Sensors and sensor modules

Abstract

To provide a sensor module capable of facilitating attachment / detachment of a sensor from a mounting substrate.SOLUTION: A sensor module comprises: a sensor 100 including a substrate 10 having an inclined plane 11 which is inclined so that an angle formed between at least a part of a side face and a top face is obtuse, a detection element 21 that is provided on and / or in the substrate and detects a specific substance in a liquid, a sensitive membrane 24 provided on the detection element, and metal layers 20a to 20d electrically connected to the detection element and provided on the inclined plane; a mounting substrate 30 that the sensor is provided on the top face; and a conductive member that is provided on the mounting substrate, of which a tip comes into contact with the metal layer from outside of the sensor toward a direction of the metal layer, and that can be attached to or detached from the sensor.SELECTED DRAWING: Figure 4

Description

Technical Field

[0001] The present invention relates to a sensor and a sensor module, and more particularly to a sensor and a sensor module for detecting information about a liquid.

Background Art

[0002] Sensors are known in which a sensitive film (reaction film) is provided on a SAW (Surface Acoustic Wave) device for detecting information about a liquid such as a substance in the liquid (for example, Patent Documents 1 to 3).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in a sensor for detecting information about a liquid, the sensitive film is exposed to the liquid. Therefore, the liquid easily remains on the sensitive film, and the sensor needs to be frequently replaced from the mounting substrate on which the sensor is mounted. When the mounting substrate and the sensor are joined by solder or the like, melting the solder to remove the sensor lacks simplicity and places a heavy burden.

[0005] The present invention has been made in view of the above problems, and an object thereof is to facilitate detachment of the sensor from the mounting substrate.

Means for Solving the Problems

[0006] The present invention relates to a sensor module comprising: a substrate having an inclined surface such that at least a portion of its side surface is inclined at an obtuse angle to its top surface; a detection element provided on and / or within the substrate for detecting a specific substance in a liquid; a sensitive film provided on the detection element; a metal layer provided on the inclined surface and electrically connected to the detection element; a mounting substrate on which the sensor is provided on its top surface; and a conductive member provided on the mounting substrate, the tip of which contacts the metal layer from the outside of the sensor toward the metal layer, and which allows the sensor to be attached and detached.

[0007] In the above configuration, the sensor may be configured to include a guide path for guiding the liquid to the sensitive membrane.

[0008] In the above configuration, the metal layer includes a first metal layer provided on a first inclined surface on a first side surface of the substrate and a second metal layer provided on a second inclined surface on a second side surface facing the first side surface of the substrate, and the conductive member may include a first conductive member in contact with the first metal layer and a second conductive member in contact with the second metal layer.

[0009] In the above configuration, the tip of the first conductive member that contacts the first metal layer is fixed to the mounting substrate, and the tip of the second conductive member that contacts the second metal layer is movable relative to the mounting substrate.

[0010] In the above configuration, a fixing member is provided on the mounting substrate, the metal layer is provided on an inclined surface on the first side surface of the substrate, the tip of the conductive member abuts against the metal layer from the outside of the sensor toward the metal layer, and the second side surface of the substrate opposite the first side surface abuts against the fixing member, thereby enabling the sensor to be attached and detached.

[0011] In the above configuration, the inclined surface can be an uneven surface.

[0012] In the above configuration, the detection element can be a surface acoustic wave element or a piezoelectric thin-film resonator.

[0013] In the above configuration, the detection element may include an IDT having a plurality of electrode fingers provided on the substrate, and the metal layer may not be provided on the side surface of the substrate in the direction in which the plurality of electrode fingers of the IDT are arranged.

[0014] In the above configuration, the sensitive membrane may be configured to include an antibody.

[0015] The present invention relates to a sensor comprising: a substrate having an inclined surface such that at least a portion of its side surface is inclined at an obtuse angle to its top surface; a detection element provided on the top surface of the substrate for detecting a specific substance in a liquid; a sensitive membrane provided on the detection element; a guide path for guiding the liquid to the sensitive membrane; and a metal layer provided on the inclined surface and electrically connected to the detection element.

[0016] In the above configuration, the sensor is provided on a mounting substrate, and the tip of a conductive member provided on the mounting substrate contacts the metal layer from the outside of the sensor toward the metal layer, thereby enabling the sensor to be attached and detached.

[0017] The present invention relates to a sensor comprising: a substrate having substantially a hexahedron and two tapered surfaces provided from one end to the other of two opposing sides in a plan view, and a flat surface between the two tapered surfaces, the substrate having a first region for a detection element provided on the flat surface for detecting a specific substance in a liquid, a second region for wiring extending on the flat surface around the first region, and a third region for a connecting electrode provided on the tapered surface and connected to the outside; a conductive pattern having an electrode in the detection element provided in the first region, wiring provided in the second region, and a connecting electrode provided in the third region that is electrically connected to the electrode via the wiring; and a sensitive film provided on the detection element. [Effects of the Invention]

[0018] According to the present invention, the attachment and detachment of the sensor from the mounting substrate can be facilitated.

Brief Description of the Drawings

[0019] [Figure 1] Figures 1(a) to 1(d) are cross-sectional views of the sensor chip. [Figure 2] Figure 2 is a plan view of the sensor in Example 1. [Figure 3] Figures 3(a) and 3(b) are the cross-sectional views taken along the line A-A and B-B of Figure 1, respectively. [Figure 4] Figure 4(a) is a plan view of the sensor module in Example 1, and Figure 4(b) is the cross-sectional view taken along the line A-A of Figure 4(a). [Figure 5] Figure 5 is a plan view of the sensor in Modified Example 1 of Example 1. [Figure 6] Figure 6 is a cross-sectional view of the sensor module in Modified Example 1 of Example 1. [Figure 7] Figure 7 is a plan view of the sensor in Modified Example 2 of Example 1. [Figure 8] Figure 8 is a plan view of the sensor in Modified Example 3 of Example 1. [Figure 9] Figures 9(a) and 9(b) are cross-sectional views of the sensor in Modified Example 4 of Example 1. [Figure 10] Figures 10(a) and 10(b) are cross-sectional views of the sensor in Modified Example 5 of Example 1. [Figure 11] Figure 11 is a plan view of the sensor in Example 2. [Figure 12] Figures 12(a) and 12(b) are the cross-sectional views taken along the line A-A and B-B of Figure 11, respectively. [Figure 13] Figures 13(a) and 13(b) are cross-sectional views of the sensor in Modified Example 1 of Example 2. [Figure 14] Figure 14 is a plan view of the sensor in Example 3. [Figure 15] Figures 15(a) to 15(c) are the cross-sectional views taken along the line A-A of Figure 14. [Figure 16] Figure 16 is a plan view of the sensor in Example 4. [Figure 17] Figure 17 is a cross-sectional view of Figure 16, section AA. [Figure 18] Figures 18(a) to 18(c) are cross-sectional views showing the method for manufacturing the sensor in Example 5. [Figure 19] Figures 19(a) to 19(c) are cross-sectional views showing a method for manufacturing a sensor in a modified example 1 of Example 5. [Figure 20] Figures 20(a) and 20(b) are cross-sectional views showing a method for manufacturing the sensor in a modified example 2 of Example 5. [Figure 21] Figure 21(a) is a block diagram of the detection system according to Example 6, and Figure 21(b) is a block diagram of the detection system according to Modification 1 of Example 6. [Modes for carrying out the invention]

