Scribe table and scribe device

Abstract

This scribe table (6) comprises grooves (62a to 62c) that are formed in a mounting surface (61) on which a frame unit (20) is mounted, and suction holes (63a to 63c) that are connected to the grooves (62a to 62c). The grooves (62a to 62c) have the shape of a partially interrupted loop in plan view and are formed in a region corresponding to a gap (G1) between the inner periphery of an opening (21a) in a frame ring (21) and the outer periphery of a workpiece (23). A degassing region (64) in which the grooves (62a to 62c) are interrupted is disposed on the side opposite the suction holes (63a to 63c) with respect to the center of the loop.

Description

Scribe table and scribe device 【0001】 The present invention relates to a scribing table that holds a workpiece during scribing, and a scribing device that includes the scribing table. 【0002】 Conventionally, scribing devices that form scribe lines on workpieces such as wafers are known. The workpiece is fixed to a frame ring with dicing tape. Specifically, the tape is attached to the underside of the frame ring so as to cover the opening of the frame ring from below. The workpiece is attached to the tape exposed from the opening, and is held in the frame ring. In this way, a frame unit consisting of the frame ring, tape, and workpiece is formed. 【0003】 When forming the scribe line, the frame unit is placed on the table of the scribing device. The table has many suction holes formed in the area where the frame unit is placed. By applying negative pressure to these suction holes, the underside of the frame unit is sucked. This holds the frame unit on the table. 【0004】 In this configuration, suction holes are also formed on the table's mounting surface, on which the workpiece is placed in plan view. This allows the workpiece to be held to the table via tape. However, in this configuration, when the scribing wheel crosses the top surface of the workpiece that is placed over the suction holes, a load is applied to the scribing wheel from the suction holes. This load reduces the accuracy of scribing the workpiece. This problem is particularly noticeable when the workpiece is thin. 【0005】In contrast, the following Patent Document 1 describes a configuration in which a frame unit can be held on a table without providing suction holes in the area on the table where the workpiece overlaps. In this configuration, a ring-shaped frame body having a plurality of suction holes on its inner peripheral surface is provided on the top surface of the table. The inner diameter of this frame body is set to be equal to or smaller than the inner diameter of the frame ring. By applying negative pressure to these suction holes, the area of ​​the tape near the inner diameter of the frame ring, i.e., the area of ​​the tape where the workpiece does not overlap, is sucked. In this way, the frame unit is held on the frame body on the table. 【0006】 Japanese Patent Application Laid-Open No. 2020-136357 【0007】 In the configuration of Patent Document 1, suction holes are formed on the inner peripheral surface of the frame body, so when the tape is sucked through the suction holes while the frame ring is placed on the top surface of the frame body, the tape can only be pulled down to the height of the suction holes. Therefore, the area of ​​the tape where the workpiece overlaps is unlikely to be in close contact with the top surface of the table, which may cause unstable loads applied to the workpiece during the scribing operation. Furthermore, with this configuration, air is likely to be trapped between the area of ​​the tape where the workpiece overlaps and the top surface of the table, making it difficult to accurately scribe the workpiece. 【0008】 In view of these problems, the present invention aims to provide a scribing table that can properly hold workpieces without providing suction holes in the area where the workpieces overlap, and a scribing device equipped with such a scribing table. 【0009】 A first aspect of the present invention relates to a scribing table that holds a frame unit having a workpiece fixed to an opening of a frame ring with tape covering the opening from below. The scribing table according to this aspect includes a groove formed in a mounting surface on which the frame unit is placed and a suction hole connected to the groove. Here, the groove has a shape in which a portion of a loop is interrupted in a plan view and is formed in an area corresponding to the gap between the inner periphery of the opening and the outer periphery of the workpiece. A degassing area where the groove is interrupted is located on the opposite side of the suction hole with respect to the center of the loop. 【0010】 With the scribing table according to this embodiment, when the frame unit is placed on the mounting surface and air is sucked from the grooves through the suction holes, the tape is sucked into the grooves, and the frame unit is adsorbed and fixed to the scribing table. At this time, the tape is drawn into the grooves by the air sucked through the suction holes, and is adsorbed to the grooves while being subjected to tension in the pulling direction. This tension causes the tape to adhere closely to the mounting surface. Furthermore, because the tape is adsorbed to the grooves in order along the grooves from the joining position of the suction holes, the tape's adhesion due to the tension progresses from the suction hole side toward the degassing area. Therefore, even if air is trapped between the tape in the area where the workpiece is fixed and the mounting surface when the frame unit is placed on the mounting surface, this air is driven into the degassing area and degassed from the degassing area as the tape adheres to the mounting surface. 