Bonding layer on an extreme ultraviolet plate

Abstract

The apparatus includes a reticle pod. The reticle pod includes a base plate having a first surface, a cover having a second surface, and at least one layer. The first surface includes a first mating surface. The second surface includes a second mating surface. The at least one layer is coupled to one or more of at least a portion of the first mating surface and at least a portion of the second mating surface. The first surface and the second surface overlap at the first mating surface and the second mating surface when the cover is attached to the base plate.

Description

Technical Field

[0001] The present disclosure generally relates to reticle pods used for reticles. More particularly, the present disclosure relates to apparatuses and methods for bonding one or more layers on a base plate and / or cover of a reticle pod, such as an extreme ultraviolet (EUV) reticle pod.

Background Art

[0002] Reticle pods are used to contain reticles. A reticle may include, for example, a photolithography mask used during semiconductor processing, such as during EUV processing. A reticle pod can be used for storing and transporting a reticle. A reticle pod can include an inner pod that is handled and manipulated by one or more tools during processing. The inner pod of the reticle pod includes a base plate and a cover. The base plate and the cover contain the reticle and protect the reticle from contamination or physical damage during transportation, storage, and processing. The inner pod can be coated with chromium. The chromium coating can help improve the reflectivity and appearance of the surface and resist loss of reflectivity from oxidation. A reticle pod can include, for example, an EUV pod for use by an EUV photolithography tool. A reticle pod can include an outer pod that has a pod door and a pod dome and houses the inner pod.

Summary of the Invention

[0003] The present disclosure generally relates to reticle pods used for reticles. More particularly, the present disclosure relates to apparatuses and methods for bonding one or more layers on a base plate and / or cover of a reticle pod, such as an EUV reticle pod.

[0004] The reticle pod may include an inner pod (e.g., a metal inner pod). The inner pod of the reticle pod may be coated, for example, with chromium to improve surface reflectivity and appearance and to help resist the loss of reflectivity from oxidation. The processes of polishing, coating, and / or plating the reticle pod may be inconsistent and may result in poor appearance. By bonding one or more layers to the surface of the reticle pod, it may be possible to avoid any second polishing, plating, and / or coating.

[0005] In one embodiment, the apparatus includes a reticle pod. The reticle pod includes a base plate having a first surface, a cover having a second surface, and at least one layer. The first surface includes a first mating surface. The second surface includes a second mating surface. At least one layer is bonded to at least a portion of the first mating surface and at least a portion of the second mating surface, one or more of the two. The first surface and the second surface overlap at the first mating surface and the second mating surface when the cover is attached to the base plate.

[0006] In one embodiment, the reticle pod is an EUV reticle pod. The base plate and cover are configured to house the reticle when the cover is attached to the base plate.

[0007] In one embodiment, the device further includes an outer pod dome and an outer pod door. The outer pod dome and outer pod door are configured to house a base plate and cover within the outer pod dome when the outer pod door is attached to the outer pod dome.

[0008] In one embodiment, at least one layer may include glass, graphite, silicon carbide, or ceramic.

[0009] In one embodiment, the apparatus further includes a binder configured to bond at least one layer to one or more of the first mating surfaces and the second mating surfaces.

[0010] In one embodiment, the binder is an adhesive. In another embodiment, the binder is an epoxy resin.

[0011] In one embodiment, at least one layer is coupled to one or more of the first mating surfaces and the second mating surfaces by magnetic coupling and thermal coupling.

[0012] In one embodiment, the base plate and cover include a substrate. In one embodiment, the substrate is coated with a coating material. In one embodiment, at least one layer is bonded to the coating material.

[0013] In one embodiment, at least one layer has a predetermined minimum thickness of about 50 microns. In one embodiment, at least one layer has a predetermined maximum thickness of about 1 millimeter. In one embodiment, at least one layer has a predetermined roughness with a roughness mean (Ra) of less than about 0.2 microns. In one embodiment, at least one layer has a predetermined thickness uniformity of less than about + / - 5 microns.

[0014] In one embodiment, at least one layer comprises a first layer and a second layer, the first layer bonded to at least a portion of a first mating surface, and the second layer bonded to at least a portion of a second mating surface, and when the cover is attached to the base plate, the first layer does not overlap with the second layer, and the combination of the first and second layers overlaps with the entire first mating surface or the entire second mating surface.

[0015] In one embodiment, the first layer is bonded to half of the first mating surface, and the second layer is bonded to half of the second mating surface.

