Temperature compensation system, semiconductor device, and temperature compensation method

Abstract

The present invention provides a temperature compensation system including a cavity, a temperature feedback module, a heating plate, a main heating module, a multi-zone temperature control module, a distributed temperature control module, and at least one auxiliary temperature adjustment module. At least one temperature control compensation region is provided on the bottom surface of the heating plate. The auxiliary temperature adjustment module and the temperature control compensation region are arranged in correspondence. The temperature feedback module performs temperature detection on the heating plate and obtains a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to perform temperature adjustment on the heating plate based on the first temperature value. The distributed temperature control module controls the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation region based on the second temperature value. It avoids complex wiring design, has a small occupied space, saves costs, and has high temperature control accuracy. The present invention further provides a semiconductor device and a temperature compensation method.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and particularly to a temperature compensation system, a semiconductor device, and a temperature compensation method.

Background Art

[0002] Currently, in the wafer baking process during semiconductor manufacturing, it is necessary to frequently use a substrate baking unit. In the heating and baking process, the temperature uniformity of the substrate is very important for whether the process capability index can be achieved. Therefore, it is equally important to effectively adjust the temperature uniformity of the substrate.

[0003] Currently, the conventional solution for adjusting the substrate temperature in the industry is to optimize the heating circuit of the heater and appropriately increase the number of zones of the heater to improve the temperature uniformity of the heating plate. However, this solution has limitations. First, it is impossible to significantly improve the temperature uniformity during the wafer baking process only by optimizing the circuit layout of the heater, optimizing the hardware structure around the heater, and even performing the necessary thermal field analysis. If we want to significantly improve the temperature uniformity during the wafer baking process, the solution adopted is to increase the number of zones of the heater, so that different zones of the heater can be individually controlled through a multi-zone temperature control system. However, such a conventional solution significantly increases the development cycle of the heater, increases the research and development cost of the heater, requires more stringent management and control requirements for the manufacturing process of the heater, which results in a decrease in the yield of the heater, and the price of the multi-zone high-precision heater becomes higher. On the other hand, in the solution of optimizing the heating circuit by adding zones, the power lines and the wires of the temperature sensors become more, the wiring becomes more complex, the design of the peripheral structure of the heater becomes difficult, adding zones to the heater significantly increases the cost of the temperature control part, and at the same time, the installation space of the hardware becomes larger.

[0004] Therefore, in order to solve the above problems in the prior art, it is necessary to provide a temperature compensation system, a semiconductor device, and a temperature compensation method. [Overview of the Initiative]

[0005] The objective of the present invention is to provide a temperature compensation system, a semiconductor device, and a temperature compensation method in order to solve the problems of the high cost and the large space required for hardware installation in the prior art for adjusting substrate temperature.

[0006] To achieve the above objective, the temperature compensation system of the present invention includes a cavity, a temperature feedback module, a heating plate, a multizone temperature control module, a distributed temperature control module, a main heating module for heating the heating plate, and at least one auxiliary temperature adjustment module, wherein the cavity and the bottom surface of the heating plate form a mounting chamber, the main heating module, the auxiliary temperature adjustment module, and the distributed temperature control module are provided inside the mounting chamber, the distributed temperature control module is communicated with the temperature feedback module and the auxiliary temperature adjustment module, and the multizone temperature control module is communicated with the temperature feedback module and the main heating module. At least one temperature control compensation region is provided on the bottom surface of the heating plate, and the auxiliary temperature adjustment module is positioned in correspondence with the temperature control compensation region. The temperature feedback module detects the temperature of the heating plate and obtains a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to adjust the temperature of the heating plate based on the first temperature value. The distributed temperature control module controls the auxiliary temperature control module to perform temperature compensation adjustments to the temperature control compensation region based on the second temperature value.

[0007] The beneficial effects of the temperature compensation system of the present invention are as follows: By positioning an auxiliary temperature control module in the temperature control compensation area, temperature compensation adjustment is performed on the heating plate, avoiding complex wiring designs, resulting in smaller occupied space and solving the problems of high costs and large hardware installation space in conventional technologies. The heating plate is detected by a temperature feedback module to obtain a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to adjust the temperature of the heating plate based on the first temperature value, and the distributed temperature control module controls the auxiliary temperature control module to perform temperature compensation adjustment on the temperature control compensation area based on the second temperature value. Through temperature adjustment and temperature compensation adjustment, the temperature of the heating plate becomes more uniform, effectively controlling temperature uniformity and achieving high temperature control accuracy while minimizing manufacturing and maintenance costs.

