Method for manufacturing photoelectric conversion elements

Abstract

To suppress unevenness in pigment density.SOLUTION: In a manufacturing method of a photoelectric conversion element 10 which is a dye-sensitized solar cell 10 formed by bonding a first substrate 20 and a second substrate 21 together, and a porous semiconductor layer 30 is formed on the first substrate 20, and a dye solution 32 containing dye 32C is printed on the first substrate 20 or the second substrate 21.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The technology disclosed herein relates to a method for manufacturing a photoelectric conversion element. [Background technology]

[0002] A dye adsorption apparatus used in the manufacture of dye-sensitized solar cells, a type of photoelectric conversion element, is disclosed in Patent Document 1 below. The dye adsorption apparatus described in Patent Document 1 is a dye adsorption apparatus for adsorbing a dye onto a porous semiconductor layer formed on the surface of a substrate to be processed, and comprises a nozzle for dispensing a dye solution in which the dye is dissolved in a predetermined solvent, a dye solution dropping and coating unit for dropping and coating the dye solution onto the semiconductor layer on the substrate from the nozzle, a solvent evaporation and removal unit for evaporating and removing the solvent from the dye solution coated onto the semiconductor layer on the substrate, and a rinsing unit for washing off and removing unwanted dyes attached to the surface of the semiconductor layer on the substrate. [Prior art documents] [Patent Documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2013-12404 [Overview of the Initiative] [Problems that the invention aims to solve]

[0004] When manufacturing a dye-sensitized solar cell using the dye adsorption apparatus described in Patent Document 1 above, the dye solution is applied to the semiconductor layer on the substrate by dropping it from a nozzle using the dye solution dropping and coating section. As a result, areas where the dye solution is dropped and areas where the dye solution is not dropped are created in the semiconductor layer, and there is a concern that unevenness in the density of the dye will occur between these areas. If unevenness in the density of the dye occurs in the semiconductor layer, the photoelectric conversion efficiency may decrease, and the appearance quality may also decrease.

[0005] The technology described herein was developed based on the circumstances described above, and aims to suppress unevenness in pigment density. [Means for solving the problem]

[0006] (1) A method for manufacturing a photoelectric conversion element relating to the technology described herein is a method for manufacturing a photoelectric conversion element comprising bonding a first substrate and a second substrate, wherein a porous semiconductor layer is formed on the first substrate, and a dye solution containing a dye is printed on the first substrate or the second substrate.

[0007] (2) In addition to the above (1), the method for manufacturing the photoelectric conversion element may also involve placing a screen plate having an opening on the first substrate or the second substrate, supplying the dye solution onto the screen plate, and spreading the supplied dye solution with a squeegee.

[0008] (3) In addition to (1) or (2) above, the method for manufacturing the photoelectric conversion element may also involve applying a sealing material in an annular shape to the substrate of the first substrate and the second substrate on which the dye solution is not printed, and supplying an electrolyte to the region surrounded by the sealing material.

[0009] (4) In addition to any of (1) to (3) above, the method for manufacturing the photoelectric conversion element may also involve printing the dye solution onto the second substrate.

[0010] (5) In addition to (4) above, the method for manufacturing the photoelectric conversion element may also involve applying a sealing material to the first substrate in an annular shape, supplying an electrolyte to the region surrounded by the sealing material, and selectively printing the dye solution on the main surface of the second substrate such that printed areas where the dye solution is printed and unprinted areas where the dye solution is not printed are alternately arranged in a repeating pattern.

[0011] (6) Further, in addition to the above (5), in the main surface of the second substrate, the dye solution may be printed so that both the printing region and the non-printing region form a strip extending along one direction.

[0012] (7) Further, in addition to the above (5), in the main surface of the second substrate, the dye solution may be printed so that both the printing region and the non-printing region form a staggered lattice pattern.

[0013] (8) Further, in addition to any one of the above (1) to (3), the dye solution may be printed on the first substrate.

Advantages of the Invention

[0014] According to the technology described in this specification, unevenness in the density of the dye can be suppressed.

Brief Description of the Drawings

[0015] [Figure 1] Plan view of the dye-sensitized solar cell according to Embodiment 1 [Figure 2] Cross-sectional view of the dye-sensitized solar cell according to Embodiment 1 [Figure 3] Flowchart showing the procedures of each step in the manufacturing method of the dye-sensitized solar cell according to Embodiment 1 [Figure 4] Cross-sectional view of the first substrate in a state where the first electrode formation step and the porous semiconductor layer formation step included in the manufacturing method of the dye-sensitized solar cell according to Embodiment 1 have been performed [Figure 5] Cross-sectional view of the first substrate in a state where the sealant material application step and the electrolyte dropping step included in the manufacturing method of the dye-sensitized solar cell according to Embodiment 1 have been performed [Figure 6] Cross-sectional view of the second substrate and the screen printing apparatus in a state where the screen plate is set in the dye solution printing step after the second electrode formation step and the catalyst layer formation step included in the manufacturing method of the dye-sensitized solar cell according to Embodiment 1 have been performed [Figure 7]Plan view of the screen plate used in the dye solution printing process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 1 [Figure 8] Cross-sectional view of the second substrate and the screen printing apparatus in a state where the dye solution is printed in the dye solution printing process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 1 [Figure 9] Cross-sectional view of the second substrate in a state where the drying process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 1 has been performed [Figure 10] Cross-sectional view of the first substrate and the second substrate showing the state before the bonding process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 1 is performed [Figure 11] Flowchart showing the procedure of each process in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 [Figure 12] Cross-sectional view of the second substrate in a state where the second electrode formation process and the catalyst layer formation process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 have been performed [Figure 13] Cross-sectional view of the second substrate in a state where the sealant application process and the electrolyte dropping process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 have been performed [Figure 14] After the first electrode formation process and the porous semiconductor layer formation process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 are performed, cross-sectional view of the first substrate and the screen printing apparatus in a state where the screen plate is set in the dye solution printing process [Figure 15] Cross-sectional view of the first substrate and the screen printing apparatus in a state where the dye solution is printed in the dye solution printing process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 [Figure 16] Cross-sectional view of the first substrate in a state where the drying process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 has been performed [Figure 17] Cross-sectional view of the first substrate and the second substrate showing the state before the bonding process included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 2 is performed [Figure 18]Plan view of the screen plate used in the dye solution printing step included in the manufacturing method of a dye-sensitized solar cell according to Embodiment 3. [Figure 19] A cross-sectional view of the second substrate and screen printing apparatus after the second electrode formation step and catalyst layer formation step, which are included in the manufacturing method of a dye-sensitized solar cell according to Embodiment 3, have been performed, and the screen plate has been set in the dye solution printing step. [Figure 20] Cross-sectional view of the second substrate and screen printing apparatus in the state after printing the dye solution in the dye solution printing step included in the method for manufacturing a dye-sensitized solar cell according to Embodiment 3. [Figure 21] Plan view of the second substrate after the dye solution has been printed via the dye solution printing step included in the manufacturing method of a dye-sensitized solar cell according to Embodiment 3. [Figure 22] Cross-sectional view of the second substrate after the drying step included in the manufacturing method of the dye-sensitized solar cell according to Embodiment 3. [Figure 23] Cross-sectional views of the first and second substrates showing the state before the bonding process included in the manufacturing method of the dye-sensitized solar cell according to Embodiment 3. [Figure 24] Plan view of the screen plate used in the dye solution printing step included in the manufacturing method of a dye-sensitized solar cell according to Embodiment 4 [Figure 25] Plan view of the second substrate after the dye solution has been printed via the dye solution printing step included in the manufacturing method of a dye-sensitized solar cell according to Embodiment 4. [Modes for carrying out the invention]

