Semiconductor transfer apparatus and method

Abstract

This invention provides a semiconductor transfer apparatus and method. The semiconductor transfer apparatus includes: a lifting mechanism, a clamping mechanism driven by the lifting mechanism to move vertically, and a transfer mechanism. The transfer mechanism includes: a supporting unit, and a horizontal displacement component that drives the supporting unit to move closer to or away from the clamping mechanism. The clamping mechanism clamps the edge of a first wafer, and the lifting mechanism drives the clamping mechanism to rise vertically to achieve vertical separation of the first wafer and a second wafer. The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the vertical separation of the first wafer and the second wafer, so that the supporting unit and the first wafer form a supporting state. This application, through the transfer mechanism, achieves rapid and accurate reception of the debonded first wafer and transfers the first wafer to the next processing step or storage location.

Description

Technical Field

[0001] This invention relates to the field of semiconductor debonding technology, and in particular to a semiconductor transfer apparatus and method. Background Technology

[0002] Temporary bonding and debonding are key steps in semiconductor manufacturing. During debonding, the debonded wafer needs to be transferred to the next processing step or storage location.

[0003] However, in existing wafer debonding devices, after completing the debonding of the upper wafer, the upper wafer is usually transferred directly by manual labor or a robotic arm. The lack of a corresponding transfer device makes it difficult to quickly and accurately receive the debonded upper wafer and transfer it to the next processing step or storage location.

[0004] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of this application and facilitating understanding by those skilled in the art. It should not be assumed that these technical solutions are known to those skilled in the art simply because they have been described in the background technology section of this application. Summary of the Invention

[0005] The purpose of this invention is to disclose a semiconductor transfer apparatus and method to address the many shortcomings of existing wafer debonding apparatuses, especially to achieve rapid and accurate reception of the debonded first wafer and transfer of the first wafer to the next processing step or storage location.

[0006] In a first aspect, the present invention provides a semiconductor transfer apparatus, comprising: a lifting mechanism, a clamping mechanism driven by the lifting mechanism to move vertically, and a transfer mechanism;

[0007] The transmission mechanism includes: a support unit, and a horizontal displacement component that drives the support unit to move closer to or away from the clamping mechanism;

[0008] The clamping mechanism clamps the edge of the first wafer, and the lifting mechanism drives the clamping mechanism to rise longitudinally, so as to separate the first wafer and the second wafer longitudinally.

[0009] The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the first wafer and the second wafer are separated longitudinally, so that the supporting unit and the first wafer form a supporting state.

[0010] In a second aspect, the present invention provides a semiconductor transfer apparatus, comprising: a clamping mechanism for clamping the edge of a first wafer carried by a second wafer, a positioning mechanism for supporting and fixing the second wafer, a lifting mechanism for driving the positioning mechanism to move up and down longitudinally, and a transfer mechanism.

[0011] The transmission mechanism includes: a support unit, and a horizontal displacement component that drives the support unit to move closer to or away from the clamping mechanism;

[0012] The clamping mechanism clamps the edge of the first wafer, and the lifting mechanism drives the positioning mechanism to descend longitudinally, so as to separate the first wafer from the second wafer longitudinally.

[0013] The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the first wafer and the second wafer are separated longitudinally, so that the supporting unit and the first wafer form a supporting state.

[0014] Thirdly, the present invention provides a semiconductor transfer apparatus, comprising:

[0015] The device includes a clamping mechanism, a positioning mechanism that clamps the edge of the first wafer carried by the second wafer, a positioning mechanism that supports and fixes the second wafer, a lifting mechanism that drives the positioning mechanism and the clamping mechanism to move up and down longitudinally, and a transmission mechanism.

[0016] The transmission mechanism includes: a support unit, and a horizontal displacement component that drives the support unit to move closer to or away from the clamping mechanism;

[0017] The clamping mechanism clamps the edge of the first wafer, and the lifting mechanism drives the positioning mechanism and the clamping mechanism to move in opposite directions along the longitudinal direction, so as to separate the first wafer and the second wafer along the longitudinal direction.

[0018] The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the first wafer and the second wafer are separated longitudinally, so that the supporting unit and the first wafer form a supporting state.

[0019] As a further improvement of the present invention, the transmission mechanism further includes a lifting unit that drives the supporting unit to move up and down longitudinally.

[0020] As a further improvement of the present invention, the supporting unit includes: a base plate for supporting the first wafer, the base plate being provided with an arc-shaped portion circumferentially surrounding the outside of the first wafer.

[0021] As a further improvement of the present invention, the top water surface height of the arc-shaped portion is higher than the top water surface height of the base plate, and the length of the arc-shaped portion is greater than the semicircular length of the first wafer.

[0022] As a further improvement of the present invention, the base plate is configured to have a relief portion that exposes part of the bottom surface of the first wafer.

[0023] As a further improvement of the present invention, the horizontal displacement assembly includes: a displacement driving unit, and a horizontal displacement support connected to the arcuate portion and controlled by the displacement driving unit.

[0024] As a further improvement of the present invention, the clamping mechanism includes: a clamping drive unit, and two clamping members controlled by the clamping drive unit and moving closer or further apart from each other to clamp or release the edge of the first wafer.

[0025] As a further improvement of the present invention, the clamping member is provided to protrude downward in the longitudinal direction to form a protrusion that at least partially supports the edge of the first wafer.

[0026] Fourthly, the present invention provides a semiconductor transfer method, comprising the following steps:

[0027] Step S1: The clamping mechanism clamps the edge of the first wafer;

[0028] Step S2: The lifting mechanism drives the clamping mechanism to rise longitudinally, so as to separate the first wafer and the second wafer longitudinally.

[0029] Step S3: The horizontal displacement component drives the support unit to be horizontally inserted at least after the first wafer and the second wafer are separated longitudinally to form a separation region;

[0030] Step S4: The clamping mechanism releases the first chip so that the supporting unit can hold the first chip.

[0031] Fifthly, the present invention provides a semiconductor transfer method, comprising the following steps:

[0032] Step S1: The clamping mechanism clamps the edge of the first wafer;

[0033] Step S2: The lifting mechanism drives the positioning mechanism to descend longitudinally to achieve longitudinal separation of the first wafer and the second wafer;

[0034] Step S3: The horizontal displacement component drives the support unit to be horizontally inserted at least after the first wafer and the second wafer are separated longitudinally to form a separation region;

[0035] Step S4: The clamping mechanism releases the first chip so that the supporting unit can hold the first chip.

[0036] Sixthly, the present invention provides a semiconductor transfer method, comprising the following steps:

[0037] Step S1: The clamping mechanism clamps the edge of the first wafer;

[0038] Step S2: The lifting mechanism drives the positioning mechanism and the clamping mechanism to move in opposite directions along the longitudinal direction to achieve longitudinal separation of the first wafer and the second wafer;

[0039] Step S3: The horizontal displacement component drives the support unit to be horizontally inserted at least after the first wafer and the second wafer are separated longitudinally to form a separation region;

[0040] Step S4: The clamping mechanism releases the first chip so that the supporting unit can hold the first chip.

