processing chambers.

[0148] In some implementations, the tool may also include a first arm position sensor configured to generate data relating to the position of the first hoisting arm relative to the semiconductor processing chamber. In Figure 13, the first arm position sensor 12100 is positioned on the first hoisting arm 130 and is communicably connected to the controller 1292 via a wired or wireless connection so that the controller 1292 can receive the data generated by the first arm position sensor 12100. The controller 1292 can also interpret and determine the position of the first hoisting arm 130 relative to each semiconductor processing chamber 104 from carriage position data and / or arm position data, including, given the position of the first carriage 122, which hoisting features the first hoisting arm 130 can engage with, which one or more processing chambers 104 are in immediate proximity to or next to the first hoisting arm 130, the position of the pivot section (i.e., shoulder) of the first hoisting arm 130 relative to each semiconductor processing chamber 104, the positioning of the first hoisting arm 130 relative to the hoisting features of each removable component on each semiconductor processing chamber 104, and the position of the first hoisting arm 130 along the vertical axis (for example, determining the vertical position of the first hoisting arm relative to the hoisting features of the removable component and the vertical position of the hoisting feature engagement interface). The data may also include distances from various features of the tool to the configuration of the first hoisting arm 130 (this may be done, for example, by using an adjacent sensor). In some embodiments, the tool may also include an arm position sensor configured to generate data relating to the position of the hoisting arm rotated around a vertical axis. From this data, the controller may determine, for example, whether the arm is positioned appropriately to avoid a known obstacle when translating vertically, or whether its hoisting features are engaged. The controller may also include commands for the vertical translation system to translate or not translate the arm vertically up or down to a certain height.

[0149] For example, the first arm position sensor 12100 may generate data indicating the position of the first hoisting arm, including the horizontal and vertical positions of the hoisting feature engagement interface of the first hoisting arm with respect to the hoisting features of the semiconductor processing chamber, and this position data can be used to determine which hoisting features the first hoisting arm 130 can engage with. For example, in Figure 6A, the first arm position sensor 12100 may generate data that a controller can use to determine that the hoisting feature engagement interface can engage with the hoisting features of the semiconductor processing chamber 104A. As noted above, the controller may determine the position of the first arm 130 along the vertical axis to further determine the positioning of the first arm 130 with respect to the hoisting features of a removable component. In some embodiments, the tool may have two or more arm position sensors that generate all the information regarding the position of the first hoisting arm with respect to one or more processing chambers.

[0150] In some embodiments, the tool may also include an engagement sensor configured to generate data on whether the hoisting feature engagement interface has engaged with any of the hoisting features in the semiconductor processing chamber. In Figure 13, the engagement sensor 12102 is positioned on the first hoisting arm 130 and is communicably connected to the controller 1292 via a wired or wireless connection so that the controller 1292 can receive the data generated by the engagement sensor 12102. The controller 1292 can also interpret and determine from this data whether the hoisting feature engagement interface has engaged with any of the hoisting features. For example, the engagement sensor 12102 may be a conductive surface configured to electrically contact another conductive surface on the hoisting feature such that an electrical continuity is created between these conductive surfaces when the hoisting feature engagement interface engages with the hoisting feature. Returning to Figures 4A and 4B, for example, the first conductive surface may be positioned on the upper surface of the first structure 138 so that it can contact the second conductive surface on the underside of the saddle plates 150A and 150B when the hoisting feature engagement interface 152 engages with the hoisting features 142A and 142B. The controller 1292 provides electrical information between these two surfaces. continuity The controller may detect whether a hoist feature engagement interface exists and determine whether there is an engagement between the hoist feature and the hoist feature. The engagement sensor may be another type of sensor, such as a proximity sensor, a contact switch, or a vision sensor. In some implementations, the controller 1292 may include instructions to prevent the vertical translation system from translating the first arm vertically or from translating it above a certain height when the hoist feature engagement interface is not engaged with any of the hoist features (thus allowing sufficient vertical translation to produce engagement between the hoist feature and the hoist feature engagement interface, but preventing further translation that would actually apply a lifting load to the removable components).

[0151] In some embodiments, the tool may also include an alignment sensor configured to generate data on whether the hoisting feature engagement interface has aligned with any hoisting feature in the semiconductor processing chamber. In some examples, this data may be used to determine whether the vertical movement of the first hoisting arm 130 causes engagement between the hoisting feature and the hoisting feature engagement interface. The alignment sensor may be positioned on the first hoisting arm 130, a removable component, or both, and communicated to the controller 1292 via a wired or wireless connection so that the controller 1292 can receive the data generated by the alignment sensor. Thus, the controller 1292 can interpret and determine from this data whether the hoisting feature engagement interface has properly engaged with the hoisting feature of any removable component so that the vertical movement of the first hoisting arm causes these items to engage. For example, returning to Figures 4A and 4B, the alignment sensor may generate data so that the controller 1292 can determine whether the holes 144A and 144B are directly below the second mechanical interface features 151A and 151B and are aligned with the second mechanical interface features 151A and 151B so that the upward movement of the first hoisting arm 130 causes the second mechanical interface features 151A and 151B to be inserted into the holes 144A and 144B. Such an alignment sensor may be, for example, a visual sensor, a magnetic sensor, or a proximity sensor.

[0152] The controller may use data from any of the sensors referenced above, as described above, to realize the movement of the first carriage and the removable components. For example, referring to Figure 13, the controller 1292 may first determine the positioning and alignment of the first carriage 122, as shown in Figure 13, such that the first carriage 122 is positioned closest to the semiconductor processing chamber 104B, the first hoisting arm 130 is positioned closest to the semiconductor processing chamber 104C, and the hoisting feature engagement interface is not engaged with any hoisting feature. If it is desirable to move the removable components of the semiconductor processing chamber 104A, the controller 1292 may use these determinations and data to move the first carriage 122 and / or the first hoisting arm 130 so that the first hoisting arm 130 can engage with the hoisting feature of the semiconductor processing chamber 104A. This movement may include instructing the carriage translation system 1288 to move the first carriage 122 closer to the semiconductor processing chamber 104A, and rotating the first hoisting arm 130 by approximately 180° in a clockwise direction, for example, so that the first hoisting arm 130 is closer to the semiconductor processing chamber 104A than shown in Figure 13.

[0153] In some embodiments, the tools may have various safety features. For example, the controller may be configured to receive information about the operating state of each semiconductor processing chamber. This operating state may include whether the semiconductor processing chamber is actively processing a substrate and whether the chamber is safe for a person to access, such as whether the chamber is unpowered, the pressure is ambient, and volatile chemicals have been removed from the chamber. If the controller receives information that one of the semiconductor processing chambers is safe for a person, or determines that it is, it may allow the carriage translation system, the hoisting arm movement system, and / or the vertical translation system to operate and move the removable components of that semiconductor processing chamber. Similarly, if the controller receives information or determines that one of the semiconductor processing chambers is not in a human-safe state, it may prevent the carriage translation system, the hoisting arm movement system, and / or the vertical translation system from operating to move the removable components of that semiconductor processing chamber (however the controller may still allow the movement of removable components of other chambers on a tool that is in a safe state for such activity).

[0154] In some embodiments, each semiconductor processing chamber may have an electrical interface, such as an electrical outlet, configured to be connectable to an electrical cable of the first carriage, and such an electrical interface may be located on a removable part of each semiconductor processing chamber. This electrical cable may be electrically connected to a power supply on the first carriage or to another power supply on the tool, such as a system power distribution box (SPDB) of the tool. Power may be routed from the SPDB along a linear guide to the first carriage, terminated at a hoisting mechanism, and further routed along the first hoisting arm by an electrical cable. The electrical cable may be terminated by a connector configured to connect to an electrical interface in any of the removable components, and may be configured to supply power to such components when power is supplied and the connector is connected. By supplying power to removable components, inspection work can be performed by driving motors located on a removable upper cover during calibration, and by keeping equipment (such as pressure gauges) located on the removable upper cover powered and warm, thereby accelerating the inspection recovery time.

[0155] In some embodiments, the electrical interface may be used as part of a safety protection device. For example, the controller may include instructions for determining electrical continuity between an electrical cable and the electrical interface. If it determines that this electrical continuity exists, the controller may allow a vertical translation mechanism or other moving mechanism to operate on the first carriage. In addition, the controller may determine whether the chamber is in an atmospheric state and, if so, allow the movement of removable components such as a top plate. In some embodiments, the chamber generates an atmospheric signal that can be detected by the controller and relays it through the electrical interface and electrical cable. The atmospheric signal may indicate whether the chamber is in an atmospheric state or not.

