Computing device
The computing device improves quantum bit gate operations by using cavity resonators and controlled signals to execute single and two-qubit gates efficiently, addressing the inefficiencies in existing technologies.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- KK TOSHIBA
- Filing Date
- 2023-08-28
- Publication Date
- 2026-06-24
AI Technical Summary
Existing computing devices face challenges in improving the characteristics of electronic circuits, particularly in executing quantum bit gate operations efficiently and at high speed.
The computing device incorporates a structure comprising cavity resonators and couplers, with controlled AC and DC signals applied to manipulate quantum states, enabling efficient single and two-qubit gate operations through frequency-variable transmon couplers.
Facilitates high-speed quantum bit gate operations with ease of scaling, enhancing the performance of computing devices by stabilizing and optimizing quantum bit operations.
Smart Images
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Abstract
Description
Technical Field
[0001] Embodiments of the present invention relate to a computing device.
Background Art
[0002] For example, an electronic circuit including a plurality of non-linear elements is used in a computing device. In the electronic circuit and the computing device, improvement of characteristics is desired.
Prior Art Documents
Non-Patent Documents
[0003]
Non-Patent Document 1
Non-Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] Embodiments of the present invention provide a computing device capable of improving characteristics.
Means for Solving the Problems
[0005] According to an embodiment of the present invention, the computing device includes an element section, a first conductive section, a second conductive section, a first coupling conductive section, and a control section. The element section includes a first structure, a second structure, and a first coupling structure. The first structure includes a first cavity resonator having a first resonant frequency, a first other cavity resonator having a first other resonant frequency, and a first coupler capable of coupling the first cavity resonator and the first other cavity resonator. The first other resonant frequency is lower than the first resonant frequency. The second structure includes a second cavity resonator having a second resonant frequency, a second other cavity resonator having a second other resonant frequency, and a second coupler capable of coupling the second cavity resonator and the second other cavity resonator. The second other resonant frequency is lower than the second resonant frequency. The first coupling structure is capable of coupling the first structure and the second structure. The control unit can supply a first AC signal containing an AC component to the first conductive part. The control unit can supply a second AC signal containing an AC component to the second conductive part. A first magnetic field generated from the first conductive part in response to the first AC signal is applied to the first coupler. A second magnetic field generated from the second conductive part in response to the second AC signal is applied to the second coupler. The control unit can supply a first DC pulse signal to the first coupling conductive part. A first coupling magnetic field generated from the first coupling conductive part in response to the first DC pulse signal is applied to the first coupling structure. [Brief explanation of the drawing]
[0006] [Figure 1] Figure 1 is a schematic plan view illustrating a computing device according to the first embodiment. [Figure 2] Figure 2 is a schematic perspective view illustrating a part of the computing device according to the first embodiment. [Figure 3] Figure 3 is a schematic plan view illustrating a computing device according to the first embodiment. [Figure 4] Figure 4 is a schematic plan view illustrating a computing device according to the first embodiment. [Figure 5] Figure 5 is a schematic plan view illustrating a computing device according to the second embodiment. [Modes for carrying out the invention]
[0007] Embodiments of the present invention will be described below with reference to the drawings. Drawings are schematic or conceptual, and the relationships between the thickness and width of each part, as well as the ratios of the sizes of different parts, are not necessarily identical to those of reality. Even when representing the same part, the dimensions and ratios may be depicted differently in different drawings. In this specification and in each figure, elements similar to those described above are denoted by the same reference numerals, and detailed explanations are omitted as appropriate.
[0008] (First Embodiment) Figure 1 is a schematic plan view illustrating a computing device according to the first embodiment. Figure 2 is a schematic perspective view illustrating a part of the computing device according to the first embodiment. As shown in Figure 1, the computing device 110 according to this embodiment includes an element unit 10E. In this example, the computing device 110 further includes a first conductive unit 41, a second conductive unit 42, a first coupled conductive unit 61, and a control unit 70.
[0009] The element section 10E includes a first structure 11, a second structure 12, and a first coupling structure 21. The first structure 11 includes a first cavity resonator 11H having a first resonant frequency, a first other cavity resonator 11L having a first other resonant frequency, and a first coupler 11C. The first coupler 11C can couple the first cavity resonator 11H and the first other cavity resonator 11L. The first other resonant frequency is lower than the first resonant frequency. The first structure 11 is a resonator pair containing two cavity resonators.
[0010] The second structure 12 includes a second cavity resonator 12H having a second resonant frequency, a second other cavity resonator 12L having a second other resonant frequency, and a second coupler 12C. The second coupler 12C can couple the second cavity resonator 12H and the second other cavity resonator 12L. The second other resonant frequency is lower than the second resonant frequency. The second structure 12 is another resonator pair containing two cavity resonators.
[0011] The first coupling structure 21 can couple the first structure 11 and the second structure 12. In this example, the first other cavity resonator 11L is located between the first cavity resonator 11H and the first coupling structure 21. The second cavity resonator 12H is located between the first coupling structure 21 and the second other cavity resonator 12L. The first coupling structure 21 is located between the first other cavity resonator 11L and the second cavity resonator 12H.
[0012] For example, the first coupling structure 21 can be coupled with the first other cavity resonator 11L and the second cavity resonator 12H.
[0013] The control unit 70 can supply a first AC signal Sa1 containing an AC component to the first conductive part 41. The control unit 70 can supply a second AC signal Sa2 containing an AC component to the second conductive part 42. The first magnetic field (AC magnetic field) generated from the first conductive part 41 in response to the first AC signal Sa1 is applied to the first coupler 11C. The second magnetic field (AC magnetic field) generated from the second conductive part 42 in response to the second AC signal Sa2 is applied to the second coupler 12C. In one example, the first conductive part 41 and the second conductive part 42 are coils. The first conductive part 41 and the second conductive part 42 may be any conductive member to which current can be supplied. The conductive member may be provided, for example, on the member (substrate) on which the coupling structure is provided. The coil may be provided separately from the member (substrate) on which the coupling structure is provided.
[0014] The control unit 70 can supply a first DC pulse signal Sd1 to the first coupling conductive part 61. The first coupling magnetic field generated from the first coupling conductive part 61 in response to the first DC pulse signal Sd1 is applied to the first coupling structure 21.
[0015] For example, one of the first cavity resonators 11H and the first other cavity resonator 11L is in a single photon state. The other of the first cavity resonator 11H and the first other cavity resonator 11L is in a state where no photon exists (for example, a "vacuum state"). For example, a state where the first cavity resonator 11H is in a single photon state and the first other cavity resonator 11L is in a vacuum state corresponds to one of "0" and "1" (for example, "0"). For example, a state where the first cavity resonator 11H is in a vacuum state and the first other cavity resonator 11L is in a single photon state corresponds to the other of "0" and "1" (for example, "1"). A state that is not one of the above two states corresponds to an error state. Which resonator has a photon present represents a qubit. The first structure 11 functions as one qubit.
