Curable composition for inkjet and for partition wall formation, light-emitting device, and method for manufacturing light-emitting device

Abstract

Provided is a curable composition which is for an inkjet and for partition wall formation, and from which a partition wall having a large aspect ratio and a high infrared light shielding property can be formed.　A curable composition for an inkjet and for partition wall formation according to the present invention comprises: a photocurable compound having (meth)acryloyl groups and vinyl groups in a total number of at least two, while not having a cyclic ether group; a thermosetting compound having a cyclic ether group; a photopolymerization initiator; a thermosetting agent; and an infrared shielding agent.

Description

Curable composition for inkjet printing and for forming partition walls, light-emitting device, and method for manufacturing light-emitting device

[0001] The present invention relates to a curable composition for inkjet use and for forming partition walls, which is applied using an inkjet device. The present invention also relates to a light-emitting device and a method for producing a light-emitting device using the curable composition.

[0002] In recent years, light-emitting devices capable of emitting infrared light have been widely used. Examples of such light-emitting devices include smartphones equipped with face authentication systems. Conventional light-emitting devices include a first member such as a substrate, a second member such as a glass member, a light-emitting member capable of emitting infrared light disposed on the surface of the first member, and a plastic housing connecting the first member and the second member. The plastic housing is typically disposed to surround the light-emitting member and is made of a material that is resistant to leakage of infrared light (see, for example, Patent Document 1 listed below).

[0003] WO2015 / 025593A1

[0004] In recent years, light-emitting devices have become increasingly smaller. However, in conventional light-emitting devices that use plastic housings, it is difficult to sufficiently reduce the distance between the light-emitting member and the plastic housing, and therefore there is a limit to how small the light-emitting device can be.

[0005] In order to achieve miniaturization of light-emitting devices, it is conceivable to manufacture light-emitting devices by using an inkjet device to apply a curable composition in a frame shape so as to surround a light-emitting member and then curing the applied curable composition to form a partition wall. In this case, the performance of the curable composition needs to be such that it can form a partition wall having a large aspect ratio (height / width) and high infrared light-shielding properties.

[0006] However, it is difficult to form partition walls with a large aspect ratio using conventional curable compositions for inkjet printing, and it is also difficult to improve the infrared light shielding properties of the partition walls using conventional curable compositions for inkjet printing.

[0007] An object of the present invention is to provide a curable composition for inkjet printing and for forming partition walls, which is capable of forming partition walls having a large aspect ratio and high infrared light shielding properties. Another object of the present invention is to provide a light-emitting device and a method for producing a light-emitting device using the curable composition.

[0008] According to a broad aspect of the present invention, there is provided a curable composition for inkjet printing and for partition wall formation (hereinafter sometimes abbreviated as "curable composition"), which comprises a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups but having no cyclic ether group, a thermosetting compound having a cyclic ether group, a photopolymerization initiator, a thermosetting agent, and an infrared light-shielding agent.

[0009] In a specific aspect of the curable composition according to the present invention, the infrared light shielding agent includes carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton.

[0010] In a specific aspect of the curable composition according to the present invention, the metal complex in the metal complex having a phthalocyanine skeleton is a vanadium complex or a copper complex, and the metal complex in the metal complex having a naphthalocyanine skeleton is a vanadium complex or a copper complex.

[0011] In a specific aspect of the curable composition according to the present invention, the carbon black has an average primary particle size of 20 nm or more and 100 nm or less.

[0012] In a specific aspect of the curable composition according to the present invention, the thermosetting compound includes a thermosetting compound having two or more cyclic ether groups.

[0013] In a specific aspect of the curable composition according to the present invention, the photocurable compound includes a photocurable compound having a dicyclopentadiene skeleton.

[0014] In a specific aspect of the curable composition according to the present invention, the thermosetting compound includes a photo- and thermosetting compound having a (meth)acryloyl group.

[0015] In a specific aspect of the curable composition according to the present invention, the photocurable compound includes a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups.

[0016] In a specific aspect of the curable composition according to the present invention, the content of the photocurable compound is 10% by weight or more and 75% by weight or less.

[0017] In a specific aspect of the curable composition according to the present invention, the thermal curing agent includes an aromatic amine compound.

[0018] In a specific aspect of the curable composition according to the present invention, the aromatic amine compound includes 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone.

[0019] In a specific aspect of the curable composition according to the present invention, the curable composition further comprises a dispersant.

[0020] In a specific aspect of the curable composition according to the present invention, the acid value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less, and the amine value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less.

[0021] According to a broad aspect of the present invention, there is provided a light-emitting device comprising: a first member; a light-emitting member arranged on a first surface of the first member; and a partition wall arranged on the first surface of the first member, wherein the partition wall is a cured product of the above-mentioned curable composition for inkjet printing and for forming partition walls.

[0022] In a specific aspect of the light-emitting device according to the present invention, the light-emitting device includes a second member, the light-emitting member being capable of emitting infrared light, the partition wall being arranged on the first surface of the first member so as to surround the light-emitting member, and the partition wall bonding the first member and the second member together.

[0023] According to a broad aspect of the present invention, there is provided a method for manufacturing a light-emitting device, comprising: an application step of applying the above-described inkjet and partition wall-forming curable composition using an inkjet device onto a first surface of a first member on which a light-emitting member is arranged, to form a curable composition layer; and a photo-curing step of irradiating the curable composition layer with light to promote curing, thereby forming a B-staged product layer.

[0024] In a specific aspect of the method for manufacturing a light-emitting device according to the present invention, the method for manufacturing a light-emitting device includes a placement step of placing a second component on the surface of the B-stage compound layer opposite the first component side, and a thermal curing step of thermally curing the B-stage compound layer by heating, wherein in the placement step, the second component is placed on the surface of the B-stage compound layer that is arranged so as to surround the light-emitting component.

[0025] The curable composition for inkjet printing and for partition wall formation according to the present invention comprises a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups but no cyclic ether group, a thermosetting compound having a cyclic ether group, a photopolymerization initiator, a heat curing agent, and an infrared light shielding agent. The curable composition for inkjet printing and for partition wall formation according to the present invention has the above-mentioned configuration, and therefore can form partition walls having a large aspect ratio and high infrared light shielding properties.

[0026] Fig. 1(a) is a plan view schematically showing a light-emitting device obtained using the curable composition for inkjet printing and for partition wall formation according to the first embodiment of the present invention, and Fig. 1(b) is a cross-sectional view schematically showing the light-emitting device. Figs. 2(a) to 2(c) are cross-sectional views illustrating each step of a method for manufacturing the light-emitting device shown in Fig. 1. Figs. 3(d) to 3(f) are cross-sectional views illustrating each step of a method for manufacturing the light-emitting device shown in Fig. 1.

[0027] The present invention will be described in detail below.

[0028] (Curable composition for inkjet printing and for partition wall formation) The curable composition for inkjet printing and for partition wall formation according to the present invention (hereinafter sometimes abbreviated as "curable composition") is used by being applied using an inkjet device (application of the curable composition using an inkjet device and use for forming partition walls). The curable composition according to the present invention is different from curable compositions that are applied by screen printing and different from curable compositions that are applied using a dispenser.

[0029] The curable composition according to the present invention comprises a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and no cyclic ether group, a thermosetting compound having a cyclic ether group, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent.

[0030] In this specification, the above-mentioned "photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and having no cyclic ether group" may be referred to as "(A) photocurable compound."

[0031] In this specification, the above-mentioned "thermosetting compound having a cyclic ether group" may be referred to as "(B) thermosetting compound."

[0032] Therefore, the curable composition according to the present invention contains (A) a photocurable compound, (B) a thermosetting compound, a photopolymerization initiator, a thermosetting agent, and an infrared light shielding agent.

[0033] The curable composition according to the present invention has the above-described configuration, and therefore can form partition walls with a large aspect ratio and high infrared light-shielding properties. The curable composition according to the present invention can form partition walls with an aspect ratio (height / width) required for a light-emitting device. Furthermore, in a light-emitting device, if infrared light irradiated from a light-emitting member leaks into unintended areas, the performance of the light-emitting device will deteriorate. The curable composition according to the present invention can form partition walls with high infrared light-shielding properties, and therefore infrared light irradiated from a light-emitting member is less likely to leak into unintended areas.

