Heat transfer components

Abstract

The present invention is a heat transfer member which is applied to a cooling device (100), which cools an object-to-be-cooled (70) in a state of being immersed in a liquid refrigerant and promotes heat transfer to the refrigerant from the object-to-be-cooled (70). Furthermore, the object-to-be-cooled (70) is an electronic apparatus. The refrigerant is a fluorine-based insulating refrigerant having a boiling point equal to or lower than 100 °C. The refrigerant is exposed to the atmosphere. In addition, the refrigerant is a heat transfer member of which a degree of superheat dT is 10 K and heat flux q is 300 kW / m2 in a boiling curve with a lateral axis as the degree of superheat dT of the refrigerant and a vertical axis as the heat flux q. However, the degree of superheat dT is a value obtained by subtracting the saturation temperature Ts of the refrigerant from the temperature Tw of the heat transfer member. In addition, the heat flux q is the calories transferred per unit area to the refrigerant from a heat transfer portion.

Claims

1. A heat transfer member applied to a cooling device (100) that cools an object to be cooled (70) while it is immersed in a liquid-phase refrigerant, which promotes heat transfer from the object to be cooled to the refrigerant, A boiling-promoting surface (84) is formed on the refrigerant side surface (82) that comes into contact with the refrigerant, which promotes the boiling of the refrigerant. In the roughness curve of the boiling-promoting surface, the portion formed between adjacent peaks is defined as a hole (84c), the distance between adjacent peaks is defined as the hole width Gw, the distance between the line connecting adjacent peaks and the bottom of the adjacent peaks is defined as the hole depth Gd, the value obtained by dividing the hole depth Gd by the hole width Gw is defined as the hole aspect ratio Gd / Gw, and the number of holes per unit length is defined as the number of holes Ng. A heat transfer member in which the number of holes Ng in the hole portion, such that the aspect ratio Gd / Gw of the hole portion is 0.01 or more, is 9 or more per 1 mm.

2. moreover, 315μm≧Gw≧1.7μm The heat transfer member according to claim 1.

3. The contact surface (81) that contacts the object to be cooled, It has an area-enhancing portion (83) that increases the area of ​​the refrigerant side surface, The heat transfer member according to claim 1 or 2, wherein the boiling-promoting surface is formed on 50% or more of the area-enlarged portion.

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