[0016] <Embodiment 1> Embodiment 1 will be described with reference to Figures 1 to 10. This embodiment shows a dye-sensitized solar cell (photoelectric conversion element) 10 and its manufacturing method. Note that parts of each drawing show the X, Y, and Z axes, and each axis is drawn so that it corresponds to the direction shown in each drawing.

[0017] As shown in Figure 1, the dye-sensitized solar cell 10 comprises multiple (four in Figure 1) cells (unit cells) 11. The dye-sensitized solar cell 10 is configured by connecting multiple cells 11 in series or parallel depending on the required output voltage. The dye-sensitized solar cell 10 also has electrodes and wiring for connecting the multiple cells 11.

[0018] As shown in Figure 2, the dye-sensitized solar cell 10 has a structure in which a first substrate (semiconductor substrate, first support) 20 and a second substrate (opposing substrate, second support) 21 are bonded together. Both the first substrate 20 and the second substrate 21 are made of glass material or synthetic resin material, and have light transmittance and insulating properties. An electrolyte 22 and a sealing portion 23 that seals the electrolyte 22 are interposed between the first substrate 20 and the second substrate 21. The electrolyte 22 will be described in detail later.

[0019] As shown in Figure 1, the sealing portion 23 is provided in an annular shape so as to surround each of the multiple cells 11. The sealing portion 23 is made of a sealing material 31 (see Figure 5). The sealing material 31 is, for example, an ultraviolet-curable resin material (photocurable resin material). The sealing portion 23 has a grid-like structure when viewed in plan. Specifically, the sealing portion 23 has a frame-shaped portion 23A that overlaps the outer peripheral edges of the first substrate 20 and the second substrate 21 and forms a frame shape when viewed in plan, and a cross-shaped portion (partition portion) 23B that overlaps the central parts of the first substrate 20 and the second substrate 21 in the X-axis and Y-axis directions and forms a cross shape when viewed in plan. The frame-shaped portion 23A surrounds all the cells 11 together. The cross-shaped portion 23B partitions the spaces between adjacent cells 11 in the X-axis and Y-axis directions.

[0020] As shown in Figure 2, the inner main surface of the first substrate 20 facing the second substrate 21 is provided with a first electrode 24 and a photoelectric conversion layer 25 that constitute the cell 11. The first electrode 24 is provided on the inner main surface of the first substrate 20. The photoelectric conversion layer 25 is provided so as to overlap the first electrode 24. Multiple sets (four sets in this embodiment) of the stacked first electrode 24 and photoelectric conversion layer 25 are arranged in a grid pattern when viewed in plan on the inner main surface of the first substrate 20. The spaces between two adjacent sets of first electrode 24 and photoelectric conversion layer 25 in the X-axis direction and between two adjacent sets of first electrode 24 and photoelectric conversion layer 25 in the Y-axis direction are separated by the cross-shaped portion 23B of the seal portion 23.

[0021] The first electrode 24 is made of a conductive material that is generally usable in solar cells. Examples of materials used for the first electrode 24 include at least one selected from the group consisting of indium tin composite oxide (ITO), tin oxide (SnO2), fluorine-doped tin oxide (FTO), zinc oxide (ZnO), and tantalum or niobium-doped titanium oxide.

[0022] The photoelectric conversion layer 25 includes a porous semiconductor and a dye (photosensitizer) 32C adsorbed on the porous semiconductor (see Figure 9). Note that the cross-section of the photoelectric conversion layer 25 shown in Figure 2 is shaded because it contains the dye 32C. The type of semiconductor constituting the porous semiconductor is not particularly limited as long as it includes a porous semiconductor commonly used as a photoelectric conversion material in the solar cell field. Examples of porous semiconductors include semiconductor compounds containing at least one selected from the group consisting of titanium dioxide, zinc oxide, tin oxide, iron oxide, niobium oxide, cerium oxide, tungsten oxide, barium titanate, strontium titanate, cadmium sulfide, lead sulfide, zinc sulfide, indium phosphide, copper-indium sulfide (CuInS2), CuAlO2, and SrCu2O2. Among these, it is particularly preferable to use a porous semiconductor containing titanium dioxide from the viewpoint of improving stability and safety. The porous semiconductor may be composed of titanium oxide nanoparticles whose particle size is within a predetermined numerical range.

[0023] As the dyes included in the photoelectric conversion layer 25, for example, one or more types of various organic dyes or metal complex dyes having absorption regions in the visible light region or the infrared light region can be used. As organic dyes, for example, those containing at least one selected from the group consisting of azo dyes, quinone dyes, quinone imine dyes, quinacridone dyes, squarylium dyes, cyanine dyes, merocyanine dyes, triphenylmethane dyes, xanthene dyes, porphyrin dyes, perylene dyes, indigo dyes, and naphthalocyanine dyes can be used. The extinction coefficient of organic dyes is generally larger than that of metal complex dyes, which take the form of molecules coordinately bonded to transition metals. As metal complex dyes, for example, those in which a metal is coordinately bonded to a molecule can be used. As molecules, for example, those containing at least one selected from the group consisting of porphyrin dyes, phthalocyanine dyes, naphthalocyanine dyes, and ruthenium dyes can be used. Examples of metals include Cu (copper), Ni (nickel), Fe (iron), Co (cobalt), V (vanadium), Sn (tin), Si (silicon), Ti (titanium), Ge (germanium), Cr (chromium), Zn (zinc), Ru (ruthenium), Mg (magnesium), Al (aluminum), Pb (lead), Mn (manganese), In (indium), Mo (molybdenum), Y (yttrium), Zr (zirconium), Nb (niobium), Sb (antimony), La (lanthanum), W (tungsten), and Pt (platinum). At least one selected from the group consisting of ), Ta (tantalum), Ir (iridium), Pd (palladium), Os (osmium), Ga (gallium), Tb (terbium), Eu (europium), Rb (rubidium), Bi (bismuth), Se (selenium), As (arsenic), Sc (scandium), Ag (silver), Cd (cadmium), Hf (hafnium), Re (rhenium), Au (gold), Ac (actinium), Tc (technetium), Te (tellurium), and Rh (rubidium) can be used. Among these, it is preferable to use a phthalocyanine-based dye or a ruthenium-based dye to which a metal is coordinated as the metal complex dye, and it is particularly preferable to use a ruthenium-based metal complex dye.

