Apparatus for extracting target assembly components and method for extracting target assembly components

Abstract

To provide a target assembly member extraction apparatus capable of extracting only a conductive wire without being affected by a member (component) other than an extraction target assembly member to be extracted, and a target assembly member extraction method.SOLUTION: A target assembly member extraction apparatus comprises original height information acquisition means, positioning means, height extraction region setting means, restoration means, remaining height information acquisition means, and extraction means. The original height information acquisition means obtains an entire original height information image from an image of an entire electronic device. The positioning means performs positioning of the other assembly member. The height extraction region setting means sets a height extraction region of the other assembly member. The restoration means calculates a height information image of the entire other assembly member on the basis of the height extraction region. The remaining height information acquisition means obtains a remaining height information image after subtracting a restoration image from the original height information image. The extraction means extracts only an extraction target assembly member from the remaining height information image.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a target assembly member extraction apparatus and a target assembly member extraction method, and particularly to a target assembly member extraction apparatus and a target assembly member extraction method for extracting an extraction target member, which is a member of an electronic device assembly, from other assembly members.

Background Art

[0002] In a manufacturing process (a process including a wire bonding step) of an electronic device assembly such as a semiconductor device (hereinafter sometimes simply referred to as an electronic device), it is necessary to perform shape quality inspection on wires after wire bonding. Here, the shape quality inspection includes, for example, inspection of the height and bending of wires, and further inspection of the spacing between wires, etc.

[0003] For this shape quality inspection of wires, visual inspection (observation) by acquiring images of the wires is generally performed. To perform this inspection stably, it is necessary to correctly recognize the wire regions from the image. For this reason, methods for recognizing wire regions have been conventionally proposed (Patent Document 1 and Patent Document 2).

[0004] In the technique disclosed in Patent Document 1, first, an omnifocal image and a distance image of the wires and connection surfaces (connection surfaces to which the wires are bonded) are created. Next, a connection surface region is specified from the omnifocal image, and a wire region and a region other than wires are separated based on height information of the distance image. Then, the wire region in the distance image is made to correspond to the omnifocal image, and the wire region in the omnifocal image is specified. Thereby, in the wire region of the omnifocal image, the wire region connecting one connection surface region and the other connection surface region of the wire to be detected is extracted.

[0005] In Patent Document 1, it is necessary to set two regions, that is, a start point and an end point, for each wire. When the number of wires is large, this setting takes time. Furthermore, it is necessary to extract wires one by one, so the overall extraction time also becomes long. For this reason, the inspection has inferior productivity.

[0006] Therefore, as described in Patent Document 2, a conductive wire extraction apparatus and conductive wire extraction method have been proposed that can extract all conductive wires at once, even if there are multiple conductive wires.

[0007] The device described in Patent Document 2 comprises original height information acquisition means, positioning means, height extraction region setting means, restoration means, remaining height information acquisition means, and extraction means. The original height information acquisition means obtains the original height information of the entire device from an image of the entire electronic device. The positioning means positions the area to which the conductive wire is connected. The height extraction region setting means sets the height extraction region of the area to which the conductive wire is connected. The restoration means obtains a height information image of the entire area to which the conductive wire is connected based on the height extraction region. The remaining height information acquisition means obtains the remaining height information by subtracting the restored image from the original height information. The extraction means extracts only the conductive wire from the remaining height information. [Prior art documents] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Publication No. 2016-157720 [Patent Document 2] Japanese Patent Publication No. 2022-72964 [Overview of the project] [Problems that the invention aims to solve]

[0009] In Patent Document 2, if foreign matter is present below the wire, the wire may contain noise composed of the foreign matter, making accurate wire extraction impossible. This occurs because the cross-sectional profile of random, irregularly shaped images (distance images) such as noise is not taken into consideration.

