Electronic device including antenna

Abstract

According to one embodiment of the present invention, an electronic device may include a display, a rear cover located opposite to the display, a conductive layer for electromagnetic interference (EMI) shielding for the display located between the display and the rear cover and including an opening, and a communication circuit configured to transmit a signal transmitted through the display to the outside or receive from the outside through an antenna formed based on at least a portion of the conductive layer around the opening. Various other embodiments may be possible.

Description

Technology Field

[0001] One embodiment of the present invention relates to an electronic device including an antenna. Background Technology

[0003] Recently, there has been a surge in demand for cost-effective near-field wireless communication. For example, NFC technology is advancing beyond existing tap-to-pay systems and is being developed to be integrated with various applications to provide users with a smarter tagging experience. For example, an electronic device such as a smartphone may include a housing comprising a front and a rear, a display located within the housing and visually exposed through the front, and an NFC antenna emitter located near the rear within the housing. An NFC recognition range is a portion that is close to the external electronic device for seamless NFC between the electronic device and the external electronic device, and may be an area overlapping with the NFC antenna emitter on the rear. When the NFC recognition range of the electronic device is brought close to the NFC recognition range of the external electronic device within a threshold distance (e.g., 100 mm as a maximum recognition distance), the electronic device can exchange data with the external electronic device through the NFC antenna emitter. The problem to be solved

[0005] When bringing an electronic device close to an external electronic device to use the NFC function, users need to be careful to ensure that the side with the NFC recognition area faces the external electronic device. When the electronic device is folded, there may be cumbersome attempts by users to locate the side with the NFC recognition area and face it toward the external electronic device, whether in the unfolded or folded state. For example, if the electronic device is implemented with an out-folding structure where the screen folds outward, the side with the NFC recognition area is not exposed to the outside when the device is in the folded state, so there may be an inconvenience in having to switch the device from the folded state to the unfolded state.

[0006] Various embodiments of the present invention may provide an electronic device including an antenna to satisfy usability (e.g., user experience satisfaction) regarding NFC by having an NFC recognition area on the screen. means of solving the problem

[0008] According to one embodiment of the present invention, an electronic device may include a display, a rear cover located opposite to the display, a conductive layer for EMI (electromagnetic interference) shielding for the display located between the display and the rear cover and including an opening, and a communication circuit configured to transmit a signal through the display to the outside or receive from the outside through an antenna formed based on at least a portion of the conductive layer around the opening. Effects of the invention

[0010] According to one embodiment of the present invention, a loop-type antenna radiator can be implemented that feeds energy toward an opening formed in a conductive layer disposed on a display and radiates energy toward the screen, thereby allowing the NFC recognition area to be located on the screen and thereby resolving the constraints on the NFC recognition area. Furthermore, in a situation where the number of antennas included in electronic devices such as smartphones is continuously increasing as the range of available applications expands, while a slim form factor of electronic devices is being pursued, a loop-type antenna radiator utilizing a conductive layer disposed on a display can contribute to the slimming of electronic devices. An antenna or antenna system implemented as a loop-type antenna radiator utilizing a conductive layer disposed on a display can be utilized in various technologies, such as MST (magnetic secure transmission) which transmits and / or receives magnetic signals instead of NFC, thereby expanding the range of user experience.

[0011] Furthermore, effects that can be obtained or predicted by various embodiments of the present invention will be disclosed directly or implicitly in the detailed description of the embodiments of the present invention. For example, various effects predicted according to various embodiments of the present invention will be disclosed in the detailed description to be set forth below. Brief explanation of the drawing

[0013] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present invention. FIG. 2a is a front perspective view of a mobile electronic device according to one embodiment. FIG. 2b is a perspective view of the rear of the electronic device of FIG. 2a according to one embodiment. FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to one embodiment. FIG. 4 is a cross-sectional view of the line A-A' of the electronic device of FIG. 2a according to one embodiment. FIG. 5 is a circuit diagram relating to an antenna device according to one embodiment. FIG. 6 is a block diagram of an electronic device according to one embodiment. FIG. 7 illustrates the operation flow of the electronic device of FIG. 6 according to one embodiment. FIGS. 8a and 8b are reference drawings regarding the operation flow of FIG. 7 according to one embodiment. FIG. 9 is a block diagram of an antenna device according to various embodiments. FIG. 10 is a block diagram of an antenna device according to various embodiments. FIG. 11 illustrates an unfolded state of an electronic device according to another embodiment. FIG. 12 illustrates a folded state of the electronic device of FIG. 11 according to another embodiment. FIG. 13 is an unfolded perspective view of the electronic device of FIG. 11 or 12 according to one embodiment. FIG. 14a is a cross-sectional view of the electronic device of FIG. 11 according to one embodiment when it is in an unfolded state. FIG. 14b is a cross-sectional view of the electronic device of FIG. 12 according to one embodiment when it is in a folded state. FIG. 15 is a block diagram relating to the electronic device of FIG. 14a or 14b according to various embodiments. FIG. 16 illustrates the operation flow of the electronic device of FIG. 15 according to one embodiment. FIGS. 17a and 17b are reference drawings regarding the operation flow of FIG. 16. FIG. 18a is a cross-sectional view of an electronic device of an out-folding structure according to various embodiments when it is in an unfolded state. FIG. 18b is a cross-sectional view of the electronic device of FIG. 18a when it is in a folded state according to various embodiments. FIG. 19 is a cross-sectional view of an electronic device of a folding structure according to various embodiments when it is in an unfolded state. FIG. 20 is a cross-sectional view of the electronic device of FIG. 19 according to one embodiment when it is in a folded state. FIG. 21 is a block diagram relating to an electronic device when the electronic device of FIG. 19 is implemented as an out-folding structure according to various embodiments. FIG. 22 illustrates the operation flow of the electronic device of FIG. 21 according to one embodiment. FIGS. 23a and 23b are reference drawings relating to the operation flow of FIG. 22 according to one embodiment. FIG. 24 is a cross-sectional view of the electronic device of FIG. 19 when it is in a folded state according to another embodiment. FIG. 25 is a cross-sectional view of an electronic device of an in-folding structure when it is in an unfolded state according to various embodiments. FIG. 26 is a cross-sectional view of the electronic device of FIG. 25 according to one embodiment when it is in a folded state. FIG. 27 is a block diagram relating to the electronic device of FIG. 25 according to various embodiments. FIG. 28 illustrates the operation flow of the electronic device of FIG. 27 according to one embodiment. FIGS. 29a and 29b are reference drawings relating to the operation flow of FIG. 28 according to one embodiment. FIG. 30 is a drawing relating to a wearable electronic device according to various embodiments. Specific details for implementing the invention

[0014] Hereinafter, various embodiments of this document are described with reference to the attached drawings.

[0015] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments of the present invention.

[0016] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input device (150), sound output device (155), display device (160), audio module (170), sensor module (176), interface (177), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., display device (160) or camera module (180)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, a sensor module (176) (e.g., fingerprint sensor, iris sensor, or light sensor) can be implemented embedded in a display device (160) (e.g., display).

[0017] The processor (120) can control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., a program (140)), and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can load commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) into volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) and an auxiliary processor (123) (e.g., a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). Additionally or generally, the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0018] The auxiliary processor (123) can control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display device (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)).

[0019] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0020] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0021] The input device (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input device (150) may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus pen).

[0022] The sound output device (155) can output a sound signal to the outside of the electronic device (101). The sound output device (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as multimedia playback or recording playback, and the receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0023] The display device (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display device (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display device (160) may include a touch circuitry configured to detect a touch, or a sensor circuitry configured to measure the intensity of a force generated by a touch (e.g., a pressure sensor).

[0024] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through an input device (150) or output sound through an audio output device (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) that is directly or wirelessly connected to the electronic device (101).

[0025] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, an illuminance sensor, a TSP (touch screen panel) hover sensor, or an ultrasonic sensor.

[0026] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0027] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0028] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that can be perceived by the user through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0029] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0030] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (388) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0031] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0032] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi Direct, or IrDA (infrared data association)) or a second network (199) (e.g., a cellular network, the Internet, or a long-range communication network such as a computer network (e.g., LAN or WAN). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify and authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0033] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module may include a single antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., an RFIC) may be additionally formed as part of the antenna module (197).

[0034] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0035] According to one embodiment, commands or data may be transmitted or received between an electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the electronic devices (102, 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the request may perform at least part of the requested function or service, or additional functions or services related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the above result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, or client-server computing technology may be used.

[0036] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0037] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., first) component is referred to as “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., by wire), wirelessly, or through a third component.

[0038] As used in this document, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0039] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored from the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' merely means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0040] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM It can be distributed online (e.g., downloaded or uploaded) through ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0041] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities. According to various embodiments, one or more of the components or operations described above may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to the integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0042] FIG. 2a is a front perspective view of a mobile electronic device (200) according to one embodiment. FIG. 2b is a rear perspective view of the electronic device (200) of FIG. 2a according to one embodiment.

[0043] According to various embodiments, the electronic device (200) of FIG. 2a may include the electronic device (101) of FIG. 1.

[0044] Referring to FIGS. 2a and 2b, an electronic device (200) according to one embodiment may include a housing (210) comprising a first surface (or front) (210A), a second surface (or rear) (210B), and a side (210C) surrounding the space between the first surface (210A) and the second surface (210B). In other embodiments (not shown), the housing may refer to a structure forming some of the first surface (210A), the second surface (210B), and the side (210C) of FIG. 2a. According to one embodiment, the first surface (210A) may be formed by a front plate (202) (e.g., a glass plate or a polymer plate having various coating layers) in which at least a portion is substantially transparent. The second surface (210B) may be formed by a rear plate (211) that is substantially opaque. The rear plate (211) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (210C) may be formed by a side bezel structure (or "side member") (218) comprising metal and / or polymer, which is combined with the front plate (202) and the rear plate (211). In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0045] According to one embodiment, the electronic device (200) may include at least one of a display (201), audio modules (203, 207, 214), a sensor module (204), camera modules (205, 212, 213), key input devices (217), and connector holes (208, 209). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., key input devices (217)) or additionally include other components (e.g., a fingerprint sensor, or a light-emitting element).

[0046] The display (201) may be exposed, for example, through a significant portion of the front plate (202). In some embodiments, the corners of the display (201) may be formed to be generally identical to the adjacent outer shape of the front plate (202). In other embodiments (not shown), in order to expand the area where the display (201) is exposed, the gap between the outer edge of the display (201) and the outer edge of the front plate (202) may be formed to be generally identical.

[0047] In another embodiment (not shown), a recess or opening may be formed in a part of the screen display area of ​​the display (201), and at least one of an audio module (214), a sensor module (204), and a first camera device (205) may be included that are aligned with said recess or said opening. In another embodiment (not shown), at least one of an audio module (214), a sensor module (204), and a camera module (205) may be included on the back surface of the screen display area of ​​the display (201). In another embodiment (not shown), the display (201) may be combined with or located adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field type stylus pen.