[0008] After the heating power of the main heating module stabilizes, the temperature feedback module performs a first temperature detection on the heating plate, obtains the first temperature value, and feeds the first temperature value back to the multizone temperature control module. After the temperature adjustment is complete, the temperature feedback module performs a second temperature detection on the heating plate, obtains the second temperature value, and feeds the second temperature value back to the distributed temperature control module.

[0009] The system optionally further includes a partition plate provided between the main heating module and the dispersed temperature control module, wherein the auxiliary temperature control module is provided on the partition plate.

[0010] Optionally, the partition plate is provided with lead holes for passing leads through.

[0011] Optionally, the auxiliary temperature control module includes a temperature compensation unit that communicates with the distributed temperature control module, wherein the distance between the temperature compensation unit and the corresponding temperature control compensation area is 0 or greater.

[0012] Optionally, the auxiliary temperature control module further includes a fixing assembly for securing the temperature compensation unit to the corresponding temperature control compensation area.

[0013] Optionally, the auxiliary temperature control module further includes a support member provided on the partition plate, an elastic member provided inside the support member, and a mounting portion provided at the uppermost end of the elastic member, and the temperature compensation unit is provided on the side of the mounting portion facing the heating plate, The elastic member, through the action of the support member, applies force to the temperature compensation unit in the direction corresponding to the temperature control compensation region, thereby adjusting the distance between the temperature compensation unit and the corresponding temperature control compensation region.

[0014] Optionally, a lead hole for passing a lead through is provided inside the support member.

[0015] Optionally, the temperature compensation unit includes a heating unit and a cooling unit, which are provided at intervals from each other.

[0016] If, optionally, the second temperature value is smaller than a preset second target temperature, the distributed temperature control module controls the heating unit to perform temperature compensation adjustments to the temperature control compensation region corresponding to the second temperature value.

[0017] If, optionally, the second temperature value is greater than a preset second target temperature, the distributed temperature control module controls the cooling unit to perform temperature compensation adjustments to the temperature control compensation region corresponding to the second temperature value.

[0018] Optionally, the temperature compensation system further includes a temperature control seal plate provided inside the mounting chamber, the temperature control seal plate being located at the bottom edge of the heating plate, an insulating space being formed between the temperature control seal plate, the heating plate and the inner wall of the mounting chamber, and the distributed temperature control module and the auxiliary temperature adjustment module both being provided in the insulating space.

[0019] Optionally, the upper surface of the heating plate includes a substrate contact area, the lower surface of the heating plate includes a bottom surface control area corresponding to the substrate contact area, and the temperature control compensation area is any area within the bottom surface control area.

[0020] The present invention further provides a semiconductor device including the temperature compensation system.

[0021] The present invention Step S0 provides a heating plate having at least one temperature control compensation region on its bottom surface, a main heating module, and an auxiliary temperature adjustment module arranged in correspondence with the temperature control compensation region. Step S1 involves detecting the temperature of the heating plate and obtaining a first temperature value and a second temperature value. Step S2 controls the main heating module to adjust the temperature of the heating plate based on the first temperature value, The present invention further provides a temperature compensation method including step S3, which controls the auxiliary temperature control module to perform temperature compensation adjustments to the temperature control compensation region based on the second temperature value. [Brief explanation of the drawing]

[0022] [Figure 1] Figure 1 is a schematic cross-sectional diagram of a temperature compensation system according to an embodiment of the present invention. [Figure 2] Figure 2 is a circuit connection block diagram of a temperature compensation system according to an embodiment of the present invention. [Figure 3]FIG. 3 is a schematic structural diagram of a temperature feedback module and a distributed temperature control module according to an embodiment of the present invention. [Figure 4] FIG. 4 is a front view of an auxiliary temperature adjustment module according to an embodiment of the present invention. [Figure 5] FIG. 5 is a cross-sectional view of an auxiliary temperature adjustment module according to an embodiment of the present invention. [Figure 6] FIG. 6 is a schematic diagram of an enlarged structure of A in FIG. 1. [Figure 7] FIG. 7 is a flowchart of a temperature compensation method according to an embodiment of the present invention.

Embodiments for Carrying Out the Invention

[0023] In order to make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the technical field to which the present invention pertains. Similar words such as "including" used herein mean that the elements or things appearing before the word include the elements or things cited after the word and their equivalents, but do not exclude other elements or things.