【0011】 Therefore, with the scribing table according to this embodiment, the area of ​​the tape where the workpiece overlaps can be brought into close contact with the mounting surface, and the workpiece can be held properly, even without providing suction holes in the area where the workpiece is fixed. Furthermore, even if air is trapped between the area of ​​the tape where the workpiece overlaps and the mounting surface, this air can be exhausted from the degassing area by the suction action of the tape. Therefore, the scribing operation on the workpiece can be performed with high precision and stability. 【0012】 In the scribing table according to this aspect, the groove is preferably formed in a position close to the outer periphery of the workpiece. 【0013】 With this configuration, the workpiece is firmly fixed to the scribing table without shifting, preventing the workpiece from shifting during the scribing operation and enabling stable scribing of the workpiece. 【0014】 The scribing table according to this aspect may be configured such that a plurality of the grooves are formed in the region corresponding to the gap. 【0015】This configuration allows the tape to be more firmly attached than when there is only one groove. This allows the workpiece to be more firmly fixed. Furthermore, compared to when there is only one groove, the tension applied to the tape during attachment can be increased, allowing the tape to adhere more firmly to the mounting surface. This allows air trapped inside to be more reliably removed. 【0016】 In this configuration, the suction holes respectively connected to the grooves may be configured so that the ends opposite to the grooves are connected to a common hole. 【0017】 According to this configuration, by sucking air from a common hole, it is possible to simultaneously suck air from a plurality of grooves via a plurality of suction holes, thereby simplifying the configuration for sucking air. 【0018】 In the scribing table according to this aspect, the groove may have a shape in which a part of a circle is broken in a plan view. 【0019】 According to this configuration, when the workpiece is circular in plan view, the grooves can be smoothly arranged along the outer periphery of the workpiece. 【0020】 In the scribing table according to this aspect, the workpiece is, for example, a wafer. 【0021】 In this case, the wafer can be fixed to the mounting surface without arranging suction holes in the area where the wafer is fixed, and air can be sucked in through the suction holes to prevent air from being trapped between the area of ​​the tape where the wafer is fixed and the mounting surface, thereby enabling the scribing operation on the wafer to be performed with high accuracy and stability. 【0022】 A second aspect of the present invention relates to a scribing apparatus, which includes the scribing table according to the first aspect and a scribing head for scribing the workpiece. 【0023】According to the scribing device of this embodiment, as described above, the workpiece can be properly held on the mounting surface without providing suction holes in the area where the workpieces overlap, so that scribing on the workpieces can be performed with high precision and stability. 【0024】 As described above, according to the present invention, it is possible to provide a scribing table and a scribing device equipped with the scribing table that can properly hold workpieces without providing suction holes in the area where the workpieces overlap. 【0025】 The effects and significance of the present invention will become more apparent from the following description of the embodiments, however, the embodiments shown below are merely examples of how the present invention may be implemented, and the present invention is not limited to the embodiments described below. 【0026】 FIG. 1 is a side view schematically illustrating the configuration of a scribing device according to an embodiment. FIGS. 2(a) and 2(b) are a plan view and an A-A cross-sectional view, respectively, illustrating the configuration of a frame unit according to an embodiment. FIGS. 3(a) to 3(c) are a plan view, a B-B cross-sectional view, and a C-C cross-sectional view, respectively, of a scribing table according to an embodiment. FIGS. 4(a) and 4(b) are a plan view and a cross-sectional view, respectively, illustrating a state in which a frame unit is placed on the mounting surface of a scribing table according to an embodiment. FIGS. 5(a) to 5(c) are a plan view, a B-B cross-sectional view, and a C-C cross-sectional view, respectively, illustrating the behavior of a tape when negative pressure is applied to three suction holes according to an embodiment. FIGS. 6(a) and 6(b) are plan views schematically illustrating the behavior of a tape when negative pressure is applied to three suction holes according to an embodiment. FIG. 7 is a block diagram illustrating the configuration of a scribing device according to an embodiment. FIG. 8 is a flowchart illustrating a scribing process for a workpiece according to an embodiment. FIG. 9(a) is a plan view illustrating the configuration of a scribing table according to a modified example. 