Substrate holder and plating device

Abstract

To realize a substrate holder that can accommodate various types of substrates with different power supply positions. The substrate holder 210 includes a base plate and a face plate 230 for sandwiching and holding a substrate together with the base plate. The face plate 230 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The substrate holder 210 includes a contact member 240 having a first bus bar 242 attached to the frame member 234 so as to be movable relative to the frame member 234, and a power supply contact 243 attached to the first bus bar 242.

Description

[Technical field]

[0001] The present application relates to a substrate holder and a plating apparatus. [Background technology]

[0002] Patent Document 1 discloses a dip-type plating device as an example of an electrolytic plating device. In this plating device, a substrate (e.g., a semiconductor wafer) with its surface to be plated facing sideways is held by a substrate holder and immersed in a plating solution, and a voltage is applied between the substrate (cathode) and the anode, depositing a conductive film on the surface of the substrate.

[0003] The substrate holder is generally configured to hold the substrate between a base plate and a face plate, with the surface of the substrate to be plated exposed through a central opening formed in the face plate, and is configured to supply power to the substrate by contacting the contact member with the substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6335763 Summary of the Invention [Problem to be solved by the invention]

[0005] The substrate holder of the plating apparatus disclosed in Patent Document 1 does not take into consideration the compatibility with various types of substrates having different power supply positions.

[0006] In other words, there are various types of substrates to be plated, and the specifications of the power supply position also differ depending on the substrate. In this case, it is necessary to prepare a dedicated substrate holder for each substrate with a different power supply position, and the number of substrate holders increases, making the plating apparatus configuration complicated.

[0007] Therefore, one object of the present application is to realize a substrate holder that is compatible with various types of substrates having different power supply positions. [Means for solving the problem]

[0008] According to one embodiment, a substrate holder is disclosed that includes a base plate, a face plate for clamping and holding a substrate together with the base plate, the face plate having a central opening and a frame member surrounding the central opening, and a contact member having a first bus bar attached to the frame member so as to be movable relative to the frame member, and a power supply contact attached to the first bus bar. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a cross-sectional view showing the overall configuration of a plating apparatus according to one embodiment. [Diagram 2] FIG. 2 is a schematic perspective view of a substrate holder according to one embodiment. [Diagram 3] FIG. 3 is a schematic cross-sectional view of a locking mechanism for a substrate holder according to an embodiment. [Figure 4] FIG. 4 is a schematic perspective view of a contact member according to an embodiment. [Diagram 5] FIG. 5 is an enlarged perspective view of a contact member according to one embodiment. [Figure 6] FIG. 6 is an enlarged perspective view of a contact member according to one embodiment. [Figure 7] FIG. 7 is an enlarged perspective view of a contact member according to one embodiment. [Figure 8] FIG. 8 is an enlarged perspective view of a contact member according to one embodiment. [Figure 9] FIG. 9 is an enlarged perspective view of a contact member according to one embodiment. [Figure 10] FIG. 10 is an enlarged perspective view of a contact member according to one embodiment. [Figure 11] FIG. 11 is a schematic perspective view of a position adjustment mechanism according to an embodiment. [Figure 12]FIG. 12 is a schematic perspective view of a position adjustment mechanism according to an embodiment. [Figure 13] FIG. 13 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. [Figure 14] FIG. 14 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. [Figure 15] FIG. 15 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. [Figure 16] FIG. 16 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. [Figure 17] FIG. 17 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. [Figure 18] FIG. 18 is an enlarged perspective view of a contact member and a position adjustment mechanism according to one embodiment. [Figure 19] FIG. 19 is an enlarged perspective view of a contact member according to one embodiment. [Figure 20] FIG. 20 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. [Figure 21] FIG. 21 is a schematic perspective view of a contact member and a position adjustment jig according to one embodiment. [Figure 22] FIG. 22 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. [Diagram 23] FIG. 23 is a schematic perspective view of a contact member and a position adjustment jig according to an embodiment. [Figure 24] FIG. 24 is a flow chart of a substrate mounting method according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and redundant description will be omitted.

[0011] <Overall configuration of plating equipment> 1 is a plan view showing the overall configuration of the plating apparatus of this embodiment. The plating apparatus 1000 includes a load port 100, a transfer robot 110, a load stage 120, an unload stage 130, a loader 140, a fixing module 200, a stocker module 300, a swap module 310, a holder cleaning module 320, a pre-wet module 400, a pre-soak module 500, a pre-soak cleaning module 510, a plating module 600, a plating cleaning module 700, a blow module 710, a temporary placement module 720, a cleaning module 800, a transfer device 900, and a control module 950.