[0024] Considering the problems existing in the prior art, the embodiments of the present invention provide a temperature compensation system. FIG. 1 is a schematic cross-sectional structure diagram of a temperature compensation system according to an embodiment of the present invention, and FIG. 2 is a circuit connection block diagram of a temperature compensation system according to an embodiment of the present invention.

[0025] Referring to Figures 1 and 2, the temperature compensation system of the present invention includes a cavity 1, a temperature feedback module 4, a heating plate 2, a distributed temperature control module 5, a multizone temperature control module 90, a main heating module 9 for heating the heating plate 2, and at least one auxiliary temperature control module 6. The cavity 1 and the bottom surface of the heating plate 2 form a mounting chamber 11, and the main heating module 9, the auxiliary temperature adjustment module 6, and the distributed temperature control module 5 are provided inside the mounting chamber 11. Referring to Figure 2, the distributed temperature control module 5 is connected to the temperature feedback module 4 and the auxiliary temperature adjustment module 6 via communication, and the multizone temperature control module 90 is connected to the temperature feedback module 4 and the main heating module 9 via communication.

[0026] In some embodiments, the heating plate 2 is made of a thermally conductive material, which facilitates temperature control of the heating plate 2 by the main heating module 9.

[0027] In some specific embodiments, the shape of the main heating module 9 matches the shape of the heating plate 2, and the heating plate 2 and the main heating module are seamlessly connected to improve temperature control efficiency.

[0028] In some embodiments, the main heating module and the heating plate 2 are connected by a sintering process.

[0029] In a specific embodiment, the main heating module 9 is embedded inside the heating plate 2 by a sintering process; that is, the main heating module 9 is embedded in the intermediate layer of the heating plate 2.

[0030] In another specific embodiment, the main heating module is sintered onto the back surface of the heating plate 4 by a sintering process, thereby seamlessly connecting the main heating module and the heating plate 2.

[0031] In some other embodiments, the main heating module 9 and the heating plate 2 are bonded or welded together.

[0032] Referring to Figures 1 and 2, at least one temperature control compensation region (not shown) is provided on the bottom surface of the heating plate 2, and the auxiliary temperature adjustment module 6 and the temperature control compensation region are arranged in correspondence.

[0033] In some specific embodiments, the specific range of the temperature control compensation region and the distance between adjacent temperature control compensation regions are jointly determined by the structural performance of the heating plate 2 itself, process requirements, and mounting conditions.

[0034] The temperature feedback module 4 detects the temperature of the heating plate 2 and obtains a first temperature value and a second temperature value. The multi-zone temperature control module 90 controls the main heating module 9 to adjust the temperature of the heating plate 2 based on the first temperature value. The distributed temperature control module 5 controls the auxiliary temperature control module 6 to perform temperature compensation adjustments to the temperature control compensation region based on the second temperature value.

[0035] In some embodiments, the distributed temperature control module 5 includes a control board consisting of a printed circuit board (PCB) and functional devices provided on the PCB.

[0036] The advantages of the temperature compensation system of the present invention are as follows: By positioning the auxiliary temperature adjustment module 6 in the temperature control compensation area, temperature compensation adjustment is performed on the heating plate 2, avoiding complex wiring designs, occupying less space, and solving the problems of high costs for adjusting substrate temperature and large hardware installation space in the prior art. The temperature feedback module 4 detects the heating plate 2 and acquires a first temperature value and a second temperature value. The multi-zone temperature control module 90 controls the main heating module 9 to adjust the temperature of the heating plate 2 based on the first temperature value. The distributed temperature control module 5 controls the auxiliary temperature adjustment module 6 to adjust the temperature of the temperature control compensation area based on the second temperature value. As a result, the temperature of the heating plate 2 becomes more uniform, temperature uniformity is effectively controlled, and temperature control accuracy is high while minimizing manufacturing and maintenance costs. The number of zones, which increased with the use of conventional technical solutions, can be effectively reduced, and the cost of the temperature control unit can be reduced.

[0037] In an optional embodiment of the present invention, the upper surface of the heating plate 2 includes a substrate contact area, the bottom surface of the heating plate 2 includes a bottom surface control area corresponding to the substrate contact area, and the temperature control compensation area is any area within the bottom surface control area.

[0038] In some embodiments, the heating plate 2 is provided with a plurality of heating zones, and the main heating module 9 includes a multi-zone heating circuit for heating the plurality of heating zones.

