Resin substrates, metal-clad laminates, and wiring boards

By employing glass cloth with high SiO2 content and controlled yarn width variation and loss tangent, the challenges of drill wear and dielectric property improvement in resin substrates and metal-clad laminates are addressed, resulting in improved drilling efficiency and dielectric performance.

JP7876092B1Active Publication Date: 2026-06-18ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ASAHI KASEI KOGYO KABUSHIKI KAISHA
Filing Date
2025-12-25
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Conventional resin substrates and metal-clad laminates face challenges in achieving high SiO2 content for improved dielectric properties while maintaining low drill wear resistance, as increased SiO2 content leads to increased drill wear and reduced drilling efficiency.

⚗Method used

The use of glass cloth woven from glass yarn with a SiO2 content of 95-100% by mass, combined with a yarn width variation coefficient of 0.20 or less, and a loss tangent of 0.34 or less at 200°C, to suppress drill wear and improve dielectric properties.

🎯Benefits of technology

This approach results in resin substrates and metal-clad laminates with excellent drill wear resistance and dielectric properties, suitable for high-speed communication applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

A resin substrate comprising a glass cloth woven from glass yarn having a Si content in the range of 95% to 100% by mass in terms of SiO2, and a resin composition, The above glass cloth has a yarn width variation coefficient calculated using the formula: Yarn width variation coefficient = Yarn width standard deviation [μm] / Yarn width [μm], where the value is within the range of 0.20 or less in both the warp and weft directions. A resin substrate having a loss tangent (tanδ) of 0.34 or less at 200°C.
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