Filter packaging structure and method for manufacturing the structure

Abstract

The present invention provides a method for manufacturing a filter packaging structure comprising: providing a carrier having a loop structure formed on its surface, the loop structure comprising a loop attached to the surface of the carrier and a support wall on the loop; providing a substrate having a resonance structure formed on its surface, the resonance structure comprising a resonator and electrodes on opposite sides of the resonator, wherein each electrode has a first portion adjacent to the resonator and a second portion further from the resonator; joining the carrier and the substrate together such that the support wall is coupled to the first portions of the electrodes and the substrate, the support wall, and the loop together surround a cavity necessary for the operation of the resonator; removing the carrier so that the second portions of the electrodes are exposed; and forming conductive structures on the second portions of the electrodes. This avoids the formation of a cavity by laminating a film on the support wall and allows the filter packaging structure to have high reliability and reduced thickness. The present invention also provides a filter packaging structure.

Description

Technology Field

[0001] The present invention relates to the field of packaging technology, and more specifically, to a filter packaging structure and a method for manufacturing the same. Background Technology

[0002] As a critical component of the radio frequency (RF) front-end, surface acoustic wave (SAW) filters operate based on the propagation of acoustic waves along the surface of the associated chip. Accordingly, the packaging of the SAW filter is required to ensure that the surface of the internal interdigital transducer (IDT) does not come into contact with anything else. In other words, sufficient space must be provided for the operation of the IDT.

[0003] Traditionally, primary packaging is first performed on a SAW filter chip to form the cavity necessary for the operation of the IDT, which can be achieved by chip-size packaging (CSP), wafer-level packaging (WLP), or other packaging technologies. Subsequently, secondary packaging is further performed on the packaging structure obtained from the primary packaging to integrate the packaging structure into a module. A conventional method for primary packaging includes the following steps: forming a support wall on the surface of a substrate on which the IDT is formed; laminating a film as a roof over the support wall to form the cavity necessary for the operation of the IDT; and forming solder pads on the roof and forming bumps on the solder pads for external connection of electrodes adjacent to the IDT.

[0004] However, in the conventional method for primary packaging described above, the loops laminated on the support walls tend to lack flatness, uniformity, and adhesive strength. Consequently, in the secondary packaging process where increased pressure is applied, the cavity formed in the packaging structure of the primary packaging is prone to deformation, and under the action of higher pressure, the loops are prone to delamination or, in severe cases, even sinking into the cavity. This affects IDT operation and leads to poor reliability of the packaging structure. Furthermore, in the conventional method, since the external connection of the electrodes is achieved by solder pads formed on the loops and bumps formed on the solder pads, the resulting packaging structure has an undesirable large thickness.

[0005] The object of the present invention is to provide a filter packaging structure having reduced thickness and higher reliability, and a method for manufacturing such a filter packaging structure.

[0006] To achieve this objective, in one aspect of the present invention, a method for manufacturing a filter packaging structure comprising: providing a carrier having a loop structure formed on its surface, the loop structure comprising a loop attached to the surface of the carrier and a support wall on the loop; providing a substrate having a resonance structure formed on its surface, the resonance structure comprising a resonator and electrodes on opposite sides of the resonator, wherein each electrode has a first portion adjacent to the resonator and a second portion further from the resonator; joining together the carrier having the loop structure formed on its surface and the support wall having the resonance structure formed on its surface such that the support wall is coupled to the first portions of the electrodes and the substrate, the support wall, and the loop together surround a cavity necessary for the operation of the resonator; removing the carrier so that a second portion of the electrodes extending beyond the side of the loop structure is exposed; and forming conductive structures on the second portions of the electrodes protruding beyond the surface of the loop further from the resonance structure.

[0007] Optionally, the step of providing a carrier having a loop structure formed on its surface may include: providing a carrier; forming a first material layer on the surface of the carrier; performing a patterning treatment on the first material layer to form a loop; forming a second material layer covering the loop on the surface of the carrier; and performing a patterning treatment on the second material layer to form a support wall.