[0039] Figure 3 is a schematic diagram of the temperature feedback module and distributed temperature control module according to an embodiment of the present invention.

[0040] In some embodiments, referring to Figure 3, the temperature compensation system further includes a cover 13, a heating cavity 10 formed between the cover 13 and the cavity 1, a wafer required for the wafer baking process or a temperature measuring wafer used for temperature detection placed in the heating cavity 10, the cover 13 covering the top of the heating cavity 10 to reduce heat loss, the heating plate 2 provided at the bottom of the heating cavity 10, the distributed temperature control module 5 located at the bottom of the heating plate 2, and the distributed temperature control module 5 and the heating plate 2 not in contact.

[0041] As an optional embodiment of the present invention, referring to Figures 1 and 2, after the heating power of the main heating module 9 has stabilized, the temperature feedback module 4 performs a first temperature detection on the heating plate 2, obtains the first temperature value, and feeds back the first temperature value to the multizone temperature control module 90. After the temperature adjustment is complete, the temperature feedback module 4 performs a second temperature detection on the heating plate 2, obtains the second temperature value, and feeds the second temperature value back to the distributed temperature control module 5.

[0042] In some embodiments, the temperature feedback module 4 includes a temperature measuring wafer 41 and a temperature sensor 42, the temperature measuring wafer 41 is connected to the temperature sensor 42, and the temperature sensor 42 and the distributed temperature control module 5 are communicated together.

[0043] In some embodiments, the temperature feedback module 4 performs the first temperature detection step, After the heating power of the main heating module 9 stabilizes, the temperature measuring wafer 41 is placed in the heating cavity 10 on the upper surface of the heating plate 2, the temperature of the temperature measuring wafer 41 is measured via the temperature sensor 42, the first temperature detection is performed on the heating plate 2, the first temperature value is obtained, and the first temperature value is fed back to the multi-zone temperature control module 90.

[0044] In some embodiments, the multi-zone temperature control module 90 controls the main heating module 9 based on the first temperature value to perform temperature adjustment on the heating plate 2. The specific adjustment step is as follows: If the first temperature value is lower than the preset first target temperature, the multizone temperature control module 90 controls the main heating module 9 to increase the heating power, raise the temperature of the heating plate 2, and maintains the output power of the main heating module 9 without changing it until the first temperature value is adjusted to the first target temperature. If the first temperature value is greater than a preset first target temperature, the multizone temperature control module 90 controls the main heating module 9 to reduce the heating power, lowering the temperature of the heating plate 2 and maintaining the output power of the main heating module 9 without changing it until the first temperature value is adjusted to the first target temperature.

[0045] In some embodiments, referring to Figures 2 and 3, the temperature feedback module 4 performs a second temperature detection step, After the temperature adjustment is completed, the temperature measuring wafer 41 is placed in the heating cavity 10 at the top of the heating plate 2, the temperature of the temperature measuring wafer 41 is detected by the temperature sensor 42, thereby enabling temperature detection of the heating plate 2, and after the temperature sensor 42 acquires the second temperature value, the second temperature value is fed back to the distributed temperature control module 5.

[0046] In some embodiments, several temperature measurement points are provided on the temperature measurement wafer 41, each of the temperature measurement points is connected to at least the temperature sensor 42, and each region of the heating plate 2 has a temperature control compensation region that corresponds to the temperature measurement point in order to detect whether or not temperature compensation adjustment is necessary. Temperature detection is performed for each of the temperature control compensation regions, and temperature compensation adjustment is performed for each of the temperature compensation regions where temperature compensation is necessary, thereby facilitating orderly temperature compensation adjustment of the heating plate 2.

[0047] In some specific embodiments, some of the temperature control compensation regions are distributed in an array with respect to the center of the bottom control region. Specific array distribution types include, but are not limited to, annular and rectangular arrays.

[0048] Referring to Figure 1 as an optional embodiment of the present invention, the temperature compensation system further includes a partition plate 7 provided between the main heating module and the distributed temperature control module 5, and the auxiliary temperature adjustment module 6 is provided on the partition plate 7.

[0049] In some embodiments, the partition plate 7 is made of an insulating material, and in order to perform an insulating role, the outer edge of the partition plate 7 and the lower wall of the heating plate 2 are sealed together, reducing heat loss in the heating cavity 10, preventing the heat in the heating cavity 10 from affecting the operation of the distributed temperature control module 5, and extending the service life of the distributed temperature control module 5.