[0041] Compared with the prior art, the beneficial effects of the present invention are as follows: the clamping mechanism clamps the edge of the first wafer after debonding, the first wafer and the second wafer are separated longitudinally, and after the first wafer and the second wafer are separated longitudinally and a separation region is formed, the horizontal displacement component drives the support unit to be horizontally inserted into at least the separation region. After the support unit and the first wafer after debonding clamped by the clamping mechanism are aligned longitudinally, the clamping mechanism releases the edge of the first wafer, and the first wafer naturally falls onto the support unit, so that the support unit supports the first wafer, thereby receiving the first wafer and exiting the separation region under the drive of the horizontal displacement component, thereby transferring the first wafer to the next processing step or storage location, so as to achieve fast and accurate reception of the first wafer after debonding and transfer of the first wafer to the next processing step or storage location, thereby improving production efficiency. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the semiconductor transfer apparatus disclosed in this invention, wherein the clamping mechanism clamps the edge of the first wafer;

[0043] Figure 2 This is a schematic diagram of the semiconductor transfer device disclosed in this invention, wherein the support unit is horizontally inserted into the separation region;

[0044] Figure 3 This is a schematic diagram of the semiconductor transfer device disclosed in this invention, wherein the clamping mechanism releases the first wafer to the support unit;

[0045] Figure 4 This is a schematic diagram of the semiconductor transfer device disclosed in this invention, wherein the support unit supports the first wafer as it exits the separation region;

[0046] Figure 5 This is a schematic diagram of the structure of a semiconductor transfer device in another embodiment of the present invention, wherein the clamping mechanism clamps the edge of the first wafer;

[0047] Figure 6 This is a schematic diagram of the structure of a semiconductor transfer device in another embodiment of the present invention, wherein the support unit is horizontally inserted into the separation region, and the clamping mechanism releases the first wafer to the support unit;

[0048] Figure 7 This is a schematic diagram of the structure of a semiconductor transfer device in another embodiment of the present invention, wherein the support unit supports the first wafer as it exits the separation region;

[0049] Figure 8 This is a schematic diagram of the structure of a semiconductor transfer device in another embodiment of the present invention, wherein the clamping mechanism clamps the edge of the first wafer;

[0050] Figure 9 This is a schematic diagram of the structure of a semiconductor transfer device in another embodiment of the present invention, wherein the support unit is horizontally inserted into the separation region, and the clamping mechanism releases the first wafer to the support unit;

[0051] Figure 10 This is a schematic diagram of the structure of a semiconductor transfer device in another embodiment of the present invention, wherein the support unit supports the first wafer as it exits the separation region;

[0052] Figure 11 This is a top view of the base plate included in the semiconductor transfer apparatus according to at least one embodiment of the present invention;

[0053] Figure 12 This is a top view of the edge of the first wafer held by the clamping member included in the semiconductor transfer apparatus of at least one embodiment of the present invention;

[0054] Figure 13 This is a bottom view of the edge of the first wafer held by the protrusion in the semiconductor transfer apparatus disclosed in at least one embodiment of the present invention.

[0055] Figure 14 This is a top view showing the clamping members of the semiconductor transfer apparatus disclosed in at least one embodiment of the present invention being spaced far apart from each other;

[0056] Figure 15 This is a schematic diagram showing the structure of a first wafer held by a clamping mechanism in at least one embodiment of the semiconductor transfer apparatus disclosed in this invention, wherein the bottom horizontal height of the first wafer is at least higher than the top horizontal height of the support unit.

[0057] Figure 16Schematic diagram of the structure in which the bottom horizontal height of the first wafer clamped by the clamping mechanism included in the semiconductor transfer device in at least one embodiment disclosed by the present invention is at least higher than the top horizontal height of the supporting unit and the top horizontal height of the second wafer carried by the positioning mechanism is at least lower than the bottom horizontal height of the supporting unit;

[0058] Figure 17 Flowchart of the semiconductor transfer method disclosed by the present invention;

[0059] Figure 18 Flowchart of the semiconductor transfer method in another embodiment disclosed by the present invention;

[0060] Figure 19 Flowchart of the semiconductor transfer method in yet another embodiment disclosed by the present invention. Detailed Description of the Preferred Embodiments

[0061] The present invention will be described in detail below in conjunction with the embodiments shown in the drawings. However, it should be noted that these embodiments are not intended to limit the present invention. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present invention.

[0062] The drawings in the present invention are not strictly drawn to actual scale, and the specific dimensions of each structure can be determined according to actual needs. The drawings described in the present invention are only schematic diagrams of the structure.

[0063] The semiconductor transfer device 100a (or semiconductor transfer device 100b, or semiconductor transfer device 100c) disclosed in the present application can automatically transfer the first wafer 201 after being debonded from the second wafer 202 through the transfer mechanism 4. Compared with the wafer debonding device in the prior art that transfers the debonded upper wafer (i.e., the first wafer 201) manually or by a robotic arm, it can quickly and accurately receive the debonded first wafer 201 and transfer the first wafer 201 to the next processing step or storage location to improve production efficiency.

[0064] The following示例性 elaborates on the technical concept of the invention to be protected by the present application through multiple specific embodiments. Unless otherwise specified, the technical terms described in the embodiments shall be understood in accordance with the general meaning in the technical field to which the present application belongs.

[0065] Refer Figures 1 to 4 As shown, a specific embodiment of a semiconductor transfer device 100a is disclosed in the present application. The semiconductor transfer device 100a includes: a lifting mechanism 3, a transfer mechanism 4, and a clamping mechanism 5.

[0066] The system includes a lifting mechanism 3, a clamping mechanism 5 driven by the lifting mechanism 3 to move vertically, and a transmission mechanism 4. The transmission mechanism 4 includes a supporting unit 41 and a horizontal displacement component 42 that drives the supporting unit 41 to move closer to or away from the clamping mechanism 5. The clamping mechanism 5 clamps the edge of the first wafer 201, and the lifting mechanism 3 drives the clamping mechanism 5 to rise vertically to achieve vertical separation of the first wafer 201 and the second wafer 202. The supporting unit 41, driven by the horizontal displacement component 42, is horizontally inserted into at least the separation area M formed after the first wafer 201 and the second wafer 202 are vertically separated, so that the supporting unit 41 and the first wafer 201 form a supporting state.

