Detection device and method for driving detection device

Abstract

A detection device 100 comprises: a storage body 50 that can store a liquid 55; a sensor chip 10 provided on the storage body 50 and having a sensitive film 24 provided on the lower surface; and a pressing member 35 that is provided below the sensitive film 24 and that presses the storage body 50 by the sensor chip 10 being pressed downward, to thereby cause the liquid 55 to be supplied to the sensitive film 24.　

Description

Detection device and driving method thereof

[0001] The present invention relates to a detection device and a driving method thereof, and more particularly to a detection device having a sensitive film and a driving method thereof.

[0002] A method using a flow path to supply a liquid such as a sample liquid to a sensor for detecting a substance in the liquid is known (see, for example, Patent Document 1).A method using capillary action to supply a liquid to a sensitive membrane is known (see, for example, Patent Documents 2 to 4).

[0003] US Patent Publication No. 2013 / 0156644 JP 2013-152209 A JP 2013-96866 A JP 2021-47051 A

[0004] When a liquid is supplied to the sensitive membrane using a flow channel, a pump is used to deliver the liquid, which results in a larger detection device. When a liquid is supplied to the sensitive membrane using capillary action, a pump is not used, which allows for a smaller device. However, when capillary action is used, the speed at which the liquid is supplied to the sensitive membrane is slow.

[0005] The present invention has been made in view of the above-mentioned problems, and has as its object to quickly supply a liquid to a sensitive membrane.

[0006] The present invention is a detection device comprising a reservoir for storing liquid, a sensor chip provided on the reservoir and having a sensitive membrane on its underside, and a pressing member provided below the sensitive membrane, which presses the reservoir when the sensor chip is pressed downward, thereby supplying the liquid to the sensitive membrane.

[0007] In the above configuration, the reservoir may have a sheet containing fiber or resin.

[0008] In the above configuration, the reservoir may be configured to absorb the liquid and release the liquid when pressed by the pressing member.

[0009] In the above configuration, the pressing member is arranged below the sensitive membrane and away from the sensitive membrane, and has multiple openings at the portion that comes into contact with the reservoir, and when the pressing member presses the reservoir, the liquid is supplied to the sensitive membrane through the multiple openings.

[0010] In the above configuration, the pressing member may be provided on the lower surface of the sensor chip so as to surround the sensitive film.

[0011] In the above configuration, the reservoir has a recess for storing the liquid, the pressing member is arranged below the sensitive membrane and away from the sensitive membrane, and has an opening that overlaps with the recess in a planar view, and when the pressing member presses the reservoir, the liquid is supplied to the sensitive membrane through the opening.

[0012] In the above configuration, the sensor substrate may include a sensor chip mounted on its underside and a first electrode electrically connected to the sensor chip on its underside, and a support substrate provided below the sensor substrate and having a second electrode on its upper surface, and when the sensor substrate is pressed downward, the sensor chip presses the reservoir and the first electrode comes into contact with the second electrode.

[0013] In the above configuration, the first electrode can be provided on the sensor chip and electrically connected to a sensor having the sensitive membrane, and the second electrode can be provided on the support substrate and electrically connected to a detection circuit that detects substances in the liquid from the output of the sensor.

[0014] In the above configuration, a recess into which the sensor chip is inserted may be provided on the upper surface of the support substrate, and the reservoir may be provided on the bottom surface of the recess.

[0015] The above-described configuration may further include an elastic body that presses the sensor substrate downward.

[0016] In the above configuration, the pressing member may be a cover that covers the sensor chip and is fixed to the sensor substrate around the sensor chip.

[0017] The present invention provides a method for driving a detection device that includes preparing a sensor chip having a sensitive film on its underside, a sensor substrate having the sensor chip on its underside and a first electrode electrically connected to the sensor chip around the sensor chip, and a support substrate having a recess or opening into which the sensor chip can be placed and a second electrode on its upper surface at a position opposite the first electrode of the sensor substrate, and inserting the sensor chip into the recess or opening of the support substrate, so that the first electrode and the second electrode are electrically connected by a force applied to the sensor substrate toward the support substrate.

[0018] According to the present invention, the liquid can be supplied to the sensitive membrane quickly.

[0019] FIGS. 1(a) to 1(d) are cross-sectional views of a detection device according to Example 1. FIG. 2 is an exploded perspective view of a detection device according to Example 2. FIG. 3 is an exploded perspective view of a sensor substrate, a sensor chip, and a pressing member according to Example 2. FIG. 4 is a top view of a support substrate and a tray according to Example 2. FIGS. 5(a) and 5(b) are a bottom view and a top view, respectively, of a sensor substrate according to Example 2. FIG. 6 is a bottom view of a sensor chip according to Example 2. FIG. 7 is a cross-sectional view taken along line A-A in FIG. 6. FIG. 8 is a cross-sectional view taken along line A-A in FIGS. 4 to 5(b). FIG. 9 is a plan view of a tray, a reservoir, and a sensor chip according to Example 2. FIG. 10 is a block diagram of a detection device according to Example 2. FIG. 11 is a cross-sectional view illustrating a method of supplying a liquid to a sensitive membrane according to Example 2. FIG. 12 is a cross-sectional view illustrating a method of supplying a liquid to a sensitive membrane according to Example 2. FIG. 13 is a cross-sectional view of a detection device according to a first modified example of Example 2. FIG. 14 is a cross-sectional view of a detection device according to a second modified example of Example 2. Fig. 15 is a plan view of a tray, a reservoir, and a sensor chip in a second modification of the second embodiment. Fig. 16 is a cross-sectional view of a detection device according to a third embodiment. Fig. 17 is a plan view of a pressing member, a tray, a reservoir, and a sensor chip in the third embodiment. Fig. 18 is a cross-sectional view illustrating a method of supplying a liquid to the sensitive membrane in the third embodiment. Fig. 19 is a cross-sectional view illustrating a method of supplying a liquid to the sensitive membrane in the third embodiment.

