Dynamic burn test system and dynamic burn test method

Abstract

To provide a dynamic burn-in test system and a dynamic burn-in test method capable of running an optimal burn-in test in accordance with the specification or the state of a specific test object.SOLUTION: A dynamic adjustment module is electrically connected to at least one signal generation module and at least one burn-in board, receives dynamic test parameters from the at least one signal generation module, and, together with the signal generation module, modulates the at least one burn-in board to perform a dynamic burn-in test on at least one defective test specimen in accordance with the dynamic test parameters.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a semiconductor test system and a test method, and particularly to a dynamic burn-in test system and a dynamic burn-in test method.

Background Art

[0002] Burn-in testing is mainly used to screen the risk of potential failures or malfunctions of semiconductor products due to factors such as manufacturing process deficiencies and design flaws.

[0003] Through harsh environmental factors (variables such as high temperature or temperature difference, large current, high voltage, etc.) in burn-in testing, defects and failures of chips due to changes in the external environment are detected, preventing problems such as failures during product use by end-users.

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the architecture of general burn-in testing, in order to improve the efficiency of testing, usually, multiple DUTs (devices under test, specimens) are simultaneously tested on one burn-in board, but all the parameters pre-written for different devices under test on the same burn-in board are the same.

[0005] That is, in the current burn-in testing architecture, an optimal burn-in test cannot be performed according to the specifications or states of specific devices under test, and there is still room for improvement in this regard.

Means for Solving the Problems

[0006] In view of such problems, the present invention has the following configuration. A dynamic burn-in test system comprising at least one burn-in board, at least one signal generation module, and a dynamic adjustment module, The at least one burn plate is suitable for being electrically connected to multiple specimens. The at least one signal generation module is electrically connected to the at least one burn plate and is used to control and test the plurality of samples, and is also suitable for determining at least one of the plurality of samples that fails in response to the test results of the plurality of samples, and for transmitting simulation test data to the at least one failing sample. The at least one signal generation module controls the at least one failing sample to execute the simulation test data, generates a simulation test result, and also generates dynamic test parameters in response to the simulation test result. The dynamic adjustment module is electrically connected to the at least one signal generation module and the at least one burn plate, receives the dynamic test parameters from the at least one signal generation module, and modulates the at least one burn plate in conjunction with the signal generation module to perform a dynamic burn test on the at least one unsuccessful sample for which the dynamic test parameters are

[0007] Furthermore, the at least one burn plate comprises a substrate, a plurality of test sockets, a temperature control module, and a power control module. The plurality of test sockets are electrically connected to the substrate, The temperature control module is electrically connected to the circuit board, and the temperature control module, under the control of the dynamic adjustment module, adjusts the temperature of each test socket. The power control module is electrically connected to the circuit board, and under the control of the dynamic adjustment module, the power control module adjusts and outputs the voltage value of each test socket.

[0008] Furthermore, the power control module provides the power of the reduced voltage value and the increased current value to each of the test sockets.

[0009] Furthermore, the dynamic adjustment module includes a power supply module, a temperature distribution module, and a power distribution module that are electrically connected to each other. The power supply module is used to supply power to at least one burn plate, and the temperature distribution module is used to transmit a test temperature control signal to the temperature control module in order to test the temperature of each of the test sockets based on the dynamic test parameters. The power distribution module transmits a test power control signal to the power control module based on the dynamic test parameters, adjusting and outputting the voltage value of each test socket.

[0010] Furthermore, the at least one signal generation module includes a storage module and a processor that are electrically connected to each other. The storage module stores a lookup table which includes multiple test results and multiple group test parameters. The at least one signal generation module finds one of the corresponding test results from the lookup table based on the simulation test results and outputs one of the corresponding group test parameters to be used as the dynamic test parameter.

[0011] Furthermore, the processor may be a system-on-a-chip, a field-programmable gate array chip, or a high-performance computing chip.

[0012] Furthermore, the sample includes a plurality of processing cores, and each processing core includes at least one temperature observation circuit. When the simulation test data is executed on the at least one of the failed samples, the at least one signal generation module reads the observed value from the at least one temperature observation circuit and uses it as the simulation test result.

[0013] Furthermore, the quantity of the temperature control modules corresponds to the quantity of the multiple test sockets, and the quantity of the power control modules corresponds to the quantity of the multiple test sockets. Each of the test sockets is electrically connected to the temperature control module and the power control module, respectively.