[0016] In one embodiment, a method for fabricating a reticle pod is provided. The reticle pod includes a base plate and a cover. The base plate has a first surface, which includes a first mating surface. The cover has a second surface, which includes a second mating surface. The method includes bonding at least one layer to one or more of the first and second mating surfaces.

[0017] In one embodiment, the method further includes coating the substrates of the base plate and cover with a coating material. The coating is performed before bonding.

[0018] In one embodiment, bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces includes applying a binder for bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces.

[0019] In one embodiment, bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces includes magnetically or thermally bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces.

[0020] In one embodiment, the material of at least one layer is glass, graphite, silicon carbide, or ceramic.

[0021] Refer to the accompanying drawings which form part of this disclosure and illustrate embodiments on which the systems and methods described herein are implementable. [Brief explanation of the drawing]

[0022] [Figure 1A] This is a cross-sectional view of the inner pod of a reticle pod when it is closed, according to one embodiment. [Figure 1B] This is a cross-sectional view of the inner pod of Figure 1A when it is open, according to one embodiment. [Figure 2]Top view of a base plate in a reticle pod according to one embodiment. [Figure 3] Bottom view of a cover for a reticle pod according to one embodiment. [Figure 4] Cross-sectional view of the mating surface of a base plate and a cover for a reticle pod according to one embodiment. [Figure 5] Prospective view of a reticle pod according to one embodiment. [Figure 6] Flowchart of a method for manufacturing a reticle pod according to one embodiment.

Embodiments for Carrying Out the Invention

[0023] Throughout, like reference numerals represent like parts.

[0024] This disclosure generally relates to reticle pods used for reticles. More particularly, this disclosure relates to devices and methods for bonding one or more layers on a base plate and / or cover of a reticle pod, such as an EUV reticle pod.

[0025] The following definitions are applicable throughout this disclosure. As defined herein, the term "layer" can refer to a sheet, quantity, and / or thickness of material, typically one of several that cover a surface.

[0026] As defined herein, the term "adhesive" can refer to a substrate used to join objects or materials together. In one embodiment, the adhesive can be a layer independent of the objects or materials being joined together.

[0027] As defined herein, the term "bonding" can refer to connecting, joining, and / or being firmly joined to something else by means of an adhesive substance, heat treatment, pressure treatment, and / or magnetic treatment, etc.

[0028] As defined herein, the term “thermal bonding” can refer to the process of joining objects or materials together by applying heat to connect or join them. In one embodiment, “thermal bonding” can refer to the process of melting objects and / or materials together to connect and / or join them.

[0029] As defined herein, the term “magnetic coupling” can refer to the process of joining objects or materials together by the magnetism of those objects or materials. In one embodiment, “magnetic coupling” may include the process of making one or more of the objects or materials (to be connected or joined) into a permanent magnet. Permanent magnets may include, but are not limited to, neodymium-iron-boron magnets, samarium-cobalt magnets, alnico (e.g., alloys such as aluminum, nickel, and cobalt) magnets, and ceramic or ferrite (e.g., ceramic-like materials made by mixing iron oxide with nickel, strontium, or cobalt) magnets.

[0030] As used herein, the term “about” means a range within which a person skilled in the art would consider a value to be within the applicable range. In some embodiments, this is within 10%. In some embodiments, this reflects the significant figures given to the value; for example, a value of 5 may include values ​​from 4.5 to 5.4, which are rounded to 5, while a value of 5.0 may include values ​​from 4.95 to 5.04.

[0031] Specific embodiments of the present disclosure are described herein with reference to the accompanying drawings. However, it should be understood that the disclosed embodiments are merely examples of the present disclosure and can be embodied in various forms. Well-known functions or configurations are not described in detail to avoid obscuring the present disclosure with unnecessary detail. Accordingly, the specific structural and functional details disclosed herein should not be construed as limiting, but merely as the basis for the claims and as a representative basis for teaching those skilled in the art to use the present disclosure in various ways in any appropriately detailed configuration. In this specification and in the drawings, similar reference numerals represent elements capable of performing the same, similar, or equivalent functions.

[0032] The scope of this disclosure should be determined by the appended claims and their legal equivalents, rather than by the examples given herein. For example, the steps described in the claims of any method can be performed in any order and are not limited to the order presented in the claims. Furthermore, unless specifically stated herein as “material” or “essential,” there are no elements that are essential for practicing this disclosure.