[0024] On the inner main surface of the second substrate 21 facing the first substrate 20, a second electrode (counter electrode) 26 and a catalyst layer 27 constituting the cell 11 are provided. The second electrode 26 is provided on the inner main surface of the second substrate 21. The catalyst layer 27 is provided so as to overlap the second electrode 26. Multiple sets (four sets in this embodiment) of the stacked second electrodes 26 and catalyst layer 27 are arranged in a grid pattern when viewed in plan on the inner main surface of the second substrate 21. The spaces between two adjacent sets of second electrodes 26 and catalyst layer 27 in the X-axis direction and between two adjacent sets of second electrodes 26 and catalyst layer 27 in the Y-axis direction are separated by the cross-shaped portion 23B of the seal portion 23.

[0025] The second electrode 26 is made of a conductive material that is generally usable in solar cells. The second electrode 26 may be made of the same material as the first electrode 24, or it may be made of a different material. The material of the second electrode 26 may be a non-transparent material. The second electrode 26 may be formed from a metallic material including at least one selected from the group consisting of titanium, tungsten, gold, silver, copper, aluminum, and nickel. The second electrode 26 may also be formed from a conductive carbon material such as carbon black or Ketjenblack. When a conductive carbon material is used for the second electrode 26, it may be formed integrally with the catalyst layer 27. The catalyst layer 27 is positioned between the electrolyte 22 and the second electrode 26, as described below, and is for activating the oxidation-reduction reaction of the electrolyte 22. The catalyst layer 27 may be made from at least one selected from the group consisting of platinum, graphite, carbon black, Ketjenblack, carbon nanotubes, graphene, and fullerene.

[0026] The electrolyte 22 will now be described. The electrolyte 22 in this embodiment is a liquid containing redox species, that is, an electrolyte solution (liquid electrolyte). The electrolyte 22 contains, for example, I- and I3 as redox species. - It includes the above I. - / I3 - Besides the system, Br 2- / Br 3- system, Fe 2+ / Fe 3+ systems, quinone / hydroquinone systems, etc. can be used. The electrolyte 22 contains, in addition to the redox species described above, a solvent (organic solvent), etc. Examples of the solvent contained in the electrolyte 22 include acetonitrile, ethanol, propanol, t-butanol, ethylene carbonate, methoxyacetonitrile, etc. As shown in FIG. 2, the electrolyte 22 is individually sealed in a space partitioned for each cell 11 by the seal portion 23. The ions contained in the electrolyte 22 move between the photoelectric conversion layer 25 and the second electrode 26 constituting each cell 11, thereby enabling the transport of electrons.

[0027] This embodiment has the above-described structure, and subsequently, the operation of the dye-sensitized solar cell 10 will be described. When light such as sunlight is irradiated onto the dye-sensitized solar cell 10, the dye contained in the photoelectric conversion layer 25 is excited by the light, and electrons in the dye transition from the ground state to the excited state. The electrons excited in the dye are injected into the conduction band of the semiconductor (e.g., titanium oxide) of the photoelectric conversion layer 25 and move from the first electrode 24 through the external circuit to the second electrode 26. The dye oxidized by losing electrons receives electrons from the electrolyte 22 and is reduced to return to the dye in the ground state. At this time, the electrolyte 22 loses electrons and becomes oxidized (e.g., when the electrolyte 22 is of the I - / I3 - system, it becomes I3 - ). On the other hand, the electrons that have moved to the second electrode 26 are passed to the electrolyte 22 through the catalyst layer 27. At this time, the electrolyte 22 receives electrons and becomes reduced (e.g., when the electrolyte 22 is of the I - / I3 - system, it becomes I - ). By repeating the above cycle, light energy is converted into electrical energy.

[0028] Next, a method for manufacturing the dye-sensitized solar cell 10 will be described. As shown in Figure 3, the method for manufacturing the dye-sensitized solar cell 10 includes a first substrate processing step of providing a predetermined structure on a first substrate 20, a second substrate processing step of providing a predetermined structure on a second substrate 21, a bonding step of bonding the first substrate 20 and the second substrate 21 together, and a sealing material curing step of curing the sealing material 31.

[0029] The first substrate processing step includes, as shown in Figure 3, a first electrode formation step for forming a first electrode 24 on the first substrate 20, a porous semiconductor layer formation step for forming a porous semiconductor layer 30 on the first substrate 20, a seal material application step for applying a seal material 31, which is the material for the seal portion 23, to the first substrate 20, and an electrolyte dropping step for dropping droplets 22LQ of electrolyte 22 onto the first substrate 20. On the other hand, the second substrate processing step includes a second electrode formation step for forming a second electrode 26 on the second substrate 21, a catalyst layer formation step for forming a catalyst layer 27 on the second substrate 21, a dye solution printing step for printing a dye solution 32 containing dye 32C onto the second substrate 21, and a drying step for drying the dye solution 32. The first and second substrate processing steps also include steps for forming electrodes, wiring, etc., on the first substrate 20 and the second substrate 21 for connecting multiple cells 11.

[0030] In the first electrode formation step included in the first substrate processing step, the first electrode 24 is formed on the main surface of the first substrate 20, as shown in Figure 4, by using, for example, a sputtering method or a spraying method. In the porous semiconductor layer formation step, a suspension containing semiconductor nanoparticles, which are the material for the porous semiconductor, is applied to the first electrode 24, and a porous semiconductor layer 30 is formed on the first electrode 24 by drying and firing, or at least one of these processes. Note that the porous semiconductor layer 30 shown in Figure 4 does not contain the dye 32C described later, so the cross-section of the porous semiconductor layer 30 is not shaded. Specifically, first, semiconductor nanoparticles are suspended in a suitable solvent to obtain a suspension. The obtained suspension is applied to the first electrode 24 by a known method such as the doctor blade method, squeegee method, spin coating method or screen printing method. The temperature, time, and atmosphere required for at least one of the drying and firing of the suspension applied to the first electrode 24 can be appropriately set according to the type of semiconductor nanoparticles. For example, it can be carried out in an air atmosphere or an inert gas atmosphere at a temperature range of 50°C to 800°C for a period of 10 seconds to 12 hours. Such drying and firing of the suspension can be carried out, for example, once at a single temperature or two or more times with varying temperatures.

