Heat dissipation devices, heat dissipation systems, and optical module heat dissipation equipment

Abstract

The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device, a heat dissipation system, and an optical module heat dissipation device. One or more a partition assembly; One or more a first heat dissipation structure; One or moreOne or more and a first heat transfer structure, the case including a receiving cavity; One or more The partition assembly is located within the storage cavity, and the one or more partition assemblies divide the storage cavity into a first sub-storage cavity. One or more a second sub-accommodating cavity, and a side of the first heat dissipation structure facing the bottom plate of the case is located in the second sub-accommodating cavity; one end of the first heat transfer structure is connected to the first heat dissipation structure; and the other end of the first heat transfer structure penetrates the case to connect to a heat exchange device. 。

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to heat dissipation devices, heat dissipation systems, and optical module heat dissipation equipment.

Background Art

[0002] In the prior art, when dissipating heat from an optical module, the two insertion terminals of the optical module need to be inserted into a heat dissipation cage for heat dissipation. However, in such an installation method, the insertion terminal located below generates a large amount of heat.

Summary of the Invention

Problems to be Solved by the Invention

[0003] To solve the above problems, This application provides a heat dissipation device, a heat dissipation system, and optical module heat dissipation equipment. In the heat dissipation device, the heat in the first heat dissipation structure can be导出 through the first heat transfer structure, improving the heat dissipation capacity of the first heat dissipation structure, and further ensuring that the heat generated from the insertion terminal inserted into the second sub-accommodation cavity can be released in a timely manner.

Means for Solving the Problems

[0004] The According to one aspect, this application provides a heat dissipation device, the heat dissipation device includes a case and One or more a partition assembly, One or more a first heat dissipation structure, One or more a heat transfer structure. The case includes a bottom plate, a top plate, and side plates. The side plates are used to connect the top plate and the bottom plate. The top plate, the bottom plate, and the side plates surround to form an accommodation cavity with one end open. One or more The partition assembly is located in the accommodation cavity. One or more The partition assembly divides the accommodation cavity into a first sub-accommodation cavity and One or moreIt is used to partition the first heat dissipation structure into a second sub-accommodation cavity, with the side of the first heat dissipation structure facing the bottom plate located within the second sub-accommodation cavity, one end of the first heat transfer structure being connected to the first heat dissipation structure, and the other end of the first heat transfer structure being used to connect to a heat exchanger.

[0005] In this embodiment, the partition assembly comprises a case housing cavity and a first sub-housing cavity. One or more The first sub-encompassing cavity is partitioned, and the second heat dissipation structure dissipates heat for the insertion terminals inserted into the first sub-encompassing cavity. The heat absorbed by the first heat dissipation structure is transferred to the heat exchanger via the first heat transfer structure, allowing the heat absorbed by the first heat dissipation structure to be released quickly, further improving the heat dissipation rate of the insertion terminals inserted into the second sub-encompassing cavity, preventing the temperature of the insertion terminals inserted into the second sub-encompassing cavity from becoming too high, and improving the service life of the optical module.

[0006] In one embodiment, the other end of the first heat transfer structure is connected to the heat exchanger by passing through the side plate.

[0007] In one embodiment, the first heat transfer structure includes a first heat conduction tube having a flattened shape, one end of the first heat conduction tube is connected to a first heat dissipation structure, and the other end of the first heat conduction tube is used to connect to a heat exchanger. In one embodiment, the other end of the first heat conduction tube penetrates a side plate to connect to the heat exchanger.

[0008] In one embodiment, the first heat transfer structure includes a heat transfer substrate and a first heat conduction tube, the first heat conduction tube being flattened, the heat transfer substrate being connected to the first heat dissipation structure, one end of the first heat conduction tube being fixedly connected to the heat transfer substrate, and the other end of the first heat conduction tube being used to connect to a heat exchanger.

[0009] In one embodiment, the first heat conduction tube includes a first tube body and a second tube body that communicate with each other, the first tube body and the heat transfer substrate are installed parallel to each other and are fixedly connected, the second tube body and the first tube body are installed at an angle to each other, and the second tube body is used to connect to a heat exchanger.

[0010] In one embodiment, the first heat conduction tube includes a first tube body, a flexible connecting tube body, and a second tube body, the flexible connecting tube body being used to connect the first tube body and the second tube body, the first tube body being used to fix and connect to a heat transfer substrate, and the second tube body being used to connect to a heat exchanger.

[0011] In one embodiment, each partition assembly is used to mount one of the first heat dissipation structures.

[0012] In one embodiment, the heat dissipation device includes a second heat dissipation structure connected to the side of the top plate away from the bottom plate.

[0013] In one embodiment, the heat dissipation device includes a second heat transfer structure connected to a second heat dissipation structure.

[0014] In one embodiment, the second heat transfer structure includes a second heat conduction tube, one end of which is connected to a second heat dissipation structure, and the other end of which is used to connect to a heat exchanger.

[0015] In one embodiment, the second heat conduction tube is flattened.

