Inductor component

Abstract

Provided is an inductor component capable of increasing the efficiency of acquisition of inductance. An inductor component according to the present invention is provided with: an element including a first main surface and a second main surface that oppose each other; a coil, at least portion of which is provided inside the element, and that is wound in a spiral along a shaft; and a first external electrode and a second external electrode that are electrically connected to the coil. The coil shaft is disposed parallel to the first main surface. The coil includes: a plurality of first coil wires that are provided on the first main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the first main surface; a plurality of second coil wires that are provided on the second main surface side with respect to the shaft and are arranged along the shaft on a plane parallel to the second main surface; a plurality of first through wires that are arranged along the shaft and extend from the first coil wires toward the second coil wires; and a plurality of second through wires that are arranged along the shaft, extend from the first coil wires toward the second coil wires, and are provided on the side opposite the first through wires with respect to the shaft. The first coil wires, first through wires, second coil wires, the second through wires are connected in the stated order to constitute at least a portion of a spiral shape. The plurality of first coil wires include a terminal coil wire located at the terminal on one side in the shaft direction. The terminal coil wire has a top surface located on a first direction side from the second main surface side towards the first main surface side, and a first side surface and a second side surface located on either side sandwiching a central line along the extension direction of the terminal coil wire. The first external electrode includes a first section that is in contact with at least of portion of the first side surface, a second section that is in contact with at least of portion of the top surface, and a third section that is in contact with at least of portion of the second side surface. The first section, second section, and third section are continuous in the stated order and constitute a protruding section that protrudes toward the first direction side.

Description

Inductor Components

[0001] The present disclosure relates to inductor components.

[0002] A conventional inductor component is described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has an element body, a coil provided within the element body and wound along the axial direction, and a first external electrode and a second external electrode provided on the element body and electrically connected to the coil.

[0003] The coil has multiple coil patterns stacked along the axis. Adjacent coil patterns in the axial direction are connected via conductive vias. The coil pattern has wiring portions extending in a direction perpendicular to the axis and pad portions provided at the ends of the wiring portions and connecting to the conductive vias. The width of the pad portions is wider than the width of the wiring portions to improve connectivity between the pad portions and the conductive vias.

[0004] Patent No. 6652280

[0005] However, in the conventional inductor components described above, the width of the pad portion is wider than the width of the wiring portion, so part of the pad portion is located radially inward of the wiring portion of the coil, which reduces the inner diameter of the coil and does not necessarily result in a high efficiency of obtaining inductance.

[0006] Therefore, an object of the present disclosure is to provide an inductor component that can increase the efficiency with which inductance can be obtained.

[0007] In order to solve the above-mentioned problems, an inductor component according to one aspect of the present disclosure comprises: an element body including a first main surface and a second main surface opposing each other; a coil at least a portion of which is provided inside the element body and wound spirally along an axis; and a first external electrode and a second external electrode which are provided outside the element body and electrically connected to the coil, the axis of the coil being arranged parallel to the first main surface, and the coil including: a plurality of first coil wirings which are provided on the first main surface side of the axis and arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings which are provided on the second main surface side of the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wires which extend from the first coil wiring towards the second coil wiring and are arranged along the axis; and a plurality of second through wires which extend from the first coil wiring towards the second coil wiring and are provided on the opposite side of the axis to the first through wires and arranged along the axis. The first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral shape, the multiple first coil wirings include an endmost coil wiring located at the end on one side of the axial direction, the endmost coil wiring having an upper surface located on a first direction side from the second main surface side toward the first main surface side, and a first side surface and a second side surface located on both sides of a center line along the extension direction of the endmost coil wiring when viewed from a direction perpendicular to the first main surface, the first external electrode including a first portion in contact with at least a part of the first side surface, a second portion in contact with at least a part of the upper surface, and a third portion in contact with at least a part of the second side surface, the first portion, the second portion, and the third portion being successive in this order to form a convex portion protruding in the first direction side.

[0008] According to the above aspect, the coil includes a first coil wiring, a first through-hole wiring, a second coil wiring, and a second through-hole wiring. The first coil wiring, the first through-hole wiring, the second coil wiring, and the second through-hole wiring are connected in this order to form at least a portion of a spiral shape. This allows the inner diameter of the coil to be increased, thereby improving inductance acquisition efficiency. Furthermore, increasing the inductance acquisition efficiency increases the Q value. Furthermore, because the first external electrode has a protrusion protruding in the first direction, its surface area is increased compared to a flat electrode without a protrusion, thereby improving the bonding strength with a connecting member such as solder. Furthermore, the protrusion of the first external electrode is in contact with the endmost coil wiring, directly connecting the first external electrode and the endmost coil wiring. This allows for a lower DC resistance (Rdc) than when the first external electrode and the endmost coil wiring are connected using, for example, via wiring.

[0009] Preferably, in one embodiment of the inductor component, the thickness of the first external electrode is thinner than the thickness of the first coil wiring.

[0010] According to the embodiment, the thickness of the inductor component can be reduced.

[0011] Preferably, in one embodiment of the inductor component, the element body is made of SiO ２ Includes.

[0012] According to the embodiment, the element body can be provided with insulation properties and rigidity.

[0013] Preferably, in one embodiment of the inductor component, the first external electrode is made up of a plurality of conductive layers, including a conductive layer made of a material different from that of the conductive layer that constitutes the endmost coil wiring.

[0014] According to the embodiment, it is possible to impart characteristics different from those of the outermost coil wiring to the first outer electrode.

[0015] Preferably, in one embodiment of the inductor component, the first external electrode further includes a bottom portion that is provided continuously from the first portion of the convex portion on the side opposite the second portion and that extends in a direction parallel to the first main surface, and a wall portion that is provided continuously from the bottom portion and that extends in the first direction.

[0016] According to the embodiment, the surface area of ​​the first external electrode is further increased, and the strength of the bond with a connecting member such as solder can be further improved.

[0017] Preferably, in one embodiment of the inductor component, the first external electrode further includes a fourth portion spaced apart from the second portion and positioned closer to the first direction than the second portion.

[0018] According to the above embodiment, since the fourth portion is further included, which is located on the first direction side of the second portion, the surface area of ​​the first external electrode is further increased, and the bonding strength with a connecting member such as solder can be further improved.

[0019] Preferably, in one embodiment of the inductor component, the first main surface has a recess, the recess has a stepped side surface, and at least a portion of the first external electrode is in contact with the side surface and shaped to conform to the side surface.

[0020] According to the embodiment, the surface area of ​​the first external electrode is further increased, and the strength of the bond with a connecting member such as solder can be further improved.

[0021] Preferably, in one embodiment of the inductor component, the inductor component further comprises an insulator provided on a portion of the first main surface, and at least a portion of the first external electrode is in continuous contact with the insulator, the first main surface, and the first side surface of the convex portion.

[0022] According to the embodiment, the first external electrode can be provided with an uneven shape, which further improves the strength of adhesion to a connecting member such as solder.

[0023] Preferably, in one embodiment of the inductor component, the first coil wiring is provided on the first main surface, and further includes an insulator covering the first coil wiring and shaped to conform to the shape of the first coil wiring, and at least a portion of the first external electrode is in contact with the insulator and shaped to conform to the shape of the first coil wiring.

[0024] According to the above embodiment, at least a portion of the first external electrode is shaped to conform to the shape of the first coil wiring, thereby further increasing the surface area of ​​the first external electrode and further improving the bonding strength with a connecting member such as solder.

[0025] Preferably, in one embodiment of the inductor component, the inductor component further comprises an organic insulator provided on the first main surface, the element body being an inorganic insulator, and the organic insulator being located inside the outer surface of the inorganic insulator when viewed in a direction perpendicular to the first main surface.

[0026] According to the embodiment, since the organic insulator is included, the organic insulator is easily imparted with fluidity, and when the first coil wiring is covered with the organic insulator, the organic insulator can be easily filled between adjacent first coil wirings, thereby improving insulation. Furthermore, since the organic insulator is not in contact with the outer surface of the inorganic insulator, the load on the organic insulator can be reduced when singulating into individual inductor components, and deformation and peeling of the organic insulator can be suppressed.

[0027] Preferably, in one embodiment of the inductor component, the first through wire and the second through wire are not parallel to each other when viewed in a direction parallel to the axis.

[0028] According to the embodiment, the distance between the first through wire and the second through wire can be increased, the inner diameter of the coil can be increased, and the Q value can be increased.

[0029] Preferably, in one embodiment of the inductor component, the element body is made of SiO ２ The first through-hole wiring is made of SiO ２ Includes.

[0030] According to the embodiment, the linear expansion coefficient of the first through wiring can be matched to the linear expansion coefficient of the element body, and cracks between the first through wiring and the element body can be suppressed.

[0031] Preferably, in one embodiment of the inductor component, the first through wiring includes a void portion or a resin portion.

[0032] According to the embodiment, the stress caused by the difference in the linear expansion coefficient between the first through wiring and the element body can be absorbed by the gap or the resin portion, thereby alleviating the stress.

[0033] Preferably, in one embodiment of the inductor component, the first through wiring has a conductive layer located on the outer periphery when viewed in the direction in which the first through wiring extends, and a non-conductive layer located inside the conductive layer.

[0034] According to the embodiment, when used in a high frequency band, current mainly flows through the surface of the first through wiring due to the skin effect, so providing a conductive layer on the outer periphery does not reduce the Q value. Furthermore, providing a non-conductive layer on the inner side can relieve stress, and manufacturing costs can be reduced by not using a conductor.

[0035] Preferably, in one embodiment of the inductor component, the axial length of the coil is shorter than the inner diameter of the coil.

[0036] According to the embodiment, the coil length is short and the coil inner diameter is large, so that the Q value can be increased.