[0012] The load port 100 is a module for loading a substrate WF stored in a cassette such as a FOUP (not shown) into the plating apparatus 1000 and for unloading the substrate WF from the plating apparatus 1000 to the cassette. In this embodiment, four load ports 100 are arranged side by side in the horizontal direction, but the number and arrangement of the load ports 100 are arbitrary. The transport robot 110 is a robot for transporting the substrate WF horizontally, and is configured to transfer the substrate WF between the load port 100 and the load stage 120.

[0013] The load stage 120 is a stage for transferring the substrate WF before plating between the transport robot 110 and the loader 140. The unload stage 130 is a stage for transferring the substrate WF after plating between the transport robot 110 and the loader 140. The loader 140 is a robot for transferring the substrate WF horizontally, and is configured to transfer the substrate WF between the load stage 120, the unload stage 130, the fixing module 200, and the cleaning module 800.

[0014] The fixing module 200 is a module for attaching a substrate WF to the substrate holder 210 and removing the substrate WF from the substrate holder 210. The stocker module 300 is a module for vertically storing the substrate holder 210. The swap module 310 is a module for temporarily storing the substrate holder 210 that needs to be replaced or maintained, and has a structure that allows the substrate holder 210 to be inserted and removed. The substrate holder 210 removed from the swap module 310 is maintained in the plating apparatus 1000 or removed outside the plating apparatus 1000 for maintenance, and the substrate holder 210 after maintenance or a new substrate holder 210 can be inserted into the swap module 310. The holder cleaning module 320 is a module for cleaning the substrate holder 210.

[0015] The pre-wet module 400 is a module for replacing air inside a pattern formed on the substrate surface with a processing liquid such as pure water or degassed water by wetting the surface to be plated of the substrate WF before plating processing. The pre-wet module 400 is configured to perform a pre-wet processing that replaces the processing liquid inside the pattern with a plating liquid during plating, thereby making it easier to supply the plating liquid inside the pattern.

[0016] The presoak module 500 is configured to perform a presoak process in which an oxide film having a high electrical resistance present on the surface of a seed layer formed on the surface to be plated of the substrate WF before plating is etched away with a treatment liquid such as sulfuric acid or hydrochloric acid to clean or activate the surface of the substrate to be plated. The presoak cleaning module 510 is a module for cleaning the substrate WF that has been subjected to the presoak process.

[0017] The plating module 600 is a module for performing plating processing on the substrate WF. The plating cleaning module 700 is a module for cleaning the substrate WF to remove plating solution and the like remaining on the substrate WF after plating processing. In this embodiment, three plating modules 600 and plating cleaning modules 700 are arranged horizontally, but the number and arrangement of the plating modules 600 and plating cleaning modules 700 are arbitrary. The blow module 710 is a module for drying the substrate WF after cleaning processing. The temporary placement module 720 is a module for temporarily placing the substrate holder 210 to which the substrate WF is attached in order to transfer it between multiple transport devices 900. In this embodiment, the temporary placement module 720 stores one substrate holder 210, but the number is arbitrary.

[0018] The cleaning module 800 is a module for performing cleaning and drying processes on the substrate WF in order to remove plating solution and the like remaining on the substrate WF after plating process that has been removed from the substrate holder 210. In this embodiment, two cleaning modules 800 are arranged horizontally side by side with the load stage 120 and the unload stage 130 in between, but the number and arrangement of the cleaning modules 800 are arbitrary. The transport device 900 is a device for transporting the substrate holder 210 vertically between multiple modules in the plating apparatus 1000. In this embodiment, three transport devices 900 are arranged side by side, but the number and arrangement of the transport devices 900 are arbitrary.

[0019] The control module 950 is configured to control multiple modules of the plating apparatus 1000 and may comprise, for example, a general or special purpose computer with an input / output interface to and from an operator.

[0020] An example of a series of plating processes performed by the plating apparatus 1000 will be described. First, the substrate WF stored in a cassette is carried into the load port 100. Next, the transfer robot 110 takes out the substrate WF from the cassette in the load port 100, and places the substrate WF on the load stage 120. The loader 140 receives the substrate WF from the load stage 120, and transfers it to the fixing module 200.

