Imaging element unit and imaging device

Abstract

The present invention provides an imaging element unit housed in an enclosure of an imaging device, the imaging element unit comprising: an imaging element that captures an image of a subject; at least two heat conduction members which conduct heat from the imaging element and which are connected to each other at a member-connecting part; and a reinforcement member that reinforces a connection between two heat conduction members at the member-connecting part.

Description

Image sensor unit and image pickup device

[0001] The technology of the present disclosure relates to an imaging element unit and an imaging device.

[0002] International Publication No. 2020 / 202811 describes an image stabilization device including a fixed body fixed inside an outer casing, a movable body having an image sensor and movable relative to the fixed body in a direction perpendicular to the optical axis direction, and a heat transfer sheet. The heat transfer sheet is a bendable sheet, with portions attached to the fixed body and the movable body, and which transfers heat generated in the movable body to the fixed body. The thickness direction of the heat transfer sheet is perpendicular to the optical axis direction.

[0003] One embodiment of the technique of the present disclosure provides an imaging element unit and an imaging device that can make it difficult for heat conduction members, through which heat from the imaging element is conducted, to come loose.

[0004] One embodiment of the technology of the present disclosure provides an imaging element unit and an imaging device that are heat-conducting members through which heat from an imaging element is conducted, and that can reduce the moving load of the heat-conducting member that deforms to follow the movement of the imaging element due to its vibration-damping function.

[0005] One embodiment of the technology of the present disclosure provides an imaging element unit and an imaging device that are capable of maintaining a good balance between the thermal conductivity and mobility of a thermally conductive member through which heat from an imaging element is conducted, the thermally conductive member deforming to be able to follow the movement of the imaging element due to its vibration-damping function.

[0006] One embodiment of the technology of the present disclosure provides an imaging element unit and an imaging device that are capable of further increasing the thermal conductivity of a thermal conduction member through which heat from an imaging element is conducted, the thermal conduction member being formed by stacking multiple thermal conduction layers containing a thermally conductive material.

[0007] One embodiment of the technique of the present disclosure provides an imaging element unit and an imaging device that can dissipate heat from an imaging element more efficiently.

[0008] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and includes an imaging element that captures an image of a subject, at least two heat conduction members through which heat from the imaging element is conducted and which are connected to each other at a member connection portion, and a reinforcing member that reinforces the connection between the two heat conduction members at the member connection portion.

[0009] It is preferable that the imaging device has an anti-shake function for moving the imaging element in the planar direction of the imaging surface, and one of the two heat conducting members is deformable so as to be able to follow the movement of the imaging element due to the anti-shake function.

[0010] The reinforcing member is preferably bonded to the two heat conducting members by an adhesive at the member connecting portion.

[0011] The reinforcing member preferably contains a heat-conductive material having a thermal conductivity of 500 W / m·K or more.

[0012] An imaging device according to the present disclosure includes a housing and any one of the imaging element units described above built into the housing.

[0013] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and includes an imaging element having an imaging surface that images a subject, an anti-shake function that moves the imaging element in the planar direction of the imaging surface, and a heat-conducting member through which heat from the imaging element is conducted, the heat-conducting member deforming so as to be able to follow the movement of the imaging element due to the anti-shake function, the heat-conducting member having an outer layer and at least one inner layer arranged inside the outer layer, each of the outer layer and the inner layer having a bending portion that allows deformation, the bending portion of the inner layer having a bending angle smaller than that of the bending portion of the outer layer.

[0014] The inner layer portion is preferably disposed in the space formed by the outer layer portion.

[0015] The bent portions of the outer layer portion and the bent portions of the inner layer portion preferably protrude outward.

[0016] An imaging device according to the present disclosure includes a housing and any one of the imaging element units described above built into the housing.

[0017] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and includes an imaging element having an imaging surface that images a subject, an anti-shake function that moves the imaging element in the planar direction of the imaging surface, and a heat-conducting member through which heat from the imaging element is conducted, the heat-conducting member deforming so as to be able to follow the movement of the imaging element due to the anti-shake function, the heat-conducting member having an outer layer and at least one inner layer arranged inside the outer layer, the outer layer having a structure with higher thermal conductivity than the inner layer, and the inner layer having a structure with higher mobility than the outer layer.

[0018] The inner layer portion is preferably disposed in the space formed by the outer layer portion.

[0019] The outer layer is preferably thicker than the inner layer.

[0020] The outer layer portion is preferably formed by laminating a plurality of thermally conductive layers containing a thermally conductive material.

[0021] The inner layer portion preferably has a thermally conductive layer containing a thermally conductive material, and the outer layer portion preferably has a greater number of laminated thermally conductive layers than the inner layer portion.

[0022] It is preferable that the density of the thermally conductive material in the outer layer portion is higher than that in the inner layer portion.

[0023] An imaging device according to the present disclosure includes a housing and any one of the imaging element units described above built into the housing.

[0024] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and comprises an imaging element that captures an image of a subject, and a heat conduction member through which heat from the imaging element is conducted, the heat conduction member being formed by stacking a plurality of heat conduction layers containing a heat conduction material, and two adjacent heat conduction layers among the plurality of heat conduction layers being connected by a connecting portion, and being stacked by being folded at the connecting portion.

[0025] Two adjacent thermally conductive layers are preferably bonded together with an adhesive.

[0026] It is preferable that the thermal conductive member has an anti-vibration function that moves the imaging element in the planar direction of the imaging surface, the thermal conductive member has a bent portion that deforms so as to follow the movement of the imaging element due to the anti-vibration function, and the connecting portion is provided in a non-bent portion other than the bent portion.

[0027] An imaging device according to the present disclosure includes a housing and any one of the imaging element units described above built into the housing.

[0028] The imaging element unit of the present disclosure is an imaging element unit built into the housing of an imaging device, and includes an imaging element having an imaging surface for imaging a subject, a movable member that holds the imaging element and moves the imaging element in the planar direction of the imaging surface, and an anti-vibration function realized by a fixed member that movably holds the movable member and is fixed in position within the housing, and a first heat conduction member that is connected to the movable member and the fixed member and conducts heat from the imaging element stored in the movable member to the fixed member, the first heat conduction member having a flexible portion that allows the movable member to move.

[0029] It is preferable that the image sensor is provided with a flexible substrate connected to the imaging element and having a flexible portion that allows the movable member to move, and that the first thermal conductive member is disposed within a space formed by the flexible portion of the flexible substrate.

[0030] The first thermally conductive member preferably has a shape that conforms to the flexible substrate.

[0031] The fixing member is preferably connected to the housing via a second thermally conductive member.

[0032] An imaging device according to the present disclosure includes a housing and any one of the imaging element units described above built into the housing.

[0033] 1 is a diagram showing a digital camera; FIG. 1 is an exploded front perspective view of an image sensor unit; FIG. 2 is an exploded rear perspective view of the image sensor unit; FIG. 3 is an exploded rear perspective view of a main part of the image sensor unit; FIG. 4 is a diagram showing the configuration of a heat conduction member; FIG. 5 is a perspective view of a heat conduction member; FIG. 6 is a plan view of a heat conduction member; FIG. 7 is a perspective view of a reinforcing member; FIG. 8 is a diagram showing the vicinity of a member connection part; FIG. 9 is a perspective view of a heat conduction member and a connection member; FIG. 10 is a simplified plan view of a heat conduction member; FIG. 11 is a diagram showing the heat conduction member before and after bending; FIG. 12 is a diagram showing the thickness of a bent part and a non-bent part; FIG. 13 is a diagram showing how a heat conduction member is deformed; FIG. 14 is a diagram showing how a heat conduction member is deformed; FIG. 15 is a diagram showing the heat conduction path of an image sensor; FIG. 16 is a diagram showing a heat conduction member of only an outer layer part; FIG. 17 is a diagram showing a heat conduction member with a triple structure; FIG. 18 is a diagram showing an octagonal heat conduction member; FIG. 19 is a diagram showing a heat conduction member in which the corners of the connection parts of the outer layer part and the inner layer part are recessed inward; FIG. 20 is a diagram showing an example in which a heat conduction member is connected to the central region of the back surface of a circuit board that does not have an opening; FIG. 21 is a diagram showing a heat conduction member of a second embodiment in which the bent part of the inner layer part has a smaller bent angle than the bent part of the outer layer part. 31 is a diagram showing a heat conduction member of a third embodiment, including an outer layer portion having a structure with higher thermal conductivity than the inner layer portion, and an inner layer portion having a structure with higher mobility than the outer layer portion. FIG. 23 is a diagram showing the vicinity of a bent portion of the heat conduction member shown in FIG. 23. FIG. 24 is a diagram showing a heat conduction member of a fourth embodiment, in which multiple heat conduction layers are laminated. FIG. 25 is a diagram showing the heat conduction member shown in FIG. 25 before bending. FIG. 25 is a diagram showing a procedure for bending the heat conduction member shown in FIG. 25. FIG. 25 is a diagram showing how heat is conducted when there are no connecting portions. FIG. 31 is a diagram showing how heat is conducted when there are connecting portions, and is a diagram for explaining the effect of the connecting portions. FIG. 32 is a diagram showing another example of a heat conduction member in which multiple heat conduction layers are laminated. FIG. 33 is a diagram showing an image sensor unit of a fifth embodiment. FIG. 34 is a cross-sectional view and a cross-sectional view of a main part of the image sensor unit taken along line A-A in FIG. 31. FIG. 35 is a diagram showing a heat conduction path of an image sensor in the fifth embodiment. FIG. 36 is a plan view showing a graphite sheet containing graphite with recesses formed in the bent portion. FIG. 37 is a perspective view showing a heat conduction member formed by bending a graphite sheet containing graphite with recesses formed in the bent portion. FIG. 1 is a plan view showing a graphite sheet including a resin film having convex portions formed at bent portions.1 is a perspective view showing a heat conductive member formed by bending a graphite sheet including a resin film having a convex portion formed at a bent portion; FIG. 2 is a diagram showing the thickness of a circuit board at a position facing a bent portion and the thickness of a circuit board at a position facing a non-bent portion; and FIG. 3 is a diagram showing a heat conductive member having a slit formed at a bent portion.

[0034] Hereinafter, an example of an embodiment of the technology of the present disclosure will be described with reference to the drawings.

[0035] [First embodiment] As an example, as shown in Fig. 1 , a digital camera 2 includes a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular imaging opening 12. An interchangeable imaging lens (not shown) is detachably attached to the lens mount 11. The digital camera 2 is an example of an "imaging device" according to the technology of the present disclosure. The camera body 10 is also an example of a "housing" according to the technology of the present disclosure.