9(b) and 9(c) are cross-sectional views showing the configuration of a scribing table according to another modified example, and FIGS. 10(a) and 10(b) are plan views showing the configuration of a scribing table according to yet another modified example. 【0027】However, the drawings are for illustrative purposes only and do not limit the scope of the present invention. 【0028】 Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience, each drawing includes an X-axis, a Y-axis, and a Z-axis, which are orthogonal to each other. The positive and negative Z-axis directions are the vertically upward and vertically downward directions, respectively, and the positive X-axis direction is the direction in which the scribing head is moved during the scribing operation. 【0029】 FIG. 1 is a side view schematically showing the configuration of a scribing device 1. As shown in FIG. 【0030】 As shown in Fig. 1, the scribing device 1 includes a movable table 2 that is movable in the Y-axis direction. The movable table 2 is threadedly engaged with a ball screw 3 that extends in the Y-axis direction. The movable table 2 is also supported by a pair of guide rails 4 that extend in the Y-axis direction so that it can move in the Y-axis direction. When the ball screw 3 is rotated by driving a motor (not shown), the movable table 2 moves in the Y-axis direction along the pair of guide rails 4. 【0031】 A scribing table 6 is installed on the moving stage 2 via a rotation mechanism 5. The rotation mechanism 5 has a motor and rotates the scribing table 6 about a rotation axis parallel to the Z axis. An adsorption structure for adsorbing the frame unit 20 is provided on the upper surface (mounting surface 61) of the scribing table 6. The configurations of the frame unit 20 and the adsorption structure will be described later with reference to FIGS. 2(a), 2(b) and 3(a) to 3(c). 【0032】 The scribing device 1 further includes a pair of support columns 7a, 7b and a transport mechanism 8 supported by the support columns 7a, 7b. The transport mechanism 8 transports the lifting mechanism 9 in the X-axis direction. The transport mechanism 8 includes a ball screw and guide rail extending in the X-axis direction, a motor that drives the ball screw, and a support plate. The support plate is threadedly engaged with the ball screw and is guided in the X-axis direction by the guide rail. The lifting mechanism 9 is attached to the support plate. When the motor of the transport mechanism 8 is driven, the lifting mechanism 9 is transported in the X-axis direction together with the support plate. The transport mechanism 8 is configured to be able to precisely transport the support plate and the lifting mechanism 9 linearly in the X-axis direction with almost no fluctuation. 【0033】 The lifting mechanism 9 raises and lowers the scribe head 10 and camera 11 in the Z-axis direction. The lifting mechanism 9 includes a ball screw and guide rail extending in the Z-axis direction, a motor that drives the ball screw, and a support plate 9a. The support plate 9a is screwed onto the ball screw and is guided in the Z-axis direction by the guide rail. The scribe head 10 and camera 11 are attached to the front surface of the support plate 9a. When the motor of the lifting mechanism 9 is driven, the scribe head 10 and camera 11 are raised and lowered in the Z-axis direction together with the support plate 9a. 【0034】 A holder unit 110 holding a cutter wheel 111 is attached to the lower end of the scribing head 10. The camera 11 is installed on the support plate 92 so that the imaging direction faces downward. The camera 11 images the frame unit 20 held on the mounting surface 61 of the scribing table 6 while being positioned at a predetermined imaging position by the transfer mechanism 8 and the lifting mechanism 9. The image captured by the camera 11 is used to adjust the position (alignment) of the frame unit 20 in the rotation direction around a rotation axis parallel to the Z-axis direction and in the Y-axis direction. 【0035】 Fig. 2(a) is a plan view showing the configuration of the frame unit 20. Fig. 2(b) is a cross-sectional view of the frame unit 20 taken along the line A-A in Fig. 2(a). For convenience, the frame ring 21 and the workpiece 23 are hatched in Fig. 2(a). 【0036】 2(a) and 2(b), the frame unit 20 includes a frame ring 21, a tape 22, and a workpiece 23. The frame ring 21 is a plate-like member made of a metal material and has a constant thickness. In a plan view, the frame ring 21 has a ring-like shape with a circular opening 21a in the center. 【0037】 The tape 22 is attached to the lower surface of the frame ring 21 and covers the opening 21 a of the frame ring 21 from below. The tape 22 is made of, for example, a resin material. The workpiece 23 is attached to the upper surface of the tape 22 exposed from the opening 21 a of the frame ring 21. 【0038】The workpiece 23 is, for example, a wafer. The workpiece 23 may also be another member such as a glass substrate. In a plan view, the workpiece 23 has a disk-like shape with a diameter smaller than that of the opening 21a. The workpiece 23 is attached to the upper surface of the tape 22 so as to be approximately concentric with the opening 21a. As a result, the workpiece 23 is fixed to the opening 21a of the frame ring 21 by the tape 22. In this state, a ring-shaped gap G1 is generated between the inner periphery of the opening 21a and the outer periphery of the workpiece 23. The radial width of the gap G1 is approximately constant around the entire circumference. 