[0021] The fixing module 200 attaches the substrate WF to the substrate holder 210. The transport device 900 transports the substrate holder 210 to which the substrate WF is attached to the pre-wet module 400. The pre-wet module 400 performs a pre-wet process on the substrate WF. The transport device 900 transports the substrate holder 210 to which the substrate WF that has been subjected to the pre-wet process is attached to the pre-soak module 500. The pre-soak module 500 performs a pre-soak process on the substrate WF. The transport device 900 transports the substrate holder 210 to which the substrate WF that has been subjected to the pre-soak process is attached to the pre-soak cleaning module 510. The pre-soak cleaning module 510 cleans the substrate WF. The transport device 900 transports the substrate holder 210 to which the substrate WF that has been subjected to the cleaning process is attached to the plating module 600. The plating module 600 performs a plating process on the substrate WF.

[0022] The transport device 900 transports the substrate holder 210 to which the plated substrate WF is attached to the plating cleaning module 700. The plating cleaning module 700 performs cleaning on the substrate WF and the substrate holder 210. The transport device 900 transports the substrate holder 210 to which the cleaned substrate WF is attached to the blow module 710. The blow module 710 performs drying on the substrate WF. The transport device 900 transports the substrate holder 210 to which the dried substrate WF is attached to the temporary placement module 720, and another transport device 900 transports the substrate holder 210 from the temporary placement module 720 to the fixing module 200. The fixing module 200 removes the substrate WF from the substrate holder 210.

[0023] The loader 140 transports the plated substrate WF removed from the substrate holder 210 to the cleaning module 800. The cleaning module 800 performs cleaning and drying processes on the substrate WF. The loader 140 places the substrate WF that has been cleaned and dried on the unload stage 130. The transport robot 110 receives the substrate WF from the unload stage 130 and transports it to a cassette in the load port 100. Finally, the cassette containing the substrate WF is unloaded from the load port 100.

[0024] The substrate holder 210 from which the substrate WF has been removed in the fixing module 200 has the next substrate WF attached thereto or is returned to the stocker module 300 by the transport device 900. The substrate holder 210 not holding the substrate WF is cleaned in the holder cleaning module 320 as necessary.

[0025] Fig. 2 is a schematic perspective view of a substrate holder according to an embodiment. As shown in Fig. 2, the substrate holder 210 includes a base plate 220 and a face plate 230 for sandwiching and holding a substrate together with the base plate 220. The face plate 230 has a central opening 234a and a frame member 234 surrounding the central opening 234a. The central opening 234a is formed in a rectangular shape. Note that, in this embodiment, an example in which the central opening 234a is formed in a rectangular shape has been shown, but this is not limiting, and the central opening 234a may be, for example, circular.

[0026] In the present embodiment, an example in which a central opening is also formed in the base plate 220 has been shown, but this is for plating both sides of the substrate. Therefore, when plating is performed on only one side of the substrate, the central opening does not need to be formed in the base plate 220. In addition, for convenience of explanation, the following description may be given using drawings in which the face plate 230 is arranged at the bottom and the base plate 220 is arranged at the top, but when the substrate holder 210 is handled in the fixing module 200, the base plate 220 is arranged at the bottom and the face plate 230 is arranged at the top.

[0027] The substrate holder 210 includes an inner seal member 250 provided on the frame member 234 so as to surround the central opening 234a, and an outer seal member 260 provided on the frame member 234 so as to surround the outside of the inner seal member 250 at a distance from the inner seal member 250. The substrate holder 210 also includes a pair of contact members 240 provided on the frame member 234 with the rectangular central opening 234a in between. The contact members 240 are provided between the inner seal member 250 and the outer seal member 260. This seals the contact members 240 and the end of the substrate from the plating solution when the substrate holder 210 is immersed in the plating solution. In this embodiment, an example in which the contact members 240 are attached to the frame member 234 in a pair with the rectangular central opening 234a in between has been shown, but is not limited thereto. The contact members 240 may be attached to the four sides of the frame member 234 so as to surround the rectangular central opening 234a.

[0028] 2, the substrate holder 210 has a plurality of locking mechanisms 270 for locking and unlocking the base plate 220 and the face plate 230. The plurality of locking mechanisms 270 are provided along the outer periphery of the base plate 220 and the face plate 230.