[0036] The camera body 10 includes a built-in imaging element unit 15. The imaging element unit 15 includes a rectangular imaging element 16. The imaging element 16 is, for example, a complementary metal oxide semiconductor (CMOS) image sensor or a charge coupled device (CCD) image sensor. The imaging element 16 has a rectangular imaging surface 17 that captures an image of a subject. The imaging surface 17 receives subject light that represents the subject. As is well known, the imaging surface 17 includes a two-dimensional array of pixels that photoelectrically convert the received subject light and output an electrical signal. The entire imaging surface 17 is exposed to the outside through the imaging opening 12.

[0037] A CPU (Central Processing Unit) 18 is connected to the imaging element unit 15. The CPU 18 controls the operation of the imaging element unit 15. Although not shown, memories such as a ROM (Read Only Memory) and / or a RAM (Random Access Memory) are connected to the CPU 18 via a bus line. The CPU 18, memory, and bus line constitute a computer.

[0038] The image sensor unit 15 has an anti-shake function. The anti-shake function is a function for suppressing positional deviation caused by vibrations applied to the camera body 10, that is, relative positional deviation between the subject light incident on the imaging surface 17 and the digital camera 2. Vibrations applied to the camera body 10 include hand shake caused by the user holding the camera body 10 to photograph a subject.

[0039] Under the control of the CPU 18, the image sensor 16 is moved by the vibration-reduction function in a direction that cancels out the positional shift by an amount that cancels out the positional shift. More specifically, the vibration-reduction function moves the image sensor 16 in the X-axis direction, which is parallel to the edge 19 of the imaging surface 17 of the image sensor 16, and / or in the Y-axis direction, which is perpendicular to the edge 19 and parallel to the edge 20 that intersects the edge 19 at a 90° angle. The X-axis direction and the Y-axis direction are examples of the "surface direction" according to the technology of the present disclosure. Note that angle-related terms such as "perpendicular" and "90°" include not only the meanings of perfectly perpendicular and 90°, but also the meanings of approximately perpendicular and approximately 90°, which include tolerances in design and manufacturing, for example, an error of about ±10% of the design value. Furthermore, the term "parallel" includes not only the meaning of perfectly parallel, but also the meaning of approximately parallel, which includes tolerances in design and manufacturing, for example, an error of about ±10% of the design value. Hereinafter, the side of side 19 will be referred to as "bottom," and the side opposite side 19 in the Y-axis direction will be referred to as "top." Furthermore, the side of side 20 will be referred to as "left," and the side opposite side 20 in the X-axis direction will be referred to as "right."

[0040] Here, in this specification, "positional deviation" refers to a phenomenon that occurs when the optical axis OA fluctuates relative to the subject due to vibration. "Optical axis OA" refers to the optical axis of subject light that enters the imaging surface 17 through the imaging lens. Fluctuation of the optical axis OA means that the optical axis OA is tilted due to the positional deviation with respect to a reference axis (for example, the optical axis OA before the positional deviation occurs). Note that in this specification, "countering the positional deviation" not only means eliminating the positional deviation, but also includes the meaning of reducing the positional deviation.

[0041] 2 and 3, the image sensor unit 15 includes a fixed member 30, a movable member 31, and a yoke 32. The fixed member 30 is disposed on the rear side of the camera body 10, and the yoke 32 is disposed on the front side of the camera body 10. The fixed member 30 is fixed to the camera body 10. In other words, the fixed member 30 is fixed in a fixed position within the camera body 10. The fixed member 30 and the yoke 32 are also fixed with a gap in the Z-axis direction, which is perpendicular to the X-axis and Y-axis. The movable member 31 is disposed between the fixed member 30 and the yoke 32 via three balls 35, 36, and 37 of the same size. The balls 35 to 37 enable the movable member 31 to move in the X-axis direction and the Y-axis direction (rotate around the Z-axis) relative to the fixed member 30 and the yoke 32. The fixed member 30 and the movable member 31 provide the vibration isolation function described above. The Z-axis is parallel to the optical axis OA.

[0042] The fixed member 30 holds magnets 40, 41, and 42. Magnets 40 to 42 are attached to the front surface of the fixed member 30 facing the movable member 31. Each of the magnets 40 to 42 is a pair of a flat magnet with its north pole facing the movable member 31 and a flat magnet with its south pole facing the movable member 31. Magnet 40 is arranged in the center of the lower part of the fixed member 30 with its long side aligned along the X-axis direction. Magnets 41 and 42 are aligned along the Y-axis direction. Magnet 41 is arranged in the upper left corner of the fixed member 30 with its long side aligned along the Y-axis direction. Magnet 42 is arranged in the lower left corner of the fixed member 30 with its long side aligned along the Y-axis direction.

[0043] In addition to magnets 40 to 42, plates 45, 46, and 47 are attached to the front surface of fixed member 30. Plate 45 is located at the lower right corner of fixed member 30, above magnet 40. Plate 46 is located on the left side of fixed member 30, between magnets 41 and 42. Plate 47 is located at the upper right corner of fixed member 30. Plate 45 supports ball 35 so that it can roll, plate 46 supports ball 36 so that it can roll, and plate 47 supports ball 37 so that it can roll.

[0044] The fixed member 30 is formed with square-shaped restriction openings 50 and 51 that restrict the movement range of the movable member 31 in the XY plane. The restriction openings 50 and 51 have approximately the same size when viewed from the Z-axis direction. The restriction opening 50 is formed in the lower left corner of the fixed member 30, between the magnet 42 and the plate 45. The restriction opening 51 is formed in the upper right corner of the fixed member 30, immediately to the left of the plate 47. In other words, the restriction openings 50 and 51 are arranged in approximately diagonal positions on the fixed member 30.

[0045] The fixing member 30 is provided with female screws 55, 56, 57, and 58 via spacers. The female screw 55 is provided in the lower right corner of the fixing member 30. The female screw 56 is provided in the upper left corner of the fixing member 30. The female screw 57 is provided in the lower left corner of the fixing member 30. The female screw 58 is provided in the upper right corner of the fixing member 30.

[0046] A relatively large rectangular access opening 59 is formed in the center of the fixed member 30. The access opening 59 is provided to allow access to the rear surface of the movable member 31 from the rear surface of the fixed member 30.

[0047] The movable member 31 holds the imaging element 16, and also holds the coils 60, 61, and 62. The imaging element 16 is disposed in the center of the movable member 31. The coil 60 is disposed in the lower center of the movable member 31, facing the magnet 40 in the Z-axis direction. The coil 61 is disposed in the upper left corner of the movable member 31, facing the magnet 41 in the Z-axis direction. The coil 62 is disposed in the lower left corner of the movable member 31, facing the magnet 42 in the Z-axis direction. The coil 60 is disposed with its long side aligned along the X-axis direction. The coils 61 and 62 are aligned along the Y-axis direction. The coils 61 and 62 are each disposed with its long side aligned along the Y-axis direction.

[0048] A magnet 65 is held by the yoke 32. Furthermore, a magnetic body 66 is attached to the coil 61, and a magnetic body 67 is attached to the coil 62. The magnet 65 is, for example, a neodymium magnet. The magnetic bodies 66 and 67 are, for example, thin iron plates. The magnet 65 is arranged so as to cover the coil 60, increasing the driving force of the coil 60. The magnetic bodies 66 and 67 are arranged along the Y-axis direction. The magnetic body 66 is arranged on the upper end side of the coil 61, and the magnetic body 67 is arranged on the lower end side of the coil 62.

[0049] As described above, coil 60 is disposed in a position facing magnet 40 in the Z-axis direction, and magnet 65 is also disposed in a position facing magnet 40 in the Z-axis direction. Therefore, magnet 65 is attracted to magnet 40 while being fixed to yoke 32.

[0050] Similarly, since coil 61 is disposed in a position facing magnet 41 in the Z-axis direction as described above, magnetic body 66 is also disposed in a position facing magnet 41 in the Z-axis direction. Therefore, magnetic body 66 is attracted to magnet 41. Furthermore, since coil 62 is disposed in a position facing magnet 42 in the Z-axis direction as described above, magnetic body 67 is also disposed in a position facing magnet 42 in the Z-axis direction. Therefore, magnetic body 67 is attracted to magnet 42.

[0051] Recesses 70, 71, and 72 are formed on the back surface of the movable member 31 facing the fixed member 30. The recess 70 is located in the lower right corner of the movable member 31, facing the plate 45 in the Z-axis direction. The recess 71 is located between the coils 61 and 62 on the left side of the movable member 31, facing the plate 46 in the Z-axis direction. The recess 72 is located in the upper right corner of the movable member 31, facing the plate 47 in the Z-axis direction. The recess 70 accommodates the ball 35 in a rollable manner, the recess 71 accommodates the ball 36 in a rollable manner, and the recess 72 accommodates the ball 37 in a rollable manner. The size of the recesses 70 to 72 when viewed in the Z-axis direction is slightly larger than the diameter of the balls 35 to 37. The depth of the recesses 70 to 72 in the Z-axis direction is slightly smaller than the diameter of the balls 35 to 37.

[0052] A cylindrical protrusion 80 protruding toward the fixed member 30 is provided on the rear surface of the movable member 31 at a position opposing the restricting opening 50 in the Z-axis direction. Furthermore, a cylindrical protrusion 81 protruding toward the fixed member 30 is provided on the rear surface of the movable member 31 at a position opposing the restricting opening 51 in the Z-axis direction. The protrusion 80 is inserted into the restricting opening 50. Furthermore, the protrusion 81 is inserted into the restricting opening 51. Therefore, the protrusions 80 and 81 act as restricting pins that restrict movement of the movable member 31 in the XY plane.

[0053] The yoke 32 is made of a magnetic material such as a thin iron plate and is roughly C-shaped. The yoke 32 forms a magnetic circuit between the magnets 40 to 42 and increases the magnetic flux received by the coils 60 to 62.

[0054] Male screws 85, 86, 87, and 88 are attached to the yoke 32. The male screws 85 to 88 are fastened to the female screws 55 to 58 of the fixed member 30. This fixes the fixed member 30 and the yoke 32, and the movable member 31 is movably held between the fixed member 30 and the yoke 32.

[0055] The imaging element unit 15 includes a pair of voice coil motors (VCMs). The pair of VCMs is a first VCM and a second VCM. The first VCM includes a pair of a magnet 40 and a coil 60, and a yoke 32, and generates power to move the movable member 31 in the Y-axis direction. On the other hand, the second VCM includes a pair of a magnet 41 and a coil 61, a pair of a magnet 42 and a coil 62, and a yoke 32, and generates power to move the movable member 31 in the X-axis direction. More specifically, the first VCM generates power to move the movable member 31 in the Y-axis direction by the magnetic force of the magnet 40 and a current flowing through the coil 60. On the other hand, the second VCM generates power to move the movable member 31 in the X-axis direction by the magnetic force of the magnet 41 and a current flowing through the coil 61, and by the magnetic force of the magnet 42 and a current flowing through the coil 62.