[0048] The audio modules (203, 207, 214) may include a microphone hole (203) and speaker holes (207, 214). A microphone for acquiring external sound may be located inside the microphone hole (203), and in some embodiments, a plurality of microphones may be provided to detect the direction of sound. The speaker holes (207, 214) may include an external speaker hole (207) and a receiver hole (214) for calls. In some embodiments, the speaker holes (207, 214) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without speaker holes (207, 214) (e.g., a piezo speaker).

[0049] The sensor module (204) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204) may include, for example, a proximity sensor that generates a signal regarding the proximity of an external object based on light passing through a portion of the first surface (210A) of the housing (210). According to various embodiments, the sensor module (204) may be various biometric sensors, such as a fingerprint sensor, for detecting biometric information based on light passing through a portion of the first surface (210A). According to various embodiments, the fingerprint sensor may be located on the back surface of the display (201). According to various embodiments (not shown), the sensor module may include an HRM sensor and / or a fingerprint sensor located on the second surface (210B) of the housing (210). The electronic device (200) may further include at least one of an unillustrated sensor module, e.g., a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, an illuminance sensor (e.g., sensor module (204)), a TSP hover sensor, or an ultrasonic sensor.

[0050] The camera modules (205, 212, 213) may include, for example, a first camera device (205), a second camera device (212), and / or a flash (213). The first camera device (205) may generate an image signal based on light passing through a portion of the first surface (210A) of the housing (210). The second camera device (212) and the flash (213) may be located on the second surface (210B) of the housing (210). The camera devices (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light-emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lens) and image sensors may be located on one side of the electronic device (200).

[0051] Key input devices (217) may be located on the side (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the aforementioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In some embodiments, the key input device may include a sensor module (not shown) located on the second side (210B) of the housing (210).

[0052] A light-emitting element (not shown) may be located, for example, on a first surface (210A) of a housing (210). The light-emitting element may, for example, provide state information of an electronic device (200) in the form of light. In another embodiment, the light-emitting element may, for example, provide a light source that is coupled with the operation of a first camera device (205). The light-emitting element may include, for example, an LED, an IR LED, or a xenon lamp.

[0053] The connector holes (208, 209) may include a first connector hole (208) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and a second connector hole (e.g., an earphone jack) (209) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0054] FIG. 3 is an unfolded perspective view of the electronic device (200) of FIG. 2a according to one embodiment.

[0055] Referring to FIG. 3, according to one embodiment, the electronic device (200) may include a side bezel structure (218), a first support member (311) (e.g., a bracket), a front plate (202), a display (201), a conductive layer (430), a first substrate assembly (341), a second substrate assembly (342), a battery (350), a second support member (361), a third support member (362), a third antenna structure (403), or a rear plate (211). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the second support member (361) or the third support member (362)) or additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or 2b, and redundant descriptions are omitted below.

[0056] The first support member (311) may, for example, be located inside the electronic device (200) and connected to the side bezel structure (218), or may be formed integrally with the side bezel structure (218). The first support member (311) may, for example, be formed of a metal material and / or a non-metal (e.g., polymer) material.

[0057] The display (201) may be coupled to one side of the first support member (311), for example, and positioned between the first support member (311) and the front plate (202). The first substrate assembly (341) and the second substrate assembly (342) may be coupled to the other side of the first support member (311), for example, and positioned between the first support member (311) and the rear plate (211).

[0058] According to one embodiment, the first substrate assembly (341) may include a first printed circuit board (PCB) (not shown). A display (201) or a first camera device (205) may be electrically connected to the first printed circuit board through various electrical paths, such as a flexible printed circuit board (FPCB). The first substrate assembly (341) may include various electronic components electrically connected to the first printed circuit board. The electronic components may be located on the first printed circuit board or may be electrically connected to the first printed circuit board through electrical paths, such as cables or an FPCB. The electronic components may include, for example, at least some of the components included in the electronic device (101) of FIG. 1.

[0059] According to various embodiments, the first substrate assembly (341) may include a Main PCB, a slave PCB positioned partially overlapping the Main PCB, and / or an interposer substrate between the Main PCB and the slave PCB, when viewed from above the rear plate (211).

[0060] According to one embodiment, the second substrate assembly (342) may be positioned spaced apart from the first substrate assembly (341) with the battery (350) in between, when viewed from above the front plate (202). The second substrate assembly (342) may include a second printed circuit board electrically connected to the first printed circuit board of the first substrate assembly (341). The second substrate assembly (342) may include various electronic components electrically connected to the second printed circuit board. The electronic components may be located on the second printed circuit board or may be electrically connected to the second printed circuit board through an electrical path such as a cable or FPCB. The electronic components may include, for example, some of the components included in the electronic device (101) of FIG. 1. According to one embodiment, the electronic component may be a USB connector utilizing the first connector hole (208), an earphone jack utilizing the second connector hole (209), a microphone utilizing the microphone hole (203), or a speaker utilizing the speaker hole (207).

[0061] According to one embodiment, the battery (350) may be positioned between the first support member (311) and the rear plate (211) and may be coupled to the first support member (311). The battery (350) is a device for supplying power to at least one component of the electronic device (200) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be positioned substantially coplanar with, for example, the first printed circuit board of the first substrate assembly (341) or the second printed circuit board of the second substrate assembly (342). The battery (350) may be positioned integrally within the electronic device (200) and may be positioned detachably from the electronic device (200).

[0062] According to one embodiment, the second support member (361) may be positioned between the first support member (311) and the rear plate (211) and may be joined to the first support member (311) through a fastening element such as a bolt. At least a portion of the first substrate assembly (341) may be positioned between the first support member (311) and the second support member (361), and the second support member (361) may cover and protect the first substrate assembly (341).

[0063] According to one embodiment, the third support member (362) may be positioned spaced apart from the second support member (361) with the battery (350) in between, when viewed from above the front plate (202). The third support member (362) may be positioned between the first support member (311) and the rear plate (211) and may be coupled to the first support member (311) through a fastening element such as a bolt. At least a portion of the second substrate assembly (342) may be positioned between the first support member (311) and the third support member (362), and the third support member (362) may cover and protect the second substrate assembly (342).

[0064] According to one embodiment, the second support member (361) and / or the third support member (362) may be formed of a metal material and / or a non-metal material (e.g., a polymer). According to various embodiments, the second support member (361) and / or the third support member (362) may be referred to as a rear case.

[0065] According to one embodiment, the third antenna structure (403) may be positioned between the second support member (361) and the rear plate (211). The third antenna structure (403) may be implemented in the form of a film, for example, such as an FPCB. According to one embodiment, the third antenna structure (403) may include a plurality of conductive patterns (381, 382) utilized as loop-type antenna radiators. For example, the plurality of conductive patterns (381, 382) may include planar helical conductive patterns (e.g., planar coils, or pattern coils).

[0066] According to one embodiment, the display (201) may include an opening (2011) formed in at least a portion of an optical sensor (e.g., a first camera device (205) or a biosensor) located inside the electronic device (200). The opening (2011) may be formed in the shape of a notch, for example. According to some embodiments, the opening (2011) may be implemented in the shape of a through hole. The first support member (311) may include an opening (3111) located corresponding to the opening (2011) of the display (201). The optical sensor may receive external light through the opening (2011) of the display (201), the opening (3111) of the first support member (311), and a portion of the front plate (202) aligned therewith. According to various embodiments (not shown), the opening (2011) of the display (201) may be replaced by a substantially transparent area formed by a change in the pixel structure and / or wiring structure.

[0067] According to one embodiment, the rear plate (211) may include an opening (2112) for positioning a second camera device (212) (see FIG. 2b) and a flash (213) (see FIG. 2b) included in the first substrate assembly (341) to be exposed to the rear (210B).

[0068] According to one embodiment, the first conductive pattern (381) of the third antenna structure (403) may be extended from a first end (381a) to a second end (381b) to form a first coil portion (or first wound portion) comprising a plurality of turns. According to one embodiment, the second conductive pattern (382) of the third antenna structure (403) may be extended from a third end (382a) to a fourth end (382b) to form a second coil portion (or second wound portion) comprising a plurality of turns. The third antenna structure (403) may include a connector (384) electrically connected to the first end (381a) and the second end (381b) of the first conductive pattern (381), and / or the third end (382a) and the fourth end (382b) of the second conductive pattern (382). The connector (384) may be electrically connected to a connector located on the first printed circuit board of the first substrate assembly (341) by passing through an opening (3613) formed in the second support member (361), for example.

[0069] According to one embodiment, a plurality of conductive patterns (381, 382) of the third antenna structure (403) can be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) located on the first substrate assembly (341).

[0070] According to one embodiment, one of the first end (381a) and the second end (381b) of the first conductive pattern (381) may be electrically connected to a wireless communication circuit, and the other may be electrically connected to ground. The ground may include, for example, a ground plane included in the first printed circuit board of the first substrate assembly (341). The wireless communication circuit may supply a radiating current to the first conductive pattern (381) and transmit and / or receive a first signal of a selected or designated first frequency band through the first conductive pattern (381). For example, the first signal may have a frequency of about 13.56 MHz for near field communication (NFC).

[0071] According to one embodiment, one of the third end (382a) and the fourth end (327b) of the second conductive pattern (382) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1), and the other may be electrically connected to ground (e.g., a ground plane included in the first printed circuit board of the first substrate assembly (341). The wireless communication circuit may supply a radiating current to the second conductive pattern (382) and transmit and / or receive a second signal of a selected or designated second frequency band through the second conductive pattern (382). The second frequency band may be different from the first frequency band utilizing the first conductive pattern (381). For example, the second signal may have a frequency of about 300 kHz or less (e.g., about 70 kHz) for magnetic secure transmission (MST).

[0072] According to various embodiments, the second conductive pattern (382) may be electrically connected to a power transmission and reception circuit located on the first printed circuit board of the first substrate assembly (341). The power transmission and reception circuit may wirelessly receive power from an external electronic device or wirelessly transmit power to an external electronic device through the second conductive pattern (382). A processor (e.g., the processor (120) of FIG. 1) may selectively connect the second conductive pattern (382) to a wireless communication circuit or a power transmission and reception circuit by controlling a switch according to the mode. The power transmission and reception circuit may include a power management integrated circuit (PMIC) or a charger integrated circuit included in the power management module (188) of FIG. 1, and may charge a battery (350) using the power received through the second conductive pattern (382). According to one embodiment, the power transmission and reception circuit may be an electromagnetic induction type power transmission and reception circuit. For example, when a magnetic field flowing through an antenna radiator (e.g., a coil) of an external electronic device is applied to a second conductive pattern (382) included in a third antenna structure (403), an induced current may flow through the second conductive pattern (382). A power transmission and reception circuit may use this induced current to provide power to a load of the electronic device (200) (e.g., battery charging). According to various embodiments, the power transmission and reception circuit may wirelessly transmit power to the external electronic device by utilizing electromagnetic induction between the antenna radiator of the external electronic device and the second conductive pattern (382) of the third antenna structure (403). According to various embodiments, the power transmission and reception circuit may be an electromagnetic resonance type power transmission and reception circuit. For example, the second conductive pattern (382) of the third antenna structure (403) may have substantially the same resonant frequency as the power transmission and reception antenna (e.g., a coil) of the external electronic device.By utilizing the resonance phenomenon between the second conductive pattern (382) of the third antenna structure (403) and the antenna for power transmission and reception of an external electronic device, the power transmission and reception circuit can wirelessly receive power from the external electronic device or wirelessly transmit power to the external electronic device.