[0014] Furthermore, the system further includes a concentrator and a computing host, wherein the at least one burner plate is a plurality of burner plates, and the at least one signal generation module is a plurality of signal generation modules. Each of the plurality of burners is electrically connected to the signal generation module, and the signal generation module is electrically connected to the computing host via the concentrator.

[0015] Furthermore, a dynamic burn test method suitable for testing multiple samples on a burn plate, A signal generation module is used to control and test the multiple samples, and in response to the test results of the multiple samples, at least one of the multiple samples is determined to be unsatisfactory. The signal generation module transmits the simulation test data to at least one sample and, at the same time, controls at least one failing sample to execute the simulation test data, thereby generating a simulation test result. The signal generation module generates dynamic test parameters in response to the simulation test results and transmits them to the dynamic adjustment module. The dynamic adjustment module modulates the burn plate in conjunction with the signal generation module, and the dynamic test parameters are used to perform a burn test on at least one unsuccessful sample.

[0016] Furthermore, the signal generation module controls the multiple samples to perform functional tests. Furthermore, the simulation test results are one of the following: voltage change value, current change value, and temperature change value.

[0017] The dynamic test parameters further include inputting at least one of a predetermined voltage value and a predetermined current value of the at least one non-conforming specimen, and the temperature of the at least one non-conforming specimen is controlled to a predetermined temperature value.

[0018] The signal generation module generates the dynamic test parameters from a look-up table based on the simulation test results.

Advantages of the Invention

[0019] A dynamic burn test system and a dynamic burn test method capable of performing an optimal burn test according to the specifications or states of specific test objects can be provided.

Brief Description of the Drawings

[0020] [Figure 1] It is a system block diagram according to an embodiment of the dynamic burn test system of the present invention. [Figure 2] It is a flowchart of an embodiment of the dynamic burn test method of the present invention. [Figure 3] It is a system block diagram according to another embodiment of the dynamic burn test system of the present invention. [Figure 4] It is a block diagram of an embodiment of the signal generation module of the dynamic burn test system of the present invention. [Figure 5] It is a block diagram of another embodiment of the signal generation module of the dynamic burn test system of the present invention. [Figure 6] It is a schematic logic diagram for executing the burn test method of the dynamic burn test system of the present invention. [Figure 7] It is a flowchart for switching the model of the burn test in the dynamic burn test method of the present invention. [Figure 8] It is a block diagram showing an embodiment of a burn plate in the dynamic burn test system of the present invention. [Figure 9]This is a flowchart of the modulation test power parameters in the dynamic burn test method of the present invention. [Figure 10] This is a flowchart of the modulation test power parameters in the dynamic burn test method of the present invention. [Figure 11] This is a block diagram showing another embodiment of the burn plate in the dynamic burn test system of the present invention. [Figure 12] This is a block diagram showing an embodiment of the test object in the dynamic burn test system of the present invention. [Figure 13] This is a schematic block diagram of another embodiment of the dynamic burn test system of the present invention. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described with reference to Figure 1. Here, Figure 1 is a system block diagram according to an embodiment of the dynamic burn test system of the present invention, and includes a burn-in board (burn-in board, referring to the substrate before firing; the same applies hereinafter) 10, a signal generation module 20, and a dynamic adjustment module 30. The signal generation module 20 and the dynamic adjustment module 30 work together based on the simulation test results of the specimen (Device Under Test, so-called DUT, but hereinafter simply referred to as "specimen") D, which is the object to be measured, to perform dynamic burning, i.e., pre-writing, on at least one unsuccessful specimen on the burn-in board 10.

[0022] The explanation will be given with reference to Figures 1 and 2. Here, Figure 2 is a flowchart of an embodiment of the dynamic burn test method of the present invention. The burn plate 10 is suitable for being electrically connected to a plurality of samples D. The signal generation module 20 is electrically connected to the burn plate 10 and is suitable for controlling the samples D for testing, determining at least one unsuccessful sample D in response to the test results of the samples D, and transmitting simulation test data to the unsuccessful samples D, as well as controlling the unsuccessful samples D to execute a simulation test and generate simulation test results, and generating dynamic test parameters in response to the simulation test.

[0023] The dynamic adjustment module 30 is electrically connected to the signal generation module 20 and the burn plate 10, and is suitable for the signal generation module 20 to receive dynamic test parameters. The dynamic adjustment module 30, in conjunction with the signal generation module 20, modulates the burn plate 10 to perform a dynamic burn-in test (hereinafter also simply referred to as "dynamic burn test") on the unsuccessful sample D using the dynamic test parameters.

