Inductor component

Abstract

Provided is an inductor component that can increase the acquisition efficiency of inductance. This inductor component comprises an element body having a first main surface and a second main surface that face each other, a coil that is provided to the element body and wound in a spiral shape along the axis, and a first external electrode and a second external electrode that are provided to the element body and are electrically connected to the coil, wherein: the axis of the coil is disposed in parallel to the first main surface; the coil includes a plurality of first coil wiring that are provided on the first main surface side relative to the axis and are arranged along the axis on a plane parallel to the first main surface, a plurality of second coil wiring that are provided on the second main surface side relative to the axis and are arranged along the axis on a plane parallel to the second main surface, a plurality of first through-wiring that extend from the first coil wiring toward the second coil wiring and are arranged along the axis, and a plurality of second through-wiring that extend from the first coil wiring toward the second coil wiring, are provided on the side opposite to the first through-wiring relative to the axis, and are arranged along the axis; the first coil wiring, the first through-wiring, the second coil wiring, and the second through-wiring are connected in this order to thereby form at least a portion of the spiral shape; and the first through-wiring and the second through-wiring are non-parallel as viewed from the axial direction.

Description

Inductor Components

[0001] The present disclosure relates to inductor components.

[0002] A conventional inductor component is described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has an element body, a coil provided within the element body and wound along the axial direction, and a first external electrode and a second external electrode provided on the element body and electrically connected to the coil.

[0003] The coil has multiple coil patterns stacked along the axis. Adjacent coil patterns in the axial direction are connected via conductive vias. The coil pattern has wiring portions extending in a direction perpendicular to the axis and pad portions provided at the ends of the wiring portions and connecting to the conductive vias. The width of the pad portions is wider than the width of the wiring portions to improve connectivity between the pad portions and the conductive vias.

[0004] Patent No. 6652280

[0005] However, in the conventional inductor components described above, the width of the pad portion is wider than the width of the wiring portion, so part of the pad portion is located radially inward of the wiring portion of the coil, which reduces the inner diameter of the coil and does not necessarily result in a high efficiency of obtaining inductance.

[0006] Therefore, an object of the present disclosure is to provide an inductor component that can increase the efficiency with which inductance can be obtained.

[0007] In order to solve the above problem, an inductor component according to one aspect of the present disclosure comprises: an element body including first and second main surfaces opposing each other; a coil provided on the element body and wound spirally along an axis; and first and second external electrodes provided on the element body and electrically connected to the coil, the axis of the coil being arranged parallel to the first main surface, the coil including: a plurality of first coil wirings provided on the first main surface side of the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side of the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires extending from the first coil wiring towards the second coil wiring and arranged along the axis; and a plurality of second through wires extending from the first coil wiring towards the second coil wiring and arranged on the opposite side of the axis from the first through wires and arranged along the axis, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral, and the first through wiring and the second through wiring are non-parallel when viewed in the axial direction.

[0008] In this specification, the term "axis" refers to the intersection of a first plane passing through the center between the first coil wiring and the second coil wiring and a second plane passing through the center between the first through wiring and the second through wiring. "The first through wiring and the second through wiring are non-parallel when viewed in the axial direction" means that the center line of the first through wiring and the center line of the second through wiring are not parallel when viewed in the axial direction. The center lines of the first through wiring and the second through wiring refer to lines passing through the centers of the through wiring in a plane perpendicular to the extension direction. "The external electrode is provided on the element body" specifically means that the external electrode is provided on the outer surface of the element body. This includes, for example, cases where the external electrode is provided directly on the outer surface of the element body, cases where the external electrode is provided on the outside of the element body via a separate member on the element body, and cases where the external electrode is provided on the outer surface of the external electrode with part of the external electrode embedded in the element body.

[0009] According to the above aspect, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring, and the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a portion of a spiral shape, thereby allowing the inner diameter of the coil to be increased and the efficiency of obtaining inductance to be increased. Furthermore, increasing the efficiency of obtaining inductance allows the Q value to be increased. Furthermore, because the first through wiring and the second through wiring are non-parallel when viewed in the axial direction, the design freedom of the first through wiring and the second through wiring can be improved, and for example, the Q value or the self-resonant frequency can be increased.

[0010] Preferably, in one embodiment of the inductor component, the first through wire and the second through wire are symmetrical with respect to the axis when viewed in a direction perpendicular to the first main surface.

[0011] According to the above embodiment, symmetry with respect to the coil axis can be ensured, and the coil can be easily designed.

[0012] Preferably, in one embodiment of the inductor component, the first through wire and the second through wire are symmetrical with respect to a line that is perpendicular to the first main surface and includes the axis when viewed in the axial direction.

[0013] According to the above embodiment, symmetry with respect to the coil axis can be ensured, and the coil can be easily designed.

[0014] Preferably, in one embodiment of the inductor component, the line edge roughness of the first through wiring is greater than the line edge roughness of the first coil wiring.

[0015] Here, the line edge roughness of the first through wiring refers to the line edge roughness of the side surface of the first through wiring that is on the inner diameter side of the coil in a cross section that is orthogonal to the axis of the coil and includes the center line of the first through wiring, and the line edge roughness of the first coil wiring refers to the line edge roughness of the side surface of the first coil wiring in a cross section that is orthogonal to the first main surface and includes the center line of the first coil wiring.

[0016] According to the embodiment, the anchor effect improves the adhesion between the first through-wire and the element body.

[0017] Preferably, in one embodiment of the inductor component, the line edge roughness of the first through wiring is equal to or smaller than the line edge roughness of the first coil wiring.

[0018] According to the embodiment, the side surface of the first through wiring is smooth, so that an increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved.

[0019] Preferably, in one embodiment of the inductor component, the first through wiring and the second through wiring have different widths.

[0020] Here, the width of the first through wiring is a circle-equivalent diameter calculated from the cross-sectional area of ​​the first through wiring in a cross section that includes the center in the extension direction of the first through wiring and is parallel to the first main surface, and the width of the second through wiring is a circle-equivalent diameter calculated from the cross-sectional area of ​​the second through wiring in a cross section that includes the center in the extension direction of the second through wiring and is parallel to the first main surface.

[0021] According to the embodiment, the degree of freedom in designing the first through wiring and the second through wiring can be improved.

[0022] Preferably, in one embodiment of the inductor component, the first through wiring has an outer peripheral portion located radially outward of the coil than the first coil wiring and the second coil wiring when viewed from the axial direction, and the outer peripheral portion is arranged between 0.3 and 0.7 of a height in a direction perpendicular to the first main surface of the element body, with the first main surface as a reference.

[0023] Here, being located radially outside the coil more than the first coil wiring and the second coil wiring means being located radially outside the coil more than the tangent line that contacts the end face that is located in a direction parallel to the first main surface of the first coil wiring and the end face that is located in a direction parallel to the first main surface of the second coil wiring, when viewed from the axial direction.

[0024] According to the embodiment, the first through wiring has an outer peripheral portion, which allows the inner diameter of the coil to be increased and the Q value to be improved. Furthermore, the outer peripheral portion is disposed between 0.3 and 0.7 of the height of the element body, which allows the outer peripheral portion to be provided only at a portion of the height of the element body, thereby reducing the possibility that the first through wiring will be exposed from the element body when singulated.

[0025] Preferably, in one embodiment of the inductor component, the inductor component further comprises: a second coil provided on the element body and wound in a spiral shape along a second axis parallel to the axis; and a third external electrode and a fourth external electrode provided on the element body and electrically connected to the second coil, wherein the second coil includes: a plurality of third coil wirings provided on the first main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the first main surface; a plurality of fourth coil wirings provided on the second main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the second main surface; a plurality of third through wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis; and a plurality of fourth through wirings extending from the third coil wiring toward the fourth coil wiring and provided on the opposite side of the third through wiring with respect to the second axis and arranged along the second axis, wherein the third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in this order to form at least a part of the spiral shape of the second coil, The second through wiring and the third through wiring are adjacent to each other.

[0026] According to the above embodiment, in the second coil as well as the first coil, the efficiency of obtaining inductance can be increased, and the degree of freedom in design can be improved.

[0027] Preferably, in one embodiment of the inductor component, when viewed in the axial direction of the coil, the first through wiring and the second through wiring and the third through wiring and the fourth through wiring are symmetrical with respect to a center line between the first coil and the second coil.

[0028] According to the above embodiment, it is possible to easily obtain a first coil and a second coil having similar characteristics.

[0029] Preferably, in one embodiment of the inductor component, the second through wire and the third through wire are arranged in parallel when viewed from the axial direction of the coil.

[0030] According to the embodiment, the second through wires and the third through wires are arranged in parallel, so that the distance between the adjacent coils and the second coil can be reduced, and the inductor component can be made smaller.

[0031] Preferably, in one embodiment of the inductor component, the first through wire and the second through wire are asymmetrical with respect to a line that is perpendicular to the first main surface and includes the axis, when viewed in the axial direction.

[0032] According to the above embodiment, in the first coil, the first through wiring and the second through wiring are asymmetrical with respect to a line that is perpendicular to the first main surface and includes the axis when viewed from the axial direction, thereby further improving the design freedom of the first through wiring and the second through wiring.

[0033] Preferably, in one embodiment of the inductor component, the third through wire and the fourth through wire are non-parallel when viewed from the second axis direction.

[0034] According to the embodiment, the distance between the third through wire and the fourth through wire can be increased, the inner diameter of the second coil can be increased, and the Q value can be improved.

[0035] Preferably, in one embodiment of the inductor component, the first through wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring, the first external electrode is provided on the first main surface side and overlaps at least a portion of the first connection surface when viewed from a direction perpendicular to the first main surface, and when viewed from the axial direction, the inclination angle on the axial side between a straight line connecting the center of the first connection surface and the center of the second connection surface and the connection surface connected to the first through wiring of the second coil wiring is greater than or equal to 60° and less than 90°.

[0036] According to the embodiment, since the inclination angle is less than 90°, the area of ​​the first coil wiring that overlaps with the first external electrode when viewed from a direction perpendicular to the first main surface can be reduced. This reduces the parasitic capacitance between the first external electrode and the first coil wiring, thereby increasing the self-resonant frequency. Furthermore, since the inclination angle is 60° or more, the inner diameter of the coil can be secured, thereby ensuring the Q value.