[0029] FIG. 3 is a schematic cross-sectional view of a locking mechanism 270 of a substrate holder according to an embodiment. As shown in FIG. 3, the base plate 220 has a first lock opening 220a formed outside the outer seal member 260. Meanwhile, the face plate 230 has a second lock opening 230a formed at a position corresponding to the first lock opening 220a outside the outer seal member 260. The locking mechanism 270 includes a holder plate 222 provided in the first lock opening 220a and a holder hook 224 protruding toward the face plate 230 side through the first lock opening 220a. Meanwhile, the locking mechanism 270 includes a clamper plate 236 provided in the second lock opening 230a and a clamper hook 238 protruding toward the base plate 220 through the second lock opening 230a.

[0030] The holder hook 224 is configured to be rotatable around the shaft 224a. The locking mechanism 270 is configured to lock the base plate 220 and the face plate 230 by engaging the holder hook 224 with the clamper hook 238 when the holder hook 224 is in the position shown by the solid line. On the other hand, the locking mechanism 270 is configured to release the engagement between the holder hook 224 and the clamper hook 238 and release the lock between the base plate 220 and the face plate 230 when the holder hook 224 rotates to the position shown by the broken line. Note that, although FIG. 2 shows an example in which a plurality of locking mechanisms 270 are provided along the outer periphery of the base plate 220 and the face plate 230, this is not limiting. Also, in the description of FIG. 4 and subsequent figures, illustration of the locking mechanism 270 is omitted for convenience of description.

[0031] Figures 4 to 7 are schematic perspective views of a contact member according to one embodiment. Figure 4 shows the entire contact member 240, and Figures 5 to 7 show enlarged views of a portion of the contact member 240. Note that the contact members 240 are provided in a pair on the frame member 234 with a central opening 234a in between, but since both have the same configuration, only one of them will be described.

[0032] 4 to 7, the contact member 240 has a first bus bar 242 that extends along the frame member 234 and is attached to the frame member 234 so as to be movable relative to the frame member 234, and a power supply contact 243 that is attached to the first bus bar 242. More specifically, the contact member 240 includes a second bus bar 244 that extends along the frame member 234 and is fixed to the frame member 234. The first bus bar 242 is attached to the second bus bar 244 in a stacked manner so as to be movable relative to the second bus bar 244.

[0033] A base end of the power feed contact 243 is fixed to the first bus bar 242, and a tip end of the power feed contact 243 protrudes in the direction of the central opening 234a. The second bus bar 244 is connected to a power source (not shown). Power is supplied from the power source to the power feed contact 243 via the second bus bar 244 and the first bus bar 242. The power feed contact 243 is configured to supply power to the board by contacting the tip end of the power feed contact 243 with the board.

[0034] First bus bar 242 is attached to second bus bar 244 so as to be movable in a first direction toward and away from central opening 234a. Second bus bar 244 has guide members 245 arranged on both ends in the extension direction of first bus bar 242. Guide members 245 are members for restricting the movement direction of first bus bar 242 to the first direction.

[0035] 5, first bus bar 242 has gripping holes 242a formed at both ends in the extension direction of first bus bar 242. Gripping holes 242a are cutouts for gripping first bus bar 242 when moving first bus bar 242 using a position adjustment mechanism and / or a jig described below.

[0036] 6 and 7, first busbar 242 has elongated hole 246 that is longer in the first direction than the extension direction of first busbar 242. A plurality of elongated holes 246 are provided along the extension direction of first busbar 242. Meanwhile, second busbar 244 has first restricting member 247 disposed at a position corresponding to elongated hole 246. First restricting member 247 is a member for restricting movement of first busbar 242 in the first direction.

[0037] Specifically, first restricting member 247 has proximal end 247a that comes into contact with the edge of elongated hole 246 when first bus bar 242 moves in a direction away from central opening 234a. Also, first restricting member 247 has distal end 247b that comes into contact with the edge of elongated hole 246 when first bus bar 242 moves in a direction approaching central opening 234a. In this embodiment, first restricting member 247 is a bolt fixed to the surface of second bus bar 244 facing first bus bar 242, and the point of the bolt shaft closest to central opening 234a is proximal end 247a, and the point of the bolt shaft farthest from central opening 234a is distal end 247b.