[0016] In one embodiment, the first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, one end of the first liquid supply pipe penetrates the side plate and communicates with the first heat dissipation structure, the other end of the first liquid supply pipe is used to communicate with a heat exchanger, one end of the first liquid outlet pipe penetrates the case and communicates with the first heat dissipation structure, the other end of the first liquid outlet pipe is used to communicate with a heat exchanger, the second heat transfer structure includes a second liquid supply pipe and a second liquid outlet pipe, one end of the second liquid supply pipe communicates with the second heat dissipation structure, the other end of the second liquid supply pipe is used to communicate with a heat exchanger, one end of the second liquid outlet pipe communicates with the second heat dissipation structure, and the second Out The other end of the liquid tube communicates with the first heat dissipation structure.

[0017] In one embodiment, the first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, and the second heat transfer structure includes a second liquid supply pipe and a second liquid outlet pipe. One end of the second liquid supply pipe communicates with the second heat dissipation structure, and the other end of the second liquid supply pipe is used to communicate with the heat exchanger, one end of the second liquid outlet pipe communicates with the second heat dissipation structure, and the other end of the second liquid outlet pipe is connected to the first Out liquid pipe others It communicates with the end and the first liquid supply pipe one The end communicates with the first heat dissipation structure, and one end of the first outlet pipe penetrates the case and communicates with the first heat dissipation structure, and the first salary The other end of the liquid pipe is used to connect to a heat exchanger.

[0018] In one embodiment, the first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, the second heat transfer structure includes a second liquid supply pipe and a second liquid outlet pipe, one end of the first liquid supply pipe communicates with the first heat dissipation structure by penetrating the side plate, the other end of the first liquid supply pipe communicates with the second heat dissipation structure, one end of the first liquid outlet pipe communicates with the first heat dissipation structure by penetrating the case, the other end of the first liquid outlet pipe communicates with the second heat dissipation structure, one end of the second liquid supply pipe communicates with the second heat dissipation structure, the other end of the second liquid supply pipe is used to communicate with a heat exchanger, one end of the second liquid outlet pipe communicates with the second heat dissipation structure, and the other end of the second liquid outlet pipe communicates with a heat exchanger.

[0019] In one embodiment, there are a plurality of cases, and the second heat dissipation structure is fixedly connected to the top plates included in the plurality of cases.

[0020] In one embodiment, the second heat dissipation structure can move toward the side approaching or leaving the bottom plate with respect to the top plate, and the first heat dissipation structure can move toward the side approaching or leaving the bottom plate with respect to the partition assembly.

[0021] According to a second aspect, the present application further provides a heat dissipation system, the heat dissipation system includes a heat exchange device and a heat dissipation device, the plurality of heat dissipation devices are installed at intervals in sequence, and the first heat transfer structure and the second heat transfer structure included in each heat dissipation device are both connected to the heat exchange device. In the heat dissipation system according to the present application, when the insertion terminals of the optical module are inserted into each heat dissipation device, since both the second heat dissipation structure and the first heat dissipation structure in each heat dissipation device can move, it can be ensured that the heat dissipation system is applicable to optical modules having insertion terminals of different sizes, and furthermore, the applicability of the heat dissipation system can be improved.

[0022] According to a third aspect, the present application further provides an optical module heat dissipation device, and the optical module heat dissipation device includes the above heat dissipation device and One or more the optical module, the optical module includes a main body and an insertion terminal connected to the main body, and the insertion terminal is inserted into the first sub-accommodation cavity and the second sub-accommodation cavity included in the heat dissipation device. In such a manner, the heat generated from the insertion terminals of the optical module can be rapidly dissipated, and the service life of the optical module can be improved.

Brief Description of the Drawings

[0023] [Figure 1] It is a heat dissipation device according to an embodiment of the present application. [Figure 2] It is an exploded view of FIG. 1. [Figure 3] It is another exploded view of FIG. 1. [Figure 4]This is a schematic diagram of the structure of a partition assembly in a heat dissipation device according to an embodiment of this application. [Figure 5] This is another schematic diagram of the partition assembly in the heat dissipation device according to an embodiment of this application. [Figure 6] This is a schematic diagram of the local structure of the case in the heat dissipation device according to the embodiment of this application. [Figure 7] This is a schematic diagram of the structure of the first heat dissipation structure in the heat dissipation device according to the embodiment of this application. [Figure 8] This is a schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of this application. [Figure 9] This is another schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in the heat dissipation device according to the embodiment of this application. [Figure 10] This is another schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in the heat dissipation device according to the embodiment of this application. [Figure 11a] This is a schematic diagram of the structure of the first heat conduction tube according to an embodiment of this application. [Figure 11b] This is another schematic diagram of the structure of the first heat conduction tube according to an embodiment of this application. [Figure 12] This is another schematic diagram of the structure of the heat dissipation device according to the embodiment of this application. [Figure 13] This is another schematic diagram of the structure of the heat dissipation device according to the embodiment of this application. [Figure 14] This is another schematic diagram of the structure of the heat dissipation device according to the embodiment of this application. [Figure 15] This is another schematic diagram of the structure of the heat dissipation device according to the embodiment of this application. [Modes for carrying out the invention]

[0024] To further clarify the purpose, technical proposal, and advantages of this application, the following describes this application in more detail, accompanied by drawings.