[0073] According to various embodiments (not shown), the third antenna structure (403) may further include a conductive line electrically connecting a point between the third end (382a) and the fourth end (382b) of the second conductive pattern (382) and a connector (384). The power transmission and reception circuit may utilize the electrical path between the third end (382a) and the conductive line, or the electrical path between the fourth end (382b) and the conductive line, in a mode for transmitting and / or receiving power.

[0074] According to various embodiments (not shown), the third antenna structure (403) may be implemented to include an additional conductive pattern electrically connected to a power transmission and reception circuit.

[0075] According to one embodiment, the conductive layer (430) may be located on the display (201) (or the back of the display (201)) between the display (201) and the first support member (311). The conductive layer (430) may be located along at least a portion of the display (201) and may include various conductive materials such as copper (Cu(copper)). The conductive layer (430) may shield electromagnetic interference (EMI) for the display (201). The conductive layer (430) may, for example, absorb or shield electromagnetic waves that may affect the display (201), thereby ensuring the performance of the display (201). The conductive layer (430) may, for example, prevent operational errors of the display (201) caused by electromagnetic interference or reduce degradation of the image quality of the display (201). In various embodiments, the conductive layer (430) may comprise aluminum (Al(aluminum)), stainless steel (SUS), or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). In various embodiments, the conductive layer (430) may also dissipate heat emitted from surrounding heat dissipation components (e.g., a display driving circuit (e.g., a DDI)). In various embodiments, the conductive layer (430) may contribute to reinforcing the rigidity of the display (201). In various embodiments, the display (201) or the second layer (420) may be implemented including the conductive layer (430).

[0076] According to one embodiment, the conductive layer (430) may include a first opening (431). The first opening (431) of the conductive layer (430) may be formed in a notch shape. The display (201) may be rectangular and may include long edges (301, 302) that are parallel to each other, and short edges (303, 304) that are parallel to each other and perpendicular to the long edges (301, 302). The first opening (431) of the conductive layer (430) may be implemented as a notch that is long and recessed in a direction (e.g., -x axis direction) from one long edge (302) of the display (201) to the other long edge (301) when viewed from above the first surface (210A).

[0077] According to one embodiment, the first opening (431) may be formed so that the EMI shielding performance by the conductive layer (430) does not decrease below a critical performance level. The first opening (431) may not have a substantial effect on the desired EMI shielding performance.

[0078] According to one embodiment, a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be electrically connected to a conductive layer (430) located on a display (201) and may transmit and / or receive a signal of a selected or designated frequency band through at least a portion of the conductive layer (430) surrounding a first opening (431). The wireless communication circuit may be electrically connected to a first connection point (FP) located near the first opening (431) or at the edge (E) of the first opening (431). A ground (e.g., a ground plane located on the first printed circuit board of the first substrate assembly (341)) may be electrically connected to a second connection point (GP) located near the first opening (431) or at the edge (E) of the first opening (431). The first connection point (FP) is a part to which radiated current is applied from the wireless communication circuit and may be referred to as a feeding point. The second connection point (GP) is a part electrically connected to ground and may be referred to as a ground point.

[0079] According to one embodiment, the edge (E) may mean a perimeter. For example, the edge (E) of the first opening (431) may mean the perimeter of the first opening (431). The perimeter may include a corner and a portion of the area surrounding the corner.

[0080] According to one embodiment, a first flexible conductive member (391) and a second flexible conductive member (392) may be positioned on a first printed circuit board of a first substrate assembly (341). The first flexible conductive member (391) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) positioned on the first printed circuit board. The second flexible conductive member (392) may be electrically connected to a ground plane positioned on the first printed circuit board. The first support member (311) may include a third opening (3113). The first flexible conductive member (391) can pass through the third opening (3113) and physically contact the first connection point (FP) of the conductive layer (430), thereby allowing the first connection point (FP) to be electrically connected to a wireless communication circuit through the first flexible conductive member (391). The second flexible conductive member (392) can pass through the third opening (3113) and physically contact the second connection point (GP) of the conductive layer (430), thereby allowing the second connection point (GP) to be electrically connected to a ground plane through the second flexible conductive member (392).

[0081] According to various embodiments, the first flexible conductive member (391) and / or the second flexible conductive member (392) may include a C-clip (e.g., a C-shaped spring), a pogo-pin, a spring, conductive poron, conductive rubber, conductive tape, or a copper connector.

[0082] According to various embodiments, various other electrical paths, such as cables, may be provided instead of the first flexible conductive member (391) or the second flexible conductive member (392).

[0083] According to one embodiment, the first connection point (FP) and the second connection point (GP) may be located near one long edge (302) of the display (201) when viewed from above the first surface (210A). According to various embodiments, the first opening (431) of the conductive layer (430) may include a relatively narrow portion (B) near one long edge (302) of the display (201), with a width in the y-axis direction when viewed from above the first surface (210A). The first connection point (FP) and the second connection point (GP) may be located on each side of the narrow portion (B).

[0084] According to one embodiment, when a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) provides a radiating current to a first connection point (FP), a radiating current may flow from the first connection point (FP) to a second connection point (GP) along the edge (E) of the first opening (431) in the conductive layer (430). As a result, the wireless communication circuit can transmit and / or receive radio waves by radiating energy in the direction toward which the first surface (210A) faces (e.g., the +z axis direction). A pattern regarding the path of the radiating current is formed based on the first opening (431) of the conductive layer (430), so that energy may be radiated toward the first surface (210A). A radiation structure that transmits and / or receives radio waves through at least a portion of the conductive layer (430) surrounding the first opening (431) of the conductive layer (430) by being fed to the first opening (431) of the conductive layer (430) may be referred to as a loop-type antenna radiator. Hereinafter, the radiator based on the first opening (431) of the conductive layer (430) will be referred to as the first antenna structure (401). The first antenna structure (401) may refer to at least a portion of the conductive layer (430) that forms an electromagnetic field based on the first opening (431).

[0085] According to one embodiment, a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) can transmit and / or receive a first signal having a frequency of about 13.56 MHz for NFC, or a second signal having a frequency of about 300 kHz or less (e.g., about 70 kHz) for MST through a first antenna structure (401) based on a first opening (431) of a conductive layer (430).

[0086] According to one embodiment, the first support member (311) may include a conductive portion (311a). According to various embodiments, the conductive portion (311a) and the side member (218) may be formed integrally and may include the same metal material. According to one embodiment, the conductive portion (311a) may include a second opening (3112) that overlaps at least partially with the first opening (431) of the conductive layer (430) when viewed from above the first surface (210A). The second opening (3112) can reduce the degradation of radiation performance by reducing the electromagnetic influence that the conductive portion (311a) exerts on the first antenna structure (401) based on the first opening (431) of the conductive layer (430).

[0087] According to one embodiment, the first support member (311) may include a non-conductive portion (311b) coupled to a conductive portion (311a). A portion of the non-conductive portion (311b) may be located at least partially in a second opening (3112) of the conductive portion (311a). According to various embodiments, the side member (218) may include a plurality of conductive portions, and a portion of the non-conductive portion (311b) may be located between the plurality of conductive portions. The non-conductive portion (311b) may be located in various other openings formed in the conductive portion (311a). The non-conductive portion (311b) may be formed in a combined form with the conductive portion (311a), for example, through insert injection.

[0088] According to various embodiments, the third opening (3113) may be implemented in a form where the non-conductive portion (311b) is not located in the second opening (3112), or may be formed with a partition between it and the second opening (3112).

[0089] According to one embodiment, in a mode for transmitting and receiving signals of a selected or specified frequency band (e.g., a mode for NFC or MST), a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be optionally connected to a first antenna structure (401) or a third antenna structure (403).

[0090] According to one embodiment, when the electronic device (200) is positioned such that the first surface (210A) faces in the direction of gravity, a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be electrically connected to the first antenna structure (401). This may be a flow of operation that considers a user experience of bringing the electronic device (200) close to the external electronic device below it in a mode relating to NFC or MST. Referring to FIG. 2a and 3, when the wireless communication circuit is electrically connected to the first antenna structure (401), a first communication recognition range (2001) may be on the first surface (210A). The first communication recognition range (2001) may correspond to a portion overlapping with the first antenna structure (401) on the first surface (210A) as a portion that brings the electronic device (200) close to the external electronic device for seamless communication between the electronic device (200) and the external electronic device. When the first communication recognition area (2001) of the first surface (210A) is brought close to the communication recognition area of ​​an external electronic device within a critical distance (e.g., 100 mm as a maximum recognition distance), the electronic device (200) can exchange data with the external electronic device through the first antenna structure (401).

[0091] According to one embodiment, when the electronic device (200) is positioned such that the second surface (210B) (see FIG. 2b) faces in the direction of gravity, a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) may be electrically connected to the third antenna structure (403). This may be a flow of operation that considers a user experience of bringing the electronic device (200) close to the external electronic device below it in a mode relating to NFC or MST. Referring to FIG. 2b and 3, when the wireless communication circuit is electrically connected to the third antenna structure (403), a second communication recognition area (2002) may be on the second surface (210B). The second communication recognition area (2002) may correspond to a portion overlapping with the third antenna structure (403) on the second surface (210B) as a portion that brings the electronic device (200) close to the external electronic device for seamless communication between the electronic device (200) and the external electronic device. When the second communication recognition area (2002) of the second surface (210B) is brought close to the communication recognition area of ​​an external electronic device within a critical distance (e.g., 100 mm as a maximum recognition distance), the electronic device (200) can exchange data with the external electronic device through the third antenna structure (403).

[0092] In one embodiment, referring to FIGS. 2a, 2b, and 3, when viewed from above on the first surface (210A) or the second surface (210B), the first communication recognition area (2001) on the first surface (210A) relating to the first antenna structure (401) may overlap at least partially with the second communication recognition area (2002) on the second surface (210B) relating to the third antenna structure (403). This allows for the same user experience regarding the interaction between the electronic device (200) and the external electronic device when tapping the electronic device (200) while holding it with the first surface (210A) facing the direction of gravity, and when tapping the external electronic device while holding the electronic device (200) with the second surface (210B) facing the direction of gravity.

[0093] FIG. 4 is a cross-sectional view along the A-A' line in the electronic device (200) of FIG. 2a according to one embodiment.

[0094] Referring to FIG. 4, in one embodiment, the electronic device (200) may include a front plate (202), a rear plate (211), a side member (218), a first support member (311), a second support member (361), a display (201), a conductive layer (430), a first substrate assembly (341), or a third antenna structure (403). According to various embodiments, at least one of the components of the electronic device (200) shown in FIG. 4 may be identical or similar to at least one of the components of FIG. 3, and redundant descriptions are omitted.

