A substrate transfer mechanism that reduces contact with the substrate on the back side.

Abstract

To solve the problem that particles resulting from contact can contaminate a chamber, substrate, or subsequent substrates, all of which reduce yield, and to provide an improved method and apparatus for reducing particles to transport substrates in a tool.SOLUTION: A substrate processing system includes a substrate input / output chamber 122 connected to a transport chamber 136, and one or more processing chambers connected to the transport chamber, the substrate input / output chamber includes a plurality of stacked carrier holders, and one of the carrier holders 204A and 204B contains carriers 206 that support the substrate.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001]

[0001] This disclosure generally relates to methods and apparatuses for transferring substrates within a processing tool. More specifically, this disclosure relates to methods and apparatuses for transferring substrates within one or more chambers of a processing tool.

Background Art

[0002]

[0002] Very large scale integration (ULSI) circuits can include over one million electronic devices (e.g., transistors) formed on a semiconductor substrate such as a silicon (Si) substrate that cooperate to perform various functions within the device.

[0003]

[0003] Many conventional heat treatments are commonly used in the manufacture of transistors and other electronic devices. These processes are typically performed within a tool having multiple chambers (e.g., a cluster tool). To achieve the desired yield, the most attention is paid to the generation of particles and / or damage to the substrate during these processes. However, one cause of particles and / or damage is during substrate transfer, i.e., when the substrate is being moved inside a particular processing chamber on the tool or when the substrate is being moved from one chamber of the tool to another chamber of the tool.

[0004]

[0004] Conventional substrate lift pins that contact the back side of the substrate during transfer (i.e., the side opposite the deposition receiving surface) have been found to be one cause of particles and / or substrate damage. For example, when the substrate contacts the lift pin, the substrate may be damaged and / or particles may be generated from the contact. The particles generated by the contact can potentially contaminate the chamber, the substrate, or subsequent substrates, all of which reduce the yield.

[0005]

[0005] Therefore, there is a need for improved methods and apparatuses for transferring substrates within a tool.

Summary of the Invention

[0006]

[0006] The disclosure generally relates to methods and apparatus for transferring substrates within a processing tool. More specifically, the disclosure relates to methods and apparatus for transferring substrates within one or more chambers of a processing tool.

[0007]

[0007] In one embodiment, a substrate processing system is disclosed, which includes a substrate input / output chamber connected to a transfer chamber, and one or more processing chambers connected to the transfer chamber, the substrate input / output chamber including a plurality of stacked carrier holders, one of which includes a substrate carrier supporting a substrate.

[0008]

[0008] In another embodiment, a load lock chamber is disclosed which includes a platen with a heat transfer element embedded inside, a plurality of carrier holders positioned around the platen, a plurality of support members extending from each of the stacked carrier holders, and a carrier positioned on one of the support members of the stacked carrier holders.

[0009]

[0009] In another embodiment, a processing chamber is disclosed, which includes a susceptor having grooves, the grooves being formed in the processing chamber adjacent to the outer circumference of the processing chamber, and a substrate support structure including a plurality of carrier lift pins, each of which is received in an opening adjacent to the groove.

[0010]

[0010] To enable a detailed understanding of the above-described features of the Disclosure, a more specific description of the Disclosure, which has been briefly summarized above, can be obtained by referring to embodiments. Some of these embodiments are illustrated in the accompanying drawings. However, it should be noted that the accompanying drawings illustrate only typical embodiments of the Disclosure, as the Disclosure may also permit other equally effective embodiments, and therefore should not be considered to limit the scope of the Disclosure. [Brief explanation of the drawing]

[0011] [Figure 1] A schematic diagram of an exemplary processing apparatus suitable for implementing this disclosure is shown. [Figure 2] This is a cross-sectional view of a load lock chamber according to one embodiment of the present disclosure. [Figure 3A] An embodiment of a carrier holder within a load lock chamber is shown. [Figure 3B] These are isometric views of another embodiment of the first and second carrier holders. [Figure 4A] This figure shows the substrate transfer sequence between the factory interface, load lock chamber, and transfer chamber shown in Figure 1. [Figure 4B] This figure shows the substrate transfer sequence between the factory interface, load lock chamber, and transfer chamber shown in Figure 1. [Figure 4C] This figure shows the substrate transfer sequence between the factory interface, load lock chamber, and transfer chamber shown in Figure 1. [Figure 4D] This figure shows the substrate transfer sequence between the factory interface, load lock chamber, and transfer chamber shown in Figure 1. [Figure 4E] This figure shows the substrate transfer sequence between the factory interface, load lock chamber, and transfer chamber shown in Figure 1. [Figure 4F] This figure shows the substrate transfer sequence between the factory interface, load lock chamber, and transfer chamber shown in Figure 1. [Figure 4G] A diagram showing the substrate transfer sequence among the factory interface, load lock chamber, and transfer chamber in FIG. 1. [Figure 5A] A diagram of a cooling platen and other components associated with the cooling platen of the load lock chamber. [Figure 5B] A diagram of a cooling platen and other components associated with the cooling platen of the load lock chamber. [Figure 5C] A diagram of a cooling platen and other components associated with the cooling platen of the load lock chamber. [Figure 6] A schematic cross-sectional view of a part of the cooling platen and the carrier. [Figure 7A] A diagram showing details of the load lock chamber. [Figure 7B] A diagram showing details of the load lock chamber. [Figure 7C] A diagram showing details of the load lock chamber. [Figure 7D] A diagram showing details of the load lock chamber. [Figure 8] An enlarged cross-sectional view of a motor connected to a support plate via a flexible joint member. [Figure 9A] An isometric view of a load lock chamber showing details of the vacuum system. [Figure 9B] An isometric view of a load lock chamber showing details of the vacuum system. [Figure 10] A schematic cross-sectional view of a processing chamber according to an embodiment. [Figure 11] An isometric view of the susceptor in FIG. 10. [Figure 12] An enlarged cross-sectional view of a part of the susceptor and the carrier in FIG. 10.

MODE FOR CARRYING OUT THE INVENTION

[0012]

[0024] For ease of understanding, the same reference numbers are used to denote the same elements common to the figures, where possible. Even without further recitation, it is contemplated that elements and features of one embodiment can be beneficially incorporated into other embodiments.

[0013]

[0025] The present disclosure provides a method and apparatus for transferring a substrate within a processing tool. Specifically, the substrate is transferred using a substrate transfer mechanism that minimizes contact with the major surface of the substrate.