[0038] Second bus bar 244 has a compression coil spring 248 for pressing first bus bar 242 against second bus bar 244. Compression coil spring 248 is disposed between first bus bar 242 and a head of a bolt which is first restricting member 247. Since first restricting member 247 is fixed to second bus bar 244, compression coil spring 248 biases first bus bar 242 against second bus bar 244.

[0039] As shown in FIG. 7, first bus bar 242 has protrusions 242b formed on a surface facing second bus bar 244 so as to extend along the first direction. Compression coil spring 248 presses first bus bar 242 against second bus bar 244, so that protrusions 242b come into contact with second bus bar 244. This ensures electrical continuity between first bus bar 242 and second bus bar 244. In addition, first restricting member 247 and compression coil spring 248 are conductive members, so that electrical continuity between first bus bar 242 and second bus bar 244 is ensured via first restricting member 247 and compression coil spring 248. In addition, since protrusions 242b extend along the first direction, protrusions 242b do not impede movement of first bus bar 242 along the first direction.

[0040] In the above description, an example has been shown in which electrical continuity between first bus bar 242 and second bus bar 244 is ensured by pressing first bus bar 242 against second bus bar 244 using compression coil spring 248, but this is not limiting. Figures 8 to 10 are enlarged perspective views of a contact member according to an embodiment.

[0041] 8 to 10, second bus bar 244 may include a disc spring 249 arranged between first bus bar 242 and second bus bar 244 in the region where first regulating member 247 is arranged, instead of compression coil spring 248. Disc spring 249 biases first bus bar 242 in a direction away from second bus bar 244. In this way, disc spring 249 presses first bus bar 242 against the head of the bolt, which is first regulating member 247.

[0042] Belleville spring 249 is a conductive member, and electrical continuity between first bus bar 242 and second bus bar 244 is ensured via belleville spring 249. First restricting member 247 is also a conductive member, and electrical continuity between first bus bar 242 and second bus bar 244 is ensured via first restricting member 247. Note that a contact surface of belleville spring 249 with first bus bar 242 extends in the first direction, and therefore belleville spring 249 does not hinder movement of first bus bar 242 along the first direction.

[0043] 11 and 12 are schematic perspective views of a position adjustment mechanism according to an embodiment. The plating apparatus 1000 includes a position adjustment mechanism 290 configured to adjust the position of the first bus bar 242 relative to the face plate 230. The position adjustment mechanism 290 is disposed in the fixing module 200. The position adjustment mechanism 290 includes an arm 292 for gripping the first bus bar 242, a first driving member 298 for moving the arm 292 in a first direction, and a second driving member 296 for moving the arm 292 in a second direction (vertical direction) perpendicular to the extension direction of the first bus bar 242 and the first direction. The first driving member 298 and the second driving member 296 can be realized by known mechanisms such as a motor, a cylinder, or the like. 11 shows a state in which arm 292 is not gripping first bus bar 242, and FIG. 12 shows a state in which arm 292 grips first bus bar 242.

[0044] 13 to 18 are enlarged perspective views of a contact member and a position adjustment mechanism according to an embodiment. Fig. 19 is an enlarged perspective view of a contact member according to an embodiment. As shown in Fig. 13, second bus bar 244 has second restricting member 241. Second restricting member 241 is a member for restricting movement of first bus bar 242 in a first direction.

[0045] Specifically, second restricting member 241 has proximal restricting member 241a that restricts movement of first bus bar 242 in a direction approaching central opening 234a when proximal end 247a of first restricting member 247 is in contact with the edge of elongated hole 246 (FIG. 17). Second restricting member 241 also has distal restricting member 241b that restricts movement of first bus bar 242 in a direction away from central opening 234a when distal end 247b of first restricting member 247 is in contact with the edge of elongated hole 246 (FIG. 15).

[0046] Proximal restriction member 241a and distal restriction member 241b are formed of leaf springs. In normal operation when no external force is applied, proximal restriction member 241a and distal restriction member 241b are present on the movement path of first bus bar 242 in the first direction and come into contact with first bus bar 242 to restrict the movement. On the other hand, when an external force is applied and proximal restriction member 241a and distal restriction member 241b are pressed toward second bus bar 244, they are configured to move out of the movement path of first bus bar 242 in the first direction and release the restriction on the movement of first bus bar 242.

