Temperature sensing assembly and battery module containing the same

Abstract

A temperature sensing assembly according to an embodiment of the present invention can include a substrate, a temperature sensor mounted on the substrate, a bridge coupled to the substrate and having a hole formed therein facing the temperature sensor, and a compression member disposed between the bridge and the substrate. A part of the compression member can be located on one side of the temperature sensor, and another part of the compression member can be located on the other side of the temperature sensor.

Description

Technical Field

[0001] This application claims the benefit of priority based on Korean Patent Application No. 10-2022-0070939 filed on June 10, 2022 and Korean Patent Application No. 10-2023-0048466 filed on April 12, 2023, and all the contents disclosed in the documents of the Korean patent applications are incorporated herein by reference.

[0002] The present invention relates to a temperature sensing assembly for sensing the temperature of a cell stack and a battery module including the same.

Background Art

[0003] In modern society, as the use of portable devices such as mobile phones, notebook computers, camcorders, and digital cameras has become common, development of technologies related to the fields associated with such mobile devices has been actively carried out. In addition, rechargeable secondary batteries are used as power sources for electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (P-HEVs), etc. as a means to solve air pollution caused by existing gasoline vehicles using fossil fuels, and the need for development of secondary batteries is increasing.

[0004] Currently, commercially available secondary batteries include nickel-cadmium batteries, nickel-metal hydride batteries, nickel-zinc batteries, lithium secondary batteries, etc. Among these, lithium secondary batteries have attracted attention because they have almost no memory effect compared to nickel-based secondary batteries, can be freely charged and discharged, have a very low self-discharge rate, and have a high energy density.

[0005] Such lithium secondary batteries mainly use a lithium-based oxide and a carbon material as a positive electrode active material and a negative electrode active material, respectively. A lithium secondary battery includes an electrode assembly in which a positive electrode plate and a negative electrode plate coated with such positive electrode active material and negative electrode active material, respectively, are disposed with a separator interposed therebetween, and an exterior material for hermetically storing the electrode assembly together with an electrolytic solution, that is, a battery case.

[0006] Generally, lithium-ion secondary batteries are classified into two types based on the shape of their casing: can-type secondary batteries, in which the electrode assembly is housed in a metal can, and pouch-type secondary batteries, in which the electrode assembly is housed in an aluminum laminate sheet pouch.

[0007] In the case of rechargeable batteries used in small devices, two to three battery cells are arranged, but in the case of rechargeable batteries used in medium to large devices such as automobiles, a battery module is used in which many battery cells are electrically connected.

[0008] Such battery modules improve capacity and output by connecting numerous battery cells in series or parallel to form a stack of battery cells. Furthermore, one or more battery modules can be mounted together with various control and protection systems, such as a Battery Management System (BMS) and a cooling system, to form a battery pack.

[0009] On the other hand, if the battery cells contained in a battery module experience overvoltage, overcurrent, or overheating, the safety and operational efficiency of the battery module become a major concern. For example, when the pressure and temperature of the battery rise, decomposition reactions of the active material and numerous side reactions proceed, causing the battery temperature to rise rapidly, which in turn accelerates the reaction between the electrolyte and electrodes. Ultimately, a thermal runaway phenomenon occurs where the battery temperature rises rapidly, and if the temperature rises above a certain level, the battery may ignite, and the increased internal pressure of the battery may cause the battery cells and the battery module containing them to explode.

[0010] Therefore, a means of detecting temperature changes in the battery cells is necessary. For this reason, temperature sensors such as thermistors are placed inside the battery module to check and control their operating status in real time or at predetermined intervals. [Overview of the Initiative] [Problems that the invention aims to solve]

[0011] One problem that the present invention aims to solve is to provide a temperature sensing assembly and a battery module including the same that prevent damage to the temperature sensor and improve accuracy and reliability. [Means for solving the problem]

[0012] A temperature sensing assembly according to an embodiment of the present invention may include a substrate, a temperature sensor mounted on the substrate, a bridge coupled to the substrate and having a hole facing the temperature sensor, and compression members positioned on both sides of the temperature sensor between the bridge and the substrate.