[0037] Preferably, in one embodiment of the inductor component, the first through wiring extends in a direction perpendicular to the first main surface, and the cross-sectional area of ​​at least one of the two end portions of the first through wiring in the extension direction is larger than the cross-sectional area of ​​the central portion of the first through wiring in the extension direction.

[0038] According to the above embodiment, the cross-sectional area of ​​the end of the first through wiring can be increased, thereby improving the connectivity between the first through wiring and at least one of the first coil wiring and the second coil wiring. Furthermore, when forming a hole in the element body and filling the hole with a conductive material by filling plating or the like to form the first through wiring in the hole of the element body, the conductive material can be easily filled in the opening side of the hole. Furthermore, since the cross-sectional area of ​​the end of the first through wiring is large and the cross-sectional area of ​​the central portion of the first through wiring is small, the first through wiring is easily formed.

[0039] Preferably, in one embodiment of the inductor component, the coil component has a thickness of 200 μm or less.

[0040] According to the embodiment, the inductor component can be made thinner.

[0041] Preferably, in one embodiment of the inductor component, the first external electrode and the second external electrode are located inside an outer surface of the element body when viewed in a direction perpendicular to the first main surface.

[0042] According to the embodiment, the first and second external electrodes are not in contact with the outer surfaces of the element body, so that when the element body is singulated into individual inductor components, the load on the first and second external electrodes can be reduced and deformation or peeling of the first and second external electrodes can be suppressed, thereby preventing deformation or peeling of the first and second external electrodes even when the inductor component is made small.

[0043] According to an inductor component according to one aspect of the present disclosure, it is possible to increase the efficiency with which inductance is obtained.

[0044] FIG. 3 is a schematic bottom view of the inductor component of the first embodiment, as viewed from the bottom side. FIG. 4 is a cross-sectional view taken along line II-II of FIG. 1 . FIG. 5 is a cross-sectional view taken along line III-III of FIG. 1 . FIG. 6 is an enlarged view of part A of FIG. 3 . FIG. 7 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 8 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 9 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 10 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 11 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 12 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 13 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. 8 is a cross-sectional view taken along the line VIII-VIII of FIG. 7. FIG. 9 is an enlarged view of part A of FIG. 8. FIG. 10 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 11 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 12 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 13 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 14 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 15 is a schematic cross-sectional view illustrating a method for manufacturing an inductor component. FIG. 16 is a schematic cross-sectional view illustrating a first modified example of the inductor component. FIG. 17 is a schematic cross-sectional view illustrating a second modified example of the inductor component. FIG. 18 is a schematic cross-sectional view illustrating a third modified example of the inductor component.

[0045] Hereinafter, an inductor component according to one aspect of the present disclosure will be described in detail with reference to the illustrated embodiments. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0046] First Embodiment An inductor component 1 according to a first embodiment will be described below. FIG. 1 is a schematic bottom view of the inductor component 1 as viewed from the bottom side. FIG. 2 is a cross-sectional view taken along II-II in FIG. 1. FIG. 3 is a cross-sectional view taken along III-III in FIG. 1. FIG. 4 is an enlarged view of part A in FIG. 3. For convenience, external electrodes are depicted by two-dot chain lines in FIG. 1. Furthermore, although the element body 10 is depicted as transparent in FIG. 1 to facilitate understanding of the structure, it may also be translucent or opaque.

[0047] 1. Overview of Configuration The overview of the inductor component 1 will be described. The inductor component 1 is a surface-mount type inductor component used, for example, in a high-frequency signal transmission circuit. As shown in Figures 1 to 4, the inductor component 1 includes an element body 10, a coil 110 at least a portion of which is provided inside the element body 10 and wound spirally along an axis AX, and a first external electrode 121 and a second external electrode 122 which are provided outside the element body 10 and electrically connected to the coil 110.

[0048] The element body 10 has a length, width, and height. The element body 10 has a first end face 100e1 and a second end face 100e2 at both ends in the length direction, a first side face 100s1 and a second side face 100s2 at both ends in the width direction, and a bottom face 100b and a top face 100t at both ends in the height direction. In other words, the outer surface 100 of the element body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b, and the top face 100t. The bottom face 100b is an example of a "first main surface" as defined in the claims, and the top face 100t is an example of a "second main surface" as defined in the claims.

[0049] As shown in the drawings, for convenience of explanation, the length direction (longitudinal direction) of the element body 10 is referred to as the X direction. The direction from the first end face 100e1 to the second end face 100e2 is referred to as the forward X direction, and the direction opposite to the forward X direction is referred to as the reverse X direction. The width direction of the element body 10 is referred to as the Y direction. The direction from the first side face 100s1 to the second side face 100s2 is referred to as the forward Y direction, and the direction opposite to the forward Y direction is referred to as the reverse Y direction. The height direction of the element body 10 is referred to as the Z direction. The direction from the bottom face 100b to the top face 100t is referred to as the forward Z direction, and the direction opposite to the forward Z direction is referred to as the reverse Z direction. The X direction, Y direction, and Z direction are mutually orthogonal and, when arranged in the order X, Y, Z, form a right-handed system. In this specification, the direction from the top face 100t side to the bottom face 100b side is referred to as the first direction D1. The first direction D1 includes not only a direction parallel to the Z direction but also a direction tilted from a direction parallel to the Z direction. In this embodiment, the first direction D1 is the reverse Z direction.

[0050] In this specification, the "outer surface 100 of the element body 10," which includes the first end surface 100e1, the second end surface 100e2, the first side surface 100s1, the second side surface 100s2, the bottom surface 100b, and the top surface 100t of the element body 10, does not simply mean a surface facing the outer periphery of the element body 10, but rather a surface that forms the boundary between the outside and the inside of the element body 10. Furthermore, "above the outer surface 100 of the element body 10" does not refer to an absolute direction such as vertically upward, which is defined by the direction of gravity, but rather refers to a direction toward the outside of the outside and the inside, with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, "above the outer surface 100" is a relative direction determined by the orientation of the outer surface 100. Furthermore, "above" with respect to a certain element includes not only an upper position away from the element, i.e., an upper position via another object on the element or an upper position with a gap therebetween, but also a position directly above the element (on).

[0051] The axis AX of the coil 110 is arranged parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom surface wirings 11b provided on the bottom surface 100b side with respect to the axis AX and arranged along the axis AX on a plane parallel to the bottom surface 100b, a plurality of top surface wirings 11t provided on the top surface 100t side with respect to the axis AX and arranged along the axis AX on a plane parallel to the top surface 100t, a plurality of first through wirings 13 extending from the bottom surface wirings 11b toward the top surface wirings 11t and arranged along the axis AX, and a plurality of second through wirings 14 extending from the bottom surface wirings 11b toward the top surface wirings 11t, provided on the opposite side of the axis AX from the first through wirings 13 and arranged along the axis AX. The plurality of bottom surface wirings 11b include an endmost coil wiring 11e located on one side in the direction of the axis AX. In this embodiment, of the plurality of bottom surface wirings 11 b, each of the two bottom surface wirings 11 b located at both ends in the axial direction AX is an endmost coil wiring 11 e. The bottom surface wiring 11 b, the first through wiring 13, the top surface wiring 11 t, and the second through wiring 14 are connected in this order to form at least a part of a spiral shape.

[0052] The bottom wiring 11b corresponds to an example of the "first coil wiring" set forth in the claims, and the top wiring 11t corresponds to an example of the "second coil wiring" set forth in the claims. The axis AX is the intersection of a first plane passing through the center between the bottom wiring 11b and the top wiring 11t and a second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction perpendicular to the axis AX.

[0053] According to the above configuration, the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14. The bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14 are connected in this order to form at least a part of a spiral, which allows the inner diameter of the coil 110 to be increased and the efficiency of obtaining inductance to be increased. Furthermore, by increasing the efficiency of obtaining inductance, the Q value can be increased.

[0054] Specifically, the pad portion of a conventional inductor component and the bottom wiring 11b and top wiring 11t of this embodiment are "receiving portions" for the wiring that penetrates the element body (the conductive vias of a conventional inductor component and the first through wiring 13 and second through wiring 14 of this embodiment), and therefore have a shape that extends perpendicular to the direction that penetrates the element body. Here, in the configuration of a conventional inductor component, the conductive vias extend in a direction parallel to the axis of the coil, and therefore the pad portion extends in a direction perpendicular to the axis of the coil, and is likely to have a structure that blocks magnetic flux generated in the axial direction of the coil.

[0055] In contrast, in this embodiment, the first through wiring 13 and the second through wiring 14 extend in a direction perpendicular to the axis AX of the coil 110, and therefore the bottom wiring 11b and the top wiring 11t extend in a direction parallel to the axis AX of the coil 110. Therefore, the bottom wiring 11b and the top wiring 11t are unlikely to have a structure that blocks magnetic flux generated in the direction of the axis AX. In other words, this embodiment can have a structure that is unlikely to block magnetic flux, thereby improving inductance acquisition efficiency and Q value.

[0056] 1 and 4 , the outermost coil wiring 11e, which is located closer to the first end face 100e1 with respect to the center of the element body 10 in the X direction, has an upper surface u located on the first direction D1 side, and a first side surface S1 and a second side surface S2 located on either side of a center line CL along the extension direction of the outermost coil wiring 11e when viewed from a direction perpendicular to the bottom surface 100b (the Z direction). The first external electrode 121 includes a first portion P1 in contact with at least a portion of the first side surface S1 of the outermost coil wiring 11e, a second portion P2 in contact with at least a portion of the upper surface u of the outermost coil wiring 11e, and a third portion P3 in contact with at least a portion of the second side surface S2 of the outermost coil wiring 11e. The first portion P1, the second portion P2, and the third portion P3, successively arranged in this order, form a protrusion P that protrudes in the first direction D1.