[0156] In some embodiments, the electrical cable may be routed along the first hoisting arm and may be of a length such that the connector and the hoisting feature engagement interface of the first hoisting arm can engage with only one electrical interface and hoisting feature in the semiconductor processing chamber at a time. For example, returning to Figure 5, the first carriage 122 includes an electrical cable 1104 routed along the first hoisting arm 130 and of a length such that a connector 1106 can be connected to the electrical interface 1108 of a removable upper cover 118. Furthermore, the length of the electrical cable 1104 allows the connector 1106 to simultaneously connect to the electrical interface 1108 and the hoisting feature engagement interface of its semiconductor processing chamber, as described in Figures 4A and 4B, and engage with the hoisting feature of its removable top cover 118, but prevents the connector 1106 from connecting to a similar electrical interface of any other removable top cover while the hoisting feature of the depicted removable top cover 118 is engaged with the first hoisting arm. Referring to Figure 12, for example, the length of the electrical cable 1104 prevents the electrical interface 1108 and connector 1106 of the removable top cover 118 of semiconductor processing chamber 104B from simultaneously connecting when the hoisting feature and hoisting feature engagement interface of the removable top cover 118 of semiconductor processing chamber 104A are engaged.

[0157] In some other embodiments, the electrical interface may provide power to components on the carriage. The electrical interface may be positioned on a fixed location on each semiconductor processing chamber or on a removable upper component. 。The electrical cable may be connected to one or more motors of the first carriage, such as the motors of the vertical translation system and (if present) the motors of the hoisting arm movement system, and may be terminated by a connector configured to connect to an electrical interface of any of the removable components, which may be configured to supply power to such components when power is supplied and the connector is connected.

[0158] In some implementations, the controller may also include instructions for supplying power to the electrical interface of the semiconductor processing chamber based on data obtained from one or more of the sensors mentioned above. For example, in some implementations, the controller may, based on the determination of the position of the first carriage, provide instructions to the electrical interface of only one of the first multiple semiconductor processing chambers at a time, regarding the operating state of that semiconductor processing chamber. TopPower may be supplied only when it is determined that it is safe to remove the cover. If a number of carriages / hoisting devices are included for a single set of semiconductor processing chambers, such functionality may be extended to supply power only to the electrical interface of a particular semiconductor processing chamber when it is determined that one of the carriage / hoisting arms is positioned to be suitable for removing a removable component from that semiconductor processing chamber, and further when it is determined that the semiconductor processing chamber is operationally safe. Referring to Figure 13 as an example, the controller 1292 receives data on the position of the first carriage 122 from the first carriage position sensor 1298, determines the position of the first carriage based on this data, and then supplies power only to the electrical interface of semiconductor processing chamber 104B (after it is determined that the chamber is in a "safe" state) because the hoisting features of the first arm 130 can reach only the removable component of the semiconductor processing chamber 104A1. As noted above, this “safe” condition may include when the chamber is not powered, the chamber pressure is ambient pressure, the temperature at which a person can handle the removable components is sufficiently low, any volatile or hazardous chemicals have been removed from the chamber, and when a person can safely access the chamber, such as when the removable components have been unfastened or bolted away from the chamber.

[0159] Similarly, the controller 1292 may include instructions to control the processor 1296 to supply power only to the electrical interface 1108 of the semiconductor processing chambers among the first plurality of semiconductor processing chambers that have hoisting features that can be engaged by the hoisting feature engagement interface 152 of the first hoisting arm 130, based on the determination of the positions of the first hoisting arm 130 and the first carriage 122. In this case as well, for example in Figure 13, these determinations may indicate that the hoisting features of the removable components of semiconductor processing chamber 104A can be engaged by the hoisting feature engagement interface of the first hoisting arm 130, and for this reason, the controller 1292 may then supply power to the electrical interface 1108 of semiconductor processing chamber 104C.

[0160] In addition or alternatively, the controller may, in response to determining that the hoisting feature engagement interface has engaged with a hoisting feature in a removable upper cover of a semiconductor processing chamber in the first plurality of semiconductor processing chambers, as described above, supply power only to the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that includes that removable upper cover. In an example in Figure 13, based on data generated by the engagement sensor 12104, the first arm position sensor 12100, and the carriage position sensor 1298, the hoisting feature engagement interface of the first hoisting arm 130 may determine that it has engaged with a hoisting feature of a removable component of the semiconductor processing chamber 104C, and based on that determination, the controller 1292 may determine that it is sufficient to supply power only to the electrical interface of the semiconductor processing chamber 104C.

[0161] In some embodiments, the engagement sensor may be considered a first interlock sensor configured to generate data on whether a hoisting feature has engaged with a hoisting feature engagement interface. The command may cause the controller to control the processor to determine, based on the data generated by the first interlock sensor, whether a hoisting feature in one of the removable components of a first plurality of semiconductor processing chambers has engaged with a hoisting feature engagement interface. The command may also cause the vertical translation system to vertically translate the first hoisting arm in response to the determination that a hoisting feature in one of the removable upper covers has engaged with a hoisting feature engagement interface, as well as not only receiving a first input signal to operate the vertical translation system. The command may further prevent the vertical translation system from vertically translating the first hoisting arm in response to the determination that a hoisting feature in one of the removable upper covers has not engaged with a hoisting feature engagement interface, as well as not only receiving a first input signal to operate the vertical translation system.

[0162] In some embodiments, another safety feature that may be included is that the movement of the first hoisting arm may be restricted to a sector of less than 360°, such as a sector of 180° or 270° (meaning substantially within a range of ±10°). This restriction may be provided by using one or more physical hard stops, such as one or more pins, that prevent the first hoisting arm from rotating to a position outside the sector, or, if present, by an internal command of the controller that prevents the motor from rotating the first hoisting arm to a position outside the sector. In some examples, the first hoisting arm, restricted to move only on the first side of a vertical plane through which the first carriage passes, is parallel to the vertical axis and perpendicular to the second axis. Referring to Figure 6B, for example, a vertical plane 1110 is shown, which is substantially perpendicular (e.g., perpendicular within a range of ±5°) to a second axis 124 that is substantially parallel (e.g., parallel within a range of ±5°) to the vertical axis 134, and the vertical plane 1110 passes through the first carriage 122. In this case, the first hoisting arm 130 is rotatable only to a position located to the left of the vertical plane 1110. As explicitly stated above, the instruction may control one or more processors to move the first hoisting arm 130 only on the first side of this vertical plane 1110, i.e., only to the left. Alternatively, such a rotation-limiting feature may operate to restrict the rotational movement of the hoisting arm to a position to the right only.

[0163] To avoid any potential confusion, it should be noted that the carriages and hoisting arms discussed herein are not equivalent to robotic arms or end effectors intended or configured to transport substrates. Furthermore, the removable components of the semiconductor processing chamber described herein should not be considered substrates, the hoisting arms described herein are neither configured nor intended to support substrates, nor the hoisting feature engagement interfaces are configured nor intended to support substrates.

[0164] In some implementations, instead of a carriage and hoisting arm system intended to be permanently mounted on the semiconductor processing tool and fully supported by an attached linear guidance system, a hoisting system that can be separated from the semiconductor processing tool may be used. In such alternative systems, the hoisting arms may be attached to a removable vertical member equipped with a vertical translation system (it should be understood that in this implementation, the reference to “vertical” refers to the orientation of the components when the hoisting system is mounted on the semiconductor processing tool, and obviously, if such a hoisting system is removed from the semiconductor processing tool, rotated 90°, and placed horizontally on the floor, the parts previously described as “vertical” technically become horizontal, and vice versa, and for the purposes of this disclosure, such components can still be described as potentially “vertical”). The removable vertical member may include one or more mechanical interfaces that allow the removable vertical member to be connected to corresponding attachment points located at various locations on the semiconductor processing tool, such as a lower framework, an upper support framework, or other lower parts of the tool. The lowest part of the vertical member may be equipped with rollers or wheels positioned to rotate the vertical member within the semiconductor processing equipment and to position it in a location that allows the vertical member to interface with different semiconductor processing tools. The vertical member itself may have one or more arm links supported by a vertical translation system mounted on it. When the vertical member is attached to an upper support framework for semiconductor processing tools, the vertical translation system may be used to vertically drive one or more arm links up and down.