[0067] The semiconductor transfer apparatus 100a provided in the above embodiments of this application clamps the edge of the debonded first wafer 201 using a clamping mechanism 5. Driven by a lifting mechanism 3, the clamping mechanism 5 rises longitudinally to achieve longitudinal separation of the first wafer 201 and the second wafer 202. After the first wafer 201 and the second wafer 202 are separated longitudinally and a separation region M is formed, a horizontal displacement component 42 drives a supporting unit 41 to be horizontally inserted at least into the separation region M. In other words, at least when the height H1 of the separation region M (i.e., the vertical distance between the first wafer 201 and the second wafer 202) is greater than the height H2 of the supporting unit 41, sufficient space is ensured in the separation region M. Then, the horizontal displacement component 42... 2. The drive support unit 41 is horizontally inserted into the separation region M. After the support unit 41 and the clamping mechanism 5 clamp the debonded first wafer 201 in the longitudinal direction, the clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls onto the support unit 41, so that the support unit 41 supports the first wafer 201, thereby receiving the first wafer 201. Subsequently, driven by the horizontal displacement component 42, it exits the separation region M, thereby transferring the first wafer 201 to the next processing step or storage location, so as to achieve fast and accurate reception of the debonded first wafer 201 and transfer the first wafer 201 to the next processing step or storage location, thereby improving production efficiency.

[0068] In some examples, the semiconductor transfer apparatus 100a further includes a positioning mechanism 1 for fixing a second wafer 202, the second wafer 202 carrying the first wafer 201. In some examples, the positioning mechanism 1 supports and fixes the second wafer 202 in a horizontal orientation. The positioning mechanism 1 is longitudinally opposed to the clamping mechanism 2 and located below the clamping mechanism 2, so that the lifting mechanism 3 drives the clamping mechanism 5 to move longitudinally closer to or away from the positioning mechanism 1. In some examples, the positioning mechanism 1 can be configured as a vacuum adsorption platform, which creates a negative pressure by evacuating air to generate an adsorption force on the second wafer 202, thereby fixing the second wafer 202. Since the positioning mechanism 1 is not the inventive point of this application, it will not be described in detail.

[0069] As shown in Figure 1 FIG. Figure 2 , the lifting mechanism 3 is used to drive the clamping mechanism 5 to move up and down longitudinally. The longitudinal direction refers to the vertical direction perpendicular to the horizon or the horizontal plane, that is, Figure 1 the direction shown by the Y-axis in Figure 1 . The clamping mechanism 5 moves down longitudinally under the drive of the lifting mechanism 3 (such as Figure 1 the direction shown by the arrow Y1 in Figure 2 ) until it stops at a suitable position, so that the clamping mechanism 5 can clamp the edge of the debonded first wafer 201 (such as Figure 2 ), and the lifting mechanism 3 drives the clamping mechanism 5 to lift the first wafer 201 longitudinally (such as Figure 2 the direction shown by the arrow Y2 in Figure 2 ) to separate the first wafer 201 and the second wafer 202 longitudinally (such as Figure 2 ). By driving the clamping mechanism 5 to rise longitudinally to a suitable position through the lifting mechanism 3, the vertical distance between the first wafer 201 and the supporting unit 41 can be reduced, so that the first wafer 201 can be placed on the supporting unit 41 with only a slight drop, reducing the impact force caused by free fall, and enabling the supporting unit 41 to receive the first wafer 201 more safely and accurately.

[0070] In some examples, the lifting mechanism 3 can be configured as a ball screw drive device, and is connected to the clamping mechanism 5 through a cantilever 31, and drives the clamping mechanism 5 to move up and down longitudinally by driving the cantilever 31. Since the lifting mechanism 3 is not the inventive point of this application, it will not be described in detail.

[0071] As shown in Figures 1 to 3 , the clamping mechanism 5 is used to clamp or release the edge of the first wafer 201. By clamping the edge of the first wafer 201 with the clamping mechanism 5, a uniform clamping force can be ensured on the edge of the first wafer 201, preventing the first wafer 201 from being damaged due to excessive local stress. In some examples, after the clamping mechanism 5 clamps the first wafer 201, it maintains its stability in a horizontal posture. When the first wafer 201 falls in a horizontal posture, its weight can be evenly distributed on the supporting unit 41, avoiding damage caused by excessive local stress.

[0072] In some examples, after the clamping mechanism 5 clamps the edge of the first wafer 201 and before the first wafer 201 and the second wafer 202 are separated longitudinally, the first wafer 201 and the second wafer 202 can be debonded by an external debonding device (not shown). After the first wafer 201 is debonded, the clamping mechanism 5 clamps the edge of the debonded first wafer 201, and the positioning mechanism 1 fixes the second wafer 202 to prevent the second wafer 202 from moving along with the first wafer 201 due to residual temporary bonding glue or other factors. Then, the lifting mechanism 3 drives the clamping mechanism 5 to rise longitudinally (such as Figure 2in the direction indicated by arrow Y2 to drive the first wafer 201 and the second wafer 202 to separate longitudinally, so as to prevent the clamping mechanism 5 from directly driving the unbonded first wafer 201 to rise longitudinally, resulting in breakage of the first wafer 201 due to excessive mechanical stress.

[0073] As shown in Figure 1 and Figure 2 shown, the transfer mechanism 4 is used to receive the unbonded first wafer 201 clamped by the clamping mechanism 5 and transfer the first wafer 201 to the next processing step or storage location.

[0074] Specifically, the transfer mechanism 4 includes: a supporting unit 41, and a horizontal displacement component 42 for driving the supporting unit 41 to approach or move away from the clamping mechanism 5. The horizontal displacement component 42 is used to drive the supporting unit 41 to move in the horizontal direction (i.e., Figure 1 the direction indicated by the X-axis in Figure 2 to approach or move away from the clamping mechanism 5. After the first wafer 201 and the second wafer 202 are separated longitudinally and a separation area M is formed, the supporting unit 41 is driven by the horizontal displacement component 42 and horizontally inserted into at least the separation area M in the direction indicated by arrow X1 in Figure 2 or Figure 15 ). After the supporting unit 41 is inserted in place, the unbonded first wafer 201 clamped by the supporting unit 41 and the clamping mechanism 5 is accurately aligned longitudinally (such as Figure 4 ), ensuring that the first wafer 201 can be correctly placed on the supporting unit 41. The clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls onto the supporting unit 41 to enable the supporting unit 41 to hold the first wafer 201, so that the supporting unit 41 can quickly and accurately receive the first wafer 201. Subsequently, under the drive of the horizontal displacement component 42, it exits the separation area M in the direction indicated by arrow X2 in

[0075] and moves away from the clamping mechanism 5 to transfer the first wafer 201 to the next processing step or storage location, thereby improving production efficiency. Figure 2 or Figure 15 ), and it is also necessary that the height H1 of the separation area M is at least greater than the height H2 of the supporting unit 41 after (such as Figure 2 or Figure 16), and then the horizontal displacement component 42 drives the supporting unit 41 to horizontally insert into the separation area M to ensure that there is enough space in the separation area M to prevent the supporting unit 41 from colliding with the first wafer 201 during the insertion process, thereby protecting the safety of the first wafer 201 and the supporting unit 41.

