Substrate for manufacturing capacitor element and method for manufacturing capacitor element

Abstract

The substrate 1 for manufacturing a capacitor element includes a substrate layer 10 divided into a product region R1 constituting a capacitor element and an outside-product region R2 surrounding at least a part of the product region R1, and a sealing layer 20 provided so as to cover at least one main surface of the substrate layer 10. The product region R1 includes an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13. The outside-product region R2 includes the core portion 11A of the anode plate 11. At least a part of the region of the outside-product region R2 located on the outer edge of the substrate layer 10 is provided with a through portion 30 penetrating the anode plate 11 in the thickness direction. At least a part of the through portion 30 is filled with a filling member 40.

Description

[Technical field]

[0001] The present invention relates to a substrate for producing a capacitor element and a method for producing a capacitor element. [Background technology]

[0002] Patent Document 1 discloses a module used in a semiconductor composite device that supplies a load with a DC voltage regulated by a voltage regulator including a semiconductor active element, the module comprising: a capacitor layer including at least one capacitor section forming a capacitor; a connection terminal used for electrical connection to at least one of the voltage regulator and the load; and a through-hole conductor formed so as to penetrate the capacitor section in the thickness direction of the capacitor layer, wherein the capacitor is electrically connected to at least one of the load and the voltage regulator via the through-hole conductor.

[0003] 17 and 19 of Patent Document 1 discloses, as one embodiment of a module, a package substrate 200D including a capacitor layer 210, a first through-hole conductor 262A, and a second through-hole conductor 264A. The capacitor layer 210 includes a capacitor section 230, a conductive section 220 electrically connected to the first through-hole conductor 262A, a conductive section 240 electrically connected to the second through-hole conductor 264A, and an insulating section 225 laminated on the surface of the capacitor section 230.

[0004] According to Patent Document 1, the capacitor layer 210 is formed by the following method.

[0005] First, both sides of an aluminum foil that will become an anode plate 231 are processed to be porous, and a porous portion 234 is formed on the surface of a core portion 232. A dielectric layer is formed by applying an oxide film to the surface of the porous portion 234. Then, a cathode layer 236 is formed on the surface of the dielectric layer.

[0006] At this time, a part of the porous portion 234 may be cut out, for example, by a dicing process or the like until the core portion 232 is exposed, and a Cu paste may be baked onto the exposed core portion 232. In this way, the capacitor portion 230 is formed.

[0007] Thereafter, through holes are formed by drilling, laser processing or the like in the areas where through-hole conductors are to be formed.

[0008] Next, a resin such as epoxy, polyimide, or phenol, or a mixed material of a resin such as epoxy, polyimide, or phenol with an inorganic filler such as silica or alumina is laminated on the capacitor section 230 and then thermally cured to seal the capacitor section 230 and form the insulating section 225. After the sealing process, a conductive layer 212 for forming the conductive sections 220 and 240 for connecting the through-hole conductors to the electrodes of the capacitor section 230 is formed on the surface of the insulating section 225 by plating wiring process or the like. Note that through holes may be formed after the sealing process.

[0009] Thereafter, the conductive layer 212 is processed by etching or the like to form the conductive parts 220 and 240. Then, holes reaching the core 232 of the anode plate 231 and the cathode layer 236 are opened in the conductive parts 220 and 240 by laser processing or the like, and a conductor such as Cu is filled in the holes, thereby electrically connecting the core 232 of the anode plate 231 and the conductive part 220, and electrically connecting the cathode layer 236 and the conductive part 240. This forms the capacitor layer 210. Note that the core 232 of the anode plate 231 and the through-hole conductor 262 may be directly connected at the end face of the anode plate 231. In this case, it is not necessary to form the conductive part 220. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] International Publication No. 2021 / 241325 Summary of the Invention [Problem to be solved by the invention]

[0011] In the stage of a semi-finished product in the middle of manufacturing a module such as the package substrate described in Patent Document 1, in the outside-product area where the cathode layer is not formed, the adhesion between the insulating part (hereinafter also referred to as the sealing layer) and the anode plate or between the insulating part and the conductive part (hereinafter also referred to as the external electrode layer) is lower than in the product area. In addition, when the insulating part is composed of two or more layers, the adhesion between the insulating parts in the outside-product area is also lower than in the product area. Therefore, in the outside-product area, bulging due to delamination (interlayer peeling) is likely to occur, and in some cases, the bulging may progress to the product area.

[0012] The present invention has been made to solve the above problems, and aims to provide a substrate for manufacturing a capacitor element that can suppress swelling caused by delamination. Another aim of the present invention is to provide a method for manufacturing a capacitor element using the substrate for manufacturing a capacitor element. [Means for solving the problem]

[0013] The substrate for manufacturing a capacitor element of the present invention comprises a substrate layer divided into a product region constituting a capacitor element and an outside-product region surrounding at least a portion of the product region, and a sealing layer provided so as to cover at least one main surface of the substrate layer. The product region includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on a surface of the porous portion, and a cathode layer provided on a surface of the dielectric layer. The outside-product region includes the core portion of the anode plate. At least a portion of the outside-product region located on the outer edge of the substrate layer is provided with a through portion penetrating the anode plate in the thickness direction. At least a portion of the through portion is filled with a filling member.

[0014] The method for producing a capacitor element of the present invention includes a step of separating a product region from the substrate for producing a capacitor element of the present invention by removing at least a part of the outside-product region. Effect of the Invention

[0015] According to the present invention, it is possible to provide a substrate for producing a capacitor element, which is capable of suppressing swelling caused by delamination. Furthermore, according to the present invention, it is possible to provide a method for producing a capacitor element using the substrate for producing a capacitor element. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is an exploded perspective view illustrating an example of a substrate for producing a capacitor element according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a plan view of the substrate for producing a capacitor element shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view that illustrates an example of a substrate for producing a capacitor element according to the first embodiment of the present invention. [Figure 4] Fig. 4A is a plan view showing an example of the arrangement of the through-holes in the outside region of the product, and Fig. 4B is a cross-sectional view showing an example of the arrangement of the through-holes in the outside region of the product. [Diagram 5] Fig. 5A is a plan view showing another example of the arrangement of the through-holes in the outside-of-product area, and Fig. 5B is a cross-sectional view showing another example of the arrangement of the through-holes in the outside-of-product area. [Figure 6] Fig. 6A is a cross-sectional view that typically shows an example of a step of separating the product region R1 from the capacitor element production substrate 1. Fig. 6B is a plan view that typically shows an example of a step of separating the product region R1 from the capacitor element production substrate 1. [Figure 7] Fig. 7A is a cross-sectional view that typically shows one example of a capacitor element obtained from the capacitor element production substrate 1. Fig. 7B is a plan view that typically shows one example of a capacitor element obtained from the capacitor element production substrate 1. [Figure 8]FIG. 8 is a cross-sectional view that typically shows a first modified example of the capacitor element production substrate 1 shown in FIG. [Figure 9] FIG. 9 is a cross-sectional view that typically shows a second modified example of the capacitor element production substrate 1 shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view that illustrates an example of a substrate for producing a capacitor element according to the second embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view that illustrates a schematic diagram of another example of a substrate for producing a capacitor element according to the second embodiment of the present invention. [Figure 12] FIG. 12 is a cross-sectional view that illustrates a modified example of the capacitor element production substrate 2 shown in FIG. [Figure 13] FIG. 13 is a cross-sectional view that illustrates a modified example of the capacitor element production substrate 2' shown in FIG. [Figure 14] FIG. 14 is a cross-sectional view that illustrates an example of a substrate for producing a capacitor element according to a third embodiment of the present invention. [Figure 15] FIG. 15 is a cross-sectional view that illustrates a schematic diagram of another example of a substrate for producing a capacitor element according to the third embodiment of the present invention. [Figure 16] FIG. 16 is a cross-sectional view that typically shows a modification of the capacitor element production substrate 3 shown in FIG. [Figure 17] FIG. 17 is a cross-sectional view that illustrates a modified example of the capacitor element production substrate 3' shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The substrate for manufacturing a capacitor element of the present invention will be described below. Note that the present invention is not limited to the following configurations, and may be modified as appropriate within the scope of the present invention. In addition, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0018] The following embodiments are merely examples, and it goes without saying that partial replacement or combination of the configurations shown in different embodiments is possible. From the second embodiment onwards, the description of the matters common to the first embodiment will be omitted, and the differences will be mainly described. In particular, similar effects due to similar configurations will not be mentioned one by one for each embodiment.

