A catalyst-granting bath for electroless plating, a method for producing an electroless plating target material containing a catalyst nucleus, a method for producing a material containing an electroless plating film, and a material containing an electroless plating film.

Abstract

To provide an electroless plating catalyst addition bath capable of obtaining excellent patternability even when skipping the post dip step of causing the non-deposition of electroless plating and capable of achieving both patternability and electroless plating depositability; a method for manufacturing a material to be electroless-plated including a catalyst nucleus using the electroless plating catalyst addition bath; a method for manufacturing a material including an electroless plating film; and the material including the electroless plating film.SOLUTION: An electroless plating catalyst application bath includes a palladium compound and aminocarboxylic acid.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a catalyst-imparting bath for electroless plating, a method for manufacturing an electroless plating target material containing a catalyst nucleus, a method for manufacturing a material containing an electroless plating film, and a material containing an electroless plating film.

Background Art

[0002] With the miniaturization and high density of electronic devices, the miniaturization of copper wiring patterns and between wirings on printed wiring boards and package boards (hereinafter also simply referred to as substrates) used therein has been progressing.

Summary of the Invention

Problems to be Solved by the Invention

[0003] As a result of intensive studies by the present inventors, the following has become clear. When performing electroless plating on a miniaturized copper wiring, even a slight out-of-pattern deposition easily connects between wirings, resulting in a short circuit, so high patternability is required.

[0004] When performing electroless plating such as nickel or palladium on a copper wiring, a catalyst-imparting (activator) step is required, and a technique for imparting a palladium catalyst is widely used. In this activator step, the palladium catalyst may remain between wirings, resulting in out-of-pattern deposition by electroless plating in a subsequent step.

[0005] In order to suppress electroless plating deposition between wirings, a post-dip step is performed after the activator step. As types of post-dip, there are those showing an effect of removing the remaining catalyst and those showing an effect of adsorbing to and inactivating the remaining catalyst. In both effects, it often affects the catalyst applied on the copper wiring pattern, and may inhibit electroless plating on the copper wiring pattern and lead to non-deposition.

[0006] As a result of diligent research by the inventors, the following has become clear. (1) Regarding the pattern issue When conventional activators are used on substrates with fine wiring and spacing, the catalyst is applied to unintended locations, resulting in electroless plating deposition in undesired areas. When electroless plating is performed on miniaturized copper wiring, even minor deposition outside the pattern can easily connect the wiring, causing short circuits. The following are possible explanations for the pattern recognition problem. (a) With the chemical solution adhering to the substrate during the activator process, the next step is water washing. (b) When palladium is brought into contact with an acidic chemical solution and then with neutral deionized water, it becomes unstable from its ionic state. Also, if the space between the wires (outside the pattern) becomes narrow, it may not be possible to completely wash it off with water. (c) When the material is brought into contact with the electroless plating bath, unstable palladium remaining outside the pattern acts as a reaction initiation point, resulting in deposition outside the pattern.

[0007] (2) Problems caused by post-dip When using conventional activators, it is necessary to remove the remaining catalyst and inactivate it by adsorption during the post-dip process. However, catalyst removal and inactivation often affect the catalyst applied within the wiring, which can lead to undeposited plating. The impact of this problem becomes greater as the substrate, wiring, and wiring spacing become smaller compared to conventional methods.

[0008] As described above, it has become clear that with conventional technology combining an activator and a post-dip process, it is difficult to achieve both pattern quality and electroless plating deposition quality as the copper wiring patterns and spaces between wiring on the substrate become smaller.

[0009] The present invention aims to solve the aforementioned problems newly identified by the inventors, and to provide a catalyst-granulating bath for electroless plating that can achieve good patternability even when the post-dip process, which causes non-deposition in electroless plating, is omitted, and that can achieve both patternability and deposition properties of electroless plating; a method for producing an electroless plating target material containing a catalyst nucleus using the electroless plating catalyst-granulating bath; a method for producing a material containing an electroless plating film; and a material containing an electroless plating film. [Means for solving the problem]

[0010] As a result of diligent research, the inventors of the present invention have discovered that by using a catalyst bath for electroless plating with a specific composition, good patternability can be obtained even without the post-dip step, which is the cause of non-deposition in electroless plating, and that both patternability and the deposition properties of electroless plating can be achieved, thus completing the present invention. In other words, the present invention (1) relates to a catalyst-granting bath for electroless plating containing a palladium compound and an aminocarboxylic acid.

