Joints and composite materials using polyetheretherketone resins
A lattice-matched interface between PEEK resin and metal oxide addresses bonding and composite challenges, enhancing adhesion strength and stability in PEEK resin-based materials.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- HITACHI LTD
- Filing Date
- 2022-11-04
- Publication Date
- 2026-06-26
AI Technical Summary
PEEK resin faces challenges in bonding or composite formation with other materials due to its high thermal stability and low reactivity, leading to delamination issues under external forces.
A bonded body and composite material are formed with a lattice-matched interface between PEEK resin and metal oxide, where the spacing difference between benzene rings in PEEK resin and metal atoms in the crystal plane is 5% or less, and an atomic density of 17 atoms/nm², enhancing adhesion strength and reducing interfacial fracture.
The solution provides high adhesion strength and stability in the bonded body and composite material, minimizing interfacial failure and improving yield strength.
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