Temperature control device and heating device

Abstract

To provide a technique capable of controlling a temperature distribution of a workpiece surface.SOLUTION: A temperature control device that is used so as to be arranged between a heat source and a workpiece, and can control a temperature transmitted to a workpiece, comprises a heat flow control part. The heat flow control part contains a sheet-like high heat conduction member with an excellent heat conduction rate to a surface direction. The heat flow control part includes: a first region; and a second region. The first region is a region occupying a predetermined range in a front surface of the heat flow control part. The second region is a region provided so as to surround the circumference of the first region. The first and second regions are constructed so that the heat conduction rate in a thickness direction vertical to at least surface direction is different.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a temperature control device and a heating device.

Background Art

[0002] It is known that various heaters are used to heat a workpiece such as a semiconductor wafer. Patent Document 1 discloses a film heater having a configuration in which heat diffusion material layers made of metal, graphite, or the like are laminated on both surfaces of a sheet-shaped heating element.

[0003] In recent years, with the miniaturization of circuit wiring in semiconductors, uniformization of the temperature distribution on the workpiece surface has been demanded. Here, as a method for uniformizing the temperature distribution on the workpiece surface, for example, there is a method of adjusting the surface temperature by increasing or decreasing the heat input amount by partially operating the heating amount of the heater. Further, for example, there is a method of physically uniformizing by using a high thermal conductivity material for the heater and the workpiece. Further, for example, there is a method of uniformizing by inserting a separate member having high heat conduction such as a heat pipe inside the workpiece.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the above-described methods, due to the delay in feedback control with respect to the temperature change on the workpiece surface, it has been difficult to stabilize the temperature with a small change width, or to finely adjust the structure such as the arrangement of the heating element suitable for the workpiece and the arrangement of the heat pipe inside the workpiece for performing temperature control so that the workpiece has a temperature distribution that satisfies the target value.

[0006] As mentioned above, conventional methods may not be able to achieve a sufficiently uniform temperature distribution, so there is a need for new methods to equalize the temperature distribution on the workpiece surface. One aspect of this disclosure is to provide a technology that can control the temperature distribution of a workpiece surface. [Means for solving the problem]

[0007] One aspect of the present disclosure is a temperature control device used between a heat source and a workpiece, capable of controlling the temperature transmitted to the workpiece, and comprising a heat flow control unit. The heat flow control unit includes a sheet-shaped high thermal conductivity material with excellent thermal conductivity in the planar direction. The heat flow control unit has a first region and a second region. The first region is a region occupying a predetermined range on the surface of the heat flow control unit. The second region is a region provided so as to surround the first region. The first region and the second region are configured to have different thermal conductivity in at least the thickness direction perpendicular to the planar direction.

[0008] In this configuration, the thermal conductivity in the thickness direction differs between the first and second regions of the heat flow control unit. This allows for control of the heat flow rate passing through the first and second regions. As a result, the temperature transmitted to the workpiece surface changes in each region, making it possible to control the temperature distribution of the workpiece surface. Therefore, a uniform temperature distribution in the surface direction is easily obtained.

[0009] In one aspect of this disclosure, the heat flow control unit may have a plurality of through holes in the first region that penetrate the heat flow control unit in the thickness direction. In such a configuration, the first region is provided with a plurality of through holes that penetrate the heat flow control unit in the thickness direction. That is, the first region of the heat flow control unit is provided with a portion in the thickness direction where no high thermal conductivity material exists. As a result, the thermal conductivity in the thickness direction of the first region is lower than the thermal conductivity in the thickness direction of the second region. Here, for example, the first region is the inner region in the surface direction of the heat flow control unit, and the second region is the outer region surrounding the second region. In such a configuration, for example, even if the temperature in the central part of the workpiece surface is high and the temperature on the end face side of the workpiece surface is low because heat easily escapes from the end face of the workpiece, a uniform temperature distribution in the surface direction can be easily obtained by controlling the heat flow rate to decrease in the first region, which is the inner region, and increasing the heat flow rate to increase in the second region, which is the outer region.

[0010] In one aspect of this disclosure, the heat flow control unit may have a plurality of through holes in the second region that penetrate the heat flow control unit in the thickness direction. In such a configuration, the second region is provided with a plurality of through holes that penetrate the heat flow control unit in the thickness direction. That is, the second region of the heat flow control unit is provided with a portion in the thickness direction where no high thermal conductivity material exists. As a result, the thermal conductivity in the thickness direction of the second region is lower than the thermal conductivity in the thickness direction of the first region. Here, for example, the first region is the inner region in the surface direction of the heat flow control unit, and the second region is the outer region surrounding the second region. In such a configuration, for example, even if the temperature on the end face side of the workpiece surface tends to be higher than the temperature in the central part of the workpiece surface because heat does not easily escape from the end face of the workpiece surface, a uniform temperature distribution in the surface direction can be easily obtained by controlling the heat flow rate to decrease in the outer region, the second region, and increasing the heat flow rate to the inner region, the first region.

