Optical module liquid cooling heat dissipation device with double elastic structure

Abstract

This invention relates to a liquid cooling heat dissipation device for optical modules with a dual-elastic structure, comprising a mounting cage and a liquid cooling plate. The liquid cooling plate and the mounting cage are fixed on a suitable PCB board. The liquid cooling plate has a bottom surface facing the optical module, and a protruding compression spring is provided on the bottom surface. The mounting cage has a mounting cavity for accommodating the optical module, and the top of the mounting cavity has an opening so that the compression spring can extend into the mounting cavity through the opening. At least one elastic support piece is provided at the bottom of the mounting cavity, and the elastic support piece is located below the optical module. After the optical module is inserted into the mounting cavity, the compression spring and the elastic support piece apply elastic forces to the optical module from the top and bottom directions, respectively, so that the optical module is subjected to bidirectional elastic clamping in the thickness direction by the compression spring and the elastic support piece, thereby maintaining a tight fit between the top surface of the optical module and the liquid cooling plate. This invention solves the problem of the optical module and the liquid cooling plate not fitting together due to the accumulation of tolerances such as the thickness tolerance of the optical module and the height tolerance of the mounting cavity, and significantly improves the heat conduction efficiency.

Description

Technical Field

[0001] This invention belongs to the field of optical module heat dissipation technology, specifically relating to an optical module liquid cooling heat dissipation device with a dual elastic structure. Background Technology

[0002] Optical modules are key components for converting optical signals to electrical signals and are widely used in high-speed, high-bandwidth transmission scenarios such as data centers and communication base stations. Among them, the eight-channel small form factor pluggable (OSFP) is a high-density, high-power optical module packaging form, and its heat dissipation design is directly related to the stability and reliability of the device operation.

[0003] Currently, the following traditional solutions are mainly used for heat dissipation of OSFP optical modules: 1. Air cooling: By increasing fan speed or enlarging the area of ​​heat sink fins, forced air convection is used to remove heat. However, with the continuous improvement of optical module integration and data transmission rate, chip power consumption has increased dramatically. Traditional air cooling solutions are limited by air thermal conductivity and space size, making it difficult to meet the heat dissipation requirements of high-power chips, which can easily lead to module overheating, frequency reduction, or failure.

[0004] 2. Liquid Cooling: To overcome the bottleneck of air cooling capacity, the industry has gradually introduced liquid cooling technology, which mainly includes the following two implementation methods: 2.1 Indirect heat conduction liquid cooling: The optical module contacts the cold plate through a heat pipe. Heat is first transferred to the heat pipe and then to the liquid cooling plate. This solution has a long heat conduction path and passes through multiple contact interfaces, resulting in high overall thermal resistance and low heat dissipation efficiency, making it difficult to cope with ultra-high power consumption scenarios. 2.2 Integrated Liquid Cooling: The integrated liquid cooling plate's heat dissipation device is rigidly connected to the mounting cage of the optical module, allowing the optical module to contact the liquid cooling plate during operation to conduct heat. However, due to manufacturing tolerances and thermal deformation during equipment operation, the rigid connection structure cannot effectively compensate for these dimensional changes, often resulting in poor contact between the optical module and the liquid cooling plate, creating local gaps and severely reducing thermal conductivity. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a liquid cooling heat dissipation device for optical modules with a dual elastic structure. By setting an elastic support plate at the bottom of the mounting cage and a compression spring plate on the bottom surface of the liquid cooling plate, a dual elastic structure is formed, which enables adaptive compensation for the optical modules in both vertical and horizontal directions. This allows each optical module to float independently, effectively avoiding the problem of the optical modules and the cooling plate not fitting together due to the accumulation of tolerances such as the thickness tolerance of the optical modules and the height tolerance of the cavity.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a liquid cooling heat dissipation device for an optical module with a dual elastic structure, comprising a mounting cage and a liquid cooling plate, wherein the mounting cage and the liquid cooling plate are fixed on a matching PCB board, the liquid cooling plate has a bottom surface facing the mounting cage, and a compression spring sheet protruding from the bottom surface is provided on the bottom surface. The mounting cage has a mounting cavity for accommodating the optical module. The top surface of the mounting cavity has an opening so that the compression spring can extend into the mounting cavity through the opening. The bottom surface of the mounting cavity has at least one elastic support piece, which is located below the optical module. After the optical module is inserted into the mounting cavity, the compression spring and the elastic support plate apply elastic force to the optical module from the top and bottom directions respectively, so that the optical module is subjected to bidirectional elastic clamping of the compression spring and the elastic support plate in the thickness direction, so as to keep the top surface of the optical module in close contact with the liquid cooling plate.