[0020] Hereinafter, an embodiment will be described with reference to the drawings.

[0021] 1(a) to 1(d) are cross-sectional views of a detection device according to Example 1. The vertically upward direction (the direction opposite to the direction of gravity) is the Z direction, and the directions perpendicular to the Z direction and extending along the sides of a rectangular sensor chip in plan view are the X direction and the Y direction.

[0022] As shown in FIG. 1( a), in the detection device 100, a reservoir 50 is provided on a base 66 such as a tray. The reservoir 50 is flexible and holds a liquid 55. The liquid contains a substance to be detected by the detection device 100. Hereinafter, this liquid will also be referred to as a sample liquid. A sensor chip 10 is disposed above the reservoir 50. A sensitive film 24 is provided on the underside of the sensor chip 10. The sensitive film 24 is a film that adsorbs a specific substance in the liquid. A pressing member 35 fixed to the sensor chip 10 is provided below the sensitive film 24. An opening 36 is provided in the pressing member 35.

[0023] 1( b), when a downward force indicated by arrow 70 is applied to the sensor chip 10, the pressing member 35 presses the reservoir 50. When the reservoir 50 is crushed by the pressing member 35, the liquid 55 stored in the reservoir 50 moves from the reservoir 50 toward the sensitive membrane 24. The liquid 55 flows upward through the opening 36, indicated by arrow 72, and is sent into the space formed by the pressing member 35 and the surface of the sensitive membrane 24 of the sensor chip 10. As a result, the sensitive membrane 24 is exposed to the liquid 55.

[0024] As will be described in detail later, the reservoir 50 is, for example, a material that holds liquid, such as filter paper or absorbent cotton sheets. The pressing member 35 functions as a sensor cover. When the lower surface of the pressing member 35 reaches the reservoir 50, the sensor surface on which the sensitive membrane 24 of the sensor chip 10 is provided and the inner surface of the pressing member 35 form a somewhat sealed space. When a further downward force indicated by the arrow 70 is applied, some of the liquid 55 in the reservoir 50 enters this space. This is similar to the action of a water gun.

[0025] If the pressing member 35 is made of flexible plastic or metal, the contact surface of the pressing member 35 with the reservoir 50 is enlarged, increasing the effect of pushing out the liquid 55. Preferably, an air escape port is provided in the pressing member 35 closest to the sensor surface. As an air escape port, a hole may be provided in a portion of the sensor chip 10 or the pressing member 35. For example, if a portion of the pressing member 35 facing the sensor chip 10 does not contact the sensor chip 10 and is recessed, air can easily escape without leaking liquid. The recess may be formed by scraping a portion of the sensor chip 10. Thus, in Example 1, instead of using a pump to supply the liquid 55, an external force may be applied downward, as indicated by the arrow 70. This external force corresponds to, for example, the force of the operator's hand, the weight of the detection device 100, or the force of an elastic body 64 such as a spring (see FIG. 8 , described later).

[0026] Previous technologies have had the following problems. To date, methods for supplying liquid 55 have included using electrical components such as a pump, and utilizing capillary action. However, the former requires the incorporation of a pump, resulting in a complex and large configuration. The latter, relying on capillary action, has the problem of slow liquid delivery speed.

[0027] In contrast, in Example 1, the pressing member 35 provided below the sensitive membrane 24 presses the reservoir 50, causing the liquid 55 to reach the sensitive membrane 24. For example, the reservoir 50 absorbs the liquid 55 and delivers the liquid 55 when pressed by the pressing member 35. This eliminates the need for a pump or the like, allowing the detection device 100 to be miniaturized. Furthermore, the liquid 55 can be quickly supplied to the sensitive membrane 24 as it is pressed.

[0028] The sensor chip 10 is connected to a detection circuit. For example, in Figures 1(a) and 1(b), the sensor chip 10 and the detection circuit that drives the sensor chip 10 are electrically connected before the pressing member 35 presses the reservoir 50. Therefore, the sensor chip 10 is in a state where it can detect a specific substance before the pressing member 35 presses it. The state where the sensor chip 10 can detect a specific substance is, for example, a state where a current flows between the electrodes in the case of a resistive sensor chip 10, a state where a voltage is applied between the electrodes in the case of a capacitive sensor chip 10, or a state where a voltage and mechanical vibration are applied to the sensor chip 10 in the case of a vibration sensor chip 10.

[0029] In contrast to the case where the sensor chip 10 and the detection circuit are electrically connected before the pressing member 35 presses the reservoir 50, in the cases shown in FIGS. 1(c) and 1(d) described below, the sensor chip 10 and the detection circuit are electrically connected when the pressing member 35 presses the reservoir 50. This significantly reduces the drive time during which current flows through the sensor chip 10 or voltage is applied to it. This reduces power consumption. Furthermore, it is possible to suppress deterioration of the sensor chip 10 due to a long drive time of the sensor chip 10.