[0033] Figures 1A and 1B show cross-sectional views of an inner pod 1 of a reticle pod according to one embodiment. Figure 1A shows the inner pod 1 when closed. Figure 1B shows the inner pod 1 when open. The inner pod 1 has an internal space having a reticle housing section 3 for housing a reticle 5. The pod 1 may include reticle supports 7A and 7B within the reticle housing section 3 for supporting the reticle 5 inside the inner pod 1.

[0034] The inner pod 1 includes a base plate 10 and a cover 40. The base plate 10 and the cover 40 are configured to be joined together. As shown in Figure 1A, the internal space of the inner pod 1 is sealed (e.g., closed) by placing the cover 40 on the base plate 10. The cover 40 is in direct contact with the base plate 10. In particular, the bottom 42 of the cover 40 is in contact with the top 12 of the base plate 10. The inner pod 1 is opened by moving the cover 40 away from the base plate 10 (e.g., by moving the cover upward in direction D1). For example, an external tool (e.g., an automated arm) opens the inner pod 1 to enter the reticle housing 3 and remove the reticle 5.

[0035] The base plate 10 and the cover 40 include one or more mating surfaces configured to fit together. In one embodiment, one or more mating surfaces may be one or more sealing surfaces that provide a seal between the base plate 10 and the cover 40. For example, the seal may be configured to reduce or prevent external contaminants (e.g., air, dust, etc.) from entering the pod 1 by passing between the base plate 10 and the cover 40. The base plate 10 may include one or more mating surfaces that directly contact the cover 40 when the cover 40 is installed on the base plate 10. The cover 40 includes one or more mating surfaces configured to directly contact the base plate 10 when the cover 40 is installed on the base plate 10. For example, the base plate 10 may include a first mating surface (e.g., mating surface 14) configured to directly contact the cover 40, and the cover 40 may include a second mating surface (e.g., mating surface 44) configured to directly contact the base plate 10.

[0036] Figure 2 is a top view of a base plate 10 for a reticle pod according to one embodiment. Figure 2 shows the upper part 12 of the base plate 10. The cover 40 is configured to be installed on the upper part 12 of the base plate 10. The base plate 10 may also include a reticle support 7A.

[0037] The base plate 10 includes a mating surface 14 and a base plate body 16. The mating surface 14 is formed on the base plate body 16. In Figure 2, the base plate 10 includes a single continuous mating surface 14. The mating surface 14 extends along the entire perimeter of the base plate 10. However, in one embodiment, the base plate 10 may include multiple mating surfaces. For example, separate mating surfaces 14 may be provided in locations where there is a greater amount of wear between the base plate 10 and the cover 40. In one embodiment, the mating surface 14 of the base plate 10 may extend along only a portion of the perimeter of the base plate 10.

[0038] As shown in Figure 2, one or more mating surfaces 14 are arranged to cover less than 75% of the base plate 10. In one embodiment, one or more mating surfaces 14 are arranged to cover less than 50% of the base plate 10. The embodiments described herein are not limited to the quantities described. That is, the quantities described herein are provided for convenience only and are not intended to limit the scope.

[0039] Figure 3 is a bottom view of a cover 40 for an inner pod according to one embodiment. Figure 3 shows the bottom 42 of the cover 40. The bottom 42 of the cover 40 is configured to contact the upper part 12 of the base plate 40 when the cover 40 is installed on the base plate 10. The cover 40 may also include a reticle housing 3 and a reticle support 7B that supports the reticle in the inner pod.

[0040] The cover 40 includes a mating surface 44 and a cover body 46. The mating surface 44 is formed on the cover body 46. In Figure 3, the cover 40 includes a single continuous mating surface 44. However, in one embodiment, the cover 40 may include multiple mating surfaces. For example, each of the mating surfaces 44 extends only along a portion of the perimeter of the base plate 40. For example, separate mating surfaces 44 may be provided in locations where there is a greater amount of wear between the base plate 10 and the cover 40.

[0041] The mating surface 44 extends along the entire perimeter of the cover 40. Therefore, when the cover 40 is installed on the base plate 10, the mating surface 44 is positioned to extend along the entire perimeter of the base plate 10. In some embodiments, one or more mating surfaces 14 of the base plate 10 and one or more mating surfaces 44 of the cover 40 can be arranged together to extend along the entire perimeter of the base plate 10. For example, the mating surface 14 of the base plate 10 cannot extend along the entire perimeter of the base plate 10, and the mating surface 44 of the cover 40 extends along a portion of the perimeter of the base plate 10 without the mating surface 14. When the mating surfaces 14 of the base plate 10 and the mating surfaces 44 of the cover 40 are considered together, they will extend along the entire perimeter of the base plate 10.

