Laminated film for forming individual pieces, method for manufacturing the same, wound body, and laminate

Abstract

To provide a laminate film which can sufficiently suppress defects when a wound laminate film 10 is wound.SOLUTION: A laminate film 10 includes: an adhesive film 1 having a first support film 1a having a first surface 1aX and a second surface 1aY and a first adhesive layer 1b; and a lamination structure part 5 having a structure part 3 (film D), a second adhesive layer 2b, and a second support film 2a. The structure part 3 has a thermosetting resin layer D1 and a rigid material layer D2. The rigid material layer D2 is laminated on the first adhesive layer 1b. A part of a surface of the first adhesive layer 1b is exposed. In a measurement sample obtained by bonding the second surface 1aY of the first support film 1a and the first adhesive layer 1b of the adhesive film 1, 90° peel strength of the first adhesive layer 1b of the adhesive film 1 to the second surface 1aY of the first support film 1a is 1.5 N / m or less.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a laminated film for forming individual pieces, a method for manufacturing the same, a wound body, and a laminate.

Background Art

[0002] In recent years, in the field of semiconductor devices, high integration, miniaturization, and high speed have been demanded. As one aspect of semiconductor devices, a structure in which semiconductor chips are stacked on a controller chip disposed on a substrate has attracted attention. For example, Patent Document 1 discloses a semiconductor die assembly including a controller die and a memory die supported by a support member on the controller die. The semiconductor assembly 100 illustrated in FIG. 1A of Patent Document 1 can be said to have a dolmen structure. The semiconductor assembly 100 includes a package substrate 402, a controller die 103 disposed on its surface, memory dies 106a and 106b disposed above the controller die 103, and support members 130a and 130b that support the memory die 106a.

[0003] Patent Document 1 discloses that a semiconductor material such as silicon can be used as the support member (support piece), and more specifically, a fragment of a semiconductor material obtained by dicing a semiconductor wafer can be used.

[0004] Further, Patent Document 2 discloses that a resin film mainly composed of a resin material can be used as the support member (support piece) instead of a semiconductor material such as silicon. As the resin film, for example, a three-layer film having two thermosetting resin layers and a rigid material layer disposed so as to be sandwiched between the thermosetting resin layers and having higher rigidity than the thermosetting resin layers in this order is exemplified.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

[0006] The inventors are developing a laminated film for forming individual pieces, which has a structural component consisting of a film comprising a thermosetting resin layer and a rigid material layer having higher rigidity than the thermosetting resin layer, as a laminated film for forming a support member (support piece).

[0007] Figure 1 is a schematic plan view showing one embodiment of a laminated film for forming individual pieces. Figure 2(a) is an enlarged view of part E of Figure 1, and Figure 2(b) is a cross-sectional view along line bb in Figure 2(a). The laminated film 10 for forming individual pieces (hereinafter sometimes simply referred to as "laminated film 10") comprises an adhesive film 1 having a first support film 1a having a first surface 1aX and a second surface 1aY opposite to the first surface 1aX, and a first adhesive layer 1b containing a non-UV curing adhesive provided on the first surface 1aX, and a laminated structural part 5 having a structural part 3 consisting of a second adhesive layer 2b and a second support film 2a, which are spaced apart on the first adhesive layer 1b of the adhesive film 1, in this order from the first adhesive layer 1b. Here, film D is a film that is divided into multiple individual pieces by dicing. Structural part 3 has a thermosetting resin layer D1 and a rigid material layer D2 having higher rigidity than the thermosetting resin layer D1. The rigid material layer D2 in structural part 3 is laminated on the first adhesive layer 1b. A portion of the surface of the first adhesive layer 1b of the adhesive film 1 opposite to the first support film 1a is not covered by structural part 3, the second adhesive layer 2b, and the second support film 2a (structural part 3, the second adhesive layer 2b, and the second support film 2a are not positioned on this portion) and is exposed. Note that the laminated film having the second support film 2a and the second adhesive layer 2b provided on the second support film 2a is sometimes called the "dicing film 2".

[0008] Incidentally, laminated films (for example, dicing-die bonding integrated films) in which multiple laminated structural parts (structures) are provided on the film are usually stored, transported, and used as wound bodies obtained by winding the laminated structural part 5 with the second support film 2a side facing inward onto a winding core.

[0009] The laminated structural portion 5 in the laminated film 10 is formed in multiple quantities by, for example, using a punching blade to gradually die-cut the individualized film substrate (raw material) and the dicing film substrate (raw material) into desired shapes. Since unnecessary portions of the individualized film substrate and the dicing film substrate are usually removed, in the laminated film 10, a portion of the surface of the first adhesive layer 1b of the adhesive film 1 opposite to the first support film 1a is not covered by the structural portion 3, the second adhesive layer 2b, and the second support film 2a (the structural portion 3, the second adhesive layer 2b, and the second support film 2a are not positioned on this surface) and is exposed (see Figures 1 and 2).

[0010] According to the inventors' investigations, when a laminated film 10 is wound onto a core with a portion of the surface of the first adhesive layer 1b of the adhesive film 1 that is opposite to the first support film 1a exposed, it has been found that a portion of the first adhesive layer 1b of the later wound laminated film 10 may adhere to the second surface 1aY of the first support film 1a of the laminated film 10 that was wound earlier. If a portion of the first adhesive layer 1b adheres to the second surface 1aY of the first support film 1a, problems such as the winding process being hindered may occur during unwinding.

[0011] Therefore, the main objective of this disclosure is to provide a laminated film for forming individual pieces, which includes a film for forming individual pieces that is divided into multiple pieces by dicing, and which can sufficiently suppress problems when unwinding the wound laminated film for forming individual pieces. [Means for solving the problem]

[0012] In an investigation to solve the above problems, the present inventors found that by adjusting the adhesive strength of the first adhesive layer to the second surface of the first support film within a predetermined range by performing surface treatment on the second surface of the first support film, it is possible to sufficiently suppress problems when unwinding the wound laminated film for forming individual pieces. In addition, in laminated films in which multiple laminated structural parts (structural parts) are provided on the film (for example, a dicing-die bonding integrated film), surface treatment is usually not performed on the second surface because the laminated film is prone to slipping and shifting when the film is wound onto the core.

[0013] This disclosure provides a laminated film for forming individual pieces according to [1] and [2], a method for manufacturing a laminated film for forming individual pieces according to [3], a wound body according to [4], and a laminate according to [5]. [1] A first support film having a first surface and a second surface opposite to the first surface, and an adhesive film having a first adhesive layer containing a non-UV curing adhesive provided on the first surface, and a laminated structural part having a plurality of spaced-apart structural parts, a second adhesive layer, and a second support film, on the first adhesive layer of the adhesive film, in this order from the first adhesive layer, wherein the structural part has a thermosetting resin layer and a rigid material layer having higher rigidity than the thermosetting resin layer, and in the structural part A laminated film for forming individual pieces, wherein the rigid layer is laminated on the first adhesive layer, a portion of the surface of the first adhesive layer of the adhesive film opposite to the first support film is exposed, and in a measurement sample obtained by bonding the second surface of the first support film and the first adhesive layer of the adhesive film, the adhesive force of the first adhesive layer of the adhesive film to the second surface of the first support film is 1.5 N / m or less, measured at 25°C under conditions of a peeling angle of 90° and a peeling speed of 50 mm / min. [2] The laminated film for forming individual pieces according to [1], wherein the second surface of the first support film is a surface that has been surface-treated, and the surface treatment is at least one selected from the group consisting of embossing, matte finish, silicone resin treatment, and fluororesin treatment. A method for manufacturing a laminated film for forming individual pieces, according to [3] [1] or [2], the manufacturing method comprising: a step of preparing a first laminate comprising the first support film, the first adhesive layer, and the film substrate for forming individual pieces in this order; a step of die-cutting the film substrate for forming individual pieces in the first laminate to produce a second laminate comprising the structural parts made of a plurality of the films for forming individual pieces; and a step of laminating the second adhesive layer and the second support film on the plurality of structural parts of the second laminate in this order to produce a plurality of laminated structural parts. [4] A winding body comprising a core and a laminated film for forming individual pieces according to [1] or [2] wound around the core. [5] A laminate comprising a first support film having a first surface and a second surface opposite to the first surface, an adhesive film having a first adhesive layer containing a non-UV curing adhesive provided on the first surface, and a plurality of structural parts consisting of individualized film forming films provided spaced apart on the first adhesive layer of the adhesive film, wherein the structural parts have a thermosetting resin layer and a rigid material layer having higher rigidity than the thermosetting resin layer, the rigid material layer in the structural parts is laminated on the first adhesive layer, and in a measurement sample obtained by bonding the second surface of the first support film and the first adhesive layer of the adhesive film, the adhesive force of the first adhesive layer of the adhesive film to the second surface of the first support film is 1.5 N / m or less, measured at 25°C under conditions of a peel angle of 90° and a peel speed of 50 mm / min. [Effects of the Invention]