[0011] In one aspect of this disclosure, the multiple through-holes may have at least one of the shapes of a circle, a polygon, and a teardrop. With such a configuration, regardless of whether the shape is circular, polygonal, or teardrop, it is possible to sufficiently reduce the heat flow transmitted to either the inner region or the outer region where the multiple through-holes are provided compared to the other region.

[0012] In one aspect of this disclosure, the heat flow control unit may include a material with a lower thermal conductivity in the first region than in the second region. In such a configuration, since the first region includes a material with a lower thermal conductivity than the second region, the thermal conductivity of the first region becomes lower than that of the second region. Here, for example, the first region is the inner region in the planar direction of the heat flow control unit, and the second region is the outer region surrounding the second region. In such a configuration, for example, even if the temperature in the central part of the workpiece surface is high and the temperature at the end face of the workpiece surface is low because heat easily escapes from the end face of the workpiece, a uniform temperature distribution in the planar direction can be easily obtained by controlling the heat flow rate to decrease in the inner region, the first region, and increasing the heat flow rate to increase in the outer region, the second region.

[0013] In one aspect of this disclosure, the heat flow control unit may include a material with lower thermal conductivity in the second region than in the first region. In such a configuration, since the second region includes a material with lower thermal conductivity than the first region, the thermal conductivity of the second region is lower than that of the first region. Here, for example, the first region is the inner region in the planar direction of the heat flow control unit, and the second region is the outer region surrounding the second region. In such a configuration, for example, even if the temperature of the end face of the workpiece surface tends to be higher than the temperature of the central part of the workpiece surface because heat does not easily escape from the end face of the workpiece surface, a uniform temperature distribution in the planar direction can be easily obtained by controlling the heat flow rate to decrease in the outer region, the second region, and increasing the heat flow rate to increase in the inner region, the first region.

[0014] One aspect of this disclosure may further include an auxiliary conduction section and a protective section. The auxiliary conduction section includes a sheet-shaped high thermal conductivity material with excellent thermal conductivity in the planar direction and is laminated to the heat flow control section. The protective section is laminated to the heat flow control section and the auxiliary conduction section and protects the heat flow control section and the auxiliary conduction section. With this configuration, heat can be diffused more easily in the planar direction compared to a configuration in which the temperature control device does not have an auxiliary conduction section. Furthermore, by laminating the protective section to the heat flow control section and the auxiliary conduction section, damage to the heat flow control section and the auxiliary conduction section can be suppressed.

[0015] One aspect of the present disclosure is a heating device comprising a heat source and the above-described temperature control device. The above-described temperature control device is arranged superimposed on the heat source. With this configuration, a heating device capable of controlling the temperature distribution of a workpiece surface can be provided using a heat source and a temperature control device capable of controlling the heat flow rate passing through an inner region and an outer region. [Brief explanation of the drawing]

[0016] [Figure 1] This is a side cross-sectional view showing a temperature control device having a heat flow control unit and an auxiliary conduction unit. [Figure 2] This diagram schematically shows the inner and outer regions of the heat flow control unit. [Figure 3] This is a plan view showing a circular heat flow control unit with multiple through holes. [Figure 4] This is a side cross-sectional view showing a heating device in which the heat source and temperature control device are integrated. [Figure 5] This diagram schematically shows an experimental configuration for verifying heat flow control in the heat flow control unit. [Figure 6] This figure shows a graph verifying the effect of heat flow control in the Z direction. [Figure 7] This figure shows a graph verifying the effect of heat flow control in the XY direction. [Figure 8] This is a plan view showing a rectangular heat flow control unit with multiple through holes. [Figure 9]It is a plan view showing a rectangular heat flow control part in which an inner area is provided in a rectangular shape. [Figure 10] It is a plan view showing a heat flow control part having a plurality of through holes with different shapes. [Figure 11] It is a side sectional view showing a temperature control device having a heat flow control part in which an inner area is composed of a low heat conduction part and an outer area is composed of a high heat conduction material. [Figure 12] It is a side sectional view showing a temperature control device having a heat flow control part in which a low heat conduction material is laminated on a central part of a high heat conduction material. [Figure 13] It is a side sectional view showing a temperature control device having a heat flow control part. [Figure 14] It is a side sectional view showing a temperature control device having a heat flow control part, an auxiliary conduction part and a contact heat resistance reduction part, and a heating device in which a heat source is integrated. [Embodiments for Carrying Out the Invention]

[0017] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to the drawings. [1. Configuration] [Temperature Control Device] The temperature control device 100 shown in FIG. 1 is disposed and used between a work 200 such as a semiconductor wafer, for example, and a heat source 300 for heating the work 200, and can control the temperature distribution on the surface of the work 200. As the heat source 300, various types of heaters such as a film heater, an ET600 high-temperature surface heater, a ceramic heater, and a silicon rubber heater are used, for example. Further, a plate or the like having a built-in sheathed heater, a cartridge heater, or the like may be used as the heat source 300. Note that FIG. 1 schematically shows the structure of the temperature control device 100, and thus there may be differences in the exact arrangement, shape, size ratio, etc. compared to an actual temperature control device. The same applies to FIGS. 4 and 11 to 14.

