Valve assemblies and valve systems used for fluid flow control.
The valve assembly with a standalone valve and sensor package addresses the high cost and redundancy of current MFCs by integrating with existing systems for precise fluid flow control, reducing costs and maintaining accuracy during semiconductor processing.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ILLINOIS TOOL WORKS INC
- Filing Date
- 2020-09-11
- Publication Date
- 2026-06-26
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Current-generation mass flow controllers (MFCs) for semiconductor wafer processing are expensive and provide redundant hardware, exceeding manufacturers' needs, and require precise control over multiple setpoints and frequent stopping/restarting, increasing production costs.
A valve assembly with a standalone valve, sensor chip package, and controller interface that uses parametric values to adjust valve stroke, integrating with existing processor-based control units to manage fluid flow accurately and efficiently.
Reduces production costs by providing precise fluid flow control without redundant hardware, utilizing existing control units, and maintaining tight flow rates during continuous process interruptions.
Smart Images

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Abstract
Description
Technical Field
[0001] This application claims the benefit of U.S. Provisional Patent Application No. 62 / 900,322, filed Sep. 13, 2019, the entire disclosure of which is incorporated herein by reference.
Background Art
[0002] Equipment used in the manufacture of semiconductor wafers is required to operate with high precision in order to maintain a desired production yield. In the process of generating integrated circuits, semiconductor wafers are processed using certain chemicals within a process chamber. Mass flow controllers (MFCs) are used in an aligned configuration to supply these chemicals to the process chamber in a timely and consistent manner and at a consistent flow rate. This can be significantly difficult because MFCs must maintain very strict accuracy, operate at multiple setpoints, and need to stop and restart continuously during the wafer manufacturing process. To manage such accuracy, state-of-the-art MFCs are equipped with a processor-based control unit, a number of sensors, and an advanced diagnostic system. However, these high-end MFCs are quite expensive and may far exceed the manufacturer's needs.
Summary of the Invention
[0003] To more fully understand the features and advantages of the present disclosure, reference is now made to the detailed description taken in conjunction with the accompanying drawings. In the accompanying drawings, corresponding numerals in different figures refer to corresponding parts.
Brief Description of the Drawings
[0004] [Figure 1A] FIG. 1A is an explanatory diagram of a valve assembly and a fluid processing system for managing an appropriate supply of fluid for manufacturing operations such as semiconductor processing manufacturing operations according to certain example embodiments. [Figure 1B]Figure 1B is an explanatory diagram of a valve assembly and fluid handling system for managing the appropriate supply of fluids for manufacturing operations such as semiconductor processing and manufacturing operations, according to a certain example embodiment. [Figure 1C] Figure 1C is an explanatory diagram of a valve assembly and fluid handling system for managing the appropriate supply of fluids for manufacturing operations such as semiconductor processing and manufacturing, according to certain example embodiments. [Figure 2] Figure 2 is a flowchart of an algorithm used for generating parametric values, communicating parametric values, and controlling the flow rate of a valve assembly based on parametric values, according to one exemplary embodiment. [Figure 3] Figure 3 shows a computing machine and a system application module according to one exemplary embodiment. [Modes for carrying out the invention]
[0005] While the creation and use of various embodiments of this disclosure will be discussed in detail below, it should be understood that this disclosure provides many applicable inventive concepts that can be embodied in a wide variety of specific situations. The specific embodiments discussed herein are illustrative and do not define the scope of this disclosure. For clarity, this disclosure may not describe all features of actual embodiments. Naturally, it will be understood that in developing any such actual embodiments, developers will have to make many embodiment-specific decisions to achieve their specific goals, such as compliance with system-related and business-related constraints, which will vary depending on the embodiment. Furthermore, it will be understood that such development efforts, while complex and time-consuming, are routine tasks for those skilled in the art who are interested in this disclosure.
[0006] As mentioned earlier, current-generation commercial MFCs are quite expensive and may far exceed the needs of manufacturers. Even if a particular MFC meets a manufacturer's needs, that manufacturer's production equipment may already have its own processor-based control units, sensors, and advanced diagnostic systems. For example, process chambers used in etching processes to etch circuits onto semiconductor wafers utilize separate control units, sensors, and diagnostic systems. In these specific cases, current-generation commercial MFCs provide redundant hardware and functional services, thus increasing production costs. Therefore, there is a need for a valve assembly that can be integrated with the manufacturer's production operations and, using the parametric variables provided by those operations, can operate with multiple setpoints and maintain a very tight mass flow rate of fluid while constantly stopping and restarting during the production process.
[0007] This specification presents a valve assembly for controlling fluid flow. The valve assembly comprises a valve block having an upstream reservoir, a downstream reservoir, and a valve seat for circulating fluid from an upstream position to a downstream position. The valve assembly further comprises a standalone valve having a movable member, a sensor chip package having at least one sensor coupled to the standalone valve, and a controller interface. The controller interface transmits at least one measured parametric value provided by the at least one sensor and receives a control signal used to adjust the valve stroke of the standalone valve. The control signal is determined based on the at least one measured parametric value.
[0008] In some embodiments, the control signal for a standalone valve is determined based on at least one measured parametric value and at least one other parametric value. In some embodiments, the valve assembly may also include a control unit having an interface for communicating with the standalone valve's controller interface. The control unit may also include another interface for receiving at least one other parametric value. The at least one other parametric value indicates the pressure of at least one selected from the group including at least one upstream pressure sensor positioned upstream of the standalone valve and at least one downstream pressure sensor positioned downstream of the standalone valve. The control unit may also generate a control signal for adjusting the valve stroke based on at least one parametric value and at least one other parametric value.