[0016] Similarly, for example, one of the second cavity resonators 12H and the second other cavity resonator 12L is in a single photon state. The other of the second cavity resonator 12H and the second other cavity resonator 12L is in a state where no photon exists (for example, a "vacuum state"). Which resonator of the qubit has a photon present represents a qubit. The second structure 12 functions as another qubit.
[0017] As described above, in the embodiment, an alternating magnetic field is applied to the first coupler 11C. Thereby, the state of the first structure 11 (qubit) can be manipulated. An alternating magnetic field is applied to the second coupler 12C. Thereby, the state of the second structure 12 (qubit) can be manipulated. That is, a one-qubit gate operation is executed.
[0018] As described above, in the embodiment, a direct current pulsed magnetic field is applied to the first coupling structure 21. Thereby, a two-qubit gate is executed on the first structure ၁၁ (qubit) and the second structure ၁၂ (qubit).
[0019] In an embodiment, for example, quantum bit gate operations can be easily performed. Quantum bit gate operations can be executed at high speed. Scaling up is easy. According to the embodiment, a computing device capable of improving characteristics can be provided.
[0020] The first coupler 11C, the second coupler 12C, and the first coupling structure 21 are, for example, frequency-variable transmon couplers.
[0021] In an embodiment, a cavity resonator is used. The cavity resonator is, for example, a three-dimensional superconducting microwave resonator. In the cavity resonator, the coherence time is long. Two cavity resonators (resonator pair) are used as quantum bits. The quantum bit is represented by whether there is one photon in either of the two cavity resonators. By controlling an alternating magnetic field (alternating magnetic flux) for a frequency-variable transmon coupler that couples the two cavity resonators of the resonator pair (modulating the frequency of the transmon), a single qubit gate operation can be executed. A plurality of quantum bits are coupled by a frequency-variable transmon coupler. For example, by controlling a direct current magnetic field (direct current magnetic flux) for a frequency-variable transmon coupler that couples two cavity resonators belonging to different quantum bits (resonator pairs) (changing the frequency of the transmon), a two-qubit gate operation can be executed.
[0022] In an embodiment, the control unit 70 can control the frequency of the alternating component of the first alternating signal Sa1. Thereby, a single qubit gate operation in the first structure 11 can be executed. The control unit 70 can control the frequency of the alternating component of the second alternating signal Sa2. Thereby, a single qubit gate operation in the second structure 12 can be executed.
[0023] For example, the control unit 70 may be able to set the frequency of the alternating component of the first alternating signal Sa1 to a value based on the first resonance frequency and the first other resonance frequency. For example, the control unit 70 may be able to set the frequency of the alternating component of the second alternating signal Sa2 to a value based on the second resonance frequency and the second other resonance frequency.
[0024] In one example, the control unit 70 can set the frequency of the AC component of the first AC signal Sa1 to the first difference between the first resonant frequency and the first other resonant frequency. This enables a 1-qubit gate operation in the first structure 11. The control unit 70 can set the frequency of the AC component of the second AC signal Sa2 to the second difference between the second resonant frequency and the second other resonant frequency. This enables a 1-qubit gate operation in the second structure 12. For example, the control unit 70 may set the frequency of the AC component of the first AC signal Sa1 to a value between 0.5 and 2 times the first difference. For example, the control unit 70 may set the frequency of the AC component of the second AC signal Sa2 to a value between 0.5 and 2 times the second difference.
[0025] In another example, the control unit 70 can set the frequency of the AC component of the first AC signal Sa1 to the first sum of the first resonant frequency and the first other resonant frequency. This enables a 1-qubit gate operation in the first structure 11. The control unit 70 can also set the frequency of the AC component of the second AC signal Sa2 to the second sum of the second resonant frequency and the second other resonant frequency. This enables a 1-qubit gate operation in the second structure 12.
[0026] In another example, the control unit 70 can set the frequency of the AC component of the first AC signal Sa1 to a first value between twice the first resonant frequency and twice the first other resonant frequency. This enables a 1-qubit gate operation in the first structure 11. The control unit 70 can also set the frequency of the AC component of the second AC signal Sa2 to a second value between twice the second resonant frequency and twice the second other resonant frequency. This enables a 1-qubit gate operation in the second structure 12.
[0027] For example, in the first state, the first DC pulse signal Sd1 is not yet supplied to the first coupling conductor 61. In the second state, the first DC pulse signal Sd1 is supplied to the first coupling conductor 61.
[0028] For example, the difference between the first state resonance frequency of the first coupled structure 21 in the first state and the first other resonance frequency is greater than the difference between the second state resonance frequency of the first coupled structure 21 in the second state and the first other resonance frequency.
[0029] For example, before the supply of the first DC pulse signal Sd1, the resonant frequency of the first coupling structure 21 is far from the first other resonant frequency. When the first DC pulse signal Sd1 is supplied, the resonant frequency of the first coupling structure 21 approaches the first other resonant frequency. After the supply of the first DC pulse signal Sd1, the resonant frequency of the first coupling structure 21 returns to its original position, far from the first other resonant frequency.
[0030] For example, the difference between the first-state resonant frequency and the second-state resonant frequency of the first coupled structure 21 in the first state is greater than the difference between the second-state resonant frequency and the second-state resonant frequency of the first coupled structure 21 in the second state.
[0031] For example, before the supply of the first DC pulse signal Sd1, the resonant frequency of the first coupled structure 21 is far from the second resonant frequency. When the first DC pulse signal Sd1 is supplied, the resonant frequency of the first coupled structure 21 approaches the second resonant frequency. After the supply of the first DC pulse signal Sd1, the resonant frequency of the first coupled structure 21 returns to its original position, far from the second resonant frequency. This operation performs a two-qubit gate operation. This two-qubit gate operation is based on, for example, a ZZ coupling (see, e.g., H. Goto, Physical Review Applied 18, 034038 (2022)).
[0032] Figure 2 illustrates the first structure 11, the second structure 12, and the first combined structure 21. The first cavity resonator 11H, the first other cavity resonator 11L, the second cavity resonator 12H, and the second other cavity resonator 12L may be cylindrical in shape along the first direction D1. The resonators (first cavity resonator 11H, first other cavity resonator 11L, second cavity resonator 12H, and second other cavity resonator 12L) include an outer enclosure member 10G (cylindrical part) and an inner member 10S (columnar part). The inner member 10S is provided inside the outer enclosure member 10G.
[0033] The first direction D1 is defined as the Z-axis direction. One direction perpendicular to the Z-axis direction is defined as the X-axis direction. The direction perpendicular to both the Z-axis direction and the X-axis direction is defined as the Y-axis direction. The first cavity resonator 11H, the first other cavity resonator 11L, the second cavity resonator 12H, and the second other cavity resonator 12L may be arranged, for example, along the XY plane.
