Data generation method, data structure, manufacturing method, and additive manufacturing device

Abstract

Provided is a data generation method for generating manufacturing control information to be used by an additive manufacturing device to fabricate an object composed of a plurality of layers. This data generation method includes: acquiring first bead width information, which is information for fabricating beads with a first width, input by a user; acquiring second bead width information, which is information for fabricating beads with a second width, input by the user; and using the first bead width information and the second bead width information to generate manufacturing control information including first path information indicating a path for fabricating an object with the first width within a first layer among a plurality of layers, and second path information indicating a path for fabricating an object with the second width within the first layer.

Description

Data generation method, data structure, processing method and additional processing device

[0001] The present invention relates to the technical field of a data generation method for generating data used to form a shaped object, a data structure, and a processing method and an additional processing apparatus that use the generated data.

[0002] As one such method, a method has been proposed in which a plurality of slice images are generated from three-dimensional data of an object, and a tool path for a three-dimensional modeling device is generated based on the plurality of slice images (see Patent Document 1).

[0003] US 2019 / 212717

[0004] According to a first aspect, there is provided a data generation method for generating processing control information used by an additive processing device to form a model made up of a plurality of layers, the data generation method including: acquiring first bead width information input by a user, the first bead width information being information for forming a bead with a first width; acquiring second bead width information input by the user, the second bead width information being information for forming a bead with a second width different from the first width; and generating the processing control information based on the first bead width information and the second bead width information, the processing control information including first pass information indicating a path for forming the model with the first width in a first layer of the plurality of layers, and second pass information indicating a path for forming the model with the second width in the first layer.

[0005] According to a second aspect, a data generation method is provided for generating processing control information used by an additive processing device equipped with a processing head including at least a material supply port for supplying a forming material for forming a formed object to form a formed object, the data generation method including generating processing control information including first pass information indicating a first path for forming a bead with a first forming material, second pass information indicating a second path for forming a bead with a second forming material different from the first forming material, and information for moving the processing head to a position for changing the forming material supplied from the material supply port from the first forming material to the second forming material after the additive processing device has formed a bead based on the first pass information and before forming a bead based on the second pass information.

[0006] According to a third aspect, a data generation method is provided for generating processing control information used to form a structure by an additive processing device having a processing head including a beam irradiation device that irradiates at least a processing beam to form a structure and a material supply port for supplying a modeling material to a position where the processing beam is irradiated, the data generation method including: acquiring information input by a user regarding a melt region which is at least a part of the portion added by the additive processing device and which is melted by irradiating the processing beam or a melting beam different from the processing beam without supplying the modeling material; and generating processing control information which includes first pass information indicating a path for performing additional processing by supplying the modeling material to a position where the processing beam is irradiated, and second pass information indicating a path for irradiating the melt region with the processing beam or a melting beam different from the processing beam.

[0007] According to a fourth aspect, there is provided a data generation method for generating processing control information used by an additive processing device having a beam irradiation device that irradiates at least a processing beam for forming a structure, and a processing head including a material supply port that supplies a forming material to a position where the processing beam is irradiated, to form a structure, the data generation method including: acquiring information input by a user regarding a measurement area where measurements are made on at least one of the surface and the interior of the structure formed by the additive processing device; and generating processing control information including first pass information that indicates a path for performing additional processing by supplying the forming material to a position where the processing beam is irradiated, and second pass information that indicates a path along which a measuring device that measures the measurement area moves.

[0008] According to a fifth aspect, there is provided a data generation method including: reading management information including first data indicating a correspondence between model information indicating a three-dimensional model of a formed object and condition information indicating a forming condition for a processing device that forms the formed object; reading the model information and the condition information indicated by the first data included in the management information; and generating parameter information including changeable parameters as part of processing control information for controlling the processing device based on the three-dimensional model indicated by the model information and the forming conditions indicated by the condition information associated with the model information.

[0009] According to a sixth aspect, there is provided a data generation method for generating processing control information used by an additive processing apparatus to form a model consisting of a plurality of layers, the data generation method including: acquiring first bead width information input by a user, the first bead width information being information for forming a bead with a first width; automatically setting second bead width information being information for forming a bead with a second width different from the first width; and generating, based on the first bead width information and the second bead width information, processing control information including first pass information indicating a path for forming an object with the first width in a first layer of the plurality of layers, and second pass information indicating a path for forming an object with the second width in the first layer.

[0010] According to a seventh aspect, a data generation method is provided for generating processing control information used to form a formed object by an additive processing device equipped with a processing head including at least a material supply port for supplying a forming material for forming a formed object, the data generation method including generating processing control information including first pass information indicating a first path for forming a bead with a first forming material, second pass information indicating a second path for forming a bead with a second forming material different from the first forming material, and information for moving the processing head to a position different from the start position for forming a bead based on the second pass information after the additive processing device has formed a bead based on the first pass information and before forming a bead based on the second pass information.

[0011] According to an eighth aspect, a data generation method is provided for generating processing control information used by an additive processing device having a processing head including a beam irradiation device that irradiates at least a first processing beam to form a structure, and a material supply port for supplying a forming material to a position where the first processing beam is irradiated, to form a structure, the data generation method including: obtaining information regarding an additional processing area where at least a portion of the part added by the additive processing device is to be processed by irradiating the first processing beam or a second processing beam different from the first processing beam without supplying the forming material; and generating processing control information including first pass information indicating a path for performing additional processing by supplying the forming material to a position where the first processing beam is irradiated, and second pass information indicating a path for irradiating the additional processing area with the first processing beam or a second processing beam different from the first processing beam.

[0012] According to a ninth aspect, there is provided a data generation method including: setting first bead width information, which is information for forming a bead at a first width; setting second bead width information, which is information for forming a bead at a second width different from the first width; and generating the processing control information based on the first bead width information and the second bead width information, which includes first pass information indicating a path for forming an object at the first width and second pass information indicating a path for forming an object at the second width.

[0013] According to a tenth aspect, a data generation method is provided for generating processing control information used to form a formed object by an additive processing device equipped with a processing head including at least a material supply port for supplying a forming material for forming a formed object, the data generation method including generating processing control information including first pass information indicating a first path for forming a bead with a first forming material, second pass information indicating a second path for forming a bead with a second forming material different from the first forming material, and information for moving the processing head after the additive processing device has formed a bead based on the first pass information and before forming a bead based on the second pass information.

[0014] According to an eleventh aspect, a data generation method is provided for generating processing control information used to form a structure by an additive processing device equipped with a processing head including a beam irradiation device that irradiates at least a first processing beam to form a structure and a material supply port for supplying a forming material to a position where the processing beam is irradiated, the data generation method including generating processing control information including first pass information that indicates a path for performing additional processing by supplying the forming material to a position where the first processing beam is irradiated, and second pass information that indicates a path for additional processing by irradiating the first processing beam or a second processing beam different from the first processing beam.

[0015] According to a twelfth aspect, there is provided a data generation method for generating processing control information used to form a molded object by an additive processing device having a beam irradiation device that irradiates at least a processing beam for forming a molded object and a processing head that includes a material supply port that supplies a molding material to a position where the processing beam is irradiated, the data generation method including generating processing control information including first pass information that indicates a path for performing additional processing by supplying the molding material to a position where the processing beam is irradiated, and second pass information that indicates a path for performing measurements on at least one of the surface and interior of the molded object.

[0016] According to a thirteenth aspect, there is provided a data structure including first data indicating a correspondence between model information indicating a three-dimensional model of a formed object and condition information indicating forming conditions related to a processing device that forms the formed object.

[0017] According to the fourteenth aspect, there is provided a processing method that uses the processing control information generated by the data generation method provided by the ninth aspect, the processing method including: forming a bead with the first width based on the first pass information included in the processing control information; and forming a bead with the second width based on the second pass information included in the processing control information.

[0018] According to the 15th aspect, a processing method is provided that uses the processing control information generated by the data generation method provided by the 10th aspect, comprising: forming a bead using the first forming material supplied from the material supply port based on the first pass information included in the processing control information; forming a bead using the second forming material supplied from the material supply port based on the second pass information included in the processing control information; and, after the bead based on the first pass information has been formed and before the bead based on the second pass information has been formed, moving the processing head based on information for moving the processing head included in the processing control information.

[0019] According to the 16th aspect, a processing method is provided that uses the processing control information generated by the data generation method provided by the 11th aspect, and includes: supplying the molding material from the material supply port to a position where the first processing beam is irradiated by the beam irradiation device based on the first pass information included in the processing control information, thereby performing the additional processing; and, based on the second pass information included in the processing control information, the beam irradiation device irradiates the first processing beam or the second processing beam to perform the additional processing.

[0020] According to the 17th aspect, there is provided a processing method that uses the processing control information generated by the data generation method provided by the 12th aspect, and includes: supplying the modeling material from the material supply port to a position where the processing beam is irradiated by the beam irradiation device based on the first pass information included in the processing control information, thereby performing the additional processing; and performing measurements of at least one of the surface and interior of the modeled object based on the second pass information included in the processing control information.

[0021] According to the 18th aspect, there is provided an additional processing device that uses the processing control information generated by the data generation method provided by the 9th aspect, comprising a processing head and a control device that controls the processing head, wherein the control device controls the processing head to form a bead with the first width based on the first pass information included in the processing control information, and controls the processing head to form a bead with the second width based on the second pass information included in the processing control information.

[0022] According to a 19th aspect, an additive processing device is provided that uses the processing control information generated by the data generation method provided by the 10th aspect, and includes a processing head including a material supply port for supplying a modeling material, and a control device that controls the processing head, wherein the control device controls the processing head to supply the first modeling material from the material supply port to form a bead based on the first pass information included in the processing control information, controls the processing head to supply the second modeling material from the material supply port to form a bead based on the second pass information included in the processing control information, and moves the processing head to a position different from the start position of forming a bead based on the second pass information based on information for moving the processing head included in the processing control information after forming a bead based on the first pass information and before forming a bead based on the second pass information.

[0023] According to the 20th aspect, an additional processing apparatus is provided that uses the processing control information generated by the data generation method provided by the 11th aspect, and comprises a processing head including a beam irradiation device that irradiates a first processing beam to form a molded object, a material supply port for supplying a molding material, and a control device that controls the processing head, wherein the control device controls the processing head based on the first pass information included in the processing control information to supply the molding material from the material supply port to a position where the first processing beam is irradiated by the beam irradiation device to perform the additional processing, and controls the processing head based on the second pass information included in the processing control information so that the beam irradiation device irradiates the first processing beam or a second processing beam different from the first processing beam to perform the additional processing.

[0024] According to the 21st aspect, there is provided an additive processing apparatus that uses the processing control information generated by the data generation method provided by the 12th aspect, comprising a processing head including a beam irradiation device that irradiates a processing beam to form a molded object, a material supply port that supplies a molding material, and a control device that controls the processing head, wherein the control device controls the processing head to supply the molding material from the material supply port to a position where the processing beam is irradiated by the beam irradiation device based on the first pass information included in the processing control information, and controls the processing head to perform the additional processing, and based on the second pass information included in the processing control information, controls the processing head to perform measurements of at least one of the surface and interior of the molded object.

[0025] According to the 22nd aspect, an additive processing device is provided that includes a processing head including a material supply port for supplying a forming material for forming a formed object, and a control device that controls the processing head, wherein the control device controls the processing head to form a bead by supplying the first forming material from the material supply port based on first pass information indicating a first path for forming a bead with a first forming material, controls the processing head to form a bead by supplying the second forming material from the material supply port based on second pass information indicating a second path for forming a bead with a second forming material different from the first forming material, and moves the processing head to a position to change the forming material supplied from the material supply port from the first forming material to the second forming material after forming a bead based on the first pass information and before forming a bead based on the second pass information, based on information for moving the processing head.

[0026] According to the 23rd aspect, an additional processing device is provided, comprising a processing head including a material supply port for supplying a forming material for forming a formed object, and a control device for controlling the processing head, wherein the control device controls the processing head to form a bead by supplying a first forming material from the material supply port based on first pass information indicating a first path for forming a bead with a first forming material, controls the processing head to form a bead by supplying a second forming material from the material supply port based on second pass information indicating a second path for forming a bead with a second forming material different from the first forming material, and moves the processing head based on information for moving the processing head after forming a bead based on the first pass information and before forming a bead based on the second pass information.

[0027] The functions and other advantages of the present invention will become apparent from the following detailed description of the preferred embodiments.

[0028] FIG. 1 is a cross-sectional view showing the configuration of a processing system. FIG. 2 is a block diagram showing the configuration of the processing system. FIG. 3 is a diagram showing the structure of an irradiation optical system. FIG. 4(a) is a plan view showing the movement trajectory of a target irradiation area within a processing unit area, and FIG. 4(b) is a plan view showing the movement trajectory of a target irradiation area on a printing surface. FIGS. 5(a) and 5(b) are plan views showing the movement trajectory of a target irradiation area within a processing unit area, and FIG. 5(c) is a plan view showing the movement trajectory of a target irradiation area on a printing surface. FIGS. 6(a) to 6(e) are cross-sectional views showing a state in which a processing light is irradiated onto a certain area on a workpiece and a printing material is supplied. FIG. 7(a) is a plan view showing the target movement trajectory of a processing unit area, and FIG. 7(b) is a plan view showing a linear object to be printed on the printing surface when the processing unit area moves along the target movement trajectory shown in FIG. 7(a). 8( a) to 8(c) are cross-sectional views illustrating a process of forming a three-dimensional object. FIG. 8(a) to 8(c) are conceptual diagrams illustrating an example of a data flow. FIG. 8(a) is a diagram illustrating an example of a three-dimensional object including a plurality of portions. FIG. 8(c) is a flowchart illustrating an example of a data flow. FIG. 8(c) is a block diagram illustrating a configuration of an information processing device. FIG. 8(c) is an example of a screen related to bead width information presented to a user. FIG. 8(c) is a flowchart illustrating an example of an operation of an information processing device. FIG. 8(a) is an example of a cross-section of a layered structure indicated by slice data. FIG. 8(c) is a diagram illustrating an example of a path for forming a bead. FIG. 8(c) is a diagram for explaining a process of switching a forming material. FIG. 8(c) is a flowchart illustrating another example of an operation of an information processing device. FIG. 8(b) is a diagram illustrating a cross-sectional view of a pipe formed up to a first time point. FIG. 8(b) is a diagram illustrating a cross-sectional view of a pipe formed up to a second time point prior to the first time point. FIG. 8(c) is a flowchart illustrating another example of an operation of an information processing device. FIG. 24(a) is a diagram illustrating an example of a path indicated by measurement path information when the measuring instrument is an imaging device. FIG. 24B is a diagram showing an example of a route indicated by the measurement path information when the measuring instrument is a laser scanner.FIG. 10 is a conceptual diagram showing an example of a method for generating measurement path information when measurement path information linked to one piece of three-dimensional model information is used as measurement path information related to another piece of three-dimensional model information.

[0029] Hereinafter, embodiments of a data generation method, a data structure, a processing method, and an additional processing device will be described with reference to the drawings.

[0030] (1) Processing System SYS First, a processing system SYS capable of processing a workpiece W, which is an example of an object, will be described. The processing system SYS may perform additive processing based on laser metal deposition (LMD). Note that the laser metal deposition may also be referred to as direct energy deposition (DED). The additive processing based on the laser metal deposition is additive processing that forms a shaped object that is integrated with the workpiece W or that can be separated from the workpiece W by melting a shaping material M supplied to the workpiece W with processing light EL (i.e., an energy beam in the form of light). Since the processing system SYS performs additive processing, it may also be referred to as an additive processing device.

[0031] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For convenience of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (i.e., a predetermined direction within a horizontal plane), and the Z-axis direction is assumed to be vertical (i.e., a direction perpendicular to the horizontal plane, essentially an up-down direction). Furthermore, the rotation directions around the X-axis, Y-axis, and Z-axis (in other words, tilt directions) are referred to as the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be the direction of gravity. Furthermore, the XY plane may be assumed to be horizontal.

[0032] (1-1) Overall Configuration of Machining System SYS The configuration of the machining system SYS will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view that schematically shows the configuration of the machining system SYS. Figure 2 is a block diagram that shows the configuration of the machining system SYS.

[0033] The processing system SYS is capable of performing additive processing on the workpiece W. By performing additive processing on the workpiece W, the processing system SYS is capable of forming a shaped object that is integrated with (or separable from) the workpiece W. In this case, the additional processing performed on the workpiece W corresponds to processing that adds, to the workpiece W, a shaped object that is integrated with (or separable from) the workpiece W. Note that the shaped object may refer to any object that the processing system SYS forms. For example, the processing system SYS is capable of forming a three-dimensional shaped object ST (that is, a three-dimensional shaped object that has a size in all three-dimensional directions, a solid object, in other words, a shaped object that has a size in the X-axis direction, Y-axis direction, and Z-axis direction) as an example of a shaped object.

[0034] When the workpiece W is a stage 31 described below, the processing system SYS is capable of performing additional processing on the stage 31. When the workpiece W is a mounted object, which is an object placed on the stage 31, the processing system SYS is capable of performing additional processing on the mounted object. The mounted object placed on the stage 31 may be another three-dimensional object ST (i.e., an existing structure) formed by the processing system SYS. Note that FIG. 1 shows an example in which the workpiece W is an existing structure placed on the stage 31. Also, the following description will be given using an example in which the workpiece W is an existing structure placed on the stage 31.

[0035] The workpiece W may be a product that has a missing portion and needs to be repaired. In this case, the machining system SYS may perform repair processing to repair the product that needs to be repaired by performing additional processing to form a shaped object to fill the missing portion. In other words, the additional processing performed by the machining system SYS may include additional processing to add a shaped object to the workpiece W to fill the missing portion.

[0036] As described above, the processing system SYS is capable of performing additive processing based on the laser build-up welding method. In other words, the processing system SYS can also be said to be a 3D printer that processes objects using additive processing technology. Note that additive processing technology may also be referred to as rapid prototyping, rapid manufacturing, or additive manufacturing.

[0037] A processing system SYS using additive manufacturing technology sequentially forms multiple structural layers SL (see FIG. 7 , described later) to form a three-dimensional object ST in which multiple structural layers SL are stacked. In this case, the processing system SYS first sets the surface of the workpiece W as a printing surface MS on which the object is actually printed, and prints the first structural layer SL on the printing surface MS. The processing system SYS then sets the surface of the first structural layer SL as a new printing surface MS, and prints the second structural layer SL on the new printing surface MS. Thereafter, the processing system SYS repeats the same operations to form a three-dimensional object ST in which multiple structural layers SL are stacked.

[0038] The processing system SYS performs additive processing by processing the modeling material M using processing light EL, which is an energy beam. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, at least one of a metallic material and a resinous material can be used as the modeling material M. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the modeling material M. The modeling material M is a powdered material. In other words, the modeling material M is a powder. However, the modeling material M does not have to be a powder. For example, at least one of a wire-shaped modeling material and a gaseous modeling material may be used as the modeling material M.

[0039] Like the forming material M, the workpiece W may also be an object containing a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. The material of the workpiece W may be the same as or different from the forming material M. For example, at least one of a metallic material and a resinous material can be used as the material of the workpiece W. Examples of metallic materials include at least one of a material containing copper, a material containing tungsten, and a material containing stainless steel. However, materials other than metallic materials and resinous materials may also be used as the material of the workpiece W.

[0040] 1 and 2 , the processing system SYS includes a material supply source 1, a processing unit 2, a stage unit 3, a light source 4, a gas supply source 5, a control unit 7, and an imaging unit 8. The processing unit 2 and the stage unit 3 may be housed in a chamber space 63IN inside the housing 6. In this case, the processing system SYS may perform additional processing in the chamber space 63IN. Note that at least one of the processing unit 2 and the stage unit 3 does not have to be housed in the chamber space 63IN inside the housing 6.

[0041] The material supply source 1 supplies the processing unit 2 with the modeling material M. The material supply source 1 supplies a desired amount of modeling material M according to the required amount so that the amount of modeling material M required per unit time for performing additive processing is supplied to the processing unit 2.

[0042] The processing unit 2 processes the modeling material M supplied from the material supply source 1 to form a model. To form the model, the processing unit 2 includes a processing head 21 and a head drive system 22. The processing head 21 further includes an irradiation optical system 211 and a plurality of material nozzles 212. However, the processing head 21 may include a plurality of irradiation optical systems 211. The processing head 21 may also include a single material nozzle 212.

[0043] The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to the light source 4 that emits (generates) the processing light EL via a light transmission member 41. An example of the light transmission member 41 is at least one of an optical fiber and a light pipe.

[0044] In the example shown in Figures 1 and 2, the processing system SYS includes two light sources 4 (specifically, light sources 4#1 and 4#2), and the irradiation optical system 211 is optically connected to the light sources 4#1 and 4#2 via optical transmission members 41#1 and 41#2, respectively. The irradiation optical system 211 emits both the processed light EL propagating from the light source 4#1 via the optical transmission member 41#1 and the processed light EL propagating from the light source 4#2 via the optical transmission member 41#2. In the following description, when it is necessary to distinguish between the two processed light beams EL emitted by the irradiation optical system 211, the processed light EL generated by the light source 4#1 will be referred to as "processed light EL#1" and the processed light EL generated by the light source 4#2 will be referred to as "processed light EL#2."

[0045] However, the processing system SYS may include a single light source 4 instead of the multiple light sources 4. The irradiation optical system 211 may emit a single processing light EL instead of emitting multiple processing light EL.

[0046] The irradiation optical system 211 emits the processing light EL downward (i.e., toward the -Z side). A stage 31 is disposed below the irradiation optical system 211. When a workpiece W is placed on the stage 31, the irradiation optical system 211 irradiates the emitted processing light EL onto the printing surface MS. Specifically, the irradiation optical system 211 can irradiate the processing light EL onto a target irradiation area (target irradiation position) EA that is set on the printing surface MS as an area to be irradiated (typically, focused) with the processing light EL. In the following description, when it is necessary to distinguish between two target irradiation areas EA onto which the irradiation optical system 211 respectively irradiates two processing light beams EL, the target irradiation area EA onto which the irradiation optical system 211 irradiates processing light EL#1 will be referred to as the "target irradiation area EA#1," and the target irradiation area EA onto which the irradiation optical system 211 irradiates processing light EL#2 will be referred to as the "target irradiation area EA#2." Furthermore, the state of the irradiation optical system 211 can be switched between a state in which the processing light EL is irradiated onto the target irradiation area EA and a state in which the processing light EL is not irradiated onto the target irradiation area EA under the control of the control unit 7. The direction of the processing light EL emitted from the irradiation optical system 211 is not limited to being directly downward (i.e., coinciding with the -Z-axis direction) and may be, for example, a direction tilted by a predetermined angle with respect to the Z-axis. In other words, the third optical system 216 (or the fθ lens 2162) described later is not limited to being an optical system telecentric on the object side and may be an optical system non-telecentric on the object side.

[0047] The irradiation optical system 211 may form a molten pool MP on the printing surface MS by irradiating the printing surface MS with processing light EL. For example, the irradiation optical system 211 may form a molten pool MP#1 on the printing surface MS by irradiating the printing surface MS with processing light EL#1. For example, the irradiation optical system 211 may form a molten pool MP#2 on the printing surface MS by irradiating the printing surface MS with processing light EL#2. The molten pool MP#1 and the molten pool MP#2 may be integrated. Alternatively, the molten pool MP#1 and the molten pool MP#2 may be separated from each other. However, the molten pool MP#1 may not be formed on the printing surface MS by irradiating the printing surface MS with processing light EL#1. The molten pool MP#2 may not be formed on the printing surface MS by irradiating the printing surface MS with processing light EL#2. Note that the irradiation optical system 211 irradiates the processing light EL (i.e., an energy beam in the form of light), and therefore may also be referred to as a beam irradiation device.

[0048] The material nozzle 212 supplies (e.g., injects, jets, spouts, or sprays) the modeling material M. The material nozzle 212 is physically connected to the material supply source 1, which is a supply source of the modeling material M, via the supply pipe 11 and the mixer 12. The material nozzle 212 supplies the modeling material M supplied from the material supply source 1 via the supply pipe 11 and the mixer 12. The material nozzle 212 may pressure-feed the modeling material M supplied from the material supply source 1 via the supply pipe 11. That is, the modeling material M from the material supply source 1 and a conveying gas (i.e., a pressure-feed gas, for example, an inert gas such as nitrogen or argon) may be mixed in the mixer 12 and then pressure-feed to the material nozzle 212 via the supply pipe 11. As a result, the material nozzle 212 supplies the modeling material M together with the conveying gas. For example, a purge gas supplied from the gas supply source 5 is used as the conveying gas. However, a gas supplied from a gas supply source different from the gas supply source 5 may be used as the transport gas.

[0049] 1, the material nozzle 212 is depicted as being tubular, but the shape of the material nozzle 212 is not limited to this. The material nozzle 212 supplies the modeling material M downward (i.e., toward the -Z side). A stage 31 is disposed below the material nozzle 212. When a workpiece W is mounted on the stage 31, the material nozzle 212 supplies the modeling material M toward the modeling surface MS. The direction of travel of the modeling material M supplied from the material nozzle 212 is inclined at a predetermined angle (for example, an acute angle) with respect to the Z-axis direction, but may also be toward the -Z side (i.e., directly downward).

[0050] The material nozzle 212 may supply the modeling material M to a position where at least one of the processing lights EL#1 and EL#2 is irradiated (i.e., at least one of the target irradiation areas EA#1 and EA#2). For this reason, the material nozzle 212 and the irradiation optical systems 211#1 and 211#2 may be aligned so that a target supply area MA, which is set on the modeling surface MS as an area where the material nozzle 212 supplies the modeling material M, at least partially overlaps with at least one of the target irradiation areas EA#1 and EA#2. The size of the target supply area MA may be larger, smaller, or the same as the size of at least one of the target irradiation areas EA#1 and EA#2.

[0051] The material nozzle 212 may supply the building material M to the molten pool MP. Specifically, the material nozzle 212 may supply the building material M to at least one of the molten pool MP#1 and the molten pool MP#2. However, the material nozzle 212 does not have to supply the building material M to the molten pool MP. For example, the processing system SYS may melt the building material M from the material nozzle 212 using processing light EL emitted from the irradiation optical system 211 before the building material M reaches the workpiece W, and then adhere the molten building material M to the workpiece W. Note that since the material nozzle 212 supplies the building material M, it may also be referred to as a material supply port.