【0039】 Fig. 3(a) is a plan view showing the configuration of the scribing table 6. Fig. 3(b) is a cross-sectional view of the scribing table 6 taken along the line B-B in Fig. 3(a), and Fig. 3(c) is a cross-sectional view of the scribing table 6 taken along the line C-C in Fig. 3(a). 【0040】 As shown in Figure 3(a), the scribing table 6 has a substantially square shape in plan view. The scribing table 6 is made of a metal material such as SUS. Three grooves 62a to 62c are formed in the mounting surface 61 of the scribing table 6. The grooves 62a to 62c have a shape in which a portion of a loop is interrupted in plan view. Here, the grooves 62a to 62c have a shape in which a portion of a circle is interrupted in plan view. 【0041】 The grooves 62a to 62c have different diameters and are arranged concentrically. The pitch between adjacent grooves is approximately constant. The three grooves 62a to 62c are formed in an area corresponding to the gap G1 between the inner periphery of the opening 21a and the outer periphery of the workpiece 23 shown in FIGS. 2(a) and 2(b). As shown in FIG. 3(b), the grooves 62a to 62c have a rectangular cross-sectional shape. The depth and radial width of the grooves 62a to 62c are each constant around the entire circumference. The depth and radial width of the grooves 62a to 62c are also the same. 【0042】As shown in Figures 3(a) and 3(c), three suction holes 63a to 63c connected to the grooves 62a to 62c, respectively, are formed in the scribing table 6. The three suction holes 63a to 63c are formed in the portions of the grooves 62a to 62c that are furthest to the positive side of the Y axis, so as to be aligned linearly in the Y axis direction. As shown in Figure 3(c), the three suction holes 63a to 63c have ends opposite the three grooves 62a to 62c that are connected to a common hole 65. The hole 65 is connected to a pressure applying unit for sucking air. 【0043】 3A, the grooves 62a to 62c are interrupted at a position opposite the suction holes 63a to 63c with respect to the center of the loop of the grooves 62a to 62c. This interruption forms a degassing region 64. 【0044】 Furthermore, four circular recesses 66 are formed at positions symmetrical about the center on the mounting surface 61. In a plan view, two of the recesses 66 are arranged at a pair of diagonal positions on the mounting surface 61, and the other two recesses 66 are arranged at another pair of diagonal positions on the mounting surface 61. These recesses 66 function as alignment marks for checking the position of the frame unit 20 relative to the mounting surface 61. 【0045】 Fig. 4(a) is a plan view showing a state in which the frame unit 20 is placed on the placement surface 61 of the scribing table 6. Fig. 4(b) is a cross-sectional view of the scribing table 6 and frame unit 20 in the state of Fig. 4(a) when cut at a plane parallel to the X-Z plane at a midpoint in the Y-axis direction. For convenience, Fig. 4(a) shows a state in which the back of the tape 22 is seen through the gap G1. 【0046】As shown in FIG. 4A , the frame unit 20 is placed on the mounting surface 61 so that the frame ring 21 is approximately evenly fitted into the four recesses 66. In this state, the three grooves 62a to 62c are positioned in an area corresponding to the gap G1 between the inner periphery of the opening 21a of the frame ring 21 and the outer periphery of the workpiece 23. At this time, the innermost groove 62a is positioned in a position close to the outer periphery of the workpiece 23. For example, if the diameter of the workpiece 23 is 100 mm, the width of the gap G1 in the radial direction is approximately 25 mm, and the radial distance between the outer periphery of the workpiece 23 and the innermost groove 62a is approximately 5 mm. The innermost groove 62a is arranged so as to follow the outer periphery of the workpiece 23. 【0047】 In the process of forming a scribe line on the workpiece 23, prior to the scribing operation, an operation is performed to suction-fix the frame unit 20 to the mounting surface 61 of the scribing table 6. That is, air is sucked out of the grooves 62a to 62c through the suction holes 63a to 63c, and the frame unit 20 is suction-fixed to the mounting surface 61. This operation is performed by applying negative pressure from the pressure applying unit to the hole 65 in FIG. 【0048】 Figure 5(a) is a plan view schematically showing the behavior of the tape 22 when negative pressure is applied to the three suction holes 63a to 63c. Figures 5(b) and 5(c) are cross-sectional views schematically showing the state of the tape 22 relative to the grooves 62a to 62c when negative pressure is applied to the three suction holes 63a to 63c. Figures 5(b) and 5(c) are cross-sectional views taken along lines B-B and C-C in Figure 5(a), respectively. 【0049】 For convenience, the workpiece 23 is not shown in Figures 5(b) and (c). Also, Figure 5(a) shows a perspective view of the back of the workpiece 23. In Figure 5(a), the area of ​​the tape 22 that has come into close contact with the placement surface 61 due to the application of negative pressure is indicated by dotted hatching. 