[0034] As shown in Figure 1, in this example, the first coupler 11C includes a first Josephson junction 11Ca and a first other Josephson junction 11Cb connected in parallel with the first Josephson junction 11Ca. The second coupler 12C includes a second Josephson junction 12Ca and a second other Josephson junction 12Cb connected in parallel with the second Josephson junction 12Ca. The first coupling structure 21 includes a first coupling Josephson junction 21a and a first other Josephson junction 21b connected in parallel with the first coupling Josephson junction 21a. Each of the first coupler 11C, the second coupler 12C, and the first coupling structure 21 includes a loop containing multiple Josephson junctions. The resonant frequency can be adjusted by controlling the magnetic flux within the loop. This enables variable coupling.
[0035] As shown in Figure 1, the computing device 110 may further include a third conductive part 43 and a second coupling conductive part 62. The element part 10E includes a third structure 13 and a second coupling structure 22. The third structure 13 includes a third cavity resonator 13H having a third resonant frequency, a third other cavity resonator 13L having a third other resonant frequency, and a third coupler 13C. The third coupler 13C can couple the third cavity resonator 13H and the third other cavity resonator 13L. The third other resonant frequency is lower than the third resonant frequency. The third structure 13 functions as a single quantum bid. The second coupling structure 22 can couple the first other cavity resonator 11L and the third cavity resonator 13H.
[0036] The control unit 70 can supply a third AC signal Sa3 containing an AC component to the third conductive part 43. The third magnetic field generated from the third conductive part in response to the third AC signal Sa3 is applied to the third coupler 13C. The control unit 70 can supply a second DC pulse signal Sd2 to the second coupling conductive part 62. The second coupling magnetic field generated from the second coupling conductive part 62 in response to the second DC pulse signal Sd2 is applied to the second coupling structure 22.
[0037] A third magnetic field based on the third AC signal Sa3 enables a one-qubit gate operation in the third structure 13. A second coupled magnetic field based on the second DC pulse signal Sd2 enables a two-qubit gate operation in the first structure 11 and the third structure 13.
[0038] As shown in Figure 1, the computing device 110 may further include a first readout resonator 11R. The first readout resonator 11R can be coupled with a first cavity resonator 11H and a third other cavity resonator 13L. The first readout resonator 11R can read out the state of the qubits (state of photons) in the first structure 11 and the third structure 13.
[0039] As shown in Figure 1, in this example, the third bonder 13C includes a third Josephson junction 13Ca and a third other Josephson junction 13Cb connected in parallel with the third Josephson junction 13Ca. The second bond structure 22 includes a second Josephson junction 22a and a second other Josephson junction 22b connected in parallel with the second Josephson junction 22a. Variable bonding is possible.
[0040] As shown in Figure 1, the computing device 110 may further include a fourth conductive part 44 and a third coupled conductive part 63. The element part 10E includes a fourth structure 14 and a third coupled structure 23. The fourth structure 14 includes a fourth cavity resonator 14H having a fourth resonant frequency, a fourth other cavity resonator 14L having a fourth other resonant frequency, and a fourth coupler 14C. The fourth coupler 14C can couple the fourth cavity resonator 14H and the fourth other cavity resonator 14L. The fourth other resonant frequency is lower than the fourth resonant frequency. The fourth structure 14 functions as one quantum bid. The third coupled structure 23 can couple the second other cavity resonator 12L and the fourth cavity resonator 14H.
[0041] The control unit 70 can supply a fourth AC signal Sa4 containing an AC component to the fourth conductive part 44. The fourth magnetic field generated from the fourth conductive part 44 in response to the fourth AC signal Sa4 is applied to the fourth coupler 14C. The control unit 70 can supply a third DC pulse signal Sd3 to the third coupling conductive part 63. The third coupling magnetic field generated from the third coupling conductive part 63 in response to the third DC pulse signal Sd3 is applied to the third coupling structure 23.
[0042] A fourth magnetic field based on the fourth AC signal Sa4 enables a one-qubit gate operation in the fourth structure 14. A third coupled magnetic field based on the third DC pulse signal Sd3 enables a two-qubit gate operation in the second structure 12 and the fourth structure 14.
[0043] As shown in Figure 1, the computing device 110 may further include a second readout resonator 12R. The second readout resonator 12R can be coupled with a second cavity resonator 12H and a fourth other cavity resonator 14L. The second readout resonator 12R can read out the state of the qubits (state of photons) in the second structure 12 and the fourth structure 14.
[0044] As shown in Figure 1, in this example, the fourth coupler 14C includes a fourth Josephson junction 14Ca and a fourth other Josephson junction 14Cb connected in parallel with the fourth Josephson junction 14Ca. The third coupling structure 23 includes a third coupling Josephson junction 23a and a third other Josephson junction 23b connected in parallel with the third coupling Josephson junction 23a. Frequency-variable coupling is possible.
[0045] As shown in Figure 1, the computing device 110 may further include a fourth coupling conductor 64. The element unit 10E includes a fourth coupling structure 24. The fourth coupling structure 24 can couple the third cavity resonator 13H and the fourth other cavity resonator 14L. The control unit 70 can supply a fourth DC pulse signal Sd4 to the fourth coupling conductor 64. The fourth coupling magnetic field generated from the fourth coupling conductor 64 in response to the fourth DC pulse signal Sd4 is applied to the fourth coupling structure 24. The fourth coupling magnetic field based on the fourth DC pulse signal Sd4 enables two-qubit gate operations in the third structure 13 and the fourth structure 14. The same operations as those described above for the first structure 11 and the second structure 12 may be applied to the third structure 13 and the fourth structure 14.
[0046] As shown in Figure 1, in this example, the fourth coupling structure 24 includes a fourth coupling Josephson junction 24a and a fourth coupling other Josephson junction 24b connected in parallel with the fourth coupling Josephson junction 24a. Frequency-variable coupling is possible.
[0047] Figure 3 is a schematic plan view illustrating a computing device according to the first embodiment. As shown in Figure 3, in the computing device 111 according to this embodiment, the configuration of the coupler and coupling structure differs from the configuration of the coupler and coupling structure in computing device 111. The rest of the configuration of computing device 111 may be the same as that of computing device 110.
[0048] As shown in Figure 3, in the computing device 111, the first coupler 11C includes a first Josephson junction 11Ca, a first other Josephson junction 11Cb, and a first intermediate Josephson junction 11Cc. The end of the first Josephson junction 11Ca is connected to the end of the first intermediate Josephson junction 11Cc. The other end of the first Josephson junction 11Ca is connected to the other end of the first other Josephson junction 11Cb. The end of the first other Josephson junction 11Cb is connected to the other end of the first intermediate Josephson junction 11Cc.
[0049] The second coupler 12C includes a second Josephson junction 12Ca, a second other Josephson junction 12Cb, and a second intermediate Josephson junction 12Cc. One end of the second Josephson junction 12Ca is connected to the other end of the second intermediate Josephson junction 12Cc. The other end of the second Josephson junction 12Ca is connected to the other end of the second other Josephson junction 12Cb. The other end of the second other Josephson junction 12Cb is connected to the other end of the second intermediate Josephson junction 12Cc.
