Photothermal conversion layer ink composition and laminate

The photothermal conversion layer ink composition addresses the need for heat and chemical resistance in semiconductor manufacturing by forming a layer that withstands high temperatures and chemicals, facilitating stress-free substrate separation using radiant energy.

JP7868973B2Active Publication Date: 2026-06-023M INNOVATIVE PROPERTIES CO
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
3M INNOVATIVE PROPERTIES CO
Filing Date
2021-12-28
Publication Date
2026-06-02

AI Technical Summary

Technical Problem

Existing adhesive materials used in semiconductor manufacturing lack sufficient heat and chemical resistance during high-temperature and chemical exposure processes, leading to substrate thickness unevenness, warping, and damage during back grinding and subsequent processes.

Method used

A photothermal conversion layer ink composition comprising a thermally decomposable light absorber and a binder, such as organic silicate partial condensate and alkali metal silicate, which forms a layer that can withstand high temperatures and chemicals, allowing for stress-free separation of substrates using radiant energy.

Benefits of technology

The photothermal conversion layer provides high heat and chemical resistance, enabling stress-free separation of substrates and supports during semiconductor manufacturing processes, including high-temperature treatments and chemical exposures.

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Abstract

To provide an ink composition capable of forming a photothermal conversion layer having high heat resistance and chemical resistance.SOLUTION: A photothermal conversion layer ink composition according to one embodiment includes a light absorber having thermal decomposability, and a binder or a precursor thereof, where the binder or precursor thereof contains at least one of an organic silicate partial condensate and an alkali metal silicate.SELECTED DRAWING: Figure 1
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