Electronic apparatus and inverter device
JPWO2025057415A5Pending Publication Date: 2026-06-16
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Filing Date
- 2026-03-25
- Publication Date
- 2026-06-16
AI Technical Summary
Technical Problem
Existing inverter devices face issues with heat generation due to current flow through copper foil patterns on the upper substrate, which can negatively affect heat-sensitive electronic components like capacitors.
Method used
The design incorporates a substrate with a first and second electrode busbar, each featuring parallel conductor plates and a connection conductor plate that electrically connects them, allowing for complex conductive paths without relying on copper foil patterns, thereby reducing heat generation.
Benefits of technology
This configuration enables efficient power supply to power elements while minimizing heat impact on capacitors, enhancing the reliability and performance of electronic devices and inverter equipment.
✦ Generated by Eureka AI based on patent content.
Abstract
Provided is an electronic apparatus capable of forming, with busbars, a complex electroconductive path on a substrate. This electronic apparatus has: a substrate on which a plurality of electronic components are mounted in rows; and a first electrode busbar and a second electrode busbar that are provided in said order and spaced apart on the substrate. The first electrode busbar and the second electrode busbar each have: two conductor plates that are parallel to each other; a connection conductor plate that electrically connects the two conductor plates; and an input electrode that supplies power to the two conductor plates. Each of the conductor plates is disposed adjacent to the electronic components and electrically connected to the electronic components. The connection conductor plate of the first electrode busbar is disposed so as to overlap with the connection conductor plate of the second electrode busbar.
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