Energy storage converters, energy storage systems, and power-consuming equipment

Abstract

The present invention relates to the field of energy storage and provides an energy storage converter, an energy storage system, and power-consuming equipment. [Solution] The energy storage converter includes a first structural part and a second structural part adjacent to each other in a predetermined direction. The first structural part includes a first circuit board, a heat dissipation module, and a second circuit board distributed sequentially from bottom to top. The second structural part includes an inductor module and a third circuit board distributed sequentially from bottom to top. The predetermined direction is perpendicular to the thickness direction of the first circuit board. Current in the energy storage converter flows sequentially through the first circuit board, the second circuit board, the third circuit board, and the inductor module. The present invention modifies the layout of each circuit board in the energy storage converter so that current flows sequentially from bottom to top through the first and second circuit boards on the right, and then from top to bottom through the third circuit board and inductor on the left, thereby minimizing the current path, reducing the circuit and power consumption, and minimizing electromagnetic interference.

Description

Technical Field

[0001] The present invention relates to the field of energy storage, and particularly to an energy storage converter, an energy storage system, and an electric power utilization device.

Background Art

[0002] An energy storage converter (abbreviated as PCS, Power Conversion System) is also called an energy storage inverter and is one of the core devices in an energy storage system. The energy storage converter includes components such as power conversion components (e.g., IGBTs), control components, protection components, a communication module, and a heat dissipation system (e.g., including a heat sink, a fan, or a liquid cooling plate).

[0003] In a conventional energy storage converter, the current flow path is long, the current flow direction becomes complicated, and the longer the current flow path is, the greater the electrical resistance encountered is. As a result, more energy dissipates in the form of heat during the current transmission process, increasing the power consumption of the converter and reducing its efficiency. In addition, a long current path may increase electromagnetic interference, especially under high-frequency operating conditions. EMI can cause a decrease in signal quality and may affect the normal operation of the control circuit, and in severe cases, may cause system failures.

Summary of the Invention

Problems to be Solved by the Invention

[0004] Embodiments of the present invention provide an energy storage converter, an energy storage system, and an electric power utilization device to solve at least the problems of large electrical resistance, high power consumption, and high electromagnetic interference caused by the long and complex current path in a conventional energy storage converter.

Means for Solving the Problems

[0005] According to some embodiments of the present invention, one aspect of the embodiment of the present invention provides an energy storage converter, the energy storage converter comprising a first structural part and a second structural part adjacent in a predetermined direction, the first structural part comprising a first circuit board, a heat dissipation module and a second circuit board distributed in order from bottom to top, the first circuit board comprising a power control module for an inverter circuit and a power conversion module for the inverter circuit, the second circuit board comprising a DC voltage adjustment module, the second structural part comprising an inductor module and a third circuit board distributed in order from bottom to top, the third circuit board comprising a sampling module, the predetermined direction being perpendicular to the thickness direction of the first circuit board, and the current in the energy storage converter flows sequentially through the first circuit board, the second circuit board, the third circuit board and the inductor module.

[0006] In some embodiments, the first structural component further includes an airflow generator, the airflow generator located on at least one side of the heat dissipation module, the side being a surface excluding the first and second surfaces of the heat dissipation module, the first surface being the surface facing the first circuit board, and the second surface being the surface facing the second circuit board.

[0007] In some embodiments, the airflow generator includes a first airflow generator and a second airflow generator, wherein the first airflow generator is located on a first side surface of the heat dissipation module, the first side surface being the side of the heat dissipation module adjacent to the inductor module, the second airflow generator is located on a second side surface of the heat dissipation module, the first side surface and the second side surface are opposite to each other, the airflow direction of the airflow generated by the first airflow generator and the airflow direction of the airflow generated by the second airflow generator are both a first airflow direction, and the first airflow direction is in the direction from the heat dissipation module toward the inductor module.

[0008] In some embodiments, the energy storage converter further includes a housing, the first and second structural components are located within the housing, and the airflow generator is movably mounted to the housing via a slide rail mechanism.

[0009] In some embodiments, the slide rail mechanism includes at least one pair of mutually engaging first and second slide rails, the first slide rail being fixed to the inner wall of the housing, and the second slide rail being fixed to the airflow generator, the airflow generator performing a push-pull motion along a preset trajectory through the guiding action of the first and second slide rails.

[0010] In some embodiments, the energy storage converter further includes a bracket and a baffle plate, the bracket being attached to the housing via a first connector, the bracket being located on the first side of the airflow generator, and the baffle plate being attached to the second side of the airflow generator, the first side and the second side being opposite each other.

[0011] In some embodiments, the heat dissipation module includes a plurality of arranged heat sinks, the airflow generator is fixed to the substrate of the first target heat sink and the substrate of the second target heat sink via a second connector, the first target heat sink being a row of heat sinks closest to the inductor module, and the second target heat sink being a row of heat sinks furthest from the inductor module.

[0012] In some embodiments, the heat sink includes at least one thermally conductive connecting member, and the fins of the heat sink are connected by the thermally conductive connecting member.

[0013] In some embodiments, the thermal conductivity of the thermally conductive connecting member is 395 to 400.

[0014] In some embodiments, the first circuit board has a plurality of heating elements on a surface adjacent to the heat dissipation module, the heating elements are electrically connected to the first circuit board via a plurality of pins, the plurality of pins are arranged along a straight line on a target surface of the heating elements, the target surface is a surface perpendicular to the first circuit board, and the straight line connecting the plurality of pins on the target surface is parallel to the first circuit board.

[0015] In some embodiments, one of the heat sinks and at least one of the heating elements are connected via a third connector.

[0016] In some embodiments, the orthographic projections of the first circuit board, the heat dissipation module, and the inductor module on the plane of the second structure spaced apart from the first structure overlap at least partially, and the orthographic projections of the second circuit board and the third circuit board on the plane of the second structure spaced apart from the first structure overlap at least partially.

[0017] According to some embodiments of the present invention, another aspect of the embodiments of the present invention provides an energy storage system comprising any one of the described energy storage converters.

[0018] According to some embodiments of the present invention, yet another aspect of the embodiments of the present invention provides a power-using device that includes any one of the described energy storage converters. [Effects of the Invention]

[0019] The technical solution provided in the embodiments of the present invention has at least the following advantages. By changing the layout of each circuit board in the energy storage converter, the current can be made to flow sequentially from bottom to top through the first circuit board on the right and the second circuit board, and then from top to bottom through the third circuit board on the left and the inductor, thereby shortening the current path, reducing the circuit and power consumption, and minimizing electromagnetic interference. This solves the problems of conventional energy storage converters, which have long and complex current paths, high electrical resistance, high power consumption, and high electromagnetic interference.

[0020] One or more embodiments are illustrated by the corresponding drawings, and these illustrative descriptions do not constitute limitations on the embodiments. Unless otherwise specified, the drawings do not constitute proportional limitations. To more clearly illustrate embodiments of the present invention or technical concepts in the prior art, the drawings necessary for the embodiments are briefly introduced below. Clearly, the drawings described below are only some embodiments of the present invention, and those skilled in the art can obtain further drawings based on these drawings without any creative work. [Brief explanation of the drawing]

[0021] [Figure 1] This is a schematic diagram of the structure of a conventional energy storage converter. [Figure 2] This is a schematic diagram of the structure of an energy storage converter according to an embodiment of the present invention. [Figure 3] This is a schematic diagram of the actual structure of an energy storage converter according to an embodiment of the present invention. [Figure 4] This is a schematic diagram of the structure of the slide rail mechanism and airflow generator in an energy storage converter according to an embodiment of the present invention. [Figure 5] This is a schematic diagram of the structure of a baffle plate in an energy storage converter according to an embodiment of the present invention. [Figure 6] This is a schematic diagram of a partial structure of an energy storage converter according to an embodiment of the present invention. [Figure 7]It is a schematic diagram of the positional relationship between the partition plate and the heat dissipation module in the energy storage converter according to an embodiment of the present invention. [Figure 8] It is a schematic diagram of the structure of the heat sink according to an embodiment of the present invention. [Figure 9] It is a schematic diagram of the structure of the first circuit board according to an embodiment of the present invention. [Figure 10] It is a schematic diagram of the connection structure between the heat sink and the heat generating element according to an embodiment of the present invention. [Figure 11] It is a schematic diagram of the positional relationship between the heat sink and the heat generating element according to an embodiment of the present invention. [Figure 12] It is a schematic diagram of the positional relationship of each component in the energy storage converter according to an embodiment of the present invention. [Figure 13] It is a schematic diagram of the positional relationship of each component in another energy storage converter according to an embodiment of the present invention.

MODE FOR CARRYING OUT THE INVENTION

[0022] In the description of the embodiments of the present invention, technical terms such as "first" and "second" are used only to distinguish different objects, and it cannot be understood that they indicate or imply relative importance, or clarify or imply the quantity, specific order or main relationship of the indicated technical features. In the description of the embodiments of the present invention, the meaning of "plural" is two or more, unless there is no particularly clear and specific limitation.