[0056] As also shown in FIG. 4 , a rectangular circuit board 90 having approximately the same size as the imaging element 16 is attached to the back surface 89 of the imaging element 16, which faces the imaging surface 17. The circuit board 90 is formed of a resin such as epoxy. A rectangular opening 91 is formed in the circuit board 90. The opening 91 is formed in the center of the circuit board 90 and exposes a central region 92 on the back surface 89 of the imaging element 16. The central region 92 is an area of ​​a predetermined size that is centered on a center point C on the back surface 89 of the imaging element 16 and surrounds the center point C. Identification information 99 of the imaging element 16 is written in the central region 92. The opening 91 is formed to allow the identification information 99 to be visually recognized. The identification information 99 is, for example, a management number and / or a two-dimensional barcode for accessing an internet page containing the management information.

[0057] Electric circuits such as a control circuit, a drive circuit, and a power supply circuit for the image sensor 16 are mounted on the circuit board 90. Connectors 94 and 95 are provided at the lower end of the rear surface 93 of the circuit board 90. In addition, a connector 96 is provided at the left end of the rear surface 93 of the circuit board 90.

[0058] One end of a flexible substrate 97 (see FIGS. 2 and 3 ) is connected to the connectors 94 and 95. The other end of the flexible substrate 97 is drawn out to the rear surface of the fixed member 30 through the access opening 59. The other end of the flexible substrate 97 is connected to the CPU 18, a power supply circuit (not shown) that supplies power from a battery, and the like. One end of a flexible substrate 98 (see FIG. 1 ) is connected to the connector 96. The other end of the flexible substrate 98 wraps around to the front of the movable member 31 and is connected to the image sensor 16. In summary, the other end of the flexible substrate 98 is connected to the image sensor 16, and one end of the flexible substrate 98 is connected to the connector 96. One end of the flexible substrate 97 is connected to the connectors 94 and 95, and the CPU 18 and the like are connected to the other end of the flexible substrate 97. Therefore, the image pickup element 16 , the circuit board 90 , the CPU 18 , etc. are connected via the flexible board 98 , the connector 96 , the connector 94 , the connector 95 , and the flexible board 97 .

[0059] The image sensor unit 15 further includes a heat conduction member 100A1, a heat conduction member 100B, and a heat conduction member 100C to which heat (driving heat) from the image sensor 16 is conducted, and a reinforcing member 101.

[0060] Heat conduction member 100B and heat conduction member 100C are connected to heat conduction member 100A1. Heat is conducted from heat conduction member 100B to heat conduction member 100A1. Heat conduction member 100A1 also conducts heat to heat conduction member 100C. Heat conduction member 100B is connected to a central region 92 of a back surface 89 of image sensor 16 exposed by opening 91. Heat is conducted from central region 92 to heat conduction member 100B.

[0061] Heat conduction members 100A1 and 100B are fixed together with an adhesive. A female screw 68 (see FIG. 3) is formed in fixing member 30. An insertion hole 103 is formed in heat conduction member 100A1. A male screw 104 is attached to heat conduction member 100C. Male screw 104 is passed through insertion hole 103 in heat conduction member 100A1 and fastened to female screw 68 of fixing member 30. In this way, heat conduction members 100A1 and 100C are fixed together.

[0062] As an example, as shown in FIG. 5 , thermal conduction member 100A1 is formed of graphite sheet 105. This allows thermal conduction member 100A1 to have appropriate elasticity. Graphite sheet 105 is configured by pouching graphite 106 in a resin film 107, such as a PET (Polyethylene Terephthalate) film, that is wider than graphite 106. The thickness of graphite 106 is, for example, 70 μm, and the thickness of resin film 107 is, for example, 5 μm. Graphite sheet 105 is an example of a "thermal conduction layer" according to the technology of the present disclosure. Graphite 106 is an example of a "thermal conduction material" according to the technology of the present disclosure.

[0063] Heat conduction members 100B and 100C are metal plates, such as copper plates, and therefore have higher rigidity than heat conduction member 100A1, which is made of graphite sheet 105. In other words, heat conduction member 100A1 has higher elasticity than heat conduction members 100B and 100C.

[0064] 6 and 7 , the thermal conduction member 100A1 has a double structure including an outer layer portion 110 and an inner layer portion 111. The inner layer portion 111 is connected to the outer layer portion 110 via a connecting portion 112 (see also FIGS. 11 and 12 ) and is disposed inside the outer layer portion 110. More specifically, the inner layer portion 111 is disposed in a space surrounded by the outer layer portion 110. An attachment portion 113 having an insertion hole 103 formed therein is provided at the top of the outer layer portion 110.

[0065] The outer layer portion 110 and the inner layer portion 111 are both hexagonal in shape when viewed in the Z-axis direction. The outer layer portion 110 is composed of a first sheet portion 115, a second sheet portion 116 that has the same length as the first sheet portion 115 and faces the first sheet portion 115, and a pair of V-shaped connecting portions 117 that connect the first sheet portion 115 and the second sheet portion 116. Similarly, the inner layer portion 111 is composed of a first sheet portion 118, a second sheet portion 119 that has the same length as the first sheet portion 118 and faces the first sheet portion 118, and a pair of V-shaped connecting portions 120 that connect the first sheet portion 118 and the second sheet portion 119. The first sheet portion 115 and the second sheet portion 116, as well as the first sheet portion 118 and the second sheet portion 119, are planar.

[0066] The thermal conduction member 100B has a first piece 125 and a second piece 126. The first piece 125 is parallel to the imaging surface 17 and the back surface 89 of the imaging element 16 and faces the back surface 89 of the imaging element 16. The first piece 125 is connected to a central region 92 of the back surface 89. The second piece 126 is bent 90° from the first piece 125 and extends in a normal direction to the imaging surface 17 and the back surface 89 of the imaging element 16. The normal direction to the imaging surface 17 and the back surface 89 of the imaging element 16 is the Z-axis direction (the direction of the optical axis OA). The second piece 126 has approximately the same size as the space between the first sheet portion 115 of the outer layer portion 110 and the first sheet portion 118 of the inner layer portion 111.

[0067] At member connection portion 130 where thermal conduction member 100A1 and thermal conduction member 100B are connected, thermal conduction member 100B is connected to thermal conduction member 100A1 through second piece 126. More specifically, second piece 126 is inserted into the space between first sheet portion 115 of outer layer portion 110 and first sheet portion 118 of inner layer portion 111, and is held sandwiched between first sheet portion 115 and first sheet portion 118. Double-sided adhesive tape is affixed to the portions of first sheet portion 115 and first sheet portion 118 where second piece 126 contacts. The adhesive of this double-sided adhesive tape secures first sheet portion 115, first sheet portion 118, and second piece 126, and thereby thermal conduction member 100A1 and thermal conduction member 100B. The member connection portion 130 is the portion where the second piece 126 of the heat conduction member 100B is inserted into the space between the first sheet portion 115 of the outer layer portion 110 of the heat conduction member 100A1 and the first sheet portion 118 of the inner layer portion 111, and is held in a sandwiched state between the first sheet portion 115 and the first sheet portion 118.

[0068] The heat conduction member 100C has a first piece 127 and a second piece 128. Like the first piece 125 of the heat conduction member 100B, the first piece 127 is parallel to the imaging surface 17 and back surface 89 of the image sensor 16 and has a wing shape that is long in the X-axis direction. Like the second piece 126 of the heat conduction member 100B, the second piece 128 is bent 90 degrees from the first piece 127 and extends in the normal direction to the imaging surface 17 and back surface 89 of the image sensor 16.

[0069] The thermal conduction members 100A1 and 100C are connected to each other at a member connection portion 131. The member connection portion 131 is a portion where the second piece 128 of the thermal conduction member 100C is inserted into the space between the second sheet portion 116 of the outer layer portion 110 and the second sheet portion 119 of the inner layer portion 111 of the thermal conduction member 100A1, and is held in a sandwiched state between the second sheet portion 116 and the second sheet portion 119. The second piece 128 is provided with a claw 129 that is hooked onto the edge of the second sheet portion 119. The claw 129 positions the second sheet portion 119.

[0070] 8 , the reinforcing member 101 has a first piece 135 and a second piece 136. Similar to the first piece 127 of the thermal conduction member 100C, the first piece 135 is parallel to the imaging surface 17 and back surface 89 of the imaging element 16 and has a wing shape that is long in the X-axis direction. An insertion hole 137 through which the male screw 104 is inserted is formed in the first piece 135. Similar to the second piece 128 of the thermal conduction member 100C, the second piece 136 is bent 90 degrees from the first piece 135 and extends in the normal direction to the imaging surface 17 and back surface 89 of the imaging element 16.

[0071] The reinforcing member 101 is made of the same graphite sheet 105 as the thermally conductive member 100A1. This allows the reinforcing member 101 to have appropriate elasticity. The thermally conductive material contained in the reinforcing member 101, here graphite 106, has a thermal conductivity of 500 W / m·K or more, and more preferably 1000 W / m·K or more. The thermally conductive material contained in the reinforcing member 101, here graphite 106, has a thermal conductivity of 5000 W / m·K or less. The thermal conductivity can be measured using a Thermowave Analyzer TA manufactured by Bethel Corporation or the like.

[0072] Reinforcing member 101 has adhesive properties. More specifically, reinforcing member 101 is a single-sided adhesive sticker having an adhesive layer on the surface that faces second sheet portion 119 of thermal conductive member 100A1 and first piece 127 of thermal conductive member 100C and is visible in FIG.

[0073] As an example, as shown in FIG. 9 , double-sided adhesive tape 140 is attached to the second sheet portion 119 of the inner layer portion 111 of the thermal conduction member 100A1 and the second piece 128 of the thermal conduction member 100C at the member connection portion 131. More specifically, the second sheet portion 119 is divided into two at the center, and the double-sided adhesive tape 140 is attached to each of the two divided second sheet portions 119. The adhesive of the double-sided adhesive tape 140 fixes the second sheet portion 119 and the second piece 128, and thus the thermal conduction member 100A1 and the thermal conduction member 100C. Note that, although the reinforcing member 101 is provided only at the member connection portion 131, this is not limiting. The reinforcing member 101 may be provided at the member connection portion 130 instead of or in addition to the member connection portion 131.