[0024] The present invention will be described with reference to Figures 1 and 2. Based on the dynamic burn test system described above, the present invention provides another dynamic burn test method as follows.

[0025] Step S01: Using the signal generation module 20, control and test sample D, and in response to the test results of sample D, determine that at least one sample D is unsuccessful. In this embodiment, the signal generation module 20 controls sample D to perform a functional test and classifies sample D based on the results of the functional test.

[0026] Step S02: The signal generation module 20 sends the simulation test data to the failing sample D and controls the failing sample D to execute the simulation test data and generate the simulation test results.

[0027] Step S03: The signal generation module 20 generates dynamic test parameters in response to the simulation test results and sends them to the dynamic adjustment module 30.

[0028] Step S04: The dynamic adjustment module 30 works in conjunction with the signal generation module 20 to modulate the failed sample D to conform to the dynamic test parameters for the dynamic burn test.

[0029] Sample D is a semiconductor component. In this embodiment, sample D of the dynamic burn test system and dynamic burn test method of the present invention is a high-performance computing (HPC) chip.

[0030] Sample D is an HPC chip, and is not limited to the following, but may include, for example, a CPU (Central Processing Unit) chip, a hardware accelerator chip (for example, a GPU (Graphics Processing Unit) chip, or a GPGPU (General-purpose) chip. computing on graphics processing units), FPGA (Field Programmable Gate Array (DSP) chip, DSP (Digital Signal Processor) This may include a Processing chip, a TPU (Tensor Processing Unit) chip, an AI (Artificial Intelligence) chip, other suitable hardware accelerator chips or combinations thereof, a memory chip (e.g., high bandwidth memory, HBM) chip, a graphics double-data rate (GDDR) memory chip, other suitable memory chips or combinations thereof, an I / O chip, a communication chip, and a power management chip.

[0031] The explanation will be given with reference to Figures 1 and 3. Here, Figure 3 is a system block diagram according to another embodiment of the dynamic burn test system of the present invention. In this embodiment, the burn plate 10 includes a substrate 11 and a plurality of test sockets 12, the test sockets 12 are electrically connected to the substrate 11 and electrically connected to the sample D to perform a dynamic burn test.

[0032] The explanation will be given with reference to Figure 3. In this embodiment, the signal generation module 20 includes a processor 21 and a storage module 22 that are electrically connected to each other. The processor 21 performs various processes required by the signal generation module 20.

[0033] In this embodiment, the processor 21 is a System on a Chip (SOC), a Field Programmable Gate Array (FPGA) chip, or a High Performance Computing (High Performance) chip. Computing (HPC) chips are acceptable, but are not limited to them. Next, we will explain with reference to Figure 4. Here, Figure 4 is a block diagram of an embodiment of the signal generation module of the dynamic burn test system of the present invention. In some embodiments in which the processor 21 of the signal generation module 20 is a system-on-a-chip (SOC), referring to Figure 4, the system single chip functions as the processor 21 and is integrated with the storage module 22 to form a single-chip type signal generation module 20. Next, the following will be explained with reference to Figure 5. Figure 5 is a block diagram of another embodiment of the signal generation module of the dynamic burn test system of the present invention. In some embodiments in which the processor 21 of the signal generation module 20 is a field-programmable gate array chip (FPGA), with reference to Figure 5, the field-programmable gate array chip includes a first field-programmable gate array chip (FPGA1) and a second field-programmable gate array chip (FPGA2), the first field-programmable gate array chip (FPGA1) functions as the processor 21, and the second field-programmable gate array chip (FPGA2) and a storage module 22 constitute a test data processing module, the test data processing module is electrically connected to the processor 21 and forms the signal generation module 20.

[0034] The storage module 22 stores test data, which is data that sample D can process. In other words, if the data that sample D can process is different, the test data will also be different.

[0035] In this embodiment, the test data may be, but is not limited to, image files, text files, audio files, video files, applications, or various files or data that can be executed by Sample D.

[0036] In this embodiment, the test data includes simulation test data and a burn test model. The simulation test data is data for performing a simulation test on sample D. The burn test model is test data executed during a dynamic burn test. That is, the simulation test data is determined based on the test results of sample D in step S01, and the burn test model is determined based on the dynamic test parameters.

