electrostatic chuck
The electrostatic chuck design addresses thickness variations by using a dual ceramic member structure with overlapping electrodes to enhance adsorption capacity and stability, ensuring consistent electrostatic attraction and efficient heat transfer.
JP7894990B1Active Publication Date: 2026-07-24NITERRA CO LTD
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- NITERRA CO LTD
- Filing Date
- 2025-09-11
- Publication Date
- 2026-07-24
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Figure 0007894990000001_ABST
Abstract
This suppresses variations in the thickness of the ceramic material present between the wafer adsorbed to the first electrode and the first electrode. [Solution] The electrode embedding member comprises a first ceramic member having a first surface and a second surface formed on the opposite side of the first surface, a first electrode disposed on the first ceramic member and having a plane that aligns with the first surface, and a second ceramic member joined to the first surface and the plane of the first electrode.
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