[0052] The irradiation optical system 211 and the material nozzle 212 may be housed in a head housing 213 provided in the processing head 21. The head housing 213 is a housing having an internal storage space for storing the irradiation optical system 211 and the material nozzle 212. In this case, the irradiation optical system 211 and the material nozzle 212 may be housed in the internal storage space of the head housing 213.

[0053] The head drive system 22 moves the machining head 21 under the control of the control unit 7. That is, the head drive system 22 moves the irradiation optical system 211 and the material nozzle 212 under the control of the control unit 7. The head drive system 22 moves the machining head 21, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. Note that the operation of moving the machining head 21 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the machining head 21 around at least one of the rotation axis along the X-axis, the rotation axis along the Y-axis, and the rotation axis along the Z-axis.

[0054] When the head drive system 22 moves the machining head 21, the relative positional relationship between the machining head 21 and the stage 31 and the workpiece W placed on the stage 31 changes. As a result, the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211 provided in the machining head 21 changes. For this reason, the head drive system 22 may be considered to function as a position changing device that can change the relative positional relationship between the stage 31, the workpiece W, and the irradiation optical system 211. Furthermore, when the relative positional relationship between the stage 31, the workpiece W, and the machining head 21 changes, the relative positional relationship between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also changes. In other words, the target irradiation areas EA#1 and EA#2 and the target supply area MA each move along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction on the surface of the workpiece W (more specifically, the build surface MS on which additional machining is performed). In this case, it may be considered that the head drive system 22 moves the processing head 21 so that the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the printing surface MS.

[0055] The stage unit 3 includes a stage 31 and a stage drive system 32. The stage 31 may also be called a table.

[0056] The workpiece W is placed on the stage 31. Specifically, the workpiece W is placed on a stage placement surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed on the stage 31. The stage 31 may be capable of holding the workpiece W placed on the stage 31. In this case, the stage 31 may be equipped with at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like to hold the workpiece W. Alternatively, the stage 31 may not be capable of holding the workpiece W placed on the stage 31. In this case, the workpiece W may be placed on the stage 31 in a clampless manner. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The above-mentioned irradiation optical system 211 emits each of the processing lights EL#1 and EL#2 during at least a portion of the period during which the workpiece W is placed on the stage 31. Furthermore, the material nozzle 212 described above supplies the modeling material M for at least a portion of the period during which the workpiece W is placed on the stage 31 .

[0057] The stage drive system 32 moves the stage 31. The stage drive system 32 moves the stage 31, for example, along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction. Note that the operation of moving the stage 31 along at least one of the θX direction, θY direction, and θZ direction may be considered equivalent to the operation of rotating the stage 31 around at least one of a rotation axis along the X-axis (i.e., A-axis), a rotation axis along the Y-axis (i.e., B-axis), and a rotation axis along the Z-axis (i.e., C-axis).

[0058] When the stage drive system 32 moves the stage 31, the relative positional relationships between the machining head 21 and the stage 31 and between the workpiece W and the irradiation optical system 211 provided in the machining head 21 change. As a result, the relative positional relationships between the stage 31, the workpiece W, and the irradiation optical system 211 provided in the machining head 21 change. For this reason, the stage drive system 32, like the head drive system 22, may be considered to function as a position changing device that can change the relative positional relationships between the stage 31, the workpiece W, and the irradiation optical system 211. Furthermore, when the relative positional relationships between the stage 31, the workpiece W, and the machining head 21 change, the relative positional relationships between the target irradiation areas EA#1 and EA#2 and the target supply area MA and the workpiece W also change. In other words, the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the surface of the workpiece W (more specifically, the printing surface MS) along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction. In this case, it may be considered that the stage drive system 32 moves the stage 31 so that the target irradiation areas EA#1 and EA#2 and the target supply area MA each move on the printing surface MS.

[0059] The light source 4 emits, for example, at least one of infrared light, visible light, and ultraviolet light as the processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include a plurality of pulsed lights (i.e., a plurality of pulse beams). The processing light EL may be laser light. In this case, the light source 4 may include a laser light source (e.g., a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２ At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 4 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0060] As described above, the processing system SYS includes multiple light sources 4 (specifically, light sources 4#1 and 4#2). In this case, the characteristics of the processing light EL#1 emitted by light source 4#1 and the characteristics of the processing light EL#2 emitted by light source 4#2 may be the same. For example, the wavelength of the processing light EL#1 (typically, the peak wavelength, which is the wavelength at which the intensity is maximum in the wavelength band of the processing light EL#1) and the wavelength of the processing light EL#2 (typically, the peak wavelength) may be the same. For example, the wavelength band of the processing light EL#1 (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value) and the wavelength band of the processing light EL#2 may be the same. For example, the intensity of the processing light EL#1 and the intensity of the processing light EL#2 may be the same. For example, the absorptivity of the workpiece W for the processing light EL#1 (or the object whose surface MS is the surface; the same applies below) may be the same as the absorptivity of the workpiece W for the processing light EL#2. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be the same. Alternatively, the characteristics of processing light EL#1 emitted by light source 4#1 and the characteristics of processing light EL#2 emitted by light source 4#2 may be different. For example, the wavelength (typically, peak wavelength) of processing light EL#1 and the wavelength (typically, peak wavelength) of processing light EL#2 may be different. For example, the wavelength band of processing light EL#1 and the wavelength band of processing light EL#2 may be different. For example, the intensity of processing light EL#1 and the intensity of processing light EL#2 may be different. For example, the absorptivity of the workpiece W for processing light EL#1 and the absorptivity of the workpiece W for processing light EL#2 may be different. In particular, the absorptivity of the workpiece W for the peak wavelength of processing light EL#1 and the absorptivity of the workpiece W for the peak wavelength of processing light EL#2 may be different.

[0061] 2 includes multiple (e.g., two) light sources 4. However, the processing system SYS does not necessarily have to include multiple light sources 4. The processing system SYS may include a single light source 4. As an example, the processing system may include a light source that emits (supplies) light in a wide wavelength band or multiple wavelengths as the single light source 4. In this case, the processing system SYS may generate processing light EL#1 and processing light EL#2 having different wavelengths by wavelength-dividing the light emitted from this light source.

[0062] The gas supply source 5 is a supply source of purge gas for purging the chamber space 63IN inside the housing 6. The purge gas includes an inert gas. Examples of the inert gas include nitrogen gas and argon gas. The gas supply source 5 is connected to the chamber space 63IN via a supply port 62 formed in a partition member 61 of the housing 6 and a supply pipe 51 connecting the gas supply source 5 and the supply port 62. The gas supply source 5 supplies purge gas to the chamber space 63IN via the supply pipe 51 and the supply port 62. As a result, the chamber space 63IN becomes a space purged with the purge gas. The purge gas supplied to the chamber space 63IN may be discharged from an exhaust port (not shown) formed in the partition member 61. The gas supply source 5 may be a cylinder containing an inert gas. When the inert gas is nitrogen gas, the gas supply source 5 may be a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0063] As described above, when the material nozzle 212 supplies the modeling material M together with a purge gas, the gas supply source 5 may supply the purge gas to the mixer 12 to which the modeling material M is supplied from the material supply source 1. Specifically, the gas supply source 5 may be connected to the mixer 12 via a supply pipe 52 connecting the gas supply source 5 and the mixer 12. As a result, the gas supply source 5 supplies the purge gas to the mixer 12 via the supply pipe 52. In this case, the modeling material M from the material supply source 1 may be supplied (specifically, pressure-fed) through the supply pipe 11 toward the material nozzle 212 by the purge gas supplied from the gas supply source 5 via the supply pipe 52. In other words, the gas supply source 5 may be connected to the material nozzle 212 via the supply pipe 52, the mixer 12, and the supply pipe 11. In this case, the material nozzle 212 supplies the modeling material M together with the purge gas for pressure-fed the modeling material M.

[0064] The control unit 7 controls the operation of the machining system SYS. For example, the control unit 7 may control the machining unit 2 (e.g., at least one of the machining head 21 and the head drive system 22) provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the material supply source 1 provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the light source 4 provided in the machining system SYS to perform additional machining on the workpiece W. For example, the control unit 7 may control the gas supply source 5 provided in the machining system SYS to perform additional machining on the workpiece W.

[0065] The control unit 7 may include, for example, an arithmetic device 71 and a storage device 72. The arithmetic device 71 may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device 72 may include, for example, a memory. The control unit 7 functions as a device that controls the operation of the machining system SYS when the arithmetic device 71 executes a computer program. This computer program is a computer program for causing the arithmetic device 71 to perform (i.e., execute) the operations to be performed by the control unit 7, which will be described later. In other words, this computer program is a computer program for causing the control unit 7 to function so as to cause the machining system SYS to perform the operations to be described later. The computer program executed by the arithmetic device 71 may be recorded in the storage device 72 (i.e., a recording medium) included in the control unit 7, or may be recorded in any storage medium (e.g., a hard disk or a semiconductor memory) built into the control unit 7 or externally attachable to the control unit 7. Alternatively, the computing device 71 may download the computer program to be executed via a network interface from a device external to the control unit 7. The storage device 72 may also be called a recording device.

[0066] The control unit 7 may control the emission mode of the processing light EL by the irradiation optical system 211. The emission mode may include, for example, at least one of the intensity of the processing light EL and the emission timing of the processing light EL. When the processing light EL includes multiple pulsed lights, the emission mode may include, for example, at least one of the emission duration of the pulsed light, the emission cycle of the pulsed light, and the ratio between the emission duration of the pulsed light and the emission cycle of the pulsed light (so-called duty ratio). Furthermore, the control unit 7 may control the movement mode of the processing head 21 by the head drive system 22. The control unit 7 may control the movement mode of the stage 31 by the stage drive system 32. The movement mode may include, for example, at least one of the movement amount, movement speed, movement direction, and movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 212. The supply mode may include, for example, at least one of the supply amount (particularly, the supply amount per unit time) and the supply timing (supply time).

[0067] The control unit 7 does not have to be provided inside the machining system SYS. For example, the control unit 7 may be provided outside the machining system SYS as a server or the like. In this case, the control unit 7 and the machining system SYS may be connected via a wired and / or wireless network (or a data bus and / or communication line). The wired network may be a network using a serial bus interface, such as at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485, and USB. The wired network may be a network using a parallel bus interface. The wired network may be a network using an interface compliant with Ethernet (registered trademark), such as at least one of 10BASE-T, 100BASE-TX, and 1000BASE-T. The wireless network may be a network using radio waves. An example of a network using radio waves is a network compliant with IEEE 802.1x (for example, at least one of a wireless LAN and Bluetooth (registered trademark)). A network using infrared rays may be used as the wireless network. A network using optical communication may be used as the wireless network. In this case, the control unit 7 and the machining system SYS may be configured to be able to send and receive various information via the network. The control unit 7 may also be able to send information such as commands and control parameters to the machining system SYS via the network. The machining system SYS may include a receiving device that receives information such as commands and control parameters from the control unit 7 via the network. The machining system SYS may also include a transmitting device (i.e., an output device that outputs information to the control unit 7) that transmits information such as commands and control parameters to the control unit 7 via the network.Alternatively, a first control device that performs part of the processing performed by the control unit 7 may be provided inside the processing system SYS, while a second control device that performs another part of the processing performed by the control unit 7 may be provided outside the processing system SYS.

[0068] A computational model that can be constructed by machine learning may be implemented in the control unit 7 by the arithmetic device 71 executing a computer program. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The control unit 7 may use the computational model to control the operation of the machining system SYS. In other words, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that a computational model that has been constructed by offline machine learning using training data may be implemented in the control unit 7. Furthermore, the computational model implemented in the control unit 7 may be updated on the control unit 7 by online machine learning. Alternatively, the control unit 7 may control the operation of the machining system SYS using a calculation model implemented in a device external to the control unit 7 (that is, a device provided outside the machining system SYS) in addition to or instead of the calculation model implemented in the control unit 7.

[0069] The recording medium for recording the computer program executed by the control unit 7 may be at least one of the following: a CD-ROM, CD-R, CD-RW, a flexible disk, an MO, a DVD-ROM, a DVD-RAM, a DVD-R, a DVD+R, a DVD-RW, a DVD+RW, and an optical disk such as Blu-ray (registered trademark), a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device in which a computer program is implemented in an executable state in at least one of the forms of software and firmware). Furthermore, each process or function included in the computer program may be realized by a logical processing block realized in the control unit 7 when the control unit 7 (i.e., the computer) executes the computer program, or may be realized by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array) or ASIC (Application Specific Integrated Circuit)) included in the control unit 7, or may be realized in a form in which the logical processing block and a partial hardware module that realizes some elements of the hardware are mixed.

[0070] The imaging unit 8 is an imaging device capable of capturing an image of an imaging target under the control of the control unit 7. Therefore, the imaging unit 8 may include a camera capable of capturing an image of the imaging target. The camera may include an imaging element. The imaging element may include a CCD (Charged Coupled Device) sensor. The imaging element may include a CMOS (Complementary Metal Oxide Semiconductor) sensor. In this case, the imaging unit 8 may capture an image of the imaging target by receiving light from the imaging target with the imaging element. In other words, the imaging unit 8 may capture an image of the imaging target by exposing the imaging element to light from the imaging target. Note that "exposure of the imaging element using light from the imaging target" may also be referred to as "exposure by the imaging element (i.e., by the imaging unit 8) (exposure of the imaging target)."

[0071] The imaged object may include at least a portion of the workpiece W. The imaged object may include at least a portion of a structure formed by the processing system SYS. In particular, the imaged object may include at least a portion of an object on which a structure surface MS is set. As described above, the structure surface MS is set on the surface of the workpiece W or the structure layer SL. Therefore, the imaged object may include at least a portion of the workpiece W or at least a portion of the structure layer SL.

[0072] As described above, a molten pool MP is formed on the build surface MS by the processing light EL. In this case, the imaging unit 8 may be capable of imaging the molten pool MP. That is, the imaging unit 8 may be capable of imaging an area including the molten pool MP (i.e., an area on the build surface MS that includes the molten pool MP). In the following description, an example will be described in which the imaging unit 8 images the molten pool MP. That is, in the following description, an example will be described in which the imaging unit 8 images an area including the molten pool MP (i.e., an area on the build surface MS that includes the molten pool MP).

[0073] The imaging unit 8 may be attached to the processing head 21. For example, as shown in FIG. 1 , the imaging unit 8 may be attached to the head housing 213 of the processing head 21. In this case, when the processing head 21 is moved by the head drive system 22, the imaging unit 8 attached to the processing head 21 also moves together with the processing head 21. In this case, the relative positional relationship between the processing head 21 and the imaging unit 8 is fixed. However, the imaging unit 8 does not have to be attached to the processing head 21. The imaging unit 8 may be attached to an object different from the processing head 21.

[0074] The imaging unit 8 captures an image of the object to be imaged, thereby generating an image in which the object to be imaged is captured. In this embodiment, since the imaging unit 8 captures an image of the molten pool MP as described above, the imaging unit 8 generates an image in which the molten pool MP is captured. In the following description, the image generated by the imaging unit 8 (i.e., the image in which the molten pool MP is captured) will be referred to as a "molten pool image IMG."

[0075] The imaging unit 8 may output the generated molten pool image IMG to the control unit 7. The control unit 7 may control the machining system SYS based on the molten pool image IMG. For example, the control unit 7 may control the machining unit 2 (e.g., at least one of the machining head 21 and the head drive system 22) to perform additional machining on the workpiece W based on the molten pool image IMG. For example, the control unit 7 may control the stage unit 3 (e.g., the stage drive system 32) to perform additional machining on the workpiece W based on the molten pool image IMG. For example, the control unit 7 may control the material supply source 1 to perform additional machining on the workpiece W based on the molten pool image IMG. For example, the control unit 7 may control the light source 4 to perform additional machining on the workpiece W based on the molten pool image IMG. For example, the control unit 7 may control the gas supply source 5 to perform additional machining on the workpiece W based on the molten pool image IMG.

[0076] The imaging unit 8 may be referred to as a light receiving device because it receives light from the molten pool MP or an imaging target including at least a portion of the workpiece W or at least a portion of the structural layer SL. The imaging unit 8 may also be referred to as a detection device that detects light from the molten pool MP or an imaging target including at least a portion of the workpiece W or at least a portion of the structural layer SL. The imaging unit 8 may also measure the molten pool MP or an imaging target including at least a portion of the workpiece W or at least a portion of the structural layer SL, in which case the imaging unit 8 may be referred to as a measurement device.

[0077] (1-2) Structure of the Irradiation Optical System 211 The structure of the irradiation optical system 211 will be described with reference to Fig. 3. Fig. 3 is a diagram showing the structure of the irradiation optical system 211.

[0078] As shown in FIG. 3 , the irradiation optical system 211 includes a first optical system 214, a second optical system 215, and a third optical system 216. The first optical system 214 is an optical system into which the processing light EL#1 emitted from the light source 4#1 is incident. The first optical system 214 is an optical system that outputs the processing light EL#1 emitted from the light source 4#1 toward the third optical system 216. The second optical system 215 is an optical system into which the processing light EL#2 emitted from the light source 4#2 is incident. The second optical system 215 is an optical system that outputs the processing light EL#2 emitted from the light source 4#2 toward the third optical system 216. The third optical system 216 is an optical system into which the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 are incident. The third optical system 216 is an optical system that emits the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 toward the printing surface MS.

[0079] The first optical system 214 includes a collimator lens 2141, a parallel plate 2142, a power meter 2143, and a galvanometer scanner 2144. The galvanometer scanner 2144 includes a focus control optical system 2145 and a galvanometer mirror 2146. However, the first optical system 214 does not necessarily have to include at least one of the collimator lens 2141, the parallel plate 2142, the power meter 2143, and the galvanometer scanner 2144. The galvanometer scanner 2144 does not necessarily have to include at least one of the focus control optical system 2145 and the galvanometer mirror 2146.

[0080] The processing light EL#1 emitted from the light source 4#1 is incident on the collimator lens 2141. The collimator lens 2141 converts the processing light EL#1 incident on the collimator lens 2141 into parallel light. Note that if the processing light EL#1 emitted from the light source 4#1 is parallel light (i.e., if the processing light EL#1, which is parallel light, enters the first optical system 214), the first optical system 214 does not need to be equipped with the collimator lens 2141. The processing light EL#1 converted into parallel light by the collimator lens 2141 is incident on the parallel plate 2142. A portion of the processing light EL#1 incident on the parallel plate 2142 passes through the parallel plate 2142. The other portion of the processing light EL#1 incident on the parallel plate 2142 is reflected by the parallel plate 2142.

[0081] The processing light EL#1 that has passed through the parallel plate 2142 is incident on the galvanometer scanner 2144. Specifically, the processing light EL#1 that has passed through the parallel plate 2142 is incident on the focus control optical system 2145 of the galvanometer scanner 2144.

[0082] The focus control optical system 2145 is an optical element that can change the focusing position CP of the processing light EL#1 (hereinafter referred to as the "focus position CP#1"). Specifically, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the irradiation direction of the processing light EL#1 that is irradiated onto the printing surface MS. In the example shown in FIG. 3, the irradiation direction of the processing light EL#1 that is irradiated onto the printing surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2145 can change the focusing position CP#1 of the processing light EL#1 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the printing surface MS with the processing light EL from above the workpiece W, the irradiation direction of the processing light EL#1 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). For this reason, the focus control optical system 2145 may be considered to be able to change the focusing position CP#1 of the processing light EL#1 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus optical system 2145 may be considered to be able to change the focusing position CP#1 of the processing light EL#1 along the direction of the optical axis AX of the irradiation optical system 211 (typically, the third optical system 216).

[0083] The irradiation direction of the processing light EL#1 may refer to the irradiation direction of the processing light EL#1 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#1 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0084] The focus control optical system 2145 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#1. In this case, the focus control optical system 2145 may change the focusing position CP#1 of the processing light EL#1 by moving at least one of the plurality of lenses along its optical axis direction.

[0085] When the focus control optical system 2145 changes the condensing position CP#1 of the processing light EL#1, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS changes. In particular, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. For this reason, it can be considered that the focus control optical system 2145 changes the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS by changing the condensing position CP#1 of the processing light EL#1.

[0086] As described above, the galvanometer scanner 2144 does not necessarily have to include the focus control optical system 2145. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#1 changes, the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 changes. Therefore, even if the galvanometer scanner 2144 does not include the focus control optical system 2145, the processing system SYS can change the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1. For example, the processing system SYS may change the positional relationship between the condensing position CP#1 of the processing light EL#1 and the printing surface MS in the irradiation direction of the processing light EL#1 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#1. For example, the processing system SYS may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#1, thereby changing the positional relationship between the focusing position CP#1 of the processing light EL#1 in the irradiation direction of the processing light EL#1 and the manufacturing surface MS.

[0087] The processing light EL#1 emitted from the focus control optical system 2145 is incident on the galvanometer mirror 2146. The galvanometer mirror 2146 deflects the processing light EL#1, thereby changing the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146. For this reason, the galvanometer mirror 2146 may be referred to as a deflection optical system. When the emission direction of the processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the position from which the processing light EL#1 is emitted from the processing head 21 is changed. When the position from which the processing light EL#1 is emitted from the processing head 21 is changed, the target irradiation area EA#1 onto which the processing light EL#1 is irradiated on the printing surface MS moves. In other words, the irradiation position onto which the processing light EL#1 is irradiated on the printing surface MS moves. For this reason, the galvanometer mirror 2146 may be considered to function as an irradiation position moving device that can move the irradiation position of the processing light EL#1 on the printing surface MS.

[0088] In particular, when the emission direction of processing light EL#1 emitted from the galvanometer mirror 2146 is changed, the irradiation position of processing light EL#1 with respect to the processing head 21 including the galvanometer mirror 2146 is changed. For this reason, the galvanometer mirror 2146 may be considered to function as a position changing device that can change the irradiation position of processing light EL#1 with respect to the processing head 21.

[0089] The galvanometer mirror 2146 includes, for example, an X-scan mirror 2146MX, an X-scan motor 2146AX, a Y-scan mirror 2146MY, and a Y-scan motor 2146AY. The processing light EL#1 emitted from the focus control optical system 2145 is incident on the X-scan mirror 2146MX. The X-scan mirror 2146MX reflects the processing light EL#1 incident on the X-scan mirror 2146MX toward the Y-scan mirror 2146MY. The Y-scan mirror 2146MY reflects the processing light EL#1 incident on the Y-scan mirror 2146MY toward the third optical system 216. Note that each of the X-scan mirror 2146MX and the Y-scan mirror 2146MY may be referred to as a galvanometer mirror.

[0090] The X-scan motor 2146AX swings or rotates the X-scan mirror 2146MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2146MX with respect to the optical path of processing light EL#1 incident on the X-scan mirror 2146MX is changed. In this case, the swing or rotation of the X-scan mirror 2146MX causes processing light EL#1 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of processing light EL#1) moves along the X-axis direction on the printing surface MS.

[0091] The Y-scan motor 2146AY swings or rotates the Y-scan mirror 2146MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2146MY with respect to the optical path of the processing light EL#1 incident on the Y-scan mirror 2146MY is changed. In this case, the swing or rotation of the Y-scan mirror 2146MY causes the processing light EL#1 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#1 (i.e., the irradiation position of the processing light EL#1) moves along the Y-axis direction on the printing surface MS.

[0092] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 is referred to as the machining unit area BSA (particularly, the machining unit area BSA#1). In this case, the target irradiation area EA#1 may be considered to move on a surface of the printing surface MS that overlaps with the machining unit area BSA#1. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2146 moves the target irradiation area EA#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without changing) is referred to as the machining unit area BSA (particularly, the machining unit area BSA#1). The machining unit area BSA#1 indicates the virtual area (in other words, the range) through which the machining head 21 actually performs additional machining using the machining light EL#1 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#1 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#1 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#1 indicates a region (in other words, a range) through which the target irradiation area EA#1 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area BSA#1 may be considered to be a virtual region determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area BSA#1 may be considered to be a virtual region located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#1 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area BSA#1.

[0093] In this case, the machining system SYS can use the galvanometer mirror 2146 to move the target irradiation area EA#1 within the machining unit area BSA#1. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the target irradiation area EA#1 within the machining unit area BSA#1. Furthermore, as described above, the molten pool MP#1 is formed by irradiating the target irradiation area EA#1 with the machining light EL#1. In this case, the machining system SYS may be considered to move the molten pool MP#1 within the machining unit area BSA#1 using the galvanometer mirror 2146. Therefore, the operation of deflecting the machining light EL#1 using the galvanometer mirror 2146 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area BSA#1. In other words, the operation of moving the target irradiation area EA#1 within the machining unit area BSA#1 may be considered equivalent to the operation of moving the molten pool MP#1 within the machining unit area BSA#1.

[0094] As described above, even if at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#1 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area BSA#1 determined based on the machining head 21 (i.e., the machining unit area BSA#1 to which the galvanometer mirror 2146 moves the target irradiation area EA#1 on the printing surface MS) moves on the printing surface MS. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area BSA#1 relative to the printing surface MS.

[0095] As an example of an operation for moving the target irradiation area EA#1 within the processing unit area BSA#1, as shown in FIG. 4A, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#1 along a single scanning direction along the printing surface MS, assuming that the processing unit area BSA#1 is stationary (i.e., not moving) on ​​the printing surface MS. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 moves along a single scanning direction within a coordinate system defined based on the processing unit area BSA#1. In particular, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth within the processing unit area BSA#1 along the single scanning direction. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 periodically moves back and forth on an axis along a single scanning direction within the processing unit area BSA#1. In this case, the shape of the processing unit area BSA#1 along which the target irradiation area EA#1 moves may be a rectangle whose longitudinal direction is the movement direction of the target irradiation area EA#1.