[0018] The temperature control device 100 comprises a heat flow control unit 11, an auxiliary conduction unit 12, an adhesive unit 13, and a protective unit 14. The temperature control device 100 is a laminate in which the heat flow control unit 11, the auxiliary conduction unit 12, the adhesive unit 13, and the protective unit 14 are stacked. However, the adhesive unit 13 and the protective unit 14 do not necessarily have to be stacked in the temperature control device.

[0019] The heat flow control unit 11 is a component made of a sheet-shaped high thermal conductivity material with excellent thermal conductivity in the planar direction. A sheet shape refers to a shape that spreads out widely and thinly. The planar direction is the direction along the spread of the flat surface of the sheet shape. As the high thermal conductivity material, for example, metals such as copper, aluminum nitride, and aluminum, and materials with high thermal conductivity such as graphite are used. The heat flow control unit 11 has a first surface 111 and a second surface 112 which is the surface opposite to the first surface 111.

[0020] An auxiliary conductive part 12 is laminated on the first surface 111 of the heat flow control unit 11. The auxiliary conductive part 12 is bonded to the heat flow control unit 11 via an adhesive part 13. The auxiliary conductive section 12 is a component made of a sheet-shaped high thermal conductivity material that has excellent thermal conductivity in the planar direction. As the high thermal conductivity material, for example, metals such as copper, aluminum nitride, and aluminum, or graphite can be used.

[0021] On the second surface 112 of the heat flow control unit 11, the adhesive portion 13 and the protective portion 14 are laminated in the order that the protective portion 14 is the outermost surface. Similarly, on the surface of the auxiliary conduction portion 12 opposite to the surface facing the heat flow control unit 11, the adhesive portion 13 and the protective portion 14 are laminated in the order that the protective portion 14 is the outermost surface.

[0022] The protective portion 14 is a sheet-shaped member that protects the second surface 112 of the heat flow control unit 11 and the surface of the auxiliary conduction unit 12 opposite to the surface facing the heat flow control unit 11. For example, the protective portion 14 can be made of a sheet made of a polyimide-based material, a mica sheet, or a silicone resin sheet. The protective portion 14 is bonded to the second surface 112 of the heat flow control unit 11 and the surface of the auxiliary conduction unit 12 opposite to the surface facing the heat flow control unit 11 via an adhesive portion 13.

[0023] As shown in Figure 2, in this embodiment, the heat flow control unit 11 is formed in a circular shape. The heat flow control unit 11 has an inner region B, which is the inner region in the planar direction, and an outer region A, which is the outer region surrounding the inner region B. In other words, the heat flow control unit 11 is configured to be divided into two regions: the outer region A and the inner region B.

[0024] In this embodiment, the inner region B is a circular region centered on the central point C of the heat flow control unit 11. The outer region A is an annular region of the heat flow control unit 11 other than the inner region B. The outer region A and the inner region B are configured to have different thermal conductivity in the thickness direction perpendicular to the plane direction. Note that the XY direction in Figure 2 is the plane direction, and the Z direction in Figure 2 is the thickness direction.

[0025] In this embodiment, as shown in Figure 3, the heat flow control unit 11 has a plurality of through holes 113 in the inner region B that penetrate the heat flow control unit 11 in the thickness direction, that is, penetrate the first surface 111 and the second surface 112. The portion where the plurality of through holes 113 are provided is a portion where no heat conductive material is present. By forming a plurality of through holes 113 and providing a portion where no high heat conductive material is present, the inner region B is given a heat flow reduction structure that reduces the heat flow rate, so that the thermal conductivity in the thickness direction of the inner region B becomes lower than the thermal conductivity in the thickness direction of the outer region A. Here, for example, the average value of the thermal conductivity in the thickness direction over the entire surface direction of the inner region B is used as the thermal conductivity in the thickness direction of the inner region B. This makes it possible to make the heat flow rate passing through the inner region B smaller than the heat flow rate from the heat source 300 passing through the outer region A.

[0026] In this embodiment, the multiple through holes 113 have a circular shape. The multiple through holes 113 are arranged in the inner region B with narrow spacing between adjacent through holes 113 so that the area where the high thermal conductivity material exists in the inner region B is small. This makes it possible to lower the thermal conductivity in the thickness direction of the inner region B compared to when the spacing between adjacent through holes 113 is wide. As a result, the thermal conductivity ratio in the thickness direction of the outer region A and the inner region B tends to be high. For example, the multiple through holes 113 are arranged such that the distance to adjacent through holes 113 is shorter than the longest width of the through hole 113. In this embodiment, the multiple through holes 113 are arranged in a staggered pattern. However, the arrangement of the multiple through holes is not limited to this, and for example, the multiple through holes may be arranged to spread radially from the center point C of the heat flow control unit 11. In this embodiment, when the adhesive portion 13 is laminated to the heat flow control unit 11, some or all of the adhesive material that constitutes the adhesive portion 13 enters into the interior of the multiple through holes 113. Even in such cases, the thermal conductivity in the thickness direction of the inner region B is lower than the thermal conductivity in the thickness direction of the outer region A. Furthermore, when the adhesive portion 13 is laminated onto the heat flow control unit 11, it is not necessary for the adhesive material to penetrate into the interior of the multiple through holes 113.