[0031] In the sealing material coating process, as shown in Figure 5, the sealing material 31, which is the material for the sealing portion 23, is coated onto the main surface of the first substrate 20 using a predetermined dispenser device. Specifically, when the sealing material coating process is performed, the sealing material 31 is coated on the main surface of the first substrate 20 in an annular shape, surrounding each of the multiple first electrodes 24 and the porous semiconductor layer 30. The coating area of ​​the sealing material 31 at this time generally coincides with the formation area of ​​the sealing portion 23 shown in Figure 1. After the sealing material coating process, it is also possible to perform a pre-curing process in which ultraviolet light is irradiated onto the sealing material 31 to the extent that it is partially cured. In the electrolyte dropping process, droplets 22LQ of the electrolyte 22 are dropped onto the main surface of the first substrate 20 using a predetermined dispenser device. At this time, a predetermined amount of the electrolyte droplets 22LQ is selectively dropped onto each of the multiple regions on the main surface of the first substrate 20 that are surrounded by the annular sealing material 31.

[0032] In the second electrode formation step included in the second substrate processing step, the second electrode 26 is formed on the main surface of the second substrate 21, as shown in Figure 6, by using, for example, a sputtering method or a spraying method. In the catalyst layer formation step, the catalyst layer 27 is formed on the second electrode 26 by, for example, a PVC method, a vapor deposition method, or a sputtering method.

[0033] Then, in the dye solution printing process, a dye solution 32 containing dye 32C is printed onto the catalyst layer 27 using a screen printing apparatus 40. The dye solution 32 used here is prepared by dissolving dye 32C in a predetermined solvent to a predetermined concentration, and is preferably in the form of a paste, but is not necessarily so. The configuration of the screen printing apparatus 40 will now be explained with reference to Figures 6 and 7. The screen printing apparatus 40 comprises at least a screen plate 41, a frame-shaped frame 42 attached to the outer edge of the screen plate 41, and a squeegee 43 that is movable on the screen plate 41. The screen plate 41 has a main surface parallel to the main surface of the second substrate 21, which is the object to be printed, and the main surface is arranged to face the main surface of the second substrate 21 at a predetermined distance. The screen printing apparatus 40 also includes a stage on which the second substrate 21 is placed. The screen plate 41 is larger in size than the second substrate 21 when viewed in plan. The screen plate 41 has openings 41A at positions that overlap with each catalyst layer 27 of the second substrate 21. Multiple openings 41A (four in this embodiment) are arranged in a grid pattern on the main surface of the screen plate 41 when viewed in plan. The screen plate 41 is manufactured by applying a photosensitive emulsion in a solid form to a substrate made of metal fine wires woven into a mesh, selectively exposing the photosensitive emulsion to light, and then developing it, with the areas where the photosensitive emulsion is not formed being the aforementioned openings 41A.

[0034] In the dye solution printing process, as shown in Figure 6, the dye solution 32 is supplied onto a screen plate 41 positioned opposite the main surface of the second substrate 21 at a predetermined distance. Then, by moving a squeegee 43 along the main surface of the screen plate 41, the dye solution 32 is spread onto the screen plate 41, as shown in Figure 8. The dye solution 32 is then selectively printed onto the catalyst layer 27 that overlaps the opening 41A of the screen plate 41 through the opening 41A. The printed dye solution 32 is distributed in a solid form over the entire area of ​​the catalyst layer 27. In other words, the printing area on the main surface of the second substrate 21 where the dye solution 32 is printed coincides with the formation area of ​​the catalyst layer 27. After printing the dye solution 32, the second substrate 21 is removed from the screen printing apparatus 40. Subsequently, in the drying process, as shown in Figure 9, the dye solution 32 printed on the catalyst layer 27 is dried at a predetermined temperature for a predetermined time. After the drying process, the solvent contained in the dye solution 32 evaporates, and the dye 32C remains attached to the catalyst layer 27. The dye 32C adheres to almost the entire surface of the catalyst layer 27 in a solid form.

[0035] After the first and second substrate processing steps are performed as described above, a bonding step is carried out. In the bonding step, as shown in Figure 10, the first substrate 20 coated with the sealing material 31 is placed on the lower side, and the second substrate 21 is placed facing the first substrate 20 from above. Then, for example, the second substrate 21 is brought closer to the first substrate 20 side and bonding is performed. When the sealing material 31 on the first substrate 20 side comes into contact with the second substrate 21 during bonding, the space formed between the first substrate 20 and the second substrate 21 is partitioned by the sealing material 31, and each partitioned space (space within each cell 11) is filled with electrolyte 22. In each space partitioned by the sealing material 31, the dye 32C that was attached to the catalyst layer 27 of the second substrate 21 dissolves into the solvent of the electrolyte 22 and diffuses into the solvent, and is gradually adsorbed onto the surface of the porous semiconductor layer 30. In this way, the photoelectric conversion layer 25 is formed. Subsequently, during the sealing material curing process, the sealing material 31 is irradiated with ultraviolet light of a predetermined intensity from a light source that emits ultraviolet light for a predetermined time. As shown in Figure 2, the sealing material 31 irradiated with ultraviolet light is completely cured to form a sealing portion 23. The electrolyte 22 in each cell 11 is sealed by the cured sealing portion 23. In this way, a dye-sensitized solar cell 10 is manufactured.

[0036] As described above, in this embodiment, in the dye solution printing step included in the second substrate processing step, a dye solution 32 containing dye 32C is printed onto the second substrate 21 by screen printing. With screen printing, the printing range of the dye solution 32 can be easily adjusted by setting the pattern related to the opening 41A of the screen plate 41. Specifically, the dye solution 32 is printed in a solid form onto the catalyst layer 27 provided on the second substrate 21. The dye 32C contained in the dye solution 32 printed on the second substrate 21 dissolves into the solvent of the electrolyte 22 and diffuses into the solvent during the bonding step. Here, the dye 32C that was attached in a solid form on the catalyst layer 27 is uniformly diffused over the entire area of ​​the electrolyte 22 that overlaps with the porous semiconductor layer 30. Since the solvent of the electrolyte 22 penetrates into the numerous pores present on the surface of the porous semiconductor layer 30, the dye 32C diffused into the solvent also diffuses to every corner of the pores and is evenly adsorbed onto the surface of the pores.

[0037] Conventionally, the dye solution was dropped onto the semiconductor layer, resulting in areas on the semiconductor layer where the dye solution was dropped and areas where it was not, which could lead to unevenness in the dye's density. In particular, dyes with large molecular sizes tend to propagate more easily along the vertical direction and less easily horizontally in the areas of the semiconductor layer where the dye solution is dropped, making unevenness in dye density more pronounced. In this embodiment, however, since the dye solution 32 is printed in a solid state onto the catalyst layer 27 on the second substrate 21, the dye 32C contained in the dye solution 32 can be uniformly deposited over almost the entire surface of the porous semiconductor layer 30 facing the catalyst layer 27. As a result, unevenness in the dye 32C density is less likely to occur in the porous semiconductor layer 30, improving the photoelectric conversion efficiency of the photoelectric conversion layer 25 and resulting in a better appearance. Furthermore, in this embodiment, the sealing material coating step and the electrolyte dropping step are included in the first substrate processing step, and the dye solution printing step and the drying step are included in the second substrate processing step. Therefore, it is possible to process the sealing material coating step and the electrolyte dropping step and the dye solution printing step and the drying step in parallel. By performing parallel processing, the cycle time can be shortened.