[0007] Its beneficial effects are: In this invention, the bidirectional elastic design of the bottom elastic support sheet and the top compression spring sheet enables synchronous adaptive compensation for the optical module in both the upper and lower directions. This allows any dimensional fluctuations in the thickness direction of the optical module to be absorbed by the dual elastic structure and converted into stable contact pressure, ensuring that the top surface of the optical module remains in close contact with the liquid cooling plate and improving the heat dissipation efficiency of the optical module.

[0008] Meanwhile, the optical module is directly pressed against the liquid cooling plate spring, and heat is transferred to the liquid cooling plate through the shortest path, which significantly reduces the contact thermal resistance and can meet the heat dissipation requirements of high-power OSFP optical modules.

[0009] Furthermore, the compression spring is an arched structure that protrudes towards the mounting cavity. The length direction of the arched structure is consistent with the insertion direction of the optical module, and the lowest point of the arched structure is lower than the top surface of the mounting cavity.

[0010] Its beneficial effects are as follows: the length direction of the arched structure is consistent with the insertion direction of the optical module, that is, the arched structure extends along the insertion and removal direction. When the optical module is inserted into the mounting cavity, the front end of the optical module first contacts the arched starting end of the pressure spring. As the insertion action proceeds, the optical module gradually pushes the pressure spring upward and compresses it. Because the arched structure extends along the insertion and removal direction, the side of the pressure spring is parallel to the insertion and removal direction of the optical module, thereby avoiding interference of the side of the pressure spring with the insertion path of the optical module and ensuring that the optical module can be inserted smoothly.

[0011] Furthermore, an elastic thermally conductive layer is filled in the gap between the compression spring sheet and the bottom surface of the liquid cooling plate.

[0012] Its beneficial effects are: the elastic thermal conductive layer fills the gap between the pressure spring and the liquid cooling plate. When the pressure spring is pushed up and compressed by the optical module, the elastic thermal conductive layer will undergo elastic deformation. On the one hand, it fills the gap between the pressure spring and the liquid cooling plate, forming a continuous heat conduction path. On the other hand, the rebound force of the elastic thermal conductive layer and the elastic force of the pressure spring are superimposed and work together on the top of the optical module, enhancing the contact pressure.

[0013] Furthermore, the elastic thermally conductive layer is a thermally conductive silicone grease, thermally conductive gel, or thermally conductive pad.

[0014] Its beneficial effect is that those skilled in the art can select appropriate materials as the elastic thermal conductive layer as needed.

[0015] Furthermore, multiple elastic support plates are provided and are evenly distributed on the bottom surface of the mounting cavity.

[0016] Its beneficial effects are: multiple elastic support plates are evenly distributed at the bottom of the mounting cavity, so that the bottom of the optical module is evenly stressed when it is subjected to upward support force, avoiding deformation of the optical module shell or damage to internal precision components due to single-point support or uneven force. While ensuring good heat dissipation, it also ensures the structural integrity and long service life of the optical module.

[0017] Furthermore, the elastic support sheet is inclined, and the upper surface of the elastic support sheet gradually rises along the insertion direction of the optical module.

[0018] Its beneficial effects are: this design allows the optical module to smoothly and gradually compress the elastic support plate during insertion, which not only reduces insertion resistance and avoids jamming, but also allows the compression of the elastic support plate to automatically adjust with the insertion depth, ensuring that the optical module can provide stable and consistent elastic support force after it is in place. At the same time, the inclined upper surface of the elastic support plate and the arched surface of the compression spring can also serve as guide surfaces to guide the insertion of the optical module.

[0019] Furthermore, the elastic support plate and the mounting cage are an integral structure.