[0076] In some examples, to avoid damage caused when the first wafer 201 naturally falls on the supporting unit 41, after the first wafer 201 and the second wafer 202 are longitudinally separated, when the supporting unit 41 inserts into the separation area M and the longitudinal distance from the first wafer 201 is relatively far (such as Figure 2 ), the lifting mechanism 3 drives the clamping mechanism 5 to slowly descend longitudinally (such as Figure 3 ), to reduce the distance between the first wafer 201 and the supporting unit 41. By controlling the descending speed and distance of the clamping mechanism 5, the distance between the first wafer 201 and the supporting unit 41 is made as small as possible (such as Figure 15 or Figure 16 ), thereby avoiding the impact force and potential damage caused by the free fall of the first wafer 201. Or, in some examples, during the longitudinal separation of the first wafer 201 and the second wafer 202, when the bottom horizontal height of the first wafer 201 is at least higher than the top horizontal height of the supporting unit 41, after the height of the separation area M is slightly greater than the height of the supporting unit 41 (such as Figure 15 or Figure 16 ), stop the first wafer 201 from rising, and then the horizontal displacement component 42 drives the supporting unit 41 to horizontally insert into the separation area M to reduce the distance between the first wafer 201 and the supporting unit 41, thereby avoiding damage caused when the first wafer 201 naturally falls on the supporting unit 41. And compared with the above examples, there is no need for the lifting mechanism 3 to additionally drive the clamping mechanism 5 to descend, so as to reduce the stroke of the lifting mechanism 3, simplify the operation steps, and improve the process efficiency.

[0077] Refer Figure 11 to Figure 15 As shown, the supporting unit 41 includes: a bottom plate 411 for supporting the first wafer 201, and an arc portion 412 protruding from the bottom plate 411 and circumferentially surrounding the outside of the first wafer 201. The first wafer 201 is supported by only contacting the back surface of the first wafer 201 (i.e., the surface facing the bottom plate 411) through the bottom plate 411, so that the back surface of the first wafer 201 can be evenly stressed, providing stable physical support for the first wafer 201 and ensuring that the first wafer 201 remains stable during the entire transfer process. The arc portion 412 plays a circumferential limiting role on the first wafer 201 to prevent the first wafer 201 from undergoing horizontal displacement during the transfer process. Optionally, the bottom plate 411 can be made of a flexible material, such as rubber or plastic, to absorb the impact force of the natural fall of the first wafer 201 and protect the first wafer 201 from physical damage.

[0078] In some examples, the shape and size of the bottom plate 411 can be matched with the first wafer 201 to ensure that the first wafer 201 can accurately fall onto the bottom plate 411, reducing the possibility of positional deviation and maintaining the correct position throughout the transfer process, thereby improving the transfer accuracy. Moreover, to accommodate first wafers 201 of different sizes, the shape and size of the bottom plate 411 can be adjusted.

[0079] See Figure 11 As shown, in some examples, the bottom plate 411 is configured with a relief portion 4111 that exposes part of the bottom surface of the first wafer 201. After the first wafer 201 is transferred to the next processing step or storage location, it provides an operating space for the manipulator (not shown) in subsequent processes, enabling the manipulator to more conveniently grasp the edge of the first wafer 201 and remove the first wafer 201.

[0080] In some examples, see Figure 11 And Figure 15 As shown, the top water level of the arc portion 412 is higher than the top water level of the bottom plate 411, and the length of the arc portion 412 is greater than the semi-circumference length of the first wafer 201. The top of the arc portion 412 is higher than the bottom plate 411 to provide higher lateral support at the edge of the first wafer 201, preventing the first wafer 201 from undergoing horizontal displacement during the transfer process. Also, the relatively high arc portion 412 can serve as an outer peripheral barrier for the first wafer 201, reducing the influence of external factors (such as air flow and mechanical collisions) on the first wafer 201 and protecting the first wafer 201 from accidental damage. The length of the arc portion 412 is greater than the semi-circumference length of the first wafer 201, which can more comprehensively wrap the outer edge of the first wafer 201, providing a wider range of lateral support for the first wafer 201 and ensuring the stability of the first wafer 201 throughout the transfer process, reducing the risk of damage that may be caused by晃动.

[0081] In some examples, see Figure 1 And Figure 2 As shown, the horizontal displacement assembly 42 includes: a displacement driving unit 421, and a horizontal displacement support 422 that connects to the arc portion 412 and is controlled by the displacement driving unit 421. The displacement driving unit 421 is responsible for providing power and controlling the movement of the horizontal displacement support 422. The displacement driving unit 421 can be configured as an electric linear actuator, a stepper motor, a servo motor, etc. The horizontal displacement support 422 connects to the arc portion 412 and can also connect to the bottom plate 411 to perform horizontal movement under the control of the displacement driving unit 421.

[0082] In some examples, see Figure 1 、 Figures 12 to 14As shown, the clamping mechanism 5 includes a clamping drive unit 51 and two clamping members 52 controlled by the clamping drive unit 51 and moving closer or further apart to clamp or release the edge of the first wafer 201. The clamping drive unit 51 is responsible for providing power and controlling the two clamping members 52 to move closer or further apart. The clamping drive unit 51 includes two drive arms 511 respectively connected to the two clamping members 52. By driving the two drive arms 511 to move closer or further apart to synchronously drive the two clamping members 52, the clamping members 52 are driven to clamp or release the edge of the first wafer 201. Optionally, the clamping drive unit 51 is configured as a combination of a servo motor (not shown) and a ball screw (not shown) to drive the two drive arms 511 to move the two clamping members 52 closer or further apart. The clamping drive unit 51 can also be configured as other devices capable of driving the two clamping members 52 closer or further apart, and this disclosure does not limit this.

[0083] In some examples, the clamping member 52 only contacts the edge of the first wafer 201 to avoid scratching or other damage to the surface of the first wafer 201. The clamping members 52 are symmetrically distributed on both sides of the edge of the first wafer 201 to ensure that the pressure applied to both sides of the edge of the first wafer 201 is uniform and to prevent excessive local force from causing the first wafer 201 to break. The clamping drive unit 51 can adjust the clamping force according to the different heights and material properties of the first wafer 201 to ensure that the first wafer 201 is not damaged due to insufficient clamping force and to avoid damage to the first wafer 201 due to excessive clamping force.

[0084] In some examples, the two clamps 52 are in Figure 14 In the separated state, when the clamping mechanism 5 descends longitudinally under the drive of the lifting mechanism 3 until it moves to a suitable position, the clamping drive unit 51 activates to drive the clamping member 52 to clamp the edge of the first wafer 201 (e.g., ...). Figure 12 , Figure 13 Before the support unit 41 is horizontally inserted into the separation region M, the clamping member 52 maintains a stable clamping position on the first wafer 201 until the support unit 41 is horizontally inserted into the separation region M (e.g., ...). Figure 2 The lifting mechanism 3 drives the clamping mechanism 5 to descend longitudinally, and when the vertical distance between the first wafer 201 and the supporting unit 41 is appropriate (e.g., Figure 3 The clamping drive unit 51 reverses its action, causing the two clamping members 52 to move away from each other (e.g., ...). Figure 14 Release the first chip 201, and the supporting unit 41 supports the rear edge of the first chip 201. Figure 4 Exit the separation region M in the direction indicated by the middle arrow X2 (e.g.) Figure 4 The clamping mechanism 5 returns to its initial position, ready for the next operation.