[0019] In the following description, unless there is a need to distinguish between the various embodiments, they will simply be referred to as "the substrate for producing a capacitor element of the present invention."

[0020] In this specification, terms indicating the relationship between elements (e.g., "vertical," "parallel," "orthogonal," etc.) and terms indicating the shapes of elements are not intended to be used in a strict sense, but are intended to include a range of substantial equivalence, for example, a difference of a few percent.

[0021] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same reference numerals will be used for the same or corresponding parts. In addition, the same reference numerals will be used for the same elements in each drawing, and duplicate explanations will be omitted.

[0022] [First embodiment] Fig. 1 is an exploded perspective view showing a schematic example of a substrate for producing a capacitor element according to a first embodiment of the present invention. Fig. 2 is a plan view of the substrate for producing a capacitor element shown in Fig. 1. For the sake of convenience, a first external electrode layer 91 and a second external electrode layer 92, which will be described later, are omitted in Figs. 1 and 2.

[0023] A capacitor element production substrate 1 shown in FIGS. 1 and 2 includes a substrate layer 10 and a sealing layer 20 provided so as to cover at least one of the main surfaces of the substrate layer 10.

[0024] 1, the sealing layer 20 is provided so as to cover both opposing main surfaces in the thickness direction of the substrate layer 10. The substrate layer 10 is protected by the sealing layer 20.

[0025] The sealing layer 20 may be composed of only one layer or two or more layers on one main surface side of the substrate layer 10. When the sealing layer 20 is composed of two or more layers, the materials constituting each layer may be the same or different.

[0026] The sealing layer 20 is formed so as to seal the substrate layer 10 by, for example, a method of thermocompression bonding an insulating resin sheet, a method of applying an insulating resin paste and then thermally curing it, or the like.

[0027] As shown in FIGS. 1 and 2, the substrate layer 10 is divided into a product region R1 and a non-product region R2 that surrounds at least a portion of the product region R1.

[0028] The capacitor element production substrate 1 is a semi-finished product. As described below, a capacitor element (for example, the capacitor element 100 shown in FIGS. 7A and 7B) is manufactured as a final product (finished product) by separating the product region R1 from the capacitor element production substrate 1.

[0029] The product region R1 is a region that constitutes a capacitor element, which is a final product (finished product). The number of product regions R1 included in the substrate layer 10 is not particularly limited, and may be one or more.

[0030] When multiple product regions R1 are included in the substrate layer 10, the product regions R1 may be arranged regularly or irregularly. The sizes and planar shapes of the product regions R1 may be the same, or some or all of them may be different.

[0031] Although not shown in Figures 1 and 2, one or more capacitor units are arranged in each product area R1. The number of capacitor units arranged in each product area R1 may be the same, or some or all of them may be different.

[0032] When multiple capacitor parts are arranged in the product region R1, the capacitor parts may be arranged regularly or irregularly. The sizes and planar shapes of the capacitor parts may be the same, or some or all of them may be different. The configurations of the capacitor parts are preferably the same, but capacitor parts with different configurations may be included.

[0033] 1 and 2, the outside-product area R2 is provided so as to surround the entirety of the product area R1. For example, when the planar shape of the product area R1 is rectangular (i.e., square or oblong), the outside-product area R2 may be provided so as to surround two opposing sides of the product area R1, may be provided in an L-shape so as to surround two adjacent sides of the product area R1, or may be provided in a frame shape so as to surround four sides of the product area R1.

[0034] 3 is a cross-sectional view that illustrates an example of a substrate for producing a capacitor element according to the first embodiment of the present invention, taken along line III-III of the substrate for producing a capacitor element shown in FIG.

[0035] The product region R1 includes an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13. This allows the product region R1 to configure an electrolytic capacitor. In the example shown in Fig. 3, the anode plate 11 has the porous portion 11B on both main surfaces of the core portion 11A, but the porous portion 11B may be provided on only one of the main surfaces of the core portion 11A.

[0036] In the product region R1, the anode plate 11, the dielectric layer 13 and the cathode layer 12 form a capacitor section.

[0037] Cathode layer 12 includes, for example, a solid electrolyte layer 12A provided on the surface of dielectric layer 13. Cathode layer 12 preferably further includes a conductor layer 12B provided on the surface of solid electrolyte layer 12A. When cathode layer 12 includes solid electrolyte layer 12A, product region R1 constitutes a solid electrolytic capacitor.

[0038] The outside-product region R2 includes a core portion 11A of the anode plate 11. As shown in Fig. 3, the outside-product region R2 may include an anode plate 11 having a porous portion 11B on at least one main surface of the core portion 11A, and may further include a dielectric layer 13 provided on the surface of the porous portion 11B.

[0039] The outside-product region R2 is a region that does not function as a capacitor element that is a final product, or a region that is not used as a capacitor element that is a final product. In the capacitor element that is a final product, the outside-product region R2 may be completely removed, or a part of the outside-product region R2 may remain.

[0040] In order to function as a capacitor element, it is necessary that the anode is connected to the core 11A of the anode plate 11 and the cathode is connected to the cathode layer 12. Therefore, the region where the anode is not connected to the core 11A of the anode plate 11 or the region where the cathode is not connected to the cathode layer 12 corresponds to the outside-product region R2 that does not function as a capacitor element.

[0041] For example, even if a region has a through-hole conductor electrically connected to anode plate 11, the region that does not function as a capacitor element in the final product corresponds to outside-product region R2. Also, even if there is a region in which a through-hole conductor electrically connected to anode plate 11 and a through-hole conductor electrically connected to cathode layer 12 are provided in the semi-finished capacitor element manufacturing substrate 1, the region that will be removed before the final product corresponds to outside-product region R2.

[0042] At least a part of the region of the outside-product region R2 located on the outer edge of the substrate layer 10 is provided with a through-hole 30 penetrating the anode plate 11 in the thickness direction. The number of through-holes 30 is not particularly limited, and may be one or more. The outside-product region R2 in which the through-hole 30 is provided may include at least a part of the region located on the outer edge of the substrate layer 10. Therefore, the through-hole 30 may be provided in a part of the region located on the outer edge of the substrate layer 10, or the through-hole 30 may be provided in the entire region located on the outer edge of the substrate layer 10.

[0043] The through-holes 30 may be holes penetrating the anode plate 11 in the thickness direction, or may be grooves dividing the anode plate 11 in the thickness direction. When a plurality of through-holes 30 are provided in the outside-product region R2, the through-holes 30 may be a mixture of holes penetrating the anode plate 11 in the thickness direction and grooves dividing the anode plate 11 in the thickness direction.

[0044] The width of the through portion 30 may be constant in the thickness direction, may decrease in the thickness direction, or may increase in the thickness direction. Also, the width of the through portion 30 may be smaller on the center side of the anode plate 11 than on both main surface sides, or may be larger on the center side of the anode plate 11 than on both main surface sides.