[0034] Furthermore, the curable composition according to the present invention can be applied with high precision to the vicinity of a light-emitting member using an inkjet device, and therefore the light-emitting device can be made smaller.

[0035] Furthermore, since the curable composition according to the present invention has the above-mentioned configuration, it is possible to increase the adhesive strength between the member to be adhered and the partition wall.

[0036] The curable composition is a photo- and thermosetting composition because it contains (A) a photocurable compound and (B) a thermosetting compound. The curable composition is preferably used by being cured by irradiation with light and then cured by heating.

[0037] Hereinafter, each component contained in the curable composition will be described in detail. In this specification, "(meth)acryloyl" means one or both of "acryloyl" and "methacryloyl", and "(meth)acrylate" means one or both of "acrylate" and "methacrylate". In addition, in this specification, the CH ２ =C(H or CH ３ ) groups are not included in the vinyl groups.

[0038] <(A) Photocurable Compound> The curable composition includes (A) a photocurable compound. The (A) photocurable compound is a photocurable compound having a total of two or more (meth)acryloyl groups and two or more vinyl groups and no cyclic ether group. The (A) photocurable compound may have a (meth)acryloyl group, may have a vinyl group, or may have both a (meth)acryloyl group and a vinyl group. The (A) photocurable compound has a (meth)acryloyl group or a vinyl group. In this case, the (A) photocurable compound has at least one of a (meth)acryloyl group and a vinyl group. The (A) photocurable compound may have a (meth)acryloyl group and a vinyl group. The (A) photocurable compound may have a (meth)acryloyl group or may have a vinyl group. The (meth)acryloyl group and the vinyl group are photocurable functional groups. The photocurable compound (A) does not have, for example, an epoxy group (cyclic ether group). Only one type of the photocurable compound (A) may be used, or two or more types may be used in combination.

[0039] The (A) photocurable compound has a total of two or more (meth)acryloyl groups and vinyl groups. When a curable composition contains an infrared light shielding agent, the photoreactivity (photocurability) of the curable composition generally tends to decrease. However, in the present invention, a (A) photocurable compound having a large number of photocurable functional groups is used, thereby increasing the number of reaction sites upon light irradiation. As a result, in the present invention, the curing of the curable composition can be smoothly promoted by light irradiation. Furthermore, in the present invention, by using a (A) photocurable compound having a large number of photocurable functional groups, the curing of the curable composition can be smoothly promoted by light irradiation, and the proportion of three-dimensional structures formed in the crosslinked state after photocuring can be increased. As a result, in the present invention, partition walls with a large aspect ratio can be formed even when the curable composition contains an infrared light shielding agent.

[0040] The (A) photocurable compound preferably contains a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups, and more preferably contains a photocurable compound having a total of four or more (meth)acryloyl groups and vinyl groups. The (A) photocurable compound further preferably contains a photocurable compound having a total of five or more (meth)acryloyl groups and vinyl groups, and particularly preferably contains a photocurable compound having a total of six or more (meth)acryloyl groups and vinyl groups. In this case, the photocurability can be further improved, and partition walls with an even larger aspect ratio can be formed. The total number of (meth)acryloyl groups and vinyl groups in the (A) photocurable compound may be 100 or less, 50 or less, or 10 or less.

[0041] The (A) photocurable compound preferably includes a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups. The (A) photocurable compound more preferably includes a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of four or more (meth)acryloyl groups and vinyl groups. The (A) photocurable compound further preferably includes a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of five or more (meth)acryloyl groups and vinyl groups. The (A) photocurable compound particularly preferably includes a photocurable compound having a total of two (meth)acryloyl groups and vinyl groups, and a photocurable compound having a total of six or more (meth)acryloyl groups and vinyl groups. In this case, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed.

[0042] From the viewpoint of forming a curable composition layer with high precision and further enhancing photocurability to form partition walls with a larger aspect ratio, the photocurable compound (A) preferably has a (meth)acryloyl group, and more preferably has two or more (meth)acryloyl groups. The photocurable compound (A) is preferably a (meth)acrylate compound, and more preferably a polyfunctional (meth)acrylate compound.

[0043] The (A) photocurable compound may contain a difunctional (meth)acrylate compound, a trifunctional (meth)acrylate compound, a tetrafunctional (meth)acrylate compound, a pentafunctional (meth)acrylate compound, or a hexafunctional (meth)acrylate compound. The (A) photocurable compound may contain a heptafunctional or higher (meth)acrylate compound. For example, the "difunctional" in a difunctional (meth)acrylate compound indicates that the compound has two (meth)acryloyl groups.

[0044] The (A) photocurable compound preferably contains a bifunctional (meth)acrylate compound, more preferably a trifunctional or higher functional (meth)acrylate compound, and even more preferably a tetrafunctional or higher functional (meth)acrylate compound. The (A) photocurable compound further preferably contains a pentafunctional or higher functional (meth)acrylate compound, and particularly preferably a hexafunctional or higher functional (meth)acrylate compound. In this case, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, the curable composition layer can be formed with even higher precision.

[0045] Examples of the bifunctional (meth)acrylate compound include ethoxylated bisphenol A di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanedi(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl ... Examples of the di(meth)acrylate include 2-ethyl-2-butylpropanediol di(meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, and dipropylene glycol di(meth)acrylate.

[0046] Examples of the trifunctional (meth)acrylate compound include glycerin propoxy tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.

[0047] Examples of the tetrafunctional (meth)acrylate compound include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.

[0048] Examples of the pentafunctional (meth)acrylate compound include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0049] Examples of the hexafunctional (meth)acrylate compound include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0050] Examples of the photocurable compound (A) having a vinyl group include vinyl ethers, ethylene derivatives, and dicyclopentadiene.

[0051] The photocurable compound (A) preferably includes a photocurable compound having a polyol skeleton, and more preferably includes a (meth)acrylate compound having a polyol skeleton, which can further increase the adhesive strength between the adhesion target members (the first member and the second member) and the partition wall.

[0052] The number of (meth)acryloyl groups (functionality) contained in the (meth)acrylate compound having a polyol skeleton may be 2, 2 or more, 3 or more, 4 or more, 5 or more, or 6 or more. The number of (meth)acryloyl groups contained in the (meth)acrylate compound having a polyol skeleton may be 100 or less, 50 or less, or 10 or less.

[0053] The (A) photocurable compound preferably includes a photocurable compound having a dicyclopentadiene skeleton, and more preferably includes a (meth)acrylate compound having a dicyclopentadiene skeleton. In this case, the dicyclopentadiene skeleton is a rigid skeleton, which reduces cure shrinkage of the curable composition, thereby further increasing the adhesive strength between the adhesion target members (first member and second member) and the partition wall.

[0054] The number of (meth)acryloyl groups (functionality) contained in the (meth)acrylate compound having a dicyclopentadiene skeleton may be 2, 2 or more, 3 or more, 4 or more, 5 or more, or 6 or more. The number of (meth)acryloyl groups contained in the (meth)acrylate compound having a dicyclopentadiene skeleton may be 100 or less, 50 or less, or 10 or less.

[0055] The content of the (A) photocurable compound in 100% by weight of the curable composition is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, and preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of the (A) photocurable compound is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, when the content of the (A) photocurable compound is equal to or less than the above-mentioned upper limit, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased.

[0056] The content of the photocurable compound having a polyol skeleton in 100% by weight of the curable composition is preferably 10% by weight or more, more preferably 15% by weight or more, even more preferably 20% by weight or more, and preferably 75% by weight or less, more preferably 70% by weight or less, and even more preferably 65% ​​by weight or less. When the content of the photocurable compound having a polyol skeleton is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, when the content of the photocurable compound having a polyol skeleton is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased.

[0057] The content of the photocurable compound having a polyol skeleton in 100% by weight of the (A) photocurable compound is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably 90% by weight or less, more preferably 80% by weight or less. When the content of the photocurable compound having a polyol skeleton is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, when the content of the photocurable compound having a polyol skeleton is equal to or greater than the above-mentioned lower limit, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased.

[0058] The content of the (A) photocurable compound other than the photocurable compound having a polyol skeleton, relative to 100% by weight of the curable composition, is preferably 10% by weight or more, more preferably 20% by weight or more, even more preferably 30% by weight or more, and preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the content of the (A) photocurable compound other than the photocurable compound having a polyol skeleton is equal to or greater than the lower limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, when the content of the (A) photocurable compound other than the photocurable compound having a polyol skeleton is equal to or less than the upper limit, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased.