[0042] The mating surface 44 is provided to cover less than 75% of the cover 40. In one embodiment, the mating surface 44 covers less than 50% of the cover 40. The mating surfaces 14, 44 of the inner pod 1 are formed to cover less than 75% of the base plate 10 and the cover 40. In one embodiment, the mating surfaces 14, 44 are formed to cover less than 50% of the base plate 10 and the cover 40. The embodiments described and mentioned herein are not limited to the quantities described. That is, the quantities described and mentioned herein are provided for convenience only and are not intended to limit.

[0043] Figure 4 is a cross-sectional view of the mating surfaces 14, 44 of the base plate 10 and cover 40 according to one embodiment. For example, the cross-section in Figure 4 extends through the dashed line A1 in Figure 2 and the dashed line A2 in Figure 3. Figure 4 shows the structure and interaction of the mating surfaces 14, 44 when the cover 40 is installed on the base plate 10 (for example, as shown in Figure 1B).

[0044] It will be recognized that in some embodiments, only one of the base plate 10 and the cover 40 may have mating surfaces. For example, the cover 40 may have one or more mating surfaces 44, while the base plate 10 may not have any mating surfaces, and vice versa.

[0045] The mating surface 14 is formed on the base plate body 16, and the mating surface 44 is formed on the cover body 46. In one embodiment, the base plate body 16 and the cover body 46 are each formed of metal or other suitable material. In one embodiment, the base plate body 16 and the cover body 46 can be formed of the same metal. In one embodiment, the base plate body 16 includes a substrate (e.g., aluminum, nickel, stainless steel, or other suitable material), and the mating surface 14 is formed on the substrate of the base plate body 16. In one embodiment, the cover body 46 includes a substrate (e.g., aluminum, nickel, stainless steel, or other suitable material), and the mating surface 44 is formed on the substrate of the cover body 46. In one embodiment, the base plate body 16 and the cover body 46 can be formed of different materials.

[0046] In one embodiment, the mating surface 14 can be formed from the same material as the substrate of the base plate body 16. The mating surface 44 can be formed from the same material as the substrate of the cover body 46. In one embodiment, chromium coating, nickel coating, plasma coating, or any other suitable coating can be applied to the substrate of the base plate body 16, the substrate of the cover body 46, the mating surface 14, and / or the mating surface 44, and chromium, nickel, or plasma can be applied as a coating to the surface of the base plate body 16, the substrate of the cover body 46, the mating surface 14, and / or the mating surface 44.

[0047] For example, as shown in Figure 4, the coating layer 20 can be formed on the base plate body 16 and / or mating surface 14. The coating layer 20 can be, but is not limited to, nickel, chromium, plasma, etc. In one embodiment, multiple coating layers 20 (e.g., about three layers having chromium as the final or top layer, these layers can be formed of nickel and / or chromium and / or plasma, and may have a thickness of about 25 microns) can be provided on the base plate body 16 and / or mating surface 14. The coating layer 20 can improve one or more properties of the base plate 10 (e.g., reduced reactivity, improved strength, etc.). In one embodiment, the cover 40 (cover body 46 and / or mating surface 14) may include a coating layer 50, similar to those described above for the coating layer 20.

[0048] In one embodiment, the mating surfaces 14, 44 may have a different coating from the coating on the substrate of the base plate body 16 and / or the substrate of the cover body 46. For example, each mating surface 14, 44 may include a coating, which may be, but is not limited to, titanium nitride, chromium nitride, and / or diamond-like carbon (DLC). Various embodiments of such coatings on the mating surfaces 14, 44 are described in U.S. Patent Application No. 63 / 017825, which is incorporated herein by reference in its entirety.