[0165] Such a hoisting system may be designed so as not to be self-supporting and / or so as not to be able to support removable components without attachment to some form of support on the tool, for example, via attachment points on an upper support framework. Thus, in some embodiments, for example, the hoisting system may lack support legs (as already discussed in this disclosure) that generally reach directly below the hoisting arm and act to prevent the hoisting system from falling due to the weight of the hoisting arm (and whatever the hoisting system is lifting). In another example, the hoisting system may have a lightweight support system that can support only the weight of the hoisting system itself but not the weight of the removable components. Existing self-supporting hoisting systems generally include legs or equivalent structures that reach directly below the hoisting arm. In contrast, the removable hoisting systems discussed herein cannot support the weight of the hoisting arm and / or the removable components without some form of external support.

[0166] When the hoisting system is attached to the semiconductor processing tool via one or more attachment points, the attachment points primarily serve to receive lateral loads, whereas axial (vertical) loads are rather directed outward through the length of the removable vertical member and through the bottom of the removable vertical member, (and perhaps, in some examples, through wheels that may be located at the base of the removable vertical member). )The load may be routed to the floor of the equipment. Therefore, any torque resulting from a vertical load applied off-center from the centerline of the removable vertical member may be neutralized by the resistive force applied by one or more attachment points to which the hoisting system is attached. In some examples, the attachment points may receive some or all of the lateral and vertical loads. In this case, the tool may include upper and lower attachment points that can support some or all of the lateral and vertical loads of the hoisting system. The torque described above can be neutralized by these numerous attachment points at the ends of the vertical member of the hoisting system. The vertical load can also be routed to the vertical member, to the upper attachment points and upper support frame, as well as to the lower attachment points, and finally to the floor, as opposed to passing through the wheels of the hoisting system. This makes the vertical member and its moving mechanism lighter and allows for a smaller load-bearing structure.

[0167] Such hoisting systems do not need to support themselves, and therefore may occupy a very small area and be lighter than self-supporting hoisting systems. This makes the hoisting system easier for people to handle and allows it to be used in more confined spaces.

[0168] Accordingly, the present disclosure includes additional alternative embodiments of another example of a semiconductor processing tool having a separable hoisting system rather than the linear guide system and carriage described above. In these alternative hoisting system embodiments, the tool may still include an upper support framework, a plurality of semiconductor processing chambers arranged along a first axis, and a base portion fixed and attached to the upper support framework. In some such implementations, the semiconductor chambers may be arranged in a manner other than along a linear axis, for example, in a circular arrangement.

[0169] In some of these alternative embodiments, the detachable hoisting system is supported by the Fab floor, connectable to a support frame at a high attachment point, and has a hoisting arm. The detachable hoisting system is mobile such that it can be moved to a position aligned with the tool on the Fab floor inside the inspection area and then fixed to the upper support framework at an attachment point on the upper support framework. Once connected to the upper support framework in place, the hoisting arm and vertical translation system are used to lift, lower, and move one or more removable components of the semiconductor processing tool. As will be discussed in more detail below, the hoisting arm and vertical translation system may be the same as or similar to the hoisting arm and vertical translation system discussed above.

[0170] Figure 14 depicts another example of a semiconductor processing tool, which is similar to Figure 2 but has notable differences. In these embodiments, the other example of the tool 1400 as described above includes not only an upper support framework 1414, a semiconductor processing chamber 1404 in a first plurality of semiconductor processing chambers 1402 arranged along a first axis 1406, and a base portion 1416 fixed to and attached to the upper support framework 1414, but also removable components such as a removable upper cover 1418 with a winding feature such as a second structure 1442 as described above.

[0171] In contrast to tool 100, another tool 1400 includes an attachment system which may include one or more attachment points 14112 fixedly supported by an upper support framework 1414. In some embodiments, two or more of the attachment points 14112 may be connected to the upper support framework 1414 at fixed positions with respect to the upper support framework 1414 along a second axis 1424. In some other embodiments, the attachment system may include a guide rail to which one or more attachment points are movably connected. For example, a guide rail 14114 highlighted and drawn in shaded in Figure 14 extends along a second axis 1424 similar to the first linear guide system described above, and one or more attachment points 14112 are movably connected to the guide rail 14114 so that they can translate along the second axis 1424 as indicated by arrow 1428. In some such implementations, the attachment points may be tightened so as to be fixed in space relative to the guide rail when tightened, or loosened so as to be slidable along the guide rail when loosened, thereby allowing new tool configurations or modifications to be adapted to maintenance procedures by readjusting the location of the attachment points. As discussed above, one or more attachment points 14112 of the attachment system serve as locations where a detachable hoisting system can be attached to or connected to the upper support framework 1414, i.e., high connection points.

[0172] Figures 15A and 15B depict side views of other examples of the semiconductor processing tool of Figure 14 and a first example of a separable hoisting system. In Figure 15A, one base portion 1416 is visible attached to an upper support framework 1414 and has a removable component 1418. Another attachment point 14112 is also visible connected to the upper support framework 1414, which may be a movable connection point as discussed above or a fixed connection point. The first example of a separable hoisting system 14116 is also visible and includes a vertical member 14118 having an upper end 14120 to which a complementary attachment point 14122 is attached, and a lower end 14124 to which a moving mechanism 14126, such as a wheel or track, is attached. The moving mechanism 14126 may be positioned on and thereby supported on the Fab floor 14128, allowing the first example of a separable hoisting system 14116 to move in various directions around the Fab floor. The complementary attachment point 14122 is configured to connect to or attach to the attachment point 14112 of the attachment system, as illustrated in Figure 15B, and when the complementary attachment point 14122 and attachment point 14112 are connected, as illustrated by identifier 14127, the first example of a detachable hoisting system 14116 attaches to the upper support framework 1414. This attachment allows the first example of a detachable hoisting system 14116 to have a relatively small footprint so that it can fit within the inspection area 1415 right next to the tool 1400, and provides the first example of a detachable hoisting system 14116 with lateral support that allows it to lift, lower, and support the heavy removable components of the tool 1400. Without this high adhesion between the upper support framework 1414 and the detachable hoisting system 14116, the first example 14116 of the detachable hoisting system would be unable to lift, move, and support the removable components, and would rather fall without a support feature extending along the Fab floor, such as legs extending from a conventional lifting mechanism, which may be wider than the area acceptable between the tools.

[0173] The first example of a detachable hoisting system 14116 also includes a hoisting arm 14130, which may be the same as, or similar to, the first hoisting arm described above. For example, the hoisting arm 14130 may include a hoisting feature engagement interface, as described above, and may be configured to pivot about a vertical axis 1434 extending through a vertical member 14118, perpendicular to the second axis 1424 and the first axis 1406. In some embodiments, the first example of a detachable hoisting system 14116 also includes a vertical translation system 14132 configured to translate the hoisting arm 14130 along the vertical axis 1434 in the direction of arrow 1464, as described above. As mentioned above, the vertical load of the detachable components is held by the hoisting arm 14130 and the vertical member 14118, which is transferred to the Fab floor by the connection between the first example of a detachable hoisting system 14116 and the Fab floor.

[0174] The vertical translation system 14132 may be motor-driven or manually powered by a hand crank, or by a cable and winch, as shown in Figure 15B. In some embodiments, when the complementary attachment point 14122 of a first example 14116 of a separable hoisting system is connected to the upper support framework 1414 at attachment point 14112, the hoisting arm 14130 is movable so that the hoisting feature engagement interface can be moved to engage with one of the hoisting features in the removable components of the semiconductor processing chamber 1404 in the first plurality of semiconductor processing chambers 1402. The mobility of the hoisting arm 14130 may be the same as the mobility described above, including, for example, the mobility shown in Figures 6A to 6E, and as a result, the hoisting arm 14130 can be moved horizontally or in a plane perpendicular to the vertical axis 1434.