[0057] Similarly, the outermost coil wiring 11e, which is located closer to the second end face 100e2 than the center of the element body 10 in the X direction, has an upper surface u located on the first direction D1 side, and a first side surface S1 and a second side surface S2 located on either side of a center line CL along the extension direction of the outermost coil wiring 11e when viewed from a direction perpendicular to the bottom surface 100b (the Z direction). The second external electrode 122 includes a first portion in contact with at least a portion of the first side surface S1 of the outermost coil wiring 11e, a second portion in contact with at least a portion of the upper surface u of the outermost coil wiring 11e, and a third portion in contact with at least a portion of the second side surface S2 of the outermost coil wiring 11e. The first, second, and third portions, in this order, form a protrusion P that protrudes continuously in the first direction D1.

[0058] According to the above configuration, the first external electrode 121 and the second external electrode 122 have protrusions P protruding in the first direction D1, which increases the surface area compared to when the electrodes are flat and do not have the protrusions P, thereby improving the strength of adhesion to a connecting member such as solder. Furthermore, the protrusions P of the first external electrode 121 and the second external electrode 122 are in contact with the outermost coil wiring 11e, directly connecting the outermost coil wiring 11e to each of the first external electrode 121 and the second external electrode 122. This reduces the DC resistance (Rdc) compared to when the outermost coil wiring 11e is connected to the first external electrode 121 and the second external electrode 122 using, for example, via wiring.

[0059] 2. Configuration of Each Part (Inductor Component 1) The volume of the inductor component 1 is preferably 0.08 mm ３ The dimension of the long side of the inductor component 1 is 0.65 mm or less. The dimension of the long side of the inductor component 1 refers to the largest value among the length, width, and height of the inductor component 1, and in this embodiment, refers to the length in the X direction. With the above configuration, the volume of the inductor component 1 is small and the long side of the inductor component 1 is short, so the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. Furthermore, the thickness of the inductor component 1 is preferably 200 μm or less. This allows the inductor component 1 to be made thin.

[0060] Specifically, the size of the inductor component 1 (length (X direction) × width (Y direction) × height (Z direction)) is 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. Furthermore, the width and height do not have to be equal, and may be, for example, 0.4 mm × 0.2 mm × 0.3 mm.

[0061] (Element body 10) The element body 10 is preferably made of SiO ２ This makes it possible to impart insulation and rigidity to the element body 10. The element body 10 is made of, for example, a sintered glass body. The sintered glass body may contain alumina, which can further increase the strength of the element body.

[0062] The glass sintered body is formed by stacking, for example, a plurality of insulating layers containing glass. The stacking direction of the plurality of insulating layers is the Z direction. That is, the insulating layers are in a layered form having main surfaces extending in the XY plane. Note that, in the element body 10, the interfaces between the plurality of insulating layers may not be clear due to firing or the like.

[0063] The element body 10 may be made of, for example, a glass substrate. The glass substrate may be a single-layer glass substrate, and since the majority of the element body is made of glass, losses such as eddy current losses at high frequencies can be suppressed.

[0064] 4, a recess C is provided on the bottom surface 100b of the element body 10. Specifically, the recess C is provided in each of the two endmost coil wirings 11e so that the connection portion with the first external electrode 121 or the second external electrode 122 is exposed from the element body 10. The shape of the recess C when viewed from the Z direction is not particularly limited as long as the connection portion is exposed from the element body 10, but in this embodiment it is rectangular.

[0065] (Coil 110) The coil 110 includes a plurality of bottom wirings 11b, a plurality of top wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14 are connected in order to form at least a part of the coil 110 wound in the direction of the axis AX.

[0066] According to the above configuration, the coil 110 is a so-called helical-shaped coil 110, so that in a cross section perpendicular to the axis AX, the area in which the bottom wiring 11b, the top wiring 11t, the first through wiring 13, and the second through wiring 14 run parallel to the winding direction of the coil 110 can be reduced, thereby reducing the stray capacitance in the coil 110.

[0067] Here, a helical shape refers to a shape in which the number of turns in the entire coil is greater than one, but the number of turns in the coil in a cross section perpendicular to the axis is less than one. "One or more turns" refers to a state in which, in a cross section perpendicular to the axis, the coil wiring has portions that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction, and "less than one turn" refers to a state in which, in a cross section perpendicular to the axis, the coil wiring does not have portions that are adjacent in the radial direction when viewed from the axial direction and run parallel to the winding direction.

[0068] The bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the Y direction at a slight inclination toward the X direction. The multiple bottom wirings 11b are arranged parallel to each other along the X direction. Here, if modified illumination, such as annular illumination or dipole illumination, is used in the photolithography process, the pattern resolution in a specific direction can be improved, allowing for the formation of a finer pattern. According to the above configuration, since the bottom wiring 11b extends in only one direction, the use of modified illumination, such as annular illumination, in the photolithography process can form a finer bottom wiring 11b, thereby enabling the miniaturization of the inductor component 1.

[0069] As described above, the multiple bottom surface wirings 11b include an endmost coil wiring 11e located at one end in the direction of the axis AX. In this embodiment, one end of the endmost coil wiring 11e in the extension direction (in other words, the portion connected to the first external electrode 121 or the second external electrode 122) is disposed in a recess C provided in the bottom surface 100b of the element body 10 and is exposed from the element body 10. Specifically, of both end portions of the endmost coil wiring 11e in the extension direction, the end connected to the first external electrode 121 or the second external electrode 122 is disposed in the recess C and exposed from the element body 10. Note that the entire endmost coil wiring 11e may be disposed in the recess C and exposed from the element body 10. In this case, it is preferable that the first external electrode 121 or the second external electrode 122 contact the entire exposed surface of the endmost coil wiring 11e (in other words, the entire first side surface s1, the entire second side surface s2, and the entire top surface u).

[0070] The top surface wiring 11t extends in only one direction. Specifically, the top surface wiring 11t extends in the Y direction. The multiple top surface wirings 11t are arranged in parallel along the X direction. With the above configuration, since the top surface wiring 11t extends in only one direction, by using, for example, modified illumination in the photolithography process, it is possible to form fine top surface wirings 11t and reduce the size of the inductor component 1.

[0071] The bottom wiring 11b and the top wiring 11t are made of a good conductor material such as copper, silver, gold, or an alloy thereof. The bottom wiring 11b and the top wiring 11t may be a metal film formed by plating, vapor deposition, sputtering, or the like, or may be a metal sintered body formed by applying and sintering a conductive paste. The bottom wiring 11b and the top wiring 11t may also have a multilayer structure in which multiple metal layers are stacked. The thickness of the bottom wiring 11b and the top wiring 11t is preferably 5 μm or more and 50 μm or less.

[0072] The first through wiring 13 is arranged on the first side surface 100s1 side with respect to the axis AX within the through hole V of the element body 10, and the second through wiring 14 is arranged on the second side surface 100s2 side with respect to the axis AX within the through hole V of the element body 10. The first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. This allows the lengths of the first through wiring 13 and the second through wiring 14 to be shortened, thereby suppressing DC resistance (Rdc). The multiple first through wirings 13 and the multiple second through wirings 14 are each arranged in parallel along the X direction.

[0073] Preferably, the first through wiring 13 is made of SiO ２ According to this, the element body 10 contains SiO ２ When the first through wiring 13 contains a material such as SiO, the linear expansion coefficient of the first through wiring 13 can be matched with the linear expansion coefficient of the element body 10, and cracks between the first through wiring 13 and the element body 10 can be suppressed. The first through wiring 13 is made of, for example, a conductive paste. The conductive material is Ag, Cu, or the like. Similarly, the second through wiring 14 is preferably made of SiO ２ Includes.

[0074] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through wiring 13, and the second through wiring 14 includes a void portion or a resin portion. This allows the void portion or the resin portion to absorb stress caused by the difference in linear expansion coefficient between the wiring and the element body 10, thereby alleviating the stress. As a method for forming the void portion, for example, a material that is burned away by sintering is used as the wiring material, and the void portion can be formed by sintering the wiring. As a method for forming the resin portion, for example, a conductive paste can be used as the wiring material to form the resin portion.

[0075] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t is made of SiO ２ According to this, the element body 10 contains SiO ２ When the wiring includes the element body 10, the linear expansion coefficient of the wiring can be matched to the linear expansion coefficient of the element body 10, and cracks between the wiring and the element body 10 can be suppressed.

[0076] (External electrodes 121, 122) The first external electrode 121 is connected to a first end of the coil 110, and the second external electrode 122 is connected to a second end of the coil 110. The first external electrode 121 is provided on the first end face 100e1 side of the center of the element body 10 in the X direction so as to be exposed from the outer surface 100 of the element body 10. The second external electrode 122 is provided on the second end face 100e2 side of the center of the element body 10 in the X direction so as to be exposed from the outer surface 100 of the element body 10. When a recess C is provided on the bottom surface 100b of the element body 10 as in this embodiment, the outer surface 100 of the element body 10 includes the inner surface of the recess C. Furthermore, in this specification, when referring to the "outside of the element body," this "outside" also includes the area inside the recess C. In other words, the area inside the recess C is considered to be the outside of the element body 10.

[0077] The first external electrode 121 may be provided continuously on the bottom surface 100b and the first end surface 100e1. In this case, since the first external electrode 121 is a so-called L-shaped electrode, a solder fillet can be formed on the first external electrode 121 when the inductor component 1 is mounted on a mounting board. Similarly, the second external electrode 122 may be provided continuously on the bottom surface 100b and the second end surface 100e2.

[0078] The first external electrode 121 has an underlayer 121e1 and a plating layer 121e2 covering the underlayer 121e1. The underlayer 121e1 includes a conductive material such as Cu, Ni, Ti, or a combination thereof. The plating layer 121e2 includes a conductive material such as Ni or Au. Similarly, the second external electrode 122 has an underlayer and a plating layer covering the underlayer. Note that the first external electrode 121 and the second external electrode 122 may each be made of a single layer of conductive material.