[0008] Optionally, the loop and the support wall may each be made of a material containing a photoresist material, and the step of performing a patterning treatment on the first material layer and the step of performing a patterning treatment on the second material layer each include an exposure and a development process.

[0009] Optionally, a circuit pattern may be formed on the loop after the first material layer is patterned to form the loop and before the second material layer is formed on the surface of the carrier.

[0010] Optionally, prior to the formation of a first material layer on the surface of the carrier, an inorganic material layer may be formed on the surface of the carrier and patterned to form a reinforcement layer, and a loop is located on the reinforcement layer.

[0011] Optionally, the resonant body may be an interdigital transducer (IDT), and the step of providing a substrate having a resonant structure formed on its surface comprises: providing a substrate; forming a metal material layer on the surface of the substrate; and performing a patterning process on the metal material layer to form an IDT and electrodes attached to the surface of the substrate.

[0012] Optionally, the step of forming conductive structures on the second portions of the electrodes may include: forming conductive posts on the second portions of the electrodes; and forming bumps at the ends of the conductive posts far from the electrodes, extending beyond the surface of the loop far from the resonant structure.

[0013] In another aspect of the present invention, a filter packaging structure comprising a substrate, a resonant structure, a loop structure, and conductive structures is provided. A resonant structure is formed on the surface of a substrate and comprises a resonant body and electrodes on the opposite sides of the resonant body, each electrode having a first portion adjacent to the resonant body and a second portion further from the resonant body. A loop structure comprises a loop and a support wall on the loop. The support wall is coupled to the first portions of the electrodes, and the second portions of the electrodes extend beyond the side of the loop structure. The support wall, the loop, and the substrate together surround a cavity necessary for the operation of the resonant body. Conductive structures are arranged on the second portions of each of the electrodes and protrude beyond the surface of the loop further from the resonant structure.

[0014] Optionally, the resonator may be an interdigital transducer (IDT), and electrodes are located on opposite sides of the IDT.

[0015] Optionally, the support wall can surround the resonator.

[0016] Optionally, a circuit pattern can be formed on a surface adjacent to the resonator where the loop is.

[0017] Optionally, the loop structure may further include a reinforcing layer attached to the surface of the loop far from the resonant structure.

[0018] Optionally, each of the conductive structures may include a conductive post and a bump, one end of the conductive post is attached to a second part of one of the electrodes, a bump is provided at the other end of the conductive post far from each electrode, and the bump protrudes beyond the surface of the loop far from the resonant structure.

[0019] Optionally, the support wall and the loop can each be made of photoresist material.

[0020] The present invention provides a filter packaging structure and a method for manufacturing said structure, wherein a loop structure can be manufactured on a carrier in advance and can be coupled to a substrate having a resonant structure formed on its surface by coupling a support wall to the electrodes of the resonant structure, which results in the formation of a cavity necessary for the operation of the resonator. This avoids the formation of a cavity by laminating a film on the support wall, avoids problems such as the cavity being prone to deformation and the loop being prone to delamination due to poor flatness, uniformity, and adhesive strength of the laminated film, and improves the reliability of the resulting filter packaging structure. Furthermore, compared to forming a cavity using a cap wafer, this involves a low-cost process that reduces process control complexity and allows the resulting packaging structure to have a smaller thickness. According to the present invention, a support wall is coupled to a first portion of the electrodes, and a second portion of the electrodes extending beyond the side of the loop structure is left. Therefore, after the loop structure is bonded to the substrate, conductive structures can be formed directly on the second portions of the electrodes without perforation, which involves a simple process. Furthermore, compared to forming bumps and solder pads on the loop, forming conductive structures directly on the second portions of the electrodes makes it easier to control the height of the conductive structures protruding beyond the loop, contributing to a reduced thickness of the resulting filter packaging structure. Brief explanation of the drawing