[0059] The content of the photocurable compound having a dicyclopentadiene skeleton in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, even more preferably 15% by weight or more, and preferably 65% ​​by weight or less, more preferably 60% by weight or less, and even more preferably 55% by weight or less. When the content of the photocurable compound having a dicyclopentadiene skeleton is equal to or greater than the lower limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. When the content of the photocurable compound having a dicyclopentadiene skeleton is equal to or less than the upper limit, the adhesive strength between the members to be bonded (first member and second member) and the partition walls can be further increased.

[0060] The content of the photocurable compound having a dicyclopentadiene skeleton in 100% by weight of the (A) photocurable compound is preferably 10% by weight or more, more preferably 20% by weight or more, and preferably 90% by weight or less, more preferably 80% by weight or less. When the content of the photocurable compound having a dicyclopentadiene skeleton is equal to or greater than the above-mentioned lower limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, when the content of the photocurable compound having a dicyclopentadiene skeleton is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the adhesive strength between the members to be bonded (first member and second member) and the partition walls can be further increased.

[0061] <(B) Thermosetting Compound> The curable composition contains (B) a thermosetting compound. The (B) thermosetting compound is a thermosetting compound having a cyclic ether group. The cyclic ether group is a thermosetting functional group. Only one type of (B) thermosetting compound may be used, or two or more types may be used in combination.

[0062] Examples of the cyclic ether group contained in the (B) thermosetting compound include an epoxy group, etc. The (B) thermosetting compound may have only one type of cyclic ether group, or may have two or more types of cyclic ether groups.

[0063] The cyclic ether group of the (B) thermosetting compound is preferably an epoxy group. The (B) thermosetting compound preferably has an epoxy group. The (B) thermosetting compound is preferably an epoxy compound. In this case, the curable composition layer can be formed with high precision. In addition, the thermosetting property can be further improved, and partition walls with an even larger aspect ratio can be formed. In addition, the adhesive strength between the members to be bonded (first member and second member) and the partition walls can be further improved.

[0064] The (B) thermosetting compound may include a thermosetting compound having one cyclic ether group, a thermosetting compound having two cyclic ether groups, a thermosetting compound having two or more cyclic ether groups, or a thermosetting compound having three or more cyclic ether groups. The (B) thermosetting compound may include an epoxy compound having one epoxy group, an epoxy compound having two epoxy groups, an epoxy compound having two or more epoxy groups, or an epoxy compound having three or more epoxy groups. The number of cyclic ether groups or epoxy groups in the (B) thermosetting compound may be 100 or less, 50 or less, or 10 or less.

[0065] From the viewpoint of more effectively exerting the effects of the present invention, the (B) thermosetting compound preferably includes a thermosetting compound having two or more cyclic ether groups, and more preferably includes an epoxy compound having two or more epoxy groups. In this case, the curable composition layer can be formed with high precision. Furthermore, the thermosetting property can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, the adhesive strength between the members to be bonded (first member and second member) and the partition walls can be further increased.

[0066] Examples of the epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus in the skeleton.

[0067] The thermosetting compound (B) may have a (meth)acryloyl group, or may not have a (meth)acryloyl group. The thermosetting compound (B) may include a thermosetting compound having a (meth)acryloyl group, or may not include a thermosetting compound having a (meth)acryloyl group.

[0068] The (B) thermosetting compound having a (meth)acryloyl group is a photo- and thermosetting compound.

[0069] In this specification, the above-mentioned "(B) thermosetting compound having a (meth)acryloyl group" may be referred to as "(B1) photo- and thermosetting compound."

[0070] The photo- and thermo-curable compound (B1) is a photo- and thermo-curable compound having a (meth)acryloyl group and a cyclic ether group. Only one type of the photo- and thermo-curable compound (B1) may be used, or two or more types may be used in combination.

[0071] The thermosetting compound (B) preferably includes a photo- and thermosetting compound (B1), which can further enhance photocurability and form partition walls with a larger aspect ratio while maintaining good adhesive strength between the members to be bonded (the first member and the second member) and the partition walls.

[0072] The photo- and thermosetting compound (B1) may have one (meth)acryloyl group or two or more (meth)acryloyl groups.

[0073] (B1) Examples of the photo- and thermosetting compound include glycidyl (meth)acrylate and 4-hydroxybutyl (meth)acrylate glycidyl ether.

[0074] The photo- and thermosetting compound (B1) preferably contains glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether, which can further enhance the photo-curability and form partition walls with a larger aspect ratio.

[0075] The content of the (B) thermosetting compound per 100 wt% of the curable composition is preferably 5 wt% or more, more preferably 10 wt% or more, even more preferably 15 wt% or more, even more preferably 20 wt% or more, and particularly preferably 30 wt% or more. The content of the (B) thermosetting compound per 100 wt% of the curable composition is preferably 80 wt% or less, more preferably 70 wt% or less, even more preferably 60 wt% or less, even more preferably 40 wt% or less, even more preferably 35 wt% or less, and particularly preferably 30 wt% or less. When the content of the (B) thermosetting compound is above the above lower limit and below the above upper limit, the curable composition layer can be formed with high precision. Furthermore, the thermosetting property can be further improved, allowing the formation of partition walls with a larger aspect ratio. Furthermore, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased.

[0076] The content of the (B1) photo- and thermosetting compound per 100 wt% of the curable composition is preferably 10 wt% or more, more preferably 20 wt% or more, and even more preferably 30 wt% or more. The content of the (B1) photo- and thermosetting compound per 100 wt% of the curable composition is preferably 80 wt% or less, more preferably 70 wt% or less, even more preferably 60 wt% or less, even more preferably 40 wt% or less, even more preferably 35 wt% or less, and particularly preferably 30 wt% or less. When the content of the (B1) photo- and thermosetting compound is above the above-mentioned lower limit and below the above-mentioned upper limit, the photocurability and thermosetting properties can be further improved, allowing for the formation of partition walls with a larger aspect ratio. Furthermore, when the content of the (B1) photo- and thermosetting compound is above the above-mentioned lower limit, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased.

[0077] The content of the (B1) photo- and thermosetting compound in 100% by weight of the (B) thermosetting compound is preferably 10% by weight or more, more preferably 20% by weight or more, even more preferably 30% by weight or more, and preferably 90% by weight or less, more preferably 80% by weight or less, and even more preferably 70% by weight or less. When the content of the (B1) photo- and thermosetting compound is equal to or greater than the above-mentioned lower limit, the photocurability can be further improved, and partition walls with a larger aspect ratio can be formed. Furthermore, when the content of the (B1) photo- and thermosetting compound is equal to or less than the above-mentioned upper limit, the adhesive strength between the members to be bonded (first member and second member) and the partition walls can be further increased.

[0078] The total content of the (A) photocurable compound and the (B) thermosetting compound per 100 wt% of the curable composition is preferably 55 wt% or more, more preferably 60 wt% or more, and even more preferably 65 wt% or more. When the total content is equal to or greater than the lower limit, the curable composition layer can be formed with high precision. Furthermore, when the total content is equal to or greater than the lower limit, the photocurability and thermosetting property can be further improved, allowing partition walls with a larger aspect ratio to be formed. Furthermore, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased. There is no particular upper limit for the total content of the (A) photocurable compound and the (B) thermosetting compound per 100 wt% of the curable composition. The total content of the (A) photocurable compound and the (B) thermosetting compound per 100 wt% of the curable composition is preferably 95 wt% or less, more preferably 90 wt% or less, and even more preferably 85 wt% or less.

[0079] <Photopolymerization initiator> The curable composition contains a photopolymerization initiator. The photopolymerization initiator may be used alone or in combination of two or more.

[0080] Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0081] The photoradical polymerization initiator is a compound that generates radicals upon irradiation with light and initiates a radical polymerization reaction.Examples of the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkylphenone compounds such as 2-hydroxy-2-methyl-1-phenyl-propan-1-one; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; and 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1 aminoacetophenone compounds such as 2-methylanthraquinone, ... Thioxanthone compounds such as thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; ketal compounds such as acetophenone dimethyl ketal and benzil dimethyl ketal; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyloxime)], ethanol oxime ester compounds such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]-1-(o-acetyloxime); and titanocene compounds such as bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, and bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium.The photoradical polymerization initiators may be used alone or in combination of two or more.