[0014] According to the present disclosure, there are provided a laminated film for forming a fragmented body including a film for forming a fragmented body that is fragmented into a plurality of pieces by dicing, which can sufficiently suppress problems when unwinding the wound laminated film for forming a fragmented body, and a method for manufacturing the same. Further, according to the present disclosure, there is provided a wound body including a laminated film for forming a fragmented body. Furthermore, according to the present disclosure, there is provided a laminate useful for forming a laminated film for forming a fragmented body.

Brief Description of the Drawings

[0015] [Figure 1] FIG. 1 is a plan view schematically showing an embodiment of a laminated film for forming a fragmented body. [Figure 2] FIG. 2(a) is an enlarged view of a portion E in FIG. 1, and FIG. 2(b) is a cross-sectional view taken along line b-b in FIG. 2(a). [Figure 3] FIGS. 3(a), (b), and (c) are cross-sectional views schematically showing the manufacturing process of a laminated film for forming a fragmented body. [Figure 4] FIGS. 4(a) and (b) are cross-sectional views schematically showing the manufacturing process of a laminated film for forming a fragmented body. [Figure 5] FIG. 5 is a cross-sectional view schematically showing a first embodiment of a semiconductor device of the present disclosure. [Figure 6] FIGS. 6(a) and 6(b) are plan views schematically showing an example of the positional relationship between a first chip and a plurality of support pieces. [Figure 7] FIG. 7 is a cross-sectional view schematically showing an embodiment of a laminated film for forming a support piece. [Figure 8] FIGS. 8(a), (b), (c), and (d) are cross-sectional views schematically showing the manufacturing process of a support piece. [Figure 9] FIG. 9 is a cross-sectional view schematically showing a state in which a plurality of support pieces are arranged around a first chip on a substrate. [Figure 10] FIG. 10 is a cross-sectional view schematically showing an example of a chip with an adhesive piece. [Figure 11]FIG. 11 is a cross-sectional view schematically showing a dorman structure formed on a substrate. [Figure 12] FIG. 12 is a cross-sectional view schematically showing a second embodiment of the semiconductor device of the present disclosure.

Embodiments for Carrying out the Invention

[0016] Hereinafter, embodiments of the present disclosure will be described with appropriate reference to the drawings. However, the present disclosure is not limited to the following embodiments. In the following embodiments, the components (including steps, etc.) are not essential unless otherwise specified. The sizes of the components in each figure are conceptual, and the relative size relationships between the components are not limited to those shown in each figure.

[0017] The same applies to the numerical values and their ranges in the present disclosure, which do not limit the present disclosure. The numerical range indicated by "~" in this specification indicates a range including the numerical values described before and after "~" as the minimum value and the maximum value, respectively. In the numerical ranges described step by step in this specification, the upper limit value or the lower limit value described in one numerical range may be replaced with the upper limit value or the lower limit value of another numerically described range. Also, in the numerical ranges described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the examples.

[0018] In this specification, the term "layer" includes, in addition to the structure formed over the entire surface when observed as a plan view, the structure formed partially. Also, in this specification, the term "step" includes not only an independent step but also the case where, even if it cannot be clearly distinguished from other steps, if the intended action of the step is achieved, it is included in this term.

[0019] In this specification, (meth)acrylate means acrylate or the corresponding methacrylate. The same applies to other similar expressions such as (meth)acryloyl group, (meth)acrylic copolymer, etc.

[0020] Unless otherwise specified, each component and material exemplified herein may be used alone or in combination of two or more.

[0021] [Laminated film for forming individual fragments] The laminated film 10 shown in Figures 1 and 2 comprises an adhesive film 1 having a first support film 1a having a first surface 1aX and a second surface 1aY opposite to the first surface 1aX, and a first adhesive layer 1b containing a non-UV curing adhesive provided on the first surface 1aX, and a laminated structural part 5 having a plurality of spaced-apart structural parts 3 made of film D, a second adhesive layer 2b, and a second support film 2a in this order from the first adhesive layer 1b on the first adhesive layer 1b of the adhesive film 1.

[0022] In the laminated film 10, a portion of the second adhesive layer 2b of the dicing film 2 may or may not be in contact with the first adhesive layer 1b of the adhesive film 1 (see Figure 2(b)). When using the laminated film 10, the adhesive film 1 is peeled off at an appropriate time.

[0023] The adhesive film 1 in the laminated film 10 has, for example, a width (length in the direction perpendicular to the longitudinal direction) of 300 to 500 mm and a total length (length in the longitudinal direction) of 10 to 400 m.

[0024] Examples of the first support film 1a include polyester (polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate, etc.), polyolefin (polyethylene, polypropylene, etc.), polycarbonate, polyamide, polyimide, polyamide-imide, polyetherimide, polyether sulfide, polyethersulfone, polyetherketone, polyphenylene ether, and polyphenylene sulfide. These films may be single-layer films or multilayer films composed of two or more films. The thickness of the first support film 1a may be, for example, 1 to 200 μm, 10 to 100 μm, or 20 to 50 μm.

[0025] The first support film 1a has a first surface 1aX on which the first adhesive layer 1b is provided, and a second surface 1aY opposite to the first surface 1aX. The second surface 1aY of the first support film 1a may be a surface that has been surface-treated. By the second surface 1aY of the first support film 1a being a surface-treated surface, the adhesive force of the first adhesive layer 1b of the adhesive film 1 to the second surface 1aY of the first support film 1a can be reduced more sufficiently.

[0026] The surface treatment may be at least one selected from the group consisting of embossing, matte finish, silicone resin coating, and fluororesin coating.

[0027] Embossing is a processing technique in which an embossing roll with a textured surface is pressed against a film, creating textures on the film's surface that correspond to the textures of the embossing roll. The embossing roll has a pattern engraved on its surface. Matting is a processing technique in which fine sand is projected onto a film to create textures on the film's surface.

[0028] Silicone resin processing refers to a processing technique that involves coating the surface of a film with silicone resin. Fluoropolymer processing refers to a processing technique that involves coating the surface of a film with fluoropolymer (such as Teflon®).

[0029] The first adhesive layer 1b is a layer containing a non-UV-curable adhesive (a layer consisting of a non-UV-curable adhesive). The first adhesive layer 1b may be a non-UV-curable adhesive layer. A non-UV-curable adhesive is a type of adhesive that exhibits a constant level of tackiness with short-term pressure and whose tackiness does not fluctuate significantly before and after UV irradiation. Examples of non-UV-curable adhesives include natural rubber-based, synthetic rubber-based, acrylic resin-based, polyvinyl ether resin-based, urethane resin-based, and silicone resin-based adhesives. The thickness of the first adhesive layer 1b may be, for example, 5 to 20 μm.

