A machine for handling circuit boards, and a method for producing electrical circuit boards.

Abstract

This work machine for a substrate comprises: a conveyance device that conveys, to a predetermined position, a carrier having placed thereon a circuit substrate of a production target and a component scheduled to be mounted to the circuit substrate; and a mounting device that, from the carrier having been conveyed to the predetermined position, holds the component placed on the carrier and that mounts the held component to the circuit substrate placed on the carrier.

Description

Technical Field

[0004] , When mounting components onto the circuit board, the mounting position of the components is corrected based on the stored misalignment amount, , , , , , , , , Prior to mounting components onto the circuit board, the mounting device mounts a transparent glass component having a second mark, which is placed on a tray on the carrier, onto a transparent glass substrate having a first mark, which is placed on the carrier at the position where the circuit board will be mounted; and the control device calculates and stores the amount of misalignment between the first mark and the second mark based on the imaging data of the glass component by the imaging device. ,

[0005]

[0001] The present invention relates to a substrate processing machine that mounts components on a circuit board conveyed by a conveying device using a mounting device, etc.

Background Art

[0002] The following patent documents describe a technique for mounting components on a circuit board conveyed by a conveying device using a mounting device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present invention is to improve the practicality of a technique for mounting components on a circuit board conveyed by a conveying device using a mounting device.

Means for Solving the Problems

[0006] Furthermore, in order to solve the above problems, this specification states that A method for producing an electrical circuit board using a circuit board mounting machine, comprising: prior to the circuit board mounting machine mounting components onto the circuit board, a carrier on which a transparent glass substrate having a first mark and a transparent glass component having a second mark are placed is transported to a predetermined position by a transport device; the glass component is held from the carrier by a mounting device and mounted onto the glass substrate; and a measurement step is performed to calculate and store the amount of misalignment between the first mark and the second mark based on imaging data obtained by imaging the mounted glass component with an imaging device; A loading process in which a transport device equipped with a circuit board handling machine transports a carrier on which the circuit board to be manufactured and the components to be mounted on the circuit board are placed to a predetermined position, and a process following the loading process in which a mounting device equipped with the circuit board handling machine holds the components placed on the carrier from the carrier that has been transported to the predetermined position. Based on the amount of deviation stored in the measurement process, the mounting position is corrected. A method for producing an electrical circuit board is disclosed, comprising: a mounting step of mounting components held by the mounting device onto a circuit board placed on the carrier; and a subsequent loading step of loading the circuit board with the components mounted onto it onto the carrier from a predetermined position by the transport device, wherein the mounting step includes a step of determining whether the components are good or bad after the mounting device has held them, and if the components are determined to be defective, a step of returning the defective components to the tray on the carrier on which the defective components were placed. [Effects of the Invention]

[0007] According to this disclosure, a transport device transports a carrier on which a circuit board to be produced and components to be mounted on that circuit board are placed to a predetermined position. Then, a mounting device picks up the components placed on the carrier from the carrier that has been transported to the predetermined position and mounts the held components onto the circuit board placed on the carrier. This improves the practicality of the technology for mounting components onto a circuit board transported by a transport device using a mounting device. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view showing a component mounting machine. [Figure 2] This is a perspective view showing a component mounting machine / device. [Figure 3] Control device branch. [Figure 4] This is a perspective showing career paths. [Figure 5]This is a perspective view showing a carrier with circuit board and components mounted on it. [Figure 6] This is a perspective view showing a carrier with a glass substrate and glass components mounted on it. [Modes for carrying out the invention]

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the figures, as embodiments for carrying out the present invention.

[0010] Figure 1 shows a component mounting machine 10. The component mounting machine 10 is a device for mounting components onto a circuit board 12. The component mounting machine 10 comprises a main unit 20, a substrate transport and holding device 22, a component mounting device 24, a mark camera 26, a parts camera 28, a loose component supply device 30, a component supply device 32, and a control device (see Figure 3) 36. The circuit board 12 can be a circuit board, a three-dimensional structured substrate, etc., and the circuit board can be a printed wiring board, a printed circuit board, etc.