[0037] Preferably, in one embodiment of the inductor component, a portion of the first connecting surface and a portion of the second connecting surface overlap when viewed in a direction perpendicular to the first main surface.

[0038] According to the above embodiment, when viewed from a direction perpendicular to the first main surface, a portion of the first connection surface and a portion of the second connection surface overlap, so when a through hole is formed in the base body, a seed layer is provided on the inner surface of the through hole, and a first through wiring is formed on the seed layer by electrolytic plating, the formation of the seed layer becomes easy.

[0039] Preferably, in one embodiment of the inductor component, the center of the first connection surface is closer to the axis than the center of the second connection surface when viewed in a direction perpendicular to the first main surface.

[0040] According to the embodiment, the first connection surface is located more inward of the coil than the second connection surface when viewed in a direction perpendicular to the first main surface, which reduces the area of ​​the first coil wiring that overlaps with the first external electrode when viewed in a direction perpendicular to the first main surface, thereby reducing the parasitic capacitance between the first external electrode and the first coil wiring and increasing the self-resonant frequency.

[0041] Preferably, in one embodiment of the inductor component, the first through wiring has a conductive layer located on the outer periphery when viewed in the direction in which the first through wiring extends, and a non-conductive layer located inside the conductive layer.

[0042] According to the embodiment, when used in a high frequency band, current mainly flows through the surface of the first through wiring due to the skin effect, so providing a conductive layer on the outer periphery does not reduce the Q value. Furthermore, providing a non-conductive layer on the inner side can relieve stress, and manufacturing costs can be reduced by not using a conductor.

[0043] Preferably, in one embodiment of the inductor component, the cross-sectional area of ​​at least one of both end portions in the extension direction of the first through wire is larger than the cross-sectional area of ​​the central portion in the extension direction of the first through wire.

[0044] According to the above embodiment, the cross-sectional area of ​​the end of the first through wiring can be increased, thereby improving the connectivity between the first through wiring and at least one of the first coil wiring and the second coil wiring. Furthermore, when forming a hole in the element body and filling the hole with a conductive material by filling plating or the like to form the first through wiring in the hole of the element body, the conductive material can be easily filled in the opening side of the hole. Furthermore, since the cross-sectional area of ​​the end of the first through wiring is large and the cross-sectional area of ​​the central portion of the first through wiring is small, the first through wiring is easily formed.

[0045] Preferably, in one embodiment of the inductor component, the thickness of the inductor component is 200 μm or less.

[0046] According to the embodiment, the inductor component can be made thinner.

[0047] Preferably, in one embodiment of the inductor component, the first external electrode and the second external electrode are located inside the outer surface of the element body when viewed in a direction perpendicular to the first main surface.

[0048] According to the embodiment, the first and second external electrodes are not in contact with the outer surfaces of the element body, so that when the element body is singulated into individual inductor components, the load on the first and second external electrodes can be reduced and deformation or peeling of the first and second external electrodes can be suppressed, thereby preventing deformation or peeling of the first and second external electrodes even when the inductor component is made small.

[0049] Preferably, in one embodiment of the inductor component, the inductor component further comprises an organic insulator provided on the first main surface, the element body being an inorganic insulator, and the organic insulator being located inside the outer surface of the inorganic insulator when viewed in a direction perpendicular to the first main surface.

[0050] According to the embodiment, since the organic insulator is included, the organic insulator is easily imparted with fluidity, and when the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, thereby improving insulation. Furthermore, since the organic insulator does not contact the outer surface of the insulator, the load on the organic insulator can be reduced when the inductor component is singulated, and deformation or peeling of the organic insulator can be suppressed.

[0051] According to an inductor component according to one aspect of the present disclosure, it is possible to increase the efficiency with which inductance is obtained.

[0052] 8 is a schematic bottom view of the inductor component of the first embodiment, as viewed from the bottom side. FIG. 2 is a cross-sectional view taken along II-II in FIG. 1 . FIG. 3 is a cross-sectional view taken along III-III in FIG. 1 . FIG. 2 is an enlarged view of a portion of FIG. 2 . FIG. 3 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 4 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 4 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 5 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 6 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 7 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 8 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 1 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 2 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 3 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 4 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 5 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 6 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 7 is a cross-sectional view illustrating a first modified example of the inductor component. FIG. 8 is a cross-sectional view illustrating a second modified example of the inductor component.

[0053] Hereinafter, an inductor component according to one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0054] First Embodiment An inductor component 1 according to a first embodiment will be described below. FIG. 1 is a schematic bottom view of the inductor component 1 as viewed from the bottom side. FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 1. For convenience, external electrodes are depicted by two-dot chain lines in FIG. 1. Furthermore, although the element body 10 is depicted as transparent in FIG. 1 to facilitate understanding of the structure, it may also be translucent or opaque.

[0055] 1. Overview of Configuration The overview of the inductor component 1 will be described. The inductor component 1 is a surface-mount type inductor component used, for example, in a high-frequency signal transmission circuit. As shown in Figures 1, 2, and 3, the inductor component 1 includes an element body 10, a coil 110 provided on the element body 10 and wound spirally along an axis AX, and a first external electrode 121 and a second external electrode 122 provided on the element body 10 and electrically connected to the coil 110.

[0056] The element body 10 has a length, width, and height. The element body 10 has a first end face 100e1 and a second end face 100e2 at both ends in the length direction, a first side face 100s1 and a second side face 100s2 at both ends in the width direction, and a bottom face 100b and a top face 100t at both ends in the height direction. In other words, the outer surface 100 of the element body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b, and the top face 100t. The bottom face 100b is an example of a "first main surface" as defined in the claims, and the top face 100t is an example of a "second main surface" as defined in the claims.

[0057] As shown in the drawings, for the sake of convenience, the lengthwise direction (longitudinal direction) of the element body 10, that is, the direction from the first end face 100e1 to the second end face 100e2, is referred to as the X direction. The widthwise direction of the element body 10, that is, the direction from the first side face 100s1 to the second side face 100s2, is referred to as the Y direction. The heightwise direction of the element body 10, that is, the direction from the bottom face 100b to the top face 100t, is referred to as the Z direction. The X direction, Y direction, and Z direction are mutually orthogonal, and when arranged in the order X, Y, Z, they form a right-handed system.

[0058] In this specification, the "outer surface 100 of the element body 10," which includes the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the element body 10, does not simply mean a surface facing the outer periphery of the element body 10, but rather a surface that forms the boundary between the outside and the inside of the element body 10. Furthermore, "above the outer surface 100 of the element body 10" does not refer to an absolute direction such as vertically upward, which is defined by the direction of gravity, but rather refers to a direction toward the outside of the outside and the inside, with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, "above the outer surface 100" is a relative direction determined by the orientation of the outer surface 100. Furthermore, "above" with respect to a certain element includes not only an upper position away from the element, i.e., an upper position via another object on the element or an upper position with a gap therebetween, but also a position directly above the element (on).

[0059] The axis AX of the coil 110 is arranged parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom surface wirings 11b provided on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top surface wirings 11t provided on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom surface wirings 11b toward the top surface wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom surface wirings 11b toward the top surface wirings 11t and provided on the opposite side of the axis AX from the first through wirings 13 and arranged along the axis AX. The bottom surface wirings 11b, the first through wirings 13, the top surface wirings 11t, and the second through wirings 14 are connected in this order to form at least a portion of a spiral shape.

[0060] The bottom wiring 11b corresponds to an example of the "first coil wiring" set forth in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" set forth in the claims. The axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t and a second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction perpendicular to the axis AX.

[0061] According to the above configuration, the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14. The bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14 are connected in this order to form at least a part of a spiral, which allows the inner diameter of the coil 110 to be increased and the efficiency of obtaining inductance to be increased. Furthermore, by increasing the efficiency of obtaining inductance, the Q value can be increased.

[0062] Specifically, the pad portion of a conventional inductor component and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for the wiring that penetrates the element body (the conductive vias of a conventional inductor component and the first through wiring 13 and second through wiring 14 of this embodiment), and therefore have a shape that extends perpendicular to the direction that penetrates the element body. Here, in the configuration of a conventional inductor component, the conductive vias extend in a direction parallel to the axis of the coil, and therefore the pad portion extends in a direction perpendicular to the axis of the coil, and is likely to have a structure that blocks magnetic flux generated in the axial direction of the coil.

[0063] In contrast, in this embodiment, the first through wiring 13 and the second through wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, and therefore the bottom wiring 11b and the top wiring 11t extend in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are unlikely to have a structure that blocks magnetic flux generated in the direction of the axis AX. In other words, this embodiment can have a structure that is unlikely to block magnetic flux, thereby improving inductance acquisition efficiency and Q value.

[0064] 2, the first through wiring 13 and the second through wiring 14 are not parallel to each other when viewed in the direction of the axis AX. That is, the center line 13a of the first through wiring 13 and the center line 14a of the second through wiring 14 are not parallel to each other when viewed in the direction of the axis AX.

[0065] According to the above configuration, the first through wiring 13 and the second through wiring 14 are non-parallel when viewed from the direction of the axis AX, which improves the degree of freedom in designing the first through wiring 13 and the second through wiring 14, and makes it possible to increase the Q value or the self-resonant frequency, for example. Specifically, the distance between the first through wiring 13 and the second through wiring 14 can be increased, which makes it possible to increase the inner diameter of the coil 110 and improve the Q value.

[0066] It is preferable that all of the first through wirings 13 and all of the second through wirings 14 are non-parallel when viewed from the direction of the axis AX. It is sufficient that at least one first through wiring 13 and at least one second through wiring 14 are non-parallel when viewed from the direction of the axis AX. It is preferable that the first through wirings 13 and the second through wirings 14 that intersect on the same plane perpendicular to the axis AX are non-parallel when viewed from the direction of the axis AX. Furthermore, although all of the first through wirings 13 overlap when viewed from the direction of the axis AX, there may be first through wirings 13 among all the first through wirings 13 that do not overlap when viewed from the direction of the axis AX. The same applies to the second through wirings 14.