[0030] In the laminated film 10, a portion of the surface of the first adhesive layer 1b of the adhesive film 1 opposite to the first support film 1a is not covered by the structural part 3, the second adhesive layer 2b, and the second support film 2a (the structural part 3, the second adhesive layer 2b, and the second support film 2a are not positioned on this portion), and is exposed. It can be said that the laminated film 10 has an exposed portion on the surface of the first adhesive layer 1b of the adhesive film 1 opposite to the first support film 1a that is not covered by the structural part 3, the second adhesive layer 2b, and the second support film 2a (the structural part 3, the second adhesive layer 2b, and the second support film 2a are not positioned on this portion).

[0031] The thickness of the adhesive film 1 (the sum of the thickness of the first support film 1a and the first adhesive layer 1b) may be, for example, 5 to 150 μm, 15 to 100 μm, or 25 to 70 μm.

[0032] In a measurement sample obtained by bonding the second surface 1aY of the first support film 1a to the first adhesive layer 1b of the adhesive film 1, the adhesive strength of the first adhesive layer 1b of the adhesive film 1 to the second surface 1aY of the first support film 1a is 1.5 N / m or less. Here, the adhesive strength is the 90° peel strength measured at 25°C under conditions of a peel angle of 90° and a peel speed of 50 mm / min. The 90° peel strength can be measured, for example, by the following method. First, cut out piece A from the first support film 1a to a width of 25 mm and a length of 100 mm. Next, cut out piece B from the adhesive film 1 to a width of 25 mm and a length of 100 mm. Then, bond the second surface 1aY of the first support film 1a on piece A to the first adhesive layer 1b of the adhesive film 1 on piece B, and use this as the measurement sample. Next, with the first support film 1a side of the cut piece A of the measurement sample fixed, the 90° peel strength is measured by peeling off the first adhesive layer 1b at 25°C under conditions of a peel angle of 90° and a peel speed of 50 mm / min using a tensile testing machine (Shimadzu Corporation, Autograph AGS-1000). If the adhesive force of the first adhesive layer 1b to the second surface 1aY of the first support film 1a is 1.5 N / m or less, even if the first adhesive layer 1b and the second surface 1aY of the first support film 1a are stuck together, separation of the first adhesive layer 1b and the second surface 1aY of the first support film 1a becomes easy during unwinding, and problems when unwinding the laminated film 10 can be sufficiently suppressed. The adhesive force may be 1.2 N / m or less or 1.0 N / m or less. The lower limit of the adhesive strength may be, for example, 0.1 N / m or more, 0.3 N / m or more, or 0.5 N / m or more.

[0033] Commercially available adhesive film 1 can be used. Examples of commercially available adhesive film 1 include PET75-H2120(10) (product name, manufactured by Nichiei Shinka Co., Ltd.), CosmoTack series (product name, manufactured by CosmoTec Co., Ltd.), and Hitarex DT series (product name, manufactured by Showa Denko Materials Co., Ltd.).

[0034] The laminated structure 5 comprises a structural part 3 made of film D, a second adhesive layer 2b, and a second support film 2a, in this order from the first adhesive layer 1b. Multiple laminated structures 5 are provided spaced apart on the first adhesive layer 1b of the adhesive film 1.

[0035] The structural part 3, made of film D, has a thermosetting resin layer D1 and a rigid material layer D2 having higher rigidity than the thermosetting resin layer D1. Film D may be a two-layer film. That is, the structural part 3 may be two layers. The rigid material layer D2 in the structural part 3 is laminated on the first adhesive layer 1b.

[0036] The thermosetting resin composition constituting the thermosetting resin layer D1 may undergo a semi-cured (B stage) state and then become a cured product (C stage) state through heat treatment. The thermosetting resin composition may contain epoxy resin, a curing agent, and an elastomer, as this makes it easier to obtain the desired effect, and may further contain inorganic fillers, curing accelerators, etc., as needed. The thermosetting resin layer D1 may be in a semi-cured (B stage) state, at least partially cured, and then become a cured product (C stage) state through heat treatment.

[0037] The epoxy resin is not particularly limited as long as it hardens and has adhesive properties. Examples of epoxy resins include bifunctional epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, and bisphenol S type epoxy resin, as well as novolac type epoxy resins such as phenol novolac type epoxy resin and cresol novolac type epoxy resin. Other examples of epoxy resins include polyfunctional epoxy resins, glycidylamine type epoxy resins, heterocyclic epoxy resins, and alicyclic epoxy resins.

[0038] Examples of curing agents include phenolic resins, ester compounds, aromatic amines, aliphatic amines, and acid anhydrides. Among these, phenolic resin may be used as the curing agent from the viewpoint of achieving high shear strength (die shear strength). Examples of commercially available phenolic resins include LF-4871 (trade name, BPA novolac type phenolic resin) from DIC Corporation, HE-100C-30 (trade name, phenylarachil type phenolic resin) from Air Water Inc., Phenolite KA and TD series from DIC Corporation, Milex XLC- series and XL series (e.g., Milex XLC-LL) from Mitsui Chemicals, Inc., HE series (e.g., HE100C-30) from Air Water Inc., MEHC-7800 series (e.g., MEHC-7800-4S) from Meiwa Kasei Co., Ltd., JDPP series from JEF Chemical Co., Ltd., and PSM series (e.g., PSM-4326) from Gun-ei Chemical Industry Co., Ltd.

[0039] From the viewpoint of achieving high shear strength (die shear strength), the proportions of epoxy resin and phenolic resin may be 0.6 to 1.5, 0.7 to 1.4, or 0.8 to 1.3 in terms of the equivalent ratio of epoxy equivalent to hydroxyl group equivalent, respectively. When the proportions are within this range, it tends to be easier to achieve sufficiently high levels of both curability and fluidity.

[0040] Examples of elastomers include acrylic resins, polyester resins, polyamide resins, polyimide resins, silicone resins, polybutadiene, acrylonitrile, epoxy-modified polybutadiene, maleic anhydride-modified polybutadiene, phenol-modified polybutadiene, and carboxy-modified acrylonitrile.

[0041] The elastomer may be an acrylic resin from the viewpoint of achieving high shear strength (die shear strength). The acrylic resin may be an epoxy group-containing (meth)acrylic copolymer obtained by polymerizing an epoxy group or a functional monomer having an epoxy group or a glycidyl group as a crosslinkable functional group, such as glycidyl acrylate or glycidyl methacrylate. Among these, the acrylic resin may be an epoxy group-containing (meth)acrylic acid ester copolymer or an epoxy group-containing acrylic rubber, and is preferably an epoxy group-containing acrylic rubber. The epoxy group-containing acrylic rubber is mainly composed of an acrylic acid ester and is a rubber having epoxy groups, mainly copolymers of butyl acrylate, acrylonitrile, etc., or copolymers of ethyl acrylate, acrylonitrile, etc. Note that the acrylic resin may have not only epoxy groups but also crosslinkable functional groups such as alcoholic or phenolic hydroxyl groups or carboxyl groups.

[0042] Examples of commercially available acrylic resins include SG-70L, SG-708-6, WS-023 EK30, SG-280 EK23, and SG-P3 solvent-modified version (product name: acrylic rubber, weight-average molecular weight: 800,000, Tg: 12℃, solvent: cyclohexanone), all manufactured by Nagase Chemtec Corporation.

[0043] The glass transition temperature (Tg) of the acrylic resin is preferably -50 to 50°C, and more preferably -30 to 30°C, from the viewpoint of achieving high shear strength (die shear strength). The weight-average molecular weight (Mw) of the acrylic resin is preferably 100,000 to 3,000,000, and more preferably 500,000 to 2,000,000, from the viewpoint of achieving high shear strength (die shear strength). Here, Mw refers to the value measured by gel permeation chromatography (GPC) and converted using a calibration curve with standard polystyrene. It should be noted that using an acrylic resin with a narrow molecular weight distribution tends to allow for the formation of highly elastic fragments.

[0044] From the viewpoint of achieving high shear strength (die shear strength), the elastomer content may be 10 to 200 parts by mass or 20 to 100 parts by mass per 100 parts by mass of the total epoxy resin and curing agent.