[0037] In these embodiments, the storage module 22 can pre-store various simulation test data and burn test models to suit various different specimens D for simulation tests and dynamic burn tests. Specifically, the simulation test data may, but are not limited to, image files, text files, audio files, video files, applications, and other files or data that can be executed by specimen D.

[0038] In this embodiment, the storage module 22 may be any type of fixed or removable random access memory (RAM), read-only memory (ROM), flash memory, hard disk drive (HDD), solid state drive (SSD), or similar components, or a combination of the above components.

[0039] Embodiments of the present invention will be described with reference to Figures 1 to 3 and Figure 6. Here, Figure 6 is a schematic diagram of the logic for executing the burn test method of the dynamic burn test system of the present invention. The execution logic of the dynamic burn test method of the present invention executes a simulation test if sample D is determined to be unsuccessful in the test of step S01.

[0040] In this embodiment, in step S01, the signal generation module 20 determines that sample D is unacceptable based on the results of the functional test, and the basis for this determination is determined by the signal generation module 20.

[0041] In this embodiment, the determination method for determining whether sample D is unsuccessful may be based on conditions such as the functional test result being greater than, less than, or not equal to a specific parameter. This is because the determined specific parameter value can be adjusted according to the importance of the test.

[0042] Therefore, the results of the functional test can be used as criteria for determining whether a test is above or below a specific parameter, such as if the data processing time exceeds a predetermined time. In some embodiments, the results of the functional test may be, for example, the number of functions that passed or failed multiple functional tests performed by sample D, but are not limited to these.

[0043] The present invention will be described with reference to Figures 1 to 3 and Figure 6. In step S02, the processor 21 of the signal generation module 20 accesses the simulation test data in the storage module 22 in response to the test result of sample D in step S01. Then, the simulation test data corresponding to sample D is transmitted to sample D, and a simulation test is performed using sample D.

[0044] In several embodiments, steps S01 and S02 can be performed directly in the burn-in device (combustion device) beforehand. Furthermore, the test environment when performing step S02 (simulation test) can be the same as when performing step S01. In other embodiments, environmental parameters such as high temperature when performing step S01 can be canceled, allowing step S02 to be performed at room temperature.

[0045] Furthermore, once sample D generates simulation test results, the processor 21 of the signal generation module 20 receives the simulation test results and generates dynamic test parameters based on the simulation test results.

[0046] In some embodiments, the simulation test results include at least one of the following: voltage change values, current change values, and temperature change values.

[0047] In other embodiments, the simulation test results may include the time it takes for sample D to process the test data, thermal design power, clock rate, or other parameters sufficient to identify the function or performance of sample D.

[0048] The dynamic adjustment module 30 adjusts the dynamic burn test parameters for each failing sample D on the burn plate 10 based on the dynamic test parameters.

[0049] Referring to Figure 6, in several embodiments, the dynamic burn test parameters include a burn test pattern, test power parameters, and test temperature parameters. In this embodiment, the burn test model refers to the test content of a dynamic burn test, including test items, test methods, and judgment criteria.

[0050] In some embodiments, the burn test models in steps S01 and S04 may be the same. In other embodiments, the burn test models in steps S01 and S04 may differ, for example, by omitting certain test items or adjusting the judgment criteria for certain test items.

[0051] The test power parameter is a specific voltage and current value applied to the failing sample D for dynamic burn-in. The test temperature parameter is a specific test temperature at which the failing sample D is dynamically pre-burned in.

[0052] In other words, in these embodiments, the specific method by which the dynamic adjustment module 30 modulates the burn plate 10 in step S04 in cooperation with the signal generation module 20 is to adjust the burn test model into which a failing sample D has been input, test the power parameters and temperature parameters, and perform a dynamic burn-in test.

[0053] In several embodiments, Figure 7 shows a specific method for modulating the burn test model into which a failing sample D is input. Here, Figure 7 is a flowchart for switching the burn test model in the dynamic burn test method of the present invention. After the signal generation module 20 generates dynamic burn test parameters in response to the simulation test results of sample D, the signal generation module 20 transmits the burn test model of the generated dynamic burn-in test parameters to the test socket 12 of the failing sample D on the burn plate 10.

[0054] Referring to Figures 2 and 3, in several embodiments, the dynamic adjustment module 30 includes a power supply module 31, a power distribution module 32, and a temperature distribution module 33 that are electrically connected to each other.

[0055] In several embodiments, the power supply module 31 includes an A / D converter that receives AC, converts AC to DC, and outputs it.