[0045] At least a portion of the through-hole 30 is filled with the filling member 40. In the example shown in Fig. 3, the entire through-hole 30 is filled with the filling member 40, but a portion of the through-hole 30 may be filled with the filling member 40. For example, there may be a gap in the space surrounded by the filling member 40 in the through-hole 30, or there may be a gap between the through-hole 30 and the filling member.

[0046] 3, the filling member 40 includes an insulating member. For example, the insulating member includes a sealing layer 20 that penetrates into the through portion 30. The sealing layer 20 may penetrate into at least a part of the through portion 30, or may penetrate into the entire through portion 30.

[0047] 3, the filling member 40 is preferably in contact with the sealing layer 20 on at least one main surface side of the substrate layer 10, and is preferably in contact with the sealing layer 20 on both main surface sides of the substrate layer 10. As described above, the filling member 40 may be integral with the sealing layer 20 on at least one main surface side of the substrate layer 10, or may be integral with the sealing layer 20 on both main surface sides of the substrate layer 10.

[0048] By providing the through-hole 30 in at least a part of the region located at the outer edge of the substrate layer 10 in the product outside region R2 and filling at least a part of the through-hole 30 with the filling material 40, it is possible to improve the adhesion between the sealing layer 20 and the anode plate 11 in the product outside region R2. Therefore, it is possible to suppress swelling caused by delamination in the product outside region R2. This also makes it possible to suppress swelling in the product region R1.

[0049] Although not shown, at least a part of the outside-product region R2 between adjacent product regions R1 may be provided with a through-hole 30. In this case, it is preferable that at least a part of the through-hole 30 is filled with the filling member 40.

[0050] When a plurality of through holes 30 are provided in the outside-product region R2, the through holes 30 that are not filled with the filling member 40 may be included.

[0051] As shown in FIG. 3, in the outside-product region R2, a dummy electrode layer 50 may be provided on the surface of the sealing layer 20. In that case, one dummy electrode layer 50 may be provided for the outside-product region R2, or a plurality of dummy electrode layers 50 may be provided. The dummy electrode layer 50 may be provided on the surface of the sealing layer 20 on both main surface sides, or on the surface of the sealing layer 20 on one of the main surface sides. The dummy electrode layer 50 may extend to the product region R1. In addition, in the outside-product region R2, the dummy electrode layer 50 may not be provided on the surface of the sealing layer 20. The dummy electrode layer 50 is an example of a dummy layer. The dummy layer may be a layer having conductivity like an electrode layer, or a layer having insulation like an insulating layer.

[0052] When a dummy layer such as the dummy electrode layer 50 is provided in the outside-product region R2, it is preferable that at least one end of the through-hole 30 is covered by the dummy layer. In the example shown in FIG. 3, both ends of the through-hole 30 are covered by the dummy electrode layer 50, but either one end of the through-hole 30 may be covered by the dummy electrode layer 50.

[0053] The dummy electrode layer 50 preferably has a common configuration to a first external electrode layer 91 and a second external electrode layer 92, which will be described later.

[0054] An example of the configuration of the product area R1 will be described below with reference to FIG.

[0055] In the product region R1, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In that case, the insulating layer 15 may be provided between the sealing layer 20 on one of the main surfaces and the anode plate 11, or the insulating layer 15 may be provided between the sealing layer 20 on both main surfaces and the anode plate 11.

[0056] Insulating layer 15 may be composed of only one layer, or may be composed of two or more layers. When insulating layer 15 is composed of two or more layers, the materials constituting each layer may be the same or different.

[0057] 3, insulating layer 15 includes a first insulating layer 15A provided on the surface of dielectric layer 13 and a second insulating layer 15B provided on the surface of first insulating layer 15A. The thickness of first insulating layer 15A may be the same as the thickness of second insulating layer 15B, or may be greater than or smaller than the thickness of second insulating layer 15B.

[0058] The product region R1 may include a first through-hole conductor 61 that is provided to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is electrically connected to the anode plate 11.

[0059] The first through-hole conductor 61 may be provided on at least the inner wall surface of the first through hole 71 that penetrates the anode plate 11 and the sealing layer 20 in the thickness direction. The first through-hole conductor 61 may be provided only on the inner wall surface of the first through hole 71, or may be provided throughout the entire interior of the first through hole 71.

[0060] When viewed in a plan view from the thickness direction, one first through-hole conductor 61 may be provided inside the cathode layer 12 included in each capacitor portion, or two or more first through-hole conductors 61 may be provided inside the cathode layer 12 included in each capacitor portion.

[0061] As shown in FIG. 3, the end face of the cathode layer 12 and the first through-hole conductor 61 are preferably insulated from each other by an insulating material (insulating layer 15 in FIG. 3).

[0062] As shown in FIG. 3, the first through-hole conductor 61 is preferably electrically connected to the anode plate 11 on the inner wall surface of the first penetrating hole 71 .

[0063] 3, when the first through-hole conductor 61 is provided only on the inner wall surface of the first through hole 71, a first resin filling portion 81 filled with a resin material may be provided inside the first through-hole conductor 61. The first resin filling portion 81 is provided in a space surrounded by the first through-hole conductor 61 in the first through hole 71. When the space in the first through hole 71 is eliminated by providing the first resin filling portion 81, the occurrence of delamination of the first through-hole conductor 61 is suppressed. The first resin filling portion 81 may be a conductor or an insulator.

[0064] The product region R1 may include a second through-hole conductor 62 that is provided to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is electrically connected to the cathode layer 12.

[0065] The second through-hole conductor 62 may be provided on at least the inner wall surface of the second through hole 72 that penetrates the anode plate 11 and the sealing layer 20 in the thickness direction. The second through-hole conductor 62 may be provided only on the inner wall surface of the second through hole 72, or may be provided throughout the entire interior of the second through hole 72.

[0066] In plan view from the thickness direction, one second through-hole conductor 62 may be provided inside cathode layer 12 included in each capacitor portion, or two or more second through-hole conductors 62 may be provided. For one capacitor portion, the number of second through-hole conductors 62 may be the same as the number of first through-hole conductors 61, or may be different.

[0067] As shown in FIG. 3, the end face of the anode plate 11 and the second through-hole conductor 62 are preferably insulated from each other by an insulating material (part of the sealing layer 20 in FIG. 3).

[0068] 3, when the second through-hole conductor 62 is provided only on the inner wall surface of the second through hole 72, a second resin filling portion 82 filled with a resin material may be provided inside the second through-hole conductor 62. The second resin filling portion 82 is provided in a space surrounded by the second through-hole conductor 62 in the second through hole 72. When the space in the second through hole 72 is eliminated by providing the second resin filling portion 82, the occurrence of delamination of the second through-hole conductor 62 is suppressed. The second resin filling portion 82 may be a conductor or an insulator.

[0069] When the first through-hole conductor 61 or the second through-hole conductor 62 is provided inside the sealing layer 20, it is preferable that an insulating layer 15 is provided around the first through-hole conductor 61 or the second through-hole conductor 62 on at least one of the main surfaces of the anode plate 11.

[0070] Furthermore, an insulating layer 15 may be provided on at least one of the main surfaces of the anode plate 11 so as to surround the periphery of the cathode layer 12. By surrounding the periphery of the cathode layer 12 with the insulating layer 15, insulation between the anode plate 11 and the cathode layer 12 is ensured, and a short circuit between them is prevented. The insulating layer 15 may be provided so as to surround a part of the periphery of the cathode layer 12, but is preferably provided so as to surround the entire periphery of the cathode layer 12.