[0010] Therefore, in view of these circumstances, the present invention aims to provide a target assembly member extraction apparatus and a target assembly member extraction method that can stably extract the target assembly (for example, conductive members such as conductive wires) without being affected by foreign matter. [Means for solving the problem]

[0011] The present invention provides a target assembly member extraction device for extracting a target assembly member, which is a component of an electronic device assembly, from other assembly members, comprising: original height information acquisition means for obtaining an original height information image of the entire electronic device assembly including the target assembly member; positioning means for positioning the other assembly members; height extraction region setting means for setting a height extraction region in the other assembly members; interpolation region setting means for setting an interpolation region adjacent to the other assembly members; region height interpolation means for obtaining a height information image of the interpolation region adjacent to the other assembly members; restoration means for obtaining a restored image consisting of a height information image of the other assembly members obtained based on the height extraction region set in the extraction region setting means, and a height information image in the interpolation region obtained by the region height interpolation means; remaining height information acquisition means for obtaining a height information image remaining after subtracting the height information image of the restored image obtained by the restoration means from the original height information image including the other assembly members obtained by the original height information acquisition means; and extraction means for extracting only the target assembly member from the remaining height information image obtained by the remaining height information acquisition means.

[0012] According to the target assembly member extraction apparatus of the present invention, the original height information acquisition means can obtain an original height information image of the entire electronic device assembly, including the assembly member to be extracted, from an image of the entire electronic device assembly. The positioning means can be used to position other assembly members. The height extraction region setting means can be used to set the height extraction region of other assembly members. The interpolation region setting means can be used to set an interpolation region adjacent to other assembly members, and the region height interpolation means can obtain a height information image of the interpolation region. The restoration means can obtain a restored image consisting of the height information image of the other assembly members obtained based on the height extraction region set in the extraction region setting means, and the height information image in the interpolation region obtained by the region height interpolation means. The remaining height information acquisition means can obtain a remaining height information image by subtracting the restored image obtained by the restoration means from the original height information image obtained by the original height information acquisition means, and the extraction means can extract only the target assembly member from the remaining height information image. With this configuration, even if foreign objects (objects other than the regular other assembly members) are present in the remaining height information image, the image data of the foreign objects will not be included.

[0013] Therefore, in the target assembly component extraction device of the present invention, if no foreign matter is present in the electronic device assembly, even if there are multiple target assembly components, all target assembly components can be extracted at once, eliminating the need to perform image processing (individual image processing) for each target assembly component. Furthermore, even if foreign matter is present, the image data of the foreign matter can be omitted, and the target assembly components can be extracted in the same way as when no foreign matter is present. In other words, since the target assembly components can be extracted using only the information of parts other than the target assembly components, candidate assembly components can be obtained regardless of the number of target assembly components, and the target assembly components can be stably extracted from the obtained conductive wire candidates by binarization, etc. Therefore, if the target assembly component is a conductive wire, the conductive wire can be extracted by processing the image taken after bonding connection. For this reason, there is no need to take or process images before bonding connection. [Effects of the Invention]

[0014] In this invention, whether or not foreign matter is present in the electronic device assembly, and even if there are multiple assembly members to be extracted, all assembly members to be extracted can be extracted at once, eliminating the need to perform image processing (individual image processing) for each assembly member to be extracted. Therefore, the setup time for extracting the assembly members to be extracted and the extraction operation time after setup can be shortened, resulting in a highly productive apparatus and method. Moreover, it is possible to extract only the assembly members to be extracted without being affected by other components (parts) that are not to be extracted. Therefore, the shape quality of the assembly members to be extracted can be detected stably and accurately. Furthermore, since there is no need to capture or process images of the assembly members to be extracted before bonding, the overall configuration of the apparatus can be simplified, processing time can be shortened (workability can be improved), and the extraction accuracy can be increased. [Brief explanation of the drawing]