[0095] According to one embodiment, the edge (not shown) of the front plate (202) may be joined to the side member (218) through various adhesive members (202c), such as double-sided tape. The edge (not shown) of the rear plate (211) may be joined to the side member (218) through various adhesive members (211c), such as double-sided tape. The first support member (311), the second support member (361), the display (201), the first substrate assembly (341), and the third antenna structure (403) may be located in the internal space of a housing (e.g., the housing (210) of FIG. 2a) comprising the front plate (202), the rear plate (211), and the side member (218).

[0096] According to one embodiment, the display (201) may be positioned between the first support member (311) and the front plate (202) and may be coupled to the front plate (202). An optical clear adhesive member (408), such as an optical clear adhesive (OCA), may be positioned between the front plate (202) and the display (201). According to one embodiment, the front plate (202) and the display (201) may be coupled without an air gap through the optical clear adhesive member (408). The optical clear adhesive member (408) can improve image quality. For example, when there is an air gap between the front plate (202) and the display (201), due to the difference in refractive index between different media (e.g., front plate (202), air gap, and display (201)), some of the light output from the display (201) may not travel straight toward the front plate (202) and may be reflected and lost. The loss of light due to the air gap may cause the image to appear blurry through the effective area (e.g., a device comprising a display (201) and a front plate (202)) capable of displaying an image, thereby causing a degradation in image quality. According to one embodiment, if the air gap between the front plate (202) and the display (201) is filled with an optical transparent adhesive member (408), the difference in refractive index between the optical transparent adhesive member (408) and the medium layer in contact with it can be minimized. When the difference in refractive index between the optical transparent adhesive member (408) and the medium layer in contact with it is minimized, the reflectivity of the interface between the optical transparent adhesive member (408) and the medium layer in contact with it can be reduced. When the reflectivity of the interface between the optical transparent adhesive member (408) and the medium layer in contact with it is reduced, reflection at the interface and the resulting loss of light can be reduced, so a clear image can be displayed on the screen.

[0097] According to one embodiment, the display (201) may include a first layer (410) and a second layer (420) bonded to the first layer (410). An adhesive member (not shown) of various polymers may be positioned between the first layer (410) and the second layer (420). An optically transparent adhesive member (408) may be positioned between the front plate (202) and the first layer (410). The first layer (410) may be positioned between the optically transparent adhesive member (408) and the second layer (420).

[0098] According to one embodiment, the first layer (410) may include a display panel (411). The display panel (411) may include a plurality of pixels implemented with a light-emitting element, such as an OLED (organic light emitting diode) or a micro LED. The area where the plurality of pixels are located may form a screen, which is an effective area capable of displaying an image. The display panel (411) may include at least one thin film transistor (TFT) for controlling the plurality of pixels. The at least one TFT can control the current to the light-emitting element to turn the pixel on or off, or to control the brightness of the pixel. The at least one TFT may be implemented as, for example, an a-Si (amorphous silicon) TFT or an LTPS (low-temperature polycrystalline silicon) TFT. The display panel (411) may include a storage capacitor, and the storage capacitor can maintain a voltage signal to the pixel, maintain the voltage entered to the pixel within one frame, or reduce the change in the gate voltage of the TFT due to leakage current during the light-emitting time. By a routine controlling at least one TFT (e.g., initialization, data write), the storage capacitor can maintain the voltage applied to the pixel at regular time intervals.

[0099] According to one embodiment, the display (201) may be a flexible display. The display panel (411) may include a light-emitting layer, a thin film transistor (TFT) film, and a base film. The light-emitting layer may include a plurality of pixels implemented with light-emitting elements, such as, for example, an OLED or a micro LED. The light-emitting layer may be placed on the TFT film through organic evaporation. A TFT film (or TFT substrate) may be located between the light-emitting layer and the base film. The TFT film may refer to a structure in which at least one TFT is placed on a flexible substrate (e.g., a polyimide (PI) film) through a series of processes such as deposition, patterning, and etching. A base film may be located between the TFT film and the second layer (420). The base film may include a flexible film formed from a material such as polyimide (PI) or polyester (PET). The base film may serve to support and protect the display panel (411). According to some embodiments, the base film may be referred to as a protective film, a back film, or a back plate. The front plate (202) may be implemented in the form of a flexible thin film (e.g., a thin film layer). The front plate (202) may include, for example, a plastic film (e.g., a polyimide film) or a thin film glass (e.g., ultra-thin glass (UTG)). The front plate (202) may be in the form of various coating layers disposed on the plastic film or thin film glass.For example, the front plate (202) may be in the form of at least one protective layer or coating layer comprising a polymer material (e.g., PET (polyester), PI (polyimide), or TPU (thermoplastic polyurethane)) disposed on a plastic film or thin film glass.

[0100] According to another embodiment, the display (201) may be a rigid display. The display panel (411) may include a light-emitting layer and a TFT substrate. The light-emitting layer may include a plurality of pixels implemented with light-emitting elements, such as, for example, OLEDs or micro LEDs. The light-emitting layer may be placed on the TFT substrate through organic evaporation. The TFT substrate may be positioned between the second layer (420) of the light-emitting layer. The TFT substrate may refer to a structure in which at least one TFT is placed on a rigid substrate (e.g., a glass substrate or a glass plate) through a series of processes such as deposition, patterning, and etching.

[0101] According to one embodiment, the first layer (410) may include an optical layer (412) located between a display panel (411) and an optical transparent adhesive member (408). An optical transparent adhesive member (not shown), such as OCA, may be located between the display panel (411) and the optical layer (412). The optical layer (412) can improve the image quality of the screen.

[0102] According to one embodiment, the optical layer (412) may include, for example, a polarizing layer (or polarizer) or a retardation layer (or retarder). The polarizing layer may be located, for example, between the retardation layer and the front plate (202). The optical layer (412) may selectively pass light that vibrates in a certain direction, generated from a light source of the display panel (411). When unpolarized light, such as sunlight, passes through the front plate (202) and the optical transparent adhesive member (408) and is incident on the display (201), the unpolarized light passes through the polarizing layer and is converted into linearly polarized light, and this linearly polarized light passes through the retardation layer and is converted into circularly polarized light. For example, when unpolarized light passes through a 90° polarization layer, it is converted into 90° linearly polarized light, and when 90° linearly polarized light passes through a 45° phase delay layer, it can be converted into circularly polarized light with a rotating polarization axis. The phase delay layer may have the characteristics of a quarter wave retarder (λ / 4 retarder). For example, when sunlight passes through a front plate (202) and an optical transparent adhesive member (408) and is incident on a display (201), most of the sunlight may be reflected from a metal, such as an electrode included in the display panel (411), which may make it difficult for the user to perceive the screen. According to one embodiment, the polarization layer and the phase delay layer can improve outdoor visibility by preventing light entering from the outside from being reflected out. For example, circularly polarized light changed by a phase delay layer having quarter wave retarder (λ / 4 retarder) characteristics is reflected from the display panel (411), and the reflected circularly polarized light passes through the phase delay layer again, causing a total λ / 2 phase delay to change into linearly polarized light perpendicular to the initial 90° polarization. This 180° linearly polarized light cannot pass through the 90° polarization layer and be emitted to the outside.According to various embodiments, a single layer combining a polarization layer and a phase delay layer may be provided, and such a layer may be defined as a 'circularly polarized layer'. In some embodiments, the polarization layer (or circularly polarized layer) may be omitted, in which case a black PDL (pixel define layer) and / or a color filter may be provided in place of the polarization layer.

[0103] According to one embodiment, the second layer (420) (e.g., lower panel) may include a plurality of layers (420-1, ..., 420-n) (n≥2) for various functions. An adhesive member (not shown) of various polymers may be positioned between the plurality of layers (420-1, ..., 420-n). Some of the plurality of layers (420-1, ..., 420-n) included in the second layer (420) may include a cushioning layer that supports the first layer (410) and protects the display (201) from external impact or mitigates external impact. The cushioning layer may include a flexible layer, such as, for example, a sponge layer, a cushion layer, or a buffer layer. Some of the plurality of layers (420-1, ..., 420-n) included in the second layer (420) may include a light-blocking layer capable of blocking external light or light generated from the first layer (410). The light-blocking layer may be, for example, an embo layer including a black layer having a rough pattern. Some of the plurality of layers (420-1, ..., 420-n) included in the second layer (420) may include a heat dissipation layer capable of diffusing, dispersing, or dissipating heat generated from the display (201) or electronic device (200). The heat dissipation layer may include, for example, a composite sheet. The heat dissipation layer may include, for example, graphite. In various embodiments, the heat dissipation layer may include a composite sheet. The composite sheet may be a sheet processed by combining layers or sheets of different properties. The composite sheet may include, for example, at least one of polyimide or graphite. The composite sheet may also be replaced with a single sheet comprising one material (e.g., polyimide, or graphite). The light-shielding layer may be located, for example, between the first layer (410) and the buffer layer. The buffer layer may be located, for example, between the light-shielding layer and the heat-dissipating layer.A heat dissipation layer (e.g., a composite sheet) may be located, for example, between the buffer layer and the conductive layer (430). The second layer (420) may include various layers that perform various other functions.

[0104] According to various embodiments (not shown), the display (201) may include a touch sensing circuit (e.g., a touch sensor). The touch sensing circuit may be implemented as a transparent conductive layer (or film) based on various conductive materials such as indium tin oxide (ITO). According to one embodiment, the touch sensing circuit may be located between the front plate (202) and the optical layer (412) (e.g., add-on type). According to another embodiment, the touch sensing circuit may be located between the optical layer (412) and the display panel (411) (e.g., on-cell type). According to another embodiment, the display panel (411) may include a touch sensing circuit or a touch sensing function (e.g., in-cell type).

[0105] According to various embodiments (not shown), the display panel (410) may be implemented based on an OLED and may include an encapsulation layer located between the light-emitting layer and the optical layer (412). The organic material and electrodes that emit light in the OLED are highly sensitive to oxygen and / or moisture and may lose their light-emitting properties. According to one embodiment, the encapsulation layer may seal the light-emitting layer to prevent oxygen and / or moisture from penetrating into the OLED. The encapsulation layer may serve as a pixel protection layer to protect a plurality of pixels of the light-emitting layer.

[0106] According to various embodiments, the display (201) may be implemented as a flexible display based on a substrate (e.g., a plastic substrate) formed from a flexible material such as polyimide (PI). The display panel (411) may be implemented based on an OLED, and the encapsulation layer may be implemented, for example, as a thin-film encapsulation (TFE). According to various embodiments, the display (201) may include a conductive pattern, such as a metal mesh (e.g., an aluminum metal mesh), as a touch sensing circuit located in the encapsulation layer between the encapsulation layer and the optical layer (412). For example, in response to the bending of the display (201), the metal mesh may have greater durability than a transparent conductive layer implemented with ITO.

