Shower plate, substrate processing apparatus, and substrate processing method
The shower plate with emissivity-modified regions addresses the challenge of non-uniform substrate temperature by enhancing heat management, achieving cost-effective and uniform temperature distribution.
JP7868954B2Active Publication Date: 2026-06-02ASM IP HLDG BV
Patent Information
- Authority / Receiving Office
- JP Β· JP
- Patent Type
- Patents
- Current Assignee / Owner
- ASM IP HLDG BV
- Filing Date
- 2021-05-31
- Publication Date
- 2026-06-02
AI Technical Summary
Technical Problem
Existing substrate processing technologies face challenges in achieving uniform in-plane temperature distribution due to complex temperature control structures that are costly and prone to issues.
Method used
A shower plate with a main body having through holes and surface treatments on its lower surface, creating regions with varying emissivities, is used to control substrate temperature distribution by altering heat absorption and dissipation.
Benefits of technology
The solution provides improved in-plane temperature uniformity and control, reducing complexity and costs by using surface treatments to manage heat distribution effectively.
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Abstract
To provide a shower plate.SOLUTION: A shower plate in an embodiment includes a body part of a tabular conductor having a plurality of through holes. The body part is provided with a surface treatment part on at least a part of an undersurface, and a surface treatment is performed to the surface treatment part, and thereby two or more regions having each different emissivity exist on the undersurface, and the body part is encircled by a flange.SELECTED DRAWING: Figure 2
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