[0030] As shown in FIG. 1( c) , in the detection device 100 of the first embodiment, the sensor chip 10 is mounted on the underside of a sensor substrate 30. The sensor substrate 30 includes an electrode 32 (first electrode) provided on the underside of a substrate 31. The electrode 32 is electrically connected to a sensor in the sensor chip 10. The electrode 32 is provided on the underside of the substrate 31 so as to surround the periphery of the sensor chip 10. In FIG. 1( c) , two electrodes 32 are provided on the left and right sides of the sensor chip 10. The electrode 32 has a rectangular planar shape, and only one electrode may be provided.

[0031] An electrode 42 (second electrode) is provided on the upper surface of the substrate 41 of the support substrate 40, facing the electrode 32. An opening (recess 45) that is slightly larger than the sensor chip 10 is provided inside the electrode 42. The substrate 41 is provided with a detection circuit that drives the sensor chip 10, and the substrate 41 is fixed in a storage chamber 61 (see FIG. 2 , described later). In FIG. 2 , described later, the opening is described as a recess 45 (concave portion), and one side of the rectangular recess 45 (the lower right side in FIG. 2 ) is open in a plan view. This makes it easier to insert the sensor chip 10 into the recess 45 through the open portion. In this case, the electrode 42 is C-shaped. The sensor chip 10, the sensor substrate 30, and the support substrate 40 are prepared in this manner.

[0032] FIG. 1( d ) shows the contact structure. The sensor chip 10 can be inserted into the recess 45, so that contact between the electrodes 32 and 42 is possible when a downward force indicated by the arrow 70 is applied, such as the weight of the sensor substrate 30 or the sensor chip 10, or when an operator presses the sensor substrate 30 or the sensor chip 10 by hand. The electrodes 42 are electrically connected to a detection circuit or the like. As shown in FIG. 8 (described later), a recess 45 may be provided on the upper surface of the support substrate 40. A reservoir 50 is provided within the recess 45. When the sensor chip 10 is placed above the reservoir 50, the electrodes 32 and 42 are arranged to face each other.

[0033] 1( d ), when the sensor substrate 30 is pressed downward toward the support substrate 40 in the direction of arrow 70, the electrode 32 comes into contact with the electrode 42 in region 74, electrically connecting the sensor chip 10 and the detection circuit. In this way, pressing the sensor substrate 30 brings the electrode 32 into contact with the electrode 42 and supplies the liquid 55 to the sensitive film 24.

[0034] In the driving method of the detection device 100 shown in FIGS. 1(c) and 1(d), when the sensor substrate 30 is pressed downward by a downward external force (or its own weight) in the direction of arrow 70, liquid is delivered to the sensitive membrane 24 of the sensor chip 10. This eliminates the need for a pump, enabling a simplified and more compact structure. At the same time, the sensor chip 10 is electrically connected to the detection circuit by the pressure and detects substances in the liquid. In this manner, the sensor chip 10 is driven by the pressure. This prevents deterioration of the sensor chip 10 and also reduces power consumption. Note that in FIGS. 1(c) and 1(d), the substrate 41 is provided in contact with the base 66 on which the reservoir 50 is provided. However, the substrate 41 may also be provided on the bottom surface of the storage chamber 61 of the storage body 60, as shown in FIG. 2 (described later).

[0035] The following examples will explain the detection device more specifically.

[0036] 2 is an exploded perspective view of a detection device according to Example 2. The vertically upward direction is the Z direction, the long side direction of the planar shape of the sensor substrate 30 is the X direction, and the short side direction is the Y direction.

[0037] As shown in FIG. 2 , in the detection device 102, the housing 60 is, for example, a rectangular parallelepiped. A storage chamber 61 is provided on the top surface of the housing 60, and the sensor substrate 30, support substrate 40, and tray 52 are stored therein. The planar shape of the storage chamber 61 is, for example, rectangular. The support substrate 40 is fixed to the bottom surface of the housing chamber 61. Electrodes 42, a detection circuit 46, and a power supply circuit 48 are provided on the top surface of the support substrate 40. The tray 52 is located on the bottom surface of the storage chamber 61 and is disposed within a recess 45 in the support substrate 40. A reservoir 50 is provided within a recess 53 on the top surface of the tray 52. ​​The sensor substrate 30 is located on the support substrate 40, above the recess 45. An elastic body 64, such as a spring, is provided on the sensor substrate 30. The storage chamber 61 of the housing 60 is covered with a lid 62. The lid 62 has a screw hole 65. The lid 62 is fixed to the housing 60 by tightening the screw. By removing the screws, the cover 62 can be opened, facilitating replacement of the sensor substrate 30. Therefore, the pressing member 35 covering the sensor chip 10 attached to the back surface of the sensor substrate 30 presses the reservoir 50, as shown in Figure 1(d), and delivers the liquid 55 to the sensitive membrane 24 of the sensor chip 10.

[0038] FIG. 3 is an exploded perspective view of a sensor substrate, a sensor chip, and a pressing member according to the second embodiment.