[0047] Arm 292 includes a proximal pressing member 293 for pressing proximal restricting member 241a to release the restriction on the movement of first bus bar 242. Arm 292 also includes a distal pressing member 294 for pressing distal restricting member 241b to release the restriction on the movement of first bus bar 242. Arm 292 also includes a gripping portion 295 that fits into gripping hole 242a of first bus bar 242.

[0048] 15 shows a state in which first busbar 242 has moved to a position closest to central opening 234a. In this state, the edge of slot 246 of first busbar 242 comes into contact with distal end 247b of first restricting member 247, and therefore, movement of first busbar 242 in a direction approaching central opening 234a is restricted. On the other hand, in this state, no external force is applied to distal restricting member 241b of second restricting member 241, and distal restricting member 241b is present on the movement path of first busbar 242 in the first direction, and therefore, movement of first busbar 242 in a direction away from central opening 234a is restricted. As a result, first busbar 242 is fixed at a position closest to central opening 234a.

[0049] 16 shows a state in which arm 292 grips first bus bar 242. In this state, distal pressing member 294 of arm 292 presses distal restricting member 241b, thereby releasing the restriction on movement of first bus bar 242 in a direction away from central opening 234a. In addition, gripping portion 295 of arm 292 fits into gripping hole 242a of first bus bar 242. This allows first driving member 298 of position adjustment mechanism 290 to move first bus bar 242 in a direction away from central opening 234a.

[0050] 17 shows a state in which first busbar 242 has moved to a position farthest from central opening 234a. In this state, the edge of slot 246 of first busbar 242 comes into contact with proximal end 247a of first restricting member 247, so that movement of first busbar 242 in a direction away from central opening 234a is restricted. On the other hand, in this state, no external force is applied to proximal restricting member 241a of second restricting member 241, and proximal restricting member 241a is present on the movement path of first busbar 242 in the first direction, so that movement of first busbar 242 in a direction approaching central opening 234a is restricted. As a result, first busbar 242 is fixed at a position farthest from central opening 234a.

[0051] As described above, according to this embodiment, the first bus bar 242 and the power supply contact 243 can be moved relative to the second bus bar 244 (frame member 234) and fixed to multiple positions, thereby realizing a substrate holder 210 that can accommodate various types of substrates with different power supply positions.

[0052] In the above description, an example has been shown in which first bus bar 242 is moved using position adjustment mechanism 290, but the present invention is not limited to this. Figures 20 to 23 are schematic perspective views of a contact member and a position adjustment jig according to an embodiment.

[0053] The position adjustment jig 280 includes a jig body 281 extending along the first bus bar 242, a jig proximal pressing member 285 provided at an end of the jig body 281 in the extension direction, and a jig distal pressing member 284 provided at an end of the jig body 281 in the extension direction. The jig proximal pressing member 285 has a function similar to that of the above-mentioned proximal pressing member 293. That is, the jig proximal pressing member 285 is a member for pressing the proximal restricting member 241a to release the restriction on the movement of the first bus bar 242. The jig distal pressing member 284 has a function similar to that of the above-mentioned distal pressing member 294. That is, the jig distal pressing member 284 is a member for pressing the distal restricting member 241b to release the restriction on the movement of the first bus bar 242.

[0054] 20 and 21, the position adjustment jig 280 includes a first claw member 282 arranged on the side opposite the central opening 234a of the jig body 281. In addition, as shown in Fig. 22, the position adjustment jig 280 includes a second claw member 283 arranged on the side of the jig body 281 opposite the central opening 234a.

[0055] Fig. 20 shows a state before first claw member 282 is fitted into the gap between first bus bar 242 and second bus bar 244. Fig. 21 shows a state after first claw member 282 has been fitted into the gap between first bus bar 242 and second bus bar 244. Fig. 22 shows a state after second claw member 283 has been fitted into the gap between first bus bar 242 and second bus bar 244.

[0056] As shown in FIG. 23, first claw member 282 and second claw member 283 are configured to slightly lift first bus bar 242 from second bus bar 244 when fitted into the gap between first bus bar 242 and second bus bar 244. That is, position adjustment jig 280 of the present embodiment is designed to bias first bus bar 242 toward second bus bar 244 by compression coil spring 248 described above. As shown in FIG. 23, first claw member 282 and second claw member 283 lift first bus bar 242 slightly from second bus bar 244, thereby making it possible to smoothly move first bus bar 242 relative to second bus bar 244. It is noted that first claw member 282 and second claw member 283 do not necessarily have to be provided. In particular, when the disc spring 249 is used instead of the compression coil spring 248, the first claw member 282 and the second claw member 283 do not need to be provided.