[0071] Although not shown in FIG. 3, the product area R1 may include a third through-hole conductor that is arranged to penetrate the anode plate 11 and the sealing layer 20 in the thickness direction and is not electrically connected to the anode plate 11 and the cathode layer 12.

[0072] The product region R1 may include a first external electrode layer 91 provided on the surface of the sealing layer 20 and electrically connected to the anode plate 11 and the first through-hole conductor 61. The first external electrode layer 91 may extend to the outside-product region R2.

[0073] One first external electrode layer 91 may be provided for one capacitor portion, or a plurality of first external electrode layers 91 may be provided for one capacitor portion.

[0074] The planar shape of the first external electrode layer 91 when viewed from the thickness direction is not particularly limited, and examples thereof include a rectangle (square or oblong), a quadrangle other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, a combination of these, etc. The planar shape of the first external electrode layer 91 may also be an L-shape, a C-shape, a step shape, etc.

[0075] The product region R1 may include a second external electrode layer 92 provided on the surface of the encapsulating layer 20 and electrically connected to the cathode layer 12 and the second through-hole conductor 62. The second external electrode layer 92 may extend to the outside-product region R2.

[0076] One second external electrode layer 92 may be provided for one capacitor unit, or multiple second external electrode layers 92 may be provided for one capacitor unit. The number of second external electrode layers 92 for one capacitor unit may be the same as the number of first external electrode layers 91, or may be different.

[0077] The planar shape of the second external electrode layer 92 when viewed from the thickness direction is not particularly limited, and examples thereof include a rectangle (square or rectangle), a quadrangle other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, or a combination of these. The planar shape of the second external electrode layer 92 may be an L-shape, a C-shape, a stepped shape, or the like. The planar shape of the second external electrode layer 92 when viewed from the thickness direction may be the same as or different from the planar shape of the first external electrode layer 91 when viewed from the thickness direction.

[0078] Although not shown in FIG. 3, the product region R1 may include a via conductor provided so as to penetrate the sealing layer 20 in the thickness direction.

[0079] For example, the product region R1 may include a via conductor electrically connected to the anode plate 11. In this case, the anode plate 11 is electrically led out to the outside of the sealing layer 20 through the via conductor, and can be electrically connected to the outside of the sealing layer 20. The number of via conductors electrically connected to the anode plate 11 may be one, or two or more.

[0080] Alternatively, the product region R1 may include a via conductor electrically connected to the cathode layer 12. In this case, the cathode layer 12 is electrically led out to the outside of the sealing layer 20 through the via conductor, and can be electrically connected to the outside of the sealing layer 20. The number of via conductors electrically connected to the cathode layer 12 may be one or two or more.

[0081] Fig. 4A is a plan view showing an example of the arrangement of the through-holes in the outside region of the product. Fig. 4B is a cross-sectional view showing an example of the arrangement of the through-holes in the outside region of the product. Fig. 4A is a plan view taken along line AA in Fig. 4B.

[0082] 4A and 4B, it is preferable that at least three through-holes 30 are arranged at equal intervals in the outside-product region R2 (see FIG. 3, etc.). The term "equally spaced" here does not mean only in the strict sense, but also means that the distances are substantially the same, for example, including a difference of about several percent.

[0083] By arranging at least three through holes 30 at equal intervals, local stress concentration is prevented, and delamination can be suppressed. Note that as long as at least three through holes 30 are arranged at equal intervals, through holes 30 with different intervals may be included.

[0084] The distance between the equally spaced through-holes 30 (the length indicated by the arrows in FIG. 4A) is not particularly limited, but is preferably 1 mm or less. On the other hand, the distance between the equally spaced through-holes 30 is, for example, 0.1 mm or more.

[0085] Fig. 5A is a plan view showing another example of the arrangement of the through-holes in the product outside region. Fig. 5B is a cross-sectional view showing another example of the arrangement of the through-holes in the product outside region. Fig. 5A is a plan view taken along line AA in Fig. 5B.

[0086] As shown in Figures 5A and 5B, at least three through-holes 30 are arranged at equal intervals in the outside-product region R2 (see Figure 3, etc.), and it is preferable that at least two of the through-holes 30 arranged at equal intervals have the same planar shape when viewed from the thickness direction. In particular, it is preferable that all of the through-holes 30 arranged at equal intervals have the same planar shape. The phrase "same planar shape" used here does not mean only the strict meaning, but also means that the planar shapes are substantially the same, for example, including a difference of about a few percent.

[0087] Hereinafter, there will be described an example of a method for producing a capacitor element using the substrate for producing a capacitor element 1. In this manner, the method for producing a capacitor element using the substrate for producing a capacitor element of the present invention also constitutes one aspect of the present invention.

[0088] Fig. 6A is a cross-sectional view that typically shows an example of a step of separating the product region R1 from the capacitor element production substrate 1. Fig. 6B is a plan view that typically shows an example of a step of separating the product region R1 from the capacitor element production substrate 1.

[0089] 6A and 6B, the product region R1 is separated by removing the outside-product region R2 from the capacitor element manufacturing substrate 1. For example, the entire outside-product region R2 may be removed by cutting the capacitor element manufacturing substrate 1 at the position of the cutting line CL1. Alternatively, a part of the outside-product region R2 may be removed by cutting the capacitor element manufacturing substrate 1 at the position of the cutting line CL1a.

[0090] Fig. 7A is a cross-sectional view that typically shows one example of a capacitor element obtained from the capacitor element production substrate 1. Fig. 7B is a plan view that typically shows one example of a capacitor element obtained from the capacitor element production substrate 1.

[0091] For example, when the capacitor element production substrate 1 is cut at the position of the cutting line CL1 in FIGS. 6A and 6B, the capacitor element 100 shown in FIGS. 7A and 7B is obtained.

[0092] FIG. 8 is a cross-sectional view that typically shows a first modified example of the capacitor element production substrate 1 shown in FIG.

[0093] In the capacitor element production substrate 1A shown in FIG. 8, the sealing layer 20 includes a first sealing layer 21 provided so as to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 provided on the surface of the first sealing layer 21.

[0094] 8, the filling member 40 includes an insulating member. For example, the insulating member includes a second sealing layer 22 that penetrates into the through portion 30. The second sealing layer 22 may penetrate into at least a portion of the through portion 30, or may penetrate into the entire through portion 30.

[0095] FIG. 9 is a cross-sectional view that typically shows a second modified example of the capacitor element production substrate 1 shown in FIG.

[0096] In capacitor element production substrate 1B shown in FIG. 9, sealing layer 20 includes a first sealing layer 21 provided so as to cover at least one main surface of substrate layer 10, and a second sealing layer 22 provided on the surface of first sealing layer 21.

[0097] 9, the filling member 40 includes an insulating member. For example, the insulating member includes a first sealing layer 21 that penetrates into the through portion 30. The first sealing layer 21 may penetrate into at least a part of the through portion 30, or may penetrate into the entire through portion 30.

[0098] 8 or 9, when the sealing layer 20 is composed of two or more layers, the adhesion between the first sealing layer 21 and the second sealing layer 22 in the outside-product region R2 can be improved by filling at least a part of the through-hole 30 with the filling member 40. Therefore, it is possible to suppress bulging caused by delamination in the outside-product region R2. This also makes it possible to suppress bulging in the product region R1.

[0099] [Second embodiment] In the capacitor element production substrate according to the second embodiment of the present invention, the filling member includes a conductive member.

[0100] FIG. 10 is a cross-sectional view that illustrates an example of a substrate for producing a capacitor element according to the second embodiment of the present invention.

[0101] In the capacitor element production substrate 2 shown in FIG.