[0023] Referring to "embodiment" in this specification means that the specific features, structures or characteristics described by referring to the embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase at each position in the specification does not necessarily mean the same embodiment, nor is it an independent or candidate embodiment that is mutually exclusive with other embodiments. Those skilled in the art can combine the embodiments described in this specification with other embodiments as explicitly and implicitly understood.

[0024] In describing embodiments of the present invention, the term "and / or" merely describes the relationship between related objects, indicating that three types of relationships may exist. For example, A and / or B can indicate three situations: A exists, A and B exist simultaneously, or B exists. Furthermore, the symbol " / " in this specification generally indicates that the preceding and succeeding related objects are in an "or" relationship.

[0025] In the description of embodiments of the present invention, the term "multiple" refers to two or more (including two), similarly, "multiple sets" refers to two or more sets (including two sets), and "multiple sheets" refers to two or more sheets (including two sheets).

[0026] In the description of embodiments of the present invention, the directions or positional relationships indicated by technical terms such as "center," "vertical direction," "horizontal direction," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "perpendicular," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial direction," "radial direction," and "circumferential direction" are the directions or positional relationships shown in the drawings. These terms are used solely to facilitate and simplify the description of embodiments of the present invention, and do not indicate or imply that the referred device or element must have a specific direction, a specific directional structure, or operation. Therefore, they cannot be understood as limitations on embodiments of the present invention.

[0027] In describing embodiments of the present invention, unless otherwise explicitly stated or limited, technical terms such as "attachment," "connection," "bonding," and "fixing" should be understood in a broad sense. For example, these may be fixed connections, detachable connections, integral connections, mechanical connections, electrical connections, direct connections, indirect connections via an intermediate medium, internal communication between two elements, or interaction relationships between two elements. Those skilled in the art will be able to understand the specific meaning of these terms in embodiments of the present invention based on the specific circumstances.

[0028] In the drawings corresponding to embodiments of the present invention, the thickness and area of ​​the layers are enlarged for better understanding and easier explanation. When one component (e.g., a layer, film, region, or base) is described as being on the other component or on the surface of the other component, the component may be located "directly" on the surface of the other component, or a third component may exist between the two components. Conversely, when one component is described as being on the surface of the other component, or when one component is described as being formed on or provided on the surface of one component, it means that there is no third component between these two components. Also, when one component is described as being "approximately" formed on the other component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on the edge of a portion of the entire surface.

[0029] In describing embodiments of the present invention, when one component "includes" another component, unless otherwise specified, this does not exclude other components, and other components may be included. Also, when a component such as a layer, film, region, or plate is said to be "located" in relation to another component, it may be "directly located" in relation to the other component (i.e., located on the surface of the other component with no other components between them), or other components may be present between them. Furthermore, when a component such as a layer, film, region, or plate is "directly located" in relation to another component, or when a component such as a layer, film, region, or plate is located on the surface of the other component, it means that no other components are located between them.

[0030] The terms used in the description of the various embodiments herein are used solely to describe specific embodiments and are not intended to limit them. As used in the description of the various embodiments described and in the appended claims, “the component” is also intended to include plural forms unless otherwise clearly indicated in the context. Here, the component includes components such as layers, films, regions, or plates.

[0031] As shown in Figure 1, and as can be seen from the background technology, in conventional energy storage converters, the power circuit board (i.e., the first circuit board 11) is mounted in a higher position, meaning that the inductor module and sampling module may be mounted below the power circuit board. The direction of current flow in the energy storage converter is, in order, through the power circuit board, DC connection board, sampling capacitor, and inductor. Based on the limitations of the functional structure of the energy storage converter, the DC connection board must be mounted above the power circuit board, and if the sampling capacitor and inductor are mounted below the power circuit board, the direction of current flow is from the intermediate power circuit board to the upper DC connection board first, and then downwards through the capacitor and inductor. Thus, the current path is long and complex. The following important problems arise from designing such a long path.

[0032] 1. Increased energy loss: Because many connectors, wires, and circuit boards are present in the current path, each of these elements constitutes additional electrical resistance. According to Ohm's law (V=IR), when current flows through these electrical resistances, heat is generated, and energy is dissipated in the form of heat. This increases the total power consumption of the converter and reduces its conversion efficiency.

[0033] 2. Electromagnetic Interference (EMI): Long current paths are prone to electromagnetic interference under high-frequency operating conditions. This is because high-frequency currents generate varying electromagnetic fields around conductors, and these electromagnetic fields can degrade signal quality by interacting with the signal lines of the control circuit. In extreme cases, EMI can disrupt the normal operation of the control circuit, potentially leading to system failure and affecting the stability and reliability of the entire energy storage system.

[0034] To address the problems of high electrical resistance, high power consumption, and high electromagnetic interference resulting from the long and complex current paths in conventional energy storage converters, the present invention provides an energy storage converter, an energy storage system, and power-consuming equipment.

[0035] The embodiments of the present invention will be described in detail below with reference to the drawings. However, it will be apparent to those skilled in the art that many technical details are described in each embodiment of the present invention in order to better understand the present invention. However, the technical proposal for which the present invention claims protection can also be realized without these technical details and the various changes and modifications based on the embodiments below.

[0036] This embodiment provides an energy storage converter. Figure 2 is a schematic diagram of the structure of an energy storage converter according to an embodiment of the present invention. As shown in Figure 2, the energy storage converter includes a first structural part 10 and a second structural part 20 adjacent to each other in a predetermined direction. The first structural part 10 includes a first circuit board 11, a heat dissipation module 12, and a second circuit board 13 distributed from bottom to top. The first circuit board 11 includes a power control module for the inverter circuit and a power conversion module for the inverter circuit. The second circuit board 13 includes a DC voltage adjustment module. The second structural part 20 includes an inductor module 21 and a third circuit board 22 distributed from bottom to top. The third circuit board 22 includes a sampling module. The predetermined direction is perpendicular to the thickness direction of the first circuit board 11. Current in the energy storage converter flows sequentially through the first circuit board 11, the second circuit board 13, the third circuit board 22, and the inductor module 21.

[0037] The first circuit board is a power circuit board, the second circuit board is a DC connection board, and the third circuit board is a capacitor board. The predetermined direction is the length direction of the horizontal energy storage converter. In the energy storage converter, the power circuit board, DC connection board, heat dissipation module, sampling capacitor, and inductor cooperate with each other to ensure the efficiency, stability, and safety of energy conversion in the energy storage system.

[0038] The power circuit board is the core component of the energy storage converter (PCS), and includes power electronics devices such as IGBTs (isolated-gate bipolar transistors) and MOSFETs (metal oxide semiconductor field-effect transistors), as well as associated control and protection circuits. These electronic devices are responsible for converting electrical energy, i.e., converting electrical energy from one form to another in DC-AC (direct current to alternating current) or AC-DC (alternating current to direct current) modes. The power circuit board houses the power control module and power conversion module of the inverter circuit. The power control module is responsible for regulating the power output of the converter, ensuring that it can respond to changes in load demand, while the power conversion module converts DC electricity to AC electricity, or vice versa.

[0039] The main function of a power circuit board is power conversion. It can quickly and efficiently convert electrical energy formats according to the demands of the energy storage system. At the same time, the control circuit ensures the accuracy and stability of the conversion process, and the protection circuit protects the device from damage in abnormal situations such as overload and short circuits, thus guaranteeing the safety of the system.

[0040] The heat dissipation module is located above the first circuit board, in direct contact with the circuit board, and is used to absorb and dissipate the heat generated when the first circuit board is operating.

[0041] A DC junction board, also known as a DC busbar, is an intermediate link connecting the DC input source of a PCS to the power circuit board. It is typically made of a highly conductive material, such as copper, to efficiently transmit DC current. The DC junction board includes a DC voltage regulating module. The role of this module is to regulate the DC voltage output from the power circuit board, ensuring it meets the requirements of subsequent circuits or loads. A rational layout of the DC junction board contributes to reducing energy consumption during the voltage regulating process. The DC junction board's role is to transmit electrical energy from an energy storage battery or other DC power source to the power circuit board with little or no loss, providing a stable DC power input for subsequent power conversion. It also functions as a junction point for multi-channel DC power supplies, facilitating system expansion and maintenance.

[0042] A sampling capacitor is an electronic element typically used in the signal sampling circuit of an energy storage converter to store electric charge. It can temporarily store and then release charge in the circuit, playing a role in voltage smoothing, filtering, and energy storage. In a PCS (Power Conditioning System), sampling capacitors are used in voltage and current sampling circuits to accurately measure and monitor parameters such as the input and output voltages and currents of the inverter.

