electronic machinery

Abstract

To provide electronic equipment that can suppress surface temperature while ensuring overall system performance. [Solution] The electronic device comprises a housing, a keyboard device provided facing the surface of the housing, a substrate on which a plurality of heat-generating elements are mounted and facing the bottom surface of the keyboard device within the housing, a fan with a first discharge port provided on a first side surface, a heat sink positioned facing the first discharge port, and a heat transport member connecting some of the plurality of heat-generating elements and the heat sink, wherein the fan has the first discharge port, a second discharge port provided on a second side surface intersecting the first side surface and opening facing the gap formed between the bottom surface of the keyboard device and the first surface of the substrate facing the bottom surface, and an inclined wall provided on a part of the second side surface and forming one edge of the second discharge port, for circulating the air discharged from the second discharge port toward the gap.

Description

Technical Field

[0005]

[0001] The present invention relates to an electronic device provided with a fan.

Background Art

[0002] An electronic device such as a notebook PC mounts a heat generating component such as a CPU. Such an electronic device often mounts a thermal module provided with a fan and a heat sink. The thermal module can absorb the heat generated by the heat generating component and dissipate it to the outside (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The configuration of Patent Document 1 includes a pair of left and right fans. Each fan has a pair of air outlets and can discharge air in two directions. The air that exits from one air outlet passes through a heat sink located immediately behind it and is discharged outside the housing. Heat from a CPU (Central Processing Unit) or the like, which usually involves the most significant heat generation, is transported to the heat sink by a heat pipe or the like. The air that exits from the other air outlet flows along the surface of a substrate disposed between the left and right fans, cools the mounted components such as the CPU, and is discharged outside the housing.

[0005] However, in a configuration where one fan has two outlets, the airflow per outlet decreases. In particular, if the airflow of one of the outlets facing the heatsink decreases significantly, there is a concern that the cooling efficiency of the heatsink will decrease. In this regard, the configuration in Patent Document 1 is a dual-fan structure having two fans and two heatsinks. Therefore, in this configuration, there is ample airflow from each fan, and the surplus fan capacity is used to discharge air onto the surface of the substrate. For this reason, in a dual-fan structure, even if the fan has outlets in two directions, the cooling capacity of the heatsink does not become a problem.

[0006] However, due to space and cost constraints within the chassis, a single-fan design with only one fan is sometimes adopted. In this design, if the fan has two exhaust outlets, there is a concern that the cooling efficiency of the heatsink will decrease. In this case, the surface temperature of the keyboard unit directly above the heatsink may rise, potentially causing discomfort to the user. Furthermore, insufficient cooling of the CPU and other components may lead to a decrease in overall system performance. On the other hand, if the fan does not have the other exhaust outlet mentioned above, it may be difficult to suppress the rise in the surface temperature of the keyboard unit due to the heat generated by heat sources other than the CPU, such as the DC-DC converter.

[0007] This invention has been made in consideration of the problems of the prior art described above, and aims to provide an electronic device that can suppress surface temperature while ensuring the overall performance of the system. [Means for solving the problem]

[0008] An electronic device according to a first aspect of the present invention comprises a housing, a keyboard device provided facing the surface of the housing, a substrate on which a plurality of heat-generating elements are mounted and facing the bottom surface of the keyboard device within the housing, a fan having a first discharge port on a first side surface, a heat sink positioned facing the first discharge port, and a heat transport member connecting some of the plurality of heat-generating elements and the heat sink, wherein the fan has the first discharge port, a second discharge port provided on a second side surface intersecting the first side surface and opening facing a gap formed between the bottom surface of the keyboard device and the first surface of the substrate facing the bottom surface, and an inclined wall provided on a part of the second side surface and forming one edge of the second discharge port, for circulating the air discharged from the second discharge port toward the gap.