[0067] 2. Configuration of each part (inductor component 1) The volume of inductor component 1 is 0.08 mm ３ The dimension of the long side of the inductor component 1 is 0.65 mm or less. The dimension of the long side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, refers to the length in the X direction. With the above configuration, the volume of the inductor component 1 is small and the long side of the inductor component 1 is short, so the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. Furthermore, the thickness of the inductor component 1 is preferably 200 μm or less. This allows the inductor component 1 to be made thin.

[0068] Specifically, the size of the inductor component 1 (length (X direction) × width (Y direction) × height (Z direction)) is 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. Furthermore, the width and height do not have to be equal, and may be, for example, 0.4 mm × 0.2 mm × 0.3 mm.

[0069] (Element body 10) The element body 10 is made of SiO ２ This makes it possible to impart insulation and rigidity to the element body 10. The element body 10 is made of, for example, a sintered glass body. The sintered glass body may contain alumina, which can further increase the strength of the element body.

[0070] The glass sintered body is formed by stacking, for example, a plurality of insulating layers containing glass. The stacking direction of the plurality of insulating layers is the Z direction. That is, the insulating layers are in a layered form having main surfaces extending in the XY plane. Note that, in the element body 10, the interfaces between the plurality of insulating layers may not be clear due to firing or the like.

[0071] The element body 10 may be made of, for example, a glass substrate. The glass substrate may be a single-layer glass substrate, and since the majority of the element body is made of glass, losses such as eddy current losses at high frequencies can be suppressed.

[0072] (Coil 110) The coil 110 includes a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in order to form at least a part of the coil 110 wound in the direction of the axis AX.

[0073] According to the above configuration, the coil 110 is a so-called helical-shaped coil 110, so that in a cross section perpendicular to the axis AX, the area in which the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 run parallel to the winding direction of the coil 110 can be reduced, thereby reducing the stray capacitance in the coil 110.

[0074] Here, a helical shape refers to a shape in which the number of turns in the entire coil is greater than one, but the number of turns in the coil in a cross section perpendicular to the axis is less than one. "One or more turns" refers to a state in which, in a cross section perpendicular to the axis, the coil wiring has portions that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction, and "less than one turn" refers to a state in which, in a cross section perpendicular to the axis, the coil wiring does not have portions that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction.

[0075] The bottom wirings 11b extend in only one direction. Specifically, the bottom wirings 11b extend in the Y direction at a slight inclination toward the X direction. All of the bottom wirings 11b are arranged parallel to each other along the X direction. Here, if modified illumination, such as annular illumination or dipole illumination, is used in the photolithography process, the pattern resolution in a specific direction can be improved, allowing for the formation of finer patterns. According to the above configuration, the bottom wirings 11b extend in only one direction and are all arranged parallel to each other. Therefore, by using, for example, modified illumination in the photolithography process, finer bottom wirings 11b can be formed, allowing for the miniaturization of the inductor component 1.

[0076] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t extends in the Y direction. All of the top surface wirings 11t are arranged in parallel along the X direction. According to the above configuration, the top surface wirings 11t extend in only one direction and are arranged in parallel. Therefore, by using, for example, modified illumination in the photolithography process, it is possible to form fine top surface wirings 11t and reduce the size of the inductor component 1.

[0077] The bottom wiring 11b and the top wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy thereof. The bottom wiring 11b and the top wiring 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste. The bottom wiring 11b and the top wiring 11t may also have a multilayer structure in which multiple metal layers are stacked. The thickness of the bottom wiring 11b and the top wiring 11t is preferably 5 μm or more and 50 μm or less.

[0078] The first through wiring 13 is arranged on the first side surface 100s1 side with respect to the axis AX within the through hole V of the element body 10, and the second through wiring 14 is arranged on the second side surface 100s2 side with respect to the axis AX within the through hole V of the element body 10. The first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. This allows the lengths of the first through wiring 13 and the second through wiring 14 to be shortened, thereby suppressing the direct current resistance (Rdc). All of the first through wirings 13 and all of the second through wirings 14 are arranged parallel to each other along the X direction.

[0079] The first through wiring 13 and the second through wiring 14 are non-parallel when viewed from the direction of the axis AX. Specifically, the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that widens outward in the radial direction of the coil 110 toward the center in the Z direction. Furthermore, the first through wiring 13 and the second through wiring 14 each have a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 and the second through wiring 14 are each formed by stacking multiple conductor layers, the first through wiring 13 and the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.

[0080] 1, the first through wires 13 and the second through wires 14 are preferably symmetrical with respect to the axis AX when viewed from a direction perpendicular to the bottom surface 100b. This ensures symmetry of the coil 110 with respect to the axis AX, facilitating the design of the coil 110. Furthermore, it is possible to reduce the amount of through wires that enter the inner diameter of the coil 110, thereby improving the Q value.

[0081] 2, the first through wires 13 and the second through wires 14 are preferably symmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX when viewed in the direction of the axis AX. This ensures symmetry of the coil 110 with respect to the axis AX, making it easier to design the coil 110. In addition, it is possible to reduce the amount of through wires that enter the inner diameter of the coil 110, thereby improving the Q value.

[0082] Preferably, the line edge roughness (hereinafter also referred to as LER) of the first through wiring 13 is greater than the line edge roughness of the bottom wiring 11b. Specifically, the line edge roughness of the first through wiring 13 refers to the line edge roughness of the side surface of the first through wiring 13 on the inner diameter side of the coil 110 in a cross section that is orthogonal to the axis AX of the coil 110 and includes the center line 13a of the first through wiring 13. The line edge roughness of the bottom wiring 11b refers to the line edge roughness of the side surface of the bottom wiring 11b in a cross section that is orthogonal to the bottom surface 100b and includes the center line 14a of the bottom wiring 11b. This improves adhesion between the first through wiring 13 and the element body 10 due to the anchor effect.

[0083] The LER of the first through wiring 13 refers to the dimensional variation in the width of the first through wiring 13. The width of the first through wiring 13 is the dimension in a direction perpendicular to the center line 13a of the first through wiring 13 in a cross section including the center line 13a. The LER is measured in accordance with the SEMI standard (SEMI Standard P47-0307, ​​Test Method for Evaluation of Line-Edge Roughness and Line Width Roughness). In this embodiment, an SEM image (or optical image) of the first through wiring 13 is acquired at a magnification that covers at least one-third of the length of the first through wiring 13 in the extension direction, and the LER of the first through wiring 13 is calculated using image processing software WinROOF2018. Similarly, an SEM image of the bottom wiring 11b is acquired at a magnification that covers at least one-third of the length of the bottom wiring 11b in the extension direction, and the LER of the bottom wiring 11b is calculated. In this specification, unless otherwise specified, LER refers to the average value of LER calculated at three or more points in the image acquired as described above, and the three or more calculated points include at least two points whose distance between the two points is equal to or greater than half of the acquired image.

[0084] Similarly, the line edge roughness of the first through wiring 13 may be greater than the line edge roughness of the top surface wiring 11t, and the anchor effect will improve the adhesion between the first through wiring 13 and the element body 10. Similarly, the line edge roughness of the second through wiring 14 may be greater than the line edge roughness of the bottom surface wiring 11b, and the anchor effect will improve the adhesion between the second through wiring 14 and the element body 10. Similarly, the line edge roughness of the second through wiring 14 may be greater than the line edge roughness of the top surface wiring 11t, and the anchor effect will improve the adhesion between the second through wiring 14 and the element body 10.

[0085] Here, the line edge roughness of the first through wiring 13 may be equal to or smaller than the line edge roughness of the bottom wiring 11b. Since the side surfaces of the first through wiring 13 are smooth, an increase in resistance at high frequencies due to the skin effect can be suppressed, thereby improving the Q value. Similarly, the line edge roughness of the first through wiring 13 may be equal to or smaller than the line edge roughness of the top wiring 11t. Similarly, the line edge roughness of the second through wiring 14 may be equal to or smaller than the line edge roughness of the bottom wiring 11b. Since the side surfaces of the second through wiring 14 are smooth, an increase in resistance at high frequencies due to the skin effect can be suppressed, thereby improving the Q value. Similarly, the line edge roughness of the second through wiring 14 may be equal to or smaller than the line edge roughness of the top wiring 11t.

[0086] Preferably, the width of the first through wiring 13 and the width of the second through wiring 14 are different. The width of the first through wiring 13 is the equivalent circle diameter calculated from the cross-sectional area of ​​the first through wiring 13 in a cross section that includes the center in the extension direction of the first through wiring 13 and is parallel to the bottom surface 100b. The width of the second through wiring 14 is the equivalent circle diameter calculated from the cross-sectional area of ​​the second through wiring 14 in a cross section that includes the center in the extension direction of the second through wiring 14 and is parallel to the bottom surface 100b. Specifically, the first through wiring 13 is divided into three equal parts in the height direction, namely, an upper part, a middle part, and a lower part, and the average value of the equivalent circle diameters of the cross-sectional areas of the three equal parts is defined as the width. Note that the width of the first through wiring 13 and the width of the second through wiring 14 are considered to be different when there is a relative difference of 10% or more between the widths of the first through wiring 13 and the second through wiring 14.

[0087] The above configuration improves the degree of freedom in designing the first through wiring 13 and the second through wiring 14. For example, if the through wiring is made in an inclined or curved shape, the DC resistance increases, so the width of the through wiring on the side with the longer line length is increased so that the DC resistances of through wirings with different shapes and different line lengths become the same.

[0088] 4 is an enlarged view of a portion of FIG. 2. As shown in FIG. 4, the first through wiring 13 has an outer peripheral portion 131 located radially outward of the coil 110 relative to the bottom wiring 11b and the top wiring 11t, as viewed in the direction of the axis AX. The outer peripheral portion 131 is located radially outward of the coil 110 relative to a tangent line L2 that contacts an end face 11b1 of the bottom wiring 11b located in a direction parallel to the bottom face 100b and an end face 11t1 of the top wiring 11t located in a direction parallel to the bottom face 100b, as viewed in the direction of the axis AX. The outer peripheral portion 131 is located between 0.3 and 0.7 of the height Z1 of the element body 10 in a direction perpendicular to the bottom face 100b, with the bottom face 100b as the reference. The height Z1 of the element body 10 is the distance from the bottom face 100b to the top face 100t. The position of 1.0 in the height Z1 of the element body 10 corresponds to the top face 100t.