[0175] In some embodiments, the first example 14116 of the separable hoisting system is configured to translate along a second axis 1424. In some such embodiments, the attachment system may have a guide rail 14114 and a movable attachment point 14112 connected to the guide rail 14114 and movable along the second axis 1424, as described above, so that when the complementary attachment point 14122 of the first example 14116 of the separable hoisting system is connected to the upper support framework 1414 at the attachment point 14112, the first example 14116 of the separable hoisting system and the attachment point 14112 can move together simultaneously along the second axis 1424, as indicated by arrow 1428 in Figure 14. In Figures 15A and 15B, this movement may be thought of as moving in and out of the page. This movement allows the first example 14116 of the separable hoisting system to connect to any of the removable components of the first plurality of semiconductor processing chambers 1402, enabling it to be lifted, moved, and lowered. In such an embodiment, the moving mechanism 14124 is in contact with the floor 14128 of the Fab, allowing the vertical member 14118 to move along the second axis 1424 together with the rest of the first example 14116 of the separable hoisting system.

[0176] In some embodiments, second examples of detachable hoisting systems may be provided that are configured similarly to the first example of a detachable hoisting system, but differ in several respects. This second example of a detachable hoisting system includes a vertical member, a hoisting arm, at least one attachment point for connection to a tool, wheels or rollers that enable this second example of a detachable hoisting system to move around a semiconductor processing facility, and additional features and configurations described herein. In some examples, the second example of a detachable hoisting system may not be able to stand on its own, nor may it be able to support the load of a detachable component without being connected to a tool. Figure 16 shows a perspective view of a second example of a detachable hoisting system 16116, which includes a vertical member 16118 with an upper end 16120 having a high attachment point 16121 (also referred to herein as a complementary attachment point) and a lower end 16124 having a moving mechanism 16126 such as a wheel or track, and further includes a hoisting arm 16130 and a vertical translation system 16132.

[0177] In some embodiments, the hoisting arm 16130 may be the same as, or similar to, the first hoisting arm and hoisting arm 14130 described above. In some embodiments, the hoisting arm 16130 may include two or more links, as shown in Figure 16. In Figure 16, the hoisting arm 16130 has three links, the first link 16131 and the second link 16133 are parallel to each other and together with the third link 16139 form a double shoulder joint 16135 and a double elbow joint 16137. The hoisting arm 16130 is configured to pivot at the double shoulder joint 16135 about a vertical axis 1634 that is substantially parallel to the longitudinal axis of the vertical member 16118 (substantially meaning parallel within a range of, for example, about 5% or 1%). The longitudinal axis, as shown in Figure 21, extends along the length of the vertical member 16118 and intersects with the first end 16120 and the second end 16124. The hoisting arm 16130 is also configured to rotate at the elbow joint 16137 about another axis 16141 parallel to the vertical axis 1634. The distal end of the third link 16139 of the hoisting arm 16130 may have one of the hoisting feature engagement interfaces described above, so as to be configured to engage with any of the hoisting features among the removable components described herein. Depending on the configuration of the hoisting arm, the hoisting arm may be movable as described above, including, for example, as shown in Figures 6A to 6E, so as to be able to move horizontally or in a plane perpendicular to the vertical axis 1634. This movement is also illustrated in Figures 20A and 20B.

[0178] The vertical translation system 16132 may be motor-driven by a motor 16166 and a drive screw 16167, as shown in Figure 16, or it may be manually powered. The vertical translation system 16132 is configured to translate the hoisting arm 16130 along the vertical axis 1634. As described above, this allows the hoisting arm 16130 to lift and lower the removable components of the tool.

[0179] A second example of a detachable hoisting system may be attached to a tool in a variety of ways. For example, like the first example of a detachable hoisting system, the second example of a detachable hoisting system may be connected to the tool at a single high attachment point, while the lowest part of the second example of a detachable hoisting system may be positioned on and supported by the floor of the manufacturing facility. In some embodiments, the second example of a detachable hoisting system may be connected to the tool at two different attachment points, such as an upper attachment point and a lower attachment point. Figure 17 depicts yet another example of a semiconductor processing tool. Similar to the other figures above, example tool 1700 includes not only an upper support framework 1714, semiconductor processing chambers 1704 in a first plurality of semiconductor processing chambers 1702 arranged along a first axis 1706, and a base portion 1716 fixedly attached to the upper support framework 1714, either directly or indirectly, but also removable components such as a removable upper cover 1718 with hoisting features as described above. The tool also includes one or more upper attachment points 17112A-17112D fixedly attached to the upper support framework 1714, and one or more lower attachment points 17113A-17113D fixedly attached to the lower elements of the tool, such as the lower frame or plate 17115. In some embodiments, as illustrated in Figure 17, each upper attachment point has a corresponding lower attachment point, and each pair may be positioned parallel to each other along an axis perpendicular to a first axis 1706, such as the vertical axis 1634.

[0180] Figures 18A and 18B depict side views of the attachment sequence between the tool and the second example of the detachable hoisting system in Figures 16 and 17. In Figure 18A, the second example of the detachable hoisting system 16116 is detached from the tool 1700, but aligned with the tool 1700, so that the upper attachment point 17112 of the tool 1700 can connect to the higher attachment point 16121 of the second example of the hoisting system 16116, and the lower attachment point 16123 of the second example of the detachable hoisting system 16116 can connect to the lower attachment point 17113 of the tool, as indicated by the dashed double-headed arrows. The lower attachment point 17113 may be configured to support the weight of the second example of the hoisting system 16116, such as having a U-shaped socket that receives the horizontal bar of the lower attachment point 16123, as can be understood in Figure 18A.

[0181] In Figure 18B, the second example 16116 of the detachable hoisting system is connected to the tool 1700 at an upper attachment point 17112 and a lower attachment point 17113. This attachment allows the second example 17116 of the detachable hoisting system to have a relatively small footprint, allowing it to fit within the inspection area right next to the tool 1700, and provides the second example 17116 with lateral and vertical support that enables it to lift, lower, and support the heavy, removable components of the tool 1700. Without these upper and lower attachment points, the second example 17116 of the detachable hoisting system would not be able to lift, move, and support the removable components without potentially dropping them. In some embodiments, as depicted in Figure 18B, the second example 16116 of the detachable hoisting system may not have to be in direct contact with, or supported by, the floor of the manufacturing facility when connected to the tool 1700. In some such embodiments, vertical loads supported by the second example 16116 of the separable hoisting system are transmitted to the tool 1700 through upper attachment point 17112 and lower attachment point 17113, and these loads are not transmitted directly to the floor through direct contact between the floor and the second example 16116 of the separable hoisting system. In some other embodiments, the second example 16116 of the separable hoisting system may be in direct contact with and thereby supported by the floor of the manufacturing facility so that vertical loads supported by the second example 16116 of the separable hoisting system are transmitted directly to the floor.

[0182] When connected to the tool, the hoisting arm 16130 is movable so that, as described above, the hoisting feature engagement interface of the hoisting arm 16130 can be moved to engage with one of the hoisting features of the removable components. Figure 19 shows a perspective view of a second example 16116 of a detachable hoisting system connected to the tool 1700 in Figures 17–18B. As shown in Figure 19, the hoisting arm 16130 is moved so that its hoisting feature engagement interface 1652 can engage with the hoisting feature 1942 of the removable component 1718. Once these items are engaged, the hoisting arm 16130 can be moved in a plane perpendicular to the vertical axis 1634, which is located within the x and y axes shown in the figure, in order to move the removable component 1718. The vertical translation system 16132 can also raise and lower removable components along the drawn z-axis, i.e., the vertical axis 1634, which may be substantially parallel to each other (for example, within a range of ±5%).

[0183] Figures 20A and 20B illustrate the sequence of movement of an example of a removable component by a second example 16116 of a separable hoisting system. These figures, along with Figures 6A to 6E above, show the second example 16116 of a separable hoisting system attached to tool 1700, as shown in Figures 17 to 19. no tsu ru 1700This is a simplified top view, viewed at an angle parallel to the vertical axis 1634 in Figures 16, 18A, and 19, so that the vertical axis 1634 is perpendicular to the page and extends into the page. The semiconductor processing chamber 1704 in the first plurality of semiconductor processing chambers 1702 is also visible, along with the base portion 1716 of these chambers, the hoisting arm 1730, and the hoisting feature engagement interface 1752 engaged with the hoisting feature 1742 of the removable component 1718. As can be seen in Figure 20B, the hoisting arm 16130 is movable so that the removable component 1718 can be moved away from the processing chamber 1704 in a direction at least perpendicular to the axis 1706, as indicated by the arrow on the removable component 1718. This movement is made possible by the movement of the links and joints of the hoisting arm 16130, including rotation around the vertical axis 1634 and the other axis 16141. In some embodiments, the hoisting arm 16130 may have only one link, and the removable component 1718 may still be movable in a plane perpendicular to the vertical axis 1634, as described above, including in cases where the first carriage remains stationary. This movement of the hoisting arm also allows the removable component engaged with the hoisting arm to move outside the tool's enveloping surface 20170, as described above and partially depicted in Figure 20B.