[0021] FIG. 1 shows a flowchart of a method for manufacturing a filter packaging structure according to one embodiment of the present invention. FIGS. 2 to 10 show schematic diagrams illustrating steps in a method for manufacturing a filter packaging structure according to one embodiment of the present invention. FIG. 11 shows a schematic cross-sectional view of a filter packaging structure according to one embodiment of the present invention. FIG. 12 shows a schematic cross-sectional view of a filter packaging structure according to another embodiment of the present invention. In these drawings, 101 means carrier; 102, adhesive layer; 103a, first material layer; 103, loop; 104, circuit pattern; 105, support wall; 106, reinforcing layer; 201 substrate; 202 resonator; 203 electrode; 203a second part of the electrode; 301 cavity; 302 conductive post; and 303 bump. Specific details for implementing the invention

[0022] The present invention will be described in more detail below with reference to the accompanying drawings illustrating specific embodiments of the invention. From the following description, the advantages and features of the invention will become clearer. Note that the drawings are not necessarily drawn to an accurate scale and are provided in a highly simplified form merely to facilitate an easy and clear description of the embodiments disclosed herein.

[0023] The present invention aims to provide a filter packaging structure having reduced thickness and higher reliability, and a method for manufacturing such a filter packaging structure.

[0024] FIG. 1 shows a flowchart of a method for manufacturing a filter packaging structure according to an embodiment of the present invention. As shown in FIG. 1, a method for manufacturing a filter packaging structure according to an embodiment of the present invention comprises the following steps:

[0025] S1) A step of providing a carrier having a loop structure formed on its surface, the loop including a loop attached to the surface of the carrier and a support wall on the loop;

[0026] S2) providing a substrate having a resonance structure formed on a surface, comprising electrodes on opposite sides of a resonance body, wherein each electrode has a first portion adjacent to the resonance body and a second portion further from the resonance body;

[0027] S3) A step of coupling a carrier and a substrate such that a support wall is coupled to the first portions of the electrodes, and the substrate, support wall, and loop together surround a cavity necessary for the operation of the resonator;

[0028] S4) A step of removing a carrier so that second portions of electrodes extending beyond the side of the loop structure are exposed; and

[0029] S5) A step of forming conductive structures on the second portions of the electrodes that protrude beyond the surface of the loop far from the resonant structure.

[0030] Although the steps in the flowchart of FIG. 1 may appear to be in a sequential order as indicated by the arrows, it should be understood that they are not necessarily performed in such an order. Unless otherwise specified in this specification, these steps are not strictly limited to being performed in any particular order and may be performed in any other appropriate order than shown in the diagram. Furthermore, at least some of the steps in the flowchart of FIG. 1 may include a number of sub-steps or phases, which are not necessarily performed simultaneously but may be performed at different times. Also, these sub-steps or phases are not necessarily performed in any particular order. Rather, they may be performed alternately with at least some of the other steps or sub-steps or phases.

[0031] FIGS. 2 through 10 show schematic diagrams illustrating steps in a method for manufacturing a filter packaging structure according to an embodiment of the present invention. FIG. 11 shows a schematic cross-sectional view of a filter packaging structure according to an embodiment of the present invention. A method for manufacturing a filter packaging structure according to an embodiment of the present invention will be described below with reference to FIGS. 1 through 11.

[0032] In step S1, a carrier (101) having a loop structure formed on its surface is provided, as shown in FIGS. 2 to 5. The loop structure includes a loop (103) attached to the surface of the carrier (101) and a support wall (105) on the loop (103).

[0033] Specifically, as shown in FIG. 2, a carrier (101) may be provided, and the carrier (101) is a rigid carrier, such as a wafer or a glass plate. An adhesive layer (102) may be applied to the surface of the carrier (101) to facilitate the attachment of a loop structure to the carrier (101) and its subsequent separation from the carrier (101). In this embodiment, the carrier (101) can be repeatedly recycled and reused, resulting in cost savings.

[0034] For example, if the adhesive layer (102) is designed to be separated from the carrier (101) and the loop (103) using a laser beam, it is preferable that the carrier (101) be selected as a transparent carrier, such as a glass plate. The adhesive layer (102) may be applied by pressing, adhesive bonding, spin coating, or other methods.