[0011] The main body of the device 20 consists of a frame 40 and a beam 42 mounted on the frame 40. The substrate transport and holding device 22 is located in the center of the frame 40 in the front-rear direction and has a transport device 50 and a clamping device 52. The transport device 50 is a device for transporting the circuit substrate 12, and the clamping device 52 is a device for holding the circuit substrate 12. As a result, the substrate transport and holding device 22 transports the circuit substrate 12 and also holds the circuit substrate 12 fixedly in a predetermined position. In the following description, the transport direction of the circuit substrate 12 will be referred to as the X direction, the horizontal direction perpendicular to that direction will be referred to as the Y direction, and the vertical direction will be referred to as the Z direction. In other words, the width direction of the component mounting machine 10 is the X direction, and the front-rear direction is the Y direction.

[0012] The component mounting device 24 is mounted on the beam 42 and has two work heads 60 and 62 and a work head moving device 64. Each work head 60 and 62 has a suction nozzle (see Figure 2) 66, which holds the component. As shown in Figure 2, the work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two work heads 60 and 62 are moved together to any position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. Each work head 60 and 62 is detachably mounted on sliders 74 and 76, and the Z-direction moving device 72 moves the sliders 74 and 76 individually in the vertical direction. In other words, the work heads 60 and 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] As shown in Figure 2, the mark camera 26 is mounted on the slider 74 facing downwards and is moved in the X, Y, and Z directions together with the work head 60. This allows the mark camera 26 to capture images of any position on the frame 40. The part camera 28 is positioned facing upwards between the substrate transport and holding device 22 and the part supply device 32 on the frame 40, as shown in Figure 1. This allows the part camera 28 to capture images of parts held by the suction nozzles 66 of the work heads 60 and 62.

[0014] The loose parts supply device 30 is located at one end of the frame 40 in the front-rear direction. The loose parts supply device 30 is a device that aligns multiple parts that are scattered loosely and supplies the parts in an aligned state. In other words, it is a device that aligns multiple parts in any orientation to a predetermined orientation and supplies the parts in that predetermined orientation.

[0015] The parts supply device 32 is located at the other end of the frame 40 in the front-rear direction. The parts supply device 32 includes a feeder-type parts supply device 86 and a tray-type parts supply device 88. The feeder-type parts supply device 86 is a device that supplies parts by tape feeder 90. The tape feeder 90, for example, separates lead parts from tape-formed parts and supplies the separated lead parts. Rails (not shown) are provided on the underside of the tape feeder 90. The rails of the tape feeder 90 are fitted into feeder slots 94 formed on the upper surface of a feeder holder 92 fixedly provided at the other end of the frame 40. The tape feeder 90 is positioned and mounted in the slots 94 of the feeder holder 92 so that it can be attached and detached with a single touch by an operator without the use of tools. The tray-type parts supply device 88 is a device that supplies parts in a state where they are placed on a tray (not shown). The tray-type parts supply device 88 has a tray holder 96, and multiple tray slots 98 are formed on the upper surface of the tray holder 96. A tray is positioned and mounted in any of the multiple slots 98. A tray for supplying small parts is positioned and mounted in one slot, while a tray for supplying large parts is positioned and mounted in two or more slots.

[0016] As shown in FIG. 3, the control device 36 includes a controller 100, a plurality of drive circuits 102, and an image processing device 104. The plurality of drive circuits 102 are connected to the transport device 50, the clamp device 52, the work heads 60, 62, the work head moving device 64, the feeder type component supply device 86, the tray type component supply device 88, and the loose component supply device 30. The controller 100 includes a CPU, a ROM, a RAM, etc., and is mainly a computer, and is connected to the plurality of drive circuits 102. Thereby, the operations of the base material transport and holding device 22, the component mounting device 24, etc. are controlled by the controller 100. Further, the controller 100 is connected to the image processing device 104. The image processing device 104 processes the image data obtained by the mark camera 26 and the parts camera 28, and the controller 100 acquires various information from the image data.