[0009] An electronic device according to a second aspect of the present invention comprises a housing, a keyboard device provided facing the surface of the housing, a substrate on which a plurality of heat-generating elements are mounted and facing the bottom surface of the keyboard device within the housing, a fan having a first discharge port on a first side surface, a heat sink positioned facing the first discharge port, and a heat transport member connecting some of the plurality of heat-generating elements and the heat sink, wherein the fan has a first discharge port and a second discharge port provided on a second side surface intersecting the first side surface and opening facing the gap between the bottom surface of the keyboard device and the first surface of the substrate facing the bottom surface, and the upper end of the second discharge port is below the bottom surface of the keyboard device and the lower end is above the second surface of the substrate opposite to the first surface when the height direction along the thickness direction of the housing is taken as a reference, the upper end of the second discharge port is below the bottom surface of the keyboard device and the lower end is above the second surface opposite to the first surface of the substrate. [Effects of the Invention]

[0010] According to the above embodiment of the present invention, it is possible to ensure the overall performance of the system while suppressing the surface temperature. [Brief explanation of the drawing]

[0011] [Figure 1] Figure 1 is a schematic plan view of an electronic device according to one embodiment, viewed from above. [Figure 2] Figure 2 is a schematic plan view showing the internal structure of the enclosure. [Figure 3] Figure 3 is a schematic bottom view showing the internal structure of the enclosure. [Figure 4] Figure 4 is a schematic side cross-sectional view of the enclosure along the line IV-IV in Figure 2. [Figure 5] Figure 5 is a perspective view of the fan from the Z1 side, looking down. [Figure 6] Figure 6 is a perspective view of the fan, looking up from the Z2 side. [Figure 7] Figure 7 is a side view of the fan. [Modes for carrying out the invention]

[0012] Hereinafter, preferred embodiments of the electronic device according to the present invention will be described in detail with reference to the attached drawings.

[0013] Figure 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in Figure 1, the electronic device 10 in this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, a notebook PC electronic device 10 is used as an example, but the electronic device may be something other than a notebook PC, such as a tablet PC, smartphone, or portable game console.

[0014] The lid 11 is a thin, flat, box-shaped enclosure. The lid 11 houses a display 16. The display 16 can be made of, for example, an organic EL display or a liquid crystal display.

[0015] The enclosure 12 is a thin, flat box. The keyboard device 18 and touchpad 19 face the top surface (surface 12a) of the enclosure 12. Hereinafter, the enclosure 12 and each component mounted thereon will be described using the operator's posture when operating the keyboard device 18 as the reference point, with the width direction (left and right) of the enclosure 12 being referred to as the X1 and X2 directions, the depth direction (front and back) of the enclosure 12 being referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the enclosure 12 being referred to as the Z1 and Z2 directions. The X1 and X2 directions may also be collectively referred to as the X direction, and similarly, the Y1 and Y2 directions and the Z1 and Z2 directions may be referred to as the Y direction and Z direction. These directions are defined for the convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0016] The housing 12 may consist of a housing member 20 that forms the top surface and the four circumferential sides, and a lower cover material 21 that forms the bottom surface. The housing member 20 may have vertical walls 20B that form the outer walls on the four circumferential edges of the upper cover material 20A that forms the surface 12a of the housing 12. In this case, the housing member 20 has a roughly bathtub shape with an open bottom. The lower cover material 21 has a roughly flat shape and serves as a lid that closes the bottom opening of the housing member 20. The housing member 20 and the lower cover material 21 are overlapped in the thickness direction and detachably connected to each other. The vertical walls 20B may be formed on the lower cover material 21. In this case, the housing member 20 may consist only of the upper cover material 20A.

[0017] The hinge 14 is installed in a concave hinge arrangement groove 12b formed on the rear edge of the housing 12, connecting the housing 12 and the lid 11. The hinge 14 has a structure in which, for example, a hinge shaft that serves as the axis of rotation is supported at both ends in the longitudinal direction of the hinge housing 14a. In this embodiment, the hinge 14 may be configured in a so-called single-bar shape in which the hinge housing 14a extends along the longitudinal direction of the hinge arrangement groove 12b.

[0018] The keyboard device 18 has a configuration in which, for example, a plurality of keys 18a are supported on the upper surface side of a plate-like member 18b so as to be movable up and down. The plate-like member 18b is formed by laminating a sheet metal member serving as a base for supporting each key 18a and a membrane sheet serving as a switch for detecting a pressing operation of each key 18a. A waterproof sheet or a sheet-like light-emitting module may be further laminated on the plate-like member 18b. The periphery of each key 18a may be separated by an isolation frame 18c that forms a part of the surface 12a of the housing 12. The isolation frame 18c may be formed in a mesh shape on a part of the upper cover material 20A. The isolation frame 18c may have a separate structure from the upper cover material 20A and may be supported by the plate-like member 18b. The bottom surface 18d of the plate-like member 18b faces the upper surface (the first surface 25A) of the substrate 25 inside the housing 12 (see FIG. 4).