[0035] As shown in FIG. 3, a first material layer (103a) can be formed on the surface of a carrier (101), and the first material layer (103a) covers the carrier (101) and the adhesive layer (102).

[0036] As a non-limiting example, materials suitable for the first material layer (103a) may include photoresist materials such as polyimide (PI), benzocyclobutene (BCB), and other polymers. Such photoresist materials may be provided in the form of a dry film or as a liquid and may be cured into the first material layer (103a) after being coated on the carrier (101).

[0037] As shown in FIG. 4, the first material layer (103a) may be patterned to form a loop (103). For example, if the first material layer (103a) is a photoresist material, performing the patterning process on the first material layer (103a) may involve exposure and development processes. This allows the loop (103) to be formed with high dimensional accuracy using a simple process. In an alternative embodiment, after the first material layer (103a) is formed, a patterned mask layer may be formed, and the first material layer (103a) may then be etched while being protected by the patterned mask layer to obtain the loop (103).

[0038] As shown in FIG. 4, a first material layer (103a) on a carrier (101) can be patterned to form one or more loops (103).

[0039] After the loop (103) is formed on the carrier (101), a circuit pattern (104) can be formed on the loop (103), as shown in FIG. 4. Without limitation, the circuit pattern (104) may include an inductor.

[0040] As shown in FIG. 5, a second material layer can be formed on the surface of the carrier (101), and the second material layer is patterned to cover the loop (103) and subsequently form a support wall (105).

[0041] As a non-limiting example, materials suitable for the second material layer may include photoresist materials such as PI, BCB, and other polymers. Such photoresist materials may be provided in the form of a dry film or as a liquid and may be cured into the second material layer after being coated on the carrier (101).

[0042] For example, if the second material layer is a photoresist material, performing a patterning treatment on the second material layer may involve an exposure and development process. This allows the support wall (105) to be formed using a simple process that does not involve etching, which could potentially cause damage to the loop (103). In an alternative embodiment, after the second material layer is formed, a patterned mask layer is formed, and then the second material layer may be etched while being protected by the patterned mask layer to obtain the support wall (105).

[0043] In this embodiment, the support wall (105) is made of the same material as the loop (103). This avoids the distinct difference in the coefficient of thermal expansion (CTE) between the two that could occur if they were made of different materials, thereby contributing to increased reliability of the product being manufactured.

[0044] Referring to FIG. 5, the support wall (105) surrounds the circuit pattern (104), and the support wall (105) may have a greater thickness than that of the circuit pattern (104). For example, the support wall (105) may be an annular wall surrounding the circuit pattern (104). Due to this arrangement, the circuit pattern (104) may be located within a recess defined by the loop (103) and the support wall (105). This contributes to enhanced protection for the circuit pattern (104).

[0045] Referring to FIG. 5, the outer edges of the support wall (105) can be aligned with the edges of the loop (103) without limitation.

[0046] In step S2, as shown in FIG. 6, a substrate (201) having a resonant structure formed on its surface is provided. The resonant structure includes a resonant body (202) and electrodes (203) on opposite sides of the resonant body (202), and each electrode has a first portion adjacent to the resonant body (202) and a second portion further from the resonant body (202).

[0047] In this embodiment, the resonator (202) may be an interdigital transducer (IDT). As an example, when the resonator (202) is implemented as an IDT, providing a substrate (201) having a resonant structure formed on its surface may include the following steps: providing the substrate (201); forming a metal material layer on the surface of the substrate (201); and performing a patterning process on the metal material layer to form electrodes (203) and an IDT on the surface of the substrate (201).

[0048] In this embodiment, the IDT and electrodes (203) may be formed in a single process and have the same thickness. In alternative embodiments, if necessary, the IDT and electrodes (203) may be formed in separate processes and / or have different thicknesses.

[0049] For example, the electrodes (203) and IDT may be made of copper, nickel-palladium-gold, nickel-gold, aluminum, or other metallic materials. Without limitation, the electrodes (203) and IDT may have a thickness of 1 μm to 5 μm.