[0102] 10, it is sufficient that the conductive member 41 is provided on at least the inner wall surface of the through portion 30. The conductive member 41 may be provided only on the inner wall surface of the through portion 30, or may be provided over the entire inside of the through portion 30.

[0103] As shown in FIG. 10, the conductive member 41 may be in contact with the anode plate 11 on the inner wall surface of the through portion 30 .

[0104] 10, when the conductive member 41 is provided only on the inner wall surface of the through-hole 30, a resin-filled portion 45 filled with a resin material may be provided inside the conductive member 41. The resin-filled portion 45 is provided in a space surrounded by the conductive member 41 in the through-hole 30. When the space in the through-hole 30 is eliminated by providing the resin-filled portion 45, the occurrence of delamination of the conductive member 41 is suppressed. The resin-filled portion 45 may be a conductor or an insulator.

[0105] The conductive member 41 preferably has a common configuration to the first through-hole conductor 61 and the second through-hole conductor 62 .

[0106] In the outside-product region R2, a dummy electrode layer 50 may be provided on the surface of the sealing layer 20.

[0107] When a dummy layer such as the dummy electrode layer 50 is provided in the outside-product region R2, it is preferable that at least one end of the through-hole 30 is covered by the dummy layer. In the example shown in FIG. 10, both ends of the through-hole 30 are covered by the dummy electrode layer 50, but either one end of the through-hole 30 may be covered by the dummy electrode layer 50.

[0108] 10, it is particularly preferable that the conductive member 41 included in the filling member 40 is connected to the dummy electrode layer 50. In this case, delamination is further suppressed.

[0109] FIG. 11 is a cross-sectional view that illustrates a schematic diagram of another example of a substrate for producing a capacitor element according to the second embodiment of the present invention.

[0110] 11, filling member 40 further includes insulating member 42 located outside conductive member 41. In this manner, filling member 40 may be composed of two or more layers of members extending from the inner wall surface of penetrating portion 30 inward.

[0111] 11, the insulating member 42 includes a sealing layer 20 that penetrates into the through portion 30. The sealing layer 20 may penetrate at least partially between the anode plate 11 and the conductive member 41, or may penetrate entirely between the anode plate 11 and the conductive member 41.

[0112] 11 , the insulating member 42 is preferably in contact with the sealing layer 20 on at least one main surface side of the substrate layer 10, and is preferably in contact with the sealing layer 20 on both main surface sides of the substrate layer 10. As described above, the insulating member 42 may be integral with the sealing layer 20 on at least one main surface side of the substrate layer 10, or may be integral with the sealing layer 20 on both main surface sides of the substrate layer 10.

[0113] In the capacitor element production substrate 2' shown in FIG. 11, the filling member 40 includes the insulating member 42, and therefore, compared to the capacitor element production substrate 2 shown in FIG. 10, delamination is further suppressed.

[0114] FIG. 12 is a cross-sectional view that illustrates a modified example of the capacitor element production substrate 2 shown in FIG.

[0115] As in the capacitor element manufacturing substrate 2A shown in Figure 12, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0116] FIG. 13 is a cross-sectional view that illustrates a modified example of the capacitor element production substrate 2' shown in FIG.

[0117] As in the capacitor element manufacturing substrate 2B shown in Figure 13, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0118] 13, insulating member 42 includes first sealing layer 21 that penetrates through portion 30. First sealing layer 21 may penetrate at least partially between anode plate 11 and conductive member 41, or may penetrate entirely between anode plate 11 and conductive member 41.

[0119] [Third embodiment] In the substrate for manufacturing capacitor elements according to the third embodiment of the present invention, the outside area includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on the surface of the porous portion, and a cathode layer provided on the surface of the dielectric layer.

[0120] FIG. 14 is a cross-sectional view that illustrates an example of a substrate for producing a capacitor element according to a third embodiment of the present invention.

[0121] In the capacitor element manufacturing substrate 3 shown in Figure 14, the outside region R2 of the product includes an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13.

[0122] The configuration of the cathode layer 12 provided in the outside-product region R2 is preferably the same as that of the cathode layer 12 provided in the product region R1.

[0123] In the outside-product region R2, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In that case, it is preferable that the penetration portion 30 penetrates the anode plate 11 and the insulating layer 15 in the thickness direction. The insulating layer 15 may be provided between the sealing layer 20 on one of the main surfaces and the anode plate 11, or may be provided between the sealing layer 20 on both main surfaces and the anode plate 11.

[0124] Insulating layer 15 may be composed of only one layer, or may be composed of two or more layers. When insulating layer 15 is composed of two or more layers, the materials constituting each layer may be the same or different.

[0125] 14, insulating layer 15 includes a first insulating layer 15A provided on the surface of dielectric layer 13 and a second insulating layer 15B provided on the surface of first insulating layer 15A. The thickness of first insulating layer 15A may be the same as the thickness of second insulating layer 15B, or may be greater than or smaller than the thickness of second insulating layer 15B.

[0126] The insulating layer 15 in the outside-product region R2 is preferably provided around the through-hole 30. In addition, the insulating layer 15 may be provided so as to surround the periphery of the cathode layer 12 in the outside-product region R2.

[0127] The configuration of the insulating layer 15 provided in the outside-product region R2 is preferably the same as that of the insulating layer 15 provided in the product region R1. Alternatively, the insulating layer 15 may not be provided in the product region R1, and may be provided only in the outside-product region R2. The configuration of the insulating layer 15 provided in the outside-product region R2 may be in contact with the insulating layer 15 provided in the product region R1, or may be separated from the insulating layer 15 provided in the product region R1.

[0128] The other configuration is the same as that of the capacitor element production substrate 2 shown in FIG.

[0129] 14, by making the outside-product area R2 have the same structure as the product area R1, the difference in thickness of the sealing layer 20 between the product area R1 and the outside-product area R2 is reduced. Therefore, the generation of stress due to undulation of the substrate is suppressed. In addition, by filling at least a part of the through-hole 30 with the filling material 40, it is possible to suppress swelling due to delamination in the outside-product area R2.

[0130] FIG. 15 is a cross-sectional view that illustrates a schematic diagram of another example of a substrate for producing a capacitor element according to the third embodiment of the present invention.

[0131] In the capacitor element manufacturing substrate 3' shown in Figure 15, similar to the capacitor element manufacturing substrate 3 shown in Figure 14, the outside region R2 of the product includes an anode plate 11 having a porous portion 11B on at least one main surface of a core portion 11A, a dielectric layer 13 provided on the surface of the porous portion 11B, and a cathode layer 12 provided on the surface of the dielectric layer 13.

[0132] In the outside-product region R2, an insulating layer 15 may be provided between the anode plate 11 and the sealing layer 20. In that case, it is preferable that the penetration portion 30 penetrates the anode plate 11 and the insulating layer 15 in the thickness direction. The insulating layer 15 may be provided between the sealing layer 20 on one of the main surfaces and the anode plate 11, or may be provided between the sealing layer 20 on both main surfaces and the anode plate 11.

[0133] The other configuration is similar to that of the capacitor element production substrate 2' shown in FIG.

[0134] FIG. 16 is a cross-sectional view that typically shows a modification of the capacitor element production substrate 3 shown in FIG.

[0135] As in the capacitor element manufacturing substrate 3A shown in Figure 16, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0136] FIG. 17 is a cross-sectional view that typically shows a modified example of the capacitor element production substrate 3' shown in FIG.

[0137] As in the capacitor element manufacturing substrate 3B shown in Figure 17, the sealing layer 20 may include a first sealing layer 21 arranged to cover at least one main surface of the substrate layer 10, and a second sealing layer 22 arranged on the surface of the first sealing layer 21.