[0089] According to the above configuration, the first through wiring 13 has the outer peripheral portion 131, which makes it possible to increase the inner diameter of the coil 110 and improve the Q value. Furthermore, the outer peripheral portion 131 is disposed between 0.3 and 0.7 of the height Z1 of the element body, so that the outer peripheral portion 131 can be provided only at a portion of the height Z1 of the element body 10, thereby reducing the possibility that the first through wiring 13 will be exposed from the element body 10 when singulated.

[0090] Similarly, the second through wiring 14 has an outer peripheral portion located radially outward of the coil 110 relative to the bottom surface wiring 11b and the top surface wiring 11t when viewed from the direction of the axis AX, and the outer peripheral portion is disposed between 0.3 and 0.7 of the height Z1 of the element body 10. This makes it possible to increase the inner diameter of the coil 110 and improve the Q value, and also reduces the possibility that the second through wiring 14 will be exposed from the element body 10 during singulation.

[0091] Preferably, the first through wiring 13 is made of SiO ２ According to this, the element body 10 contains SiO ２ When the first through wiring 13 contains a material such as SiO, the linear expansion coefficient of the first through wiring 13 can be matched with the linear expansion coefficient of the element body 10, and cracks between the first through wiring 13 and the element body 10 can be suppressed. The first through wiring 13 is made of, for example, a conductive paste. The conductive material is Ag, Cu, or the like. Similarly, the second through wiring 14 is preferably made of SiO ２ Includes.

[0092] 2, the first end of the bottom wiring 11b and the first end of the top wiring 11t overlap each other when viewed from a direction perpendicular to the bottom surface 100b, and the angle θ between the bottom wiring 11b and the top wiring 11t is an acute angle. The angle θ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in FIG. 2) and the center line of the width of the top wiring 11t (the dashed line in FIG. 2) when viewed from a direction perpendicular to the bottom surface 100b.

[0093] 2, the angle θ formed between the bottom wiring 11b and the top wiring 11t connected to the same first through wiring 13 is preferably 5° or more and 45° or less when viewed from a direction perpendicular to the bottom surface 100b. The angle θ is the angle between the center line of the width of the bottom wiring 11b (the dashed line in FIG. 2) and the center line of the width of the top wiring 11t (the dashed line in FIG. 2) when viewed from a direction perpendicular to the bottom surface 100b.

[0094] According to the above configuration, the coil 110 is tightly wound, thereby improving inductance. Because the angle θ is 45° or less, the coil length is shortened, leakage magnetic flux is reduced, and the Q value is increased. The coil length refers to the distance between the outermost end portions of the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 in the axial AX direction. Because the angle θ is 5° or more, the possibility of contact between two adjacent first through wirings 13 in the axial AX direction is reduced, and the possibility of contact between two adjacent second through wirings 14 in the axial AX direction is also reduced. Note that the angle θ may be 5° or more and 45° or less for at least one pair of bottom wiring 11b and top wiring 11t among all the bottom wirings 11b and top wirings 11t.

[0095] Similarly, preferably, when viewed from a direction perpendicular to the bottom surface 100b, the angle θ formed between the bottom surface wiring 11b and the top surface wiring 11t connected to the same second through wiring 14 is 5° or more and 45° or less. This allows the coil 110 to be wound densely, thereby improving the inductance.

[0096] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through wiring 13, and the second through wiring 14 includes a void portion or a resin portion. This allows the void portion or the resin portion to absorb stress caused by the difference in linear expansion coefficient between the wiring and the element body 10, thereby alleviating the stress. As a method for forming the void portion, for example, a material that is burned away by sintering is used as the wiring material, and the void portion can be formed by sintering the wiring. As a method for forming the resin portion, for example, a conductive paste can be used as the wiring material to form the resin portion.

[0097] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t is made of SiO ２ According to this, the element body 10 contains SiO ２ When the wiring includes the element body 10, the linear expansion coefficient of the wiring can be matched to the linear expansion coefficient of the element body 10, and cracks between the wiring and the element body 10 can be suppressed.

[0098] (First external electrode 121 and second external electrode 122) The first external electrode 121 is connected to a first end of the coil 110, and the second external electrode 122 is connected to a second end of the coil 110. The first external electrode 121 is provided on the first end face 100e1 side of the center of the element body 10 in the X direction so as to be exposed from the outer surface 100 of the element body 10. The second external electrode 122 is provided on the second end face 100e2 side of the center of the element body 10 in the X direction so as to be exposed from the outer surface 100 of the element body 10.

[0099] When viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the element body 10. In other words, the first external electrode 121 and the second external electrode 122 are located inside the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, and the second side surface 100s2 of the element body 10.

[0100] According to the above configuration, the first external electrode 121 and the second external electrode 122 are not in contact with the outer surface 100 of the element body 10, and therefore, when the inductor component is singulated, the load on the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component is made smaller, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0101] The first external electrode 121 may be provided continuously on the bottom surface 100b and the first end surface 100e1. In this case, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when the inductor component 1 is mounted on a mounting board. Similarly, the second external electrode 122 may be provided continuously on the bottom surface 100b and the second end surface 100e2.

[0102] The first external electrode 121 has a bottom surface portion 121b provided on the bottom surface 100b and a via portion 121v embedded in the bottom surface 100b. The via portion 121v is connected to the bottom surface portion 121b. The via portion 121v is connected to an end of the bottom surface wiring 11b located on the first end surface 100e1 side in the direction of the axis AX.

[0103] The second external electrode 122 has a bottom surface portion 122b provided on the bottom surface 100b and a via portion 122v embedded in the bottom surface 100b. The via portion 122v is connected to the bottom surface portion 122b. The via portion 122v is connected to an end of the bottom surface wiring 11b located on the second end surface 100e2 side in the axis AX direction.

[0104] The first external electrode 121 has an underlayer 121e1 and a plating layer 121e2 covering the underlayer 121e1. The underlayer 121e1 includes a conductive material such as Ag or Cu. The plating layer 121e2 includes a conductive material such as Ni or Sn. A portion of the bottom surface portion 121b and the via portion 121v are formed from the underlayer 121e1. Another portion of the bottom surface portion 121b is formed from the plating layer 121e2. Similarly, the second external electrode 122 has an underlayer and a plating layer covering the underlayer. Note that the first external electrode 121 and the second external electrode 122 may be formed from a single layer of conductive material.

[0105] (Method of Manufacturing Inductor Component 1) Next, a method of manufacturing inductor component 1 will be described with reference to Figures 5A to 5M. Figures 5A to 5H, 5K, and 5L are views corresponding to the II-II cross section in Figure 1. Figures 5I, 5J, and 5M are views corresponding to the III-III cross section in Figure 1.

[0106] 5A, a first insulating layer 1011 is provided by printing on a base substrate 1000. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, or the like, and the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.

[0107] 5B, a second insulating layer 1012 is provided on a first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed by, for example, a photolithography process. Alternatively, the groove may be formed from the beginning as a printing pattern.

[0108] As shown in FIG. 5C , a top surface conductor layer 1011t is provided in the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, or the like. At this time, for example, the top surface conductor layer 1011t is formed as a print pattern so that it remains only in the groove 1012a. After printing the top surface conductor layer 1011t on the second insulating layer 1012, a photolithography process may be used to leave the top surface conductor layer 1011t only in the groove 1012a.

[0109] As shown in Fig. 5D, a third insulating layer 1013 is provided by printing on the second insulating layer 1012. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed in the same manner as in Fig. 5B.

[0110] As shown in Fig. 5E, a first through conductor layer 1131 of the first layer is provided in the first groove 1013a by printing, and a second through conductor layer 1141 of the first layer is provided in the second groove 1013b by printing. The first through conductor layer 1131 of the first layer and the second through conductor layer 1141 of the first layer are formed in the same manner as in Fig. 5C.

[0111] 5F , the above-described steps are repeated to provide a fourth insulating layer 1014 on the third insulating layer 1013, and a second-layer first penetrating conductor layer 1132 and a second-layer second penetrating conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third-layer first penetrating conductor layer 1133 and a third-layer second penetrating conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015. Furthermore, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a fourth-layer first penetrating conductor layer 1134 and a fourth-layer second penetrating conductor layer 1144 are provided in each of the two grooves provided in the sixth insulating layer 1016. Furthermore, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016, and a fifth first through conductor layer 1135 and a fifth second through conductor layer 1145 are provided in each of two grooves provided in the seventh insulating layer 1017.

[0112] At this time, the first through conductor layer 1131 of the first layer, the first through conductor layer 1132 of the second layer, and the first through conductor layer 1133 of the third layer are stacked in order so as to be displaced radially outward of the coil, and the first through conductor layer 1133 of the third layer, the first through conductor layer 1134 of the fourth layer, and the first through conductor layer 1135 of the fifth layer are stacked in order so as to be displaced radially inward of the coil. Similarly, the second through conductor layer 1141 of the first layer, the second through conductor layer 1142 of the second layer, and the second through conductor layer 1143 of the third layer are stacked in order so as to be displaced radially outward of the coil, and the second through conductor layer 1143 of the third layer, the second through conductor layer 1144 of the fourth layer, and the second through conductor layer 1145 of the fifth layer are stacked in order so as to be displaced radially inward of the coil.

[0113] As shown in Figure 5G, an eighth insulating layer 1018 is provided on the seventh insulating layer 1017, and a bottom conductor layer 1011b is provided in a groove provided in the eighth insulating layer 1018. The material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t. As shown in Figure 5H, a ninth insulating layer 1019 is provided on the eighth insulating layer 1018.

[0114] As shown in Fig. 5I, a groove 1019a is provided in the ninth insulating layer 1019 so as to expose a portion of the bottom conductor layer 1011b. As shown in Fig. 5J, an underlying conductor layer 1121e1 is provided on the ninth insulating layer 1019 and in the groove 1019a. The material of the underlying conductor layer 1121e1 is, for example, a resin paste made of Ag, Cu, or the like.