[0015] [Figure 1] This is a block diagram showing a conductive wire extraction device, which is a target assembly member extraction device of the present invention. [Figure 2] This is a process diagram of the conductive wire extraction method, which is a method for extracting target assembly members of the present invention. [Figure 3] This is a simplified plan view of an electronic device assembly, which is a semiconductor device. [Figure 4] This is a simplified side view of an electronic device assembly, which is a semiconductor device. [Figure 5] The process for obtaining a frame height information image is shown, where (a) is a simplified diagram showing frame positioning, (b) is a plan view of the frame height information image, and (b) is a side view of the frame height information image. [Figure 6] The process for obtaining a chip height information image is shown, where (a) is a simplified diagram showing chip positioning, (b) is a plan view of the chip height information image, and (b) is a side view of the chip height information image. [Figure 7]A step of obtaining lead height information image is illustrated, wherein (a) is a schematic diagram showing lead positioning, (b) is a plan view of the lead height information image, and (c) is a side view of the lead height information image. [Figure 8] An interpolation region image of an interpolation region is illustrated, wherein (a) is a schematic plan view and (b) is a schematic side view. [Figure 9] A wire extraction step is illustrated, wherein (a) is a schematic diagram of an original height information image, (b) is a schematic diagram showing a restored image, and (c) is a schematic diagram showing an extracted wire. [Figure 10] A step of extracting a wire from wire region candidates is illustrated, wherein (a) is a distance image diagram showing the wire region candidates and (b) is a wire information image diagram. [Figure 11] It is a schematic diagram when a wire is extracted and the height of a region other than the wire is set to 0. MODE FOR CARRYING OUT THE INVENTION

[0016] Hereinafter, embodiments of the present invention will be described with reference to FIGS. 1 to 11.

[0017] The target assembly member extraction apparatus according to the present invention extracts an extraction target assembly member, which is a member of an electronic device assembly, from other assembly members. FIG. 1 shows a conductive wire extraction apparatus serving as the target assembly member extraction apparatus. This conductive wire extraction apparatus is configured to extract the conductive wire 4 from the conductive wire connected portion (another assembly member) in an electronic device assembly (hereinafter sometimes simply referred to as an electronic device) which is an extraction target assembly member and is bonded and connected by the conductive wire 4 (see FIG. 3 and the like) as a conductive member. Here, the term "electronic device" refers to general devices that have a semiconductor device and perform a certain function, and the term "semiconductor device" refers to all devices that can function by utilizing semiconductor characteristics; electro-optical devices, semiconductor circuits, and electronic devices are all semiconductor devices. In general, electronic devices are classified into three types: semiconductors, electronic displays, and general electronic components. Semiconductors are classified into logic circuits, memory circuits, analog circuits, and discrete components. Electronic displays include liquid crystal devices, organic EL, and the like. General electronic components include capacitors, printed circuits, connectors, sensors, inductors, switches, power supplies, and the like. In addition to the conductive wire 4, conductive members also include conductive clips and the like.

[0018] FIG. 3 and FIG. 4 show an electronic device assembly, which includes a frame (base) 1, a chip 2 and leads 3 (3A, 3B) on the base 1. The chip 2 and the leads 3 (3A, 3B) are connected by a plurality of conductive wires 4. Therefore, in this embodiment, the conductive wire 4 can be referred to as an extraction target assembly member, and the chip 2, the leads 3, and the like can be referred to as other assembly members (assembly members not subject to extraction). In the following description, the conductive wire 4 is used as the extraction target assembly member, and the chip 2 and the leads 3 are used as the other assembly members.

[0019] Figure 1 is a block diagram showing the overall configuration of a conductive wire extraction device, which is a target assembly member extraction device according to the present invention. This conductive wire extraction device comprises an original height information acquisition means 10, a positioning means 11, a height extraction area setting means 12, a correction means 13, an interpolation area setting means 14, an area height interpolation means 15, a restoration means 16, a remaining height information acquisition means 17, and an extraction means 18.