[0056] In this embodiment, in step S04, the dynamic adjustment module 30 transmits a test power control signal to the burn plate 10 via the power distribution module 32 based on the dynamic burn test parameters, and a test temperature control signal is transmitted to the burn plate 10 via the temperature distribution module 33 based on the dynamic burn test parameters.

[0057] The explanation will be given with reference to Figure 8. Here, Figure 8 is a block diagram showing an embodiment of a burn plate in the dynamic burn test system of the present invention. In some embodiments, the burn plate 10 also includes a power control module 13. The power control module 13 is electrically connected to the substrate 11 and adjusts the voltage values ​​output to each test socket 12 based on control of the power distribution module 32 from the dynamic adjustment module 30.

[0058] In several embodiments, the power control module 13 is a DC-DC converter, and the power supply module 31 of the dynamic adjustment module 30 supplies power to the power control module 13.

[0059] In this embodiment, Figure 9 shows a specific method by which the dynamic adjustment module 30 modulates the test power parameters of the burn plate 10 in step S04. Here, Figure 9 is a flowchart of the modulated test power parameters in the dynamic burn test method of the present invention. After the signal generation module 20 generates dynamic burn test parameters, including the test power parameters, in response to the simulation test results of sample D, the signal generation module 20 transmits a test power control signal to the power control module 13 of the burn plate 10 via the power distribution module 32, and the power control module 13 of the burn plate 10 can supply the corresponding power to the test socket 12 based on the test power control signal from the power distribution module 32.

[0060] In several embodiments, the power supply module 31 includes an A / D converter, and the power control module 13 is a DC / DC converter.

[0061] The power supplied by the power supply module 31 has a first voltage value and a first current value. After the power control module 13 receives power from the power supply module 31, the first voltage value decreases and the first current value increases simultaneously. This allows a dynamic burn test to be performed on the unsuccessful sample D in the test socket 12 using power with a lower voltage value and an increased current value.

[0062] Therefore, the power supply module 31 only needs to provide normal voltage and current values ​​to the burn plate 10, and the power can be supplied to the test socket 12 via the power control module 13 on the burn plate 10 with a reduced voltage and increased current. The power supply module 31 does not need to be designed to supply a larger current as the number of specimens D increases.

[0063] This will be explained with reference to Figure 8. In several embodiments, the burn plate 10 also includes a temperature control module 14, which is electrically connected to the substrate 11.

[0064] In these embodiments, in step S04, the temperature control module 14 of the burn plate 10 controls the temperature of each test socket 12 based on a temperature control signal from the temperature distribution module 33 of the dynamic adjustment module 30, i.e., the temperature is the burn test temperature.

[0065] In several embodiments, in step S04, the specific method by which the dynamic adjustment module 30 adjusts the test temperature parameters of the burn plate 10 is shown in Figure 10. Here, Figure 10 is a flowchart of the modulated test power parameters in the dynamic burn test method of the present invention. After the signal generation module 20 generates dynamic burn test parameters, including the test temperature parameters, in response to the simulation test results of sample D, the signal generation module 20 transmits a test temperature control signal to the temperature control module 14 of the burn plate 10 via the temperature distribution module 33. The temperature control module 14 of the burn plate 10 can change the test temperature of the test socket 12 based on the test temperature control signal from the temperature distribution module 33.

[0066] In several embodiments, the temperature control module 14 may be a heater or a cooler. In these embodiments, the temperature control module 14 is located in a position corresponding to each test socket 12, but is not limited thereto.

[0067] Referring to Figures 8 and 11, in several embodiments in which the burn plate 10 includes power control modules 13, the number of power control modules 13 is not limited. Here, Figure 11 is a block diagram showing another embodiment of the burn plate in the dynamic burn test system of the present invention.

[0068] When there is only one power control module 13 (as shown in Figure 8), the power control module 13 is electrically connected to each test socket 12 on the burn plate 10, and the power parameters of each test socket 12 are controlled via the single power control module 13.

[0069] If there are multiple power control modules 13 (as shown in Figure 11), the number of power control modules 13 is the same as the number of test sockets 12. Each power control module 13 is electrically connected to a test socket 12, and the power parameters of each test socket 12 are controlled by a separate power control module 13.

[0070] Referring to Figures 8 and 11, in multiple embodiments in which the burn plate 10 includes temperature control modules 14, the number of temperature control modules 14 is not limited, but may be one or more.