[0020] Figures 1(a) to 1(d) are cross-sectional views of the sensor chip 80. The sensor chip 80 is generally approximately hexahedral. The sensor chip 80 is fabricated on and / or within a large substrate such as a wafer. Units that will become the sensor chip 80 are formed in a matrix on the wafer. Then, by fully dicing the boundaries of the units using a dicing device, a hexahedral sensor chip 80 is obtained.

[0021] Depending on the type of sensor, if it has a piezoelectric layer, a lower electrode is laminated on the substrate, an active piezoelectric layer is laminated on the lower electrode, and an upper electrode is laminated on the piezoelectric layer. A sensitive film is formed on the upper electrode. When the sensor is formed using semiconductor elements such as FETs (Field Effect Transistors), a P-type semiconductor layer, an intrinsic semiconductor layer, and / or an N-type semiconductor layer are fabricated as active regions on the surface and within the substrate. Then, at least two electrodes are formed on the upper surface of this hexahedron sensor chip 80 in order to drive the sensor.

[0022] On the other hand, in the case of a sensor chip 80 that detects liquid, for example, the sensitive membrane is immersed in the liquid. Therefore, the sensor chip 80 needs to be replaced frequently, and a mechanism for easy replacement is required.

[0023] If the sensor chip 80 is to be easily replaced, it is necessary to prevent damage to the sensor chip 80 due to mechanical pressure. In the embodiment described below, a mechanical pressing mechanism is used to enable mounting of the sensor chip 80 to the mounting substrate 30 and electrical connection between the sensor chip 80 and the mounting substrate 30, while preventing damage to the sensor chip 80.

[0024] In the sensor chip 80, most components are a support substrate or a substrate made of the material that forms the sensor. The support substrate or the constituent material of the substrate is a single crystal, polycrystalline or amorphous ceramic or semiconductor material, or an inorganic insulating material such as glass, sapphire or SiN. These materials are thin in the finished sensor chip 80.

[0025] The sensor chip 80 is almost rectangular and thin. That is, the area of ​​the top surface 80a and the bottom surface 80b is large, while the area of ​​the sides 80c and 80d is small. As shown in Figure 1(a), if a force F1 is applied to the sensor chip 80 from the top surface 80a or the bottom surface 80b in the thickness direction, the sensor chip 80 may easily break.

[0026] Furthermore, as shown in Figure 1(b), the angles between the sides 80c and 80d of the sensor chip 80 and the top surface 80a and bottom surface 80b are approximately 90°. The sensor chip 80 has some strength against the horizontal force F2 applied to the opposing sides 80c and 80d. However, because the sensor chip 80 is thin, it can bend upward or downward as shown by the dashed line. This may cause warping of the sensing film, etc., potentially preventing stable immersion in liquid or stable sensing.

[0027] To solve the above problems, the present invention discloses the following embodiment. As shown in Figure 1(c), the sensor chip 80 has sides 80c and 80d that form an obtuse angle θ with respect to the upper surface 80a. When the fixing jig 85 is brought into contact with the left side surface 80d and the conductive member 86 is pressed down from above on the right side surface 80c as indicated by arrow 88, a force Fx is applied to the side surface 80c in the planar direction of the upper surface 80a, preventing lateral displacement of the sensor chip 80. A downward force Fz is also applied. Force Fz becomes the force that fixes the sensor chip 80 to the mounting substrate 30. Therefore, the sensor chip 80 can be easily fixed to the mounting substrate 30 by the fixing jig 85 and the conductive member 86. A connecting electrode 84 is provided on the inclined side surface 80c. The conductive member 86 mechanically contacts the connecting electrode 84, enabling electrical connection between the conductive member 86 and the connecting electrode 84.

[0028] Furthermore, another embodiment is disclosed as shown in Figure 1(d). In the sensor chip 80, a support substrate 82 and a sensor layer 81 provided on the support substrate 82 are stacked. In this case, the side surface 82c of the support substrate 82 and the side surface 81c of the sensor layer 81 are inclined surfaces. The connecting electrode 84 extends from the side surface 82c to 81c. This makes it easy to remove the sensor chip 80, similar to the case shown in Figure 1(c).

[0029] As described above, by making the side surface 80c of the sensor chip 80 an inclined surface and providing the connection electrode 84, which is electrically connected to the detection element inside the sensor chip 80, on the inclined surface of the side surface 80c, the sensor chip 80 can be removed. A specific embodiment will be described below. [Examples]

[0030] Example 1 is an example in which a delayed linear surface acoustic wave element is used as the detection element. Figure 2 is a plan view of the sensor 100 in Example 1, and Figures 3(a) and 3(b) are cross-sectional views AA and BB of Figure 2, respectively.

[0031] The direction of elastic wave propagation on the upper surface of the substrate 10 is defined as the X direction (long side direction), the direction normal to the upper surface of the substrate 10 is defined as the Z direction, and the direction parallel to the upper surface of the substrate 10 and perpendicular to the X direction is defined as the Y direction (short side direction). In Figure 2, the sensitive membrane 24 is shown with a dashed line, and the cavity 27, inlet 27a, and outlet 27b are shown with solid lines. The fluid tip 26, inlet passage 28a, and outlet passage 28b are not shown.

[0032] As shown in Figures 2 to 3(b), the sensor 100 (corresponding to the sensor chip 80 in Figure 1(c)) has IDTs (Interdigital Transducers) 16a and 16b on the substrate 10. The IDTs 16a and 16b are spaced apart. The IDTs 16a and 16b are formed of a metal film 17. Each IDT has a pair of comb-shaped electrodes 14a and 14b. The comb-shaped electrode 14a has multiple electrode fingers 12a and a bus bar 13a, and the comb-shaped electrode 14b has electrode fingers 12b and a bus bar 13b. The bus bars 13a and 13b extending in the X direction are connected to the Y ends of the multiple electrode fingers 12a and the -Y ends of the electrode fingers 12b, respectively.