[0019] FIG. 2 is a plan view schematically showing the internal structure of the housing 12. FIG. 3 is a bottom view schematically showing the internal structure of the housing 12. FIG. 2 is a view of the inside of the housing 12 as seen from above (the Z1 side) with the lid body 11, the hinge 14, the keyboard device 18, the upper cover material 20A, etc. omitted. FIG. 3 is a view of the inside of the housing 12 as seen from below (the Z2 side) with the lower cover material 21 removed.

[0020] As shown in FIGS. 2 and 3, the housing 12 houses a thermal module 24, a substrate 25, and a battery device 26. Various electronic components, mechanical components, etc. are further provided inside the housing 12.

[0021] The substrate 25 is a circuit board serving as the motherboard of the electronic device 10. The substrate 25 is disposed closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery serving as the power source of the electronic device 10. The battery device 26 is disposed closer to the Y1 side of the substrate 25 and extends in the X direction.

[0022] The circuit board 25 has a CPU 25a mounted on it. The CPU 25a is a processing unit that performs calculations related to the main control and processing of the electronic device 10. A DC-DC converter 25b and a memory 25c may also be mounted around the CPU 25a. The DC-DC converter 25b is a power supply unit that converts the DC voltage from the battery device 26 to a predetermined DC voltage. The memory 25c is a storage device. Various other electronic components, such as a communication module, can also be mounted on the circuit board 25.

[0023] The circuit board 25 can have its upper surface on the Z1 side (first surface 25A) as the mounting surface to the housing member 20. The first surface 25A may be screwed to, for example, the inner surface (Z2 side surface) of the upper cover material 20A or the bottom surface 18d of the keyboard device 18 via cylindrical members (bosses). The circuit board 25 can have its lower surface on the Z2 side (second surface 25B) as the mounting surface for the CPU 25a, DC-DC converter 25b, memory 25c, etc. Electronic components such as the CPU 25a may be mounted on the first surface 25A. The circuit board 25 may also have its second surface 25B as the mounting surface to the housing member 20.

[0024] The CPU 25a is one of the largest heat-generating components among the electronic components mounted within the enclosure 12. The thermal module 24 can absorb and dissipate the heat generated by the CPU 25a and expel it outside the enclosure 12. The thermal module 24 can also cool the DC-DC converter 25b and memory 25c, which are the next largest heat-generating components after the CPU 25a.

[0025] As shown in Figures 2 and 3, the thermal module 24 of this embodiment may include a heat pipe 28, a heat sink 29, and a fan 30.

[0026] The heat pipe 28 is a pipe-shaped heat transport member. The heat pipe 28 is formed by flattening a metal pipe to create an elliptical cross-section, and sealing a working fluid in the sealed space inside. Examples of working fluids include water, alternative refrigerants, acetone, or butane. One end (heat receiving part) of the heat pipe 28 is connected to the CPU 25a, and the other end (heat dissipation part) is connected to the heat sink 29. The heat receiving part of the heat pipe 28 may be connected to the CPU 25a via, for example, a copper heat receiving plate 32. The heat receiving plate 32 may be pressed against the top surface of the CPU 25a using a leaf spring member 33. The heat pipe 28 can efficiently transport the heat generated by the CPU 25a to the heat sink 29. The heat transport member may be other than the heat pipe 28. For example, a plate-type vapor chamber may be used as the heat transport member.

[0027] The heatsink 29 is provided facing the inner wall surface of a vertical wall 20B that extends in the X direction on the Y2 side of the housing 12, and extends in the X direction. Hereafter, this vertical wall 20B on the Y2 side may also be referred to as the "rear wall 20B". The heatsink 29 is positioned facing the first discharge port 42 of the fan 30. The heatsink 29 is made of a metal with high thermal conductivity, such as aluminum or copper. The heatsink 29 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands upright in the Z direction and extends in the Y direction. A gap is formed between adjacent fins through which air discharged from the fan 30 passes.

[0028] The fan 30 is positioned, for example, close to the Y1 side of the heatsink 29 and close to the X2 side of the circuit board 25. The placement of the fan 30 may be changed as appropriate. The positional relationship between the fan 30, the heatsink, and the circuit board 25 may also be changed as appropriate.