[0071] When there is only one temperature control module 14 (as shown in Figure 8), the temperature control module 14 is electrically connected to each test socket 12 on the burn plate 10, and the temperature parameter of each test socket 12 is controlled via the single temperature control module 14.

[0072] If there are multiple temperature control modules 14 (as shown in Figure 11), the number of temperature control modules 14 is the same as the number of test sockets 12. Each temperature control module 14 is electrically connected to a test socket 12, and the temperature parameters of each test socket 12 are controlled by a separate temperature control module 14.

[0073] In some embodiments, the means by which the signal generation module 20 generates dynamic test parameters based on simulation test results may be one that generates dynamic test parameters from a lookup table. In these embodiments, the storage module 22 stores a lookup table containing a plurality of test results and a plurality of grouped test parameters corresponding to each test result.

[0074] In these embodiments, the processor 21 of the signal generation module 20 compares the simulation test results with a lookup table to obtain the corresponding test results, compares the test results to obtain the corresponding grouped test parameters (hereinafter also simply referred to as "group test parameters"), and finally outputs the obtained grouped test parameters to the dynamic adjustment module 30 as dynamic test parameters.

[0075] In several embodiments, the relationship between a test result and a grouped test parameter in a lookup table may include, but not limited to, a single simulation test result corresponding to a single grouped test parameter, or a single simulation test result may correspond to multiple grouped test parameters, or include multiple simulation test results corresponding to a single grouped test parameter, or include multiple simulation test results corresponding to multiple grouped test parameters.

[0076] Specifically, an example of a single simulation test result corresponding to a grouped single test parameter is that if the voltage change value (simulation test result) satisfies a predetermined value (test result), the grouped test parameter modulates the test voltage parameter input to the test socket 12.

[0077] An example of a single simulation test result corresponding to multiple grouped test parameters is that when the voltage change value (simulation test result) satisfies a predetermined value (test result), the grouped test parameters simultaneously switch between modulating the burn test model input to the test socket 12 and the test voltage parameter input to the test socket 12.

[0078] An example of multiple simulation test results corresponding to a single grouped test parameter is that when both the voltage change value (simulation test result) and the temperature change value (simulation test result) satisfy a predetermined value (test result), the grouped test parameter switches and switches the burn test model input to the test socket 12.

[0079] An example of multiple simulation test results corresponding to multiple grouped test parameters is that when both the voltage change value (simulation test result) and the current change value (simulation test result) satisfy a predetermined value (test result), the grouped test parameters simultaneously switch the burn test model input to the test socket 12 and modulate the test temperature parameter input to the test socket 12.

[0080] However, the test results and grouped test parameter settings described above are merely examples and not limiting.

[0081] In some embodiments, the number of lookup tables stored by the storage module 22 is multiple, and each lookup table may, but is not limited to, correspond to a different sample D, different simulated test data, or different data groups of simulated tests.

[0082] In this embodiment, each lookup table corresponds to a different sample D. If the type or specifications of sample D are different, the corresponding lookup table will also be different. In this way, when sample D changes, the test results in the lookup table and the corresponding grouped test parameters also change accordingly.

[0083] In multiple embodiments where the lookup tables correspond to different simulation test data, if the test data for the simulation test performed by sample D is different, the corresponding lookup table will also be different.

[0084] Thus, as the data from the simulation tests performed by sample D changes, the test results and corresponding grouped test parameters in the lookup table also change accordingly.

[0085] In multiple embodiments where the lookup tables correspond to different groups of simulation test data, if the data of the simulation test performed by sample D belongs to a different data group of simulation tests that includes data from multiple simulation tests, the corresponding lookup tables will be different.

[0086] Thus, if the simulation test data executed by sample D belongs to a different simulation test data group, the grouped test parameters corresponding to the test results in the lookup table will also change accordingly. However, the above lookup table configuration is just an example and is not limited to it.

[0087] The method by which the signal generation module 20 generates dynamic test parameters based on simulation test results is not limited to generation by a lookup table as shown in the embodiment described above. In several other implementations, the signal generation module 20 can also calculate dynamic test parameters based on a specific formula.

[0088] In this embodiment, the temperature change values ​​from the simulation test results are based on sample D, with the surface temperature (Tc: Case Temperature) and junction temperature (Tj: Junction Temperature) of sample D being determined. This refers to, but is not limited to, the operating temperature (temperature) or the core operating temperature. The surface temperature of sample D is the temperature of the shell surface of sample D, and can be detected by placing a surface temperature sensor on the surface of sample D.