[0033] Viewed from the X direction, the regions where electrode fingers 12a and 12b overlap are regions 15a and 15b where surface acoustic waves propagate. In at least a portion of regions 15a and 15b, electrode fingers 12a and 12b are arranged alternately, one at a time. Region 15c, to which regions 15a and 15b extend in the X direction, is the region where surface acoustic waves mainly propagate. The busbars 13a and 13b of IDT16a are electrically connected to the metal layers 20a and 20b (corresponding to the connecting electrode 84 in Figure 1(c)) via wiring 18. The busbars 13a and 13b of IDT16b are electrically connected to the metal layers 20c and 20d (connecting electrodes) via wiring 18.

[0034] The region 15c between IDTs 16a and 16b is the propagation path 15 through which surface acoustic waves primarily propagate. A metal film 22 is provided on the substrate 10 of the propagation path 15. The metal film 22 may be made of the same material as the metal film 17 forming IDTs 16a and 16b, or it may be made of a different material. The metal film 22 functions as a sensing electrode to obtain the effect of mass loading in the propagation path 15 by canceling the electrical effects that are affected by the dielectric constant and electrical conductivity of the liquid when the liquid to be detected comes into contact with the sensitive film 24. The metal film 22 may not be provided. The sensitive film 24 is provided on the metal film 22 via a linker such as a self-assembled monolayer.

[0035] The fluid chip 26 is, for example, a microchannel. The fluid chip 26 is provided with a cavity 27. The lower surface of the cavity 27 is in contact with the upper surface of the sensing membrane 24 or surrounds the sensing membrane 24. The upper and side surfaces of the cavity 27 correspond to the inner walls of the fluid chip 26. The cavity 27 is a sensing space where the liquid to be sensed accumulates. The fluid chip 26 is provided with an inlet 27a and an outlet 27b connected to the cavity 27. As shown in Figure 2, the inlet 27a and outlet 27b are, for example, located on the upper surface of the cavity 27. The inlet 27a is connected to the +X side end of the cavity 27 near the +X side short side of the rectangular propagation path 15 in a plan view, and the outlet 27b is connected to the -X side end of the cavity 27 near the -X side short side of the propagation path 15. Note that the positions of the inlet 27a and outlet 27b are not limited to the above configuration.

[0036] An inlet 27a and an outlet 27b are connected to an inlet passage 28a and an outlet passage 28b, respectively. The inlet passage 28a and the outlet passage 28b are, for example, liquid supply fittings to which tubes 29a and 29b are connected. As shown by arrow 50a, the liquid to be detected is introduced from tube 29a to the inlet passage 28a, and the liquid is supplied to the upper surface of the sensitive membrane 24 via the inlet passage 28a, the inlet 27a, and the cavity 27. The sensitive membrane 24 is exposed (immersed) in the liquid. After detecting a substance, the liquid is discharged to tube 29b via the cavity 27, the outlet 27b, and the outlet passage 28b, as shown by arrow 50b. Multiple inlets 27a and inlet passages 28a, outlets 27b and outlet passages 28b may be provided.

[0037] When metal layer 20a is set to ground potential and a high-frequency signal is applied to metal layer 20b, IDT16a excites surface acoustic waves near the surface of substrate 10. The surface acoustic waves propagate near the surface of substrate 10 in the propagation path 15 and reach IDT16b. In IDT16b, the surface acoustic waves cause a high-frequency signal to be output to metal layer 20d relative to metal layer 20c, which is at ground potential.

[0038] When substances in the liquid are adsorbed onto the sensitive film 24, the sensitive film 24 becomes heavier. This increases the mass added to the propagation path 15, slowing down the velocity of the surface acoustic waves propagating through the propagation path 15. Therefore, the change in the velocity of the surface acoustic waves can be detected from the change in the phase difference between the high-frequency signal transmitted by IDT 16a and the high-frequency signal received from IDT 16b. This allows for the detection of substances in the liquid. In this way, the IDTs 16a and 16b and the propagation path 15, which are provided on the upper surface of the substrate 10, function as detection elements 21 that detect information related to the liquid.

[0039] The planar shape of the substrate 10 is approximately rectangular. The ±Y side surfaces (the two longer sides) of the substrate 10 are inclined surfaces 11 with an obtuse angle θ with respect to the top surface, and the ±X side surfaces (the shorter sides) of the substrate 10 are vertical surfaces 11a perpendicular to the top surface of the substrate 10. The inclined surfaces 11 have an obtuse angle θ with respect to the top surface of the substrate 10. The vertical surfaces 11a have an angle of approximately 90° with respect to the top surface of the substrate 10. The metal layers 20a to 20d are provided on the inclined surfaces 11. Note that the ±X side surfaces of the substrate 10 may be inclined with respect to the top surface of the substrate 10. The sides of the substrate 10 are generally formed using a dicing blade. The sides other than those intentionally made into inclined surfaces 11 are determined by the shape of the dicing blade used to cut the substrate 10.

[0040] The substrate 10 is substantially a hexahedron and has inclined surfaces 11 (tapered surfaces) provided from one end to the other of two opposing sides in a plan view, and a top surface which is a flat surface between the inclined surfaces 11. The top surface has a first region for the detection element 21, a second region around the first region for wiring 18 extending to the top surface, and a third region for connecting electrodes (metal layers 20a to 20d) provided on the inclined surfaces 11 and connected to the outside. A conductive pattern is provided having electrodes (IDT 16a and 16b) within the detection element 21 provided in the first region, wiring 18 provided in the second region, and metal layers 20a to 20d provided in the third region that are electrically connected to the electrodes via the wiring 18.

[0041] The substrate 10 is, for example, a piezoelectric substrate, a lithium tantalate (LiTaO3) substrate, a lithium niobate (LiNbO3) substrate, or a quartz substrate, such as a single-crystal rotational Y-cut X-propagation lithium tantalate substrate or a single-crystal rotational Y-cut X-propagation lithium niobate substrate.

[0042] The metal film 17 is mainly composed of at least one metal, such as aluminum, copper, and molybdenum. The wiring 18, metal layer 20, and metal film 22 are mainly composed of gold, copper, and aluminum, for example. The wiring 18, metal film 22, and metal film 17 may be formed simultaneously and may be made of the same material as each other.

[0043] The sensitive membrane 24 is, for example, an antibody connected to a metal membrane 22 by a linker or other connector. The antibody binds to a specific antigen in the liquid (for example, a protein to which the antibody binds from a virus or bacteria, or the protein itself).

[0044] The fluid tip 26 is made of, for example, a resin such as polydimethylsiloxane, a silicon substrate, a glass substrate, or a metal. The inlet passage 28a and the outlet passage 28b are made of, for example, a resin.

[0045] Figure 4(a) is a plan view of the sensor module in Example 1, and Figure 4(b) is a cross-sectional view AA of Figure 4(a).