[0027] <Heating device> The heating device 400 shown in Figure 4 is an integrated device comprising a heat source 300 and a temperature control device 100. The heating device 400 is positioned between two workpieces 200 and can control the temperature transmitted to the surface of the workpieces 200 to any desired temperature distribution. The heating device 400 comprises a heat source 300 and two temperature control devices 100. The heating device 400 is a laminate in which the temperature control devices 100 are stacked on both sides of the heat source 300. In other words, the heating device 400 has a configuration in which the heat source 300 is sandwiched between the two temperature control devices 100.

[0028] In the heating device 400, the temperature control device 100 is stacked on the heat source 300 such that the heat flow control unit 11 is located outside the auxiliary conduction unit 12. That is, the temperature control device 100 is stacked on the heat source 300 such that the auxiliary conduction unit 12 is located on the heat source 300 side. In other words, the auxiliary conduction unit 12 is positioned between the heat source 300 and the heat flow control unit 11. The auxiliary conduction unit 12 is bonded to the heat source 300 via an adhesive portion 13. Specifically, the temperature control device 100 is bonded to the heat source 300 with the adhesive portion 13, which does not have a protective portion 14 on the auxiliary conduction unit 12 side of the temperature control device 100, exposed. Note that in the heating device 400, the adhesive portion 13 and protective portion 14 are not required to be stacked on the second surface 112 side of the heat flow control unit 11. Also, the heating device may be configured so that the heat flow control unit 11 and the auxiliary conduction unit 12 are not located on one side of the heat source 300. In other words, the heating device may have only the adhesive portion 13 and the protective portion 14 laminated on one side of the heat source 300.

[0029] <Verification results of heat flow control in the heat flow control unit> Figure 5 schematically shows a verification method for verifying heat flow control in the heat flow control unit 11. In this embodiment, the verification results of heat flow control are based on a simulation using CFD (hereinafter referred to as CFD simulation). CFD stands for Computational Fluid Dynamics. The CFD simulation was performed under the conditions of an ambient temperature of 21°C, a heater heat output of 1500W, a workpiece material of SUS304, and a heater temperature control point at the center of the upper surface of the workpiece 200. Specifically, the temperature control device 100 was simulated and verified by placing a heat flow verification unit 110 and an auxiliary conduction unit 12, which have an outer region A and an inner region B, on top of each other between the workpiece 200 and the heat source 300. The heat flow verification unit 110 and the auxiliary conduction unit 12 are positioned such that the heat flow verification unit 110 is on the workpiece 200 side and the auxiliary conduction unit 12 is on the heat source 300 side. Note that the heat flow verification unit 110 has a structure that corresponds to the heat flow control unit 11 in Figure 6, but does not have a structure that corresponds to the heat flow control unit 11 in Figure 7.

[0030] Figure 6 is a graph showing the effect on the uniformity of the workpiece surface temperature when the thermal conductivity in the Z direction of the inner region B is changed in the heat flow verification unit 110. For example, in the heat flow verification unit 110, the thermal conductivity of the outer region A and the inner region B in the XY direction is set to the same value of 500, and the ratio of thermal conductivity of the outer region A and the inner region B in the Z direction is changed, and the temperature difference between the maximum and minimum temperatures in the plane direction of the workpiece 200, i.e., the XY direction, is compared. Specifically, in the heat flow verification unit 110, the thermal conductivity of the outer region A and the inner region B in the XY direction is set to the same value of 500, the thermal conductivity of the inner region B in the Z direction is set to 0.5, and the thermal conductivity of the outer region A in the Z direction is set to 3.84, which is defined as verification condition T1. In verification condition T1, the thermal conductivity of the auxiliary conduction unit 12 in the XY direction is 500, and the thermal conductivity in the Z direction is 3.84. Furthermore, a condition consisting substantially of only the auxiliary conduction section 12, namely, a condition T2 in which the thermal conductivity in the XY direction of the outer region A and the inner region B in the heat flow verification section 110 is set to the same value of 500, and the thermal conductivity in the Z direction of the outer region A and the inner region B is set to the same value of 3.84, was defined as comparison condition T2. ​​Then, verification condition T1 and comparison condition T2 were compared.

[0031] As shown in Figure 6, the temperature difference under verification condition T1, where the thermal conductivity of the inner region B in the Z direction is lower than that of the outer region A in the Z direction, was smaller than the temperature difference under comparison condition T2. ​​A smaller temperature difference in the XY direction results in a more uniform temperature distribution across the 200 surface of the workpiece. Therefore, it is desirable for the heat flow control unit 11 to have a lower thermal conductivity of the inner region B in the Z direction than that of the outer region A in the Z direction. In other words, it is desirable for the heat flow control unit 11 to have a high ratio of thermal conductivity in the Z direction between the inner region B and the outer region A.