[0079] The first external electrode 121 is arranged to cover the entire recess C provided in the bottom surface 100b of the element body 10 when viewed from the Z direction. As a result, the first external electrode 121 is in contact with the entire surface of the first side surface S1 of the endmost coil wiring 11e that is exposed from the element body 10, the entire surface of the top surface u of the endmost coil wiring 11e that is exposed from the element body 10, and the entire surface of the second side surface S2 of the endmost coil wiring 11e that is exposed from the element body 10. As a result, the first external electrode 121 has a protrusion P at a position corresponding to the portion of the endmost coil wiring 11e that is exposed from the element body 10. The first external electrode 121 has a step 121s that corresponds to the step of the recess C (a first surface, described later).

[0080] Similarly, the second external electrode 122 is arranged so as to cover the entire recess C provided in the bottom surface 100b of the element body 10 when viewed from the Z direction. As a result, the second external electrode 122 is in contact with the entire surface of the first side surface S1 of the endmost coil wiring 11e that is exposed from the element body 10, the entire surface of the top surface u of the endmost coil wiring 11e that is exposed from the element body 10, and the entire surface of the second side surface S2 of the endmost coil wiring 11e that is exposed from the element body 10. As a result, the second external electrode 122 has a protrusion P at a position corresponding to the part of the endmost coil wiring 11e that is exposed from the element body 10. The second external electrode 122 has a step 122s that corresponds to the step of the recess C.

[0081] (Another Preferred Configuration) Preferably, as shown in FIG. 4 , the Z-direction thickness t1 of the first external electrode 121 is thinner than the Z-direction thickness t2 of the bottom wiring 11b. Here, when the first external electrode 121 is composed of multiple layers, the thickness of the first external electrode 121 refers to the thickness of all layers. Reducing the thickness of the first external electrode 121 has little effect on the DC resistance (Rdc). Therefore, with the above configuration, the thickness of the inductor component 1 can be reduced while suppressing an increase in DC resistance. More preferably, the thickness t1 of the first external electrode 121 is equal to or less than half the thickness t2 of the bottom wiring 11b. This allows the thickness of the inductor component 1 to be more effectively reduced. Similarly, the thickness of the second external electrode 122 may also be thinner than the thickness of the bottom wiring 11b.

[0082] Preferably, the first external electrode 121 is composed of multiple conductive layers, including a conductive layer made of a different material from the conductive layer making up the endmost coil wiring 11e. Specifically, the endmost coil wiring 11e may be made of a conductive layer with high conductivity, such as Cu or Ag. The first external electrode 121 may be made of a conductive layer that has good adhesion to the endmost coil wiring 11e, such as Ti, a conductive layer with high electromigration resistance, such as Ni, a conductive layer with high corrosion resistance, such as Au, or a conductive layer with high solder wettability. This configuration allows the first external electrode 121 to have characteristics different from those of the endmost coil wiring 11e. Similarly, the second external electrode 122 is composed of multiple conductive layers, including a conductive layer made of a different material from the conductive layer making up the endmost coil wiring 11e.

[0083] Preferably, the first external electrode 121 further includes a bottom portion BP1 extending continuously from the first portion P1 of the protrusion P on the side opposite the second portion P2, in a direction parallel to the bottom surface 100b (the Y direction), and a wall portion WP1 extending continuously from the bottom portion BP1 in the first direction D1. This configuration further increases the surface area of ​​the first external electrode 121, thereby further improving the bonding strength with a connecting member such as solder. Also preferably, the first external electrode 121 further includes a bottom portion BP2 extending continuously from the third portion P3 of the protrusion P on the side opposite the second portion P2, in a direction parallel to the bottom surface 100b, and a wall portion WP2 extending continuously from the bottom portion BP2 in the first direction D1. This configuration further increases the surface area of ​​the first external electrode 121, thereby further improving the bonding strength with a connecting member such as solder. Similarly, the second external electrode 122 may further include a bottom portion that is provided continuously from at least one of the first and third portions of the convex portion P to the opposite side from the second portion and extends in a direction parallel to the bottom surface 100b, and a wall portion that is provided continuously from the bottom portion and extends in the first direction D1.

[0084] Preferably, the first external electrode 121 further includes a fourth portion P4 that is spaced apart from the second portion P2 and is located closer to the first direction D1 than the second portion P2. Specifically, the fourth portion P4 is a portion of the first external electrode 121 that is provided on the bottom surface 100b excluding the recess C. This configuration further increases the surface area of ​​the first external electrode 121. Furthermore, the inclusion of the fourth portion P4 allows the first external electrode 121 to have a concave shape between the second portion P2 and the fourth portion P4. Furthermore, because the fourth portion P4 is located closer to the first direction D1 than the second portion P2, the depth of the concave shape can be deeper than when the fourth portion P4 is located on the opposite side of the first direction D1 (the forward Z direction side) than the second portion P2. As a result, the surface area of ​​the first external electrode 121 can be more effectively increased, thereby further improving the strength of adhesion to a connecting member such as solder. Similarly, the second external electrode 122 may further include a fourth portion that is spaced apart from the second portion and is located closer to the first direction D1 than the second portion.

[0085] Preferably, the bottom surface 100b has a recess C, the recess C having a stepped side surface CS, and at least a portion of the first external electrode 121 contacts the side surface CS and is shaped to conform to the side surface CS. Specifically, the side surface CS has a first surface f1 extending along the Z direction, a second surface f2 extending along the Z direction, and a third surface f3 connecting the first surface f1 and the second surface f2 and extending along the XY plane. The first surface f1 is disposed on the opening side of the recess C, and the second surface f2 is disposed on the bottom side of the recess C. The width of the first surface f1 in the Y direction is greater than the width of the second surface f2 in the Y direction. The width of the first surface f1 in the X direction is greater than the width of the second surface f2 in the X direction. The first surface f1, the second surface f2, and the third surface f3 form the stepped shape of the side surface CS. The number of steps in the stepped shape is not particularly limited. This configuration further increases the surface area of ​​the first external electrode 121, thereby further improving the strength of adhesion to a connecting member such as solder. Similarly, at least a portion of the second external electrode 122 may be in contact with the stepped side surface of the recess C and shaped to fit along the side surface.

[0086] (Method of Manufacturing Inductor Component 1) Next, a method of manufacturing inductor component 1 will be described with reference to Figures 5A to 5O. Figures 5A to 5G, 5I, 5K, and 5M are views corresponding to the cross section taken along II-II in Figure 1. Figures 5H, 5J, 5L, 5N, and 5O are views corresponding to the cross section taken along III-III in Figure 1.

[0087] 5A, a first insulating layer 1011 is provided by printing on a base substrate 1000. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, or the like, and the material of the first insulating layer 1011 is, for example, a resin such as epoxy or polyimide, or an inorganic insulating film such as SiO or SiN.

[0088] 5B, a second insulating layer 1012 is provided on a first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed by, for example, a photolithography process. Alternatively, the groove may be formed from the beginning as a printing pattern.

[0089] As shown in FIG. 5C , a top surface conductor layer 1011t is provided in the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, or the like. At this time, for example, the top surface conductor layer 1011t is formed as a print pattern so that it remains only in the groove 1012a. After printing the top surface conductor layer 1011t on the second insulating layer 1012, a photolithography process may be used to leave the top surface conductor layer 1011t only in the groove 1012a.

[0090] As shown in Fig. 5D, a third insulating layer 1013 is provided by printing on the second insulating layer 1012. A first groove 1013a and a second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed in the same manner as in Fig. 5B.

[0091] As shown in Fig. 5E, a first through conductor layer 1131 of the first layer is provided in the first groove 1013a by printing, and a second through conductor layer 1141 of the first layer is provided in the second groove 1013b by printing. The first through conductor layer 1131 of the first layer and the second through conductor layer 1141 of the first layer are formed in the same manner as in Fig. 5C.

[0092] 5F , the above-described steps are repeated to provide a fourth insulating layer 1014 on the third insulating layer 1013, and a second-layer first penetrating conductor layer 1132 and a second-layer second penetrating conductor layer 1142 are provided in each of the two grooves provided in the fourth insulating layer 1014. Furthermore, a fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and a third-layer first penetrating conductor layer 1133 and a third-layer second penetrating conductor layer 1143 are provided in each of the two grooves provided in the fifth insulating layer 1015.

[0093] As shown in Figure 5G, a sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and a bottom conductor layer 1011b is provided in a groove provided in the sixth insulating layer 1016. The material of the bottom conductor layer 1011b is the same as the material of the top conductor layer 1011t. Figure 5H shows the same process as Figure 5G. As shown in Figure 5H, a groove 1016a is provided in the sixth insulating layer 1016, and a bottom conductor layer 1011b is provided in the groove 1016a. The groove 1016a becomes part of the recess C.

[0094] As shown in FIG. 5I, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016. Next, a groove is provided in the seventh insulating layer 1017 so that at least the portions of the bottom conductor layer 1011b that are connected to the first and second external electrodes are exposed. FIG. 5J shows the same process as FIG. 5I. As shown in FIG. 5J, a groove 1017a is provided in the seventh insulating layer 1017. The groove 1017a becomes part of the recess C. In this embodiment, the opening size of the groove 1017a is larger than the opening size of the groove 1016a. This allows a staircase shape to be formed on the side surface of the recess C.