[0046] As shown in Figures 4(a) and 4(b), the sensor 100 is mounted on the mounting substrate 30. Conductive pins 36a to 36d are fixed to the mounting substrate 30. Conductive pins 36a and 36c (first conductive members) are in contact with metal layers 20a and 20c (first metal layers) provided on the inclined surface 11 (first inclined surface) of the first side surface corresponding to the long side of the +Y side (upper side in Figure 4(a)) of the substrate 10 of the sensor 100. Conductive pins 36b and 36d (second conductive members) are in contact with metal layers 20b and 20d (second metal layers) provided on the inclined surface 11 (second inclined surface) of the second side surface corresponding to the long side of the -Y side (lower side in Figure 4(a)) of the substrate 10 of the sensor 100. Conductive pins 36a to 36d are equipped with a pin portion 37a and a connector portion 37b. The connector portion 37b is fixed to the mounting board 30 by a fixing member 34. The tips of the pin portions 37a mechanically contact the metal layers 20a to 20d provided on the inclined surface 11 from the outside of the sensor 100. The conductive pins 36a to 36d are electrically connected to the terminal 38 via wiring 32, as shown on the left side (-X side) of Figure 4(a).

[0047] Terminal 38 is plugged into a connector terminal on a motherboard, which is provided separately from the mounting board 30, and is connected to a circuit that drives the sensor module 120. This circuit is, for example, a circuit that detects substances in a liquid. Note that the circuit that detects substances in a liquid may also be provided on the mounting board 30.

[0048] The mounting substrate 30 is an insulating substrate made of resin or ceramics. The conductive pins 36a to 36d are, for example, spring pins (movable conductive members) or fixed pins (fixed conductive members). The spring pins have a spring installed inside. When the tip of the pin portion 37a is pressed toward the connector portion 37b, the pin portion 37a moves toward the connector portion 37b. At this time, the presence of a spring causes a force to act on the tip of the pin portion 37a in the direction of arrow 51a, and it is mechanically pressed toward the metal layer 20c. As a result, the tip of the pin portion 37a is electrically connected to the metal layer 20c. The fixed pins are rigid and do not extend or retract. The fixing member 34 is, for example, solder. The wiring 32 and terminals 38 are metal layers mainly composed of, for example, copper, gold, or aluminum.

[0049] As shown by arrow 51a in Figure 4(b), a force acts on the tips of the conductive pins 36a to 36d (i.e., the tips of the pin portion 37a) from the outside to the inside of the sensor 100. This causes the tips of the conductive pins 36a to 36d to press against the metal layers 20a to 20d in the direction of arrow 51a, thereby electrically connecting the conductive pins 36a to 36d with the metal layers 20a to 20d. Furthermore, the metal layers 20a to 20d are provided on the inclined surface 11. Therefore, a force is applied that presses the inclined surface 11 downwards, as shown by arrow 51b. As a result, the sensor 100 is pressed against the mounting substrate 30 and mechanically fixed in place.

[0050] The conductive pins 36a and 36c on the upper (+Y side) or the conductive pins 36b and 36d on the lower (-Y side) of Figure 4(a) may be fixed pins that do not move, and the other may be a spring pin. With this structure, the sensor 100 can be easily attached to and detached from the mounting board 30, as explained in Figure 1(c).

[0051] A method for mounting the sensor 100 to the mounting board 30 will be described. For example, conductive pins 36a and 36c are fixed pins and are fixed to the mounting board 30. Conductive pins 36b and 36d are not fixed to the mounting board 30, and their entirety is movable relative to the mounting board 30 in the vertical direction (±Y direction) as shown in Figure 4(a). Alternatively, conductive pins 36b and 36d are spring pins. That is, the connector portion 37b of conductive pins 36b and 36d is fixed to the mounting board 30 with solder or the like, and the pin portion 37a is attached to the connector portion 37b via a spring, and is movable relative to the mounting board 30 in the ±Y direction. In this way, the tips of conductive pins 36a and 36b are fixed to the mounting board 30. The tips of conductive pins 36b and 36d are movable relative to the mounting board 30.

[0052] First, the metal layers 20a and 20c on the upper (+Y) side of the sensor 100 are pressed against the tips of the pin portions 37a of the conductive pins 36a and 36c. Then, the pin portions 37a of the conductive pins 36b and 36d are moved to the upper (+Y) side of the paper relative to the mounting substrate 30, pressing the tips of the pin portions 37a of the conductive pins 36b and 36d against the metal layers 20b and 20d. As a result, the tips of the conductive pins 36b and 36d are mechanically brought into contact with the metal layers 20b and 20d, and the conductive pins 36b and 36d and the metal layers 20b and 20d are electrically connected.

[0053] Furthermore, the sensor 100 can be removed by moving the tips of the conductive pins 36b and 36d downward (-Y side) relative to the mounting substrate 30. In Figures 4(a) and 4(b), the direction of the force applied to the substrate 10 from the conductive pins 36a and 36c and conductive pins 36b and 36d is the direction of extension of the two short sides of the sensor 100 (Y direction). Applying force to the substrate 10 in the direction of extension of the short sides (Y direction) suppresses warping of the substrate 10 more effectively than applying force to the substrate 10 in the direction of extension of the long sides (X direction).

[0054] When the sensitive membrane 24 comes into contact with liquid, liquid tends to remain on the sensitive membrane 24. Also, if the sensor 100 has a fluid tip 26 (guide path) that guides the liquid to the sensitive membrane 24, liquid tends to remain in the cavity 27 of the fluid tip 26. For this reason, the sensor 100 will need to be replaced frequently from the mounting substrate 30 on which it is mounted. In particular, if the sensitive membrane 24 contains antibodies, it is difficult to detach the antigen from the antibodies, and the sensor 100 will need to be replaced after a single measurement.

[0055] According to Embodiment 1, the metal layers 20a to 20d electrically connected to the detection element 21 are provided on the inclined surface 11. The tips of the conductive pins 36a to 36d (conductive members) contact the metal layers 20a to 20d from the outside of the sensor 100, in the direction of the metal layers 20a to 20d of the sensor 100, making the sensor 100 detachable. This allows the sensor 100 to be electrically connected to the mounting substrate 30, and at the same time, the sensor 100 can be easily attached to and detached from the mounting substrate 30. Furthermore, as shown by arrow 51b in Figure 4(b), the sensor 100 can be pressed against the mounting substrate 30, enabling stable measurement.

[0056] In order to press the sensor 100 against the mounting substrate 30, the angle θ between the inclined surface 11 and the upper surface of the substrate 10 is preferably 100° or more and 170° or less, more preferably 110° or more and 160° or less, and even more preferably 120° or more and 150° or less. The thickness of the substrate 10 is, for example, 300 μm to 500 μm so that the conductive pins 36a to 36d can easily press against the metal layers 20a to 20d, respectively. The thickness of the metal layers 20a to 20d is preferably 0.5 μm or more so that the metal layers 20a to 20d do not peel off when the conductive pins 36a to 36d are pressed against them, respectively.