[0009] In some additional embodiments, the sensor chip package includes a position sensor. The sensor chip package generates at least one parametric value indicating at least one selected from the group including the position of a movable member and obstruction of a non-movable member. The sensor chip package may also include at least one upstream pressure sensor positioned in the upstream reservoir or upstream channel of the valve block. The sensor chip package may also include at least one downstream pressure sensor positioned in the downstream reservoir or downstream channel of the valve block. The sensor chip package may also include differential pressure sensors positioned in the upstream and downstream reservoirs. The sensor chip package may also include a temperature sensor positioned in at least one selected from the group including the upstream reservoir, upstream channel, downstream reservoir, downstream channel, and valve seat.
[0010] In some embodiments, the sensor chip package can generate parametric values indicating the position of a movable member. The sensor chip package can also generate parametric values indicating interference from a non-movable member. The sensor chip package can also generate one or more parametric values indicating the pressure of at least one selected from the group including an upstream pressure sensor positioned in a valve block, a downstream pressure sensor, and a differential pressure sensor. The sensor chip package can also generate parametric values indicating heat.
[0011] In some other embodiments, the sensor chip package can generate parametric values indicating the position of a movable member. The sensor chip package can also generate parametric values indicating interference from a non-movable member. The sensor chip package can also generate parametric values indicating the pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor. The sensor chip package can also generate parametric values indicating the temperature of at least one selected from the group including an upstream reservoir, an upstream channel, a valve seat, a downstream reservoir, and a downstream channel.
[0012] This specification also presents a fluid handling system used in manufacturing equipment. This fluid handling system comprises a valve block, a standalone valve, an upstream fluid source fluid-coupled to the standalone valve, a downstream process tool fluid-coupled to the standalone valve, and a control unit. The valve block includes an upstream reservoir, a downstream reservoir, and a valve seat that allows fluid to flow from the upstream position to the downstream position. The standalone valve has a movable member, and a sensor chip package has at least one sensor coupled to the valve. The control unit includes an interface communicatively coupled to the standalone valve and the sensor chip package. The control unit generates a control signal used to control the stroke of the standalone valve based on at least one parametric value from the sensor chip package.
[0013] In some embodiments, the control unit interface is communicatively coupled to at least one selected from a group including at least one upstream pressure sensor positioned upstream and at least one downstream pressure sensor positioned downstream. In these embodiments, the interface generates a control signal used to control the stroke of a standalone valve based on at least one parametric value from a sensor chip package and at least one other parametric value. The other parametric value represents the pressure from the group including at least one upstream pressure sensor positioned upstream of the valve block and at least one downstream pressure sensor positioned downstream of the valve block.
[0014] The sensor chip package includes a position sensor. The sensor chip package generates a parametric value indicating at least one selected from the group including the position of a movable member and interference of a non-movable member. In some embodiments, the sensor chip package may also include an upstream pressure sensor positioned in the upstream reservoir of the valve block. In some embodiments, the sensor chip package may also include a downstream pressure sensor positioned in the downstream reservoir of the valve block. In some embodiments, the sensor chip package may also include differential pressure sensors positioned in the upstream and downstream reservoirs. In some embodiments, the sensor chip package includes a temperature sensor positioned in at least one selected from the group including the upstream reservoir, upstream channel, downstream reservoir, downstream channel, and valve seat.
[0015] The sensor chip package generates a parametric value indicating the position of at least one selected from the group including the position of a movable member and the obstruction of a non-movable member. In some embodiments, the sensor chip package generates one or more parametric values indicating the pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor. In some embodiments, the sensor chip package generates a parametric value indicating the temperature of at least one selected from the group including an upstream reservoir, a valve seat, and a downstream reservoir. In some embodiments, the upstream fluid source includes an upstream pressure sensor. In some embodiments, the downstream process tool includes a downstream pressure sensor.
[0016] As used herein, "upstream" or "upstream side" refers to, for example, the location or side closest to the fluid source after the upstream valve or before the downstream valve in an MFC. As used herein, "high pressure (HP) side" or "HP side" of an MFC refers to the upstream or upstream side. As used herein, "downstream" or "downstream side" refers to the location or side furthest from the fluid source. As used herein, "one or more positional predetermined values" refers to a priori variables, including valve seat position values based on variables including valve seat position values and fluid flow rate. As used herein, "valve seat opening" refers to the instantaneous position of the valve in either the closed or open state, or any position between the closed and open states. As used herein, "volume body" refers to a reservoir of known volume used as a point in a flow line for measuring the pressure of the fluid flowing through that flow line. As used herein, "parametric value" refers to a variable having parameters and values. As used herein, "control signal" refers to an encoded signal that can also be a variable.
[0017] Referring here to Figures 1A to 1C, a valve assembly and fluid processing system for managing the proper supply of fluid for manufacturing operations such as semiconductor processing and manufacturing operations are shown according to an exemplary embodiment. Basically, this fluid processing system is a third-party system. The valve assembly comprises a valve 10 (piezo or solenoid), a sensor chip package 12, and a valve block 14. The valve assembly may also include a control unit 20. However, the control unit 20 may be part of a fluid processing system to which the valve assembly is communicatively coupled. In addition, the control unit 20 may be a processing unit with the valve assembly, or a processing unit provided by an integrated fluid processing system to perform a specific task. The fluid processing system comprises a fluid source 16 and a process tool 18. The control unit 20, in combination with feedback from the valve assembly and fluid processing system, controls the valve assembly to maintain a desired fluid flow rate of the fluid circulating between the fluid source 16 at the upstream position and the process tool 18 at the downstream position based on read parametric values. In addition, any changes to the actual flow rate based on the desired flow rate are communicated to the process tool 18 in the form of at least one parametric value, such as an absolute pressure value.