[0050] The substrate (201) may be a piezoelectric substrate. Suitable materials for the piezoelectric substrate may include aluminum nitride (AlN), quartz, lithium niobate, and lithium tantalite.

[0051] Referring to FIG. 6, a plurality of resonators (202) may be formed on a substrate (201), and each resonator is provided with electrodes (203) formed on opposite sides of the resonator (202).

[0052] It should be noted that in this embodiment, step S1 precedes step S2, but the present invention is not limited thereto. In alternative embodiments, step S2 may precede step S1, or the two steps may occur in parallel.

[0053] In step S3, referring to FIG. 7, a carrier (101) having a loop structure formed on its surface and a substrate (201) having a resonant structure formed on its surface are oriented so that the surface of the carrier (101) having the loop structure and the surface of the substrate (201) having the resonant structure are facing each other and joined together. As a result, a support wall (105) is joined to the first portions of the electrodes (203), and the substrate (201), the support wall (105), and the loop (103) together surround a cavity (301) necessary for the operation of the resonant body (202), which is now located within a recess defined by the loop (103) and the support wall (105).

[0054] In this embodiment, the coupling of the carrier (101) and the substrate (201) depends on the coupling of the support wall (105) and the electrodes (203), which occurs at the end face of the support wall (105) and the first portions of the electrodes (203), and the second portions (203a) of the electrodes are left.

[0055] In this embodiment, the bonding of the carrier (101) and the substrate (201) can be achieved by hot press bonding so that the photoresist material within the support wall (105) adheres to the surfaces of the electrodes (203). In alternative embodiments, the bonding of the carrier (101) having a loop structure formed on its surface and the substrate (201) having a resonant structure formed on its surface can be achieved by any other suitable bonding method known in the art.

[0056] In step S4, referring to FIGS. 7 and FIGS. 8, the carrier (101) and the adhesive layer (102) are removed so that the second portions (203a) of the electrodes extending beyond the side of the loop structure are exposed.

[0057] Since the loop (103) is attached to the adhesive layer (102) applied to the surface of the carrier (101), the loop (103) can be easily detached from the carrier (101) while removing the carrier using a simple process that does not involve etching.

[0058] In step S5, as shown in FIGS. 9 and 10, conductive structures are formed on the second portions (203a) of the electrodes and protrude beyond the surface of the loop (103) far from the resonant structure.

[0059] Specifically, each conductive structure includes a conductive post (302) and a bump (303). One end of the conductive post (302) is attached to a second portion of the corresponding electrode (203), and the bump (303) is located at the other end of the conductive post (302) and protrudes beyond the surface of the loop (103) away from the resonant structure.

[0060] The formation of conductive structures on the second portions of the electrodes (203) may include: forming conductive posts (302) on the second portions of the electrodes (203) along the side walls of the support wall (105) and the loop (103), optionally by electroplating or other techniques, as shown in FIG. 9; and forming bumps (303) protruding beyond the surface of the loop (103) far from the resonant structure on the other ends of the conductive posts (302) far from the electrodes (203), as shown in FIG. 10.

[0061] In this embodiment, as shown in FIGS. 8 and 9, since the outer edge of the support wall (105) is aligned with the edge of the loop (103), the side walls of the support wall (105) and the loop (103) that define the spaces for forming the conductive posts together form continuous and straight walls of the spaces, which allows for good quality of the conductive posts (302) formed on the second portions of the electrodes (203) to fill the spaces. This contributes to the stable electrical conductivity characteristics of the conductive posts (302).

[0062] As a non-limiting example, the end faces of the conductive posts (302) far from the electrodes (203) are parallel to the surface of the loop (103) far from the electrodes (203). Suitable materials for the conductive posts (302) may include copper, nickel, tin-silver, and other metallic materials. Without limitation, bumps (303) are formed on the end faces of the conductive posts (302) far from the electrodes (203) by the placement of solder balls and subsequent reflow soldering.

[0063] Next, referring to FIGS. 10 and FIGS. 11, when a plurality of packaging structures are manufactured, the substrate (201) is diced to obtain individual packaged dies.