[0082] A photopolymerization initiation aid may be used together with the above-mentioned photoradical polymerization initiator. Examples of the photopolymerization initiation aid include N,N-dimethylaminobenzoic acid ethyl ester, N,N-dimethylaminobenzoic acid isoamyl ester, pentyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. Photopolymerization initiation aids other than these may also be used. The above-mentioned photopolymerization initiation aids may be used alone or in combination of two or more.

[0083] Furthermore, titanocene compounds such as CGI-784 (manufactured by Ciba Specialty Chemicals) that have absorption in the visible light region may be used to promote the photoreaction.

[0084] Examples of the photocationic polymerization initiator include sulfonium salts, iodonium salts, metallocene compounds, benzoin tosylate, etc. The photocationic polymerization initiator may be used alone or in combination of two or more.

[0085] The content of the photopolymerization initiator in 100% by weight of the curable composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, even more preferably 1% by weight or more, and preferably 30% by weight or less, more preferably 20% by weight or less, even more preferably 10% by weight or less.

[0086] <Thermal Curing Agent> The curable composition contains a thermal curing agent. The thermal curing agents may be used alone or in combination of two or more.

[0087] Examples of the heat curing agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. Modified polyamine compounds such as amine-epoxy adducts may also be used as the heat curing agent. Other heat curing agents may also be used.

[0088] The amine compound refers to a compound having one or more amino groups. The amine compound may be a primary amine, a secondary amine, or a tertiary amine. Examples of the amine compound include aliphatic amine compounds, alicyclic amine compounds, aromatic amine compounds, hydrazides, and guanidine derivatives. The aliphatic amine compound may be an aliphatic polyamine. The alicyclic amine compound may be an alicyclic polyamine. The aromatic amine compound may be an aromatic polyamine. In addition, the amine compound may be an adduct such as an epoxy compound-added polyamine (a reaction product of an epoxy compound and a polyamine), a Michael addition polyamine (a reaction product of an α,β-unsaturated ketone and a polyamine), a Mannich addition polyamine (a condensate of a polyamine with formalin and a phenol), a thiourea-added polyamine (a reaction product of a thiourea and a polyamine), or a ketone-blocked polyamine (a reaction product of a ketone compound and a polyamine [ketimine]).

[0089] Examples of the aliphatic polyamine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0090] Examples of the alicyclic polyamine include menthene diamine, isophorone diamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0091] Examples of the aromatic polyamines include m-phenylenediamine, p-phenylenediamine, o-xylylenediamine, m-xylylenediamine, p-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenylsulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(4-aminophenoxy)phenyl]sulfone, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(3-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline), and 4,4-diaminodiphenylsulfone.

[0092] Examples of the hydrazide include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.

[0093] Examples of the guanidine derivatives include dicyandiamide, 1-o-tolyldiguanide, α-2,5-dimethylguanide, α,ω-diphenyldiguanidide, α,α-bisguanylguanidinodiphenyl ether, p-chlorophenyldiguanide, α,α-hexamethylenebis[ω-(p-chlorophenol)]diguanide, phenyldiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0094] Examples of the phenol compound include polyhydric phenol compounds, such as phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4′-biphenylphenol, naphthalene skeleton-containing phenol novolac resins, xylylene skeleton-containing phenol novolac resins, dicyclopentadiene skeleton-containing phenol novolac resins, and fluorene skeleton-containing phenol novolac resins.

[0095] Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylnadic anhydride, dodecylsuccinic anhydride, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0096] The heat curing agent preferably contains an amine compound, and is preferably an amine compound. The amine compound is preferably an aromatic amine compound. From the viewpoint of improving the inkjet ejection properties of the curable composition and forming partition walls with an even larger aspect ratio, the aromatic amine compound preferably contains 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone. In this case, the aromatic amine compound contains at least one of 1,3-bis(3-aminophenoxy)benzene and bis[4-(3-aminophenoxy)phenyl]sulfone. The aromatic amine compound may contain 1,3-bis(3-aminophenoxy)benzene and bis[4-(3-aminophenoxy)phenyl]sulfone. The aromatic amine compound may contain 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone. When the thermosetting agent contains these preferable compounds, the adhesive strength between the members to be adhered (the first member and the second member) and the partition wall can be further increased.

[0097] In 100% by weight of the curable composition, the content of the heat curing agent is preferably 1% by weight or more, more preferably 5% by weight or more, even more preferably 10% by weight or more, and preferably 40% by weight or less, more preferably 30% by weight or less, even more preferably 25% by weight or less.

[0098] <Infrared Light Shielding Agent> The curable composition contains an infrared light shielding agent. By containing an infrared light shielding agent in the curable composition, the infrared light shielding property of the partition wall formed from the curable composition can be improved. The infrared light shielding agent may be used alone or in combination of two or more types.

[0099] The infrared light shielding agent is not particularly limited as long as it is a particle or compound having the ability to shield infrared light.

[0100] Examples of the infrared light shielding agent include carbon black, carbon nanotubes, graphene, lanthanum hexaboride compounds, cesium tungsten oxide compounds, dithiol compounds, naphthoquinone compounds, aminium compounds, immonium compounds, azo compounds, phthalocyanine compounds, naphthalocyanine compounds, anthracyanine compounds, quinacridone compounds, pentaphene compounds, dioxazine compounds, perylene compounds, and indole compounds.

[0101] From the viewpoint of further enhancing the infrared light shielding property, the infrared light shielding agent preferably contains carbon black, a phthalocyanine compound, or a naphthalocyanine compound, and more preferably contains carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton. In this case, the infrared light shielding agent contains at least one of carbon black, a phthalocyanine compound, and a naphthalocyanine compound. The infrared light shielding agent may contain at least two of carbon black, a phthalocyanine compound, and a naphthalocyanine compound, or may contain carbon black, a phthalocyanine compound, and a naphthalocyanine compound. The infrared light shielding agent may contain carbon black, a phthalocyanine compound, or a naphthalocyanine compound. From the viewpoint of having excellent light absorption in a wide range from near-infrared light to infrared light and further enhancing the infrared light shielding property, it is even more preferable that the infrared light shielding agent contains carbon black. From the viewpoints of achieving excellent light absorption in a localized region of near-infrared light, forming partition walls with an even larger aspect ratio without inhibiting the photocuring reaction of the photocurable compound (A), and further enhancing the infrared light-shielding property, it is more preferable that the infrared light-shielding agent contains a metal complex having a phthalocyanine skeleton.

[0102] When the curable composition contains an infrared light shielding agent, the average primary particle size of the carbon black is preferably 15 nm or more, more preferably 20 nm or more, even more preferably 30 nm or more, and preferably 100 nm or less, more preferably 90 nm or less. When the average primary particle size of the carbon black is equal to or greater than the above lower limit, the dispersibility of the carbon black in the curable composition can be further increased when the curable composition is circulated and applied while being heated using an inkjet device, thereby improving the inkjet dischargeability of the curable composition and enabling the formation of partition walls with a larger aspect ratio.

[0103] The average primary particle size of the carbon black can be measured using a transmission electron microscope (TEM). Examples of transmission electron microscopes include the "JEM-ARM200F" manufactured by JEOL Ltd. The major and minor diameters of particle images obtained using the transmission electron microscope are measured, and the geometric mean value of the measured values ​​(major diameter x minor diameter) is calculated. １／２ The average primary particle size of the carbon black is preferably determined by measuring the primary particle sizes of 100 particles of the carbon black and arithmetically averaging the measured values.

[0104] The metal complex having a phthalocyanine skeleton is a phthalocyanine compound. From the viewpoint of further enhancing the infrared light shielding property, the metal complex in the metal complex having a phthalocyanine skeleton is preferably a vanadium complex or a copper complex. The phthalocyanine compound is preferably a phthalocyanine containing a vanadium atom or a copper atom.

[0105] The metal complex having a naphthalocyanine skeleton is a naphthalocyanine compound. From the viewpoint of further enhancing the infrared light shielding property, the metal complex in the metal complex having a naphthalocyanine skeleton is preferably a vanadium complex or a copper complex. The naphthalocyanine compound is preferably a naphthalocyanine containing a vanadium atom or a copper atom.