[0043] An inductor is a passive electronic element capable of storing magnetic field energy and is typically used for filtering, energy storage, and impedance matching. In energy storage converters, inductors often appear in the form of filtering inductors and are used to smooth the current, reduce high-frequency components in the current, and improve the quality of electrical energy. The main functions of an inductor in a PCS are filtering and energy storage. During the conversion process, the inductor can smooth the pulsed current generated by the power circuit board, reduce harmonics in the output current, and improve the purity of electrical energy. Inductors can also store some energy, providing or absorbing energy when instantaneous power demand changes, contributing to the stabilization of the system's operating state.

[0044] As shown in Figure 2, the current in the energy storage converter first flows through the power control and conversion module of the first circuit board 11, is then cooled by the heat dissipation module 12, then reaches the DC voltage regulation module of the second circuit board 13, then flows to the sampling module of the third circuit board 22, and finally undergoes filtering and energy storage processing by the inductor module 21. Compared to conventional designs, this embodiment reduces the length of the current transmission path by optimizing the layout of the circuit boards, thereby reducing energy loss during the current transmission process and improving the conversion efficiency of the PCS. The heat dissipation module 12 is mounted directly above the heat-generating first circuit board 11, allowing for more rapid and effective heat absorption. At the same time, the optimization of the overall layout enhances the heat dissipation effect of the heat dissipation module 12, contributing to an extended service life of the equipment. By rationally planning the relative positions of the circuit boards, the length of signal lines in the current path is reduced, thereby reducing the generation of EMI under high-frequency operating conditions, ensuring the stability of the control circuit and signal quality, and improving the reliability of the entire system. The use of a vertical layout reduces the overall dimensions of the casing by saving horizontal space, improving energy density and lowering material and manufacturing costs. This reduction in dimensions is particularly significant in terms of cost savings, considering that the casing material is aluminum-laminated zinc sheet.

[0045] The above embodiment modifies the layout of each circuit board in the energy storage converter so that current flows sequentially from bottom to top through the first and second circuit boards on the right, and then from top to bottom through the third circuit board and inductor on the left. This minimizes the current path, reduces circuit complexity and power consumption, and minimizes electromagnetic interference. This solves the problems of conventional energy storage converters, which have long and complex current paths, high electrical resistance, high power consumption, and high electromagnetic interference.

[0046] In some embodiments, as shown in Figure 3, the first structural part further includes an airflow generator 14, the airflow generator 14 located on at least one side of the heat dissipation module 12, the side being a surface excluding the first and second surfaces of the heat dissipation module 12, the first surface being the surface facing the first circuit board 11, and the second surface being the surface facing the second circuit board 13.

[0047] Here, the airflow generator may be a fan. Since the heat dissipation module is located between the first circuit board and the second circuit board, if the fan is mounted above or below it, it will be blocked by the first and second circuit boards. As a result, the airflow blown out from the airflow generator will be directly blocked by the circuit boards and will not be able to conduct to the heat dissipation module, thus preventing the heat dissipation module from effectively dissipating heat.

[0048] By mounting the airflow generator on the side, the heat dissipation module can be cooled more effectively and precisely. Concentrating airflow in the heat dissipation passage significantly improves the heat exchange rate, ensuring that power electronics devices, such as IGBTs, remain at their optimal operating temperature and reducing the risk of thermal failure. Such a layout reduces the direct thermal impact of the airflow generator on the first and second circuit boards, particularly on temperature and electromagnetically sensitive circuit components such as the voltage regulation module and sampling circuit, and also contributes to reducing EMI. This is advantageous for maintaining circuit stability, reducing signal distortion, and improving conversion efficiency. Placing the airflow generator on the side rather than the top or bottom allows for better utilization of vertical space, reducing the overall casing dimensions, improving energy density, and providing greater flexibility in the placement of other assemblies, such as inductors and sampling capacitors. By positioning the airflow generator on the side of the heat dissipation module, heat management is significantly enhanced, adverse effects on the circuit board are reduced, the spatial layout of the equipment and the convenience of maintenance are optimized, and ultimately the conversion efficiency, reliability, and cost benefits of the energy storage converter are improved.

[0049] Depending on the performance and design of the energy storage converter itself, the airflow generator may be mounted on at least one side of the heat dissipation module, i.e., it may be mounted on only one side of the heat dissipation module, on any of the four sides, or on only two sides. The number of airflow generators mounted on one side can also be adaptively selected, i.e., one or more may be mounted, but it must be subject to the dimensional limitations of the energy storage converter. For example, the sum of the lengths of all fans mounted on one side cannot exceed the side length of the heat dissipation module on that side.

[0050] Preferably, as shown in Figure 3, the airflow generator 14 includes a first airflow generator 141 and a second airflow generator 142, wherein the first airflow generator 141 is located on the first side surface of the heat dissipation module 12, the first side surface being the side of the heat dissipation module 12 that is close to the inductor module 21, the second airflow generator 142 is located on the second side surface of the heat dissipation module 12, the first side surface and the second side surface are opposite each other, the wind direction of the airflow generated by the first airflow generator 141 and the wind direction of the airflow generated by the second airflow generator 142 are both the first wind direction, and the first wind direction is the direction from the heat dissipation module 12 toward the inductor module 21.

[0051] Here, both the first and second airflow generators may be fans. In an energy storage converter (PCS), the inductor also needs to dissipate heat, as it generates heat during operation. The role of the inductor is to store energy in the circuit, smooth the current, and filter electromagnetic interference (EMI) during the electrical energy conversion process. However, achieving these functions involves energy loss, primarily in the form of heat loss.

[0052] In designing energy storage converters, it is necessary to minimize device redundancy as much as possible in order to achieve miniaturization, reduce the volume of the energy storage converter, and save occupied space. Therefore, a device layout is designed that can dissipate heat from both high-power devices such as power circuit boards and inductors. Based on this design, by placing the first airflow generator between the heat dissipation module and the inductor module, and placing the second airflow generator on the side of the heat dissipation module facing the first airflow generator, both heat dissipation from the heat dissipation module and the heat dissipation from the inductor module can be satisfied.

[0053] The first airflow generator 141 and the second airflow generator 142 are arranged symmetrically or asymmetrically, with the aim of guiding the heat released from the heat dissipation module 12 to the vicinity of the inductor module 21. Such an arrangement not only enhances the cooling effect of the heat dissipation module 12, but bidirectional airflow is also advantageous for heat dissipation of the inductor module 21, as the inductor module 21 generates considerable heat even during high-frequency operation. During the design phase, establishing internal ducts ensures that the airflow flows along a set path, avoiding blind spots or turbulent airflow and improving the overall thermal management performance of the equipment. Considering noise issues during the operation of the airflow generators, sound insulation materials can be added to the design or low-noise fans can be used to reduce the acoustic impact of the equipment during operation.

[0054] The bidirectional airflow design significantly improves the heat dissipation effect of the heat dissipation module 12 while simultaneously meeting the cooling requirements of the inductor module 21. The oriented airflow ensures that heat can quickly transfer from critical heat-generating areas (primarily the power circuit board where IGBTs are located) to the outside of the equipment, avoiding localized overheating and improving the reliability and safety of the equipment. By providing airflow generators on both sides of the heat dissipation module 12, a smoother airflow path is created, reducing air resistance. This means that even at the same fan speed, cooling efficiency is improved, resulting in better heat dissipation without increasing energy consumption. Such a design allows for a more compact spatial plan, integrating the airflow generators with the heat dissipation module and inductor module without occupying extra volume. This contributes to improved energy density of the equipment, enabling the same capacity PCS to be realized in a smaller volume, contributing to miniaturization and flexible on-site placement. By optimizing the layout of the airflow generator, the electromagnetic influence on sensitive elements on the circuit board, particularly on the sampling module and control circuit of the first circuit board 11 and the second circuit board 13, is reduced, contributing to the maintenance of system signal integrity.

[0055] Furthermore, the heat dissipation module may be a heat sink, and the first airflow generator and the second airflow generator are attached to the base of the heat sink by a screw connection structure.

[0056] In some embodiments, as shown in Figure 4, the energy storage converter further includes a housing 01, the first structural part and the second structural part are located inside the housing 01, and the airflow generator 14 is movably mounted to the housing 01 via a slide rail mechanism 30.

[0057] In the design of the energy storage converter, not only are the first structural part (mainly including the power circuit board and heat dissipation module) and the second structural part (e.g., the inductor module) housed within the housing 01, but a slide rail mechanism 30 is also newly adopted, which enables the movable mounting of the airflow generator 14 (usually a fan or blower). Specifically, the airflow generator 14 is attached to the housing 01 via the slide rail mechanism 30 and can be easily pulled out and pushed in without removing the housing 01, making maintenance and cleaning very convenient.

[0058] The slide rail mechanism 30 may be a sliding guide rail, ensuring that the airflow generator 14 can move stably and without resistance inside the housing 01. The slide rail may be straight or curved to conform to the shape of the housing, to accommodate different housing designs. The airflow generator 14 is designed to be removable and can be easily pulled out or pushed back in by the slide rail mechanism 30, which not only facilitates cleaning of dust accumulations on the fan blades or heat sink fins but also facilitates the replacement of a damaged airflow generator without the need to disassemble the entire housing. A dedicated maintenance passage is provided inside the housing 01 to ensure that the airflow generator 14 does not interfere with other assemblies when sliding and also makes it convenient for maintenance staff to perform maintenance operations.