[0057] Next, a substrate mounting method will be described. Fig. 24 is a flowchart of the substrate mounting method according to one embodiment. In the substrate mounting method, first, the substrate holder 210 is stored in the fixing module 200 (step S101). At this time, the substrate holder 210 is placed in the fixing module 200 so that the base plate 220 faces down and the face plate 230 faces up.

[0058] Next, the substrate mounting method unlocks the substrate holder 210 using the locking mechanism 270 (step S102). Next, the substrate mounting method lifts the faceplate 230 upward (step S103). Next, the substrate mounting method inserts the arm 292 of the position adjustment mechanism 290 between the baseplate 220 and the faceplate 230 (step S104).

[0059] Next, the substrate mounting method grips the first bus bar 242 using the arm 292 and moves the first bus bar 242 (step S105). For example, in step S105, the first bus bar 242 is moved to a position closest to the central opening 234a or to a position farthest from the central opening 234a according to the specifications of the power supply position of the substrate WF. Next, the substrate mounting method retracts the arm 292 from between the base plate 220 and the face plate 230 (step S106).

[0060] Next, in the substrate mounting method, the substrate WF is placed on the upper surface of the base plate 220 (step S107). Next, in the substrate mounting method, the face plate 230 is lowered to sandwich the substrate WF between the base plate 220 and the face plate 230 (step S108).

[0061] Next, in the substrate mounting method, the substrate holder 210 is locked using the locking mechanism 270 (step S109). As a result, the substrate WF is clamped by the substrate holder 210. Next, in the substrate mounting method, the substrate holder 210 is unloaded from the fixing module 200 (step S110).

[0062] According to the board mounting method of this embodiment, the first bus bar 242 and the power supply contact 243 can be moved relative to the second bus bar 244 (frame member 234) and fixed to multiple positions, making it possible to accommodate various types of boards with different power supply positions.

[0063] Although several embodiments of the present invention have been described above, the above-mentioned embodiments of the present invention are intended to facilitate understanding of the present invention and do not limit the present invention. The present invention may be modified or improved without departing from the spirit thereof, and the present invention naturally includes equivalents thereof. Furthermore, any combination or omission of each component described in the claims and specification is possible within the scope of solving at least a part of the above-mentioned problems or achieving at least a part of the effects.

[0064] The present application discloses, as one embodiment, a substrate holder including: a base plate; a face plate for sandwiching and holding a substrate together with the base plate, the face plate having a central opening and a frame member surrounding the central opening; and a contact member having a first bus bar attached to the frame member so as to be movable relative to the frame member, and a power supply contact attached to the first bus bar.

[0065] Furthermore, as one embodiment, the present application discloses a substrate holder in which the central opening is formed in a rectangular shape, and the contact members are attached to the frame member in a pair on either side of the rectangular central opening, or are attached to the four sides of the frame member so as to surround the rectangular central opening.

[0066] Furthermore, as one embodiment, the present application discloses a substrate holder, wherein the contact member further includes a second bus bar fixed to the frame member, and the first bus bar is attached to the second bus bar so as to be movable relative to the second bus bar.

[0067] Furthermore, the present application discloses, as one embodiment, a substrate holder in which the first bus bar is configured to be movable in a first direction toward and away from the central opening, and the second bus bar has guide members arranged at both ends of the extension direction of the first bus bar, for regulating the movement direction of the first bus bar to the first direction.

[0068] Furthermore, the present application discloses, as one embodiment, a substrate holder, wherein the first busbar has a long hole that is longer in the first direction than the extension direction of the first busbar, and the second busbar has a first regulating member arranged at a position corresponding to the long hole, the first regulating member having a proximal end that contacts the edge of the long hole when the first busbar moves in a direction away from the central opening, and a distal end that contacts the edge of the long hole when the first busbar moves in a direction toward the central opening.

[0069] Furthermore, the present application discloses, as one embodiment, a substrate holder having a second regulating member, wherein the second bus bar has a proximal regulating member that regulates movement of the first bus bar in a direction toward the central opening when the proximal end of the first regulating member is in contact with the edge of the long hole, and a distal regulating member that regulates movement of the first bus bar in a direction away from the central opening when the distal end of the first regulating member is in contact with the edge of the long hole.

