Fully Automatic Integrated Vacuum Hole Sealing Machine

Abstract

We provide a fully automatic, integrated vacuum hole-filling machine that can automatically complete the hole-filling and squeegeeing processes for PCB boards. [Solution] The vacuum hole-filling machine comprises a base frame, a hole-filling device, a squeegee device, and a transfer mechanism. The hole-filling device is used to complete the hole-filling process of the PCB board, the squeegee device is used to complete the ink application and squeegeeing process of the PCB board, and the transfer mechanism is used to move the PCB board awaiting hole-filling to the clamping mechanism in the hole-filling device, or to move the PCB board after hole-filling is complete to the clamping mechanism of the squeegee device. By moving the PCB board to the clamping mechanisms of the hole-filling device and the squeegee device using the transfer mechanism, the supply operation of the PCB board hole-filling or squeegeeing process is automatically completed, thereby ensuring the efficiency, quality, and yield of the PCB board hole-filling and squeegeeing processes.

Description

[Technical Field]

[0001] The present invention relates to the technical field of PCB processing, and in particular to a fully automatic integrated vacuum hole plugging machine. [Background Art]

[0002] In the processing procedure of a PCB board, it is usually necessary to perform processes such as hole plugging and squeegee processing.

[0003] Conventional hole plugging machines for PCB boards usually can only perform the hole plugging process for PCB boards, and the squeegee process needs to be performed separately by a squeegee machine. That is, when performing the hole plugging process on a PCB board, an operator manually sets the PCB board on the hole plugging machine, and clamps the PCB board by a clamping mechanism inside the hole plugging machine to perform the hole plugging process. After the hole plugging process, the operator manually takes the PCB board out of the hole plugging machine, sets it on the squeegee machine, and further clamps the PCB board by a clamping mechanism inside the squeegee machine to perform the squeegee process.

[0004] As can be seen from the above, in the prior art, the hole plugging process and the squeegee process of a PCB board cannot be performed intensively on the same hole plugging machine. When the hole plugging process and the squeegee process are performed sequentially, it is necessary to manually set the PCB board on the clamping mechanism of the hole plugging machine or the squeegee machine. However, in the process of manually transferring the PCB board, due to operator fatigue, there is a possibility that the efficiency, quality and yield of the hole plugging process and the squeegee process of the PCB board cannot be guaranteed. [Summary of the Invention] [Problem to be Solved by the Invention]

[0005] In view of the deficiencies of the prior art, one of the objects of the present invention is to provide a fully automatic integrated vacuum hole plugging machine, which aims to solve the technical problems that the hole plugging process and the squeegee process of a PCB board cannot be intensively performed on the same hole plugging machine, and when manually transferring the PCB board from the hole plugging process to the squeegee process, the efficiency, quality and yield of the hole plugging process and the squeegee process of the PCB board cannot be guaranteed due to operator fatigue. [Means for solving the problem]

[0006] To achieve the above objective, the present invention employs the following technical solutions.

[0007] A fully automatic, integrated vacuum hole-filling machine, Base frame and A hole-filling device comprising a hole-filling chamber, a clamping mechanism A, a lifting device A, and a head assembly, wherein the hole-filling chamber is provided on a base frame and communicates with a vacuum device provided outside the hole-filling chamber, the clamping mechanism A is provided inside the hole-filling chamber and comprises a clamp plate, a lifting plate, and a plurality of telescopic units, the clamp plate is fixed inside the hole-filling chamber and lifting units are provided at both ends of the clamp plate, the lifting ends of the lifting units are connected to the lifting plate, the plurality of telescopic units are all provided on the lifting plate and clamp claws are connected to the telescopic ends of the telescopic units, a clamp passage is formed between the plurality of clamp claws and the clamp plate, the lifting device A is provided on the hole-filling chamber and is used to lift and lower the head assembly inside the hole-filling chamber, the head assembly is provided with a head, the head communicates with an ink negative pressure pipe located outside the hole-filling chamber and is used to fill the holes in the PCB board clamped by the clamping mechanism A, and the hole-filling device, A squeegee device comprising a squeegee chamber, a clamping mechanism B, a lifting device B, and a squeegee assembly, wherein the squeegee chamber is fixed on a base frame and provided at a distance from the hole-filling chamber in the lateral direction of the base frame, the clamping mechanism B is provided inside the squeegee chamber and the structure of the clamping mechanism B is the same as the structure of the clamping mechanism A, and the lifting device B is provided on the squeegee chamber and is used to raise and lower the squeegee assembly inside the squeegee chamber, and the squeegee device comprises a squeegee chamber, a clamping mechanism B, a lifting device B, and a squeegee assembly, the squeegee device comprising a squeegee chamber, a clamping mechanism B, a lifting device B, and a squeegee assembly, the squeegee chamber being fixed on a base frame and provided at a distance from the hole-filling chamber in the lateral direction of the base frame, the clamping mechanism B being provided inside the squeegee chamber and the structure of the clamping mechanism B being the same as the structure of the clamping mechanism A, and the lifting device B being provided above the squeegee chamber and used to raise and lower the squeegee assembly inside the squeegee chamber, A transfer mechanism comprising a linear drive module and a supply assembly, wherein the linear drive module is provided at the top of the base frame in the lateral direction, outside the hole-filling chamber and outside the squeegee chamber, the linear drive module is used to move the supply assembly laterally, and the supply assembly is used to grip a PCB board and transport it to the clamp passage.