[0049] As shown in Figure 4, layer 11 can be bonded to the mating surface 14 of the base plate 10 after the base plate 10 has been coated, for example, with coating layer 20. Layer 21 can be bonded to the mating surface 44 of the cover 40 after the cover 40 has been coated, for example, with coating layer 50. In another embodiment, only layer 11 is bonded to the mating surface 14, and layer 21 is optional. In yet another embodiment, only layer 21 is bonded to the mating surface 44, and layer 11 is optional. In Figures 1A to 4, the base plate 10 and the cover 40 each have at least one bonding layer 11, 21. The bonding layer 11 of the coated base plate 10 is in direct contact with the bonding layer 21 of the coated cover 40 when the coated cover 40 having the bonding layer 21 is placed on the coated base plate 10 having the bonding layer 11. In other embodiments, layers 11, 21 cannot contact the bonding layer of the opposing coated mating surface. Layers 11, 21 can be in direct contact with the opposing coated mating surface. For example, layer 11 can directly contact the coated cover 40 when the coated cover 40 is placed on a coated base plate 10 having the bonding layer 11. In another embodiment, layer 11 can be bonded to a mating surface 14 of the base plate 10, and the base plate 10 is not coated with a coating layer. Layer 21 can be bonded to a mating surface 44 of the cover 40, and the cover 40 is not coated with a coating layer.

[0050] In one embodiment, layer 11 is bondable to at least a portion of mating surface 14. Layer 21 is bondable to at least a portion of mating surface 44. When the cover 40 is attached to the base plate 10, layer 11 does not overlap with layer 21, and the combination of layer 11 and layer 21 overlaps with the entire mating surface 14 or the entire mating surface 44.

[0051] For example, layer 11 can be bonded to half of mating surface 14, and layer 21 can be bonded to half of mating surface 44. When the cover 40 is attached to the base plate 10, layer 11 does not overlap with layer 21, but the combination of layer 11 and / or layer 21 overlaps with the entire mating surface 14 or the entire mating surface 44. It will be recognized that layer 11 can be bonded to any suitable part or division or section of mating surface 14, and layer 21 can be bonded to any suitable part or division or section of mating surface 44. In such embodiments, the combination of layer 11 and layer 21 can overlap with the entire mating surface 14 or the entire mating surface 44 to provide proper sealing.

[0052] In one embodiment, layers 11 and 21 may be bonding layers formed of glass, graphite, silicon carbide (SiC), ceramic, or any other suitable material. Layer 11 has a thickness T1. Layer 21 has a thickness T2. In one embodiment, each of thicknesses T1 and T2 may have a minimum thickness of about 50 microns. It will be recognized that the minimum thickness may help to facilitate handling of the layers. Each of thicknesses T1 and T2 may have a maximum thickness of about 1 millimeter. It will be recognized that the maximum thickness may help to facilitate the manufacturing of the layers and maintain a uniform thickness of the layers. Each of thicknesses T1 and T2 may have a roughness mean (Ra) of less than about 0.2 microns. It will be recognized that this roughness may improve wear performance, reduce potential particles, improve sealing performance, and / or maintain a suitable coefficient of friction. Each of thicknesses T1 and T2 may have a thickness uniformity of less than about + / - 5 microns. It will be recognized that this uniform thickness can promote proper surface flatness and / or improve sealing performance.

[0053] Each layer 11, 21 can extend along the entire length of the coated mating surfaces 14, 44. For example, with respect to the mating surface 14, layer 11 can extend along the entire perimeter of the base plate 10, as similarly described above and shown in Figure 2.

[0054] Returning to Figure 4, along each coated mating surface 14 of the base plate 10, layer 11 provides overlapping surfaces 18 of the base plate 10. Along each coated mating surface 44 of the cover 40, layer 21 provides overlapping surfaces 48 of the cover 40. Therefore, when the cover 40 is placed on the base plate 10, it contacts the base plate 10 only through one or more of the overlapping surfaces 18, 48.

[0055] In one embodiment, layers 11 and 21 can be bonded to the coated mating surfaces 14 and 44 by heat bonding, pressure bonding (e.g., pressure-sensitive adhesive), magnetic bonding, mechanical bonding (e.g., mechanical interlocking), chemically ray curable adhesive, photocurable adhesive, or any other suitable bonding process, without requiring a binder between layers 11 and 21 and the corresponding coated mating surfaces 14 and 44.

[0056] In one embodiment, layers 11 and 21 can be bonded to their respective coated mating surfaces 14 and 44 by applying a binder (not shown) between layers 11 and 21 and the coated mating surfaces 14 and 44. The binder can be a layer configured to bond layers 11 and 21 to the coated mating surfaces 14 and 44. In one embodiment, the binder can be an adhesive or any other suitable material. In one embodiment, the binder can be an epoxy resin, a pressure-sensitive adhesive, or any other suitable material.