[0014]

[0026] FIG. 1 is a schematic top view of an exemplary processing system 100 including one embodiment of a substrate transfer mechanism suitable for implementing the present disclosure. Processing system 100 includes a substrate input / output chamber 122, a vacuum-tight processing platform 104, a factory interface 102, and a system controller 144. Substrate input / output chamber 122 may be a load lock chamber. In one embodiment, processing chamber 100 may be a CENTRA™ integrated processing system commercially available from Applied Materials, Inc. of Santa Clara, Calif. It is contemplated that other processing systems, including those from other manufacturers, may be adapted to obtain the advantages of the present disclosure.

[0015]

[0027] Platform 104 includes at least one substrate input / output chamber 122 coupled to a plurality of processing chambers 110, 112, 132, 128, 120, and a vacuum substrate transfer chamber 136. Two substrate input / output chambers 122 are shown in FIG. Factory interface 102 is connected to transfer chamber 136 by substrate input / output chamber 122.

[0016]

[0028] In one embodiment, the factory interface 102 includes at least one docking station 108 and at least one factory interface robot 114 to facilitate the transfer of substrates. The docking station 108 is configured to receive one or more forward-opening unified pods. Two FOUPs 106A and 106B are shown in the embodiment of Figure 1. The factory interface robot 114, having a blade 116 positioned at one end of the robot 114, is configured to transfer substrates from FOUPs 106A and 106B to the processing platform 104 for processing through the substrate input / output chamber 122.

[0017]

[0029] The substrate input / output chamber 122 has a first port connected to the factory interface 102 and a second port connected to the transfer chamber 136. The substrate input / output chamber 122 is connected to a pressure control system (not shown). The pressure control system pumps down and vents the substrate input / output chamber 122 to facilitate the passage of the substrate between the vacuum environment of the transfer chamber 136 and the substantial ambient (e.g., atmospheric) environment of the factory interface 102.

[0018]

[0030] The transfer chamber 136 houses a vacuum robot 130. The vacuum robot 130 has blades 134 capable of transferring the substrate 124 between the substrate input / output chamber 122 and the processing chambers 110, 112, 132, 128, and 120.

[0019]

[0031] The system controller 144 is connected to the processing system 100. The system controller 144 controls the operation of the system 100 by using direct control of the processing chambers 110, 112, 132, 128, and 120 of the system 100, or alternatively by controlling the processing chambers 110, 112, 132, 128, and 120 and the computer (or controller) associated with the system 100. In operation, the system controller 144 enables data collection and feedback from each chamber and the system controller 144 to optimize the performance of the system 100.

[0020]

[0032] The system controller 144 generally includes a central processing unit (CPU) 138, memory 140, and support circuitry 142. The CPU 138 may be one of any form of general-purpose computer processor available for use in industrial settings. The support circuitry 142 is conventionally connected to the CPU 138 and may include a cache, clock circuitry, input / output subsystems, power supply, etc. When software routines are executed by the CPU 138, they redirect the CPU 138 to the application-specific computer (controller) 144. The software routines may also be stored and / or executed by a second controller (not shown) located remotely from the system 100.

[0021]

[0033] Figure 2 is a cross-sectional view of a substrate input / output chamber 122 according to one embodiment of the present disclosure. The substrate input / output chamber 122 generally comprises a chamber body 202, a first carrier holder 204B, a second carrier holder 204A, a temperature control pedestal 240, and an optional heater module 270. The first carrier holder 204B and the second carrier holder 204A each include a substrate 124 supported by a carrier 206. The chamber body 202 may be made from a single material such as aluminum. The chamber body 202 includes a first side wall 208, a second side wall 210, a lateral wall 242 (only one is shown in Figure 2), and an upper section 214 and a lower section 216 defining the chamber space 218. A window (not shown) may be provided in the upper section 214 of the chamber body. The window is typically made of quartz. If a heater module 270 is included, the upper part 214 of the chamber body 202 is at least partially covered by the heater module 270.

[0022]

[0034] The pressure in the chamber space 218 can be controlled to evacuate the substrate input / output chamber 122 to substantially match the environment of the transfer chamber 136 and ventilate it to substantially match the environment of the factory interface 102. The chamber body 202 includes one or more vents 230 and pump passages 232. The flow within the substrate input / output chamber 122 during ventilation and exhaust is substantially laminar due to the location of the vents 230 and pump passages 232, and is configured to minimize particulate contamination.

[0023]

[0035] The pump passage 232 is connected to the vacuum pump 236. The vacuum pump 236 has low vibration, thereby minimizing disturbance to the substrate 124 positioned in holders 204B and 204A within the substrate input / output chamber 122, while minimizing the fluid path between the substrate input / output chamber 122 and the pump 236 to generally less than 3 feet, thereby improving pump-down efficiency and time.

[0024]

[0036] The first loading port 238 is located on the first side wall 208 of the chamber body 202, enabling the transfer of the substrate 124 between the substrate input / output chamber 122 and the factory interface 102. The first slit valve 244 selectively seals the first loading port 238, isolating the substrate input / output chamber 122 from the factory interface 102. The second loading port 239 is located on the second side wall 210 of the chamber body 202, enabling the transfer of the substrate 124 between the substrate input / output chamber 122 and the transfer chamber 136. A second slit valve 246, substantially similar to the first slit valve 244, selectively seals the second loading port 239, isolating the substrate input / output chamber 122 from the vacuum environment of the transfer chamber 136.

[0025]

[0037] The first carrier holder 204B is concentrically connected to (i.e., superimposed on) the second carrier holder 204A, which is located above the bottom 216 of the chamber. The carrier holders 204B and 204A are generally mounted on a support 220 connected to a shaft 282 that extends through the bottom 216 of the chamber body 202. Typically, each carrier holder 204B, 204A is configured to hold one substrate positioned on its respective carrier 206. The shaft 282 is connected to a lift mechanism 296 located outside the substrate input / output chamber 122. The lift mechanism 296 controls the raising of the carrier holders 204B and 204A within the chamber body 202. The bellows 284 is connected between the support 220 and the bottom 216 of the chamber body 202 and positioned around the shaft 282, thereby providing a flexible seal between the second carrier holder 204A and the bottom 216, preventing leakage from or into the chamber body 202 and facilitating the raising and lowering of the carrier holders 204B and 204A without compromising the pressure inside the substrate input / output chamber 122.

[0026]

[0038] The first carrier holder 204B is used to hold unprocessed substrates from the factory interface 102 on the first carrier 206, while the second carrier holder 204A is used to hold processed substrates (e.g., etched substrates) on the second carrier 206 returning from the transfer chamber 136.