[0050] The first bond structure 21 includes a first bond Josephson junction 21a, a first bond other Josephson junction 21b, and a first bond intermediate Josephson junction 21c. The end of the first bond Josephson junction 21a is connected to the end of the first bond intermediate Josephson junction 21c. The other end of the first bond Josephson junction 21a is connected to the other end of the first bond other Josephson junction 21b. The end of the first bond other Josephson junction 21b is connected to the other end of the first bond intermediate Josephson junction 21c.
[0051] In the computing device 111, the first coupler 11C, the second coupler 12C, and the first coupling structure 21 are double transmon couplers. This enables faster gate operations.
[0052] In the computing device 111, the third coupler 13C includes a third Josephson junction 13Ca, a third other Josephson junction 13Cb, and a third intermediate Josephson junction 13Cc. The end of the third Josephson junction 13Ca is connected to the end of the third intermediate Josephson junction 13Cc. The other end of the third Josephson junction 13Ca is connected to the other end of the third other Josephson junction 13Cb. The end of the third other Josephson junction 13Cb is connected to the other end of the third intermediate Josephson junction 13Cc.
[0053] The fourth coupler 14C includes a fourth Josephson junction 14Ca, a fourth other Josephson junction 14Cb, and a fourth intermediate Josephson junction 14Cc. The end of the fourth Josephson junction 14Ca is connected to the end of the fourth intermediate Josephson junction 14Cc. The other end of the fourth Josephson junction 14Ca is connected to the other end of the fourth other Josephson junction 14Cb. The end of the fourth other Josephson junction 14Cb is connected to the other end of the fourth intermediate Josephson junction 14Cc.
[0054] The second bond structure 22 includes a second bond Josephson junction 22a, a second bond other Josephson junction 22b, and a second bond intermediate Josephson junction 22c. The end of the second bond Josephson junction 22a is connected to the end of the second bond intermediate Josephson junction 22c. The other end of the second bond Josephson junction 22a is connected to the other end of the second bond other Josephson junction 22b. The end of the second bond other Josephson junction 22b is connected to the other end of the second bond intermediate Josephson junction 22c.
[0055] The third bond structure 23 includes a third bond Josephson junction 23a, a third bond other Josephson junction 23b, and a third bond intermediate Josephson junction 23c. The end of the third bond Josephson junction 23a is connected to the end of the third bond intermediate Josephson junction 23c. The other end of the third bond Josephson junction 23a is connected to the other end of the third bond other Josephson junction 23b. The end of the third bond other Josephson junction 23b is connected to the other end of the third bond intermediate Josephson junction 23c.
[0056] The fourth joint structure 24 includes a fourth joint Josephson junction 24a, a fourth joint other Josephson junction 24b, and a fourth joint intermediate Josephson junction 24c. The end of the fourth joint Josephson junction 24a is connected to the end of the fourth joint intermediate Josephson junction 24c. The other end of the fourth joint Josephson junction 24a is connected to the other end of the fourth joint other Josephson junction 24b. The end of the fourth joint other Josephson junction 24b is connected to the other end of the fourth joint intermediate Josephson junction 24c.
[0057] Figure 4 is a schematic plan view illustrating a computing device according to the first embodiment. In Figure 4, the conductive parts (first conductive part 41, second conductive part 42, third conductive part 43, fourth conductive part 44, first coupling conductive part 61, second coupling conductive part 62, third coupling conductive part 63, and fourth coupling conductive part 64, etc.) are omitted.
[0058] In the computing device 111, the first coupler 11C includes a first part 11Cp, a first other part 11Cq, a first opposing part 11Cr, and a first opposing other part 11Cs. The first opposing part 11Cr is electrically connected to one end of the first Josephson junction 11Ca and one end of the first intermediate Josephson junction 11Cc. The first opposing other part 11Cs is electrically connected to one end of the first other Josephson junction 11Cb and the other end of the first intermediate Josephson junction 11Cc. The first part 11Cp is electrically connected to the other end of the first Josephson junction 11Ca and the other end of the first other Josephson junction 11Cb. The first other part 11Cq is electrically connected to the other end of the first Josephson junction 11Ca and the other end of the first other Josephson junction 11Cb.
[0059] The first portion 11Cp is electrically connected to the enclosure member 10G (see Figure 2) of the first cavity resonator 11H. The first other portion 11Cq is electrically connected to the enclosure member 10G of the first other cavity resonator 11L. The first opposing portion 11Cr is capacitively coupled to the inner member 10S (see Figure 2) of the first cavity resonator 11H. The first opposing other portion 11Cs is capacitively coupled to the inner member 10S of the first other cavity resonator 11L. The first portion 11Cp and the first other portion 11Cq are set to a fixed potential (e.g., ground potential).
[0060] In the computing device 111, the second coupler 12C includes a second part 12Cp, a second other part 12Cq, a second opposing part 12Cr, and a second opposing other part 12Cs. The second opposing part 12Cr is electrically connected to one end of the second Josephson junction 12Ca and one end of the second intermediate Josephson junction 12Cc. The second opposing other part 12Cs is electrically connected to one end of the second other Josephson junction 12Cb and the other end of the second intermediate Josephson junction 12Cc. The second part 12Cp is electrically connected to the other end of the second Josephson junction 12Ca and the other end of the second other Josephson junction 12Cb. The second other part 12Cq is electrically connected to the other end of the second Josephson junction 12Ca and the other end of the second other Josephson junction 12Cb.
[0061] The second portion 12Cp is electrically connected to the enclosure member 10G of the second cavity resonator 12H. The second other portion 12Cq is electrically connected to the enclosure member 10G of the second other cavity resonator 12L. The second opposing portion 12Cr is capacitively coupled to the inner member 10S of the second cavity resonator 12H. The second opposing other portion 12Cs is capacitively coupled to the inner member 10S of the second other cavity resonator 12L. The second portion 12Cp and the second other portion 12Cq are set to a fixed potential (e.g., ground potential), for example.
[0062] In the computing device 111, the third coupler 13C includes a third portion 13Cp, a third other portion 13Cq, a third opposing portion 13Cr, and a third opposing other portion 13Cs. The third opposing portion 13Cr is electrically connected to one end of the third Josephson junction 13Ca and one end of the third intermediate Josephson junction 13Cc. The third opposing other portion 13Cs is electrically connected to one end of the third other Josephson junction 13Cb and the other end of the third intermediate Josephson junction 13Cc. The third portion 13Cp is electrically connected to the other end of the third Josephson junction 13Ca and the other end of the third other Josephson junction 13Cb. The third other portion 13Cq is electrically connected to the other end of the third Josephson junction 13Ca and the other end of the third other Josephson junction 13Cb.
[0063] The third portion 13Cp is electrically connected to the enclosure member 10G of the third other cavity resonator 13L. The third other portion 13Cq is electrically connected to the enclosure member 10G of the third cavity resonator 13H. The third opposing portion 13Cr is capacitively coupled to the inner member 10S of the third other cavity resonator 13L. The third opposing portion 13Cs is capacitively coupled to the inner member 10S of the third other cavity resonator 13L. The third portion 13Cp and the third other portion 13Cq are set to a fixed potential (e.g., ground potential).