[0095] As shown in FIG. 5K, the entire laminate is sintered in a high-temperature furnace (e.g., 500°C or higher). The first through seventh insulating layers 1011-1017 are sintered to form the element body 10, the top conductor layer 1011t is sintered to form the top wiring 11t, the bottom conductor layer 1011b is sintered to form the bottom wiring 11b, the first through third through conductor layers 1131-1133 are sintered to form the first through wiring 13, and the first through third second through conductor layers 1141-1143 are sintered to form the second through wiring 14. Therefore, sintering the insulating layers improves strength, and sintering the conductor layers volatilizes unnecessary resin components contained in the conductor layers and fuses the conductor material contained in the conductor layers, achieving high conductivity. The base substrate 1000 may be peeled off by decomposing the surface during sintering, or may be mechanically removed by grinding or the like before or after sintering, or chemically removed by etching or the like before or after sintering. Fig. 5L shows the same step as Fig. 5K. As shown in Fig. 5L, the sintering process forms an element body 10 having a recess C in the bottom surface 100b.

[0096] As shown in FIG. 5M , a conductive material such as Cu, Ni, Ti, or a combination thereof is deposited by sputtering, and then etched into a predetermined shape by photolithography to form an underlayer 121e1. The predetermined shape is such that the underlayer 121e1 covers at least the inner surface of the recess C. Next, a plating layer 121e2 is formed by electroless plating to cover the underlayer 121e1. The plating layer 121e2 is, for example, Ni / Au. Thus, the external electrodes 121 and 122 are formed. FIG. 5N shows the same process as FIG. 5M . As shown in FIG. 5N , the first external electrode 121 contacts the portion of the endmost coil wiring 11e exposed from the element body 10, forming a protrusion P on the first external electrode 121. Although not shown, the second external electrode 122 contacts the portion of the endmost coil wiring 11e exposed from the element body 10, forming a protrusion P on the second external electrode 122.

[0097] As shown in Fig. 5O, the substrate is separated into individual pieces along cutting lines D. In this way, the inductor component 1 is manufactured as shown in Fig. 3 .

[0098] 6A is a view corresponding to the cross section III-III in FIG. 1 showing a first modified example of an inductor component. As shown in FIG. 6A, in an inductor component 1A of the first modified example, the element body 10 is not provided in a region on the forward Y-direction side and a region on the reverse Y-direction side of a portion of the endmost coil wiring 11e that is exposed from the element body 10. This makes it easier to bring the first external electrode 121 into contact with the bottom surface 100b of the element body 10.

[0099] 6B is a view showing a second modified inductor component corresponding to the cross section II-II of FIG. 1. As shown in FIG. 6B, in an inductor component 1B of the second modified example, the first through wiring 13 and the second through wiring 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, allowing the inner diameter of the coil 110 to be increased, and the Q value to be improved.

[0100] Specifically, the first through wiring 13 and the second through wiring 14 are bent at the center so that the distance between them becomes wider toward the center in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that widens outward in the radial direction of the coil 110 toward the center in the Z direction. Furthermore, the first through wiring 13 and the second through wiring 14 each have a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 and the second through wiring 14 are each formed by stacking multiple conductor layers, the first through wiring 13 and the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.

[0101] 6C is a view corresponding to the cross section II-II of FIG. 1, showing a third modified example of an inductor component. As shown in FIG. 6C, in an inductor component 1C of the third modified example, the first through wiring 13 and the second through wiring 14 are not parallel when viewed from a direction parallel to the axis AX of the coil 110. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, allowing the inner diameter of the coil 110 to be increased, and the Q value to be improved.

[0102] Specifically, the first through wiring 13 and the second through wiring 14 are inclined so that the distance between them becomes wider toward the top surface wiring 11t in the Z direction. In other words, the first through wiring 13 and the second through wiring 14 each have a shape that extends radially outward from the coil 110 as far as the top surface wiring 11t in the Z direction. In this way, the coil 110 has a trapezoidal shape when viewed from the axis AX direction. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.

[0103] (Fourth Modification) Fig. 6D is a view showing a fourth modification of an inductor component, corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6D, an inductor component 1D of the fourth modification includes a first coil 110A and a second coil 110B, as compared to the inductor component 1B of the second modification shown in Fig. 6B.

[0104] In the first coil 110A, when viewed in a direction parallel to the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.

[0105] Specifically, the first through wiring 13 has the same configuration as the first through wiring 13 of the inductor component 1B of the second modified example. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. In other words, the first through wiring 13 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The first through wiring 13 has a stepped shape along the Z direction. According to the above configuration, when the first through wiring 13 is formed by stacking multiple conductor layers, the first through wiring 13 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.

[0106] In the second coil 110B, when viewed in a direction parallel to the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.

[0107] Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1B of the second modified example. On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. In other words, the second through wiring 14 is bent at the center so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider toward the center in the Z direction. The second through wiring 14 has a stepped shape along the Z direction. According to the above configuration, when the second through wiring 14 is formed by stacking multiple conductor layers, the second through wiring 14 can be easily formed in a stepped shape by stacking the conductor layers of each layer in a shifted manner.

[0108] (Fifth Modification) Fig. 6E is a view showing a fifth modification of an inductor component, corresponding to the cross section taken along line II-II in Fig. 1. As shown in Fig. 6E, the inductor component 1E of the fifth modification includes a first coil 110A and a second coil 110B, as compared to the inductor component 1C of the third modification shown in Fig. 6C.

[0109] In the first coil 110A, when viewed in a direction parallel to the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110A to be increased, and the Q value to be improved.

[0110] Specifically, the first through wiring 13 has a configuration similar to that of the first through wiring 13 of the inductor component 1C of the third modified example. On the other hand, the second through wiring 14 has a linear shape parallel to the Z direction. That is, the first through wiring 13 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly and shortened, thereby reducing the DC resistance of the first through wiring 13 and the second through wiring 14.

[0111] In the second coil 110B, when viewed in a direction parallel to the axis AX, the first through wiring 13 and the second through wiring 14 are not parallel to each other. This allows the distance between the first through wiring 13 and the second through wiring 14 to be increased, the inner diameter of the coil 110B to be increased, and the Q value to be improved.

[0112] Specifically, the second through wiring 14 has the same configuration as the second through wiring 14 of the inductor component 1C of the third modified example. On the other hand, the first through wiring 13 has a linear shape parallel to the Z direction. That is, the second through wiring 14 is inclined so that the distance between the first through wiring 13 and the second through wiring 14 becomes wider in the Z direction toward the top surface wiring 11t. With the above configuration, the first through wiring 13 and the second through wiring 14 can be formed linearly, and the electrical resistance of the first through wiring 13 and the second through wiring 14 can be reduced.

[0113] Second Embodiment FIG. 7 is a schematic bottom view showing a second embodiment of an inductor component, as viewed from the bottom side. FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. 7. FIG. 9 is an enlarged view of part A in FIG. 8. In FIG. 7, for convenience, the insulating layers are omitted, and the external electrodes are depicted with two-dot chain lines. Also, in FIG. 7, the element body 10 is depicted as transparent to facilitate understanding of the structure. The second embodiment differs from the first embodiment mainly in the position of the coil axis, the orientation of the through-wiring, the material of the element body, the presence of an insulator, and the configuration of the external electrodes. These differences will be described below. The other configurations are the same as those of the first embodiment, and their description will be omitted.

[0114] 7 , in the inductor component 1F, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the element body 10 in the X direction. This reduces the interference of the magnetic flux of the coil 110 by the first external electrode 121 and the second external electrode 122, thereby improving the efficiency of obtaining inductance.

[0115] The length of the coil 110 in the direction of the axis AX is shorter than the inner diameter of the coil 110. This allows the coil length to be short and the inner diameter to be large, thereby improving the Q value. The inner diameter of the coil refers to the diameter of a circle that is based on the minimum area of ​​the region surrounded by the coil 110 when viewed through from the direction of the axis AX.

[0116] (Element body 10) The element body 10 is an inorganic insulator. The material of the element body 10 is preferably glass, which has high insulating properties and can suppress eddy currents, thereby increasing the Q value. The element body 10 preferably contains silicon, which increases the thermal stability of the element body 10 and therefore suppresses fluctuations in the dimensions of the element body 10 due to heat, thereby reducing variations in electrical characteristics.

[0117] The element body 10 is preferably a single-layer glass plate. This ensures the strength of the element body 10. Furthermore, the single-layer glass plate has small dielectric loss, which allows for a high Q value at high frequencies. Furthermore, since there is no sintering process as in the case of sintered bodies, deformation of the element body 10 during sintering can be suppressed, thereby suppressing pattern misalignment and providing an inductor component with a small inductance tolerance.

[0118] As a material for the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate, such as Foturan II (registered trademark of Schott AG), is preferred. In particular, the single-layer glass plate is preferably made of cerium oxide (ceria: CeO ２ In this case, cerium oxide acts as a sensitizer, making photolithographic processing easier.

[0119] However, the single-layer glass plate may be a glass plate that does not have photosensitivity, since it can be processed by mechanical processing such as drilling or sandblasting, dry / wet etching using a photoresist or metal mask, laser processing, etc. Furthermore, the single-layer glass plate may be one obtained by sintering a glass paste, or may be formed by a known method such as the float method.

[0120] (Coil 110) As shown in FIG. 7, the bottom wiring 11b extends in only one direction. Specifically, the bottom wiring 11b extends in the X direction. The multiple bottom wirings 11b are arranged parallel to one another along the Y direction. The multiple bottom wirings 11b include an endmost coil wiring 11e located on one side of the axis AX direction (Y direction). In this embodiment, of the multiple bottom wirings 11b, each of the two bottom wirings 11b located at both ends in the axis AX direction is the endmost coil wiring 11e. The top wiring 11t extends in only one direction. Specifically, the top wiring 11t extends in the X direction at a slight incline toward the Y direction. The multiple top wirings 11t are arranged parallel to one another along the Y direction.