[0050] In one of the selectable embodiments of the present invention, the partition plate 7 is provided with lead holes for passing leads through.

[0051] Figure 4 is a front view of an auxiliary temperature control module according to an embodiment of the present invention, Figure 5 is a cross-sectional view of an auxiliary temperature control module according to an embodiment of the present invention, and Figure 6 is a schematic diagram of an enlarged view of the structure of A in Figure 1.

[0052] Referring to Figures 1, 4, 5, and 6 as an optional embodiment of the present invention, the auxiliary temperature control module 6 includes a temperature compensation unit 60, the temperature compensation unit 60 is communicated with the distributed temperature control module 5, and the distance between the temperature compensation unit 60 and the corresponding temperature control compensation area is 0 or greater.

[0053] In an optional embodiment of the present invention, the auxiliary temperature control module 6 further includes a fixing assembly (not shown) for fixing the temperature compensation unit 60 to the corresponding temperature control compensation region.

[0054] Referring to Figure 4, as an optional embodiment of the present invention, the temperature compensation unit 60 includes a heating unit 601 and a cooling unit 602 that are spaced apart from each other.

[0055] In some embodiments, the temperature compensation unit 60 and the heating plate 2 interact in a contact manner, that is, the distance between the uppermost end of the temperature compensation unit 60 and the corresponding temperature control compensation region (not shown) is equal to 0, thereby causing the uppermost end of the temperature compensation unit 60 to be in close contact with the temperature control compensation region (not shown).

[0056] In some specific embodiments, the fixing assembly is a heat-resistant adhesive, which adheres the temperature compensation unit 60 to the temperature control compensation area corresponding to the bottom surface of the heating plate 2. The heat-resistant adhesive can maintain good viscosity in high-temperature environments, ensuring that the temperature compensation unit 60 adheres to the bottom surface of the heating plate 2, resulting in a superior temperature compensation adjustment effect.

[0057] In some specific embodiments, the heating unit 601 of the temperature compensation unit 60 is a ceramic heating sheet.

[0058] In some specific embodiments, the cooling unit 602 of the temperature compensation unit 60 is a semiconductor cooling chip.

[0059] In some other embodiments, the temperature compensation unit 60 is suspended between the heating plate 2 and the dispersed temperature control module 5 via the fixed assembly, so that the distance between the uppermost end of the temperature compensation unit 60 and the corresponding temperature control compensation area is greater than 0. The temperature compensation unit 60 and the heating plate 2 interact non-contact.

[0060] In some specific embodiments, the heating unit 601 of the temperature compensation unit 60 is an LED light or a halogen lamp.

[0061] In a selectable embodiment of the present invention, if the second temperature value is smaller than a preset second target temperature, the distributed temperature control module 5 controls the heating unit 601 to perform temperature compensation adjustments to the heating zone until the second temperature value is adjusted to the second target temperature. If the second temperature value is greater than a preset second target temperature, the distributed temperature control module 5 controls the cooling unit 602 to perform temperature compensation adjustments for the heating zone until the second temperature value is adjusted to the second target temperature.

[0062] In some embodiments, the cooling unit 602 of the temperature compensation unit 60 is a small gas supply assembly.

[0063] In some embodiments, the miniature gas supply assembly is configured to spray clean refrigerant gas into the corresponding temperature control compensation area under the control of the distributed temperature control module 5.

[0064] In some specific embodiments, the miniature gas supply assembly includes a gas circulation line positioned corresponding to each of the temperature control compensation regions, and the miniature gas supply assembly is configured to circulate a clean refrigerant gas through the gas circulation line under the control of the distributed temperature control module 5 to cool the corresponding temperature control compensation region, and the gas circulation line is positioned close to or in close contact with the back surface of the heating plate 2 to improve the cooling effect.

[0065] In some embodiments, the cooling unit 602 of the temperature compensation unit 60 is a small liquid supply assembly.

[0066] In some specific embodiments, the miniature liquid supply assembly includes a liquid circulation line positioned corresponding to each of the temperature control compensation regions, and the miniature liquid supply assembly is configured to circulate a refrigerant liquid in the liquid circulation line under the control of the distributed temperature control module 5 to cool the corresponding temperature control compensation region, and the liquid circulation line is positioned close to or in close contact with the back surface of the heating plate 2 to improve the cooling effect.