[0027]

[0039] Figure 3A shows one embodiment of carrier holders 204B, 204A within a substrate input / output chamber 122. Carrier 206 is not shown in Figure 3A for clarity. The second carrier holder 204A is generally held above the bottom 216 of the chamber body 202 by a support 220. A first standoff 308 is positioned between the members 304, 306 to maintain the second carrier holder 204A at a distance from the support 220. A second standoff 310 is positioned between the first carrier holder 204B and the second carrier holder 204A to maintain a distance between them. When substrates are collected and piled on the carrier holders 204B, 204A, the standoffs 308, 310 allow the blades 134, 116 of the transfer and factory interface robots 130, 114 to pass between them. Each holder 204B, 204A may alternatively have an "L-shaped" configuration that incorporates a portion that maintains a separation relationship between the holders 204B, 204A and adjacent components of the substrate input / output chamber 122.

[0028]

[0040] Each carrier holder 204B, 204A includes a first member 304 and a second member 306. Each member 304, 306 includes a curved inner portion 312 having a lip 314 extending radially inward from there. The curved inner portion 312 is configured to allow the substrate 124 to rest on the lip 314. The curved inner portions 312 trap the substrate 124 between them, thereby preventing the substrate 124 from falling off the lip 314. The first member 304 faces the second member 306, with each curved inner portion 312 facing the other. The first member 304 and the second member 306 are on either side of the temperature control pedestal 240. The temperature control pedestal 240 is located in the center of the chamber 122 and protrudes from the bottom 216 of the chamber 122.

[0029]

[0041] Figure 3B is an isometric view of another embodiment of the first carrier holder 204B and the second carrier holder 204A. The first carrier holder 204B and the second carrier holder 204A are shown to support the carrier 206, respectively. A support member 320 is shown between the carrier 206 and the standoffs 308, 310. The carrier 206 may be manually moved into the board input / output chamber 122 to initialize the system. For example, the carrier 206 may be positioned on the standoffs 308, 310 by opening the top 214 (shown in Figure 2) or through one of the first loading port 238 or the second loading port 239. The positioning process will be described in detail below.

[0030]

[0042] Each support member 320 may be made of quartz material. Each support member 320 contacts the standoffs 308, 310 via interference fit or other suitable connection method. The standoffs 308, 310 may be made of a metallic material such as stainless steel. The standoffs 308, 310 may be separated by a pitch or distance 322 of about 1 inch. Each carrier 206 may be made of a ceramic material such as silicon carbide. The distance 324 between the top surface of the temperature control pedestal 240 and the bottom surface of the carrier 206 in the standoff 308 may be about 0.75 inches.

[0031]

[0043] Referring again to Figure 2, the temperature control pedestal 240 is connected to the bottom 216 of the chamber body 202 by a support 278 located in the center of the chamber 202. The support 278 may be hollow or may include passages that allow connections of fluids, electrical signals, sensors, etc., to the pedestal 240. The shaft 282 and the lift mechanism 296 are positioned around the periphery of the support 278.

[0032]

[0044] The temperature control pedestal 240 has a temperature control surface 292 for thermal control of a nearby substrate. The temperature control pedestal 240 includes a heat transfer element 286, which may be a circulating water jacket, a thermoelectric device such as a Peltier element, or other structures that may be used for temperature control of the temperature control surface 292. For example, the heat transfer element 286 may include one or more tubes located within the cooling platen 280 and fluidly connected to a cooling fluid source (not shown), thereby circulating the cooling fluid through the cooling platen 280.

[0033]

[0045] The support 220, to which the carrier holders 204B and 204A are connected, can be lowered to a first position in which the upper surface 292 of the cooling platen 280 is close to or in contact with a substrate supported by the second carrier holder 204A. In this first position, the cooling platen 280 can be used to regulate the temperature of a substrate placed on (or near) the cooling platen 280. For example, a substrate returning from processing can be cooled within the substrate input / output chamber 122 while the substrate input / output chamber 122 is being evacuated by supporting the substrate with the upper surface 292 of the cooling platen 280. Thermal energy is transferred from the substrate through the cooling platen 280 to the heat transfer element 286, thereby cooling the substrate. After the substrate has cooled, the carrier holders 204B and 204A can be raised toward the upper part 214 of the chamber body 202, thereby allowing robots 130 and 114 to access the substrate placed on the second substrate support 204A. Optionally, holders 204B and 204A may be lowered to a position where their upper surfaces 292 contact or are in close proximity to the substrate supported by the first carrier holder 204B. In this position, the cooling platen 280 may be used to thermally regulate and heat the substrate.

[0034]

[0046] Figures 4A to 4G are various diagrams illustrating the substrate transfer sequence between the factory interface 102, the substrate input / output chamber 122, and the transfer chamber 136 in Figure 1. Figure 4A is a schematic side view of the substrate input / output chamber 122, showing a first robot blade 400 extending through the first loading port 238 of the substrate input / output chamber 122. The first robot blade 400 is shown supporting an unprocessed substrate 405 from the factory interface 102 in Figure 1. The first robot blade 400 may be one of the blades 116 of the factory interface robot 114 shown in Figure 1.

[0035]

[0047] In addition to the first loading port 238, the substrate input / output chamber 122 includes a cooling platen 280, a second carrier holder 204A, a first carrier holder 204B, and a carrier 206 positioned on holders 204B and 204A via a support member 320. Furthermore, lift pins 410, one of which is shown in cross-section, extend through the cooling platen 280. Each lift pin 410 is connected to an actuator 411 that moves the lift pin 410 in the Z direction. A bellows assembly 416 is provided between the cooling platen 280 and the actuator 411. Multiple bushings 417 are also provided within the cooling platen 280 to facilitate the vertical movement of the lift pins 410 internally.

[0036]

[0048] Each lift pin 410 is configured to contact the edge of the underside of the substrate 405. Each lift pin 410 includes a tip 412 positioned at the end of the shaft 413. The tip 412 is made of a softer material than the material of the shaft 413. For example, the shaft 413 may be made from a metallic material such as stainless steel, while the tip 412 may be made from a polymer material. The softer material of the tip 412 prevents or minimizes scratches on the underside of the substrate 405. Exemplary materials for the tip 412 are fluoropolymers, including polytetrafluoroethylene (PTFE), fluorinated ethylene propylene (FEP), perfluoroalkoxy (PFA), or other suitable plastic materials. The tip 412 may be designed to connect to each shaft 413 through an interference fit. In the embodiment shown in Figure 4A, the tip 412 includes a projection 414 that fits snugly into a recess 415 formed in the shaft 413.