[0184] In some embodiments, a second example of a separable hoisting system may be configured such that the vertical translation system and the hoisting arm can move together as a single unit along a vertical member. This may allow the second example of a separable hoisting system to move easily around a manufacturing facility and be stored without taking up much space when not in use. This also advantageously allows the vertical translation system to be moved out of the way during installation and removal from a tool so that the vertical translation system does not obstruct or interfere with access to high attachment points. Figure 21 depicts another configuration of the second example of a separable hoisting system of Figure 16. In Figure 21, the second example of a separable hoisting system 16116 includes a slide rail 16145 configured such that the vertical translation system 16132 and the hoisting arm 16130 can move together as a single unit along the vertical member 16118 along its longitudinal axis 16147. As can be seen in Figure 21, the vertical translation system 16132 and the hoisting arm 16130 are moved together toward the lower end of the vertical member 16118. This movement may not be powered in some embodiments, while in other embodiments it may be powered by a motor, a linear actuator, or other mechanism described herein.

[0185] As mentioned above, the second example 16116 of the detachable hoisting system can be moved around the floor of the manufacturing facility by positioning the moving mechanism 16126 on the floor of the manufacturing facility. In some embodiments, the moving mechanism 16126 may include a pair of foldable wheels 16149 as shown in Figure 21. In Figure 21, the pair of foldable wheels 16149 is not folded, which allows all four wheels of the second example 16116 of the detachable hoisting system to be positioned on the floor and supported by the floor, so that it can move around the floor. The pair of foldable wheels 16149 is not intended to support the load of the removable components of the tool, but rather to assist in moving the second example 16116 of the detachable hoisting system. In Figure 18A, a set of foldable wheels 16149 appears folded or bent to reduce the footprint of a second example 16116 of a mounted, detachable hoisting system.

[0186] As explicitly stated above, the tool may include additional upper and lower attachment points so that a second example of a detachable hoisting system can be positioned at various locations on the tool to access all of the semiconductor processing chambers of the tool. Referring to Figure 20B, for example, the tool 1700 may include additional upper and lower attachment points around some or all of the semiconductor processing chambers, such as around location 20150. This allows the second example of a detachable hoisting system 16116 to be detachably connected to the tool 1700 at each of these locations 20150 so that it can access all of the removable components on top of the semiconductor processing chambers 1704A-1704E. In some embodiments, each pair of upper and lower attachment points may be positioned approximately between two side-by-side chambers so that the second example of a detachable hoisting system 16116 can be positioned at one location to access the removable components of both side-by-side chambers. For example, referring to Figure 20A, the upper and lower attachment points to which the second example 16116 of the separable hoisting system attaches allow the second example 16116 of the separable hoisting system to access the removable components of both semiconductor processing chambers 1704D and 1704E. Thus, in some such embodiments, the number of pairs of upper and lower attachment points may be one less than the number of semiconductor processing chambers. In the example Figures 20A and 20B, the multiple semiconductor processing chambers 1702 have five chambers 1704A-1704E, and the four pairs of upper and lower attachment points may be positioned approximately between each of these chambers at location 20150, as can be seen in Figure 17 which depicts four pairs of upper and lower attachment points 17112A-17112D and 17113A-17113D.

[0187] As stated above, the connection between the detachable hoisting system and the tool is reconfigurable, thereby allowing the system to attach to the tool and remove the system from the tool without destructive means. This may involve using bolts, pins, screws, clamps, or other features that can be fixed together and removed without damaging the tool or system, such as by welding. Thus, the detachable hoisting system can be moved into position and attached to a tool for a limited time, such as the time required for inspection or repair, and then removed and moved to another tool or to a separate storage location within the facility.

[0188] The detachable hoisting system may also include any of the safety features described above, such as power cords routed along the hoisting arm and safety protection devices.

[0189] In addition to the claims enumerated herein, the following additional implementations should be understood to fall within the scope of this disclosure.

[0190] Implementation form 1: A semiconductor processing tool comprising a support framework, a first plurality of semiconductor processing chambers arranged along a first axis, a first attachment point connected to the support framework, and a first separable hoisting system having a base portion on which each semiconductor processing chamber is fixedly mounted relative to the support framework and a removable upper cover with one or more hoisting features, wherein the first separable hoisting system comprises a vertical member having an upper end with a complementary attachment point and a lower end with a moving mechanism, the complementary attachment point being separably connected to the first attachment point, the moving mechanism being supported by the floor, and the first separable hoisting system further comprises a hoisting arm having one or more links connected to the vertical member, the hoisting arm being configured to pivot about a vertical axis substantially perpendicular to the first axis, and the hoisting arm comprising a hoisting feature engagement interface configured to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers.

[0191] Implementation form 2: A semiconductor processing tool according to implementation form 1, wherein the first separable hoisting system further includes a vertical translation system configured to translate the hoisting arm perpendicular to the support framework and parallel to the vertical axis.

[0192] Implementation form 3: A semiconductor processing tool according to implementation form 2, wherein the first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input causing the semiconductor processing tool to translate a hoisting arm along a vertical member.

[0193] Implementation form 4: A semiconductor processing tool of implementation form 2, wherein the first vertical translation system is configured to move together with the hoisting arm as a single unit along a vertical member.

[0194] Implementation form 5: A semiconductor processing tool according to implementation form 1, wherein the moving mechanism includes foldable wheels.

[0195] Implementation form 6: A semiconductor processing tool comprising a support framework having an upper attachment point, a lower attachment point vertically offset below the upper attachment point, a first plurality of semiconductor processing chambers arranged along a first axis, and a separable hoisting system having a base portion fixedly mounted to the support framework and a removable component with one or more hoisting features, wherein the separable hoisting system comprises an upper end having a high attachment point, a lower end having a lowest attachment point, and a vertical member with a moving mechanism, wherein the high attachment point is detachably connected to the upper attachment point, and the lowest attachment point is detachably connected to the lower attachment point, and the separable hoisting system further comprises a hoisting arm having one or more links configured to pivot about a vertical axis substantially perpendicular to the first axis, and a vertical translation system configured to translate the hoisting arm perpendicular to the support framework and parallel to the vertical axis, wherein the hoisting arm includes a hoisting feature engagement interface configured to engage with any of the hoisting features in the removable components of the first plurality of semiconductor processing chambers.

[0196] Implementation form 7: A semiconductor processing tool according to implementation form 6, wherein the vertical translation system includes a motor configured to provide a first mechanical input to the vertical translation system, the first mechanical input causing the hoisting arm to translate in a direction parallel to the vertical axis of the semiconductor processing tool.

[0197] Implementation form 8: A semiconductor processing tool of implementation form 7, further comprising a power supply, a detachable hoisting system, further comprising an electrical control cable connected to the power supply, routed along a hoisting arm, and terminated by a connector, each detachable component further comprising an electrical interface configured to be connectable to a connector, the electrical control cable being of a length such that the connector and the hoisting feature engagement interface of the hoisting arm are each simultaneously engaged with only one electrical interface and hoisting feature of the semiconductor processing chamber at any one time.

[0198] Implementation form 9: A semiconductor processing tool according to implementation form 8, further comprising a controller comprising one or more processors and one or more non-temporary memory elements, wherein the non-temporary memory elements control one or more processors to receive information regarding the operating state of each semiconductor processing chamber and store instructions via an electrical interface to cause one of the semiconductor processing chambers to provide a first operating signal to operate the vertical translation system only when the information regarding the operating state of that semiconductor processing chamber indicates that the semiconductor processing chamber is in a state safe for humans.

[0199] Implementation form 10: A semiconductor processing tool according to implementation form 8, wherein a removable component receives power from a power source through an electrical cable.

[0200] Implementation form 11: A semiconductor processing tool according to implementation form 7, wherein the vertical translation system comprises a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and a cable winding device.

[0201] Implementation form 12: A semiconductor processing tool of implementation form 6, further comprising a first interlock configured to prevent the first vertical translation system from translating the first hoisting arm vertically when a detachable hoisting system engages with a hoisting feature in any of the removable components of the first plurality of semiconductor processing chambers and does not engage with a hoisting feature in a removable upper cover of the first plurality of semiconductor processing chambers.