[0039] As shown in FIG. 3 , electrodes 32 are provided on the lower surface (upper surface in FIG. 3 ) of the substrate 31 of the sensor substrate 30. A through-hole 34 is provided through the substrate 31. The sensor chip 10 is mounted on the lower surface of the sensor substrate 30. A sensitive film 24 is provided on the lower surface of the sensor chip 10. The pressing member 35 is, for example, a member formed by bending a metal plate. The pressing member 35 has a lower plate 38 a and side plates 38 b. The planar shape of the lower plate 38 a is, for example, rectangular, and four side plates 38 b are bent in the +Z direction from each of the four sides of the rectangle. Arms 37 (insertion plates) extend in the +Z direction from the +Z ends of a pair of opposing side plates 38 b. The arms 37 are inserted into the through-hole 34 of the sensor substrate 30. The arms 37 are bent on the upper surface of the sensor substrate 30 and joined to the sensor substrate 30 by, for example, soldering. The pressing member 35 may also be formed using metal drawing. Furthermore, the pressing member 35 may be formed in one step by injection molding using a metal mold. At least the surface of the pressing member 35 is preferably an insulator so that the pressing member 35 does not electrically short-circuit with the metal film 21 and the surface acoustic wave resonator 25 via the liquid 55.

[0040] Fig. 4 is a top view of the support substrate and tray in Example 2. Figs. 5(a) and 5(b) are bottom and top views, respectively, of the sensor substrate in Example 2. In Fig. 4, the sensor substrate 30, electrodes 32, detection circuit 46, and power supply circuit 48 are indicated by dashed lines. Fig. 5(a) is a perspective view of the bottom surface of the sensor substrate 30 from above. The sensor chip 10 and electrodes 42 are indicated by dashed lines.

[0041] As shown in FIG. 4 , a recess 45 is provided in the support substrate 40. The recess 45 penetrates the support substrate 40 in the Z direction. The recess 45 does not have to penetrate the support substrate 40. A tray 52 having a reservoir 50 provided therein is placed within the recess 45. A detection circuit 46 and a power supply circuit 48 are provided on the support substrate 40 on the side opposite (+Y direction) to the open portion (-Y direction) of the recess 45. Electrodes 42 and 42a are provided on the upper surface of the substrate 41. The C-shaped portion of the electrode 42 extending vertically is connected to the detection circuit 46. A pair of C-shaped portions of the electrode 42 extending horizontally are provided along the upper and lower edges of the recess 45, on both sides toward the open portion. The electrode 42a electrically connects the detection circuit 46 and the power supply circuit 48.

[0042] 5A, a pair of electrodes 32 are provided on the lower surface of the sensor substrate 30. The opposing portions of the two electrodes 32 overlap the rear surface of the surface-mounted sensor chip 10. The two electrodes 32 are soldered to the terminals 19 (see FIG. 7) on the rear surface of the sensor chip 10.

[0043] 5B, an elastic body 64 is illustrated on the upper surface of the sensor substrate 30. As shown in FIG. 8, which will be described later, the elastic body 64 attached to the cover 62 abuts against the upper surface of the sensor substrate 30. The elastic body 64 may also be attached to the sensor substrate 30 side.

[0044] As shown in Figures 4 and 5(a), when the sensor substrate 30 is placed on the support substrate 40, the sensor substrate 30 is positioned so as to cover the recess 45 and so that the other end of the electrode 32 overlaps the other end of the electrode 42.

[0045] Fig. 6 is a bottom view of the sensor chip in Example 2, and Fig. 7 is a cross-sectional view taken along the line A-A in Fig. 6. The electrode fingers 12a and 12b extend in the X direction (vertical direction), and the electrode fingers 12a and 12b are arranged in the Y direction (horizontal direction). In Fig. 6, the sensitive film 24 provided on the electrode fingers 12a and 12b is indicated by a dashed line.

[0046] 6 and 7, a surface acoustic wave resonator 25 is provided as a sensor on the lower surface of the substrate 11 of the sensor chip 10. The surface acoustic wave resonator 25 includes an interdigital transducer (IDT) 16 and a reflector 17. The IDT 16 and the reflector 17 are formed of metal films. The IDT 16 is sandwiched between a pair of reflectors 17 in the Y direction.

[0047] Each IDT 16 has a pair of comb electrodes 14a and 14b. Comb electrode 14a has a plurality of electrode fingers 12a and a bus bar 13a, and comb electrode 14b has a plurality of electrode fingers 12b and a bus bar 13b. The bus bars 13a and 13b extend in the Y direction, and the +X ends of the plurality of electrode fingers 12a and the −X ends of the plurality of electrode fingers 12b extend in the X direction, respectively.

[0048] When viewed from the Y direction, the region where the electrode fingers 12a and 12b overlap is a fixed "overlap region" 26 through which the surface acoustic wave propagates. In this overlap region 26, the electrode fingers 12a and 12b are arranged alternately. The surface acoustic wave excited by the IDT 16 is reflected by the reflector 17 and confined within the overlap region 26. The bus bars 13a and 13b of the IDT 16 are electrically connected to the pads 15a and 15b, respectively.

[0049] The pads 15a and 15b are electrically connected to terminals 19 provided on the upper surface of the substrate 11 through via wiring 18 (also called through electrodes) that penetrate the substrate 11. As a result, the terminals 19 are electrically connected to the IDTs 16 of the surface acoustic wave resonators 25. An insulating film 20 is provided on the substrate 11 so as to cover the IDTs 16 and the reflectors 17. A metal film 21 and a sensitive film 24 are provided in an overlapping region 26 on the insulating film 20. A protective film 22 is provided so as to surround the metal film 21 and the sensitive film 24.