[0037]

[0049] The first robot blade 400 extends into the substrate input / output chamber 122 through the first loading port 238 in the X direction. The first robot blade 400 is programmed to position the substrate 405 concentrically with the carrier 206 located on the second carrier holder 204A.

[0038]

[0050] Figures 4B and 4C are schematic cross-sectional views of the substrate input / output chamber 122 when the first robot blade 400 is positioned as shown in Figure 4A. In addition to the first robot blade 400, carrier 206, and substrate 405, a heat transfer element 286 is more clearly shown inside the cooling platen 280. A cover plate 428 can be used to seal the heat transfer element 286 inside the cooling platen 280. The cover plate 428 may be circular and may be made from aluminum.

[0039]

[0051] Referring again to Figure 4A, the minimum clearance between the first robot blade 400 and any other components in the substrate input / output chamber 122 is approximately 0.12 inches during this transfer process. For example, the distance 440 between the lower surface of the support member 320 and the upper surface of the substrate 405 is approximately 0.12 inches, the distance 442 between the upper surface of the substrate 405 and the surface of the first loading port 238 is approximately 0.16 inches, the distance 444 between the lower surface of the substrate 405 and the upper surface of the tip 412 is approximately 0.2 inches, and the distance 446 between the upper surface of the tip 412 and the upper surface of the cooling platen 280 is approximately 0.60 inches or greater.

[0040]

[0052] Figure 4D is a schematic side view showing another part of the transfer process discussed in the description of Figures 4A to 4C. Figure 4D shows the substrate 405 transferred from the first robot blade 400 to the lift pin 410. The transfer of the substrate 405 to the lift pin 410 can be achieved by the vertical movement (Z direction) of the first robot blade 400. In this position, the distance 448 between the top surface of the first robot blade 400 and the bottom surface of the substrate 405 may be about 0.2 inches. The distance 450 between the bottom surface of the first robot blade 400 and the top surface of the carrier 206 may be about 0.13 inches in this position. In this position, the first robot blade 400 can be withdrawn from the substrate input / output chamber 122.

[0041]

[0053] Figure 4E is a schematic side view showing another part of the transfer process discussed in the description of Figures 4A to 4D. Figure 4E shows the substrate 405 being transferred from the lift pin 410 to the carrier 206 positioned on the second carrier holder 204A. In this figure, the support 220 (shown in Figure 2), which moves the holders 204B and 204A in the Z direction, is at its highest position. The highest position of the support 220 causes both holders 204B and 204A to be raised toward the upper part 214. Furthermore, the retraction (lowering in the Z direction) of the lift pin 410 allows the second robot blade 452 to enter the second loading port 239 from the transfer chamber 136, as shown in Figure 2. The second robot blade 452 may be the blade 134 of the vacuum robot 130 shown in Figure 1.

[0042]

[0054] The second robot blade 452 is used to transfer the substrate 405 and the carrier 206 via the transfer chamber 136 to one or more of the processing chambers 110, 112, 132, 128, and 120 shown in Figure 1. In the position shown in Figure 4E, the distance 454 between the lower surface of the upper part 214 and the carrier 206 positioned on the first carrier holder 204B is approximately 0.25 inches, and the distance 456 between the upper surface of the second robot blade 452 and the lower surface of the carrier 206 may be approximately 0.19 inches. To transfer the substrate 405 to the second robot blade 452, the support 220 (Figure 2) descends in the Z direction over a distance greater than 456. The second robot blade 452, with the carrier 206 and substrate 405 on top, can then be withdrawn from the second loading port 239 in the X direction.

[0043]

[0055] Figure 4F is a schematic side view showing another part of the transfer process discussed in the description of Figures 4A to 4E. Figure 4F shows a processed substrate 458 coming from the transfer chamber 136 (shown in Figure 1), supported by a carrier 206. The carrier 206 is supported by a second robotic blade 452. In this transfer process, the support 220 is in its lowest position, resulting in a space between the upper part 214 and the first carrier holder 204B. Furthermore, the lift pins 410 are retracted. In Figure 4F, the substrate 458 is shown with the carrier 206 aligned concentrically with the first carrier holder 204B.

[0044]

[0056] Figure 4G is a schematic side view showing another part of the transfer process discussed in the description of Figures 4A to 4F. Between the two positions shown in Figures 4F and 4G, the lift pin 410 acts vertically (Z direction) from the position shown in Figure 4F to the position shown in Figure 4G, showing the substrate 458 supported by the lift pin 410. Furthermore, the carrier 206 is supported by the first carrier holder 204B. As shown in Figure 4G, once the substrate 458 is supported by the lift pin 410, the first robot blade 400 acts laterally (X direction) and / or vertically (Z direction) to remove the substrate 458 from the lift pin 410. Once the substrate 458 is supported by the first robot blade 400, the first robot blade 400, on which the substrate 458 rests, can move through the first loading port 238, and the substrate 458 can be positioned within the factory interface 102.

[0045]

[0057] Figures 5A to 5C are various diagrams of the cooling platen 280 and other components associated with the cooling platen 280 in the substrate input / output chamber 122. Figure 5A is an isometric view of the cooling platen 280 and the first carrier holder 204B and second carrier holder 204A connected to the support 220. Figure 5B is an isometric partial cross-sectional view of the cooling platen 280, one of the multiple carriers 206, and the support 220.

[0046]

[0058] Figure 5A shows that a plurality of positioning pins 500 are connected to the cooling platen 280 in the outer peripheral region of the cooling platen 280. Each positioning pin 500 is temporarily positioned within an opening 505 formed on the outer periphery of the cooling platen 280 (shown in Figure 5B) and is used to center or position the carrier 206 on the first carrier holder 204B and the second carrier holder 204A. The positioning pins 500 define the outer edge position of the carrier 206 when it is positioned on either the first or second carrier holder 204A or 204B. For example, the carrier 206 may be manually moved into the substrate input / output chamber 122, and the positioning pins 500 are used to position the carrier 206 relative to the cooling platen 280. Once the carrier 206 is positioned on the first or second carrier holder 204A, 204B, the positioning pins 500 tightly confine the outer edges of each carrier 206, positioning the carrier 206 for processing. Once the carrier 206 is positioned, the positioning pins 500 can be removed. Each positioning pin 500 may be made from quartz material.

[0047]

[0059] Figure 5A further shows multiple alignment pads 510 connected to the cooling platen 280. Although only two pads 510 are shown in Figure 5A, another pad is hidden by the first carrier holder 204B and the second carrier holder 204A.