[0106] The content of the infrared light-shielding agent in 100% by weight of the curable composition is preferably 0.1% by weight or more, more preferably 0.5% by weight or more, and preferably 10% by weight or less, more preferably 5% by weight or less. When the content of the infrared light-shielding agent is equal to or more than the above lower limit and equal to or less than the above upper limit, the infrared light-shielding property can be further improved, and partition walls having an even larger aspect ratio can be formed.

[0107] <(C) Photocurable Compound> The curable composition may contain a photocurable compound having a total of one (meth)acryloyl group and one vinyl group and no cyclic ether group, which can further improve the storage stability of the curable composition.

[0108] In this specification, the above-mentioned "photocurable compound having one (meth)acryloyl group and one vinyl group in total and having no cyclic ether group" may be referred to as "(C) photocurable compound."

[0109] The (C) photocurable compound may have a (meth)acryloyl group or may have a vinyl group. The (C) photocurable compound has only one of a (meth)acryloyl group and a vinyl group. The (C) photocurable compound may have a (meth)acryloyl group or may have a vinyl group. The (meth)acryloyl group and the vinyl group are photocurable functional groups. The (C) photocurable compound does not have, for example, an epoxy group (cyclic ether group). Only one type of (C) photocurable compound may be used, or two or more types may be used in combination.

[0110] Examples of the (C) photocurable compound (monofunctional (meth)acrylate compound) having a (meth)acryloyl group include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, i-propyl (meth)acrylate, n-butyl (meth)acrylate, i-butyl (meth)acrylate, sec-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, and 2-phenoxyethyl (meth)acrylate. glycerol mono(meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentanyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, and stearyl (meth)acrylate.

[0111] Examples of the photocurable compound (C) having a vinyl group include vinyl ethers, ethylene derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, N-vinylpyrrolidone, and N-vinylformamide.

[0112] The content of the (C) photocurable compound in 100% by weight of the curable composition is preferably 30% by weight or less, more preferably 20% by weight or less, and even more preferably 10% by weight or less. When the content of the (C) photocurable compound is equal to or less than the above upper limit, the content of the (A) photocurable compound that can be contained in the curable composition can be increased, thereby further improving photocurability and forming partition walls with a larger aspect ratio. There is no particular limitation on the lower limit of the content of the (C) photocurable compound in 100% by weight of the curable composition. The content of the (C) photocurable compound in 100% by weight of the curable composition may be 0% by weight or more, may exceed 0% by weight, may be 1% by weight or more, or may be 5% by weight or more. The curable composition may not contain the (C) photocurable compound.

[0113] The total content of the (A) photocurable compound, the (B) thermosetting compound, and the (C) photocurable compound in 100% by weight of the curable composition is preferably 55% by weight or more, more preferably 60% by weight or more, and even more preferably 65% ​​by weight or more. When the total content is equal to or greater than the lower limit, the curable composition layer can be formed with high precision. Furthermore, partition walls with a larger aspect ratio can be formed. Furthermore, the adhesive strength between the adhesion target members (first member and second member) and the partition walls can be further increased. There is no particular upper limit to the total content of the (A) photocurable compound, the (B) thermosetting compound, and the (C) photocurable compound. The total content of the (A) photocurable compound, the (B) thermosetting compound, and the (C) photocurable compound is preferably 95% by weight or less, more preferably 90% by weight or less, and even more preferably 85% by weight or less.

[0114] <Curing Accelerator> The curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more.

[0115] Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, quaternary phosphonium salts, organic metal salts, phosphorus compounds, and urea compounds.

[0116] The content of the curing accelerator in 100% by weight of the curable composition is preferably 0.01% by weight or more, more preferably 0.05% by weight or more, and preferably 10% by weight or less, more preferably 5% by weight or less.

[0117] <Solvent> The curable composition may or may not contain a solvent. The solvent may be used alone or in combination of two or more.

[0118] Examples of the solvent include water and organic solvents.

[0119] From the viewpoint of further enhancing the removability of residues, the solvent is preferably an organic solvent.

[0120] Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, esters such as ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum-based solvents such as petroleum ether and naphtha.

[0121] From the viewpoint of further increasing the thickness precision of the curable composition layer, the smaller the content of the solvent in the curable composition, the better.

[0122] When the curable composition contains the solvent, the content of the solvent is preferably 5 wt % or less, more preferably 1 wt % or less, and even more preferably 0.5 wt % or less, based on 100 wt % of the curable composition. It is most preferable that the curable composition does not contain the solvent.

[0123] <Dispersant> The curable composition may or may not contain a dispersant. The curable composition preferably contains a dispersant. When the curable composition contains a dispersant, the dispersibility of the carbon black in the curable composition is further increased when the curable composition is circulated and applied while being heated using an inkjet device, thereby improving the inkjet ejection properties of the curable composition and enabling the formation of partition walls with a larger aspect ratio.

[0124] The dispersant has a structure in which a hydrophilic skeleton and a lipophilic skeleton are covalently bonded within one molecule. Examples of the dispersant include surfactants such as cationic dispersants, anionic dispersants, nonionic dispersants, amphoteric dispersants, silicone dispersants, fluorine dispersants, and polymer dispersants. The dispersant may be used alone or in combination of two or more.

[0125] Examples of the cationic dispersant include resins and compounds having an amino group. The cationic dispersant preferably has an amino group. The cationic dispersant may have one, two, three, or four amino groups. The number of amino groups in the cationic dispersant may be 100 or less, 50 or less, or 10 or less. The cationic dispersant does not have to be a thermosetting agent.

[0126] Examples of the anionic dispersant include resins and compounds having a carboxyl group, a sulfonic acid group, a sulfate ester group, or a phosphate ester group. The anionic dispersant preferably has a carboxyl group, a sulfonic acid group, a sulfate ester group, or a phosphate ester group.

[0127] Examples of the nonionic dispersant include a nonionic dispersant having a polyoxyethylene group and a nonionic dispersant having an amide group. Examples of the nonionic dispersant having a polyoxyethylene group include polyoxyethylene alkyl ether, polyoxyethylene alkylaryl ether, acetylene glycol, and polyoxyethylene glycol ester copolymer. Examples of the nonionic dispersant having an amide group include polyoxyethylene fatty acid amide.

[0128] Examples of the polymer dispersant include BYK-9076 (manufactured by BYK), DISPERBYK-145 (manufactured by BYK), FLORENE GW-1500 (manufactured by Kyoeisha Chemical Co., Ltd.), EfkaPX4701 (manufactured by BASF), and Hinotect T-6000 (manufactured by Kawaken Fine Chemicals Co., Ltd.).

[0129]

[0063] From the viewpoint of improving the inkjet dischargeability of the curable composition and forming partition walls having a larger aspect ratio, the molecular weight of the dispersant is preferably 500 or more, more preferably 1,000 or more, even more preferably 2,000 or more, and preferably 50,000 or less, more preferably 25,000 or less, even more preferably 10,000 or less.

[0130] The acid value of the dispersant is preferably 0 mgKOH / g or more, more preferably 10 mgKOH / g or more, even more preferably 20 mgKOH / g or more, and preferably 100 mgKOH / g or less, and more preferably 90 mgKOH / g or less. When the acid value of the dispersant is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the inkjet ejection properties of the curable composition can be improved, partition walls with a larger aspect ratio can be formed, and the pot life can be improved. The amine value of the dispersant is preferably 0 mgKOH / g or more, more preferably 10 mgKOH / g or more, even more preferably 20 mgKOH / g or more, and preferably 100 mgKOH / g or less, and more preferably 90 mgKOH / g or less. When the amine value of the dispersant is equal to or greater than the above-mentioned lower limit and equal to or less than the above-mentioned upper limit, the inkjet ejection properties of the curable composition can be improved, partition walls with a larger aspect ratio can be formed, and the pot life can be improved. From the viewpoints of improving the inkjet dischargeability of the curable composition, forming partition walls having a larger aspect ratio, and improving the pot life, it is preferable that the acid value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less, and that the amine value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less.

[0131] <Other Components> The curable composition may contain components other than the above-described components. The other components are not particularly limited, but include adhesion aids such as coupling agents, fillers, leveling agents, antifoaming agents, and polymerization inhibitors.

[0132] (Other Details of Curable Composition) The curable composition is applied using an inkjet device, and is therefore generally liquid at 25°C. The viscosity of the curable composition at 25°C and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, even more preferably 10 mPa·s or more, still more preferably 160 mPa·s or more, preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, and still more preferably 1500 mPa·s or less. From the viewpoints of further increasing the thickness accuracy of the curable composition layer and further reducing the likelihood of voids occurring in the curable composition layer, it is particularly preferable that the viscosity of the curable composition at 25°C and 10 rpm be 160 mPa·s or more and 1600 mPa·s or less.