[0025] In conventional technology, when dissipating heat from an optical module, the two insertion terminals of the optical module must be inserted into a heat dissipation cage to dissipate heat. In this installation method, the insertion terminal located at the bottom generates a large amount of heat. However, the heat dissipation cage cannot release the heat generated from the lower insertion terminal in a timely manner, and this can cause the temperature of the insertion terminal to become too high, affecting the performance and lifespan of the optical module.

[0026] Therefore, there is an urgent need for a new heat dissipation device to solve the above technical challenges.

[0027] The terms used in the following embodiments are for the purpose of describing specific embodiments and are not intended to limit this application. As used in the specification and appended claims of this application, the singular expressions "one," "one kind," "the said," "above," "the said," and "this" are intended to include expressions such as "one or more" unless explicitly indicated otherwise in the context.

[0028] References made herein such as “one embodiment” or “some embodiments” mean that one or more embodiments of this application include certain features, structures, or characteristics described in association with that embodiment. Thus, phrases appearing in various parts of this specification such as “in one embodiment,” “in some embodiments,” “in some other embodiments,” and “in some other embodiments” do not necessarily all refer to the same embodiment, and unless otherwise emphasized, mean “one or more embodiments, but not all embodiments.” Terms such as “include,” “incorporate,” “have,” and variations thereof mean “include, but not limited to,” unless otherwise emphasized.

[0029] Figure 1 shows a heat dissipation device according to an embodiment of this application, and Figures 2 and 3 are exploded views of Figure 1. Referring to Figures 1 to 3, the heat dissipation device consists of a case 10 and One or more The partition assembly 30 and One or moreThe first heat dissipation structure 40 and One or more The case 10 includes a first heat transfer structure 70. In one embodiment, the partition assembly 30 and the first heat transfer structure 70 are installed in a one-to-one correspondence, and the first heat transfer structure 70 and the first heat dissipation structure 40 are installed in a one-to-one correspondence. The case 10 includes a top plate 12, a bottom plate 11, and side plates 13, the side plates 13 connecting the top plate 12 and the bottom plate 11, and the side plates 13, the top plate 12, and the bottom plate 11 enclose a housing cavity with one end open. Here, the shapes of the top plate 12 and the bottom plate 11 may be rectangular, circular, or polygonal. Generally speaking, to facilitate arrangement, both the top plate 12 and the bottom plate 11 are rectangular. The side panel 13 may include two first side panels 130 and one second side panel 131, the two first side panels 130 being spaced apart along a first direction X, and the second side panel 131 connecting the two first side panels 130. Specifically, the second side panel 131 and the first side panels 130 may be connected by a locking mechanism. This facilitates the assembly of the case 10.

[0030] Continuing to refer to Figures 1 to 3, One or more The partition assembly 30 is located within the housing cavity, and one or more partition assemblies 30 may be connected to two first side plates 130, and at least one partition assembly 30 connects the housing cavity to the first sub-housing cavity 14 One or more The first heat dissipation structure 40 is partitioned into a second sub-accommodation cavity 15. The side of the first heat dissipation structure 40 facing the bottom plate 11 is located inside the second sub-accommodation cavity 15. In this embodiment, the first sub-accommodation cavity 14 and the second sub-accommodation cavity 15 are used to insert the insertion terminals of the optical module, and the insertion terminals located inside the second sub-accommodation cavity 15 and the first heat dissipation structure 40 perform heat exchange to achieve heat dissipation to the optical module. Here, the heat absorbed by the first heat dissipation structure 40 is continuously transferred to the heat exchanger via the first heat transfer structure 70, so that the first heat dissipation structure 40 is at a relatively low temperature. This can be guaranteed, thereby improving the heat dissipation capacity of the first heat dissipation structure 40 and further guaranteeing that the heat generated from the insertion terminals inserted into the second sub-accommodation cavity 15 can be released in a timely manner.

[0031] Here, the heat exchanger may be a cold plate or a liquid-cooled structure.

[0032] In one embodiment, the partition assembly 30 included in the heat dissipation device may be one, two, or three. When there is one partition assembly 30, it is located between the bottom plate 11 and the top plate 12, and the single partition assembly 30 divides the housing cavity into one first sub-housing cavity 14 and one second sub-housing cavity 15. When there are two partition assemblies 30, the two partition assemblies 30 are installed with a gap between the top plate 12 and the bottom plate 11, and the two partition assemblies 30 divide the housing cavity into one first sub-housing cavity 14 and two second sub-housing cavities 15. When there are three partition assemblies 30, the three partition assemblies 30 are installed with a gap between the top plate 12 and the bottom plate 11, and the three partition assemblies 30 divide the housing cavity into one first sub-housing cavity 14 and three second sub-housing cavities 15.

[0033] Continuing to refer to Figures 1 to 3, in some embodiments, the heat dissipation device includes a second heat dissipation structure 20, which is located on the side of the top plate 12 away from the bottom plate 11, and the top plate 12 is connected to the second heat dissipation structure 20, and the insertion terminal located in the first sub-accommodation cavity 14 and the second heat dissipation structure 20 perform heat exchange, ensuring that the heat generated from the insertion terminal located in the first sub-accommodation cavity 14 can be released in a timely manner.