[0020] The original height information acquisition means 10 obtains the original height information image of the entire electronic device (including the base 1) from an image of the entire electronic device including the conductive wire 4. The positioning means 11 positions the conductive wire connection area. The height extraction area setting means 12 sets the height extraction area of ​​the conductive wire connection area. The correction means 13 corrects the area of ​​the conductive wire connection area and the height extraction area of ​​that area. The interpolation area setting means 14 sets an interpolation area that connects the conductive wire connection areas. The area height interpolation means 15 obtains the height information image of the interpolation area that connects the conductive wire connection areas. The restoration means 16 obtains a restored image consisting of the height information image of the conductive wire connection area obtained based on the height extraction area set in the extraction area setting means 12, and the height information image in the interpolation area obtained by the area height interpolation means 15. The remaining height information acquisition means 17 obtains the remaining height information image by subtracting the restored image obtained by the restoration means 16 from the original height information image obtained by the original height information acquisition means 10. The extraction means 18 extracts only the conductive wire 4 from the remaining height information image acquired by the remaining height information acquisition means 17.

[0021] The original height information acquisition means 10 comprises an imaging means (for example, a means composed of a CCD camera or a CMOS camera, etc.) for imaging the entire electronic device, a distance image creation means, and a full-focus image creation means. Here, a distance image is an image in which the relative distance information at the time when the degree of focus is at its maximum for each image is expressed in terms of brightness. For this reason, the distance image creation means stores the relative distance information at the time when the degree of focus is at its maximum for each image at the same time as imaging by the imaging means, and creates a distance image from the imaging means to the imaged object.

[0022] A fully focused image is an image in which all pixels are in focus, reconstructed by evaluating the degree of focus for each pixel from multiple images with different focal points and combining the local images that are in focus. In other words, a fully focused image is created by continuously changing the distance between the imaging system and the object (scanning the camera in the Z direction), capturing multiple images with different focal points, evaluating the focus for each local region, and reconstructing the image from a combination of the local images that are in focus. As a result, a fully focused image is in focus at all pixels. For this reason, a drive mechanism is required to drive the camera constituting the imaging means at least in the Z direction (vertical direction). This drive mechanism may enable driving in the horizontal plane in the XY direction in addition to driving the camera in the Z direction. The drive mechanism can be configured as, for example, an XYZ stage. The original height information image is an information image of the base 1 and the conductive wire connection area.

[0023] The positioning means 11 can consist of this imaging means and a full-focus image creation means. The positioning means 11 aligns the full-focus image using a preset marker (such as a pattern or object located at a distance from the conductive wire connection area), and identifies a location in the full-focus image where the relative positional relationship between the marker and the conductive wire connection area (for example, frame 1) matches that of a reference model, and the relative position of the marker matches that of a stored model. Alternatively, the positioning means 11 may consist of this imaging means and a distance image creation means, and the positioning may be performed in the distance image using a preset marker.

[0024] The height extraction region setting means 12 sets an arbitrary position in the region of the conductive wire connection area (for example, frame 1) as the height extraction region 31 (see Figure 5(a)). The correction means 13 corrects the region of the conductive wire connection area and the height extraction region of that region.

[0025] The interpolation region setting means 14 interpolates the area between lead 3A and chip 2 when extracting a conductive wire 4 that connects lead 3A and chip 2 in the electronic device shown in Figure 3. That is, if the base 1 between lead 3A and chip 2 of the product does not have any protrusions (foreign objects 5), then when imaged by the imaging means, nothing will be visible below the conductive wire 4. However, if there is a foreign object 5 between lead 3A and chip 2, this foreign object 5 will be visible. As a result, noise will be included in the wire image. Therefore, the interpolation region in this case refers to the area between lead 3A and chip 2.