[0138] 17, insulating member 42 includes first sealing layer 21 that penetrates through portion 30. First sealing layer 21 may penetrate at least partially between anode plate 11 and conductive member 41, or may penetrate entirely between anode plate 11 and conductive member 41.

[0139] [Other embodiments] The substrate for producing capacitor elements of the present invention is not limited to the above-described embodiment, and various applications and modifications can be made within the scope of the present invention with respect to the configuration of the product area and non-product area, the production conditions, etc.

[0140] For example, in the first or second embodiment of the present invention, an insulating layer may be provided between the anode plate and the sealing layer in the outside-product region, as in the third embodiment. In that case, it is preferable that the penetration portion penetrates the anode plate and the insulating layer in the thickness direction.

[0141] The insulating layer in the outside-product region is preferably provided around the through-hole. Also, the insulating layer may be provided in the outside-product region so as to surround the periphery of the cathode layer.

[0142] In the substrate for producing a capacitor element of the present invention, when a plurality of through holes are provided in the outside-product region, through holes filled with the filling member described in the different embodiments may be mixed in.

[0143] The detailed configuration of the capacitor portion included in the product area will be described below.

[0144] Examples of the planar shape of the capacitor portion when viewed from the thickness direction include a rectangle (square or oblong), a quadrangle other than a rectangle, a polygon such as a triangle, a pentagon, or a hexagon, a circle, an ellipse, a combination of these, etc. The planar shape of the capacitor portion may also be an L-shape, a C-shape, a step shape, etc.

[0145] The anode plate 11 is preferably made of a valve metal that exhibits a so-called valve action. Examples of the valve metal include simple metals such as aluminum, tantalum, niobium, titanium, and zirconium, and alloys containing at least one of these metals. Among these, aluminum or an aluminum alloy is preferable.

[0146] The shape of the anode plate 11 is preferably a flat plate, and more preferably a foil. Thus, in this specification, the term "plate-like" includes "foil-like".

[0147] The anode plate 11 may have the porous portion 11B on at least one main surface of the core portion 11A. In other words, the anode plate 11 may have the porous portion 11B on only one main surface of the core portion 11A, or may have the porous portion 11B on both main surfaces of the core portion 11A. The porous portion 11B is preferably a porous layer formed on the surface of the core portion 11A, and more preferably an etched layer.

[0148] The thickness of the anode plate 11 before the etching process is preferably 60 μm or more and 200 μm or less. The thickness of the core portion 11A that is not etched after the etching process is preferably 15 μm or more and 70 μm or less. The thickness of the porous portion 11B is designed according to the required withstand voltage and electrostatic capacitance, but it is preferably 10 μm or more and 180 μm or less in total for the porous portions 11B on both sides of the core portion 11A.

[0149] The pore size of the porous portion 11B is preferably 10 nm or more and 600 nm or less. The pore size of the porous portion 11B means the median size D50 measured by a mercury porosimeter. The pore size of the porous portion 11B can be controlled by adjusting various conditions in the etching, for example.

[0150] The dielectric layer 13 provided on the surface of the porous portion 11B is porous reflecting the surface state of the porous portion 11B, and has a finely uneven surface shape. The dielectric layer 13 is preferably made of an oxide film of the valve metal. For example, when an aluminum foil is used as the anode plate 11, the dielectric layer 13 made of an oxide film can be formed by anodizing the surface of the aluminum foil in an aqueous solution containing ammonium adipate or the like (also called chemical conversion treatment).

[0151] The thickness of the dielectric layer 13 is designed according to the required withstand voltage and capacitance, but is preferably 10 nm or more and 100 nm or less.

[0152] When the cathode layer 12 includes the solid electrolyte layer 12A, examples of materials constituting the solid electrolyte layer 12A include conductive polymers such as polypyrroles, polythiophenes, and polyanilines. Among these, polythiophenes are preferred, and poly(3,4-ethylenedioxythiophene), also known as PEDOT, is particularly preferred. The conductive polymer may also include a dopant such as polystyrene sulfonate (PSS). The solid electrolyte layer 12A preferably includes an inner layer that fills the pores (recesses) of the dielectric layer 13, and an outer layer that covers the dielectric layer 13.

[0153] The thickness of solid electrolyte layer 12A from the surface of porous portion 11B is preferably 2 μm or more and 20 μm or less.

[0154] The solid electrolyte layer 12A is formed, for example, by a method of forming a polymerized film of poly(3,4-ethylenedioxythiophene) or the like on the surface of the dielectric layer 13 using a treatment liquid containing a monomer such as 3,4-ethylenedioxythiophene, or a method of applying a dispersion liquid of a polymer such as poly(3,4-ethylenedioxythiophene) to the surface of the dielectric layer 13 and drying it.

[0155] The solid electrolyte layer 12A can be formed in a predetermined region by applying the above-mentioned treatment liquid or dispersion liquid to the surface of the dielectric layer 13 by a method such as sponge transfer, screen printing, dispenser application, or inkjet printing.

[0156] When the cathode layer 12 includes the conductor layer 12B, the conductor layer 12B includes at least one layer selected from a conductive resin layer and a metal layer. The conductor layer 12B may be only a conductive resin layer or only a metal layer. The conductor layer 12B preferably covers the entire surface of the solid electrolyte layer 12A.

[0157] The conductive resin layer may be, for example, a conductive adhesive layer containing at least one conductive filler selected from the group consisting of a silver filler, a copper filler, a nickel filler, and a carbon filler.

[0158] Examples of the metal layer include a metal plating film and a metal foil. The metal layer is preferably made of at least one metal selected from the group consisting of nickel, copper, silver, and alloys containing these metals as main components. The term "main component" refers to the elemental component with the largest weight ratio.

[0159] The conductive layer 12B includes, for example, a carbon layer provided on the surface of the solid electrolyte layer 12A and a copper layer provided on the surface of the carbon layer.

[0160] The carbon layer is provided to electrically and mechanically connect the solid electrolyte layer 12A and the copper layer. The carbon layer can be formed in a predetermined area by applying a carbon paste to the surface of the solid electrolyte layer 12A by a method such as sponge transfer, screen printing, dispenser application, or inkjet printing. The thickness of the carbon layer is preferably 2 μm or more and 20 μm or less.

[0161] The copper layer can be formed in a predetermined area by applying a copper paste to the surface of the carbon layer by sponge transfer, screen printing, spray application, dispenser application, inkjet printing, etc. The thickness of the copper layer is preferably 2 μm or more and 20 μm or less.

[0162] The sealing layer 20 is made of an insulating material. In this case, the sealing layer 20 preferably contains an insulating resin.

[0163] Examples of the insulating resin contained in the sealing layer 20 include epoxy resin and phenol resin.

[0164] The sealing layer 20 preferably further contains a filler.

[0165] Examples of the filler contained in the sealing layer 20 include inorganic fillers such as silica particles and alumina particles.

[0166] Between the anode plate 11 and the sealing layer 20, for example, a stress relaxation layer, a moisture-proof film, or other layer may be provided.

[0167] The insulating layer 15 is made of an insulating material, and in this case, the insulating layer 15 is preferably made of an insulating resin.

[0168] Examples of insulating resins that form the insulating layer 15 include polyphenylsulfone resins, polyethersulfone resins, cyanate ester resins, fluororesins (tetrafluoroethylene, tetrafluoroethylene-perfluoroalkylvinyl ether copolymers, etc.), polyimide resins, polyamideimide resins, epoxy resins, and derivatives or precursors thereof.