[0064] According to an alternative embodiment disclosed herein, in step S1, before the first material layer (103a) is formed on the surface of the carrier (101), an inorganic material layer is formed on the surface of the carrier (101) and then patterned to form a reinforcing layer (106), as shown in FIG. 12. In this case, a loop (103) may subsequently be formed on the reinforcing layer (106). The reinforcing layer (106) is formed to increase the resistance of the loop (103) to pressure, thereby improving the reliability of the resulting filter packaging structure. The inorganic material layer on which the reinforcing layer (106) is manufactured may be, for example, a silicon oxide (SiO2) or silicon nitride (Si3N4) layer.

[0065] Embodiments of the present invention also provide a filter packaging structure that can be obtained according to the method discussed above. The filter packaging structure may be obtained as a packaging structure that has not yet been diced, or as an individual packaged die obtained from singulation by dicing.

[0066] Referring to FIG. 11, the filter packaging structure comprises a substrate (201), a resonant structure, a loop structure, and a conductive structure. A resonant structure is formed on the surface of the substrate (201), and the resonant structure comprises a resonant body (202) and electrodes (203) on opposite sides of the resonant body (202), each electrode having a first portion adjacent to the resonant body (202) and a second portion further from the resonant body (202). A loop structure comprises a loop (103) and a support wall (105) on the loop (103). The support wall (105) is coupled to the first portions of the electrodes (203), and the second portions of the electrodes (203) extend beyond the side of the loop structure. The substrate (201), the support wall (105), and the loop (103) together surround a cavity (301) necessary for the operation of the resonant body (202). The conductive structures are located in the second portions of the electrodes (203) and protrude beyond the surface of the loop (103) far from the resonant structure.

[0067] As an example, the filter packaging structure of the present embodiment may be a surface acoustic wave (SAW) filter packaging structure. In this case, the resonator (202) may be an interdigital transducer (IDT), and the electrodes (203) are accordingly located on opposite sides of the IDT. In an alternative embodiment, the filter packaging structure may be another filter that relies on a cavity to deliver its filtering function, such as a bulk acoustic wave (BAW) filter packaging structure.

[0068] For example, the electrodes (203) may be made of a metallic material such as copper, nickel-palladium-gold, nickel-gold, or aluminum, and may have a thickness of 1 μm to 5 μm. Without limitation, the resonator (202) may be made of the same material as the electrodes (203) and may have the same thickness. Alternatively, the thickness of the resonator (202) may be different from the thickness of the electrodes (203).

[0069] Referring to FIG. 11, the loop structure and the substrate (201) can be combined as a result of the combination of the support wall (105) and the electrodes (203). The support wall (105) may be a ring-shaped wall surrounding the resonator (202).

[0070] For example, both the support wall (105) and the loop (103) can be made of photoresist material. In this case, the support wall (105) and the loop (103) can be obtained using an exposure and development process. This allows for obtaining high structural accuracy using a simple process.

[0071] In this embodiment, a loop structure may be manufactured on a carrier in advance, the loop (103) may be attached to the carrier, and a support wall (105) may be stacked on the loop (103). This avoids the formation of a cavity by laminating a film on the support wall, and avoids the problem of the cavity being prone to deformation and the loop being prone to peeling due to poor flatness, uniformity, and adhesive strength of the laminated film. Thus, improved reliability can be obtained.

[0072] Referring to FIG. 11, a circuit pattern (104) is formed on the surface of a loop (103) adjacent to a resonator (202). This circuit pattern (104) may be formed before the loop structure is coupled to the substrate (201). This allows the circuit pattern (104) to be integrated on the inner surface of the loop (103) adjacent to the cavity (301), increasing the integration density of the filter packaging structure and diversifying the functions of the filter. Additionally, the circuit pattern (104) can be formed more easily without considering the pressure resistance of the cavity (301). Furthermore, the cavity (301) may provide protection for the circuit pattern (104). Suitable materials for the circuit pattern (104) may include, for example, copper and aluminum. Without limitation, the circuit pattern (104) may include an inductor.