[0018] Valve 10 is coupled to valve block 14. Valve 10 includes movable members such as a valve stem 10A and a valve body 10B. Valve block 14 includes channels including an upstream inlet channel 14A and a downstream outlet channel 14B, an upstream reservoir 14C, a valve seat 14D, and a downstream reservoir 14E. Any flow path between the fluid source 16 and the process tool 18 has a known volume and can be used by control unit 20 with parametric values described herein to control the position of the valve stem 10A or the valve body 10B. The valve stem 10A and valve body 10B respond to commands from control unit 20A. The stroke of valve 10 is represented by the valve stem 10A and valve body 10B when they are fully open, fully closed, or between fully open and fully closed. Valve 10 is fully closed when the valve body 10B is at the same height as the valve seat 14C. In response to the opening operation, the fluid flows from the upstream channel 14A into the upstream reservoir 14C at a flow rate determined by the degree to which the valve seat 14C is open, and then flows through the valve seat 14D, the downstream reservoir 14E, and the downstream outlet channel 14B. Clearly, the degree to which the valve seat 14C is open is based on several parametric values such as a set value, fluid type, position of the movable member, current flow rate, temperature, and pressure.
[0019] In one embodiment, the valve assembly comprises only a single valve 10 and a sensor chip package 12, the sensor chip package 12 having a position sensor. In another embodiment, the sensor chip package 12 includes a position sensor and at least one selected from the group including absolute pressure sensors and differential pressure sensors. In other words, the sensor chip package 12 may include a position sensor and at least one absolute pressure sensor or at least one differential pressure sensor, or it may include a position sensor and a combination of one or more absolute pressure sensors and one or more differential pressure sensors. In some embodiments, the sensor chip package 12 may include a differential pressure (DP) sensor or a temperature sensor, or both. These sensors can be positioned in any flow path of the valve block 14, such as the inlet channel 14A, outlet channel 14B, upstream reservoir 14C, valve seat 14D, and downstream reservoir 14E.
[0020] In Figure 1A, the manufacturer's fluid handling system includes a universal gas box as the fluid source 16, and the process tool 18 includes a process chamber 18A and a gas manifold 18B. In Figure 1B, the manufacturer's fluid handling system includes a fluid source 16 from an upstream process, and the process tool 18 includes a process chamber 18A. In this embodiment, process gas is supplied to the process chamber 18A by positioning a valve between the universal gas box and the process chamber, near the chamber lid. In Figure 1C, the fluid source 16 is helium, and the process tool 18 includes a wafer chuck 18C. In the embodiments of Figures 1A, 1B, and 1C, a pressure sensor 30 is positioned upstream of the valve assembly to measure pressure in volume 1 (V1) and generate a parametric value P1. In addition to this embodiment, a pressure sensor 32 is positioned downstream of the valve assembly to measure pressure in volume 2 (V2) and generate a parametric value P2. However, depending on the configuration of the valve assembly, pressure sensors 30 and 32 may not be required. In addition to the embodiments shown in Figures 1A and 1C, sensors integrated within the manufacturer's fluid source 16 and process tool 18 are used to measure pressure and generate parametric values P0 and P3, respectively. In the embodiment shown in Figure 1B, another sensor 34 is positioned between the fluid source 16 and V1 to measure pressure and generate parametric value P0. The pressure sensors 30 and 32 can be gauge sensors, differential pressure sensors, absolute pressure sensors, or any combination thereof.
[0021] In addition to the embodiments described above, the sensor chip package 12 communicates the position of the valve stem 10A and / or valve body 10B, or other movable flow limiting mechanisms such as a ball on the valve seat, to the control unit 20 for reading and processing. Priori information describing the stroke of the valve stem 10A and / or valve body 10B, such as information describing position 0 as the valve closed, information describing position 10 as fully open, and various variables describing the positions between them, can be stored in memory or hard disk associated with the control unit 20 and correlated with the stored flow values. In some of these embodiments, the sensor chip package 12 includes, in addition to the position sensor, an upstream absolute pressure sensor, for example, positioned in the upstream inlet channel 14A to measure absolute pressure and communicate a parametric value P1. In some of these embodiments, the sensor chip package 12 may include, in addition to the position sensor, a downstream absolute pressure sensor, for example, positioned in the downstream outlet channel 14B to measure absolute pressure and communicate a parametric value P2. In some of these embodiments, the sensor chip package 12 may include, in addition to the position sensor, both an upstream absolute pressure sensor and a downstream absolute pressure sensor that measure absolute pressure and communicate parametric values P1 and P2. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a differential pressure sensor that measures differential pressure (DP). In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a differential pressure sensor that measures pressure and generates parametric values DP, P1 or P2 or both, and one or both of an upstream absolute pressure sensor and a downstream absolute pressure sensor. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor that measures the temperature of the orifice and reservoir 14C. In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor.In some embodiments, the sensor chip package 12 may include, in addition to the position sensor, a temperature sensor and at least one selected from the group including a differential pressure sensor, an upstream absolute pressure sensor, and a downstream absolute pressure sensor. Obviously, the sensor chip package 12 included with the valve assembly may depend on the manufacturer's sensor configuration for the fluid handling system.
[0022] In each of the embodiments described above, the position of the valve stem 10A and / or valve body 10B, and the parametric values P0 to P3 of the absolute pressure are communicated to and read by the control unit 20 in order to control the operation of the valve assembly. In some embodiments, the position of the valve stem 10A and / or valve body 10B, the parametric values P0 to P3 of the absolute pressure, and at least one selected from the group including DP and the parametric value of temperature are communicated to and read by the control unit 20 in order to control the operation of the valve assembly. In addition, if P3 is updated, the updated P3 is provided to the process tool 18 used to adjust the operation of either the process chamber 18A or the wafer chuck 18B. In some embodiments, the valve assembly may be included in the process tool 18, for example, in the gas manifold 18B or on top of the process chamber 18A.