[0017] The component mounting machine 10 performs component mounting on the circuit board 12 held by the substrate transport and holding device 22, as described above. Specifically, the circuit board 12 is transported to a predetermined work position by the transport device 50 and fixedly held in that position by the clamp device 52. Next, the mark camera 26 moves above the circuit board 12 and takes an image of the circuit board 12. This provides information regarding the error in the holding position of the circuit board 12. In addition, the loose component supply device 30 or component supply device 32 supplies components at a predetermined supply position. Specifically, for example, in the tray-type component supply device 88 of the component supply device 32, as described above, components are placed on a tray mounted in the slot 98 of the tray holding base 96, and components are supplied on that tray. Then, either the work head 60 or 62 moves above the component supply position and holds the component with the suction nozzle 66. Next, the work heads 60 and 62, which are holding the parts, move above the parts camera 28, and the parts held by the suction nozzle 66 are imaged by the parts camera 28. This provides information regarding the error in the holding position of the parts. Then, the work heads 60 and 62, which are holding the parts, move above the circuit board 12, and the held parts are mounted onto the circuit board 12, correcting for errors in the holding position of the circuit board 12, errors in the holding position of the parts, etc.

[0018] Thus, in the component mounting machine 10, components supplied from a supply device such as the tray-type component supply device 88 are mounted on the circuit board 12. At this time, for example, large components are supplied by the tray-type component supply device 88. However, large components are placed on trays of a large size, and the trays of that large size are mounted in the plurality of slots 98 of the tray holding base 96. Therefore, there are cases where many types of components cannot be supplied by the tray-type component supply device 88. Specifically, for example, if ten slots 98 are formed in the tray holding base 96 and three trays for large components that occupy three slots 98 are mounted on the tray holding base 96, there is only one empty slot. Therefore, many types of components cannot be supplied by the tray-type component supply device 88. For this reason, when the mounting process for all types of components to be mounted cannot be completed only by the component mounting machine 10, it is necessary to perform the mounting process for components that cannot be supplied by the component mounting machine 10 using another component mounting machine. Also, since the placement area of the tray is limited, when the components placed on the tray become insufficient, it is also necessary to replenish the components that are insufficient on the tray.

[0019] In view of such circumstances, in the component mounting machine 10, using the carrier 110 shown in FIG. 4, a plurality of trays (see FIG. 5) 120 are carried in together with the circuit board 12, and the components placed on each of the plurality of trays are mounted on the circuit board 12. More specifically, the carrier 110 is generally a rectangular plate-shaped member and is carried into the component mounting machine 10 by the transfer device 50 in a posture extending in the longitudinal direction. For this reason, the direction in which the carrier 110 is transferred and the longitudinal direction are described as the X direction, and the direction orthogonal to the longitudinal direction of the carrier 110 is described as the Y direction.

[0020] A recess 112 is formed in the center of the carrier 110 in the X direction, with an internal dimension slightly larger than the external dimension of the circuit board 12. Therefore, as shown in Figure 5, the circuit board 12 can be fitted into the recess 112 in a positioned state. In this way, the circuit board 12 is placed in the recess 112 of the carrier 110 in a positioned state. Note that the depth dimension of the recess 112 is shallower than the thickness dimension of the circuit board 12. Therefore, the upper surface of the circuit board 12 placed in the recess 112 is higher than the upper surface of the carrier 110.