【0050】5(c), when negative pressure is applied to the suction holes 63a to 63c through the holes 65, the air in the grooves 62a to 62c connected to the suction holes 63a to 63c is sucked in, and the tape 22 is drawn into the grooves 62a to 62c and adsorbed thereto. As the tape 22 is drawn into the grooves 62a to 62c in this manner, tension T1 in the horizontal direction toward the grooves 62a to 62c is generated in the tape 22 on the inside and outside of the grooves 62a to 62c, and this tension T1 causes the tape 22 on the inside of the grooves 62a to 62c to adhere tightly to the mounting surface 61. 【0051】 Here, the tape 22 adheres to the grooves 62a to 62c in order from the portion closest to the suction holes 63a to 63c to the portion furthest from the portion around the entire circumference of the grooves 62a to 62c. Therefore, immediately after the application of the negative pressure, the tape 22 has not yet adhered to the grooves 62a to 62c at the position B-B in Fig. 5(a), as shown in Fig. 5(b). Therefore, the tape 22 adheres to the mounting surface 61 in the area hatched with dots in Fig. 5(a). 【0052】 Thereafter, the range in which the tape 22 adheres to the mounting surface 61 expands in the negative Y-axis direction as the tape 22 is attracted to the grooves 62a to 62c and moves along the grooves 62a to 62c toward the negative Y-axis side. 【0053】 6A and 6B are plan views that schematically show the behavior of the tape 22 when the tape 22 is further attracted to the grooves 62a to 62c. 【0054】 As the adhesion of tape 22 to grooves 62a to 62c progresses further, the range of contact expands further toward the negative side of the Y axis, as shown in Fig. 6(a), and the range of contact gradually approaches degassing region 64. Thereafter, when the adhesion of tape 22 progresses to the ends of grooves 62a to 62c on the negative side of the Y axis, as shown in Fig. 6(b), tape 22 is adsorbed to grooves 62a to 62c around the entire periphery of gap G1 between the inner periphery of opening 21a and the outer periphery of workpiece 23, and tape 22 comes into close contact with mounting surface 61 over the entire area of ​​opening 21a. 【0055】If air is trapped between the underside of the tape 22 and the mounting surface 61 when the frame unit 20 is mounted, the suction range expands toward the degassing region 64, and the air trapped is gradually pushed toward the degassing region 64 as the contact range expands, as shown in Figures 5(a) and 6(a) and (b). After that, when the suction operation is completed, the air AR generated by the trapped air is degassed to the outside from the degassing region 64, and the entire area of ​​the tape 22 in the area where the workpiece 23 overlaps comes into uniform contact with the mounting surface 61 without any trapped air. 【0056】 FIG. 7 is a block diagram showing the configuration of the scribing device 1. 【0057】 The scribing device 1 includes a control unit 101, a table driving unit 102, a head transport unit 103, a head lifting unit 104, a head driving unit 105, and a pressure applying unit 106. 【0058】 The control unit 101 includes a processing circuit such as a CPU, and memories such as a ROM, a RAM, and a hard disk, and controls each unit according to a program stored in the memory. The table driving unit 102 includes the ball screw 3 and the rotation mechanism 5 shown in Fig. 1. Under the control of the control unit 101, the table driving unit 102 moves the scribing table 6 in the Y-axis direction or rotates the scribing table 6 about a rotation axis parallel to the Z-axis. 【0059】 The head transport unit 103 includes the transport mechanism 8 shown in Fig. 1 and transports the scribe head 10 and camera 11 in the X-axis direction under control of the control unit 101. The head lifting unit 104 includes the lifting mechanism 9 shown in Fig. 1 and lifts the scribe head 10 and camera 11 in the Z-axis direction under control of the control unit 101. 【0060】 The head driving unit 105 includes a driving mechanism that drives the holder unit 110 in the vertical direction in the scribing head 10. The head driving unit 105 drives the driving mechanism in accordance with control from the control unit 101, and presses the cutter wheel 111 against the surface of the workpiece 23 with a predetermined load. The pressure applying unit 106 includes an air pressure source, and applies negative pressure to the suction holes 63a to 63c via the hole 65 in Figure 3(c). 【0061】 FIG. 8 is a flowchart showing the scribing process for the workpiece 23. 【0062】 After the frame unit 20 is placed on the placement surface 61 of the scribing table 6, the control unit 101 executes a process of suction-adsorbing the frame unit 20 to the placement surface 61 (S101). In step S101, the control unit 101 controls the pressure applying unit 106 to apply negative pressure to the suction holes 63a to 63c. As a result, as described with reference to FIGS. 5(a) to 6(b), the tape 22 of the frame unit 20 is sucked into the grooves 62a to 62c of the placement surface 61, and the frame unit 20 is fixed by suction to the placement surface 61. 【0063】 Next, the control unit 101 controls the table driving unit 102 to adjust the position of the scribing table 6 so that the first scribe line (the line to be scribed) defined on the surface of the workpiece 23 is aligned with the movement trajectory of the cutter wheel 111 in the X-axis direction in a plan view (S102). Thereafter, the control unit 101 controls the head transport unit 103, the head lifting unit 104, and the head driving unit 105 to perform a scribing operation along the scribe line (S103). 