[0020] Its beneficial effects are: it can be formed in one step through stamping process without additional assembly process, which not only improves structural strength and production efficiency, but also reduces manufacturing costs, while avoiding performance instability caused by loose assembly.

[0021] Furthermore, the mounting cage has a mounting layer on which a plurality of mounting cavities are spaced apart.

[0022] Its beneficial effects are: by setting multiple mounting cavities at intervals on a single mounting layer, multiple optical modules can be installed side by side and centrally dissipated, which improves space utilization and the integration of heat dissipation devices, and is suitable for equipment scenarios with high-density port configurations.

[0023] Furthermore, fixing blocks are provided at both ends of the liquid cooling plate along its length, and the fixing blocks are used to fix and connect with the PCB board.

[0024] Its beneficial effects are: the liquid cooling plate is connected to the PCB board through the fixing blocks at both ends, which not only ensures the stability of the liquid cooling plate installation, but also avoids a direct rigid connection between the liquid cooling plate and the mounting cage, maintaining the independent installation state of the two.

[0025] Furthermore, the mounting cage has an upper mounting layer and a lower mounting layer arranged vertically, and a plurality of mounting cavities are provided at intervals on each mounting layer; the liquid cooling plate includes an upper liquid cooling plate located above the upper mounting layer and a lower liquid cooling plate located above the lower mounting layer, and the upper surface of the lower liquid cooling plate is in contact with the bottom surface of the upper mounting layer.

[0026] Its beneficial effects are: through the upper and lower double-layer mounting cavity and the corresponding upper and lower liquid cooling plate design, vertical optical module stacking is realized, which greatly improves the port density; the upper surface of the lower liquid cooling plate is in close contact with the bottom surface of the upper mounting layer, forming an interlayer heat conduction path, so that the heat generated by the optical module of the upper mounting layer can also be conducted downward to the lower liquid cooling plate, optimizing the overall heat dissipation effect of the multi-layer structure.

[0027] Furthermore, lower fixing blocks are provided at both ends of the lower liquid cooling plate along its length, and the lower fixing blocks are used to fix and connect with the PCB board; upper fixing blocks are provided at both ends of the upper liquid cooling plate along its length, and the upper fixing blocks are used to connect with the lower fixing blocks.

[0028] Its advantages are: the upper liquid cooling plate is connected to the lower fixing block through the upper fixing block, rather than being directly fixed to the PCB board. This layer-by-layer fixing method not only ensures the positioning accuracy of the upper and lower liquid cooling plates, but also avoids increasing the overall size and taking up space on the PCB board. At the same time, it facilitates layered installation and maintenance.

[0029] The beneficial effects of this invention are: 1. In this invention, both the liquid cooling plate and the mounting cage are connected to the PCB board, eliminating the need for additional rigid connections and simplifying assembly. However, this installation method introduces new problems: the flatness error of the PCB board itself, the installation position deviation of the liquid cooling plate and the mounting cage, and the respective fit tolerances between the two and the PCB board all accumulate and ultimately manifest as gaps or interference between the liquid cooling plate's pressure spring and the top of the optical module. This invention addresses these issues by setting an elastic support plate at the bottom of the mounting cavity of the mounting cage and a pressure spring on the bottom surface of the liquid cooling plate. Through the bidirectional elastic design of the bottom elastic support plate and the top pressure spring, synchronous adaptive compensation is achieved in both the vertical and horizontal directions of the optical module. This allows any dimensional fluctuations in the thickness direction of the optical module to be absorbed by the dual elastic structure and converted into stable contact pressure, ensuring a tight fit between the top surface of the optical module and the liquid cooling plate. This solves the problem of the optical module and the cooling plate failing to fit due to the accumulation of tolerances such as the thickness dimensional tolerances and cavity height dimensional tolerances, thereby ensuring good heat dissipation efficiency.

[0030] 2. The elastic support sheet and compression spring sheet of the present invention can generate bidirectional elastic force on the optical module, so that the optical module is in a "suspended clamping" state in the mounting cavity. In addition to being able to float adaptively, it can also absorb kinetic energy by relying on the buffering effect of the upper and lower elasticity when the equipment is subjected to vibration or impact, avoiding rigid collision between the optical module and the mounting cavity, and significantly improving the working reliability of the optical module under complex working conditions.