[0048]

[0060] Cross-sections of the pads 510 are shown in Figures 5B and 5C. Each pad 510 can be used to prevent contact between the carrier 206 and the cooling platen 280. Furthermore, since the carrier 206 is supported by the pads 510 during cooling, contact between the substrate (not shown) and the platen 280 is prevented. For example, when a substrate is placed on the substrate receiving surface 515 of the carrier 206, the pads 510 provide a gap 520 between the top surface of the cooling platen 280 and the substrate receiving surface 515 of the carrier 206. The substrate receiving surface 515 of the carrier 206 will coincide with the bottom surface of the substrate mounted thereon, and the gap 520 will extend from the bottom surface of the substrate to the top surface of the cooling platen 280. Similar to the positioning pins 500, the pads 510 are made of quartz material.

[0049]

[0061] Figure 5C is an enlarged cross-sectional view of the cooling platen 280, one of the pads 510, and the carrier 206. Each pad 510 has a generally "T"-shaped cross-section, and each pad 510 includes a flat shoulder 530. The shoulder 530 surrounds a projection 535 extending therefrom. An inclined surface 540 is provided between the shoulder 530 and the projection 535, where the projection 535 is frustoconical. The inclined surface 540 can be used to center the carrier 206 relative to the cooling platen 280. Each pad 510 further includes a pin portion 545 that is inserted into an opening 550 formed in the cooling platen 280. The shoulder 530 fits into a concave flange 555 of the cooling platen 280. The height 560 of the shoulder 530 is slightly greater than the depth of the concave flange 555 to provide a gap 520.

[0050]

[0062] Figure 6 is a schematic cross-sectional view of part of the cooling platen 280 and carrier 206. The carrier 206 has a substrate 600 supported on a substrate receiving surface 515. The carrier 206 includes a circular body 605, which has a groove 610 formed on the opposite side of the substrate receiving surface 515. Here, the circular body 605 is annular. A peripheral edge 615 adjacent to the groove 610 contacts the shoulder 530 of the pad 510 (both shown in Figure 5C). The contact between the peripheral edge 615 and the shoulder 530 (shown in Figure 5C) provides a gap 520. A beveled edge 620 connects one of the peripheral edges 615 (e.g., the outer edge) to the outer wall 625. The beveled edge 620 may contact the inclined surface 540 of the pad 510 (both shown in Figure 5C).

[0051]

[0063] Figures 7A to 7D are various diagrams illustrating the details of the substrate input / output chamber 122. Figure 7A is an isometric bottom view of the substrate input / output chamber 122, showing the substrate lift mechanism 700 that moves the lift pins 410. The substrate lift mechanism 700 includes a motor 704 connected to the cooling platen 280 and a support plate 702 that supports a plurality of lift pin assemblies 706. A vacuum system 708 having a plurality of primary vacuum tubes 710 is also shown. The primary vacuum tubes 710 are connected to the cooling platen 280 and are used to evacuate passages associated with the lift pins 410 located within the cooling platen 280. The vacuum system 708 and the primary vacuum tubes 710 are in fluid communication with each other, which is described in more detail in Figure 9A.

[0052]

[0064] Figures 7B and 7C are side cross-sectional views of a portion of the cooling platen 280, showing the motion brought about by the substrate lift mechanism 700. Figure 7B shows the lift pin 410 in the extended position, and Figure 7C shows the lift pin 410 in the retracted position. Figure 7D is an enlarged cross-sectional view of the substrate lift mechanism 700 in Figure 7B. Although Figures 7B to 7D show only one lift pin 410 and its associated substrate lift mechanism 700, it should be noted that each of the multiple lift pins 410 on the support plate 702 has an associated substrate lift mechanism 700.

[0053]

[0065] As shown in Figures 7B to 7D, the lift pin assembly 706 includes a bellows 708 positioned between the cooling platen 280 and the base housing 711 connected to the support plate 702. The bellows 708 may be made from a metal alloy having a low coefficient of thermal expansion and high strength. In one example, the bellows 708 may be a Ni-Mo-Cr alloy (e.g., an alloy material sold under the trade name HAYNES® 242®). A seal 709, such as an O-ring, may be provided at the interface between the base housing 711 and the support plate 702. A mounting plate 713 may be connected between the cooling platen 280 and the bellows 708. The mounting plate 713 may be connected to the cooling platen 280 via fasteners.

[0054]

[0066] A portion of the shaft 413 of the lift pin 410 is positioned within the base housing 711. For example, as best shown in Figures 7B and 7D, the end of the shaft 413 opposite the tip 412 is connected to a gripping member 712. The gripping member 712 may be made from a plastic material suitable for use in high-temperature environments (e.g., a polyimide polymer sold under the trade name VESPEL®). The gripping member 712 is connected to a retainer housing 714. The retainer housing 714 receives the lip 716 of the gripping member 712 at one end. The opposite end of the retainer housing 714 is connected to a base pin 718. The base pin 718 may be connected to a support plate 702. Materials for the base pin 718, base housing 711, and retainer housing 714 include metals such as stainless steel.

[0055]

[0067] Referring again to Figures 7B and 7C, a bushing 417 is shown positioned around one of the lifter pins 410. Each bushing 417 may be made from a plastic material suitable for use in high-temperature environments. Each bushing 417 may be secured by an internal retainer 724 (e.g., a snap ring retainer). A limiting member 726, which may be a bolt or screw shaft, is shown connected to the support plate 702. As shown in Figure 7B, the height of the limiting member 726 can be adjusted, for example, in the Z direction to restrict the movement of the lift pin 410 in the Z direction.

[0056]

[0068] Figure 8 is an enlarged cross-sectional view of a motor 704 connected to a support plate 702 via a flexible connecting member 800. The flexible connecting member 800 includes a base 805 connected to the support plate 702 by a plurality of base fasteners 810. Each base fastener 810 passes through an oversized hole 815 formed in the support plate 702. Each oversized hole 815 has a diameter larger than the diameter of the base fastener 810, thereby allowing the base fastener 810 to pass through the hole 815 and be fixed to the base 805. The base 805 includes a through slot 820 that receives a portion of a central fastener 825. The central fastener 825 connects the motor 704 to the base 805. The through slot 820 exposes at least a portion of the head 830 of the central fastener 825, thereby allowing rotation of the central fastener 825 to move the central fastener 825 along the Z direction. When activated, the flexible connecting member 800 creates a gap of several millimeters 835 between the support plate 702 and the outer peripheral region of the base 805.