[0096] As another example of the operation of moving the molten pool MP#1 within the machining unit area BSA#1, as shown in Figures 5(a) and 5(b), the galvanometer mirror 2146 may deflect the machining light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions along the machining surface MS within the machining unit area BSA#1, assuming that the machining unit area BSA#1 is stationary (i.e., not moving) on ​​the machining surface MS. In other words, the galvanometer mirror 2146 may deflect the machining light EL#1 so that the target irradiation area EA#1 moves along multiple scanning directions within a coordinate system defined based on the machining unit area BSA#1. In particular, the galvanometer mirror 2146 may deflect the machining light EL#1 so that the target irradiation area EA#1 periodically moves back and forth along each of the multiple scanning directions within the machining unit area BSA#1. In other words, the galvanometer mirror 2146 may deflect the processing light EL#1 so that the target irradiation area EA#1 within the processing unit area BSA#1 moves back and forth periodically on axes along each of multiple scanning directions.

[0097] 5A shows an example in which the target irradiation area EA#1 moves back and forth along the X-axis and Y-axis directions within the processing unit area BSA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area BSA#1 is circular. In this case, the shape of the processing unit area BSA#1 through which the target irradiation area EA#1 moves may be circular. FIG. 5B shows an example in which the target irradiation area EA#1 moves back and forth along the X-axis and Y-axis directions within the processing unit area BSA#1 so that the movement trajectory of the target irradiation area EA#1 within the processing unit area BSA#1 is mesh-shaped. In this case, the shape of the processing unit area BSA#1 through which the target irradiation area EA#1 moves may be rectangular.

[0098] 4A, 5A, and 5B, the operation of periodically moving the target irradiation area EA#1 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#1 so that the target irradiation area EA#1 moves periodically on the printing surface MS may be referred to as a wobbling operation.

[0099] The control unit 7 may move at least one of the machining head 21 and the stage 31 so that the machining unit area BSA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area BSA#1 using the galvanometer mirror 2146. In other words, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the machining unit area BSA#1 moves on the manufacturing surface MS during a period in which the target irradiation area EA#1 is moved within the machining unit area BSA#1 using the galvanometer mirror 2146.

[0100] For example, in the example shown in FIG. 4A, the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area BSA#1 moves along a target movement trajectory MT0 that intersects (or, in some cases, is perpendicular to) the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area BSA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along a scanning direction that intersects (or, in some cases, is perpendicular to) the target movement trajectory MT0 of the processing unit area BSA#1 on the printing surface MS. As a result, on the printing surface MS, the target irradiation area EA#1 may move along the movement trajectory MT#1 shown in FIG. 4B. Specifically, the target irradiation area EA#1 may move along the target movement trajectory MT0 of the processing unit area BSA#1 while moving along a scanning direction that intersects with the target movement trajectory MT0. That is, the target irradiation area EA#1 may move along a wave-shaped (for example, sinusoidal) movement locus MT#1 that oscillates around the target movement locus MT0.

[0101] 5(a) or 5(b), the control unit 7 may control at least one of the head drive system 22 and the stage drive system 32 so that the processing unit area BSA#1 moves along a target movement trajectory MT0 extending along at least one of a direction along the movement direction (i.e., the scanning direction) of the target irradiation area EA#1 within the processing unit area BSA#1 and a direction intersecting (or, in some cases, perpendicular to) the movement direction of the target irradiation area EA#1 within the processing unit area BSA#1. Conversely, the control unit 7 may control the galvanometer mirror 2146 so that the target irradiation area EA#1 periodically moves along each of a scanning direction along the target movement trajectory MT0 of the processing unit area BSA#1 on the printing surface MS and a scanning direction intersecting (or, in some cases, perpendicular to) the target movement trajectory MT0. Note that Figure 5(c) shows the movement trajectory MT#1 of the target irradiation area EA#1 on the printing surface MS when the processing unit area BSA#1 shown in Figure 5(a) moves along the target movement trajectory MT0 on the printing surface MS.

[0102] When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit areas BSA#1, a molten pool MP#1 is formed in at least a portion of the processing unit area BSA#1. As a result, a molded object is formed within the processing unit area BSA#1. As described above, the processing unit area BSA#1 is an area having a width in a direction intersecting the movement direction of the processing unit area BSA#1 on the printing surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a molded object having a width in a direction intersecting the target movement trajectory MT0 of the processing unit area BSA#1 is formed on the printing surface MS. For example, in the example shown in FIGS. 4( a) and 4(b), a molded object having a width along the X-axis direction and extending along the Y-axis direction is formed. For example, in the example shown in FIGS. 5(a) and 5(c), a molded object having a width along the X-axis direction and extending along the Y-axis direction is formed.

[0103] When the processing light EL#1 is irradiated onto the printing surface MS in units of processing unit areas BSA#1, the processing unit areas BSA#1 are scanned with the processing light EL#1 by the galvanometer mirror 2146. Therefore, compared to when the processing light EL#1 is irradiated onto the printing surface MS without using the galvanometer mirror 2146, the amount of energy transmitted from the processing light EL#1 to the processing unit areas BSA#1 is less likely to vary within the processing unit areas BSA#1. In other words, the distribution of the amount of energy transmitted from the processing light EL#1 to the processing unit areas BSA#1 can be made uniform. As a result, the processing system SYS can form a shaped object on the printing surface MS with relatively high printing accuracy.

[0104] However, the machining system SYS does not have to irradiate the manufacturing surface MS with the processing light EL#1 in units of processing unit areas BSA#1. The machining system SYS may irradiate the manufacturing surface MS with the processing light EL#1 without using the galvanometer mirror 2146. In this case, the target irradiation area EA#1 may move on the manufacturing surface MS in conjunction with the movement of at least one of the machining head 21 and the stage 31.

[0105] Returning to FIG. 3 , the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. The power meter 2143 can detect the intensity of the processing light EL#1 incident on the power meter 2143. For example, the power meter 2143 may include a light-receiving element that detects the processing light EL#1 as light. Alternatively, the higher the intensity of the processing light EL#1, the greater the amount of energy generated by the processing light EL#1. As a result, the amount of heat generated by the processing light EL#1 increases. Therefore, the power meter 2143 may detect the intensity of the processing light EL#1 by detecting the processing light EL#1 as heat. In this case, the power meter 2143 may include a heat detection element that detects the heat of the processing light EL#1.

[0106] As described above, the processing light EL#1 reflected by the parallel plate 2142 is incident on the power meter 2143. Therefore, the power meter 2143 detects the intensity of the processing light EL#1 reflected by the parallel plate 2142. Because the parallel plate 2142 is disposed on the optical path of the processing light EL#1 between the light source 4#1 and the galvanometer mirror 2146, the power meter 2143 may be considered to detect the intensity of the processing light EL#1 traveling along the optical path between the light source 4#1 and the galvanometer mirror 2146. In this case, the power meter 2143 can stably detect the intensity of the processing light EL#1 without being affected by the deflection of the processing light EL#1 by the galvanometer mirror 2146. However, the location of the power meter 2143 is not limited to the example shown in FIG. 3 . For example, the power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path between the galvanometer mirror 2146 and the printing surface MS. The power meter 2143 may detect the intensity of the processing light EL#1 traveling along the optical path within the galvanometer mirror 2146.

[0107] The detection result of the power meter 2143 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#1 based on the detection result of the power meter 2143 (i.e., the detection result of the intensity of the processing light EL#1). For example, the control unit 7 may control the intensity of the processing light EL#1 so that the intensity of the processing light EL#1 on the printing surface MS becomes a desired intensity. To control the intensity of the processing light EL#1, for example, the control unit 7 may control the light source 4#1 to change the intensity of the processing light EL#1 emitted from the light source 4#1 based on the detection result of the power meter 2143. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#1 having an appropriate intensity.

[0108] As described above, the processing light EL#1 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#1 incident on the power meter 2143 may have an intensity capable of melting the shaping material M. However, if the processing light EL#1 having an intensity capable of melting the shaping material M is incident on the power meter 2143, the power meter 2143 may be damaged by the processing light EL#1. Therefore, the processing light EL#1 may be incident on the power meter 2143 with an intensity not high enough to damage the power meter 2143. In other words, the first optical system 214 may weaken the intensity of the processing light EL#1 incident on the power meter 2143 so that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 is incident on the power meter 2143.

[0109] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the reflectivity of the parallel plate 2142 for the processing light EL#1 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2142 for the processing light EL#1, the lower the intensity of the processing light EL#1 incident on the power meter 2143. Therefore, the reflectivity of the parallel plate 2142 may be set to a value low enough to realize a state in which the processing light EL#1, having an intensity not high enough to damage the power meter 2143, is incident on the power meter 2143. For example, the reflectivity of the parallel plate 2142 may be less than 10%. For example, the reflectivity of the parallel plate 2142 may be less than a few percent. Plain glass may be used as the parallel plate 2142 with such low reflectivity.

[0110] For example, in order to weaken the intensity of the processing light EL#1 incident on the power meter 2143, the first optical system 214 may cause the processing light EL#1 to be incident on the power meter 2143 via multiple parallel plates 2142. Specifically, the processing light EL#1 may be reflected multiple times by each of the multiple parallel plates 2142 and incident on the power meter 2143. In this case, the intensity of the processing light EL#1 reflected multiple times by each of the multiple parallel plates 2142 is weaker than the intensity of the processing light EL#1 reflected once by a single parallel plate 2142. Therefore, there is a high possibility that the processing light EL#1 having an intensity not high enough to damage the power meter 2143 will be incident on the power meter 2143.

[0111] A desired coating treatment may be applied to the surface of the parallel plate 2142 (particularly, at least one of the incident surface onto which the processing light EL#1 is incident and the reflecting surface onto which the processing light EL#1 is reflected). For example, the surface of the parallel plate 2142 may be subjected to anti-reflection coating (AR).

[0112] The second optical system 215 includes a collimator lens 2151, a parallel plate 2152, a power meter 2153, and a galvanometer scanner 2154. The galvanometer scanner 2154 includes a focus control optical system 2155 and a galvanometer mirror 2156. However, the second optical system 215 does not necessarily have to include at least one of the collimator lens 2151, the parallel plate 2152, the power meter 2153, and the galvanometer scanner 2154. The galvanometer scanner 2154 does not necessarily have to include at least one of the focus control optical system 2155 and the galvanometer mirror 2156.

[0113] The processing light EL#2 emitted from the light source 4#2 is incident on the collimator lens 2151. The collimator lens 2151 converts the processing light EL#2 incident on the collimator lens 2151 into parallel light. Note that if the processing light EL#2 emitted from the light source 4#2 is parallel light (i.e., if the processing light EL#2, which is parallel light, enters the second optical system 215), the second optical system 215 does not need to include the collimator lens 2151. The processing light EL#2 converted into parallel light by the collimator lens 2151 is incident on the parallel plate 2152. A portion of the processing light EL#2 incident on the parallel plate 2152 passes through the parallel plate 2152. The other portion of the processing light EL#2 incident on the parallel plate 2152 is reflected by the parallel plate 2152.

[0114] Processing light EL#2 that has passed through the parallel plate 2152 is incident on a galvanometer scanner 2154. Specifically, processing light EL#2 that has passed through the parallel plate 2152 is incident on a focus control optical system 2155 of the galvanometer scanner 2154.

[0115] The focus control optical system 2155 is an optical element that can change the focusing position CP of the processing light EL#2 (hereinafter referred to as the "focus position CP#2"). Specifically, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the irradiation direction of the processing light EL#2 that is irradiated onto the printing surface MS. In the example shown in FIG. 3, the irradiation direction of the processing light EL#2 that is irradiated onto the printing surface MS is a direction in which the Z-axis direction is the main component. In this case, the focus control optical system 2155 can change the focusing position CP#2 of the processing light EL#2 along the Z-axis direction. Furthermore, because the irradiation optical system 211 irradiates the printing surface MS with the processing light EL from above the workpiece W, the irradiation direction of the processing light EL#2 is a direction that intersects with the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). For this reason, the focus control optical system 2155 may be considered to be able to change the focusing position CP#2 of the processing light EL#2 along a direction intersecting the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). The focus optical system 2155 may be considered to be able to change the focusing position CP#2 of the processing light EL#2 along the direction of the optical axis AX of the irradiation optical system 211 (typically, the third optical system 216).

[0116] The irradiation direction of the processing light EL#2 may refer to the irradiation direction of the processing light EL#2 emitted from the third optical system 216. In this case, the irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the third optical system 216. The irradiation direction of the processing light EL#2 may be the same as the direction along the optical axis of the final optical element that is arranged closest to the printing surface MS among the optical elements constituting the third optical system 216. The final optical element may be the fθ lens 2162 described below. Furthermore, if the fθ lens 2162 described below is composed of multiple optical elements, the final optical element may be the optical element that is arranged closest to the printing surface MS among the multiple optical elements constituting the fθ lens 2162.

[0117] The focus control optical system 2155 may include, for example, a plurality of lenses arranged along the irradiation direction of the processing light EL#2. In this case, the focus control optical system 2155 may change the focusing position CP of the processing light EL#2 by moving at least one of the plurality of lenses along its optical axis direction.

[0118] When the focus control optical system 2155 changes the condensing position CP#2 of the processing light EL#2, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS changes. In particular, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. For this reason, it can be considered that the focus control optical system 2155 changes the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS by changing the condensing position CP#2 of the processing light EL#2.

[0119] As described above, the galvanometer scanner 2154 does not necessarily have to include the focus control optical system 2155. Even in this case, if the positional relationship between the irradiation optical system 211 and the printing surface MS in the irradiation direction of the processing light EL#2 changes, the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 changes. Therefore, even if the galvanometer scanner 2154 does not include the focus control optical system 2155, the processing system SYS can change the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2. For example, the processing system SYS may change the positional relationship between the condensing position CP#2 of the processing light EL#2 and the printing surface MS in the irradiation direction of the processing light EL#2 by using the head drive system 22 to move the processing head 21 along the irradiation direction of the processing light EL#2. For example, the processing system SYS may use the stage drive system 32 to move the stage 31 along the irradiation direction of the processing light EL#2, thereby changing the positional relationship between the focusing position CP#2 of the processing light EL#2 in the irradiation direction of the processing light EL#2 and the manufacturing surface MS.

[0120] The processing light EL#2 emitted from the focus control optical system 2155 is incident on the galvanometer mirror 2156. The galvanometer mirror 2156 deflects the processing light EL#2, thereby changing the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156. For this reason, the galvanometer mirror 2156 may be referred to as a deflection optical system. When the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the position from which the processing light EL#2 is emitted from the processing head 21 is changed. When the position from which the processing light EL#2 is emitted from the processing head 21 is changed, the target irradiation area EA#2 onto which the processing light EL#2 is irradiated on the printing surface MS moves. In other words, the irradiation position onto which the processing light EL#2 is irradiated on the printing surface MS moves. For this reason, the galvanometer mirror 2156 may be considered to function as an irradiation position moving device that can move the irradiation position of the processing light EL#2 on the printing surface MS.

[0121] In particular, when the emission direction of the processing light EL#2 emitted from the galvanometer mirror 2156 is changed, the irradiation position of the processing light EL#2 with respect to the processing head 21 including the galvanometer mirror 2156 is changed. Therefore, the galvanometer mirror 2156 may be considered to function as a position changing device that can change the irradiation position of the processing light EL#2 with respect to the processing head 21.

[0122] The galvanometer mirror 2156 includes, for example, an X-scan mirror 2156MX, an X-scan motor 2156AX, a Y-scan mirror 2156MY, and a Y-scan motor 2156AY. Processing light EL#2 emitted from the focus control optical system 2155 is incident on the X-scan mirror 2156MX. The X-scan mirror 2156MX reflects the processing light EL#2 incident on the X-scan mirror 2156MX toward the Y-scan mirror 2156MY. The Y-scan mirror 2156MY reflects the processing light EL#2 incident on the Y-scan mirror 2156MY toward the third optical system 216. Note that each of the X-scan mirror 2156MX and the Y-scan mirror 2156MY may be referred to as a galvanometer mirror.

[0123] The X-scan motor 2156AX swings or rotates the X-scan mirror 2156MX around a rotation axis along the Y-axis. As a result, the angle of the X-scan mirror 2156MX with respect to the optical path of processing light EL#2 incident on the X-scan mirror 2156MX is changed. In this case, the swing or rotation of the X-scan mirror 2156MX causes processing light EL#2 to scan the printing surface MS along the X-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of processing light EL#2) moves along the X-axis direction on the printing surface MS.

[0124] The Y-scan motor 2156AY swings or rotates the Y-scan mirror 2156MY around a rotation axis along the X-axis. As a result, the angle of the Y-scan mirror 2156MY with respect to the optical path of the processing light EL#2 incident on the Y-scan mirror 2156MY is changed. In this case, the swing or rotation of the Y-scan mirror 2156MY causes the processing light EL#2 to scan the printing surface MS along the Y-axis direction. In other words, the target irradiation area EA#2 (i.e., the irradiation position of the processing light EL#2) moves along the Y-axis direction on the printing surface MS.

[0125] In this embodiment, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 is referred to as the machining unit area BSA (particularly, the machining unit area BSA#2). In this case, the target irradiation area EA#2 may be considered to move on a surface (first surface) of the printing surface MS that overlaps with the machining unit area BSA#2. Specifically, the virtual area on the printing surface MS through which the galvanometer mirror 2156 moves the target irradiation area EA#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed (i.e., without change) is referred to as the machining unit area BSA (particularly, the machining unit area BSA#2). The machining unit area BSA#2 indicates a virtual area (in other words, a range) in which the machining head 21 actually performs additional machining using the machining light EL#2 while the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#2 indicates a virtual area (in other words, a range) that the processing head 21 actually scans with the processing light EL#2 when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. The processing unit area BSA#2 indicates a region (in other words, a range) through which the target irradiation area EA#2 actually moves when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed. Therefore, the processing unit area BSA#2 may be considered to be a virtual area determined based on the processing head 21 (particularly, the irradiation optical system 211). In other words, the processing unit area BSA#2 may be considered to be a virtual area located at a position on the printing surface MS that is determined based on the processing head 21 (particularly, the irradiation optical system 211). Note that the maximum region over which the galvanometer mirror 2146 can move the target irradiation area EA#2 on the printing surface MS when the positional relationship between the irradiation optical system 211 and the printing surface MS is fixed may also be referred to as the processing unit area BSA#2.

[0126] In this case, the machining system SYS can use the galvanometer mirror 2156 to move the target irradiation area EA#2 within the machining unit area BSA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the target irradiation area EA#2 within the machining unit area BSA#2. Furthermore, as described above, the molten pool MP#2 is formed by irradiating the target irradiation area EA#2 with the machining light EL#2. In this case, the machining system SYS may be considered to use the galvanometer mirror 2156 to move the molten pool MP#2 within the machining unit area BSA#2. Therefore, the operation of deflecting the machining light EL#2 using the galvanometer mirror 2156 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area BSA#2. In other words, the operation of moving the target irradiation area EA#2 within the machining unit area BSA#2 may be considered equivalent to the operation of moving the molten pool MP#2 within the machining unit area BSA#2.

[0127] As described above, when at least one of the machining head 21 and the stage 31 moves, the target irradiation area EA#2 moves on the printing surface MS. However, when at least one of the machining head 21 and the stage 31 moves, the relative positional relationship between the galvanometer mirror 2146 and the printing surface MS changes. As a result, the machining unit area BSA#2 determined based on the machining head 21 (i.e., the machining unit area BSA#2 to which the galvanometer mirror 2156 moves the target irradiation area EA#2 on the printing surface MS) moves on the printing surface MS. For this reason, in this embodiment, the operation of moving at least one of the machining head 21 and the stage 31 may be considered equivalent to the operation of moving the machining unit area BSA#2 relative to the printing surface MS.

[0128] The characteristics of the processing unit area BSA#2 (e.g., shape, movement pattern, etc.) may be the same as the characteristics of the processing unit area BSA#1 described above. The movement pattern of the target irradiation area EA#2 within the processing unit area BSA#2 (e.g., movement trajectory, etc.) may be the same as the movement pattern of the target irradiation area EA#1 within the processing unit area BSA#1 described above. For this reason, detailed description of the characteristics of the processing unit area BSA#2 and the movement pattern of the target irradiation area EA#2 within the processing unit area BSA#2 (e.g., movement trajectory, etc.) will be omitted, but an example will be briefly described below. As shown in FIG. 4( a), under the assumption that the processing unit area BSA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 within the processing unit area BSA#2 so that the target irradiation area EA#2 moves along a single scanning direction along the printing surface MS. 4(a) moves along the target movement trajectory MT0 on the printing surface MS, so that the target irradiation area EA#2 may move along the movement trajectory MT#2 (e.g., a wave-shaped movement trajectory MT#2 oscillating around the target movement trajectory MT0) shown in FIG. 4(b) on the printing surface MS. As shown in FIG. 5(a) and FIG. 5(b), under the assumption that the processing unit area BSA#2 is stationary (i.e., not moving) on ​​the printing surface MS, the galvanometer mirror 2156 may deflect the processing light EL#2 so that the target irradiation area EA#2 moves along multiple scanning directions within the processing unit area BSA#2.

[0129] 4A, 5A, and 5B, the operation of periodically moving the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation. In other words, the operation of periodically moving (or deflecting) the processing light EL#2 so as to periodically move the target irradiation area EA#2 on the printing surface MS may be referred to as a wobbling operation.

[0130] Typically, the processing unit area BSA#1 and the processing unit area BSA#2 coincide. In other words, the processing unit area BSA#1 is identical to the processing unit area BSA#2. Therefore, the galvanometer mirror 2156 may be considered to deflect the processing light EL#2 so that the target irradiation area EA#2 moves within the processing unit area BSA#1. The galvanometer mirror 2146 may be considered to deflect the processing light EL#1 so that the target irradiation area EA#1 moves within the processing unit area BSA#2. However, the processing unit area BSA#1 and the processing unit area BSA#2 may be partially different.

[0131] When the processing light EL#2 is irradiated onto the printing surface MS in units of the processing unit area BSA#2, a molten pool MP#2 is formed in at least a part of the processing unit area BSA#2. As a result, a molded object is formed within the processing unit area BSA#2. As described above, the processing unit area BSA#2 is an area having a width in a direction intersecting the movement direction of the processing unit area BSA#2 on the printing surface MS (specifically, the direction in which the target movement trajectory MT0 extends). In this case, a molded object having a width along the direction intersecting the target movement trajectory MT0 of the processing unit area BSA#2 is formed on the printing surface MS. For example, in the example shown in FIGS. 4( a) and 4(b), a molded object having a width along the X-axis direction and extending along the Y-axis direction is formed. For example, in the example shown in FIGS. 5(a) and 5(c), a molded object having a width along the X-axis direction and extending along the Y-axis direction is formed.

[0132] When the processing light EL#2 is irradiated onto the printing surface MS in units of processing unit areas BSA#2, the processing unit areas BSA#2 are scanned with the processing light EL#2 by the galvanometer mirror 2156. Therefore, compared to when the processing light EL#2 is irradiated onto the printing surface MS without using the galvanometer mirror 2156, the amount of energy transmitted from the processing light EL#2 to the processing unit areas BSA#2 is less likely to vary within the processing unit areas BSA#2. In other words, the amount of energy transmitted from the processing light EL#2 to the processing unit areas BSA#2 can be made uniform. As a result, the processing system SYS can form a model on the printing surface MS with relatively high printing accuracy.

[0133] However, the machining system SYS does not have to irradiate the manufacturing surface MS with the processing light EL#2 in units of the processing unit area BSA#2. The machining system SYS may irradiate the manufacturing surface MS with the processing light EL#2 without using the galvanometer mirror 2156. In this case, the target irradiation area EA#2 may move on the manufacturing surface MS in accordance with the movement of at least one of the machining head 21 and the stage 31.

[0134] Returning to FIG. 3 , the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. The power meter 2153 is a specific example of an electrical component used to control the processing light EL#2. Specifically, the power meter 2153 can detect the intensity of the processing light EL#2 incident on the power meter 2153. For example, the power meter 2153 may include a light-receiving element that detects the processing light EL#2 as light. Alternatively, the higher the intensity of the processing light EL#2, the greater the amount of energy generated by the processing light EL#2. As a result, the amount of heat generated by the processing light EL#2 increases. Therefore, the power meter 2153 may detect the intensity of the processing light EL#2 by detecting the processing light EL#2 as heat. In this case, the power meter 2153 may include a heat-detecting element that detects the heat of the processing light EL#2.

[0135] As described above, the processing light EL#2 reflected by the parallel plate 2152 is incident on the power meter 2153. Therefore, the power meter 2153 detects the intensity of the processing light EL#2 reflected by the parallel plate 2152. Because the parallel plate 2152 is disposed on the optical path of the processing light EL#2 between the light source 4#2 and the galvanometer mirror 2156, the power meter 2153 may be considered to detect the intensity of the processing light EL#2 traveling along the optical path between the light source 4#2 and the galvanometer mirror 2156. In this case, the power meter 2153 can stably detect the intensity of the processing light EL#2 without being affected by the deflection of the processing light EL#2 by the galvanometer mirror 2156. However, the location of the power meter 2153 is not limited to the example shown in FIG. 3 . For example, the power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path between the galvanometer mirror 2156 and the printing surface MS. The power meter 2153 may detect the intensity of the processing light EL#2 traveling along the optical path within the galvanometer mirror 2156.

[0136] The detection result of the power meter 2153 is output to the control unit 7. The control unit 7 may control (in other words, change) the intensity of the processing light EL#2 based on the detection result of the power meter 2153 (i.e., the detection result of the intensity of the processing light EL#2). For example, the control unit 7 may control the intensity of the processing light EL#2 so that the intensity of the processing light EL#2 on the printing surface MS becomes a desired intensity. To control the intensity of the processing light EL#2, for example, the control unit 7 may control the light source 4#2 based on the detection result of the power meter 2153 to change the intensity of the processing light EL#2 emitted from the light source 4#2. As a result, the processing system SYS can appropriately print a model on the printing surface MS by irradiating the printing surface MS with processing light EL#2 having an appropriate intensity.

[0137] As described above, the processing light EL#2 has an intensity capable of melting the shaping material M. Therefore, the processing light EL#2 incident on the power meter 2153 may have an intensity capable of melting the shaping material M. However, if the processing light EL#2 having an intensity capable of melting the shaping material M is incident on the power meter 2153, the power meter 2153 may be damaged by the processing light EL#2. Therefore, the processing light EL#2 may be incident on the power meter 2153 with an intensity not high enough to damage the power meter 2153. In other words, the second optical system 215 may weaken the intensity of the processing light EL#2 incident on the power meter 2153 so that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 is incident on the power meter 2153.