[0013] The bridge can be connected on the upper side of the substrate.

[0014] The bridge may include a main body portion to which the substrate is connected, and an extension portion extending from the main body portion, the compression member in contact with the substrate at a predetermined distance.

[0015] The extension portion may have the aforementioned hole formed in it.

[0016] The substrate may include a coupling portion that connects to the bridge and a mounting portion on which the temperature sensor is mounted at a predetermined distance from the bridge.

[0017] An adhesive layer may be provided between the joint and the bridge.

[0018] The substrate may further include an inclined portion that connects the bonding portion and the mounting portion and is formed at an angle to the mounting portion.

[0019] The compression member can be bonded to the bridge and the substrate.

[0020] The hole can be non-overlapping with the compression member in the direction through which the hole penetrates (it does not need to overlap).

[0021] An embodiment of the present invention may include a battery module comprising a housing, a cell stack comprising a plurality of battery cells housed in the housing and arranged parallel to each other, and a temperature sensing assembly for sensing the temperature of the cell stack. The temperature sensing assembly may include a substrate located above the cell stack, a temperature sensor mounted on the substrate, a bridge coupled to the substrate and having a hole facing the temperature sensor, and compression members located on both sides of the temperature sensor between the bridge and the substrate.

[0022] The battery module may further include a busbar frame on which busbars connecting the plurality of battery cells are mounted. The bridge may be rotatably connected to the busbar frame.

[0023] At least a portion of the temperature sensing assembly can be positioned between the upper plate of the housing and the cell stack. [Effects of the Invention]

[0024] According to a preferred embodiment of the present invention, even if the cell stack expands or pressure is applied to the substrate due to tolerances during the assembly of the battery module, the compression member can prevent damage to the temperature sensor, and the substrate can maintain a state where it is adjacent to or in close contact with the cell stack. This improves the accuracy and reliability of the temperature sensor.

[0025] Furthermore, since the compression member does not interfere with the temperature sensor, and the bridge hole is formed to face the temperature sensor, the temperature sensor can enter the bridge hole even if the compression member is excessively compressed. This prevents damage to the temperature sensor.

[0026] In addition, it can include effects that can be easily predicted by those skilled in the art from the configurations according to the preferred embodiments of the present invention.

Brief Description of the Drawings

[0027] The following drawings attached to this specification illustrate the preferred embodiments of the present invention and serve to further understand the technical idea of the present invention together with the detailed description of the invention to be described later. The present invention should not be construed as being limited only to the matters described in such drawings.

[0028] [Figure 1] It is a perspective view showing the appearance of a battery module according to an embodiment of the present invention. [Figure 2] It is an exploded perspective view of the battery module shown in FIG. 1. [Figure 3] It is a view showing a temperature sensing assembly provided in a battery module according to an embodiment of the present invention. [Figure 4] It is an exploded perspective view of a temperature sensing assembly according to an embodiment of the present invention. [Figure 5] It is a plan view of a temperature sensing assembly according to an embodiment of the present invention. [Figure 6] It is a schematic diagram for explaining the operation of a temperature sensing assembly according to an embodiment of the present invention. [Figure 7] It is a view of a temperature sensing assembly according to a comparative example. [Figure 8] It is a view of a temperature sensing assembly according to a comparative example. [Figure 9] It is an exploded perspective view of a temperature sensing assembly according to another embodiment of the present invention.

Modes for Carrying Out the Invention

[0029] Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, so that they can be easily implemented by a person with ordinary skill in the art to which the present invention pertains. However, the present invention can be realized in a variety of different forms and is not limited or restricted by the embodiments described below.