[0064] In the computing device 111, the fourth coupler 14C includes a fourth part 14Cp, a fourth other part 14Cq, a fourth opposing part 14Cr, and a fourth opposing other part 14Cs. The fourth opposing part 14Cr is electrically connected to one end of the fourth Josephson junction 14Ca and one end of the fourth intermediate Josephson junction 14Cc. The fourth opposing other part 14Cs is electrically connected to one end of the fourth other Josephson junction 14Cb and the other end of the fourth intermediate Josephson junction 14Cc. The fourth part 14Cp is electrically connected to the other end of the fourth Josephson junction 14Ca and the other end of the fourth other Josephson junction 14Cb. The fourth other part 14Cq is electrically connected to the other end of the fourth Josephson junction 14Ca and the other end of the fourth other Josephson junction 14Cb.
[0065] The fourth portion 14Cp is electrically connected to the enclosure member 10G of the fourth other cavity resonator 14L. The fourth other portion 14Cq is electrically connected to the enclosure member 10G of the fourth cavity resonator 14H. The fourth opposing portion 14Cr is capacitively coupled to the inner member 10S of the fourth other cavity resonator 14L. The fourth opposing portion 14Cs is capacitively coupled to the inner member 10S of the fourth other cavity resonator 14L. The fourth portion 14Cp and the fourth other portion 14Cq are set to a fixed potential (e.g., ground potential), for example.
[0066] In the computing device 111, the first coupling structure 21 includes a first coupling portion 21p, a first coupling other portion 21q, a first coupling opposing portion 21r, and a first coupling opposing other portion 21s. The first coupling opposing portion 21r is electrically connected to one end of the first coupling Josephson junction 21a and one end of the first coupling intermediate Josephson junction 21c. The first coupling opposing other portion 21s is electrically connected to one end of the first coupling other Josephson junction 21b and the other end of the first coupling intermediate Josephson junction 21c. The first coupling portion 21p is electrically connected to the other end of the first coupling Josephson junction 21a and the other end of the first coupling other Josephson junction 21b. The first coupling other portion 21q is electrically connected to the other end of the first coupling Josephson junction 21a and the other end of the first coupling other Josephson junction 21b.
[0067] The first coupling portion 21p is electrically connected to the enclosure member 10G of the first other cavity resonator 11L. The first other coupling portion 21q is electrically connected to the enclosure member 10G of the second cavity resonator 12H. The first opposing coupling portion 21r is capacitively coupled to the inner member 10S of the first other cavity resonator 11L. The first opposing coupling portion 21s is capacitively coupled to the inner member 10S of the second cavity resonator 12H. The first coupling portion 21p and the first other coupling portion 21q are set to a fixed potential (e.g., ground potential).
[0068] In the computing device 111, the second bond structure 22 includes a second bond portion 22p, a second bond other portion 22q, a second bond opposing portion 22r, and a second bond opposing other portion 22s. The second bond opposing portion 22r is electrically connected to one end of the second bond Josephson junction 22a and one end of the second bond intermediate Josephson junction 22c. The second bond opposing other portion 22s is electrically connected to one end of the second bond other Josephson junction 22b and the other end of the second bond intermediate Josephson junction 22c. The second bond portion 22p is electrically connected to the other end of the second bond Josephson junction 22a and the other end of the second bond other Josephson junction 22b. The second bond other portion 22q is electrically connected to the other end of the second bond Josephson junction 22a and the other end of the second bond other Josephson junction 22b.
[0069] The second coupling portion 22p is electrically connected to the enclosure member 10G of the first other cavity resonator 11L. The second other coupling portion 22q is electrically connected to the enclosure member 10G of the third cavity resonator 13H. The second opposing coupling portion 22r is capacitively coupled to the inner member 10S of the first other cavity resonator 11L. The second opposing coupling portion 22s is capacitively coupled to the inner member 10S of the third cavity resonator 13H. The second coupling portion 22p and the second other coupling portion 22q are set to a fixed potential (e.g., ground potential).
[0070] In the computing device 111, the third bond structure 23 includes a third bond portion 23p, a third bond other portion 23q, a third bond opposing portion 23r, and a third bond opposing other portion 23s. The third bond opposing portion 23r is electrically connected to one end of the third bond Josephson junction 23a and one end of the third bond intermediate Josephson junction 23c. The third bond opposing other portion 23s is electrically connected to one end of the third bond other Josephson junction 23b and the other end of the third bond intermediate Josephson junction 23c. The third bond portion 23p is electrically connected to the other end of the third bond Josephson junction 23a and the other end of the third bond other Josephson junction 23b. The third bond other portion 23q is electrically connected to the other end of the third bond Josephson junction 23a and the other end of the third bond other Josephson junction 23b.
[0071] The third coupling portion 23p is electrically connected to the enclosure member 10G of the second other cavity resonator 12L. The third other coupling portion 23q is electrically connected to the enclosure member 10G of the fourth cavity resonator 14H. The third opposing coupling portion 23r is capacitively coupled to the inner member 10S of the third other cavity resonator 13L. The third opposing coupling portion 23s is capacitively coupled to the inner member 10S of the fourth cavity resonator 14H. The third coupling portion 23p and the third other coupling portion 23q are set to a fixed potential (e.g., ground potential), for example.
[0072] In the computing device 111, the fourth bond structure 24 includes a fourth bond portion 24p, a fourth bond other portion 24q, a fourth bond opposing portion 24r, and a fourth bond opposing other portion 24s. The fourth bond opposing portion 24r is electrically connected to one end of the fourth bond Josephson junction 24a and one end of the fourth bond intermediate Josephson junction 24c. The fourth bond opposing other portion 24s is electrically connected to one end of the fourth bond other Josephson junction 24b and the other end of the fourth bond intermediate Josephson junction 24c. The fourth bond portion 24p is electrically connected to the other end of the fourth bond Josephson junction 24a and the other end of the fourth bond other Josephson junction 24b. The fourth bond other portion 24q is electrically connected to the other end of the fourth bond Josephson junction 24a and the other end of the fourth bond other Josephson junction 24b.
[0073] The fourth coupling portion 24p is electrically connected to the enclosure member 10G of the third cavity resonator 13H. The fourth coupling other portion 24q is electrically connected to the enclosure member 10G of the fourth other cavity resonator 14L. The fourth coupling opposite portion 24r is capacitively coupled to the inner member 10S of the third cavity resonator 13H. The fourth coupling opposite other portion 24s is capacitively coupled to the inner member 10S of the fourth other cavity resonator 14L. The fourth coupling portion 24p and the fourth coupling other portion 24q are set to a fixed potential (e.g., ground potential).
[0074] The outer enclosure member 10G described above includes a superconductor. For example, the inner member 10S corresponds to a signal line. By setting the outer enclosure member 10G to a fixed potential (e.g., ground potential), stable characteristics can be obtained.