[0034] For ease of understanding, in this application, the first direction X is the alignment direction of the two first side plates 130, the second direction Y is the direction in which the opening ends of the first sub-accommodation cavity 14 and the second sub-accommodation cavity 15 extend toward the bottom, and the third direction Z is the alignment direction of the bottom plate 11 and the top plate 12. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other. It should be noted that the perpendicularity as defined in the embodiments of this application is not limited to a relationship where the absolute intersection angle is 90 degrees, but rather allows for relationships that are not absolute perpendicular intersections due to factors such as assembly tolerances, design tolerances, and the influence of structural flatness, and allows for errors in a small angular range. Exemplaryly, 80 to 100 degrees may be understood as a perpendicular relationship within the range of assembly tolerances.

[0035] The following explanation uses the example of a single partition assembly being installed within the case of a heat dissipation device.

[0036] Figure 4 is a schematic diagram of the structure of a partition assembly in a heat dissipation device according to an embodiment of the present application, and Figure 5 is another schematic diagram of the structure of a partition assembly in a heat dissipation device according to an embodiment of the present application. Referring to Figures 3 to 5, each partition assembly 30 is used to mount one first heat dissipation structure 40. The partition assembly 30 includes a partition plate 31 and two partition side plates 32, the two partition side plates 32 are installed facing each other along a first direction X, and the two partition side plates 32 are connected to the side of the partition plate 31 toward the bottom plate 11. Here, the partition side plate 32 includes a connecting plate 320 and a mounting plate 321 connected to the connecting plate 320, the mounting plate 321 is located between the two connecting plates 320, the two mounting plates 321 are spaced apart along a first direction X, the first heat dissipation structure 40 is drilled into the partition assembly 30 through the gap between the two connecting plates 320 along the first direction X, and the two mounting plates 321 are used to mount the first heat dissipation structure 40. When the first heat dissipation structure 40 is installed in the partition assembly 30 via the partition side plate 32, a portion of the first heat dissipation structure 40 can enter the second sub-accommodation cavity 15 through the gap between the two mounting plates 321, thereby ensuring that when the insertion terminals of the optical module are inserted into the second sub-accommodation cavity 15, the insertion terminals of the optical module can contact the first heat dissipation structure 40.

[0037] In one embodiment, the partition plate 31 is One or moreThe partition plate 31 includes a first opening 310, the first opening 310 is used to install one first elastic member 311, the first elastic member 311 extending to one side of the mounting plate 321. When the first heat dissipation structure 40 is installed within the partition assembly 30, the first elastic member 311 can contact the first heat dissipation structure, the first heat dissipation structure 40 can move along a third direction Z, and the second sub-accommodation cavity 15 can accommodate socket terminals of different sizes. In this case, it may be understood that the first heat dissipation structure 40 is installed within the partition assembly and the first heat dissipation structure 40 can move toward or away from the bottom plate relative to the partition assembly. In some embodiments, the partition plate 31 includes one first opening 310, the first elastic member 311 is installed within the first opening 310, or multiple first elastic members 311 are installed within the first opening 310. In some embodiments, the partition plate 31 includes a plurality of first openings 310, each of which is fitted with a first elastic member 311, and the plurality of first openings 310 are distributed in an array-like manner on the partition plate 31.

[0038] In some embodiments, the partition plate 31 includes a first plate 312, a second plate 313, and a third plate 314 connected in sequence, with the first opening 310 and the first elastic member 311 both installed on the first plate 312. The first plate 312 and the third plate 314 may be installed parallel to each other, and the connecting plate 320 is located between the second plate 313 and the second side plate. Here, the length of the connecting plate 320 along the second direction Y being less than the length of the partition plate 31 may be understood as the length of the connecting plate 320 along the second direction Y being less than the length of the first plate 312. Thus, after the first heat dissipation structure 40 is mounted on the partition assembly 30, the first heat dissipation structure 40 can be connected to the heat transfer structure via the side of the partition assembly 30. Furthermore, the third plate 314 and the mounting plate 321 are on the same plane and can both be used to mount the first heat dissipation structure 40, and the second plate 313 can restrict the movement of the first heat dissipation structure 40 along the second direction Y.

[0039] It should be noted that multiple openings may be provided on the second plate 313, thereby facilitating gas to enter the case through the openings and improving the heat dissipation capacity of the first heat dissipation structure. One or more The connecting plate 320 includes stopper openings 322, which extend along a third direction Z and are connected to the first heat dissipation structure 40 to ensure stability when the first heat dissipation structure 40 moves up and down along the third direction. Here, the number of stopper openings 322 may be adjusted according to the actual situation.