[0202] Implementation form 13: A semiconductor processing tool according to implementation form 6, wherein the moving mechanism is a semiconductor processing tool equipped with four wheels.

[0203] Implementation form 14: A semiconductor processing tool according to implementation form 6, wherein the moving mechanism is a semiconductor processing tool equipped with a set of foldable wheels.

[0204] Implementation form 15: A semiconductor processing tool according to implementation form 6, wherein the first vertical translation system is configured to move together with the hoisting arm as a single unit along a vertical member.

[0205] Implementation form 16: A semiconductor processing tool according to implementation form 15, wherein the vertical member further includes a slide rail configured to move a first vertical translation system.

[0206] Implementation form 17: A semiconductor processing tool according to implementation form 6, wherein the moving mechanism is not supported by the floor when connected to the lower attachment point and the upper attachment point.

[0207] Implementation form 18: A semiconductor processing tool according to implementation form 6, wherein the moving mechanism is supported by the floor when connected to a lower attachment point and an upper attachment point.

[0208] Implementation form 19: A semiconductor processing tool according to implementation form 6, wherein the lower attachment point is vertically offset below the base portion of the multiple processing chambers.

[0209] Implementation form 20: A semiconductor processing tool according to implementation form 6, wherein the support framework further includes a plurality of upper attachment points, the tool further includes a plurality of lower attachment points offset below the plurality of upper attachment points, the plurality of semiconductor processing chambers include N processing chambers, the plurality of upper attachment points include N-1 upper attachment points, and the plurality of lower attachment points include N-1 lower attachment points.

[0210] Implementation form 21: A semiconductor processing tool according to implementation form 6, wherein the hoisting arm further comprises three or more links, a double shoulder joint, and a double elbow joint.

[0211] Implementation form 22: A semiconductor processing tool according to implementation form 6, wherein the removable component is not a substrate.

[0212] Implementation form 23: A semiconductor processing tool according to implementation form 6, wherein the hoisting arm is not configured to support a substrate.

[0213] Implementation form 24: A semiconductor processing tool according to implementation form 23, wherein the winding feature engagement interface is not configured to support the substrate.

[0214] The features of the tools described herein offer numerous advantages for lifting and moving removable components compared to conventional lifting mechanisms. These features allow cluster tools to be positioned closer together because they do not require additional floor space in the Fab to accommodate a self-supporting hoisting mechanism, the tool's footprint is not expanded, or even slightly expanded, by including these features, and the removable components can be easily accessed and moved quickly, thereby reducing tool downtime for inspection and maintenance. The ability to control the movement of the carriage and hoisting arm using a moving mechanism and controller may also enable more efficient, faster, and safer control and movement of the removable components.