【0064】 In step 103, the control unit 101 first controls the head transport unit 103 to position the cutter wheel 111 directly above the beginning of the scribe line, and then controls the head lift unit 104 to lower the scribe head 10 until the cutter wheel 111 contacts the surface of the workpiece 23. Furthermore, the control unit 101 controls the head drive unit 105 to press the cutter wheel 111 against the workpiece 23 with a predetermined load. The control unit 101 then controls the head transport unit 103 to transport the scribe head 10 in the positive direction of the X-axis until the cutter wheel 111 reaches the end position of the scribe line. This performs a scribing operation on the scribe line. The control unit 101 then controls the head lift unit 104 to move the cutter wheel 111 away from the surface of the workpiece 23. 【0065】When the scribing operation for the first scribe line is thus completed, the control unit 101 determines whether the scribing operation for all scribe lines defined on the surface of the workpiece 23 has been completed (S104). If the determination in step S104 is NO, the control unit 101 returns the process to step S102 and controls the table driving unit 102 to position the cutter wheel 111 directly above the next scribe line. Thereafter, the control unit 101 performs the scribing operation for the next scribe line by the same process as above (S103). 【0066】 The control unit 101 repeatedly executes the processes of steps S102 and S103 until the scribing operation for all scribe lines is completed (S104: NO). If the multiple scribe lines are defined in a vertical and horizontal grid pattern, the control unit 101 rotates the scribe table 6 by 90 degrees upon completion of the scribing operation for the multiple scribe lines in the horizontal direction, and executes the scribing operation for the multiple scribe lines in the vertical direction. 【0067】 When the scribing operation for all scribe lines defined on the surface of the workpiece 23 is completed in this manner (S104: YES), the control unit 101 controls the pressure applying unit 106 to terminate the application of negative pressure to the suction holes 63a to 63c, and releases the frame unit 20 from suction on the mounting surface 61 (S105). As a result, the control unit 101 terminates the scribing process for the frame unit 20. 【0068】 <Effects of the embodiment> According to the present embodiment, the following effects are achieved. 【0069】5(a) to 6(b), when air is sucked from the grooves 62a to 62c via the suction holes 63a to 63c in a state in which the frame unit 20 is placed on the placement surface 61, the tape 22 is sucked into the grooves 62a to 62c, and the frame unit 20 is adsorbed and fixed to the scribing table 6. At this time, the tape 22 is drawn into the grooves 62a to 62c by the suction of air via the suction holes 63a to 63c, and is therefore adsorbed to the grooves 62a to 62c while receiving tension T1 in the pulling direction. This tension T1 causes the tape 22 to come into close contact with the placement surface 61. Furthermore, because the tape 22 is attracted to the grooves 62a to 62c in order from the joining positions of the suction holes 63a to 63c along the grooves 62a to 62c, the adhesion of the tape 22 by the tension T1 progresses from the suction holes 63a to 63c side toward the deaeration area 64, as shown in Figures 5(a) and 6(a) and (b). Therefore, even if air is trapped between the tape 22 in the area where the workpiece 23 is fixed and the mounting surface 61, this air AR is driven into the deaeration area 64 and deaeration is achieved from the deaeration area 64 as the tape 22 is brought into closer contact with the mounting surface 61. 【0070】 Therefore, with the scribing table 6 according to this embodiment, the area of ​​the tape 22 where the workpiece 23 overlaps can be brought into close contact with the mounting surface 61, and the workpiece 23 can be properly held, even without providing suction holes in the area where the workpiece 23 is fixed. Furthermore, even if air is trapped between the area of ​​the tape 22 where the workpiece 23 overlaps and the mounting surface 61, this air can be exhausted from the degassing area 64 by the suction action of the tape 22. Therefore, the scribing operation on the workpiece 23 can be performed with high precision and stability. 【0071】 4(a) and 4(b), the groove 62a is formed in a position close to the outer periphery of the workpiece 23. This allows the periphery of the workpiece 23 to be attracted to the scribing table 6, so that the workpiece 23 can be firmly fixed without shifting. This makes it possible to prevent the workpiece 23 from shifting position during the scribing operation, and the scribing operation on the workpiece 23 can be performed stably. 【0072】As shown in Figures 4(a) and (b), the scribing table 6 has multiple (three) grooves 62a to 62c formed in the area corresponding to the gap G1. This allows the tape 22 to be more firmly adsorbed than when there is only one groove. Therefore, the workpiece 23 can be more firmly fixed. Furthermore, compared to when there is only one groove, the tension T1 applied to the tape 22 during adsorption can be increased, allowing the tape 22 to be more firmly attached to the mounting surface 61. This allows air trapped inside the tape to be more reliably degassed, allowing for more stable scribing operations. 