[0038] As described above, the dye-sensitized solar cell (photoelectric conversion element) 10 of this embodiment is a method for manufacturing a dye-sensitized solar cell 10 which is made by bonding a first substrate 20 and a second substrate 21 together, wherein a porous semiconductor layer 30 is formed on the first substrate 20, and a dye solution 32 containing dye 32C is printed on the first substrate 20 or the second substrate 21.

[0039] A porous semiconductor layer 30 is formed on the first substrate 20, and a dye solution 32 is printed on either the first substrate 20 or the second substrate 21. The dye-sensitized solar cell 10 is then manufactured by bonding the first substrate 20 and the second substrate 21 together. In this embodiment, when the dye solution 32 is printed on the second substrate 21, the dye 32C is adsorbed onto the porous semiconductor layer 30 as the first substrate 20 and the second substrate 21 are bonded together. Because the dye solution 32 is printed on either the first substrate 20 or the second substrate 21 in this way, the printing area of ​​the dye solution 32 can be easily adjusted, thereby reducing unevenness in the density of the dye 32C, as is the case with conventional drop-type dyeing methods. This improves photoelectric conversion efficiency and results in a better appearance.

[0040] Furthermore, a screen plate 41 having an opening 41A is placed on the first substrate 20 or the second substrate 21, a dye solution 32 is supplied onto the screen plate 41, and the supplied dye solution 32 is spread by a squeegee 43. When the dye solution 32 supplied onto the screen plate 41 is spread by the squeegee 43, the dye solution 32 is printed onto the first substrate 20 or the second substrate 21 through the opening 41A of the screen plate 41. In this way, since the dye solution 32 is printed by a screen printing method, the printing range of the dye solution 32 can be easily adjusted by setting the pattern related to the opening 41A of the screen plate 41.

[0041] Furthermore, a sealing material 31 is applied in an annular shape to the first substrate 20, which is one of the two substrates 20 and the second substrate 21, on which the dye solution 32 is not printed, and the electrolyte 22 is supplied to the region surrounded by the sealing material 31. When the first substrate 20 and the second substrate 21 are bonded together, the space between the two substrates 20 and 21 is filled with the electrolyte 22, and the electrolyte 22 is sealed by the sealing portion 23 made of the sealing material 31. The process of printing the dye solution 32 on the first substrate 20 or the second substrate 21 and the process of applying the sealing material 31 to the first substrate 20, which is one of the two substrates 21 and the second substrate 21, on which the dye solution 32 is not printed, and supplying the electrolyte 22 can be processed in parallel. This makes it possible to shorten the cycle time.

[0042] Next, the dye solution 32 is printed onto the second substrate 21. After forming a porous semiconductor layer 30 on the first substrate 20 and printing the dye solution 32 onto the second substrate 21, the first substrate 20 and the second substrate 21 are bonded together. As a result, the dye 32C contained in the dye solution 32 printed on the second substrate 21 is adsorbed onto the porous semiconductor layer 30 formed on the first substrate 20.

[0043] <Embodiment 2> Embodiment 2 will be described with reference to Figures 11 to 17. This Embodiment 2 shows a case where the manufacturing procedure of the dye-sensitized solar cell 10 is changed. Note that redundant explanations of the structure, operation, and effects, which are the same as those described in Embodiment 1, will be omitted.

[0044] In the manufacturing method of the dye-sensitized solar cell 10 according to this embodiment, as shown in Figure 11, the first substrate processing step includes a first electrode formation step and a porous semiconductor layer formation step, a dye solution printing step and a drying step, while the second substrate processing step includes a second electrode formation step and a catalyst layer formation step, a sealing material coating step and an electrolyte dropping step. The first substrate processing step and the second substrate processing step will be described below.

[0045] In the second substrate processing step, similar to Embodiment 1, the second electrode formation step and the catalyst layer formation step are performed, and as shown in Figure 12, the second electrode 126 and the catalyst layer 127 are provided on the main surface of the second substrate 121. Subsequently, when the sealing material coating step is performed, as shown in Figure 13, the sealing material 131 is coated on the main surface of the second substrate 121 in an annular shape, surrounding multiple second electrodes 126 and catalyst layers 127, respectively. Next, when the electrolyte dropping step is performed, droplets 122LQ of electrolyte 122 are selectively dropped in predetermined amounts onto each of the multiple regions on the main surface of the second substrate 121 that are surrounded by the annular sealing material 131.

[0046] In the first substrate processing step, similar to Embodiment 1, the first electrode formation step and the porous semiconductor layer formation step are performed, and as shown in Figure 14, the first electrode 124 and the porous semiconductor layer 130 are provided on the main surface of the first substrate 120. Next, the dye solution printing step is performed. The screen plate 141 of the screen printing apparatus 140 used in the dye solution printing step has openings 141A at positions that overlap with each porous semiconductor layer 130 of the first substrate 120. Multiple openings 141A are arranged in a grid pattern (four in this embodiment) on the main surface of the screen plate 141 when viewed in plane (see Figure 7). In the dye solution printing step, the dye solution 132 is supplied onto the screen plate 141 which is positioned opposite the main surface of the first substrate 120 at a predetermined distance. Then, by moving the squeegee 143 along the main surface of the screen plate 141, the dye solution 132 is spread onto the screen plate 141 as shown in Figure 15. The dye solution 132 is then selectively printed onto the porous semiconductor layer 130 superimposed on the opening 141A of the screen plate 141 through the opening 141A. The printed dye solution 132 is distributed in a solid form over the entire surface of the porous semiconductor layer 130. In other words, the printing area where the dye solution 132 is printed on the main surface of the first substrate 120 coincides with the formation area of ​​the porous semiconductor layer 130. In this way, the dye solution 132 printed on the porous semiconductor layer 130 penetrates into the pores of the porous semiconductor layer 130, promoting the diffusion of the dye 32C contained in the dye solution 132, and the dye 32C is gradually adsorbed onto the surface of the porous semiconductor layer 130. After that, when the drying process is performed, as shown in Figure 16, the solvent contained in the dye solution 132 printed on the porous semiconductor layer 130 evaporates, and the dye 32C remains adsorbed on the surface of the porous semiconductor layer 130. In this way, the photoelectric conversion layer 125 is formed.