[0032] Figure 7 is a graph showing the effect on the uniformity of the workpiece surface temperature when the thermal conductivity in the XY direction of the inner region B is changed in the heat flow verification unit 110. For example, in the heat flow verification unit 110, the thermal conductivity in the Z direction of the outer region A and the inner region B is set to the same value of 3.84, and the ratio of thermal conductivity in the XY direction of the outer region A and the inner region B is changed, and the temperature difference between the maximum and minimum temperatures in the surface direction of the workpiece 200, i.e., the XY direction, is compared. Specifically, in the heat flow verification unit 110, the thermal conductivity in the Z direction of the outer region A and the inner region B is set to the same value of 3.84, the thermal conductivity of the inner region B in the XY direction is set to 340, and the thermal conductivity of the outer region A in the XY direction is set to 500, which is defined as verification condition T3. In verification condition T3, the thermal conductivity of the auxiliary conduction unit 12 in the Z direction is 3.84, and the thermal conductivity in the XY direction is 500. Furthermore, a condition consisting of only the auxiliary conduction section 12, namely, a condition in which the thermal conductivity in the Z direction of the outer region A and the inner region B in the heat flow verification section 110 is set to the same value of 3.84, and the thermal conductivity in the XY direction of the outer region A and the inner region B is set to the same value of 500, was defined as comparison condition T4. Then, verification condition T3 and comparison condition T4 were compared.

[0033] As shown in Figure 7, the temperature difference under comparison condition T4, where both the thermal conductivity in the XY directions of the outer region A and the inner region B were high, was smaller than the temperature difference under verification condition T3. In other words, lowering the thermal conductivity in the planar direction in the inner region B may have an effect that reduces the uniformity of the temperature distribution on the 200 surface of the workpiece.

[0034] From the verification results in Figures 6 and 7 above, it can be seen that in the heat flow control unit 11, changing the thermal conductivity in the thickness direction of the outer region A and the inner region B, while keeping the thermal conductivity ratio in the surface direction of the outer region A and the inner region B unchanged, is important for improving the uniformity of the temperature distribution on the surface of the workpiece 200.

[0035] [2. Effects] According to the embodiments described in detail above, the following effects can be obtained. (2a) In this embodiment, the heat flow control unit 11 is configured such that the thermal conductivity in the thickness direction of the outer region A and the inner region B are different. This makes it possible to control the heat flow rate passing through the outer region A and the inner region B. As a result, the temperature transmitted to the surface of the workpiece 200 changes in each region A and B, making it possible to control the temperature distribution on the surface of the workpiece 200.

[0036] Specifically, the inner region B is provided with multiple through-holes 113 that penetrate the heat flow control unit 11 in the thickness direction. That is, the inner region B of the heat flow control unit 11 has a portion in the thickness direction where no high thermal conductivity material is present. As a result, the thermal conductivity of the inner region B in the thickness direction is lower than that of the outer region A in the thickness direction. Therefore, the heat flow rate to the inner region B decreases, and the heat flow rate to the outer region A increases. Consequently, for example, even if the temperature of the central part of the workpiece 200 surface is high and the temperature of the end face side of the workpiece 200 surface tends to be low because heat easily escapes from the end face of the workpiece 200, the heat flow rate to the outer region A, which is the part where heat easily escapes, increases, thus reducing the temperature difference between the central part and the end face side of the workpiece 200 surface. As a result, the uniformity of the temperature distribution on the workpiece 200 surface is improved.

[0037] (2b) In this embodiment, the temperature control device 100 includes a heat flow control unit 11, an auxiliary conduction unit 12, an adhesive unit 13, and a protective unit 14. By including the auxiliary conduction unit 12 in addition to the heat flow control unit 11, the temperature control device 100 can more easily diffuse heat in the planar direction compared to a configuration in which the temperature control device does not include the auxiliary conduction unit. Furthermore, when the temperature control device 100 is placed on the heat source 300, by placing the auxiliary conduction unit 12, which is stacked on the heat flow control unit 11, on the heat source 300 side, the multiple through holes 113 in the inner region B of the heat flow control unit 11 are positioned directly above the heat source 300, thereby suppressing the rapid temperature rise that may occur directly below the multiple through holes 113. As a result, failure of the temperature control device 100 can be suppressed. In other words, the temperature control device 100 can be used even with a heat source 300 that is not insulated.

[0038] Furthermore, by stacking the protective section 14 on the heat flow control unit 11 and the auxiliary conduction unit 12, the heat flow control unit 11 and the auxiliary conduction unit 12 are not exposed in the temperature control device 100, thus suppressing damage to the heat flow control unit 11 and the auxiliary conduction unit 12. In addition, since the heat flow control unit 11 and the auxiliary conduction unit 12 are protected when the temperature control device 100 is handled alone, the heat flow control unit 11 and the auxiliary conduction unit 12, which are made of graphite and are difficult to handle due to their brittleness, can be handled more easily. In this embodiment, the inner region B corresponds to an example of the first region, and the outer region A corresponds to an example of the second region.