[0011] The present invention (2) relates to a catalyst-granting bath for electroless plating according to the present invention (1), which contains a palladium compound at a palladium concentration of 1 to 1000 mg / L.

[0012] The present invention (3) relates to a catalyst-granting bath for electroless plating according to the present invention (1) or (2), containing 0.2 to 20 g / L of aminocarboxylic acid.

[0013] The present invention (4) relates to a catalyst-granting bath for electroless plating according to any one of the present inventions (1) to (3), which contains an inorganic acid.

[0014] The present invention (5) relates to a catalyst-granting bath for electroless plating according to any of the present inventions (1) to (4), wherein the pH is 6.5 or less.

[0015] The present invention (6) relates to a catalyst-granting bath for electroless plating according to any one of the present inventions (1) to (5), wherein the electroless plating is electroless plating on a material in which copper and / or a copper alloy is exposed on the surface.

[0016] The present invention (7) relates to a method for producing an electroless plating target material including a catalyst nucleus, comprising a catalyst application step of bringing the electroless plating target material into contact with a catalyst application bath for electroless plating described in any of the present inventions (1) to (6).

[0017] The present invention (8) relates to a method for producing a material including an electroless plating film, comprising a catalyst application step of bringing a material to be electroless plated into contact with a catalyst-applying bath for electroless plating described in any of the present inventions (1) to (6), and a step of performing an electroless plating treatment after the catalyst application step.

[0018] The present invention (9) relates to a material comprising a material on which a metal is exposed on its surface, a catalyst nucleus on the metal, and a coating on the catalyst nucleus, wherein the catalyst nucleus contains palladium and the coating is an electroless plating film. [Effects of the Invention]

[0019] According to the present invention, since the electroless plating catalyst bath contains a palladium compound and an aminocarboxylic acid, good patternability can be obtained even if the post-dip step, which causes non-deposition in electroless plating, is omitted, and both patternability and the deposition properties of electroless plating can be achieved. [Modes for carrying out the invention]

[0020] The catalyst-granulating bath (catalyst-granulating solution for electroless plating) of the present invention contains a palladium compound and an aminocarboxylic acid. As a result, good patternability can be obtained even without the post-dip step, which is a cause of non-deposition in electroless plating, and both patternability and deposition properties of electroless plating can be achieved.

[0021] The reason why the aforementioned effects are obtained in the electroless plating catalyst bath is presumed to be as follows. (1) Regarding the resolution of the pattern problem (a) The aminocarboxylic acid added as a complexing agent to the electroless plating catalyst bath (activator bath) of the present invention can form a complex with palladium (the metal provided as a catalyst) contained in the activator. (b) By forming a complex, palladium becomes less likely to become unstable when entering the water washing process, and it becomes easier to be washed away in the water washing process. (c) As a result, palladium existing outside the wiring is easily removed, and the reaction initiation points of electroless plating outside the wiring are reduced, so it is considered that the patternability is improved. (d) Since palladium on the copper wiring exists as metallic palladium by a substitution reaction, it is not washed away by water washing, so only palladium outside the wiring can be removed. As described above, a good patternability can be obtained by the catalyst-imparting bath for electroless plating of the present invention. (2) Regarding the solution of the problem (deposition property of electroless plating) by post-dip As described in the explanation of (1) above, since unnecessary palladium outside the wiring can be removed only by water washing, the conventional post-dip process becomes unnecessary. As a result, the problem related to the post-dip process, that is, the risk of non-deposition of electroless plating disappears, and a good deposition property of electroless plating can be obtained. As described above, the catalyst-imparting bath for electroless plating of the present invention can obtain good patternability even when omitting the post-dip process that causes non-deposition of electroless plating due to the synergistic effect of the palladium compound and aminocarboxylic acid, and can achieve both patternability and deposition property of electroless plating.