[0057]

[0069] Figures 9A and 9B are isometric views of the substrate input / output chamber 122, showing details of the vacuum system 708. Figure 9A is an isometric bottom view of the substrate input / output chamber 122, and Figure 9B is an isometric cross-sectional view of the bottom of the substrate input / output chamber 122.

[0058]

[0070] In Figures 9A and 9B, a support plate 702 is positioned below the cooling platen 280, with a motor 704 and several lift pin assemblies 706 connected between them. Several primary vacuum tubes 710 are shown in Figure 9A. Each primary vacuum tube 710 is associated with its respective lift pin assembly 706 and connected to the forward line 900 by one or more secondary vacuum tubes 905. An isolation valve 910 is shown positioned between the primary vacuum tubes 710 and the forward line 900.

[0059]

[0071] As shown in Figure 9B, each primary vacuum tube 710 (only one is shown in Figure 9B) is fluidly connected to a lift pin passage 915 by a bore 920. Both the bore 920 and the lift pin passage 915 are formed within the cooling platen 280. For example, the lift pin passage 915 is a through-hole formed between two main faces of the cooling platen 280, and the bore 920 may be a passage formed along the length of the lift pin passage 915 to one of the main faces of the cooling platen 280 that connects to the primary vacuum tube 710. During operation, the vacuum system 708 is connected to a forward line 900 which is connected to a vacuum pump 236 (shown in Figure 2). The vacuum pump 236 is used to evacuate the lift pin passage 915, but is also used to evacuate the chamber space 218 of the substrate input / output chamber 122.

[0060]

[0072] Figure 10 is a schematic cross-sectional view of a processing chamber 1000 according to one embodiment. The processing chamber 1000 may be one or more of the processing chambers 110, 112, 132, 128, and 120 shown in Figure 1.

[0061]

[0073] The susceptor 1006 is located inside the processing chamber 1000, between the upper dome 1028 and the lower dome 1014. The processing chamber 1000 may be used for processing one or more substrates, including the deposition of material onto the upper surface of the substrate 124. The processing chamber 1000 may include, among other components, an array of radiant heating lamps 1002 for heating the back surface 1004 of the susceptor 1006 located inside the processing chamber 1000. As used herein, “susceptor” is defined as an object that absorbs radiant energy and converts the absorbed radiant energy into thermal energy. This thermal energy heats another object placed on or near the susceptor. Although the processing chamber 1000 includes the susceptor 1006, embodiments of the carrier 206 described herein may be used with other types of substrate supports or pedestals and may be configured similarly to the susceptor 1006. The upper dome 1028, the lower dome 1014, and the base ring 1036 positioned between the upper dome 1028 and the lower dome 1014 generally define the internal region of the processing chamber 1000. As described herein, a substrate 124, with its device side 1016 facing upward and positioned on the front side 1010 of the susceptor 1006 on the carrier 206, can be brought into the processing chamber 1000 and positioned on the susceptor 1006 through the loading port 1003. The susceptor 1006 can be supported by a susceptor support structure 1090. The susceptor support structure 1090 includes at least three first support arms 1092 (only two are shown) supported by a central shaft 1032. In one embodiment, lowering the susceptor 1006 on the central shaft 1032 allows the carrier lift pin 1005 to contact the carrier 206. The carrier lift pin 1005 passes through the holes in the first support arm 1092 and the susceptor 1006, lifting the carrier 206 and the substrate 124 from the susceptor 1006. The carrier 206 may be positioned in a recess or groove 1025 formed on the front side 1010 of the susceptor 1006. While the susceptor 1006 is positioned in the processing location as shown, it divides the internal space of the processing chamber 1000 into a processing gas area 1056 above the substrate 124 and a purge gas area 1058 below the susceptor 1006.The susceptor 1006 can be rotated and further moves the substrate 124 and carrier 206 vertically 1034. The lamp 1002 may be configured to include a light bulb 1041 and is used to heat the substrate 124. An optical pyrometer 1018 may be used for temperature measurement / control of the substrate 124. The lamp 1002 may be contained inside a lamp head 1045. The lamp head 1045 may be cooled during or after processing by a cooling fluid introduced, for example, into a channel 1049 located between multiple lamps 1002. The processing gas supplied from the processing gas source 1072 is introduced into the processing gas region 1056 through a processing gas inlet 1074 formed in the base ring 1036. The processing gas is discharged from the processing gas region 1056 (along the flow path 1075) through a gas outlet 1078 located on the opposite side of the processing gas inlet 1074 in the processing chamber 1000. The removal of the process gas through the gas outlet 1078 can be facilitated by a vacuum pump 1080 connected thereto. A circular shield 1067 or a preheating ring may optionally be placed around the susceptor 1006. The susceptor 1006 may be further surrounded by a liner assembly 1063. The shield 1067 prevents or minimizes the leakage of thermal / optical noise from the lamp 1002 to the device side 1016 of the substrate 124 while providing a preheating zone for the process gas. The liner assembly 1063 shields the process space (i.e., the process gas area 1056 and the purge gas area 1058) from the metal wall of the process chamber 1000. The metal wall may react with the precursor and cause contamination within the process space. The shield 1067 and / or liner assembly 1063 may be made from CVD SiC, SiC-coated sintered graphite, grown SiC, opaque quartz, coated quartz, or any similar suitable material resistant to chemical decomposition by processing and purging gases. A reflector 1022, fixed to the upper dome 1028 using a clamping ring 1030, may optionally be positioned outside the upper dome 1028. To connect to a cooling source (not shown), the reflector 1022 may have one or more channels 1026. The channels 1026 connect to passages (not shown) formed on the side of the reflector 1022.

[0062]

[0074] Figure 11 is an isometric view of the susceptor 1006 in Figure 10. The carrier 206 is supported by carrier lift pins 1005, which move the substrate 124 (the portion supported by the carrier 206 is shown) away from the front side 1010 of the susceptor 1006. The positions of the carrier 206 and substrate 124 shown in Figure 11 may be transfer positions in which a robot (not shown) can enter the space between the front side 1010 of the susceptor 1006 and the substrate 124.

[0063]

[0075] The substrate support 190 includes a central shaft 1032 and an outer shaft 1100 positioned around the central shaft 1032. One or both of the central shaft 1032 and the outer shaft 1100 are linearly movable relative to the other. In one embodiment, the central shaft 1032 can be moved in the Z direction while the outer shaft 1100 is stationary in order to move the susceptor 1006 up and down relative to the carrier lift pin 1005. The carrier lift pin 1005 is positioned on a second support arm 1105 which is substantially parallel to a first support arm 1092. The end of the second support arm 1105 includes a pad 1110 on which the carrier lift pin 1005 is supported during the transport of the carrier 206. The first support arm 1092 includes an angled extension 1115 that contacts the back side 1004 of the susceptor 1006 on its outer circumference 1120. The carrier lift pin 1005 is movably positioned through an opening 1125 formed in the first support arm 1092, thereby allowing the carrier lift pin 1005 to move in the Z direction relative to the first support arm 1092.