[0030] For the purpose of clearly describing the present invention, detailed descriptions of relevant prior art that are irrelevant to the description or that could obscure the gist of the invention have been omitted. In this specification, when assigning reference numerals to components in the drawings, the same or similar reference numerals are used for components that are the same or similar throughout the specification.

[0031] Furthermore, the terms and words used in this specification and the claims should not be interpreted in a manner limited to their ordinary or dictionary meanings, but rather should be interpreted in a manner consistent with the technical idea of ​​the present invention, in accordance with the principle that inventors may appropriately define the concepts of terms in order to best describe their invention.

[0032] Figure 1 is a perspective view illustrating the external appearance of a battery module according to one embodiment of the present invention, and Figure 2 is an exploded perspective view of the battery module shown in Figure 1.

[0033] A battery module 100 according to one embodiment of the present invention may include a cell stack 110 and a housing 120.

[0034] The cell stack 110 may include a plurality of battery cells 111 arranged parallel to each other. The cell stack 110 can be housed in a housing 120.

[0035] Multiple battery cells 111 can be arranged facing each other in a first direction (for example, a direction parallel to the Y-axis). More specifically, multiple battery cells 111 can be stacked on top of each other in the first direction. Each battery cell 111 can also be arranged elongated in a second direction perpendicular to the first direction (for example, a direction parallel to the X-axis). The first direction can be parallel to the overall width direction of the housing 120, and the second direction can be parallel to the overall length direction of the housing 120.

[0036] Each battery cell 111 can be a pouch-type battery cell. Pouch-type battery cells can maximize the number of layers per unit area, thereby increasing the energy density of the battery module 100. A pouch-type battery cell 111 can be manufactured by housing an electrode assembly, including a positive electrode, a negative electrode, and a separator, in a cell case formed from a laminate sheet, and then heat-sealing the cell case. However, it is obvious that the battery cell 111 does not necessarily have to be supplied in pouch form, and may be supplied in prismatic, cylindrical, or other various forms, provided that the storage capacity required by the device to which it will be subsequently installed is achieved.

[0037] Each battery cell 111 may be provided with a pair of electrode leads 112. The pair of electrode leads 112 can protrude in opposite directions and can protrude parallel to the longitudinal direction of the battery cell 111. However, it is not limited to this, and the pair of electrode leads 112 can also protrude in the same direction and parallel to each other.

[0038] Furthermore, the cell stack 110 may be provided with at least one heat dissipation pad. The heat dissipation pad can be positioned between multiple battery cells 111 or positioned to cover the outermost battery cell 111.

[0039] The housing 120 can give the appearance of the battery module 100. The housing 120 can be made of a metal material with high strength.

[0040] The structure of the housing 120 can be varied. For example, the housing 120 can be a monoframe. The monoframe can be a metal plate material in which the upper plate 121, lower plate, and both side plates are integrated. As another example, the housing 120 can have a structure in which a U-shaped frame and the upper plate 121 are joined together. The U-shaped frame can be a metal plate material in which the lower plate and side plates are joined or integrated together. In addition, the structure of the housing 120 may be provided as a structure in which L-shaped frames are joined together, and may be provided in various structures not described in the examples above.

[0041] The housing 120 may have an internal space in which the cell stack 110 can be housed. More specifically, the housing 120 may include an upper plate 121, a lower plate, and side plates. The housing 120 may have open ends in the overall length direction and may be covered by end plates 140, which will be described later.

[0042] The battery module 100 may further include a busbar frame 130 and an end plate 140.

[0043] The busbar frame 130 can be positioned on both sides of the cell stack 110 in the overall length direction. At least one busbar 131 can be mounted on the busbar frame 130, and each busbar 131 can be connected to the electrode leads 112 of the battery cells 111. The busbars 131 can be configured to electrically connect multiple battery cells 111 to external devices.

[0044] The end plate 140 can be positioned outside the busbar frame 130. That is, the busbar frame 130 can be positioned between the cell stack 110 and the end plate 140.