[0074] First piece 135 of reinforcing member 101 is adhered to first piece 127 of thermal conduction member 100C (see also FIG. 7 ). Second piece 136 of reinforcing member 101 is adhered to surface 119A of second sheet portion 119 of thermal conduction member 100A1 (see also FIG. 7 ). First piece 135 is large enough to cover the lower half of first piece 127 of thermal conduction member 100C. Second piece 136 is large enough to cover the entire second sheet portion 119. Surface 119A of second sheet portion 119 to which second piece 136 is adhered is the surface opposite to the adhesive surface between thermal conduction member 100A1 and thermal conduction member 100C by double-sided adhesive tape 140. In this manner, first piece 135 and second piece 136 are adhered to first piece 127 and second sheet portion 119, respectively, so that reinforcing member 101 reinforces the connection between heat conduction member 100A1 and heat conduction member 100C at member connection portion 131. That is, heat conduction member 100A1 and heat conduction member 100C are an example of "two heat conduction members" according to the technology of the present disclosure. Also, heat conduction member 100A1 is an example of "one of the two heat conduction members" according to the technology of the present disclosure.

[0075] The thickness of heat conduction member 100B is greater than the thickness of heat conduction member 100A1. Heat conduction member 100A1 is, for example, 80 μm thick, and heat conduction member 100B is, for example, 1 mm thick. Heat conduction member 100C is also greater than the thickness of heat conduction member 100A1, for example, 1 mm thick.

[0076] As an example, as shown in Figure 10, a heat conduction member 100D is attached to a heat conduction member 100C with adhesive. Like the heat conduction members 100A1 and the like, the heat conduction member 100D is formed of a graphite sheet 105. This allows the heat conduction member 100D to have an appropriate degree of elasticity. The thickness of the heat conduction member 100D is greater than the thickness of the heat conduction member 100A1. The thickness of the heat conduction member 100D is, for example, 500 µm.

[0077] A connecting member 145 is further attached to heat conduction member 100D with an adhesive. Like heat conduction members 100B and 100C, connecting member 145 is a metal plate, such as a copper plate. Connecting member 145 is connected to a top plate 146 of camera body 10. Top plate 146 of camera body 10 is, for example, a magnesium plate or an aluminum plate.

[0078] 11 , as an example, the outer layer portion 110 of the thermal conduction member 100A1 has a hexagonal shape when viewed from the Z-axis direction, as described above, and therefore has six corners: 150, 151, 152, 153, 154, and 155. The inner layer portion 111 also has a hexagonal shape when viewed from the Z-axis direction, and therefore has six corners: 156, 157, 158, 159, 160, and 161. Corners 150 to 155 and corners 156 to 161 function as bending portions that enable deformation in response to the movement of the image sensor 16 due to the vibration isolation function. Hereinafter, corners 150 to 161 may be referred to as bending portions 150 to 161.

[0079] Bent portions 150 to 155 of outer layer portion 110 protrude outward. Similarly, bent portions 156 to 161 of inner layer portion 111 also protrude outward. In other words, heat conduction member 100A1 has a pantograph-like shape. Note that in FIG. 11, the heat conduction member 100A1 is simplified by, for example, omitting the illustration of mounting portion 113. The same applies to FIGS. 14 and 15.

[0080] 12, as an example, heat conduction member 100A1 is formed by folding the dashed line portion of a single sheet-like material 170. Specifically, first, the portion of connection portion 112 is folded 180 degrees so that the portion that will become outer layer portion 110 faces the portion that will become inner layer portion 111. Next, the portions of bent portions 156 to 161 are folded to form inner layer portion 111, and then the portions of bent portions 150 to 155 are folded to form outer layer portion 110. Finally, the portion that will become mounting portion 113 is folded to complete heat conduction member 100A1.

[0081] Thermal conduction member 100A1 has reinforcing graphite sheet 171. Like graphite sheet 105, reinforcing graphite sheet 171 is made of graphite and a resin film. Reinforcing graphite sheet 171 is provided on two sides that constitute connecting portion 117 and connecting portion 120, but is not provided on bent portions 154, 155, 160, and 161. That is, the two sides that constitute connecting portion 117 and connecting portion 120 are configured by stacking graphite sheet 105 and reinforcing graphite sheet 171. On the other hand, bent portions 154, 155, 160, and 161 are configured by only one graphite sheet 105. Therefore, the two sides that constitute connecting portion 117 and connecting portion 120 have a greater number of stacked graphite sheets than bent portions 154, 155, 160, and 161.

[0082] For this reason, as shown in FIG. 13 as an example, the thickness T UB of the two sides constituting connection portions 117 and 120 is thicker than the thickness T HB of bent portions 154, 155, 160, and 161 due to the reinforcing graphite sheet 171 (THB<THUB). In other words, bent portions 154, 155, 160, and 161 are thinner than the other two sides constituting connection portions 117 and 120. Reinforcing graphite sheet 171 and graphite sheet 105 of connection portions 117 and 120 are examples of "thermal conduction layers" according to the technology of the present disclosure. Furthermore, the two sides constituting connection portions 117 and 120 are examples of "non-bent portions" according to the technology of the present disclosure. Note that in FIG. 13, connection portion 117 and bent portion 154 are depicted as representatives.

[0083] 14 and 15, the heat conduction member 100A1 deforms to follow the movement of the image sensor 16 due to the vibration isolation function. Fig. 14 shows how the heat conduction member 100A1 deforms by expanding and contracting in the vertical direction in response to the movement of the image sensor 16 along the Y axis due to the vibration isolation function. Fig. 15 shows how the heat conduction member 100A1 deforms by tilting in the horizontal direction in response to the movement of the image sensor 16 along the X axis due to the vibration isolation function.

[0084] Next, the operation of the above configuration will be described. When the digital camera 2 is used to capture video at 120 frames per second (4K / 120p) with a resolution equivalent to 4K, for example, and the image sensor 16 is subjected to a relatively large load, heat that cannot be ignored is generated in the image sensor 16.

[0085] In the image sensor unit 15 of this embodiment, the heat of the image sensor 16 follows a conduction path as shown in Fig. 16, for example. That is, the heat of the image sensor 16 is first conducted from the rear surface 89 of the image sensor 16 to the heat conduction member 100B connected to the central region 92 of the rear surface 89. Next, the heat is conducted from the heat conduction member 100B to the heat conduction member 100A1 connected through the second piece 126 of the heat conduction member 100B.

[0086] The heat conducted to thermal conduction member 100A1 is conducted to thermal conduction member 100C connected via second piece 128. The heat is further conducted from thermal conduction member 100C to thermal conduction member 100D, and from thermal conduction member 100D to connecting member 145. The heat is then conducted via connecting member 145 to top plate 146 of camera body 10, and is dissipated to the outside via top plate 146.

[0087] In the image sensor unit 15, the movable member 31 is movable relative to the fixed member 30 and the yoke 32. The movable member 31 holds the image sensor 16. Therefore, the image sensor 16 moves in conjunction with the movement of the movable member 31. If a positional shift of the subject light incident on the imaging surface 17 occurs due to a user's hand shake or the like, the movable member 31, and therefore the image sensor 16, is moved under the control of the CPU 18 in a direction that cancels out the positional shift and by an amount that cancels out the positional shift. In response to the movement of the image sensor 16 due to this vibration isolation function, the heat conduction member 100A1 is deformed as shown in FIGS. 14 and 15 .

[0088] As described above, the image sensor unit 15 includes the image sensor 16 that captures an image of a subject, the heat conduction member 100A1 and the heat conduction member 100C that conduct heat from the image sensor 16 and are connected to each other at the member connection portion 131, and the reinforcing member 101. The reinforcing member 101 reinforces the connection between the heat conduction member 100A1 and the heat conduction member 100C at the member connection portion 131. This makes it possible to make the connection between the heat conduction member 100A1 and the heat conduction member 100C less likely to come loose. As described above, the reinforcing member 101 may be provided at the member connection portion 130, and the connection between the heat conduction member 100A1 and the heat conduction member 100B may be reinforced by the reinforcing member 101.

[0089] The thermal conduction member 100A1 and the thermal conduction member 100C are bonded together using double-sided adhesive tape 140, which is attached to the second sheet portion 119 of the inner layer portion 111 of the thermal conduction member 100A1 and the second piece 128 of the thermal conduction member 100C. However, increasing the adhesive strength of the double-sided adhesive tape 140 would correspondingly decrease the thermal conductivity from the thermal conduction member 100A1 to the thermal conduction member 100C, so the adhesive strength of the double-sided adhesive tape 140 cannot be increased significantly. Therefore, the adhesive strength of the double-sided adhesive tape 140 alone could potentially cause the thermal conduction member 100A1 and the thermal conduction member 100C to become disconnected. Therefore, by using a reinforcing member 101 to reinforce the connection between the thermal conduction member 100A1 and the thermal conduction member 100C, the connection between the thermal conduction member 100A1 and the thermal conduction member 100C becomes less likely to become disconnected.

[0090] A reinforcing member may be provided to reinforce the connection between the first sheet portions 115 and 118 of the thermal conduction member 100A1 and the second piece 126 of the thermal conduction member 100B. In this case, the thermal conduction member 100A1 and the thermal conduction member 100B are an example of the "two thermal conduction members" according to the technology of the present disclosure. However, the second sheet portion 119 is divided into two. Therefore, the connection between the second sheet portion 119 and the second piece 128 of the thermal conduction member 100C is weaker than the connection between the undivided first sheet portions 115 and 118 and the second piece 126 of the thermal conduction member 100B. Therefore, there is a strong need to reinforce the connection between the thermal conduction member 100A1 and the thermal conduction member 100C with the reinforcing member 101, as in this example.

[0091] The imaging element unit 15 has an anti-vibration function that moves the imaging element 16 in the planar direction of the imaging surface 17. As shown in FIGS. 14 and 15 , the heat conduction member 100A1 deforms to follow the movement of the imaging element 16 due to the anti-vibration function. The deformation of the heat conduction member 100A1 makes it easier for the heat conduction member 100A1 and the heat conduction member 100C to become disconnected from each other. This further enhances the effect of making it more difficult for the heat conduction member 100A1 and the heat conduction member 100C to become disconnected from each other.

[0092] Reinforcing member 101 is bonded to heat conduction member 100A1 and heat conduction member 100C with an adhesive at member connection portion 131. Reinforcing member 101 can further strengthen the reinforcement of the connection between heat conduction member 100A1 and heat conduction member 100C.

[0093] The reinforcing member 101 contains a thermally conductive material with a thermal conductivity of 500 W / m·K or more. Therefore, the reinforcing member 101 can not only reinforce the connection between the thermally conductive member 100A1 and the thermally conductive member 100C, but also conduct heat from the image sensor 16.

[0094] The inner layer portion 111 is disposed in the space formed by the outer layer portion 110. Therefore, the space formed by the outer layer portion 110 can be effectively utilized as a location for arranging the inner layer portion 111.