[0026] The region height interpolation means 15 obtains a height information image 43 (see Figure 8(a)) of the interpolation region that connects the conductive wire connection points (adjacent to the assembly member to be extracted) as set by the interpolation region setting means 14. The restoration means 16 obtains a restoration image consisting of the height information image of the conductive wire connection points obtained based on the height extraction region set by the extraction region setting means 12, and the height information image of the interpolation region obtained by the region height interpolation means 15. Here, the height information image 43 of the interpolation region is an image of the point that connects the conductive wire connection points, whether or not there is foreign matter at the bottom of the conductive wire 4 that connects the conductive wire connection points, and constitutes a part of the restoration image as described later. Adjacent to the assembly member to be extracted includes cases where there are multiple regions between the conductive wire connection points.

[0027] The remaining height information acquisition means 17 obtains the remaining height information by subtracting the restored image obtained by the restoration means 16 from the original height information image obtained by the original height information acquisition means 10, thereby obtaining the height information of the conductive wire 4. In addition, the extraction means 18 can extract only the wire 4 from the height information image of the wire 4.

[0028] Incidentally, the control of each of the aforementioned means 10, 11, 12, 13, 14, 15, 16, 17, 18 and the drive mechanism for driving the camera that constitutes the imaging means can be performed by a computer (not shown). A computer basically consists of an input means with an input function, an output means with an output function, a storage means with a memory function, an arithmetic means with an arithmetic function, and a control means with a control function. The input function is for reading information from the outside into the computer, and the read data and programs are converted into signals in a format suitable for the computer system. The output function displays calculation results and stored data to the outside. The storage means stores and saves programs, data, processing results, etc. The arithmetic function processes data by calculating and comparing it according to the instructions of the program. The control function decodes the instructions of the program and issues instructions to each means, and this control function is in charge of all the means of the computer. Input means include keyboards, mice, tablets, microphones, joysticks, scanners, capture boards, etc. Output means include monitors, speakers, printers, etc. Storage methods include memory, hard disks, CDs, CD-Rs, PDs, MOs, etc. Processing methods include CPUs, etc., and control methods include CPUs, motherboards, etc.

[0029] The conductive wire extraction device configured as described above can perform the steps shown in Figure 2. Specifically, it comprises an original height information acquisition step 20, a positioning step 21, a height extraction region setting step 22, a correction step 23, an interpolation region setting step 24, a region height interpolation step 25, a restoration step 26, a remaining height information acquisition step 27, and an extraction step 28.

[0030] Next, we will explain each process in detail. In this case, as shown in Figures 3 and 4, we will explain the case where only multiple wires 4 of an electronic device are extracted, which comprises a frame 1, a chip 2, and leads 3 (3A, 3B), with the chip 2 and leads 3 (3A, 3B) connected by wires 4. For this reason, the conductive wire connection points are the frame 1, the chip 2, and the leads 3 (3A, 3B) as described above. In addition, there is a foreign object 5 between one lead 3A and the chip 2 that is not present in a normal product.

[0031] First, a full-focus image and a depth image of this electronic device are acquired. Next, as shown in Figure 5(a), the frame 1 is positioned to determine the frame region 30. Then, the height extraction region 31 (31A, 31B) is set within the frame region 30. In this case, if positional correction of the frame region 30 and the height extraction region 31 (31A, 31B) is necessary, it is corrected using the correction means 13. This correction process uses pre-set markers and corrects the relative positional relationship between the markers and the frame region 30 and the height extraction region 31 in the full-focus image or depth image so that it matches the reference model. After that, the height and inclination of the frame 1 are determined based on the height extraction region, and the overall height information image 40 of the frame (base) 1 is restored as shown in Figures 5(b) and 5(c).

[0032] Next, as shown in Figure 6(a), the chip 2 is positioned to determine the chip region 32. Then, the height extraction region 33 (33A, 33B) in the chip region 32 is set. In this case, if position correction of the chip region 32 and the height extraction region 33 (33A, 33B) is necessary, it is corrected using the correction means 13. After that, the height and inclination of the chip 2 are determined based on the height extraction region, and the overall height information image 41 of the chip 2 is restored as shown in Figures 6(b) and 6(c).