[0008] Furthermore, the supply assembly comprises a clamping assembly, which is used to clamp PCB boards awaiting hole filling or squeegeeing.

[0009] Furthermore, the supply assembly further comprises an extrusion assembly, which is provided longitudinally on the base frame and connected to a linear drive module and a clamping assembly, and the extrusion assembly is used to push the clamping assembly into the filling chamber or squeegee chamber and to push the clamping assembly out of the filling chamber or squeegee chamber.

[0010] Furthermore, the extrusion assembly comprises a fixed seat, a movable seat, and a drive unit, wherein the fixed seat extends vertically, one end of the fixed seat is drive-connected to the linear drive module, guide blocks are provided on opposing sides of the other end of the fixed seat, rails are fixed to opposing sides of the movable seat, the rails extend longitudinally along the base frame and are slidable relative to the guide blocks, the drive unit is provided on the movable seat and drive-connected to the clamping assembly, and the drive unit is used to move the clamping assembly along the longitudinal direction of the base frame.

[0011] Furthermore, the movable seat is provided with a fall prevention plate member to prevent the PCB board held by the clamping assembly from falling.

[0012] Furthermore, the clamping assembly comprises a connecting plate, a drive mechanism, and two supply width adjustment plates, wherein the connecting plate extends laterally along the base frame and is fixed on the movable seat, the two supply width adjustment plates are provided at both ends of the connecting plate along the laterally along the base frame, and the drive mechanism is provided on the connecting plate and is used to move the two supply width adjustment plates toward or toward each other.

[0013] Furthermore, a ventilation conduit is provided at the top of the hole-filling chamber, the conduit communicates with the inside of the hole-filling chamber, and a ventilation valve is provided in the conduit, and the conduit is used to exhaust the inside of the hole-filling chamber.

[0014] Furthermore, the squeegee device further comprises an ink application assembly, which is provided on the squeegee chamber and comprises two connecting members and two ink extrusion heads, the two connecting members being provided in the squeegee chamber and the two ink extrusion heads being provided on the two connecting members respectively, the two ink extrusion heads being located in the squeegee chamber and the two ink extrusion heads being located on both sides of the PCB board clamped by the clamping mechanism B, the ink extrusion heads communicating via a pipeline to a vacuum ink extruder provided outside the squeegee chamber, the vacuum ink extruder supplying ink to the ink extrusion heads using a vacuum method, and the ink extrusion heads being used to apply ink to the PCB board clamped by the clamping mechanism B.

[0015] Furthermore, the ink application assembly further comprises a linear movement module, which is located at the top outside the squeegee chamber and is used to move the two connecting members along the lateral direction of the base frame.

[0016] Furthermore, each of the connecting members is provided with an extension mechanism, and the extension end of each extension mechanism extends along the longitudinal direction of the base frame and is driven and connected to each ink extrusion head. [Effects of the Invention]

[0017] Compared to the conventional technology, the beneficial effects of the present invention are as follows: When using the fully automatic integrated vacuum hole-filling machine according to the present invention, the machine hand grips the PCB board awaiting hole-filling and automatically supplies it to the supply assembly. Subsequently, the linear drive module moves the supply assembly along the lateral direction of the base frame to the position of the corresponding hole-filling chamber. Then, the supply assembly inserts the gripped PCB board into the hole-filling chamber. At this time, the lifting unit of the clamping mechanism A raises the lifting plate, ensuring that the supply assembly transports the PCB board along the longitudinal direction of the base frame until it contacts the clamping plate of the clamping mechanism A. After the supply assembly has transported the PCB board until it contacts the clamping plate of the clamping mechanism A, the lifting unit of the clamping mechanism A lowers the lifting plate of the clamping mechanism A, and each extension unit of the clamping mechanism A moves each clamping claw of the clamping mechanism A along the longitudinal direction of the base frame toward the clamping plate of the clamping mechanism A, thereby clamping and fixing the PCB board in the clamping passage of the clamping mechanism A. Next, the hole-filling chamber is sealed, maintaining a sealed state inside the chamber, and the air inside the hole-filling chamber is exhausted using a vacuum device. Simultaneously, the head assembly is raised and lowered using the lifting device A, thereby filling the holes in the PCB board, which is clamped and fixed by the clamping mechanism A, using the ink ejected from the head of the head assembly.

[0018] After the PCB board filling operation is complete, the filling chamber is opened, and the supply assembly is inserted into the corresponding filling chamber to clamp and fix the PCB board held by clamping mechanism A. At this time, the lifting unit of clamping mechanism A raises the lifting plate, and the supply assembly extends out of the filling chamber along the longitudinal direction of the base frame. Subsequently, the linear drive module moves the supply assembly along the transverse direction of the base frame to the position of the corresponding squeegee chamber. At this time, the filled PCB board held by the supply assembly is transported into the squeegee chamber along the longitudinal direction of the base frame. At this time, the lifting unit of clamping mechanism B raises the lifting plate, ensuring that the supply assembly transports the PCB board along the longitudinal direction of the base frame until it contacts the clamping plate of clamping mechanism B. After the supply assembly transports the PCB board until it contacts the clamp plate of clamp mechanism B, the lifting unit of clamp mechanism B lowers the lifting plate of clamp mechanism B, and each extension unit of clamp mechanism B moves each clamping claw of clamp mechanism B along the longitudinal direction of the base frame toward the clamp plate of clamp mechanism B, thereby clamping and fixing the PCB board in the clamping passage of clamp mechanism B. At this time, the squeegee assembly is raised and lowered by the lifting device B, thereby squeezing the PCB board clamped and fixed in clamp mechanism B.