[0075] (Second Embodiment) Figure 5 is a schematic plan view illustrating a computing device according to the second embodiment. As shown in Figure 5, in the computing device 120 according to this embodiment, at least one of the control unit 70, the conductive part, and the coupling conductive part is omitted. The configuration of the computing device 120, excluding these, may be the same as that of the computing device 111.
[0076] In the computing device 120, at least one of the coupler and the coupled structure includes a double transmon coupler. In the computing device 120, stable bit operations can be performed at high speed. A computing device capable of improving characteristics is provided.
[0077] The embodiments may include the following technical proposals. (Technical proposal 1) The element part, First conductive part and The second conductive part and First coupling conductive part and Control unit and Equipped with, The element portion includes a first structure, a second structure, and a first coupling structure. The first structure is, A first cavity resonator having a first resonant frequency, A first other cavity resonator having a first other resonant frequency, A first coupler capable of coupling the first cavity resonator and the first other cavity resonator, Includes, The aforementioned first other resonant frequency is lower than the aforementioned first resonant frequency. The second structure is, A second cavity resonator having a second resonant frequency, A second other cavity resonator having a second other resonant frequency, A second coupler capable of coupling the second cavity resonator and the second other cavity resonator, Includes, The aforementioned second resonant frequency is lower than the aforementioned second resonant frequency. The first connecting structure is capable of connecting the first structure and the second structure, The control unit is capable of supplying the first conductive part with a first AC signal containing an AC component. The control unit is capable of supplying a second AC signal containing an AC component to the second conductive part. The first magnetic field generated from the first conductive part in response to the first AC signal is applied to the first coupler. The second magnetic field generated from the second conductive part in response to the second AC signal is applied to the second coupler. The control unit is capable of supplying a first DC pulse signal to the first coupling conductive unit. A computing device that applies the first coupling magnetic field generated from the first coupling conductive part in response to the first DC pulse signal to the first coupling structure.
[0078] (Technical proposal 2) In the first state, before the first DC pulse signal is supplied to the first coupling conductive part, In the second state, the first DC pulse signal is supplied to the first coupling conductive part. The calculation device according to Technical Proposal 1, wherein the difference between the first state resonance frequency of the first coupled structure in the first state and the first other resonance frequency is greater than the difference between the second state resonance frequency of the first coupled structure in the second state and the first other resonance frequency.
[0079] (Technical proposal 3) In the first state, before the first DC pulse signal is supplied to the first coupling conductive part, In the second state, the first DC pulse signal is supplied to the first coupling conductive part. The calculation device according to Technical Proposal 1, wherein the difference between the first state resonance frequency and the second resonance frequency of the first coupled structure in the first state is greater than the difference between the second state resonance frequency and the second resonance frequency of the first coupled structure in the second state.
[0080] (Technical proposal 4) The first other cavity resonator is located between the first cavity resonator and the first coupling structure. The second cavity resonator is located between the first coupled structure and the second other cavity resonator. The first coupling structure is a computing device according to any one of Technical Proposals 1 to 3, located between the first other cavity resonator and the second cavity resonator.
[0081] (Technical proposal 5) The first coupling structure is capable of coupling with the first other cavity resonator and the second cavity resonator, as described in any one of Technical Proposals 1 to 4.
[0082] (Technical proposal 6) The first coupler includes a first Josephson junction and a first other Josephson junction connected in parallel with the first Josephson junction. The second coupler includes a second Josephson junction and a second other Josephson junction connected in parallel with the second Josephson junction. The computing device according to any one of Technical Proposals 1 to 5, wherein the first coupling structure includes a first coupling Josephson junction and a first coupling other Josephson junction connected in parallel with the first coupling Josephson junction.
[0083] (Technical proposal 7) The first bond structure includes a first bond Josephson junction, a first bond other Josephson junction, and a first bond intermediate Josephson junction. The end of the first bond Josephson junction is connected to the end of the first bond intermediate Josephson junction, The other end of the first joint Josephson junction is connected to the other end of the first joint other Josephson junction. The computing device according to any one of Technical Proposals 1 to 5, wherein the end of the first bond other Josephson junction is connected to the other end of the first bond intermediate Josephson junction.
[0084] (Technical proposal 8) The first coupler includes a first Josephson junction, a first other Josephson junction, and a first intermediate Josephson junction. The end of the first Josephson junction is connected to the end of the first intermediate Josephson junction. The other end of the first Josephson joint is connected to the other end of the first other Josephson joint. The computing device according to Technical Proposal 7, wherein the end of the first other Josephson junction is connected to the other end of the first intermediate Josephson junction.
[0085] (Technical proposal 9) The aforementioned second coupler includes a second Josephson junction, a second other Josephson junction, and a second intermediate Josephson junction. The end of the second Josephson joint is connected to the end of the second intermediate Josephson joint. The other end of the second Josephson joint is connected to the other end of the second other Josephson joint. The computing device according to Technical Proposal 8, wherein the end of the second other Josephson junction is connected to the other end of the second intermediate Josephson junction.
[0086] (Technical proposal 10) Third conductive part and The second coupling conductive part, Furthermore, The element portion includes a third structure and a second coupling structure, The third structure is, A third cavity resonator having a third resonant frequency, A third other cavity resonator having a third other resonant frequency, A third coupler capable of coupling the third cavity resonator and the third other cavity resonator, Includes, The aforementioned third resonant frequency is lower than the aforementioned third resonant frequency. The second coupling structure is capable of coupling the first other cavity resonator and the third cavity resonator. The control unit is capable of supplying a third AC signal containing an AC component to the third conductive part. The third magnetic field generated from the third conductive part in response to the third AC signal is applied to the third coupler. The control unit is capable of supplying a second DC pulse signal to the second coupling conductive unit. The second coupling magnetic field generated from the second coupling conductive part in response to the second DC pulse signal is applied to the second coupling structure, according to the calculation device described in any one of Technical Proposals 1 to 9.
[0087] (Technical proposal 11) Further comprising a first readout resonator, The computing apparatus according to Technical Proposal 10, wherein the first readout resonator is connectable to the first cavity resonator and the third other cavity resonator.
[0088] (Technical proposal 12) The fourth conductive part, Third coupling conductive part, Furthermore, The element portion includes a fourth structure and a third coupling structure, The fourth structure is, A fourth cavity resonator having a fourth resonant frequency, A fourth other cavity resonator having a fourth other resonant frequency, A fourth coupler capable of coupling the fourth cavity resonator and the fourth other cavity resonator, Includes, The aforementioned fourth other resonant frequency is lower than the aforementioned fourth resonant frequency. The third coupling structure is capable of coupling the second other cavity resonator and the fourth cavity resonator. The control unit is capable of supplying a fourth AC signal containing an AC component to the fourth conductive part. The fourth magnetic field generated from the fourth conductive part in response to the fourth AC signal is applied to the fourth coupler. The control unit is capable of supplying a third DC pulse signal to the third coupling conductive unit. The computing device according to Technical Proposal 10 or 11, wherein the third coupling magnetic field generated from the third coupling conductive part in response to the third DC pulse signal is applied to the third coupling structure.