[0033] Furthermore, as shown in Figure 7(a), the lead 3 (3A, 3B) is positioned to determine the lead region 34. Then, the height extraction region 35 (35A, 35B) is set within the lead region 34. In this case, if positional correction of the lead region 34 and the height extraction region 35 (35A, 35B) is necessary, it is corrected using the correction means 13. After that, the height and inclination of the lead 3 are determined based on the height extraction region, and the overall height information image 42 of the lead 3 is restored (obtained) as shown in Figures 7(b) and 7(c).

[0034] In this case, since there is foreign matter 5 between lead 3A and tip 2, an interpolation region 6 is set to connect lead 3A and tip 2, as shown in Figure 8(a), and a height information image 43 of this interpolation region 6 is obtained. If an image of foreign matter is displayed within the interpolation region 6, it will become noise when the conductive wire is extracted. However, when connecting to a conductive wire 4 between conductive connected parts, the conductive wire 4 is higher than the conductive connected parts, and foreign matter below this wire 4 is ignored.

[0035] This allows us to obtain a reconstructed image 45 (see Figure 8(b)) by adding the height information image 43 of the interpolation region 6 to the overall height information image 41 of the chip 2 and the overall height information image 42 of the lead 3, as shown in Figure 7(c).

[0036] Subsequently, as shown in Figure 9(a), the wire candidate region image 46 shown in Figure 9(c) is calculated by subtracting (deleting) the height information image 40 of frame 1, the height information image 41 of chip 2, the height information image 42 of lead 3, and the height information image 43 of interpolation region 6, as shown in Figure 9(b), from the original overall height information image 44. In other words, the candidate region image 46 can be calculated by subtracting the restored image 45 from the original overall height information image 44.

[0037] Specifically, the wire candidate region image 46 is an image like the one shown in Figure 10(a). From such an image, the conductive wire 4 can be extracted by performing a binarization process, as shown in Figure 10(b). That is, an image in which only the conductive wire 4 is displayed can be obtained. In this case, as shown in Figure 10(b), the image in which only the conductive wire 4 is displayed can be mapped to the entire full-focus image or depth image of the electronic device.

[0038] According to the conductive wire extraction apparatus of the present invention, the original height information acquisition means 10 can obtain an original height information image of the entire electronic device including the conductive wire 4 from an image of the entire electronic device. The positioning means 11 can position the conductive wire connection area. The height extraction area setting means 12 can set the height extraction area of ​​the conductive wire connection area. The interpolation area setting means 14 can set an interpolation area connecting the conductive wire connection areas, and the area height interpolation means 15 can obtain a height information image 43 of the interpolation area 6. The restoration means 16 can obtain a restored image 45 consisting of the height information image 41 of the conductive wire connection area obtained based on the height extraction area 41 set in the extraction area setting means 12, and the height information image 43 in the interpolation area obtained by the area height interpolation means. The remaining height information acquisition means 17 can obtain the remaining height information by subtracting the restored image 45 obtained by the restoration means 16 from the original height information obtained by the original height information acquisition means 10, and the extraction means 18 can extract only the conductive wire 4 from the remaining height information image. With this configuration, the remaining height information image will not include image data of foreign objects (objects other than the regular conductive wire connection points) 5 present on the base.

[0039] In this invention, whether or not foreign matter is present on the base 1, and even if there are multiple conductive wires 4, all conductive wires 4 can be extracted at once, eliminating the need to perform image processing (individual image processing) on ​​each conductive wire 4. Furthermore, even if foreign matter 5 is present on the base 1, the image data of the foreign matter 5 can be omitted, and the conductive wires 4 can be extracted in the same way as if no foreign matter were present on the base 1. As a result, the setup time for conductive wire extraction and the extraction operation time after setup can be shortened, resulting in a highly productive apparatus and method. Moreover, it is possible to extract only the conductive wires 4 without being affected by other components (parts) that are to be extracted. As a result, the shape quality of the conductive wires 4 can be detected stably and accurately. In addition, since there is no need to capture or process images before bonding, the overall configuration of the apparatus can be simplified, processing time can be shortened (workability can be improved), and the extraction accuracy can be improved.