[0019] As described above, the fully automatic integrated vacuum hole-filling machine of the present invention can automatically complete the hole-filling process and the squeegeeing process for PCB boards. Furthermore, by moving the PCB board to the clamping mechanism of the hole-filling device or the clamping mechanism of the squeegee device using the transfer mechanism, the supply operation for the PCB board hole-filling process or the squeegeeing process is automatically completed, thereby ensuring the efficiency, quality, and yield of the PCB board hole-filling process and the squeegeeing process. [Brief explanation of the drawing]

[0020] [Figure 1] This is a schematic diagram showing the structure of the fully automatic, integrated vacuum hole filling machine according to the present invention. [Figure 2] This is a front view of Figure 1. [Figure 3] It is a rear view of FIG. 1. [Figure 4] It is a schematic diagram showing the structure of the hole filling apparatus according to the present embodiment. [Figure 5] It is a front view of FIG. 4. [Figure 6] It is a schematic diagram showing the connection structure between the lifting device A and the head assembly according to the present embodiment. [Figure 7] It is a schematic diagram showing the structure of the head assembly according to the present embodiment. [Figure 8] It is a bottom view of FIG. 7. [Figure 9] It is a schematic diagram showing the structure of the front head component according to the present embodiment. [Figure 10] It is a schematic diagram showing the structure of the rear head component according to the present embodiment. [Figure 11] It is a schematic diagram showing the structure in a state where the clamp mechanism A according to the present embodiment clamps a PCB board. [Figure 12] It is a schematic diagram showing the structure of the clamp mechanism A according to the present embodiment. [Figure 13] It is a bottom view of FIG. 12. [Figure 14] It is a schematic diagram showing the three-dimensional structure of the squeegee apparatus according to the present embodiment. [Figure 15] It is a rear view showing the squeegee apparatus according to the present embodiment. [Figure 16] It is a schematic diagram showing the structure of the squeegee assembly according to the present embodiment. [Figure 17] It is a schematic diagram showing the structure of the ink application assembly according to the present embodiment. [Figure 18] It is a schematic diagram showing the structure of the transfer mechanism according to the present embodiment. [Figure 19] It is a schematic diagram showing the structure of FIG. 18 viewed from another angle. [Figure 20] It is a front view of the supply assembly according to the present embodiment. [Figure 21] It is a rear view of the supply assembly according to the present embodiment. [Figure 22] It is a schematic diagram showing the connection structure of the supply assembly and the extrusion assembly according to the present embodiment. [Figure 23] This is a schematic diagram showing the structure from a different angle than Figure 22. [Modes for carrying out the invention]

[0021] The specific embodiments described herein are merely for interpretation purposes and should not be understood as limiting the present invention.

[0022] As can be understood in this description of the present invention, orientations or positional relationships indicated by terms such as “width,” “top,” “bottom,” “front,” “rear,” “top,” and “bottom” are based on the orientations or positional relationships shown in the drawings and are merely for the purpose of facilitating and simplifying the description of the present invention. They do not indicate or suggest that the described devices or elements have a specific orientation, are configured in a specific orientation, or operate in a specific orientation, and should therefore not be construed as limitations on the present invention. Unless otherwise specified or limited, the terms “attachment,” “connection,” “joining,” and “installation” shall be interpreted broadly, and may include, for example, a fixed connection, a detachable connection, or an integral connection. They may be mechanical connections, direct connections, indirect connections via an intermediate medium, internal communication between two elements, or an interaction relationship between two elements. Those skilled in the art will understand the specific meaning of the above terms in this invention depending on the specific circumstances.

[0023] In the present invention, unless otherwise specified or limited, the phrase "above" or "below" the second feature of the first feature may include cases where the first and second features are in direct contact, or it may include cases where the first and second features are not in direct contact but are in contact via another feature between them.

[0024] Referring to Figures 1 to 23, the present invention provides a fully automatic, integrated vacuum hole-filling machine comprising a base frame 1, a hole-filling device 2, a squeegee device 3, and a transfer mechanism 4.

[0025] Referring to Figures 1 to 13, the hole-filling device 2 comprises a hole-filling chamber 20, a clamping mechanism A21, a lifting device A23, and a head assembly 22. The hole-filling chamber 20 is fixed to the base frame 1, and the inside of the hole-filling chamber 20 is in communication with a vacuum device 6 located outside the hole-filling chamber 20. A door 201 is opened on the rear side of the hole-filling chamber 20, and an automatic lifting door 202 is attached to the door 201, which is used to close the door 201. The vacuum device 6 can create a vacuum inside the hole-filling chamber 20. When it is necessary to create a vacuum inside the hole-filling chamber 20, the automatic lifting door 202 seals the door 201 of the hole-filling chamber 20.

[0026] Automatic lifting door 202 employs an existing automatic lifting door structure, and therefore, a further explanation is omitted here.