[0029] Figure 4 is a schematic side cross-sectional view of the housing 12 along the line IV-IV in Figure 2. Figure 5 is a perspective view of the fan 30 looking down from the Z1 side. Figure 6 is a perspective view of the fan 30 looking up from the Z2 side. Figure 7 is a side view of the fan 30.

[0030] The fan 30 has a fan housing 36. Inside the fan housing 36 are housed fan blades 38 and a motor unit 39. The fan 30 can be configured as a centrifugal fan in which the fan blades 38 are rotated by the motor unit 39. Reference numeral 30a in Figures 2, 3, 5, and 6 indicates a bracket for screw-fastening the fan 30 to the housing member 20 or the circuit board 25. Figure 7 omits the illustration of the bracket 30a.

[0031] The fan housing 36 can be made of metal cover plates 40 and 41. The cover plate 40 on the Z2 side may have a plate portion 40a and a side wall portion 40b that rises from the edge of the plate portion 40a. The cover plate 40 has a roughly bathtub shape with an open top. The cover plate 41 on the Z1 side serves as a lid to close the top opening of the cover plate 40.

[0032] The fan housing 36 may have discharge ports 42 and 43 provided on the side wall portion 40b, and intake ports 44 and 45 provided on the plate portion 40a and the cover plate 41.

[0033] The first discharge port 42 is formed as an opening over substantially the entire surface of the side wall portion 40b of the fan housing 36, which extends in the X direction facing the Y2 direction. The first discharge port 42 can discharge air in the Y2 direction. The air discharged from the first discharge port 42 passes through the heat sink 29. The air that has passed through the heat sink 29 is discharged to the outside of the housing 12 through an opening (first opening) 46 formed in the rear wall 20B, which is one of the outer walls of the housing 12.

[0034] The second discharge port 43 is formed as an opening in a part of the side wall portion 40b of the fan housing 36 that extends in the Y direction facing the X1 direction. The second discharge port 43 can discharge air in the X1 direction. The air discharged from the second discharge port 43 passes through the space (gap 48) formed between the bottom surface 18d of the keyboard device 18 and the first surface 25A of the circuit board 25. The air that has passed through the gap 48 is discharged to the outside of the housing 12 through an opening (second opening) 47 formed in the rear wall 20B. In this way, the second discharge port 43 has a structure that allows air to flow smoothly into the gap 48, but the details will be described later.

[0035] The intake ports 44 and 45 are formed on the upper and lower surfaces of the fan housing 36, respectively. Intake port 44 is formed as an opening in the cover plate 41 on the Z1 side. Intake port 44 may be omitted. Intake port 45 is formed as an opening in the plate portion 40a of the cover plate 40 on the Z2 side. Directly below intake port 45, an opening 49 is provided in the lower cover material 21 of the housing 12 (see Figure 4). The fan 30 can take in outside air through the opening 49 to the intake ports 44 and 45 and discharge it through the discharge ports 42 and 43.

[0036] Next, a more specific example of the configuration of the second discharge port 43 and its surrounding area will be described.

[0037] As shown in Figures 2 to 7, the fan 30 has a first discharge port 42 on the side surface 40b1 facing Y2, and a second discharge port 43 on the side surface 40b2 facing X1, which is part of the outer peripheral surface formed by the side wall portion 40b.

[0038] The second discharge port 43 opens facing the gap 48, allowing air to flow smoothly into the gap 48 (see Figure 4). On the other hand, in the electronic device 10 of this embodiment, it is desirable that the second discharge port 43 not allow air to flow into the space between the second surface 25B of the substrate 25 and the lower cover material 21 as much as possible. The reason for this is to minimize the airflow of the second discharge port 43 while effectively suppressing the rise in the surface temperature of the keyboard device 18 (temperature of surface 12a). In other words, by suppressing the airflow of the second discharge port 43, the decrease in airflow of the first discharge port 42 is minimized, and the decrease in the cooling efficiency of the CPU 25a by the heat sink 29 is suppressed, thereby ensuring the performance of the entire system.