[0138] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the reflectivity of the parallel plate 2152 for the processing light EL#2 may be set to an appropriate value. Specifically, the lower the reflectivity of the parallel plate 2152 for the processing light EL#2, the lower the intensity of the processing light EL#2 incident on the power meter 2153. Therefore, the reflectivity of the parallel plate 2152 may be set to a value low enough to realize a state in which the processing light EL#2, having an intensity not high enough to damage the power meter 2153, is incident on the power meter 2153. For example, the reflectivity of the parallel plate 2152 may be less than 10%. For example, the reflectivity of the parallel plate 2152 may be less than a few percent. Plain glass may be used as the parallel plate 2152 with such low reflectivity.

[0139] For example, in order to weaken the intensity of the processing light EL#2 incident on the power meter 2153, the second optical system 215 may cause the processing light EL#2 to be incident on the power meter 2153 via multiple parallel plates 2152. Specifically, the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 may be incident on the power meter 2153. In this case, the intensity of the processing light EL#2 reflected multiple times by each of the multiple parallel plates 2152 is weaker than the intensity of the processing light EL#2 reflected once by a single parallel plate 2152. Therefore, there is a high possibility that the processing light EL#2 having an intensity not high enough to damage the power meter 2153 will be incident on the power meter 2153.

[0140] A desired coating treatment may be applied to the surface of the parallel plate 2152 (particularly, at least one of the incident surface onto which the processing light EL#2 is incident and the reflecting surface onto which the processing light EL#2 is reflected). For example, the surface of the parallel plate 2152 may be subjected to anti-reflection coating (AR).

[0141] The third optical system 216 includes a prism mirror 2161 and an fθ lens 2162 .

[0142] Processing light EL#1 emitted from the first optical system 214 and processing light EL#2 emitted from the second optical system 215 are each incident on a prism mirror 2161. The prism mirror 2161 reflects each of processing light EL#1 and EL#2 toward an fθ lens 2162. The prism mirror 2161 reflects processing light EL#1 and EL#2, which are incident on the prism mirror 2161 from different directions, in the same direction (specifically, toward the fθ lens 2162).

[0143] Furthermore, if the processing light EL#1 emitted from the first optical system 214 and the processing light EL#2 emitted from the second optical system 215 can each be directly incident on the fθ lens 2162, the third optical system 216 does not need to be equipped with a prism mirror 2161.

[0144] The fθ lens 2162 is an optical system for emitting each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 toward the printing surface MS. In other words, the fθ lens 2162 is an optical system for irradiating each of the processing lights EL#1 and EL#2 reflected by the prism mirror 2161 onto the printing surface MS. As a result, the processing lights EL#1 and EL#2 that have passed through the fθ lens 2162 are irradiated onto the printing surface MS.

[0145] The fθ lens 2162 may be an optical element capable of focusing each of the processing beams EL#1 and EL#2 on a focusing surface. In this case, the fθ lens 2162 may be referred to as a focusing optical system. The focusing surface of the fθ lens 2162 may be set, for example, on the printing surface MS. In this case, the third optical system 216 may be considered to have a focusing optical system whose projection characteristic is fθ. However, the third optical system 216 may also have a focusing optical system whose projection characteristic is different from fθ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f tan θ. For example, the third optical system 216 may have a focusing optical system whose projection characteristic is f sin θ.

[0146] The optical axis AX of the fθ lens 2162 is an axis along the Z-axis. Therefore, the fθ lens 2162 emits each of the processing lights EL#1 and EL#2 along the Z-axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be the Z-axis direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 2162. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions.

[0147] (2) Operation of the Machining System SYS The additive processing operation performed on the workpiece W by the machining system SYS configured as described above will be described. The additive processing performed on the workpiece W corresponds to an operation of forming a structure by adding a structure that is integrated with (or separable from) the workpiece W to the workpiece W. For convenience of explanation, the following describes additive processing for forming a three-dimensional object ST, which is a structure having a desired shape. As described above, the machining system SYS forms the three-dimensional object ST by performing additive processing based on the laser build-up welding method. Therefore, the machining system SYS may form the three-dimensional object ST by performing existing additive processing that complies with the laser build-up welding method. An example of an operation of forming the three-dimensional object ST using the laser build-up welding method will be briefly described below.

[0148] The processing system SYS forms a three-dimensional object ST on a workpiece W based on three-dimensional model data (in other words, three-dimensional model information) of the three-dimensional object ST to be formed. The three-dimensional model data may be measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS. To form the three-dimensional object ST, the processing system SYS sequentially forms, for example, multiple layered substructures (hereinafter referred to as "structural layers") SL aligned along the Z-axis direction. For example, the processing system SYS sequentially forms multiple structural layers SL layer by layer based on data of the multiple layers obtained by slicing a three-dimensional model of the three-dimensional object ST along the Z-axis direction. As a result, a three-dimensional object ST is formed, which is a layered structure in which multiple structural layers SL are stacked. The structural layers SL do not necessarily have to be layered structures. The flow of the operation for forming a three-dimensional object ST by sequentially forming a plurality of structural layers SL one by one will be described below.

[0149] First, the operation of forming each structure layer SL will be described with reference to FIGS. 6A to 6E. Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 21 and the stage 31 so that processing unit areas BSA#1 and BSA#2 are set in desired areas on the printing surface MS corresponding to the surface of the workpiece W or the surface of the printed structure layer SL. Then, the irradiation optical system 211 irradiates the processing unit areas BSA#1 and BSA#2 with processing beams EL#1 and EL#2, respectively. At this time, the focusing positions CP#1 and CP#2 at which the processing beams EL#1 and EL#2 are focused in the Z-axis direction may coincide with the printing surface MS. Alternatively, the focusing positions CP#1 and CP#2 at which the processing beams EL#1 and EL#2 are focused in the Z-axis direction may be offset from the printing surface MS. As a result, as shown in Figure 6(a), molten pools MP#1 and MP#2 are formed on the building surface MS irradiated with the processing beams EL#1 and EL#2, respectively. Furthermore, as shown in Figure 6(b), the processing system SYS supplies the building material M from the material nozzle 212 under the control of the control unit 7. As a result, the building material M is supplied to each of the molten pools MP#1 and MP#2. The building material M supplied to the molten pool MP#1 is melted by the processing beam EL#1 irradiated onto the molten pool MP#1. Similarly, the building material M supplied to the molten pool MP#2 is melted by the processing beam EL#2 irradiated onto the molten pool MP#2.

[0150] Furthermore, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to move the target irradiation areas EA#1 and EA#2 within the machining unit areas BSA#1 and BSA#2, respectively. That is, the irradiation optical system 211 uses the galvanometer mirrors 2146 and 2156 to scan the machining unit areas BSA#1 and BSA#2 with the machining beams EL#1 and EL#2, respectively. When the target irradiation area EA#1 moves and the machining beam EL#1 is no longer irradiated onto the molten pool MP#1, the molten build material M in the molten pool MP#1 cools and solidifies (i.e., solidifies). Similarly, when the target irradiation area EA#2 moves and the machining beam EL#2 is no longer irradiated onto the molten pool MP#2, the molten build material M in the molten pool MP#2 cools and solidifies (i.e., solidifies). Furthermore, as the target irradiation areas EA#1 and EA#2 move, the molten pools MP#1 and MP#2 also move. As a result, as shown in Figure 6(c), within the processing unit areas BSA#1 and BSA#2 through which the molten pools MP#1 and MP#2 move, a molded object made of the solidified mold material M is deposited on the mold surface MS.

[0151] 6(c), for ease of explanation, the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 are physically separated. However, the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 may be integrated. In particular, when the processing unit areas BSA#1 and BSA#2 coincide (or partially overlap), the object made of the solidified building material M in the processing unit area BSA#1 and the object made of the solidified building material M in the processing unit area BSA#2 may be integrated. During a period in which the target irradiation areas EA#1 and EA#2 are moving within the physically separated machining unit areas BSA#1 and BSA#2, respectively, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 move on the printing surface MS. In other words, the machining system SYS may move the target irradiation areas EA#1 and EA#2 within the machining unit areas BSA#1 and BSA#2, respectively, and move the machining unit areas BSA#1 and BSA#2 on the printing surface MS in parallel.

[0152] Alternatively, during the period when the target irradiation areas EA#1 and EA#2 are moving within the machining unit areas BSA#1 and BSA#2, respectively, the machining system SYS does not have to move the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 do not move on the printing surface MS. In this case, after the additional machining (i.e., printing) within the machining unit areas BSA#1 and BSA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 are set in another area on the printing surface MS. In other words, after the additional machining (i.e., printing) within the machining unit areas BSA#1 and BSA#2 is completed, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the machining unit areas BSA#1 and BSA#2 move on the printing surface MS. In this case, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have already been set (i.e., the area where additional machining has already been performed) and the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have newly been set (i.e., the area where additional machining will now be performed) are adjacent to each other. In particular, the machining system SYS may move at least one of the machining head 21 and the stage 31 so that the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have already been set do not overlap with the area on the printing surface MS where the machining unit areas BSA#1 and BSA#2 have newly been set. However, the processing system SYS may move at least one of the processing head 21 and the stage 31 so that the area on the printing surface MS where processing unit areas BSA#1 and BSA#2 have already been set partially overlaps with the area on the printing surface MS where processing unit areas BSA#1 and BSA#2 have newly been set.

[0153] The machining system SYS repeats a series of manufacturing processes, including forming a molten pool MP#1 by irradiating the machining unit area BSA#1 with the machining light EL#1, forming a molten pool MP#2 by irradiating the machining unit area BSA#2 with the machining light EL#2, supplying the manufacturing material M to the molten pools MP#1 and MP#2, melting the supplied manufacturing material M, and solidifying the molten manufacturing material M, while moving the machining unit areas BSA#1 and BSA#2 along the target movement trajectory MTO on the manufacturing surface MS, as shown in FIG. 6( d ). In this case, as the machining unit areas BSA#1 and BSA#2 move, a manufactured object having a width in a direction intersecting the target movement trajectory MTO is manufactured on the manufacturing surface MS. For example, when the machining unit areas BSA#1 and BSA#2 move as shown in FIGS. 4( a ) and 4 ( b ), a manufactured object having a width in the X-axis direction and extending in the Y-axis direction is manufactured. For example, when the processing unit areas BSA#1 and BSA#2 move as shown in Figures 5(a) and 5(c), respectively, a structure having a width along the X-axis direction and extending along the Y-axis direction is formed.

[0154] As a result, as shown in Fig. 6(e), a structure layer SL corresponding to a structured object, which is an aggregate of the melted and then solidified building material M, is formed on the building surface MS. That is, a structure layer SL corresponding to an aggregate of objects formed on the building surface MS in a pattern corresponding to the target movement trajectories MT0 of the processing unit areas BSA#1 and BSA#2 is formed. That is, a structure layer SL having a shape corresponding to the target movement trajectories MT0 of the processing unit areas BSA#1 and BSA#2 in plan view is formed.

[0155] Note that when the target irradiation area EA#1 is set in an area where it is not desired to form an object, the processing system SYS does not have to irradiate the target irradiation area EA#1 with the processing light EL#1. Alternatively, the processing system SYS may irradiate the target irradiation area EA#1 with the processing light EL#1 and stop the supply of the building material M. Alternatively, the processing system SYS may supply the building material M to the target irradiation area EA#1 and irradiate the target irradiation area EA#1 with the processing light EL#1 at an intensity that does not cause the formation of a molten pool MP. The same applies when the target irradiation area EA#2 is set in an area where it is not desired to form an object.

[0156] The processing system SYS may irradiate the modeling material M ejected from the material nozzle 212 with the processing light EL (for example, at least one of EL#1 and EL#2). In this case, the modeling material M ejected from the material nozzle 212 is melted by the processing light EL before reaching the modeling surface MS. As a result, the molten modeling material M drips onto the modeling surface MS.

[0157] Note that instead of or in addition to forming the molten pool MP, the processing system SYS may irradiate the processing light EL onto the building material M injected from the material nozzle 212. Note that when the processing system SYS irradiates the building material M injected from the material nozzle 212 with the processing light EL in addition to forming the molten pool MP, the processing system SYS may use a portion (e.g., 30%) of the processing light EL to form the molten pool MP, and irradiate the remaining portion (e.g., 70%) of the processing light EL onto the building material M injected from the material nozzle 212 (in other words, it may be used to melt the building material M injected from the material nozzle 212).

[0158] The target movement trajectories MT0 of the machining unit areas BSA#1 and BSA#2 may be referred to as machining paths (in other words, tool paths). In this case, the control unit 7 may move at least one of the machining head 21 and the stage 31 based on path information indicating the target movement trajectories MT0 (i.e., path information indicating the machining paths) so that each of the machining unit areas BSA#1 and BSA#2 moves along the target movement trajectories MT0 on the printing surface MS.

[0159] In addition to indicating the target movement trajectory MTO, the path information may also include information regarding a target value for the width of the object (hereinafter referred to as the "target width"). The target width may be a target value for the dimension (i.e., width) in a direction perpendicular to the target movement trajectory MTO. The target width may also be referred to as a line width or a bead width. Specifically, as described above, as the processing unit areas BSA#1 and BSA#2 move along the target movement trajectory MTO, an object having a width along a direction intersecting the target movement trajectory MTO is formed on the printing surface MS. For example, when the processing unit areas BSA#1 and BSA#2 move along the Y-axis direction as shown in FIG. 7A, a linear object having a width along the X-axis direction and extending along the Y-axis direction is formed on the printing surface MS as shown in FIG. 7B. The structure layer SL described above corresponds to a collection of linear objects shown in FIG. 7B. In this case, the pass information may include information on the target value of the width D of the linear object (i.e., the target width), as shown in Fig. 7(b). In other words, the pass information may include information on the width of the linear object to be formed on the printing surface MS. Note that since the target width may be referred to as the bead width, the linear object may also be referred to as a bead.

[0160] In this case, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, based on the line width information so that the target irradiation areas EA#1 and EA#2 move within the processing unit areas BSA#1 and BSA#2, respectively. For example, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 move periodically within the line width indicated by the line width information. In other words, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 do not deviate outside the line width indicated by the line width information. In other words, the control unit 7 may control the galvanometer mirrors 2146 and 2156, respectively, so that the target irradiation areas EA#1 and EA#2 move periodically within the target width of the object indicated by the line width information. That is, the control unit 7 may control the galvanometer mirrors 2146 and 2156 so that the target irradiation areas EA#1 and EA#2 do not deviate outside the target width of the object indicated by the line width information.

[0161] As a result, the molten pools MP#1 and MP#2 also move periodically inside the line width indicated by the line width information. In other words, the molten pools MP#1 and MP#2 do not deviate outside the line width indicated by the line width information. In other words, the molten pools MP#1 and MP#2 move periodically inside the target width of the object indicated by the line width information. In other words, the molten pools MP#1 and MP#2 do not deviate outside the target width of the object indicated by the line width information. This allows the machining system SYS to appropriately form a linear object having the target width indicated by the line width information.

[0162] The line width indicated by the line width information (i.e., the target width of the object) may be the same as the width of each of the processing unit areas BSA#1 and BSA#2. Alternatively, the line width indicated by the line width information (i.e., the target width of the object) may be smaller than the width of each of the processing unit areas BSA#1 and BSA#2. The size in the X-axis direction and the size in the Y-axis direction of each of the processing unit areas BSA#1 and BSA#2 may be several millimeters. However, the size of each of the processing unit areas BSA#1 and BSA#2 is not limited to several millimeters.

[0163] The machining system SYS repeatedly performs operations for forming such a structure layer SL based on the three-dimensional model data under the control of the control unit 7. Specifically, before performing operations for forming the structure layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYS performs operations for forming the first structure layer SL#1 on the build surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structure layer SL#1. Specifically, the control unit 7 acquires path information for forming the first structure layer SL#1, which is generated based on the slice data corresponding to the structure layer SL#1. Note that the control unit 7 may generate the path information after or before the machining system SYS starts additional processing. Thereafter, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to form the first structure layer SL#1. As a result, the structure layer SL#1 is formed on the build surface MS as shown in FIG. 8A. Thereafter, the machining system SYS sets the surface (i.e., the upper surface) of the structural layer SL#1 as a new printing surface MS, and then prints a second structural layer SL#2 on the new printing surface MS. To print the structural layer SL#2, the control unit 7 first controls at least one of the head drive system 22 and the stage drive system 32 so that the machining head 21 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive system 22 and the stage drive system 32 to move the machining head 21 toward the +Z side and / or move the stage 31 toward the −Z side so that the machining unit areas BSA#1 and BSA#2 are set on the surface of the structural layer SL#1 (i.e., the new printing surface MS). Thereafter, under the control of the control unit 7, the machining system SYS prints the structural layer SL#2 on the structural layer SL#1 based on the slice data corresponding to the structural layer SL#2, using operations similar to those used to print the structural layer SL#1. As a result, a structure layer SL#2 is formed as shown in Fig. 8(b) . Thereafter, the same operation is repeated until all of the structure layers SL that constitute the three-dimensional object ST to be formed on the workpiece W are formed.As a result, as shown in FIG. 8C, a three-dimensional object ST is formed by a layered structure in which a plurality of structural layers SL are stacked.

[0164] (3) Method for Generating Machining Control Information As described above, the control unit 7 may move at least one of the machining head 21 and the stage 31 based on the path information so that each of the machining unit areas BSA#1 and BSA#2 moves along the target movement trajectory MT0 on the printing surface MS. Below, a method for the control unit 7 to generate machining control information including path information for moving at least one of the machining head 21 and the stage 31 (in other words, for controlling at least one of the machining head 21 and the stage 31) will be described.

[0165] (3-1) Data Flow The data flow from three-dimensional model information indicating the shape of the object to generation of processing control information will be described with reference to Fig. 9 to Fig. 11. Below, a method for generating processing control information using recipe creation software SW1, CAM (Computer Aided Manufacturing) software SW2, and equipment operation software SW3 shown in Fig. 9 will be described.

[0166] The recipe creation software SW1, the CAM software SW2, and the equipment operation software SW3 may be included in a single device (e.g., a personal computer) or in different devices. The device including the equipment operation software SW3 may constitute a part of the machining system SYS (e.g., a part of the control unit 7), or may be a device different from the machining system SYS. The three-dimensional model information may be information representing a CAD (Computer Aided Design) model. In this case, the three-dimensional model information may be information in an STL file format or an STP file format. Since the three-dimensional model information represents the shape of the object, it may also be referred to as three-dimensional object model information.

[0167] An example of a shaped object OB is a shaped object formed using two different shaping materials M1 and M2. Note that the shaped object may be formed using a single shaping material or three or more shaping materials.

[0168] 10 , the object OB includes 11 portions (specifically, portions OB#1 to OB#11) with different blending ratios of the building material M1 and the building material M2. Part OB#1 is a portion containing only the building material M1 (i.e., the blending ratio of the building material M1 is 100%). Part OB#2 is a portion containing 90% of the building material M1 and 10% of the building material M2. Part OB#3 is a portion containing 80% of the building material M1 and 20% of the building material M2. Part OB#4 is a portion containing 70% of the building material M1 and 30% of the building material M2. Part OB#5 is a portion containing 60% of the building material M1 and 40% of the building material M2. Part OB#6 is a part where the blending ratio of the molding material M1 is 50% and the blending ratio of the molding material M2 is 50%. Part OB#7 is a part where the blending ratio of the molding material M1 is 40% and the blending ratio of the molding material M2 is 60%. Part OB#8 is a part where the blending ratio of the molding material M1 is 30% and the blending ratio of the molding material M2 is 70%. Part OB#9 is a part where the blending ratio of the molding material M1 is 20% and the blending ratio of the molding material M2 is 80%. Part OB#10 is a part where the blending ratio of the molding material M1 is 10% and the blending ratio of the molding material M2 is 90%. Part OB#11 is a part where only the molding material M2 is used (i.e., the blending ratio of the molding material M2 is 100%).

[0169] In this embodiment, it is assumed that there are 11 pieces of 3D model information (specifically, 3D model information MI#1 to MI#11) corresponding to portions OB#1 to OB#11, respectively. The number of pieces of 3D model information corresponding to the object OB may be determined arbitrarily by the user. In other words, the number of pieces of 3D model information corresponding to the object OB is not limited to 11. The 3D model file F11 in FIG. 9 is a file that stores 3D model information. The number of 3D model files F11 may correspond to the number of pieces of 3D model information. Since the number of pieces of 3D model information related to the object OB is 11, the number of 3D model files F11 related to the object OB may be 11. The number of 3D model files F11 may be different from the number of pieces of 3D model information.

[0170] The recipe creation software SW1 reads the 3D model file F11 to generate a process control file F21 and a recipe file F22. The recipe creation software SW1 may further generate an overall recipe file F23. Note that the recipe creation software SW1 does not necessarily have to generate the overall recipe file F23.

[0171] Here, if a group of 3D model files including multiple 3D model files F11 exists for one object, the recipe creation software SW1 reads in the group of 3D model files. For example, if a group of 3D model files including 11 3D model files F11 that respectively store three-dimensional model information MI#1 to MI#11 exists for the object OB, the recipe creation software SW1 reads in the group of 3D model files.

[0172] The recipe file F22 indicates the modeling conditions of a processing device (e.g., the processing system SYS) when a model or a part of a model represented by the three-dimensional model information stored in the 3D model file F11 is to be formed. The recipe creation software SW1 generates one recipe file F22 for one 3D model file F11.

[0173] When the recipe creation software SW1 reads a group of 3D model files, the recipe creation software SW1 generates a plurality of recipe files F22 corresponding to the plurality of 3D model files F11 included in the group of 3D model files. In this case, the recipe creation software SW1 may generate a recipe file F22 indicating modeling conditions specific to each portion of the object represented by the three-dimensional model information stored in each 3D model file F11, among the modeling conditions of the processing apparatus when the portion of the object represented by each of the plurality of pieces of three-dimensional model information stored in the plurality of 3D model files F11 is modeled. The recipe creation software SW1 may generate an overall recipe file F23 indicating modeling conditions common to all portions of the object represented by each of the plurality of pieces of three-dimensional model information stored in the plurality of 3D model files F11, among the modeling conditions of the processing apparatus when the portion of the object represented by each of the plurality of pieces of three-dimensional model information stored in the plurality of 3D model files F11 is modeled. The specific modeling conditions may include a modeling speed. Note that, when the object is modeled by stacking a plurality of layers, the specific modeling conditions may include a plurality of modeling speeds corresponding to the plurality of layers, respectively. The common modeling conditions may include the heater temperature of the processing device (e.g., the processing system SYS).

[0174] The heater temperature refers to the temperature of the heater for heating the stage 31 when forming an object. The heater temperature may be a target temperature of the heater, the temperature of the stage 31 heated by the heater, the temperature of the object heated by the heater via the stage 31, or the temperature of the gas in the chamber space 63IN heated by the heater via the stage 31 (in other words, the ambient temperature).

[0175] The process control file F21 includes data indicating the correspondence between the 3D model file F11 and the recipe file F22. The process control file F21 may include information (e.g., a file name) for identifying the overall recipe file F23. When the recipe creation software SW1 reads a group of 3D model files and generates multiple recipe files F21, the process control file F21 includes data indicating the correspondence between the multiple 3D model files F11 included in the group of 3D model files and the multiple recipe files F21.

[0176] The 3D model file F11 may be referred to as model information because it stores three-dimensional model information that indicates a three-dimensional model of the object. The recipe file F22 may be referred to as condition information because it indicates the forming conditions of the processing device that forms the object. Therefore, data indicating the correspondence between the 3D model file F11 and the recipe file F22 can be said to be data indicating the correspondence between model information and condition information. Therefore, the data structure related to the process management file F21 can be said to include data indicating the correspondence between model information and condition information. When the recipe creation software SW1 reads a group of 3D model files, the data structure related to the process management file F21 can be said to include data indicating the correspondence between multiple pieces of model information and multiple pieces of condition information.

[0177] For example, a computer running recipe creation software SW1 (i.e., a computer program) may read a 3D model file F11. The computer may generate a process control file F21 and a recipe file F22 by performing processing defined by the recipe creation software SW1. The computer may also generate an overall recipe file by performing processing defined by the recipe creation software SW1.

[0178] The CAM software SW2 reads the process control file F21. The CAM software SW2 reads the 3D model file F11 and the recipe file F22 based on data included in the process control file F21 that indicates the correspondence between the 3D model file F11 and the recipe file F22.

[0179] The CAM software SW2 generates a recipe file F33 based on the recipe file F22. Here, the CAM software SW2 may change at least a part of the modeling conditions indicated by the loaded recipe file F22 in accordance with a user's input. When at least a part of the modeling conditions indicated by the recipe file F22 is changed in accordance with a user's input, the CAM software SW2 generates a recipe file F33 indicating modeling conditions including the changed modeling conditions. Note that, when there are multiple recipe files F22, the CAM software SW2 may generate multiple recipe files F33 corresponding to the multiple recipe files F22, respectively. Therefore, data indicating the association between the 3D model file F11 and the recipe file F22, which is included in the process management file F21, may be used as information indicating the association between the 3D model file F11 and the recipe file F33.

[0180] The CAM software SW2 generates machining control information as a program that commands the operation of a machining device (e.g., machining system SYS) based on the three-dimensional model information indicated by the 3D model file F11 and the modeling conditions indicated by the recipe file F33. Here, the machining control information is an NC (numerical control) program. However, the machining control information is not limited to an NC program.

[0181] When generating the processing control information, the CAM software SW2 generates processing path information that indicates a processing path for forming an object corresponding to the three-dimensional model information indicated by the 3D model file F11 corresponding to the recipe file F33. The CAM software SW2 stores data that associates the generated processing path information with the forming conditions indicated by the recipe file F33 in the processing control information.

[0182] The CAM software SW2 extracts changeable parameters from the processing control information generated based on the 3D model file F11 and the recipe file F33. Here, the changeable parameters may be parameters related to the molding conditions of the processing device that forms the object. The CAM software SW2 outputs an NC header file F31 that includes the extracted changeable parameters. The CAM software SW2 outputs the generated processing control information, except for the extracted changeable parameters, as an NC file F32. Note that the changeable parameters may include at least one of the molding speed of the processing device that forms the object and the supply speed of the molding material by the processing device that forms the object.