[0115] As shown in FIG. 5K, the entire laminate is sintered in a high-temperature furnace (e.g., 500°C or higher). The first through ninth insulating layers 1011-1019 are sintered to form the element body 10, the top conductor layer 1011t is sintered to form the top wiring 11t, the bottom conductor layer 1011b is sintered to form the bottom wiring 11b, the first through fifth through conductor layers 1131-1135 are sintered to form the first through wiring 13, the first through fifth second through conductor layers 1141-1145 are sintered to form the second through wiring 14, and the base conductor layer 1121e1 is sintered to form the base layer 121e1. Therefore, sintering the insulating layers improves strength, and sintering the conductor layers volatilizes unnecessary resin components contained in the conductor layers and fuses the conductor materials contained in the conductor layers, thereby achieving high conductivity. The base substrate 1000 may be peeled off by decomposing the surface during sintering, or may be mechanically removed by grinding or the like before or after sintering, or may be chemically removed by etching or the like before or after sintering.

[0116] As shown in Fig. 5L, the substrate is separated into individual pieces along cut lines C. As shown in Fig. 5M, a plating layer 121e2 is formed by barrel plating so as to cover the base layer 121e1, thereby forming the first external electrode 121. In this way, the inductor component 1 is manufactured as shown in Fig. 2.

[0117] 6A is a view corresponding to the cross section II-II of FIG. 1 , showing a first modified example of an inductor component. As shown in FIG. 6A , in an inductor component 1A of the first modified example, the first through wiring 13 and the second through wiring 14 are not parallel to each other when viewed from the direction of the axis AX. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, allowing the inner diameter of the coil 110 to be increased, and the Q value to be improved.

[0118] Specifically, the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that widens outward in the radial direction of the coil 110 toward the center in the Z direction.

[0119] Furthermore, the first through wiring 13 and the second through wiring 14 each have an arc shape along the Z direction. That is, the inner surface of the first through wiring 13 has a concave curved surface, and the outer surface of the first through wiring 13 has a convex curved surface. The inner surface of the second through wiring 14 has a concave curved surface, and the outer surface of the second through wiring 14 has a convex curved surface. The inner surface of each of the first through wiring 13 and the second through wiring 14 is the surface on the inner diameter side of the coil 110, and the outer surface of each of the first through wiring 13 and the second through wiring 14 is the surface on the outer diameter side of the coil 110.

[0120] According to the above configuration, the inner surfaces of the first through wiring 13 and the second through wiring 14 and the outer surfaces of the first through wiring 13 and the second through wiring 14 can be made smooth, thereby reducing DC resistance. In particular, because the inner surfaces of the first through wiring 13 and the second through wiring 14 are smooth, an increase in resistance at high frequencies due to the skin effect can be suppressed, and the Q value can be improved.

[0121] 6B is a view corresponding to the cross section II-II of FIG. 1 showing a second modified inductor component. As shown in FIG. 6B, in an inductor component 1B of the second modified example, the first through wiring 13 and the second through wiring 14 are not parallel when viewed from the direction of the axis AX. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110 to be increased, and the Q value to be improved.

[0122] Specifically, the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top surface wiring 11t in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that extends radially outward from the coil 110 as far as the top surface wiring 11t in the Z direction. In this way, the coil 110 has a trapezoidal shape when viewed in the direction of the axis AX.

[0123] According to the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly and shortened, and the direct current resistance of the first through wiring 13 and the second through wiring 14 can be reduced.

[0124] (Third Modification) Fig. 6C is a view corresponding to the cross section II-II of Fig. 1, showing a third modification of an inductor component. As shown in Fig. 6C, an inductor component 1C of the third modification includes a first coil 110A and a second coil 110B, as compared to the inductor component 1 shown in Fig. 2. The first coil 110A corresponds to the coil 110 of the inductor component 1 shown in Fig. 2.

[0125] Similar to the first coil 110A, the second coil 110B is provided on the element body 10, wound spirally along the axis AX (an example of the second axis), and connected to a third external electrode and a fourth external electrode (not shown). The third external electrode and the fourth external electrode have the same configuration as the first external electrode 121 and the second external electrode 122 of the inductor component 1 shown in FIG. 1.

[0126] Similar to the first coil 110A, the second coil 110B includes bottom wiring 11b (an example of third coil wiring), top wiring 11t (an example of fourth coil wiring), first through wiring 13 (an example of third through wiring), and second through wiring 14 (an example of fourth through wiring).

[0127] In the first coil 110A, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.

[0128] Specifically, the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1 in FIG. 2 . On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The first through wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 is formed by stacking multiple conductor layers, the first through wiring 13 can be easily formed in a stepped shape by stacking the conductor layers in a shifted manner.

[0129] In the second coil 110B, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.

[0130] Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1 in FIG. 2 . On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. That is, the second through wiring 14 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The second through wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through wiring 14 is formed by stacking multiple conductor layers, the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers in a shifted manner.

[0131] 6C , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the first through wiring 13 and the second through wiring 14 of the first coil 110A and the first through wiring 13 and the second through wiring 14 of the second coil 110B are symmetrical with respect to a center line M between the first coil 110A and the second coil 110B. When viewed from the direction of the axis AX of the first coil 110A, the center line M is a line passing through the center between the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B. Specifically, the first through wiring 13 of the first coil 110A and the second through wiring 14 of the second coil 110B are line-symmetrical with respect to the center line M, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are line-symmetrical with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.

[0132] 6C , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other. In this manner, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other, which reduces the distance between the adjacent first coil 110A and second coil 110B, thereby enabling the inductor component 1C to be made smaller.

[0133] 6C , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other. In the first coil 110A, the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX.

[0134] According to the above configuration, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, thereby reducing the distance between adjacent first and second coils 110A and 110B, and thereby enabling the inductor component 1C to be miniaturized. Furthermore, in the first coil 110A, the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX, as viewed in the axial direction. This further improves the design freedom of the first through wiring 13 and the second through wiring 14. Similarly, in the second coil 110B, the first through wiring 13 and the second through wiring 14 may be asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX, as viewed in the axial direction.

[0135] (Fourth Modification) Fig. 6D is a view showing a fourth modification of an inductor component, corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6D, in an inductor component 1D of the fourth modification, compared to the inductor component 1A shown in Fig. 6A, the coil includes a first coil 110A and a second coil 110B.

[0136] In the first coil 110A, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.

[0137] Specifically, the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1A in Fig. 6A. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The first through wiring 13 has an arc shape along the Z direction. With the above configuration, the side surface of the first through wiring 13 can be smoothed, and the DC resistance of the first through wiring 13 can be reduced.

[0138] In the second coil 110B, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.

[0139] Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1A in Fig. 6A. On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. In other words, the second through wiring 14 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The second through wiring 14 has an arc shape along the Z direction. With the above configuration, the side surface of the second through wiring 14 can be smoothed, and the DC resistance of the second through wiring 14 can be reduced.

[0140] 6D , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the first through wiring 13 and the second through wiring 14 of the first coil 110A and the first through wiring 13 and the second through wiring 14 of the second coil 110B are line-symmetric with respect to the center line M between the first coil 110A and the second coil 110B. Specifically, the first through wiring 13 of the first coil 110A and the second through wiring 14 of the second coil 110B are line-symmetric with respect to the center line M, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are line-symmetric with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.

[0141] 6D , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other. In this manner, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other, which reduces the distance between the adjacent first coil 110A and second coil 110B, thereby enabling the inductor component 1D to be made smaller.

[0142] 6D , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other. In the first coil 110A, the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX.

[0143] According to the above configuration, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, thereby reducing the distance between adjacent first and second coils 110A and 110B, and thereby enabling the inductor component 1D to be miniaturized. Furthermore, in the first coil 110A, the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX, as viewed in the direction of the axis AX. This further improves the design freedom of the first through wiring 13 and the second through wiring 14. Similarly, in the second coil 110B, the first through wiring 13 and the second through wiring 14 may be asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX, as viewed in the direction of the axis AX.

[0144] (Fifth Modification) Fig. 6E is a view showing a fifth modification of an inductor component, corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6E, inductor component 1E of the fifth modification includes a first coil 110A and a second coil 110B, as compared to inductor component 1B of the second modification shown in Fig. 6B.

[0145] In the first coil 110A, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.

[0146] Specifically, the first through wiring 13 has a configuration similar to that of the first through wiring 13 of the inductor component 1B of the second modified example. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. That is, the first through wiring 13 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.

[0147] In the second coil 110B, when viewed from the direction of the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.

[0148] Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1B of the second modified example. On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. That is, the second through wiring 14 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly, and the electrical resistance of the first through wiring 13 and the second through wiring 14 can be reduced.

[0149] 6E , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the first through wiring 13 and the second through wiring 14 of the first coil 110A and the first through wiring 13 and the second through wiring 14 of the second coil 110B are line-symmetric with respect to the center line M between the first coil 110A and the second coil 110B. Specifically, the first through wiring 13 of the first coil 110A and the second through wiring 14 of the second coil 110B are line-symmetric with respect to the center line M, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are line-symmetric with respect to the center line M. This makes it easy to obtain the first coil 110A and the second coil 110B with the same characteristics.

[0150] 6E , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other. In this manner, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other, which reduces the distance between the adjacent first coil 110A and second coil 110B, thereby enabling the inductor component 1E to be made smaller.

[0151] 6E , the axis AX of the first coil 110A and the axis AX of the second coil 110B are preferably arranged parallel to each other. When viewed from the direction of the axis AX of the first coil 110A, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are adjacent to each other, and the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged parallel to each other. In the first coil 110A, the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX.

[0152] According to the above configuration, the second through wiring 14 of the first coil 110A and the first through wiring 13 of the second coil 110B are arranged in parallel, thereby reducing the distance between adjacent first and second coils 110A and 110B, and thereby reducing the size of the inductor component 1E. Furthermore, in the first coil 110A, the first through wiring 13 and the second through wiring 14 are asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX, as viewed in the axial direction. This further improves the design freedom of the first through wiring 13 and the second through wiring 14. Similarly, in the second coil 110B, the first through wiring 13 and the second through wiring 14 may be asymmetrical with respect to a line L1 that is perpendicular to the bottom surface 100b and includes the axis AX, as viewed in the axial direction.