[0107] According to various embodiments (not shown), the display (201) may further include a pressure sensor capable of measuring the intensity (pressure) of the touch.

[0108] According to various embodiments, the plurality of layers included in the first layer (410) and / or the second layer (420), the stacking structure or the stacking order may vary. According to various embodiments, the display (201) may further include various components depending on the form in which it is provided. These components cannot all be listed as they vary depending on the convergence trend of the display (201), but components equivalent to the components mentioned above may be additionally included in the display (201). According to various embodiments, certain components from the components mentioned above may be excluded or replaced with other components depending on the form in which the display (201) is provided.

[0109] According to one embodiment, a conductive layer (430) may be positioned on the display (201) between the display (201) and the first support member (311). An adhesive member (not shown) of various polymers may be positioned between the second layer (420) of the display (201) and the conductive layer (430).

[0110] According to one embodiment, the conductive layer (430) may include a first opening (431). The conductive layer (430) may include a third surface (430a) that is bonded to the second layer (420), and a fourth surface (430b) located opposite to the third surface (430a) and substantially parallel to the third surface (430a). The first opening (431) may include a first edge (E1) formed on the third surface (430a), a second edge (E2) formed on the fourth surface (430b), and an inner side surface (or inner side surface) (not shown) connecting the first edge (E1) and the second edge (E2). According to one embodiment, the conductive layer (430) may be formed as a thin film with a thickness of about 0.03 mm or less (e.g., about 0.012 mm), and the edge (E) of the first opening (431) may be defined as the first edge (E1) or the second edge (E2).

[0111] FIG. 5 is a circuit diagram relating to an antenna device (500) according to one embodiment.

[0112] In one embodiment, referring to FIGS. 4 and 5, an antenna device (or antenna system) (500) may include a first antenna structure (401) made of a conductive layer (430) having a first opening (431) located on a display (201), a wireless communication circuit (510), ground (G), a first electrical path (520), or a second electrical path (530). The wireless communication circuit (510) (e.g., the wireless communication module (192) of FIG. 1) may be electrically connected to a first connection point (e.g., a feed point) (FP) located near the first opening (431) via the first electrical path (520). The ground (G) may be electrically connected to a second connection point (e.g., a grounding point) (GP) located near the first opening (431) via the second electrical path (530). The ground (G) may include a ground plane located on the first printed circuit board (440) of the first substrate assembly (341) of FIG. 4. The first electrical path (520) may include, for example, the first flexible conductive member (391) of FIG. 3. The second electrical path (530) may include, for example, the second flexible conductive member (392) of FIG. 3. When the wireless communication circuit (510) provides a radiating current to the first connection point (FP), the radiating current may flow from the first connection point (FP) to the second connection point (GP) along the edge (E) of the first opening (431) in the conductive layer (430). As a result, the wireless communication circuit (510) can transmit and / or receive radio waves by radiating energy in the direction in which the first surface (210A) faces (e.g., +z axis direction) through the first antenna structure (401). The wireless communication circuit (510) can transmit and / or receive signals of a selected or designated frequency band through the first antenna structure (401). For example, the signal is about 13 regarding NFC.It may be a first signal with a frequency of 56 MHz, or a second signal having a frequency of about 300 kHz or less (e.g., about 70 kHz) for the MST.

[0113] According to one embodiment, the first opening (431) may be formed to form a resonance of a selected or specified frequency. When a radiating current is supplied to the first connection point (FP), the radiating current may flow along the edge (E) of the first opening (431) from the first connection point (FP) to the second connection point (GP). The length (D) of the edge (E) extending from the first connection point (FP) to the second connection point (GP) may have a value capable of forming a resonance of the selected or specified frequency. According to one embodiment, the perimeter of at least a portion of the conductive layer (430) surrounding the first opening (431) which operates as an antenna may have a length capable of forming a resonance of the selected or specified frequency. For example, when the selected or specified frequency is about 13.56 MHz for NFC, the length (D) may be formed to form an inductance of about 0.2 to 2 microhenries (uH (microhenry)), and the inductance and impedance values ​​required by the IC may differ. According to various embodiments, the length (D) of the edge (E) may be 100 mm to 200 mm.

[0114] According to various embodiments, when the selected or specified frequency is a frequency of about 300 kHz or less (e.g., about 70 kHz) for MST, the length (D) of the edge (E) can be formed to form an inductance of about 8 to 12 microhenries (uH(microhenry)).

[0115] According to various embodiments (not shown), the first opening (431) may be formed in various other shapes (e.g., circular, polygonal, or slot), not limited to the rectangular shape shown in FIG. 3 or 5, with respect to the length (D).

[0116] Referring to FIGS. 4 and 5, in one embodiment, when energy is radiated in the direction toward which the first surface (210A) faces through the first antenna structure (401), the first layer (410) and the second layer (420) of the display (201) may not substantially affect the radiation performance of the first antenna structure (401). For example, at least one medium included in the first layer (410) or the second layer (420) of the display (201) may have a dielectric constant or electrical conductivity that does not reduce the radiation performance of the first antenna structure (401) below a threshold value.

[0117] According to one embodiment, the first support member (311) may be positioned between the display (201) and the first substrate assembly (341). The first support member (311) may include a conductive portion (311a). The conductive portion (311a) may include a second opening (3112) that overlaps at least partially with the first opening (431) of the conductive layer (430) when viewed from above the first surface (210A).

[0118] Referring to FIGS. 4 and 5, in one embodiment, the second opening (3112) of the first support member (311) may overlap the entire first opening (431) of the conductive layer (430) when viewed from above the first surface (210A). According to various embodiments (not shown), the second opening (3112) may be formed at least partially along the edge (E) of the first opening (431) when viewed from above the first surface (210A). The second opening (3112) may reduce the degradation of radiation performance for the first antenna structure (401) by ensuring that the conductive portion (311a) of the first support member (311) does not overlap at least partially with the first opening (431) when viewed from above the first surface (210A). When a radiation current is supplied to the first antenna structure (401), the electromagnetic force generated in the first antenna structure (401) can pass through the first opening (431) and the second opening (3112) aligned therewith. The second opening (3112) prevents the magnetic flux from being reduced by the conductive part (311a), thereby ensuring the radiation performance of the first antenna structure (401). If the magnetic flux is not reduced, the electromagnetic energy increases due to the increase in the inductance value, and thus the radiation performance can be improved. According to various embodiments, the second opening (3112) can be implemented in various forms such that, when viewed from above the first surface (210A), the conductive part (311a) of the first support member (311) does not overlap with the first opening (431). For example, the second opening (3112) can be formed in the shape of a through hole or a notch.

[0119] According to various embodiments, the second opening (3112) may be formed in a circular, polygonal, or slot shape.

[0120] According to some embodiments, even if the second opening (3112) is not formed, if the radiation performance of the first antenna structure (401) is secured above a critical level, the second opening (3112) may be omitted. In this case, the conductive portion (311a) may be extended to replace the second opening (3112), and thereby the rigidity of the first support member (311) may be secured.

[0121] According to various embodiments, the first support member (311) may include a non-conductive portion (311b) located at least partially in the second opening (3112). The non-conductive portion (311b) located in the second opening (3112) may be combined with a conductive portion (311a) to enable the rigidity of the first support member (311) to be secured. According to some embodiments, if the rigidity of the first support member (311) is secured above a critical level even without the non-conductive portion (311b) located in the second opening (3112), the non-conductive portion (311b) located in the second opening (3112) may be omitted.

[0122] According to one embodiment, the first substrate assembly (341) may include a first printed circuit board (440) or a first shielding member (441). The first printed circuit board (440) may include one side (440a) facing the front plate (202) and another side (440b) located opposite to the one side (440a) and facing the rear plate (211). The first shielding member (441) may be located on the one side (440a) of the first printed circuit board (440). The first shielding member (441) may overlap at least partially with the first opening (431) of the conductive layer (430) or the second opening (3112) of the first support member (311) when viewed from above the first side (210A). The first shielding member (441) can cover a plurality of elements (444) located on one side (440a) of the first printed circuit board (440). The first shielding member (441) can reduce the electrical effect of the electromagnetic field formed from the first antenna structure (401) of FIG. 5 on the plurality of elements (444) located on the first printed circuit board (440). The first shielding member (441) may include a conductive member such as a shield can.

[0123] According to one embodiment, the second support member (361) may be positioned between the first support member (311) and the rear plate (211) and may be joined to the first support member (311) through a fastening element such as a bolt. At least a portion of the first substrate assembly (341) may be positioned between the first support member (311) and the second support member (361), and the second support member (361) may cover and protect the first substrate assembly (341).

[0124] According to one embodiment, the third antenna structure (403) may be positioned between the second support member (361) and the rear plate (211). The third antenna structure (403) may be implemented in the form of a film, for example, such as an FPCB. At least one coil (e.g., the first conductive pattern (381) or the second conductive pattern (382) of FIG. 3) included in the third antenna structure (403) may be electrically connected to a wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1). The wireless communication circuit may transmit and / or receive radio waves by radiating energy through the third antenna structure (403) in the direction in which the second surface (210B) faces (e.g., the -z axis direction).

[0125] According to one embodiment, when viewed from above on the second surface (210B), the third antenna structure (403) may overlap at least partially with the first opening (431) of the conductive layer (430).

[0126] According to one embodiment, the first substrate assembly (341) may include a second shielding member (442). The second shielding member (442) may be located on one side (440b) of the first printed circuit board (440). The second shielding member (442) may overlap at least partially with the third antenna structure (403) when viewed from above on the second side (210B). The second shielding member (442) may cover a plurality of elements (445) located on the one side (440b) of the first printed circuit board (440). The first shielding member (441) may reduce the electrical influence of the electromagnetic field formed from the third antenna structure (403) on the plurality of elements (445) located on the first printed circuit board (440). The second shielding member (442) may include a conductive member such as a shield can.

[0127] Referring to FIGS. 4 and 5, in various embodiments, when a radiating current is supplied to a first connection point (FP) of a first antenna structure (401), a portion of the energy radiated from the first antenna structure (401) may be induced into a conductive portion (311a) of a first support member (311) adjacent to the first antenna structure (401). For example, such induction may occur due to an electromagnetic influence (e.g., electromagnetic coupling) between the first antenna structure (401) and the conductive portion (311a). As a result, a radiating current may flow along the edge (or border) of the second opening (3112) of the conductive portion (311a), and energy may be radiated in the direction in which the second surface (210B) faces (e.g., the -z axis direction). For example, radio waves radiated from the first antenna structure (401) may encounter the second antenna structure (402), causing a surface current to be excited and flow. This flow of surface current can form energy in the direction toward which the second surface (210B) faces. A conductive portion (311a) of the first support member (311) may be located near the first antenna structure (401), and a portion of the conductive portion (311a) including a second opening (3112) may be electromagnetically coupled to the first antenna structure (401) to function as an additional antenna radiator (e.g., a loop antenna radiator). A radiating structure that feeds to the second opening (3112) of the conductive portion (311a) and transmits and / or receives radio waves through at least a portion of the conductive portion (311a) surrounding the second opening (3112) may be referred to as a loop antenna radiator. Hereinafter, the radiator based on the second opening (3112) of the conductive portion (311a) will be referred to as the second antenna structure (402). The second antenna structure (402) may refer to a part that forms an electromagnetic field based on the second opening (3112) in the conductive portion (311a).