[0031] 3. Compared with the indirect heat conduction liquid cooling method in the existing technology, the present invention uses the bottom elastic support plate to directly press the optical module against the liquid cooling plate pressure spring plate. The heat conduction path is extremely short, which can dissipate heat from the optical module in time, avoid the accumulation of heat affecting the quality of signal transmission, and also avoid affecting the safety of the equipment.

[0032] 3. The elastic support plates are usually arranged in a parallel or symmetrical structure to ensure uniform force distribution at the bottom of the optical module. This distributed support not only provides a stable pushing force but also avoids the risk of deformation of the optical module shell or damage to internal precision components due to excessive local stress. While achieving efficient heat dissipation, it also ensures the long-term reliability and structural integrity of the optical module. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the liquid cooling heat dissipation device for the optical module in Example 1; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 This is a schematic diagram of the liquid cooling plate structure of the optical module liquid cooling heat dissipation device in Example 1; Figure 4 This is a view of the liquid cooling plate in Example 1, perpendicular to the insertion / removal direction of the optical module; Figure 5 This is a schematic diagram of the liquid cooling heat dissipation device for the optical module in Example 2; The markings in the diagram are: 1. Mounting cage, 2. Liquid cooling plate, 3. Fixing block, 4. Mounting cavity, 5. Elastic support plate, 6. Compression spring, 7. Elastic heat-conducting layer, 8. Upper liquid cooling plate, 9. Upper mounting layer, 10. Lower liquid cooling plate, 11. Lower mounting layer, 12. Upper fixing block, 13. Lower fixing block, 14. Welding pin, 15. Fixing hole, 16. Threaded hole, 17. Screw. Detailed Implementation

[0034] The present invention will be further described in detail below with reference to the embodiments, but this should not be construed as limiting the invention in any way. Example 1

[0035] like Figure 1-3 As shown, a liquid cooling heat dissipation device for optical modules includes a mounting cage 1 and a liquid cooling plate 2. In this embodiment, the mounting cage 1 is a single-layer structure, i.e., it has a mounting layer with multiple mounting cavities 4 spaced apart along its length. Each mounting cavity 4 houses an optical module (not shown in the figure). In this embodiment, there are eight mounting cavities 4. The top of each mounting cavity 4 has an opening so that the top surface of the optical module inside the mounting cavity 4 can be in close contact with the liquid cooling plate 2, thereby better conducting heat to the liquid cooling plate 2. The bottom surface of each mounting cavity 4 has one or more elastic support plates 5, which are located below the optical module.

[0036] The liquid cooling plate 2 has a bottom surface facing the optical module, and a pressure spring 6 protruding from the bottom surface is provided on the bottom surface. The shape and size of the pressure spring 6 are adapted to the opening at the top of the mounting cavity 4 so that the pressure spring 6 can extend downward into the mounting cavity 4 and make contact with the optical module therein.

[0037] After the optical module is inserted into the mounting cavity 4, the bidirectional elastic design of the bottom elastic support plate 5 and the top compression spring plate 6 generates a bidirectional elastic force on the optical module, allowing it to be in a "floating clamping" state within the mounting cavity 4. This ensures that the top of the optical module is in close contact with the liquid cooling plate 2, guaranteeing excellent heat conduction efficiency. Furthermore, in addition to the optical module's adaptive floating capability, the upper and lower elasticity also absorbs kinetic energy when the equipment is subjected to vibration or impact, preventing rigid collisions between the optical module and the mounting cavity 4. This significantly improves the reliability of the optical module under complex operating conditions.

[0038] Preferred, such as Figure 4As shown, the pressure spring 6 is disposed on the bottom surface of the liquid cooling plate 2, and has an overall downward convex arched structure. The arched direction of the arched structure extends along the insertion and removal direction of the optical module, that is, the length direction of the arched structure is consistent with the insertion direction of the optical module, so that the pressure spring 6 has a downward convex arc shape in the cross-section perpendicular to the insertion and removal direction of the optical module.