[0040] Figure 6 is a schematic diagram of the local structure of the case in the heat dissipation device according to an embodiment of the present application. Referring to Figure 6, in the above embodiment, at least one pair of first elastic clamp members 50 and at least one pair of second elastic clamp members 60 are further installed in the case 10. Here, one pair of first elastic clamp members 50 includes two first elastic clamp members 50, and one pair of second elastic clamp members 60 includes two second elastic clamp members 60. At least one pair of first elastic clamp members 50 is installed in the first sub-accommodation cavity, and at least one pair of second elastic clamp members 60 is installed in the second sub-accommodation cavity. Specifically, on each first side plate 130 One or more A first elastic clamp member 50 is installed, and the installation of the first elastic clamp member 50 can restrict the movement of the insertion terminal of the optical module in the first sub-accommodation cavity along the first direction X. Similarly, further on each first side plate 130 One or more A second elastic clamp member 60 is installed, and the installation of the second elastic clamp member 60 can restrict the movement of the insertion terminal of the optical module in the second sub-accommodation cavity along the first direction X. Here, the first elastic clamp member 50, the second elastic clamp member 60, and the first elastic member may all be a single elastic piece or other elastic structural members.

[0041] The heat dissipation device includes an engagement assembly 90, which can fix the top plate 12 and the second heat dissipation structure 20. When the second heat dissipation structure 20 is specifically connected to the top plate 12, an opening for accommodating the second heat dissipation structure 20 may be provided on the top plate 12, a portion of the second heat dissipation structure 20 being installed in the opening of the top plate 12, the engagement assembly engaging the second heat dissipation structure 20 with the top plate 12, and a gap existing between the engagement assembly and the second heat dissipation structure 20, allowing the second heat dissipation structure 20 to move toward or away from the bottom plate relative to the top plate 12. Here, the engagement assembly 90 may specifically be a pressing structure, the pressing may be a spring, an elastic piece, or a fastener.

[0042] In the above embodiment, the second heat dissipation structure 20 includes a second heat dissipation motherboard 21, which is connected to the top plate 12 and used to dissipate heat for the insertion terminals inserted into the first sub-accommodation cavity. In some other embodiments, the second heat dissipation structure 20 further includes a plurality of second heat dissipation fin groups 22, which are spaced apart along a second direction Y and installed on the side of the second heat dissipation motherboard 21 away from the top plate 12.

[0043] Figure 7 is a schematic diagram of the structure of the first heat dissipation structure in a heat dissipation device according to an embodiment of the present application. Referring to Figure 7, the first heat dissipation structure 40 includes a first heat dissipation motherboard 41, a contact plate 42, and a stopper block. The contact plate 42 is installed on the side of the first heat dissipation motherboard 41 facing the bottom plate, and the contact plate 42 is used to dissipate heat from the insertion terminals inserted into the second sub-housing cavity by contacting the insertion terminals. The stopper block is connected to the side of the first heat dissipation motherboard 41, and the stopper block is used to ensure that the first heat dissipation structure can move along a third direction when it is in contact with the insertion terminals by fitting into a stopper opening. The first heat dissipation structure 40 includes a first heat dissipation fin group 43, and the multiple first heat dissipation fin groups 43 are installed on the side facing the top plate of the first heat dissipation motherboard 41 and are used to improve the heat dissipation capacity of the first heat dissipation motherboard 41.

[0044] Figure 8 is a schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of the present application. Referring to Figure 8, the first heat transfer structure 70 includes a first heat conduction tube 72, which is flattened in order to improve the contact area between the first heat conduction tube 72 and the first heat dissipation structure 40. One end of the first heat conduction tube 72 is connected to the first heat dissipation structure 40, and the other end of the first heat conduction tube 72 is used to connect to a heat exchanger by passing through the case. In this case, the heat exchanger may be a cold plate, and the cold plate and the first heat conduction tube 72 perform heat exchange, and the first heat conduction tube 72 and the first heat dissipation structure 40 perform heat exchange. Furthermore, the first heat conduction tube 72 can pass through the side plate in order to connect to the heat exchanger.

[0045] Figure 9 is another schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of the present application. Referring to Figure 9, the first heat transfer structure 70 includes a heat transfer substrate 71 and a first heat conduction tube 72, the heat transfer substrate 71 is used to connect to the first heat dissipation structure 40, and the first heat conduction tube 72 is flattened in order to improve the contact area between the first heat conduction tube 72 and the first heat dissipation structure 40. Specifically, the heat transfer substrate 71 is installed on the outside of the side plate 13 and is fixed to the side plate 13, in which case the side plate 13 is the first side plate, the heat transfer substrate 71 penetrates the first side plate and is connected to the first heat dissipation structure 40, one end of the first heat conduction tube 72 is fixedly connected to the side of the heat transfer substrate 71 facing or away from the side plate 13, and the other end of the first heat conduction tube 72 is used to connect to a heat exchanger. This ensures that the heat absorbed by the first heat dissipation structure 40 is transferred to the external heat exchanger via the first heat conduction tube 72.

[0046] Figure 10 is another schematic diagram of the connection between the first heat dissipation structure and the first heat transfer structure in a heat dissipation device according to an embodiment of the present application. Referring to Figure 10, in one embodiment, the first heat dissipation structure 40 may further include a liquid-cooled heat sink 44, which is installed between the first heat dissipation motherboard 41 and the first heat dissipation fin group 43, one end of the first heat conduction tube 72 is fixed to the heat transfer substrate 71, and the first heat conduction tube 72 can be bonded to the liquid-cooled heat sink 44, thereby improving the heat dissipation capacity of the first heat dissipation structure 40.