[0085] In some examples, the parameter Figure 13 and Figure 15As shown, the clamping member 52 has a protrusion 521 extending longitudinally downwards to form at least a partial gripping portion of the edge of the first wafer 201. The protrusion 521 is designed to be arc-shaped, preferably semi-arc-shaped (e.g., Figure 13 The protrusion 521 fits tightly against the edge of the first wafer 201 to provide a larger contact area and enhance the clamping force on the first wafer 201. Furthermore, the semi-circular protrusion 521 can distribute the clamping force more evenly on both sides of the edge of the first wafer 201, avoiding excessive localized force that could cause wafer breakage. The protrusion 521 can be adjusted according to different sizes of the first wafer 201 to increase the versatility and flexibility of the semiconductor transfer device 100a.

[0086] Please refer to Figures 5 to 7 Another specific embodiment of the semiconductor transfer device 100b disclosed herein. The semiconductor transfer device 100b includes: a positioning mechanism 1, a lifting mechanism 3, a transfer mechanism 4, and a clamping mechanism 5.

[0087] The device includes a clamping mechanism 5, a positioning mechanism 1 that supports and fixes the second wafer 202, a lifting mechanism 3 that drives the positioning mechanism 1 to move up and down longitudinally, and a transmission mechanism 4. The transmission mechanism 4 includes a supporting unit 41 and a horizontal displacement component 42 that drives the supporting unit 41 to move closer to or away from the clamping mechanism 5. The clamping mechanism 5 clamps the edge of the first wafer 201, and the lifting mechanism 3 drives the positioning mechanism 1 to descend longitudinally to achieve longitudinal separation of the first wafer 201 and the second wafer 202. The supporting unit 41 is horizontally inserted into the separation area M formed after the first wafer 201 and the second wafer 202 are separated longitudinally under the drive of the horizontal displacement component 42, so that the supporting unit 41 and the first wafer 201 form a supporting state.

[0088] The semiconductor transfer apparatus 100b provided in the above embodiments of this application clamps the edge of the debonded first wafer 201 using a clamping mechanism 5. Driven by a lifting mechanism 3, a positioning mechanism 1 descends longitudinally to achieve longitudinal separation of the first wafer 201 and the second wafer 202. After the first wafer 201 and the second wafer 202 are separated longitudinally and a separation region M is formed, a horizontal displacement component 42 drives a supporting unit 41 to be horizontally inserted at least into the separation region M. In other words, at least after the height H1 of the separation region M (i.e., the vertical distance between the first wafer 201 and the second wafer 202) is greater than the height H2 of the supporting unit 41 (e.g., ...). Figure 6 To ensure sufficient space in the separation region M, the horizontal displacement component 42 drives the support unit 41 to be horizontally inserted into the separation region M. The first wafer 201, after being debonded and held by the support unit 41 and the clamping mechanism 5, is precisely aligned longitudinally (e.g., ...). Figure 6 or Figure 15) The clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls onto the supporting unit 41, so as to enable the supporting unit 41 to hold the first wafer 201. After the supporting unit 41 receives the first wafer 201, under the drive of the horizontal displacement component 42, the supporting unit 41 exits the separation area M, thereby transferring the first wafer 201 to the next processing step or storage position, so as to quickly and accurately receive the first wafer 201 after debonding and transfer the first wafer 201 to the next processing step or storage position, thereby improving production efficiency.

[0089] Refer Figure 5 As shown, the positioning mechanism 1 is used to fix the second wafer 202, and the second wafer 202 carries the first wafer 201. The positioning mechanism 1 and the clamping mechanism 2 are arranged oppositely along the longitudinal direction and are located below the clamping mechanism 2, so that the lifting mechanism 3 drives the clamping mechanism 5 to lift or lower along the longitudinal direction to approach or move away from the positioning mechanism 1. In some examples, the positioning mechanism 1 supports and fixes the second wafer 202 in a horizontal posture. In some examples, the positioning mechanism 1 can be configured as a vacuum adsorption platform, and negative pressure is formed by pumping air to generate an adsorption force on the second wafer 202 to fix the second wafer 202. Since the positioning mechanism 1 is not the inventive point of the present application, it will not be described in detail.

[0090] Refer Figure 5 And Figure 6 As shown, the lifting mechanism 3 is used to drive the positioning mechanism 1 to lift or lower along the longitudinal direction. The longitudinal direction refers to the vertical direction perpendicular to the horizon or the horizontal plane, that is Figure 5 the direction shown by the Y axis in Figure 5 The positioning mechanism 1 rises along the longitudinal direction under the drive of the lifting mechanism 3 (such as Figure 6 the direction shown by the arrow Y2 in

[0091] Refer Figures 5 to 7 As shown, in some examples, the clamping mechanism 5 is fixed by an external support device (not shown), and the horizontal height position remains unchanged. After the clamping mechanism 5 clamps the edge of the first wafer 201, and before the first wafer 201 and the second wafer 202 are separated along the longitudinal direction, the first wafer 201 and the second wafer 202 are debonded by an external debonding device (not shown). After the first wafer 201 is debonded, the clamping mechanism 5 clamps the edge of the debonded first wafer 201, and the positioning mechanism 1 fixes the second wafer 202, so as to prevent the second wafer 202 from moving along with the first wafer 201 due to residual temporary bonding glue or other factors.

[0092] In some examples, the support unit 41, driven by the horizontal displacement component 42, is horizontally inserted into at least the separation region M formed after the first wafer 201 and the second wafer 202 are separated longitudinally. Specifically, after the clamping mechanism 5 clamps the edge of the debonded first wafer 201, the lifting mechanism 3 drives the positioning mechanism 1 to lower the second wafer 202 longitudinally (e.g., ...). Figure 6 (As indicated by the middle arrow Y1), to drive the second wafer 202 and the first wafer 201 to separate longitudinally (as shown by...). Figure 6 For example, when the clamping mechanism 5 clamps the edge of the first wafer 201 and the bottom horizontal height of the first wafer 201 is at least higher than the top horizontal height of the supporting unit 41 (e.g.) Figure 6 Furthermore, the lifting mechanism 3 needs to drive the positioning mechanism 1 to descend until the top horizontal height of the second chip 202 is at least lower than the bottom horizontal height of the supporting unit 41 (e.g., Figure 6 or Figure 16 To ensure sufficient space in the separation area M, the horizontal displacement component 42 drives the support unit 41 to be horizontally inserted into at least the separation area M in the direction indicated by arrow X1. After the support unit 41 is inserted into place, the support unit 41 and the first wafer 201 held by the clamping mechanism 5 are precisely aligned longitudinally to ensure that the first wafer 201 can be correctly placed on the support unit 41. Then, the clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls onto the support unit 41, so that the support unit 41 supports the first wafer 201.