[0057] [Example 1 Modification 1] Figure 5 is a plan view of the sensor 102 in Modification 1 of Example 1. Two pairs of metal layers 20a to 20d are provided on one of the longer sides of the planar shape of the substrate 10. In Figure 5, an inclined surface 11 is provided on the lower (-Y side) longer side. Four metal layers 20a to 20d are provided on the inclined surface 11 of the lower (-Y side) longer side. The wiring 18 electrically connects the electrode fingers 12a and 12b of the right IDT 16a and left IDT 16b to the metal layers 20a to 20d, and rearranges the IDTs 16a and 16b on the metal layers 20a to 20b. In this case, the upper (+Y side) longer side of the substrate 10 is a vertical surface 11a and does not have an inclined surface. Therefore, the vertical surface 11a on the +Y side of the substrate 10 can be firmly brought into contact with the vertical surface of the fixing member 35 (see Figure 6), and the tips of all the pin portions 37a of the conductive pins 36a to 36d can be brought into contact with the metal layers 20a to 20d of the inclined surface 11 on the -Y side of the substrate 10. This contact operation is simpler than bringing the conductive pins 36a to 36d into contact with the inclined surfaces 11 on both sides of the substrate 10, as in Embodiment 1.

[0058] Figure 6 is a cross-sectional view of the sensor module in Modification 1 of Example 1, showing the sensor 102 of Figure 5 mounted on the mounting substrate 30 using a fixing member 35. The fixing member 35 is fixed to the mounting substrate 30 with adhesive or solder. On the other hand, the entire conductive pins 36a to 36d are movable relative to the mounting substrate 30. Alternatively, the conductive pins 36a to 36d are spring pins. The mechanism of the conductive pins 36a to 36d is the same as in Figures 4(a) and 4(b). By moving the conductive pins 36a to 36d themselves or the pin portions 37a of the conductive pins 36a to 36d so that the vertical surface 11a of the substrate 10 of the sensor 102 abuts against the fixing member 35 and the tips of the pin portions 37a of the conductive pins 36a to 36d abut against the metal layers 20a to 20d, mechanical fixing of the sensor 102 to the mounting substrate 30 and electrical connection between the sensor 102 and the mounting substrate 30 are made.

[0059] [Modification 2 of Example 1] Figure 7 is a plan view of the sensor 104 in Modification 2 of Example 1. The sensor 104 has inclined surfaces 11 on the lower (-Y side) and upper (+Y side) long sides of the planar shape of the substrate 10 in Figure 7. As shown in Figures 4(a) and 4(b), the conductive pins 36a to 36d are brought into contact with the inclined surfaces 11, and a force indicated by arrow 51b is generated on the two long sides, similar to Figure 4(b), to fix the sensor 104 to the mounting substrate 30. The other configurations are the same as Modification 1 of Example 1 and will not be described.

[0060] As shown in the modified examples 1 and 2 of Embodiment 1 in Figures 5 to 7, the inclined surface 11 on which the metal layers 20a to 20d are provided may be provided on one side surface of the substrate 10. In this case, as shown in Figure 6, the force pressing the sensor 102 against the mounting substrate 30 is generated on only one inclined surface 11. Therefore, the force pressing the sensor 102 against the mounting substrate 30 is small.

[0061] Therefore, as shown in Figure 4(b) of Example 1, a force is generated on the two opposing inclined surfaces 11 that presses the sensor 100 against the mounting substrate 30. Thus, compared to the structure in Figure 6, the sensor 100 can be pressed against the mounting substrate 30 with a greater force.

[0062] [Modification 3 of Example 1] Figure 8 is a plan view of the sensor 106 in modified example 3 of Embodiment 1. In the sensor 106, the two short sides (±X sides) of the substrate 10 are inclined surfaces 11, and the long side (±Y side) is a vertical surface 11a. As shown in Figure 8, the two wirings 18 on the left side (-X side) extend at an inclination angle with respect to the extension direction (X direction) of the busbars 13a and 30b. Metal layers 20a and 20b are provided on the inclined surface 11 on the left side (+X side). The two wirings 18 on the right side (+X side) extend at an inclination angle with respect to the extension direction (X direction) of the busbars 13a and 13b, and metal layers 20c and 20d are provided on the inclined surface 11 on the right side (+X side). The other configurations are the same as in Embodiment 1 and will not be described further.

[0063] In Example 1 and its modified form, the surface acoustic wave excited in IDT 16a propagates in the +X and -X directions, as shown by arrows 53a and 53b. Suppose a metal layer is provided in the portion of region 15a extended to the left (-X) short side, and a metal layer is provided in the portion of region 15b extended to the right (+Y) short side. In this case, the surface acoustic wave propagating as shown by arrow 53b is reflected by the metal layer and returns to IDT 16a as shown by arrow 53c, propagating through the propagation path 15. When the surface acoustic wave reflected by the metal layer reaches IDT 16b, noise increases, and the sensitivity of the detection element 21 decreases. All embodiments are designed to avoid this main propagation region of the elastic wave.

[0064] The metal layers 20a to 20d are not provided in the direction in which the electrode fingers 12a and 12b are aligned. This suppresses the reflection of surface acoustic waves of arrow 53c and improves the sensitivity of the detection element 21.

[0065] [Modification 4 of Example 1] Figures 9(a) and 9(b) correspond to the AA and BB cross-sectional views in Figure 8. In the sensor 108 of Modification 4, the inclined surface 11 is an uneven surface. Similar to Modification 3 in Figure 8, no metal layer is provided on the long side (±Y side) of the substrate 10. Also, as shown in Figure 9(b), metal layers 20a and 20c are provided on the inclined surface 11 in the long side direction (X direction) outside the ±Y direction of regions 15a and 15b (see Figure 8). Furthermore, as shown in Figure 9(a), the metal layers 20a to 20d are not provided in the extended region in the X direction of regions 15a and 15b (IDT 16a and 16b) where the electrode fingers 12a and 12b are arranged. This suppresses the reflection of surface acoustic waves indicated by arrow 53c and improves the sensitivity of the detection element 21. The other configurations are the same as Modification 3 of Example 1 and are omitted from the explanation.

[0066] In Modification 4 of Example 1, the inclined surface 11 is an uneven surface. As a result, as shown in Figure 9(b), the adhesion between the metal layers 20a to 20d and the inclined surface 11 is improved by the anchoring effect. Therefore, even when the tips of the conductive pins 36a to 36d press against the metal layers 20a to 20d, it is possible to suppress the peeling of the metal layers 20a to 20d from the inclined surface 11. The uneven surface of the inclined surface 11 is, for example, the unevenness of the cut surface that occurs when the substrate 10 is cut using a dicing blade or when the substrate 10 is cut by pulsed laser light. Furthermore, it is also possible to form an uneven surface on the inclined surface 11 when the inclined surface 11 is formed by etching the substrate 10. When the conductive pins 36a to 36d are mechanically brought into contact with the metal layers 20a to 20d, the unevenness of the inclined surface 11 can improve the adhesion between the metal layers 20a to 20d and the substrate 10.