[0040] It is preferable to have a correction means 13 for correcting the area of ​​the conductive wire connection and the height extraction area. In this way, with the correction means 13, only the conductive wire 4 can be extracted stably and with high accuracy without being affected by the area of ​​the conductive wire connection.

[0041] For positioning by the positioning means 11, either a full-focus image or a distance image can be used. Here, a full-focus image is an image in which all pixels are in focus, reconstructed by evaluating the degree of focus for each pixel from multiple images with different focal points and combining the local images in focus. A distance image is an image in which the relative distance information at the time when the degree of focus is maximum for each pixel is expressed in terms of brightness.

[0042] The original height information image obtained by the original height information acquisition means 10 can be acquired using a distance image.

[0043] The conductive wire connection point is at least one component of the chip 2 and lead 3. In other words, conductive wires can be stably extracted in the manufacturing process of electronic devices such as general semiconductor devices.

[0044] By the way, as shown in Figure 11(a), in an electronic device having one chip 2 and three leads 3 (3c, 3d, 3e) on a base 1, where the chip 2 and lead 3D are connected by a conductive wire 4 (4A), and lead 3C and lead 3E are connected by a conductive wire 4 (4B), the conductive wires 4 (4A) and 4 (4B) will cross.

[0045] In this case, each wire 4A and 4B is extracted individually. Specifically, when extracting wire 4A, an interpolation region 6 is set between the chip 2 and the lead 3D in Figure 11(b). Then, a reconstructed image 45 is obtained by calculating the height information image 41 of the chip 2, the height information image 41 of the lead 3, and the height information image 43 of this interpolation region. Finally, by subtracting this reconstructed image 45 from the original overall height information image 44, the conductive wire 4A can be extracted.

[0046] Furthermore, when extracting wire 4B, an interpolation region 6 is set between lead 3C and lead 3E in Figure 11(c). Then, by obtaining the height information image 41 of lead 3 and the height information image 43 of this interpolation region, a reconstructed image 45 is obtained. Then, by subtracting this reconstructed image 45 from the original overall height information image 44, the conductive wire 4A can be extracted.

[0047] In this way, even if the conductive wires 4 are crossed, each conductive wire 4 can be stably extracted, enabling high-precision extraction.

[0048] Although embodiments of the present invention have been described above, the present invention is not limited to the above embodiments and can be modified in various ways. For example, the range of each height extraction region of the conductive wire-connected portion is arbitrary. As an electronic device assembly, as shown in Figures 3 and 4, it has a frame 1, a chip 2, and a lead 3, and the conductive wire 4 may be used to connect the chips together, connect the leads together, or connect the chip 2 and the lead 3. The electronic device is not limited to having a frame 1, a chip 2, and a lead 3. Also, as an electronic device assembly, in the embodiments the original height information image included a base (frame) 1, but it may not include such a base 1. Also, when a base 1 is included, in the embodiments the upper surface of the base 1 was composed of a flat surface, but it is not limited to a flat surface. Even if the data of the base 1 is not used, an object can be extracted at an appropriate threshold (height) by using an interpolation region.

[0049] In the embodiment, the interpolation region was defined as the area between conductive wire connection points, requiring at least two conductive wire connection points. However, it is not limited to the area between connection points; at least one other assembly member that is a conductive wire connection point is sufficient.

[0050] The full-focus image and depth image may be monochrome or color, and may be two-dimensional or three-dimensional. The conductive wire 4 is not limited to the number of wires to be extracted. Furthermore, when imaging with the imaging means, in the above embodiment, the camera side, which is the imaging means, was driven (moved). However, the camera side may be stopped and the electronic device side driven, thereby driving both the camera side and the electronic device side.