[0039] By configuring the pressure spring 6 as an arched structure extending along the insertion / removal direction, when the optical module is inserted into the mounting cavity 4, the front end of the optical module first contacts the arched starting end of the pressure spring 6. As the insertion proceeds, the optical module gradually pushes the pressure spring 6 upward and compresses it. Because the arched structure extends along the insertion / removal direction, the side of the pressure spring 6 will not form a protrusion or obstruction in the optical module's insertion / removal direction, thereby avoiding interference of the pressure spring 6 with the optical module's insertion path and ensuring smooth insertion of the optical module.

[0040] The lowest point of the arched structure of the compression spring 6 is lower than the top surface of the mounting cavity 4, so that the compression spring 6 can partially extend into the mounting cavity 4 and elastically contact the top surface of the inserted optical module.

[0041] Furthermore, such as Figure 2 As shown, the elastic support piece 5 is inclined, and its upper surface gradually rises along the insertion direction of the optical module to form an inclined surface that guides the insertion of the optical module. Therefore, in addition to providing an elastic force to press the optical module against the liquid cooling plate 2, the elastic support piece 5 also guides the insertion of the optical module. Moreover, the arched design of the compression spring 6 also serves to guide the insertion of the optical module.

[0042] In this embodiment, multiple elastic support plates 5 are provided and evenly distributed at the bottom of the mounting cavity 4, for example, they can be arranged side by side or symmetrically. This distributed design ensures that the bottom of the optical module is subjected to uniform force. In other embodiments, the elastic support plate 5 can also be provided as a single one, in which case it is preferable to place the elastic support plate 5 at the center of the mounting cavity 4.

[0043] Preferably, the elastic support piece 5 and the cage body of the mounting cage 1 are designed as a single unit, which can be integrally formed by stamping, hardly increasing the manufacturing cost and not changing the standard interface size of the optical module, and can be directly applied to existing equipment.

[0044] In this embodiment, both the mounting cage 1 and the liquid cooling plate 2 are fixedly connected to the matching PCB board.

[0045] like Figure 1 , 3As shown, fixing blocks 3 are provided at both ends of the liquid cooling plate 2 along its length. Fixing holes 15 are provided on the fixing blocks 3; these holes are open-circuit holes. Screws pass through the fixing holes 15 to connect the fixing blocks 3 to the appropriate PCB board, thus achieving a fixed connection between the fixing blocks 3 and the PCB board. Preferably, the lower surface of the fixing blocks 3 rests on the PCB board, making the connection more reliable.

[0046] Furthermore, the bottom of the mounting cage 1 is provided with soldering pins 14 for connecting to the PCB board, and the two end faces of the mounting cage 1 in the length direction are clearance-fitted with the fixing block 3 on the same side.

[0047] As a preferred embodiment of this example, Figure 4 As shown, the gap between the pressure spring 6 and the bottom surface of the liquid cooling plate 2 is also filled with thermally conductive silicone grease, thermally conductive gel, or thermally conductive pads, serving as a compressible elastic thermally conductive layer 7. When the pressure spring 6 is compressed by the optical module, the elastic thermally conductive layer 7 undergoes elastic deformation. On the one hand, it fills the gap between the pressure spring 6 and the liquid cooling plate 2, forming a continuous heat conduction path; on the other hand, the rebound force of the elastic thermally conductive layer 7 and the elastic force of the pressure spring 6 are superimposed, acting together on the top of the optical module to enhance the contact pressure. Example 2

[0048] The difference between this embodiment and Embodiment 1 is that the installation cage 1 in Embodiment 1 is a single-layer cage, while the installation cage 1 in this embodiment is a double-layer cage. The specific structure is as follows: Figure 5 As shown, the mounting cage 1 has two mounting layers: an upper mounting layer 9 and a lower mounting layer 11. Each layer has the same number of mounting cavities 4. For example, in this embodiment, each layer has 8 mounting cavities 4, and the mounting cavities 4 of the upper and lower layers are arranged vertically and vertically. Each mounting cavity 4 contains an elastic support piece 5 as described in Embodiment 1. The liquid cooling plate 2 includes an upper liquid cooling plate 8 located above the upper mounting layer 9 and a lower liquid cooling plate 10 located above the lower mounting layer 11, and the upper surface of the lower liquid cooling plate 10 is in contact with the bottom surface of the upper mounting layer 9.