[0153] Second Embodiment Fig. 7 is a schematic bottom view showing a second embodiment of an inductor component, as viewed from the bottom side. Fig. 8 is a cross-sectional view taken along line VIII-VIII in Fig. 7. In Fig. 7, for convenience, the insulating layers are omitted, and the external electrodes are drawn with two-dot chain lines. Also, in Fig. 7, the element body 10 is drawn transparently to facilitate understanding of the structure. The second embodiment differs from the first embodiment mainly in the position of the coil axis, the material of the element body, and the presence of an insulating layer, and these differences will be mainly described below. The other configurations are the same as those of the first embodiment, and description thereof will be omitted.

[0154] 7 , in the inductor component 1F, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the element body 10 in the X direction. This reduces the interference of the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, thereby improving the efficiency of obtaining inductance.

[0155] The length of the coil 110 in the axial AX direction is shorter than the inner diameter of the coil 110. The length of the coil 110 in the axial AX direction is also referred to as the coil length. This allows the coil length to be short and the coil inner diameter to be large, thereby improving the Q value. The inner diameter of the coil refers to the diameter of a circle equivalent to the minimum area of ​​the region surrounded by the coil 110 when viewed through from the axial AX direction.

[0156] (Element body 10) The element body 10 is an inorganic insulator. The material of the element body 10 is preferably glass, which has high insulating properties and can suppress eddy currents, thereby increasing the Q value. The element body 10 preferably contains silicon, which increases the thermal stability of the element body 10 and therefore suppresses fluctuations in the dimensions of the element body 10 due to heat, thereby reducing variations in electrical characteristics.

[0157] The element body 10 is preferably a single-layer glass plate. This ensures the strength of the element body 10. Furthermore, the single-layer glass plate has small dielectric loss, which allows for a high Q value at high frequencies. Furthermore, since there is no sintering process as in the case of sintered bodies, deformation of the element body 10 during sintering can be suppressed, thereby suppressing pattern misalignment and providing an inductor component with a small inductance tolerance.

[0158] As a material for the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate, such as Foturan II (registered trademark of Schott AG), is preferred. In particular, the single-layer glass plate is preferably made of cerium oxide (ceria: CeO ２ In this case, cerium oxide acts as a sensitizer, making photolithographic processing easier.

[0159] However, the single-layer glass plate may be a glass plate that does not have photosensitivity, since it can be processed by mechanical processing such as drilling or sandblasting, dry / wet etching using a photoresist or metal mask, laser processing, etc. Furthermore, the single-layer glass plate may be one obtained by sintering a glass paste, or may be formed by a known method such as the float method.

[0160] 8 , the inductor component 1F has an insulator 22. The insulator 22 covers both the bottom surface 100b and the top surface 100t of the element body 10. The insulator 22 may be provided only on the bottom surface 100b out of the bottom surface 100b and the top surface 100t.

[0161] The insulator 22 is a component that covers the wiring (bottom wiring 11b, top wiring 11t) to protect the wiring from external forces, prevent damage to the wiring, and improve the insulation of the wiring. The insulator 22 is preferably an organic insulator. For example, the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form. In particular, the insulator 22 is preferably made of a material with a low dielectric constant, which can reduce the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 when the insulator 22 is present between the coil 110 and the external electrodes 121 and 122. The insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.) or by applying and thermally curing a paste-like resin. The insulator 22 may also be an inorganic film, such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulating properties and can be thinned.

[0162] Preferably, when the element body 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b. Since the organic insulator is included, the organic insulator is easily imparted with fluidity. When the wiring (bottom wiring 11b, top wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wirings, improving insulation. Furthermore, since the organic insulator does not contact the outer surface of the inorganic insulator, the load on the organic insulator can be reduced when the element body 10 is singulated into individual inductor components, and deformation or peeling of the organic insulator can be suppressed.

[0163] (Coil 110) As shown in FIG. 7, the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the X direction. All of the bottom wiring 11b are arranged parallel to the Y direction. The top wiring 11t extends in only one direction. Specifically, the top wiring 11t extends in the X direction at a slight incline toward the Y direction. All of the top wiring 11t are arranged parallel to the Y direction.

[0164] 7 and 8 , the first through wiring 13 is arranged on the first end face 100e1 side with respect to the axis AX within the through hole V of the element body 10, and the second through wiring 14 is arranged on the second end face 100e2 side with respect to the axis AX within the through hole V of the element body 10. The first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. The multiple first through wirings 13 and the multiple second through wirings 14 are each arranged in parallel along the Y direction.

[0165] The first through wiring 13 and the second through wiring 14 are non-parallel when viewed from the direction of the axis AX. Specifically, the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top surface wiring 11t in the Z direction. The first through wiring 13 and the second through wiring 14 each have a shape that extends radially outward from the coil 110 as far as the top surface wiring 11t in the Z direction. The coil 110 has a trapezoidal shape when viewed from the direction of the axis AX. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.

[0166] 9 is a partial enlarged view of FIG. 8 . As shown in FIGS. 7 , 8 , and 9 , the first through wiring 13 has a first connection surface 13y1 connected to the bottom surface wiring 11b and a second connection surface 13y2 connected to the top surface wiring 11t. The first external electrode 121 is provided on the bottom surface 100b side, and when viewed from a direction perpendicular to the bottom surface 100b, the first external electrode 121 overlaps at least a portion of the first connection surface 13y1. When viewed from the axis AX direction, the inclination angle α on the axis AX side between a straight line L3 connecting the center of the first connection surface 13y1 and the center of the second connection surface 13y2 and the connection surface 11t2 connected to the first through wiring 13 of the top surface wiring 11t is greater than or equal to 60° and less than 90°.

[0167] According to the above configuration, since the inclination angle α is less than 90°, it is possible to reduce the area of ​​the bottom wiring 11b that overlaps with the first external electrode 121 when viewed from a direction perpendicular to the bottom surface 100b. This reduces the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b, thereby increasing the self-resonant frequency. Furthermore, since the inclination angle α is 60° or more, it is possible to ensure the inner diameter of the coil 110 and thereby ensure the Q value.

[0168] Similarly, the second through wiring 14 has a first connection surface 14y1 connected to the bottom surface wiring 11b and a second connection surface 14y2 connected to the top surface wiring 11t. The second external electrode 122 is provided on the bottom surface 100b side, and may overlap at least a portion of the first connection surface 14y1 when viewed from a direction perpendicular to the bottom surface 100b. In this case, when viewed from the axis AX direction, the inclination angle β on the axis AX side formed by a line L4 connecting the center of the first connection surface 14y1 and the center of the second connection surface 14y2 and a connection surface 11t3 connected to the second through wiring 14 of the top surface wiring 11t may be greater than or equal to 60° and less than 90°.

[0169] With the above configuration, since the inclination angle β is less than 90°, the area of ​​the bottom wiring 11b that overlaps with the second external electrode 122 when viewed from a direction perpendicular to the bottom surface 100b can be reduced. This reduces the parasitic capacitance between the second external electrode 122 and the bottom wiring 11b, thereby increasing the self-resonant frequency. Furthermore, since the inclination angle β is 60° or more, the inner diameter of the coil 110 can be secured to ensure a sufficient Q value.

[0170] 7, in the first through wiring 13, a portion of the first connection surface 13y1 and a portion of the second connection surface 13y2 overlap when viewed from a direction perpendicular to the bottom surface 100b. This facilitates the formation of the seed layer when a through hole V is formed in the element body 10, a seed layer is provided on the inner surface of the through hole V, and the first through wiring 13 is formed on the seed layer by electrolytic plating. Similarly, in the second through wiring 14, a portion of the first connection surface 14y1 and a portion of the second connection surface 14y2 may overlap when viewed from a direction perpendicular to the bottom surface 100b.

[0171] 7 , in the first through wiring 13, the center of the first connection surface 13y1 is preferably closer to the axis AX than the center of the second connection surface 13y2 when viewed perpendicular to the bottom surface 100b. As a result, when viewed perpendicular to the bottom surface 100b, the first connection surface 13y1 is positioned more inward of the coil 110 than the second connection surface 13y2. This reduces the area of ​​the bottom wiring 11b that overlaps with the first external electrode 121 when viewed perpendicular to the bottom surface 100b, thereby reducing the parasitic capacitance between the first external electrode 121 and the bottom wiring 11b and increasing the self-resonant frequency. Similarly, in the second through wiring 14, the center of the first connection surface 14y1 may be closer to the axis AX than the center of the second connection surface 14y2 when viewed perpendicular to the bottom surface 100b.

[0172] (Method of Manufacturing Inductor Component 1F) Next, a method of manufacturing the inductor component 1F will be described with reference to Figures 10A to 10H, which are cross-sectional views taken along the line VIII-VIII in Figure 7.

[0173] 10A, a copper foil 2001 is provided by printing on a base substrate 2000. The material of the base substrate 2000 is the same as that of the base substrate 1000 of the first embodiment.

[0174] As shown in FIG. 10B , a glass substrate 2010, which will become the element body 10, is provided on a base substrate 2000. For example, the base substrate 2000 and the glass substrate 2010 are tightly attached to each other using a jig such as conductive tape, pins, or a frame. The glass substrate 2010 has a first through hole V1 and a second through hole V2. The first through hole V1 and the second through hole V2 are non-parallel. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate in which through holes are formed in advance using a laser, photolithography, or the like. The glass substrate 2010 may be, for example, a TSV (Through Silicon Via) substrate, or may be something else. Furthermore, Ti / Cu or other necessary conductive materials may be deposited in advance as seeds on the surface of the glass substrate 2010 by sputtering or the like.