[0064]

[0076] Figure 12 is an enlarged cross-sectional view of a portion of the susceptor 1006 and carrier 206 as shown in Figure 10. As described in Figure 10, the carrier 206 is positioned within a groove 1025 formed in the front side 1010 of the susceptor 1006. One of the carrier lift pins 1005 is provided through an opening 1200 formed in the susceptor 1006 adjacent to the groove 1025. In the processing positions shown in Figures 10 and 12, the carrier lift pin 1005 disengages from the carrier 206 so that the carrier 206 can rest or be received within the groove 1025. For example, the groove 1025 includes a reference plane 1205 on which the peripheral edge 615 of the carrier 206 can be supported. In the illustrated processing positions, the groove 1025 and carrier 206 are constructed such that the upper surface 1210 of the carrier 206 is below one or both of the planes of the front side 1010 of the susceptor 1006 and the upper surface of the substrate 124. The carrier lift pin 1005 includes a flared head 1215. The flared head 1215 allows the carrier lift pin 1005 to be suspended within the susceptor 1006 and separated from the carrier 206. For example, the carrier lift pin 1005 includes a circular angled side wall 1220 that fits into the angled side wall 1225 of the opening 1200.

[0065]

[0077] However, during transport, the carrier 206 on which the substrate 124 rests may be lifted and separated from the susceptor 1006. For example, the susceptor 1006 may be biased downward (in the Z direction) so that the protrusion 1230 of the flared head 1215 contacts the groove 610 of the carrier 206. By continuously lifting the lift pin 1005 in the Z direction, the substrate 124 is separated from the front side 1010 of the susceptor 1006, as shown in Figure 11. Separating the substrate 124 and the carrier 206 from the susceptor 1006 allows a robot blade (not shown; for example, the blade 134 of the vacuum robot 130 shown in Figure 1) to enter between them.

[0066]

[0078] While the above description applies to embodiments of the present disclosure, other embodiments and further embodiments of the present disclosure may be devised without departing from the fundamental scope of the present disclosure. The scope of the present disclosure is determined by the following claims.

Claims

1. A plurality of stacked holders, each configured to support a carrier supporting a substrate, wherein each of the stacked holders includes a standoff, and the standoff includes a curved inner portion, A pedestal comprising a heat transfer element positioned to regulate the temperature of the substrate supported by the carrier on one of the plurality of stacked holders, A plurality of positioning pins positioned within a plurality of openings formed around the outer circumference of the platen of the pedestal, wherein when the carrier is supported by one of the plurality of stacked holders, the plurality of positioning pins define the outer edge position of the carrier in order to position the carrier on the one holder. A chamber equipped with a chamber.

2. Transfer chamber and The chamber according to claim 1, connected to the transfer chamber, A transfer chamber robot disposed within the transfer chamber, configured to transfer substrates from the transfer chamber to each of the plurality of stacked holders, A substrate processing system equipped with the following features.

3. The substrate processing system according to claim 2, further comprising a factory interface loading station equipped with a loading station robot, wherein the chamber is positioned between the transfer chamber and the factory interface loading station, and the loading station robot is configured to transfer substrates from the factory interface loading station to each of the plurality of stacked holders.

4. The chamber according to claim 1, wherein the pedestal is connected to the bottom of the chamber, and the heat transfer element includes a passage through which a fluid is passed.

5. The chamber according to claim 4, wherein the distance between the upper surface of the pedestal and the lower surface of the carrier supported by one of the holders is approximately 0.75 inches.

6. The chamber according to claim 4, wherein the curved inner portion includes a curved lip, and each of the plurality of stacked holders further includes a second standoff having a second curved lip facing toward the curved lip of the standoff, and the standoff and the second standoff are on either side of the pedestal.

7. The chamber according to claim 6, wherein the pedestal is located in the center of the chamber.

8. The chamber according to claim 1, wherein adjacent holders among the plurality of stacked holders are stacked at a pitch of approximately 1 inch.

9. The chamber according to claim 4, wherein the passage is connected to a cooling fluid source.

10. The chamber according to claim 1, wherein each of the plurality of stacked holders further includes a plurality of support members extending laterally from the curved inner portion of the standoff.

11. The chamber according to claim 10, wherein the plurality of support members are made of quartz material and connected to the standoffs, and the standoffs are made of metal material.

12. The chamber according to claim 1, further comprising a heating module, wherein the plurality of stacked holders are positioned between the heating module and the pedestal, and the heating module is configured to heat the substrate supported on the carrier on one of the plurality of stacked holders.

13. The chamber according to claim 1, further comprising one or more ventilation passages and discharge passages, wherein the one or more ventilation passages and discharge passages are configured to form a layered gas flow between them.

14. The chamber according to claim 1, wherein the carrier is made of a ceramic material.

15. A support connected to a shaft extending through the bottom of the chamber, the support to which the plurality of stacked holders are attached, A lift mechanism connected to the shaft, wherein the lift mechanism is located outside the chamber and is configured to control the raising of the plurality of stacked holders inside the chamber. The chamber according to claim 1, further comprising:

16. The chamber according to claim 1, wherein the heat transfer element is sealed within the pedestal using a circular metal overplate.

17. The chamber according to claim 1, wherein the plurality of positioning pins are made of quartz material.

18. The chamber according to claim 1, further comprising a plurality of alignment pads connected to the platen, each of the plurality of alignment pads having a shoulder portion, the shoulder portion surrounding a projection extending from the shoulder portion.

19. Each of the aforementioned plurality of alignment pads The inclined surface between the shoulder portion and the frustoconical projection, A pin portion inserted into the pad opening formed in the platen Furthermore, The chamber according to claim 18, wherein the shoulder portion is fitted into the concave flange of the platen, and the height of the shoulder portion is greater than the depth of the concave flange in order to provide a gap between the platen and the substrate receiving surface of the carrier.