[0169] The insulating layer 15 may be made of the same resin as the sealing layer 20. Unlike the sealing layer 20, if the insulating layer 15 contains an inorganic filler, it may adversely affect the effective capacitance part of the capacitor part, so that the insulating layer 15 is preferably made of a resin alone.

[0170] The insulating layer 15 can be formed in a predetermined area by applying a mask material, such as a composition containing an insulating resin, to the surface of the porous portion 11B by a method such as sponge transfer, screen printing, dispenser application, or inkjet printing.

[0171] The insulating layer 15 may be formed on the porous portion 11B either before or after the dielectric layer 13 is formed.

[0172] The first external electrode layer 91 is electrically connected to the anode plate 11. In the example shown in Fig. 3, the first external electrode layer 91 is provided on the surface of the first through-hole conductor 61, and functions as a connection terminal of the capacitor unit. In the example shown in Fig. 3, the first external electrode layer 91 is electrically connected to the anode plate 11 via the first through-hole conductor 61, and functions as a connection terminal for the anode plate 11.

[0173] Examples of the constituent material of the first external electrode layer 91 include metal materials containing low-resistance metals such as silver, gold, copper, etc. In this case, the first external electrode layer 91 is formed by, for example, plating the surfaces of the first through-hole conductors 61.

[0174] In order to improve the adhesion between the first external electrode layer 91 and other components, in this case, between the first external electrode layer 91 and the first through-hole conductor 61, a mixed material of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler and resin may be used as a constituent material of the first external electrode layer 91.

[0175] The second external electrode layer 92 is electrically connected to the cathode layer 12. In the example shown in Fig. 3, the second external electrode layer 92 is provided on the surface of the second through-hole conductor 62, and functions as a connection terminal of the capacitor section.

[0176] Examples of the constituent material of the second external electrode layer 92 include metal materials containing low-resistance metals such as silver, gold, copper, etc. In this case, the second external electrode layer 92 is formed by, for example, plating the surfaces of the second through-hole conductors 62.

[0177] In order to improve the adhesion between the second external electrode layer 92 and other components, in this case, between the second external electrode layer 92 and the second through-hole conductor 62, a mixed material of at least one conductive filler selected from the group consisting of silver filler, copper filler, nickel filler, and carbon filler and resin may be used as a constituent material of the second external electrode layer 92.

[0178] The constituent materials of the first external electrode layer 91 and the second external electrode layer 92 are preferably the same as each other at least in terms of type, but may be different from each other.

[0179] When multiple capacitor sections are arranged in the planar direction, each of the capacitor sections may be provided with a first external electrode layer 91 electrically connected to the anode plate 11 and a second external electrode layer 92 electrically connected to the cathode layer 12, and at least one of the first external electrode layer 91 and the second external electrode layer 92 may be provided in common among the multiple capacitor sections.

[0180] The first external electrode layer 91 and the second external electrode layer 92 may be provided on both main surfaces of the sealing layer 20 or on only one of the main surfaces of the sealing layer 20.

[0181] When the first through-hole conductor 61 is electrically connected to the anode plate 11 on the inner wall surface of the first through hole 71, it is preferable that the first through-hole conductor 61 is electrically connected to the end surface of the anode plate 11 that faces the inner wall surface of the first through hole 71 in the planar direction. In this way, the anode plate 11 is electrically led out to the outside via the first through-hole conductor 61.

[0182] It is preferable that the core portion 11A and the porous portion 11B are exposed on the end face of the anode plate 11 that is electrically connected to the first through-hole conductor 61. In this case, the porous portion 11B as well as the core portion 11A are electrically connected to the first through-hole conductor 61.

[0183] When viewed in the thickness direction, the first through-hole conductor 61 is preferably electrically connected to the anode plate 11 over the entire circumference of the first through hole 71. In this case, the connection resistance between the anode plate 11 and the first through-hole conductor 61 is likely to decrease, and therefore the equivalent series resistance (ESR) is likely to decrease.

[0184] The second through-hole conductor 62 is electrically connected to the cathode layer 12 via, for example, the second external electrode layer 92 and a via conductor.

[0185] The first through-hole conductor 61 is formed, for example, as follows. First, a first through hole 71 penetrating the anode plate 11 and the sealing layer 20 in the thickness direction is formed by performing drilling, laser processing, or the like. Then, the inner wall surface of the first through hole 71 is metallized with a metal material containing a low-resistance metal such as copper, gold, or silver, to form the first through-hole conductor 61. When forming the first through-hole conductor 61, for example, the inner wall surface of the first through hole 71 is metallized by electroless copper plating, electrolytic copper plating, or the like, to facilitate processing. Note that the method of forming the first through-hole conductor 61 may be a method of filling the first through hole 71 with a metal material, a composite material of metal and resin, or the like, in addition to a method of metallizing the inner wall surface of the first through hole 71.

[0186] An anode connection layer may be provided between the anode plate 11 and the first through-hole conductor 61 in the planar direction. That is, the anode plate 11 and the first through-hole conductor 61 may be electrically connected via the anode connection layer.

[0187] By providing the anode connection layer between the anode plate 11 and the first through-hole conductor 61 in the surface direction, the anode connection layer functions as a barrier layer for the anode plate 11, more specifically, as a barrier layer for the core portion 11A and the porous portion 11B. When the anode connection layer functions as a barrier layer for the anode plate 11, dissolution of the anode plate 11 that occurs during chemical treatment for forming external electrode layers such as the first external electrode layer 91 is suppressed, and thus infiltration of the chemical solution into the capacitor portion is suppressed, which tends to improve reliability.

[0188] The anode connecting layer preferably includes a layer mainly composed of nickel. In this case, damage to the metal (e.g., aluminum) constituting the anode plate 11 is reduced, and the barrier property of the anode connecting layer against the anode plate 11 is easily improved.

[0189] In addition, in the planar direction, an anode connection layer does not have to be provided between the anode plate 11 and the first through-hole conductor 61. In this case, the first through-hole conductor 61 may be directly connected to the end surface of the anode plate 11.

[0190] The second through-hole conductor 62 is formed, for example, as follows. First, a through-hole penetrating the anode plate 11 and the cathode layer 12 in the thickness direction is formed by drilling, laser processing, or the like. Next, the above-mentioned through-hole is filled with an insulating material. The part filled with the insulating material is subjected to drilling, laser processing, or the like to form the second through-hole 72. At this time, the diameter of the second through-hole 72 is made smaller than the diameter of the through-hole filled with the insulating material, so that the insulating material is present between the inner wall surface of the previously formed through-hole and the inner wall surface of the second through-hole 72 in the surface direction. Thereafter, the inner wall surface of the second through-hole 72 is metallized with a metal material containing a low-resistance metal such as copper, gold, or silver, to form the second through-hole conductor 62. When forming the second through-hole conductor 62, for example, the inner wall surface of the second through-hole 72 is metallized by electroless copper plating, electrolytic copper plating, or the like to facilitate processing. In addition, the method of forming the second through-hole conductor 62 may be a method of filling the second through hole 72 with a metal material, a composite material of metal and resin, or the like, in addition to a method of metallizing the inner wall surface of the second through hole 72.

[0191] Examples of materials that can be used to form the via conductor include metal materials that contain low-resistance metals such as silver, gold, and copper.

[0192] The via conductor is formed, for example, by plating the inner wall surface of a via hole penetrating the sealing layer 20 in the thickness direction with the above-mentioned metal material, or by filling it with a conductive paste and then performing a heat treatment.

[0193] The capacitor element obtained from the substrate for producing a capacitor element of the present invention can be suitably used as a constituent material of a composite electronic component. Such a composite electronic component includes, for example, a capacitor element, an external electrode layer provided on the surface of the sealing layer of the capacitor element and electrically connected to the anode plate and cathode layer of the capacitor element, and an electronic component connected to the external electrode layer.

