Diamond wire cutting device for preventing silicon wafer from being broken

Abstract

The utility model relates to the field of silicon wafer diamond wire cutting, especially to a prevent silicon wafer diamond wire cutting equipment that breaks. Including base, the upper surface of base is installed with processing frame, one side of base is installed with support, the upper end of support is installed with controlling means, the output of controlling means is installed with wire cutting device, the inside of processing frame is equipped with auxiliary structure, the auxiliary structure includes two slide rails, two slide rails are fixedly connected with processing frame, the inner wall sliding connection of slide rail has two sliding blocks, two sliding blocks are fixedly connected with the side of approaching each other of link plate, the upper surface fixedly connected with screw rod of link plate. The utility model provides a prevent silicon wafer diamond wire cutting equipment that breaks has can be convenient in the fixed when cutting silicon wafer, not only can the loss of silicon wafer processing be less, but also can increase the precision advantage of silicon wafer processing.

Description

Technical Field

[0001] This utility model relates to the field of diamond wire cutting of silicon wafers, and in particular to a diamond wire cutting device that prevents silicon wafers from breaking. Background Technology

[0002] Diamond wire cutting equipment is a precision device used for cutting silicon wafers, sapphire, and other hard materials, and is widely used in the semiconductor, photovoltaic, and LED industries. It uses diamond-coated steel wire (i.e., diamond wire) as the cutting tool, and the high-speed rotating diamond wire cuts the material, achieving high precision and high efficiency.

[0003] Existing technologies, such as the utility model patent with publication number CN217621509U, disclose a diamond wire cutting device. This patent employs a frame; a C-shaped wire saw frame mounted on the frame; multiple wire wheels located at the apex corners of the C-shaped wire saw frame, all on the same plane, with multiple grooves formed on their circumferential surfaces; multiple diamond wires wound parallel to each other within the grooves; a clamping and feeding mechanism perpendicular to the C-shaped wire saw frame, positioned on one side of the frame and corresponding to a notch in the frame; and a platform on the other side of the C-shaped wire saw frame, corresponding to the position of the clamping and feeding mechanism. This utility model addresses the technical problems encountered when cutting multiple monocrystalline silicon rods simultaneously with a single diamond wire, such as high rotational resistance of the single diamond wire, which can negatively impact the cut surface quality of the monocrystalline silicon wafers.

[0004] The inventors discovered during daily use that in existing technologies, the silicon wafer is not properly secured, causing minute displacements or wobbling within the equipment during the cutting process. Diamond wire cutting is a high-speed, precision operation; any minute displacement or vibration can be amplified, leading to uneven cutting force and even directly causing the silicon wafer to shatter. The silicon wafer endures significant cutting stress during the process. Without proper securing, the wafer may experience minute displacements or vibrations during cutting, causing uneven stress distribution. In particular, weak points on the silicon wafer are prone to excessive stress concentration, leading to the formation or propagation of cracks. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies.

[0006] To solve the above-mentioned technical problems, this utility model provides a diamond wire cutting device for preventing silicon wafer breakage, comprising: a base, a processing frame mounted on the upper surface of the base, a bracket mounted on one side of the base, a control device mounted on the upper end of the bracket, a wire cutting device mounted on the output end of the control device, an auxiliary structure inside the processing frame, the auxiliary structure including two slide rails, the two slide rails being fixedly connected to the processing frame, two sliders slidably connected to the inner wall of the slide rails, a connecting plate fixedly connected to the side of the two sliders that are close to each other, a screw fixedly connected to the upper surface of the connecting plate, a sliding plate slidably connected to the arc surface of the screw, a fixing plate fixedly connected to the lower surface of the connecting plate, hydraulic rods mounted on the side of the two fixing plates that are far from each other, the hydraulic rods being fixedly connected to the processing frame, a threaded ring rotatably connected to the upper surface of the sliding plate, the threaded ring being threadedly connected to the screw, a connecting plate fixedly connected to the side of the two sliding plates that are close to each other, and a pressure plate fixedly connected to the end of the connecting plate that is far from the sliding plate.