[0022] By applying a catalyst to a material to be electroless plated using the catalyst-granting bath for electroless plating of the present invention, an electroless plated material containing catalyst nuclei can be produced. As described above, this electroless plated material containing catalyst nuclei has fewer reaction initiation sites for electroless plating outside the wiring, and palladium, which acts as a reaction initiation site, is present on the wiring as a catalyst nuclei, resulting in excellent patternability and electroless plating deposition. Furthermore, by performing electroless plating treatment on this electroless plated material containing catalyst nuclei, electroless plating can be performed while suppressing deposition outside the pattern, and a material containing an electroless plated film can be produced. Because this material containing an electroless plated film has excellent patternability and electroless plating deposition, it is suitably used in printed circuit boards and package substrates with increasingly miniaturized copper wiring patterns and / or spaces between wiring, and is suitable for use in miniaturized and high-density electronic devices.

[0023] <Catalyst-inducing bath for electroless plating> The electroless plating catalyst bath of the present invention contains a palladium compound and an aminocarboxylic acid.

[0024] <<Palladium Compounds>> The palladium compound is deposited on the wiring, forming catalytic nuclei that serve as the reaction initiation points for electroless plating. The palladium compound is not particularly limited as long as it is soluble in the catalyst bath for electroless plating. Specific examples include inorganic and organic palladium salts, such as palladium chloride, palladium sulfate, palladium nitrate, palladium acetate, palladium bromide, palladium iodide, tetraamminepalladium hydrochloride, tetraamminepalladium sulfate, and dinitrodiamminepalladium. These may be used individually or in combination of two or more. Among these, palladium chloride and palladium sulfate are preferred.

[0025] The catalyst bath for electroless plating preferably contains a palladium compound at a concentration of 1 to 1000 mg / L, more preferably 3 to 200 mg / L, even more preferably 5 to 100 mg / L, and particularly preferably 10 to 100 mg / L. Within these ranges, it tends to be possible to achieve a better balance between patternability and electroless plating deposition.

[0026] In the catalyst bath for electroless plating, the content of metal compounds other than palladium compounds is preferably 0.1 mg / L or less, more preferably 0.05 mg / L or less, and even more preferably 0.01 mg / L or less, as a metal concentration. This tends to result in better effects of the present invention. Here, if multiple metals other than palladium are present, the metal concentration refers to the total concentration. The same applies to the concentrations of other components.

[0027] The palladium content in the catalyst bath for electroless plating, based on 100% by mass of metal, is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and particularly preferably 98% by mass or more, and may also be 100% by mass. This tends to allow for a better balance between patternability and electroless plating deposition.

[0028] <<Aminocarboxylic acid>> Aminocarboxylic acids form complexes with palladium; that is, aminocarboxylic acids function as complexing agents. The aminocarboxylic acid may be the L-isomer, D-isomer, or DL-isomer, but the L-isomer is preferred. Aminocarboxylic acids may be used alone or in combination of two or more. Furthermore, in this specification, aminocarboxylic acids are compounds having an amino group and a carboxyl group, so-called amino acids, but they may also be derivatives in which the amino group and / or carboxyl group have been derivatized. Of course, the amino group and / or carboxyl group may also form part of a ring.

[0029] The aminocarboxylic acid is not particularly limited as long as it can form a complex with palladium. In particular, the inventors' studies have shown that (1) aminocarboxylic acids and their derivatives containing a sulfur atom, and (2) aminocarboxylic acids and their derivatives with low hydrophobicity tend to provide a better balance between patternability and electroless plating deposition. For this reason, (1) aminocarboxylic acids and their derivatives containing a sulfur atom, and (2) aminocarboxylic acids and their derivatives with low hydrophobicity are preferred.

[0030] Examples of aminocarboxylic acids containing sulfur atoms and their derivatives include methionine, cysteine, and their derivatives. Preferred derivatives are alkylated or acetylated forms, such as methylated and ethylated forms.