[0121] The first through wiring 13 is arranged on the first end face 100e1 side with respect to the axis AX within the through hole V of the element body 10, and the second through wiring 14 is arranged on the second end face 100e2 side with respect to the axis AX within the through hole V of the element body 10. The first through wiring 13 and the second through wiring 14 each extend in a direction perpendicular to the bottom surface 100b and the top surface 100t. The multiple first through wirings 13 and the multiple second through wirings 14 are each arranged in parallel along the Y direction.

[0122] 8 , the inductor component 1F has an insulator 22. The insulator 22 covers both the bottom surface 100b and the top surface 100t of the element body 10. The insulator 22 may be provided only on the bottom surface 100b out of the bottom surface 100b and the top surface 100t.

[0123] The insulator 22 is a component that covers the wiring (bottom wiring 11b, top wiring 11t) to protect the wiring from external forces, prevent damage to the wiring, and improve the insulation of the wiring. The insulator 22 is preferably an organic insulator. For example, the insulator 22 may be a resin film such as epoxy or polyimide, which is easy to form. In particular, the insulator 22 is preferably made of a material with a low dielectric constant, which can reduce the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 when the insulator 22 is present between the coil 110 and the external electrodes 121 and 122. The insulator 22 can be formed, for example, by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.) or by applying and thermally curing a paste-like resin. The insulator 22 may also be an inorganic film, such as an oxide, nitride, or oxynitride of silicon or hafnium, which has excellent insulating properties and can be thinned.

[0124] An opening 22a is provided in the insulator 22 covering the bottom surface 100b so as to expose the connection portion of the endmost coil wiring 11e that is connected to the external electrodes 121, 122. The opening 22a is a through-hole that penetrates the insulator 22 in the thickness direction (Z direction). The shape of the opening 22a when viewed from the Z direction is not particularly limited as long as it exposes the connection portion of the bottom surface wiring 11b. In this embodiment, as shown in FIG. 7 , the shape of the opening 22a when viewed from the Z direction is sufficiently larger than the shape of the connection portion of the bottom surface wiring 11b and is similar to the shape of the connection portion.

[0125] Specifically, in the endmost coil wiring 11e located on the second side surface 100s2 side of the center of the element body 10, the shape of the connection portion connected to the first external electrode 121 (in other words, the portion of the endmost coil wiring 11e exposed from the insulator 22) is bullet-shaped with a tip whose width in the Y direction narrows toward the reverse X direction. In addition, the shape of the opening 22a provided on the first external electrode 121 side, as viewed from the Z direction, is sufficiently larger than the shape of the connection portion, and is bullet-shaped with a tip whose width in the Y direction narrows toward the reverse X direction so as to be similar to the shape of the connection portion.

[0126] Similarly, in the endmost coil wiring 11e located closer to the first side surface 100s1 than the center of the element body 10, as viewed in the Z direction, the connection portion connected to the second external electrode 122 (in other words, the portion of the endmost coil wiring 11e exposed from the insulator 22) has a bullet-like shape with a tip whose width in the Y direction narrows toward the forward X direction. As viewed in the Z direction, the shape of the opening 22a provided on the second external electrode 122 side is sufficiently larger than the shape of the connection portion, and is bullet-like with a tip whose width in the Y direction narrows toward the forward X direction so as to be similar to the shape of the connection portion. Making the shape of the opening 22a sufficiently larger than the shape of the connection portion more reliably exposes the connection portion from the insulator 22, and making the shape of the opening 22a similar to the shape of the connection portion minimizes the amount of etching of the insulator 22 and ensures the insulation of the wiring.

[0127] 7, 8, and 9, the first external electrode 121 is provided so as to cover the entire opening 22a located on the first end face 100e1 side when viewed from the Z direction. As a result, the first external electrode 121 includes a first portion P1 in contact with at least a part of the first side surface S1 of the last coil wiring 11e, a second portion P2 in contact with at least a part of the upper surface u of the last coil wiring 11e, and a third portion P3 in contact with at least a part of the second side surface s2 of the last coil wiring 11e, and the first portion P1, the second portion P2, and the third portion P3 are successively arranged in this order to form a protrusion P that protrudes in the first direction D1. Specifically, the first external electrode 121 contacts the entire surface of the first side surface S1 of the endmost coil wiring 11e that is exposed from the insulator 22, the entire surface of the top surface u of the endmost coil wiring 11e that is exposed from the element body 10, and the entire surface of the second side surface S2 of the endmost coil wiring 11e that is exposed from the element body 10. As a result, the first external electrode 121 has a protrusion P at a position corresponding to the portion of the endmost coil wiring 11e that is exposed from the element body 10.

[0128] Similarly, the second external electrode 122 is provided so as to cover the entire opening 22a located on the second end surface 100e2 side when viewed from the Z direction. Thus, the second external electrode 122 includes a first portion in contact with at least a portion of the first side surface S1 of the endmost coil wiring 11e, a second portion in contact with at least a portion of the top surface u of the endmost coil wiring 11e, and a third portion in contact with at least a portion of the second side surface s2 of the endmost coil wiring 11e, and the first portion, second portion, and third portion are successively arranged in this order to form a protrusion P that protrudes in the first direction D1. Specifically, the second external electrode 122 is in contact with the entire surface of the first side surface S1 of the endmost coil wiring 11e that is exposed from the insulator 22, the entire surface of the top surface u of the endmost coil wiring 11e that is exposed from the element body 10, and the entire surface of the second side surface S2 of the endmost coil wiring 11e that is exposed from the element body 10. As a result, the second external electrode 122 has a protrusion P at a position corresponding to the exposed portion of the endmost coil wiring lie from the element body 10.

[0129] Preferably, when viewed from a direction (Z direction) perpendicular to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside the outer surface 100 of the element body 10. With this configuration, the first external electrode 121 and the second external electrode 122 are not in contact with the outer surface 100 of the element body 10. Therefore, when the inductor component 1F is singulated, the load on the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component 1F is made small, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0130] According to the inductor component 1F, the first external electrode 121 and the second external electrode 122 have protrusions P protruding in the first direction D1, which increases the surface area compared to when the electrodes are flat and do not have the protrusions P, thereby improving the strength of adhesion to a connecting member such as solder. Furthermore, the protrusions P of the first external electrode 121 and the second external electrode 122 are in contact with the outermost coil wiring 11e, which allows direct connection between the first external electrode 121 and the second external electrode 122 and the outermost coil wiring 11e. This reduces the DC resistance (Rdc) compared to when the first external electrode 121 and the second external electrode 122 are connected to the outermost coil wiring 11e using, for example, via wiring.

[0131] 9 , the first external electrode 121 preferably further includes an insulator 22 provided on a portion of the bottom surface 100b, and at least a portion of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the protrusion P. Specifically, the first external electrode 121 includes a bottom portion BP1 that is provided continuously from the first portion P1 of the protrusion P on the side opposite to the second portion P2 and extends in a direction parallel to the bottom surface 100b, and a wall portion WP1 that is provided continuously from the bottom portion BP1 and extends in the first direction D1. The wall portion WP1, the bottom portion BP1, and the first portion P1 are in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the protrusion P.

[0132] In this embodiment, at least a portion of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the protrusion P. Specifically, the first external electrode 121 includes a bottom portion BP2 that is provided continuously from the third portion P3 of the protrusion P on the side opposite to the second portion P2 and extends in a direction parallel to the bottom surface 100b, and a wall portion WP2 that is provided continuously from the bottom portion BP2 and extends in the first direction D1. The wall portion WP2, the bottom portion BP2, and the third portion P3 are in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the protrusion P.

[0133] According to the above configuration, at least a portion of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the protrusion P, so that an uneven shape can be imparted to the first external electrode 121. This can further improve the bonding strength with a connecting member such as solder. Furthermore, at least a portion of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the protrusion P, so that an uneven shape can be imparted to the first external electrode 121. This can further improve the bonding strength with a connecting member such as solder.

[0134] Similarly, at least a portion of the second external electrode 122 may be in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the protrusion P.

[0135] Preferably, the first external electrode 121 further includes a fourth portion P4 that is spaced apart from the second portion P2 and is located closer to the first direction D1 than the second portion P2. Specifically, the fourth portion P4 is a portion of the first external electrode 121 that is provided on the upper surface 22u of the insulator 22. With this configuration, the surface area of ​​the first external electrode 121 can be further increased by further including the fourth portion P4. Similarly, the second external electrode 122 may also further include a fourth portion that is spaced apart from the second portion and is located closer to the first direction D1 than the second portion.

[0136] (Method of Manufacturing Inductor Component 1F) Next, a method of manufacturing the inductor component 1F will be described with reference to Figures 10A to 10H, which are cross-sectional views taken along the line VIII-VIII in Figure 7.

[0137] 10A, a copper foil 2001 is provided by printing on a base substrate 2000. The material of the base substrate 2000 is the same as that of the base substrate 1000 of the first embodiment.

[0138] As shown in FIG. 10B , a glass substrate 2010, which will become the element body 10, is provided on a base substrate 2000. For example, the base substrate 2000 and the glass substrate 2010 are tightly attached to each other using a jig such as conductive tape, pins, or a frame. The glass substrate 2010 has a through-hole V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate in which through-holes are formed in advance using a laser, photolithography, or the like. The glass substrate 2010 may be, for example, a TSV (Through Silicon Via) substrate, or may be something else. Furthermore, Ti / Cu or other necessary conductive materials may be deposited in advance as seeds on the surface of the glass substrate 2010 by sputtering or the like.