[0007] The effect achieved by the above components is as follows: when it is necessary to fix and cut the silicon wafer, the hydraulic rod is started to operate. The output end of the hydraulic rod drives the fixing plate to move. The fixing plate drives the connecting plate to move. The connecting plate drives the slider to move. The slider slides on the inner wall of the slide rail. The connecting plate drives the screw to move. The screw drives the slide plate and the threaded ring to move. The slide plate drives the connecting plate to move. The connecting plate drives the pressure plate to move. Then the pressure plate is moved above the silicon wafer. Then the threaded ring is rotated to move. The threaded ring drives the slide plate to move on the surface of the screw. Then the slide plate drives the connecting plate to move. The connecting plate drives the pressure plate to press and fix the silicon wafer.

[0008] Preferably, a protective pad, which is a rubber pad, is fixedly connected to the lower surface of the pressure plate.

[0009] The effect achieved by the above components is that the protective pad can protect the silicon wafer and prevent the pressure plate from being worn when fixing the silicon wafer.

[0010] Preferably, the arc surface of the threaded ring is provided with a plurality of slots, and the plurality of slots are evenly distributed on the threaded ring.

[0011] The effect achieved by the above components is that the groove can increase the friction between the hand and the threaded ring, preventing slippage when rotating the threaded ring.

[0012] Preferably, a limiting rod is fixedly connected inside the slide rail, and the limiting rod is slidably connected to the slider.

[0013] The effect achieved by the above components is that the limiting rod can limit the slider, preventing the slider from deviating when sliding on the inner wall of the slide rail, thus improving the stability of the slider sliding.

[0014] Preferably, two positioning rods are fixedly connected to the upper surface of the connecting plate, and the positioning rods are slidably connected to the sliding plate.

[0015] The effect achieved by the above components is that the positioning rod can limit the skateboard, prevent the skateboard from deviating during use, and improve the stability of the skateboard.

[0016] Preferably, the connecting plate has a rectangular cross-section and is made of stainless steel.

[0017] The effect achieved by the above components is that the stainless steel material can increase the service life of the connecting plate and prevent the connecting plate from rusting during use.

[0018] Compared with related technologies, the diamond wire cutting equipment for preventing silicon wafer breakage provided by this utility model has the following beneficial effects:

[0019] This invention provides a diamond wire cutting device to prevent silicon wafer breakage. By incorporating an auxiliary structure, it addresses the issue that in existing technologies, the silicon wafer is not properly secured, leading to minute displacements or vibrations within the device during cutting. Diamond wire cutting is a high-speed, precision operation; any minute displacement or vibration can be amplified, resulting in uneven cutting force and even directly causing the silicon wafer to break. The silicon wafer endures significant cutting stress during the process. Without proper securing, the wafer may experience minute displacements or vibrations, causing uneven stress distribution. Weak points on the wafer are particularly susceptible to excessive stress concentration, leading to crack formation or propagation. This device facilitates easy securing of the silicon wafer during cutting, reducing processing losses and increasing processing precision. Attached Figure Description

[0020] Figure 1 A schematic diagram of the structure of a diamond wire cutting device for preventing silicon wafer breakage provided by this utility model;

[0021] Figure 2 for Figure 1 The diagram shows the auxiliary structure.

[0022] Figure 3 for Figure 2 The diagram shows the internal structure.

[0023] Figure 4 for Figure 3 The enlarged view of point A shown.