[0183] The CAM software SW2 may store information (for example, file names) for identifying the NC header file F31 and the NC file F32 in the recipe file F33.

[0184] The CAM software SW2 adds information (e.g., file names) for identifying the NC header file F31 and the NC file F32 to the process control file F21. The CAM software SW2 updates data included in the process control file F21 that indicates the correspondence between the 3D model file F11 and the recipe file F22. For example, the CAM software SW2 may update the data by replacing information (e.g., file name) for identifying the recipe file F22 in the data that indicates the correspondence between the 3D model file F11 and the recipe file F22 with information (e.g., file name) for identifying the recipe file F33 that corresponds to the recipe file F22. The process control file F21 to which information has been added and updated by the CAM software SW2 is referred to as a process control file F21a.

[0185] The NC header file F31 may be referred to as parameter information because it contains changeable parameters. A program (e.g., an NC program) that commands the operation of a machining device and is generated based on the three-dimensional model information indicated by the 3D model file F11 and the molding conditions indicated by the recipe file F22 is information for controlling the machining device and may be referred to as machining control information. Therefore, it can be said that the data structure of the process control file F21a to which information for identifying the NC header file F31 (e.g., a file name) has been added contains data indicating parameter information as part of the machining control information.

[0186] For example, a computer executing the CAM software SW2 (i.e., a computer program) may read a process control file F21. That is, the computer may read the process control file F21, which includes data indicating the correspondence between the 3D model file F11 and the recipe file F22. The computer may read the 3D model file F11 and the recipe file F22 based on the process control file F21 by performing processing defined by the CAM software SW2. The computer may generate an NC header file F31, including changeable parameters, as part of an NC program based on three-dimensional model information indicated by the 3D model file F11 and modeling conditions indicated by a recipe file F33 corresponding to the recipe file F22 by performing processing defined by the CAM software SW2. The computer may add information (e.g., a file name) for identifying the NC header file F31 to the process control file F21 by performing processing defined by the CAM software SW2.

[0187] The equipment operation software SW3 reads the process control file F21a. The equipment operation software SW3 reads the recipe file F33 based on data included in the process control file F21a indicating the correspondence between the 3D model file F11 and the recipe file F33. The equipment operation software SW3 reads the overall recipe file F23, the NC header file F31, and the NC file F32 based on information included in the process control file F21a for identifying the overall recipe file F23, the NC header file F31, and the NC file F32. The equipment operation software SW3 may change at least some of the parameters included in the NC header file F31 in response to user input.

[0188] For example, a computer executing the equipment operation software SW3 (i.e., a computer program) may read the process control file F21 a. The computer may then read the recipe file F33, the overall recipe file F23, the NC header file F31, and the NC file F32 based on the process control file F21 a by performing processing defined by the equipment operation software SW3.

[0189] The above-mentioned process will be further explained with reference to the flowchart of Fig. 11. In Fig. 11, a computer executing recipe creation software SW1 outputs a process control file F21 (step S101). Next, a computer executing CAM software SW2 reads the process control file F21 (step S102). The computer executing CAM software SW2 reads the 3D model file F11 and the recipe file F22 based on data indicating the correspondence between the 3D model file F11 and the recipe file F22, which is included in the process control file F21 (step S103).

[0190] A user of the computer executing the CAM software SW2 may use the computer to at least one of confirm and change parameters related to the modeling conditions indicated by the recipe file F22 (step S104). The computer executing the CAM software SW2 changes the modeling conditions in accordance with the parameters related to the modeling conditions changed by the user. The computer executing the CAM software SW2 generates machining path information indicating a machining path for forming a model. The computer executing the CAM software SW2 generates machining control information including the changed modeling conditions and machining path information.

[0191] Thereafter, the computer executing the CAM software SW2 outputs the process control file F21a, the NC header file F31, the NC file F32, and the recipe file F33 (step S105). The computer executing the equipment operation software SW3 reads the process control file F21a (step S106). The computer executing the equipment operation software SW3 reads the NC header file F31, the NC file F32, the recipe file F33, and the overall recipe file F23 based on the process control file F21a (step S107).

[0192] A user of a computer executing the device operation software SW3 may use the computer to confirm and / or change at least one of the parameters indicated by the NC header file F31, the parameters related to the forming conditions indicated by the recipe file F33, and the parameters related to the forming conditions indicated by the overall recipe file F23 (step S108).

[0193] The computer that executes the recipe creation software SW1, the computer that executes the CAM software SW2, and the computer that executes the equipment operation software SW3 may be the same or different.

[0194] As described above, the CAM software SW2 reads the 3D model file F11 and the recipe file F22 based on the process control file F21. The equipment operation software SW3 reads the recipe file F33, the overall recipe file F23, the NC header file F31, and the NC file F32 based on the process control file F21a.

[0195] If at least one of the process control files F21 and F21a were not available, the user of at least one of the CAM software SW2 and the equipment operation software SW3 would have to manually specify the files (i.e., information) that the software should load. The greater the number of 3D model files F11 and recipe files F22, the more complicated and time-consuming this user's work becomes. In addition, there is a possibility that the user will make an operational error, such as making an incorrect specification, during the process.

[0196] If the process control files F21 and F21a are available, the user only needs to issue a command to read one of the process control files F21 and F21a, and the software (i.e., one of the CAM software SW2 and the equipment operation software SW3) will automatically read the file to be read, which simplifies the user's work and reduces the time required for the work.

[0197] When a user wants to change parameters included in the machining control information (e.g., an NC program) using the device operation software SW3, if the NC header file F31 is not available, the user must search for the desired parameters in the machining control information. Here, the larger the size of the object, the greater the amount of information in the machining control information. Therefore, the greater the amount of information in the machining control information, the longer it takes the user to search for the desired parameters.

[0198] The CAM software SW2 extracts changeable parameters from the machining control information and generates an NC header file F31 containing the extracted parameters. This allows the user to search for the desired parameter from the parameters contained in the NC header file F31, thereby reducing the time required for the user's work.

[0199] (3-2) Variable Bead Width Printing The pass information may include information on the target value of the width D of the linear object (i.e., the target width) shown in Fig. 7B, for example. The target width may also be called the bead width, and therefore, information on the target width of the linear object (i.e., information on the width of the linear object to be printed) may also be called bead width information.

[0200] As described above, the path information is generated by the computer that executes the CAM software SW2. First, the computer that executes the CAM software SW2 will be described, followed by a description of the bead width information.

[0201] Here, an information processing device COM is taken as an example of a computer that executes the CAM software SW2. The information processing device COM will be described with reference to Fig. 12. In Fig. 12, the information processing device COM includes an arithmetic unit 501, a storage unit 502, a communication unit 503, an input unit 504, and an output unit 505.

[0202] The arithmetic device 501 may include, for example, at least one of a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an FPGA (Field Programmable Gate Array), and a TPU (Tensor Processing Unit).

[0203] The storage device 502 may include, for example, at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and an optical disk array. In other words, the storage device 502 may include a non-transitory recording medium. The storage device 502 is capable of storing desired data. For example, the storage device 502 may temporarily store a computer program (e.g., CAM software SW2) executed by the arithmetic device 501. The storage device 502 may temporarily store data that the arithmetic device 501 temporarily uses when the arithmetic device 501 is executing a computer program.

[0204] The communication device 503 may be capable of communicating with devices external to the information processing device COM. The communication device 503 may perform wired communication or wireless communication. Wired communication is not limited to communication via a network, but also includes communication via a cable such as a USB (Universal Serial Bus) cable. Wireless communication is not limited to communication via a network, but also includes short-range wireless communication such as Bluetooth (registered trademark).

[0205] The input device 504 is a device capable of receiving information input to the information processing device COM from outside. The input device 504 may include an operation device (e.g., at least one of a keyboard, a mouse, and a touch panel) that can be operated by a user of the information processing device COM. The input device 504 may include a recording medium reading device that can read information recorded on a recording medium that is detachable from the information processing device COM, such as a USB memory. Note that when information is input to the information processing device COM via the communication device 503 (in other words, when the information processing device COM acquires information via the communication device 503), the communication device 503 may function as an input device.

[0206] The output device 505 is a device capable of outputting information to the outside of the information processing device COM. The output device 505 may output visual information such as text or images, auditory information such as sound, or tactile information such as vibration, as the information. The output device 505 may include, for example, at least one of a display, a speaker, a printer, and a vibration motor. The output device 505 may be capable of outputting information to a recording medium detachable from the information processing device COM, such as a USB memory. Note that when the information processing device COM outputs information via the communication device 503, the communication device 503 may function as the output device.

[0207] The information processing device COM, which serves as a computer executing the CAM software SW2, reads the process management file F21. The information processing device COM reads the 3D model file F11 and the recipe file F22 based on data included in the process management file F21 that indicates the correspondence between the 3D model file F11 and the recipe file F22. The arithmetic unit 501 of the information processing device COM may slice a structure corresponding to the three-dimensional model information indicated by the 3D model file F11 (hereinafter, appropriately referred to as a "3D model of the structure") to generate multiple slice data pieces each representing a cross section of multiple layers (i.e., layered substructures) that form the structure. Therefore, the slice data can be considered to be data representing layered substructures (hereinafter, appropriately referred to as "structural layers"). If the structure is formed of a single layer, the arithmetic unit 501 need not generate slice data pieces.

[0208] The arithmetic device 501 generates path information indicating a path for forming each of a plurality of structure layers indicated by the plurality of slice data, based on the plurality of slice data.

[0209] When generating the pass information, the arithmetic device 501 controls the output device 505 to present a screen related to bead width information to the user. In this case, the screen presented to the user may include bead width information for each of a plurality of layers corresponding to each of a plurality of slice data. The user may change the bead width information for each of the plurality of layers via the input device 504. Here, the user can specify two or more pieces of bead width information for each of the plurality of layers. In other words, the user can specify bead width information such that a portion of one of the plurality of layers is formed with beads having a first width, and another portion of the one layer is formed with beads having a second width different from the first width.

[0210] For example, the arithmetic device 501 may control the output device 505 so that a screen (e.g., a dialog box) such as that shown in Fig. 13 is presented to the user as a screen relating to bead width information. Note that Fig. 13 shows input fields into which the first bead width and the second bead width can be input, but a screen including three or more input fields for bead widths may be presented to the user as a screen relating to bead width information.

[0211] For example, when a user inputs, via the input device 504, first bead width information for forming a bead with a first width for a first layer among the multiple layers, and second bead width information for forming a bead with a second width different from the first width, the arithmetic device 501 acquires the first bead width information and the second bead width information. The arithmetic device 501 generates first pass information indicating a path for forming a bead with the first width indicated by the first bead width information (in other words, a part of the structure layer corresponding to the first layer) based on the slice data corresponding to the first layer and the first bead width information. The arithmetic device 501 generates second pass information indicating a path for forming a bead with the second width indicated by the second bead width information (in other words, another part of the structure layer corresponding to the first layer) based on the slice data corresponding to the first layer and the second bead width information. The arithmetic device 501 generates processing control information including the first pass information and the second pass information. At this time, the arithmetic device 501 may generate the processing control information so that the first pass information and the second pass information are included in one file.

[0212] The operation of the information processing device COM will be further described with reference to the flowchart of Fig. 14. The arithmetic device 501 of the information processing device COM may slice the 3D model of the object to generate slice data (step S201). Note that if the object is formed in one layer, the arithmetic device 501 does not need to perform the process of step S201.

[0213] For example, when the user inputs a numerical value into an input field for inputting a first bead width on the screen shown in Fig. 13 via the input device 504, the arithmetic device 501 may acquire the first bead width (corresponding to the first width indicated by the first bead width information described above) (step S202). For example, when the user inputs a numerical value into an input field for inputting a second bead width on the screen shown in Fig. 13 via the input device 504, the arithmetic device 501 may acquire the second bead width (corresponding to the second width indicated by the second bead width information described above) (step S203).

[0214] The arithmetic device 501 sets the bead width based on the first bead width acquired in the process of step S202 and the second bead width acquired in the process of step S203 (step S204). Thereafter, the arithmetic device 501 generates first pass information indicating a path for forming a bead with the first bead width and second pass information indicating a path for forming a bead with the second bead width (step S205).

[0215] In addition to the first pass information and the second pass information, the arithmetic device 501 may generate path information indicating a path for moving a machining head (e.g., machining head 21) of a machining device (e.g., machining system SYS) to a position where a process for switching the bead width from one of the first bead width and the second bead width to the other of the first bead width and the second bead width is performed. The position where the process for switching the bead width is performed may be a position in an area different from the area where the object is to be formed. In this case, the position may be referred to as an evacuation position. Therefore, the path information indicating a path for moving the machining head to a position where the process for switching the bead width is performed may be referred to as evacuation path information.

[0216] The evacuation path information may include information on additive manufacturing conditions in addition to information on a path for moving the machining head to a position where the processing for switching the bead width is performed. The additive manufacturing conditions may include at least one of information on the bead width after switching and information for switching the degree of overlap, which will be described later.

[0217] A processing device (e.g., a processing system SYS) that operates based on processing control information including first pass information and second pass information may form a bead with a first width based on the first pass information included in the processing control information. The processing device may further form a bead with a second width based on the second pass information included in the processing control information. For details about the bead forming method, see "(2) Operation of the processing system SYS" above.

[0218] The arithmetic device 501 may generate the first pass information and the second pass information taking into consideration the time required to change the bead width. For example, the arithmetic device 501 may generate the first pass information and the second pass information so as to suppress the number of times the bead width is changed (for example, so as to minimize the number of times the bead width is changed).

[0219] As described above, each of the plurality of slice data indicates a contour line that shows a cross section of one layer of the object. It can be said that the contour line is information that indicates the printing shape of the layered structure of that one layer. It can also be said that the contour line is information that indicates the printing size of the layered structure of that one layer. Therefore, it can be said that each of the plurality of slice data includes information that indicates the printing shape and printing size of the corresponding layer. Therefore, it can be said that the first pass information is generated based on at least one of the printing shape and printing size obtained from the three-dimensional model information indicated by the 3D model file F11, and the first bead width information. Similarly, it can be said that the second pass information is generated based on at least one of the printing shape and printing size obtained from the three-dimensional model information indicated by the 3D model file F11, and the second bead width information.

[0220] As described above, the information processing device COM reads the 3D model file F11 and the recipe file F22 based on the process management file F21. Here, the process management file F21 read by the information processing device COM is specified by the user. Therefore, it can be said that the 3D model file F11 read based on the process management file F21 is the 3D model file F11 specified or input by the user.

[0221] The arithmetic device 501 may control the output device 505 so that a screen on which a user can specify (or select) one layer (e.g., the first layer) from among multiple layers forming the object is presented to the user before the screen on bead width information is presented to the user. After the screen on which a user can specify (or select) one layer from among multiple layers is presented to the user, if the user specifies (or selects) one layer from among the multiple layers via the input device 504, the arithmetic device 501 may control the output device 505 so that a screen on bead width information for the specified (or selected) layer is presented to the user. The screen on which the first bead width information is specified and the screen on which the second bead width information is specified may be the same screen (see, for example, FIG. 13 ). That is, the screen on bead width information for one layer (e.g., the first layer) may include a portion for specifying the first bead width information and a portion for specifying the second bead width information. The screen on which the bead width information for one layer is specified may include a portion for specifying three or more pieces of bead width information.

[0222] When generating the first pass information and the second pass information, the arithmetic device 501 may generate the first pass information and the second pass information so that the beads formed based on the first pass information (i.e., beads with a first width) and the beads formed based on the second pass information (i.e., beads with a second width) are formed without gaps in the first layer. Here, "forming the beads without gaps in the first layer" may mean that the region defined by the outline of the cross section included in the slice data corresponding to the first layer (i.e., the region corresponding to the structure layer) is filled with the beads without gaps.

[0223] Each of the first pass information and the second pass information can be said to be information indicating a movement direction in which a processing head (e.g., processing head 21) of a processing device (e.g., processing system SYS) and a table (e.g., stage 31) on which an object is placed move relatively to form a bead. Therefore, each of the first pass information and the second pass information can be said to be information indicating a movement path of the processing head (e.g., processing head 21). The movement direction may also be referred to as a scanning direction.

[0224] In the movement direction, beads are formed continuously (in other words, without gaps), as shown in Fig. 7(b), for example. On the other hand, the length of the bead in the direction intersecting the movement direction (i.e., the width direction) is a length equivalent to the bead width (see, for example, width D in Fig. 7(b)) defined by the first pass information or the second pass information. Therefore, when another bead is formed adjacent to one bead, a gap may occur between the one bead and the other bead.

[0225] The calculation device 501 may generate the first pass information and the second pass information so that the bead based on the first pass information (i.e., the bead of the first width) and the bead based on the second pass information (i.e., the bead of the second width) are formed without any gaps in the direction intersecting the movement direction (i.e., the width direction).

[0226] When the user specifies the bead width, the user may specify an area in the first layer where the bead width is to be specified via the input device 504. For the area, the user may specify one type of bead width, or may specify two or more bead widths. The shape and size of the area where the bead width is to be specified may be determined arbitrarily by the user.

[0227] For example, as shown in Fig. 15, the shape of the structure layer indicated by the cross-sectional contour line of the first layer (see the solid line in Fig. 15) is assumed to be a rectangle. In this case, the user may specify a first region R1 and a second region R2 as regions for specifying the bead width. Note that the second region R2 may be automatically determined when the first region R1 is specified by the user.

[0228] When the user specifies the bead width of the first region R1 as a first width, the arithmetic device 501 may generate, for the first region R1, first pass information indicating a path for printing a part of the structural layer corresponding to the first region R1 with the first width. If attempting to print a part of the structural layer corresponding to the first region R1 using only beads of the first width causes gaps to form in the first region R1, the arithmetic device 501 may generate first pass information and second pass information so that at least a part of the first region R1 is printed using beads of the first width and beads of the second width, thereby printing the first region R1 without gaps.

[0229] For example, the first width is greater than the second width. As shown in Fig. 16 , in a case where a gap occurs in a region R11 when a part of the structure layer corresponding to the first region R1 is modeled using only beads of the first width, the arithmetic device 501 may generate first pass information and second pass information so that the first region R1 is modeled without any gaps by modeling beads of the second width in the region R11.

[0230] If a first amount of gaps occurs in the first region R1 when attempting to model a portion of the structure layer corresponding to the first region R1 using only beads of the first width, the computing device 501 may generate first pass information and second pass information so that at least a portion of the first region R1 is modeled using beads of the first width and beads of the second width, thereby forming the portion of the structure layer corresponding to the first region R1 with a gap smaller than the first amount. The term "a gap smaller than the first amount" is a concept that also includes the case where there are no gaps (i.e., the amount of gap is zero).

[0231] To prevent the occurrence of gaps, the calculation device 501 may generate pass information (for example, at least one of the first pass information and the second pass information) so that a portion of one bead overlaps a portion of another bead adjacent to the one bead. Note that the degree of overlap between two adjacent beads may vary depending on the bead width, or may be constant.

[0232] Incidentally, the specifications of the processing device (e.g., the processing system SYS) determine the values ​​that the bead width can take (in other words, the range in which the bead width can be changed). In other words, the specifications of the processing device limit the values ​​that the bead width can take. For example, the arithmetic device 501 may acquire device information related to the processing device (e.g., the processing system SYS) via the communication device 503. Alternatively, the user may input the device information related to the processing device to the information processing device COM via the input device 504. In this case, the arithmetic device 501 may acquire the device information input by the user. The arithmetic device 501 may determine the values ​​that the bead width can take based on the acquired device information. The arithmetic device 501 may determine the maximum and minimum values ​​of the bead width as the values ​​that the bead width can take.

[0233] The device information may include optical system information related to the optical system of the processing device (e.g., the processing system SYS). The arithmetic device 501 may determine possible values ​​for the bead width based on the optical system information. The optical system of the processing device (e.g., the processing system SYS) may include a galvanometer scanner (e.g., the galvanometer scanner 2144) that can change the focusing position of the processing beam (e.g., the processing light EL). In this case, the optical system information may include first range information that indicates a variable range of the focusing position of the processing beam (e.g., the processing light EL) by the galvanometer scanner (e.g., the galvanometer scanner 2144) possessed by the optical system of the processing device (e.g., the processing system SYS). The arithmetic device 501 may determine possible values ​​for the bead width based on the first range information. The optical system of the processing device (e.g., the processing system SYS) may be configured to change the spot diameter of the processing beam (e.g., the processing light EL). In this case, the optical system information may include second range information indicating a variable range of the spot diameter of the processing beam (e.g., processing light EL). The calculation device 501 may determine possible values ​​of the bead width based on the second range information.

[0234] When specifying the bead width, the user may specify the bead width by inputting a numerical value indicating the bead width via the input device 504. In this case, the calculation device 501 may control the output device 505 so that the bead width information screen includes the possible values ​​for the bead width. Alternatively, the user may specify the bead width by selecting one bead width from a plurality of preset bead widths via the input device 504. For example, if 2 mm, 1 mm, and 0.1 mm are available as bead width options, the user may specify a first bead width by selecting one of 2 mm, 1 mm, and 0.1 mm. The user may specify a second bead width by selecting a value different from the first bead width from 2 mm, 1 mm, and 0.1 mm.

[0235] When specifying the bead width, the user may specify the overlap degree by inputting a numerical value indicating the degree of overlap between two adjacent beads via the input device 504. The user may specify the overlap degree by inputting a numerical value indicating the degree of overlap for each bead width via the input device 504. Alternatively, the user may specify the overlap degree by selecting one of a plurality of preset overlap degrees via the input device 504. For example, if 0.4 mm, 0.2 mm, and 0.08 mm are available as overlap degree options, the user may specify the overlap degree of a bead of a first width by selecting one of 0.4 mm, 0.2 mm, and 0.08 mm. The user may specify the overlap degree of a bead of a second width by selecting one of 0.4 mm, 0.2 mm, and 0.08 mm. Note that the overlap degree of a bead of a first width and the overlap degree of a bead of a second width may be the same or different. Note that when the user selects the degree of bead overlap, this is equivalent to the user instructing that beads be formed without gaps within the first layer.

[0236] When generating the first pass information, the arithmetic device 501 may generate the first pass information based on a first width specified by the user and an overlapping degree of beads of the first width specified by the user.When generating the second pass information, the arithmetic device 501 may generate the second pass information based on a second width specified by the user and an overlapping degree of beads of the second width specified by the user.

[0237] In addition, if the optical system of the processing device (e.g., the processing system SYS) includes a galvanometer scanner (e.g., the galvanometer scanner 2144) that can change the focusing position of the processing beam (e.g., the processing light EL), the arithmetic device 501 may generate control information for controlling the galvanometer scanner based on pass information (e.g., the first pass information and the second pass information) when generating the processing control information. The arithmetic device 501 may include the generated control information in the processing control information.

[0238] The user may not specify the bead width and overlapping degree. In this case, the arithmetic device 501 may generate pass information based on a predetermined bead width (e.g., an initial value of the bead width) and a predetermined overlapping degree (e.g., an initial value of the overlapping degree). Alternatively, instead of specifying the bead width and overlapping degree, the user may select a modeling mode that defines the bead width and overlapping degree. For example, the modeling mode may include at least one of a high-speed mode, a medium mode, and a high-definition mode.

[0239] The high-speed mode is a mode in which a bead is formed with a large width (e.g., the maximum value that a bead can have). For example, in the high-speed mode, the large width may be 2 mm, and the overlapping degree may be 0.4 mm. When the high-speed mode is selected, the arithmetic device 501 may generate pass information for forming a structure layer indicated by the slice data while satisfying the conditions of a bead width of 2 mm and an overlapping degree of 0.4 mm. In this case, if a gap occurs in the structure layer to be formed due to the conditions of a bead width of 2 mm and an overlapping degree of 0.4 mm, the arithmetic device 501 may generate pass information for forming a bead with a width smaller than 2 mm to fill the gap. In other words, the arithmetic device 501 may generate pass information so that the structure layer is formed without any gaps.

[0240] Here, a bead width of 2 mm is defined as the first width, and a width smaller than 2 mm is defined as the second width. The above-mentioned "pass information for forming a structure layer indicated by slice data while satisfying the conditions that the bead width is 2 mm and the overlap degree is 0.4 mm" may be referred to as first pass information. The above-mentioned "pass information for forming a bead with a width smaller than 2 mm in order to fill the gap" may be referred to as second pass information.

[0241] The intermediate mode is a mode in which beads are formed with an intermediate width (e.g., an intermediate value of the values ​​that the beads can take) in a region corresponding to the outer edge of the structure layer indicated by the slice data (e.g., the second region R2 in FIG. 15 ), and beads are formed with a wide width (e.g., the maximum value that the beads can take) in a region corresponding to a portion other than the outer edge of the structure layer (e.g., the first region R1 in FIG. 15 ). For example, in the intermediate mode, the intermediate width may be 1 mm, and the wide width may be 2 mm. Furthermore, the overlapping degree of beads with an intermediate width may be 0.2 mm, and the overlapping degree of beads with a wide width may be 0.4 mm.

[0242] When the intermediate mode is selected, the arithmetic device 501 may generate pass information for printing a portion of the structure layer corresponding to the region corresponding to the outer edge (e.g., the second region R2 in FIG. 15 ) while satisfying the conditions that the bead width is 1 mm and the overlapping degree is 0.2 mm. In this case, if a gap occurs in a portion of the structure layer to be printed due to the conditions that the bead width is 1 mm and the overlapping degree is 0.2 mm, the arithmetic device 501 may generate pass information for printing a bead with a width smaller than 1 mm to fill the gap. Here, the bead width of 1 mm is defined as the first width, and a width smaller than 1 mm is defined as the second width. The above “pass information for printing a portion of the structure layer corresponding to the region corresponding to the outer edge while satisfying the conditions that the bead width is 1 mm and the overlapping degree is 0.2 mm” may be referred to as first pass information. The above “pass information for printing a bead with a width smaller than 1 mm” may be referred to as second pass information.

