Water-soluble epoxy resin composition and method for producing the same, as well as emulsion, coating composition and cured coating film using the water-soluble epoxy resin composition.

JP7874349B1Active Publication Date: 2026-06-16KYOEISHA CHEM CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
KYOEISHA CHEM CO LTD
Filing Date
2025-01-30
Publication Date
2026-06-16

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Abstract

To provide a water-soluble epoxy resin composition and a method for producing the same, which have extremely small average particle sizes of micelles and can maintain an unchanging emulsion state in terms of storage stability and freeze-thaw stability. [Solution] A method for producing a water-soluble epoxy resin composition containing a water-soluble epoxy resin (II) containing three or more epoxy groups in its molecule and the epoxy resin (E), obtained by reacting a carboxylic acid di / trianhydride (A), a polyalkylene glycol derivative of formula (I) containing a hydroxyl group at one end (B), and water (C) with a reaction catalyst, and then reacting the resulting reaction product with an epoxy resin (E). H-(OCH2CH2) n -OR(I) JPEG0007874349000018.jpg3189 [In the formula, R is an alkyl group, (meth)acryloyl group, allyl group, or acyl group; n is 18 or greater; m is 0 to 4; k is an integer from 0 to 3; m+k=2 to 4; A is a carboxylic acid dianhydride or carboxylic acid trianhydride; and Ea and Eb represent epoxy resins, respectively.]
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Claims

1. A method for producing a water-soluble epoxy resin composition comprising a water-soluble epoxy resin represented by formula (II) having three or more epoxy groups in its molecule, obtained by reacting a carboxylic acid dianhydride or carboxylic acid trianhydride (A), a polyalkylene glycol derivative containing a hydroxyl group at one end represented by formula (I) (B), and water (C) with a reaction catalyst, and then reacting the resulting reaction product with an epoxy resin (E). H-(OCH) 2 CH 2 ) n -O-R (I) [In formula (I), R is an alkyl group, a (meth)acryloyl group, an allyl group, or an acyl group. n is any integer greater than or equal to 18. [In formula (II), R is an alkyl group, a (meth)acryloyl group, an allyl group, or an acyl group. n represents any integer greater than or equal to 18. m represents an integer between 0 and 4. k represents an integer between 0 and 3, and m + k = 2 to 4. A' represents a residue of a carboxylic acid dianhydride or carboxylic acid trianhydride. Ea and Eb each independently represent different epoxy resin residues.

2. A method for producing a water-soluble epoxy resin composition according to claim 1, wherein the reaction catalyst is a water-soluble reaction catalyst.

3. A method for producing a water-soluble epoxy resin composition according to claim 1 or 2, wherein the polyalkylene glycol derivative (B) containing a hydroxyl group at one end is polyethylene glycol monomethyl ether, polyethylene glycol lauryl ether, polyethylene glycol mono(meth)acrylate, or polyethylene glycol monoallyl ether.

4. A method for producing a water-soluble epoxy resin composition according to claim 1 or 2, wherein the carboxylic acid dianhydride or carboxylic acid trianhydride (A) is pyromellitic anhydride or bisphenol A type carboxylic acid dianhydride.

5. A method for producing a water-soluble epoxy resin composition according to claim 1 or 2, wherein the epoxy resin (E) is a bisphenol-type epoxy resin having two or more epoxy groups in its molecule.

6. A water-soluble epoxy resin composition comprising an epoxy resin (E) and an epoxy resin (E), wherein the reaction product of a reaction catalyst comprising a carboxylic acid dianhydride or carboxylic acid trianhydride (A), a polyalkylene glycol derivative containing a hydroxyl group at one end represented by formula (I) (B), and water (C) is a water-soluble epoxy resin represented by formula (II) having three or more epoxy groups in its molecule. H-(OCH 2 CH 2 ) n -OR (I) [In formula (I), R is an alkyl group, a (meth)acryloyl group, an allyl group, or an acyl group. n is any integer greater than or equal to 18. [In formula (II), R is an alkyl group, a (meth)acryloyl group, an allyl group, or an acyl group. n represents any integer greater than or equal to 18. m represents an integer between 0 and 4. k represents an integer between 0 and 3, and m + k = 2 to 4. A' represents a residue of a carboxylic acid dianhydride or carboxylic acid trianhydride. Ea and Eb each independently represent different epoxy resin residues.

7. The water-soluble epoxy resin composition according to claim 6, wherein the epoxy resin (E) is contained in an amount greater than 0 moles and less than 4 moles per mole of the water-soluble epoxy resin represented by formula (II).

8. An emulsion comprising the water-soluble epoxy resin composition described in claim 6.

9. Furthermore, the emulsion according to claim 8 further comprises at least one of a water-soluble curing agent and a water-soluble polymerization catalyst.

10. A coating composition comprising the emulsion according to claim 8 or 9.

11. A cured coating film of the coating composition according to claim 10.