[0045] Examples of inorganic fillers include aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, aluminum oxide, aluminum nitride, aluminum borate whiskers, boron nitride, crystalline silica, amorphous silica, and the like.

[0046] The average particle size of the inorganic filler may be 0.005 μm to 1.0 μm or 0.05 to 0.5 μm from the viewpoint of achieving high shear strength (die shear strength). The surface of the inorganic filler may be chemically modified from the viewpoint of achieving high shear strength (die shear strength). Examples of materials for chemically modifying the surface include silane coupling agents. Examples of functional groups of silane coupling agents include vinyl groups, acryloyl groups, epoxy groups, mercapto groups, amino groups, diamino groups, alkoxy groups, and ethoxy groups.

[0047] From the viewpoint of achieving high shear strength (die shear strength), the inorganic filler content may be 20 to 200 parts by mass or 30 to 100 parts by mass per 100 parts by mass of the resin components (epoxy resin, curing agent, and elastomer) of the thermosetting resin composition.

[0048] Examples of curing accelerators include imidazoles and their derivatives, organophosphorus compounds, secondary amines, tertiary amines, and quaternary ammonium salts. From the viewpoint of achieving high shear strength (die shear strength), the curing accelerator may be an imidazole. Examples of imidazoles include 2-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole.

[0049] From the viewpoint of achieving high shear strength (die shear strength), the content of the curing accelerator may be 0.04 to 3 parts by mass or 0.04 to 0.2 parts by mass per 100 parts by mass of the total of the epoxy resin and curing agent.

[0050] The rigid layer D2 may be, for example, a resin layer having higher rigidity than the thermosetting resin layer D1, or a metal layer having higher rigidity than the thermosetting resin layer D1. The resin layer is made of a different material from the thermosetting resin layer D1, and may be, for example, a polyimide layer. When the rigid layer D2 is the resin layer, it tends to have excellent pickability even without performing a thermosetting treatment on the thermosetting resin layer D1 after it has been diced into individual pieces. The metal layer may be, for example, a copper layer or an aluminum layer. When the rigid layer D2 is the metal layer, in addition to excellent pickability, it tends to have excellent visibility in the pick-up process due to the optical contrast between the resin material and the metal material.

[0051] The ratio of the thickness of the thermosetting resin layer D1 to the thickness of the structural part 3 made of film D (thickness of thermosetting resin layer D1 / thickness of structural part 3) may be 0.1 to 0.8, 0.2 to 0.7, or 0.2 to 0.6. When the ratio is 0.1 or higher, for example, there is a tendency to be excellent in suppressing positional displacement after the individual pieces are placed. When the ratio is 0.8 or lower, there is a tendency to be excellent in pick-up performance. The thickness of the thermosetting resin layer D1 may be, for example, 5 to 120 μm or 10 to 60 μm. The thickness of the rigid material layer D2 may be, for example, 20 to 80 μm or 20 to 60 μm.

[0052] The structural part 3, made of film D, may be formed by, for example, punching a punch blade or the like to cut a film substrate (raw material) for forming individual pieces into a desired shape (this can also be rephrased as "(pre)cut" or "cut"). The shape of the structural part 3 in plan view may be, for example, a circle as shown in Figure 2(a), or a rectangle (square or rectangle). If the shape of the structural part 3 in plan view is circular, the diameter of the structural part 3 may be, for example, 290 to 340 mm or 310 to 335 mm.

[0053] The second support film 2a can be similar to the film exemplified for the first support film 1a. The thickness of the second support film 2a may be, for example, 1 to 200 μm, 50 to 170 μm, or 70 to 130 μm.

[0054] The second adhesive layer 2b is a layer containing (consisting of) an adhesive. The second adhesive layer 2b may be an adhesive layer. The adhesive may be an adhesive commonly used in the field, and may be either a non-UV curing adhesive or a UV curing adhesive. That is, the second adhesive layer 2b may be either a non-UV curing adhesive layer or a UV curing adhesive layer. Examples of non-UV curing adhesives are those similar to the non-UV curing adhesive exemplified in the first adhesive layer 1b. UV curing adhesives are adhesives that have the property of decreasing tackiness upon irradiation with ultraviolet light, and conventionally known adhesives can be used. Examples of UV curing adhesives include resins having photoreactive carbon-carbon double bonds. More specifically, examples include acrylic resin-based adhesives. The thickness of the second adhesive layer 2b may be, for example, 1 to 100 μm.

[0055] The shape of the dicing film 2 in plan view can be adjusted as appropriate to match the shape of film D. The dicing film 2 may be obtained by, for example, punching a die or the like to cut (pre-cut) a dicing film base material (raw material) into a desired shape. The shape of the dicing film 2 in plan view may be, for example, a circle as shown in Figure 2(a), or a rectangle (square or rectangle). If the shape of the dicing film 2 in plan view is circular, the diameter of the dicing film 2 may be, for example, 290 to 500 mm or 310 to 400 mm.

[0056] The thickness of the dicing film 2 (the sum of the thickness of the second support film 2a and the second adhesive layer 2b) may be, for example, 5 to 200 μm, 15 to 170 μm, or 30 to 140 μm.

[0057] In the laminated film 10, it is preferable that the 30° peel strength (first peel strength) of the adhesive film 1 (first adhesive layer 1b) relative to the structural part 3 (rigid layer D2) made of film D is lower than the 30° peel strength (second peel strength) of the dicing film 2 (second adhesive layer 2b) relative to the structural part 3 (thermosetting resin layer D1) made of film D. Due to this relationship in peel strength, in the laminated film 10, the adhesive film 1 is easier to peel off before the dicing film 2.

[0058] The first peel strength may be, for example, 0.5 N / 25 mm or less, or 0.4 N / 25 mm or less, or 0.3 N / 25 mm or less. The lower limit of the first peel strength may be, for example, 0.1 N / 25 mm or more. The first peel strength can be measured by the following method. First, a laminated film 10 is prepared and cut out to a width of 25 mm and a length of 100 mm to create a measurement sample. Next, the dicing film 2 is peeled off from the measurement sample and the film D side of the measurement sample is fixed to a metal support plate. With the measurement sample fixed, the first peel strength can be measured by peeling off the adhesive film 1 under the conditions of a measurement temperature of 25°C, a peeling angle of 30°, and a peeling speed of 60 mm / min.

[0059] The second peel strength may be greater than 0.5 N / 25 mm, and may be 1.0 N / 25 mm or greater, or 2.0 N / 25 mm or greater. The upper limit of the second peel strength may be, for example, 5.0 N / 25 mm or less. The second peel strength can be measured by the following method. First, a laminated film 10 is prepared, and a measurement sample is made by cutting it to a width of 25 mm and a length of 100 mm. Next, the adhesive film 1 is peeled off from the measurement sample, and the film D side of the measurement sample is fixed to a metal support plate. With the measurement sample fixed, the second peel strength can be measured by peeling off the dicing film 2 under the conditions of a measurement temperature of 25°C, a peeling angle of 30°, and a peeling speed of 60 mm / min.

[0060] When a portion of the dicing film 2 (second adhesive layer 2b) is in contact with the adhesive film 1 (first adhesive layer 1b), the 90° peel strength (third peel strength) of the adhesive film 1 (first adhesive layer 1b) relative to the dicing film 2 (second adhesive layer 2b) may be, for example, 0.2 N / 25 mm or less, or 0.1 N / 25 mm or less, or 0.05 N / 25 mm or less. The lower limit of the third peel strength may be, for example, 0.01 N / 25 mm or more. The third peel strength can be measured by the following method. First, a laminated film 10 is prepared, and a measurement sample is made by cutting it to a width of 25 mm and a length of 200 mm. Next, the dicing film 2 side of the measurement sample is fixed to a metal support plate. With the measurement sample fixed, the third peel strength can be measured by peeling off the adhesive film under the conditions of a measurement temperature of 25°C, a peeling angle of 90°, and a peeling speed of 50 mm / min. If the third peel strength is within the above range, the adhesive film 1 can be easily peeled off from the laminated film 10.