[0095] 12 and 13 , bent portions 154, 155, 160, and 161 have structures different from those of the two sides constituting connecting portions 117 and 120, which are non-bent portions. Specifically, bent portions 154, 155, 160, and 161 each have a single graphite sheet 105 containing graphite 106. Furthermore, the two sides constituting connecting portions 117 and 120, which are non-bent portions, have a greater number of graphite sheet layers than bent portions 154, 155, 160, and 161 due to reinforcing graphite sheet 171. Furthermore, bent portions 154, 155, 160, and 161 are thinner than the two sides constituting connecting portions 117 and 120, which are non-bent portions. This allows thermal conduction member 100A1 to have an appropriate structure. Specifically, the bending resistance of bent portions 154, 155, 160, and 161 can be reduced. Thermal conduction member 100A1 can smoothly deform in response to the movement of image sensor 16 due to its vibration-damping function. In other words, the moving load of thermal conduction member 100A1 can be reduced. Furthermore, reinforcing graphite sheet 171 can prevent unintended deformation of the two sides that make up connecting portion 117 and connecting portion 120. Note that reinforcing graphite sheet 171 may be provided on first sheet portion 115 and first sheet portion 118, and second sheet portion 116 and second sheet portion 119, in addition to the two sides that make up connecting portion 117 and connecting portion 120.

[0096] On the two sides constituting connecting portion 117 and connecting portion 120, a plurality of graphite pieces 106 may be stacked and then the plurality of graphite pieces 106 may be collectively pouched in resin film 107, so that the two sides constituting connecting portion 117 and connecting portion 120 may be thicker than bent portions 154, 155, 160, and 161. In this case, graphite piece 106 is an example of a "thermal conduction layer" according to the technology of the present disclosure.

[0097] Although the heat conduction member 100A1 has been illustrated as having a double structure including an outer layer portion 110 and an inner layer portion 111, this is not limitative. As an example, as shown in FIG. 17 , a heat conduction member 100A2 may have only one outer layer portion 175. The number of inner layer portions 111 is also not limited to one. As an example, a heat conduction member 100A3 shown in FIG. 18 may have a triple structure including one outer layer portion 180 and two inner layer portions 181 and 182 arranged inside the outer layer portion 180 (the space surrounded by the outer layer portion 180).

[0098] Furthermore, the shape of the heat conduction member when viewed in the Z-axis direction is not limited to a hexagon. For example, as shown in FIG. 19 , the shape of the outer layer portion 185 and the inner layer portion 186 when viewed in the Z-axis direction may be octagonal, as in the heat conduction member 100A4. Furthermore, as shown in FIG. 20 , the heat conduction member 100A5 may have corners 194 and 195 of the connecting portion 192 of the outer layer portion 190 and corners 196 and 197 of the connecting portion 193 of the inner layer portion 191 recessed inward. The corners 194 to 197 function as bent portions. The heat conduction member 100A5 has a shape that resembles a "Σ" combined with its mirror image. However, as in the heat conduction member 100A1 of the first embodiment, having bent portions 154, 155, 160, and 161 protruding outward is preferable because it allows for a larger space to be surrounded by the outer layer portion 110, making it easier to form the inner layer portion 111.

[0099] In the first embodiment described above, an example was shown in which an opening 91 exposing a central region 92 of a rear surface 89 of the imaging element 16 is formed in the circuit board 90 and the first piece 125 of the thermally conductive member 100B is connected to the central region 92 through the opening 91. However, this is not limiting. For example, as shown in Fig. 21 , the thermally conductive member 100B may be connected to a central region 202 of a rear surface 201 of a circuit board 200 that does not have an opening 91.

[0100] Although not shown, a circuit board that does not have an opening 91 and the thermally conductive member 100B may be connected via a thermally conductive gel or the like.

[0101] 22 , a heat conduction member 100A6 according to a second embodiment includes an outer layer portion 205 and an inner layer portion 206 disposed inside the outer layer portion 205 (i.e., the space surrounded by the outer layer portion 205). The outer layer portion 205 and the inner layer portion 206 are both hexagonal in shape when viewed in the Z-axis direction. The outer layer portion 205 and the inner layer portion 206 are connected via a connecting portion 207. The outer layer portion 205 includes a first sheet portion 208, a second sheet portion 209 having the same length as the first sheet portion 208 and facing the first sheet portion 208, and a pair of V-shaped connecting portions 210 connecting the first sheet portion 208 and the second sheet portion 209. Similarly, the inner layer portion 206 is composed of a first sheet portion 211, a second sheet portion 212 having the same length as the first sheet portion 211 and facing the first sheet portion 211, and a pair of V-shaped connecting portions 213 connecting the first sheet portion 211 and the second sheet portion 212.

[0102] The connecting portion 210 has a bent portion 214, and the connecting portion 213 has a bent portion 215. The bent portion 214 is a corner of two sides that make up the connecting portion 210, and the bent portion 215 is a corner of two sides that make up the connecting portion 213. Both the bent portion 214 and the bent portion 215 protrude outward. When the image stabilization function is not working and the image sensor 16 is in the home position, the bending angle θ1 of the bent portion 214 is larger than the bending angle θ2 of the bent portion 215 (θ1 > θ2).

[0103] Therefore, compared to when the bending angle θ2 is equal to or greater than the bending angle θ1, the inner layer portion 206 can achieve a greater amount of expansion and contraction in the vertical direction with a smaller change in the bending portion 215. As a result, the moving load of the thermal conduction member 100A6 can be reduced. Furthermore, because the bending portions 214 and 215 protrude outward, a larger space can be enclosed by the outer layer portion 205, allowing the bending angle θ2 of the bending portion 215 to be smaller. Note that the bending portions 214 and 215 may be recessed inward, as in the thermal conduction member 100A5 shown in FIG. 20 . However, in this case, the bending angle θ2 of the bending portion 215 cannot be made too small, so it is still preferable for the bending portions 214 and 215 to protrude outward.

[0104] 23 , a heat conduction member 100A7 according to a third embodiment includes an outer layer portion 220 and an inner layer portion 221 disposed inside the outer layer portion 220 (i.e., the space surrounded by the outer layer portion 220). The outer layer portion 220 and the inner layer portion 221 are both hexagonal when viewed in the Z-axis direction. Unlike the heat conduction member 100A1 of the first embodiment, the outer layer portion 220 and the inner layer portion 221 are not formed from a single sheet-like material 170, but are formed separately. Therefore, the outer layer portion 220 and the inner layer portion 221 are not connected via a connecting portion, as is the case with the heat conduction member 100A1 of the first embodiment.

[0105] The outer layer portion 220 is composed of a first sheet portion 222, a second sheet portion 223 that has the same length as the first sheet portion 222 and faces the first sheet portion 222, and a pair of V-shaped connecting portions 224 that connect the first sheet portion 222 and the second sheet portion 223. Similarly, the inner layer portion 221 is composed of a first sheet portion 225, a second sheet portion 226 that has the same length as the first sheet portion 225 and faces the first sheet portion 225, and a pair of V-shaped connecting portions 227 that connect the first sheet portion 225 and the second sheet portion 226.

[0106] The connecting portion 224 has a bent portion 228, and the connecting portion 227 has a bent portion 229. The bent portion 228 is a corner of two sides that make up the connecting portion 224, and the bent portion 229 is a corner of two sides that make up the connecting portion 227. Both the bent portion 228 and the bent portion 229 protrude outward.

[0107] The thickness THO of the outer layer portion 220 is greater than the thickness THI of the inner layer portion 221 (THO>THI). The outer layer portion 220 is formed by laminating four graphite sheets 232O each composed of graphite 230O and a resin film 231O. On the other hand, the inner layer portion 221 is formed by laminating two graphite sheets 232I each composed of graphite 230I and a resin film 231I.

[0108] Graphite 230O is thinner than graphite 230I. Generally, the thinner the thickness of graphite, the higher the density. Therefore, the density ρO of graphite 230O is higher than the density ρI of graphite 230I (ρO > ρI). Densities ρO and ρI are determined, for example, by measuring the thickness and weight of 50 cm x 50 cm pieces of graphite 230O and graphite 230I, and dividing the weight by the volume of the piece. Therefore, the unit of densities ρO and ρI is g / cm ３ Graphite 230O and 230I are an example of a "thermal conductive material" according to the technology of the present disclosure. Graphite sheets 232O and 232I are an example of a "thermal conductive layer" according to the technology of the present disclosure. Note that, hereinafter, graphite sheets 232O and 232I may be collectively referred to as graphite sheet 232.

[0109] 24 , four graphite sheets 232O constituting outer layer portion 220 are not bonded at bent portion 228, but are bonded with double-sided adhesive tape 235 at two sides constituting connecting portion 224. The two sides constituting connecting portion 224 are an example of a "non-bent portion" according to the technology of the present disclosure. Although not shown, two graphite sheets 232I constituting inner layer portion 221 are also not bonded at bent portion 229, but are bonded at two sides constituting connecting portion 227.

[0110] As described above, in the third embodiment, the outer layer portion 220 has a structure that is more thermally conductive than the inner layer portion 221, and the inner layer portion 221 has a structure that is more mobile than the outer layer portion 220. This makes it possible to maintain a good balance between the thermal conductivity and the mobility of the heat conduction member 100A7.

[0111] The outer layer portion 220 is thicker than the inner layer portion 221. Therefore, the heat conduction efficiency of the outer layer portion 220 can be more easily increased than that of the inner layer portion 221. Furthermore, the resistance of the bent portion 229 of the inner layer portion 221 when bent can be more easily reduced than the resistance of the bent portion 228 of the outer layer portion 220 when bent.

[0112] Outer layer portion 220 is formed by laminating a plurality of graphite sheets 232O containing graphite 230O. In addition, inner layer portion 221 has graphite sheet 232I containing graphite 230I. Outer layer portion 220 includes four graphite sheets 232O, while inner layer portion 221 includes two graphite sheets 232I, meaning that outer layer portion 220 has a greater number of laminated layers than inner layer portion 221. Therefore, the thermal conduction efficiency of outer layer portion 220 can be more easily increased than that of inner layer portion 221. In addition, the resistance of bent portion 229 of inner layer portion 221 when bent can be more easily reduced than the resistance of bent portion 228 of outer layer portion 220 when bent.

[0113] Graphite 230O contained in graphite sheet 232O constituting outer layer portion 220 has a higher density than graphite 230I contained in graphite sheet 232I constituting inner layer portion 221. Therefore, the thermal conduction efficiency of outer layer portion 220 can be more easily increased than that of inner layer portion 221. Furthermore, the resistance of bent portion 229 of inner layer portion 221 when bent can be more easily reduced than the resistance of bent portion 228 of outer layer portion 220 when bent.

[0114] Graphite sheet 232 is not bonded at bent portions 228 and 229, but is bonded at two sides constituting connecting portion 224, which is a non-bent portion, and two sides constituting connecting portion 227. This reduces resistance when bending bent portions 228 and 229. Note that in addition to bent portions 228 and 229, other bent portions, such as the bent portion at the corner between first sheet portion 222 and connecting portion 224 and the bent portion at the corner between second sheet portion 226 and connecting portion 227, may also be configured not to be bonded.