[0047] After the first and second substrate processing steps are performed as described above, a bonding step is carried out. In the bonding step, as shown in Figure 17, the second substrate 121 coated with the sealing material 131 is placed on the lower side, and the first substrate 120 is placed facing the second substrate 121 from above. Then, for example, the first substrate 120 is brought closer to the second substrate 121 side and bonding is performed. When the sealing material 131 on the second substrate 121 side comes into contact with the first substrate 120 during bonding, the space formed between the first substrate 120 and the second substrate 121 is partitioned by the sealing material 131, and each partitioned space (space within each cell 111) is filled with electrolyte 122. Subsequently, when the sealing material curing step is carried out, the sealing material 131 is irradiated with ultraviolet light and the sealing material 131 is completely cured. In this way, a dye-sensitized solar cell 110 is manufactured.

[0048] As described above, in this embodiment, in the dye solution printing process included in the first substrate processing process, a dye solution 132 containing dye 32C is printed onto the first substrate 120 by screen printing. With screen printing, the printing range of the dye solution 132 can be easily adjusted by setting the pattern related to the opening 141A of the screen plate 141. Specifically, the dye solution 132 is printed in a solid form onto the porous semiconductor layer 130 provided on the first substrate 120. Therefore, the dye 32C contained in the dye solution 132 printed on the first substrate 120 is uniformly diffused throughout the entire porous semiconductor layer 130. Since the dye solution 132 enters into the numerous pores present on the surface of the porous semiconductor layer 130, the dye 32C contained in the dye solution 132 also diffuses to every corner of the pores and is evenly adsorbed onto the surface of the pores.

[0049] Conventionally, since the dye solution was dropped onto the semiconductor layer, areas of the semiconductor layer where the dye solution was dropped and areas where it was not were created, which could lead to unevenness in the density of the dye. In particular, dyes with large molecular sizes tend to propagate more easily along the vertical direction and less easily in the horizontal direction in the areas of the semiconductor layer where the dye solution is dropped, resulting in strong unevenness in the density of the dye. In this embodiment, however, since the dye solution 132 is printed in a solid state onto the porous semiconductor layer 130 provided on the first substrate 120, the dye 32C contained in the dye solution 132 can be uniformly attached over almost the entire surface of the porous semiconductor layer 130. As a result, unevenness in the density of the dye 32C in the porous semiconductor layer 130 is less likely to occur, improving the photoelectric conversion efficiency of the photoelectric conversion layer 125 and resulting in a better appearance. Furthermore, in this embodiment, the dye solution printing process and drying process are included in the first substrate processing process, and the sealing material coating process and electrolyte dropping process are included in the second substrate processing process. Therefore, it is possible to process the dye solution printing process and drying process and the sealing material coating process and electrolyte dropping process in parallel. By performing parallel processing, the cycle time can be shortened.

[0050] As described above, according to this embodiment, a dye solution 132 is printed onto the first substrate 120. After forming a porous semiconductor layer 130 on the first substrate 120, the dye solution 132 is printed onto the porous semiconductor layer 130. Then, the dye 32C contained in the printed dye solution 132 is adsorbed onto the porous semiconductor layer 130. Subsequently, the dye-sensitized solar cell 110 is manufactured by bonding the first substrate 120 and the second substrate 121 together.

[0051] <Embodiment 3> Embodiment 3 will be described with reference to Figures 18 to 23. This Embodiment 3 shows a case where the dye solution printing process is modified from Embodiment 1 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those described in Embodiment 1, will be omitted.

[0052] As shown in Figure 18, the screen plate 241 of the screen printing apparatus 240 used in the dye solution printing process according to this embodiment has multiple openings 241A provided at positions that overlap with each porous semiconductor layer 230 of the first substrate 220. The openings 241A are elongated strips that extend along the Y-axis in the portion of the screen plate 241 that overlaps with the porous semiconductor layer 230, and multiple openings are arranged side by side with spacing in the X-axis direction. The dimensions (length) of the openings 241A in the Y-axis direction are approximately the same as the dimensions of the porous semiconductor layer 230 in the Y-axis direction. The dimensions (width) of the openings 241A in the X-axis direction are smaller than the dimensions of the porous semiconductor layer 230 in the X-axis direction. The spacing between the multiple openings 241A (the spacing between two adjacent openings 241A in the X-axis direction) is approximately equal to the dimensions of the openings 241A in the X-axis direction.

[0053] In the dye solution printing process, the dye solution 232 is printed onto the second substrate 221 using a screen plate 241 with the configuration described above. Specifically, as shown in Figure 19, the dye solution 232 supplied onto the screen plate 241 is spread by a squeegee 243. At this time, the direction of movement of the squeegee 243 is, for example, in the X-axis direction, that is, the width direction of the opening 241A. The dye solution 232 spread by the squeegee 243 is selectively printed onto the catalyst layer 227 superimposed on the opening 241A through the opening 241A of the screen plate 241, as shown in Figure 20.

[0054] As shown in Figure 21, the printed dye solution 232 forms an elongated strip extending along the Y-axis direction (one direction) on the catalyst layer 227, and multiple strips are arranged side by side with gaps in the X-axis direction (a direction intersecting the one direction). In other words, the dye solution 232 is selectively printed on the main surface of the second substrate 221 such that printed areas PA, where the dye solution 232 is printed, and non-printed areas NPA, where the dye solution 232 is not printed, are alternately arranged one by one along the X-axis direction. In Figure 21, the printed areas PA of the catalyst layer 227 are shown as a shaded area, while the non-printed areas NPA are shown as white outlines. Both the printed areas PA and the non-printed areas NPA form strips extending along the Y-axis direction. The printed areas PA are positioned to overlap the opening 241A of the screen plate 241 when viewed in plan. The non-printing area (NPA) is located in a position that does not overlap with the opening 241A of the screen plate 241, and is adjacent to the opening 241A in the X-axis direction (located between two openings 241A).

[0055] Subsequently, during the drying process, as shown in Figure 22, the solvent contained in the dye solution 232 printed on the catalyst layer 227 evaporates, leaving the dye 232C attached to the catalyst layer 227. The dye 232C selectively adheres to multiple printed regions PA on the catalyst layer 227. Then, during the bonding process, when the first substrate 220 and the second substrate 221 are bonded together, as shown in Figure 23, the electrolyte 222 on the first substrate 220 side enters each of the non-printed regions NPA among the alternately arranged printed regions PA and non-printed regions NPA on the catalyst layer 227. Therefore, the electrolyte 222 comes into contact with the first surface 232C1 of the dye 232C present in each printed region PA that faces the porous semiconductor layer 230, and the second surface 232C2 that faces the dye 232C present in adjacent printed regions PA in the X-axis direction. As a result, the contact area of ​​the electrolyte 222 with the dye 232C in the printing area PA is larger than in Embodiment 1, making it easier for the dye 232C to dissolve in the solvent of the electrolyte 222 and increasing the rate of diffusion into the solvent. This allows the dye 232C dissolved in the electrolyte 222 to diffuse more quickly into the pores of the porous semiconductor layer 230 and be adsorbed more quickly on the surface of the pores. This makes it less likely for unevenness in the density of the dye 232C to occur in the porous semiconductor layer 230 and allows for a reduction in cycle time.