[0050] The substrate 11 is, for example, a piezoelectric substrate, and is made of lithium tantalate (LiTaO ３ ) substrate, lithium niobate (LiNbO ３) substrate or quartz substrate, for example, a single crystal rotated Y-cut X-propagation lithium tantalate substrate or a single crystal rotated Y-cut X-propagation lithium niobate substrate. When the IDT 16 excites a shear horizontal (SH) wave, the substrate 11 is a 32° to 50° rotated Y-cut lithium tantalate substrate. The substrate 11 may also be a composite substrate in which a piezoelectric substrate is provided on an insulating substrate such as a sapphire substrate.

[0051] The IDT 16 and the reflector 17 are primarily composed of at least one metal selected from the group consisting of aluminum, copper, and molybdenum. The via wiring 18, the terminal 19, and the metal film 21 are primarily composed of gold, copper, and aluminum. The insulating film 20 is a film for suppressing electrical short circuits between the metal film 21 and the surface acoustic wave resonator 25, and is an inorganic insulating film such as a silicon oxide film or a silicon nitride film. The protective film 22 is a film for suppressing deterioration of the insulating film 20 due to contact of the liquid 55 with the insulating film 20. The protective film 22 is a resin film such as a permanent resist. The metal film 21 is larger than the overlap region 26 in plan view, and is a film for suppressing the effects of electrical perturbations. The metal film 21 is primarily composed of gold, for example.

[0052] The sensitive film 24 is, for example, an assembly including an antibody connected to a connector such as a linker provided on the metal film 21. The antibody binds to a specific antigen in the liquid (for example, a protein in a virus or bacterium to which the antibody binds, or another protein itself). The sensitive film 24 is just one example, and any film capable of detecting an antigen may be used. The liquid 55, which is the sample liquid, includes a bodily fluid such as saliva or blood.

[0053] When a substance in the liquid 55 binds to the sensitive film 24, the sensitive film 24 becomes heavier. This increases the mass added to the IDT 16, lowering the resonant frequency of the surface acoustic wave resonator 25. By detecting the change in the resonant frequency of the surface acoustic wave resonator 25, information about the substance in the liquid can be detected.

[0054] FIG. 8 is a cross-sectional view taken along line A-A in FIGS. 4 to 5(b). Note that FIG. 8 also illustrates the housing 60 and the lid 62, which are not shown in FIGS. 4 to 5(b). The electrode fingers 12a and 12b in FIG. 6 are illustrated as electrode fingers 12. This also applies to the following figures. A metal layer 43 is provided on the underside of the substrate 41. The metal layer 43 is joined, for example, with solder to a metal layer provided on the bottom of the storage chamber 61 of the housing 60. The substrate 41 may be screwed to the housing 60. A metal layer 33 is provided on the upper surface of the substrate 31. An elastic body 64 is provided between the metal layer 33 and the lid 62. The elastic body 64 is, for example, a spring, and presses the sensor substrate 30 downward. The housing 60, the lid 62, and the elastic body 64 are made of metal. When a ground potential is supplied to the housing 60, the metal layers 33 and 43 are also supplied with the ground potential. Some of the electrodes (including electrode 32) provided on the lower surface of substrate 31 may be electrically connected to metal layer 33 provided on the upper surface of substrate 31 through via wiring that penetrates substrate 31. Some of the electrodes (including electrodes 42 and 42a) provided on the upper surface of substrate 41 may be electrically connected to metal layer 43 provided on the lower surface of substrate 41 through via wiring that penetrates substrate 41.

[0055] The terminals 19 provided on the upper surface of the sensor chip 10 are joined to the electrodes 32 by solder or metal paste (not shown). As a result, the electrodes 32 are electrically connected to the IDT 16 via the terminals 19, via wirings 18 (through electrodes), and pads 15a on the surface acoustic wave resonator 25 side. When the pressing member 35 presses the reservoir 50, the liquid 55 in the reservoir 50 is sent and introduced into the pressing member 35, and the sensitive film 24 is immersed in the liquid 55.

[0056] Fig. 9 is a plan view of the tray, reservoir, and sensor chip in Example 2. In Fig. 9, the sensor chip 10 is indicated by a dotted line, and the reservoir 50 is indicated by a fine dotted line.

[0057] As shown in Figure 9, a reservoir 50 is provided on the bottom surface of a recess 53 (see Figure 8) provided in a tray 52. ​​A pressing member 35 also serves as a cover for the sensor chip 10, and is provided to cover the sensor chip 10. A plurality of openings 36 are provided so as to be scattered over almost the entire area of ​​the portion of the pressing member 35 that contacts the reservoir 50 (lower plate 38a). In Figure 9, the openings 36 are provided in a 3 x 3 array. The number of openings 36 can be set as appropriate. The planar shape of the openings 36 is, for example, circular.

[0058] The housing 60 and the lid 62 are made of an insulating material such as a metal or resin primarily composed of, for example, stainless steel or aluminum. The substrates 31 and 41 are made of an insulating material such as resin or ceramics, and are, for example, printed circuit boards. The electrodes 32, 42 and the metal layers 33 and 43 are, for example, primarily composed of copper, gold, or aluminum. When the substrates 31 and 41 are printed circuit boards, the electrodes 32, 42 and the metal layers 33 and 43 are made of copper foil, with the copper foil surface being gold-plated.