[0021] Furthermore, as shown in Figure 4, the carrier 110 also has four recesses 114 formed on either side of the recess 112 in the X direction of the carrier 110. The four recesses 114 are the same shape, and two of the four recesses 114a and b are formed side by side in the Y direction at one end of the carrier 110 in the X direction, while the other two recesses 114c and d are formed side by side in the Y direction at the other end of the carrier 110 in the X direction. In addition, the internal dimensions of each of the four recesses 114 are slightly larger than the external dimensions of the tray 120 for small parts. Therefore, as shown in Figure 5, it is possible to fit the tray 120 into each of the four recesses 114 in a positioned state. In this way, the tray 120 is placed in a positioned state in each of the four recesses 114 of the carrier 110. Note that the depth dimension of the recess 114 is shallower than the height dimension of the tray 120. Therefore, the upper end of the tray 120 placed in the recess 114 is higher than the upper surface of the carrier 110.

[0022] Furthermore, multiple parts 122 are placed on tray 120 in an aligned state. Specifically, on tray 120a, which is placed in recess 114a, eight parts 122a are placed in two rows in the X direction, with four parts 122a in each row. In other words, eight parts 122a are placed on tray 120a in a 2x4 arrangement. Also, on tray 120b, which is placed in recess 114b, six parts 122b are placed in two rows in the X direction, with three parts 122b in each row. In other words, six parts 122b are placed on tray 120b in a 2x3 arrangement. Also, on tray 120d, which is placed in recess 114d, four parts 122d are placed in two rows in the X direction, with two parts 122d in each row. In other words, tray 120d has four parts 122d arranged in a 2x2 grid. Also, tray 120c, which is placed in the recess 114c, has four parts 122a arranged in a single row in the X direction, and next to those four parts 122a, three parts 122b are placed in a single row in the X direction. In other words, trays 120a, b, and d have multiple units of one type of part arranged in a grid, and tray 120c has multiple units of two types of parts arranged in a grid.

[0023] Then, the circuit board 12 is placed in the recess 112, and the carrier 110, on which trays 120 with multiple components 122 on them are placed in each of the four recesses 114, is transported to the component mounting machine 10 by the transport device 50. The four trays 120 placed in the four recesses 114 each contain the number of components intended to be mounted on the circuit board 12. In other words, all the components intended to be mounted on the circuit board 12 are the eight components 122a on tray 120a, the six components 122b on tray 120b, the four components 122a and three components 122b on tray 120c, and the four components 122d on tray 120d.

[0024] The placement of the circuit board 12 into the recess 112 and the placement of the tray 120 into the recess 114 may be performed manually by an operator or automatically by a device such as an articulated robot. Similarly, the placement of multiple parts onto the tray may be performed manually by an operator or automatically by a device such as an articulated robot.

[0025] Then, when the carrier 110 is transported to a predetermined work position by the transport device 50, the carrier 110 is fixedly held in that position by the clamp device 52. Next, the mark camera 26 moves above the circuit board 12 placed in the recess 114 of the carrier 110 and images the circuit board 12. This provides information regarding the error in the placement position of the circuit board 12. Also, since a part 122 is placed on the tray 120 placed in the recess 114 of the carrier 110, either the work head 60 or 62 moves above the tray 120 placed in the recess 114 of the carrier 110 and holds the part 122 with the suction nozzle 66. Then, the work head 60 or 62 holding the part 122 moves above the part camera 28, and the part camera 28 images the part 122 held by the suction nozzle 66. This provides information regarding the error in the holding position of the part 122. Furthermore, the quality of the component 122 held by the suction nozzle 66 is determined based on the imaging data. In other words, it is confirmed whether there are any defects, deformations, etc., in the component 122 held by the suction nozzle 66 based on the imaging data. If it is confirmed that there are no defects, deformations, etc., in the component 122 held by the suction nozzle 66, the work heads 60 and 62 holding the component 122 move above the circuit board 12 placed on the recess 114 of the carrier 110, and the held component 122 is mounted onto the circuit board 12, correcting for errors in the placement position of the circuit board 12, errors in the holding position of the component, etc. In this way, the component 122, which is placed on the carrier 110 via the tray 120, is mounted onto the circuit board 12 placed on the carrier 110. On the other hand, if it is confirmed that a part 122 held by the suction nozzle 66 is damaged, deformed, or otherwise defective, the work heads 60 and 62 holding the part 122 move above the tray 120 on which the part 122 was placed, and return the held part 122 to the tray 120. In addition, the circuit board 12 placed on the carrier 110 is fitted with parts supplied from the loose parts supply device 30, the feeder-type parts supply device 86, and the tray-type parts supply device 88, as well as parts placed on the carrier 110 via the tray 120.Then, once the mounting work on the circuit board 12 is complete, the clamping device 52 on the carrier 110 at the work position is released, and the carrier 110 is transported away from the work position by the transport device 50. In this way, an electrical circuit board is created with components mounted on the circuit board 12. Note that the electrical circuit board is one in which components are mounted on the circuit board 12 in a state where they are electrically connected. However, the electrical circuit board may have not only electrically connected components but also components that are not electrically connected.