[0093] Of course, in some examples not shown, when the clamping mechanism 5 clamps the edge of the first wafer 201, the bottom horizontal height of the first wafer 201 may also be lower than the top horizontal height of the supporting unit 41. To avoid interference between the supporting unit 41 and the clamping mechanism 5 or the first wafer 201 during the movement of the supporting unit 41 in the direction indicated by arrow X1, the transmission mechanism 4 further includes: a lifting unit 423 that drives the supporting unit 41 to move up and down longitudinally. The lifting unit 423 drives the supporting unit 41 to descend longitudinally so that the top horizontal height of the supporting unit 41 is lower than the bottom horizontal height of the first wafer 201. Furthermore, the lifting mechanism 3 needs to drive the positioning mechanism 1 to descend until the top horizontal height of the second wafer 202 is at least lower than the bottom horizontal height of the supporting unit 41 (e.g., Figure 16To ensure sufficient space in the separation region M, the horizontal displacement component 42 drives the support unit 41 to be horizontally inserted into at least the separation region M in the direction indicated by arrow X1. To prevent damage to the first wafer 201 when it falls naturally onto the support unit 41, after the support unit 41 is inserted, it is precisely aligned longitudinally with the debonded first wafer 201 held by the clamping mechanism 5. The lifting unit 423 drives the support unit 41 to slowly rise longitudinally, reducing the distance between the first wafer 201 and the support unit 41 (e.g., ...). Figure 6 , Figure 15 This prevents damage to the first chip 201 when it falls naturally onto the support unit 41. In some examples, the lifting unit 423 can be a telescopic device such as an electric actuator, cylinder, or electric lead screw.

[0094] The technical solutions of the semiconductor transfer device 100b disclosed in this embodiment and the semiconductor transfer device 100a in the previous embodiment include the same parts, which will not be repeated here.

[0095] Please refer to Figures 8 to 10 Another specific embodiment of the semiconductor transfer device 100c disclosed herein. The semiconductor transfer device 100c includes: a positioning mechanism 1, a lifting mechanism 3, a transfer mechanism 4, and a clamping mechanism 5.

[0096] The device includes a clamping mechanism 5, a positioning mechanism 1 that supports and fixes the second wafer 202, a lifting mechanism 3 that drives the positioning mechanism 1 and the clamping mechanism 5 to move vertically, and a transmission mechanism 4. The transmission mechanism 4 includes a supporting unit 41 and a horizontal displacement component 42 that drives the supporting unit 41 to move closer to or further away from the clamping mechanism 5. The clamping mechanism 5 clamps the edge of the first wafer 201, and the lifting mechanism 3 drives the positioning mechanism 1 and the clamping mechanism 5 to move in opposite directions vertically to achieve vertical separation of the first wafer 201 and the second wafer 202. The supporting unit 41 is horizontally inserted into the separation area M formed after the first wafer 201 and the second wafer 202 are vertically separated under the drive of the horizontal displacement component 42, so that the supporting unit 41 and the first wafer 201 form a supporting state.

[0097] The semiconductor transfer apparatus 100c provided in the above embodiments of this application clamps the edge of the first wafer 201 after debonding via a clamping mechanism 5. The lifting mechanism 3 drives the positioning mechanism 1 to move longitudinally in opposite directions from the clamping mechanism 5; that is, the lifting mechanism 3 drives the positioning mechanism 1 to move longitudinally downwards (e.g., ...). Figure 9 (As indicated by the middle arrow Y1), the lifting mechanism 3 drives the clamping mechanism 5 to move longitudinally upward (as shown by the middle arrow Y1). Figure 9in the direction indicated by arrow Y2) to achieve longitudinal separation of the first wafer 201 and the second wafer 202. After the first wafer 201 and the second wafer 202 are longitudinally separated and a separation region M is formed, the horizontal displacement component 42 drives the supporting unit 41 to horizontally insert at least into the separation region M. In other words, at least after the height H1 of the separation region M (i.e., the vertical distance between the first wafer 201 and the second wafer 202) is greater than the height H2 of the supporting unit 41 (as Figure 9 ), to ensure that there is sufficient space in the separation region M, and then the horizontal displacement component 42 drives the supporting unit 41 to horizontally insert into the separation region M. After the supporting unit 41 and the first wafer 201 clamped by the clamping mechanism 5 are precisely aligned longitudinally (as Figure 9 or Figure 15 ), the clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls onto the supporting unit 41 to achieve the supporting unit 41 supporting the first wafer 201. After the supporting unit 41 receives the first wafer 201, the supporting unit 41 exits the separation region M under the drive of the horizontal displacement component 42, thereby transferring the first wafer 201 to the next processing step or storage location, so as to achieve rapid and precise reception of the debonded first wafer 201 and transfer the first wafer 201 to the next processing step or storage location, thereby improving production efficiency.

[0098] As Figure 9 shown, the lifting mechanism 3 drives the positioning mechanism 1 and the clamping mechanism 5 to move away from each other longitudinally. The longitudinal direction refers to the vertical direction perpendicular to the horizon or the horizontal plane, that is, Figure 8 the direction indicated by the Y-axis in Figure 8 . During the working process, the clamping mechanism 5 descends longitudinally under the drive of the lifting mechanism 3 (as Figure 8 in the direction indicated by arrow Y1 in Figure 8 ), and the positioning mechanism 1 ascends longitudinally under the drive of the lifting mechanism 3 (as Figure 9 in the direction indicated by arrow Y2 in Figure 9in the direction indicated by arrow Y2) to longitudinally separate the first wafer 201 from the second wafer 202. The lifting mechanism 3 drives the clamping mechanism 5 to rise longitudinally to a suitable position to reduce the vertical distance between the first wafer 201 and the supporting unit 41, enabling the first wafer 201 to be placed on the supporting unit 41 with only a slight descent, reducing the impact force caused by free fall, and enabling the supporting unit 41 to receive the first wafer 201 more safely and accurately.

[0099] In some examples, the lifting mechanism 3 can be configured as a ball screw drive device and is respectively connected to the positioning mechanism 1 and the clamping mechanism 5 through the cantilever 31, and drives the positioning mechanism 1 and the clamping mechanism 5 to lift and lower longitudinally by driving the cantilever 31. Since the lifting mechanism 3 is not the inventive point of this application, it will not be described in detail.

[0100] In some examples, after the clamping mechanism 5 clamps the edge of the first wafer 201 and before the first wafer 201 and the second wafer 202 are longitudinally separated, the first wafer 201 and the second wafer 202 can be debonded by an external debonding device (not shown). After the first wafer 201 is debonded, the clamping mechanism 5 clamps the edge of the debonded first wafer 201, and the positioning mechanism 1 fixes the second wafer 202 to prevent the second wafer 202 from moving with the first wafer 201 due to residual temporary bonding glue or other factors.