[0073] For example, each conductive structure may include a conductive post (302) and a bump (303). One end of the conductive post (302) is attached to a second portion of the corresponding electrode (203), and the bump (303) is located at the other end of the conductive post (302) away from the electrode (203) and protrudes beyond the surface of the loop (103) away from the resonant structure. Suitable materials for the conductive posts (302) may include copper, nickel, tin-silver, and other metallic materials. Without limitation, the bumps (303) may be made of tin.

[0074] According to alternative embodiments disclosed herein, as shown in FIG. 12, the loop structure may further include a reinforcing layer (106) attached to the surface of the loop (103) far from the resonant structure. The reinforcing layer (106) is included to increase the resistance of the loop (103) to pressure, thereby improving the reliability of the filter packaging structure. As an example, the reinforcing layer (106) is made from an inorganic material layer such as silicon oxide (SiO2) or silicon nitride (Si3N4).

[0075] The present invention provides a filter packaging structure and a method for manufacturing said structure, wherein a loop structure can be manufactured on a carrier in advance and can be coupled to a substrate (201) on which a resonant structure is formed on its surface by coupling a support wall (105) to the electrodes (203) of the resonant structure, which results in the formation of a cavity necessary for the operation of the resonator (202). This avoids the formation of a cavity by laminating a film on the support wall, avoids problems such as the cavity being prone to deformation and the loop being prone to delamination due to poor flatness, uniformity, and adhesive strength of the laminated film, and improves the reliability of the resulting filter packaging structure. Furthermore, compared to forming a cavity using a cap wafer, this involves a low-cost process that reduces process control complexity and allows the resulting packaging structure to have a smaller thickness. According to the present invention, the support wall (105) is coupled to first portions of the electrodes (203), and second portions of the electrodes extending beyond the side of the loop structure are left. Accordingly, after the loop structure is bonded to the substrate (201), conductive structures can be formed directly on the second portions of the electrodes (203) without perforation, which involves a simple process. Additionally, compared to forming bumps and solder pads on the loop, forming the conductive structures directly on the second portions of the electrodes (203) makes it easier to control the height of the conductive structures protruding beyond the loop, thereby contributing to a reduced thickness of the resulting filter packaging structure.

[0076] It should be noted that the embodiments disclosed in this specification are described in a progressive manner, and the description of each embodiment focuses on the differences from other embodiments. Common or similar features among the embodiments are referenced to each other.

[0077] Although the present invention has been described above with reference to various preferred embodiments, it is not intended to be limited to these embodiments in any way. In light of the teachings above in this specification, those skilled in the art may make various possible variations and modifications to the disclosed embodiments without departing from the essence or scope of the invention. Accordingly, any and all such simple variations, equivalent alternatives, and modifications made to the aforementioned embodiments without departing from the scope of the invention are intended to fall within the scope of the invention.