[0023] Referring now to FIG. 2, there is shown a flow diagram of an algorithm used for generating parametric values, communicating the parametric values, and controlling the flow rate of a valve assembly based on the parametric values, according to an exemplary embodiment. The algorithm is shown generally as 60. Algorithm 60 begins at block 62, where, in the valve assembly, the algorithm generates at least one parametric value. The generated parametric value indicates the position of the valve stem 10A or the valve body 10B, or both. In addition to the parametric value indicating the position of the valve stem 10A or the valve body 10B, the algorithm can generate at least one other parametric value indicating the absolute pressure from at least one selected from the group including an upstream absolute pressure sensor and at least one downstream absolute pressure sensor. The other parametric values generated can include DP and temperature.
[0024] In one embodiment, the fluid processing system can include one or more upstream absolute pressure sensors positioned at one or more upstream locations from the valve assembly. The one or more downstream absolute pressure sensors can be positioned at a downstream location from the valve assembly. Basically, the absolute pressure sensors measure the pressure and algorithm 60 generates P0 and P3. In some embodiments, depending on the manufacturer's equipment, sensor 30 or sensor 32, or both, are used to measure the pressure and algorithm 60 generates P1 and P2 in addition to P0 and P3.
[0025] In one embodiment, the sensor chip package 12 can include at least one selected from the group including an upstream absolute pressure sensor positioned within the upstream inlet channel 14A of the valve block 14 and a downstream absolute pressure sensor positioned within the downstream outlet channel 14B of the valve block 14. Additionally, the sensor chip package 12 of the valve 10 can include a differential pressure sensor that measures differential pressure. Further, the sensor chip package 12 of the valve 10 can include a temperature sensor that measures temperature. More specifically, a sensor chip package 12 having a specific sensor configuration can be coupled to the valve 10 based on the specific sensor configuration of the fluid processing system.
[0026] The algorithm 60 generates at least one selected from the group including a parametric value indicating the position of the valve stem 10A or the valve body 10B, parametric values P0 and P3 indicating the absolute pressures in the fluid source 16 and the process tool 18, and parametric values P1 and P2 indicating the upstream absolute pressure and the downstream absolute pressure at a position within or outside the valve assembly. In some embodiments, a parametric value indicating differential pressure (DP) is generated. In some embodiments, a parametric value indicating temperature is generated. In some embodiments, parametric values of DP and temperature are generated.
[0027] In block 64, algorithm 60 communicates parametric values generated from the sensor chip package 12 and other sensors from the fluid processing system for further processing. In block 66, the communicated parametric values, including the position of the valve stem 10A or valve body 10B, absolute pressure, and optionally differential pressure and temperature, are read, processed, and used, along with stored prior information, to determine a desired flow rate. This desired flow rate can be based on a set value, the fluid type, the position of the valve stem 10A and / or valve body 10B, and the current flow rate, temperature, and pressure (absolute and differential). In block 68, the positions of the valve stem 10A and valve body 10B are adjusted using the determined flow rate and stored correlation variables representing various positions of the valve stem 10A and valve body 10B. In block 70, at least one of the parametric values, such as some adjustment to P3, is communicated to the process tool 18.
[0028] Referring here to Figure 3, an example of a computing machine 100 and a system application module 200 are shown. The computing machine 100 can be any of the various computers, mobile devices, laptop computers, Internet of Things (IoT), servers, embedded systems, or computing systems presented herein. The module 200 may include one or more hardware or software elements, such as other OS applications and user and kernel space applications, designed to facilitate the computing machine 100 performing the various methods and processing functions presented herein. The computing machine 100 includes a processor 110, a system bus 120, system memory 130, storage media 140, input / output interfaces 150, and a network 170, such as cellular / GPS, Bluetooth®, Wi-Fi®, or DeviceNet. (Registered trademark) EtherCAT (Registered trademark)It may include various internal or auxiliary components, such as a network interface 160 for communicating with Analog, RS485, etc., and one or more sensors 180.
[0029] A computing machine can be implemented as a conventional computer system, embedded controller, laptop, server, mobile device, smartphone, wearable computer, customized machine, any other hardware platform, or any combination or a combination thereof. A computing machine can also be a distributed system configured to function using multiple computing machines interconnected via a data network or bus system.
[0030] The processor 110 can be designed to execute code instructions to perform the operations and functions described herein, manage request flows and address mappings, perform calculations, and generate commands. The processor 110 can be configured to monitor and control the operation of components in a computing machine. The processor 110 can be a general-purpose processor, a processor core, a multiprocessor, a reconfigurable processor, a microcontroller, a digital signal processor ("DSP"), an application-specific integrated circuit ("ASIC"), a controller, a state machine, gate logic, a discrete hardware component, any other processing unit, or any combination or a combination thereof. The processor 110 can be a single processing unit, multiple processing units, a single processing core, multiple processing cores, a dedicated processing core, a coprocessor, or any combination thereof. According to certain embodiments, the processor 110 can be a software-based or hardware-based virtual computing machine running in one or more other computing machines together with other components of computing machine 100.
[0031] The system memory 130 may include non-volatile memory such as read-only memory ("ROM"), programmable read-only memory ("PROM"), erasable programmable read-only memory ("EPROM"), flash memory, or any other device capable of storing program instructions or data with or without power applied. The system memory 130 may also include volatile memory such as random access memory ("RAM"), static random access memory ("SRAM"), dynamic random access memory ("DRAM"), and synchronous dynamic random access memory ("SDRAM"). Other types of RAM may also be used to implement the system memory 130. The system memory 130 may be implemented using a single memory module or multiple memory modules. Although the system memory 130 is presented as part of a computing machine, those skilled in the art will understand that the system memory 130 may be separate from the computing machine 100 without departing from the scope of the subject art. It should also be understood that the system memory 130 may include or operate with non-volatile storage devices such as a storage medium 140.