[0059] The pressing member 35 is a metal plate made of, for example, copper or aluminum. The pressing member 35 may also be an insulating plate made of, for example, resin. The pressing member 35 in FIG. 8 may be flexible enough to be easily deformed or crushed when pressure is applied. In this case, the pressing member 35 deforms when it presses the reservoir 50. This improves the airtightness of the space formed by the reservoir 50, the pressing member 35, and the sensor chip 10. Furthermore, the sensitive membrane 24 moves closer to the reservoir 50. This allows for more efficient liquid delivery to the sensitive membrane 24, similar to the water gun effect. The thickness of the metal plate of the pressing member 35 is, for example, 0.05 mm to 0.5 mm, and the diameter of the opening 36 is, for example, 0.05 mm to 0.5 mm. The distance between the pressing member 35 and the sensitive membrane 24 is, for example, 0.05 mm to 0.5 mm. These dimensions can be set as appropriate.

[0060] The reservoir 50 is, for example, sheet-shaped and contains fiber or resin. The fibrous material containing fiber is, for example, paper or nonwoven fabric, such as filter paper, absorbent cotton, or cloth. The resin-containing sheet is, for example, an open-cell sponge or gel. The reservoir 50 is a flexible member that can store liquid. When the reservoir 50 is pressed, the liquid 55 is forced out of the reservoir 50.

[0061] FIG. 10 is a block diagram of a detection device according to a second embodiment. As shown in FIG. 10, the detection device 102 includes an oscillator circuit 81, a detection circuit 46, and a power supply circuit 48. The oscillator circuit 81 includes a resonator 80. The resonator 80 is a surface acoustic wave resonator 25. The oscillator circuit 81 outputs an oscillation signal having an oscillation frequency corresponding to the resonant frequency of the resonator 80. The detection circuit 46 includes a measuring device 82 and a calculator 83. The measuring device 82 measures the frequency of the oscillation signal output by the oscillator circuit 81. The measuring device 82 may be, for example, a network analyzer. The calculator 83 detects information about substances in the liquid based on the amount of change in the frequency of the oscillation signal measured by the measuring device 82. The power supply circuit 48 supplies power to the detection circuit 46.

[0062] Next, a method of supplying liquid to the sensitive film 24 in the second embodiment will be described with reference to FIGS.

[0063] 11 , with the lid 62 removed from the storage body 60, a tray provided with a reservoir 50 soaked in a liquid 55 that is a specimen liquid is placed on the bottom surface of the recess 45 of the support substrate 40. Next, the sensor substrate 30 is placed on the support substrate 40 so that the pressing member 35 is positioned above the reservoir 50.

[0064] As shown in FIG. 12 , the sensor substrate 30 is placed on the support substrate 40, and the lid 62 is bonded to the housing 60 (see FIG. 8 ). The elastic force of the spring of the elastic body 64 generates a downward external force indicated by arrow 70, pressing the sensor substrate 30 toward the support substrate 40. When the reservoir 50 is pressed by the pressing member 35, the pressed portion of the reservoir 50 contracts, and the volume of the reservoir 50 is reduced to, for example, half or less. This causes the liquid 55 to be released from the reservoir 50. The liquid 55 is introduced between the pressing member 35 and the sensitive membrane 24 through the opening 36 of the pressing member 35, as indicated by the upward arrow 72. As a result, the sensitive membrane 24 comes into contact with the liquid 55.

[0065] 12, recess 53 of tray 52 has an inclined side surface that surrounds the entire bottom periphery. When an external force causes this inclined side surface to come into contact with the bottom periphery of pressing member 35, opening 36 of pressing member 35 serves as an escape route for liquid 55. Therefore, liquid 55 does not spill out of tray 52, but is sent upward and absorbed by sensitive membrane 24.

[0066] Simultaneously with this pressing, the electrodes 32 and 42 come into contact as shown in region 74. As a result, the detection circuit 46 is electrically connected to the surface acoustic wave resonator 25 via the electrodes 42 and 32, the terminal 19, and the via wiring 18. This allows the detection circuit 46 to detect substances and the like in the liquid 55 based on changes in the resonant frequency of the surface acoustic wave resonator 25.

[0067] Thereafter, the sensor substrate 30 and the specimen liquid 55 can be easily replaced by removing the lid 62 from the housing 60. According to the second embodiment, the liquid 55 can be supplied to the sensitive film 24 without the sensitive film 24 directly contacting the reservoir 50.

[0068] The pressing member 35 is a cover that covers the sensor chip 10 and is fixed to the sensor substrate 30 around the sensor chip 10. This allows the pressing member 35 to also be used as a cover that protects the sensor chip 10.

[0069] A sensor (surface acoustic wave resonator 25) having a sensitive film 24 is provided on the sensor chip 10. An electrode 32 (first electrode) is electrically connected to the surface acoustic wave resonator 25. A detection circuit 46 that detects a substance in a liquid 55 from the output of the surface acoustic wave resonator 25 is provided on a support substrate 40 that serves as a motherboard. An electrode 42 is electrically connected to the detection circuit 46. As a result, when the sensor substrate 30 is pressed toward the support substrate 40 and the electrodes 32 and 42 come into contact with each other, the detection circuit 46 and the surface acoustic wave resonator 25 can be electrically connected.