[0047] Figure 11a is a schematic diagram of the structure of a first heat conduction tube according to an embodiment of the present application. Referring further to Figures 9, 10 and 11a, the first heat conduction tube 72 includes a first tube 720 and a second tube 721 connected to each other, wherein the first tube 720 and the heat transfer substrate 71 are installed parallel to each other, the second tube 721 and the first tube 720 are installed at an angle, and at least a portion of the second tube 721 and the bottom plate are installed parallel to each other. Specifically, the second tube 721 and the first tube 720 may be installed vertically. In this installation method, if there are multiple cases, the installation method of the first pipe 720 can reduce the distance between two adjacent cases, and the installation method of the second pipe 721 can reduce the convenience of connecting the second pipe 721 to the heat exchanger and improve the flexibility of the second pipe 721's floating along the third direction Z.

[0048] Figure 11b is a schematic diagram of yet another structure of the first heat conduction tube according to an embodiment of the present application, the first heat conduction tube includes a first tube body 720, a flexible connecting tube body 722, and a second tube body 721, the flexible connecting tube body 722 is used to connect the first tube body 720 and the second tube body 721, and the first tube body 720 is used to connect to a heat transfer substrate. Specifically, when the heat transfer substrate is installed on the outside of the side plate, the first tube body 720 is used to be fixedly connected to the side of the heat transfer substrate facing or away from the side plate, and the second tube body 721 is used to connect to a heat exchanger. In this installation method, when the first tube body 720 is connected to the heat transfer substrate, the first tube body 720 and the heat transfer substrate are installed in parallel, which can increase the efficiency of heat transfer. The bonding area between the second tube body 721 and the heat exchanger is large. This increases the heat transfer efficiency of the first heat conduction tube.

[0049] Figure 12 is a schematic diagram of yet another structure of a heat dissipation device according to an embodiment of the present application, and referring to Figure 12, the heat dissipation device includes a second heat transfer structure 80. The second heat transfer structure 80 includes a second heat conduction tube 81, one end of which is connected to the second heat dissipation structure 20, and the other end of which is connected to a heat exchanger. Here, the second heat conduction tube 81 is flattened in order to improve the heat dissipation capacity of the second heat transfer structure 80 to the second heat dissipation structure 20. The first heat transfer structure 70 includes a first heat conduction tube 72, one end of which is connected to the first heat dissipation structure 40, and the other end of which is connected to the heat exchanger by passing through the second side plate 131. The other end of the first heat conduction tube 72 and the other end of the second heat conduction tube 81 are installed at opposite ends of the heat exchanger along the third direction. Alternatively, the other end of the first heat conduction tube 72 and the other end of the second heat conduction tube 81 are installed on the same side of the heat exchanger.

[0050] Figure 13 is a schematic diagram of yet another structure of a heat dissipation device according to an embodiment of the present application. Referring to Figure 13, the first heat transfer structure 70 includes a first liquid supply pipe 73 and a first liquid outlet pipe 74. One end of the first liquid supply pipe 73 penetrates the case and communicates with the first heat dissipation structure, the other end of the first liquid supply pipe 73 is used to communicate with a heat exchanger, and one end of the first liquid outlet pipe 74 penetrates the case and communicates with the first heat dissipation structure. Specifically, one end of the first liquid supply pipe 73 can penetrate the side plate (the side plate is the first side plate 130) and communicate with the first heat dissipation structure, the side plate of the first liquid outlet pipe 74 (the side plate is the first side plate 130) communicates with the first heat dissipation structure, and the other end of the first liquid outlet pipe 74 is used to communicate with a heat exchanger. The second heat transfer structure 80 includes a second liquid supply pipe 82 and a second liquid outlet pipe 83. One end of the second liquid supply pipe 82 communicates with the second heat dissipation structure 20, and the other end of the second liquid supply pipe 82 is used to communicate with a heat exchanger. One end of the second liquid outlet pipe 83 communicates with the second heat dissipation structure 20, and the other end of the second liquid supply pipe 82 communicates with the first heat dissipation structure 40. In this configuration, the second heat dissipation structure 20 and the first heat dissipation structure are connected to the heat exchanger via the second heat transfer structure 80 and the first heat transfer structure 70, respectively. Both the second heat transfer structure 80 and the first heat transfer structure 70 allow refrigerant to flow into the second heat dissipation structure 20 and the first heat dissipation structure via pipelines, thereby improving the heat dissipation efficiency of the second heat dissipation structure 20 and the first heat dissipation structure.