[0089] The connection temperature of sample D is the operating temperature at which sample D actually operates. Based on the ambient temperature (Ta), the thermal resistance of the known sample (θj-a), and its power consumption efficiency (P[W]), it can be calculated using the formula (Tj = Ta + θj-a × P[W]).

[0090] Overall, unlike the conventional method after step S01, the unacceptable sample D is directly eliminated.

[0091] In this embodiment, for any unsuccessful sample D, the simulation test in step S02 is run again, the dynamic test parameters of Burn are adjusted again based on the simulation test results for each unsuccessful sample D, and Burn is run again.

[0092] Here, the processing range of dynamic test parameters is not limited to these, but includes, but is not limited to, the dynamic calculation test upper limit of the power supply, dynamic adjustment of the power supply and protection range, test program, output status, temperature and voltage provision, automatic switching of the hottest area, and automatic temperature control of the surface temperature, connection surface temperature, or core temperature of specimen D.

[0093] The working core temperature of sample D includes the actual operating temperature of each processing core C in sample D, which comprises multiple processing cores C.

[0094] The following will be explained with reference to Figures 3 and 12. Here, Figure 12 is a block diagram showing an embodiment of the test object in the dynamic burn test system of the present invention. In these embodiments, the specimen D includes a number of processing cores C. Each processing core C includes at least one temperature observation circuit C1. The signal generation module 20 reads the temperature sensing value of the temperature observation circuit C1 of each processing core C of the specimen D as a simulation test result.

[0095] In this way, when sample D includes processing cores C and complex, advanced simulation test data is executed, the signal generation module 20 can directly read the core temperature of each processing core C, improving the accuracy of temperature determination and subsequent dynamic fluctuations.

[0096] Next, the processor 21 of the signal generation module 20 generates dynamic test parameters for each processing core C of sample D according to the simulation test results, and the dynamic adjustment module 30 adjusts the dynamic burn test parameters for each processing core C of each failing sample D on the burn plate 10 based on the dynamic test parameters. The parameters include, but are not limited to, appropriate test voltages and temperatures for each processing core C to prevent each processing core C from overheating.

[0097] In other words, these embodiments can also be used to simulate the test results of each processing core C on each sample D, dynamically adjusting the respective test parameters (voltage, temperature, etc.).

[0098] The explanation will be given with reference to Figure 13, which is a schematic block diagram of another embodiment of the dynamic burn test system of the present invention. In some embodiments, the dynamic burn test system further includes a concentrator (hub) 40, a computing host 50, and a burn host 60.

[0099] In these embodiments, there are multiple signal generation modules 20, each electrically connected to a computing host 50 via a concentrator 40 to form a computing system. The dynamic adjustment module 30 is electrically connected to a burn host 60 to form a burn test system.

[0100] The computing system is electrically connected to the burn test system and can be adapted to burn in multiple burn plates 10. Here, there are multiple burn plates 10, and each burn plate 10 is electrically connected to a signal generation module 20. In this way, the computing system and the burn test system work together to perform dynamic burning on the multiple burn plates 10.

[0101] Referring to Figure 13, in several embodiments, the dynamic burn test system can be integrated into a single hardware architecture. For example, the computing system is incorporated into a first body M1, and the burn test system is incorporated into a second body M2 and installed in the first body M1 of the computing system.

[0102] This allows for the connection lines between the computing system and the burn test system to be as short as possible, making them better suited to high-speed transmission and high-speed computing operating environments. [Explanation of Symbols]

[0103] 10 Burn boards 11 circuit boards 12 test sockets 13 Power control module 14 Temperature control module 20 Signal Generation Modules 21 processors 22 Storage Modules 30 Dynamic Adjustment Modules 31 Power supply module 32 Power Distribution Modules 33 Temperature distribution module 40 Concentrator 50 Computing Hosts 60 Burn Host C Processing Core C1 Temperature observation circuit Sample D M1 First body M2 Second main unit Steps S01-S04