[0175] As shown in FIG. 10C , a first through conductor layer 2013, which will become the first through wiring 13, is formed in the first through hole V1. A second through conductor layer, which will become the second through wiring 14, is formed in the second through hole V2. Specifically, by supplying power from the copper foil 2001 on the base substrate 2000, electrolytic plating is performed in the first through hole V1 to form the first through conductor layer 2013, and electrolytic plating is performed in the second through hole V2 to form the second through conductor layer 2014. Alternatively, a seed layer may be formed on the surface of the glass substrate 2010 or the inner surfaces of the through holes V1 and V2 by sputtering or the like, and the through conductor layer may be formed using known methods such as fill plating, conformal plating, or a printing and filling method of a conductive paste. If there is unnecessary plating growth on the surface of the glass substrate 2010, the unnecessary portions may be removed by polishing, CMP, wet etching (etch-back), or dry etching.

[0176] 10D, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 may be removed mechanically by grinding or the like, or may be removed chemically by etching or the like.

[0177] As shown in FIG. 10E , a bottom conductor layer 2011b that will become the bottom wiring 11b and a top conductor layer 2011t that will become the top wiring 11t are formed on a glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed by electrolytic plating on the seed layer in the openings of the photoresist. The photoresist and seed layer are then removed by wet etching or dry etching. This results in the formation of a bottom conductor layer 2011b and a top conductor layer 2011t that are patterned into any desired shape. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously.

[0178] 10F , insulating layers 2022 that will become insulators 22 are provided on the top and bottom surfaces of glass substrate 2010 so as to cover the conductor layers. At this time, the bottom-side insulating layer 2022 and the top-side insulating layer 2022 may be formed one at a time, or both may be formed simultaneously. Then, holes 2022a are formed on bottom-side conductor layer 2011b of bottom-side insulating layer 2022 using photolithography or laser processing.

[0179] As shown in FIG. 10G , a first external electrode conductor layer 2121, which will become the first external electrode 121, is provided on the bottom insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b. Specifically, a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and a Ni and Au plating layer is formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the openings of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned into an arbitrary shape. Alternatively, a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the openings of the photoresist is removed by wet etching or dry etching. A Ni and Au plating layer may be formed on the remaining seed layer by electroless plating. Similarly, a second external electrode conductor layer 2122 that will become the second external electrode 122 is provided on the insulating layer 2022 on the bottom surface side.

[0180] As shown in Fig. 10H, the substrate is separated into individual pieces along the cutting lines C. In this way, the inductor component 1F is manufactured as shown in Fig. 8.

[0181] 2. Modifications (First Modification) FIG. 11A is a view corresponding to a portion of the cross section VIII-VIII of FIG. 7 , illustrating a first modification of an inductor component. As shown in FIG. 11A , in an inductor component 1G of the first modification, the cross-sectional area of ​​each of end portions 13e in the extension direction of the first through wiring 13 is larger than the cross-sectional area of ​​a central portion 13m in the extension direction of the first through wiring 13. The cross-sectional area of ​​the first through wiring 13 is the area of ​​a cross section in a direction perpendicular to the bottom surface 100b of the first through wiring 13. In a cross section along the extension direction of the first through wiring 13, the width of the first through wiring 13 in the direction perpendicular to the bottom surface 100b continuously increases from the central portion 13m toward the end portions 13e.

[0182] This allows the cross-sectional area of ​​the end 13e of the first through wiring 13 to be increased, thereby improving the connectivity between the first through wiring 13 and at least one of the bottom wiring 11b and the top wiring 11t. Furthermore, when forming a through hole V as a hole portion in the element body 10 and filling the through hole V with a conductive material by filling plating or the like to form the first through wiring 13 in the through hole V, it is easy to fill the conductive material on the opening side of the through hole V. Furthermore, since the cross-sectional area of ​​the end 13e of the first through wiring 13 is large and the cross-sectional area of ​​the central portion 13m of the first through wiring 13 is small, the first through wiring 13 is easy to form.

[0183] It is sufficient that the cross-sectional area of ​​one end 13e of the first through wiring 13 is larger than the cross-sectional area of ​​the central portion 13m of the first through wiring 13. Similarly, the cross-sectional area of ​​at least one end of the second through wiring 14 may be larger than the cross-sectional area of ​​the central portion 13m of the first through wiring 13.

[0184] (Second Modification) Figure 11B is a diagram corresponding to a portion of the cross section VIII-VIII of Figure 7, showing a second modification of an inductor component. As shown in Figure 11B, in an inductor component 1H of the second modification, the first through wiring 13 has a conductive layer 13s located on the outer periphery when viewed from the direction in which the first through wiring 13 extends, and a non-conductive layer 13u located inside the conductive layer 13s. When used in a high frequency band, current flows mainly through the surface of the first through wiring 13 due to the skin effect, so providing the conductive layer 13s on the outer periphery does not reduce the Q value. Furthermore, providing the non-conductive layer 13u on the inner side can alleviate stress and reduce manufacturing costs by not using a conductor.

[0185] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through hole V of the element body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electrolytic plating. In this manner, multiple conductive layers 13s, such as Ti / Cu / electrolytic Cu or Pd / electroless Cu / electrolytic Cu, can be formed on the outer periphery of the first through wiring 13. The inside of the conductive layer 13s is then sealed with resin by printing, heat pressing, or the like, to form the non-conductive layer 13u made of resin. In this manner, current can flow through the surface (conductive layer 13s) of the first through wiring 13, while stress can be alleviated by the non-conductive layer 13u inside the first through wiring 13.

[0186] Similarly, the second through wiring 14 may have a conductive layer located on the outer periphery when viewed from the direction in which the second through wiring 14 extends, and a non-conductive layer located inside the conductive layer. Note that the cross-sectional area of ​​each of the two end portions in the extension direction of the first through wiring 13 is larger than the cross-sectional area of ​​the central portion in the extension direction of the first through wiring 13, but the cross-sectional area of ​​each of the two end portions in the extension direction of the first through wiring 13 may be the same as the cross-sectional area of ​​the central portion in the extension direction of the first through wiring 13.

[0187] The present disclosure is not limited to the above-described embodiments, and design modifications are possible within the scope of the present disclosure. For example, the respective features of the first and second embodiments may be combined in various ways.

[0188] The present disclosure includes the following aspects. <1> An element body including a first main surface and a second main surface opposing each other; a coil provided on the element body and wound spirally along an axis; and a first external electrode and a second external electrode provided on the element body and electrically connected to the coil, wherein the axis of the coil is arranged parallel to the first main surface, and the coil includes: a plurality of first coil wirings provided on the first main surface side of the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side of the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wires extending from the first coil wiring toward the second coil wiring and provided on the opposite side of the axis to the first through wires and arranged along the axis, and the first coil wiring, the first through wire, the second coil wiring, and the second through wire are connected in this order to form at least a part of the spiral shape, An inductor component, wherein the first through wiring and the second through wiring are non-parallel when viewed in the axial direction. <2> The inductor component according to <1>, wherein the first through wiring and the second through wiring are line-symmetric with respect to the axis when viewed in a direction perpendicular to the first main surface. <3> The inductor component according to <1> or <2>, wherein the first through wiring and the second through wiring are line-symmetric with respect to a line that is perpendicular to the first main surface and includes the axis when viewed in the axial direction. <4> The inductor component according to any one of <1> to <3>, wherein the line edge roughness of the first through wiring is larger than the line edge roughness of the first coil wiring. <5> The inductor component according to any one of <1> to <3>, wherein the line edge roughness of the first through wiring is equal to or smaller than the line edge roughness of the first coil wiring. <6> The inductor component according to <1>, wherein the width of the first through wiring and the width of the second through wiring are different.<7> The inductor component according to any one of <1> to <6>, wherein the first through wiring has an outer peripheral portion located radially outward of the coil than the first coil wiring and the second coil wiring when viewed from the axial direction, and the outer peripheral portion is arranged between 0.3 and 0.7 of a height of the element body in a direction perpendicular to the first main surface, with the first main surface as a reference. <8> The element further comprises: a second coil provided on the element body and wound in a spiral shape along a second axis parallel to the axis; and a third external electrode and a fourth external electrode provided on the element body and electrically connected to the second coil, wherein the second coil includes: a plurality of third coil wirings provided on the first main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the first main surface; a plurality of fourth coil wirings provided on the second main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the second main surface; a plurality of third through wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis; and a plurality of fourth through wirings extending from the third coil wiring toward the fourth coil wiring and provided on the opposite side of the third through wiring with respect to the second axis and arranged along the second axis, wherein the third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in this order to form at least a part of the spiral shape of the second coil, The inductor component according to any one of <1> to <7>, wherein the second through wiring and the third through wiring are adjacent to each other. <9> The inductor component according to <8>, wherein, when viewed in the axial direction of the coil, the first through wiring and the second through wiring and the third through wiring and the fourth through wiring are line-symmetric with respect to a center line between the coil and the second coil. <10> The inductor component according to <8> or <9>, when viewed in the axial direction of the coil, the second through wiring and the third through wiring are arranged in parallel. <11> The inductor component according to <9>, wherein, when viewed in the axial direction, the first through wiring and the second through wiring are asymmetric with respect to a line that is orthogonal to the first main surface and includes the axis.<12> The inductor component according to <8>, wherein the third through wiring and the fourth through wiring are non-parallel when viewed from the second axial direction. <13> The inductor component according to any one of <1> to <12>, wherein the first through wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring, the first external electrode is provided on the first main surface side and overlaps at least a portion of the first connection surface when viewed from a direction perpendicular to the first main surface, and an inclination angle of the axis side formed by a straight line connecting a center of the first connection surface and a center of the second connection surface and a connection surface of the second coil wiring connected to the first through wiring is 60° or more and less than 90° when viewed from the axial direction. <14> The inductor component according to <13>, wherein a portion of the first connection surface and a portion of the second connection surface overlap when viewed from a direction perpendicular to the first main surface. <15> The inductor component according to <13> or <14>, wherein, as viewed in a direction orthogonal to the first main surface, a center of the first connecting surface is closer to the axis than a center of the second connecting surface. <16> The inductor component according to any one of <1> to <15>, wherein the first through wiring has a conductive layer located on the outer periphery as viewed in the direction in which the first through wiring extends, and a non-conductive layer located inside the conductive layer. <17> The inductor component according to any one of <1> to <16>, wherein a cross-sectional area of ​​at least one of both end portions in the extension direction of the first through wiring is larger than a cross-sectional area of ​​a central portion in the extension direction of the first through wiring. <18> The inductor component according to any one of <1> to <17>, wherein a thickness of the inductor component is 200 μm or less. <19> The inductor component according to any one of <1> to <18>, wherein, as viewed in a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside the outer periphery of the element body. <20> The inductor component according to any one of <1> to <19>, further comprising an organic insulator provided on the first main surface, wherein the element body is an inorganic insulator, and the organic insulator is located inside an outer surface of the inorganic insulator when viewed in a direction perpendicular to the first main surface.