[0067] Referring to Figure 5 as an optional embodiment of the present invention, the auxiliary temperature control module 6 further includes a support member 61 provided on the partition plate 7, an elastic member 62 provided inside the support member 61, and a mounting portion 63 provided at the uppermost end of the elastic member 62, and the temperature compensation unit 60 is provided on the side of the mounting portion 63 facing the heating plate 2, Due to the action of the support member 61, the elastic member 62 applies force to the temperature compensation unit 60 in the direction corresponding to the temperature control compensation region, thereby adjusting the distance between the temperature compensation unit 60 and the corresponding temperature control compensation region.

[0068] In some embodiments, a groove 64 is provided inside the support member 61, allowing the mounting portion 63 to slide in a direction away from or towards the bottom surface of the heating plate 2, and the elastic member 62 is provided inside the groove 64. The groove 64 defines the radial range of movement of the mounting portion 63 and adjusts the distance between the temperature compensation unit 60 and the temperature control compensation area as needed, thereby enabling the temperature compensation unit 60 to act effectively on the corresponding temperature control compensation area.

[0069] In some embodiments, the elastic member 62 is in a compressed operating state, and a force is applied to the temperature compensation unit 60 in a direction corresponding to the temperature control compensation region (not shown), causing the uppermost end of the temperature compensation unit 60 to be in close contact with the corresponding temperature control compensation region (not shown).

[0070] In some specific embodiments, the elastic member 62 is a spring.

[0071] In an optional embodiment of the present invention, a lead hole for passing a lead is provided inside the support member 61, and a lead hole for passing a lead is also provided inside the mounting portion 63.

[0072] In some embodiments, referring to Figure 5, the partition plate 7 is provided with a first lead hole (not shown) for passing leads through, the support member 61 is provided with a second lead hole 610 for passing leads through, and the mounting portion 63 is provided with a third lead hole 630 for passing leads through. By passing the leads through the third lead hole 630, the groove 64, the second lead hole 610, and the first lead hole, the temperature compensation unit 60 is connected to the distributed temperature control module 5, and communication between the temperature compensation unit 60 and the distributed temperature control module 5 can be achieved.

[0073] Referring to Figure 1, an optional embodiment of the present invention further includes a temperature control seal plate 3, the temperature control seal plate 3 being provided in the mounting chamber 11, the temperature control seal plate 3 being located at the bottom end of the heating plate 2, the temperature control seal plate 3 forming an insulating space between the heating plate 2 and the inner wall of the heating cavity 10, and the distributed temperature control module 5 and the auxiliary temperature adjustment module 6 both being provided in the insulating space.

[0074] In some embodiments, the temperature control seal plate 3 is made of thermal insulation material, and the outer surface of the temperature control seal plate 3 and the inner wall of the heating cavity 10 are sealed together, allowing for the formation of a thermal insulation space between the heating plate 2 and the inner wall of the heating cavity 10, making it easier to maintain the temperature inside the heating cavity 10, thereby ensuring temperature stability in the semiconductor substrate processing process, resulting in power saving and energy efficiency. The temperature control board 8 also plays a sealing role in protecting circuit components such as the distributed temperature control module 5 and auxiliary temperature control module 6 located between the heating plate 2 and the temperature control seal plate 3.

[0075] The present invention further provides a semiconductor device including the temperature compensation system.

[0076] Figure 7 is a flowchart of the temperature compensation method according to an embodiment of the present invention.

[0077] Referring to Figure 7, the present invention is S0: A step of providing a heating plate having at least one temperature control compensation region on its bottom surface, a main heating module, and an auxiliary temperature control module arranged in correspondence with the temperature control compensation region. S1: A step of detecting the temperature of the heating plate and obtaining a first temperature value and a second temperature value, S2: A step of controlling the main heating module to adjust the temperature of the heating plate based on the first temperature value, The present invention further provides a temperature compensation method, which includes the step of controlling the auxiliary temperature control module to perform temperature compensation adjustments to the temperature control compensation region based on the second temperature value.