[0115] A plurality of graphite pieces 230O may be stacked, and then the plurality of graphite pieces 230O may be collectively pouched in resin film 231O. Similarly, a plurality of graphite pieces 230I may be stacked, and then the plurality of graphite pieces 230I may be collectively pouched in resin film 231I. In these cases, graphite pieces 230O and 230I are examples of the "thermal conduction layer" according to the technology of the present disclosure.

[0116] 25 , a heat conduction member 100A8 according to a fourth embodiment includes an outer layer portion 240 and an inner layer portion 241 disposed inside the outer layer portion 240 (i.e., in the space surrounded by the outer layer portion 240). Both the outer layer portion 240 and the inner layer portion 241 have a hexagonal shape when viewed from the Z-axis direction. The outer layer portion 240 and the inner layer portion 241 are connected via a connecting portion 242.

[0117] The outer layer portion 240 is composed of a first sheet portion 243, a second sheet portion 244 that has the same length as the first sheet portion 243 and faces the first sheet portion 243, and a pair of V-shaped connecting portions 245 that connect the first sheet portion 243 and the second sheet portion 244. Similarly, the inner layer portion 241 is composed of a first sheet portion 246, a second sheet portion 247 that has the same length as the first sheet portion 246 and faces the first sheet portion 246, and a pair of V-shaped connecting portions 248 that connect the first sheet portion 246 and the second sheet portion 247.

[0118] Connecting portion 245 has a bent portion 249, and connecting portion 248 has a bent portion 250. Bent portion 249 is a corner of two sides that make up connecting portion 245, and bent portion 250 is a corner of two sides that make up connecting portion 248. Bent portion 249 and bent portion 250 both protrude outward.

[0119] Both the outer layer portion 240 and the inner layer portion 241 are formed by laminating two graphite sheets 251. The graphite sheet 251 constituting the outer layer portion 240 and the graphite sheet 251 constituting the inner layer portion 241 differ from the graphite sheets 232O and 232I of the third embodiment in that the thickness and density of the graphite contained therein are the same. However, for ease of explanation, the graphite sheet 251 constituting the outer layer portion 240 will be referred to as graphite sheet 251O, and the graphite sheet 251 constituting the inner layer portion 241 will be referred to as graphite sheet 251I. The graphite sheet 251 is an example of a "thermal conduction layer" according to the technology of the present disclosure.

[0120] 26 , thermal conduction member 100A8 is formed from a single sheet-like material 255. Material 255 includes two graphite sheets 251O that form outer layer portion 240 and two graphite sheets 251I that form inner layer portion 241. Two graphite sheets 251O are connected by a single connecting portion 256O. Two graphite sheets 251I are connected by a single connecting portion 256I. Note that, hereinafter, connecting portions 256O and 256I may be collectively referred to as connecting portion 256.

[0121] Connecting portion 256O is provided in the center of graphite sheet 251O, in a portion that will become first sheet portion 243 of outer layer portion 240. In other words, connecting portion 256O is provided in a portion other than bent portion 249. First sheet portion 243 is an example of a “non-bent portion” according to the technology of the present disclosure.

[0122] Connecting portion 256I is provided in the center of graphite sheet 251I, in a portion that will become first sheet portion 246 of inner layer portion 241. In other words, connecting portion 256I is provided in a portion other than bent portion 250. First sheet portion 246 is an example of a "non-bent portion" according to the technology of the present disclosure.

[0123] Of the two graphite sheets 251O, double-sided adhesive tape 257 is attached to portions that will become first sheet portion 243 and second sheet portion 244 of graphite sheet 251O on the connection portion 242 side. In addition, of the two graphite sheets 251I, double-sided adhesive tape 257 is also attached to portions that will become first sheet portion 246 and second sheet portion 247 of graphite sheet 251I on the connection portion 242 side.

[0124] As an example, as shown in FIG. 27 , thermal conduction member 100A8 is formed by bending the dashed line portion of material 255 shown in FIG. 26 . Specifically, as shown in the upper and middle rows, connecting portion 256I is first bent 180 degrees to bring two graphite sheets 251I face each other. Then, two graphite sheets 251I are overlapped and bonded together with the adhesive of double-sided adhesive tape 257. Next, as shown in the middle and lower rows, connecting portion 256O is bent 180 degrees to bring two graphite sheets 251O face each other. Then, two graphite sheets 251O are overlapped and bonded together with the adhesive of double-sided adhesive tape 257. Thereafter, connecting portion 242 is bent 180 degrees to bring the portion that will become outer layer portion 240 and the portion that will become inner layer portion 241 face each other. Then, the bent portion 250 and other portions are bent to form the inner layer portion 241, and then the bent portion 249 and other portions are bent to form the outer layer portion 240.

[0125] As an example, consider a comparative example in which multiple graphite sheets 251O and 251I are simply stacked without connecting portions 256O and 256I, as shown in FIG. 28 . In this case, heat from the image sensor 16 is largely conducted to the first graphite sheets 251O and 251I that contact the second piece 126 of the thermal conductive member 100B. However, heat is not conducted very well from the first graphite sheets 251O and 251I to the second graphite sheets 251O and 251I that do not contact the second piece 126. As a result, the effect of stacking multiple graphite sheets 251 is not fully realized. Furthermore, in this case, the adhesive strength of the double-sided adhesive tape 257 weakens, and if two adjacent graphite sheets 251 peel off, the heat conduction path from the image sensor 16 is interrupted.

[0126] 29 , in the fourth embodiment, heat conduction member 100A8 is formed by stacking multiple graphite sheets 251, with adjacent graphite sheets 251 being connected by connecting portions 256 and folded at connecting portions 256. As a result, heat is conducted from first graphite sheets 251O and 251I that contact second piece 126 to second graphite sheets 251O and 251I that do not contact second piece 126 via connecting portions 256O and 256I. This allows the effect of stacking multiple graphite sheets 251 to be fully realized, further improving the thermal conductivity of heat conduction member 100A8. Even if the adhesive strength of double-sided adhesive tape 257 weakens and two adjacent graphite sheets 251 peel off, connecting portions 256O and 256I can ensure a heat conduction path for image sensor 16. Furthermore, even if two adjacent graphite sheets 251 peel off, connecting portions 256O and 256I can prevent the two graphite sheets 251 from separating from each other.

[0127] Two adjacent graphite sheets 251 are bonded together with the adhesive of double-sided adhesive tape 257. Therefore, the heat conduction efficiency can be improved compared to when two adjacent graphite sheets 251 are not bonded together.

[0128] The connecting portion 256 is provided at a non-bending portion other than the bending portions 249 and 250. Therefore, there is no risk that the bending of the bending portions 249 and 250 will be hindered by the connecting portion 256.

[0129] Although the number of layers of graphite sheets 251 is two in the above example, this is not a limitation. Furthermore, although the number of connecting portions 256 is one in the above example, this is not a limitation. For example, as in material 260 shown in FIG. 30 , graphite sheets 251O and 251I may each have four sheets, and connecting portions 256O and 256I may each have five sheets. In this case, connecting portions 256O and 256I are also provided in portions other than bent portions 249 and 250.

[0130] Fifth Embodiment As an example, as shown in Fig. 31 , an image sensor unit 270 according to a fifth embodiment includes a heat conduction member 100E. The heat conduction member 100E is connected to the fixing member 30 and the camera body 10. The heat conduction member 100E is a metal plate, for example, a copper plate. The heat conduction member 100E is an example of a "second heat conduction member" according to the technology of the present disclosure.

[0131] 32, which shows a cross-sectional view of the image sensor unit 270 taken along line A-A in FIG. 31, a flexible substrate 275 and a heat conduction member 100F are connected to the fixed member 30 and the movable member 31. The flexible substrate 275 is connected to the image sensor 16 through the movable member 31. The flexible substrate 275 and the heat conduction member 100F are disposed between the fixed member 30 and the movable member 31. The flexible substrate 275 has a C-shaped flexure 276 that allows the movable member 31 to move. Similarly, the heat conduction member 100F has a C-shaped flexure 277 that allows the movable member 31 to move. The flexible substrate 275 and the heat conduction member 100F are bonded with double-sided adhesive tape in areas other than the flexures 276 and 277.

[0132] Heat conduction member 100F is disposed in space SP formed by flexible substrate 275's bending portion 276. Heat conduction member 100F is slightly smaller than flexible substrate 275 so as not to hinder the movement of flexible substrate 275, but has a shape that generally conforms to flexible substrate 275. Note that a shape that "conforms to" flexible substrate 275 includes not only a shape that completely conforms to flexible substrate 275, but also a shape that generally conforms to flexible substrate 275, such as heat conduction member 100F in FIG. 32 .

[0133] The thermal conduction member 100F conducts the heat of the imaging element 16 stored in the movable member 31 to the fixed member 30. The thermal conduction member 100F is formed of, for example, a graphite sheet, similar to the thermal conduction member 100A1. This allows the thermal conduction member 100F to have appropriate elasticity. The thermal conduction member 100F is an example of a "first thermal conduction member" according to the technology of the present disclosure.

[0134] In the image sensor unit 270 of this embodiment, the heat from the image sensor 16 follows a conduction path as shown in FIG. 33 , for example. That is, the heat from the image sensor 16 is first conducted to the movable member 31. Next, the heat is conducted from the movable member 31 to the thermal conduction member 100F. The heat conducted to the thermal conduction member 100F is conducted to the fixed member 30. The heat conducted to the fixed member 30 is conducted to the thermal conduction member 100E. Furthermore, the heat is conducted to the camera body 10 through the thermal conduction member 100E, and is dissipated to the outside through the camera body 10.

[0135] As described above, in the fifth embodiment, the image sensor unit 270 includes a heat conduction member 100F that is connected to the fixed member 30 and the movable member 31 and that conducts the heat of the image sensor 16 stored in the movable member 31 to the fixed member 30, and that has a flexible portion 277 that allows movement of the movable member 31. This makes it possible to dissipate heat from the image sensor 16 more efficiently.

[0136] The imaging element unit 270 is connected to the imaging element 16 and includes a flexible substrate 275 having a flexible portion 276 that allows movement of the movable member 31. The thermally conductive member 100F is disposed in a space SP formed by the flexible portion 276 of the flexible substrate 275. Therefore, the space SP can be effectively used as a location for disposing the thermally conductive member 100F.

[0137] The heat conducting member 100F has a shape that conforms to the flexible substrate 275. Therefore, the heat conducting member 100F can smoothly deform in accordance with the deformation of the flexible substrate 275 caused by the movement of the movable member 31.