[0031] As aminocarboxylic acids and their derivatives with low hydrophobicity, those with lower hydrophobicity than glycine (more hydrophilic than glycine) and their derivatives are preferred, with glycine as the reference. Specifically, examples include serine, glutamine, aspartic acid, arginine, lysine, asparagine, histidine, proline, and their derivatives. Among these, glutamine, histidine, aspartic acid, proline, and their derivatives are preferred, histidine, aspartic acid, proline, and their derivatives are more preferred, and histidine, proline, and their derivatives are even more preferred. Alkylated and acetylated derivatives are preferred.

[0032] The hydrophobicity of aminocarboxylic acids can be calculated according to Sereda et al, J. Chrom.., 676: 139-53, 1994. Table 1 shows the hydrophobicity indices of 20 amino acids calculated according to Sereda et al, J. Chrom.., 676: 139-53, 1994. In this specification, the hydrophobicity index is an indicator of the relative hydrophobicity of how well an aminocarboxylic acid dissolves in water. The values ​​in Table 1 were measured at pH 2 and are relative values ​​converted so that the values ​​of leucine and isoleucine, which have the highest hydrophobicity, are 100 relative to glycine, which has a value of 0. For aminocarboxylic acids that are more hydrophilic than glycine, the values ​​will be negative.

[0033] [Table 1]

[0034] According to Sereda et al, J. Chrom., 676: 139-53, 1994, the hydrophobicity (hydrophobic index) of aminocarboxylic acids (including aminocarboxylic acid derivatives) is preferably -1 or less, preferably -5 or less, more preferably -10 or less, and even more preferably -15 or less. The lower limit is not particularly limited, but preferably -50 or more. Within the above range, it tends to be possible to achieve a better balance between patternability and electroless plating deposition.

[0035] The catalyst bath for electroless plating preferably contains 0.2 to 20 g / L of aminocarboxylic acid, more preferably 0.5 to 15 g / L, and even more preferably 0.8 to 10 g / L. Within these ranges, aminocarboxylic acid and palladium tend to form a more appropriate complex, which tends to allow for a better balance between patternability and electroless plating deposition.

[0036] In the complexing agent contained in the electroless plating catalyst bath, the content of aminocarboxylic acid is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and particularly preferably 98% by mass or more, and may also be 100% by mass. This tends to allow for a better balance between patternability and electroless plating deposition.

[0037] In a catalyst bath for electroless plating, the ratio of aminocarboxylic acid concentration to palladium (metallic palladium (Pd)) concentration (aminocarboxylic acid concentration (g / L) / Pd concentration (g / L)) is preferably 10 to 1000, more preferably 20 to 500, and even more preferably 50 to 200. Within this range, aminocarboxylic acid and palladium tend to form a more appropriate complex, allowing for a better balance between patternability and electroless plating deposition.

[0038] In this specification, the metal concentrations, such as the palladium (metallic palladium (Pd)) concentration, in the electroless plating catalyst bath are measured using an ICP (manufactured by Horiba, Ltd.). Furthermore, in this specification, the aminocarboxylic acid concentration in the catalyst bath for electroless plating is measured by liquid chromatography (manufactured by Shimadzu Corporation).

[0039] < <ph>> The pH of the catalyst bath for electroless plating is preferably 6.5 or lower, more preferably 5.5 or lower, even more preferably 4.5 or lower, particularly preferably 3.5 or lower, most preferably 2.5 or lower, even more preferably 1.5 or lower, and still most preferably 1.0 or lower, with no particular lower limit. When the pH is 6.5 or lower, aminocarboxylic acid and palladium tend to form a more appropriate complex, which tends to allow for a better balance between patternability and electroless plating deposition. In this specification, the pH of the catalyst bath for electroless plating is the value measured at 25°C.

[0040] The pH of the catalyst bath for electroless plating can be adjusted by selecting the type of palladium compound and aminocarboxylic acid. Alkaline and acidic components may also be added as needed. The alkaline component is not particularly limited, but examples include sodium hydroxide and ammonium. The acidic component is not particularly limited, but examples include sulfuric acid and phosphoric acid. These alkaline and acidic components may be used individually or in combination of two or more. Inorganic acids are preferred.