[0059] The slide-rail mounted airflow generator 14 significantly simplifies the maintenance process. Maintenance staff can directly pull out the airflow generator for cleaning or inspection without having to remove the entire enclosure, reducing the difficulty and time cost of maintenance and improving the maintainability and service life of the equipment. The movable airflow generator allows for more flexible adjustment of the heat dissipation policy. For example, when the PCS is under high load operation, the fan can be pushed closer to the heat dissipation module to enhance the heat dissipation effect, and when the equipment is under low load or in standby mode, the fan can be appropriately detached to reduce wasted energy consumption. The movable design of the slide-rail mechanism 30 makes the installation and maintenance of the airflow generator 14 safer and more efficient, reducing equipment failure due to improper maintenance or insufficient heat dissipation, and improving the overall safety and reliability of the system. The slide-rail movable airflow generator design not only improves the maintenance convenience and heat dissipation efficiency of the energy storage converter, but also optimizes the spatial layout and enhances the equipment's EMI management capabilities, thereby improving the overall safety, reliability, and economics of the PCS.

[0060] In some embodiments, the slide rail mechanism includes at least one pair of mutually engaging first and second slide rails (not shown), the first slide rail being fixed to the inner wall of the housing, and the second slide rail being fixed to the airflow generating device, the airflow generating device performing a push-pull motion along a preset trajectory through the guiding action of the first and second slide rails.

[0061] In some specific embodiments of energy storage converters, the slide rail mechanism is designed as at least one pair of mutually engaging first and second slide rails. The first slide rail is fixed to the inner wall of the housing, and the second slide rail is attached to the airflow generator, ensuring that the airflow generator performs stable and smooth pushing and pulling motion along a predetermined trajectory within the housing. Such a design not only provides ease of maintenance but also optimizes the positioning and operating efficiency of the airflow generator.

[0062] The first and second slide rails may be manufactured from metal materials such as aluminum or steel to ensure sufficient strength and durability. The surfaces of the slide rails should be treated with special processes such as plating or lubrication to reduce friction and ensure smooth sliding. The pre-set trajectories should take into account the layout of the heat dissipation module and inductor module, ensuring that the airflow generator can most effectively cover the main heat-generating areas during push-pull motion, while avoiding collision or interference with other internal assemblies. The first slide rail is fixed to the inner wall of the housing by screws or welding, and the second slide rail is attached to the frame of the airflow generator by appropriate fastening members (e.g., clamps or screws) to ensure structural stability and operational safety.

[0063] The double-rail sliding design allows the airflow generator to perform push-pull motion within the housing, eliminating the need to remove the housing or the airflow generator. This significantly simplifies the cleaning and inspection process, reducing maintenance costs and time. Furthermore, the retractable design of the airflow generator facilitates regular cleaning and replacement, reducing the effects of dust accumulation and equipment aging, extending the overall service life of the energy storage converter, and lowering maintenance costs. The sliding rail mechanism allows the airflow generator to be moved to the edge of the housing when not in use, freeing up space for other equipment or assemblies. This flexibility contributes to optimizing the internal layout of the housing and improving energy density.

[0064] In some embodiments, as shown in Figure 5, the energy storage converter further includes a bracket (not shown) and a baffle plate 40, the bracket being attached to the housing 01 via a first connector, the bracket being located on the first side of the airflow generator, and the baffle plate 40 being attached to the second side of the airflow generator, with the first side and the second side being opposite each other.

[0065] In some embodiments, the energy storage converter not only includes a slide rail mechanism to enable movable mounting of the airflow generator, but also further designs brackets and baffle plates 40 to further optimize the positioning and airflow management of the airflow generator. Specifically, the brackets are attached to the housing 01 via first connectors and are located on the first side of the airflow generator, and are used to provide support and positioning functions. The baffle plates 40 are attached to the second side (opposite the first side) of the airflow generator and are intended to guide the airflow to prevent its irregular diffusion and ensure that the airflow can be effectively focused on critical areas requiring cooling.

[0066] The bracket may be L-shaped or U-shaped and is fixed to the inner wall of the housing 01 by a first connector (e.g., a locking groove, screw fastening, or magnetic adsorption). The first bracket can provide physical support, ensuring stability when the airflow generator slides, and can also act as a moving stopper, ensuring that the device does not exceed a preset trajectory.

[0067] The baffle plate 40 is located on the second side of the airflow generator and may be a flat baffle plate or a complex structure with flow guide grooves, and is used to guide the airflow in a specific direction, for example, to a heat dissipation module or an inductor module. The size and shape of the opening of the baffle plate 40 can be optimized according to the actual thermal management requirements.

[0068] By referring to the layout of the bracket and baffle plate 40, the airflow path can be precisely planned to ensure that the airflow can cover the entire heat dissipation module while avoiding direct collision with sensitive circuit elements, thereby reducing EMI (electromagnetic interference) problems caused by the airflow. The mounting of the bracket and baffle plate 40 should be designed for easy attachment and detachment, which not only simplifies the maintenance process of the airflow generator but also facilitates adjustment of the airflow path, allowing it to adapt to the heat dissipation requirements under different operating conditions.

[0069] By adding the baffle plate 40, the direction of the airflow emitted by the airflow generator can be precisely controlled, ensuring that the airflow can be effectively focused on critical areas such as the heat dissipation module and inductor module, thereby improving cooling efficiency and reducing the risk of localized overheating. The bracket not only provides physical support for the airflow generator but also limits its range of motion, avoiding vibrations or displacements that may occur in the equipment under the action of high-speed airflow, thereby enhancing the overall stability and reliability of the system. The design of the detachable bracket and baffle plate 40 allows for quick replacement or cleaning, eliminating the need to completely disassemble the housing or the airflow generator itself, reducing maintenance time and costs, and extending the equipment's lifecycle. In addition to being used for airflow management, the bracket and baffle plate 40 may also serve other functions; for example, the bracket may be part of a wiring channel, and the baffle plate 40 may be integrated as part of an EMI shield, further optimizing the spatial layout within the housing and the multifunctionality of the equipment. Since the positions of the baffle plate 40 and the bracket can be fine-tuned according to specific needs, such a design enhances the adaptability of the energy storage converter to different operating environments and conditions, thereby enabling the equipment to maintain optimal heat dissipation in any of the different scenarios.

[0070] The design of airflow guide grooves in baffle plates is primarily used to guide and optimize airflow paths, ensuring that airflow can most effectively cover and cool critical heat-generating areas of the energy storage converter, such as IGBTs, capacitors, and other power electronics assemblies. The structural design of the airflow guide grooves not only affects airflow guidance but also has a significant impact on heat dissipation efficiency, noise levels, and the overall aerodynamic performance of the equipment.

[0071] The shape of the flow guide groove may be linear, corrugated, S-shaped, or a more complex geometric shape, and specifically depends on the layout of the target airflow area. In terms of dimensions, the width and height of the flow guide groove must be appropriate to not only guide a sufficient airflow but also to ensure that the airflow is not excessively obstructed, which would cause increased pressure loss and noise.

[0072] Setting the angle of the flow guide groove is extremely important. Generally, the angles of the inlet and outlet of the flow guide groove must be aligned with the airflow direction of the airflow generator, reducing energy loss as the airflow enters and exits the groove. Furthermore, by adjusting the angle of the flow guide groove, the direction of the airflow can be precisely controlled and directed more concentratedly to a designated heat dissipation area.

[0073] The number and layout of airflow guide grooves in the baffle plate must be optimized according to the thermal distribution characteristics of the internal assembly of the equipment. Near hotspot areas, more airflow guide grooves can be designed to achieve more efficient point-to-point cooling, while in non-hotspot areas, the number of grooves can be reduced to allow airflow to flow more naturally and reduce unwanted turbulence.

[0074] The material selection for the flow guide groove should consider resistance to airflow and durability. Typically, lightweight, high-strength alloy materials, such as aluminum alloy, are used, and combined with smoothing and anti-corrosion coatings to reduce airflow friction and extend service life.

[0075] The airflow guide grooves can direct airflow directly onto the heatsink, reducing ineffective circulation and leakage of airflow, significantly improving heat dissipation efficiency, and contributing to stable operation of the equipment under high load. The optimized airflow path reduces turbulence and airflow shock, lowering noise and vibration during equipment operation, and providing a quieter and more stable operating environment. The presence of airflow guide grooves does not affect normal equipment maintenance, and their adjustable design allows maintenance staff to better control the direction of airflow during cleaning or inspection, preventing dust from entering areas where airflow should not reach. The dynamically adjustable airflow guide groove design can adapt to changes in the operating environment, responding in real time regardless of fluctuations in thermal load or airflow direction requirements, and providing optimal cooling effects.