[0128] According to various embodiments, when a radiating current is supplied to a first connection point (FP) of a first antenna structure (401), a substantial amount of radiating current may be induced to the second antenna structure (402) from the first connection point (FP) (e.g., feed point), which is the point where the radiating current is maximum. According to various embodiments (not shown), when viewed from above on the second surface (210B), a part of the second antenna structure (402) may be positioned overlapping the first connection point (FP) of the first antenna structure (401). According to various embodiments (not shown), for the induction of radiating current, when viewed from above on the second surface (210B), the second antenna structure (402) may be positioned overlapping various other parts of the first antenna structure (401). According to various embodiments, for inducing a radiated current, at least a portion of the first antenna structure (401) and at least a portion of the second antenna structure (402) may be positioned at a distance where they can be electromagnetically coupled.

[0129] According to various embodiments, the structure may be implemented such that radiated current flows directly from the first antenna structure (401) to the second antenna structure (402). For example, a conductive material (e.g., conductive adhesive) (409) may be located in at least a portion between the conductive layer (430) and the conductive portion (311a) of the first support member (311). The conductive material (409) can electrically connect the conductive layer (430) and the conductive portion (311a), and radiated current can flow from the first antenna structure (401) to the second antenna structure (402). When a second antenna structure (402) capable of radiating energy toward a second surface (210B) is utilized, at least one element that electromagnetically affects the radiation performance of the second antenna structure (402) between the second antenna structure (402) and the second surface (210B) may be implemented by omitting or changing its location. For example, the first substrate assembly (341) may not extend between the second antenna structure (402) and the second surface (210B). For example, the second support member (361) may not extend between the second antenna structure (402) and the second surface (210B), may be omitted, or may be formed of a non-conductive material (e.g., a polymer).

[0130] According to various embodiments, when a second antenna structure (402) capable of radiating energy toward the second surface (210B) is utilized, the first antenna structure (401) and the second antenna structure (402) may be implemented in a different position from the embodiment of FIG. 3 or 4 so as not to have an electromagnetic effect on the second antenna structure (402). For example, the first antenna structure (401) and the second antenna structure (402) may be positioned to overlap at least partially with the battery (350) of FIG. 3 when viewed from above the first surface (210A).

[0131] According to various embodiments, when a second antenna structure (402) capable of radiating energy toward the second surface (210B) is utilized, the third antenna structure (403) may be omitted. According to some embodiments, the third antenna structure (403) may be positioned so as not to overlap with the second antenna structure (402) when viewed from above the second surface (210B).

[0132] Referring to FIG. 5, in various embodiments, the second antenna structure (402) may be extended as shown in reference numeral 501 to have an additional loop (5011) through which radiated current flows.

[0133] According to various embodiments, the second antenna structure (402) may shift the resonant frequency of the first antenna structure (401) to a specified frequency or shift the resonant frequency of the first antenna structure (401) by a specified amount. The second antenna structure (402) may operate as a frequency adjustment circuit (or matching circuit) to match the impedance or shift the resonant frequency to a specified frequency or shift it by a specified amount. For example, when a radiating current is supplied to a first connection point (FP) of the first antenna structure (401), electromagnetic coupling with the second antenna structure (402) may occur in at least a portion of the first antenna structure (401), and a substantial change in frequency characteristics due to electromagnetic coupling with the second antenna structure (402) may occur at the first connection point (FP) (e.g., feed point), which is the point where the radiating current is maximum.

[0134] According to various embodiments, when the second antenna structure (402) is not implemented, the first antenna structure (401) and the conductive portion (311a) of the first support member (311) may be implemented to be electromagnetically isolated. For example, the first antenna structure (401) and the conductive portion (311a) of the first support member (311) may be positioned apart to have an electromagnetically specified degree of isolation.

[0135] According to various embodiments, the conductive layer (430) and the first antenna structure (401) implemented therein may be omitted, and the wireless communication circuit (510) may be electrically connected to the conductive portion (311a) of the first support member (311) and the second antenna structure (402) implemented therein. The wireless communication circuit (510) may transmit and / or receive radio waves by radiating energy toward the front (210A) or rear (210B) through the second antenna structure (402).

[0136] According to various embodiments, the wireless communication circuit (510) may be electrically connected to the conductive portion (311a) of the first support member (311) and the second antenna structure (402) implemented therein. The conductive layer (430) located on the display (201) is not electrically connected to the wireless communication circuit (510), and the first opening (431) of the conductive layer (430) may serve to reduce the degradation of the radiation performance of the second antenna structure (402). When a radiation current is supplied to the second antenna structure (402), a portion of the radiation current may be induced to the conductive layer (430) adjacent to the second antenna structure (402). As a result, a radiating current can flow along the edge (E) of the first opening (431) of the conductive layer (430), and the first antenna structure (401) can be implemented as an additional antenna radiator that radiates energy toward the first surface (210A).

[0137] According to various embodiments, a display panel (411) included in the first layer (410) of a display (201) may include a semiconductor device (e.g., an active layer of a TFT) that acts as a switch controlling pixels. When external light, such as sunlight, enters the display (201), a photoelectric effect occurs in which the semiconductor device absorbs light and generates photoelectrons, and leakage current may be induced in the semiconductor device as a result. This leakage current may cause a voltage drop in the pixels, thereby reducing the brightness of the display (201). Sunlight or external light may be reflected from at least one medium included in the display (201) and enter the semiconductor device, and this reflected light may also cause leakage current in the semiconductor device, thereby reducing the brightness of the display (201). The display (201) may include a first display area (A1) where a conductive layer (430) is located and a second display area (A2) where a conductive layer (430) is not located. Due to the first opening (431), the first display area (A1) and the second display area (A2) have different medium layer structures, so the decrease in brightness caused by external light, such as sunlight, in the first display area (A1) and the second display area (A2) may differ. For example, in the second display area (A2), external light, such as sunlight, may be reflected from the air gap and / or non-conductive portion (311b), which is the lower medium below the second layer (420), and absorbed by the semiconductor device, and as a result, may have lower brightness than the first display area (A1) under the same conditions. Due to the difference in brightness between the first display area (A1) and the second display area (A2), it is difficult to have generally even brightness across the entire screen, which may degrade image quality. According to one embodiment, a medium of various materials may be placed in the first opening (431).As a result, the change in brightness of the first display area (A1) and the change in brightness of the second display area (A2) due to the electrical influence of reflected light become generally constant, and image quality can be improved. The reflectance of the interface between the two media can be based on the refractive indices of the two media, and the medium located in the first opening (431) can be determined by taking this into consideration. According to various embodiments, an anti-reflection layer capable of suppressing light reflection may be located in the first opening (431).

[0138] FIG. 6 is a block diagram relating to an electronic device (600) according to one embodiment.

[0139] Referring to FIG. 6, in one embodiment, the electronic device (600) may include a first loop antenna radiator (611), a second loop antenna radiator (612), a wireless communication circuit (620), a processor (630), a memory (640), a sensor (650), or a switch (660). The electronic device (600) may be, for example, the electronic device (101) of FIG. 1, or the electronic device (200) of FIG. 2a or 3.

[0140] According to one embodiment, the first loop antenna radiator (611) may include the first antenna structure (401) of FIG. 5. The first loop antenna radiator (611) may include the first antenna structure (401) and the second antenna structure (402) of FIG. 5. The second loop antenna radiator (612) may include the third antenna structure (403) of FIG. 3. The first loop antenna radiator (611) may include a loop extending from one end (e.g., the first connection point (FP) of FIG. 5) electrically connected to a switch (660) to the other end (e.g., the second connection point (GP) of FIG. 5) electrically connected to ground (G). The second loop-type antenna radiator (612) may include a loop (e.g., a coil) extending from one end (e.g., the first end (381a) or the third end (382a) in FIG. 3) which is electrically connected to the switch (660) to the other end (e.g., the second end (381b) or the fourth end (382b) in FIG. 3) which is electrically connected to the ground (G). The ground (G) may include a ground plane located in the first substrate assembly (341) in FIG. 3 or 4, for example.

[0141] According to one embodiment, a wireless communication circuit (620) (e.g., the wireless communication module (192) of FIG. 1) may be implemented to transmit and / or receive a signal of a selected or designated frequency band through a first loop antenna radiator (611) or a second loop antenna radiator (612). According to one embodiment, the signal may be a first signal having a frequency of about 13.56 MHz for NFC, or a second signal having a frequency of about 300 kHz or less (e.g., about 70 kHz) for MST. An antenna device (or antenna system) may be referred to as including the first loop antenna radiator (611), the second loop antenna radiator (612), the wireless communication circuit (620), ground (G), and electrical paths between them.

[0142] According to one embodiment, the switch (or switching circuit) (660) may include a first terminal (661), a second terminal (662), or a third terminal (663). The first terminal (661) may be electrically connected to a wireless communication circuit (620). The second terminal (662) may be electrically connected to a first loop antenna radiator (611). The third terminal (663) may be electrically connected to a second loop antenna radiator (612). Under the control of the processor (630), the switch (660) may electrically connect the first terminal (661) to the second terminal (662) or the third terminal (663).

[0143] According to various embodiments, the switch (660) may be included in a wireless communication circuit (620) or a processor (630).

[0144] According to one embodiment, the electronic device (600) may be implemented such that a first loop antenna radiator (611) or a second loop antenna radiator (612) is optionally electrically connected to a wireless communication circuit (620) based on the motion or orientation of the electronic device (600).

[0145] According to one embodiment, memory (640) (e.g., memory (130) of FIG. 1) may store instructions (e.g., program (140) of FIG. 1) for a processor (630) (e.g., processor (120) of FIG. 1) to control an antenna device including a first loop antenna radiator (611) and a second loop antenna radiator (612). According to one embodiment, memory (640) may store direction detection instructions (641) and / or switch control instructions (642).

[0146] According to one embodiment, the direction detection instruction (641) may include routines that cause the processor (630) to use the sensor (650) to determine the direction in which the first surface (e.g., the first surface (210A) of FIG. 2a) or the second surface (e.g., the second surface (210B) of FIG. 2a) of the electronic device (600) faces based on the direction of gravity. According to various embodiments, the sensor (650) may include at least a portion of the sensor module (176) of FIG. 1. According to one embodiment, according to the direction detection instruction (641), the processor (630) may determine a first case in which the electronic device (600) is positioned such that the first surface faces the direction of gravity, or a second case in which the electronic device (600) is positioned such that the second surface faces the direction of gravity.

[0147] According to one embodiment, the switch control instruction (642) may include a routine that causes the processor (630) to control the switch (660) based on the direction of the electronic device (600).

[0148] FIG. 7 illustrates the operation flow (700) of the electronic device of FIG. 6 according to one embodiment. FIG. 8a and 8b are reference drawings regarding the operation flow of FIG. 7 according to one embodiment.