[0139] As shown in FIG. 10C , a first through conductor layer 2013, which will become the first through wiring 13, is formed in the through hole V of the glass substrate 2010. Although not shown, a second through conductor layer, which will become the second through wiring 14, is similarly formed in the through hole V. Specifically, by supplying power from the copper foil 2001 on the base substrate 2000, electrolytic plating is performed in the through hole V of the glass substrate 2010 to form the first through conductor layer 2013. Alternatively, a seed layer may be formed on the surface of the glass substrate 2010 or the inner surface of the through hole V by sputtering or the like, and the through conductor layer may be formed using known methods such as fill plating, conformal plating, or a printing and filling method of a conductive paste. If there is unnecessary plating growth on the surface of the glass substrate 2010, the unnecessary portions may be removed by polishing, CMP, wet etching (etch-back), or dry etching.

[0140] 10D, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 may be removed mechanically by grinding or the like, or may be removed chemically by etching or the like.

[0141] As shown in FIG. 10E , a bottom conductor layer 2011b that will become the bottom wiring 11b and a top conductor layer 2011t that will become the top wiring 11t are formed on a glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed by electrolytic plating on the seed layer in the openings of the photoresist. The photoresist and seed layer are then removed by wet etching or dry etching. This results in the formation of a bottom conductor layer 2011b and a top conductor layer 2011t that are patterned into any desired shape. At this time, the bottom conductor layer 2011b and the top conductor layer 2011t may be formed one at a time, or both may be formed simultaneously.

[0142] As shown in FIG. 10F , insulating layers 2022 that become insulators 22 are provided on the top and bottom surfaces of glass substrate 2010 so as to cover the conductor layers. At this time, the bottom-side insulating layer 2022 and the top-side insulating layer 2022 may be formed one at a time, or both may be formed simultaneously. Then, holes 2022a are formed in bottom-surface conductor layer 2011b of bottom-surface insulating layer 2022 using photolithography or laser processing. At this time, portions of bottom-surface conductor layer 2011b that will become connection portions to be connected to the first and second external electrodes are exposed from insulating layer 2022. Holes 2022a become openings 22a.

[0143] As shown in FIG. 10G , a first external electrode conductor layer 2121, which will become the first external electrode 121, is provided on the bottom insulating layer 2022. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b via the hole 2022a. The first external electrode conductor layer 2121 also contacts the bottom conductor layer 2011b via the hole 2022a, forming a protrusion P. Specifically, a Pd catalyst (not shown) is provided on the bottom insulating layer 2022, and a Ni or Au plating layer is formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the openings of the photoresist is removed by wet etching or dry etching. This forms the first external electrode conductor layer 2121 patterned into a desired shape. Alternatively, a seed layer (not shown) is provided on the bottom insulating layer 2022, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the openings of the photoresist is removed by wet etching or dry etching. A Ni or Au plating layer may be formed on the remaining seed layer by electroless plating. Although not shown, a second external electrode conductor layer that will become the second external electrode 122 is similarly provided on the insulating layer 2022 on the bottom surface side.

[0144] 10H, the substrate is separated into individual pieces along the cutting lines D. In this way, the inductor component 1F is manufactured as shown in FIG.

[0145] 2. Modifications (First Modification) Fig. 11A is a view corresponding to the cross section VIII-VIII of Fig. 7 showing a first modification of an inductor component. As shown in Fig. 11A, in an inductor component 1G of the first modification, first through wiring 13 extends in a direction perpendicular to bottom wiring 11b, and the cross-sectional area of ​​each of end portions 13e of first through wiring 13 in the extension direction is larger than the cross-sectional area of ​​a central portion 13m of first through wiring 13 in the extension direction. In other words, in a cross section along the extension direction of first through wiring 13, the width in the direction perpendicular to the extension direction of first through wiring 13 continuously increases from central portion 13m toward end portions 13e.

[0146] This allows the cross-sectional area of ​​the end 13e of the first through wiring 13 to be increased, thereby improving the connectivity between the first through wiring 13 and at least one of the bottom wiring 11b and the top wiring 11t. Furthermore, when forming a through hole V as a hole portion in the element body 10 and filling the through hole V with a conductive material by filling plating or the like to form the first through wiring 13 in the through hole V, it is easy to fill the conductive material on the opening side of the through hole V. Furthermore, since the cross-sectional area of ​​the end 13e of the first through wiring 13 is large and the cross-sectional area of ​​the central portion 13m of the first through wiring 13 is small, the first through wiring 13 is easy to form.

[0147] It is sufficient that the cross-sectional area of ​​one end 13e of the first through wiring 13 is larger than the cross-sectional area of ​​the central portion 13m of the first through wiring 13. Similarly, the cross-sectional area of ​​at least one end of the second through wiring 14 may be larger than the cross-sectional area of ​​the central portion 13m of the first through wiring 13.

[0148] In the inductor component 1G of the first modification, the bottom wiring 11b is provided on the bottom surface 100b, and further includes an insulator 22 that covers the bottom wiring 11b and has a shape that conforms to the shape of the bottom wiring 11b. At least a portion of the first external electrode 121 is in contact with the insulator 22 and has a shape that conforms to the shape of the bottom wiring 11b. Specifically, the insulator 22 covers the bottom wiring 11b and has a shape that extends in the X direction when viewed from the Z direction, and has a shape that conforms to the shape of the bottom wiring 11b. In short, the insulator 22 is provided so as to cover each bottom wiring 11b separately. In the region between adjacent bottom wirings 11b, the bottom surface 100b is exposed from the insulator 22. Furthermore, the portion of the first external electrode 121 excluding the protrusion P and the portion in contact with the bottom surface 100b is in contact with the insulator 22 and has a shape that extends in the X direction when viewed from the Z direction, and is shaped to match the shape of the bottom surface wiring 11b.

[0149] The insulators 22 cover the top surface wirings 11t and extend in the X direction at a slight angle to the Y direction when viewed from the Z direction, and are shaped to fit the shape of the top surface wirings 11t. In other words, the insulators 22 are provided so as to cover each of the top surface wirings 11t individually. This allows the material cost of the insulators 22 to be reduced.

[0150] Methods for forming the insulator 22 having a shape that conforms to the shape of the bottom wiring 11b or the top wiring 11t include, for example, methods of forming an organic resin or an inorganic insulator on the surface of the bottom wiring 11b or the top wiring 11t using methods such as CVD (Chemical Vapor Deposition), sputtering, or coating.

[0151] According to the above configuration, at least a portion of the first external electrode 121 is shaped to conform to the shape of the bottom wiring 11b, thereby further increasing the surface area of ​​the first external electrode 121 and further improving the bonding strength with a connecting member such as solder.

[0152] Similarly, at least a portion of the second external electrode 122 may be in contact with the insulator 22 and may be shaped to fit the shape of the bottom wiring 11b.

[0153] (Second Modification) FIG. 11B is a cross-sectional view corresponding to the VIII-VIII cross section of FIG. 7 , illustrating a second modification of the inductor component. As shown in FIG. 11B , in the inductor component 1H of the second modification, compared to the inductor component 1G of the first modification, an insulator 22 is further provided on the entire bottom surface 100b, excluding the portion where the bottom wiring 11b is provided and the peripheral portion. The Z-direction thickness of the insulator 22 is thinner than the Z-direction thickness of the bottom wiring 11b. With this configuration, the area of ​​the portion of the first external electrode 121 facing the bottom wiring 11b is smaller than in the first modification, thereby reducing the stray capacitance that may occur between the first external electrode 121 and the bottom wiring 11b compared to the first modification. Furthermore, because the insulator 22 is filled between adjacent bottom wirings 11b more than in the first modification, the insulation between adjacent bottom wirings 11b can be ensured more than in the first modification.

[0154] Furthermore, in the inductor component 1H of the second modification, when the element body 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside the outer surface 100 of the inorganic insulator when viewed from a direction perpendicular to the bottom surface 100b. Since the organic insulator is included, the organic insulator is easily imparted with fluidity. When the wiring (bottom surface wiring 11b, top surface wiring 11t) is covered with the organic insulator, the organic insulator can be easily filled between adjacent wirings, thereby improving insulation. Furthermore, since the organic insulator does not contact the outer surface of the inorganic insulator, the load on the organic insulator can be reduced when the inductor component 1H is singulated, and deformation or peeling of the organic insulator can be suppressed.

[0155] Furthermore, in the inductor component 1H of the second modification, compared to the inductor component 1G of the first modification, an insulator 22 is further provided on the entire top surface 100t, excluding the portion where the top surface wiring 11t is provided and the outer periphery. The thickness of the insulator 22 in the Z direction is thinner than the thickness of the top surface wiring 11t in the Z direction. This protects the element body 10 from the external environment.

[0156] (Third Modification) Fig. 11C is a schematic cross-sectional view of a first through wiring showing a third modification of an inductor component. As shown in Fig. 11C, in the third modification, the first through wiring 13 has a conductive layer 13s located on the outer periphery when viewed from the direction in which the first through wiring 13 extends, and a non-conductive layer 13u located inside the conductive layer 13s. When used in a high frequency band, current flows mainly through the surface of the first through wiring 13 due to the skin effect, so providing the conductive layer 13s on the outer periphery does not reduce the Q value. Furthermore, providing the non-conductive layer 13u on the inner side can alleviate stress and reduce manufacturing costs by not using a conductor.

[0157] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through hole V of the element body 10 by sputtering or electroless plating. Then, a plating layer is formed on the seed layer by electrolytic plating. In this manner, multiple conductive layers 13s, such as Ti / Cu / electrolytic Cu or Pd / electroless Cu / electrolytic Cu, can be formed on the outer periphery of the first through wiring 13. The inside of the conductive layer 13s is then sealed with resin by printing, heat pressing, or the like, to form the non-conductive layer 13u made of resin. In this manner, current can flow through the surface (conductive layer 13s) of the first through wiring 13, while stress can be alleviated by the non-conductive layer 13u inside the first through wiring 13.