[0027] Referring to Figures 4 and 11-13, the clamping mechanism A21 is provided inside the hole-filling chamber 20 and comprises a clamping plate 210, a lifting plate 212, and a plurality of telescopic units 213. The clamping plate 210 is fixed to the top of the hole-filling chamber 20, and lifting units 2120 are fixed to both the left and right ends of the clamping plate 210. The lifting ends of the lifting units 2120 are connected to the lifting plate 212. All of the plurality of telescopic units 213 are provided on the lifting plate 212, and clamping claws 214 are connected to the telescopic ends of the telescopic units 213. A clamping passage 215 is formed between the plurality of clamping claws 214 and the clamping plate 210. The clamping passage 215 is mainly used to clamp and fix PCB boards 8 awaiting hole filling.

[0028] In this embodiment, the telescopic unit 213 employs a telescopic cylinder, and the lifting unit 2120 employs a lifting cylinder. In other embodiments, the telescopic unit 213 or the lifting unit 2120 may be an electric push rod. Referring to Figures 4 and 6, the lifting device A23 is mounted on the hole-filling chamber 20 and is used to raise and lower the head assembly 22 within the hole-filling chamber 20. Specifically, the lifting device A23 comprises a lifting power assembly 230 and a ball screw mechanism 231, and is provided on the top surface outside the hole-filling chamber 20. The ball screw A24 of the ball screw mechanism 231 is driven and connected to the lifting power assembly 230, and the ball screw A24 of the ball screw mechanism 231 is provided inside the hole-filling chamber 20. The aforementioned ball screw mechanisms 231 are provided at both ends of the mounting seat 220, and both ends of the mounting seat 220 are driven and connected to the ball screws A24 of the two ball screw mechanisms 231, respectively. As a result, by rotationally driving the ball screws A24 of each ball screw mechanism 231 with the lifting power assembly 230, the mounting seat 220 can be raised and lowered vertically, thereby achieving the objective of the lifting device A23 to raise and lower the head assembly 22 within the hole-filling chamber 20. In other embodiments, the lifting device A23 may be an electric push rod or a linear module, and is not limited thereto.

[0029] Referring to Figures 4 and 6-10, the head assembly 22 is located at the bottom of the hole-filling chamber 20, and the head assembly 22 is equipped with a head. Here, the heads are the front head 2211 and the rear head 2221, respectively. The front head 2211 and the rear head 2221 communicate with an ink negative pressure pipe located outside the hole-filling chamber 20 and are used to fill the holes in the PCB board, which are held by the clamp mechanism A, with ink. Here, the ink negative pressure pipe communicates with an ink supply device 7 located outside the hole-filling chamber 20, and supplies ink to the head via the ink supply device 7. The ink supply device 7 employs an existing ink supply structure, and a detailed explanation of its specific structure is omitted here.

[0030] Referring to Figures 6 to 10, the head assembly 22 according to this embodiment comprises a mounting base 220, a front head component 221, and a rear head component 222. The left and right ends of the mounting base 220 are connected to lifting devices A23, respectively, and the mounting base 220 can be raised and lowered vertically by the lifting devices A23.

[0031] Referring to Figures 4 and 6-10, the front head component 221 comprises a front mounting plate 2210 and the front head 2211 described above, and the rear head component 222 comprises a rear mounting plate 2220 and the rear head 2221 described above. The front mounting plate 2210 and the rear mounting plate 2220 are fixed to the mounting seat 220 so as to face each other along the longitudinal direction of the base frame, and the head of the front head component 221 is fixed to the side of the front mounting plate 2210 facing the rear mounting plate 2220, and the rear The head of the head component 222 is fixed to the side of the rear mounting plate 2220 facing the front mounting plate 2210, and an ink filling passage 2223 is formed between the front head 2211 and the rear head 2221. The ink filling passage 2223 penetrates both opposing sides of the mounting seat 220 and is located directly below the clamp passage 215 of the clamp mechanism A21. The inner diameter of the ink filling passage 2223 is larger than the thickness of the PCB board 8, thereby enabling the ink filling passage 2223 to accommodate the PCB board 8. During the hole-filling process for the PCB board 8, the automatic lifting door 202 seals the door 201 of the hole-filling chamber 20, the inside of the hole-filling chamber 20 is evacuated, the PCB board 8 is clamped and fixed in the clamp passage 215 of the clamping mechanism A21, the ink supply device 7 supplies ink to the front head 2211 and the rear head 2221 via the ink negative pressure piping, and the lifting device A23 raises and lowers the head assembly 22 up and down, so that the front head 2211 and the rear head 2221 fill the holes in the PCB board 8 with ink, thereby completing the hole-filling process for the PCB board 8.

[0032] Referring to Figures 4 and 6-10, the front head component 221 further includes a telescopic cylinder A2212 for moving the front mounting plate 2210 along the longitudinal direction of the base frame 1 toward the rear mounting plate 2220 or in the opposite direction. Multiple telescopic cylinders A2212 are provided, and all of them are fixed within the hole-filling chamber 20. Similarly, the rear head component 222 further includes a telescopic cylinder B2222 for moving the rear mounting plate 2220 along the longitudinal direction of the base frame 1 toward the front mounting plate 2210 or in the opposite direction. Multiple telescopic cylinders B2222 are provided, and all of them are fixed within the hole-filling chamber 20. As can be seen from the above, the distance between the front mounting plate 2210 and the rear mounting plate 2220 is adjustable, that is, the dimensions of the ink filling passage 2223 are adjustable.