[0045] The end plate 140 can be coupled to the housing 120. The end plate 140 can cover both open ends of the housing 120. An opening 140h is formed in the end plate 140, and the bus bar 131 can be electrically connected through the opening 140h. That is, the bus bar 131 of one battery module 100 can be electrically connected to other battery modules 100 or BDUs (Battery Disconnect Units) through the opening 140h.

[0046] Figure 3 is a diagram illustrating a temperature sensing assembly provided in a battery module according to one embodiment of the present invention, Figure 4 is an exploded perspective view of the temperature sensing assembly according to one embodiment of the present invention, Figure 5 is a plan view of the temperature sensing assembly according to one embodiment of the present invention, and Figure 6 is a schematic diagram illustrating the operation of the temperature sensing assembly according to one embodiment of the present invention.

[0047] The battery module 100 may include a temperature sensing assembly 10 that senses the temperature of the cell stack 110.

[0048] At least a portion of the temperature sensing assembly 10 can be positioned between the upper plate 121 of the housing 120 and the cell stack 110. That is, at least a portion of the temperature sensing assembly 10 can be positioned above the cell stack 110 and below the upper plate 121. The temperature sensing assembly 10 can be pressed or pressed against the cell stack 110 by the upper plate 121 or another configuration located below the upper plate 121.

[0049] The temperature sensing assembly 10 can be connected to the busbar frame 130. More specifically, the temperature sensing assembly 10 can be rotatably connected to the busbar frame 130. For example, the temperature sensing assembly 10 can be hinged to the busbar frame 130.

[0050] This allows the temperature sensing assembly 10 to reliably adhere to the cell laminate 110, enabling accurate measurement of the cell laminate 110's temperature.

[0051] The temperature sensing assembly 10 may include a substrate 20, a temperature sensor 40 mounted on the substrate 20, a bridge 30 having a hole 34 formed therein that connects to the substrate 20 and faces (opposes) the temperature sensor 40, and a compression member 50 positioned between the bridge 30 and the substrate 20.

[0052] The substrate 20 can be located above the cell stack 110. The substrate 20 can be formed to be generally elongated in the overall direction of the cell stack 110. The substrate 20 can include multiple regions having different degrees of inclination. The substrate 20 can be formed as a single unit, but is not limited to this.

[0053] A temperature sensor 40 can be mounted on the substrate 20. The temperature sensor 40 can be a temperature-sensing element. The temperature sensor 40 can be fixed to the substrate 20 by soldering.

[0054] The temperature sensor 40 may include a thermistor. A thermistor is a semiconductor device that utilizes the phenomenon of resistance changing in response to temperature. Thermistors have the advantage of being small in size and being able to measure rapid and precise temperature changes.

[0055] The substrate 20 can be a flexible printed circuit board (FPCB). The substrate 20 can be electrically connected to the temperature sensor 40 and can transmit temperature information measured by the temperature sensor 40 to the outside.

[0056] The temperature information measured by the temperature sensor 40 can be transmitted to other devices outside the battery module 100. For example, the temperature information measured by the temperature sensor 40 can be transmitted to a battery management system (BMS) outside the battery module 100 and used to control the battery module 100.

[0057] The bridge 30 can be coupled to the upper side of the substrate 20. The bridge 30 has higher rigidity than the substrate 20 and can support the substrate 20.

[0058] The bridge 30 can be formed to be long in the overall direction of the cell stack 110. The bridge 30 may include multiple regions having different inclinations. The bridge 30 may be formed as a single unit, but is not limited to this.

[0059] The bridge 30 can be rotatably connected to the busbar frame 130. More specifically, the bridge 30 can be hinged to the upper end of the busbar frame 130 so as to be rotatable relative to the busbar frame 130. Since the bridge 30 is coupled to the substrate 20, the bridge 30 can rotate together with the substrate 20. The bridge 30 can rotate about an axis parallel to the stacking direction of the cell stack 110.