[0041] Examples of inorganic acids include sulfuric acid, hydrochloric acid, nitric acid, carbonic acid, and phosphoric acid. Among these, sulfuric acid and hydrochloric acid are preferred.

[0042] The catalyst bath for electroless plating preferably contains 1 to 200 g / L of inorganic acid, more preferably 5 to 150 g / L, and even more preferably 10 to 100 g / L. Within this range, aminocarboxylic acid and palladium tend to form a more appropriate complex, which tends to allow for a better balance between patternability and electroless plating deposition.

[0043] The catalyst bath for electroless plating may contain a buffering agent to enhance its pH buffering capacity. The buffering agent is not particularly limited as long as it has buffering properties. For example, compounds that can buffer to a pH of 6.5 or lower include citric acid, tartaric acid, sodium salts, potassium salts, and ammonium salts of acetate. These may be used individually or in combination of two or more. The buffering agent concentration in the electroless plating catalyst bath is preferably 1.0 to 50 g / L, more preferably 5.0 to 30 g / L.

[0044] <> The catalyst-granting bath for electroless plating may also contain, along with the aforementioned components, components commonly used in catalyst-granting baths for electroless plating, such as Cu ion scavengers and surfactants.

[0045] The electroless plating catalyst bath of the present invention is suitably usable as an electroless plating catalyst bath for materials on which copper and / or copper alloys are exposed on the surface.

[0046] <Method for producing electroless plating target material containing catalyst nuclei (catalyst application method)> A method for producing an electroless plating target material containing a catalyst nucleus of the present invention (a method for applying a catalyst to an electroless plating target material of the present invention) includes a catalyst application step of bringing the electroless plating target material into contact with the electroless plating catalyst application bath of the present invention.

[0047] The material to be electroless plated is not particularly limited as long as it is a material in which metal is exposed on the surface. For example, the material may be made of one or a combination of materials such as glass fiber reinforced epoxy, polyimide, plastics such as PET, glass, ceramics, metal oxides, metals, paper, synthetic or natural fibers, and its shape may be any of plates, films, cloth, fibers, tubes, etc. Examples of metals exposed on the surface include copper, copper alloys, silver, silver alloys, gold, gold alloys, molybdenum, tungsten, etc. Among these, copper alloys, silver alloys, and gold alloys can be applied to alloys containing 50% or more by weight of copper, silver, or gold, respectively. In particular, it is preferable that the metal exposed on the surface is copper or a copper alloy. Specific examples of materials to be electroless plated include printed circuit boards, semiconductor packages, electronic components, ceramic substrates, etc. In these materials, the metal exposed on the surface may constitute wiring.

[0048] It is preferable that the material to be electroless plated has been pre-treated by known methods, such as cleaning treatments including degreasing, hot water washing, soft etching, acid cleaning, or pre-dipping.

[0049] The specific method for bringing the electroless plating target material into contact with the electroless plating catalyst bath of the present invention is not particularly limited, but usually, the workpiece can be immersed in the electroless plating catalyst bath of the present invention. In addition, the catalyst application treatment can also be performed by spraying or coating the catalyst bath onto the surface of the electroless plating target material.

[0050] In the catalyst application step, the liquid temperature of the catalyst application bath for electroless plating of the present invention is not particularly limited, but is generally preferably around 5 to 80°C, and more preferably around 15 to 50°C.

[0051] The processing time for the catalyst application step is not particularly limited, but is generally preferred to be around 5 seconds to 30 minutes, and more preferably around 15 seconds to 10 minutes.

[0052] By the method for producing an electroless plating target material containing the catalyst nucleus of the present invention (a method for applying a catalyst to an electroless plating target material of the present invention), a palladium-containing catalyst nucleus is formed on the surface metal of the electroless plating target material. The catalyst nucleus has a composition corresponding to the components (particularly the metal components) in the catalyst application bath for electroless plating of the present invention. For example, if the catalyst application bath for electroless plating of the present invention contains a metal element-containing compound, the catalyst nucleus contains palladium and the said metal.