[0039] [3. Other Embodiments] While embodiments of this disclosure have been described above, it goes without saying that this disclosure is not limited to the embodiments described above and can take various forms.

[0040] (3a) In the above embodiment, the heat flow control unit 11 is shown as having a circular shape, but the shape of the heat flow control unit is not limited to this. For example, it may be rectangular, as shown in Figure 8, the heat flow control unit 11a. The heat flow control unit 11a has an inner region B which is a circular area, and an outer region A2 which is the area of ​​the rectangular sheet other than the inner region B, i.e., the outer area surrounding the inner region B. The inner region B of the heat flow control unit 11a is provided with a plurality of circular through holes 113.

[0041] (3b) In the above embodiment, a configuration in which the inner region B of the heat flow control unit 11 is a circular region was illustrated, but the shape of the inner region of the heat flow control unit is not limited to this. For example, as shown in Figure 9, the inner region B3 may be a rectangular region. The heat flow control unit 11b has an inner region B3 which is a rectangular region, and an outer region A3 which is the region of the rectangular sheet other than the inner region B3, i.e., the outer region surrounding the inner region B3. The inner region B3 of the heat flow control unit 11b is provided with a plurality of circular through holes 113.

[0042] (3c) In the above embodiment, a configuration in which the multiple through holes 113 are circular is illustrated, but the shape of the multiple through holes is not limited to this. For example, the multiple through holes may be polygonal, including triangles, rhombuses, and quadrilaterals, or teardrop shapes. With such a configuration, the multiple through holes can take on various shapes, making it possible to provide a more preferable shape in accordance with the control of the temperature distribution that satisfies the target value. In any case, whether circular, polygonal, or teardrop shapes are adopted, it is possible to sufficiently reduce the heat flow rate transmitted to the inner regions B and B3 compared to the outer regions A to A3. Verification results from CFD simulation show that in the region where the multiple through holes are formed, the thermal conductivity in the thickness direction can be reduced, but the thermal conductivity in the surface direction can also be reduced to some extent. Here, when the multiple through holes have a teardrop or diamond shape, the thermal conductivity in the thickness direction can be reduced, and the thermal conductivity in the surface direction can be made less likely to be lower compared to other shapes. As a result, when the multiple through holes have a teardrop or diamond shape, it is possible to improve the uniformity of the temperature distribution on the surface of the workpiece 200.

[0043] Furthermore, as shown in Figure 10, for example, the heat flow control unit 11c may have multiple through-holes 113c that combine various shapes such as polygons including triangles, rhombuses, and quadrilaterals, and teardrop shapes. The heat flow control unit 11c has an inner region B4 which is a circular area, and an outer region A4 which is the area of ​​the rectangular sheet other than the inner region B4, i.e., the outer region surrounding the inner region B4. Multiple through-holes 113c of various shapes are provided in the inner region B4 of the heat flow control unit 11c in an arrangement that minimizes the gaps between the through-holes 113c. With this configuration, by arranging through-holes 113c of various shapes to fill the gaps, it is possible to provide a large area in the inner region B4 where there is no high thermal conductivity material, and as a result, the thermal conductivity of the inner region B4 tends to be low.

[0044] (3d) In the above embodiment, a configuration was illustrated in which a heat flow reduction structure is provided in the inner region of the heat flow control unit 11 by providing a plurality of through holes 113 in the inner region B such that the thermal conductivity in the thickness direction of the outer region A and the inner region B is different. However, the configuration of providing a heat flow reduction structure in the inner region of the heat flow control unit is not limited to this.

[0045] For example, as shown in Figure 11, the temperature control device 100d may include a heat flow control unit 11d in the inner region B5 that contains a material with lower thermal conductivity than the outer region A5. In the heat flow control unit 11d, the outer region A5 is made of a sheet-shaped high thermal conductivity material with excellent thermal conductivity in the planar direction, and the inner region B5 is made of a material with lower thermal conductivity than the high thermal conductivity material. That is, the heat flow control unit 11d is formed by fitting a sheet-shaped low thermal conductivity section 15 made of a material with lower thermal conductivity than the high thermal conductivity material into the hollowed-out central part of the high thermal conductivity material. Examples of materials with lower thermal conductivity than the high thermal conductivity material include resin sheets, polyimide sheets, rubber sheets, and silicone sheets. In such a configuration, since the inner region B5 contains a material with lower thermal conductivity than the outer region A5, the thermal conductivity of the inner region B5 is lower than that of the outer region A5. Therefore, for example, even if heat easily escapes from the end face of the workpiece 200, resulting in a higher temperature in the central part of the workpiece 200's surface and a lower temperature at the end face, a uniform temperature distribution in the surface direction can be easily obtained by controlling the amount of heat transferred to the inner region B5 and increasing the amount of heat transferred to the outer region A5.