[0060] A hole 34 can be formed in the bridge 30 that faces the temperature sensor 40 on the substrate 20. Therefore, even if the substrate 20 is deformed toward the bridge 30, the temperature sensor 40 can be inserted into the hole 34. In other words, interference between the temperature sensor 40 and the bridge 30 can be prevented.

[0061] The substrate 20 may include a coupling portion 21 that connects to the bridge 30 and a mounting portion 22 on which the temperature sensor 40 is mounted at a predetermined distance from the bridge 30. The substrate 20 may further include an inclined portion 23 that connects the coupling portion 21 and the mounting portion 22 and is formed at an angle to the mounting portion 22.

[0062] The bridge 30 may include a main body 31 to which the substrate 20 is connected, and an extension 32 extending from the main body 31 and contacting the compression member 50 at a predetermined distance from the substrate 20. The bridge 30 may further include a connecting portion 33 that is rotatably connected to the busbar frame 130.

[0063] The bonding portion 21 of the substrate 20 can be bonded to the bridge 30, thereby allowing for easy connection to the bridge 30. In other words, an adhesive layer 60 may be provided between the bonding portion 21 and the bridge 30.

[0064] The connecting portion 21 can be connected to the main body portion 31 of the bridge 30. The connecting portion 21 of the substrate 20 can be formed parallel to the main body portion 31 of the bridge 30. Therefore, the connecting portion 21 and the main body portion 31 can be in close contact and connected with the adhesive layer 60 in between.

[0065] For example, the adhesive layer 60 can be double-sided tape.

[0066] However, the method of connecting the coupling portion 21 of the substrate 20 and the main body portion 31 of the bridge 30 is not limited to this.

[0067] The mounting portion 22 of the substrate 20 can be spaced a predetermined distance from the bridge 30. More specifically, the mounting portion 22 can be spaced a predetermined distance from the extension portion 32 of the bridge 30. This distance allows the temperature element 40 and the compression member 50 to be positioned between the substrate 20 and the bridge 30.

[0068] The extension 32 of the bridge 30 can extend from the main body 31. The extension 32 and the main body 31 can be parallel to each other or formed with different slopes.

[0069] The mounting portion 22 of the substrate 20 can be formed parallel to the extension portion 32 of the bridge 30. Therefore, the spacing can be kept constant with respect to the longitudinal direction of the mounting portion 22.

[0070] A temperature sensor 40 can be mounted on the mounting portion 22. The temperature sensor 40 can be fixed to the mounting portion 22 by soldering.

[0071] The temperature sensor 40 can face a hole 34 formed in the bridge 30. More specifically, a hole 34 facing the temperature sensor 40 can be formed in the extension 32 of the bridge 30. This allows the temperature sensor 40 to be inserted into the hole 34 even if the mounting portion 22 of the substrate 20 is deformed toward the extension 32 of the bridge 30. In other words, interference between the temperature sensor 40 and the extension 32 of the bridge 30 can be prevented.

[0072] The inclined portion 23 of the substrate 20 is located between the coupling portion 21 and the mounting portion 22, and can connect the coupling portion 21 and the mounting portion 22. The inclined portion 23 can be formed integrally with the coupling portion 21 and the mounting portion 22. The inclined portion 23 allows the coupling portion 21 and the mounting portion 22 to be roughly stepped. As a result, the coupling portion 21 can be in close contact with the main body portion 31 of the bridge 30, and the mounting portion 22 can be spaced at a predetermined distance from the extension portion 32 of the bridge 30.

[0073] The connecting portion 33 of the bridge 30 may have a shape that is bent downward in the main body portion 31. The connecting portion 33 may be rotatably connected to the busbar frame 130.

[0074] The compression member 50 can be positioned between the substrate 20 and the bridge 30. The compression member 50 can be positioned between the mounting portion 22 of the substrate 20 and the extension portion 32 of the bridge 30.