Claims

Claim 1 A method for manufacturing a filter packaging structure comprises the steps of: providing a carrier having a roof structure formed on a surface, wherein the roof structure comprises a roof attached to the surface of the carrier and a support wall on the roof; providing a substrate having a resonant structure formed on a surface, wherein the resonant structure comprises a resonant body and electrodes on opposite sides of the resonant body, each electrode having a first portion adjacent to the resonant body and a second portion further from the resonant body; bonding the carrier having the roof structure formed on a surface and the substrate having the resonant structure formed on a surface to each other such that the support wall is bonded to the first portions of the electrodes and the substrate, the support wall, and the roof together surround a cavity necessary for the operation of the resonant body; and removing the carrier so as to expose the second portions of the electrodes extending beyond the side of the roof structure. A method for manufacturing a filter packaging structure, comprising the step of forming conductive structures protruding beyond the surface of the loop far from the resonant structure on the second portions of the electrodes. Claim 2 A method for manufacturing a filter packaging structure according to claim 1, wherein the step of providing the carrier having the loop structure formed on its surface comprises: providing the carrier; forming a first material layer on the surface of the carrier; performing a patterning treatment on the first material layer to form the loop; forming a second material layer covering the loop on the surface of the carrier; and performing a patterning treatment on the second material layer to form the support wall. Claim 3 A method for manufacturing a filter packaging structure according to claim 2, wherein each of the loop and the support wall is made of a material including a photoresist material, and each of the steps of performing a patterning treatment on the first material layer and performing a patterning treatment on the second material layer includes an exposure and a development process. Claim 4 A method for manufacturing a filter packaging structure according to claim 2, wherein a circuit pattern is formed on the loop after the first material layer is patterned to form the loop and before the second material layer is formed on the surface of the carrier. Claim 5 A method for manufacturing a filter packaging structure according to claim 2, wherein, prior to the first material layer being formed on the surface of the carrier, an inorganic material layer is formed on the surface of the carrier and patterned to form a reinforcement layer, and the loop is located on the reinforcement layer. Claim 6 A method for manufacturing a filter packaging structure according to claim 1, wherein the resonant body is an interdigital transducer (IDT), and the step of providing a substrate having the resonant structure formed on its surface comprises: providing the substrate; forming a metal material layer on the surface of the substrate; and performing a patterning treatment on the metal material layer to form the IDT and the electrodes attached to the surface of the substrate. Claim 7 A method for manufacturing a filter packaging structure according to claim 1, wherein the step of forming the conductive structures on the second portions of the electrodes comprises: forming conductive posts on the second portions of the electrodes; and forming bumps at the ends of the conductive posts far from the electrodes, extending beyond the surface of the loop far from the resonant structure. Claim 8 A method for manufacturing a filter packaging structure, wherein, in paragraph 2, the first material layer is patterned to form a plurality of loops on the carrier. Claim 9 A method for manufacturing a filter packaging structure according to claim 4, wherein the support wall is an annular wall, the annular wall surrounds the circuit pattern, and the circuit pattern is located within a recess defined by the loop and the support wall. Claim 10 A method for manufacturing a filter packaging structure according to claim 6, wherein the IDT and the electrodes are formed in a single process and the IDT and the electrodes have the same thickness. Claim 11 A filter packaging structure comprising a substrate, a resonant structure, a loop structure, and conductive structures, wherein the resonant structure is formed on the surface of the substrate and comprises a resonant body and electrodes on opposite sides of the resonant body, each electrode having a first portion adjacent to the resonant body and a second portion further from the resonant body, the loop structure comprising a loop and a support wall on the loop, wherein the support wall is coupled to the first portions of the electrodes and the second portions of the electrodes extend beyond the side of the loop structure, the support wall and the loop together with the substrate surround a cavity necessary for the operation of the resonant body, and the conductive structures are arranged on the second portions of each of the electrodes and protrude beyond the surface of the loop further from the resonant structure. Claim 12 In claim 11, the resonator is an interdigital transducer (IDT), and the electrodes are located on opposite sides of the IDT, forming a filter packaging structure. Claim 13 In claim 11, the support wall is a filter packaging structure surrounding the resonator. Claim 14 In claim 11, the loop is a filter packaging structure having a circuit pattern formed on a surface adjacent to the resonator. Claim 15 In claim 11, the loop structure further comprises a reinforcing layer—the reinforcing layer being attached to the surface of the loop further from the resonance structure—a filter packaging structure. Claim 16 A filter packaging structure according to claim 11, wherein each of the conductive structures comprises a conductive post and a bump, one end of the conductive post is attached to the second portion of one of the electrodes, the bump is provided at the other end of the conductive post further from each of the electrodes, and the bump protrudes beyond the surface of the loop further from the resonant structure. Claim 17 In claim 11, a filter packaging structure in which the support wall and the loop, respectively, are each made of a photoresist material. Claim 18 In claim 11, a filter packaging structure in which a plurality of loops are formed on a carrier. Claim 19 A filter packaging structure according to claim 14, wherein the support wall is a ring-shaped wall, the ring-shaped wall surrounds the circuit pattern, and the circuit pattern is located within a recess defined by the loop and the support wall. Claim 20 In claim 12, the above IDT is a filter packaging structure having the same thickness as the electrodes.

Images