[0101] For the technical solutions of the same parts included in the semiconductor transfer device 100c disclosed in this embodiment and the semiconductor transfer device 100a or semiconductor transfer device 100c in the foregoing embodiment, refer to the foregoing embodiment and will not be elaborated here.

[0102] Based on the technical solution of a semiconductor transfer device 100a disclosed in the foregoing embodiment, this embodiment also discloses a semiconductor transfer method.

[0103] Refer to Figures 1 to 4 、 Figure 17 As shown, the semiconductor transfer method includes the following steps:

[0104] Step S1, the clamping mechanism 5 clamps the edge of the first wafer 201. The clamping mechanism 5 descends longitudinally under the drive of the lifting mechanism 3 (such as Figure 1 in the direction indicated by arrow Y1) until it stops at a suitable position, and the clamping mechanism 5 clamps the edge of the debonded first wafer 201 (such as Figure 1 ).

[0105] Step S2, the lifting mechanism 3 drives the clamping mechanism 5 to rise longitudinally to longitudinally separate the first wafer 201 from the second wafer 202. The lifting mechanism 3 drives the clamping mechanism 5 to lift the first wafer 201 longitudinally (such as Figure 2 in the direction indicated by arrow Y2 in order to drive the first wafer 201 and the second wafer 202 to be separated longitudinally (such as Figure 2 ).

[0106] Step S3: The horizontal displacement component 42 drives the supporting unit 41 to horizontally insert at least into the separation area M formed after the first wafer 201 and the second wafer 202 are separated longitudinally. After the first wafer 201 and the second wafer 202 are separated longitudinally and the separation area M is formed, the supporting unit 41 is driven by the horizontal displacement component 42 and moves along Figure 2 in the direction indicated by arrow X1 in order to horizontally insert at least into the separation area M. In other words, at least after the height H1 of the separation area M is greater than the height H2 of the supporting unit 41 (such as Figure 2 ), to ensure that there is enough space in the separation area M, and then the horizontal displacement component 42 drives the supporting unit 41 to horizontally insert into the separation area M.

[0107] Step S4: The clamping mechanism 5 releases the first wafer 201 so that the first wafer 201 is held by the supporting unit 41. After the supporting unit 41 is inserted in place, the supporting unit 41 and the first wafer 201 held by the clamping mechanism 5 are precisely aligned longitudinally (such as Figure 2 ), ensuring that the first wafer 201 can be correctly placed on the supporting unit 41. The clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls onto the supporting unit 41, so as to realize that the supporting unit 41 holds the first wafer 201, so that the supporting unit 41 can quickly and accurately receive the first wafer 201. Subsequently, under the drive of the horizontal displacement component 42, it moves along Figure 4 in the direction indicated by arrow X2 in order to exit the separation area M and move away from the clamping mechanism 5, so as to transfer the first wafer 201 to the next processing step or storage location, thereby improving production efficiency.

[0108] Based on the technical solution of a semiconductor transfer device 100b disclosed in the foregoing embodiments, this embodiment also discloses a semiconductor transfer method.

[0109] Referring to Figures 5 to 7 , Figure 18 as shown, the semiconductor transfer method includes the following steps:

[0110] Step S1: The clamping mechanism 5 clamps the edge of the first wafer 201. The positioning mechanism 1 rises longitudinally under the drive of the lifting mechanism 3 (such as Figure 5 in the direction indicated by arrow Y2) until it stops after moving to a suitable position for the clamping mechanism 5 to clamp the edge of the de-bonded first wafer 201.

[0111] Step S2: The lifting mechanism 3 drives the positioning mechanism 1 to descend longitudinally, so as to separate the first wafer 201 and the second wafer 202 longitudinally. The driving positioning mechanism 1 descends longitudinally (as Figure 6 shown by the arrow Y1 in

[0112] ), so as to drive the second wafer 202 and the first wafer 201 to separate longitudinally. Figure 6 Step S3: The horizontal displacement component 42 drives the supporting unit 41 to horizontally insert at least into the separation area M formed after the first wafer 201 and the second wafer 202 are separated longitudinally. After the first wafer 201 and the second wafer 202 are separated longitudinally and the separation area M is formed, the supporting unit 41 is driven by the horizontal displacement component 42 and inserted horizontally along Figure 6 the direction shown by the arrow X1 in

[0113] at least into the separation area M. In other words, at least after the height H1 of the separation area M is greater than the height H2 of the supporting unit 41 (as Figure 6 ), to ensure that there is enough space in the separation area M, and then the horizontal displacement component 42 is used to drive the supporting unit 41 to horizontally insert into the separation area M. Figure 7 Step S4: The clamping mechanism 5 releases the first wafer 201, so that the first wafer 201 is supported by the supporting unit 41. After the supporting unit 41 is inserted in place, the supported unit 41 and the first wafer 201 clamped by the clamping mechanism 5 are precisely aligned longitudinally (as

[0114] ), ensuring that the first wafer 201 can be correctly placed on the supporting unit 41. The clamping mechanism 5 releases the edge of the first wafer 201, and the first wafer 201 naturally falls on the supporting unit 41, so as to realize that the supporting unit 41 supports the first wafer 201, so that the supporting unit 41 can quickly and accurately receive the first wafer 201. Subsequently, driven by the horizontal displacement component 42, it exits the separation area M along

[0115] the direction shown by the arrow X2 in Figures 8 to 10 and Figure 19 and moves away from the clamping mechanism 5, so as to transfer the first wafer 201 to the next processing step or storage position, thereby improving production efficiency.

[0116] Based on the technical solution of a semiconductor transfer device 100c disclosed in the foregoing embodiments, this embodiment also discloses a semiconductor transfer method. Figure 8 Step S1: The clamping mechanism 5 clamps the edge of the first wafer 201. The clamping mechanism 5 descends longitudinally under the drive of the lifting mechanism 3 (as Figure 8 shown by the arrow Y1 in(As indicated by the middle arrow Y2), until the clamping mechanism 5 and the positioning mechanism 1 move to the appropriate position and stop, so that the clamping mechanism 5 can clamp the edge of the first wafer 201 after it has been debonded (as shown by the middle arrow Y2). Figure 8 ).

[0117] Step S2: The lifting mechanism 3 drives the positioning mechanism 1 and the clamping mechanism 5 to move longitudinally in opposite directions to achieve longitudinal separation of the first wafer 201 and the second wafer 202. The lifting mechanism 3 drives the positioning mechanism 1 and the clamping mechanism 5 to move longitudinally in opposite directions, that is, the lifting mechanism 3 drives the positioning mechanism 1 to move longitudinally downwards (e.g., ...). Figure 9 (As indicated by the middle arrow Y1), the lifting mechanism 3 drives the clamping mechanism 5 to move longitudinally upward (as shown by the middle arrow Y1). Figure 9 (in the direction indicated by the middle arrow Y2) to achieve longitudinal separation of the first wafer 201 and the second wafer 202.