[0075] The compression member 50 can be bonded to the substrate 20 and the bridge 30, respectively. Specifically, the bottom surface of the compression member 50 can be bonded to the mounting portion 22 of the substrate 20, and the top surface can be bonded to the extension portion 32 of the bridge 30.

[0076] For example, a lower adhesive layer may be provided between the bottom surface of the compression member 50 and the upper surface of the mounting portion 22, and an upper adhesive layer may be provided between the upper surface of the compression member 50 and the lower surface of the extension portion 32. The lower adhesive layer and the upper adhesive layer may be double-sided tape.

[0077] This prevents the mounting portion 22 of the substrate 20 and the extension portion 32 of the bridge 30 from separating or deforming in an unintended direction.

[0078] The compression member 50 can be configured to be compressed when the substrate 20 is deformed toward the bridge 30. The compression member 50 can mitigate the deformation of the substrate 20 and prevent the substrate 20 from interfering with the bridge 30. In addition, the compression member 50 can improve the durability of the temperature sensing assembly 10.

[0079] The compression member 50 can be a compression pad whose material itself has elastic force and deforms under compression. In this case, the material of the compression member 50 is not limited and can be a material that is elastically deformed by a predetermined external force. For example, the compression member 50 can be made of an elastically deformable material such as sponge or polyurethane foam and can be compressed between the bridge 30 and the substrate 20.

[0080] However, this is not the only option; the compression member 50 can also be configured to exert elastic force depending on its shape, such as a spring.

[0081] The compression member 50 can be located on both sides of the temperature sensor 40. That is, a portion of the compression member 50 can be located on one side of the temperature sensor 40, and another portion of the compression member 50 can be located on the other side of the temperature sensor 40.

[0082] For example, the compression member 50 may include a first compression member 50 located on one side of the temperature sensor 40 and a second compression member 50 located on the other side of the temperature sensor 40.

[0083] As a result, the compression member 50 does not interfere with the temperature sensor 40, and pressure is not applied to the temperature sensor 40 when the compression member 50 is compressed. More specifically, even if the cell stack 110 expands or pressure is applied to the substrate 20 due to tolerances during the assembly of the battery module 100, the compression member 50 prevents damage to the temperature sensor 40, and the substrate 20 can maintain a state where it is adjacent to or in close contact with the cell stack 110. This improves the accuracy and reliability of the temperature sensor 40.

[0084] The hole 34 formed in the bridge 30 can be non-overlapped with the compression member 50 in the direction through which the hole 34 passes (they do not overlap). This prevents the compression member 50 from blocking the hole 34, and even when the compression member 50 is compressed, the temperature sensor 40 can face the hole 34 or enter the hole 34.

[0085] Figures 7 and 8 show a temperature sensing assembly according to a comparative example.

[0086] In the comparative example, the temperature sensing assembly 10' does not require a hole to be formed in the bridge 30 toward the temperature sensor 40, and the compression member 50' can cover the temperature sensor 40. That is, the temperature sensor 40 can be embedded in the compression member 50'.

[0087] Therefore, there is no problem when the compression member 50' is lightly compressed, but if the compression member 50' is strongly compressed, there is a risk that the temperature sensor 40 may be damaged.

[0088] On the other hand, as described above, in the case of the temperature sensing assembly 10 according to the present invention, the compression member 50 does not interfere with the temperature sensor 40, the hole 34 of the bridge 30 is formed to face the temperature sensor 40, and even if the compression member 50 is excessively compressed, the temperature sensor 40 can enter the hole 34. This prevents damage to the temperature sensor 40.

[0089] Figure 9 is an exploded perspective view of a temperature sensing assembly according to another embodiment of the present invention.

[0090] Another embodiment of the present invention, the temperature sensing assembly 10', utilizes the above-described embodiment except for the compression member 50a.