[0078] Referring to Figures 1 to 7 in some specific embodiments, the specific operating steps of the temperature compensation method of the present invention are as follows, with reference to the temperature compensation system of the present invention. (1) After the heating power of the main heating module 9 has stabilized, the temperature measuring wafer 41 is placed on the heating surface on the upper surface of the heating plate 2, the temperature measuring wafer 41 is measured via the temperature sensor 42, the first temperature detection is performed on the heating plate 2, the first temperature value is obtained, and the first temperature value is fed back to the multizone temperature control module 90. (2) The multi-zone temperature control module 90 controls the main heating module 9 to adjust the temperature of the heating plate 2 based on the first temperature value, specifically, If the first temperature value is lower than a preset first target temperature, the multizone temperature control module controls the main heating module to increase the heating power, raise the temperature of the heating plate, and maintains the output power of the main heating module without changing it until the first temperature value is adjusted to the first target temperature. If the first temperature value is greater than a preset first target temperature, the multizone temperature control module controls the main heating module to reduce the heating power, lowering the temperature of the heating plate, and maintains the output power of the main heating module without changing it until the first temperature value is adjusted to the first target temperature. (3) During the temperature compensation adjustment stage of the heating plate 2, that is, after the temperature adjustment is completed, several temperature measurement points on the temperature measurement wafer 41 are measured by several temperature sensors 42 to obtain several second temperature values, and the measured second temperature values ​​are fed back to the distributed temperature control module 5 to realize online monitoring of the temperature within the temperature control compensation area. (4) The step of the distributed temperature control module 5 controlling the auxiliary temperature control module 6 to perform temperature compensation adjustments to the temperature control compensation region based on the second temperature value is, specifically, If the second temperature value is smaller than the second target temperature, the distributed temperature control module 5 controls the temperature rise unit 601 of the temperature sensor 42 in the corresponding temperature control compensation region to raise the temperature of the temperature control compensation region until the second temperature value corresponding to the temperature control compensation region reaches the second target temperature. If the second temperature value is greater than the second target temperature, the distributed temperature control module 5 controls the cooling unit 602 of the temperature sensor 42 in the corresponding temperature control compensation region to cool the temperature control compensation region until the second temperature value corresponding to the temperature control compensation region reaches the second target temperature.

[0079] Conventional technology typically adjusts the temperature uniformity of a heating plate by performing zone-specific control over the heating plate. For example, the heating plate is divided into 7, 13, or 15 zones. Considering the layout requirements of functional devices and the constraints of wiring placement, the number of zones on the heating plate cannot be infinitely large, and each zone contains several temperature measurement sampling points on the temperature measurement wafer. When a specific zone is indicated from the temperature measurement wafer, for example, if the temperature uniformity of the first zone does not meet process requirements and needs to be adjusted to increase the temperature, the main control unit controls the first zone to increase its temperature. However, this adjustment has the following problems: The average temperature of some of the temperature measurement sampling points in some of the temperature measurement sampling points in the first zone will be lower than the target temperature, while the temperature of some of these temperature measurement sampling points will be higher than the target temperature, and the temperature difference between them and the target temperature will likely differ from one another. Even in each temperature-controlled area where the temperature is lower than the target temperature, the temperature difference from the target temperature will likely differ from one another. It is found that single-zone temperature adjustment is again prone to easily introducing the problem of temperature non-uniformity across the entire range of the heating plate.

[0080] Furthermore, the above-described zone-based control method requires independent temperature control for each zone, which significantly increases the cost of the temperature control unit. Moreover, the more zones there are, the more heating devices are needed, clearly increasing the overall temperature control cost.

[0081] In a technical solution according to an embodiment of the present invention, after the heating power of the main heating module 9 has stabilized, the temperature feedback module 4 performs a first temperature detection on the heating plate 2, obtains the first temperature value, feeds the first temperature value back to the multizone temperature control module 90, and controls the main heating module 9 so that the multizone temperature control module 90 adjusts the temperature of the heating plate 2 based on the first temperature value until the first temperature value is maintained within the first temperature range.

[0082] After the temperature adjustment is completed, the temperature sensor 42 acquires temperature information from the temperature measuring wafer 41 to obtain a second temperature value. Based on the second temperature value, several temperature control compensation regions on the bottom surface of the heating plate 2 that require temperature compensation adjustment are determined. Finally, the distributed temperature control module 5 controls the corresponding temperature compensation unit 60 to raise or cool the temperature control compensation region until the second temperature value is maintained at the second target temperature, thereby achieving the objective of temperature compensation adjustment. This realizes two temperature detections and two temperature adjustments of the heating plate, and enables independent temperature measurement and independent temperature compensation adjustment functions for several of the temperature compensation units 60, ensuring that the temperature of each temperature control compensation region reaches a preset temperature range and ensuring uniformity of the temperature of the heating plate 2 and uniformity of the temperature of each zone of the heating plate 2.

[0083] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and changes can be made to these embodiments. However, it should be understood that such modifications and changes are within the scope and spirit of the invention as set forth in the appended claims. Furthermore, the invention described herein is capable of other embodiments and can be carried out or realized in various ways.