[0053] The palladium content in the catalyst nucleus is preferably 80% by mass or more, more preferably 90% by mass or more, even more preferably 95% by mass or more, and particularly preferably 98% by mass or more, and may also be 100% by mass. This tends to allow for a better balance between patternability and electroless plating deposition.

[0054] In this specification, the content of each element in the catalyst nucleus is measured by ICP (manufactured by Horiba, Ltd.).

[0055] By electroless plating a material containing the catalyst nucleus, an electroless plating film can be formed with superior patternability and electroless plating deposition properties. Since the catalyst nucleus is for surface activation, the amount of catalyst is, for example, 2 μg / dm 2 Above, 2~100μg / dm 2 It can be.

[0056] <Method for manufacturing materials containing electroless plating films> The present invention provides a method for producing a material containing an electroless plating film (a method for electroless plating a material to be electroless plated according to the present invention), which includes a catalyst application step of bringing the material to be electroless plated into contact with the electroless plating catalyst bath of the present invention, and a plating step of performing electroless plating after the catalyst application step.

[0057] The catalyst application step is the same as the step described in the method for producing electroless plating material containing catalyst nuclei.

[0058] In the plating process, after the catalyst application step, electroless plating is performed on the electroless plating target material containing the catalyst nuclei obtained in the catalyst application step. Specifically, in the plating process, electroless plating is performed by bringing the electroless plating bath into contact with the electroless plating target material containing the catalyst nuclei obtained in the catalyst application step. This produces a material containing an electroless plating film.

[0059] There are no particular limitations on the electroless plating bath, and any self-catalytic electroless plating bath can be used. For example, electroless palladium plating baths, electroless palladium alloy plating baths, electroless copper plating baths, electroless copper alloy plating baths, electroless silver plating baths, electroless silver alloy plating baths, electroless nickel plating baths, electroless nickel alloy plating baths, electroless cobalt plating baths, electroless cobalt alloy plating baths, electroless gold plating baths, electroless gold alloy plating baths, etc., can be used. There are no particular limitations on the specific composition of these electroless plating baths; for example, any self-catalytic electroless plating bath with a known composition containing a reducing agent component may be used. The plating conditions should also follow the usual plating conditions depending on the type of plating bath used. Furthermore, these plating baths may be combined. That is, for example, a plating film may be formed using an electroless palladium plating bath, and then a plating film may be formed using an electroless nickel plating bath.

[0060] Preferably, the electroless plating baths are electroless palladium plating baths, electroless palladium alloy plating baths, electroless nickel plating baths, electroless nickel alloy plating baths, electroless cobalt plating baths, and electroless cobalt alloy plating baths, with electroless palladium plating baths, electroless palladium alloy plating baths, electroless nickel plating baths, and electroless nickel alloy plating baths being more preferable.

[0061] As described above, it is preferable not to perform a post-dip step in the present invention. Specifically, it is preferable not to perform a post-dip step between the catalyst application step and the plating step. This tends to allow for a better balance between patternability and the deposition properties of electroless plating. Furthermore, in the present invention, it is preferable to perform a water washing step after the catalyst application step. This removes unwanted palladium outside the wiring, eliminating the need for the conventional post-dip step. As a result, the problems associated with the post-dip step, namely the risk of non-deposition of electroless plating, are eliminated, and good electroless plating deposition properties are obtained.

[0062] The method for producing a material containing an electroless plating film of the present invention (the method for electroless plating a target material of the present invention) makes it possible to form an electroless plating film with excellent patternability and electroless plating deposition properties. The method for producing a material containing an electroless plating film of the present invention (the method for electroless plating a target material of the present invention) makes it possible to obtain a material having such an electroless plating film, specifically a material in which a metal is exposed on the surface, a catalyst nucleus on the metal, and a film on the catalyst nucleus, wherein the catalyst nucleus contains palladium and the film is an electroless plating film.

[0063] The processing conditions and various concentration settings described above are not limited to those conditions, and can be appropriately changed depending on the thickness of the film to be formed, etc.