[0039] As shown in Figure 4, the fan 30 in this embodiment is positioned within the housing 12 to fill the space between the keyboard device 18 and the lower cover material 21. In other words, the thickness (height in the Z direction) of the fan 30 is slightly less than the height in the Z direction between the keyboard device 18 and the lower cover material 21. For example, if the height between the bottom surface 18d of the keyboard device 18 and the inner surface of the lower cover material 21 is about 9 mm, the thickness of the fan 30 is, for example, 8.6 mm. The thickness of the substrate 25 is, for example, 1 mm, and the height of the gap 48 formed between the bottom surface 18d and the first surface 25A is about 1 mm. Therefore, with respect to the Z direction, the substrate 25 is located midway between the heights of the side surface 40b2 of the fan 30 (see Figure 4).

[0040] Therefore, the fan 30 may have an inclined wall 50 on a part of its side surface 40b2. As shown in Figures 2 and 4, the side surface 40b2 on which the second discharge port 43 is formed is positioned facing the X2 side end surface 25C of the substrate 25. The inclined wall 50 acts as a flow straightening plate to allow the air discharged from the second discharge port 43 to flow upward (towards the gap 48) of the end surface 25C. The inclined wall 50 is gradually sloped from bottom to top in the direction from the fan 30 toward the end surface 25C (X1 direction). This allows the air from the second discharge port 43 to flow smoothly into the gap 48. The dotted arrows in Figure 4 schematically show the airflow, and the same applies to Figure 2. Note that the angle and shape of the inclined wall 50 must be set so that it does not come into contact with the fan blades 38.

[0041] In this embodiment, the upper edge (upper end 43a) of the second discharge port 43 is formed by the cover plate 41. The lower edge (lower end 43b) of the second discharge port 43 is formed by the end portion 50a of the inclined wall 50. As a result, the air discharged from the second discharge port 43 flows smoothly along the inner surface of the inclined wall 50. This allows the air from the second discharge port 43 to flow into the gap 48 even more smoothly.

[0042] As shown in Figure 4, it is preferable that, with reference to the Z direction, the upper end 43a of the second discharge port 43 of the fan 30 is below the bottom surface 18d (towards Z2) and the lower end 43b is above the second surface 25B (towards Z1). This allows air from the second discharge port 43 to be introduced into the gap 48 more reliably and suppresses outflow to the second surface 25B. Thus, it is preferable that the lower end 43b is positioned opposite the end surface 25C, and more preferably flush with the first surface 25A. In other words, it is preferable that the lower end 43b is at a height position in the Z direction that is below the first surface 25A and above the second surface 25B.

[0043] Here, we provide an example of the dimensions of a fan 30 mounted on an electronic device 10, which is a notebook PC. Needless to say, the dimensions and shape of the fan 30 are not limited to those shown in the example. As shown in Figure 7, the fan 30 may have, for example, a length L in the Y direction of 70 mm, a height (thickness) H in the Z direction of 8.6 mm, and a width W in the X direction of 80 mm (see Figure 2). In this case, the second discharge port 43 may have, for example, a height H1 in the Z direction of 1.5 mm and a width W1 in the Y direction of 30 mm. The width of the first discharge port 42 in the X direction is approximately the same as the width W of the fan 30, for example, about 78 mm. The height of the first discharge port 42 in the Z direction is approximately the same as the height H of the fan 30, for example, about 8.4 mm.

[0044] Thus, the height H1 of the second discharge port 43 is preferably smaller than the height (height H) of the side surface 40b2, and preferably half or less. This allows for more reliable introduction of air from the second discharge port 43 into the gap 48 while effectively suppressing outflow to the second surface 25B. Furthermore, the width W1 of the second discharge port 43 is preferably smaller than the width (approximately the same as width W) of the first discharge port 42, and preferably half or less. This ensures sufficient airflow from the second discharge port 43 while suppressing a decrease in airflow from the first discharge port 42.

[0045] In Figures 5 to 7, the corner between the second discharge port 43 and the first discharge port 42 is shown as being in communication with each other. In the actual product, it is preferable to provide a support column that stands upright in the Z direction at this corner. This support column may have a width in the Y direction of, for example, about 8 mm. In this case, the second discharge port 43 may be configured to have a width W1 in the Y1 direction, starting from a position offset from the side surface 40b1 by the width of the support column (for example, 8 mm) toward the Y1 side.