[0032] The storage medium 140 may include hard disks, floppy disks, compact disk read-only memory ("CD-ROM"), digital versatile disks ("DVD"), Blu-ray discs, magnetic tape, flash memory, other non-volatile memory devices, solid-state drives ("SSD"), any magnetic storage devices, any optical storage devices, any electrical storage devices, any semiconductor storage devices, any physical-based storage devices, any other data storage devices, or any combination or a selection of these. The storage medium 140 can store one or more operating systems, application programs and program modules, data, or any other information. The storage medium 140 may be part of a computing machine or connected to a computing machine. The storage medium 140 may also be part of one or more other computing machines that communicate with the computing machine, such as servers, database servers, cloud storage, or network-attached storage.
[0033] Application module 200 and other OS application modules may include one or more hardware or software elements configured to facilitate the execution of various methods and processing functions presented herein by a computing machine. Application module 200 and other OS application modules may include one or more algorithms or sequences of instructions stored as software or firmware in association with system memory 130, storage medium 140, or both. Thus, storage medium 140 may represent an example of a machine or computer-readable medium capable of storing instructions or code for execution by processor 110. Machine or computer-readable medium can generally refer to any one or more media used to provide instructions to processor 110. Such machine or computer-readable media associated with application module 200 and other OS application modules may include computer software products. It should be understood that computer software products including application module 200 and other OS application modules may also be associated with one or more processes or methods for delivering application module 200 and other OS application modules to a computing machine via a network, any signaling medium, or any other communication or distribution technology. Application module 200 and other OS application modules may also include hardware circuits, or information for configuring hardware circuits such as microcode, or configuration information for FPGAs or other PLDs. In one embodiment, application module 200 and other OS application modules may include algorithms capable of performing functional operations described by the computer system flowcharts (operating modes) presented herein.
[0034] The input / output ("I / O") interface 150 can be configured to connect to one or more external devices, receive data from one or more external devices, and transmit data to one or more external devices. These external devices, along with various internal devices, may also be known as peripheral devices. The I / O interface 150 can include both electrical and physical connections to connect various peripheral devices to the computing machine or processor 110. The I / O interface 150 can be configured to communicate data, addresses, and control signals between peripheral devices, the computing machine, or the processor 110. The I / O interface 150 supports Small Computer System Interface ("SCSI"), Serial Attached SCSI ("SAS"), Fibre Channel, Peripheral Component Interconnect ("PCI"), PCI Express (PCIe), Serial Bus, Parallel Bus, Advanced Technology Attachment ("ATA"), Serial ATA ("SATA"), Universal Serial Bus ("USB"), and Thunderbolt. (Registered trademark) FireWire (Registered trademark) It can be configured to implement any standard interface, such as various video buses. The I / O interface 150 can be configured to implement only one interface or bus technology. Alternatively, the I / O interface 150 can be configured to implement multiple interfaces or bus technologies. The I / O interface 150 can be configured to operate as part of the system bus 120, as the entirety of the system bus 120, or together with the system bus 120. The I / O interface 150 can include one or more buffers for buffering transmissions between one or more external devices, internal devices, computing machines, or processors 110.
[0035] The I / O interface 150 can connect a computing machine to a variety of input devices, including mice, touchscreens, scanners, electronic digitizers, sensors, receivers, touchpads, trackballs, cameras, microphones, keyboards, any other pointing devices, or any combination thereof. The I / O interface 150 can also connect a computing machine to a variety of output devices, including video displays, speakers, printers, projectors, haptic feedback devices, automation controls, robotic components, actuators, motors, fans, solenoids, valves, pumps, transmitters, signal generators, lights, and the like.
[0036] Computing machine 100 can operate in a networked environment using logical connections via NIC 160 to one or more other systems or computing machines on the network. Examples of networks include wide area networks (WANs), local area networks (LANs), intranets, the Internet, wireless access networks, wired networks, mobile networks, telephone networks, optical networks, or combinations thereof. The network can be a packet-switched network or circuit-switched network of any topology and can use any communication protocol. Communication links within the network can involve various digital or analog communication media, such as fiber optic cables, free-space optics, waveguides, conductors, wireless links, antennas, and radio frequency communications.
[0037] One or more sensors 180 can be a position sensor and a pressure sensor. The pressure sensor can be an absolute pressure (P) sensor or a differential pressure (DP) sensor. The position sensor can be a capacitive sensor, an optical sensor, a strain gauge sensor, or a magnetic sensor. Sensor 180 can be a conventional sensor or a semiconductor-based sensor.
[0038] The processor 110 can be connected to other components of the computing machine or various peripheral devices considered herein via the system bus 120. It should be understood that the system bus 120 can be within the processor 110, outside the processor 110, or both. According to some embodiments, the processor 110, any of the other components of the computing machine, or any of the various peripheral devices considered herein can be incorporated into a single device such as a system-on-a-chip ("SOC"), system-on-a-package ("SOP"), or ASIC device.
[0039] Embodiments may include computer programs that embody the functions described and illustrated herein, which are implemented in a computer system comprising instructions stored in a machine-readable medium and a processor that executes those instructions. However, it should be clear that there are many different ways of implementing embodiments in computer programming, and embodiments should not be construed as being limited to any one set of computer program instructions unless otherwise disclosed in an exemplary embodiment. Furthermore, a skilled programmer could write such a computer program to implement one of the embodiments disclosed based on the accompanying flowcharts, algorithms, and relevant descriptions in the text of the application. Therefore, disclosure of a particular set of program code instructions is not considered necessary for a full understanding of how to create and use embodiments. Furthermore, a person skilled in the art will understand that one or more aspects of the embodiments described herein can be implemented in one or more computing systems by hardware, software, or a combination thereof. Furthermore, any reference to an action performed by a computer should not be construed as being performed by a single computer, since two or more computers can perform that action.