[0076] In some embodiments, the opening, closing, or shape of the flow guide grooves can be adjusted in real time by an electromechanical structure, thereby further optimizing the heat dissipation effect in response to different operating loads and environmental conditions.

[0077] In the design of a typical energy storage converter enclosure, the airflow guide grooves in the baffle plate are designed to be linear, with an inlet angle slightly downward and an outlet angle upward. This allows the airflow to rise vertically along the heatsink, avoiding direct collision of the airflow with the inductor module and reducing electromagnetic interference. Such a design is applicable when the IGBTs and the heatsink are on the same vertical plane.

[0078] In other embodiments, the airflow guide groove is S-shaped, and the S-shaped design of the airflow guide groove is applied when it is necessary to guide airflow in a more complex environment. For example, when airflow needs to bypass obstacles within the enclosure, such as capacitor modules or other electronic assemblies, the S-shaped airflow guide groove can ensure that the airflow bends smoothly, maintains sufficient velocity and directional stability, and effectively covers the heat dissipation area.

[0079] In other embodiments, the flow guide groove may be of an adjustable design, in which the shape or degree of opening / closing of the flow guide groove can be adjusted by external control (e.g., a motor or a pneumatic device). In high-load operation mode, the flow guide groove is automatically opened or adjusted to a state more suitable for the passage of high-speed airflow. On the other hand, in low-load or standby mode, the flow guide groove may be closed or adjusted to a more energy-saving form, reducing unnecessary airflow consumption and noise.

[0080] Within the energy storage converter, multiple high-precision temperature sensors should be placed around critical heat-generating assemblies, such as IGBTs and capacitors. These sensors may be thermocouples, thermistors, or infrared temperature sensors, and are used to monitor the temperature of these assemblies in real time. After the temperature data is collected by the sensors, it is transmitted to the main control unit via an internal bus or wirelessly. The main control unit includes a microprocessor and a memory unit, which stores and processes the temperature data and determines whether it is necessary to adjust the flow guide grooves to optimize heat dissipation. Adjustment of the flow guide grooves is typically achieved by electric actuators, which may be stepping motors or servo motors, that adjust the opening or direction of the flow guide grooves according to commands from the main control unit.

[0081] If the temperature of the IGBTs or capacitors exceeds a preset threshold, the main control unit automatically triggers an electric actuator to adjust the angle or opening of the airflow channel, directing more airflow directly onto the overheated assembly and accelerating heat dissipation. For example, if the temperature monitoring system detects that the IGBTs' temperature has risen to 80°C, the main control unit calculates the required increase in airflow using a preset algorithm. The main control unit then commands the electric actuator to adjust the opening of the airflow channel closest to the IGBTs to its maximum and to direct the direction of the airflow channel directly onto the IGBTs. As the temperature decreases, the opening and direction of the airflow channel automatically return to normal to balance heat dissipation and energy consumption.

[0082] The interior of the energy storage converter may be divided into multiple temperature monitoring regions, and the angle and opening of the flow guide grooves in each region are independently adjusted to respond to temperature changes in that region. For example, if a temperature sensor detects that the temperature in the capacitor region is higher than 75°C, the main control unit activates the flow guide groove adjustment algorithm for that region. An electric actuator adjusts the angle of the corresponding flow guide groove to match the capacitor and increases the opening of the flow guide groove to guide a large flow rate of air to directly cool the capacitor. At the same time, if the temperature in the IGBT region is low, the flow guide groove can be adjusted to a smaller opening to reduce unnecessary airflow and save energy consumption.

[0083] Alternatively, a balanced temperature distribution can be achieved by analyzing the temperature gradients in the IGBTs and capacitor regions and intelligently adjusting the direction and opening of the flow guide grooves. For example, temperature sensors continuously monitor the temperature in each region, and the main control unit analyzes the temperature distribution and identifies areas with high temperatures. The main control unit calculates the required airflow for each region and adjusts the flow guide grooves using electric actuators to guide the airflow so that it preferentially flows through the high-temperature regions. As the temperature distribution becomes uniform, the angle and opening of the flow guide grooves are adjusted to the system's preset optimized state, achieving the overall system temperature control target.

[0084] Intelligent adjustment of the air guide grooves enables rapid temperature response and balanced distribution, effectively avoiding localized overheating, reducing thermal stress on IGBTs and capacitors, and extending assembly life. Dynamically adjusting the opening of the air guide grooves reduces unwanted airflow, lowers energy consumption of fans or blowers, and improves the overall energy efficiency of the system. Intelligent control of airflow reduces unwanted air velocity and turbulence, effectively lowering noise levels during equipment operation.

[0085] In some embodiments, as shown in Figure 6, the heat dissipation module includes a plurality of arranged heat sinks 121, and the airflow generator 14 is fixed to the substrate of the first target heat sink and the substrate of the second target heat sink via a second connector 122, the first target heat sink being a row of heat sinks 121 closest to the inductor module, and the second target heat sink being a row of heat sinks 121 furthest from the inductor module.

[0086] Specifically, the heat sink may be a direct-discharge type heat sink, and the second connector may be a dedicated fixing clamp, screw fastener, or magnetic attraction device. During the design phase, it is necessary to ensure that the airflow generator can be firmly fixed to the heat sink substrate, and that the device can be easily removed for maintenance when necessary. The airflow generator is fixed to the substrates of the first and second target heat sinks. Its specific position should consider the coverage and strength of the airflow, ensuring that the entire heat dissipation module is covered by a uniform and effective airflow, while avoiding direct collision of the airflow with the inductor module, thereby reducing unwanted noise and electromagnetic interference. The heat sinks can be arranged in multiple rows to match the layout of IGBTs (Insulated Gate Bipolar Transistors) or other major heat-generating components. The design of the heat sinks in different rows (e.g., the shape, size, and density of the heat dissipation fins) should be optimized according to their relative position to the inductor module to achieve optimal thermal management and airflow guiding effects. Considering the fixed position of the airflow generator, the duct design inside the enclosure must be specially planned to ensure that the airflow flows smoothly from the first target heatsink to the second target heatsink, covering the entire heat dissipation module, while also reducing turbulence and blind spots within the enclosure, thereby improving heat dissipation efficiency.

[0087] By fixing the airflow generator to the heat sinks at both ends of the heat dissipation module, uniform distribution of airflow across the module is ensured, improving heat exchange efficiency, avoiding localized overheating, extending the equipment's lifespan, and enhancing performance stability. Optimizing the position of the airflow generator also contributes to reducing noise generated by airflow colliding with the inductor module and other sensitive components, providing a quieter environment, especially when low noise is required for equipment operation. The design of the second connector simplifies the attachment and detachment of the airflow generator, eliminating the need to disassemble the entire enclosure during maintenance, saving maintenance time and costs, and facilitating quick inspection and replacement of the equipment. This design allows for a more compact integration of the airflow generator and heat sinks, contributing to a reduction in the overall dimensions of the equipment, optimizing the spatial layout within the enclosure, and improving energy density. This enables the equipment to achieve higher power electrical energy conversion within a limited space.

[0088] Furthermore, as shown in Figure 7, in some embodiments, the heat sink is further provided with partition plates 50 on both sides. The partition plates can close or partially close the spaces on both sides of the heat sink, forming an oriented airflow passage. Such a design guides the airflow to blow more directly and concentratedly onto the heat sink, preventing unintended diffusion of the airflow within the enclosure and improving heat dissipation efficiency. When the heat sink is laid out, the partition plates on both sides and the heat sink form a single duct, ensuring that the airflow generated by the fan is directly aligned with the heat sink, reducing airflow bypass and turbulence, and enhancing the heat dissipation effect. The installation of partition plates prevents hot air released from the heat sink from re-entering the intake, thus preventing the circulation of hot air and reducing heat dissipation performance. The partition plates ensure that the airflow is unidirectional, i.e., hot air is expelled and cold air enters, contributing to effective heat exchange. The distance between the partition plate and the heatsink should be properly designed, not too tight to obstruct airflow, nor too wide to allow hot air to flow back. Typically, there is a small gap between the partition plate and the heatsink to allow airflow but prevent the backflow of hot air. The partition plate can also act as an acoustic barrier, absorbing or reflecting noise generated by the fan and reducing the overall acoustic noise level of the equipment. By attaching partition plates of a certain thickness to both sides of the heatsink and using sound-absorbing material (e.g., sound-absorbing sponge or foam) as a lining for the partition plates, noise generated during fan operation can be effectively reduced. The partition plate can also act as a physical barrier, protecting the internal electronic assembly from the effects of external factors (e.g., dust, water vapor, or foreign matter), improving the stability and lifespan of the equipment. The partition plate can be designed to have a microperforated or louvered structure, allowing airflow to pass through while effectively preventing the entry of external dust and foreign matter, protecting sensitive electronic assemblies. The presence of partition plates can enhance the overall structural stability of the enclosure, contributing to the reduction of structural deformation and vibration transmission, especially under high-vibration or complex mounting environments.By adding reinforcing ribs or using high-strength materials (e.g., metal alloys) in the design of the partition plates, the structural strength of the partition plates can be significantly improved, and the overall stability of the enclosure can be enhanced.