[0051] Figure 14 is a schematic diagram of yet another structure of a heat dissipation device according to an embodiment of the present application. Referring to Figure 14, the first heat transfer structure 70 includes a first liquid supply pipe 73 and a first liquid outlet pipe 74, and the second heat transfer structure 80 includes a second liquid supply pipe 82 and a second liquid outlet pipe 83. One end of the second liquid supply pipe 82 is in communication with the second heat dissipation structure 20, and the other end of the second liquid supply pipe 82 is used to communicate with the heat exchanger. One end of the second liquid outlet pipe 83 is in communication with the second heat dissipation structure 20, and the other end of the second liquid outlet pipe 83 is in communication with one end of the first liquid supply pipe 73, and the other end of the first liquid supply pipe 73 is in communication with the first heat dissipation structure. One end of the first liquid outlet pipe 74 is in communication with the first heat dissipation structure, and the other end of the first liquid outlet pipe 74 is used to communicate with the heat exchanger. In this configuration, the first heat dissipation structure and the second heat dissipation structure are connected in series via the second outlet pipe 83 and the first supply pipe 73. The refrigerant is returned to the heat exchanger through the second supply pipe 82, the second heat dissipation structure 20, the second outlet pipe 83, the first supply pipe 73, the first heat dissipation structure, and the first outlet pipe 74, completing the heat dissipation to the second and first heat dissipation structures. Specifically, both the first outlet pipe 74 and the first supply pipe 73 can penetrate the side plate and communicate with the first heat dissipation structure.

[0052] Figure 15 is a schematic diagram of yet another structure of a heat dissipation device according to an embodiment of the present application. Referring to Figure 15, the first heat transfer structure 70 includes a first liquid supply pipe 73 and a first liquid outlet pipe 74, and the second heat transfer structure 80 includes a second liquid supply pipe 82 and a second liquid outlet pipe 83. One end of the first liquid supply pipe 73 penetrates the side plate and communicates with the first heat dissipation structure, the other end of the first liquid supply pipe 73 communicates with the second heat dissipation structure 20, one end of the first liquid outlet pipe 74 communicates with the first heat dissipation structure, and the other end of the first liquid outlet pipe 74 communicates with the second heat dissipation structure 20. One end of the second liquid supply pipe 82 communicates with the second heat dissipation structure 20, and the other end of the second liquid supply pipe 82 is used to communicate with the heat exchanger. One end of the second liquid outlet pipe 83 communicates with the second heat dissipation structure 20, and the other end of the second liquid outlet pipe 83 communicates with the heat exchanger. In this system, the refrigerant enters the second heat dissipation structure 20 through the second liquid supply pipe 82, the first liquid supply pipe 73 communicates with the second heat dissipation structure 20 and transports the refrigerant to the first heat dissipation structure, and the first liquid outlet pipe 74 recirculates the refrigerant that has absorbed heat in the first heat dissipation structure back to the second heat dissipation structure 20, and further recirculates it back to the heat exchanger through the second liquid outlet pipe 83.

[0053] In some embodiments, the size of the second heat dissipation structure is large, and each second heat dissipation structure may be connected to the top plate of multiple cases, and the multiple cases are arranged with intervals between them, and each first heat dissipation structure in each case is in communication with the second heat dissipation structure 20 via a first liquid supply pipe 73 and a first liquid outlet pipe 74.

[0054] In one embodiment, the first liquid supply pipe 73, the first liquid outlet pipe 74, the second liquid supply pipe 82, and the second liquid outlet pipe 83 may all be hoses.

[0055] This application further provides a heat dissipation system comprising a heat exchanger and a plurality of heat dissipation devices, the plurality of heat dissipation devices being installed sequentially at intervals, and both a first heat transfer structure and a second heat transfer structure included in each heat dissipation device being connected to the heat exchanger. In this installation method, when the insertion terminals of an optical module are inserted into each heat dissipation device, both the second heat dissipation structure and the first heat dissipation structure can be moved within each heat dissipation device, thus ensuring that the heat dissipation system can be applied to optical modules having insertion terminals of different sizes, and further improving the applicability of the heat dissipation system.

[0056] This application is, Optical module heat dissipation equipment Further providing the above Optical module heat dissipation equipment This includes a heat dissipation device and One or more The optical module includes a body and a socket terminal connected to the body, the socket terminal being inserted into a first sub-encompassing cavity and a second sub-encompassing cavity included in the heat dissipation device. In this configuration, heat generated from the socket terminal of the optical module can be rapidly dissipated, improving the service life of the optical module.

[0057] Clearly, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of the embodiments of the present invention. Thus, the present invention is intended to include these modifications and variations to the embodiments of the present invention if such modifications and variations fall within the scope of the claims of the present invention and the equivalent art. [Explanation of Symbols]

[0058] 10-Case, 11-Bottom plate, 12-Top plate, 13-Side plate, 130-First side plate, 131-Second side plate, 14-First sub-encompassing cavity, 15-Second sub-encompassing cavity, 20-Second heat dissipation structure, 21-Second heat dissipation motherboard, 22-Second heat dissipation fin group, 30-Partition assembly, 31-Partition plate, 310-First opening, 311-First elastic member, 312-First plate body, 313-Second plate body, 314-Third plate body, 32-Partition side plate, 320-Connecting plate, 321-Mounting plate, 322-Stopper opening 40-First heat dissipation structure, 41-First heat dissipation motherboard, 42-Contact plate, 43-First heat dissipation fin group, 44-Liquid cooling heat sink, 50-First elastic clamp member, 60-Second elastic clamp member, 70-First heat transfer structure, 71-Heat transfer substrate, 72-First heat conduction tube, 720-First tube body, 721-Second tube body, 722-Flexible connecting tube body, 73-First liquid supply tube, 74-First liquid outlet tube, 80-Second heat transfer structure, 81-Second heat conduction tube, 82-Second liquid supply tube, 83-Second liquid outlet tube, 90-Engagement assembly.