[0046] Furthermore, for example, as shown in Figure 12, the temperature control device 100e may include a heat flow control unit 11e composed of a high thermal conductivity material 111e and a low thermal conductivity material 112e laminated only in the central region of the high thermal conductivity material 111e. In this way, by placing the low thermal conductivity material 112e only in the central region, the central portion of the high thermal conductivity material 111e sinks in, and the low thermal conductivity material 112e can be surrounded by the high thermal conductivity material 111e, as shown in Figure 12. Note that the heat flow control units 11d and 11e have the same effects as the heat flow control unit 11 in the above embodiment.

[0047] (3e) In the above embodiment, the heat flow control unit 11 is shown as having a heat flow reduction structure in the inner region B, but the region of the heat flow reduction structure provided in the heat flow control unit is not limited to the inner region. For example, the heat flow control unit may have no heat flow reduction structure in the inner region, but may have a heat flow reduction structure in the outer region. Specifically, for example, the heat flow control unit may have a plurality of through holes in the outer region that penetrate the heat flow control unit in the thickness direction. Also, for example, the heat flow control unit may include a material in the outer region that has a lower thermal conductivity than the inner region. In such a configuration, the inner region and the outer region are configured to have different thermal conductivity at least in the thickness direction. In this case, the thermal conductivity in the thickness direction of the outer region is lower than the thermal conductivity in the thickness direction of the inner region. As a result, the heat flow rate to the outer region decreases, and the heat flow rate to the inner region increases. Therefore, for example, even if the temperature on the edge side of the workpiece 200 tends to be higher than the temperature on the central part of the workpiece 200 surface because heat does not easily escape from the edge, the heat flow rate transferred to the outer region where heat does not easily escape is reduced, thereby reducing the temperature difference between the central part and the edge side of the workpiece 200 surface. As a result, the uniformity of the temperature distribution on the workpiece 200 surface is improved.

[0048] (3f) In the above embodiment, the temperature control device 100 is shown as having an auxiliary conduction unit 12 stacked on a heat flow control unit 11, but the configuration of the temperature control device is not limited to this. For example, the temperature control device 100f shown in Figure 13 may have a configuration that does not include an auxiliary conduction unit 12. The temperature control device 100f comprises a heat flow control unit 11 and protective units 14 that are bonded to both sides thereof via adhesive units 13.

[0049] (3g) In the above embodiment, a heating device 400 is exemplified in which a temperature control device 100 having a protective part 14 for suppressing damage to the heat flow control unit 11 is laminated on each of the two sides of the heat source 300, but the configuration of the heating device is not limited thereto. For example, as shown in the heating device 400a in Figure 14, a temperature control device 100g having a workpiece contact part 16 may be laminated on each of the two sides of the heat source 300. The workpiece contact part 16 can reduce the contact thermal resistance between the temperature control device 100g and the workpiece 200 that would adversely affect the temperature distribution on the surface of the workpiece 200. The temperature control device 100g comprises a heat flow control unit 11, an auxiliary conduction part 12, an adhesive part 13, and a workpiece contact part 16. The workpiece contact part 16 is bonded to the second surface 112 of the heat flow control unit 11 via the adhesive part 13 so as to be located on the outermost surface of the temperature control device 100g. The workpiece contact part 16 is a member made of TIM. TIM stands for Thermal Interface Material. TIM is made of materials such as silicon resin or graphite. By positioning the workpiece contact portion 16 on the outermost surface, when it comes into contact with the workpiece 200, the workpiece contact portion 16 sinks in, absorbing the effects of machining on the surface of the workpiece 200. As a result, the contact thermal resistance with the surface of the workpiece 200 is reduced. By reducing the contact thermal resistance with the surface of the workpiece 200, it becomes easier to make the temperature distribution on the surface of the workpiece 200 more uniform.

[0050] (3h) In the above embodiment, an example was given in which the inner region B is a circular region centered on the center point C of the heat flow control unit 11, but the position in which the inner region of the heat flow control unit is arranged is not limited to this. For example, the inner region may be arranged at a position offset from the center point of the heat flow control unit. Also, in the above embodiment, an example was given in which the heat flow control unit 11 is divided into two regions, an outer region A and an inner region B, but the configuration of the heat flow control unit is not limited to this. For example, the heat flow control unit may be configured to be divided into three or more regions, such as having a plurality of first regions and a second region. The first region is a region that occupies a predetermined range on the surface of the heat flow control unit. The second region is a region that surrounds the periphery of the first region. The heat flow control unit may be arranged at any position within the range in which the plurality of first regions are surrounded by the second region. Even in such a configuration, either the first region or the second region may have a plurality of through holes. Furthermore, the first region may contain a material with lower thermal conductivity than the second region, and the second region may contain a material with lower thermal conductivity than the first region. Also, for example, the first region may be configured to have a difference in thermal conductivity within its range, such that it has a temperature gradient from the inside to the outside or from the outside to the inside. Also, for example, the heat flow control unit may be configured to include, in addition to the first and second regions, a third region and a fourth region surrounding the third region. The heat flow control unit may be configured to realize multiple different heat flow controls such that the third and fourth regions have a difference in thermal conductivity that is different from that of the first and second regions.

