Circuit board, method for manufacturing a circuit board, and electronic device.

Abstract

To provide a circuit board with a built-in semiconductor device, which is constructed to prevent cracking and have excellent reliability of operation over a wide temperature range.SOLUTION: A circuit board 10A consists of a first insulating substrate 1 laminated to a second insulating substrate 2 via a first adhesive layer 7a, and a semiconductor element 9 is embedded in an embedded portion 1c formed in the first insulating substrate 1.SELECTED DRAWING: Figure 1

Claims

1. A multilayer wiring board in which insulating substrates with metal layers are laminated via a heat-resistant adhesive layer, The first insulating substrate, which is made of an inorganic material, has a recessed portion formed in the stacking direction, and a semiconductor element is embedded in the recessed portion. The semiconductor element is an optical device, a first electronic component is mounted on the first insulating substrate, an optical waveguide is formed on the first insulating substrate, the first electronic component and the optical device are connected, and the optical device and the optical waveguide are coupled. The optical device has a first external electrode and a second external electrode, the first external electrode is connected to a conductive paste filled in the second insulating substrate of the insulating substrate, and the second external electrode is connected to the first electronic component. A circuit board characterized by the following.

2. The inorganic material is glass, and the adhesive layer is made of thermoplastic resin. The circuit board according to claim 1, characterized by the following:

3. At least one of the adhesive layers that adheres to the first insulating substrate has a laminated structure, the first layer in close contact with the first insulating substrate is made of a thermosetting resin, and the second layer in close contact with the first layer is made of a thermoplastic resin. A circuit board according to claim 1 or 2, characterized by the above.

4. The external electrodes in the semiconductor device are connected by a conductive paste filled in the second insulating substrate of the insulating substrate. A circuit board according to any one of claims 1 to 3, characterized by the above.

5. An electronic device having a circuit board according to any one of claims 1 to 4.

6. A manufacturing method for producing a multilayer wiring board by laminating insulating substrates on which metal layers are formed via a heat-resistant adhesive layer, The first insulating substrate, which is made of an inorganic material, has a recessed portion formed in the stacking direction, After stacking the first insulating substrate, a semiconductor element is embedded in the embedded portion. The semiconductor element is an optical device, an optical waveguide is formed on the first insulating substrate to couple the optical device and the optical waveguide, and a first electronic component is mounted on the first insulating substrate and the first electronic component and the optical device are connected. The optical device has a first external electrode and a second external electrode, the first external electrode is connected to a conductive paste filled in the second insulating substrate of the insulating substrate, and the second external electrode is connected to the first electronic component. A method for manufacturing circuit boards characterized by the following.

7. A manufacturing method for producing a multilayer wiring board by laminating insulating substrates on which metal layers are formed via a heat-resistant adhesive layer, The first insulating substrate, which is made of an inorganic material, has a recessed portion formed in the stacking direction, After stacking the first insulating substrate, a semiconductor element is embedded in the embedded portion. The semiconductor element is an optical device, an optical waveguide is formed on the first insulating substrate to couple the optical device and the optical waveguide, and a first electronic component is mounted on the first insulating substrate and the first electronic component and the optical device are connected. The optical waveguide is formed by patterning or ion exchange treatment. A method for manufacturing circuit boards characterized by the following.

8. The inorganic material is glass, and the adhesive layer is made of thermoplastic resin. A method for manufacturing a circuit board according to claim 6 or 7, characterized by the above.

9. At least one of the adhesive layers that adheres to the first insulating substrate has a laminated structure, the first layer in close contact with the first insulating substrate is made of a thermosetting resin, and the second layer in close contact with the first layer is made of a thermoplastic resin. A method for manufacturing a circuit board according to claim 6 or 7, characterized by the above.

10. The external electrodes of the semiconductor device are connected by a conductive paste filled in the second insulating substrate of the insulating substrate. A method for manufacturing a circuit board according to any one of claims 6 to 9, characterized by the above.

11. The aforementioned embedded portion is formed by etching. A method for manufacturing a circuit board according to any one of claims 6 to 10, characterized by the above.

Images