[0056] As described above, according to this embodiment, a sealing material 231 is applied to the first substrate 220 in an annular shape, and an electrolyte 222 is supplied to the area surrounded by the sealing material 231. The dye solution 232 is selectively printed on the main surface of the second substrate 221 so that printed areas PA, where the dye solution 232 is printed, and non-printed areas NPA, where the dye solution 232 is not printed, are arranged alternately in a repeating pattern. When the dye solution 232 is printed on the second substrate 221, the printed areas PA and non-printed areas NPA are arranged alternately in a repeating pattern. When the first substrate 220 and the second substrate 221 are bonded together, the electrolyte 222 on the first substrate 220 side enters the non-printed areas NPA of the alternating printed areas PA and non-printed areas NPA on the main surface of the second substrate 221. As a result, the contact area of ​​the electrolyte 222 with the dye 232C (dye solution 232) in the printing area PA increases, thereby improving the adsorption rate of the dye 232C to the porous semiconductor layer 230 on the first substrate 220 side. In addition, as the first substrate 220 and the second substrate 221 are bonded together, the electrolyte 222 is sealed by the sealing portion 23 made of the sealing material 231.

[0057] Furthermore, the dye solution 232 is printed on the main surface of the second substrate 221 such that both the printed area PA and the non-printed area NPA form a strip extending in one direction. When the dye solution 232 is printed on the second substrate 221, the printed area PA and the non-printed area NPA, both extending in one direction, are arranged alternately in a direction intersecting the direction of extension. When the first substrate 220 and the second substrate 221 are bonded together, the electrolyte 222 on the first substrate 220 side enters the non-printed area NPA, which forms a strip on the main surface of the second substrate 221. As a result, the contact area of ​​the electrolyte 222 with respect to the dye 232C (dye solution 232) in the printed area PA that is adjacent to the non-printed area NPA and forms a strip increases.

[0058] <Embodiment 4> Embodiment 4 will be described with reference to Figure 24 or Figure 25. This Embodiment 4 shows a case where the dye solution printing process is modified from Embodiment 3 described above. Note that redundant explanations of the structure, operation, and effects, which are the same as those of Embodiment 3, will be omitted.

[0059] As shown in Figure 24, the screen plate 341 of the screen printing apparatus 40 used in the dye solution printing process according to this embodiment has multiple openings 341A arranged in a staggered pattern when viewed in plan in the portion that overlaps with the porous semiconductor layer 330. Specifically, the openings 341A have a rectangular shape in plan, and are arranged in groups of multiples with predetermined intervals in the X-axis direction and the Y-axis direction. Figure 24 illustrates the case where the plan shape of the openings 341A is square, and the spacing between each arrangement in the X-axis direction and the Y-axis direction is approximately equal to the length of one side of the opening 341A.

[0060] In the dye solution printing process, when the dye solution 332 is printed onto the second substrate 321 using the screen plate 341 configured as described above, the dye solution 332 forms a pattern as shown in Figure 25. More specifically, the dye solution 332 printed on the second substrate 321 is arranged in groups of multiples with predetermined intervals in the X-axis and Y-axis directions, as shown in Figure 25. In other words, the dye solution 332 is selectively printed on the main surface of the second substrate 321 so that printed areas PA, where the dye solution 332 is printed, and non-printed areas NPA, where the dye solution 332 is not printed, form a staggered grid pattern (one by one alternating along the X-axis and Y-axis directions). In Figure 25, the printed areas PA of the catalyst layer 327 are shown as a shaded area, while the non-printed areas NPA are shown as white outlines.

[0061] When the second substrate 321, on which the dye solution 332 is printed, is bonded to the first substrate 20, the electrolyte 22 on the first substrate 20 side penetrates into each of the non-printed regions NPA among the printed regions PA and non-printed regions NPA arranged in a staggered pattern on the catalyst layer 327 (see Figure 23). Therefore, the electrolyte 22 comes into contact with the first surface 332C1 of the dye 332C present in each printed region PA that faces the porous semiconductor layer 30, the second surface 332C2 that faces the dye 332C present in adjacent printed regions PA in the X-axis direction, and the third surface 332C3 that faces the dye 332C present in adjacent printed regions PA in the Y-axis direction. In this way, the contact area of ​​the electrolyte 22 with respect to the dye 332C in the printed regions PA is larger than in Embodiment 3, so that the dye 332C dissolves more easily in the solvent of the electrolyte 22 and the rate of diffusion into the solvent becomes faster. As a result, the dye 332C dissolved in the electrolyte 22 diffuses more rapidly into the pores of the porous semiconductor layer 30 and is adsorbed more rapidly onto the surface of the pores. This makes it less likely for unevenness in the density of the dye 332C to occur in the porous semiconductor layer 30, and also allows for further shortening of the cycle time.

[0062] As described above, according to this embodiment, the dye solution 332 is printed on the main surface of the second substrate 321 such that both the printed area PA and the non-printed area NPA form a staggered grid pattern. When the dye solution 332 is printed on the second substrate 321, the printed area PA and the non-printed area NPA, both forming a staggered grid pattern, are arranged alternately in two intersecting directions. When the first substrate 20 and the second substrate 321 are bonded together, the electrolyte 22 on the first substrate 20 side enters the non-printed area NPA, which forms a staggered grid pattern on the main surface of the second substrate 321. As a result, the contact area of ​​the electrolyte 22 with respect to the dye solution 332 in the printed area PA adjacent to the non-printed area NPA and forming a staggered grid pattern increases.

[0063] <Other Embodiments> The technology disclosed herein is not limited to the embodiments described above in the description and drawings, but also includes, for example, the following embodiments.

[0064] (1) In embodiments 1, 3, and 4, the sealing material 31, 231 may be applied to the second substrate 21, 221, 321 on which the dye solution 32, 232, 332 is printed, and the electrolyte 22, 222 may be dropped onto the second substrate 21, 221, 321 on which the dye solution 32, 232, 332 is printed.

[0065] (2) In Embodiment 2, the sealing material 131 may be applied to the first substrate 120 on which the dye solution 132 is printed, and the electrolyte 122 may be dropped onto the first substrate 120 on which the dye solution 132 is printed.

[0066] (3) In embodiments 1 and 2, the size of the openings 41A and 141A in the screen plates 41 and 141 (size of the printing area PA) may be smaller than the sizes of the catalyst layers 27 and 127 and the porous semiconductor layers 30 and 130.