[0149] According to one embodiment, with reference to FIGS. 7, 8a, and 8b, the processor (630) can determine, in operation 701, a first case in which the first surface (610A) (e.g., the first surface (210A) of FIG. 2a) faces in the direction of gravity, or a second case in which the second surface (610B) (e.g., the second surface (210B) of FIG. 2b) faces in the direction of gravity.

[0150] According to one embodiment, referring to FIGS. 6, 7 and 8a, when a first case is identified in which the first surface (610A) faces the direction of gravity, the processor (630) can electrically connect the wireless communication circuit (620) and the first loop antenna radiator (611) (e.g., the first antenna structure (401) of FIG. 3) in operation 703. When the electronic device (600) (e.g., the electronic device (200) of FIG. 2a) is positioned so that the first surface (610A) faces the direction of gravity, the first terminal (661) and the second terminal (662) of the switch (660) are electrically connected, so that the wireless communication circuit (620) can be electrically connected to the first loop antenna radiator (611). This may be an operation flow that considers a user experience of bringing the electronic device (600) close to the external electronic device (800) below it in a mode relating to NFC or MST. When the wireless communication circuit (620) is electrically connected to the first loop-type antenna radiator (611), the first communication recognition area (6001) (e.g., the first communication recognition area (2001) of FIG. 2a) may be on the first surface (610A). When the first communication recognition area (6001) of the first surface (610A) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (8001) of the external electronic device (800), the electronic device (600) can exchange data with the external electronic device (800) through the first loop-type antenna radiator (611).

[0151] According to one embodiment, with reference to FIGS. 6, 7 and 8b, when a second case is identified in which the second surface (610B) faces the direction of gravity, the processor (630) can electrically connect the wireless communication circuit (620) and the second loop antenna radiator (612) (e.g., the third antenna structure (403) of FIG. 3) in operation 705. When the electronic device (600) (e.g., the electronic device (200) of FIG. 2a) is positioned so that the second surface (610B) faces the direction of gravity, the first terminal (661) and the third terminal (663) of the switch (660) can be electrically connected. With the first terminal (661) and the third terminal (663) of the switch (660) electrically connected, the wireless communication circuit (620) can be electrically connected to the second loop antenna radiator (612). This may be a flow of operation that considers a user experience of bringing the electronic device (600) close to the external electronic device (800) below it in a mode relating to NFC or MST. When the wireless communication circuit (620) is electrically connected to the second loop antenna radiator (612), the second communication recognition area (6002) (e.g., the second communication recognition area (2002) in FIG. 2b) may be on the second surface (610B). When the second communication recognition area (6002) on the second surface (610B) is brought close to the communication recognition area (8001) of the external electronic device (800) within a threshold distance (e.g., 100 mm as a maximum recognition distance), the electronic device (600) can exchange data with the external electronic device (800) through the second loop antenna radiator (612).

[0152] According to various embodiments, the processor (630) may be implemented to store a direction detection instruction (641) and / or a switch control instruction (642). According to various embodiments, the processor (630) may be implemented to include a first control unit that executes the direction detection instruction (641) and / or a second control unit that executes the switch control instruction (642).

[0153] Referring to FIG. 6, according to various embodiments, the electronic device (600) may further include a frequency adjustment circuit (or matching circuit) connected to an electrical path between a wireless communication circuit (620) and a first loop antenna radiator (611), and / or an electrical path between a wireless communication circuit (620) and a second loop antenna radiator (612). The frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance, or shift the resonant frequency of the antenna device to a specified frequency or by a specified amount.

[0154] FIG. 9 is a block diagram relating to an antenna device (900) according to various embodiments.

[0155] Referring to FIG. 9, in one embodiment, the antenna device (900) may include an antenna structure (910), a wireless communication circuit (920), a ground (G), or a switch (or switch circuit) (960).

[0156] According to one embodiment, the antenna structure (910) is a loop-shaped antenna radiator implemented by forming a first opening (931) (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (930) (e.g., the first opening (431) of FIG. 3 or 4) located on a display (e.g., the display (201) of FIG. 3 or 4), and may be substantially identical to the first antenna structure (401) of FIG. 3, 4, or 5. The antenna structure (910) may include a first feeding point (FP1) and a second feeding point (FP2) electrically connected to a switch (960), and a grounding point (GP) (e.g., the second connection point (GP) of FIG. 5) electrically connected to ground (G). The ground (G) may include, for example, a ground plane located in the first substrate assembly (341) of FIG. 3.

[0157] According to one embodiment, a wireless communication circuit (920) (e.g., the wireless communication module (192) of FIG. 1) may include a first wireless communication circuit (921) and a second wireless communication circuit (922). The first wireless communication circuit (921) may be implemented to transmit and / or receive a first signal in a first frequency band. The second wireless communication circuit (922) may be implemented to transmit and / or receive a second signal in a second frequency band different from the first frequency band.

[0158] According to one embodiment, the switch (960) may include a first terminal (961), a second terminal (962), a third terminal (963), or a fourth terminal (964). The first terminal (961) may be electrically connected to a first wireless communication circuit (921). The second terminal (962) may be electrically connected to a second wireless communication circuit (922). The third terminal (963) may be electrically connected to a first feeding point (FP1) located in the antenna structure (910) (e.g., the first connection point (FP) of FIG. 5). The fourth terminal (964) may be electrically connected to a second feeding point (FP2) located in the antenna structure (910). The second feeding point (FP2) may be located near the first opening (931) or at the edge (not shown) of the first opening (931), separated from the first feeding point (FP1).

[0159] According to various embodiments, an electrical path (971) between a first feeding point (FP1) and a third terminal (963), or an electrical path (972) between a second feeding point (FP2) and a fourth terminal (964), may include a flexible conductive member (e.g., the first flexible conductive member (391) of FIG. 3) between a printed circuit board (not shown) on which a wireless communication circuit (920) and a switch (960) are located and a conductive layer (930). An electrical path (973) between a grounding point (GP) and ground (G) may include a flexible conductive member (e.g., the second flexible conductive member (392) of FIG. 3) between the printed circuit board and the conductive layer (930).

[0160] According to one embodiment, in a mode for transmitting and / or receiving a first signal of a first frequency band, the switch (960) can electrically connect the first terminal (961) and the third terminal (963) by means of a control signal (965) from a processor (e.g., the processor (120) of FIG. 1). When the first terminal (961) and the third terminal (963) are electrically connected, the first wireless communication circuit (921) can be electrically connected to the antenna structure (910) through the first feeding point (FP1). When the first wireless communication circuit (921) supplies a radiating current to the first feeding point (FP1), the radiating current can travel along the edge (E) of the first opening (931) from the first feeding point (FP1) to the grounding point (GP). As a result, the antenna structure (910) can resonate at a first frequency with respect to the first signal.

[0161] According to one embodiment, in a mode for transmitting and / or receiving a second signal of a second frequency band, the switch (960) can electrically connect the second terminal (962) and the fourth terminal (964) by means of a control signal (965) from a processor (e.g., processor (120) of FIG. 1). When the second terminal (962) and the fourth terminal (964) are electrically connected, the second wireless communication circuit (922) can be electrically connected to the antenna structure (910) through the second feeding point (FP2). When the second wireless communication circuit (922) supplies a radiating current to the second feeding point (FP2), the radiating current can travel along the edge (E) of the first opening (931) from the second feeding point (FP2) to the grounding point (GP). As a result, the antenna structure (910) can resonate at a second frequency with respect to the second signal.

[0162] According to various embodiments, the first signal of the first frequency band or the second signal of the second frequency band may relate to NFC or MST.

[0163] FIG. 10 is a block diagram relating to an antenna device (1000) according to various embodiments.

[0164] Referring to FIG. 10, in one embodiment, the antenna device (1000) may include an antenna structure (1010), a wireless communication circuit (1020), or a ground (G).

[0165] According to one embodiment, the antenna structure (1010) may include a first radiating member (1001) and a second radiating member (1002). The first radiating member (1001) may be a loop-type antenna radiator implemented by forming a first opening (1031) (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (1030) (e.g., the first opening (431) of FIG. 3 or 4)) located on a display (e.g., the display (201) of FIG. 3 or 4). The second radiating member (1002) may be a loop-type antenna radiator implemented by forming a second opening (1032) (e.g., the first opening (431) of FIG. 3 or 4) in the conductive layer (1030). The first radiating member (1001) or the second radiating member (1002) may be implemented in at least the same manner as the first antenna structure (401) of FIG. 3, 4, or 5. The first radiating member (1001) may include a first feeding point (FP1) (e.g., the first connection point (FP) of FIG. 5) electrically connected to a wireless communication circuit (1020) and a first grounding point (GP1) (e.g., the second connection point (GP) of FIG. 5) electrically connected to ground (G). The second radiating member (1002) may include a second feeding point (FP2) (e.g., the first connection point (FP) of FIG. 5) electrically connected to a wireless communication circuit (1020) and a second grounding point (GP2) (e.g., the second connection point (GP) of FIG. 5) electrically connected to ground (G). The ground (G) may include, for example, a ground plane located in the first substrate assembly (341) of FIG. 3 or 4.

[0166] According to one embodiment, a wireless communication circuit (1020) (e.g., the wireless communication module (192) of FIG. 1) may include a first wireless communication circuit (1021) and a second wireless communication circuit (1022). The first wireless communication circuit (1021) may be implemented to transmit and / or receive a first signal in a first frequency band. The second wireless communication circuit (1022) may be implemented to transmit and / or receive a second signal in a second frequency band different from the first frequency band.

[0167] According to one embodiment, in a mode for transmitting and / or receiving a first signal of a first frequency band, a first wireless communication circuit (1021) may be electrically connected to a first radiating unit (1001) through a first feeding point (FP1). When the first wireless communication circuit (1021) supplies a radiating current to the first feeding point (FP1), the radiating current may travel along the edge (E1) of the first opening (1031) from the first feeding point (FP1) to the first grounding point (GP1). As a result, the first radiating unit (1001) may resonate at a first frequency with respect to the first signal.

[0168] According to one embodiment, in a mode for transmitting and / or receiving a second signal of a second frequency band, a second wireless communication circuit (1022) may be electrically connected to a second radiating unit (1002) through a second feeding point (FP2). When the second wireless communication circuit (1022) supplies a radiating current to the second feeding point (FP2), the radiating current may travel along the edge (E2) of the second opening (1032) from the second feeding point (FP2) to the second grounding point (GP2). As a result, the second radiating unit (1002) may resonate at a second frequency with respect to the second signal.

[0169] According to various embodiments, the first signal of the first frequency band or the second signal of the second frequency band may relate to NFC or MST.

[0170] According to various embodiments, the first radiating part (1001) and the second radiating part (1002) may be spaced apart to have electromagnetically specified isolation so as to reduce electromagnetic influence between the first radiating part (1001) and the second radiating part (1002).