[0049] The lower liquid cooling plate 10 has lower fixing blocks 13 at both ends along its length. The lower fixing blocks 13 have fixing holes 15 and threaded holes 16. The fixing holes 15 are open holes. Screws 17 pass through the fixing holes 15 and connect to the corresponding PCB board to achieve a fixed connection between the lower fixing blocks 13 and the PCB board. The upper liquid cooling plate 8 has upper fixing blocks 12 at both ends along its length. The upper fixing blocks 12 have fixing holes 15. The fixing holes 15 are open holes. Screws 17 pass through the fixing holes 15 and connect to the corresponding threaded holes below to achieve a connection between the upper fixing blocks 12 and the lower fixing blocks 13.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Those skilled in the art should understand that modifications or equivalent substitutions can be made to the specific implementation of the present invention with reference to the above embodiments. Any modifications or equivalent substitutions that do not depart from the spirit and scope of the present invention are within the protection scope of the pending claims.

Claims

1. A liquid cooling heat dissipation device for an optical module with a dual elastic structure, comprising a mounting cage (1) and a liquid cooling plate (2), wherein the mounting cage (1) and the liquid cooling plate (2) are fixed on a suitable PCB board, characterized in that, The liquid cooling plate (2) has a bottom surface facing the mounting cage (1), and a compression spring (6) protruding from the bottom surface is provided on the bottom surface. The mounting cage (1) is provided with a mounting cavity (4) for accommodating the optical module. The top surface of the mounting cavity (4) is provided with an opening so that the compression spring (6) can extend into the mounting cavity (4) through the opening. The bottom surface of the mounting cavity (4) is provided with at least one elastic support piece (5), which is located below the optical module. After the optical module is inserted into the mounting cavity (4), the compression spring (6) and the elastic support plate (5) apply elastic force to the optical module from the top and bottom directions respectively, so that the optical module is subjected to bidirectional elastic clamping by the compression spring (6) and the elastic support plate (5) in the thickness direction, so as to keep the top surface of the optical module in close contact with the liquid cooling plate (2).

2. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1, characterized in that, The compression spring (6) is an arched structure that protrudes toward the mounting cavity (4). The length direction of the arched structure is consistent with the insertion direction of the optical module, and the lowest point of the arched structure is lower than the top surface of the mounting cavity (4).

3. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1 or 2, characterized in that, An elastic thermally conductive layer (7) is filled in the gap between the compression spring (6) and the bottom surface of the liquid cooling plate (2).

4. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 3, characterized in that, The elastic thermally conductive layer (7) is thermally conductive silicone grease, thermally conductive gel, or thermally conductive pad.

5. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1, characterized in that, Multiple elastic support plates (5) are provided and are evenly distributed on the bottom surface of the mounting cavity (4).

6. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1, characterized in that, The elastic support sheet (5) is inclined, and the upper surface of the elastic support sheet (5) gradually rises along the insertion direction of the optical module.

7. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1, characterized in that, The elastic support plate (5) and the mounting cage (1) are an integral structure.

8. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1, characterized in that, The mounting cage (1) has a mounting layer, on which a plurality of mounting cavities (4) are spaced apart.

9. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 8, characterized in that, The liquid cooling plate (2) has fixing blocks (3) at both ends along its length, and the fixing blocks (3) are used to fix and connect with the PCB board.

10. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 1, characterized in that, The mounting cage (1) has an upper mounting layer (9) and a lower mounting layer (11) arranged vertically, and a plurality of mounting cavities (4) are provided at intervals on each mounting layer; the liquid cooling plate (2) includes an upper liquid cooling plate (8) located above the upper mounting layer (9) and a lower liquid cooling plate (10) located above the lower mounting layer (11), and the upper surface of the lower liquid cooling plate (10) is in contact with the upper mounting layer (9).

11. The optical module liquid cooling heat dissipation device with a dual elastic structure according to claim 10, characterized in that, The lower liquid cooling plate (10) has lower fixing blocks (13) at both ends along its length, which are used to fix it to the PCB board; the upper liquid cooling plate (8) has upper fixing blocks (12) at both ends along its length, which are used to connect to the lower fixing blocks (13).

Images