[0033] Furthermore, a receiving tray (not shown) located within the hole-filling chamber 20 is fixed below the head assembly 22. After the front head 2211 and rear head 2221 fill the PCB board 8 with ink, any excess ink enters the receiving tray from below the ink filling passage and is collected. To monitor the amount of ink in the receiving tray in real time, a laser sensor (not shown) can be fixed inside the hole-filling chamber 20. The laser sensor is controlled by an electrical control box 9 of the fully automatic integrated vacuum hole-filling machine, which is mounted on the base frame 1 (see Figure 3). By monitoring the amount of ink in the receiving tray in real time using the laser sensor, it is possible to prevent the tray from overflowing due to an excess of ink.

[0034] Referring to Figure 1, a ventilation pipe 25 is further provided at the top of the hole-filling chamber 20. The ventilation pipe 25 communicates with the inside of the hole-filling chamber 20, and a ventilation valve 250 is provided in the ventilation pipe 25. The ventilation pipe 25 is used to exhaust the inside of the hole-filling chamber 20. Specifically, after each hole-filling process is completed, the vacuum device 6 stops, the ventilation valve 250 in the ventilation pipe 25 opens, and the inside of the hole-filling chamber 20 is exhausted. This prevents the ink inside the hole-filling chamber 20 from atomizing and contaminating the working environment between vehicles. When vacuum hole-filling is performed, the ventilation valve 250 in the ventilation pipe 25 is closed.

[0035] Referring to Figure 1, the hole-filling device 2 of this embodiment can be provided in multiple locations depending on the actual working conditions. For example, two hole-filling devices 2 of this embodiment are provided, meaning that the fully automatic integrated vacuum hole-filling machine of the present invention is equipped with two hole-filling stations, thereby improving the efficiency and quality of hole-filling of the PCB board 8.

[0036] Referring to Figures 1, 14, and 15, the squeegee device 3 comprises a squeegee chamber 30, a clamping mechanism B31, a lifting device B32, a squeegee assembly 33, and an ink application assembly 34.

[0037] Referring to Figures 1, 14, and 15, the squeegee chamber 30 is fixed on the base frame 1 and is spaced apart from the hole-filling chamber 20 in the lateral direction of the base frame 1. The clamping mechanism B31 is located at the top of the squeegee chamber 30, and an opening 301 is provided on the rear side of the squeegee chamber 30, to which an automatic lifting door 202 can be attached. The lifting device B32 is located on the squeegee chamber 30 and is used to raise and lower the squeegee assembly 33 within the squeegee chamber 30, thereby causing the squeegee assembly 33 to move up and down vertically and remove ink from the PCB board 8 that is clamped and fixed by the clamping mechanism B31.

[0038] The structure of clamp mechanism B31 is the same as that of clamp mechanism A21, and the structure of lifting device B32 is the same as that of lifting device A23; therefore, further explanation is omitted here. Furthermore, the structure of squeegee assembly 33 is the same as that of the existing squeegee assembly 33, and will not be explained in detail here.

[0039] Referring to Figure 14 or Figure 15, a measuring device 35 is provided at the bottom of the squeegee chamber 30, and an ink tray 36 is provided in the measuring device 35. After the squeegee assembly 33 removes ink from the PCB board 8, excess ink enters the ink tray 36 through the ink removal passage of the squeegee assembly 33 and is collected. The squeegee chamber 30 employs an ink receiving measuring system to monitor the amount of ink in the ink tray 36 in real time. In addition, an ink receiving funnel 37 is provided between the ink tray 36 and the squeegee assembly 33. The ink receiving funnel 37 can be fixed to the inner wall of the squeegee chamber 30, and the ink receiving funnel 37 can directly collect ink into the ink tray 36. By detecting the amount of ink in the ink tray 36 using the measuring system, it prevents ink from overflowing and contaminating the device, and at the same time, it has a function to prompt manual ink collection when the ink tray is full.

[0040] Referring to Figures 14 and 17, the ink application assembly 34 is provided on the squeegee chamber 30 and comprises a linear movement module (not shown), two connecting members 340, and two ink extrusion heads 341. Here, the two connecting members 340 are provided on the squeegee chamber 30, and the two ink extrusion heads 341 are each provided on the two connecting members 340. The two ink extrusion heads 341 are located inside the squeegee chamber 30 and are located on both sides of the PCB board 8 held by the clamping mechanism B31. The ink extrusion heads 341 communicate with a vacuum ink extruder 5 provided outside the squeegee chamber 30 via a pipeline, and the vacuum ink extruder 5 supplies ink to the ink extrusion heads 341 using a vacuum method. The ink extrusion heads 341 are used to apply ink to the PCB board 8 held by the clamping mechanism B31. The linear movement module is located at the top outside the squeegee chamber 30 and is used to move the two connecting members 340 along the lateral direction of the base frame 1. Each of the connecting members 340 is provided with an extension mechanism 342, the extension end of each extension mechanism 342 extends along the longitudinal direction of the base frame 1, and the extension end of each extension mechanism 342 is driven and connected to each ink extrusion head 341, allowing ink to be applied to the PCB board 8 clamped and fixed by the clamping mechanism B31 via the ink extrusion head 341. As can be seen from the above, the squeegee device 3 of this embodiment can continuously and integrally automate the application and removal of ink, improving the production efficiency and quality of the PCB board 8.