[0215] Unless the contents of this disclosure expressly require otherwise, throughout the specification and claims, terms such as “comprise” and “comprising” should be interpreted in a comprehensive sense, i.e., “inclusive but not limiting,” as opposed to an exclusive or exhaustive sense. Words used in singular or plural also generally include plural or singular, respectively. In addition, the words “in this specification,” “under this specification,” “above,” “below,” and words with similar meanings refer to this application as a whole and not to any particular part thereof. When the word “or” is used in reference to a list of two or more items, the word has the following interpretations: any of the items in the list, all of the items in the list, and all of any combination of items in the list. The term “implementation” refers not only to the implementation of the techniques and methods described herein but also to physical objects that embody the structure and / or incorporate the techniques and / or methods described herein. In this specification, the term “substantially” means within 5% of the reference value unless otherwise specified. For example, "substantially vertical" means vertical within a range of ±5%. This disclosure may be implemented in the following forms: [Form 1] It is a semiconductor processing tool, Upper support framework and A first set of semiconductor processing chambers arranged along a first axis, A first linear guide system extending along a second axis substantially parallel to the first axis, fixed and supported by the upper support framework, First carriage and Equipped with, Each of the semiconductor processing chambers has a base portion fixedly mounted to the upper support framework and a removable upper cover with one or more winding features. The first carriage includes a first hoisting arm with one or more links, The first hoisting arm is configured to pivot about a vertical axis substantially perpendicular to the second axis, The first carriage is configured to be movably engaged with the first linear guidance system and to translate along the second axis relative to the first linear guidance system. The first hoisting arm includes a hoisting feature engagement interface configured to engage with one of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, The first carriage and the first hoisting arm are movable semiconductor processing tools so as to be able to move the hoisting feature engagement interface to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers. [Form 2] A semiconductor processing tool according to Embodiment 1, wherein the first carriage further includes a first vertical translation system that translates the first hoisting arm perpendicular to the first linear guidance system and parallel to the vertical axis. [Form 3] A semiconductor processing tool according to Embodiment 2, further comprising a power supply, The first vertical translation system includes a motor configured to provide a first mechanical input to the first vertical translation system, the first mechanical input causing the first hoisting arm to be translated vertically in a direction parallel to the vertical axis. The first carriage further includes an electrical control cable connected to the power supply, routed along the first hoisting arm, and terminated by a connector. Each of the aforementioned removable top covers further includes an electrical interface configured to be connectable to the connector, The electrical control cable is of a length such that the connector and the hoisting feature engagement interface of the first hoisting arm can each engage with only one electrical interface and one hoisting feature in the semiconductor processing chamber at a time. [Form 4] A semiconductor processing tool according to Embodiment 3, further comprising a controller comprising one or more processors and one or more non-temporary memory elements, wherein the one or more non-temporary memory elements control the one or more processors, Information regarding the operating status of each semiconductor processing chamber is received, The electrical interface causes one of the semiconductor processing chambers to provide a first activation signal that activates the first vertical translation system only when the information regarding the operating state of that semiconductor processing chamber indicates that the semiconductor processing chamber is in a state that is safe for humans. A semiconductor processing tool that stores instructions for a particular purpose. [Form 5] A semiconductor processing tool as described in Embodiment 3, A first carriage position sensor configured to generate data relating to the position of the first carriage along the first linear guidance system, A controller comprising one or more processors and one or more non-temporary memory elements, wherein the one or more non-temporary memory elements control the one or more processors, Based on the data generated by the first carriage position sensor, the position of the first carriage along the first linear guidance system is determined. Based on the determination of the position of the first carriage, power is supplied to the electrical interface of only one of the first plurality of semiconductor processing chambers at a time. A controller that stores instructions for A semiconductor processing tool that also features additional capabilities. [Form 6] A semiconductor processing tool according to Embodiment 5, further comprising an arm position sensor configured to generate data relating to the position of the first hoisting arm relative to the semiconductor processing chamber in the first plurality of semiconductor processing chambers, wherein the one or more non-temporary memory elements control the one or more processors, Based on the data generated by the arm position sensor, the position of the first hoisting arm is determined for each of the semiconductor processing chambers among the first plurality of semiconductor processing chambers. Based on the determination of the position of the first hoisting arm and the determination of the position of the first carriage, power is supplied only to the electrical interface of the semiconductor processing chamber among the first plurality of semiconductor processing chambers that is closest to the hoisting feature engagement interface of the first hoisting arm. A semiconductor processing tool that further stores instructions for use. [Form 7] A semiconductor processing tool according to Embodiment 5, wherein the one or more non-temporary memory elements further store instructions for controlling the one or more processors to move the first hoisting arm through the first carriage and only on the first side of a vertical plane parallel to the vertical axis and perpendicular to the second axis. [Form 8] A semiconductor processing tool as described in Embodiment 3, An engagement sensor configured to generate data relating to whether one of the hoisting features in the removable upper cover is engaged with the hoisting feature engagement interface of the first hoisting arm, A controller comprising one or more processors and one or more non-temporary memory elements, wherein the one or more non-temporary memory elements control the one or more processors, Based on the data generated by the engagement sensor, it is determined whether one of the hoisting features in the removable upper cover of the first plurality of semiconductor processing chambers has engaged with the hoisting feature engagement interface of the first hoisting arm. In response to determining that one of the winding features in the removable upper cover of the first plurality of semiconductor processing chambers and the winding feature engagement interface have engaged, power is supplied only to the electrical interface of the semiconductor processing chamber in the first plurality of semiconductor processing chambers that includes the removable upper cover. A controller that stores instructions for A semiconductor processing tool that also features additional capabilities. [Form 9] A semiconductor processing tool according to Embodiment 3, wherein the removable upper cover receives power from the power supply through the electrical cable. [Form 10] A semiconductor processing tool according to Embodiment 2, wherein the first carriage is Engaging with the winding feature in any of the removable upper covers of the first plurality of semiconductor processing chambers, When the first vertical translation system does not engage with one of the hoisting features in the removable upper cover of the first plurality of semiconductor processing chambers, it prevents the first hoisting arm from translating vertically. A semiconductor processing tool further includes a first interlock configured as such. [Form 11] A semiconductor processing tool according to Embodiment 2, wherein the first vertical translation system is selected from the group consisting of a linear ball screw actuator, a hydraulic actuator, an actuator using a rack and pinion, and a cable winding device. [Form 12] A semiconductor processing tool according to Embodiment 2, further comprising a controller comprising one or more processors and one or more non-temporary memory elements, The first linear guidance system further includes a carriage translation system configured to translate the first carriage along the second axis, The first carriage further includes a hoisting arm moving system configured to move the first hoisting arm in a plane perpendicular to the vertical axis, The one or more non-temporary memory elements control the one or more processors, The carriage translation system is made to move the first carriage along the second axis, The hoisting arm moving system and the first vertical translation system move the first hoisting arm to engage one of the hoisting features in the removable upper cover of the first plurality of semiconductor processing chambers with the hoisting feature engagement interface, When the one of the hoisting features in the removable upper cover engages with the hoisting feature engagement interface, the first vertical translation system causes the removable upper cover to be translated vertically. When the hoisting feature in the removable upper cover engages with the hoisting feature engagement interface, the hoisting arm moving system causes the removable upper cover to translate in the plane perpendicular to the vertical axis. A semiconductor processing tool that stores instructions for a particular purpose. [Form 13] A semiconductor processing tool according to Embodiment 12, wherein the one or more non-temporary memory elements control the one or more processors, When the hoisting feature in the removable upper cover engages with the hoisting feature engagement interface, the hoisting arm moving system and the first vertical translation system move the first hoisting arm to disengage the hoisting feature engagement interface from the hoisting feature in the removable upper cover. A semiconductor processing tool that further stores instructions for use. [Form 14] A semiconductor processing tool according to Embodiment 12, wherein the one or more non-temporary memory elements control the one or more processors, When the one hoisting feature in the removable upper cover engages with the hoisting feature engagement interface, the carriage translation system and the hoisting arm movement system translate the removable upper cover in the plane perpendicular to the vertical axis. A semiconductor processing tool that further stores instructions for use. [Form 15] A semiconductor processing tool as described in Embodiment 1, The semiconductor processing chambers in the first plurality of semiconductor processing chambers are all located inside the tool envelope surface, The first hoisting arm is movable so as to allow any of the first plurality of semiconductor processing chambers to move outside the tool envelope surface. [Form 16] A semiconductor processing tool as described in Embodiment 1, The first linear guidance system further includes a first rail and a second rail that are parallel to each other and offset from each other in a direction parallel to the vertical axis, A semiconductor processing tool wherein the first carriage is configured to engage simultaneously with the first rail and the second rail, and to translate along the second axis relative to the first linear guidance system while simultaneously engaging with the first rail and the second rail. [Form 17] A semiconductor processing tool according to Embodiment 16, wherein the first carriage further includes a first vertical translation system configured to move a first hoisting arm perpendicular to the first linear guidance system and parallel to the vertical axis, below the first linear guidance system and above the base portion of the first plurality of semiconductor processing chambers. [Form 18] A semiconductor processing tool according to Embodiment 17, wherein the first vertical translation system is further configured to vertically translate the first hoisting arm above the first linear guidance system. [Form 19] A semiconductor processing tool as described in Embodiment 1, The first linear induction system is positioned vertically above the first plurality of semiconductor processing chambers, offset in a direction parallel to the vertical axis, The first carriage is a semiconductor processing tool that is vertically offset directly below the first linear induction system. [Form 20] A semiconductor processing tool according to Embodiment 1, wherein the hoisting feature engagement interface is connected to the distal end of the first hoisting arm using a coupling configured to allow the hoisting feature engagement interface to rotate about two or more axes perpendicular to the vertical axis. [Form 21] A semiconductor processing tool according to Embodiment 20, wherein the joint is a spherical joint. [Form 22] A semiconductor processing tool according to Embodiment 20, wherein the joint is further configured such that the hoisting feature engagement interface can rotate about an axis parallel to the vertical axis. [Form 23] A semiconductor processing tool as described in Embodiment 1, Each of the aforementioned removable upper covers includes a pair of saddle posts, Each saddle post includes a pair of vertical riser rods and a saddle plate that defines the upper limit of the vertical riser rods and extends between the riser rods. Each of the saddle plates includes a first mechanical interface feature, The saddle posts of each of the aforementioned hoisting features are positioned such that the first mechanical interface features are spaced apart from each other by a first distance. The hoisting feature engagement interface includes a beam with two second mechanical interface features spaced apart by the first distance, A semiconductor processing tool in which each of the first mechanical interface features is complementary to one of the second mechanical interface features. [Form 24] A semiconductor processing tool as described in Embodiment 1, Each of the first plurality of semiconductor processing chambers includes a removable component selected from a group consisting of a radio frequency (RF) generator, a pump, and a cryogenic pump. Each of the aforementioned removable components includes one or more second winding features, The hoisting arm's hoisting feature engagement interface is further configured to engage with the second hoisting feature of any of the removable components of the first plurality of semiconductor processing chambers. The first carriage and the first hoisting arm are movable semiconductor processing tools so as to be able to move the hoisting feature engagement interface to engage with any of the second hoisting features in any of the removable components of the first plurality of semiconductor processing chambers. [Form 25] A semiconductor processing tool according to Embodiment 1, wherein the first hoisting arm includes a linear section perpendicular to the vertical axis, which includes the hoisting feature engagement interface. [Form 26] A semiconductor processing tool as described in Embodiment 25, The first hoisting arm includes a pivot section configured to pivot about the vertical axis, The first hoisting arm is a semiconductor processing tool that includes an angled section extending between the pivot section and the linear section and oriented at an angle inclined with respect to the vertical axis. [Form 27] A semiconductor processing tool according to Embodiment 1, wherein the first plurality of semiconductor processing chambers comprises two of the semiconductor processing chambers. [Form 28] A semiconductor processing tool according to Embodiment 27, wherein the first plurality of semiconductor processing chambers comprises three of the semiconductor processing chambers. [Form 29] A semiconductor processing tool according to Embodiment 28, wherein the first plurality of semiconductor processing chambers comprises five of the semiconductor processing chambers. [Form 30] A semiconductor processing tool as described in Embodiment 1, A plurality of second semiconductor processing chambers arranged along a third axis substantially parallel to the first axis and offset from the first axis, An internal region disposed between the first plurality of semiconductor processing chambers and the second plurality of semiconductor processing chambers, A second linear guide system extending along a fourth axis substantially parallel to the third axis, fixedly supported by the upper support framework, The second carriage and Furthermore, The first linear guidance system and the second linear guidance system are positioned outside the internal region, Each of the second plurality of semiconductor processing chambers has a second base portion fixedly mounted to the upper support framework and a second removable upper cover having one or more second winding features. The second carriage includes a second hoisting arm with one or more links, The second hoisting arm is configured to pivot about a second vertical axis perpendicular to the fourth axis, The second carriage is configured to be movably engaged with the second linear guidance system and to translate along the fourth axis relative to the second linear guidance system. The second hoisting arm includes a second hoisting feature engagement interface configured to engage with one of the second hoisting features in the second removable upper cover of the semiconductor processing chamber in the second plurality of semiconductor processing chambers, The second carriage and the second hoisting arm are movable semiconductor processing tools such that the second hoisting feature engagement interface can be moved to engage with any of the hoisting features in the second removable upper cover of the semiconductor processing chamber in the second plurality of semiconductor processing chambers. [Form 31] A semiconductor processing tool as described in Embodiment 30, The base portion of the first plurality of semiconductor processing chambers, the second base portion of the second plurality of semiconductor processing chambers, and the internal region are all located inside the second envelope surface. The first hoisting arm is movable so as to move one of the removable upper covers in the first plurality of semiconductor processing chambers outside the second envelope surface, The second hoisting arm is a movable semiconductor processing tool that allows one of the second removable upper covers in the second plurality of semiconductor processing chambers to move outside the second envelope surface. [Form 32] A semiconductor processing tool as described in Embodiment 30, The second removable upper cover is of the same type as the first removable upper cover. The second hoisting feature engagement interface is of the same type as the hoisting feature engagement interface. The second winding feature is a semiconductor processing tool consisting of the same type as the first winding feature. [Form 33] A semiconductor processing tool according to Embodiment 1, further comprising a bellows that creates a seal at the interface between the first carriage and the first linear guide system when the first carriage engages with the first linear guide system. [Form 34] A semiconductor processing tool as described in Embodiment 1, Equipped with a second carriage, The second carriage includes a second hoisting arm with one or more links, the second hoisting arm being configured to pivot about a second vertical axis perpendicular to the second axis, The second carriage is configured to be movably engaged with the first linear guidance system and to translate along the second axis relative to the first linear guidance system. The second hoisting arm includes a second hoisting feature engagement interface configured to engage with one of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers, The second carriage and the second hoisting arm are movable so that the second hoisting feature engagement interface can be moved to engage with any of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers. The first linear guidance system is further configured such that the first carriage and the second carriage can simultaneously engage with the first linear guidance system and move along the second axis of a semiconductor processing tool. [Form 35] A semiconductor processing tool as described in Embodiment 1, wherein the removable upper cover is not a substrate. [Form 36] A semiconductor processing tool according to Embodiment 1, wherein the first hoisting arm is not configured to support a substrate. [Form 37] A semiconductor processing tool according to Embodiment 36, wherein the winding feature engagement interface is not configured to support the substrate.

