Semiconductor device and method for manufacturing a semiconductor device
The semiconductor device uses a frame member to fix the module to a support via a heat transfer medium, addressing issues of warpage and thermal deformation, ensuring stable wiring and efficient heat dissipation while reducing costs.
JP7885534B2Active Publication Date: 2026-07-07FUJI ELECTRIC CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- FUJI ELECTRIC CO LTD
- Filing Date
- 2022-02-02
- Publication Date
- 2026-07-07
Smart Images
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Abstract
To realize a high performance and high quality semiconductor device that comprises a semiconductor module which is mounted on a support medium through a heat transfer medium.SOLUTION: A semiconductor device 1A comprises: a support medium 10; a semiconductor module 20; a heat transfer medium 30; and a first frame member 40. The semiconductor module 20 has a semiconductor chip and a resin member sealing the semiconductor chip, and is mounted on the support medium 10 through the heat transfer medium 30. The first frame member 40 is arranged on the semiconductor module 20, and has a first frame part 41 that covers an edge part 21a of a top surface 20a of the semiconductor module 20 (its resin member) and a first opening 42 that is provided in an inside of the first frame part 41 and leads to the semiconductor module 20 (its resin member). The first frame member 40 is fixed to the support medium 10 by a screw 50. Fixing using the first frame member 40 permits mitigation and dispersion of a stress generated in the semiconductor module 20 and suppresses degradation of its performance and quality.SELECTED DRAWING: Figure 1
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