[0057] It will be recognized that bonding layers 11, 21 to the coated base plate 10 and / or coated cover 40 may eliminate the need for any second polishing, plating, or coating of the base plate 10 and / or cover 40. Layers 11, 21 may have a more consistent surface quality than the coated base plate 10 and / or coated cover 40 and may reduce wear on the coated base plate 10 and / or coated cover 40. Layers 11, 21 may be prefabricated, thin, flat, solid, and / or smooth, and may be formed from, for example, a wear-resistant material. It will be recognized that a smoother surface of the bonding layer (e.g., overlapping surfaces 18, 48) may result in better wear resistance. Bonding layers 11, 21 to the coated base plate 10 and / or coated cover 40 may help control appearance issues and / or reduce yield losses. Depending on the properties of the layers 11 and 21 (bonded to the base plate 10 and / or cover 40), it may be possible to ensure ease of handling of the layers, ease of manufacturing of the layers, maintenance of uniform thickness of the layers, improved wear resistance, reduction of potential particles, maintenance of an appropriate coefficient of friction, assurance of appropriate surface flatness, and / or improved sealing performance.

[0058] Figure 5 is a prospective view of a reticle pod 200 according to one embodiment. The reticle pod 200 includes an inner pod 210 and an outer pod 220. For example, the reticle pod 200 could be, but is not limited to, a reticle pod for EUV processing of photolithography masks. In one embodiment, the inner pod 210 has a length of approximately 8 inches and a width of approximately 8 inches.

[0059] The inner pod 210 includes a cover 212 and a base plate 214. The cover 212 and the base plate 214 are configured to be joined together. When joined together, the cover 212 and the base plate 214 define an internal space that is sized and molded to accommodate a reticle 230. For example, the reticle 230 may be a photolithography mask used for EUV processing, etc. In some embodiments, at least one of the cover 212 and the base plate 214 includes one or more bonding layers 216, as similarly discussed above for the base plate 10 and cover 40 in Figures 1A to 4. In some embodiments, the cover 212 and the base plate 214 each include at least one of the bonding layers 216 (not clearly visible for cover 212 in Figure 5). The cover 212 may be, for example, the cover 40 described above and shown in Figures 1A, 1B, and 3. The base plate 214 can be, for example, the base plate 10 described above and shown in Figures 1A, 1B, and 2.

[0060] The outer pod 220 includes an outer pod dome 222 and an outer pod door 224. The outer pod 220 is configured to house the inner pod 210 within an internal space defined by the outer pod dome 222 and the outer pod door 224. The outer pod dome 222 can be fixed to the outer pod door 224, for example, to enclose the internal space and house the inner pod 210 during transport and handling of the reticle pod 200. The outer pod dome 222 and the outer pod door 224 can each contain one or more polymer materials or any other suitable material, or the entire structure can be made of these materials.

[0061] Figure 6 is a flowchart of a method 600 for fabricating a reticle pod according to one embodiment. For example, method 600 can form the reticle pod 200 described above and shown in Figure 5, or one or both of the base plate 10 and cover 40 for the reticle pod described above and shown in Figures 1A to 4. In one embodiment, the reticle pod is an EUV reticle pod.

[0062] The operation or processing flowchart 600 may include one or more operations, actions, or functions represented by one or more blocks 610, 620, 630, 640, and 650. Although shown as separate blocks, various blocks may be split into additional blocks, combined into fewer blocks, or deleted depending on the desired implementation. Method 600 can be initiated at either block 610 or block 620. It will be recognized that block 610 may be performed before block 620, or vice versa.

[0063] In 610, bonding layers (e.g., layer 11 and / or layer 21) are prepared, provided, and / or manufactured. In 620, a reticle pod is provided, comprising a base plate (e.g., base plate 10, base plate 214), a cover (e.g., cover 40, cover 212), and / or mating surfaces (e.g., mating surfaces 14 and 44). In one embodiment, 620 may include forming one or both of the base plate and the cover. In 620, one or more mating surfaces (e.g., mating surface 14, mating surface 44, mating surface 216) are formed on at least one of the base plate body (e.g., base plate body 16) of the base plate and the cover body (e.g., cover body 46) of the cover. One or more mating surfaces are configured, for example, to provide a seal between the base plate and the cover. In 620, the reticle pod is coated, for example, with a chrome coating, a nickel coating, a plasma coating, or any other suitable coating. Method 600 then proceeds to 630.