【0073】 3(c), the ends of the plurality of (three) suction holes 63a to 63c connected to the plurality of (three) grooves 62a to 62c, respectively, on the opposite side to the plurality of grooves 62a to 62c are connected to a common hole 65. As a result, by sucking air through the common hole 65, air can be simultaneously sucked from the plurality of grooves 62a to 62c via the plurality of suction holes 63a to 63c. This simplifies the configuration for sucking air. 【0074】 As shown in Fig. 3A, the grooves 62a to 62c have a shape that resembles a partially broken circle in plan view, which allows the grooves 62a to 62c to be smoothly arranged along the outer periphery of the workpiece 23 when the workpiece 23 has a circular shape in plan view, as shown in Fig. 4A. 【0075】 2(a) and 2(b), the workpiece 23 is, for example, a wafer. In this case, the wafer can be fixed to the mounting surface 61 without arranging suction holes in the area where the wafer is fixed, and air can be suctioned through the suction holes 63a to 63c to prevent air from being trapped between the area of ​​the tape 22 where the wafer is fixed and the mounting surface 61. Therefore, the scribing operation on the wafer can be performed with high precision and stability. 【0076】<Modifications> In the above embodiment, three grooves 62a to 62c are formed in the mounting surface 61, but the number of grooves formed in the mounting surface 61 is not limited to this. For example, as shown in Fig. 9(a) , one groove 62 may be formed in the mounting surface 61, or a plurality of grooves other than three may be formed in the mounting surface 61. 【0077】 9( a), the groove 62 is also disposed in a region corresponding to the gap G1 of the frame unit 20. Furthermore, the groove 62 is preferably formed in a position as close as possible to the outer periphery of the workpiece 23 when the frame unit 20 is placed in a predetermined position on the placement surface 61. In this configuration, only one suction hole 63 connected to the groove 62 may be formed. Also in this configuration, a degassing region 64 where the groove 62 ends is disposed on the opposite side of the suction hole 63 with respect to the center of the loop along the groove 62. The cross-sectional shape, depth, and radial width of the groove 62 can be set arbitrarily as long as the tape 22 can be properly brought into close contact with the placement surface 61. 【0078】 Furthermore, even when a plurality of grooves other than three are formed on the mounting surface 61, these grooves are arranged in an area corresponding to the gap G1 of the frame unit 20. Also in this case, it is preferable that the innermost groove is formed in a position as close as possible to the outer periphery of the workpiece 23 when the frame unit 20 is placed in a predetermined position on the mounting surface 61. Furthermore, similar to the configuration of Fig. 2(a), a suction hole is arranged in each groove, and a degassing area where these grooves end is arranged on the opposite side of the suction hole with respect to the center of the loop along these grooves. 【0079】 In the above embodiment, the cross-sectional shape of the grooves 62a to 62c is rectangular as shown in Fig. 3(b), but the cross-sectional shape of the grooves 62a to 62c may be a shape other than rectangular. For example, as shown in Fig. 9(b), the cross-sectional shape of the grooves 62a to 62c may be a rectangular shape with rounded corners. Alternatively, the cross-sectional shape of the grooves 62a to 62c may be semicircular, semielliptical, triangular, trapezoidal, etc. 【0080】 Furthermore, the pitch between the grooves does not have to be constant, and the depth, radial width and shape of the grooves may differ between the grooves. 【0081】 In the above embodiment, as shown in Fig. 3(c), the plurality of suction holes 63a to 63c are connected to the common hole 65. However, as shown in Fig. 9(c), negative pressure may be applied to the suction holes 63a to 63c individually. In this case, negative pressure does not necessarily have to be applied to the suction holes 63a to 63c simultaneously. For example, negative pressure may be applied to each suction hole in order from the outer suction hole 63c toward the inner suction hole 63a. 【0082】 10(a), the width W1 of the deaeration area 64 may be different from that of the configuration in FIG. 3(a). The width of the deaeration area 64 may be set so that the tape 22 in the area where the workpiece 23 overlaps can be brought into close contact with the mounting surface 61 by suction of air from the grooves 62a to 62c, and so that air trapped between the tape 22 and the mounting surface 61 in this area can be deaeration from the deaeration area 64. Alternatively, the width W1 of the deaeration area 64 may be set slightly wider, and other suction holes or suction grooves may be formed within the deaeration area 64 of this width W1. 