[0070] Furthermore, the present application discloses, as one embodiment, a plating apparatus including any of the substrate holders described above and a position adjustment mechanism configured to adjust the position of the first bus bar relative to the face plate.

[0071] Furthermore, as one embodiment, the present application discloses a plating apparatus, wherein the position adjustment mechanism includes an arm for gripping the first bus bar, a first drive member for moving the arm in a first direction toward and away from the central opening, and a second drive member for moving the arm in a second direction perpendicular to the extension direction of the first bus bar and the first direction.

[0072] Furthermore, the present application discloses, as one embodiment, a plating apparatus wherein the arm includes a proximal pressing member for pressing the proximal control member to release the restriction on the movement of the first bus bar, and a distal pressing member for pressing the distal control member to release the restriction on the movement of the first bus bar. [Explanation of symbols]

[0073] 200 Fixing Module 210 Substrate holder 220 Base Plate 230 Faceplate 234 Frame members 234a central opening 240 Contact material 241 Second Regulating Member 241a Proximal restriction member 241b Distal restriction member 242 1st busbar 242a Gripping hole 243 Power supply contact 244 Second busbar 245 Guide member 246 Slot 247 First Regulating Member 247a Proximal end 247b Distal end 250 Inner seal member 260 Outer seal member 270 Locking mechanism 290 Position adjustment mechanism 292 Arm 293 Proximal pressing member 294 Distal pressing member 295 Gripping part 296 Second driving member 298 First driving member 1000 Plating Equipment WF board

Claims

1. A base plate; a face plate for sandwiching and holding a substrate together with the base plate, the face plate having a central opening and a frame member surrounding the central opening; a contact member having a first bus bar attached to the frame member so as to be movable relative to the frame member, and a power supply contact attached to the first bus bar; a substrate holder comprising:

2. The central opening is formed in a rectangular shape, The contact members are attached to the frame member in pairs with the rectangular central opening therebetween, or are attached to the four sides of the frame member so as to surround the rectangular central opening. The substrate holder of claim 1 .

3. The contact member further includes a second bus bar fixed to the frame member, the first bus bar is attached to the second bus bar so as to be movable relative to the second bus bar; The substrate holder of claim 2 .

4. the first bus bar is configured to be movable in a first direction toward and away from the central opening; the second bus bar has guide members disposed on both ends of the first bus bar in an extension direction thereof for restricting a moving direction of the first bus bar to the first direction. The substrate holder of claim 3 .

5. the first bus bar has a slot that is longer in the first direction than the extension direction of the first bus bar; the second bus bar includes a first restricting member disposed at a position corresponding to the long hole, the first restricting member having a proximal end that contacts an edge of the long hole when the first bus bar moves in a direction away from the central opening and a distal end that contacts the edge of the long hole when the first bus bar moves in a direction toward the central opening; The substrate holder of claim 4 .

6. the second bus bar has a second restricting member including a proximal restricting member that restricts movement of the first bus bar in a direction toward the central opening when the proximal end of the first restricting member is in contact with an edge of the elongated hole, and a distal restricting member that restricts movement of the first bus bar in a direction away from the central opening when the distal end of the first restricting member is in contact with an edge of the elongated hole. The substrate holder of claim 5 .

7. A substrate holder according to any one of claims 1 to 6, a position adjustment mechanism configured to adjust a position of the first bus bar relative to the face plate; 13. A plating apparatus comprising:

8. the position adjustment mechanism includes an arm for gripping the first bus bar, a first drive member for moving the arm in a first direction toward and away from the central opening, and a second drive member for moving the arm in a second direction perpendicular to an extension direction of the first bus bar and the first direction; Including, 8. The plating apparatus according to claim 7.

9. A substrate holder according to claim 6; a position adjustment mechanism configured to adjust a position of the first bus bar relative to the face plate; Including, the position adjustment mechanism includes an arm for gripping the first bus bar, a first drive member for moving the arm in a first direction toward and away from the central opening, and a second drive member for moving the arm in a second direction perpendicular to an extension direction of the first bus bar and the first direction; Including, the arm includes a proximal pressing member for pressing the proximal restricting member to release the restriction on movement of the first bus bar, and a distal pressing member for pressing the distal restricting member to release the restriction on movement of the first bus bar. Plating equipment.