[0061] With the laminated film 10, even when the first adhesive layer 1b and the second surface 1aY of the first support film 1a are stuck together, separation of the first adhesive layer 1b and the second surface 1aY of the first support film 1a becomes easy during unwinding, and problems when unwinding the laminated film 10 can be sufficiently suppressed.

[0062] With the laminated film 10, when the structural part 3 made of film D is diced to form individual pieces, the thermosetting resin layer on the outermost surface is absent. As a result, delamination between the thermosetting resin layer on the outermost surface and the rigid material layer does not occur, and burrs that are presumed to originate from the thermosetting resin layer and are generated on the cut surface (side) of the dicing line are also reduced. This makes it possible to sufficiently suppress defects that occur when the film for forming individual pieces is diced to form individual pieces.

[0063] The laminated film 10 may be used in the manufacturing process of a semiconductor device. The individual pieces formed from the laminated film 10 can be used, for example, as support pieces in a semiconductor device having a dolmen structure including a substrate, a first chip disposed on the substrate, a plurality of support pieces disposed on the substrate around the first chip, and a second chip supported by the plurality of support pieces and disposed to cover the first chip.

[0064] Furthermore, the individual pieces formed from the laminated film 10 can be used as reinforcing materials for semiconductor chips, for example, by attaching them to semiconductor chips. The individual pieces formed from the laminated film 10 can be manufactured by a method including steps (A) to (C) in the semiconductor device manufacturing method described later.

[0065] [Method for manufacturing laminated film for forming individual fragments] Figures 3(a), (b), and (c), and Figures 4(a), (b), and (c) are schematic cross-sectional views illustrating the manufacturing process of a laminated film for forming individual pieces. The manufacturing method of the laminated film 10 comprises the steps of: preparing a first laminate 20 comprising a first support film 1a, a first adhesive layer 1b, and a film substrate DA for forming individual pieces (hereinafter sometimes simply referred to as "film substrate DA") in this order (first step); die-cutting the film substrate DA in the first laminate 20 to produce a second laminate 30 comprising a structural part 3 made of a plurality of films D (second step); and laminating a second adhesive layer 2b and a second support film 2a on the plurality of structural parts 3 of the second laminate 30 in this order to produce a plurality of laminated structural parts 5 (third step). The film substrate DA may be a raw roll of film D.

[0066] The first step is to prepare the first laminate 20. The manufacturing method of the first laminate 20 is not particularly limited as long as a laminate with the said configuration can be obtained, but it can be obtained by placing the rigid layer D2 side of a film substrate DA having a thermosetting resin layer D1 and a rigid layer D2 on the first adhesive layer 1b of an adhesive film 1 having a first support film 1a and a first adhesive layer 1b provided on the first support film 1a, and then bonding the adhesive film 1 and the film substrate DA together (see Figure 3(a)).

[0067] The thermosetting resin layer D1 can be formed, for example, by applying a thermosetting resin composition onto a support film. In forming the thermosetting resin layer D1, a varnish of the thermosetting resin composition (thermosetting resin varnish) may be used. When using a thermosetting resin varnish, the above components are mixed or kneaded in a solvent to prepare a thermosetting resin varnish, the obtained thermosetting resin layer D1 can be obtained by applying the thermosetting resin varnish onto a support film, and removing the solvent by heating and drying.

[0068] The support film is not particularly limited as long as it can withstand the above-mentioned heat drying, but may be, for example, polyester film, polypropylene film, polyethylene terephthalate (PET) film, polyimide film, polyetherimide film, polyethylene naphthalate film, polymethylpentene film, etc. The support film may be a multilayer film made by combining two or more types, and its surface may be treated with a release agent such as silicone or silica. The thickness of the support film may be, for example, 10 to 200 μm or 20 to 170 μm.

[0069] Mixing or kneading can be carried out using conventional agitators, mixers, three-roll mills, ball mills, and other dispersers, in appropriate combinations.

[0070] The solvent used in the preparation of thermosetting resin varnishes is not limited as long as it can uniformly dissolve, knead, or disperse each component, and conventionally known solvents can be used. Examples of such solvents include ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone, as well as dimethylformamide, dimethylacetamide, N-methylpyrrolidone, toluene, and xylene.

[0071] Known methods can be used to apply the thermosetting resin varnish onto the support film, such as the knife coating method, roll coating method, spray coating method, gravure coating method, bar coating method, and curtain coating method. Heat drying is not particularly limited as long as the conditions allow the solvent used to evaporate sufficiently, but it can be carried out in the range of 50 to 150°C for 1 to 30 minutes. Heat drying can be carried out in stages with different heating temperatures and different heating times.

[0072] The film substrate DA can be obtained by bonding a thermosetting resin layer D1 and a rigid material layer D2 with a heated rubber roll.

[0073] The first laminate 20 can also be obtained by preparing a film substrate DA by laminating a rigid material layer D2 and a thermosetting resin layer D1 in that order on the first adhesive layer 1b of the adhesive film 1. In this case, after bonding the first adhesive layer 1b and the rigid material layer D2 of the adhesive film 1, the thermosetting resin layer D1 can be provided by applying a thermosetting resin varnish to the rigid material layer D2.

[0074] The second step is to produce the second laminate 30. Here, the film substrate DA of the first laminate 20 produced is cut in the direction X from the top surface of the film substrate DA at position L1 using a punching blade or the like to make it a desired shape (for example, circular), thereby die-cutting (pre-cutting, cutting), and the second laminate 30 having a structural part 3 made of multiple films D can be produced (see Figures 3(b) and (c), first pre-cutting process). The cut made when die-cutting the film substrate DA may reach a part of the adhesive film 1. In addition, unnecessary parts of the die-cut film substrate DA are usually removed.

[0075] The second laminate 30 comprises a first support film 1a having a first surface 1aX and a second surface 1aY opposite to the first surface 1aX, and an adhesive film 1 having a first adhesive layer 1b containing a non-UV curing adhesive provided on the first surface 1aX, and a plurality of structural parts 3 made of film D provided spaced apart on the first adhesive layer 1b of the adhesive film 1. Here, film D is a film that is divided into multiple individual pieces by dicing. The structural part 3 has a thermosetting resin layer D1 and a rigid material layer D2 having higher rigidity than the thermosetting resin layer D1. The rigid material layer D2 in the structural part 3 is laminated on the first adhesive layer 1b. In a measurement sample obtained by bonding the second surface 1aY of the first support film 1a to the first adhesive layer 1b of the adhesive film 1, the adhesive force of the first adhesive layer 1b of the adhesive film 1 to the second surface 1aY of the first support film 1a is 1.5 N / m or less.

[0076] Furthermore, the inventors' studies have shown that the presence of a first adhesive layer 1b in the adhesive film 1 suppresses delamination between the first support film 1a and the rigid material layer D2. The inventors' studies have also shown that the presence of a first adhesive layer 1b in the adhesive film 1 allows for efficient removal of foreign matter (e.g., resin residue) adhering to the structural part 3 made of the film substrate DA or film D during the manufacturing process. Therefore, the presence of a first adhesive layer 1b in the adhesive film 1 makes it possible to improve the yield in die-cutting of the film substrate DA. Foreign matter can be removed, for example, when peeling off the adhesive film 1 when using the laminated film 10. Since the peeled adhesive film 1 is usually discarded, the foreign matter, by adhering to the first adhesive layer 1b of the adhesive film 1, is removed from the structural part 3 made of the film substrate DA or film D and discarded together with the adhesive film 1. Furthermore, the adhesive film 1 functions as a protective layer for the second adhesive layer 2b, which may be exposed by die-cutting the film substrate DA. For example, it can prevent foreign matter from adhering to the second adhesive layer 2b during the transport or shipping process.