[0138] The fixing member 30 is connected to the camera body 10 via the heat conducting member 100E. Therefore, the heat from the image sensor 16 that is conducted to the fixing member 30 via the heat conducting member 100F can be efficiently dissipated to the camera body 10.

[0139] 34 as an example, a graphite sheet 280 for forming a heat conduction member 100A9 (see FIG. 35 ) of the 6_1 embodiment has a different structure of graphite 284 at a V-shaped connecting portion 283 (both see FIG. 35 ) connecting a first sheet portion 281 and a second sheet portion 282. Specifically, the graphite 284 has an inwardly recessed portion 286 at a bent portion 285, which is a corner of two sides constituting the connecting portion 283. Therefore, the width WGB of the bent portion 285 of the graphite 284 is narrower than the width WGUB of a non-bent portion 287 constituting two sides of the connecting portion 283 (WGB<WGUB). On the other hand, a resin film 288 has the same width WC at the bent portion 285 and the non-bent portion 287. Here, the term "same" in the same width not only means exactly the same, but also includes the meaning of approximately the same, including an allowable error in design and manufacturing, for example, an error of about ±10% of the design value.

[0140] Because graphite 284 has recesses 286 at bent portions 285, the coverage of graphite 284 by resin film 288 is wider at width MB of bent portions 285 than at width MUB of non-bent portions 287 (MB>MUB). Therefore, bent portions 285 have a structure with higher mechanical strength than non-bent portions 287. Here, the coverage is the distance from the end of graphite 284 in the width direction to the end of resin film 288 in the width direction.

[0141] 35 is a perspective view of the heat conduction member 100A9 after assembly, in which the resin film 288 is not depicted to avoid complication.

[0142] As described above, in the 6_1 embodiment, the bent portion 285 has a structure with higher mechanical strength than the non-bent portion 287. Therefore, in the bent portion 285 that deforms many times following the movement of the imaging element 16, damage to the resin film 288 that is the covering material can be suppressed, and the durability of the heat conduction member 100A9 can be improved.

[0143] Graphite sheet 280 includes graphite 284 and resin film 288 covering graphite 284, the resin film 288 being wider than graphite 284. A covering margin, which is the distance from the widthwise end of graphite 284 to the widthwise end of resin film 288, is wider in bent portion 285 than in non-bent portion 287. Specifically, the width of graphite 284 is narrower in bent portion 285 than in non-bent portion 287. Furthermore, the width of resin film 288 is the same in bent portion 285 and non-bent portion 287. This reduces the risk of breakage of resin film 288 at bent portion 285, causing leakage of graphite 284 to the outside, and facilitates increasing the mechanical strength of bent portion 285. Furthermore, special processing of resin film 288 is not required, allowing the use of an inexpensive resin film 288.

[0144] 36 shows an example of a graphite sheet 290 for forming a thermal conduction member 100A10 (see FIG. 37 ) according to a 6_2 embodiment. The graphite sheet 290 differs in the structure of a resin film 298 at a V-shaped connecting portion 293 (see FIG. 37 ) connecting a first sheet portion 291 and a second sheet portion 292. Specifically, the resin film 298 has a protruding portion 296 that protrudes outward at a bent portion 295, which is a corner of two sides that constitute the connecting portion 293. Therefore, in the resin film 298, the width WCB of the bent portion 295 is wider than the width WCB of the non-bent portion 297 that constitutes two sides of the connecting portion 293 (WCB > WCUB). Meanwhile, the graphite 294 has the same width WG at the bent portion 295 and the non-bent portion 297. Here, the term "same" in the same width not only means exactly the same, but also includes the meaning of approximately the same, including an allowable error in design and manufacturing, for example, an error of about ±10% of the design value.

[0145] Because the resin film 298 has the convex portions 296 at the bent portions 295, the coverage of the graphite 294 by the resin film 298 is such that the width MB of the bent portions 295 is wider than the width MUB of the non-bent portions 297 (MB>MUB), as in the case of the above-described 6_1 embodiment. Therefore, the bent portions 295 have a structure with higher mechanical strength than the non-bent portions 297. Here, the coverage is the distance from the widthwise end of the graphite 294 to the widthwise end of the resin film 298, as in the case of the above-described 6_1 embodiment.

[0146] 37 is a perspective view of the heat conduction member 100A10 after assembly. In FIG. 37, graphite 294 is not drawn to avoid complexity.

[0147] 38 , as an example, a plurality of mounted components 302 are mounted on a rear surface 301 of a circuit board 300 of this embodiment. The mounted components 302 are, for example, a control circuit, a drive circuit, a power supply circuit, a resistor, or a capacitor for the image sensor 16. The mounted components 302 are mounted at positions facing the non-bent portion 297 of the thermal conductive member 100A10, but are not mounted at positions facing the bent portion 295. Therefore, the thickness of the circuit board 300 including the mounted components 302 is such that the thickness T H C B at the position facing the bent portion 295 is thinner than the thickness T H C B at the position facing the non-bent portion 297 (T H C B <T H C B ).

[0148] In this sixth embodiment, the bent portion 295 also has a structure with higher mechanical strength than the non-bent portion 297. This makes it possible to improve the durability of the bent portion 295, which deforms many times in response to the movement of the imaging element 16, and therefore the durability of the heat conduction member 100A10.

[0149] In the sixth embodiment, the resin film 298 is wider in the bent portion 295 than in the non-bent portion 297. Furthermore, the width of the graphite 294 is the same in the bent portion 295 and the non-bent portion 297. This reduces the risk of the resin film 298 being broken at the bent portion 295 and the graphite 294 leaking to the outside, and easily increases the mechanical strength of the bent portion 295. Furthermore, no special processing is required for the graphite 294, and inexpensive graphite 294 can be used.

[0150] The thermal conductive member 100A10 is disposed at a position facing the circuit board 300 of the image sensor 16. The thickness T HCB of the circuit board 300 at a position facing the bent portion 295 is thinner than the thickness T HCUB of the circuit board 300 at a position facing the non-bent portion 297. This reduces the risk of a mounted component 302 on the circuit board 300 interfering with the bent portion 295 and hindering the bending of the bent portion 295. Furthermore, the space formed by the protrusion 296 between the thermal conductive member 100A10 and the circuit board 300 can be effectively utilized as a mounting location for the mounted component 302. Note that, as long as the thickness T HCB of the circuit board 300 at a position facing the bent portion 295 is thinner than the thickness T HCUB of the circuit board 300 at a position facing the non-bent portion 297 and the mounted component 302 does not interfere with the bent portion 295, the mounted component 302 may also be mounted at a position facing the bent portion 295.

[0151] 39 as an example, a heat conduction member 100A11 according to a seventh embodiment has slits 306 formed in bent portions 305. The longitudinal direction of the slits 306 is aligned with the Y-axis direction, which is the direction in which the heat conduction member 100A11 expands and contracts due to bending of the bent portions 305.

[0152] As described above, in the seventh embodiment, the slits 306 are formed in the bent portion 305. This reduces the resistance when the bent portion 305 is bent. The heat conduction member 100A11 can smoothly deform in accordance with the movement of the image sensor 16 due to the vibration isolation function. This reduces the moving load on the heat conduction member 100A11.

[0153] The longitudinal direction of the slits 306 is along the Y-axis direction, which is the direction in which the heat conduction member 100A11 expands and contracts due to bending of the bending portions 305. Therefore, a wider heat conduction path for the image sensor 16 in the Y-axis direction can be ensured compared to when the longitudinal direction of the slits 306 is along a direction intersecting the Y-axis direction, such as the Z-axis direction. The reduction in the heat conduction efficiency of the heat conduction member 100A11 due to the formation of the slits 306 can be minimized.

[0154] The slits 306 may be formed at the bent corner between the first sheet portion and the connecting portion, and at the bent corner between the second sheet portion and the connecting portion.

[0155] Although the CPU 18 has been exemplified as a processor that controls the operation of the image sensor unit 15, this is not limiting. Instead of or in addition to the CPU 18, a programmable logic device (PLD), which is a processor whose circuit configuration can be changed after manufacture, such as an FPGA (Field Programmable Gate Array), and / or a dedicated electric circuit having a circuit configuration designed specifically for executing specific processing, such as an ASIC (Application Specific Integrated Circuit), may be used.

[0156] In the first embodiment, the plates 45 to 47 are provided on the fixed member 30 and the recesses 70 to 72 are provided on the movable member 31, but this is not limiting. The plates 45 to 47 may be provided on the movable member 31 and the recesses 70 to 72 may be provided on the fixed member 30. Furthermore, in the first embodiment, the magnets 40 to 42 are provided on the fixed member 30 and the coils 60 to 62 are provided on the movable member 31, but this is not limiting. The magnets 40 to 42 may be provided on the movable member 31 and the coils 60 to 62 may be provided on the fixed member 30.

[0157] The number of sets of balls 35 to 37, plates 45 to 47, and recesses 70 to 72 is not limited to three, but may be four or more.

[0158] The imaging element unit of the present disclosure can also be applied to imaging devices other than the exemplified digital camera 2, such as smartphones, tablet terminals, or surveillance cameras.

[0159] From the above description, the technology described in the following supplementary paragraphs can be understood.