[0194] In the composite electronic component, the electronic component connected to the external electrode layer may be a passive element or an active element. Both the passive element and the active element may be connected to the external electrode layer, or either the passive element or the active element may be connected to the external electrode layer. Also, a composite of the passive element and the active element may be connected to the external electrode layer.

[0195] Examples of passive elements include inductors, etc. Examples of active elements include memories, GPUs (Graphical Processing Units), CPUs (Central Processing Units), MPUs (Micro Processing Units), and PMICs (Power Management ICs).

[0196] The capacitor element has a sheet-like shape as a whole. Therefore, in the composite electronic component, the capacitor element can be treated like a mounting board, and electronic components can be mounted on the capacitor element. Furthermore, by making the electronic components mounted on the capacitor element into a sheet-like shape, it is also possible to connect the capacitor element and the electronic components in the thickness direction via through-hole conductors that penetrate each electronic component in the thickness direction. As a result, the active elements and passive elements can be configured like a single module.

[0197] For example, a switching regulator can be formed by electrically connecting a capacitor element between a voltage regulator including a semiconductor active element and a load to which the converted DC voltage is supplied.

[0198] In the composite electronic component, a circuit layer may be formed on either one surface of a capacitor matrix sheet on which a plurality of capacitor elements are laid out, and the circuit layer may be connected to a passive element or an active element.

[0199] Alternatively, the capacitor element may be placed in a cavity provided in advance in the substrate, embedded in resin, and then a circuit layer may be formed on the resin. Another electronic component (passive element or active element) may be mounted in another cavity of the same substrate.

[0200] Alternatively, the capacitor element may be mounted on a smooth carrier such as a wafer or glass, an outer layer made of resin may be formed, and then a circuit layer may be formed and connected to a passive or active element.

[0201] The present specification discloses the following:

[0202] <1> a substrate layer divided into a product area constituting a capacitor element and an outside-product area surrounding at least a part of the product area; a sealing layer provided so as to cover at least one of the main surfaces of the substrate layer; The product region includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on a surface of the porous portion, and a cathode layer provided on a surface of the dielectric layer, the out-of-product region includes the core of the anode plate, a through-hole penetrating through the anode plate in a thickness direction is provided in at least a part of the region of the outside-of-product region that is located at an outer edge of the substrate layer, At least a portion of the through portion is filled with a filling member.

[0203] <2> The filling member includes a conductive member. <1> The substrate for producing a capacitor element according to claim 1 .

[0204] <3> The filling member is composed of two or more layers of members in an inward direction from the inner wall surface of the through-hole. <2> The substrate for producing a capacitor element according to claim 1 .

[0205] <4> The filling member further includes an insulating member located outside the conductive member. <3> The substrate for producing a capacitor element according to claim 1 .

[0206] <5> The filling member includes an insulating member. <1> The substrate for producing a capacitor element according to claim 1 .

[0207] <6> The insulating member includes the sealing layer that penetrates into at least a portion of the through-hole. <4> or <5> The substrate for producing a capacitor element according to claim 1 .

[0208] <7> The outside-product region includes the anode plate having the porous portion on at least one main surface of the core portion, the dielectric layer provided on a surface of the porous portion, and the cathode layer provided on a surface of the dielectric layer. <1> ~ <6> 13. A substrate for producing a capacitor element according to claim 12.

[0209] <8> In the outside-product region, an insulating layer is provided between the anode plate and the sealing layer, The through portion penetrates the anode plate and the insulating layer in the thickness direction. <1> ~ <7> 13. A substrate for producing a capacitor element according to claim 12.

[0210] <9> At least three of the through holes are arranged at equal intervals in the outside region of the product. <1> ~ <8> 13. A substrate for producing a capacitor element according to claim 12.

[0211] <10> At least two of the through holes arranged at equal intervals have the same planar shape when viewed from the thickness direction. <9> The substrate for producing a capacitor element according to claim 1 .

[0212] <11> In the outside-product region, a dummy layer is provided on a surface of the sealing layer, At least one end of the through portion is covered by the dummy layer. <1> ~ <10> 13. A substrate for producing a capacitor element according to claim 12.

[0213] <12> <1> ~ <11> 2. A method for producing a capacitor element, comprising a step of separating a product area by removing at least a part of the outside-product area from the capacitor element production substrate described in any one of claims 1 to 11. [Explanation of symbols]

[0214] 1, 1A, 1B, 2, 2', 2A, 2B, 3, 3', 3A, 3B Capacitor element manufacturing substrate 10 Substrate Layer 11 Anode plate 11A core 11B Porous part 12 Cathode layer 12A solid electrolyte layer 12B Conductive layer 13 Dielectric layer 15 Insulating layer 15A First Insulation Layer 15B Second insulating layer 20 Sealing layer 21 First sealing layer 22 Second sealing layer 30 Penetration 40 Filling material 41 Conductive materials 42 Insulating materials 45 Resin filling section 50 Dummy electrode layer (dummy layer) 61 First through hole conductor 62 Second through hole conductor 71 First through hole 72 Second Through Hole 81 First resin filling section 82 Second resin filling section 91 1st external electrode layer 92 Second external electrode layer 100 Capacitor element CL1, CL1a cutting line R1 product area R2 Non-product area

Claims

1. a substrate layer divided into a product area constituting a capacitor element and an outside-product area surrounding at least a part of the product area; a sealing layer provided so as to cover at least one of the main surfaces of the substrate layer; the product region includes an anode plate having a porous portion on at least one main surface of a core portion, a dielectric layer provided on a surface of the porous portion, and a cathode layer provided on a surface of the dielectric layer; the outside-product region includes the core of the anode plate, a through-hole penetrating through the anode plate in a thickness direction is provided in at least a part of the region of the outside-product region that is located at an outer edge of the substrate layer, At least a portion of the through portion is filled with a filling member.

2. The substrate for producing a capacitor element according to claim 1 , wherein the filling member includes a conductive member.

3. 3. The substrate for producing a capacitor element according to claim 2, wherein the filling member is composed of two or more layers of members extending inward from the inner wall surface of the through portion.

4. The substrate for producing a capacitor element according to claim 3 , wherein the filling member further includes an insulating member located outside the conductive member.

5. The substrate for producing a capacitor element according to claim 1 , wherein the filling member includes an insulating member.

6. The substrate for producing a capacitor element according to claim 4 , wherein the insulating member includes the sealing layer embedded in at least a portion of the through portion.

7. The substrate for manufacturing a capacitor element according to any one of claims 1 to 5, wherein the outside-product area includes the anode plate having the porous portion on at least one main surface of the core portion, the dielectric layer provided on a surface of the porous portion, and the cathode layer provided on a surface of the dielectric layer.

8. In the outside-product region, an insulating layer is provided between the anode plate and the sealing layer, 6. The substrate for producing a capacitor element according to claim 1, wherein the through portion penetrates the anode plate and the insulating layer in the thickness direction.

9. 6. The substrate for producing a capacitor element according to claim 1, wherein at least three of the through holes are disposed at equal intervals in the outside-product region.

10. 10. The substrate for producing a capacitor element according to claim 9, wherein at least two of the through holes arranged at equal intervals have the same planar shape when viewed from the thickness direction.

11. In the outside-product region, a dummy layer is provided on a surface of the sealing layer, 6. The substrate for producing a capacitor element according to claim 1, wherein at least one end of the through portion is covered with the dummy layer.

12. A method for producing a capacitor element, comprising a step of separating a product area from the substrate for producing a capacitor element according to any one of claims 1 to 5 by removing at least a part of the outside-product area.

Images