[0077] When the film substrate DA is die-cut into a desired shape (e.g., a circle), a first notch may be formed on the surface of the adhesive film 1 along the outer edge of the die-cut desired shape. The depth of the first notch may be, for example, less than the thickness of the adhesive film 1 and 25 μm or less.

[0078] The third step is to form multiple laminated structural parts by laminating a second adhesive layer 2b and a second support film 2a in this order onto the thermosetting resin layer D1 of the structural part 3, which consists of multiple films D (see Figures 4(a) and (b)). As a method for laminating the second adhesive layer 2b and the second support film 2a in this order, for example, a dicing film substrate 2A having a second support film 2a and a second adhesive layer 2b provided on the second support film 2a is placed so as to cover the entire surface of the thermosetting resin layer D1 of the structural part 3, which consists of multiple films D, and the placed dicing film substrate 2A is cut in the direction Y from the top surface of the dicing film substrate 2A at position L2 using a punching blade or the like to make it a desired shape (for example, a circle) (see Figure 4(b), second pre-cutting process). When the dicing film substrate 2A is laminated onto the surface of the thermosetting resin layer D1 of the structural part 3, a portion of the second adhesive layer 2b of the dicing film substrate 2A may or may not be in contact with the first adhesive layer 1b of the adhesive film 1 (see Figure 4(b)). Also, the dicing film substrate 2A (dicing film 2) may be in contact with the side surface of the film D. The cut made when die-cutting the dicing film substrate 2A may reach a portion of the adhesive film 1.

[0079] In addition, unnecessary portions of the die-cut dicing film substrate 2A are usually removed. As a result, a portion of the surface of the first adhesive layer 1b of the adhesive film 1 opposite to the first support film 1a is not covered by the structural part 3, the second adhesive layer 2b, and the second support film 2a (the structural part 3, the second adhesive layer 2b, and the second support film 2a are not positioned on this part), and is exposed (see Figures 1 and 2).

[0080] The dicing film substrate 2A may be the raw material for the dicing film 2. Commercially available products can be used for the dicing film substrate 2A. Alternatively, the dicing film substrate 2A can be obtained, for example, by preparing a varnish (adhesive varnish) for the adhesive (non-UV curable adhesive or UV curable adhesive) that constitutes the second adhesive layer 2b, applying the adhesive varnish onto the second support film 2a, and then removing the solvent by heating and drying. The solvent used when applying the adhesive varnish onto the second support film 2a, the method of applying the adhesive varnish, the method of removing the solvent, etc., may be the same as, for example, the solvent, the method of applying the adhesive varnish, the method of removing the solvent, etc., used when applying the thermosetting resin varnish onto the support film.

[0081] When the dicing film substrate 2A is die-cut into a desired shape (e.g., a circle), a second cut may be formed on the surface of the adhesive film 1 along the outer edge of the die-cut desired shape. The depth of the second cut may be, for example, less than the thickness of the adhesive film 1 and 25 μm or less.

[0082] [Coiled body] The wound body comprises a core and the laminated film for forming individual pieces, which is wound around the core. The wound body can be obtained by winding the laminated film for forming individual pieces around the core.

[0083] The shape of the core may be, for example, approximately cylindrical. The approximately cylindrical core may have, for example, an outer diameter of 8 to 20 mm (diameter of the cross-section perpendicular to the longitudinal direction) and a length of 100 to 240 mm (length in the longitudinal direction). The material of the core may be, for example, a plastic material such as ABS (Acrylonitrile-butadiene-styrene) resin. It may be something like this.

[0084] [Semiconductor device and method for manufacturing the same] <First Embodiment> Figure 5 is a schematic cross-sectional view showing a first embodiment of the semiconductor device of the present disclosure. The semiconductor device 100 shown in Figure 5 comprises a substrate 40, a chip T1 (first chip) disposed on the surface of the substrate 40, a plurality of support pieces DXc disposed on the surface of the substrate 40 around the chip T1, a chip T2 (second chip) disposed above the chip T1, an adhesive piece Tc sandwiched between the chip T2 and the plurality of support pieces DXc, chips T3 and T4 laminated on the chip T2, a plurality of wires w that electrically connect electrodes (not shown) on the surface of the substrate 40 to chips T1 to T4, and a sealing material 50 filled in the gap between chip T1 and chip T2, etc. The support pieces DXc may be cured products of individualized bodies formed by separating a film D into individual pieces.

[0085] In this embodiment, a dolmen structure is formed on the substrate 40 by a plurality of support pieces DXc, a chip T2, and an adhesive piece Tc located between the support pieces DXc and the chip T2. The chip T1 is spaced apart from the adhesive piece Tc. By appropriately setting the thickness of the support pieces DXc, space can be secured for the wire w that connects the upper surface of the chip T1 to the substrate 40. Because the chip T1 is spaced apart from the adhesive piece Tc, a short circuit of the wire w connected to the chip T1 can be prevented by the upper part of the wire w coming into contact with the chip T2. In addition, since there is no need to embed the wire in the adhesive piece Tc that comes into contact with the chip T2, there is an advantage that the adhesive piece Tc can be made thinner.

[0086] As shown in Figure 5, the adhesive piece Tc between chip T1 and chip T2 covers the region R on chip T2 facing chip T1 and extends continuously from region R to the periphery of chip T2. In other words, one adhesive piece Tc covers region R on chip T2 and is interposed between chip T2 and multiple support pieces, bonding them together. Note that Figure 5 illustrates an embodiment in which the adhesive piece Tc is provided so as to cover the entire surface (bottom surface) of one side of chip T2. However, since the adhesive piece Tc may shrink during the manufacturing process of the semiconductor device 100, it is sufficient for it to substantially cover the entire surface (bottom surface) of one side of chip T2, and for example, there may be areas on the periphery of chip T2 that are not covered by the adhesive piece Tc. The bottom surface of chip T2 in Figure 5 corresponds to the back surface of the chip. The back surface of modern chips often has irregularities. By covering substantially the entire back surface of chip T2 with the adhesive piece Tc, it is possible to suppress the occurrence of cracks or fractures in chip T2.

[0087] The substrate 40 may be an organic substrate or a metal substrate such as a lead frame. From the viewpoint of suppressing warping of the semiconductor device 100, the thickness of the substrate 40 may be, for example, 90 to 300 μm, or 90 to 210 μm.

[0088] The chip T1 is, for example, a controller chip, which is bonded to the substrate 40 by an adhesive piece T1c and electrically connected to the substrate 40 by a wire w. The shape of the chip T1 in plan view is, for example, rectangular (square or rectangle). The length of one side of the chip T1 is, for example, 5 mm or less, and may be 2 to 5 mm or 1 to 5 mm. The thickness of the chip T1 is, for example, 10 to 150 μm, and may be 20 to 100 μm.

[0089] Chip T2 is, for example, a memory chip, and is bonded to support piece DXc via adhesive piece Tc. In plan view, chip T2 is larger in size than chip T1. In plan view, the shape of chip T2 is, for example, a rectangle (square or rectangle). The length of one side of chip T2 is, for example, 20 mm or less, and may be 4 to 20 mm or 4 to 12 mm. The thickness of chip T2 is, for example, 10 to 170 μm, and may be 20 to 120 μm. Chips T3 and T4 are also, for example, memory chips, and are bonded to chip T2 via adhesive piece Tc. The length of one side of chips T3 and T4 may be the same as that of chip T2, and the thickness of chips T3 and T4 may also be the same as that of chip T2.

[0090] The support piece DXc acts as a spacer, forming a space around the chip T1. The support piece DXc comprises a layer made of a cured thermosetting resin composition (a layer obtained by curing the thermosetting resin layer) and a rigid layer, arranged in this order from the substrate 40. As shown in Figure 6(a), two support pieces DXc (rectangular shape) may be placed at separate positions on both sides of the chip T1, or as shown in Figure 6(b), one support piece DXc (square shape, a total of four) may be placed at positions corresponding to the corners of the chip T1. The length of one side of the support piece DXc in plan view is, for example, 20 mm or less, and may be 1 to 20 mm or 1 to 12 mm. The thickness (height) of the support piece DXc is, for example, 10 to 180 μm, and may be 20 to 120 μm.