[0026] In this way, by transporting the carrier 110, on which the circuit board 12 and the components 122 to be mounted on the circuit board 12 are placed, to the component mounting machine 10, it becomes possible to mount many types of components on the circuit board in the component mounting machine 10, even if many slots 98 in the tray-type component supply device 88 are occupied by trays for large components. In other words, even if many trays for large components are set on the tray holder 96, many types of small components can be placed on the trays 120 of the carrier 110, making it possible to supply many types of components in the component mounting machine 10. Furthermore, since the carrier 110 has four recesses 114, a tray 120 can be placed in each of these four recesses 114, thus increasing the number of places in the component mounting machine 10 where trays 120 can be placed. Consequently, the frequency of replenishing components in the component mounting machine 10 can be reduced. Furthermore, for example, by placing components to be supplied by the tape feeder 90 onto the tray 120 of the carrier 110, a tape feeder 90 that supplies different types of components can be mounted on the feeder holder 92. This makes it possible to supply even more types of components to the component mounting machine 10. Moreover, if all components to be mounted on the circuit board 12 can be placed onto the tray 120 of the carrier 110, it becomes possible to remove supply devices such as the loose component supply device 30 and component supply device 32 from the component mounting machine 10. In other words, it becomes possible to manufacture electrical circuit boards with a component mounting machine that does not have component supply devices.

[0027] Furthermore, by mounting components 122, which are placed on the carrier 110, onto the circuit board 12, the travel distance of the work heads 60 and 62 that hold the components 122 is shortened, making it possible to reduce the cycle time. In other words, conventionally, the work head holds the components in a component supply device 32, etc., which is located away from the work position, and moves above the circuit board 12 held at the work position. On the other hand, by using the carrier 110, the work head holds the components placed on the carrier 110 and moves above the circuit board 12 placed on the carrier 110, so the travel distance of the work head is shorter than in conventional methods. This makes it possible to shorten the cycle time for mounting components onto the circuit board.

[0028] Furthermore, the four trays 120 placed on the four recesses 114 of the carrier 110 contain multiple components that are to be mounted on the circuit board 12. The work head then picks up each component 122 on the trays 120 one by one, and based on the imaging data captured by the suction nozzle 66, checks whether there are any defects, deformations, etc., in the component 122 it holds. If it is determined that there is an abnormality in the component, the work head returns the held component to the tray 120. Therefore, if there are no components remaining on the four trays 120 on the carrier 110 when it is discharged from the component mounting machine 10, the operator can determine that all the components placed on the carrier 110 have been mounted on the circuit board 12. On the other hand, if there are components remaining on any of the four trays 120 on the carrier 110 when it is discharged from the component mounting machine, the operator can determine that the remaining component is a component that is defective, deformed, etc. Then, if the worker can repair the part, for example, if the lead of a leaded component is bent and the lead can be straightened by hand, the worker will repair it and attach the manually repaired part to the circuit board 12. If the worker cannot repair the part, they will attach a part of the same type as a replacement part to the circuit board 12.