【0083】 10(b), the deaeration area 64 may be positioned slightly off-center from the symmetrical position of the suction holes 63a to 63c with respect to the center of the loop. The position of the deaeration area 64 may be set at a position where the tape 22 in the area where the workpiece 23 overlaps can be brought into close contact with the mounting surface 61 by suction of air from the grooves 62a to 62c, and where air trapped between the tape 22 in this area and the mounting surface 61 can be deaeration from the deaeration area 64. 【0084】Furthermore, the suction holes 63a to 63c do not necessarily have to be aligned in a line in the radial direction, but may be aligned in a slightly serpentine pattern in the circumferential direction. The suction holes 63a to 63c may be arranged so that the tape 22 in the area where the workpiece 23 overlaps can be brought into close contact with the mounting surface 61 by sucking air from the grooves 62a to 62c through these suction holes 63a to 63c, and so that air trapped between the tape 22 in this area and the mounting surface 61 can be degassed through the degassing area 64. This also applies when multiple sets of grooves and suction holes other than three are arranged on the scribing table 6. 【0085】 Furthermore, in the above embodiment, the shape of the groove in plan view is a shape of a partially interrupted circle, but the shape of the groove in plan view is not limited to this. For example, if the outline of the workpiece 23 in plan view is an ellipse, the shape of the groove may be a shape of a partially interrupted ellipse. The loop shape of the groove in plan view may be any shape that allows air to be sucked from the grooves 62a to 62c to bring the tape 22 in the area where the workpiece 23 overlaps into close contact with the mounting surface 61, and that allows air trapped between the tape 22 in this area and the mounting surface 61 to be degassed through the degassing area 64. 【0086】 5(a) to 5(c), the magnitude of the negative pressure applied to the holes 65 does not necessarily have to be constant, and for example, the magnitude of the negative pressure applied to the holes 65 may be controlled to change over time. For example, during the period from the start of suction until the tape 22 reaches the state shown in FIG. 6(b), the magnitude of the negative pressure applied to the holes 65 may be gradually increased over time, and the magnitude of the negative pressure at the end of this period may be maintained in the subsequent suction operation. 【0087】Furthermore, the configuration of the scribing device 1 is not limited to the configuration shown in Fig. 1, and the configuration of the frame unit 20 is not limited to the configuration shown in Figs. 2(a) and (b). For example, in the configuration of Fig. 1, the scribe head 10 is moved in the X-axis direction during the scribing operation, but the scribe table 6 may be moved in the X-axis direction without moving the scribe head during the scribing operation. Furthermore, Fig. 2(b) shows that the thickness of the frame ring 21 and the thickness of the workpiece 23 are approximately the same, but the thickness of the frame ring 21 and the thickness of the workpiece 23 may be different. 【0088】 The present invention does not necessarily require that no suction grooves or suction holes be arranged in the area of ​​the mounting surface 61 that overlaps the workpiece 23 in a plan view. For example, suction grooves or suction holes may be arranged in the area of ​​the mounting surface 61 that overlaps the outer periphery of the workpiece 23 that corresponds to the scrap material after the workpiece 23 is cut along the scribing path. 【0089】 In addition, the embodiments of the present invention can be modified in various ways as appropriate within the scope of the technical ideas set forth in the claims. 【0090】 REFERENCE SIGNS LIST 1 scribing device 6 scribing table 10 scribing head 20 frame unit 21 frame ring 21a opening 22 tape 23 workpiece 61 placing surface 62, 62a, 62b, 62c grooves 63, 63a, 63b, 63c suction holes 64 degassing area 65 hole G1 gap

Claims

1. A scribing table that holds a frame unit in which a workpiece is fixed to an opening of a frame ring with tape that covers the opening from below, the scribing table comprising: a groove formed in a mounting surface on which the frame unit is placed; and a suction hole connected to the groove; the groove has a shape in which a part of a loop is interrupted in a plan view, and is formed in an area corresponding to a gap between the inner circumference of the opening and the outer circumference of the workpiece; and a degassing area where the groove is interrupted is located on the opposite side of the suction hole with respect to the center of the loop.

2. A scribing table according to claim 1, characterized in that the groove is formed in a position close to the outer periphery of the workpiece.

3. A scribing table according to claim 1, wherein a plurality of the grooves are formed in the area corresponding to the gap, and a suction hole is formed for each of the grooves.

4. A scribing table according to claim 3, wherein the suction holes respectively connected to the plurality of grooves are connected at their ends opposite the plurality of grooves to a common hole.

5. A scribing table according to claim 1, wherein the groove has a shape in which a part of a circle is broken when viewed from above.

6. A scribing table according to claim 1, characterized in that the workpiece is a wafer.

7. A scribing device comprising: a scribing table according to any one of claims 1 to 6; and a scribing head for scribing the workpiece.