[0051] (3i) The functions of one component in the above embodiment may be distributed among multiple components, or the functions of multiple components may be integrated into one component. Also, some parts of the configuration of the above embodiment may be omitted. Also, at least some parts of the configuration of the above embodiment may be added to, substituted for, or otherwise replaced with the configuration of other above embodiments. Any aspect of the technical concept specified by the wording of the claims is an embodiment of the present disclosure.

[0052] [Technical concepts disclosed in this specification] [Item 1] A temperature control device used by being placed between a heat source and a workpiece, and capable of controlling the temperature transmitted to the workpiece, The heat flow control unit includes a sheet-shaped high thermal conductivity material with excellent thermal conductivity in the planar direction, The heat flow control unit has a first region occupying a predetermined range on the surface of the heat flow control unit, and a second region provided so as to surround the first region. A temperature control device wherein the first region and the second region are configured to have different thermal conductivity in at least the thickness direction perpendicular to the plane direction.

[0053] [Item 2] A temperature control device as described in item 1, The heat flow control unit has a first region with a plurality of through holes that penetrate the heat flow control unit in the thickness direction, and is a temperature control device.

[0054] [Item 3] A temperature control device as described in item 1, The heat flow control unit has a plurality of through holes in the second region that penetrate the heat flow control unit in the thickness direction, and is a temperature control device.

[0055] [Item 4] A temperature control device as described in item 2 or item 3, A temperature control device wherein the plurality of through holes have at least one of the shapes of a circle, a polygon, and a teardrop.

[0056] [Item 5] A temperature control device as described in item 1, The heat flow control unit is a temperature control device in which the first region contains a material with a lower thermal conductivity than the second region.

[0057] [Item 6] A temperature control device as described in item 1, The heat flow control unit is a temperature control device in which the second region contains a material with a lower thermal conductivity than the first region.

[0058] [Item 7] A temperature control device described in any one of items 1 to 6, The sheet-shaped high thermal conductivity material, which has excellent thermal conductivity in the aforementioned planar direction, is included, and the auxiliary conductive part is laminated in the heat flow control unit, A protective section is stacked on the heat flow control unit and the auxiliary conduction unit to protect the heat flow control unit and the auxiliary conduction unit, A temperature control device further equipped with the following features.

[0059] [Item 8] A heating device, Heat source and A temperature control device according to any one of items 1 to 7, which is placed in conjunction with the heat source, A heating device equipped with the following features. [Explanation of symbols]

[0060] 11,11a~11e...Heat flow control unit, 12...Auxiliary conduction unit, 13...Adhesion unit, 14...Protection unit, 15...Low heat conductivity unit, 16...Workpiece contact unit, 100,100d~100g...Temperature control unit, 110...Heat flow verification unit, 111...First surface, 112...Second surface, 113,113c...Through hole, 200...Workpiece, 300...Heat source, 400,400a...Heating device, A,A2~A5...Outer region, B,B3~B5...Inner region, C...Center point, T1,T3...Verification conditions, T2,T4...Comparison conditions.

Claims

1. A temperature control device used by being placed between a heat source and a workpiece, and capable of controlling the temperature transmitted to the workpiece, A heat flow control unit including a sheet-shaped high thermal conductivity material with excellent thermal conductivity in the planar direction, The sheet-shaped high thermal conductivity material, which has excellent thermal conductivity in the aforementioned planar direction, is included, and the auxiliary conductive part is laminated in the heat flow control unit, Equipped with, The heat flow control unit has a first region occupying a predetermined range on the surface of the heat flow control unit, a second region provided so as to surround the periphery of the first region, and a plurality of through holes in either the first region or the second region that penetrate the heat flow control unit in a thickness direction perpendicular to the surface direction. The first region and the second region are configured such that they have different thermal conductivity in at least the thickness direction. The auxiliary conduction unit is a temperature control device, wherein the auxiliary conduction unit is laminated on the side of the heat flow control unit that faces the heat source when the temperature control device is positioned between the heat source and the workpiece.

2. A temperature control device according to claim 1, The heat flow control unit is a temperature control device having the plurality of through holes in the first region.

3. A temperature control device according to claim 1, The heat flow control unit is a temperature control device having the plurality of through holes in the second region.

4. A temperature control device according to claim 1, A temperature control device wherein the plurality of through holes have at least one of the shapes of a circle, a polygon, and a teardrop.

5. A temperature control device according to claim 1, The heat flow control unit is a temperature control device in which the first region contains a material with a lower thermal conductivity than the second region.

6. A temperature control device according to claim 1, The heat flow control unit is a temperature control device in which the second region contains a material with a lower thermal conductivity than the first region.

7. A temperature control device according to any one of claims 1 to 6, A temperature control device further comprising a protective unit stacked on the heat flow control unit and the auxiliary conduction unit to protect the heat flow control unit and the auxiliary conduction unit.

8. A heating device, Heat source and A temperature control device according to any one of claims 1 to 6, which is arranged in superimposed on the heat source, A heating device equipped with the following features.

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