[0064] In 630, the bonding layers 11 and 21 are bondable to the reticle pod. In one embodiment, only layer 11 is bonded to the coated mating surface 14 of the base plate 10. In one embodiment, only layer 21 is bonded to the coated mating surface 44 of the cover 40. In one embodiment, layer 11 is bonded to the coated mating surface 14 of the base plate 10, and layer 21 is bonded to the coated mating surface 44 of the cover 40. Method 600 then proceeds to either 640 or 650.

[0065] In 640, a binder may be applied between the bonding layers 11, 21 and the coated mating surfaces 14, 44 in order to bond the bonding layers 11, 21 to the coated mating surfaces 14, 44. The binder can be an adhesive, epoxy resin, or any other suitable material that can bond the bonding layers 11, 21 to the coated mating surfaces 14, 44.

[0066] In 650, the bonding layers 11, 21 can be bonded to the coated mating surfaces 14, 44 by a thermal bonding, pressure bonding, magnetic bonding, mechanical bonding, and / or any other suitable bonding process that does not require a binder between the layers 11, 21 and the coated mating surfaces 14, 44.

[0067] It should be recognized that the method 600 in various embodiments can be modified to achieve features similar to those discussed above with respect to the base plate 10 and cover 40 in Figures 1A to 4. For example, in one embodiment, the method 600 can form one or more mating surfaces that extend along the entire perimeter of the base plate.

[0068] The embodiments disclosed herein can improve the wear resistance of the reticle pod, thereby improving the life and / or yield of the reticle pod. The described features can reduce defects (e.g., raised areas that may wear out faster than usual over time) and / or irregularities and / or inconsistencies.

[0069] Pattern: Any of embodiments 1 to 17 can be combined with any of embodiments 18 to 22.

[0070] Embodiment 1. Apparatus comprising a reticle pod, the reticle pod comprising: a base plate having a first surface, the first surface including a first mating surface; a cover having a second surface, the second surface including a second mating surface; and a bonding layer bonded to the first mating surface or the second mating surface, wherein the first surface and the second surface overlap at the first mating surface and the second mating surface when the cover is attached to the base plate.

[0071] Embodiment 2. The apparatus of Embodiment 1, wherein the reticle pod is an extreme ultraviolet (EUV) reticle pod, and the base plate and cover are configured to house the reticle when the cover is attached to the base plate.

[0072] Embodiment 3. The apparatus of Embodiment 1 or Embodiment 2, further comprising an outer pod dome and an outer pod door, wherein the outer pod dome and outer pod door are configured to house a base plate and cover within the outer pod dome when the outer pod door is attached to the outer pod dome.

[0073] Embodiment 4. An apparatus according to any one of Embodiments 1 to 3, wherein the material of the bonding layer is glass, graphite, silicon carbide, or ceramic.

[0074] Embodiment 5. An apparatus according to any one of Embodiments 1 to 4, further comprising a binder configured to bond a bonding layer to a first mating surface or a second mating surface.

[0075] Embodiment 6. The apparatus of Embodiment 5, wherein the binder is an adhesive.

[0076] Embodiment 7. The apparatus of Embodiment 5, wherein the binder is epoxy resin.

[0077] Embodiment 8. An apparatus according to any one of Embodiments 1 to 7, wherein the bonding layer is bonded to a first mating surface or a second mating surface by magnetic coupling and thermal coupling.

[0078] Embodiment 9. An apparatus according to any one of Embodiments 1 to 8, wherein the base plate and cover include a substrate.

[0079] Embodiment 10. The apparatus of Embodiment 9, wherein the substrate is coated with a coating material.

[0080] Embodiment 11. The apparatus of Embodiment 10, wherein the bonding layer is bonded to the coating material.

[0081] Embodiment 12. The apparatus according to any one of Embodiments 1 to 11, wherein the bonding layer has a predetermined minimum thickness of approximately 50 microns.

[0082] Embodiment 13. The apparatus according to any one of Embodiments 1 to 12, wherein the bonding layer has a predetermined maximum thickness of approximately 1 millimeter.

[0083] Embodiment 14. The apparatus according to any one of Embodiments 1 to 13, wherein the bonding layer has a predetermined roughness with an average roughness of less than approximately 0.2 microns.

[0084] Embodiment 15. The apparatus according to any one of Embodiments 1 to 14, wherein the bonding layer has a predetermined thickness uniformity of less than approximately + / - 5 microns.