[0067] [Modification 5 of Example 1] Figures 10(a) and 10(b) are cross-sectional views of the sensor 110 in modified example 5 of Example 1, corresponding to cross-sections AA and BB in Figure 1, respectively.

[0068] As shown in Figures 10(a) and 9(b), a modification 5 of Example 1 is shown. In this sensor 110, the substrate 10 comprises a support substrate 10a and a piezoelectric layer 10b provided on the support substrate 10a. The support substrate 10a is, for example, a sapphire substrate, an alumina substrate, a quartz substrate, a crystal substrate, a spinel substrate, a SiC substrate, or a silicon substrate. The piezoelectric layer 10b is, for example, a lithium tantalate substrate, a lithium niobate substrate, or a crystal substrate. An insulating film, such as a silicon oxide film or an aluminum oxide film, may be provided between the support substrate 10a and the piezoelectric layer 10b. The inclined surface 11 and the metal layers 20a to 20d are provided on the long side (±Y side) of the substrate 10. The other configurations are the same as in Example 1 and will not be described. [Examples]

[0069] Example 2 is an example in which a surface acoustic wave resonator is used as the detection element. Figure 11 is a plan view of the sensor 112, and Figures 12(a) and 12(b) are cross-sectional views AA and BB of Figure 11, respectively. In Figure 11, the metal film 22 and the sensitive film 24 are shown with dashed lines, and the cavity 27, inlet 27a and outlet 27b are shown with solid lines. The fluid tip 26, inlet passage 28a and outlet passage 28b are not shown.

[0070] As shown in Figures 11 to 12(b), the sensor 112 of Embodiment 2 is provided with a surface acoustic wave resonator 21a as a detection element instead of the IDTs 16a, 16b and propagation path 15 shown in Figures 2 to 3(a). The surface acoustic wave resonator 21a has an IDT 16 and a reflector 19 provided on the substrate 10. The IDT 16 and reflector 19 are formed from a metal film 17.

[0071] The IDT16 has comb-shaped electrodes 14a and 14b. The comb-shaped electrode 14a has multiple electrode fingers 12a and a busbar 13a. The region where the electrode fingers 12a and 12b overlap when viewed from the X direction is shown as region 15a. The configuration of the IDT16 is the same as that of the IDT16a and 16b in Example 1. Reflectors 19 are formed on both sides of the IDT16 in the X direction. In region 15a, the surface acoustic wave excited by the IDT16 propagates mainly in the X direction, and the reflectors 19 reflect the elastic wave. Let λ be the pitch of the electrode fingers 12a and the pitch of the electrode fingers 12b. λ corresponds to the wavelength of the surface acoustic wave excited by the IDT16. λ is twice the pitch D of the multiple electrode fingers 12a and 12b. Note that λ may be other than twice the pitch D.

[0072] An insulating film 25 is provided on the substrate 10 so as to cover the IDT 16 and the reflector 19. A metal film 22 is provided on the insulating film 25 so as to overlap with region 15a. A sensitive film 24 is provided on the insulating film 25 so as to cover the metal film 22. The busbars 13a and 13b of the IDT 16 are electrically connected to the metal layers 20a and 20b, respectively, via wiring 18.

[0073] When substances in the liquid are adsorbed onto the sensitive film 24, the sensitive film 24 becomes heavier. This increases the mass added to the IDT 16, lowering the resonance frequency of the surface acoustic wave resonator 21a. By detecting the change in the resonance frequency of the surface acoustic wave resonator 21a, information about the liquid can be detected.

[0074] The materials of the substrate 10, metal films 17 and 22, metal layers 20a and 20b, sensitive film 24, fluid chip 26, introduction path 28a, and discharge path 28b are the same as in Example 1. The insulating film 25 is, for example, a silicon oxide film or a silicon nitride film.

[0075] [Modification 1 of Example 2] Figures 13(a) and 13(b) are cross-sectional views of the sensor 114 in modified example 1 of Example 2, corresponding to cross-sections AA and BB in Figure 11, respectively.

[0076] As shown in Figures 13(a) and 12(b), in the sensor 114 of Modification 1 of Example 2, the substrate 10 comprises a support substrate 10a and a piezoelectric layer 10b provided on the support substrate 10a, similar to Figures 10(a) and 10(b) of Modification 5 of Example 1. An IDT 16 (sensing electrode) is provided on the piezoelectric layer 10b, and a sensitive film 24 is provided on the IDT 16. The materials of the support substrate 10a and the piezoelectric layer 10b are the same as in Modification 5 of Example 1. The other configurations are the same as in Example 2 and will not be described. [Examples]

[0077] Example 3 is an example in which a bulk acoustic wave resonator (i.e., a BAW (Bulk Acoustic Wave) resonator) is used as the detection element. Figure 14 is a plan view of the sensor 116 in Example 3, and Figures 15(a) to 15(c) are cross-sectional views AA of Figure 14. In Figure 14, the lower electrode 42 and the sensitive membrane 24 are shown with dashed lines, and the fluid tip 26, introduction passage 28a, and discharge passage 28b are not shown.

[0078] As shown in Figures 14 and 15(a), in the sensor 116 of Embodiment 3, a recess is provided in the center of the top surface of the substrate 10 in a plan view, and the inside of the recess is a void 40 (cavity). This cavity may penetrate from the back surface of the substrate 10. As shown in Figure 15(a), the lower electrode 42 is provided on the substrate 10 and the void 40. A piezoelectric layer 44 is provided so as to overlap the lower electrode 42. An upper electrode 46 is provided so as to overlap the lower electrode 42 and the piezoelectric layer 44. The region where the lower electrode 42 and the upper electrode 46 face each other with the piezoelectric layer 44 in between is a region 45 where elastic waves such as thickness longitudinal vibration mode or thickness shear vibration mode resonate. The planar shape of region 45 may be an ellipse, circle, square, pentagon, or other polygonal shape. A sensitive film 24 is provided on the upper electrode 46 within region 45.

[0079] When liquid and substances within the liquid are adsorbed onto the sensitive film 24, the sensitive film 24 becomes heavier. This lowers the resonant frequency of the piezoelectric thin-film resonator 21b. By detecting the change in the resonant frequency of the piezoelectric thin-film resonator 21b, information about the liquid can be detected.