[0089] In some embodiments, as shown in Figure 8, the heat sink 121 includes at least one thermally conductive connecting member 123, and the fins of the heat sink 121 are connected by the thermally conductive connecting member 123.

[0090] In the design of the heat dissipation module for energy storage converters, employing thermally conductive connectors to connect the heat sink fins is intended to improve thermal conduction efficiency and structural stability, as well as optimize the heat sink layout and airflow management. Such a design ensures that heat is transferred rapidly and uniformly from the heat-generating elements to the heat sink, thereby improving overall heat dissipation performance.

[0091] The use of highly thermally conductive materials (e.g., copper or aluminum) in the manufacture of thermally conductive connectors is due to their excellent thermal conductivity. The fins of a heat sink are connected to the heat sink substrate via thermally conductive connectors, which are typically designed as thin or tubular structures with a large contact area to improve the efficiency of the heat conduction path and the structural rigidity of the heat sink.

[0092] Thermally conductive connectors not only enhance heat conduction but also strengthen the structural stability of the heatsink, reducing damage from prolonged operation or vibration. Each fin of the heatsink is connected to the substrate or other fins via a thermally conductive connector, forming a stable heat conduction network. Thermally conductive connectors can be designed to have shapes that enhance structural stability, such as reinforcing ribs or mesh structures, while ensuring sufficient heat conduction performance. The entire heatsink module is integrally formed with thermally conductive connectors, improving the structural strength of the heatsink and reducing the risk of damage from external forces (e.g., vibration).

[0093] Thermally conductive connecting members manufactured from highly thermally conductive materials significantly improve the heat transfer efficiency between the heat sink fins and the heat-generating element. This allows heat to be transferred more quickly from the heat-generating element to the heat sink and then released into the environment by airflow. The airflow guide structure in the thermally conductive connecting member effectively optimizes the airflow path, ensuring that the airflow uniformly covers the heat sink, reducing blind spots in the airflow, and improving cooling efficiency. The integrated thermally conductive connecting member not only enhances the structural stability of the heat sink but also reduces vibration and improves the thermal cycling capability of the material, thereby extending the service life of the heat sink.

[0094] In some embodiments, as shown in Figure 8, the thermal conductivity of the thermally conductive connecting member 123 is 395 to 400.

[0095] When designing thermally conductive connecting components, selecting materials with particularly high thermal conductivity (e.g., 395-400 W / (m·K)) is crucial for achieving efficient heat transfer performance. Such high thermal conductivity materials typically refer to high-purity copper or specially treated aluminum alloys, which can provide an extremely good heat transfer path between the heat source and the heat sink.

[0096] High thermal conductivity materials rapidly conduct heat from a heat source (e.g., IGBTs or capacitors) to a heat sink, shortening the thermal response time of the heat conduction path, ensuring timely heat dissipation, and avoiding localized overheating. High thermal conductivity materials promote uniform heat distribution in the connecting member, reduce thermal resistance between the heat source and the heat sink, allow each part of the heat sink to be fully utilized, and avoid a decrease in heat dissipation efficiency due to uneven heat conduction. With the same heat sink area and airflow conditions, a thermal conductivity connecting member can significantly improve overall heat dissipation efficiency. This is because heat is transferred more quickly and uniformly to the heat sink surface, and heat can be rapidly removed by the airflow. High thermal conductivity materials contribute to reducing the temperature gradient between the heat source and the heat sink. This means that a small temperature difference can be maintained between the heat source and the heat sink, reducing thermal stress caused by excessively large temperature differences and extending the service life of the assembly. High thermal conductivity materials can maintain good thermal conductivity at any different ambient temperature, which means that the stability of the heat dissipation system of the energy storage converter can also be maintained even under extreme temperature conditions, ensuring the normal operation of the equipment.

[0097] Assuming that the IGBTs inside the energy storage converter are operating under high load, a large amount of heat is generated. By connecting the IGBTs to the heat sink using a thermally conductive connector with a thermal conductivity of 395-400 W / (m·K), it can be observed that heat is rapidly conducted from the IGBTs to the heat sink, allowing the IGBT temperature to quickly stabilize within a safe range even under high-load operating conditions. The heat sink temperature becomes more uniform, avoiding the occurrence of localized hot spots and improving the overall operating efficiency of the heat sink. The thermal management system for the entire energy storage converter has a faster response speed and can better adapt to rapidly changing operating conditions such as sudden increases in load or rapid changes in ambient temperature.

[0098] Selecting high thermal conductivity materials as thermally conductive connecting members 123 is crucial for improving the thermal management performance of energy storage converters. This not only significantly improves thermal conduction efficiency but also ensures uniform temperature distribution, reduces thermal stress, and extends the service life of the equipment. Such a design philosophy reflects a deep understanding of material properties and a pursuit of overall optimization of the heat dissipation system, making it a vital component in constructing high-performance energy storage solutions.

[0099] In some embodiments, as shown in Figure 9, the first circuit board 11 has a plurality of heating elements 111 on the surface adjacent to the heat dissipation module, the heating elements 111 are electrically connected to the first circuit board 11 via a plurality of pins, the plurality of pins are arranged along a straight line on the target surface of the heating elements 111, the target surface is a surface perpendicular to the first circuit board 11, and the straight line connecting the plurality of pins on the target surface is parallel to the first circuit board 11.

[0100] As shown in Figure 9, the heating element is arranged flat on the first circuit board, and by soldering the heating element flatly to the top of the power circuit board (first circuit board), the force on the pins of the heating element is small, making it less susceptible to damage and improving the reliability of the entire system. Furthermore, by directly mounting the heat dissipation module above the heating element, after the heating element generates heat, the heat diffuses upward and is directly dissipated by the heat dissipation module, resulting in a better heat dissipation effect.

[0101] When the heating element is mounted below the power circuit board, the heat naturally diffuses upward after the heating element has generated heat, increasing the temperature of the power circuit board. In this case, the power of the heat dissipation module needs to be set higher to dissipate heat from both the heating element and the power circuit board. Furthermore, because the heat generated by the heating element diffuses upward, mounting the heat dissipation module below the heating element reduces the heat dissipation efficiency of the heat dissipation module. To ensure sufficient heat dissipation, a larger heat dissipation module with higher power is required, which not only occupies a large space within the system but also results in significant power loss for the heat dissipation module. In other words, the volume and power consumption of conventional heat dissipation modules are both larger than those in this embodiment. That is, in this embodiment, after the heating element generates heat, the heat naturally diffuses upward and is directly transferred to the heat dissipation module above. This direction of heat diffusion conforms to the principles of natural thermodynamics and makes the heat dissipation process smoother and more efficient. The heat dissipation module can be tightly bonded to the heat-generating elements, and in terms of design, it can accommodate the demand for direct heat dissipation by considering a larger contact area, a denser or more efficient heat dissipation sheet.

[0102] By welding the heating element flat to the top of the power circuit board and directly mounting the heat dissipation module above the heating element, not only is space saved on the device, but one welding process is also eliminated. Furthermore, after the heating element generates heat, the heat diffuses upward and is directly dissipated by the heat dissipation module, resulting in a better heat dissipation effect. This solves the problems of conventional methods of mounting heating elements and heat dissipation modules on power circuit boards, which involve complex welding processes, low heat dissipation efficiency, and low reliability.

[0103] In some embodiments, as shown in Figure 10, one heat sink 121 and at least one heating element 111 are connected via a third connector 112.

[0104] The third connector, encompassing various types such as screws, clamps, or elastic fixing members, not only plays the crucial role of providing a robust link between the heat-generating element and the heat-dissipating module, but also, due to its superior resistance, effectively counteracts the threat of connection slack caused by vibration, temperature fluctuations, and external physical shocks, significantly improving the mechanical strength and operational stability of the energy storage converter system. The precise pressure applied by the third connector promotes gap-free bonding between the heat-generating element and the cooling structure, directly reducing heat conduction obstacles and enabling efficient transfer of thermal energy. This design allows for the rapid capture of heat released during the device's operating period and guided to the cooling device, significantly lowering the device's surface temperature and effectively extending the device's lifespan and overall lifecycle.

[0105] Compared to conventional welding or adhesive fastening techniques, the modular mounting policy using a third-party joint significantly optimizes the assembly and disassembly processes between heating elements and heat dissipation modules, providing unprecedented convenience for the maintenance and upgrade of energy storage systems. If any module fails and needs replacement, the third-party joint allows for quick and lossless replacement, drastically reducing maintenance cycles and lowering the cost overhead of maintenance work. This non-permanent connection method brings greater flexibility and cost-effectiveness to energy storage systems.