Claims

1. A heat dissipation device comprising one or more cases, one or more partition assemblies, one or more first heat dissipation structures, and one or more first heat transfer structures, The case comprises a housing cavity with one end open, the one or more partition assemblies located within the housing cavity, and the one or more partition assemblies are used to divide the housing cavity into a first sub-housing cavity and one or more second sub-housing cavities. The one or more first heat dissipation structures are located within the one or more second sub-accommodating cavities, and One end of the first heat transfer structure is connected to the first heat dissipation structure, and the other end of the first heat transfer structure penetrates the case and exchanges heat with a heat exchanger. Here, the first heat transfer structure includes a first heat conduction tube having a flattened shape, one end of the first heat conduction tube is connected to the first heat dissipation structure, and the other end of the first heat conduction tube is used to connect to the heat exchanger. The heat dissipation device further includes a second heat dissipation structure and a second heat transfer structure connected to the second heat dissipation structure. The second heat transfer structure includes a second liquid supply pipe and a second liquid outlet pipe, A heat dissipation device wherein one end of the second liquid supply pipe communicates with the second heat dissipation structure, the other end of the second liquid supply pipe is used to communicate with the heat exchanger, and one end of the second liquid outlet pipe communicates with the second heat dissipation structure.

2. The heat dissipation device according to claim 1, wherein the case includes a bottom plate, a top plate, and side plates, the side plates being used to connect the top plate and the bottom plate, and the housing cavity being formed so as to be surrounded by the top plate, the bottom plate, and the side plates.

3. The heat dissipation device according to claim 2, wherein the other end of the first heat transfer structure is connected to the heat exchanger by passing through the side plate.

4. The heat dissipation device according to claim 2, wherein the second heat dissipation structure is connected to the side of the top plate away from the bottom plate, and each partition assembly is used to mount one of the first heat dissipation structures.

5. The first heat transfer structure includes a first liquid supply pipe and a first liquid outlet pipe, one end of the first liquid supply pipe passing through a side plate and communicating with the first heat dissipation structure, the other end of the first liquid supply pipe being used to communicate with a heat exchanger, one end of the first liquid outlet pipe passing through the case and communicating with the first heat dissipation structure, the other end of the first liquid outlet pipe being used to communicate with a heat exchanger, or The other end of the second liquid supply pipe is in communication with the first heat dissipation structure, or The other end of the second outlet pipe communicates with one end of the first outlet pipe, one end of the first supply pipe communicates with the first heat dissipation structure, one end of the first outlet pipe penetrates the case and communicates with the first heat dissipation structure, and the other end of the first supply pipe is used to communicate with the heat exchanger, or One end of the first liquid supply pipe penetrates the case and communicates with the first heat dissipation structure, the other end of the first liquid supply pipe communicates with the second heat dissipation structure, one end of the first liquid outlet pipe penetrates the case and communicates with the first heat dissipation structure, the other end of the first liquid outlet pipe communicates with the second heat dissipation structure, and The heat dissipation device according to claim 2, wherein the other end of the second outlet pipe is in communication with the heat exchanger.

6. The first heat dissipation structure can move toward or toward the bottom plate relative to the partition assembly, and the second heat dissipation structure can move toward or toward the bottom plate relative to the top plate, and The heat dissipation device according to any one of claims 2 to 5, wherein the one or more cases are a plurality, and the second heat dissipation structure is connected to top plates included in the plurality of cases.

7. The heat dissipation device according to claim 1, wherein the first heat transfer structure further includes a heat transfer substrate, the heat transfer substrate is connected to the first heat dissipation structure, one end of the first heat conduction tube is fixedly connected to one side of the heat transfer substrate, and the other end of the first heat conduction tube is connected to the heat exchanger.

8. The first heat conduction tube includes a first tube body and a second tube body communicating with each other, the first tube body and the heat transfer substrate are installed parallel to each other and are fixedly connected, the second tube body and the first tube body are installed at an angle, the second tube body is used to connect to the heat exchanger, or The heat dissipation device according to claim 7, wherein the first heat conduction tube includes a first tube body, a flexible connecting tube body, and a second tube body, the flexible connecting tube body is used to connect the first tube body and the second tube body, the first tube body is used to fix and connect to the heat transfer substrate, and the second tube body is used to connect to the heat exchange device.

9. A heat dissipation system comprising a heat exchanger and a plurality of heat dissipation devices according to any one of claims 1 to 5, wherein the plurality of heat dissipation devices are installed sequentially at intervals, and a first heat transfer structure and a second heat transfer structure included in each heat dissipation device are both connected to the heat exchanger.

10. Optical module heat dissipation device comprising a heat dissipation device according to any one of claims 1 to 5 and one or more optical modules, wherein the optical module comprises a body and an insertion terminal connected to the body, and the insertion terminal is inserted into a first sub-accommodation cavity and a second sub-accommodation cavity included in the heat dissipation device.

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