[0243] When the intermediate mode is selected, the arithmetic device 501 may generate pass information for printing other portions of the structured layer corresponding to regions other than the outer edge (e.g., the first region R1 in FIG. 15 ) while satisfying the conditions that the bead width is 2 mm and the overlapping degree is 0.4 mm. In this case, if gaps occur in other portions of the structured layer due to the conditions that the bead width is 2 mm and the overlapping degree is 0.4 mm, the arithmetic device 501 may generate pass information for printing beads with widths smaller than 2 mm to fill the gaps. Here, the bead width of 2 mm is defined as the first width, and a width smaller than 2 mm is defined as the second width. The above “pass information for printing other portions of the structured layer corresponding to regions other than the outer edge while satisfying the conditions that the bead width is 2 mm and the overlapping degree is 0.4 mm” may be referred to as first pass information. The above “pass information for printing beads with widths smaller than 2 mm” may be referred to as second pass information.

[0244] The high-definition mode is a mode in which beads are formed with a narrow width (e.g., the minimum value that the bead can have) in a region corresponding to the outer edge of the structure layer indicated by the slice data (e.g., the second region R2 in FIG. 15 ), and beads are formed with an intermediate width (e.g., the intermediate value of the bead's possible values) in a region corresponding to a portion other than the outer edge (e.g., the first region R1 in FIG. 15 ). For example, in the high-definition mode, the narrow width may be 0.1 mm, and the intermediate width may be 1 mm. Furthermore, the overlapping degree of the narrow-width beads may be 0.08 mm, and the overlapping degree of the intermediate-width beads may be 0.2 mm.

[0245] When the high-resolution mode is selected, the calculation device 501 may generate path information for forming a portion of the structural layer corresponding to the region corresponding to the outer edge (e.g., the second region R2 in Figure 15) while satisfying the conditions that the bead width is 0.1 mm and the overlap degree is 0.08 mm.

[0246] When the high-definition mode is selected, the arithmetic device 501 may generate pass information for printing other portions of the structured layer corresponding to regions other than the outer edge (e.g., the first region R1 in FIG. 15 ) while satisfying the conditions that the bead width is 1 mm and the overlapping degree is 0.2 mm. In this case, if gaps occur in other portions of the structured layer due to the conditions that the bead width is 1 mm and the overlapping degree is 0.2 mm, the arithmetic device 501 may generate pass information for printing beads with widths smaller than 1 mm to fill the gaps. Here, the bead width of 1 mm is defined as the first width, and a width smaller than 1 mm is defined as the second width. The “pass information for printing other portions of the structured layer corresponding to regions other than the outer edge while satisfying the conditions that the bead width is 1 mm and the overlapping degree is 0.2 mm” may be referred to as first pass information. The “pass information for printing beads with widths smaller than 1 mm” may be referred to as second pass information.

[0247] The wider the bead width, the faster the structure layer indicated by the slice data is formed. Therefore, it can be said that the bead width indicates the forming speed of the object. Furthermore, the narrower the bead width, the higher the forming accuracy of the structure layer indicated by the slice data. Therefore, it can be said that the bead width indicates the forming accuracy of the object. Therefore, it can be said that the forming mode that defines the bead width indicates at least one of the forming speed and forming accuracy of the object.

[0248] The above-described operation of the information processing device COM may be realized by the calculation device 501 reading the CAM software SW2. In other words, the above-described operation of the information processing device COM may be realized by providing the functions of the CAM software SW2 to the information processing device COM.

[0249] When the width of the bead that can be formed by a processing device is fixed, the following method has been proposed as a method for forming a target object. When the width of the bead is relatively wide, a target object larger than the structure layer indicated by the slice data is first formed. Then, unnecessary portions of the formed object are removed so that the formed object approaches the structure layer. With this method, it may be difficult to perform a cutting process when the shape of the target structure layer is relatively complex. Furthermore, when a relatively expensive metal material is used as the forming material, more forming material than actually required is used, which increases manufacturing costs. In contrast, when the width of the bead is relatively narrow, the structure layer indicated by the slice data can be formed without performing a cutting process. However, due to the relatively narrow width of the bead, the forming speed of the structure layer becomes relatively slow.

[0250] When two or more types of bead widths can be selected when forming the structure layer indicated by the slice data (in other words, when the bead width is variable), the structure layer indicated by the slice data can be formed relatively quickly while suppressing the amount of cutting performed by the above-mentioned cutting process. Therefore, by selecting the bead width, it is possible to form a model while achieving both a relatively fast modeling speed and relatively high modeling accuracy. Note that "suppressing the amount of cutting" may include setting the amount of cutting to zero (i.e., not performing cutting).

[0251] In addition, when two or more types of bead widths can be selected, it is relatively easy to manufacture a hollow structure having, for example, a relatively thick outer wall and a relatively thin inner wall. The hollow structure may include at least one of an internal flow path, an air-cooling pipe, a lattice structure, and a honeycomb structure.

[0252] (3-3) Material Switching Process When a modeled object including two or more parts made of different modeling materials, such as the modeled object OB shown in Fig. 10, is manufactured by a processing device (e.g., the processing system SYS), a modeling material switching process is performed during the modeling of the model. For this reason, a computer (e.g., the information processing device COM) that executes the CAM software SW2 may generate information related to the modeling material switching process as information included in the processing control information.

[0253] In the following, information related to the process of switching the modeling material will be described using an information processing device COM as an example of a computer that executes the CAM software SW2. Note that in the following, the modeling material will be described as a powder material (i.e., powder). However, the modeling material is not limited to powder, and may be a wire-like material or a gaseous material.

[0254] As explained in "(3-2) Variable-Bead-Width Printing," the path information for printing an object is generated based on multiple slice data that are generated by slicing a 3D model of the object. For example, when printing the object OB shown in Fig. 10, after a layer of a layered structure of part OB#1 is printed, a layer of a layered structure of part OB#2 that corresponds to (has the same height as) the layer of part OB#1 may be printed. For convenience of explanation, the description of parts OB#3 to OB#11 included in the object OB will be omitted.

[0255] Part OB#1 is a part made only of the building material M1. Part OB#2 is a part made of a building material with a blending ratio of 90% building material M1 and 10% building material M2. Therefore, the building material used to build part OB#1 is different from the building material used to build part OB#2. For this reason, after one layer of part OB#1 is built, it is necessary to switch the building material (in other words, change the building material) before one layer of part OB#2 is built.

[0256] In a processing SYS (see FIG. 1 ) as an example of a processing apparatus, a modeling material from a material supply source 1 is transported to a material nozzle 212 via a mixer 12 and a supply pipe 11. The modeling material is switched in the material supply source 1. Therefore, after the modeling material is switched from the first modeling material to the second modeling material, it takes a certain amount of time for the second modeling material to be injected from the material nozzle 212. Furthermore, even if the modeling material is switched from the first modeling material to the second modeling material in the material supply source 1, it is necessary to discharge, for example, the first modeling material that is present in the supply pipe 11 and is not used to model a model.

[0257] For this reason, when switching the modeling material, the processing head (e.g., processing head 21) of the processing device (e.g., processing system SYS) is moved to a predetermined position different from the area where the model is to be formed. The information processing device COM may generate information for moving the processing head (e.g., processing head 21) to the predetermined position as information related to the modeling material switching process.

[0258] For example, the operation of the processing head (e.g., processing head 21) of the processing device (e.g., processing system SYS) when one layer of each of parts OB#1 and OB#2 of the object OB shown in Figure 10 is formed will be described with reference to Figure 17.

[0259] In FIG. 17 , the machining head forms a bead along path P1 to form one layer of portion OB#1. At this time, the machining head is positioned at the terminal position P1e of path P1. The machining head then moves from terminal position P1e to material switching position P0. After the build material is switched at material switching position P0, the machining head moves to the starting position P2s of path P2. Note that the machining head may move from material switching position P0 to terminal position P1e, and then further move from terminal position P1e to starting position P2s. Alternatively, the machining head may move from material switching position P0 to starting position P2s. The machining head then forms a bead along path P2 to form one layer of portion OB#2.

[0260] For example, to operate a machining head (e.g., machining head 21) as described above, the arithmetic device 501 of the information processing device COM may generate machining control information (e.g., an NC program) including first pass information indicating a path P1, second pass information indicating a path P2, and information for moving the machining head to a material switching position P0. Since the material switching position P0 is the target position of the machining head, the information for moving the machining head may include position information indicating the material switching position P0. Therefore, it can be said that the machining control information including information for moving the machining head includes position information indicating the material switching position P0. The material switching position P0 may be the origin of a coordinate system defined by mutually orthogonal X-, Y-, and Z-axes. In this case, the material switching position P0 may be referred to as a home position. In this case, it can be said that the information for moving the machining head, including position information indicating the material switching position P0, includes information about the home position. The arithmetic device 501 may generate the machining control information such that the first pass information, second pass information, and information for moving the machining head are contained in a single file.

[0261] The modeling material used to model part OB#1 (i.e., modeling material M1) may be referred to as the first modeling material. The modeling material used to model part OB#2 (i.e., modeling material with a 90% blending ratio of modeling material M1 and a 10% blending ratio of modeling material M2) may be referred to as the second modeling material. Because part OB#1 is modeled using the first modeling material, the first pass information can be considered as pass information indicating path P1 for modeling a bead using the first modeling material. Because part OB#2 is modeled using the second modeling material, the second pass information can be considered as pass information indicating path P2 for modeling a bead using the second modeling material. Furthermore, the material switching position P0 can be considered as a position for switching the modeling material supplied from a material supply port (e.g., material nozzle 212) of a processing device (e.g., processing system SYS) from the first modeling material to the second modeling material. The material switching position P0 can also be said to be a position for retracting the processing head from the area where the object (e.g., at least one of the portions OB#1 and OB#2) is to be formed. Therefore, the material switching position P0 may also be called the retraction position. The area where the object is to be formed may also be called the forming area.

[0262] The operation of the information processing device COM will be further described with reference to the flowchart in Fig. 18. The arithmetic device 501 of the information processing device COM may slice the 3D model of the object to generate slice data (step S301). Note that if the object is formed in one layer, the arithmetic device 501 does not need to perform the process of step S301.

[0263] The calculation device 501 generates first pass information indicating a first path (e.g., path P1) for forming a bead with the first forming material for a portion (e.g., portion OB#1) of one layer of the object indicated by the slice data that is formed with the first forming material (step S302).

[0264] The calculation device 501 generates second pass information indicating a second path (e.g., path P2) for forming a bead with the second forming material for a portion (e.g., portion OB#2) of one layer of the object indicated by the slice data that is formed with the second forming material (step S303).

[0265] The calculation device 501 generates evacuation path information indicating a path for moving the processing head (e.g., processing head 21) of the processing device to the material switching position P0 to change from the first forming material to the second forming material after the processing device (e.g., processing system SYS) has formed a bead based on the first pass information and before forming a bead based on the second pass information (step S304).

[0266] The arithmetic device 501 generates return path information indicating a path for moving the machining head (e.g., machining head 21) from the material switching position P0 to the bead formation start position based on the second pass information (step S305). Note that the arithmetic device 501 may generate evacuation path information and return path information as at least a part of the information for moving the machining head.

[0267] The first and second molding materials may include stainless steel, copper, aluminum, titanium, etc. The first and second molding materials may be different materials. For example, the first molding material may be copper, and the second molding material may be titanium, which is different from the copper of the first molding material.

[0268] The first and second modeling materials may have different characteristics. For example, the first and second modeling materials may have different particle sizes. The first modeling material may have a particle size distribution with a peak at 30 μm, and the second modeling material may have a particle size distribution with a peak at 100 μm. For example, the first and second modeling materials may be the same type of material but with different particle sizes.

[0269] A processing device (e.g., a processing system SYS) that operates based on processing control information including first pass information, second pass information, and information for moving a processing head may form a bead using a first modeling material supplied from a material supply port (e.g., a material nozzle 212) based on the first pass information included in the processing control information. After the bead based on the first pass information is formed, the processing device may move the processing head (e.g., a processing head 21) to a material switching position P0 based on information for moving the processing head included in the processing control information. After the modeling material is switched from the first modeling material to the second modeling material, the processing device may form a bead using the second modeling material supplied from a material supply port (e.g., a material nozzle 212) based on second pass information included in the processing control information. Note that for a method of forming a bead, please refer to "(2) Operation of the processing system SYS" above.

[0270] The information for moving the machining head may include at least one of the following: information for causing a machining device (e.g., the machining system SYS) to acquire a current position when the machining head (e.g., the machining head 21) is located at the end position P1e; information for causing the machining device to terminate the tool center point control mode; information for causing the machining device to move the machining head to the material switching position P0; information for causing the machining device to switch the modeling material; information for causing the machining device to move the machining head to the stored current position; information for causing the machining device to prepare to form a model with the switched modeling material; and information for causing the machining device to start the tool center point control mode. At least some of this information may be specified by G-code. Examples of the tool center point include the tip of the material supply port (e.g., the material nozzle 212) and the focal position of the machining beam (e.g., the machining light EL).

[0271] The arithmetic device 501 may generate, in a processing device (e.g., a processing system SYS), evacuation path information indicating a path for the processing head to move to the material switching position P0, as information for moving the processing head (e.g., the processing head 21) to the material switching position P0. In this case, the arithmetic device 501 may generate the evacuation path information based on the shape of the object so that the processing head does not come into contact with the object. Note that the evacuation path information may be included in information for moving the processing head. In other words, the arithmetic device 501 may generate the evacuation path information as part of information for moving the processing head.

[0272] The material switching position P0 may be fixed or may be changeable. For example, as shown in FIG. 19, material switching positions P0a and P0b may be set as the material switching position P0. In FIG. 19, the material switching positions P0a and P0b have different Z coordinates. Three or more material switching positions may be set. The multiple material switching positions may differ from each other in at least one of the X coordinate, Y coordinate, and Z coordinate.

[0273] As shown in FIG. 19( a), at the initial stage of the printing of parts OB#1 and OB#2, the heights of parts OB#1 and OB#2 are relatively low, so material switching position P0a may be selected as the position for switching the printing material. As shown in FIG. 19( b), at a stage where the printing of parts OB#1 and OB#2 has progressed, the heights of parts OB#1 and OB#2 are relatively high, so material switching position P0b may be selected as the position for switching the printing material. In other words, when multiple material switching positions (e.g., material switching positions P0a and P0b) are set, the arithmetic unit 501 may select the material switching position closest to the printing end position of part OB#1 (e.g., end position P1e) from the multiple material switching positions. In this case, the arithmetic unit 501 may generate, as the above-mentioned evacuation path information, evacuation path information indicating a path for the machining head to move to the selected material switching position. This configuration can shorten the time required for the printing material switching process.

[0274] The plurality of material switching positions do not have to be set in advance. In this case, the arithmetic device 501 may set the material switching positions based on the outer dimensions of the object immediately before starting the process of switching the modeling material. In this case, the arithmetic device 501 may set the material switching positions to positions outside the modeling area and closest to the modeling end position (e.g., end position P1e) of part OB#1 based on the outer dimensions. In other words, the arithmetic device 501 may arbitrarily set the material switching positions based on the outer dimensions.

[0275] Incidentally, when the attitude of a machining head (e.g., machining head 21) of a machining device (e.g., machining system SYS) is changed, the machining head may be tilted with respect to a table (e.g., stage 31) on which a molded object is placed. Also, when the attitude of the table is changed, the machining head may be tilted with respect to the table. In other words, when the attitude of at least one of the machining head and the table is changed, the machining head may be tilted with respect to the table. For this reason, the arithmetic device 501 may generate evacuation path information indicating a path for the machining head to move to a material switching position (e.g., material switching position P0) based on the relative tilt between the machining head and the table.

[0276] As described above, the arithmetic device 501 may generate the evacuation path information based on the shape of the object so that the machining head does not come into contact with the object. Therefore, the arithmetic device 501 may generate the evacuation path information based on at least one of the shape of the object and the relative inclination between the machining head and the table.

[0277] If the machining head is tilted relative to the table due to a bead being formed with the first modeling material while the machining head's posture is changed from the reference posture (for example, if the machining head is tilted relative to the table at the terminal position P1e), the arithmetic device 501 may generate first posture change information to cause the machining device to change the posture of the machining head to the reference posture. In this case, the arithmetic device 501 may generate machining control information so that the machining head is moved to the material switching position based on the evacuation path information after the posture of the machining head is changed to the reference posture based on the first posture change information. Note that the reference posture of the machining head may be defined as the posture of the machining head relative to the table. Note that the first posture change information may be included in information for moving the machining head. In other words, the arithmetic device 501 may generate the first posture change information as part of information for moving the machining head.

[0278] As described above, the machining head may be tilted relative to the table due to a change in the attitude of the table. Therefore, the first attitude change information may include information for changing the attitude of the table, which is tilted relative to the horizontal (in other words, tilted), to the reference attitude (e.g., horizontal), in addition to or instead of information for changing the attitude of the machining head to the reference attitude.

[0279] The arithmetic device 501 may generate material switching information for causing the processing device (e.g., the processing system SYS) to switch the modeling material from the first modeling material to the second modeling material after the processing head moves to the material switching position (e.g., material switching position P0). Note that the material switching information may be included in the information for moving the processing head. In other words, the arithmetic device 501 may generate the material switching information as part of the information for moving the processing head.

[0280] As described above, when switching the modeling material, it is necessary to discharge the modeling material (i.e., the modeling material not used to model the object) present in the piping (e.g., the supply pipe 11). If the modeling material present in the piping is not properly discharged, the quality of the object formed after switching the modeling material may be reduced. For this reason, the arithmetic device 501 may generate standby information for causing the machining head (e.g., the machining head 21) to wait for a predetermined time at the material switching position (e.g., the material switching position P0). Note that the standby information may be included in the material switching information. In other words, the arithmetic device 501 may generate the standby information as part of the material switching information.

[0281] For example, the first modeling material may be supplied from a first feeder (e.g., corresponding to the material supply source 1) via a pipe (e.g., supply pipe 11). The second modeling material may be supplied from a second feeder via the above-mentioned pipe. The first feeder and the second feeder may be included in the same housing or in different housings. When the modeling material is switched from the first modeling material to the second modeling material, the time required to discharge the first modeling material present in the pipe changes depending on the speed at which the second feeder feeds the second modeling material. Therefore, the time (the above-mentioned predetermined time) that the processing head waits at the material switching position may change depending on the speed at which the second feeder feeds the second modeling material.

[0282] If the speed at which the second feeder feeds the second modeling material is a fixed value and known, the arithmetic device 501 may include, in the standby information, information indicating the speed at which the second feeder feeds the second modeling material and information for causing the processing device to calculate a standby time based on the feeding speed. If the speed at which the second feeder feeds the second modeling material is variable, the arithmetic device 501 may include, in the standby information, information for causing the processing device to acquire the speed at which the second feeder feeds the second modeling material and information for causing the processing device to calculate a standby time based on the feeding speed. Note that the arithmetic device 501 may generate information for instructing the processing device to change from the first feeder to the second feeder as part of material switching information for causing the processing device to switch the modeling material from the first modeling material to the second modeling material.

[0283] This configuration allows the waiting time of the processing head at the material switching position to be appropriately determined. Therefore, when the modeling material is switched from the first modeling material to the second modeling material, the first modeling material present in the piping can be appropriately discharged. As a result, the quality of the modeled object formed after the modeling material switching can be improved.

[0284] If the material switching position (e.g., material switching position P0) is located above a table (e.g., stage 31) of a processing device (e.g., processing system SYS), the modeling material discharged from a material supply port (e.g., material nozzle 212) may accumulate on the table when the modeling material is switched. The computing device 501 may generate information for causing the processing device to remove the modeling material accumulated on the table. In this case, the accumulated modeling material may be removed by purging with a purge gas (e.g., purge gas supplied from the supply port 62 to the chamber space 63IN). The accumulated modeling material may be removed by shaking off the modeling material from the table as the table rotates around an axis parallel to the X-axis.

[0285] The arithmetic device 501 may generate return path information indicating a path for the machining head to move from the material switching position (e.g., material switching position P0) to the bead formation start position (e.g., start position P2s) in the machining device (e.g., machining system SYS). The return path information may be included in the information for moving the machining head. In other words, the arithmetic device 501 may generate the return path information as part of the information for moving the machining head.

[0286] If the machining head is tilted with respect to the table due to the bead being formed with the first modeling material while the posture of the machining head is changed from the reference posture (for example, if the machining head is tilted with respect to the table at the terminal position P1e), the arithmetic unit 501 may acquire the posture of the machining head when the bead was formed with the first modeling material (for example, the posture of the machining head at the terminal position P1e). Then, if the posture of the machining head is changed to the reference posture before the machining head moves to the material switching position (for example, the material switching position P0) based on the retraction path information, the arithmetic unit 501 may generate second posture change information for changing the posture of the machining head from the reference posture to the posture of the machining head when the bead was formed with the first modeling material.

[0287] In this case, the arithmetic device 501 may generate processing control information so that, after the processing head is moved to the printing start position based on the return path information, the posture of the processing head is changed from the reference posture to the posture of the processing head when the bead was printed with the first printing material based on the second posture change information. Note that the second posture change information may be included in information for moving the processing head. In other words, the arithmetic device 501 may generate the second posture change information as part of information for moving the processing head. Note that the posture of the processing head when the bead is printed with the first printing material can be said to be the posture after the processing device (e.g., the processing system SYS) has printed the bead based on the first path information.

[0288] The evacuation path information may include information on additive modeling conditions in addition to information indicating the path for the machining head (e.g., machining head 21) to move to the material switching position (e.g., material switching position P0). The information on additive modeling conditions may include information for switching the modeling material.

[0289] The arithmetic device 501 may generate information for instructing the processing device (e.g., the processing system SYS) to start switching the modeling material from the first modeling material to the second modeling material when the processing head (e.g., the processing head 21) is moving from the modeling area to the material switching position (e.g., the material switching position P0). This configuration can reduce the time the processing head waits at the material switching position compared to when switching the modeling material from the first modeling material to the second modeling material is started after the processing head reaches the material switching position. As a result, the time required to form a model (e.g., the model OB) can be shortened.

[0290] Incidentally, when the building material is a powder, the building material discharged from the material supply port (e.g., the material nozzle 212) due to switching of the building material may accumulate in at least a part of the building area (specifically, at least one of on top of an already built object and at least a part of an area where future objects will be built). For example, when the processing device starts switching the building material from the first building material to the second building material while the processing head is moving from the building area to the material switching position, the building material is likely to accumulate in at least a part of the building area.

[0291] The arithmetic device 501 may generate imaging information for causing a processing device (e.g., the processing system SYS) to capture an image of the shaping area using an imaging device (e.g., the imaging unit 8). The arithmetic device 501 may generate determination information for causing the processing device to determine whether or not shaping material has accumulated based on an image including the shaping area captured by the imaging device. If it is determined that shaping material has accumulated, the arithmetic device 501 may generate removal information for causing the processing device to remove the accumulated shaping material. Note that the accumulated shaping material may be removed by purging with a purge gas (e.g., a purge gas supplied to the chamber space 63IN from the supply port 62).

[0292] For example, the arithmetic device 501 may generate processing control information so that, after the modeling material is switched from the first modeling material to the second modeling material based on the material switching information, and before the machining head moves based on the return path information, the processing control information is executed based on the imaging information, determination information, and removal information. Note that the imaging information, determination information, and removal information may be included in information for moving the machining head. In other words, the arithmetic device 501 may generate the imaging information, determination information, and removal information as part of information for moving the machining head.

[0293] The above-described operation of the information processing device COM may be realized by the calculation device 501 reading the CAM software SW2. In other words, the above-described operation of the information processing device COM may be realized by providing the functions of the CAM software SW2 to the information processing device COM.

[0294] (3-4) Planarization Processing As described with reference to FIG. 8 , for example, in the modeling process for forming a three-dimensional object ST by stacking multiple structural layers, the three-dimensional object ST is not planarized. In other words, if the three-dimensional object ST is to be planarized, the planarization needs to be performed separately from the modeling process. However, after at least one of a relatively complex structure and a hollow structure (e.g., a pipe) is formed, it may be difficult to perform a planarization process on the object. Therefore, a computer (e.g., an information processing device COM) executing the CAM software SW2 may generate information related to the planarization process (i.e., the flattening process) as part of the processing control information.

[0295] Hereinafter, information related to the planarization process will be described using an information processing device COM as an example of a computer that executes the CAM software SW2. Here, the planarization process refers to a process in which a processing beam (i.e., a beam irradiated onto the modeling material when the model is being modeled) or a melting beam different from the processing beam is used to melt a portion of the model to flatten the model. Such a planarization process may be at least one of a remelt process and an ablation process. The planarization process may involve either a remelt process or an ablation process, or both a remelt process and an ablation process. Since various existing aspects of the planarization process, including the remelt process and the ablation process, are applicable, detailed description thereof will be omitted.

[0296] In the following, pass information indicating a path for supplying a modeling material to form a bead will be referred to as modeling pass information, and pass information indicating a path for performing a flattening process on a modeled object will be referred to as melting pass information.

[0297] The arithmetic device 501 may slice the object corresponding to the three-dimensional model information indicated by the 3D model file F11, and generate a plurality of slice data pieces each representing a cross section of a plurality of layers forming the object (i.e., a plurality of layered structures). Note that if the object is formed of a single layer, the arithmetic device 501 does not need to generate slice data pieces.

[0298] As described with reference to FIG. 8 , a three-dimensional object ST is formed by stacking multiple structural layers SL. During the formation of one structural layer (e.g., structural layer SL#1), portions (so-called "burrs") that protrude beyond the cross-sectional contour line indicated by the slice data (see the bold line in FIG. 15 ) may be generated. For example, a flattening process may be performed to remove the protruding portions. In this case, the flattening process is performed so that, when viewed from above, the shape of the one structural layer approaches (typically coincides with) the cross-sectional contour line indicated by the slice data for the one structural layer.

[0299] When viewing one structural layer from above, the area to be subjected to the planarization process may be a region (e.g., region AR in FIG. 15 ) adjacent to the area corresponding to the one structural layer in the cross section shown by the slice data for the one structural layer. As shown in FIG. 8 , the one structural layer has a thickness (in other words, a length in the Z-axis direction). In an actual planarization process, the processing beam or melting beam is irradiated onto the side surface of the one structural layer. Therefore, it can be said that the area to be subjected to the planarization process is the side surface region of the one structural layer.