[0091] The compression members 50a located on both sides of the temperature sensor 40 can be connected to each other insofar as they do not interfere with the temperature sensor 40. The compression members 50a can be formed as a single unit.

[0092] The compression member 50a can surround the temperature sensor 40. That is, a portion of the compression member 50a can be located on one side of the temperature sensor 40, and another portion of the compression member 50a can be located on the other side of the temperature sensor 40.

[0093] More specifically, a through-hole is formed in the compression member 50a, and the temperature sensor 40 can be positioned within the through-hole. The through-hole can face a hole 34 formed in the bridge 30.

[0094] In this embodiment, there is an advantage in simplifying the bonding process of the compression member 50a to the substrate 20 and / or bridge 30.

[0095] The above description is merely illustrative of the technical concept of the present invention, and any person with ordinary skill in the art to which the present invention belongs can make various modifications and alterations without departing from the essential characteristics of the present invention.

[0096] Therefore, the embodiments disclosed in this invention are for illustrative purposes only, and not to limit the technical concept of the invention, and the scope of the technical concept of the invention is not limited by such embodiments.

[0097] The scope of protection of this invention shall be interpreted in accordance with the following claims, and all technical ideas within an equivalent scope shall be interpreted as being included within the scope of the rights of this invention. [Explanation of symbols]

[0098] 10 Temperature sensing assembly 20 circuit boards 21 Joint 22 Mounting part 23 Slope 30 Bridge 31 Main body 32 Extension 33 Connecting part 34 holes 40 Temperature Sensors 50 Compression member 60 Adhesive layer 100 Battery Modules 110-cell stack 111 battery cells 120 Housing 130 Busbar Frame 140 End Plate

Claims

1. circuit board and A temperature sensor mounted on the aforementioned substrate, A bridge is coupled to the substrate and has a hole formed therein that faces the temperature sensor, The bridge and the substrate are located between the temperature sensor and compression members positioned on both sides of the temperature sensor, The hole is a temperature sensing assembly that does not overlap with the compression member in the direction through which the hole penetrates.

2. The temperature sensing assembly according to claim 1, wherein the bridge is coupled on the upper side of the substrate.

3. The aforementioned bridge, The main body portion to which the aforementioned substrate is attached, The temperature sensing assembly according to claim 1, further comprising an extension portion extending from the main body portion and the compression member in contact with the substrate at a predetermined distance.

4. The temperature sensing assembly according to claim 3, wherein the extension portion has the hole formed therein.

5. The aforementioned substrate is The coupling portion that connects to the bridge, The temperature sensing assembly according to claim 1, further comprising the bridge and a mounting portion on which the temperature sensor is mounted at a predetermined distance.

6. The temperature sensing assembly according to claim 5, wherein an adhesive layer is provided between the joint and the bridge.

7. The aforementioned substrate is The temperature sensing assembly according to claim 5, further comprising an inclined portion that connects the coupling portion and the mounting portion and is formed at an angle to the mounting portion.

8. The temperature sensing assembly according to claim 1, wherein the compression member is bonded to the bridge and the substrate.

9. Housing and A cell stack comprising a plurality of battery cells housed in the aforementioned housing and arranged parallel to each other, The cell stack includes a temperature sensing assembly that senses the temperature of the cell stack, The temperature sensing assembly is A substrate located above the aforementioned cell stack, A temperature sensor mounted on the aforementioned substrate, A bridge is coupled to the substrate and has a hole formed therein that faces the temperature sensor, The bridge and the substrate are located between the temperature sensor and compression members positioned on both sides of the temperature sensor, The aforementioned hole is a battery module that does not overlap with the compression member in the direction through which the hole penetrates.

10. The system further includes a busbar frame to which busbars connected to the aforementioned plurality of battery cells are mounted, The battery module according to claim 9, wherein the bridge is rotatably connected to the busbar frame.

11. The battery module according to claim 9, wherein at least a portion of the temperature sensing assembly is located between the upper plate of the housing and the cell stack.

Images