[0064] The material containing the electroless plating film obtained by the present invention can be used in a variety of electronic components. Examples of electronic components include those used in home appliances, in-vehicle equipment, power transmission systems, transportation equipment, and communication equipment. Specifically, these include air conditioners, elevators, electric vehicles, hybrid vehicles, trains, power modules such as power control units for power generation equipment, general home appliances, and personal computers. [Examples]

[0065] The present invention will be described in detail based on the examples provided, but the present invention is not limited to these examples.

[0066] According to the conditions shown in Tables 4-7, each treatment was applied to a substrate with copper wiring widths of 50 μm and wiring spacing of 20 μm. Electroless nickel plating (nickel film thickness: 4 μm) or electroless palladium plating (palladium film thickness: 0.15 μm) was then performed, and the patternability was evaluated based on the degree of nickel or palladium deposition between the wirings. In this evaluation of pattern quality, for electroless nickel plating, a state where the spacing between wires is 10 μm or more after electroless nickel plating was evaluated as "good," a state where the wires are connected was evaluated as "bad," and a state where there are no connections between wires and the distance is less than 10 μm was evaluated as "good." Furthermore, for pattern evaluation, in the case of electroless palladium plating, a state where the distance between wires is 15 μm or more after electroless palladium plating was evaluated as "good," a state where the distance between wires is 10 to less than 15 μm was evaluated as "acceptable," and a state where the distance is less than 10 μm was evaluated as "unacceptable." Furthermore, the deposition performance of electroless plating was evaluated as follows: "○" indicated that electroless nickel or palladium was deposited, and "×" indicated that it was not deposited. The evaluation results are shown in Tables 4 to 7. Note that in Tables 4-7, the palladium concentrations shown are palladium elemental equivalent concentrations (mg / L). Furthermore, in Tables 2 and 3, the processes were carried out in the order listed above. As shown in Tables 4-7, the post-dipping process was not performed in the examples.

[0067] [Table 2]

[0068] [Table 3]

[0069] [Table 4]

[0070] [Table 5]

[0071] [Table 6]

[0072] [Table 7]

[0073] Tables 2-7 show that the electroless plating catalyst baths in the examples containing palladium compounds and aminocarboxylic acids can achieve good patternability even without the post-dip step, which is a cause of non-deposition in electroless plating, thus enabling a balance between patternability and electroless plating deposition.< / ph>

Claims

1. Contains palladium compounds and aminocarboxylic acids. A catalyst bath for electroless plating, wherein the aminocarboxylic acid is at least one selected from the group consisting of serine, glutamine, aspartic acid, arginine, lysine, asparagine, histidine, proline and their derivatives, and aminocarboxylic acids and their derivatives containing a sulfur atom.

2. A catalyst-granting bath for electroless plating according to claim 1, comprising a palladium compound at a palladium concentration of 1 to 1000 mg / L.

3. A catalyst-granting bath for electroless plating according to claim 1, comprising 0.2 to 20 g / L of aminocarboxylic acid.

4. A catalyst-granting bath for electroless plating according to claim 1, comprising an inorganic acid.

5. The catalyst-granting bath for electroless plating according to claim 1, wherein the pH is 6.5 or less.

6. The electroless plating catalyst bath according to claim 1, wherein the electroless plating is performed on a material in which copper and / or a copper alloy is exposed on the surface.

7. A method for producing an electroless plating material including a catalyst nucleus, comprising a catalyst application step of bringing the electroless plating material into contact with a catalyst-applying bath for electroless plating according to any one of claims 1 to 6.

8. A catalyst application step of bringing a material to be electroless plated into contact with a catalyst-applying bath for electroless plating according to any one of claims 1 to 6, and A process of electroless plating after the catalyst application process. A method for producing a material containing an electroless plating film, including the above.

9. The material includes a metal with an exposed surface, a catalyst nucleus on the metal, and a coating on the catalyst nucleus. The catalyst nucleus contains palladium, The aforementioned film is an electroless plating film, The electroless plating film is a material in which at least one is selected from the group consisting of electroless palladium plating films and electroless palladium alloy plating films.

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