[0080] The substrate 10 is, for example, a silicon substrate, a sapphire substrate, a quartz substrate, a glass substrate, a ceramic substrate, or a GaAs substrate. The lower electrode 42 and the upper electrode 46 are single-layer films of, for example, ruthenium, chromium, aluminum, titanium, copper, molybdenum, tungsten, tantalum, platinum, rhodium, or iridium, or multilayer films of multiple types selected from these films. As an example, the lower electrode 42 and the upper electrode 46 are ruthenium films.

[0081] The piezoelectric layer 44 is, for example, an aluminum nitride film, a zinc oxide film, a gallium nitride film, a lead zirconate titanate film, a lead titanate film, a lithium tantalate film, or a lithium niobate film. As an example, the piezoelectric layer 44 is mainly composed of aluminum nitride. The (002) orientation of the aluminum nitride may be in the Z direction or it may be inclined with respect to the Z direction.

[0082] As shown in Figure 15(b), in sensor 116a, the upper surface of the substrate 10 is flat, and a dome-shaped gap 40 is provided between the substrate 10 and the lower electrode 42. The other configurations are the same as those of sensor 116 in Figure 15(a).

[0083] As shown in Figure 15(c), the sensor 116b is provided with an acoustic reflective film 41 instead of the air gap 40. The acoustic reflective film 41 consists of alternating layers of a film 41a with low acoustic impedance and a film 41b with high acoustic impedance. By making the thickness of each of the films 41a and 41b approximately 1 / 4 of the wavelength of the elastic wave, the elastic wave is reflected by the acoustic reflective film 41. The other configurations are the same as those of the sensor 116 in Figure 15(a).

[0084] As shown in sensors 116 and 116a in Figures 15(a) and 15(b), the detection element may be an FBAR (Film Bulk Acoustic Resonator). As shown in sensor 116b in Figure 15(c), it may also be an SMR (Solidly Mounted Resonator). [Examples]

[0085] Example 4 uses a QCM (Quartz Crystal Microbalance) as the detection element. Figure 16 is a plan view of the sensor 118 according to Example 4, and Figure 17 is a cross-sectional view AA of Figure 16. In Figure 16, the lower electrode 42 and the sensitive membrane 24 are shown with dashed lines, and the fluid tip 26, introduction passage 28a, and discharge passage 28b are not shown.

[0086] The substrate 10 of the sensor 118 is a single-crystal quartz. A lower electrode 42 is provided on the lower surface of the substrate 10, and an upper electrode 46 is provided on the upper surface of the substrate 10. The lower electrode 42 is electrically connected to the wiring 18 via a through electrode 47 that penetrates the substrate 10. The region where the lower electrode 42 and the upper electrode 46 face each other across the substrate 10 is a region 45 where elastic waves such as thickness-slip vibration modes resonate. The planar shape of region 45 may be an ellipse, a circle, a square, or a polygon such as a pentagon.

[0087] When substances in the liquid are adsorbed onto the sensitive film 24, the sensitive film 24 becomes heavier. This increases the mass added to region 45, lowering the resonant frequency of the QCM. By detecting the change in the resonant frequency of the QCM, information about the liquid can be detected. In the case of Example 4 as well, inclined surfaces 11 are provided on a pair of short sides (±X sides) of the substrate 10, and metal layers 20a and 20b are provided on these inclined surfaces 11. [Examples]

[0088] Example 5 describes the manufacturing methods of Examples 1 to 4 and modified examples. As described in Figures 1(a) to 1(d), the sensor chip is generally formed by forming sensor units in a matrix on a large wafer and then separating the wafer into individual pieces. In the following description, adjacent units within the wafer are shown in cross-sectional views. As shown in Figure 18(a), all detection elements 21 are formed on the substrate 10. Subsequently, laser beams 54a and 54b are irradiated onto the upper surface of the substrate 10. The laser beam 54a is scanned along the scribe line in the X and Y directions.

[0089] As shown in Figure 18(b), grooves 56 are formed in the substrate 10 by irradiating it with laser beams 54a and 54b. Next, the substrate 10 between the grooves 56 is cut using a dicing blade 55. As shown in Figure 18(c), a cutting groove 57 is formed. The upper part 57a of the cutting groove 57 is an inclined surface 11 corresponding to the groove 56, and the angle θ between the inclined surface 11 and the upper surface of the substrate 10 is obtuse. The lower part 57b of the cutting groove 57 is a vertical surface 11a. As a result, the substrate 10 is cut at the cutting groove 57, and the sensor is separated into individual pieces. After that, as shown in Figure 3(a), metal layers 20a to 20d are formed to cover the inclined surface 11 using sputtering, vacuum deposition, or plating. The formation of the sensitive film 24 may be performed after the sensor has been separated into individual pieces. Since the inclined surface 11 is formed by scanning with pulsed laser light, irregularities are formed on the inclined surface 11. This improves the adhesion between the metal layers 20a and 20d. Furthermore, the irregularities on the inclined surface 11 are smaller compared to when the inclined surface 11 is formed using a dicing blade.

[0090] [Modification 1 of Example 5] Figures 19(a) to 19(c) are cross-sectional views showing a method for manufacturing a sensor using etching and dicing blades. As shown in Figure 19(a), a mask layer 58 having an opening 58a is formed on a substrate 10. The mask layer is, for example, a photoresist. Then, using this mask layer 58, a groove 59 is formed in the substrate 10 below the opening 58a. As shown in Figure 19(b), the side surface of the groove 59 is inclined. For example, the side surface of the groove 59 can be made inclined by wet etching the substrate 10 using the mask layer 58 as a mask. Alternatively, dry etching may be used to form the inclined surface.

[0091] Next, using the dicing blade 55, the substrate 10 is fully cut by aligning the dicing blade 55 with the groove 59, leaving the inclined surface intact. As a result, a cutting groove 57 is formed, as shown in Figure 19(c). When the groove 59 is formed using the etching method, the inclined surface 11 will be a surface with few irregularities. When the groove 59 is formed using the blasting method, the inclined surface 11 can be an uneven surface. As shown in Figure 3(a), metal layers 20a to 20d are formed to cover the inclined surface 11.

[0092] [Modification 2 of Example 5] Figures 20(a) and 20(b) are cross-sectional views showing a method for manufacturing a sensor in a modified example 2 of Example 5. As shown in Figure 20(a), the side surface 60a at the tip of the dicing blade 60 is perpendicular to the extension direction of the rotation axis 62. The side surface 60b on the rotation axis 62 side of side surface 60a is inclined with respect to side surface 60a.

[0093] As shown in Figure 20(b), a cutting groove 57 is formed by fully cutting the substrate 10 using a dicing blade 60. The upper part 57a of the cutting groove 57 becomes an inclined surface 11 corresponding to the side surface 60b, and the lower part 57b becomes a vertical surface 11a corresponding to the side surface 60a. The inclined surface 11 and the vertical surface 11a are uneven surfaces. If the dicing blade 60 has a grit size of 320, the maximum height roughness Rz of the uneven surface will be, for example, about 50 μm. The maximum height roughness Rz of the uneven surface can be, for example, 1 μm or 10 μm or more. The roughness of the inclined surface 11 can be selected by appropriately selecting the grit size of the dicing blade 60.