[0029] Furthermore, the carrier 110 can be used not only for mounting components but also for obtaining the amount of misalignment of components during mounting. Specifically, as shown in Figure 6, a glass substrate 150 having the same dimensions as the circuit board 12 is placed in the recess 112 of the carrier 110. The placed glass substrate 150 is transparent and has four circular marks 152 formed on it. A tray 120a is placed in the recess 112a of the carrier 110, and four glass components 156 are placed on the tray 120a in a 2x2 arrangement. Each glass component 156 is also transparent and has a circular mark 158 formed on it. The circular marks 152 formed on the glass substrate 150 and the circular marks 158 formed on the glass components 156 are approximately the same size.

[0030] Then, before the component mounting operation is performed on the circuit board in the component mounting machine 10, the carrier 110, on which the tray 120a containing the glass substrate 150 and glass components 156 is placed, is transported by the transport device 50 to the work position of the component mounting machine 10. The glass components 156 that have been transported by the carrier 110 are then mounted onto the glass substrate 150. At this time, the glass components 156 are mounted onto the glass substrate 150 so that the marks 158 formed on the glass components 156 and the marks 152 formed on the glass substrate 150 overlap. Once each of the four glass components 156 has been mounted onto the glass substrate 150, the mark camera 26 captures an image of each mounted glass component 156.

[0031] Next, the controller 100 calculates the amount of misalignment of the glass component 156 on the glass substrate 150 based on the image data acquired by the mark camera 26 when it images the glass component 156. Specifically, if the glass component 156 is mounted on the glass substrate 150 without any misalignment from the intended mounting position, the mark 152 formed on the glass substrate 150 and the mark 158 formed on the glass component 156 will perfectly overlap. On the other hand, if the glass component 156 is mounted on the glass substrate 150 with a misalignment from the intended mounting position, the mark 152 formed on the glass substrate 150 and the mark 158 formed on the glass component 156 will not perfectly overlap and will be misaligned. Therefore, the controller 100 calculates the amount and direction of misalignment between the mark 152 formed on the glass substrate 150 and the mark 158 formed on the glass component 156 based on the image data acquired by the mark camera 26 when it images the glass component 156. The controller 100 then stores the calculated amount and direction of deviation as the amount of deviation in the mounting position of components during component mounting, which is specific to the component mounting machine 10. Therefore, when the component mounting machine 10 mounts components onto the circuit board 12, the controller 100 corrects the mounting position of the components based on the stored amount of deviation in the mounting position. This enables the components to be mounted accurately to the intended mounting position on the circuit board 12.

[0032] Note that the component mounting machine 10 is an example of a board-mounting machine. The circuit board 12 is an example of a circuit board. The substrate transport and holding device 22 is an example of a transport device. The component mounting device 24 is an example of a mounting device. The carrier 110 is an example of a carrier. The tray 120 is an example of a tray. The component 122 is an example of a component.

[0033] Furthermore, the present invention is not limited to the above embodiments, and can be implemented in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiments, one carrier 110 supports one circuit board, but it may also have a structure that can support multiple circuit boards.

[0034] Furthermore, in the above embodiment, the circuit board 12 is positioned on the carrier 110 by being fitted into the recess 112 of the carrier 110. However, a fixing mechanism such as a clamping mechanism may be provided on the carrier, and the circuit board may be positioned on the carrier by the fixing mechanism.

[0035] Furthermore, in the above embodiment, the part 122 is placed on the tray 120, and the tray 120 is placed on the recess 114 of the carrier 110. In other words, the part 122 is indirectly placed on the recess 114 of the carrier 110 via the tray 120. On the other hand, the part 122 may be placed directly on the recess 114 of the carrier 110. Alternatively, the part 122 may be placed directly on the upper surface of the carrier 110 without forming a recess 114 or the like on the upper surface of the carrier 110, and the parts placed directly on the carrier may be scattered in any orientation. Also, the multiple parts placed directly on the carrier may be of the same type or of multiple types.