[0046] As shown in Figures 2 and 4, a duct-structured air passage 52 may be formed in the gap 48. The air passage 52 makes the airflow from the second discharge port 43 toward the opening 47 smoother and can also prevent backflow to the intake ports 44 and 45. The air passage 52 can be formed by an airtight material 52a that stands upright between the bottom surface 18d and the first surface 25A.

[0047] The airtight material 52a is, for example, a member formed from sponge or rubber into a rod shape. The airtight material 52a does not need to completely block the passage of air, but it needs to have a certain degree of airflow resistance to restrict the direction of airflow. As shown in Figure 2, the airtight material 52a extends in the X1 direction from, for example, the Y1 side edge of the second discharge port 43, bending as appropriate as needed, and finally extends in the Y1 direction. This allows the airtight material 52a to form an air passage 52 on its inner circumference. It is preferable that the air passage 52 be set to an area that encompasses the heat-generating elements, the CPU 25a, DC-DC converter 25b, and memory 25c, in a plan view in the Z direction. As a result, as shown by the dashed waveform arrows in Figure 4, the heat released from the CPU 25a, DC-DC converter 25b, and memory 25c toward the first surface 25A is smoothly cooled by the air from the second discharge port 43 flowing through the gap 48 (air passage 52) and discharged to the opening 47.

[0048] It is preferable to provide an airtight material 54 similar to the airtight material 52a on the surface of the cover plate 41 of the fan 30 facing the air passage 52, and on the Z1 side surface of the heat sink 29. This will prevent the air discharged from the second discharge port 43 into the air passage 52 from flowing back into the intake port 44 immediately after discharge.

[0049] As described above, the electronic device 10 according to one aspect of this embodiment comprises a substrate 25 on which a plurality of heat-generating elements such as a CPU 25a and a DC-DC converter 25b are mounted, and a single fan 30. In other words, the thermal module 24 of the electronic device 10 can have a single-fan structure. In this case, the fan 30 may have a first discharge port 42 that opens facing the heat sink 29, a second discharge port 43 that opens facing the gap 48, and an inclined wall 50. The inclined wall 50 is provided on a part of the side surface 40b2 and forms one edge of the second discharge port 43. The inclined wall 50 is an air outlet for circulating the air discharged from the second discharge port 43 toward the gap 48. Thus, the fan 30 has two discharge ports 42 and 43. Here, the second discharge port 43 of the fan 30 has an inclined wall 50, which allows air to flow efficiently into the gap 48 between the substrate 25 and the keyboard device 18. Therefore, the fan 30 can minimize the reduction in airflow at the first discharge port 42, even while having a second discharge port 43.

[0050] Another embodiment of this electronic device 10 includes a substrate 25 on which multiple heat-generating elements such as a CPU 25a and a DC-DC converter 25b are mounted, and a single fan 30. In other words, the thermal module 24 of the electronic device 10 can have a single-fan structure. In this case, the fan 30 may have a first discharge port 42 that opens facing the heat sink 29, and a second discharge port 43 that opens facing the gap 48. The upper end 43a of the second discharge port 43 may be below the bottom surface 18d of the keyboard device 18 and the lower end 43b may be above the second surface 25B when the height direction along the thickness direction (Z direction) of the housing 12 is taken as a reference. Thus, the fan 30 has two discharge ports 42, 43. Here, the lower end 43b of the second discharge port 43 of the fan 30 is above the second surface 25B of the substrate 25, which allows air to flow efficiently into the gap 48 between the substrate 25 and the keyboard device 18. Furthermore, the outflow of air from the second discharge port 43 to the second surface 25B can be effectively suppressed. As a result, the fan 30 can minimize the reduction in airflow at the first discharge port 42, even while having the second discharge port 43.

[0051] Therefore, according to the electronic device 10 in each of the above embodiments, the cooling efficiency of the heat sink 29 can be ensured, thereby ensuring the overall performance of the system. Moreover, the electronic device 10 can suppress the rise in surface temperature of the keyboard device 18 by the air circulating in the gap 48.