[0040] The embodiments described herein can be used in conjunction with computer hardware and software that perform the methods and processing functions described above. The systems, methods, and procedures described herein can be implemented in programmable computers, computer executable software, or digital circuits. The software can be stored on computer-readable media. Examples of computer-readable media include floppy disks, RAM, ROM, hard disks, removable media, flash memory, memory sticks, optical media, magneto-optical media, CD-ROMs, etc. Examples of digital circuits include integrated circuits, gate arrays, building block logic, field-programmable gate arrays (FPGAs), etc.
[0041] The system examples, method examples, and action examples described in the embodiments presented above are illustrative, and in alternative embodiments, certain actions may be performed in a different order, in parallel with each other, completely omitted, and / or combined between different embodiments, and / or certain additional actions may be performed, without departing from the scope and spirit of the various embodiments. Accordingly, such alternative embodiments are included in the description herein.
[0042] Where used herein, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms. Where used herein, the terms "comprises" and / or "comprising" identify the presence of the described feature, complete, step, action, element, and / or component, but do not exclude the presence or addition of one or more other features, complete, step, action, element, component, and / or groups thereof. Where used herein, the term "and / or" includes any and all combinations of one or more of the items listed together. Where used herein, phrases such as "between X and Y" and "between about X and Y" should be interpreted as including X and Y. In this specification, phrases such as "between X and Y" mean "between X and about Y." In this specification, phrases such as "from about X to Y" mean "from about X to about Y."
[0043] As used herein, “hardware” may include combinations of discrete components, integrated circuits, application-specific integrated circuits, field-programmable gate arrays, or other suitable hardware. As used herein, “software” may include one or more objects, agents, threads, lines of code, subroutines, separate software applications, two or more lines of code or other suitable software structures operating in two or more software applications on one or more processors (the processors include one or more microcomputers or other suitable data processing units, memory devices, input / output devices, data input devices such as displays, keyboards or mice, peripherals such as printers and speakers, associated drivers, control cards, power supplies, network devices, docking station devices, or other suitable devices that operate together with the processor or other devices under the control of the software system), or other suitable software structures. In one exemplary embodiment, the software may include one or more lines of code or other suitable software structures operating in a general-purpose software application such as an operating system, and one or more lines of code or other suitable software structures operating in a dedicated software application. As used herein, the terms “couple,” “couples,” and “coupled” are related terms and may include physical connections (such as copper conductors), virtual connections (such as randomly assigned memory locations in data memory devices), logical connections (such as logic gates in semiconductor devices), other suitable connections, or suitable combinations of such connections.The term "data" can refer to a suitable structure for using, transporting, or storing data, such as a data message having data fields, data buffers, data values, and sender / receiver address data; a control message having data values and one or more operators that causes a receiving system or component to perform a function using the data; or other suitable hardware or software components for the electronic processing of data.
[0044] Generally, a software system is a system that operates on a processor to perform a predetermined function in response to a given data field. For example, a system can be defined by the function that the system performs and the data field on which the system performs the function. As used herein, a NAME system (where NAME is typically the name of a general-purpose function performed by the system) refers to a software system that operates on a processor and is configured to perform a disclosed function for a disclosed data field. Unless a specific algorithm is disclosed, any suitable algorithm known to a person skilled in the art for performing a function using the relevant data field is construed to be within the scope of this disclosure. For example, a message system that generates a message including a sender address field, a recipient address field, and a message field may include software running on a processor that can obtain the sender address field, recipient address field, and message field from a suitable system or device of the processor, such as a buffer device or buffer system; assemble the sender address field, recipient address field, and message field into a suitable electronic message format (such as an email message, a TCP / IP message, or any other suitable message format having a sender address field, recipient address field, and message field); and transmit the electronic message using the processor's electronic messaging system and devices over a communication medium such as a network. While this disclosure is intended to illustrate exemplary embodiments for those skilled in the art, it is not intended to provide guidance to those not skilled in the art, such as those unfamiliar with programming in a suitable programming language or the processor. Based on the above disclosure, specific coding can be provided for specific applications.A specific algorithm for performing a certain function may be provided in flowchart form or in other preferred format, and data fields and associated functions may be shown in exemplary sequence of operations, the sequence may be rearranged as preferred and is not intended to be limiting unless explicitly mentioned to be limiting.
[0045] Where used herein, unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" are intended to include the plural forms. Where used herein, the terms "comprises" and / or "comprising" identify the presence of the described feature, complete, step, action, element, and / or component, but do not exclude the presence or addition of one or more other features, complete, step, action, element, component, and / or groups thereof. Where used herein, the term "and / or" includes any and all combinations of one or more of the items listed together. Where used herein, phrases such as "between X and Y" and "between about X and Y" should be interpreted as including X and Y. In this specification, phrases such as "between X and Y" mean "between X and about Y." In this specification, phrases such as "from about X to Y" mean "from about X to about Y."
[0046] The embodiments disclosed above are presented for illustrative purposes and to enable those skilled in the art to implement the disclosure; however, the disclosure is not intended to be exhaustive or to limit oneself to the disclosed forms. Those skilled in the art will see many non-substantial modifications and variations without departing from the spirit and scope of the disclosure. The claims are intended to broadly encompass the disclosed embodiments and any such modifications. Furthermore, the following clauses represent further embodiments of the disclosure and should be considered within the scope of the disclosure.
[0047] Article 1. A valve block having an upstream reservoir, a downstream reservoir, and a valve seat for circulating fluid from the upstream position to the downstream position, A standalone valve having a movable member, A sensor chip package having at least one sensor coupled with a standalone valve, A controller interface that transmits at least one measured parametric value provided by at least one sensor and receives a control signal used to adjust the valve stroke of a standalone valve, wherein the control signal is determined based on at least one measured parametric value, and the controller interface A valve assembly that controls fluid flow rate, equipped with the necessary components.
[0048] Clause 2. The control signal for a standalone valve assembly as described in Clause 1 is determined based on at least one measured parametric value and at least one other parametric value.