[0070] A recess 45 (recess or opening) into which the sensor chip 10 fits is provided on the upper surface of the support substrate 40, and a reservoir 50 is provided on the bottom surface of the recess 45. As a result, when the sensor chip 10 and the pressing member 35 are inserted into the recess 45 and the pressing member 35 presses the reservoir 50, the electrode 32 on the lower surface of the sensor substrate 30 comes into contact with the electrode 42 on the upper surface of the support substrate 40. If the support substrate 40 is thicker than the thickness of the sensor chip 10, a bulkhead member may be placed below the tray 52. ​​Furthermore, the recess 45 does not have to penetrate the support substrate 40 in the Z direction.

[0071] The elastic body 64 presses downward on the sensor substrate 30. This allows the pressing member 35 to press the reservoir 50 and the electrode 32 to come into contact with the electrode 42.

[0072] [Variation 1 of Example 2: Omission of Pressing Member] FIG. 13 is a cross-sectional view of a detection device according to Variation 1 of Example 2. As shown in FIG. 13, this detection device 104 does not include a pressing member 35 that functions as a cover. The protective film 22a is thicker than the protective film 22 shown in FIG. 7 of Example 2. The thickness of the protective film 22a is, for example, 10 μm to 200 μm. The thickness of the protective film 22a can be set as appropriate. The protective film 22a is provided to surround the sensitive film 24, similar to the protective film 22 shown in FIG. 6. When the protective film 22a presses against the reservoir 50, the liquid is introduced into the space surrounded by the protective film 22a, the sensitive film 24, and the reservoir 50. As a result, the sensitive film 24 is exposed to the liquid 55. The other configurations are the same as those of Example 2, and therefore a description thereof will be omitted.

[0073] According to the first modification of the second embodiment, the protective film 22a is provided on the lower surface of the sensor chip 10 so as to surround the sensitive film 24. This allows the protective film 22a to be used as a pressing member without providing the pressing member 35. This allows the detection device 104 to be made smaller and at a lower cost.

[0074] [Variation 2 of Example 2: Forming a Pressing Member on the Sensor Chip] Figure 14 is a cross-sectional view of a detection device 106 according to Variation 2 of Example 2. As shown in Figure 14, the detection device 106 according to Variation 2 of Example 2 does not include the pressing member 35 fixed to the sensor substrate 30. Instead of the pressing member 35, a pressing member 35a is provided on the underside of the protective film 22 on the sensor chip 10 side. The pressing member 35a is bonded to the protective film 22. When the pressing member 35a presses the reservoir 50, the liquid 55 is introduced into the space surrounded by the pressing member 35a, the protective film 22, and the sensitive film 24 through the opening 36. As a result, the sensitive film 24 is exposed to the liquid 55.

[0075] 15 is a plan view of a tray, a reservoir, and a sensor chip in a second modification of the second embodiment. The reservoir 50 is indicated by a dotted line.

[0076] A pressing member 35a is provided on the underside of the sensor chip 10. The pressing member 35a has an opening 36 that overlaps the sensitive film 24. The thickness of the metal plate of the pressing member 35a is, for example, 0.05 mm to 0.5 mm, and the diameter of the opening 36 is, for example, 0.05 mm to 0.5 mm. The distance between the thickness of the pressing member 35a and the sensitive film 24 is, for example, 0.05 mm to 0.5 mm. These dimensions can be set appropriately. The pressing member 35a is, for example, an insulating plate such as glass, a metal plate, or a rigid resin plate. To prevent electrical short-circuiting between the pressing member 35a and the metal film 21 or the surface acoustic wave resonator 25 via the liquid 55, the pressing member 35a is preferably an insulator. The pressing member 35a and the protective film 22 are bonded together, for example, with an adhesive or adhesive sheet. The other configurations are the same as those of the second embodiment, and therefore will not be described again.

[0077] In the third modification of the second embodiment, the pressing member 35a is fixed to the surface of the sensor chip 10 corresponding to the periphery of the sensitive film 24. In this manner, the pressing member 35a may be fixed to the sensor chip 10.

[0078] [Positioning a recess in which liquid accumulates in a portion of the reservoir that is pressed] Figure 16 is a cross-sectional view of a detection device 108 according to a third embodiment. In this detection device 108, a recess 51 (e.g., an opening that penetrates the reservoir 50a vertically) is provided on the upper surface of the reservoir 50a, and liquid 55 is accumulated in the recess 51. The reservoir 50a hardly absorbs the liquid 55 but is flexible. The reservoir 50a is, for example, a fluororesin such as polytetrafluoroethylene. The reservoir 50a may be made of any flexible material, such as resin.

[0079] 17 is a plan view of the pressing member, tray, reservoir, and sensor chip in Example 3. The sensor chip 10 is indicated by a dotted line, and the reservoir 50a is indicated by a thin dotted line. A recess 51 is provided on the upper surface of the reservoir 50a. At least a portion of the recess 51 is provided so as to overlap at least a portion of the opening 36 of the pressing member 35. The other configurations are the same as in Example 2, and therefore a description thereof will be omitted.

[0080] A method of supplying liquid to the sensitive film 24 in the third embodiment will be described with reference to FIGS.

[0081] As shown in FIG. 18, when the pressing member 35 is not in contact with the reservoir 50a, the liquid 55 is stored in the recess 51 of the reservoir 50a.