[0133] The viscosity is measured at 25° C. using an E-type viscometer (for example, "TVE22L" manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

[0134] The curable composition can be used to bond a first member and a second member, and to form a partition wall. The curable composition is preferably used by being applied onto the first surface of the first member. The curable composition is preferably used by being applied onto the first surface of the first member so as to surround a light-emitting member arranged on the first surface of the first member. The curable composition is preferably used by being applied in a frame shape onto the first surface of the first member. The curable composition is preferably used to form a frame-shaped partition wall. A light-emitting member is preferably present inside the frame-shaped partition wall. An internal space is preferably present inside the partition wall. A void portion is preferably present inside the partition wall.

[0135] The first member, the second member, and the light-emitting member will be described in detail later.

[0136] (Light-emitting device and method for manufacturing light-emitting device) A light-emitting device according to the present invention comprises a first member, a light-emitting member arranged on a first surface of the first member, and a partition wall arranged on the first surface of the first member, wherein the partition wall is a cured product of the above-mentioned curable composition for inkjet printing and for forming a partition wall.

[0137] The light-emitting device preferably includes a second member. In the light-emitting device, the partition preferably bonds the first member and the second member. In the light-emitting device, the partition preferably is disposed on the first surface of the first member so as to surround the light-emitting member.

[0138] The method for manufacturing the light-emitting device preferably includes the following steps (1) to (4): (1) a coating step of applying the above-mentioned inkjet and partition wall-forming curable composition using an inkjet device onto a first surface of a first member on which a light-emitting member is disposed, to form a curable composition layer; (2) a photocuring step of irradiating light to promote curing of the curable composition layer, to form a B-staged product layer; (3) a placement step of placing a second member on the surface of the B-staged product layer opposite the first member side; and (4) a thermal curing step of thermally curing the B-staged product layer by heating.

[0139] Specific embodiments of the present invention will be described below with reference to the drawings. Note that in the drawings, the size, thickness, shape, etc. may differ from the actual size, thickness, shape, etc. for the sake of convenience of illustration.

[0140] Fig. 1(a) is a plan view schematically showing a light-emitting device obtained using the curable composition for inkjet printing and for partition wall formation according to the first embodiment of the present invention, and Fig. 1(b) is a cross-sectional view schematically showing the light-emitting device, taken along line II in Fig. 1(a).

[0141] The light-emitting device 10 shown in FIG. 1 includes a first member 1, a second member 2, a partition wall 3, and a light-emitting member 4. The partition wall 3 is a cured product of the curable composition described above. The partition wall 3 is a photo- and thermally cured product of the curable composition described above. The partition wall 3 bonds the first surface 1a of the first member 1 to the first surface 2a of the second member 2. The partition wall 3 is disposed on the first surface 1a of the first member 1 and on the first surface 2a of the second member 2. The partition wall 3 is disposed on the first surface 1a of the first member 1 so as to surround the light-emitting member 4. The partition wall 3 is not disposed on the surface of the light-emitting member 4. The partition wall 3 has a frame-like shape. A space is formed by the area surrounded by the first member 1, the second member 2, and the partition wall 3.

[0142] An example of a method for manufacturing the light-emitting device shown in FIG. 1 will be described with reference to FIGS. 2(a) to 2(c) and FIGS. 3(d) to 3(f).

[0143] 2(a), a curable composition layer 3A is formed by applying a curable composition using an inkjet device onto the first surface 1a of the first member 1 on which the light-emitting member 4 is disposed (application step). The curable composition is applied to the upper surface of the first member 1 to form the curable composition layer 3A. The curable composition is ejected from the ejection unit 51 of the inkjet device.

[0144] 2(b), the curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to proceed with curing of the curable composition layer 3A, thereby forming a B-staged product layer 3B (photo-curing step). The B-staged product layer 3B is a pre-cured product layer of the curable composition.

[0145] In the method for manufacturing a light-emitting device, after applying the curable composition to a specific region, the entire applied curable composition may be irradiated with light to form a B-staged product layer. In the method for manufacturing a light-emitting device, the applied curable composition may be irradiated with light every time multiple drops of the curable composition are applied, to form a B-staged product layer. In the method for manufacturing a light-emitting device, the applied curable composition may be irradiated with light every time one drop of the curable composition is applied, to form a B-staged product layer.

[0146] After the photocuring step, it is determined whether or not to repeat the coating step and the photocuring step. If the coating step and the photocuring step are repeated, the curable composition is coated on the surface side of the formed B-staged material layer opposite to the first member side.

[0147] 2(c) and 3(d) are diagrams showing the second coating step and the second photocuring step, respectively. As shown in FIG. 2(c), an inkjet device is used to coat a curable composition on the surface of the B-staged material layer 3B opposite the first member 1 side, thereby forming a curable composition layer 3A on the surface of the B-staged material layer 3B. Next, as shown in FIG. 3(d), light is irradiated onto the coated curable composition layer 3A from a light irradiation unit 52 of the inkjet device, thereby forming a B-staged material layer 3B.

[0148] 2 and 3, the coating step and the photo-curing step are performed twice in the thickness direction of the curable composition layer, as shown in Figures 2(a) and 2(b) and as shown in Figures 2(c) and 3(d). By performing the coating step and the photo-curing step multiple times in the thickness direction of the curable composition layer, the thickness of the B-staged product layer can be increased, and the aspect ratio (thickness / width) of the B-staged product layer can be increased. The coating step and the photo-curing step may each be performed two or more times, or three or more times.

[0149] By repeating the above-mentioned application step and photo-curing step, a B-stage compound layer 3B is formed, which is disposed so as to surround the light emitting member 4.

[0150] 3( e), a second member 2 is placed on the surface of the B-stage compound layer 3B, which is arranged to surround the light-emitting member 4, opposite the first member 1 (placement step). The second member 2 is placed on the surface of the frame-shaped B-stage compound layer 3B. Pressure may be applied when placing the second member.

[0151] Next, as shown in Fig. 3(f), the B-staged material layer 3B is thermally cured by heating (thermal curing step). The laminated structure including the first member 1, the second member 2, and the B-staged material layer 3B obtained in Fig. 3(e) is heated to thermally cure the B-staged material layer 3B. This forms the partition walls 3. The partition walls 3 are photo- and thermo-cured layers of a curable composition.

[0152] In this manner, the light emitting device 10 shown in FIG. 1 can be obtained.

[0153] In the coating step, from the viewpoint of forming partition walls having a larger aspect ratio, it is preferable to coat (discharge) the curable composition while circulating it.

[0154] The inkjet device is not particularly limited, and any inkjet device capable of applying the curable composition according to the present invention can be used. The inkjet device preferably includes an ink tank in which the curable composition is stored, a discharge part connected to the ink tank and from which the curable composition is discharged, and a circulation channel part having one end connected to the discharge part and the other end connected to the ink tank and through which the curable composition flows. In this case, the inkjet dischargeability of the curable composition can be improved, and a partition wall having an even larger aspect ratio can be formed.

[0155] The circulation flow path section may or may not include a buffer tank and a pump within the circulation flow path section. The circulation flow path section preferably includes the buffer tank and preferably includes the pump within the circulation flow path section. Furthermore, the circulation flow path section may include a flow meter, a thermometer, a filter, a liquid level sensor, and the like within the circulation flow path section in addition to the buffer tank and the pump.

[0156] From the viewpoint of improving the inkjet ejection properties of the curable composition and forming partition walls with a larger aspect ratio, it is preferable to circulate the curable composition while heating it. When circulating the curable composition while heating it, the temperature of the curable composition can be adjusted by introducing a heater into the ink tank or using a heater in the circulation channel section.

[0157] From the viewpoint of improving the inkjet dischargeability of the curable composition and forming partition walls having a larger aspect ratio, the temperature of the circulated curable composition is preferably 30°C or higher, more preferably 40°C or higher, and preferably 120°C or lower, more preferably 100°C or lower.