[0049] Clause 3. Further comprising a control unit having an interface for communicating with the controller interface of a standalone valve, The control unit has another interface for receiving at least one other parametric value, the at least one other parametric value indicating at least one pressure selected from the group including at least one upstream pressure sensor positioned upstream of the standalone valve and at least one downstream pressure sensor positioned downstream of the standalone valve. The valve assembly according to Clause 1, wherein the control unit generates a control signal that adjusts the valve stroke based on at least one parametric value and at least one other parametric value.
[0050] Clause 4. The sensor chip package comprises a position sensor, as described in Clause 1 of the valve assembly.
[0051] Clause 5. The valve assembly according to Clause 4, wherein the sensor chip package generates at least one parametric value indicating at least one selected from the group including the position of a movable member and interference of a non-movable member.
[0052] Clause 6. The sensor chip package is An upstream pressure sensor positioned in the upstream reservoir or upstream channel of the valve block; a downstream pressure sensor positioned in the downstream reservoir or downstream channel of the valve block; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and at least one temperature sensor selected from the group including the upstream reservoir, upstream channel, downstream reservoir, downstream channel, and valve seat. The valve assembly described in Clause 4 further comprises the following:
[0053] Clause 7. The sensor chip package is The position of at least one selected from the group including the position of a movable member and the obstruction of a non-movable member, The pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor, A valve assembly according to Clause 6 that generates at least one parametric value indicating the above.
[0054] Clause 8. The sensor chip package is The position of at least one selected from the group including the position of a movable member and the obstruction of a non-movable member, The pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor, The temperature of at least one selected from the group including the upstream reservoir, valve seat, and downstream reservoir, A valve assembly according to Clause 6 that generates at least one parametric value indicating the above.
[0055] Article 9. A valve block having an upstream reservoir, a downstream reservoir, and a valve seat for circulating fluid from the upstream position to the downstream position, A standalone valve having a movable member, A sensor chip package having at least one sensor coupled with a valve, An upstream fluid source fluid-coupled to a standalone valve, A downstream process tool fluid-coupled to a standalone valve, A control unit having an interface communicatively coupled to a standalone valve and sensor chip package, Equipped with, The control unit is a fluid handling system used in manufacturing equipment that generates a control signal used to control the stroke of a standalone valve based on at least one parametric value from a sensor chip package.
[0056] Clause 10. The interface is communicatively coupled to at least one selected from the group including at least one upstream pressure sensor located at an upstream position and at least one downstream pressure sensor located at a downstream position. The fluid handling system according to Clause 9, wherein the interface generates a control signal used to control the stroke of a standalone valve based on at least one parametric value from a sensor chip package and at least one other parametric value from a group including at least one upstream pressure sensor positioned upstream of the valve block and at least one downstream pressure sensor positioned downstream of the valve block.
[0057] Clause 11. The fluid processing system described in Clause 9 comprises a sensor chip package with a position sensor.
[0058] Clause 12. The fluid processing system according to Clause 11, wherein the sensor chip package generates at least one parametric value indicating at least one selected from the group including the position of a movable member and interference of a non-movable member.
[0059] Clause 13. The sensor chip package is An upstream pressure sensor positioned in the upstream reservoir of the valve block, a downstream pressure sensor positioned in the downstream reservoir of the valve block, a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir, and at least one selected from the group including the upstream reservoir, upstream channel, downstream reservoir, downstream channel, and valve seat, The fluid processing system described in Clause 12 further comprises the following:
[0060] Clause 14. The sensor chip package is The position of at least one selected from the group including the position of a movable member and the obstruction of a non-movable member, The pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor, A fluid processing system according to Clause 13, which generates at least one parametric value indicating the following.
[0061] Clause 15. The sensor chip package is The position of at least one selected from the group including the position of a movable member and the obstruction of a non-movable member, The pressure of at least one selected from the group including an upstream pressure sensor, a downstream pressure sensor, and a differential pressure sensor, The temperature of at least one selected from the group including the upstream reservoir, valve seat, and downstream reservoir, A fluid processing system according to Clause 13, which generates at least one parametric value indicating the following.
[0062] Clause 16. The fluid processing system according to Clause 9, wherein the upstream fluid source comprises at least one upstream pressure sensor.
[0063] Clause 17. The fluid processing system described in Clause 9 includes a downstream process tool equipped with a downstream pressure sensor.
[0064] Clause 18. A method using a valve assembly to control the fluid flow rate in a fluid processing system, In a valve assembly, a first parametric value is generated that indicates the position of the movable member of the standalone valve, Upstream of the valve assembly, a second parametric value representing absolute pressure is generated, In a process tool downstream of the valve assembly, a third parametric value representing pressure is generated, Adjusting the valve position based on a first parametric value, a second parametric value, a third parametric value, and at least one other parametric value selected from the group including a setpoint, current fluid flow rate, fluid type, at least one other pressure, temperature, and differential pressure, Methods that include...
[0065] Article 19. To generate another parametric value indicating pressure from the upstream position between the fluid source and the valve assembly, To generate another parametric value indicating pressure from the upstream position between the process tool and the valve assembly, The method described in Article 18, further including the method described in Article 18.
[0066] Article 20. In the upstream inlet channel of the valve assembly, generate another parametric value indicating pressure, In the downstream outlet channel of the valve assembly, generate another parametric value indicating pressure, The method described in Article 18, further including the method described in Article 18.
Claims
1. A valve block having an upstream reservoir, a downstream reservoir, and a valve seat for circulating fluid from the upstream position to the downstream position, A standalone valve having a movable member, A sensor chip package having at least two sensors coupled to the standalone valve, A controller interface that transmits at least one measured parametric value provided by the at least two sensors and receives a control signal used to adjust the valve stroke of the standalone valve, wherein the control signal is determined based on the at least one measured parametric value, comprising: The first parametric value indicating pressure is generated in the upstream inlet channel of the valve assembly. A second parametric value indicating pressure is generated in the downstream outlet channel of the valve assembly, which controls the fluid flow rate of the valve assembly.