[0160] [Supplementary Item 1] An image sensor unit built into a housing of an imaging device, comprising: an image sensor that captures an image of a subject; at least two heat conduction members through which heat from the image sensor is conducted and which are connected to each other at a member connection portion; and a reinforcing member that reinforces the connection between the two heat conduction members at the member connection portion. [Supplementary Item 2] The image sensor unit according to Supplementary Item 1, which has an anti-shake function that moves the image sensor in a planar direction of an imaging surface, and one of the two heat conduction members deforms to be able to follow the movement of the image sensor due to the anti-shake function. [Supplementary Item 3] The image sensor unit according to Supplementary Item 1 or Supplementary Item 2, wherein the reinforcing member is adhered to the two heat conduction members at the member connection portion with an adhesive. [Supplementary Item 4] The image sensor unit according to any one of Supplementary Items 1 to 3, wherein the reinforcing member includes a heat conduction material having a thermal conductivity of 500 W / m·K or more. [Supplementary Item 5] An imaging device comprising: a housing; and an imaging element unit according to any one of Supplementary Items 1 to 4 built into the housing. [Supplementary Item 6] An imaging element unit built into the housing of an imaging device, comprising: an imaging element having an imaging surface that images a subject; an anti-shake function that moves the imaging element in a planar direction of the imaging surface; and a heat-conducting member through which heat from the imaging element is conducted, the heat-conducting member deforming to follow the movement of the imaging element due to the anti-shake function, wherein the heat-conducting member has an outer layer portion and at least one inner layer portion arranged inside the outer layer portion, each of the outer layer portion and the inner layer portion having a bent portion that enables the deformation, the bent portion of the inner layer portion having a smaller bent angle than the bent portion of the outer layer portion. [Supplementary Item 7] An imaging element unit according to Supplementary Item 6, wherein the inner layer portion is arranged in a space formed by the outer layer portion. [Supplementary Item 8] The image sensor unit according to Supplementary Item 6 or Supplementary Item 7, wherein the bent portion of the outer layer portion and the bent portion of the inner layer portion protrude outward. [Supplementary Item 9] An imaging device comprising: a housing; and the image sensor unit according to any one of Supplementary Items 6 to 8, built into the housing.[Supplementary Item 10] An image sensor unit to be built into the housing of an imaging device, comprising: an image sensor having an imaging surface that images a subject; an anti-shake function that moves the image sensor in a planar direction of the imaging surface; and a heat conduction member through which heat from the image sensor is conducted, the heat conduction member deforming to be able to follow the movement of the image sensor due to the anti-shake function, the heat conduction member having an outer layer portion and at least one inner layer portion arranged inside the outer layer portion, the outer layer portion having a structure that is more thermally conductive than the inner layer portion, and the inner layer portion having a structure that is more mobile than the outer layer portion. [Supplementary Item 11] The image sensor unit according to Supplementary Item 10, wherein the inner layer portion is arranged in a space formed by the outer layer portion. [Supplementary Item 12] The image sensor unit according to Supplementary Item 10 or Supplementary Item 11, wherein the outer layer portion is thicker than the inner layer portion. [Supplementary Item 13] The image sensor unit according to any one of Supplementary Items 10 to 12, wherein the outer layer portion is formed by stacking a plurality of thermally conductive layers containing a thermally conductive material. [Supplementary Item 14] The image sensor unit according to Supplementary Item 13, wherein the inner layer portion has a thermally conductive layer containing a thermally conductive material, and the outer layer portion has a greater number of thermally conductive layers stacked than the inner layer portion. [Supplementary Item 15] The image sensor unit according to Supplementary Item 13 or Supplementary Item 14, wherein the outer layer portion has a higher density of the thermally conductive material than the inner layer portion. [Supplementary Item 16] An imaging device comprising: a housing; and the image sensor unit according to any one of Supplementary Items 10 to 15 built into the housing. [Supplementary Item 17] An image sensor unit built into a housing of an imaging device, comprising: an image sensor that captures an image of a subject; and a thermally conductive member through which heat from the image sensor is conducted, wherein the thermally conductive member is formed by stacking a plurality of thermally conductive layers containing a thermally conductive material, and two adjacent thermally conductive layers of the plurality of thermally conductive layers are connected by a connecting portion and are stacked by being folded at the connecting portion. [Supplementary Item 18] The image sensor unit according to Supplementary Item 17, wherein the two adjacent thermally conductive layers are bonded with an adhesive.[Supplementary Item 19] The image sensor unit according to Supplementary Item 17 or Supplementary Item 18, which has an anti-shake function that moves the image sensor in a planar direction of the imaging surface, the heat conduction member has a bent portion that deforms to be able to follow the movement of the image sensor due to the anti-shake function, and the connecting portion is provided at a non-bent portion other than the bent portion. [Supplementary Item 20] An imaging device comprising: a housing; and the image sensor unit according to any one of Supplementary Items 17 to 19 built into the housing. [Supplementary Item 21] An image sensor unit built into the housing of an imaging device, comprising: an image sensor having an imaging surface for capturing an image of a subject; a movable member that holds the image sensor and moves the image sensor in a planar direction of the imaging surface; and a vibration isolation function realized by a fixed member that movably holds the movable member and is fixed in position within the housing; and a first thermal conduction member connected to the movable member and the fixed member and conducting heat stored in the image sensor to the fixed member, the first thermal conduction member having a flexible portion that allows movement of the movable member. [Supplementary Item 22] The image sensor unit according to Supplementary Item 21, further comprising: a flexible substrate connected to the image sensor and having a flexible portion that allows movement of the movable member, the first thermal conduction member being disposed within a space formed by the flexible portion of the flexible substrate. [Supplementary Item 23] The image sensor unit according to Supplementary Item 22, wherein the first thermal conduction member has a shape that follows the flexible substrate. [Supplementary Item 24] The image sensor unit according to any one of Supplementary Items 21 to 23, wherein the fixing member is connected to the housing via a second thermal conductive member. [Supplementary Item 25] An imaging device comprising: a housing; and the image sensor unit according to any one of Supplementary Items 21 to 24, built into the housing.

[0161] The technology of the present disclosure can be appropriately combined with the various embodiments and / or various modified examples described above. Furthermore, it is needless to say that the technology is not limited to the above-described embodiments, and various configurations can be adopted as long as they do not deviate from the gist of the present disclosure.

[0162] The above-described description and illustrations are a detailed explanation of the parts related to the technology of the present disclosure and are merely an example of the technology of the present disclosure. For example, the above description of the configuration, functions, actions, and effects is an explanation of an example of the configuration, functions, actions, and effects of the parts related to the technology of the present disclosure. Therefore, it goes without saying that unnecessary parts may be deleted, new elements may be added, or replacements may be made to the above-described description and illustrations within the scope of the gist of the technology of the present disclosure. Furthermore, to avoid confusion and facilitate understanding of the parts related to the technology of the present disclosure, the above-described description and illustrations omit explanations of common technical knowledge that do not require particular explanation to enable the implementation of the technology of the present disclosure.

[0163] In this specification, "A and / or B" is synonymous with "at least one of A and B." In other words, "A and / or B" means that it may be only A, only B, or a combination of A and B. Furthermore, in this specification, the same concept as "A and / or B" is also applied when three or more things are expressed by connecting them with "and / or."

[0164] All publications, patent applications, and technical standards mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent application, or technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. An imaging element unit built into the housing of an imaging device, comprising: an imaging element for capturing an image of a subject; at least two heat-conducting members through which heat from the imaging element is conducted and which are connected to each other at a member connection part; and a reinforcing member that reinforces the connection between the two heat-conducting members at the member connection part.

2. An imaging element unit as described in claim 1, which has an anti-vibration function that moves the imaging element in the planar direction of the imaging surface, and one of the two heat-conducting members is deformed so as to be able to follow the movement of the imaging element due to the anti-vibration function.

3. The imaging element unit according to claim 1, wherein the reinforcing member is bonded to the two heat conducting members at the member connecting portion with an adhesive.

4. The imaging element unit according to claim 1, wherein the reinforcing member contains a thermally conductive material having a thermal conductivity of 500 W / m·K or more.

5. An imaging device comprising: a housing; and an imaging element unit according to any one of claims 1 to 4 built into the housing.

6. An imaging element unit built into the housing of an imaging device, comprising: an imaging element having an imaging surface for imaging a subject; an anti-shake function for moving the imaging element in the planar direction of the imaging surface; and a heat-conducting member through which heat from the imaging element is conducted, the heat-conducting member deforming to be able to follow the movement of the imaging element due to the anti-shake function, wherein the heat-conducting member has an outer layer and at least one inner layer disposed inside the outer layer, each of the outer layer and the inner layer having a bending portion that enables the deformation, and the bending portion of the inner layer has a bending angle smaller than that of the bending portion of the outer layer.

7. The imaging element unit according to claim 6, wherein the inner layer portion is disposed in a space formed by the outer layer portion.

8. The image pickup element unit according to claim 6, wherein the bent portion of the outer layer portion and the bent portion of the inner layer portion protrude outward.

9. An imaging device comprising: a housing; and an imaging element unit according to any one of claims 6 to 8 built into the housing.

10. An imaging element unit built into the housing of an imaging device, comprising: an imaging element having an imaging surface for imaging a subject; an anti-shake function for moving the imaging element in the planar direction of the imaging surface; and a heat-conducting member through which heat from the imaging element is conducted, the heat-conducting member deforming so as to be able to follow the movement of the imaging element due to the anti-shake function, wherein the heat-conducting member has an outer layer and at least one inner layer disposed inside the outer layer, the outer layer having a structure with higher thermal conductivity than the inner layer, and the inner layer having a structure with higher mobility than the outer layer.

11. The imaging element unit according to claim 10, wherein the inner layer portion is disposed in a space formed by the outer layer portion.

12. The image pickup element unit according to claim 10, wherein the outer layer portion is thicker than the inner layer portion.

13. The image pickup element unit according to claim 10, wherein the outer layer portion is formed by laminating a plurality of thermally conductive layers containing a thermally conductive material.

14. An imaging element unit according to claim 13, wherein the inner layer portion has a thermally conductive layer containing a thermally conductive material, and the outer layer portion has a greater number of laminated thermally conductive layers than the inner layer portion.

15. The image pickup element unit according to claim 13, wherein the density of the thermally conductive material in the outer layer portion is higher than that in the inner layer portion.

16. An imaging device comprising: a housing; and an imaging element unit according to any one of claims 10 to 15 built into the housing.

17. An imaging element unit built into the housing of an imaging device, comprising: an imaging element for capturing an image of a subject; and a thermally conductive member through which heat from the imaging element is conducted; wherein the thermally conductive member is formed by stacking a plurality of thermally conductive layers containing a thermally conductive material, and two adjacent thermally conductive layers among the plurality of thermally conductive layers are connected by a connecting portion, and are stacked by being folded at the connecting portion.

18. The image pickup element unit according to claim 17, wherein two adjacent thermally conductive layers are bonded together with an adhesive.

19. An imaging element unit as described in claim 17, which is provided with an anti-vibration function that moves the imaging element in the planar direction of the imaging surface, wherein the heat conduction member has a bent portion that deforms to follow the movement of the imaging element due to the anti-vibration function, and the connecting portion is provided at a non-bent portion other than the bent portion.

20. An imaging device comprising: a housing; and an imaging element unit according to any one of claims 17 to 19 built into the housing.

21. An imaging element unit built into the housing of an imaging device, comprising: an imaging element having an imaging surface for imaging a subject; a movable member that holds the imaging element and moves the imaging element in the planar direction of the imaging surface; and a vibration isolation function realized by a fixed member that movably holds the movable member and is fixed in position within the housing; and a first heat conduction member that is connected to the movable member and the fixed member and conducts heat from the imaging element stored in the movable member to the fixed member, the first heat conduction member having a flexible portion that allows the movable member to move.

22. An imaging element unit as described in claim 21, further comprising a flexible substrate connected to the imaging element and having a flexible portion that allows movement of the movable member, and the first thermal conductive member is disposed within a space formed by the flexible portion of the flexible substrate.

23. The image pickup element unit according to claim 22, wherein the first heat conducting member has a shape that conforms to the flexible substrate.

24. The image pickup element unit according to claim 21, wherein the fixing member is connected to the housing via a second heat conducting member.

25. An imaging device comprising: a housing; and an imaging element unit according to any one of claims 21 to 24 built into the housing.