[0189] 1, 1A-1H Inductor component 10 Body 11b Bottom wiring (first coil wiring) 11b1 End surface 11t Top wiring (second coil wiring) 11t1 End surface 11t2 Connection surface 11t3 Connection surface 13 First through wiring 131 Outer peripheral portion 13a Center line 13e End portion 13m Central portion 13s Conductive layer 13u Non-conductive layer 13y1 First connection surface 13y2 Second connection surface 14 Second through wiring 14a Center line 14y1 First connection surface 14y2 Second connection surface 22 Insulator 100b Bottom surface (first main surface) 100t Top surface (second main surface) 110, 110A, 110B Coil 121 First external electrode 121b Bottom portion 121v Via portion 121e1 Underlayer 121e2 Plating layer 122 Second external electrode 122b Bottom portion 122v Via portion AX Axis L1, L2, L4 Straight line L3 Tangent line M Center line V Through hole Z1 Height θ Angle between bottom surface wiring and top surface wiring α, β Tilt angle

Claims

1. A base body including a first main surface and a second main surface facing each other, a coil provided on the base body and wound spirally along an axis, a first external electrode and a second external electrode provided on the base body and electrically connected to the coil and comprising: the axis of the coil is arranged parallel to the first main surface, the coil includes a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis and comprising: the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape, the first through wiring and the second through wiring are non-parallel when viewed from the axial direction along the axis, and the widths of the first through wiring and the second through wiring are different, an inductor component.

2. A base body including a first main surface and a second main surface facing each other, a coil provided on the base body and wound spirally along an axis, a first external electrode and a second external electrode provided on the base body and electrically connected to the coil and comprising: the axis of the coil is arranged parallel to the first main surface, the coil includes a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis and comprising: The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape. The first through wiring and the second through wiring are non-parallel when viewed from the axial direction along the axis. The first through wiring has an outer peripheral portion located on the outer side in the radial direction of the coil than the first coil wiring and the second coil wiring when viewed from the axial direction. The outer peripheral portion is disposed between 0.3 and 0.7 of the height in the direction perpendicular to the first main surface of the element body with reference to the first main surface, an inductor component.

3. An element body including a first main surface and a second main surface facing each other, A coil provided on the element body and wound spirally along an axis, A first external electrode and a second external electrode provided on the element body and electrically connected to the coil Comprising, The axis of the coil is disposed parallel to the first main surface, The coil is, A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, A plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, A plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis Including, The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape. The first through wiring and the second through wiring are non-parallel when viewed from the axial direction along the axis. A second coil provided on the element body and wound spirally along a second axis parallel to the axis, A third external electrode and a fourth external electrode provided on the element body and electrically connected to the second coil Further comprising, The second coil is, A plurality of third coil wirings provided on the first main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the first main surface, A plurality of fourth coil wirings provided on the second main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the second main surface, A plurality of third through wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis; A plurality of fourth through wirings extending from the third coil wiring toward the fourth coil wiring, provided on the side opposite to the third through wiring with respect to the second axis, and arranged along the second axis; comprising; The third coil wiring, the third through wiring, the fourth coil wiring, and the fourth through wiring are connected in this order to constitute at least a part of the spiral shape of the second coil; The second through wiring and the third through wiring are adjacent to each other; An inductor component in which the second through wiring and the third through wiring are arranged in parallel when viewed from the axial direction of the coil.

4. A base body including a first main surface and a second main surface facing each other; A coil provided on the base body and wound spirally along an axis; A first external electrode and a second external electrode provided on the base body and electrically connected to the coil; comprising; The axis of the coil is arranged parallel to the first main surface; The coil is; A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface; A plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; A plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; A plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the side opposite to the first through wiring with respect to the axis, and arranged along the axis; comprising; The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of the spiral shape; The first through wiring and the second through wiring are non-parallel when viewed from the axial direction along the axis; The first through wiring has a conductive layer located on the outer peripheral side when viewed from the extending direction of the first through wiring and a non-conductive layer located inside the conductive layer. An inductor component.

5. The inductor component according to any one of claims 1 to 4, wherein the first through wiring and the second through wiring are line-symmetric with respect to the axis when viewed from a direction perpendicular to the first main surface.

6. The first through-wiring and the second through-wiring are line-symmetric with respect to a straight line that is orthogonal to the first main surface and includes the axis, when viewed from the axial direction, the inductor component according to any one of claims 1 to 4.

7. The line edge roughness of the first through-wiring is greater than the line edge roughness of the first coil wiring, the inductor component according to any one of claims 1 to 4.

8. The line edge roughness of the first through-wiring is the same as or smaller than the line edge roughness of the first coil wiring, the inductor component according to any one of claims 1 to 4.

9. When viewed from the axial direction of the coil, the first through-wiring and the second through-wiring and the third through-wiring and the fourth through-wiring are line-symmetric with respect to the center line between the coil and the second coil, the inductor component according to claim 3.

10. The first through-wiring and the second through-wiring are non-line-symmetric with respect to a straight line that is orthogonal to the first main surface and includes the axis, when viewed from the axial direction, the inductor component according to claim 9.

11. The third through-wiring and the fourth through-wiring are non-parallel, when viewed from the second axial direction, the inductor component according to claim 3.

12. The first through-wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring, The first external electrode is provided on the first main surface side and overlaps at least a part of the first connection surface, when viewed from a direction orthogonal to the first main surface, When viewed from the axial direction, the inclination angle on the axis side formed by the straight line connecting the center of the first connection surface and the center of the second connection surface and the connection surface of the second coil wiring connected to the first through-wiring is 60° or more and less than 90°, the inductor component according to any one of claims 1 to 4.

13. When viewed from a direction orthogonal to the first main surface, a part of the first connection surface and a part of the second connection surface overlap, the inductor component according to claim 12.

14. When viewed from a direction orthogonal to the first main surface, the center of the first connection surface is closer to the axis than the center of the second connection surface, the inductor component according to claim 12.

15. The cross-sectional area of at least one of both ends in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring, the inductor component according to any one of claims 1 to 4.

16. The thickness of the inductor component is 200 μm or less. The inductor component according to any one of claims 1 to 4.

17. When viewed from a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside the outer peripheral surface of the element body. The inductor component according to any one of claims 1 to 4.

18. Furthermore, an organic insulator provided on the first main surface is provided. The element body is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction orthogonal to the first main surface. The inductor component according to any one of claims 1 to 4.

19. The first through-wiring has an outer peripheral portion located outside the coil in the radial direction of the coil, when viewed from the axial direction, relative to the first coil wiring and the second coil wiring. The outer peripheral portion is disposed between 0.3 and 0.7 of the height in the direction orthogonal to the first main surface of the element body with respect to the first main surface. The inductor component according to claim 1.

20. A second coil provided on the element body and wound spirally along a second axis parallel to the axis. A third external electrode and a fourth external electrode provided on the element body and electrically connected to the second coil. Further comprising: The second coil A plurality of third coil wirings provided on the first main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the first main surface. A plurality of fourth coil wirings provided on the second main surface side with respect to the second axis and arranged along the second axis on a plane parallel to the second main surface. A plurality of third through-wirings extending from the third coil wiring toward the fourth coil wiring and arranged along the second axis. A plurality of fourth through-wirings extending from the third coil wiring toward the fourth coil wiring and provided on the side opposite to the third through-wiring with respect to the second axis and arranged along the second axis. Including: The third coil wiring, the third through-wiring, the fourth coil wiring, and the fourth through-wiring are connected in this order to constitute at least a part of the spiral shape of the second coil. The second through-wiring and the third through-wiring are adjacent to each other. When viewed from the axial direction of the coil, the second through-wiring and the third through-wiring are arranged in parallel. The inductor component according to claim 1 or 2.

21. The first through-wiring has a conductive layer located on the outer peripheral side when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer. The inductor component according to any one of Claims 1 to 3.

22. A body including a first main surface and a second main surface facing each other, A coil provided on the body and wound spirally along an axis, A first external electrode and a second external electrode provided on the body and electrically connected to the coil are provided, The axis of the coil is arranged parallel to the first main surface, The coil is A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, A plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, A plurality of first through-wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, A plurality of second through-wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through-wiring with respect to the axis and arranged along the axis are included, The first coil wiring, the first through-wiring, the second coil wiring, and the second through-wiring are connected in this order to constitute at least a part of the spiral shape, The first through-wiring and the second through-wiring are non-parallel when viewed from the axial direction along the axis, The first through-wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring, The first through-wiring includes a portion located outside the diameter of the coil more than the first connection surface and the second connection surface when viewed from the axial direction. The inductor component.

23. A body including a first main surface and a second main surface facing each other, A coil provided on the body and wound spirally along an axis, A first external electrode and a second external electrode provided on the body and electrically connected to the coil are provided, The axis of the coil is arranged parallel to the first main surface, The coil is A plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, A plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, A plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; A plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the side opposite to the first through wiring with respect to the axis, and arranged along the axis; comprising; The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape; The first through wiring and the second through wiring are non-parallel when viewed from the axial direction along the axis; The first through wiring has a first connection surface connected to the first coil wiring and a second connection surface connected to the second coil wiring; When viewed from the axial direction, the center of the second connection surface is located on the outer side in the radial direction of the coil than the center of the first connection surface; The first through wiring is an inductor component including a portion located on the outer side in the radial direction of the coil than the first connection surface when viewed from the axial direction.