[0094] As shown in Figures 20(a) and 20(b), a dicing blade 60 is used to cut the substrate 10 so that at least a portion of the cut surface becomes an obtuse angle θ with respect to the upper surface of the substrate 10, forming multiple substrates 10. Then, as shown in Figures 9(a) and 9(b), metal layers 20a to 20d that are electrically connected to the detection element 21 are formed on the inclined surface 11. This creates irregularities on the inclined surface 11, thereby improving the adhesion between the metal layers 20a to 20d and the inclined surface 11. [Examples]

[0095] Example 6 is an example of a detection system. Figure 21(a) is a block diagram of the detection system according to Example 6. As shown in Figure 21(a), in the detection system 124 of Example 6, the oscillation circuit 71 has a resonator 70. The resonator 70 is the detection element in Examples 2 to 4 and their modified versions. The oscillation circuit 71 outputs an oscillation signal having an oscillation frequency corresponding to the resonant frequency of the resonator 70. The detector 72 includes a measuring instrument 73 and a calculator 74. The measuring instrument 73 measures the frequency of the oscillation signal output by the oscillation circuit 71. The measuring instrument 73 may be, for example, a network analyzer. The calculator 74 detects information about the liquid, such as substances in the liquid, based on the amount of change in the frequency of the oscillation signal measured by the measuring instrument 73.

[0096] [Example 6 Modification 1] Modification 1 of Example 6 is an example of a detection system using Example 1 and its modification. Figure 21(b) is a block diagram of the detection system according to Modification 1 of Example 6. As shown in Figure 21(b), in the detection system 126 of Modification 1 of Example 6, the transmitter 75 transmits a high-frequency signal to the IDT 16a of the detection element 21 of Example 1. The receiver 76 receives a high-frequency signal from the IDT 16b of the detection element 21. The detector 77 includes a measuring instrument 78 and a calculator 79. The measuring instrument 78 measures the phase difference between the high-frequency signal transmitted by the transmitter 75 and the high-frequency signal received by the receiver 76. The calculator 79 detects information about the liquid based on the amount of change in the phase difference measured by the measuring instrument 78.

[0097] While embodiments of the present invention disclose a detection element for detecting substances in a liquid, the invention is not limited thereto. For example, the detection element may detect substances in a gas.

[0098] Although embodiments of the present invention have been described in detail above, the present invention is not limited to these specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention as described in the claims. [Explanation of Symbols]

[0099] 10 circuit boards 11 Slope 11a Vertical plane 12a, 12b electrode fingers 13a, 13b busbar 14a, 14b comb-shaped electrode 15a~15c area 15 Propagation Paths 16, 16a, 16b IDT 17, 22 Metal film 18, 32 Wiring 19 Reflector 20a~20d metal layer 21 detection elements 24 Sensitive membrane 26 Fluid Tips 27 Cavity 27a Inlet 27b Outlet 28a Introductory path 28b discharge path 29a, 29b tubing 30 mounted circuit boards 34, 35 Fixing members 36a~36d Conductive pins 40 void 41 Acoustic reflective film 42 Lower electrode 44 Piezoelectric layer 45 areas 46 Upper electrode 47 Through electrode 54a, 54b Laser light 56, 57 groove 58 Mask Layers

Claims

1. A sensor comprising: a substrate having an inclined surface such that at least a portion of its side is inclined at an obtuse angle to its top surface; a detection element provided on and / or within the substrate for detecting a specific substance in a liquid; a sensitive film provided on the detection element; and a metal layer provided on the inclined surface and electrically connected to the detection element; A mounting substrate on which the sensor is provided on the upper surface, A conductive member is provided on the aforementioned mounting substrate, the tip of which contacts the metal layer from the outside of the sensor toward the direction of the metal layer, and the sensor is detachable. A sensor module equipped with the following features.

2. The sensor module according to claim 1, wherein the sensor comprises a guide path for guiding the liquid to the sensitive membrane.

3. The metal layer includes a first metal layer provided on a first inclined surface on a first side surface of the substrate, and a second metal layer provided on a second inclined surface on a second side surface facing the first side surface of the substrate. The sensor module according to claim 1 or 2, wherein the conductive member includes a first conductive member that contacts the first metal layer and a second conductive member that contacts the second metal layer.

4. The sensor module according to claim 3, wherein the tip of the first conductive member that contacts the first metal layer is fixed to the mounting substrate, and the tip of the second conductive member that contacts the second metal layer is movable relative to the mounting substrate.

5. The mounting substrate is provided with a fixing member, The metal layer is provided on the inclined surface of the first side surface of the substrate, The sensor module according to claim 1 or 2, wherein the conductive member has a tip that abuts the metal layer from the outside of the sensor toward the metal layer, and the second side surface of the substrate opposite the first side surface abuts the fixing member, thereby enabling the sensor to be attached and detached.

6. The sensor module according to claim 1 or 2, wherein the inclined surface is an uneven surface.

7. The sensor module according to claim 1 or 2, wherein the detection element is a surface acoustic wave element or a piezoelectric thin-film resonator.

8. The detection element comprises an IDT having a plurality of electrode fingers provided on the substrate, The sensor module according to claim 1 or 2, wherein the metal layer is not provided on the side surface of the substrate in the direction in which the plurality of electrode fingers of the IDT are arranged.

9. The sensor module according to claim 1 or 2, wherein the sensitive membrane comprises an antibody.

10. A substrate having an inclined surface such that at least a portion of the side is inclined at an obtuse angle to the top surface, A detection element provided on the upper surface of the substrate for detecting a specific substance in the liquid, A sensitive film provided on the detection element, The sensitive membrane has a guide channel for guiding the liquid, A metal layer electrically connected to the detection element and provided on the inclined surface, A sensor equipped with the following features.

11. The aforementioned sensor is provided on the mounting board. The sensor according to claim 10, wherein the tip of a conductive member provided on the mounting substrate contacts the metal layer from the outside of the sensor toward the direction of the metal layer, and the sensor is detachable.

12. A substrate having substantially a hexahedron, with two tapered surfaces extending from one end to the other of two opposing sides in a plan view, a flat surface between the two tapered surfaces, a first region on the flat surface for a detection element to detect a specific substance in a liquid, a second region around the first region extending onto the flat surface for wiring, and a third region on the tapered surface for connecting electrodes connected to the outside, A conductive pattern having an electrode in a detection element provided in the first region, wiring provided in the second region, and a connecting electrode provided in the third region that is electrically connected to the electrode via the wiring, A sensitive film provided on the detection element, A sensor equipped with the following features.