[0041] Referring to Figures 18 to 23, the transfer mechanism 4 comprises a linear drive module 40 and a supply assembly 41. The linear drive module 40 is located at the top of the base frame 1, outside the hole-filling chamber 20 and outside the squeegee chamber 30, in the lateral direction. The linear drive module 40 is used to move the supply assembly 41 laterally, and the supply assembly 41 is used to grip the PCB board 8 and transport it to the clamp passage 215 of clamp mechanism A21 or clamp passage 215 of clamp mechanism B31. The supply assembly 41 comprises a clamping assembly 410 and an extrusion assembly 411, the clamping assembly 410 being used to clamp a PCB board 8 awaiting filling or squeegeeing, the extrusion assembly 411 being mounted longitudinally on the base frame 1 and connected to the linear drive module 40 and the clamping assembly 410, the extrusion assembly 411 being used to push the clamping assembly 410 into the filling chamber 20 or squeegee chamber 30, and also to extrude the clamping assembly 410 from within the filling chamber 20 or squeegee chamber 30.

[0042] Referring to Figures 18 to 23, the extrusion assembly 411 comprises a fixed seat 4110, a movable seat 4111, and a drive unit. Here, the fixed seat 4110 extends vertically, one end of the fixed seat 4110 is driven and connected to a linear drive module 40, and guide blocks are provided on both opposing sides of the other end of the fixed seat 4110. Rails are fixed to both opposing sides of the movable seat 4111, the rails extend along the longitudinal direction of the base frame 1 and are slidable relative to the guide blocks, and the drive unit is provided on the movable seat 4111 and driven and connected to the clamping assembly 410, and the drive unit is used to move the clamping assembly 410 along the longitudinal direction of the base frame 1. The drive unit comprises a drive motor 4112 and a ball screw B4113. The drive motor 4112 is fixed to the movable seat 4111, and the ball screw B4113 extends along the longitudinal direction of the base frame 1. The output shaft of the drive motor 4112 is driven and connected to one end of the ball screw B4113 and is used to rotate the ball screw B4113. A nut B4114 is screwed onto the ball screw B4113, and the nut B4114 is fixed to the fixed seat 4110. The other end of the ball screw B4113 is connected to the clamping assembly 410 via a support seat, and the clamping assembly 410 is connected and fixed to the movable seat 4111. As can be seen from the above, by moving the fixed seat 4110 along the lateral direction of the base frame 1 using the linear drive module 40, the extrusion assembly 411 and the clamping assembly 410 can be moved along the lateral direction of the base frame 1. Furthermore, the nut B4114 screwed onto the ball screw B4113 is connected to and fixed to the fixed seat 4110, and the ball screw B4113 is connected to the clamping assembly 410, and the clamping assembly 410 is connected to and fixed to the movable seat 4111. Therefore, when the drive motor 4112 rotates the ball screw B4113, the ball screw B4113 moves the movable seat 4111 along the axial direction of the ball screw B4113, and the drive motor 4112 also moves together with the movable seat 4111, thereby moving the clamping assembly 410 along the axial direction of the ball screw B4113. As shown in Figure 22, a supply positioning plate 4115 is further fixed to the fixed seat 4110, and the supply positioning plate 4115 is used for positioning when supplying the PCB board 8 to the clamping assembly 410.

[0043] Referring to Figures 18 to 23, the clamping assembly 410 comprises a connecting plate 4101, a drive mechanism 4102, and two supply width adjustment plates 4103. The connecting plate 4101 extends laterally along the base frame 1 and is fixed on a movable seat 4111. The two supply width adjustment plates 4103 are provided at both ends of the connecting plate 4101 along the laterally along the base frame 1. The drive mechanism 4102 is provided on the connecting plate 4101 and is used to move the two supply width adjustment plates 4103 toward or toward each other. Thus, the clamping assembly 410 has a width adjustment function and can accommodate clamping and fixing PCB boards 8 of different dimensions. Furthermore, the movable seat 4111 is further provided with a fall prevention plate member 43, which is used to prevent the PCB board 8 clamped by the clamping assembly 410 from falling.

[0044] The drive mechanism 4102 in this embodiment can employ a ball screw drive mechanism, and in other embodiments, the drive mechanism 4102 can employ a bidirectional cylinder, and is not limited thereto.

[0045] In addition to the above structure, the discharge assembly 42 is also driven and connected to the linear drive module 40. The discharge assembly 42 is used to grip the PCB board 8 in the squeegee chamber 30 and transport it to the next process. The structure of the discharge assembly 42 is the same as that of the supply assembly 41, so a further explanation is omitted here.

[0046] The operating principle of the fully automatic integrated vacuum hole filling machine according to the present invention is as follows. When performing the hole-filling process, the machine hand first grips the PCB board 8 awaiting hole-filling and automatically supplies it to the supply assembly 41. Then, the linear drive module 40 moves the supply assembly 41 along the lateral direction of the base frame 1 to the door 201 of the corresponding hole-filling chamber 20, at which point the door 201 is opened. Subsequently, the supply assembly 41 inserts the PCB board 8 it is gripping into the hole-filling chamber 20 through the door 201. At this time, the lifting unit 2120 of the clamping mechanism A21 raises the lifting plate 212, ensuring that the supply assembly 41 transports the PCB board 8 along the longitudinal direction of the base frame 1 until it contacts the clamping plate 210 of the clamping mechanism A21. After the supply assembly 41 transports the PCB board 8 until it contacts the clamp plate 210 of the clamp mechanism A21, the lifting unit 2120 of the clamp mechanism A21 lowers the lifting plate 212 of the clamp mechanism A21, and each telescopic unit 213 of the clamp mechanism A21 moves each clamping claw 214 along the longitudinal direction of the base frame 1 toward the clamp plate 210 of the clamp mechanism A21, thereby clamping and fixing the PCB board 8 in the clamp passage 215 of the clamp mechanism A21. Next, the door 201 of the hole-filling chamber 20 is sealed to maintain a sealed state inside the hole-filling chamber 20, and the air inside the hole-filling chamber 20 is exhausted by the vacuum device 6. At the same time, the head assembly 22 is raised and lowered by the lifting device A23, so that the ink ejected from the head of the head assembly 22 is used to fill the holes in the PCB board 8 that is clamped and fixed by the clamp mechanism A21.