20. The aforementioned carrier, A circular body comprising a circular body including a groove formed in the circular body on the side opposite to the substrate receiving surface, A peripheral edge adjacent to the groove, configured to contact the shoulder portion of the alignment pad, A sloping edge portion that connects one of the aforementioned peripheral portions to the outer wall, and a sloping edge portion configured to contact the inclined surface of the alignment pad. The chamber according to claim 19, comprising:

21. A platen with a heat transfer element embedded inside, Multiple carrier holders positioned around the platen, Multiple support members extending from the aforementioned multiple carrier holders, A carrier positioned on one of the support member among the plurality of carrier holders, A plurality of positioning pins positioned within a plurality of openings formed around the outer circumference of the platen, wherein when the carrier is supported by one of the plurality of carrier holders, the plurality of positioning pins define the outer edge position of the carrier in order to position the carrier on the one carrier holder. A chamber equipped with a chamber.

22. The chamber according to claim 21, wherein each of the carrier holders includes a plurality of support members extending from the carrier holder to support the carrier.

23. The chamber according to claim 21, further comprising a plurality of lift pins arranged to be movable through the platen.

24. The chamber according to claim 23, wherein each of the plurality of lift pins comprises a tip and a shaft, the tip being made of a material softer than the material of the shaft.

25. The chamber according to claim 24, wherein the material of the tip is a polymer material and the material of the shaft is a metal material.

26. The chamber according to claim 25, wherein the protruding portion of the tip is fitted into a recess formed in the shaft using an interference fit.

27. The chamber according to claim 23, wherein each of the plurality of lift pins is operably connected to a dedicated actuator.

28. The chamber according to claim 23, wherein the plurality of lift pins are arranged in openings formed in the platen, and each of the openings is fluidly connected to a vacuum system.

29. The chamber according to claim 28, wherein the vacuum system comprises a plurality of primary vacuum tubes associated with the openings, the plurality of primary vacuum tubes being connected to a forward line by one or more secondary vacuum tubes, each of the primary vacuum tubes being fluidly connected to one of the openings by a bore formed in the platen, the openings being formed between two main surfaces of the platen, and the bore being formed between one of the corresponding openings and one of the two main surfaces.

30. The chamber according to claim 23, wherein the plurality of lift pins are arranged inside the carrier and the plurality of carrier holders.

31. The chamber according to claim 21, wherein each of the plurality of carrier holders is provided with a standoff and a curved lip.

32. The chamber according to claim 21, wherein each of the plurality of carrier holders is attached to a support connected to a shaft extending through the bottom of the chamber.

33. The lift pin assembly further comprises, Support plate and A base housing connected to the support plate, A shaft made of a first material, having a recess formed in the shaft, and at least a portion of the shaft being disposed within the base housing, A tip made of a second material softer than the first material, including a protruding portion that fits into the recess using an interference fit, A gripping member disposed within the base housing, wherein one end of the shaft is connected to the gripping member, A retainer housing disposed within the base housing and connected to the support plate, the retainer housing receiving the lip of the gripping member and The chamber according to claim 21, comprising:

34. A seal is disposed at the interface between the base housing and the support plate, The base pin connected to the retainer housing and the support plate, A bushing arranged around the shaft, A motor connected to the support plate via a flexible connecting member, wherein the motor is connected between the support plate and the platen. The chamber according to claim 33, further comprising:

35. The aforementioned lift pin assembly A bellows disposed between the platen and the base housing, the bellows being made of a metal alloy, A mounting plate connected between the platen and the bellows, the mounting plate being connected to the platen via a fastener. The chamber according to claim 34, further comprising:

36. The base pin and the base housing are made of one or more metals. The bushing is made of plastic material and is secured by an internal retainer. A limiting member is connected to the support plate. The chamber according to claim 34, wherein the flexible connecting member comprises a base connected to the support plate by a plurality of base fasteners, each of the base fasteners passing through an oversized hole formed in the support plate, each of the oversized holes having a diameter larger than the diameter of the base fastener, the base comprising a through slot for receiving a portion of a central fastener, and the central fastener connecting the motor to the base.

37. The chamber according to claim 36, wherein the through-slot exposes at least a portion of the head of the central fastener, the rotation of the central fastener moves the central fastener, and the flexible connecting member, when the flexible connecting member is actuated, creates a gap between the support plate and the outer peripheral region of the base.

38. A plurality of stacked holders, each configured to support a carrier supporting a substrate, wherein each of the stacked holders includes a standoff, each standoff includes a curved inner portion, and each of the plurality of stacked holders further includes a plurality of support members extending laterally from the curved inner portion of the standoff, A pedestal comprising a heat transfer element positioned to regulate the temperature of the substrate supported by the carrier on one of the plurality of stacked holders, A chamber equipped with a chamber.

39. The chamber according to claim 38, wherein the plurality of support members are made of quartz material and connected to the standoffs, and the standoffs are made of metal material.

40. The chamber according to claim 38, wherein each of the plurality of stacked holders further includes a second standoff, the second standoff having a second curved inner portion facing toward the curved inner portion of the standoff and a second plurality of support members extending laterally from the second curved inner portion, and the standoff and the second standoff are on both sides of the pedestal.

41. The chamber according to claim 38, further comprising a plurality of alignment pads connected to the platen of the pedestal, each of the plurality of alignment pads having a shoulder portion, the shoulder portion surrounding a projection extending from the shoulder portion.

42. Each of the aforementioned plurality of alignment pads The inclined surface between the shoulder portion and the frustoconical projection, A pin portion inserted into the pad opening formed in the platen Furthermore, The chamber according to claim 41, wherein the shoulder portion is fitted into the concave flange of the platen, and the height of the shoulder portion is greater than the depth of the concave flange in order to provide a gap between the platen and the substrate receiving surface of the carrier.

43. The aforementioned carrier, A circular body comprising a circular body including a groove formed in the circular body on the side opposite to the substrate receiving surface, A peripheral edge adjacent to the groove, configured to contact the shoulder portion of the alignment pad, A sloping edge portion that connects one of the aforementioned peripheral portions to the outer wall, and a sloping edge portion configured to contact the inclined surface of the alignment pad. The chamber according to claim 42, comprising:

44. Transfer chamber and The chamber according to claim 38, connected to the transfer chamber, A transfer chamber robot disposed within the transfer chamber, configured to transfer substrates from the transfer chamber to each of the plurality of stacked holders, A substrate processing system equipped with the following features.

45. The chamber according to claim 38, wherein the pedestal is connected to the bottom of the chamber, and the heat transfer element includes a passage through which a fluid is passed.

46. The chamber according to claim 45, wherein the distance between the upper surface of the pedestal and the lower surface of the carrier supported by one of the holders is 0.75 inches.

47. The chamber according to claim 45, wherein the passage is connected to a cooling fluid source.

48. The chamber according to claim 38, wherein the heat transfer element is sealed within the pedestal using a circular metal overplate.

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