[0089] (Technical proposal 13) Further equipped with a second readout resonator, The computing apparatus according to Technical Proposal 12, wherein the second readout resonator is connectable to the second cavity resonator and the fourth other cavity resonator.
[0090] (Technical proposal 14) Further comprising a fourth coupling conductive part, The element portion includes a fourth coupling structure, The fourth coupling structure is capable of coupling the third cavity resonator and the fourth other cavity resonator, The control unit is capable of supplying a fourth DC pulse signal to the fourth coupling conductive unit. The fourth coupling magnetic field generated from the fourth coupling conductive part in response to the fourth DC pulse signal is applied to the fourth coupling structure, as described in the calculation device according to Technical Proposal 12 or 13.
[0091] (Technical proposal 15) Equipped with an element section, The element portion includes a first structure, a second structure, and a first coupling structure. The first structure is, A first cavity resonator having a first resonant frequency, A first other cavity resonator having a first other resonant frequency, A first coupler capable of coupling the first cavity resonator and the first other cavity resonator, Includes, The aforementioned first other resonant frequency is lower than the aforementioned first resonant frequency. The second structure is, A second cavity resonator having a second resonant frequency, A second other cavity resonator having a second other resonant frequency, A second coupler capable of coupling the second cavity resonator and the second other cavity resonator, Includes, The aforementioned second resonant frequency is lower than the aforementioned second resonant frequency. The first connecting structure is a computing device capable of connecting the first structure and the second structure.
[0092] (Technical proposal 16) The first bond structure includes a first bond Josephson junction, a first bond other Josephson junction, and a first bond intermediate Josephson junction. The end of the first bond Josephson junction is connected to the end of the first bond intermediate Josephson junction, The other end of the first joint Josephson junction is connected to the other end of the first joint other Josephson junction. The computing device according to technical proposal 15, wherein the end of the first bond other Josephson junction is connected to the other end of the first bond intermediate Josephson junction.
[0093] (Technical proposal 17) The first coupler includes a first Josephson junction, a first other Josephson junction, and a first intermediate Josephson junction. The end of the first Josephson junction is connected to the end of the first intermediate Josephson junction. The other end of the first Josephson joint is connected to the other end of the first other Josephson joint. The end of the first other Josephson joint is connected to the other end of the first intermediate Josephson joint. The aforementioned second coupler includes a second Josephson junction, a second other Josephson junction, and a second intermediate Josephson junction. The end of the second Josephson joint is connected to the end of the second intermediate Josephson joint. The other end of the second Josephson joint is connected to the other end of the second other Josephson joint. The computing apparatus according to technical proposal 15 or 16, wherein the end of the second other Josephson junction is connected to the other end of the second intermediate Josephson junction.
[0094] (Technical proposal 18) The element portion includes a third structure and a second coupling structure, The third structure is, A third cavity resonator having a third resonant frequency, A third other cavity resonator having a third other resonant frequency, A third coupler capable of coupling the third cavity resonator and the third other cavity resonator, Includes, The aforementioned third resonant frequency is lower than the aforementioned third resonant frequency. The second coupling structure is capable of coupling the first other cavity resonator and the third cavity resonator. The aforementioned third coupler includes a third Josephson junction, a third other Josephson junction, and a third intermediate Josephson junction. The end of the third Josephson junction is connected to the end of the third intermediate Josephson junction. The other end of the third Josephson joint is connected to the other end of the third other Josephson joint. The computing apparatus according to any one of the technical proposals 15 to 17, wherein the end of the third other Josephson junction is connected to the other end of the third intermediate Josephson junction.
[0095] (Technical proposal 19) The element portion includes a fourth structure and a third coupling structure, The fourth structure is, A fourth cavity resonator having a fourth resonant frequency, A fourth other cavity resonator having a fourth other resonant frequency, A fourth coupler capable of coupling the fourth cavity resonator and the fourth other cavity resonator, Includes, The aforementioned fourth other resonant frequency is lower than the aforementioned fourth resonant frequency. The third coupling structure is capable of coupling the second other cavity resonator and the fourth cavity resonator. The fourth coupler includes a fourth Josephson junction, a fourth other Josephson junction, and a fourth intermediate Josephson junction. The end of the fourth Josephson joint is connected to the end of the fourth intermediate Josephson joint. The other end of the fourth Josephson joint is connected to the other end of the fourth other Josephson joint. The computing apparatus according to Technical Proposal 18, wherein the end of the fourth other Josephson junction is connected to the other end of the fourth intermediate Josephson junction.
[0096] (Technical proposal 20) The aforementioned bond structure includes a first bond portion, a second first bond portion, a first opposing first bond portion, and a second opposing first bond portion. The first bond opposing portion is electrically connected to one end of the first bond Josephson junction and to one end of the first bond intermediate Josephson junction. The opposing portion of the first bond is electrically connected to one end of the Josephson junction of the first bond and to the other end of the intermediate Josephson junction of the first bond. The first coupling portion is electrically connected to the other end of the first coupling Josephson junction and the other end of the first coupling other Josephson junction. The other portion of the first bond is electrically connected to the other end of the first bond Josephson junction and the other end of the other Josephson junction of the first bond. The first coupling portion is electrically connected to the first other cavity resonator enclosure member of the first other cavity resonator, The first coupling portion is electrically connected to the second cavity resonator enclosure member of the second cavity resonator, The first coupling opposing portion is capacitively coupled to the inner member of the first other cavity resonator of the first other cavity resonator. The computing apparatus according to Technical Proposal 7 or 16, wherein the first coupled opposing other portion is capacitively coupled to the second cavity resonator inner member of the second cavity resonator.
[0097] According to the embodiment, a computing device capable of improving characteristics can be provided.
[0098] Embodiments of the present invention have been described above with reference to examples. However, the present invention is not limited to these examples. For example, the specific configurations of each element, such as structures, cavity resonators, couplers, coupling structures, and control units included in the computing device, are included within the scope of the present invention as long as those skilled in the art can appropriately select from the known scope to implement the present invention in a similar manner and obtain similar effects.
[0099] Combinations of two or more elements from each example, to the extent technically feasible, are also included within the scope of the present invention, insofar as they encompass the gist of the invention.
[0100] All computing devices that a person skilled in the art can implement by appropriately modifying the design based on the computing device described above as an embodiment of the present invention also fall within the scope of the present invention, insofar as they encompass the gist of the present invention.
[0101] Within the scope of the concept of this invention, a person skilled in the art would be able to conceive of various modifications and alterations, and it is understood that such modifications and alterations also fall within the scope of this invention.