[0036] Furthermore, although a plate-shaped member is used as the carrier 110 in the above embodiment, various shapes of members such as dish-shaped, bowl-shaped, or container-shaped members can be used as long as they are capable of supporting the circuit board 12 and the component 122. Also, the carrier may be the circuit board itself. In other words, the circuit board and the component may be placed on top of the circuit board.

[0037] Furthermore, the components placed on the carrier 110 may be components electrically connected to the circuit board 12, or components that are not electrically connected to the circuit board 12. In other words, the components placed on the carrier 110 and mounted on the circuit board 12 may be electronic components, electrical circuit components, leaded components, shielding covers, etc.

[0038] Furthermore, in the above embodiment, multiple parts are arranged in N x M rows, that is, in multiple rows, on the tray 120 placed on the recess 114 of the carrier 110, but they may also be arranged in a single row. Also, the multiple parts placed on the tray may not be arranged but scattered randomly on the tray 120. In addition, the multiple parts mounted on the tray may be of the same type, or they may be of multiple types.

[0039] Furthermore, in the above embodiment, an operator checks whether or not parts remain in the four trays 120 on which the carrier 110 is placed, but this could also be done automatically using an imaging device such as a mark camera. [Explanation of Symbols]

[0040] 10: Component mounting machine (PCB work machine) 12: Circuit board material (circuit board) 22: Material transport and holding device (transport device) 24: Component mounting device (mounting device) 110: Carrier 120: Tray 122: Component

Claims

1. A transport device that transports a carrier on which a circuit board to be manufactured and components to be mounted on that circuit board are placed to a predetermined location, A mounting device that holds a component placed on a carrier that has been transported to the predetermined position, and mounts the held component onto a circuit board placed on the carrier, A circuit board work machine equipped with, Prior to mounting components onto the circuit board, the mounting device mounts a transparent glass component having a second mark, which is placed on a tray on the carrier, onto a transparent glass substrate having a first mark, which is placed on the carrier at the position where the circuit board will be mounted. The control device calculates and stores the amount of misalignment between the first mark and the second mark based on the imaging data of the glass component taken by the imaging device. The mounting device, when mounting components onto the circuit board, corrects the mounting position of the components based on the stored misalignment amount, and after holding the components placed on the carrier, has a function to determine whether the components are good or bad, and if a component is determined to be defective, returns the defective component to the tray on the carrier on which the defective component was placed.

2. The substrate work machine according to claim 1, wherein the carrier has multiple components, and these multiple components are arranged in a line.

3. Multiple components are placed on the carrier, and the substrate work machine according to claim 1 or claim 2 is placed on a tray.

4. A method for producing an electrical circuit board using a board processing machine, Prior to the board mounting machine mounting components onto the circuit board, a measurement step is performed in which a carrier on which a transparent glass substrate having a first mark and a transparent glass component having a second mark is placed is transported to a predetermined position by a transport device, the glass component is held from the carrier by a mounting device and mounted onto the glass substrate, and the amount of misalignment between the first mark and the second mark is calculated and stored based on the imaging data obtained by imaging the mounted glass component with an imaging device. A loading process in which a transport device equipped with a circuit board handling machine transports a carrier on which the circuit board to be manufactured and the components to be mounted on that circuit board are placed to a predetermined position, A mounting step, which is a step following the aforementioned loading step, wherein the mounting device provided in the board-to-board work machine holds the component placed on the carrier after it has been transported to the predetermined position, corrects the mounting position based on the amount of misalignment stored in the measurement step, and mounts the component held by the mounting device onto the circuit board placed on the carrier, A subsequent step after the mounting step, wherein the transport device unloads the circuit board, which has been placed on the carrier with the components mounted on it, from the predetermined position. A method for producing an electrical circuit board by performing the following: A method for producing an electrical circuit board, wherein the mounting step includes a step of determining whether the component is good or bad after the mounting device has held the component, and if it is determined to be defective, the step of returning the defective component to the tray on the carrier on which the defective component was placed.

Images