[0024] The following are the labels in the diagram: 1. Base; 2. Processing frame; 3. Support; 4. Wire cutting device; 5. Control device; 6. Auxiliary structure; 601. Slide rail; 602. Pressure plate; 603. Hydraulic rod; 604. Positioning rod; 605. Screw; 606. Slider; 607. Connecting plate; 608. Connecting plate; 609. Slide plate; 610. Threaded ring; 611. Groove; 612. Limiting rod; 613. Protective pad; 614. Fixing plate. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0026] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0027] Please see Figures 1 to 4 The present invention provides a diamond wire cutting device for preventing silicon wafer breakage, comprising: a base 1, a processing frame 2 mounted on the upper surface of the base 1, a support 3 mounted on one side of the base 1, a control device 5 mounted on the upper end of the support 3, a wire cutting device 4 mounted on the output end of the control device 5, and an auxiliary structure 6 provided inside the processing frame 2.

[0028] In the embodiments of this utility model, please refer to Figures 1 to 4The auxiliary structure 6 includes two slide rails 601, which are fixedly connected to the processing frame 2. Two sliders 606 are slidably connected to the inner wall of the slide rails 601. A connecting plate 607 is fixedly connected to the side of the two sliders 606 that is close to each other. A screw 605 is fixedly connected to the upper surface of the connecting plate 607. A slide plate 609 is slidably connected to the arc surface of the screw 605. A fixing plate 614 is fixedly connected to the lower surface of the connecting plate 607. A hydraulic rod 603 is installed on the side of the two fixing plates 614 that is far from each other. The hydraulic rod 603 is fixedly connected to the processing frame 2. A threaded ring 610 is rotatably connected to the upper surface of the slide plate 609. The threaded ring 610 is threadedly connected to the screw 605. A connecting plate 608 is fixedly connected to the side of the two slide plates 609 that is close to each other. A pressure plate 602 is fixedly connected to the end of the connecting plate 608 that is far from the slide plate 609. When it is necessary to fix and cut the silicon wafer, the hydraulic rod 603 is activated. The output end of the hydraulic rod 603 drives the fixing plate 614 to move. The fixing plate 614 drives the connecting plate 607 to move. The connecting plate 607 drives the slider 606 to move. The slider 606 slides on the inner wall of the slide rail 601. The connecting plate 607 drives the screw 605 to move. The screw 605 drives the slide plate 609 and the threaded ring 610 to move. The slide plate 609 drives the connecting plate 608 to move. The connecting plate 608 drives the pressure plate 602 to move. Then the pressure plate 602 is moved above the silicon wafer. Then the threaded ring 610 is rotated to move. The threaded ring 610 drives the slide plate 609 to move on the surface of the screw 605. Then the slide plate 609 drives the connecting plate 608 to move. The connecting plate 608 drives the pressure plate 602 to press and fix the silicon wafer. A protective pad 613, which is a rubber pad, is fixedly connected to the lower surface of the pressure plate 602. The protective pad 613 protects the silicon wafer and prevents wear on the pressure plate 602 when fixing the wafer. The threaded ring 610 has several slots 611 evenly distributed on its arc surface. These slots increase friction between the hand and the threaded ring 610, preventing slippage during rotation. A limit rod 612 is fixedly connected inside the slide rail 601 and slidably connected to the slider 606. The limit rod 612 limits the slider 606, preventing it from shifting while sliding on the inner wall of the slide rail 601 and improving its stability. Two positioning rods 604 are fixedly connected to the upper surface of the connecting plate 607 and slidably connected to the sliding plate 609. The positioning rod 604 can limit the sliding plate 609, preventing it from shifting during use and improving its sliding stability. The connecting plate 607 has a rectangular cross-section and is made of stainless steel. The stainless steel material increases the service life of the connecting plate 607 and prevents it from corroding during use.