[0102] While several embodiments of the present invention have been described, these embodiments are presented as examples only and are not intended to limit the scope of the invention. These novel embodiments can be carried out in a variety of other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their variations are included in the scope and spirit of the invention, as well as in the claims of the invention and its equivalents. [Explanation of symbols]
[0103] 10E: Element part, 10G: Outer shell parts, 10S: Inner parts, 11~14: 1st~4th structure, 11C~14C: 1st~4th coupler, 11H~14H: 1st~4th キャビティ resonator, 11L~14L: The 1st~4th other キャビティ resonator, 11R, 12R: The 1st and 2nd キみみし resonator, 11Ca~14Ca: The 1st~4th ジョセフソン junction, 11Cb~14Cb: The 1st~4th other ジョセフソン joint, 11Cc~14Cc: Intermediate josefon joints of the 1st to 4th sections; 11Cp~14Cp: Parts 1st to 4th sections; 11Cq~14Cq: Other parts of the 1st to 4th sections; 11Cr~14Cr: Opposite parts of the 1st to 4th sections; 11Cs~14Cs: Opposite parts of the 1st to 4th sections; 21~24: Jointed structures of the 1st to 4th sections; 21a~24a: Josefon joints of the 1st to 4th sections; 21b~24b: Other josefon joints of the 1st to 4th sections; 21c~24c: Intermediate josefon joints of the 1st to 4th sections. 21p~24p: 1st~4th connecting parts; 21q~24q: 1st~4th connecting parts; 21r~24r: 1st~4th connecting parts facing each other; 21s~24s: 1st~4th connecting parts facing each other; 41~44: 1st~4th conductive parts; 61~64: 1st~4th connecting conductive parts; 70: Control unit; 110, 111, 120: Computing device; D1: 1st direction; Sa1~Sa4: 1st~4th AC signals; Sd1~Sd4: 1st~4th DC power signals.
Claims
1. The element part, First conductive part and The second conductive part and First coupling conductive part and Control unit and Equipped with, The element portion includes a first structure, a second structure, and a first coupling structure. The first structure is, A first cavity resonator having a first resonant frequency, A first other cavity resonator having a first other resonant frequency, A first coupler capable of coupling the first cavity resonator and the first other cavity resonator, Includes, The first other resonant frequency is lower than the first resonant frequency. The second structure described above is A second cavity resonator having a second resonant frequency, A second other cavity resonator having a second other resonant frequency, A second coupler capable of coupling the second cavity resonator and the second other cavity resonator, Includes, The aforementioned second resonant frequency is lower than the aforementioned second resonant frequency. The first connecting structure is capable of connecting the first structure and the second structure, The control unit is capable of supplying the first conductive part with a first AC signal containing an AC component. The control unit is capable of supplying the second conductive part with a second AC signal containing an AC component. The first magnetic field generated from the first conductive part in response to the first AC signal is applied to the first coupler. The second magnetic field generated from the second conductive part in response to the second AC signal is applied to the second coupler. The control unit is capable of supplying a first DC pulse signal to the first coupling conductive unit. A computing device that applies the first coupling magnetic field generated from the first coupling conductive part in response to the first DC pulse signal to the first coupling structure.
2. In the first state, before the first DC pulse signal is supplied to the first coupling conductive part, In the second state, the first DC pulse signal is supplied to the first coupling conductive part. The calculation device according to claim 1, wherein the difference between the first state resonant frequency of the first coupling structure in the first state and the first other resonant frequency is greater than the difference between the second state resonant frequency of the first coupling structure in the second state and the first other resonant frequency.
3. The computing apparatus according to claim 1 or 2, wherein the first coupling structure is coupled to the first other cavity resonator and the second cavity resonator.
4. The first coupler includes a first Josephson junction and a first other Josephson junction connected in parallel with the first Josephson junction. The second coupler includes a second Josephson junction and a second other Josephson junction connected in parallel with the second Josephson junction. The computing apparatus according to claim 1, wherein the first coupling structure includes a first coupling Josephson junction and a first coupling other Josephson junction connected in parallel with the first coupling Josephson junction.
5. The first bond structure includes a first bond Josephson junction, a first bond other Josephson junction, and a first bond intermediate Josephson junction. The end of the first bond Josephson junction is connected to the end of the first bond intermediate Josephson junction, The other end of the first joint Josephson junction is connected to the other end of the first joint other Josephson junction. The computing device according to claim 1, wherein the end of the first bond other Josephson junction is connected to the other end of the first bond intermediate Josephson junction.
6. The first coupler includes a first Josephson junction, a first other Josephson junction, and a first intermediate Josephson junction. The end of the first Josephson junction is connected to the end of the first intermediate Josephson junction. The other end of the first Josephson joint is connected to the other end of the first other Josephson joint. The computing device according to claim 5, wherein the end of the first other Josephson junction is connected to the other end of the first intermediate Josephson junction.
7. The aforementioned second coupler includes a second Josephson junction, a second other Josephson junction, and a second intermediate Josephson junction. The end of the second Josephson joint is connected to the end of the second intermediate Josephson joint. The other end of the second Josephson joint is connected to the other end of the second other Josephson joint. The computing device according to claim 6, wherein the end of the second other Josephson junction is connected to the other end of the second intermediate Josephson junction.
8. Equipped with an element section, The element portion includes a first structure, a second structure, and a first coupling structure. The first structure is, A first cavity resonator having a first resonant frequency, A first other cavity resonator having a first other resonant frequency, A first coupler capable of coupling the first cavity resonator and the first other cavity resonator, Includes, The first other resonant frequency is lower than the first resonant frequency. The second structure described above is A second cavity resonator having a second resonant frequency, A second other cavity resonator having a second other resonant frequency, A second coupler capable of coupling the second cavity resonator and the second other cavity resonator, Includes, The aforementioned second resonant frequency is lower than the aforementioned second resonant frequency. The first combined structure is a computing device capable of combining the first structure and the second structure.
9. The first bond structure includes a first bond Josephson junction, a first bond other Josephson junction, and a first bond intermediate Josephson junction. The end of the first bond Josephson junction is connected to the end of the first bond intermediate Josephson junction, The other end of the first joint Josephson junction is connected to the other end of the first joint other Josephson junction. The computing device according to claim 8, wherein the end of the first bond other Josephson junction is connected to the other end of the first bond intermediate Josephson junction.
10. The first bond structure includes a first bond portion, a second first bond portion, a first bond opposing portion, and a second first bond opposing portion. The first bond opposing portion is electrically connected to one end of the first bond Josephson junction and to one end of the first bond intermediate Josephson junction. The opposing portion of the first bond is electrically connected to one end of the Josephson junction of the first bond and to the other end of the intermediate Josephson junction of the first bond. The first coupling portion is electrically connected to the other end of the first coupling Josephson junction and the other end of the first coupling other Josephson junction. The other portion of the first bond is electrically connected to the other end of the first bond Josephson junction and the other end of the other Josephson junction of the first bond. The first coupling portion is electrically connected to the first other cavity resonator enclosure member of the first other cavity resonator, The first coupling portion is electrically connected to the second cavity resonator enclosure member of the second cavity resonator. The first coupling opposing portion is capacitively coupled to the inner member of the first other cavity resonator of the first other cavity resonator. The computing apparatus according to claim 5 or 9, wherein the first coupled opposing other portion is capacitively coupled to the inner member of the second cavity resonator of the second cavity resonator.