[0047] When performing the squeegeeing process, the hole-filling process is already completed, the automatic lifting door 202 of the hole-filling chamber 20 is opened, the supply assembly 41 is inserted into the corresponding hole-filling chamber 20, and the PCB board 8 held by the clamping mechanism A21 is clamped and fixed in place. At this time, the lifting unit 2120 of the clamping mechanism A21 raises the lifting plate 212, and then the supply assembly 41 extends out of the hole-filling chamber 20 along the longitudinal direction of the base frame 1, after which the linear drive module 40 supplies... The assembly 41 is moved along the lateral direction of the base frame 1 to the position of the corresponding opening 301 of the squeegee chamber 30. At this time, the filled PCB board 8 held by the supply assembly 41 is transported into the squeegee chamber 30 along the longitudinal direction of the base frame 1. At this time, the lifting unit 2120 of the clamping mechanism B31 raises the lifting plate 212, ensuring that the supply assembly 41 transports the PCB board 8 along the longitudinal direction of the base frame 1 until it contacts the clamping plate 210 of the clamping mechanism B31. After the supply assembly 41 transports the PCB board 8 until it contacts the clamp plate 210 of the clamp mechanism B31, the lifting unit 2120 of the clamp mechanism B31 lowers the lifting plate 212 of the clamp mechanism B31, and each telescopic unit 213 of the clamp mechanism B31 moves each clamp claw 214 along the longitudinal direction of the base frame 1 toward the clamp plate 210 of the clamp mechanism B31, thereby clamping and fixing the PCB board 8 in the clamp passage 215 of the clamp mechanism B31. At this time, the squeegee assembly 33 is raised and lowered by the lifting device B32, thereby squeezing the PCB board 8 that is clamped and fixed in the clamp mechanism B31.

[0048] As described above, 1. The fully automatic integrated vacuum hole-filling machine of the present invention can automatically complete the hole-filling process and the squeegeeing process for the PCB board 8. Furthermore, by moving the PCB board 8 to the clamping mechanism of the hole-filling device 2 or to the clamping mechanism of the squeegee device 3 using the transfer mechanism 4, the supply operation for the hole-filling process or the squeegeeing process of the PCB board 8 is automatically completed, thereby ensuring the efficiency, quality, and yield of the hole-filling process and the squeegeeing process of the PCB board 8. 2. The clamping mechanisms A21 and B31 according to the present invention are equipped with a lifting and lowering clamping function. By using the clamping mechanism A21 or B31 in combination with the clamping assembly 410, not only is the use of space within the hole-filling chamber 20 or squeegee chamber 30 optimized, but highly efficient, flexible, and highly accurate hole-filling or squeegeeing work is also realized.

[0049] The foregoing are merely preferred embodiments of the present invention and are not intended to limit the scope of protection of the embodiments of the present invention. All equivalent structural or process transformations made by the specification and accompanying drawings of the present invention, or applied directly or indirectly in other relevant art fields, are similarly included within the scope of protection of the present invention. [Explanation of Symbols]

[0050] 1. Base frame 2. Hole-filling device 20. Hole-filling chamber 201, Door 202, Automatic lifting door 21. Clamping mechanism A 210, clamp plate 212, Lifting plate 2120, Lifting unit 213, Telescopic Unit 214, Clamping claws 215, Clamp passage 22. Head Assembly 220, Mounting base 221, Front head component 2210, Front mounting plate 2211, front head 2212, Telescopic Cylinder A 222, Rear head component 2220, rear mounting plate 2221, rear head 2222, Telescopic Cylinder B 2223, ink filling passage 23. Lifting device A 230, Lifting power assembly 231. Ball screw mechanism 24. Ball screw A 25. Ventilation piping 250, ventilation valve 3. Squeegee device 30. Squeegee Room 301, aperture 31. Clamp mechanism B 32. Lifting device B 33. Squeegee Assembly 34. Ink coating assembly 340, connecting member 341, Ink ejection head 342, Telescoping mechanism 35, Weighing device 36. Ink tray 37. Ink receiving funnel 4, Transfer mechanism 40. Linear drive module 41. Supply Assembly 410, Clamping Assembly 4101, connecting plate 4102, drive mechanism 4103, Supply width adjustment plate 411. Extrusion Assembly 4110, fixed seat 4111, movable seat 4112, drive motor 4113, Ball screw B 4114, Nut B 4115, supply positioning plate 42. Discharge Assembly 43, Fall prevention plate member 5. Vacuum ink extruder 6. Vacuuming device 7. Ink supply device 8, PCB board 9. Electrical control box