[0091] Next, a method for manufacturing the semiconductor device 100 will be described. The manufacturing method of this embodiment includes the following steps (A) to (G). The manufacturing method of this embodiment may further include the following step (H). (A) The adhesive film 1 comprises a first support film 1a having a first surface 1aX and a second surface 1aY opposite to the first surface 1aX, and a first adhesive layer 1b containing a non-UV curing adhesive provided on the first surface 1aX, and a laminated structural part 5X having a structural part 3X consisting of a support piece forming film DX (hereinafter sometimes simply referred to as "film DX") provided spaced apart on the first adhesive layer 1b of the adhesive film 1, a second adhesive layer 2b, and a second support film 2a in this order from the first adhesive layer 1b, wherein the structural part 3X comprises a thermosetting resin layer D1 and a rigid material layer D2 having higher rigidity than the thermosetting resin layer D1. The process of preparing a laminated film 10X for forming a support piece (hereinafter sometimes simply referred to as "laminated film 10X") is as follows (see Figure 7): The rigid material layer D2 in the structural part 3X is laminated on the first adhesive layer 1b, a portion of the surface of the first adhesive layer 1b of the adhesive film 1 opposite to the first support film 1a is exposed, and in a measurement sample obtained by bonding the second surface 1aY of the first support film 1a to the first adhesive layer 1b of the adhesive film 1, the adhesive force of the first adhesive layer 1b to the second surface 1aY of the first support film 1a is 1.5 N / m or less, as measured at 25°C under conditions of a peeling angle of 90° and a peeling speed of 50 mm / min. (B) A step of forming a plurality of support pieces DXa on the surface of the second adhesive layer 2b by dicing the structural part 3X made of film DX (see Figure 8(b)). (C) Step of picking up the support piece DXa from the second adhesive layer 2b (see Figure 8(d)) (D) Step of placing chip T1 on substrate 40 (E) A step of arranging a plurality of support pieces DXa on the substrate 40 around the chip T1 or around the area where the chip T1 is to be placed (see Figure 9) (F) A step to prepare an adhesive chip T2a comprising a chip T2 and an adhesive piece Ta provided on one surface of the chip T2 (see Figure 10). (G) A step of constructing a dolmen structure by placing adhesive chips T2a on the surface of multiple support pieces DXc (see Figure 11). (H) A step of sealing the gap between chip T1 and chip T2 with sealing material 50 (see Figure 5)

[0092] (A) Process Step (A) is a step of preparing the laminated film 10X. The laminated film 10X can be the laminated film 10 described above. In this case, the structural part 3 made of film D becomes the structural part 3X made of film DX, and the laminated structural part 5 becomes the laminated structural part 5X. When using the laminated film 10X, the adhesive film 1 is peeled off at an appropriate timing. The timing for peeling off the adhesive film 1 may be, for example, between steps (A) and (B).

[0093] (B) Process and (C) Process Step (B) is a step of forming a plurality of support pieces DXa on the surface of the second adhesive layer 2b by dicing the structural part 3X made of film DX, and step (C) is a step of picking up the support pieces DXa from the second adhesive layer 2b. As shown in Figure 8(a), a dicing ring DR is attached to the laminate obtained by peeling the adhesive film 1 from the laminated film 10X. That is, the dicing ring DR is attached to the second adhesive layer 2b of the laminated film 10X, and the structural part 3X made of film DX is positioned inside the dicing ring DR. In this state, the structural part 3X made of film DX is divided into individual pieces by dicing (see Figure 8(b)). This makes it possible to obtain a large number of support pieces DXa from the structural part 3X made of film DX. Subsequently, if the second adhesive layer 2b is an ultraviolet-curable adhesive layer, the adhesive force between the second adhesive layer 2b and the support pieces DXa is reduced by irradiating the second adhesive layer 2b with ultraviolet light. As shown in Figure 8(c), the support pieces DXa are separated from each other by expanding the second support film 2a. As shown in Figure 8(d), the support pieces DXa are peeled from the second adhesive layer 2b by pushing them up with the push-up jig 42, and the support pieces DXa are picked up by suction with the suction collet 44. The curing reaction of the thermosetting resin layer D1 may be advanced by heating the structural part 3X made of film DX before dicing or the support pieces DXa before picking. The pick-up performance tends to be better when the support pieces DXa are moderately cured at the time of picking. It is preferable that the cuts for individualization are formed up to the outer edge of the structural part 3X made of film DX.

[0094] (D) Process Step (D) is the step of placing the chip T1 on the substrate 40. For example, first, the chip T1 is placed at a predetermined position on the substrate 40 via an adhesive piece T1c. Then, the chip T1 is electrically connected to the substrate 40 with a wire w. Step (D) may be performed before step (E), before step (A), between step (A) and step (B), between step (B) and step (C), or between step (C) and step (E).

[0095] (E) Process Step (E) is a step of placing a plurality of support pieces DXa on the substrate 40 around the chip T1 or around the area where the chip T1 is to be placed. After step (E), the structure 60 shown in Figure 7 is manufactured. The structure 60 comprises the substrate 40, the chip T1 placed on its surface, and the plurality of support pieces DXa. The placement of the support pieces DXa can be done by a crimping process. The crimping process can be performed, for example, at a temperature of 80 to 180°C and a pressure of 0.01 to 0.50 MPa for 0.5 to 3.0 seconds. The support pieces DXa may be completely hardened and become support pieces DXc at the time of step (E), or they may not be completely hardened at this point. It is preferable that the support pieces DXa are completely hardened and become support pieces DXc before the start of step (G).

[0096] (F) Process Step (F) is a step of preparing an adhesive chip T2a, which comprises a chip T2 and an adhesive piece Ta provided on one surface of the chip T2. The adhesive chip T2a comprises a chip T2 and an adhesive piece Ta provided on one surface thereof. The adhesive chip T2a can be obtained, for example, by using a semiconductor wafer and a dicing-die bonding integrated film, through a dicing step and a pick-up step.

[0097] (G) Process Step (G) is the process of positioning the adhesive chip T2a above the chip T1 such that the adhesive chip Ta is in contact with the upper surface of multiple support pieces DXc. Specifically, the chip T2 is pressed onto the upper surface of the support piece DXc via the adhesive chip Ta. The pressing process can be carried out for 0.5 to 3.0 seconds under conditions of 80 to 180°C and 0.01 to 0.50 MPa. Next, the adhesive chip Ta is cured by heating. The curing process can be carried out for 5 minutes or more under conditions of 60 to 175°C and 0.01 to 1.0 MPa. This causes the adhesive chip Ta to harden and become the adhesive chip Tc. Through this process, a dolmen structure is constructed on the substrate 40 (see Figure 11). Because the chip T1 is separated from the adhesive chip T2a, a short circuit of the wire w due to the upper part of the wire w coming into contact with the chip T2 can be prevented. Furthermore, since there is no need to embed a wire in the adhesive piece Ta that comes into contact with the chip T2, there is the advantage that the adhesive piece Ta can be made thinner.

[0098] (G) After step (G) and before step (H), chip T3 is placed on chip T2 via an adhesive piece, and then chip T4 is placed on chip T3 via an adhesive piece. The adhesive piece can be any thermosetting resin composition similar to the adhesive piece Ta described above, and will become an adhesive piece Tc upon heat curing (see Figure 5). On the other hand, chips T2, T3, and T4 are electrically connected to the substrate 40 with wires w. Note that the number of chips stacked on top of chip T1 is not limited to the three in this embodiment and can be set as appropriate.