[0085] Embodiment 16. Any one of Embodiments 1 to 15, wherein the bonding layer is a first bonding layer, further comprising a second bonding layer bonded to a first mating surface and bonded to a second mating surface, and the first bonding layer does not overlap with the second bonding layer when the cover is attached to the base plate.

[0086] Embodiment 17. The apparatus of Embodiment 16, wherein the first bonding layer is bonded to half of the first mating surface, and the second bonding layer is bonded to half of the second mating surface.

[0087] Embodiment 18. A method for manufacturing a reticle pod, the reticle pod comprising a base plate and a cover, the base plate having a first surface, the first surface comprising a first mating surface, the cover having a second surface, the second surface comprising a second mating surface, the method comprising bonding at least one layer to one or more of the first mating surface and the second mating surface.

[0088] Embodiment 19. The method of Embodiment 18, further comprising coating the substrates of the base plate and cover with a coating material, wherein the coating is performed before bonding.

[0089] Embodiment 20. The method of Embodiment 18 or Embodiment 19, wherein bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces comprises applying a binder for bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces.

[0090] Embodiment 21. Bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces is any one of the methods of Embodiments 18 to 20, comprising magnetically or thermally bonding at least one layer to one or more of the first mating surfaces and the second mating surfaces.

[0091] Embodiment 22. Any one of embodiments 18 to 21, wherein the material of at least one layer is glass, graphite, silicon carbide, or ceramic.

[0092] The examples disclosed in this application are intended to be illustrative and not limiting in any way. The scope of the invention is defined by the appended claims rather than the foregoing description, and all modifications arising within the meaning and scope of equivalence of the claims are intended to be encompassed within those scopes.

[0093] The technical terms used herein are intended to describe specific embodiments and are not intended to be limiting. The terms “a,” “an,” and “the” also include their plural forms unless otherwise explicitly indicated. The terms “comprises” and / or “comprising,” when used herein, specify the presence of the described features, integers, processes, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, processes, operations, elements, and / or components.

[0094] It should be understood that detailed modifications may be made to the above description without departing from the scope of this disclosure, particularly with respect to the constituent materials used, as well as the shape, size, and arrangement of the components. The embodiments described herein and described herein are illustrative only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A device comprising a reticle pod, wherein the reticle pod is A base plate having a first surface, wherein the first surface includes a first mating surface, A cover having a second surface, wherein the second surface includes a second mating surface, It comprises a bonding layer bonded to the first mating surface and / or the second mating surface, The first mating surface is formed on the base plate body of the base plate, The second mating surface is formed on the cover body of the cover, An apparatus in which, when the cover is attached to the base plate, the bonding layer bonded to the first mating surface and the bonding layer bonded to the second mating surface are in direct contact, or the bonding layer bonded to the first mating surface and the bonding layer bonded to the second mating surface do not overlap.

2. The apparatus according to claim 1, further comprising an outer pod dome and an outer pod door, wherein the outer pod dome and the outer pod door are configured to house the base plate and the cover within the outer pod dome when the outer pod door is attached to the outer pod dome.

3. The apparatus according to claim 1, further comprising a binder configured to bond the bonding layer to the first mating surface and / or the second mating surface.

4. The apparatus according to claim 1, wherein the bonding layer has a thickness of 50 microns to 1 millimeter.

5. The apparatus according to claim 1, wherein the bonding layer has a predetermined roughness with an average roughness of less than 0.2 microns.

6. The apparatus according to claim 1, wherein the bonding layer has a predetermined thickness uniformity of less than + / - 5 microns.

7. The apparatus according to claim 1, wherein the bonding layer bonded to the first mating surface is bonded to half of the first mating surface, and the bonding layer bonded to the second mating surface is bonded to half of the second mating surface.

8. A method for manufacturing a reticle pod, wherein the reticle pod includes a base plate and a cover, the base plate having a first surface, the first surface including a first mating surface, the cover having a second surface, the second surface including a second mating surface, and the first mating surface and / or the second mating surface including a bonding layer bonded to the first mating surface and / or the second mating surface. The first mating surface is formed on the base plate body of the base plate, The second mating surface is formed on the cover body of the cover, A method wherein, when the cover is attached to the base plate, the bonding layer bonded to the first mating surface and the bonding layer bonded to the second mating surface are in direct contact, or the bonding layer bonded to the first mating surface and the bonding layer bonded to the second mating surface do not overlap.

9. The method further includes coating the substrate of the base plate and the cover with a coating material. The method according to claim 8, wherein the coating is performed before bonding.

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