2. The valve assembly according to claim 1, wherein the control signal of the standalone valve is determined based on the at least one measured parametric value and at least one other parametric value.
3. The control unit further comprises an interface for communicating with the controller interface of the standalone valve, The control unit has another interface for receiving at least one other parametric value, the at least one other parametric value representing at least one pressure selected from the group including at least one upstream pressure sensor positioned upstream of the standalone valve and at least one downstream pressure sensor positioned downstream of the standalone valve. The valve assembly according to claim 1, wherein the control unit generates the control signal for adjusting the valve stroke based on the at least one measured parametric value and the at least one other parametric value.
4. The valve assembly according to claim 1, wherein the sensor chip package comprises a position sensor.
5. The valve assembly according to claim 4, wherein the sensor chip package generates the at least one measured parametric value that is selected from the group including the position of the movable member and the position of the shut-off portion of the non-movable member that is in contact with the movable member.
6. The aforementioned sensor chip package is The valve assembly according to claim 4, further comprising: an upstream pressure sensor positioned in the upstream reservoir or upstream inlet channel of the valve block; a downstream pressure sensor positioned in the downstream reservoir or downstream outlet channel of the valve block; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and at least one selected from the group including the upstream reservoir, the upstream inlet channel, the downstream reservoir, the downstream outlet channel, and the valve seat.
7. The aforementioned sensor chip package is The position of at least one selected from the group including the position of the movable member and the position of the blocking portion of the non-movable member that contacts the movable member, The pressure of at least one selected from the group including the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor, The valve assembly according to claim 6, which generates the at least one measured parametric value indicating the above.
8. The aforementioned sensor chip package is The position of at least one selected from the group including the position of the movable member and the position of the blocking portion of the non-movable member that contacts the movable member, The pressure of at least one selected from the group including the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor, The temperature of at least one selected from the group including the upstream reservoir, the upstream inlet channel, the valve seat, the downstream reservoir, and the downstream outlet channel, The valve assembly according to claim 6, which generates the at least one measured parametric value indicating the above.
9. A valve block having an upstream reservoir, a downstream reservoir, and a valve seat for circulating fluid from the upstream position to the downstream position, A standalone valve having a movable member, A sensor chip package having at least one sensor coupled to the standalone valve, An upstream fluid source fluid-coupled to the standalone valve, wherein a first pressure sensor is positioned between the valve block and the upstream fluid source, A downstream process tool fluidly coupled to the standalone valve, wherein a second pressure sensor is positioned between the valve block and the downstream process tool, and the downstream process tool includes a downstream pressure sensor. The system comprises the first pressure sensor, the second pressure sensor, the standalone valve, and a control unit having an interface communicatively coupled to the sensor chip package, The control unit is a fluid processing system used in a manufacturing facility, which generates a control signal used to control the stroke of the standalone valve based on at least one parametric value from the sensor chip package, the first pressure sensor, and the second pressure sensor.
10. The interface is communicatively coupled to at least one selected from the group including at least one upstream pressure sensor positioned at an upstream location and at least one downstream pressure sensor positioned at a downstream location. The fluid handling system according to claim 9, wherein the interface generates the control signal used to control the stroke of the standalone valve based on at least one measured parametric value from the sensor chip package and at least one other parametric value from a group including the at least one upstream pressure sensor positioned upstream of the valve block and the at least one downstream pressure sensor positioned downstream of the valve block.
11. The fluid processing system according to claim 9, wherein the sensor chip package comprises a position sensor.
12. The fluid processing system according to claim 11, wherein the sensor chip package generates at least one measured parametric value that is selected from the group including the position of the movable member and the position of the blocking portion of the non-movable member that is in contact with the movable member.
13. The aforementioned sensor chip package is The fluid processing system according to claim 12, further comprising: an upstream pressure sensor positioned in the upstream reservoir of the valve block; a downstream pressure sensor positioned in the downstream reservoir of the valve block; a differential pressure sensor positioned in the upstream reservoir and the downstream reservoir; and at least one selected from the group including the upstream reservoir, the upstream inlet channel, the downstream reservoir, the downstream outlet channel, and the valve seat.
14. The aforementioned sensor chip package is The position of at least one selected from the group including the position of the movable member and the position of the blocking portion of the non-movable member that contacts the movable member, The fluid processing system according to claim 13, which generates the at least one measured parametric value indicating the pressure of at least one selected from the group including the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor.
15. The aforementioned sensor chip package is The position of at least one selected from the group including the position of the movable member and the position of the blocking portion of the non-movable member that contacts the movable member, The pressure of at least one selected from the group including the upstream pressure sensor, the downstream pressure sensor, and the differential pressure sensor, The temperature of at least one selected from the group including the upstream reservoir, the valve seat, and the downstream reservoir, The fluid processing system according to claim 13, which generates at least one measured parametric value indicating the above.
16. The fluid processing system according to claim 9, wherein the upstream fluid source is equipped with an upstream pressure sensor.
17. A method using a valve assembly to control the fluid flow rate in a fluid processing system, In the valve assembly, a first parametric value is generated that indicates the position of the movable member of the standalone valve, Upstream of the valve assembly, a second parametric value is generated that indicates the absolute pressure at a position between the valve assembly and the upstream fluid source. In the upstream inlet channel of the valve assembly, another parametric value indicating pressure is generated, In a process tool downstream of the valve assembly, a third parametric value is generated that indicates the pressure at a position between the valve assembly and the process tool downstream. In the downstream outlet channel of the valve assembly, another parametric value indicating pressure is generated, A method comprising adjusting the position of a valve based on the first parametric value, the second parametric value, the third parametric value, and at least one other parametric value selected from the group including a set value, current fluid flow rate, fluid type, at least one other pressure, temperature, and differential pressure.