Claims

1. A dynamic burn test system comprising at least one burn plate, at least one signal generation module, and a dynamic adjustment module, The at least one burn plate is suitable for being electrically connected to multiple specimens. The at least one burn plate comprises a substrate, a plurality of test sockets, a temperature control module, and a power control module. The plurality of test sockets are electrically connected to the substrate, The temperature control module is electrically connected to the circuit board, and the temperature control module, under the control of the dynamic adjustment module, adjusts the temperature of each test socket. The power control module is electrically connected to the circuit board, and the power control module, under the control of the dynamic adjustment module, adjusts and outputs the voltage value of each test socket. The at least one signal generation module is electrically connected to the at least one burn plate and is used to control and test the plurality of samples, and is also suitable for determining at least one of the plurality of samples that fails in response to the test results of the plurality of samples, and for transmitting simulation test data to the at least one failing sample, wherein the simulation test data is test data that is executed to simulate the actual usage conditions of the at least one failing sample. The at least one signal generation module controls the at least one failing sample to execute the simulation test data, generates a simulation test result, and also generates dynamic test parameters in response to the simulation test result. A dynamic burn test system comprising: a dynamic adjustment module electrically connected to at least one signal generation module and at least one burn plate; receiving the dynamic test parameters from the at least one signal generation module; and modulating the at least one burn plate in conjunction with the signal generation module to perform a dynamic burn test on at least one unsuccessful sample based on the dynamic test parameters.

2. The dynamic burn test system according to claim 1, wherein the power control module provides power to each of the test sockets with a reduced voltage value and a increased current value.

3. The dynamic adjustment module includes a power supply module, a temperature distribution module, and a power distribution module that are electrically connected to each other. The power supply module is used to supply power to at least one burn plate, and the temperature distribution module is used to transmit a test temperature control signal to the temperature control module in order to test the temperature of each of the test sockets based on the dynamic test parameters. The dynamic burn test system according to claim 1, wherein the power distribution module transmits a test power control signal to the power control module based on the dynamic test parameters, and adjusts and outputs the voltage value of each test socket.

4. The at least one signal generation module includes a storage module and a processor that are electrically connected to each other. The dynamic burn test system according to claim 1, wherein the storage module stores a lookup table, the lookup table includes a plurality of test results and a plurality of group test parameters, and the at least one signal generation module finds one of the corresponding plurality of test results from the lookup table based on the simulation test result, and outputs one of the corresponding plurality of group test parameters to be used as the dynamic test parameter.

5. The dynamic burn test system according to claim 4, wherein the processor is a system-on-a-chip, a field-programmable gate array chip, or a high-performance computing chip.

6. The sample includes a plurality of processing cores, each of which includes at least one temperature observation circuit. The dynamic burn test system according to claim 1, wherein when the at least one unsuccessful sample executes the simulation test data, the at least one signal generation module reads the observed value of the at least one temperature observation circuit to obtain the simulation test result.

7. The quantity of the temperature control modules corresponds to the quantity of the multiple test sockets, and the quantity of the power control modules corresponds to the quantity of the multiple test sockets. The dynamic burn test system according to claim 1, wherein each of the test sockets is electrically connected to the temperature control module and the power control module, respectively.

8. The system further includes a concentrator and a computing host, wherein the at least one burner plate is a plurality of burner plates, and the at least one signal generation module is a plurality of signal generation modules. The dynamic burn test system according to claim 1, wherein each of the plurality of burn plates is electrically connected to the signal generation module, and the signal generation module is electrically connected to the computing host via the concentrator.

9. A dynamic burn test method suitable for testing multiple samples on a burn plate, A signal generation module is used to control and test the multiple samples, and in response to the test results of the multiple samples, at least one of the multiple samples is determined to be unsatisfactory. The signal generation module transmits simulation test data to the at least one failing sample and, at the same time, controls the at least one failing sample to execute the simulation test data, thereby generating a simulation test result, wherein the simulation test data is test data executed to simulate the actual usage conditions of the at least one failing sample. The signal generation module generates dynamic test parameters in response to the simulation test results and transmits them to the dynamic adjustment module. The dynamic adjustment module modulates the burn plate in conjunction with the signal generation module so that the dynamic test parameters are adjusted to perform a burn test on at least one unsuccessful sample. A dynamic burn test method comprising inputting at least one of a predetermined voltage value and a predetermined current value for the at least one failing specimen, wherein the temperature of the at least one failing specimen is controlled to a predetermined temperature value.

10. The dynamic burn test method according to claim 9, wherein the signal generation module controls the plurality of samples to perform a functional test.

11. The dynamic burn test method according to claim 9, wherein the simulation test result is one of the voltage change value, current change value, and temperature change value.

12. The dynamic burn test method according to claim 9, wherein the signal generation module generates the dynamic test parameters from a lookup table based on the simulation test results.

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