[0106] The unique design of the third joint imparts a certain elastic or regulating function to it, allowing it to effectively handle the thermal expansion and contraction phenomena of the heating element and heat dissipation module at their dynamic operating temperatures. Such elastic properties are particularly important in repeated temperature cycles, as they can effectively buffer mechanical stresses caused by temperature changes, reduce the possibility of material wear and structural damage, and further strengthen the foundation for the structural stability and long-term safe operation of the system.

[0107] In short, the adoption of the third-generation junction enhances the stable connection between the heat-generating element and the heat-dissipating module, significantly improving the thermal management efficiency of the energy storage converter and simplifying the system maintenance process. Furthermore, its flexible elastic design effectively mitigates the potential threat that temperature fluctuations pose to the integrity of the system structure, ensuring the highly efficient, stable, and continuous operation of the energy conversion system. The multifunctionality of such junctions plays a crucial role in meeting the complex demands of modern energy storage technology and provides robust technical support for building high-performance, highly reliable energy storage equipment.

[0108] As shown in Figure 9, the heat-generating elements are arranged in an array on the first circuit board. This layout policy ensures that there is no overlap in the horizontal plane between the projection of each device pin and the cooling device. This innovation not only maximizes the efficient use of the limited space on the circuit board but also provides greater flexibility in other circuit wiring and element allocation by preventing shielding of device pins by the cooling structure, thereby promoting compactness and high-density integration in the circuit board design. As shown in Figure 11, heat-generating elements 111 located in the same row or column share heat dissipation resources, resulting in a significant simplification of the cooling system structure. Such a design reduces the total number of cooling devices required, lowers manufacturing costs, and reduces the physical burden on the circuit board by reducing the use of connectors, thereby improving the overall stability and reliability of the system. The design that shares heat dissipation modules reduces the number of heat sinks by integrating heat dissipation resources, reduces the complexity of installation, makes the assembly process more efficient, and lowers maintenance costs. The combination of array layout and shared heat dissipation contributes to the uniform distribution of heat generated from heat-generating elements, preventing localized temperatures from becoming too high, which is crucial for maintaining the thermal equilibrium of the power circuit board. By sharing heat dissipation resources, each heat-generating element is ensured to receive sufficient cooling, significantly extending the service life of the devices and improving the overall thermal management performance of the system. Precise matching between heat-generating elements and heat dissipation modules allows for rapid and uniform heat diffusion, avoiding localized overheating and ensuring performance stability and safety during long-term operation.

[0109] The array-like arrangement and clear projection separation design provide significant convenience for maintenance operations. Maintenance staff can directly access each device and its pins without worrying about shielding the cooling system when inspecting or replacing heat-generating elements. This offers unexpected value in the equipment maintenance and fault location process, significantly accelerating maintenance speed and reducing equipment downtime. The design employs an unshielded layout for the heat-generating elements and cooling modules, ensuring that the cooling structure does not obstruct direct contact with the devices during maintenance or upgrades, simplifying the maintenance process and improving the efficiency of fault inspection.

[0110] The design of arranging heat-generating elements in an array and sharing a heat dissipation module represents an innovative breakthrough in the field of thermal management and space optimization for modern energy storage converters. It not only enables efficient space utilization and cost control, but also optimizes thermal energy distribution, extends device lifespan, and, more importantly, significantly improves equipment maintainability and fault inspection efficiency, providing strong technical support to enhance the overall performance, stability, and economics of energy storage systems.

[0111] By positioning the heat dissipation module above the heat-generating elements, it is possible to selectively assign one heat dissipation module to each heat-generating element, or for a set of multiple heat-generating elements to share the same heat dissipation module, or for a single integrated large-area heat dissipation module to uniformly handle the heat dissipation needs of all heat-generating elements. Such grouping or unified cooling policies aim to balance cost and efficiency, enabling shared cooling for heat-generating elements with similar heat output, controlling the overall deployment of heat dissipation modules to some extent, and achieving economic optimization through resource sharing.

[0112] When a heat dissipation module is dedicated to a single heat-generating element, such a precise one-to-one pairing policy ensures that the heat dissipation module closely matches the surface of the heat-generating element, creating an efficient heat conduction channel that leads directly to a single heat source. By eliminating intermediate stages, such direct contact minimizes resistance in the heat transfer process, accelerates the rate of heat dissipation, effectively suppresses the operating temperature of the heat-generating element, and significantly improves the overall heat dissipation performance of the system. By placing a dedicated heat dissipation module for each heat-generating element, this approach not only greatly simplifies the thermal management layout of the circuit board layer surface, avoiding the challenges of spatial constraints and heat flow distribution imbalances often seen when multiple devices share the same heat dissipation module, but also provides unprecedented freedom and flexibility to the circuit board design.

[0113] More importantly, such personalized assignment cooling solutions significantly improve the convenience of system maintenance and the potential for modular upgrades. Because each heat source and its corresponding heat dissipation module do not interfere with each other, when a failure or maintenance need arises, precise operations can be performed on the affected assembly without having to move the entire unit, greatly reducing maintenance complexity and minimizing equipment downtime. It also facilitates generational changes for specific heat sources or heat dissipation modules, ensuring that the system can continuously adapt to ever-changing technological and performance requirements.

[0114] Furthermore, the one-to-one heat dissipation module design demonstrates a deep understanding of and flexible response to the diverse characteristics of heat-generating elements. It allows designers to customize the optimal heat dissipation module type and specifications according to the specific thermal behavior, physical dimensions, and mounting location requirements of each heat-generating element. Such customized selections not only improve the system's response speed and cooling accuracy but also facilitate the optimization of the overall system performance, allowing it to better adapt to complex circuit architectures and demanding operating conditions.

[0115] When a heat dissipation module is dedicated to a single heat-generating element, this one-to-one assembly mode ensures that the heat dissipation module adheres seamlessly to the heat-generating element, creating a core heat conduction link that directly reaches a single heat source. This unique direct-contact design significantly reduces obstacles in the heat conduction process, accelerates the heat dissipation rhythm, and further significantly suppresses the working temperature of the heat-generating element, enhancing the system's heat dissipation efficiency and thermal management performance. Each heat-generating element belongs to an independent heat dissipation module, and this policy not only cleverly simplifies the complexity of the thermal design of the circuit board layer surface and optimizes the layout, but at the same time avoids the spatial pressure and imbalance in thermal energy distribution commonly encountered when multiple devices share the same heat dissipation module.

[0116] Furthermore, such dedicated cooling solutions offer significant advantages in terms of maintenance and upgrades. Because each heat-generating element and its corresponding heat dissipation module are independent of each other, if a device or its heat dissipation module encounters a failure or requires periodic inspection, localized and precise intervention measures can be implemented, avoiding the potential risk of a chain reaction and ensuring the continuous operation of other assemblies. This targeted maintenance approach not only significantly reduces the time and effort required for maintenance but also dramatically improves the modular upgrade capability of the entire system and the convenience of daily maintenance, laying a solid foundation for the long-term stable operation of the system.

[0117] Furthermore, the one-to-one placement of heat dissipation modules demonstrates a design philosophy that meticulously considers the thermal characteristics, physical form, and mounting environment of individual heat-generating elements. It allows designers to carefully select the optimal type and parameters of heat dissipation modules based on the unique thermal characteristics, dimensional specifications, and specific location on the circuit board of each heat-generating element. Such highly customized selection not only promotes refined and personalized thermal management but also effectively enhances overall system performance, enabling it to comfortably address the diverse thermal management challenges in complex circuit architectures and achieving a perfect integration of system performance and circuit design requirements.

[0118] As described above, this one-to-one heat dissipation module assembly method, with its efficient heat conduction, simple layout optimization, precise maintenance policy, and highly personalized selection mechanism, brings unprecedented thermal management breakthroughs to high-power electronic equipment such as energy storage converters, and is a powerful guarantee for improving system operational stability, optimizing circuit design, and promoting the long-term development of equipment.

[0119] Furthermore, this configuration, where one heat dissipation module corresponds to one heat-generating element, allows for greater flexibility in the positioning of heat-generating elements on the power circuit board. This design allows each heat-generating element to have an optimal cooling solution customized according to its power level and thermal characteristics. For example, high-power IGBTs may require larger primary connectors and more effective heat dissipation modules, while low-power devices can employ smaller connectors and heat dissipation modules, enabling flexible system placement and optimization.

[0120] While selecting a single large heat dissipation module to cover the entire area may result in a higher initial investment, in the long run, such an integrated solution not only saves valuable circuit board space and allows for a more sophisticated layout, but also demonstrates economies of scale during the production and installation phases. Large heat dissipation modules manufactured and installed in large quantities offer greater cost advantages than installing multiple smaller devices in a distributed manner, reducing fragmentation of material procurement and redundant steps in the manufacturing process, thereby lowering overall material and labor consumption.