[0158] In the photo-curing step, ultraviolet light is preferably irradiated. The irradiance and irradiation time of the ultraviolet light in the photo-curing step can be appropriately changed depending on the composition of the curable composition and the coating thickness of the curable composition. The irradiance of the ultraviolet light in the photo-curing step is, for example, 1000 mW / cm ２ or more, 5000 mW / cm ２ or more, and may be 10,000 mW / cm ２ or less, and may be 8000 mW / cm ２ The irradiation time of ultraviolet light in the photocuring step may be, for example, 0.01 seconds or more, 0.1 seconds or more, 400 seconds or less, or 100 seconds or less.

[0159] In the disposing step, it is preferable that the second member be disposed on the surface of the B-stage compound layer disposed so as to surround the light emitting member, and that the surface of the B-stage compound layer formed in a frame shape be bonded to the second member.

[0160] The thermal curing step is preferably carried out after the placement step.

[0161] The heating temperature and heating time in the thermal curing step can be appropriately changed depending on the composition of the curable composition and the thickness of the B-staged product layer. The heating temperature in the thermal curing step may be, for example, 100° C. or higher, 120° C. or higher, and 250° C. or lower, or 200° C. or lower. The heating time in the thermal curing step may be, for example, 5 minutes or longer, 30 minutes or longer, or 600 minutes or shorter, or 300 minutes or shorter.

[0162] The width, height, shape, etc. of the partition wall can be changed as appropriate.

[0163] The width of the partition wall is preferably 5 μm or more, more preferably 10 μm or more, even more preferably 25 μm or more, and preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. When the width of the partition wall is equal to or greater than the lower limit, the strength of the partition wall can be increased. When the width of the partition wall is equal to or less than the upper limit, the light-emitting device can be further miniaturized. When the width of the partition wall is equal to or greater than the lower limit, the infrared light shielding property can be further improved.

[0164] The height of the partition wall is preferably 50 μm or more, more preferably 100 μm or more, even more preferably 200 μm or more, and preferably 3000 μm or less, more preferably 2000 μm or less, and even more preferably 1000 μm or less. When the height of the partition wall is equal to or greater than the lower limit, a partition wall having a larger aspect ratio can be formed. When the height of the partition wall is equal to or less than the upper limit, the light-emitting device can be further miniaturized. Furthermore, when the height of the partition wall is equal to or less than the upper limit, the occurrence of distortion in the partition wall can be effectively suppressed.

[0165] The aspect ratio (ratio of height to width (height / width)) of the partition wall is preferably 3 or more, more preferably 5 or more, even more preferably 10 or more, and preferably 100 or less, more preferably 50 or less, and even more preferably 30 or less. When the aspect ratio (height / width) is equal to or greater than the lower limit, the light-emitting device can be made even smaller. When the aspect ratio (height / width) is equal to or less than the upper limit, the strength of the partition wall can be increased.

[0166] Examples of the first member include a circuit board, a semiconductor element, and a silicon substrate.

[0167] The second member may be a transparent member, etc. Examples of the second member that is a transparent member include transparent glass members such as diffusion glass and IR-cut glass, etc. The second member is preferably a transparent glass member.

[0168] The light emitting member is preferably a light emitting member capable of emitting infrared light. Examples of the light emitting member include a 3D sensor light source.

[0169] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to the following examples.

[0170] The following materials were prepared:

[0171] ((A) Photocurable Compound) Hexafunctional (meth)acrylate compound: dipentaerythritol hexaacrylate ("DPHA" manufactured by Daicel-Allnex Corporation) Trifunctional (meth)acrylate compound: trimethylolpropane triacrylate ("TMPTA" manufactured by Daicel-Allnex Corporation) Bifunctional (meth)acrylate compound 1: ethoxylated bisphenol A diacrylate ("APG-700" manufactured by Shin-Nakamura Chemical Co., Ltd., a (meth)acrylate compound having a polyol skeleton) Bifunctional (meth)acrylate compound 2: tricyclodecane dimethanol diacrylate ("IRR214K" manufactured by Daicel-Allnex Corporation, a (meth)acrylate compound having a dicyclopentadiene skeleton) Bifunctional (meth)acrylate compound 3: 1,6-hexanediol diacrylate ("HDDA" manufactured by Daicel-Allnex Corporation)

[0172] ((B) Thermosetting Compound) (B1) Photo- and thermosetting compound: 4-hydroxybutyl (meth)acrylate glycidyl ether (manufactured by Mitsubishi Chemical Corporation, "4HBAGE") Bifunctional epoxy compound: bisphenol A type epoxy compound (manufactured by DIC Corporation, "850CRP")

[0173] ((C) Photocurable Compound) Monofunctional (meth)acrylate compound: 2-ethylhexyl acrylate ("2EHA" manufactured by Nippon Shokubai Co., Ltd.)

[0174] (Photopolymerization initiator) 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone (Irg379 manufactured by IGM)

[0175] (Thermal curing agent) 1,3-bis(3-aminophenoxy)benzene ("APB-N" manufactured by Mitsui Chemicals, Inc.) Bis[4-(3-aminophenoxy)phenyl]sulfone ("BAPS-M" manufactured by Seika Corporation) 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane ("Curehard MED" manufactured by Kumiai Chemical Industry Co., Ltd.) Dicyandiamide ("DICY7" manufactured by Mitsubishi Chemical Corporation)

[0176] (Silane coupling agent) 3-glycidoxypropylmethyldimethoxysilane ("KBM-402" manufactured by Shin-Etsu Chemical Co., Ltd.) 3-glycidoxypropylmethyldiethoxysilane ("KBE-402" manufactured by Shin-Etsu Chemical Co., Ltd.)

[0177] (Infrared light shielding agent) Phthalocyanine vanadium complex ("HA-1" manufactured by Nippon Shokubai Co., Ltd.) Phthalocyanine copper complex ("FDN-006" manufactured by Yamada Chemical Industry Co., Ltd.) Phthalocyanine metal complex ("FDN-008" manufactured by Yamada Chemical Industry Co., Ltd.) Carbon black 1 ("SF Black BJ2296" manufactured by Sanyo Dish Co., Ltd., average primary particle diameter 35 nm) Carbon black 2 ("MA600" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 20 nm) Carbon black 3 ("PD-605" manufactured by Mikuni Dish Co., Ltd., average primary particle diameter 65 nm) Carbon black 4 ("#10" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 75 nm) Carbon black 5 ("#20" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 50 nm) Carbon black 6 ("#85" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 40 nm) Carbon Black 7 ("MA220" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 55 nm) Carbon Black 8 ("MCF88" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 18 nm) Carbon Black 9 ("#850" manufactured by Mitsubishi Chemical Corporation, average primary particle diameter 17 nm)

[0178] (Dispersants) Wetting and dispersing agent (BYK "BYK9076", acid value 38 mg KOH / g, amine value 44 mg KOH / g) Wetting and dispersing agent (BYK "DISPERBYK-145", acid value 76 mg KOH / g, amine value 71 mg KOH / g) Wetting and dispersing agent (Kyoeisha Chemical Co., Ltd. "Floren GW-1500", acid value 55 mg KOH / g, amine value 0 mg KOH / g) Wetting and dispersing agent (BASF "EfkaPX4701", acid value 0 mg KOH / g, amine value 40 mg KOH / g)

[0179] (Examples 1 to 40 and Comparative Examples 1 and 2) The components shown in Tables 1 to 9 were blended in the blending amounts (net amounts) shown in Tables 1 to 9 and mixed uniformly to obtain curable compositions for inkjet printing and for forming partition walls.

[0180] (Evaluation) (1) Ability to form partition walls with a large aspect ratio (1) Ability to form partition walls with a width of 300 μm and a height of 1 mm, 2) Ability to form partition walls with a width of 200 μm and a height of 1 mm, and 3) Ability to form partition walls with a width of 100 μm and a height of 1 mm) The obtained curable composition was applied to a first member using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device (application step). Next, the applied curable composition was irradiated with ultraviolet light to form a B-staged product layer (photocuring step). The above application step and photocuring step were repeated in the thickness direction of the formed B-staged product layer. Next, the obtained B-staged product layer was heated and thermally cured to form partition walls (photo- and thermocured product layer) (thermal curing step). The shape of the partition walls was observed using a laser microscope (Olympus "OLS4100").

[0181] As described above, it was confirmed whether or not partition walls having the following shapes could be formed: 1) partition walls having a width of 300 μm and a height of 1 mm, 2) partition walls having a width of 200 μm and a height of 1 mm, and 3) partition walls having a width of 100 μm and a height of 1 mm. In the table, "A" means that partition walls having the above shape could be formed, and "B" means that partition walls having the above shape could not be formed.