[0052] The fan 30 may have a configuration without an inclined wall 50. Even in this case, the lower end 43b is above the second surface 25B, allowing air to flow efficiently into the gap 48 between the substrate 25 and the keyboard device 18. If the fan 30 has an inclined wall 50, the lower end 43b may be below the second surface 25B. Even in this case, the second discharge port 43 can smoothly direct air into the gap 48 along the inclined wall 50, and the outflow of air from the second discharge port 43 to the second surface 25B side can be suppressed. Of course, it is even more preferable for the fan 30 to have an inclined wall 50, with its end, the lower end 43b, positioned above the second surface 25B. This allows for even smoother airflow into the gap 48 and effectively suppresses air outflow to the second surface 25B side.

[0053] It should be noted that the present invention is not limited to the embodiments described above, and can be freely modified without departing from the spirit of the invention. [Explanation of symbols]

[0054] 10 Electronic equipment 11 Lid 12 cabinets 18 Keyboard device 24 Thermal Modules 25 circuit boards 25A 1st page 25B 2nd side 25a CPU 25b DC-DC converter 25c memory 28 Heat Pipes 29 Heatsink 30 Fans 36 Fan Casing 40b1,40b2 Side 42 1st discharge port 43 2nd outlet 43a top end 43b Bottom end 46, 47, 49 Openings 48 gaps 50 Slanted wall 52 Airflow channels 52a, 54 Airtight material

Claims

1. It is an electronic device, The casing and A keyboard device is provided so as to face the surface of the aforementioned housing, Multiple heat-generating elements, including the CPU, are mounted, and a circuit board facing the bottom surface of the keyboard device is located within the enclosure. A fan with a first discharge port on its first side, A heat sink positioned facing the first discharge port, A heat transport member connecting at least the CPU among the plurality of heat-generating elements and the heat sink, Equipped with, The aforementioned fan said, The first discharge port and, A second discharge port is provided on the second side surface intersecting the first side surface, and opens facing the gap formed between the bottom surface of the keyboard device and the first surface of the substrate facing the bottom surface, An inclined wall is provided on a part of the second side surface, forming one edge of the second discharge port, and allowing the air discharged from the second discharge port to flow toward the gap, It has, At least the CPU among the plurality of heating elements is mounted on the second surface of the substrate. The height of the second discharge port is less than or equal to half the height of the second side surface. An electronic device characterized by the following features.

2. The electronic device according to claim 1, The fan is positioned such that its second side faces the end face of the substrate. When the height direction is taken along the thickness direction of the housing as a reference, the upper end of the second discharge port is below the bottom surface of the keyboard device, and the lower end is above the second surface of the circuit board opposite to the first surface. An electronic device characterized by the following features.

3. The electronic device according to claim 2, The lower end of the second discharge port is the end of the inclined wall. An electronic device characterized by the following features.

4. It is an electronic device, The casing and A keyboard device is provided so as to face the surface of the aforementioned housing, Multiple heat-generating elements, including the CPU, are mounted, and a circuit board facing the bottom surface of the keyboard device is located within the enclosure. A fan with a first discharge port on its first side, A heat sink positioned facing the first discharge port, A heat transport member connecting at least the CPU among the plurality of heat-generating elements and the heat sink, Equipped with, The aforementioned fan said, The first discharge port and, A second discharge port is provided on the second side surface intersecting the first side surface, and opens facing the gap between the bottom surface of the keyboard device and the first surface of the substrate facing the bottom surface, It has, The second discharge port, when viewed with reference to the height direction along the thickness direction of the housing, has its upper end below the bottom surface of the keyboard device and its lower end above the second surface of the circuit board opposite to the first surface. At least the CPU among the plurality of heating elements is mounted on the second surface of the substrate. The height of the second discharge port is less than or equal to half the height of the second side surface. An electronic device characterized by the following features.

5. The electronic device according to claim 4, The fan is provided on a part of the second side surface and forms one edge of the second discharge port, and has an inclined wall for allowing the air discharged from the second discharge port to flow toward the gap. An electronic device characterized by the following features.

6. The electronic device according to claim 1 or 5, The inclined wall is gradually sloped from bottom to top in the direction from the fan toward the end face of the substrate. An electronic device characterized by the following features.

7. The electronic device according to claim 1 or 4, The outer wall of the housing is provided with a first opening facing the heat sink and a second opening facing the gap. Furthermore, the keyboard device is provided with an airtight material that is positioned to stand upright between the bottom surface of the keyboard device and the first surface of the circuit board, and which forms an air passage in a part of the gap from the second discharge port toward the second opening. An electronic device characterized by the following features.

Images