[0158] Similarly, the second through wiring 14 may have a conductive layer located on the outer periphery when viewed in the direction in which the second through wiring 14 extends, and a non-conductive layer located inside the conductive layer.

[0159] The present disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the spirit and scope of the present disclosure. For example, the respective features of the first and second embodiments may be combined in various ways.

[0160] In the above embodiment, both the first external electrode and the second external electrode have a convex portion, but only one of the first external electrode and the second external electrode may have a convex portion. In this case, the external electrode without a convex portion may be connected to the bottom wiring, for example, through a via wiring provided in the element body.

[0161] The present disclosure includes the following aspects: <1> An element body including a first main surface and a second main surface opposing each other, a coil at least a portion of which is provided inside the element body and wound spirally along an axis, and a first external electrode and a second external electrode provided outside the element body and electrically connected to the coil, the axis of the coil being arranged parallel to the first main surface, the coil including: a plurality of first coil wirings provided on the first main surface side of the axis and arranged along the axis on a plane parallel to the first main surface, a plurality of second coil wirings provided on the second main surface side of the axis and arranged along the axis on a plane parallel to the second main surface, a plurality of first through wires extending from the first coil wiring toward the second coil wiring and arranged along the axis, and a plurality of second through wires extending from the first coil wiring toward the second coil wiring and provided on the opposite side of the axis to the first through wires and arranged along the axis, an inductor component, wherein the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to form at least a part of the spiral, the plurality of first coil wirings include an endmost coil wiring located at the end on one side in the axial direction, the endmost coil wiring having an upper surface located in a first direction from the second main surface side toward the first main surface side, and a first side surface and a second side surface located on both sides of a center line along the extension direction of the endmost coil wiring when viewed from a direction perpendicular to the first main surface, the first external electrode including a first portion in contact with at least a part of the first side surface, a second portion in contact with at least a part of the upper surface, and a third portion in contact with at least a part of the second side surface, the first portion, the second portion, and the third portion being successive in this order to form a convex portion protruding in the first direction. <2> The inductor component according to <1>, wherein the thickness of the first external electrode is thinner than the thickness of the first coil wiring. <3> The element body is made of SiO ２<4> The inductor component according to any one of <1> to <3>, wherein the first external electrode is composed of a plurality of conductive layers, including a conductive layer made of a material different from that of a conductive layer constituting the endmost coil wiring. <5> The inductor component according to any one of <1> to <4>, wherein the first external electrode further includes: a bottom portion provided continuously from the first portion of the convex portion on a side opposite to the second portion, extending in a direction parallel to the first main surface, and a wall portion provided continuously from the bottom portion and extending in the first direction. <6> The inductor component according to any one of <1> to <5>, wherein the first external electrode further includes a fourth portion spaced apart from the second portion and located closer to the first direction than the second portion. <7> The inductor component according to any one of <1> to <6>, wherein the first main surface has a recess, wherein the recess has a stepped side surface, and at least a portion of the first external electrode is in contact with the side surface and has a shape that follows the side surface. <8> The inductor component according to any one of <1> to <7>, further comprising an insulator provided on a portion of the first main surface, and at least a portion of the first external electrode is in continuous contact with the insulator, the first main surface, and the first side surface of the protrusion. <9> The inductor component according to any one of <1> to <8>, wherein the first coil wiring is provided on the first main surface, and further comprises an insulator that covers the first coil wiring and has a shape that follows the shape of the first coil wiring, and at least a portion of the first external electrode is in contact with the insulator and has a shape that follows the shape of the first coil wiring. <10> The inductor component according to any one of <1> to <9>, further comprising an organic insulator provided on the first main surface, wherein the element body is an inorganic insulator, and the organic insulator is located inside an outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface. <11> The inductor component according to any one of <1> to <10>, wherein the first through-wire and the second through-wire are not parallel when viewed from a direction parallel to the axis. <12> The element body is made of SiO ２ The first through-hole wiring is made of SiO ２<13> The inductor component according to any one of <1> to <12>, wherein the first through wiring includes a void portion or a resin portion. <14> The inductor component according to any one of <1> to <13>, wherein the first through wiring has a conductive layer located on the outer periphery as viewed in the direction in which the first through wiring extends, and a non-conductive layer located inside the conductive layer. <15> The inductor component according to any one of <1> to <14>, wherein the axial length of the coil is shorter than the inner diameter of the coil. <16> The inductor component according to any one of <1> to <15>, wherein the first through wiring extends in a direction orthogonal to the first main surface, and wherein a cross-sectional area of ​​at least one of both end portions in the extension direction of the first through wiring is larger than a cross-sectional area of ​​a central portion in the extension direction of the first through wiring. <17> The inductor component according to any one of <1> to <16>, wherein the thickness of the inductor component is 200 μm or less. <18> The inductor component according to any one of <1> to <17>, wherein the first external electrode and the second external electrode are located inside an outer surface of the element body when viewed in a direction perpendicular to the first main surface.

[0162] DESCRIPTION OF SYMBOLS 1, 1A-1H Inductor component 10 Body 11b Bottom wiring (first coil wiring) 11t Top wiring (second coil wiring) 11e Endmost coil wiring 13 First through wiring 13e End portion 13m Central portion 13s Conductive layer 13u Non-conductive layer 14 Second through wiring 22 Insulator 22a Opening 22u Top surface 100b Bottom surface (first main surface) 100t Top surface (second main surface) 100e1 First end surface 100e2 Second end surface 100s1 First side surface 100s2 Second side surface 110 Coil 121 First external electrode 121e1 Underlayer 121e2 Plating layer 122 Second external electrode 121s, 122s Step AX Axis BP1, BP2 Bottom WP1, WP2 Wall CL Center line C Recess CS Side of recess D1 First direction f1 to f3 First to third surfaces s1, s2 First and second side surfaces u Top surface t1, t2 Thickness P Protrusion P1 to P4 First to fourth portions V Through hole

Claims

1. A base body including a first main surface and a second main surface facing each other, a coil at least partially provided inside the base body and wound spirally along an axis, a first external electrode and a second external electrode provided outside the base body and electrically connected to the coil, comprising: the axis of the coil is arranged parallel to the first main surface, the coil a plurality of first coil wirings provided on the first main surface side with respect to the axis and arranged along the axis on a plane parallel to the first main surface, a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface, a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis, a plurality of second through wirings extending from the first coil wiring toward the second coil wiring and provided on the side opposite to the first through wiring with respect to the axis and arranged along the axis including, the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring are connected in this order to constitute at least a part of the spiral shape, the plurality of first coil wirings include an outermost coil wiring located at one end in the axial direction, the outermost coil wiring has an upper surface located on the first direction side from the second main surface side toward the first main surface side, and a first side surface and a second side surface located on both sides sandwiching a center line along the extending direction of the outermost coil wiring when viewed from a direction perpendicular to the first main surface, the first external electrode includes a first portion in contact with at least a part of the first side surface, a second portion in contact with at least a part of the upper surface, and a third portion in contact with at least a part of the second side surface, and the first portion, the second portion, and the third portion are continuously arranged in this order to form a convex portion protruding toward the first direction side, an inductor component.

2. The inductor component according to claim 1, wherein the thickness of the first external electrode is thinner than the thickness of the first coil wiring.

3. The base body contains SiO ２ The inductor component according to claim 1 or 2, which contains ２ .

4. The inductor component according to claim 1 or 2, wherein the first external electrode is composed of a plurality of conductive layers and includes a conductive layer having a different material from the conductive layer constituting the outermost coil wiring.

5. The first external electrode is continuously provided from the first portion of the convex portion to the side opposite to the second portion, and includes a bottom portion extending in a direction parallel to the first main surface, and a wall portion continuously provided from the bottom portion and extending in the first direction. The inductor component according to claim 1 or 2.

6. The first external electrode further includes a fourth portion that is separated from the second portion and is located on the first direction side of the second portion. The inductor component according to claim 1 or 2.

7. The first main surface has a recess, The recess has a stepped side surface, At least a part of the first external electrode is in contact with the side surface and has a shape along the side surface. The inductor component according to claim 1 or 2.

8. Further provided with an insulator provided on a part of the first main surface, At least a part of the first external electrode is in continuous contact with the insulator, the first main surface, and the first side surface of the convex portion. The inductor component according to claim 1 or 2.

9. The first coil wiring is provided on the first main surface, Further provided with an insulator covering the first coil wiring and having a shape along the shape of the first coil wiring, At least a part of the first external electrode is in contact with the insulator and has a shape along the shape of the first coil wiring. The inductor component according to claim 1 or 2.

10. Further provided with an organic insulator provided on the first main surface, The element body is an inorganic insulator, and the organic insulator is located inside the outer surface of the inorganic insulator when viewed from a direction perpendicular to the first main surface. The inductor component according to claim 1 or 2.

11. When viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel. The inductor component according to claim 1 or 2.

12. The base body contains SiO ２ and The first through-wiring is SiO ２ The inductor component according to claim 1 or 2, including.

13. The first through-wiring includes a void portion or a resin portion. The inductor component according to claim 1 or 2.

14. The first through-wiring has a conductive layer located on the outer peripheral side when viewed from the direction in which the first through-wiring extends, and a non-conductive layer located inside the conductive layer. The inductor component according to claim 1 or 2.

15. The axial length of the coil is shorter than the inner diameter of the coil. The inductor component according to claim 1 or 2.

16. The first through-wiring extends in a direction perpendicular to the first main surface, The inductor component according to claim 1 or 2, wherein the cross-sectional area of at least one of both end portions in the extending direction of the first through wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through wiring.

17. The inductor component according to claim 1 or 2, wherein the thickness of the inductor component is 200 μm or less.

18. The inductor component according to claim 1 or 2, wherein the first external electrode and the second external electrode are located inside the outer surface of the element body when viewed from a direction perpendicular to the first main surface.