Claims

1. It is a fully automatic, integrated vacuum hole-filling machine, Base frame and A hole-filling device comprising a hole-filling chamber, a clamping mechanism A, a lifting device A, and a head assembly, wherein the hole-filling chamber is provided on a base frame and communicates with a vacuum device provided outside the hole-filling chamber, the clamping mechanism A is provided inside the hole-filling chamber and comprises a clamp plate, a lifting plate, and a plurality of telescopic units, the clamp plate is fixed inside the hole-filling chamber and lifting units are provided at both ends of the clamp plate and the lifting ends of the lifting units are connected to the lifting plate, all of the plurality of telescopic units are provided on the lifting plate and clamp claws are connected to the telescopic ends of the telescopic units and clamp passages are formed between the plurality of clamp claws and the clamp plate, the lifting device A is provided on the hole-filling chamber and is used to lift and lower the head assembly inside the hole-filling chamber and the head assembly is provided with a head and the head communicates with an ink negative pressure pipe located outside the hole-filling chamber and is used to fill the holes in the PCB board clamped by the clamping mechanism A, A squeegee device comprising a squeegee chamber, a clamping mechanism B, a lifting device B, and a squeegee assembly, wherein the squeegee chamber is fixed on a base frame and provided at a distance from the hole-filling chamber in the lateral direction of the base frame, the clamping mechanism B is provided inside the squeegee chamber and the structure of the clamping mechanism B is the same as the structure of the clamping mechanism A, and the lifting device B is provided on the squeegee chamber and is used to raise and lower the squeegee assembly inside the squeegee chamber, and the squeegee device comprises a squeegee chamber, a clamping mechanism B, a lifting device B, and a squeegee assembly, the squeegee device comprising a squeegee chamber, a clamping mechanism B, a lifting device B, and a squeegee assembly, the squeegee chamber being fixed on a base frame and provided at a distance from the hole-filling chamber in the lateral direction of the base frame, the clamping mechanism B being provided inside the squeegee chamber and the structure of the clamping mechanism B being the same as the structure of the clamping mechanism A, and the lifting device B being provided above the squeegee chamber and used to raise and lower the squeegee assembly inside the squeegee chamber, A transfer mechanism comprising a linear drive module and a supply assembly, wherein the linear drive module is located at the top of the base frame, outside the hole-filling chamber and outside the squeegee chamber in the lateral direction, the linear drive module is used to move the supply assembly laterally, and the supply assembly is used to grip a PCB board and transport it to the clamp passage, the transfer mechanism comprising: The supply assembly comprises a clamping assembly and an extrusion assembly, the clamping assembly being used to clamp PCB boards awaiting filling or squeegeeing, the extrusion assembly being mounted longitudinally on the base frame and connected to a linear drive module and the clamping assembly, the extrusion assembly being used to push the clamping assembly into the filling chamber or squeegee chamber, or to extrude the clamping assembly from the filling chamber or squeegee chamber, The squeegee device further comprises an ink application assembly, the ink application assembly being provided on the squeegee chamber and comprising two connecting members and two ink extrusion heads, the two connecting members being provided in the squeegee chamber, the two ink extrusion heads being provided on the two connecting members respectively, the two ink extrusion heads being located in the squeegee chamber, the two ink extrusion heads being located on both sides of the PCB board clamped by the clamping mechanism B, the ink extrusion heads communicating via a pipeline to a vacuum ink extruder provided outside the squeegee chamber, the vacuum ink extruder supplying ink to the ink extrusion heads using a vacuum method, and the ink extrusion heads being used to apply ink to the PCB board clamped by the clamping mechanism B, characterized in that it is a fully automatic, integrated vacuum hole filling machine.

2. The extrusion assembly comprises a fixed seat, a movable seat, and a drive unit, wherein the fixed seat extends vertically, one end of the fixed seat is drive-connected to the linear drive module, guide blocks are provided on opposing sides of the other end of the fixed seat, rails are fixed to opposing sides of the movable seat, the rails extend along the longitudinal direction of the base frame and are slidable relative to the guide blocks, the drive unit is provided on the movable seat and drive-connected to the clamping assembly, and the drive unit is used to move the clamping assembly along the longitudinal direction of the base frame, characterized in that the fully automatic integrated vacuum hole filling machine according to claim 1.

3. The fully automatic integrated vacuum hole filling machine according to claim 2, characterized in that the movable seat is provided with a fall prevention plate member for preventing the PCB board held by the clamping assembly from falling.

4. The clamping assembly comprises a connecting plate, a drive mechanism, and two supply width adjustment plates, wherein the connecting plate extends laterally along the base frame and is fixed on the movable seat, the two supply width adjustment plates are provided at both ends of the connecting plate along the laterally along the base frame, and the drive mechanism is provided on the connecting plate and is used to move the two supply width adjustment plates toward or toward each other, as described in claim 2.

5. The fully automatic integrated vacuum hole-filling machine according to claim 1, characterized in that a ventilation pipe is provided at the top of the hole-filling chamber, the ventilation pipe communicates with the inside of the hole-filling chamber, a ventilation valve is provided in the ventilation pipe, and the ventilation pipe is used to exhaust the inside of the hole-filling chamber.

6. The fully automatic, integrated vacuum hole filling machine according to claim 1, wherein the ink application assembly further comprises a linear movement module, the linear movement module being located at the top outside the squeegee chamber and used to move the two connecting members along the lateral direction of the base frame.

7. The fully automatic integrated vacuum hole filling machine according to claim 1 or 6, characterized in that each of the connecting members is provided with an extension mechanism, and the extension end of each extension mechanism extends along the longitudinal direction of the base frame and is driven and connected to each ink extrusion head.

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