Claims

1. The system includes a cavity, a temperature feedback module, a heating plate, a multizone temperature control module, a distributed temperature control module, a main heating module for heating the heating plate, and at least one auxiliary temperature control module, wherein the cavity and the bottom surface of the heating plate form a mounting chamber, the main heating module, the auxiliary temperature control module, and the distributed temperature control module are provided inside the mounting chamber, the distributed temperature control module is communicated with the temperature feedback module and the auxiliary temperature control module, and the multizone temperature control module is communicated with the temperature feedback module and the main heating module. At least one temperature control compensation region is provided on the bottom surface of the heating plate, and the auxiliary temperature adjustment module is positioned in correspondence with the temperature control compensation region. The temperature feedback module detects the temperature of the heating plate and obtains a first temperature value and a second temperature value. The multi-zone temperature control module controls the main heating module to adjust the temperature of the heating plate based on the first temperature value. The distributed temperature control module controls the auxiliary temperature control module to perform temperature compensation adjustments to the temperature control compensation region based on the second temperature value. The present invention further includes a partition plate provided between the main heating module and the distributed temperature control module, wherein the auxiliary temperature adjustment module is provided on the partition plate. The auxiliary temperature control module includes a temperature compensation unit that is communicated with the distributed temperature control module, and the distance between the temperature compensation unit and the corresponding temperature control compensation area is 0 or greater, characterized in that the temperature compensation system is a temperature compensation system.

2. After the heating power of the main heating module stabilizes, the temperature feedback module performs a first temperature detection on the heating plate, obtains the first temperature value, and feeds the first temperature value back to the multizone temperature control module. The temperature compensation system according to claim 1, characterized in that the temperature feedback module performs a second temperature detection on the heating plate after the temperature adjustment is completed, obtains the second temperature value, and feeds back the second temperature value to the distributed temperature control module.

3. The temperature compensation system according to claim 1, characterized in that the partition plate is provided with lead holes for passing leads through.

4. The temperature compensation system according to claim 1, wherein the auxiliary temperature adjustment module further comprises a fixing assembly for fixing the temperature compensation unit to the corresponding temperature control compensation region.

5. The auxiliary temperature control module further includes a support member provided on the partition plate, an elastic member provided inside the support member, and a mounting portion provided at the uppermost end of the elastic member, and the temperature compensation unit is provided on the side of the mounting portion facing the heating plate, The temperature compensation system according to claim 1, characterized in that, by the action of the support member, the elastic member applies force to the temperature compensation unit in a direction corresponding to the temperature control compensation region, thereby adjusting the distance between the temperature compensation unit and the corresponding temperature control compensation region.

6. The temperature compensation system according to claim 5, characterized in that a lead hole for passing a lead is provided inside the support member.

7. The temperature compensation system according to claim 5, characterized in that the temperature compensation unit includes a heating unit and a cooling unit provided at intervals.

8. The temperature compensation system according to claim 7, characterized in that, when the second temperature value is smaller than a preset second target temperature, the distributed temperature control module controls the heating unit to perform temperature compensation adjustments with respect to the temperature control compensation region corresponding to the second temperature value.

9. The temperature compensation system according to claim 7, characterized in that, if the second temperature value is greater than a preset second target temperature, the distributed temperature control module controls the cooling unit to perform temperature compensation adjustments with respect to the temperature control compensation region corresponding to the second temperature value.

10. The temperature compensation system according to claim 1 or 7, further comprising a temperature control seal plate provided inside the mounting chamber, wherein the temperature control seal plate is located at the bottom edge of the heating plate, an insulating space is formed between the temperature control seal plate, the heating plate and the inner wall of the mounting chamber, and both the distributed temperature control module and the auxiliary temperature adjustment module are provided in the insulating space.

11. A semiconductor device comprising the temperature compensation system described in claim 1.

12. Step S0 provides a heating plate having at least one temperature control compensation region on its bottom surface, a main heating module, and an auxiliary temperature adjustment module arranged in correspondence with the temperature control compensation region. Step S1 involves detecting the temperature of the heating plate and obtaining a first temperature value and a second temperature value. Step S2 controls the main heating module to adjust the temperature of the heating plate based on the first temperature value, A temperature compensation method applied to the temperature compensation system according to claim 1, characterized by including step S3 of controlling the auxiliary temperature adjustment module to perform temperature compensation adjustment on the temperature control compensation region based on the second temperature value.

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