[0051] Furthermore, the assembly components to be extracted may be semiconductor chips, and are not limited to conductive materials; they may also be non-conductive materials such as glass, plastic, or ceramic. [Explanation of Symbols]

[0052] 2 chips 3, 3A, 3B, 3C, 3D 3E lead 4, 4A, 4B conductive wires 5 Foreign object 6 Interpolation region 10 Information acquisition means 11 Positioning means 12. Height extraction area setting means 13 Correction means 14 Interpolation region setting means 15. Region height interpolation means 16 Restoration means 17 Information acquisition means 18 Extraction means 20 Information acquisition process 22 Extraction area setting process 23 Correction process 24 Interpolation region setting process 25. Region height interpolation process 26. Restoration process 27 Information acquisition process 28 Extraction process 31, 33, 35 Height extraction regions

Claims

1. A target assembly member extraction device for extracting a target assembly member, which is a component of an electronic device assembly, from other assembly members, A means for obtaining the original height information image of the entire electronic device assembly from an image of the electronic device assembly including the assembly member to be extracted, Positioning means for positioning the other assembly members, A height extraction region setting means for setting the height extraction region in the other assembly member, Interpolation region setting means for setting an interpolation region adjacent to the other assembly member, A region height interpolation means for obtaining a height information image of an interpolation region adjacent to the aforementioned other assembly member, A restoration means for obtaining a height information image of another assembly member obtained based on the height extraction region set in the extraction region setting means, and a restoration means for obtaining a restored image consisting of the height information image in the interpolated region obtained by the region height interpolation means, A remaining height information acquisition means obtains a height information image by subtracting the height information image of the restored image obtained by the restoration means from the original height information image including other assembly members obtained by the original height information acquisition means, A target assembly member extraction device characterized by comprising an extraction means for extracting only the target assembly member from a remaining height information image acquired by the remaining height information acquisition means.

2. The target assembly member extraction device according to claim 1, further comprising correction means for correcting the regions of other assembly members and the height extraction region.

3. The target assembly member extraction device according to claim 1, characterized in that the positioning by the positioning means uses a full-focus image or a distance image.

4. The target assembly member extraction device according to claim 1, characterized in that the acquisition of the original height information image by the original height information acquisition means uses a distance image.

5. The target assembly member extraction device according to claim 1, characterized in that it extracts each of the aforementioned target assembly members.

6. The target assembly member extraction device according to claim 1, characterized in that it extracts multiple target assembly members at once.

7. The target assembly member extraction apparatus according to claim 1, characterized in that the target assembly member is a conductive wire as a conductive member.

8. The target assembly member extraction device according to claim 1, characterized in that the other assembly members are at least one of the frame, chip, and lead members.

9. A method for extracting target assembly members, which are components of an electronic device assembly, from other assembly members, A step of obtaining original height information to obtain an image of the entire original height information from an image of an electronic device assembly including the assembly member to be extracted, A positioning step for positioning the other assembly members, A height extraction region setting step for setting the height extraction region in the other assembly member, An interpolation region setting step for setting an interpolation region adjacent to the other assembly member, A region height interpolation step is performed to obtain a height information image of an interpolation region adjacent to the other assembly member, A restoration step to obtain a restored image consisting of a height information image of the other assembly member obtained based on the height extraction region set in the extraction region setting step, and a height information image in the interpolated region obtained in the region height interpolation step, A remaining height information acquisition step is performed by subtracting the height information image of the restored image obtained in the restoration step from the original height information image including the other assembly members obtained in the original height information acquisition step, and obtaining the remaining height information image. A method for extracting target assembly members, characterized by comprising an extraction step of extracting only the target assembly members from the remaining height information image acquired in the remaining height information acquisition step.

10. The method for extracting target assembly members according to claim 9, characterized in that, when there are multiple assembly members to be extracted and the interpolation regions intersect, it is possible to select which of the other assembly members' regions to set as the height restoration image.

Images