[0182] (2) Infrared Light Shielding Property of Partition Wall The obtained curable composition was applied to a first member using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device (application step). Next, the applied curable composition was irradiated with ultraviolet light to form a B-staged product layer (photocuring step). The above application step and photocuring step were repeated in the thickness direction of the formed B-staged product layer. Next, the obtained B-staged product layer was heated to thermally cure it (thermal curing step). The infrared transmittance (optical path length: 100 μm) of the obtained photo- and thermoset product layer at a wavelength of 950 nm was measured using a spectrophotometer (Hitachi High-Technologies Corporation, "U-4100").

[0183] <Criteria for determining the infrared light shielding ability of partition walls> ○○: Infrared transmittance at a wavelength of 950 nm is less than 0.1%. ○: Infrared transmittance at a wavelength of 950 nm is 0.1% or more and 10% or less. ×: Infrared transmittance at a wavelength of 950 nm is more than 10%.

[0184] (3) Adhesion between the Adhesion Target Member and the Partition Walls A glass substrate (5 cm × 5 cm) was prepared as the adhesion target member. The obtained curable composition was applied to the glass substrate using an inkjet head of a piezoelectric inkjet printer equipped with an ultraviolet irradiation device (application process). Next, the applied curable composition was irradiated with ultraviolet light to form a B-staged product layer (photocuring process). The above application process and photocuring process were repeated in the thickness direction of the formed B-staged product layer. Next, the obtained B-staged product layer was heated and thermally cured to form partition walls (photo- and thermosetting product layer) with a height of 150 μm (thermal curing process). The obtained partition walls were cut vertically and horizontally at 1 mm intervals to create 100 grids. Each grid of the partition walls was observed using a laser microscope (Olympus Corporation, "OLS4100"), and the adhesion between the adhesion target member and the partition walls was evaluated according to the following criteria.

[0185] [Criteria for determining the adhesiveness between the adhesive target member and the partition walls] ◯: The number of squares where the partition walls peeled off was 0 to 10. ◯: The number of squares where the partition walls peeled off was 11 to 30. ×: The number of squares where the partition walls peeled off was 31 or more.

[0186] (4) Inkjet Dischargeability A discharge test of the obtained curable composition was carried out from the inkjet head of a piezo inkjet printer equipped with an ultraviolet irradiation device. The inkjet dischargeability was evaluated according to the following criteria.

[0187] [Evaluation criteria for inkjet dischargeability] A: The curable composition can be discharged without discharge unevenness for 100 hours or more continuously. B: The curable composition can be discharged without discharge unevenness for 10 hours of continuous discharge, but slight discharge unevenness occurs during 10 hours or more but less than 100 hours of continuous discharge. C: The curable composition can be discharged for 10 hours or more continuously, but slight discharge unevenness occurs during 10 hours of continuous discharge. D: The curable composition can be discharged, but cannot be discharged for 10 hours or more continuously. E: The curable composition can be discharged, but discharge unevenness occurs in the initial stage. F: The curable composition cannot be discharged in the initial stage of discharging.

[0188] The compositions and results are shown in Tables 1 to 9 below.

[0189]

[0190]

[0191]

[0192]

[0193]

[0194]

[0195]

[0196]

[0197]

[0198] REFERENCE SIGNS LIST 1... First member 1a... First surface 2... Second member 2a... First surface 3... Partition wall 3A... Curable composition layer 3B... B-staged product layer 4... Light-emitting member 10... Light-emitting device 51... Discharge section 52... Light irradiation section

Claims

1. a photocurable compound having a total of two or more (meth)acryloyl groups and vinyl groups and no cyclic ether group; a thermosetting compound having a cyclic ether group; A photopolymerization initiator; A heat curing agent; A curable composition for ink-jet printing and for forming partition walls, comprising an infrared light shielding agent.

2. The curable composition for inkjet and partition wall formation described in claim 1, which is used to form a partition wall having a height of 50 μm or more.

3. The curable composition for inkjet and partition formation according to claim 1, which is used to form a partition having an aspect ratio (ratio of height to width (height / width)) of 3 or more.

4. The curable composition for inkjet and partition formation described in claim 1, which is used to form a partition in a light-emitting device comprising a first member, a light-emitting member arranged on a first surface of the first member, and a partition arranged on the first surface of the first member.

5. The curable composition for inkjet and partition wall formation described in claim 1, wherein the photocurable compound includes a (meth)acrylate compound having hexa- or higher functionality.

6. The curable composition for ink-jet and partition wall formation according to claim 1 , wherein the infrared light shielding agent comprises carbon black, a metal complex having a phthalocyanine skeleton, or a metal complex having a naphthalocyanine skeleton.

7. the metal complex in the metal complex having a phthalocyanine skeleton is a vanadium complex or a copper complex, The curable composition for ink-jet and partition wall formation according to claim 6 , wherein the metal complex in the metal complex having a naphthalocyanine skeleton is a vanadium complex or a copper complex.

8. The curable composition for ink-jet printing and for forming partition walls according to claim 6 or 7, wherein the carbon black has an average primary particle size of 20 nm or more and 100 nm or less.

9. The curable composition for ink jet and partition wall formation according to any one of claims 1 to 7, wherein the thermosetting compound includes a thermosetting compound having two or more cyclic ether groups.

10. The curable composition for ink-jet and partition wall formation according to any one of claims 1 to 7, wherein the photocurable compound includes a photocurable compound having a dicyclopentadiene skeleton.

11. The curable composition for ink jet and partition wall formation according to any one of claims 1 to 7, wherein the thermosetting compound comprises a photo- and thermosetting compound having a (meth)acryloyl group.

12. The curable composition for inkjet and partition wall formation according to any one of claims 1 to 7, wherein the photocurable compound contains a photocurable compound having a total of three or more (meth)acryloyl groups and vinyl groups.

13. The curable composition for ink-jet and partition wall formation according to any one of claims 1 to 7, wherein the content of the photocurable compound is from 10% by weight to 75% by weight.

14. The curable composition for ink jet and partition wall formation according to any one of claims 1 to 7, wherein the heat curing agent comprises an aromatic amine compound.

15. The curable composition for ink jet and partition wall formation according to claim 14, wherein the aromatic amine compound comprises 1,3-bis(3-aminophenoxy)benzene or bis[4-(3-aminophenoxy)phenyl]sulfone.

16. The curable composition for ink-jet printing and for forming partition walls according to any one of claims 1 to 7, further comprising a dispersant.

17. The acid value of the dispersant is 10 mgKOH / g or more and 100 mgKOH / g or less, The curable composition for ink-jet and partition wall formation according to claim 16, wherein the amine value of the dispersant is from 10 mgKOH / g to 100 mgKOH / g.

18. The curable composition for inkjet and partition wall formation according to any one of claims 1 to 7, wherein the content of the infrared light shielding agent is 0.5 wt % or more in 100 wt % of the curable composition.

19. A curable composition for inkjet and partition wall formation according to any one of claims 1 to 7, excluding a curable composition used for forming a marking portion in an electronic component.

20. The curable composition for inkjet and partition wall formation according to claim 1, wherein the infrared light shielding agent comprises carbon black.

21. A first member; a light emitting member disposed on a first surface of the first member; a partition disposed on the first surface of the first member; A light-emitting device, wherein the partition wall is a cured product of the curable composition for ink-jet and partition wall formation according to any one of claims 1 to 7.

22. A second member is provided, The light emitting member is a light emitting member capable of emitting infrared light, the partition is disposed on the first surface of the first member so as to surround the light emitting member, 22. The light emitting device of claim 21, wherein the partition bonds the first member and the second member.

23. a coating step of coating the curable composition for inkjet and partition wall formation according to any one of claims 1 to 7, using an inkjet device, onto a first surface of a first member on which a light-emitting member is arranged, to form a curable composition layer; and a photocuring step of irradiating the curable composition layer with light to cause curing to proceed, thereby forming a B-stage product layer.

24. a step of disposing a second member on a surface of the B-stage layer opposite the first member; and a heat curing step of heat curing the B-staged material layer by heating.

24. The method for manufacturing a light-emitting device according to claim 23, wherein in the disposing step, the second member is disposed on a surface of the B-stage compound layer that is disposed so as to surround the light-emitting member.