[0300] Therefore, in an object (e.g., a three-dimensional object ST) formed by stacking multiple structural layers, the region to which the planarization process is applied can be said to be the side region of the object. For example, in the case of the hollow object OB2 shown in Figure 20, the region to which the planarization process is applied may include the outer surface region OW and the inner surface region IW of the object OB2. Note that, for the hollow object OB2, the region to which the planarization process is applied may be only one of the outer surface region OW and the inner surface region IW.

[0301] The area to be flattened is an area where a part of the object is melted by the processing beam or the melting beam, and therefore may also be referred to as a melted area.

[0302] The calculation device 501 may set a molten region based on the cross-sectional contour lines (i.e., the contour lines of the layered structure) included in each of the multiple slice data and the three-dimensional model information indicated by the 3D model file F11. As a result, the calculation device 501 may acquire molten region information indicating the molten region. Note that the thickness of one structural layer (i.e., one layered structure) is uniquely determined from the slice spacing when generating the slice data. Therefore, the calculation device 501 can identify a side region of one structural layer related to one slice data based on the three-dimensional model information indicated by the 3D model file F11. The calculation device 501 may set the identified side region as at least a part of the molten region.

[0303] If the three-dimensional model information indicated by the 3D model file F11 is information indicating a CAD model, the user may specify the molten region in advance on the CAD model. If the three-dimensional model information indicated by the 3D model file F11 is information indicating a CAD model, the user may specify the molten region by touching or clicking a GUI (Graphical User Interface) that displays a three-dimensional shape based on the CAD model. The user may specify the molten region from at least one of camera images captured from all directions of the formed object and a live image of the formed object.

[0304] The melting region may be set automatically, not by a user, but by the information processing device COM (specifically, the arithmetic device 501). For example, when a curved pipe is to be molded as a shaped object, the timing for melting a portion of the shaped object may be set automatically so that the processing beam or melting beam is irradiated onto the target position within the melting region before the processing beam or melting beam for melting a portion of the shaped object becomes unable to be irradiated onto the target position due to the shape of the pipe.

[0305] The arithmetic device 501 may generate melt path information indicating a path (e.g., see the dashed line in FIG. 20 ) along which the processing beam or melt beam is irradiated for the planarization process, based on the melt region. In this case, the arithmetic device 501 may generate melt path information indicating a path along which the processing beam or melt beam is irradiated, based on the melt region, so as to trace the contour of the formed layered structure. In other words, the arithmetic device 501 may generate melt path information based on the melt region so that the processing beam or melt beam is irradiated onto the surface of the formed layered structure. Note that "tracing the contour of the layered structure" means that a spot of the processing beam or melt beam of a predetermined size moves on the surface (e.g., side) of the layered structure, or that the focal position of the processing beam or melt beam moves on the surface (e.g., side) of the layered structure.

[0306] The CAM software SW2 may include information about the spot diameter of at least one of the processing beam and melt beam used in the planarization process. The information about the spot diameter may include the distance from the reference plane of the optical system (e.g., the irradiation optical system 211) of the processing device (e.g., the processing system SYS) to the processing point (i.e., a point on the object to be planarized). This distance may be referred to as the laser spot distance. The calculation device 501 may generate melt pass information based on the melt region and the information about the spot diameter. The calculation device 501 may set the irradiation angle of the processing beam or melt beam when generating the melt pass information. In this case, the melt pass information can be said to include irradiation angle information that defines the irradiation angle.

[0307] The arithmetic device 501 may generate processing control information (e.g., an NC program) including the shaping pass information and the melting pass information so that, after at least a portion of a shaped object (e.g., a three-dimensional shaped object ST) is shaped based on the shaping pass information, a flattening process is performed on at least a portion of the shaped object based on the melting pass information. The arithmetic device 501 may generate the processing control information so that the shaping pass information and the melting pass information are included in a single file. By shaping at least a portion of a shaped object based on the shaping pass information, another portion is added to an already shaped portion. For this reason, shaping at least a portion of a shaped object based on the shaping pass information may be referred to as additional processing. The flattening process performed based on the melting pass information (i.e., the flattening process) is a process performed in addition to the additional processing, and therefore may be referred to as additional processing.

[0308] The processing control information, which is generated so that the flattening process is performed based on the melting pass information after at least a portion of the object is formed based on the forming pass information, defines the execution order of the forming process for forming at least a portion of the object and the flattening process. Therefore, it can be said that the processing control information includes timing information that indicates the timing at which the flattening process is performed based on the melting pass information.

[0309] The operation of the information processing device COM will be further described with reference to the flowchart in Fig. 21. The arithmetic device 501 of the information processing device COM may slice the 3D model of the object to generate slice data (step S401). Note that if the object is formed in one layer, the arithmetic device 501 does not need to perform the process of step S401.

[0310] Here, it is assumed that N pieces of slice data are generated in the processing of step S401. The arithmetic device 501 generates modeling path information for modeling each of the first to Nth layers of the modeling object indicated by the N pieces of slice data (step S402).

[0311] The arithmetic device 501 acquires melt region information indicating the melt region (step S403). The arithmetic device 501 generates melt path information indicating a path for irradiating the processing beam or melt beam to be irradiated for the planarization process based on the melt region indicated by the melt region information (step S404). In the processing of step S404, the arithmetic device 501 may generate multiple pieces of melt path information.

[0312] Next, the arithmetic device 501 sets the execution order of the modeling that is performed based on the modeling pass information generated in the process of step S402 and the flattening that is performed based on the melting pass information generated in the process of step S404 (step S405). For example, in the process of step S405, the arithmetic device 501 may set the execution order so that after the first to Nth layers of the modeling object are modeled based on the modeling pass information, the flattening process is performed based on the melting pass information. For example, in the process of step S405, the arithmetic device 501 may set the execution order so that after a part of the modeling object is modeled based on some of the multiple modeling pass information, the flattening process is performed on the part of the modeled object based on the melting pass information.

[0313] In addition to the modeling path information and the melting path information, the calculation device 501 may generate path information indicating a path for moving a machining head (e.g., machining head 21) to a position where a machining device (e.g., machining system SYS) performs processing to switch between a mode in which the machining head operates based on the modeling path information and a mode in which the machining head operates based on the melting path information. In this case, the machining head may move along the path indicated by the generated path information after moving along the path indicated by the modeling path information and before moving along the path indicated by the melting path information. Furthermore, the machining head may move along the path indicated by the generated path information after moving along the path indicated by the melting path information and before moving along the path indicated by the modeling path information.

[0314] A processing device (e.g., the processing system SYS) that operates based on processing control information including the fabrication path information and the melting path information may supply a fabrication material from a material supply port (e.g., the material nozzle 212) to a position where a processing beam (e.g., processing light EL) is irradiated by a beam irradiation device (e.g., the irradiation optical system 211) based on the fabrication path information included in the processing control information, thereby fabricating at least a portion of the fabricated object. Furthermore, based on the melting path information included in the processing control information, the processing device may irradiate a processing beam or a melting beam from the beam irradiation device without supplying a fabrication material from the material supply port, thereby performing a planarization process (i.e., planarization processing) on ​​at least a portion of the fabricated object. For details about the bead fabrication method, see "(2) Operation of the processing system SYS" above.

[0315] The arithmetic device 501 may generate, based on the printing pass information, first beam information that specifies at least one of the spot diameter and power of a processing beam (e.g., processing light EL) when a processing device (e.g., the processing system SYS) forms a bead (i.e., at least a portion of the object). In this case, the processing device may control a light source (e.g., the light source 4) based on the first beam information so that the processing beam specified by the first beam information is irradiated onto the printing material. Furthermore, the arithmetic device 501 may generate, based on the melting pass information, second beam information that specifies at least one of the spot diameter and power of a processing beam or melting beam when the processing device (e.g., the processing system SYS) performs a planarization process on at least a portion of the object. In this case, the processing device may control the light source based on the second beam information so that the processing beam or melting beam specified by the second beam information is irradiated onto at least a portion of the object. Note that the spot diameter specified by the first beam information may be different from the spot diameter specified by the second beam information. The power defined by the first beam information may be different from the power defined by the second beam information. The processing control information may include at least one of the first beam information and the second beam information. That is, the arithmetic device 501 may generate at least one of the first beam information and the second beam information as part of the processing control information. The processing control information may include head speed information related to the movement speed of a processing head (e.g., processing head 21) of a processing device (e.g., processing system SYS). That is, the arithmetic device 501 may generate the head speed information as part of the processing control information.

[0316] The calculation device 501 may generate processing control information including the modeling pass information and the melting pass information so that after a part of the modeled object is modeled based on the first modeling pass information, a flattening process is performed on the part of the modeled object based on the first melting pass information, and then after another part of the modeled object is modeled based on the second modeling pass information, a flattening process is performed on the other part of the modeled object based on the second melting pass information.

[0317] 8, a model (e.g., a three-dimensional model ST) is formed by sequentially forming a structure layer (e.g., a structure layer SL#1) from the lowermost structure layer and stacking the formed structure layers. Therefore, if no measures are taken when a planarization process is performed on a part of a model after the part of the model has been formed, there is a possibility that the planarization process will not be performed appropriately due to a part of the optical system (e.g., the irradiation optical system 211) of a processing device (e.g., the processing system SYS) coming into contact with the part of the model.

[0318] In the case of a relatively complicated piping PI as shown in Fig. 22(a), for example, flattening processing of the inside of the piping surrounded by the dotted circle C cannot be performed after the piping PI has been shaped to the state shown in Fig. 22(a). The flattening processing of the inside of the piping surrounded by the dotted circle C may be performed in the state shown in Fig. 22(b), for example.

[0319] In consideration of these points, the calculation device 501 may generate processing control information including modeling pass information and melting pass information so that, after the layered structure of the i-th layer indicated by the i-th slice data to the j-th layer indicated by the j-th slice data is modeled based on the modeling pass information, the layered structure of the i-th layer to the j-th layer is subjected to a planarization process based on the melting pass information generated based on the i-th slice data to the j-th slice data, where "i" is a value smaller than "j".

[0320] For example, the arithmetic device 501 may determine the jth layer based on the heights of the layered structures from the i-th layer to the j-th layer and the laser spot distance (i.e., the distance from the reference plane of the optical system of the processing device to the processing point). For example, the arithmetic device 501 may determine the jth layer so that the heights of the layered structures from the i-th layer to the j-th layer do not exceed a value obtained by multiplying the height dz of the layered structure of one layer by a predetermined constant.

[0321] The arithmetic device 501 may determine the jth layer as follows: The arithmetic device 501 may determine whether or not the planarization process for at least a portion of the layer structure of the kth layer is hindered due to the shape of the layer structure of the k+1th layer indicated by the k+1th slice data. If it is determined that the planarization process for at least a portion of the layer structure of the kth layer is hindered due to the shape of the layer structure of the k+1th layer, the arithmetic device 501 may determine the kth layer as the jth layer. Note that the user may specify the jth layer via the input device 504.

[0322] The above-described operation of the information processing device COM may be realized by the calculation device 501 reading the CAM software SW2. In other words, the above-described operation of the information processing device COM may be realized by providing the functions of the CAM software SW2 to the information processing device COM.

[0323] As described above, the arithmetic device 501 generates processing control information (e.g., an NC program) including the printing path information and the melting path information, so that a single processing device (e.g., a processing system SYS) can perform a printing process for printing an object and a flattening process for the printed object. For example, for a hollow object (e.g., a pipe), by alternately printing a part of the object and flattening the printed part, it is possible to print the object while flattening the inner wall of the hollow object (i.e., a part that is difficult to flatten after printing), which is extremely advantageous in practical use.

[0324] (3-5) Measurement Path Information The machining apparatus (e.g., machining system SYS) may be equipped with a measuring instrument. The measuring instrument may refer to an instrument for measuring at least one of the geometric accuracy (e.g., height, XY dimensions), surface roughness, defects, pores (i.e., tiny bubble-like holes), and flaw detection of the object. The geometric accuracy, etc., are indices for determining whether the object has been formed as intended (e.g., according to the three-dimensional model information indicated by the 3D model file F11). For this reason, the measuring instrument may be referred to as a product inspection instrument. The measuring instrument may refer to an instrument for measuring the temperature of the object (which may be referred to as the "workpiece temperature"). In this case, the measuring instrument may be referred to as a temperature detection device. The measuring instrument may refer to an instrument for observing the molten pool (e.g., molten pool MP). The measuring instrument may refer to an instrument for real-time observation (in other words, live view) of the interior (e.g., chamber space 63IN) of the machining apparatus (e.g., machining system SYS). In these cases, the measuring instrument may be referred to as an observation device.

[0325] The measuring instrument may be at least one of a laser scanner and an imaging device. The laser scanner may be a three-dimensional scanner. The imaging device may be a stereo camera. The measuring instrument is installed in the processing apparatus so as to be movable inside the processing apparatus (e.g., chamber space 63IN). For example, the measuring instrument may be disposed in a housing (e.g., head housing 213) that houses a processing head (e.g., processing head 21). In this case, the measuring instrument moves together with the processing head. Alternatively, the measuring instrument may be disposed on a member for moving the measuring instrument that is different from the housing that houses the processing head. The member for moving the measuring instrument may be referred to as a dedicated measurement head. In this case, the measuring instrument and the processing head move independently of each other.

[0326] A computer (e.g., an information processing device COM) that executes the CAM software SW2 may generate information related to measurement by a measuring device as part of the processing control information. Hereinafter, information related to measurement will be described using the information processing device COM as an example of a computer that executes the CAM software SW2. Hereinafter, path information indicating a path for supplying a modeling material to form a bead will be referred to as modeling path information. Also, path information indicating a path for a measuring device to measure a model will be referred to as measurement path information.

[0327] Note that, when the measuring instrument moves together with the processing head (e.g., processing head 21), the modeling path information and the measurement path information may be included in a single file. Furthermore, when the measuring instrument and the processing head move independently of each other, the modeling path information (i.e., information for moving the processing head) and the measurement path information (i.e., information for moving the measurement-dedicated head) may be included in a single file. As described above, the measuring instrument may measure the geometric accuracy, etc. of the object. The geometric accuracy, etc. can be obtained by measuring the structure from its exterior. For example, as described with reference to FIG. 8 , a three-dimensional object ST is formed by stacking multiple structure layers SL. As shown in FIG. 8 , one structure layer (e.g., structure layer SL#1) has a thickness (in other words, the length in the Z-axis direction). When one structure layer is formed, the measuring instrument can measure the side and top surfaces of the one structure layer. Therefore, when a three-dimensional structure ST is formed by stacking multiple structural layers SL, the measuring instrument can measure the side and top surfaces of the three-dimensional structure ST. In the case of a hollow structure, if an opening exists on the top surface of the structure (see, for example, structure OB2 shown in FIG. 20 ), the measuring instrument can measure the outer wall (i.e., outer side surface), inner wall (i.e., inner side surface), and top surface of the structure.

[0328] The side surfaces (including the outer and inner surfaces) and the top surface of an object are surfaces of the object. Therefore, it can be said that the measuring instrument measures the surface of the object. Therefore, the area measured by the measuring instrument may include the surface area of ​​the object. Note that the inner walls of the object are the internal surfaces of the object. Therefore, measuring the inner walls of an object with a measuring instrument can be said to be measuring the interior of the object with a measuring instrument. Note that the area measured by the measuring instrument may also be referred to as the measurement area. For example, in the case of an object OB2 having a hollow structure shown in FIG. 20 , the measurement area may include the outer surface area OW and the inner surface area IW of the object OB2. Note that for an object OB2 having a hollow structure, the measurement area may be only one of the outer surface area OW and the inner surface area IW.

[0329] The arithmetic device 501 may slice the object corresponding to the three-dimensional model information indicated by the 3D model file F11, and generate a plurality of slice data pieces each representing a cross section of a plurality of layers forming the object (i.e., a plurality of layered structures). Note that if the object is formed of a single layer, the arithmetic device 501 does not need to generate slice data pieces.

[0330] The arithmetic device 501 may set a measurement region based on the cross-sectional contour lines (i.e., the contour lines of the layered structure) included in each of the multiple slice data and the three-dimensional model information indicated by the 3D model file F11. As a result, the arithmetic device 501 may acquire measurement region information indicating the measurement region. The thickness of one structural layer (i.e., one layered structure) is uniquely determined from the slice spacing when generating the slice data. Therefore, the arithmetic device 501 can identify the lateral region of one structural layer associated with one slice data based on the three-dimensional model information indicated by the 3D model file F11. The arithmetic device 501 may set the identified lateral region as at least a part of the measurement region. In other words, the measurement region may be automatically set by the information processing device COM (specifically, the arithmetic device 501) rather than by a user.

[0331] If the three-dimensional model information indicated by the 3D model file F11 is information indicating a CAD model, the user may specify the measurement area in advance on the CAD model. If the three-dimensional model information indicated by the 3D model file F11 is information indicating a CAD model, the user may specify the measurement area by touching or clicking a GUI that displays a three-dimensional shape based on the CAD model. The user may specify the measurement area from at least one of camera images captured from all directions of the formed object and live images of the formed object.

[0332] The arithmetic device 501 may generate measurement path information that indicates a path along which the measuring instrument will measure the object, based on the measurement area. The surface of the object can be rephrased as the outer shape of the object. The object to be formed is an object that corresponds to the three-dimensional model information indicated by the 3D model file F11 (in other words, is indicated by the three-dimensional model information). Therefore, it can be said that the three-dimensional model information includes information related to the outer shape of the object. As described above, the measurement area may include the surface area of ​​the object. Therefore, it can be said that the measurement path information is generated based on information related to the outer shape of the three-dimensional model information indicating the object.

[0333] The measuring instrument has a distance range within which it can properly measure the object. This distance range may be referred to as the standoff distance. The calculation device 501 may generate measurement path information based on the measurement area and the standoff distance. Note that the CAM software SW2 may include in advance information regarding the standoff distance associated with the measuring instrument.

[0334] The arithmetic device 501 may generate processing control information (e.g., an NC program) including the printing path information and the measurement path information so that after at least a part of a printed object (e.g., a three-dimensional printed object ST) is printed based on the printing path information, a measuring instrument measures at least a part of the printed object based on the measurement path information. Note that the arithmetic device 501 may generate the processing control information so that the printing path information and the measurement path information are included in one file.

[0335] The operation of the information processing device COM will be further described with reference to the flowchart of Fig. 23. The arithmetic unit 501 of the information processing device COM acquires three-dimensional model information indicated by the 3D model file F11 (step S501).

[0336] The arithmetic device 501 may slice the object corresponding to the three-dimensional model information acquired in the processing of step S501 (i.e., the 3D model of the object) to generate slice data. Note that if the object is formed in one layer, the arithmetic device 501 does not need to generate slice data. The arithmetic device 501 may generate printing path information based on the slice data (step S502). Note that if slice data is not generated, the arithmetic device 501 may generate printing path information based on the 3D model of the object.

[0337] The arithmetic device 501 acquires measurement area information indicating the measurement area (step S503). The arithmetic device 501 generates measurement path information indicating a path along which the measuring instrument will measure the object, based on the measurement area indicated by the measurement area information (step S504). In the processing of step S504, the arithmetic device 501 may generate multiple pieces of measurement path information.

[0338] In addition to the modeling path information and the measurement path information, the arithmetic device 501 may generate path information indicating a path for moving a machining head (e.g., machining head 21) to a position where a machining device (e.g., machining system SYS) performs processing to switch between a mode in which the machining head operates based on the modeling path information and a mode in which the measuring instrument operates based on the measurement path information. In this case, after the machining head moves along the path indicated by the modeling path information, the measuring instrument may move along the path indicated by the generated path information before moving along the path indicated by the measurement path information. Furthermore, after the measuring instrument moves along the path indicated by the measurement path information, the measuring instrument may move along the path indicated by the generated path information before the machining head moves along the path indicated by the modeling path information.

[0339] A processing device (e.g., a processing system SYS) that operates based on processing control information including printing path information and measurement path information may supply a printing material from a material supply port (e.g., a material nozzle 212) to a position where a processing beam (e.g., processing light EL) is irradiated by a beam irradiation device (e.g., an irradiation optical system 211) based on the printing path information included in the processing control information, thereby forming at least a part of the object. The processing device may further measure at least a part of the formed object using a measuring instrument based on the measurement path information included in the processing control information.

[0340] If the measuring instrument is an imaging device (e.g., a camera), the arithmetic unit 501 may generate measurement path information so that the imaging device temporarily stops at an imaging position on a path for measuring the object (i.e., a position where the imaging device captures an image of the object). In this case, the measurement path information may include movement information for moving the imaging device along the path for measuring the object, stop information for temporarily stopping the imaging device, and imaging information for causing the imaging device to capture an image of the object.

[0341] Specifically, the calculation device 501 may generate measurement path information so that after the imaging device moves based on the first movement information, the imaging device stops based on the first stop information, the imaging device captures an image of the object based on the first imaging information, and then the imaging device moves based on the second movement information.

[0342] An example of a route indicated by the measurement path information when the measuring instrument is an imaging device is shown in Fig. 18(a). In Fig. 18(a), arrows indicate the route. In Fig. 18(a), black circles indicate positions where the imaging device temporarily stops. In Fig. 18(a), a dotted rectangle indicates the imaging range of the imaging device.

[0343] The stop information may include information indicating a position where the imaging device is temporarily stopped. In this case, the stop information may be referred to as position information. The position where the imaging device is temporarily stopped may be determined based on information about the imaging range of the imaging device (e.g., the angle of view). For example, if the angle of view of the imaging device is relatively wide, the interval between the first position where the imaging device is temporarily stopped and the second position where the imaging device is temporarily stopped after the first position may be relatively wide. For example, if the angle of view of the imaging device is relatively narrow, the interval between the first position where the imaging device is temporarily stopped and the second position where the imaging device is temporarily stopped after the first position may be relatively narrow. In either case, the arithmetic unit 501 may determine the position where the imaging device is temporarily stopped so that a portion of the image captured by the imaging device at the first position overlaps a portion of the image captured by the imaging device at the second position.

[0344] The arithmetic device 501 may determine the movement speed of the imaging device as a measuring instrument when it moves along a path for measuring the object. In this case, the measuring device 501 may determine the number of images to be captured by the imaging device based on the movement speed. The measuring device 501 may reduce the number of images as the movement speed increases. In other words, the measuring device 501 may increase the number of images as the movement speed decreases. In this case, the measuring device 501 may determine a position at which to temporarily stop the imaging device based on the number of images to be captured by the imaging device. Note that the arithmetic device 501 may include at least one of speed information indicating the movement speed and image number information indicating the number of images to be captured by the imaging device in the measurement path information.

[0345] If the imaging device is a single two-dimensional camera, the arithmetic device 501 may generate measurement data by stitching together multiple images based on the position where the imaging device is temporarily stopped (i.e., the imaging position). If the imaging device is a stereo camera, the arithmetic device 501 may first generate multiple point cloud data based on images captured by the imaging device at multiple positions where the imaging device is temporarily stopped. The arithmetic device 501 may then generate measurement data by stitching together multiple point cloud data based on the position where the imaging device is temporarily stopped (i.e., the imaging position). Alternatively, the arithmetic device 501 may generate measurement data by stitching together multiple point cloud data using a best-fit process. The arithmetic device 501 may store the measurement data in the storage device 502. The arithmetic device 501 may control the output device 505 to present the measurement data to a user.

[0346] If the measuring instrument is a laser scanner, the arithmetic device 501 may generate measurement path information so that the movement speed of the laser scanner is temporarily reduced in a measurement range on the path for measuring the shaped object (i.e., the range in which the laser scanner measures the shaped object). In this case, the measurement path information may include movement information for moving the laser scanner along the path for measuring the shaped object, range information indicating the range in which the movement speed of the laser scanner is temporarily reduced, and measurement information for causing the laser scanner to measure the shaped object.

[0347] An example of a path indicated by the measurement path information when the measuring instrument is a laser scanner is shown in Fig. 18(b). In Fig. 18(b), the arrow indicates the path. The portion of the arrow indicated by the dashed line corresponds to the range in which the movement speed of the laser scanner is temporarily reduced.

[0348] If the measuring instrument is a laser scanner, the arithmetic device 501 may generate measurement data by stitching together point cloud data as the measurement results of the laser scanner based on the positions where the laser scanner measured the object. The arithmetic device 501 may store the measurement data in the storage device 502. The arithmetic device 501 may control the output device 505 to present the measurement data to a user.

[0349] The arithmetic device 501 may associate the measurement path information generated as described above with the three-dimensional model information indicated by the 3D model file F11, and store the associated measurement path information in the storage device 502. For example, assume that measurement path information MP#1 associated with the three-dimensional model information indicated by the 3D model file F11#1 is stored in the storage device 502. If the three-dimensional model information indicated by a 3D model file F11#2, which is different from the 3D model file F11#1, is the same as the three-dimensional model information indicated by the 3D model file F11#1, the arithmetic device 501 may use the measurement path information MP#1 stored in the storage device 502 as measurement path information that indicates a path along which a measuring instrument will measure the object associated with the three-dimensional model information indicated by the 3D model file F11#2.

[0350] Alternatively, if the three-dimensional model information indicated by the 3D model file F11#2 is similar to the three-dimensional model information indicated by the 3D model file F11#1, the arithmetic device 501 may generate measurement path information indicating the path along which a measuring instrument will measure the object related to the three-dimensional model information indicated by the 3D model file F11#2 by multiplying the path indicated by the measurement path information MP#1 stored in the storage device 502 by a predetermined coefficient (see FIG. 19 ). Note that the predetermined coefficient may be determined based on the similarity ratio between the three-dimensional model information indicated by the 3D model file F11#1 and the three-dimensional model information indicated by the 3D model file F11#2.

[0351] Furthermore, the arithmetic device 501 may generate processing control information including modeling path information and measurement path information so that after a part of the model is modeled based on the first modeling path information, the measuring instrument measures the part of the model that has been modeled based on the first measurement path information, and then after another part of the model is modeled based on the second modeling path information, the measuring instrument measures the other part of the model that has been modeled based on the second measurement path information.