[0121] However, integrated large heat dissipation modules also present new manufacturing challenges, primarily due to significantly increased requirements for stability and structural support. Given their considerable volume and mounting weight, the circuit board design must incorporate additional structural reinforcement elements, such as increasing support points or employing high-strength fixing brackets, to ensure that the heat dissipation module remains stable even under its own weight and unexpected mechanical stresses. To achieve this objective, the number of fixing points for the heat dissipation module needs to be increased to four or more in order to distribute the load and enhance structural reliability. Furthermore, when selecting a heat dissipation module, direct-insert or pogo-pin type heat sinks can be considered. Each type of heat sink has its advantages: direct-insert heat sinks are simple in structure and easy to install, while pogo-pin type heat sinks, although slightly more complex in structure, offer superior heat exchange performance due to their larger heat dissipation area.

[0122] In short, by leveraging the assembly policy for heat dissipation modules, it is possible to find the optimal balance between cost control, space management, and thermal energy dissipation efficiency, regardless of whether the modules are shared by the group or cover the entire area. At the same time, in the face of the structural stability challenges posed by large heat dissipation modules, rational support design and high-quality fixed assemblies become essential elements, ensuring the reliability and durability of the system in complex operating environments.

[0123] In some embodiments, as shown in Figures 12 and 13, the orthographic projections of the first circuit board 11, the heat dissipation module 12, and the inductor module 21 on the plane of the second structure that is spaced apart from the first structure overlap at least partially, and the orthographic projections of the second circuit board 13 and the third circuit board 22 on the plane of the second structure that is spaced apart from the first structure overlap at least partially.

[0124] The overlapping layout allows for the inclusion of more critical assemblies within the same enclosure dimensions, further improving energy density, which is particularly important for portable or space-constrained energy storage applications. The vertical overlapping of the first circuit board 11, heat dissipation module 12, and inductor module 21 allows the inductor module to be mounted in the lateral space of the first circuit board and heat dissipation module, eliminating the need to occupy separate planar space at the bottom of the enclosure.

[0125] The overlapping layout of the inductor module and heat dissipation module allows heat generated by the inductor module to be directly absorbed by the heat dissipation module, improving overall thermal efficiency. The inductor module 21 is located on the side of the heat dissipation module 12, and the heat from the inductor module is rapidly dissipated through the heat dissipation module and airflow generator, preventing overheating. The overlapping layout simplifies wiring between circuit boards, reduces wiring length, lowers the risk of electromagnetic interference, and facilitates assembly installation and maintenance.

[0126] Embodiments of the present invention further provide an energy storage system comprising any one of the above-described energy storage converters.

[0127] The energy storage converter design scheme provided by the present invention can achieve a significant improvement in energy density within a limited volume through device recession, array arrangement, and optimization of heat dissipation and connection technologies. Such spatial optimization not only reduces the physical dimensions of the converter but also promotes a compact layout for the entire energy storage system, providing physical space possibilities for high energy storage and high-efficiency conversion, and is particularly applicable to space-constrained application scenarios such as urban distributed energy systems and electric vehicle charging stations. Energy storage systems designed using the energy storage converter of the present invention not only achieve optimization in terms of physical space and cost control but also show significant progress in thermal management, maintenance, and upgrade flexibility. These overall advantages not only improve the overall performance of the system but also enhance its adaptability in complex environments and stability during long-term operation.

[0128] Embodiments of the present invention further provide power-using equipment including any one of the above-described energy storage converters.

[0129] The design of the energy storage converter in this invention significantly improves space utilization efficiency through device recession, optimization of heat sink and device layout, and a shared thermal management policy. For power-consuming equipment, this means that a more powerful energy storage system can be integrated into a more compact space, reducing the equipment's footprint and freeing up valuable space for other critical assemblies such as battery packs, control units, or user interfaces. This enables a smaller and lighter overall equipment design, enhancing portability and placement flexibility. Power-consuming equipment designed using the energy storage converter of this invention demonstrates significant market competitiveness and user value due to its overall advantages in terms of space efficiency, cost control, thermal management, ease of maintenance, and performance improvement. These optimizations not only improve the practicality of the equipment but also enhance its long-term operational economics and reliability, developing new possibilities for power supply and management in various application scenarios, and showing great potential, especially in industrial automation, data centers, and renewable energy systems where there are high demands for energy efficiency and stability.

[0130] As those skilled in the art will see, the above embodiments are specific examples for realizing the present invention, and in actual applications, various changes to form and detail are possible as long as they do not depart from the spirit and scope of the invention. Since any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention, the scope of protection of the present invention should be limited to the scope set forth in the appended claims. [Explanation of symbols]

[0131] 01 Cabinet 10 1st structure part 11 1st circuit board 111 Heat-generating element 112 Third splicer 12 Heat dissipation modules 121 Heatsink 122 2nd splicer 123 Thermally conductive connecting member 13 Second circuit board 14. Airflow Generator 141 First airflow generator 142 Second airflow generator 20 Second structure part 21 Inductor Modules 22 Third circuit board 30 Slide rail mechanism 40 Baffle Plate 50 partition plates

Claims

1. An energy storage converter, The structure includes a first structural part and a second structural part adjacent to each other in a predetermined direction, the first structural part includes a first circuit board, a heat dissipation module and a second circuit board distributed sequentially from bottom to top, the first circuit board includes a power control module for the inverter circuit and a power conversion module for the inverter circuit, the second circuit board includes a DC voltage adjustment module, the second structural part includes an inductor module and a third circuit board distributed sequentially from bottom to top, the third circuit board includes a sampling module, and the predetermined direction is perpendicular to the thickness direction of the first circuit board. An energy storage converter characterized in that the current in the energy storage converter flows sequentially through the first circuit board, the second circuit board, the third circuit board, and the inductor module.

2. The first structural part further includes an airflow generating device, The energy storage converter according to claim 1, wherein the airflow generating device is located on at least one side of the heat dissipation module, the side being a surface excluding the first and second surfaces of the heat dissipation module, the first surface being a surface facing the first circuit board, and the second surface being a surface facing the second circuit board.

3. The airflow generating device includes a first airflow generating device and a second airflow generating device. The first airflow generator is located on the first side surface of the heat dissipation module, and the first side surface is the side of the heat dissipation module that is close to the inductor module. The energy storage converter according to claim 2, characterized in that the second airflow generator is located on the second side surface of the heat dissipation module, the first side surface and the second side surface are opposite surfaces, the wind direction of the airflow generated by the first airflow generator and the wind direction of the airflow generated by the second airflow generator are both the first wind direction, and the first wind direction is in the direction from the heat dissipation module toward the inductor module.

4. The energy storage converter further includes a housing, The energy storage converter according to claim 2, characterized in that the first structural part and the second structural part are located inside the housing, and the airflow generating device is movably mounted to the housing via a slide rail mechanism.

5. The energy storage converter according to claim 4, wherein the slide rail mechanism includes at least one pair of mutually engaging first slide rails and second slide rails, the first slide rail being fixed to the inner wall of the housing, the second slide rail being fixed to the airflow generating device, and the airflow generating device performing a push-pull motion along a preset trajectory by the guiding action of the first slide rail and the second slide rail.

6. The energy storage converter further includes a bracket and a baffle plate, The bracket is attached to the housing via a first connector, and the bracket is located on the first side of the airflow generator. The energy storage converter according to claim 4, characterized in that the baffle plate is attached to the second side of the airflow generator, and the first side and the second side are opposite each other.

7. The heat dissipation module includes a plurality of arranged heat sinks, The energy storage converter according to claim 2, characterized in that the airflow generating device is fixed to the substrate of the first target heatsink and the substrate of the second target heatsink via a second connector, the first target heatsink is a row of heatsinks closest to the inductor module, and the second target heatsink is a row of heatsinks furthest from the inductor module.

8. The heat sink includes at least one thermally conductive connecting member, The energy storage converter according to claim 7, characterized in that the fins of the heat sink are connected by the thermally conductive connecting member.

9. The energy storage converter according to claim 8, characterized in that the thermal conductivity of the thermally conductive connecting member is 395 to 400.

10. The energy storage converter according to claim 7, wherein the first circuit board has a plurality of heating elements on a surface adjacent to the heat dissipation module, the heating elements are electrically connected to the first circuit board via a plurality of pins, the plurality of pins are arranged along a straight line on a target surface of the heating elements, the target surface is a surface perpendicular to the first circuit board, and the straight line connecting the plurality of pins on the target surface is parallel to the first circuit board.

11. The energy storage converter according to claim 10, characterized in that one of the heat sinks and at least one of the heating elements are connected via a third junction.

12. The energy storage converter according to claim 1, characterized in that the orthographic projections of the first circuit board, the heat dissipation module, and the inductor module on the plane of the second structure spaced apart from the first structure overlap at least partially, and the orthographic projections of the second circuit board and the third circuit board on the plane of the second structure spaced apart from the first structure overlap at least partially.

13. An energy storage system characterized by including an energy storage converter according to any one of claims 1 to 12.

14. A power-using device characterized by including an energy storage converter according to any one of claims 1 to 12.

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