[0067] (4) In Embodiment 3, the spacing between the openings 241A in the screen plate 241 (spacing between the printing areas PA) may be greater than or less than the width dimension of the openings 241A.

[0068] (5) In Embodiment 3, the direction of movement of the squeegee 243 may coincide with the Y-axis direction, that is, the length direction of the opening 241A.

[0069] (6) In Embodiment 4, the planar shape of the opening 341A in the screen plate 341 (planar shape of the printing area PA) may be rectangular. Alternatively, the planar shape of the opening 341A in the screen plate 341 may be a shape other than a rectangle (for example, a circle, an ellipse, a triangle, a polygon with pentagons or more, etc.).

[0070] (7) In Embodiment 4, the spacing between each of the openings 341A in the X-axis and Y-axis directions (the spacing between each of the printing area PA) in the screen plate 341 may be different from the length of one side of the opening 341A.

[0071] (8) In the dye solution printing process, the dye solutions 32, 132, 232, and 332 may be printed using a printing method other than screen printing (such as letterpress printing, intaglio printing, lithographic printing, or stencil printing).

[0072] (9) The specific method for forming the first electrodes 24, 124 in the first electrode formation step can be modified as appropriate in addition to the above.

[0073] (10) The specific method for forming the second electrodes 26,126 in the second electrode formation step can be modified as appropriate in addition to the above.

[0074] (11) The specific method for forming the porous semiconductor layers 30, 130, and 230 in the porous semiconductor layer formation process can be modified as appropriate in addition to the above.

[0075] (12) The specific method of applying the sealing materials 31, 131, and 231 in the sealing material application process can be changed as appropriate in addition to the above.

[0076] (13) The specific method of dropping electrolytes 22, 122, and 222 in the electrolyte dropping step can be changed as appropriate in addition to the above. Alternatively, an electrolyte coating step in which electrolytes 22, 122, and 222 are applied may be performed instead of the electrolyte dropping step. In addition, the electrolyte dropping step can be changed as appropriate depending on the material used for electrolytes 22, 122, and 222.

[0077] (14) The specific methods for forming catalyst layers 27, 127, 227, and 327 in the catalyst layer formation process can be modified as appropriate in addition to the above.

[0078] (15) The specific method for bonding the first substrates 20, 120, 220 and the second substrates 21, 121, 221, 321 in the bonding process can be modified as appropriate in addition to the above.

[0079] (16) The specific materials for each electrode 24, 26, 124, 126, catalyst layers 27, 127, 227, 327, porous semiconductor layers 30, 130, 230, sealing material 31, 131, 231, dye solution 32, 132, 232, 332, and dyes 32C, 232C, 332C can be changed as appropriate in addition to those listed above.

[0080] (17) Each substrate 20, 21, 120, 121, 220, 221, 321 may be made of synthetic resin material in addition to glass material.

[0081] (18) Electrolytes 22, 122, and 222 may be liquids, solids (solid electrolytes), gels (gel electrolytes, molten salt gel electrolytes), etc.

[0082] (19) The sealing materials 31, 131, and 231 may be composed of a photocurable resin material having the property of curing with light of wavelengths other than ultraviolet light, or they may be composed of a thermosetting resin material. If the sealing materials 31, 131, and 231 are changed, the sealing material curing process should be changed according to the properties of the sealing materials 31, 131, and 231.

[0083] (20) The planar shape of the cell 11 in the dye-sensitized solar cell 10, 110 can be changed as appropriate in addition to the shape shown. The planar shape of the cell 11 may be, for example, a vertically elongated rectangle, a horizontally elongated rectangle, etc.

[0084] (21) The number of cells 11 in the dye-sensitized solar cells 10 and 110 can be changed as appropriate, in addition to the arrangement shown in the figures. For example, the dye-sensitized solar cells 10 and 110 may be configured to have a single cell 11. [Explanation of symbols]

[0085] 10,110…Dye-sensitized solar cell (photoelectric conversion element), 20,120,220…First substrate, 21,121,221,321…Second substrate, 22,122,222…Electrolyte, 30,130,230…Porous semiconductor layer, 31,131,231…Sealing material, 32,132,232,332…Dye solution, 32C,232C,332C…Dye, 41,141,241,341…Screen plate, 41A,141A,241A,341A…Aperture, 43,143,243…Squeegee, PA…Printed area, NPA…Non-printed area

Claims

1. A method for manufacturing a photoelectric conversion element formed by bonding a first substrate and a second substrate together, A porous semiconductor layer formation step in which a porous semiconductor layer is formed on the first substrate, A dye solution printing step of printing a dye solution containing a dye onto the second substrate, A bonding step in which an electrolyte is interposed between the first substrate and the second substrate, A dye adsorption step involves diffusing the dye into the electrolyte and adsorbing it onto the surface of the porous semiconductor layer. A method for manufacturing a photoelectric conversion element having

2. The method for manufacturing a photoelectric conversion element according to Claim 1, wherein the dye solution printing step involves placing a screen plate having an opening on the second substrate, supplying the dye solution onto the screen plate, and spreading the supplied dye solution with a squeegee.

3. A method for manufacturing a photoelectric conversion element according to claim 1 or claim 2, further comprising: a sealing material coating step of coating a sealing material on a first substrate in an annular shape; and an electrolyte supply step of supplying an electrolyte to a region surrounded by the sealing material.

4. The method for manufacturing a photoelectric conversion element according to claim 1 or claim 2, further comprising a drying step of drying the dye solution.

5. The method for manufacturing a photoelectric conversion element according to claim 1 or 2, further comprising a catalyst layer formation step of forming a catalyst layer between the second substrate and the dye solution.

6. The method for manufacturing a photoelectric conversion element according to claim 5, wherein the dye solution is distributed in a solid form over the entire area of ​​the catalyst layer.

7. A method for manufacturing a photoelectric conversion element formed by bonding a first substrate and a second substrate together, A porous semiconductor layer is formed on the first substrate. A dye solution containing a dye is printed onto the second substrate. A sealing material is applied to the first substrate in an annular shape, and an electrolyte is supplied to the region surrounded by the sealing material. A method for manufacturing a photoelectric conversion element, comprising selectively printing the dye solution on the main surface of the second substrate such that printed areas on which the dye solution is printed and unprinted areas on which the dye solution is not printed are arranged alternately in a repeating pattern.

8. A method for manufacturing a photoelectric conversion element according to claim 7, wherein the dye solution is printed on the main surface of the second substrate such that the printed area and the non-printed area both extend in one direction, forming a strip shape.

9. A method for manufacturing a photoelectric conversion element according to claim 7, wherein the dye solution is printed on the main surface of the second substrate such that both the printed area and the non-printed area form a staggered grid pattern.

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