[0352] When the measuring instrument is an imaging device, the arithmetic device 501 may generate information for causing the imaging device to capture an image of a cross-section of the modeled layer structure each time a layer of the layered structure is modeled. The processing control information may include information for causing the imaging device to capture an image of the cross-section of the modeled layer structure. In other words, the arithmetic device 501 may generate, as part of the processing control information, information for causing the imaging device to capture an image of the cross-section of the modeled layer structure. Note that multiple cross-sectional images captured by the imaging device of each of the multiple cross-sections of the layered structures may be stored in the storage device 502 after being subjected to a stitching process.

[0353] The arithmetic device 501 may generate processing control information including modeling path information and measurement path information so that the measuring instrument measures a portion of the object that has already been modeled, while another portion of the object is modeled based on the modeling path information. In this case, the measurement path information may include condition information indicating a condition for the measuring instrument to start measurement. The condition information may include at least one of the elapsed time since the portion of the object was modeled and the temperature of the portion of the object. With this configuration, the measuring instrument can measure the portion of the object while suppressing the influence of temperature changes of the portion of the object. In addition, the processing device may include a reflective temperature sensor. In this case, the processing device may determine whether the temperature of the portion of the object indicated by the condition information is satisfied based on the output of the reflective temperature sensor.

[0354] The machining apparatus (for example, the machining system SYS) may include at least one of a laser scanner and an image capture device as one measuring instrument, and an ultrasonic measuring instrument as another measuring instrument. In this case, the arithmetic device 501 may generate measurement path information indicating a path along which at least one of the laser scanner and the image capture device as one measuring instrument measures the object, and measurement path information indicating a path along which the ultrasonic measuring instrument as another measuring instrument measures the object. In this case, the surface shape and internal defects of the object can be measured simultaneously by measuring the object with the one measuring instrument and the another measuring instrument.

[0355] The machining apparatus (e.g., machining system SYS) may include at least one of a laser scanner and an image capture device as one measuring instrument, and a surface roughness measuring instrument as another measuring instrument. In this case, the arithmetic unit 501 may generate measurement path information indicating a path along which at least one of the laser scanner and the image capture device as one measuring instrument measures the object, and measurement path information indicating a path along which the surface roughness measuring instrument as another measuring instrument measures the object.

[0356] The arithmetic device 501 may generate processing control information that includes melting pass information (see "(3-4) Flattening Process") in addition to the modeling pass information and the measurement pass information. In this case, the arithmetic device 501 may generate processing control information such that, after at least a portion of the object is modeled based on the modeling pass information, a measuring instrument measures at least a portion of the object based on the first measurement pass information, and after a flattening process is performed on at least a portion of the object based on the melting pass information, the measuring instrument measures the portion that has been subjected to the flattening process based on the second measurement pass information. In this case, the user can confirm the effectiveness of the flattening process by comparing measurement data obtained by measuring at least a portion of the object based on the first measurement pass information with measurement data obtained by measuring the portion that has been subjected to the flattening process based on the second measurement pass information.

[0357] As described in "(3-2) Variable-Bead Width Manufacturing," the manufacturing pass information may include first pass information indicating a path for manufacturing a bead with a first width, and second pass information indicating a path for manufacturing a bead with a second width. Furthermore, at least one of the first pass information and the second pass information may include information indicating the degree of overlap between two adjacent beads. In this case, the arithmetic device 501 may generate processing control information so that, after at least a part of the object (e.g., a layered structure of one layer) is manufactured based on at least one of the first pass information and the second pass information included in the manufacturing pass information, the measuring instrument measures at least a part of the object based on the measurement pass information. In this case, the user can confirm at least one of the finish quality of the bead manufactured based on at least one of the first pass information and the second pass information and the unevenness of the surface of the manufactured bead, from measurement data obtained by measuring at least a part of the object based on the measurement pass information.

[0358] The above-described operation of the information processing device COM may be realized by the calculation device 501 reading the CAM software SW2. In other words, the above-described operation of the information processing device COM may be realized by providing the functions of the CAM software SW2 to the information processing device COM.

[0359] As described above, the calculation device 501 generates processing control information (e.g., an NC program) including printing path information and measurement path information, so that a single processing device (e.g., a processing system SYS) can perform a printing process to print a molded object and a measurement process to measure the molded object.

[0360] For example, in a comparative example in which a processing device performs the forming process and a measuring device different from the processing device performs the measurement process, if a measurement process is performed on a formed part during the formation of a formed object, the following user work is required: After waiting until the formed part drops below a predetermined temperature, the formed part is removed from the processing device and attached to the measuring device. Then, after the measurement process by the measuring device is completed, the formed part is removed from the measuring device and attached to the processing device again.

[0361] In contrast, if the arithmetic device 501 generates processing control information including the printing path information and the measurement path information, the above-mentioned user work does not occur. Therefore, the time required for the measurement process can be shortened. As a result, the time required to print the object can be shortened. In addition, since there is no need to reattach the printed part to the processing device, it is possible to prevent the occurrence of an attachment error due to reattachment.

[0362] <Supplementary Notes> The following supplementary notes are further disclosed regarding the above-described embodiment.

[0363] (Supplementary Note 1) A processing method for an additive processing device to form a shaped object composed of a plurality of layers, the processing method including: forming a bead with a first width in a first layer of the plurality of layers based on first pass information indicating a path for forming the shaped object with the first width; and forming a bead with a second width in the first layer based on second pass information indicating a path for forming the shaped object with a second width different from the first width.

[0364] (Supplementary Note 2) The processing method described in Supplementary Note 1, wherein the first pass information and the second pass information are generated so that a bead formed based on the first pass information and a bead formed based on the second pass information are formed without gaps within the first layer.

[0365] (Supplementary Note 3) The processing method described in Supplementary Note 1 or 2, wherein, in the modeling within the first layer, the first pass information and the second pass information are generated so that the bead based on the first pass information and the bead based on the second pass information are formed without any gaps in a direction intersecting a scanning direction for relatively scanning the processing head of the additive processing device and a table on which the model is placed to form a bead.

[0366] (Supplementary Note 4) The processing method described in any one of Supplementary Notes 1 to 3, wherein, in a case where gaps occur when a first region in the first layer is formed using only beads of the first width, the first pass information and the second pass information are generated so that the first region is formed without gaps by forming a part of the first region using beads of the first width and beads of the second width.

[0367] (Supplementary Note 5) The processing method described in any one of Supplementary Notes 1 to 4, wherein, when a first amount of gap occurs when a first region in the first layer is formed using only beads of the first width, the first pass information and the second pass information are generated so that a portion of the first region is formed using beads of the first width and beads of the second width, thereby forming a gap smaller than the first amount.

[0368] (Supplementary Note 6) The processing method according to Supplementary Note 5, wherein each of the first pass information and the second pass information is generated based on information on at least one of a shape and a size of the object obtained from 3D model information indicating a shape of the object.

[0369] (Supplementary Note 7) The processing method according to any one of Supplementary Notes 1 to 6, wherein the first pass information and the second pass information are included in one file.

[0370] (Supplementary Note 8) The processing method according to any one of Supplementary Notes 1 to 7, wherein the first pass information and the second pass information are generated based on 3D model information indicating a shape of the object.

[0371] (Supplementary Note 9) The processing method described in any one of Supplementary Notes 1 to 8, wherein the first pass information and the second pass information are generated based on a first degree of overlap between adjacent passes of the first width and a second degree of overlap between adjacent passes of the second width.

[0372] (Supplementary Note 10) The processing method according to any one of Supplementary Notes 1 to 9, wherein the first pass information and the second pass information are generated based on a modeling mode that indicates at least one of a modeling speed and a modeling accuracy for modeling the object.

[0373] (Supplementary Note 11) The processing method according to any one of Supplementary Notes 1 to 10, wherein possible values ​​of the first width and the second width are determined based on device information related to the additional processing device.

[0374] (Supplementary Note 12) The processing method according to any one of Supplementary Notes 1 to 11, wherein the possible values ​​of the first width and the second width are the maximum and minimum values ​​that the first width and the second width can take.

[0375] (Supplementary Note 13) The processing method described in Supplementary Note 11 or 12, wherein the additional processing device has an optical system for emitting a processing beam, the device information includes optical system information related to the optical system, and possible values ​​of the first width and the second width are determined based on the optical system information included in the device information.

[0376] (Supplementary Note 14) The processing method according to Supplementary Note 13, wherein the optical system includes a galvanometer scanner capable of changing the focusing position of the processing beam, the optical system information includes range information indicating a range within which the focusing position can be varied by the galvanometer scanner, and possible values ​​of the first width and the second width are determined based on the range information.

[0377] (Supplementary Note 15) The data generation method described in Supplementary Note 14, wherein each of the first path information and the second path information is path information indicating a movement path of a processing head including at least the optical system, and control information for controlling the galvano scanner is generated based on the first path information and the second path information.

[0378] (Appendix 16) The processing method described in Appendix 13, wherein the optical system is configured to be able to change the spot diameter of the processing beam, the optical system information includes information indicating a variable range of the spot diameter of the processing beam, and possible values ​​of the first width and the second width are determined based on the information indicating the variable range of the spot diameter of the processing light.

[0379] (Supplementary Note 17) The processing method according to any one of Supplementary Notes 1 to 16, wherein the additional processing device is a DED type additional processing device.

[0380] (Supplementary Note 18) A processing method for forming a shaped object by an additive processing device equipped with a processing head including a material supply port for supplying a forming material for forming a shaped object, the processing method comprising: supplying a first forming material from the material supply port based on first pass information indicating a first path for forming a bead with a first forming material, to form a bead; supplying a second forming material from the material supply port based on second pass information indicating a second path for forming a bead with a second forming material different from the first forming material, to form a bead; and moving the processing head to a position for changing the forming material supplied from the material supply port from the first forming material to the second forming material, based on information for moving the processing head, after forming a bead based on the first pass information and before forming a bead based on the second pass information.

[0381] (Supplementary Note 19) The machining method according to Supplementary Note 18, wherein the first pass information, the second pass information, and the information for moving the machining head are included in one file.

[0382] (Supplementary Note 20) The processing method according to Supplementary Note 18 or 19, wherein the information for moving the processing head includes evacuation position information indicating a position to which the processing head is to be evacuated from a modeling area.

[0383] (Supplementary Note 21) The processing method according to Supplementary Note 20, wherein the retraction position information includes information indicating a plurality of retraction positions, and the processing method further includes moving the processing head to one of the plurality of retraction positions that is closest to a bead formation end position based on the first pass information.

[0384] (Supplementary Note 22) The processing method according to Supplementary Note 21, wherein the information for moving the processing head further includes evacuation path information that is a path for the processing head to move to the position indicated by the evacuation position information.

[0385] (Supplementary Note 23) The machining method according to Supplementary Note 22, wherein the evacuation path information is generated based on at least one of a shape of the object and a relative inclination between a table on which the object is placed and the machining head.

[0386] (Supplementary Note 24) The processing method described in Supplementary Note 23, wherein the information for moving the processing head further includes first attitude change information for changing the relative attitude of the processing head with respect to the table to the reference attitude when the relative attitude of the processing head with respect to the table is different from the reference attitude, and includes moving the processing head based on the evacuation path information or the evacuation position information after the relative attitude of the processing head with respect to the table is changed to the reference attitude.

[0387] (Appendix 25) The processing method described in any one of Appendices 21 to 24, wherein the information for moving the processing head further includes return path information indicating a path for the processing head to return from the position indicated by the evacuation position information to a bead formation start position based on the second path information after switching from the first forming material to the second forming material.

[0388] (Appendix 26) The processing method described in Appendix 25, wherein the information for moving the processing head includes second attitude change information for changing the relative attitude of the processing head with respect to the table after the processing head has completed moving back to a position for starting to form a bead based on the second path information based on the return path information.

[0389] (Supplementary Note 27) The processing method according to Supplementary Note 26, wherein the orientation indicated by the second orientation information is an orientation after the additional processing device has formed a bead based on the first pass information.

[0390] (Supplementary Note 28) The processing method described in any one of Supplementary Notes 20 to 27, further including switching the material supplied by the material supply port from the first modeling material to the second modeling material based on the evacuation position information after the processing head has been evacuated from the modeling area to the evacuation area.

[0391] (Supplementary Note 29) The processing method according to any one of Supplementary Notes 20 to 28, wherein the information for moving the processing head includes information about a home position.

[0392] (Supplementary Note 30) The processing method described in any one of Supplementary Notes 18 to 29, comprising switching the modeling material supplied by the material supply port from the first modeling material to the second modeling material based on material switching information for switching the modeling material supplied from the material supply port from the first modeling material to the second modeling material, wherein the material switching information includes at least one of information for instructing a change from a first feeder that supplies the first modeling material to a second feeder that supplies the second modeling material, information regarding a waiting time for switching from the first modeling material to the second modeling material, and information regarding a feed speed of the second modeling material.

[0393] (Supplementary Note 31) A processing method for forming a shaped object by an additive processing device equipped with a processing head including at least a beam irradiation device that irradiates a processing beam for forming a shaped object and a material supply port that supplies a shaping material to a position where the processing beam is irradiated, the processing method comprising: performing the additional processing by supplying the shaping material from the material supply port to a position where the processing beam is irradiated by the beam irradiation device, based on first pass information that indicates a path for performing the additional processing by supplying the shaping material to the position where the processing beam is irradiated; and irradiating the processing beam or the melting beam different from the processing beam by the beam irradiation device, based on second pass information that indicates a path for irradiating the processing beam or the melting beam different from the processing beam to a melting region that is at least a part of the portion added by the additive processing device, and that is melted by irradiating the processing beam or the melting beam different from the processing beam without supplying the shaping material.

[0394] (Supplementary Note 32) The processing method according to Supplementary Note 31, wherein the first pass information and the second pass information are included in one file.

[0395] (Supplementary Note 33) The processing method according to Supplementary Note 31 or 32, wherein at least a part of the portion added by the additional processing device is a surface of the added portion.

[0396] (Supplementary Note 34) The processing method according to Supplementary Note 33, wherein the second pass information includes irradiation angle information that defines an irradiation angle of the processing beam with respect to the surface.

[0397] (Supplementary Note 35) The processing method according to Supplementary Note 33 or 34, further comprising the beam irradiation device irradiating the processing beam or the melting beam onto the melting region based on timing information indicating the timing of processing the surface based on the second pass information.

[0398] (Supplementary Note 36) The processing method according to Supplementary Note 35, wherein the first pass information includes information about paths of a plurality of layers constituting the object, and the timing information is a timing before modeling of the plurality of layers is completed.

[0399] (Appendix 37) The processing method described in Appendix 36, wherein the plurality of layers includes a first layer and a second layer above the first layer, and when the formation of the second layer prevents processing of at least a portion of the surface of the first layer, the timing information indicates timing before the formation of the second layer.

[0400] (Supplementary Note 38) The processing method according to any one of Supplementary Notes 31 to 37, wherein the second pass information is generated based on information about an outer shape of a three-dimensional model representing an object to be formed by the additive processing device.

[0401] (Appendix 39) The processing method described in any one of Appendices 31 to 38, wherein at least one of a spot diameter and a power of the processing beam or the melting beam in processing based on the second pass information is different from a spot diameter and a power of the processing beam in processing based on the first pass information.

[0402] (Supplementary Note 40) A processing method for forming a shaped object by an additive processing device having a processing head including a beam irradiation device that irradiates a processing beam to form a shaped object and a material supply port that supplies a shaping material to a position where the processing beam is irradiated, the processing method comprising: performing the additional processing by supplying the shaping material from the material supply port to a position where the processing beam is irradiated by the beam irradiation device based on first path information that indicates a path for performing the additional processing by supplying the shaping material to the position where the processing beam is irradiated; and moving a measuring device that measures a measurement area where measurements are made on at least one of the surface and the interior of the shaped object formed by the additive processing device based on second path information that indicates a path along which the measuring device moves.

[0403] (Supplementary Note 41) The processing method according to Supplementary Note 40, wherein the first pass information and the second pass information are included in one file.

[0404] (Supplementary Note 42) The processing method according to Supplementary Note 40 or 41, wherein the measurement is performed by at least one of a laser scanner and an im...

Claims

1. 1. A data generation method for generating processing control information used to form a shaped object by an additive processing device having a processing head including at least a material supply port for supplying a shaping material for forming the shaped object, the method comprising: First pass information indicating a first path for forming a bead using the first forming material; second pass information indicating a second path for forming a bead using a second forming material different from the first forming material; and generating processing control information including information for moving the processing head after the additional processing device has formed the bead based on the first pass information and before the additional processing device has formed the bead based on the second pass information. Data generation method.

2. and information for moving the processing head to a position different from a bead formation start position based on the second pass information. The data generation method according to claim 1 .

3. generating processing control information including information for moving the processing head to a position for changing the modeling material supplied from the material supply port from the first modeling material to the second modeling material; The data generation method according to claim 1 .

4. The machining control information is generated so that the first pass information, the second pass information, and information for moving the machining head are included in one file. The data generation method according to claim 1 .

5. The information for moving the processing head includes evacuation position information indicating a position to which the processing head is to be evacuated from the modeling area. The data generation method according to claim 1 .

6. the evacuation position information includes information indicating a plurality of evacuation positions, the processing head moves to one of the plurality of evacuation positions that is closest to a bead formation end position based on the first pass information. The data generation method according to claim 5 .

7. The processing control information further includes evacuation path information that is a path for the processing head to move to the position indicated by the evacuation position information. The data generation method according to claim 6.

8. The evacuation path information is generated based on at least one of the shape of the object and the relative inclination between the table on which the object is placed and the processing head. The data generation method according to claim 7 .

9. the machining control information further includes first posture change information for changing the relative posture of the machining head with respect to the table to the reference posture when the relative posture of the machining head with respect to the table is different from the reference posture, The movement of the machining head based on the evacuation path information or the evacuation position information is performed after the relative posture of the machining head with respect to the table is changed to the reference posture. The data generation method according to claim 8.

10. The processing control information further includes return path information indicating a path for the processing head to return to a bead forming start position based on the second path information from the position indicated by the evacuation position information after switching from the first modeling material to the second modeling material. The data generation method according to claim 6.

11. the processing control information includes second attitude change information for changing the relative attitude of the processing head with respect to the table after the processing head has completed its movement to return to a position for starting bead formation based on the second path information based on the return path information. The data generation method according to claim 10.

12. The posture indicated by the second posture information is a posture after the additional processing device forms a bead based on the first pass information. The data generation method according to claim 11.

13. The processing control information further includes switching the material supplied by the material supply port from the first modeling material to the second modeling material after the processing head is retracted from the modeling area to the retraction area based on the retraction position information. The data generation method according to claim 5 .

14. The information for moving the processing head includes information about a home position. The data generation method according to claim 5 .

15. the processing control information further includes material switching information for switching the modeling material supplied from the material supply port from the first modeling material to the second modeling material, The material switching information includes at least one of information for instructing a change from a first feeder that supplies the first modeling material to a second feeder that supplies the second modeling material, information regarding a waiting time for switching from the first modeling material to the second modeling material, and information regarding a feed speed of the second modeling material. The data generation method according to claim 1 .

16. A processing method for forming a shaped object using an additive processing device equipped with a processing head including a material supply port for supplying a forming material for forming the shaped object, comprising: supplying the first modeling material from the material supply port based on first path information indicating a first path for forming a bead with the first modeling material, and forming a bead; supplying the second modeling material from the material supply port based on second path information indicating a second path for forming a bead with a second modeling material different from the first modeling material; and moving the processing head to a position where the modeling material supplied from the material supply port is changed from the first modeling material to the second modeling material, after the bead based on the first pass information has been formed and before the bead based on the second pass information has been formed, based on information for moving the processing head; A processing method comprising:

17. The first path information, the second path information, and the information for moving the machining head are included in one file. The processing method according to claim 16.

18. The information for moving the processing head includes evacuation position information indicating a position for the processing head to evacuate from the printing area. The processing method according to claim 16.

19. The evacuation location information includes information indicating a plurality of evacuation locations, and moving the processing head to a retraction position among the plurality of retraction positions that is closest to a bead formation end position based on the first pass information. The processing method according to claim 18.

20. The information for moving the machining head further includes evacuation path information which is a path for the machining head to move to the position indicated by the evacuation position information. The processing method according to claim 19.

21. The evacuation path information is generated based on at least one of the shape of the object and the relative inclination of the table on which the object is placed and the processing head. The processing method according to claim 20.

22. The information for moving the machining head further includes first attitude change information for changing the relative attitude of the machining head with respect to the table to the reference attitude when the relative attitude of the machining head with respect to the table is different from the reference attitude; and moving the machining head based on the evacuation path information or the evacuation position information after the relative attitude of the machining head with respect to the table is changed to the reference attitude. The processing method according to claim 21.

23. The information for moving the processing head further includes return path information indicating a path for the processing head to return from the position indicated by the evacuation position information to a bead printing start position based on the second path information after switching from the first printing material to the second printing material. The processing method according to claim 19.

24. The information for moving the machining head includes second posture change information for changing the relative posture of the machining head with respect to the table after the machining head has completed its movement to return to a position for starting to form a bead based on the second path information based on the return path information. The processing method according to claim 23.

25. The posture indicated by the second posture information is the posture after the additional processing device forms a bead based on the first path information. The processing method according to claim 24.

26. The information for moving the machining head includes information about a home position. The processing method according to claim 18.

27. ​​The method includes switching the molding material supplied by the material supply port from the first molding material to the second molding material based on material switching information for switching the molding material supplied from the material supply port from the first molding material to the second molding material, The material switching information includes at least one of information for instructing a change from a first feeder that supplies the first modeling material to a second feeder that supplies the second modeling material, information regarding a waiting time for switching from the first modeling material to the second modeling material, and information regarding a feed speed of the second modeling material. The processing method according to claim 16.

28. The method further includes switching the material supplied by the material supply port from the first modeling material to the second modeling material after the processing head has retracted from the modeling area to the retraction area based on the retraction position information.

28. The processing method according to any one of claims 18 to 27.

29. A processing method for forming a shaped object using an additive processing device equipped with a processing head including a material supply port for supplying a forming material for forming the shaped object, comprising: supplying the first modeling material from the material supply port based on first path information indicating a first path for forming a bead with the first modeling material, and forming a bead; supplying the second modeling material from the material supply port based on second path information indicating a second path for forming a bead with a second modeling material different from the first modeling material; and After the additional processing device has formed a bead based on the first pass information and before forming a bead based on the second pass information, based on information for moving the processing head, the processing head is moved to a position different from a formation start position of the bead based on the second pass information. A processing method comprising:

30. A processing head including a material supply port for supplying a molding material for forming a molded object; a control device for controlling the machining head; Equipped with The control device controlling the processing head to supply the first modeling material from the material supply port to form a bead based on first path information indicating a first path for forming a bead with the first modeling material; controlling the processing head to supply the second modeling material from the material supply port to form a bead based on second path information indicating a second path for forming a bead with a second modeling material different from the first modeling material; After forming a bead based on the first pass information and before forming a bead based on the second pass information, the processing head is moved to a position where the modeling material supplied from the material supply port is changed from the first modeling material to the second modeling material, based on information for moving the processing head. Additive processing equipment.

31. The first path information, the second path information, and the information for moving the machining head are included in one file. The additional processing device according to claim 30.

32. The information for moving the processing head includes evacuation position information indicating a position for the processing head to evacuate from the printing area. The additional processing device according to claim 30.

33. The evacuation location information includes information indicating a plurality of evacuation locations, The control device moves the processing head to a retraction position among the plurality of retraction positions that is closest to a bead formation end position based on the first pass information. The additional processing device according to claim 32.

34. The information for moving the machining head further includes evacuation path information which is a path for the machining head to move to the position indicated by the evacuation position information. The additional processing apparatus according to claim 33.

35. The evacuation path information is generated based on at least one of the shape of the object and the relative inclination between the table on which the object is placed and the processing head. The additional processing device according to claim 34.

36. The information for moving the machining head further includes first attitude change information for changing the relative attitude of the machining head with respect to the table to the reference attitude when the relative attitude of the machining head with respect to the table is different from the reference attitude; The control device changes the relative attitude of the machining head with respect to the table to the reference attitude, and then moves the machining head based on the evacuation path information or the evacuation position information. The additional processing apparatus according to claim 35.

37. The information for moving the processing head further includes return path information indicating a path for the processing head to return from the position indicated by the evacuation position information to a bead forming start position based on the second path information after switching from the first forming material to the second forming material. The additional processing apparatus according to claim 33.

38. The information for moving the machining head includes second attitude change information for changing the relative attitude of the machining head with respect to the table after the machining head has completed its movement to return to a position for starting bead formation based on the second path information based on the return path information. The additional processing apparatus according to claim 37.

39. The posture indicated by the second posture information is the posture after the additive processing device forms a bead based on the first path information. The additional processing apparatus according to claim 38.

40. The information for moving the machining head includes information about a home position. The additional processing device according to claim 32.

41. The control device controls the processing head to switch the forming material supplied by the material supply port from the first forming material to the second forming material based on material switching information for switching the forming material supplied from the material supply port from the first forming material to the second forming material, The material switching information includes at least one of information for instructing a change from a first feeder that supplies the first modeling material to a second feeder that supplies the second modeling material, information regarding a waiting time for switching from the first modeling material to the second modeling material, and information regarding a feed speed of the second modeling material. The additional processing device according to claim 30.

42. The control device controls the processing head so that the material supplied by the material supply port is switched from the first printing material to the second printing material after the processing head is retracted from the printing area to the retraction area based on the retraction position information.

42. An additional processing apparatus according to any one of claims 32 to 41.

43. A processing head including a material supply port for supplying a molding material for forming a molded object; a control device for controlling the machining head; Equipped with The control device controlling the processing head to supply the first modeling material from the material supply port to form a bead based on first path information indicating a first path for forming a bead with the first modeling material; controlling the processing head to supply the second modeling material from the material supply port to form a bead based on second path information indicating a second path for forming a bead with a second modeling material different from the first modeling material; After the additional processing device has formed a bead based on the first pass information and before the additional processing device forms a bead based on the second pass information, the processing head is moved to a position different from a formation start position of the bead based on the second pass information, based on information for moving the processing head. Additive processing equipment.