[0029] The working principle of the diamond wire cutting device for preventing silicon wafer breakage provided by this utility model is as follows: When it is necessary to fix and cut the silicon wafer, the hydraulic rod 603 is started to operate. The output end of the hydraulic rod 603 drives the fixing plate 614 to move. The fixing plate 614 drives the connecting plate 607 to move. The connecting plate 607 drives the slider 606 to move. The slider 606 slides on the inner wall of the slide rail 601. The connecting plate 607 drives the screw 605 to move. The screw 605 drives the slide plate 609 and the threaded ring 610 to move. The slide plate 609 drives the connecting plate 608 to move. The connecting plate 608 drives the pressure plate 602 to move. Then, the pressure plate 602 is moved above the silicon wafer. Then, the threaded ring 610 is rotated to move. The threaded ring 610 drives the slide plate 609 to move on the surface of the screw 605. Then, the slide plate 609 drives the connecting plate 608 to move, and the connecting plate 608 drives the pressure plate 602 to press and fix the silicon wafer. The protective pad 613 can protect the silicon wafer and prevent the pressure plate 602 from wearing when fixing the silicon wafer. The slot 611 can increase the friction between the hand and the threaded ring 610 and prevent slippage when rotating the threaded ring 610. The limiting rod 612 can limit the slider 606 and prevent the slider 606 from deviating when sliding on the inner wall of the slide rail 601, thus improving the sliding stability of the slider 606. The positioning rod 604 can limit the slide plate 609 and prevent the slide plate 609 from deviating during use, thus improving the sliding stability of the slide plate 609. The stainless steel material can increase the service life of the connecting plate 607 and prevent the connecting plate 607 from rusting during use.

[0030] The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0031] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A diamond wire cutting device for preventing silicon wafer breakage, characterized in that, include: A base (1) is provided, on the upper surface of which a processing frame (2) is mounted. A bracket (3) is mounted on one side of the base (1). A control device (5) is mounted on the upper end of the bracket (3). A wire cutting device (4) is mounted on the output end of the control device (5). An auxiliary structure (6) is provided inside the processing frame (2). The auxiliary structure (6) includes two slide rails (601). The two slide rails (601) are fixedly connected to the processing frame (2). Two sliders (606) are slidably connected to the inner wall of the slide rails (601). A connecting plate (607) is fixedly connected to the side of the two sliders (606) that are close to each other. The upper surface of the connecting plate (607) is fixedly connected to... There is a screw (605), and a slide plate (609) is slidably connected to the arc surface of the screw (605). A fixing plate (614) is fixedly connected to the lower surface of the connecting plate (607). A hydraulic rod (603) is installed on the side of the two fixing plates (614) that are far apart from each other. The hydraulic rod (603) is fixedly connected to the processing frame (2). A threaded ring (610) is rotatably connected to the upper surface of the slide plate (609). The threaded ring (610) is threadedly connected to the screw (605). A connecting plate (608) is fixedly connected to the side of the two slide plates (609) that are close to each other. A pressure plate (602) is fixedly connected to the end of the connecting plate (608) that is far away from the slide plate (609).

2. The diamond wire cutting equipment for preventing silicon wafer breakage according to claim 1, characterized in that, A protective pad (613) is fixedly connected to the lower surface of the pressure plate (602), and the protective pad (613) is a rubber pad.

3. The diamond wire cutting equipment for preventing silicon wafer breakage according to claim 1, characterized in that, The arc surface of the threaded ring (610) is provided with a number of slots (611), and the number of slots (611) are evenly distributed on the threaded ring (610).

4. The diamond wire cutting equipment for preventing silicon wafer breakage according to claim 1, characterized in that, The slide rail (601) is internally fixedly connected to a limiting rod (612), and the limiting rod (612) is slidably connected to the slider (606).

5. The diamond wire cutting equipment for preventing silicon wafer breakage according to claim 1, characterized in that, Two positioning rods (604) are fixedly connected to the upper surface of the connecting plate (607), and the positioning rods (604) are slidably connected to the sliding plate (609).

6. The diamond wire cutting equipment for preventing silicon wafer breakage according to claim 1, characterized in that, The connecting plate (607) has a rectangular cross-section and is made of stainless steel.

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