[0082] As shown in Figure 19, when the underside of pressing member 35 presses reservoir 50a downward, as indicated by arrow 70, liquid 55 in recess 51 is forcefully introduced into pressing member 35 through opening 36 in the upward direction of arrow 72. This principle is similar to how a water gun shoots water. Because the diameter of each recess 51 in reservoir 50a is small, a slight lateral force acts on liquid 55 when reservoir 50a is pressed, allowing water to be forcefully introduced into pressing member 35. This exposes sensitive membrane 24 to liquid 55. This configuration can improve the liquid delivery speed.

[0083] According to the third embodiment, the reservoir 50a has a recess 51 that stores the liquid 55. The pressing member 35 has an opening 36 that overlaps with the recess 51 in a plan view. When the pressing member 35 presses the reservoir 50a, the liquid 55 is supplied to the sensitive membrane 24 through the opening 36. In this way, even when the reservoir 50a does not absorb the liquid 55, the liquid 55 can be supplied to the sensitive membrane 24. The pressing member may be a pressing member 35a fixed to the protective membrane 22 as in the second modification of the second embodiment.

[0084] In the second and third embodiments, the surface acoustic wave (SAW) resonator 25 has been described as an example of the sensor. However, the sensor may be a bulk acoustic wave (BAW) resonator such as a film bulk acoustic resonator (FBAR) or a solidly mounted resonator (SMR). The sensor may also be a delay line sensor having a delay line between IDTs. A quartz crystal microbalance (QCM) may also be used as the sensor. Sensors other than those described above may also be used. Although an example in which one sensor is provided on the sensor substrate 30 has been described, multiple sensors may also be provided on the sensor substrate 30.

[0085] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to such specific embodiments, and various modifications and changes are possible within the scope of the gist of the present invention described in the claims.

[0086] REFERENCE SIGNS LIST 10 Sensor chip 21 Metal film 22, 22a Protective film 24 Sensitive film 25 Surface acoustic wave resonator 30 Sensor substrate 32, 42 Electrodes 35, 35a Pressing member 40 Support substrate 46 Detection circuit 50, 50a Reservoir 52 Tray 55 Liquid

Claims

1. A reservoir for storing liquid; A sensor chip provided on the reservoir and having a sensitive film on its lower surface; a pressing member that is provided below the sensitive membrane and presses the reservoir by pressing the sensor chip downward, thereby supplying the liquid to the sensitive membrane; A detection device comprising:

2. The detection device according to claim 1 , wherein the reservoir comprises a sheet containing a fiber or a resin.

3. The detection device according to claim 1 , wherein the reservoir absorbs the liquid and releases the liquid when pressed by the pressing member.

4. The pressing member is provided below the sensitive membrane and spaced from the sensitive membrane, and has a plurality of openings at a portion where the pressing member abuts against the reservoir, 4. The detection device according to claim 2, wherein the liquid is supplied to the sensitive membrane through the plurality of openings by the pressing member pressing the reservoir.

5. 4. The detection device according to claim 2, wherein the pressing member is provided on the lower surface of the sensor chip so as to surround the sensitive film.

6. A detection device as described in claim 1, comprising an elastic body that presses the sensor chip downward.

7. A tray having a recess on an upper surface thereof, The reservoir is sheet-shaped and provided in the recess. The detection device according to claim 1 .

8. The reservoir has a recess for storing the liquid, the pressing member is provided below the sensitive membrane and spaced apart from the sensitive membrane, and has an opening that overlaps with the recess in a plan view; The detection device according to claim 1 , wherein the liquid is supplied to the sensitive membrane through the opening by the pressing member pressing the reservoir.

9. a sensor substrate having a lower surface on which the sensor chip is mounted and a first electrode electrically connected to the sensor chip; a support substrate provided under the sensor substrate and having a second electrode provided on an upper surface thereof; Equipped with 9. The detection device according to claim 1, wherein the sensor substrate is pressed downward, so that the sensor chip presses the reservoir and the first electrode comes into contact with the second electrode.

10. a sensor having the sensitive film is provided on the sensor chip; the first electrode is electrically connected to the sensor; a detection circuit for detecting a substance in the liquid from an output of the sensor is provided on the support substrate; The detection device according to claim 9 , wherein the second electrode is electrically connected to the detection circuit.

11. a recess into which the sensor chip is inserted is provided on an upper surface of the support substrate; The detection device according to claim 9 , wherein the reservoir is provided on a bottom surface of the recess.

12. The detection device according to claim 9 , further comprising an elastic body that presses the sensor substrate downward.

13. 10. The detection device according to claim 9, wherein the pressing member is a cover that covers the sensor chip and is fixed to the sensor substrate around the sensor chip.

14. A sensor chip having a sensitive film on its underside; a sensor substrate having the sensor chip provided on a lower surface thereof and a first electrode provided around the sensor chip and electrically connected to the sensor chip; a support substrate having a recess or an opening into which the sensor chip is inserted and a second electrode provided on an upper surface thereof at a position opposite to the first electrode of the sensor substrate; Prepare A method for driving a detection device, comprising: inserting the sensor chip into a recess or opening in the support substrate; and electrically connecting the first electrode and the second electrode by a force applied to the sensor chip toward the support substrate.

15. The preparation includes preparing an elastic body that presses the sensor substrate toward the support substrate. A method for driving the detection device according to claim 14.

16. The preparation includes preparing a tray having a recess on an upper surface and a reservoir for storing liquid; The reservoir is sheet-shaped and provided in the recess. A method for driving the detection device according to claim 14.