Claims

1. It is a semiconductor processing tool, Supporting framework and A first set of semiconductor processing chambers arranged along a first axis, A first attachment point connected to the aforementioned support framework, It comprises a first detachable hoisting system, Each semiconductor processing chamber comprises a base portion fixedly mounted to the support framework and a removable upper cover including one or more winding features. The first detachable hoisting system comprises a vertical member, the vertical member comprising an upper end including a complementary attachment point and a lower end including a moving mechanism, The complementary attachment point is connected to the first attachment point so as to be separable. The aforementioned moving mechanism is supported by the floor, The first detachable hoisting system further comprises a hoisting arm connected to the vertical member, the hoisting arm comprising one or more links, The hoisting arm is configured to pivot about a vertical axis perpendicular to the first axis, A semiconductor processing tool comprising a hoisting arm comprising a hoisting feature engagement interface configured to engage with one of the hoisting features in the removable upper covers of the first plurality of semiconductor processing chambers.

2. A semiconductor processing tool according to claim 1, The first separable hoisting system further comprises a vertical translation system configured to at least partially translate the hoisting arm perpendicular to the support framework and parallel to the vertical axis, in a semiconductor processing tool.

3. A semiconductor processing tool according to claim 2, The vertical translation system includes a motor configured to provide a first mechanical input to the vertical translation system. The first mechanical input is a semiconductor processing tool that causes the hoisting arm to be translated at least partially along the vertical member.

4. A semiconductor processing tool according to claim 2, The aforementioned vertical translation system is configured to move together with the hoisting arm as a single unit along the vertical member, and is used as a semiconductor processing tool.

5. A semiconductor processing tool according to claim 1, The aforementioned mobile mechanism is a semiconductor processing tool equipped with foldable wheels.

6. It is a semiconductor processing tool, A support framework with an upper attachment point, A lower attachment point that is vertically offset below the upper attachment point, A first set of semiconductor processing chambers arranged along a first axis, It is equipped with a detachable hoisting system, Each semiconductor processing chamber comprises a base portion fixedly mounted to the support framework and a removable component including one or more winding features. The detachable hoisting system includes a vertical member, The vertical member comprises an upper end including a high attachment point, a lower end including a lowest attachment point, and a moving mechanism. The aforementioned high attachment point is connected to the upper attachment point so that it can be separated, The lowest attachment point is connected to the lower attachment point so as to be separable, The aforementioned detachable hoisting system further includes: A hoisting arm comprising one or more links, configured to pivot about a vertical axis perpendicular to the first axis, The system comprises a vertical translation system configured to move the hoisting arm perpendicular to the support framework and at least partially in a direction parallel to the vertical axis, A semiconductor processing tool comprising a hoisting arm having a hoisting feature engagement interface configured to engage with the hoisting feature of any of the removable components of a first plurality of semiconductor processing chambers.

7. A semiconductor processing tool according to claim 6, The vertical translation system includes a motor configured to provide a first mechanical input to the vertical translation system. The first mechanical input is a semiconductor processing tool that causes the hoisting arm to be at least partially translated in the direction parallel to the vertical axis.

8. A semiconductor processing tool according to claim 7, further, Equipped with a power supply, The detachable hoisting system further comprises an electrical control cable connected to the power supply, routed along the hoisting arm, and terminated with a connector. Each of the aforementioned removable components further comprises an electrical interface that can be connected to the connector, A semiconductor processing tool wherein the electrical control cable is of a length such that the connector and the hoisting feature engagement interface of the hoisting arm can each engage with only one electrical interface and one hoisting feature in the semiconductor processing chamber at a time.

9. A semiconductor processing tool according to claim 8, further, At least one processor, At least one non-temporary memory, which, in response to being executed by the at least one processor, provides at least one to the at least one processor. Information regarding the operating status of each semiconductor processing chamber is received. A first operating signal is transmitted via one of the electrical interfaces of the semiconductor processing chamber, configured to at least partially operate the vertical translation system in response only to the information relating to the operating state of the semiconductor processing chamber indicating that the semiconductor processing chamber is in a state that is safe for humans. A non-temporary memory comprising one or more sequences of one or more instructions, A semiconductor processing tool equipped with the following features.

10. A semiconductor processing tool according to claim 8, The removable component is configured to receive power from the power supply through the electrical control cable, and is a semiconductor processing tool.

11. A semiconductor processing tool according to claim 7, The vertical translation system is a semiconductor processing tool comprising a linear ball screw actuator, a hydraulic actuator, a rack and pinion actuator, and / or a cable winding device.

12. A semiconductor processing tool according to claim 6, The detachable hoisting system further includes a first interlock, Engaging with the winding feature of any of the removable components of the first plurality of semiconductor processing chambers, In response to the failure to engage with one of the hoisting features in the removable upper cover of the first plurality of semiconductor processing chambers, the vertical translation system prevents the hoisting arm from translating at least partially vertically. A semiconductor processing tool comprising a first interlock configured as follows.

13. A semiconductor processing tool according to claim 6, The aforementioned mobile mechanism is a semiconductor processing tool equipped with four wheels.

14. A semiconductor processing tool according to claim 6, The aforementioned mobile mechanism is a semiconductor processing tool equipped with a set of foldable wheels.

15. A semiconductor processing tool according to claim 6, The aforementioned vertical translation system is configured to move together with the hoisting arm as a single unit along the vertical member, and is used as a semiconductor processing tool.

16. A semiconductor processing tool according to claim 15, The semiconductor processing tool further comprises a vertical member with a slide rail configured to allow the vertical translation system to move.

17. A semiconductor processing tool according to claim 6, The aforementioned moving mechanism is a semiconductor processing tool that, when connected to the lower attachment point and the upper attachment point, is not supported by the floor.

18. A semiconductor processing tool according to claim 6, The moving mechanism is a semiconductor processing tool that is supported by the floor when connected to the lower attachment point and the upper attachment point.

19. A semiconductor processing tool according to claim 6, A semiconductor processing tool wherein the lower attachment point is vertically offset below the base portion of the first plurality of semiconductor processing chambers.

20. A semiconductor processing tool according to claim 6, The support framework further comprises a plurality of upper attachment points, The semiconductor processing tool further comprises a plurality of lower attachment points offset below the plurality of upper attachment points, A semiconductor processing tool comprising N semiconductor processing chambers, N-1 upper attachment points, and N-1 lower attachment points.

21. A semiconductor processing tool according to claim 6, The hoisting arm further comprises three or more links, a double shoulder joint, and a double elbow joint, in a semiconductor processing tool.

22. A semiconductor processing tool according to claim 6, The aforementioned removable component is a semiconductor processing tool, not a circuit board.

23. A semiconductor processing tool according to claim 6, The aforementioned hoisting arm is not configured to support a substrate in the semiconductor processing tool.

24. A semiconductor processing tool according to claim 23, The aforementioned winding feature engagement interface is not configured to support a substrate in a semiconductor processing tool.

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