[0118] Step S3: The horizontal displacement component 42 drives the support unit 41 to be horizontally inserted at least after the first wafer 201 and the second wafer 202 have separated longitudinally to form a separation region M. After the first wafer 201 and the second wafer 202 have separated longitudinally and formed the separation region M, the support unit 41, driven by the horizontal displacement component 42, moves along... Figure 9 The horizontal insertion is indicated by the middle arrow X1 at least within the separation region M. In other words, it is done at least after the height H1 of the separation region M is greater than the height H2 of the supporting unit 41 (e.g., ...). Figure 9 This ensures that the separation area M has sufficient space, and then the horizontal displacement component 42 drives the support unit 41 to be horizontally inserted into the separation area M.

[0119] Step S4: The clamping mechanism 5 releases the first wafer 201, allowing the support unit 41 to hold the first wafer 201. After the support unit 41 is inserted into place, the support unit 41 and the debonded first wafer 201 held by the clamping mechanism 5 are precisely aligned longitudinally (e.g., ...). Figure 9 To ensure the first chip 201 is correctly placed on the support unit 41, the clamping mechanism 5 releases the edge of the first chip 201, allowing it to fall naturally onto the support unit 41. This enables the support unit 41 to hold the first chip 201 quickly and accurately, and then, driven by the horizontal displacement component 42, moves it along... Figure 10 The first wafer 201 is moved out of the separation area M and away from the clamping mechanism 5 in the direction indicated by the middle arrow X2, so as to transfer the first wafer 201 to the next processing step or storage location, thereby improving production efficiency.

[0120] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0121] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0122] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor transfer apparatus, characterized in that, include: The lifting mechanism, the clamping mechanism driven by the lifting mechanism to move vertically, and the transmission mechanism; The transmission mechanism includes: a support unit, and a horizontal displacement component that drives the support unit to move closer to or away from the clamping mechanism; The clamping mechanism clamps the edge of the first wafer, and the lifting mechanism drives the clamping mechanism to rise longitudinally, so as to separate the first wafer and the second wafer longitudinally. The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the first wafer and the second wafer are separated longitudinally, so that the supporting unit and the first wafer form a supporting state.

2. A semiconductor transfer apparatus, characterized in that, include: The device includes a clamping mechanism, a positioning mechanism that clamps the edge of the first wafer carried by the second wafer, a lifting mechanism that drives the positioning mechanism to move up and down longitudinally, and a transmission mechanism. The transmission mechanism includes: a support unit, and a horizontal displacement component that drives the support unit to move closer to or away from the clamping mechanism; The clamping mechanism clamps the edge of the first wafer, and the lifting mechanism drives the positioning mechanism to descend longitudinally, so as to separate the first wafer from the second wafer longitudinally. The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the first wafer and the second wafer are separated longitudinally, so that the supporting unit and the first wafer form a supporting state.

3. A semiconductor transfer apparatus, characterized in that, include: The device includes a clamping mechanism, a positioning mechanism that clamps the edge of the first wafer carried by the second wafer, a positioning mechanism that supports and fixes the second wafer, a lifting mechanism that drives the positioning mechanism and the clamping mechanism to move up and down longitudinally, and a transmission mechanism. The transmission mechanism includes: a support unit, and a horizontal displacement component that drives the support unit to move closer to or away from the clamping mechanism; The clamping mechanism clamps the edge of the first wafer, and the lifting mechanism drives the positioning mechanism and the clamping mechanism to move in opposite directions along the longitudinal direction, so as to separate the first wafer and the second wafer along the longitudinal direction. The supporting unit, driven by the horizontal displacement component, is horizontally inserted into at least the separation area formed after the first wafer and the second wafer are separated longitudinally, so that the supporting unit and the first wafer form a supporting state.

4. The semiconductor transfer apparatus according to claim 2, characterized in that, The transmission mechanism further includes a lifting unit that drives the supporting unit to move up and down longitudinally.

5. The semiconductor transfer apparatus according to any one of claims 1 to 4, characterized in that, The supporting unit includes a base plate that supports the first wafer, the base plate having a protruding arc-shaped portion that circumferentially surrounds the outside of the first wafer.

6. The semiconductor transfer apparatus according to claim 5, characterized in that, The top water level of the arc-shaped portion is higher than the top water level of the base plate, and the length of the arc-shaped portion is greater than the semicircular length of the first wafer.

7. The semiconductor transfer apparatus according to claim 5, characterized in that, The base plate is configured to have a recessed portion that exposes part of the bottom surface of the first wafer.

8. The semiconductor transfer apparatus according to claim 5, characterized in that, The horizontal displacement assembly includes: a displacement driving unit, and a horizontal displacement support connected to the arcuate portion and controlled by the displacement driving unit.

9. The semiconductor transfer apparatus according to claim 5, characterized in that, The clamping mechanism includes: a clamping drive unit, and two clamping members controlled by the clamping drive unit and moving closer or further apart to clamp or release the edge of the first wafer.

10. The semiconductor transfer apparatus according to claim 9, characterized in that, The clamping member is longitudinally downwardly protruding to form a protrusion that at least partially supports the edge of the first wafer.

11. A semiconductor transfer method, characterized in that, Includes the following steps: Step S1: The clamping mechanism clamps the edge of the first wafer; Step S2: The lifting mechanism drives the clamping mechanism to rise longitudinally, so as to separate the first wafer and the second wafer longitudinally. Step S3: The horizontal displacement component drives the support unit to be horizontally inserted at least after the first wafer and the second wafer are separated longitudinally to form a separation region; Step S4: The clamping mechanism releases the first chip so that the supporting unit can hold the first chip.

12. A semiconductor transfer method, characterized in that, Includes the following steps: Step S1: The clamping mechanism clamps the edge of the first wafer; Step S2: The lifting mechanism drives the positioning mechanism to descend longitudinally to achieve longitudinal separation of the first wafer and the second wafer; Step S3: The horizontal displacement component drives the support unit to be horizontally inserted at least after the first wafer and the second wafer are separated longitudinally to form a separation region; Step S4: The clamping mechanism releases the first chip so that the supporting unit can hold the first chip.

13. A semiconductor transfer method, characterized in that, Includes the following steps: Step S1: The clamping mechanism clamps the edge of the first wafer; Step S2: The lifting mechanism drives the positioning mechanism and the clamping mechanism to move in opposite directions along the longitudinal direction to achieve longitudinal separation of the first wafer and the second wafer; Step S3: The horizontal displacement component drives the support unit to be horizontally inserted at least after the first wafer and the second wafer are separated longitudinally to form a separation region; Step S4: The clamping mechanism releases the first chip so that the supporting unit can hold the first chip.

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