[0099] (H) Process Step (H) is a process in which the gap between chip T1 and chip T2 is sealed with sealing material 50. After step (H), the semiconductor device 100 shown in Figure 5 can be obtained.

[0100] <Second Embodiment> Figure 12 is a schematic cross-sectional view showing a second embodiment of the semiconductor device of the present disclosure. In the semiconductor device 100 of the first embodiment, the chip T1 is spaced apart from the adhesive piece Tc, whereas in the semiconductor device 200 of this embodiment, the chip T1 is in contact with the adhesive piece Tc. That is, the adhesive piece Tc is in contact with the upper surface of the chip T1 and the upper surface of the support piece DXc. For example, by appropriately setting the thickness of the structural part 3X made of film DX, the position of the upper surface of the chip T1 and the position of the upper surface of the support piece DXc can be made to coincide.

[0101] In the semiconductor device 200, the chip T1 is connected to the substrate 40 by flip-chip connection rather than wire bonding. However, by configuring the wire w to be embedded in the adhesive piece Ta, it is possible to achieve a configuration where the chip T1 is wire-bonded to the substrate 40, and the chip T1 is in contact with the adhesive piece Tc. The adhesive piece Ta, together with the chip T2, constitutes the adhesive piece-attached chip T2a (see Figure 10).

[0102] As shown in Figure 12, the adhesive piece Tc between tip T1 and tip T2 covers the region R on tip T2 facing tip T1 and extends continuously from region R to the periphery of tip T2. This single adhesive piece Tc covers region R on tip T2 and is interposed between tip T2 and multiple support pieces, bonding them together. The lower surface of tip T2 in Figure 12 corresponds to the back surface. As described above, the back surface of modern tips often has irregularities. By covering substantially the entire back surface of tip T2 with the adhesive piece Tc, it is possible to suppress the occurrence of cracks or fractures in tip T2 even when the upper surface of tip T1 comes into contact with the adhesive piece Tc.

[0103] Although embodiments of the present disclosure have been described in detail above, the present disclosure is not limited to the above embodiments. For example, in the above embodiments, the case in which the second adhesive layer 2b is an ultraviolet-curable adhesive layer was illustrated, but the second adhesive layer 2b may be a non-ultraviolet-curable adhesive layer.

[0104] According to the laminated film for forming individual pieces of a laminated object of this disclosure, the adhesive strength of the first adhesive layer of the adhesive film to the second surface of the first support film is sufficiently low. Even if a portion of the first adhesive layer of the adhesive film of the laminated film for forming individual pieces of a laminated object [Examples]

[0105] The present disclosure will be described below with reference to examples, but the present disclosure is not limited to these examples.

[0106] (Reference example 1) [Preparation of adhesive film] As an adhesive film, we prepared TP-3336NS from the CosmoTack series (product name, manufactured by CosmoTec Co., Ltd.).

[0107] [Measurement of the adhesive strength (90° peel strength) of the adhesive layer of an adhesive film on a surface treated (silicone resin processing) of a support film] As the first support film, A31B (product name, Toyobo Co., Ltd.) was prepared. A31B is a film having a first surface that is not surface-treated and a second surface that is surface-treated (silicone resin processing), and the predetermined adhesive strength (90° peel strength) was measured using this film. First, the first support film was cut to a width of 25 mm and a length of 100 mm to prepare cut piece A. Next, the adhesive film was cut to a width of 25 mm and a length of 100 mm to prepare cut piece B. Subsequently, the measurement sample for Reference Example 1 was prepared by bonding the second surface of the first support film on cut piece A to the first adhesive layer of the adhesive film on cut piece B. Next, with the first support film side of the cut piece A of the measurement sample fixed, the 90° peel strength was measured by peeling off the first adhesive layer at 25°C under the conditions of a peel angle of 90° and a peel speed of 50 mm / min using a tensile testing machine (Shimadzu Corporation, Autograph AGS-1000). The 90° peel strength of the measurement sample in Reference Example 1 was 1.0 N / m.

[0108] (Reference example 2) [Measurement of the adhesive strength (90° peel strength) of the adhesive layer of the adhesive film on the untreated surface of the support film] A measurement sample for Reference Example 2 was prepared in the same manner as in Reference Example 1, except that the first surface of the first support film of cut-out piece A was bonded to the first adhesive layer of the adhesive film of cut-out piece B, and the 90° peel strength was measured. The 90° peel strength of the measurement sample for Reference Example 2 was 2.0 N / m. [Explanation of symbols]

[0109] 1…Adhesive film, 1a…First support film, 1aX…First surface, 1aY…Second surface, 2…Dicing film, 2A…Dicing film substrate, 2a…Second support film, 2b…Second adhesive layer, 3,3X…Structural part, 5,5X…Laminated structural part, 10…Laminated film for forming individual pieces, 10X…Laminated film for forming support pieces, 20…First laminate, 30…Second laminate, 40…Base Plate, 50...Sealing material, 60...Structure, 100, 200...Semiconductor equipment, D...Film for forming individual components, DA...Film substrate for forming individual components, DX...Film for forming support pieces, D1...Thermosetting resin layer, D2...Rigid layer, DXa...Support piece, DXc...Support piece (cured product), R...Region, T1, T2, T3, T4...Chip, T2a...Chip with adhesive piece, Ta...Adhesive piece, Tc...Adhesive piece (cured product).

Claims

1. A first support film having a first surface and a second surface opposite to the first surface, and an adhesive film having a first adhesive layer containing a non-UV curing adhesive provided on the first surface, A laminated structure comprising a plurality of structural parts made of individualized body-forming films, a second adhesive layer, and a second support film, arranged in this order from the first adhesive layer on the first adhesive layer of the adhesive film, spaced apart from each other, Equipped with, The structural part comprises a thermosetting resin layer and a rigid material layer having higher rigidity than the thermosetting resin layer. The rigid material layer in the structural part is laminated on the first adhesive layer, A portion of the surface of the first adhesive layer of the adhesive film that is opposite to the first support film is exposed. In a measurement sample obtained by bonding the second surface of the first support film and the first adhesive layer of the adhesive film, the adhesive strength of the first adhesive layer of the adhesive film to the second surface of the first support film is 1.5 N / m or less, measured at 25°C with a peeling angle of 90° and a peeling speed of 50 mm / min. Laminated film for forming individual fragments.

2. The second surface of the first support film is a surface that has been surface-treated. The surface treatment is at least one selected from the group consisting of embossing, matte finish, silicone resin coating, and fluororesin coating. A laminated film for forming individual pieces according to claim 1.

3. A method for manufacturing a laminated film for forming individual pieces according to claim 1 or 2, The aforementioned manufacturing method A step of preparing a first laminate comprising the first support film, the first adhesive layer, and a film substrate for forming individual pieces in this order, A step of die-cutting the individualized film substrate in the first laminate and producing a second laminate comprising the structural part made up of a plurality of individualized film substrates, A step of creating a plurality of laminated structural parts by laminating the second adhesive layer and the second support film on a plurality of the structural parts of the second laminate in this order, Equipped with, A method for manufacturing a laminated film for forming individual fragments.

4. The system comprises a core and a laminated film for forming individual pieces according to claim 1 or 2, wound around the core. A coiled body.

5. A first support film having a first surface and a second surface opposite to the first surface, and an adhesive film having a first adhesive layer containing a non-UV curing adhesive provided on the first surface, A structural part consisting of a film for forming individual pieces, which is provided spaced apart on the first adhesive layer of the adhesive film, Equipped with, The structural part comprises a thermosetting resin layer and a rigid material layer having higher rigidity than the thermosetting resin layer. The rigid material layer in the structural part is laminated on the first adhesive layer, In a measurement sample obtained by bonding the second surface of the first support film and the first adhesive layer of the adhesive film, the adhesive strength of the first adhesive layer of the adhesive film to the second surface of the first support film is 1.5 N / m or less, measured at 25°C with a peeling angle of 90° and a peeling speed of 50 mm / min. Laminated structure.

Images