[0171] According to various embodiments, the first radiating member (1001) and the second radiating member (1002) may be electromagnetically coupled to each other, and as a result, the resonant frequency formed in the first radiating member (1001) or the resonant frequency formed in the second radiating member (1002) may not have a specified value. According to one embodiment, the antenna device (1000) may further include a frequency adjustment circuit (e.g., a matching circuit), and the frequency adjustment circuit may match the impedance, shift the resonant frequency to a specified frequency, or shift it by a specified amount.

[0172] According to various embodiments, the technical concept of the present invention can be applied to foldable electronic devices.

[0173] FIG. 11 illustrates a flat or unfolded state of an electronic device according to another embodiment. FIG. 12 illustrates a folded state of the electronic device of FIG. 11 according to another embodiment.

[0174] Referring to FIGS. 11 and 12, in one embodiment, an electronic device (11) (e.g., electronic device (101) of FIG. 1) may include a foldable housing (1100), a hinge cover (1130) covering a foldable portion of the foldable housing (1100), and a flexible or foldable display (1200) (hereinafter simply, display) (e.g., display device (160) of FIG. 1) located within the space formed by the foldable housing (1100). According to one embodiment, the foldable housing (1100) may include a front (1100a) to which the display (1200) is exposed, a rear (1100b) facing away from the front (1100a), and sides (1100c, 1100d) surrounding the space between the front (1100a) and the rear (1100b).

[0175] According to one embodiment, the foldable housing (1100) may include a first housing structure (1110) and a second housing structure (1120) connected by a hinge structure (not shown). For example, the first housing structure (1110) may be rotatably connected to the second housing structure (1120) by the hinge structure.

[0176] According to one embodiment, the foldable housing (1100) may be formed integrally, comprising a first housing portion (1110) and a second housing portion (1120) connected by a hinge portion.

[0177] According to one embodiment, the first housing structure (1110) may include a first surface (1101) facing a first direction (①), a second surface (1102) facing a second direction (②) opposite to the first direction (①), and a first side (1100c) that at least partially surrounds the space between the first surface (1101) and the second surface (1102). The second housing structure (1120) may include a third surface (1103) facing a third direction (③), a fourth surface (1104) facing a fourth direction (④) opposite to the third direction (③), and a second side (1100d) that at least partially surrounds the space between the third surface (1103) and the fourth surface (1104). The front surface (1100a) of the electronic device (11) may include a first surface (1101) and a third surface (1103), and the rear surface (1100b) of the electronic device (11) may include a second surface (1102) and a fourth surface (1104). In various embodiments (not shown), the first housing structure (1110) may refer to a structure forming part of the first surface (1101), the second surface (1102), and the first side surface (1100c). In various embodiments (not shown), the second housing structure (1120) may refer to a structure forming part of the third surface (1103), the fourth surface (1104), and the second side surface (1100d).

[0178] According to one embodiment, the foldable housing (1100) may include a transparent plate (not shown) (e.g., a polymer plate including various coating layers) forming a first surface (1101) and a third surface (1103). A display (1200) may be positioned along the transparent plate and may be exposed through the first surface (1101) and the third surface (1103). The transparent plate may have flexibility to enable a folded state of the electronic device (11). According to one embodiment, the display (1200) may be implemented to include a transparent plate, and the transparent plate may be omitted in the foldable housing (1100).

[0179] According to one embodiment, the first housing structure (1110) may include a first rear cover (1180) positioned on one side of the folding axis (A) to form at least a portion of the second surface (1102). For example, the first rear cover (1180) may have a substantially rectangular periphery (1181), said periphery (1181) may be wrapped by a first side member (1111). According to various embodiments, the first side member (1111) and the first rear cover (1180) may be formed integrally and may include the same material.

[0180] According to one embodiment, the second housing structure (1120) may include a second rear cover (1190) located on the other side of the folding axis (A) and forming at least a portion of the fourth side (1104). For example, the second rear cover (1190) may have a substantially rectangular edge (1191), said edge (1191) may be wrapped by a second side member (1121). According to various embodiments, the second side member (1121) and the second rear cover (1190) may be formed integrally and may include the same material.

[0181] According to various embodiments, the first rear cover (1180) and / or the second rear cover (1190) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials.

[0182] According to one embodiment, the first rear cover (1180) and the second rear cover (1190) may have a substantially symmetrical shape with respect to the folding axis (A). The first rear cover (1180) and the second rear cover (1190) do not necessarily have mutually symmetrical shapes, and in other embodiments, the first rear cover (1180) and / or the second rear cover (1190) may be provided with various other shapes.

[0183] According to one embodiment, the first housing structure (1110) may include a first side member (or, first side bezel structure) (1111) forming a first side (1100c), and the second housing structure (1120) may include a second side member (or, second side bezel structure) (1121) forming a second side (1100d). The first side member (1111) and / or the second side member (1121) may include a metal or a polymer.

[0184] According to various embodiments, the first side member (1111) and the second side member (1121) may be extended to form an edge area of ​​the front (1100a). For example, the front (1100a) of the electronic device (11) may be formed by a display (1200), and a portion of the first side member (1111) and a portion of the second side member (1121) adjacent to the display (1200).

[0185] According to various embodiments, a portion (not shown) of the first side member (1111) adjacent to the edge (1181) of the first rear cover (1180), and / or a portion (not shown) of the second side member (1121) adjacent to the edge (1191) of the second rear cover (1190) may form a portion of the rear (1100b). For example, the rear (1100b) of the electronic device (11) may be formed by the first rear cover (1180), a portion of the first side member (1111) adjacent to the first rear cover (1180), the second rear cover (1190), and a portion of the second side member (1121) adjacent to the second rear cover (1190).

[0186] According to one embodiment, the first side member (1111) and the second side member (1121) are located on both sides of the folding axis (A) and may have a shape that is symmetrical overall with respect to the folding axis (A).

[0187] According to one embodiment, the first housing structure (1110) may further include a component placement area (1114) that extends from or is combined with the first side member (1111) to form a first surface (1101) together with the display (1200). An area of ​​the first housing structure (1110) other than the component placement area (1114) may have a shape that is mutually symmetrical with respect to the second housing structure (1120). At least one component utilizing the first surface (1101) may be located in the component placement area (1114). According to one embodiment, the component placement area (1114) may be formed to have an area set adjacent to one corner of the first side member (1111). According to various embodiments, the location, shape, and size of the component placement area (1114) are not limited to the illustrated examples. For example, in another embodiment, the component placement area (1114) may be provided in any area between the top corner and the bottom corner of the first housing structure (1110) or other corners of the first housing structure (1110). Components for performing various functions embedded in the electronic device (11) may be exposed to the first surface (1101) through the component placement area (1114) or through one or more openings (not shown) provided in the component placement area (1114). According to one embodiment, the component (1146) located in the component placement area (1114) may include at least one of various sensors such as a proximity sensor, a front camera, a light-emitting element, or a receiver. For example, the light-emitting element may provide state information of the electronic device (11) in the form of light. In another embodiment, the light-emitting element may provide a light source that is coupled with the operation of the front camera, for example. The light-emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

[0188] According to one embodiment, the electronic device (11) may include at least one of audio modules (1141, 1142) or a connector hole (1144).

[0189] According to one embodiment, the audio modules (1141, 1142) may include a microphone hole (1141) or a speaker hole (1142). A microphone may be located inside the microphone hole (1141) to acquire external sound, and in some embodiments, a plurality of microphones may be located to detect the direction of sound. The speaker hole (1142) may include an external speaker hole or a receiver hole for calls. In some embodiments, the speaker hole (1142) and the microphone hole (1141) may be implemented as a single hole, or a speaker may be included without the speaker hole (1142) (e.g., a piezo speaker). According to one embodiment, the connector hole (1144) may include a first connector hole capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (e.g., an earphone jack) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device. The location or number of connector holes is not limited to the embodiment of FIG. 11 or 12 and may be formed differently.

[0190] In various embodiments (not shown), at least one of an audio module (e.g., a call receiver), a sensor module (e.g., a proximity sensor, or a fingerprint sensor), a camera module (e.g., a front camera), or a light-emitting element may be included on the back surface of the screen display area of ​​the display (1200). In other embodiments (not shown), the display (1200) may be combined with or located adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field-type electronic pen.

[0191] According to one embodiment, the first housing structure (1110) and the second housing structure (1120) may together form a recess, which is a space where the display (1200) is located. In the illustrated embodiment, due to the component placement area (1114), the recess may have two or more different widths in a direction perpendicular to the folding axis (A).

[0192] For example, the recess may include a first width (w1) in the x-axis direction between a first part (1121a) parallel to the folding axis (A) of the second side member (1121) and a first part (1111a) formed at the edge of the component placement area (1114) of the first side member (1111). The recess may include a second width (w2) in the x-axis direction between a second part (1121b) of the second side member (1121) and a second part (1111b) parallel to the folding axis (A) that does not correspond to the component placement area (1114) of the first side member (1111). The second width (w2) may be formed to be longer than the first width (w1). According to one embodiment, a first part (1111a) of a first housing structure (1110) having a mutually asymmetrical shape and a first part (1121a) of a second housing structure (1120) may form a first width (w1) of the recess, and a second part (1111b) of a first housing structure (1110) having a mutually symmetrical shape and a second part (1121b) of a second housing structure (1120) may form a second width (w2) of the recess. According to one embodiment, the first part (1121a) and the second part (1121b) of the second housing structure (1120) may have different distances from the folding axis (A). The width of the recess is not limited to the illustrated example. According to various embodiments, the recess may have a plurality of widths by the shape of the part placement area (1114) or the part having an asymmetric shape of the first housing structure (1110) and the second housing structure (1120).

[0193] According to various embodiments, one or more components may be located or visually exposed on the rear surface (1100b) of the electronic device (11).

[0194] For example, a sub-display (1193) may be visually exposed through the second rear cover (1190). According to one embodiment, the sub-display (1193) may be visible through substantially the entire area of ​​the second rear cover (1190). According to some embodiments, the sub-display may be positioned to be visually exposed through a portion of the entire area of ​​the second rear cover (1190) (e.g., the second rear area (1192)).

[0195] For example, at least one component (1145) may be visually exposed through the first rear area (1182) of the first rear cover (1180). In various embodiments, the at least one component (1145) may include a sensor (e.g., proximity sensor, heart rate sensor) and / or a rear camera.

[0196] Referring to FIG. 12, a hinge cover (1130) is positioned between a first housing structure (1110) and a second housing structure (1120) to cover an internal component (e.g., a hinge structure). According to some embodiments, the hinge structure may be referred to as an element including the hinge cover (1130). In one embodiment, the hinge cover (1130) may be covered by a part of the first housing structure (1110) and the second housing structure (1120) or exposed to the outside, depending on whether the electronic device (11) is in an unfolded or folded state.

[0197] For example, when the electronic device (11) is in an unfolded state as shown in FIG. 11, the hinge cover (1130) may be covered by the first housing structure (1110) and the second housing structure (1120) and not exposed. For example, when the electronic device (11) is in a folded state (e.g., a fully folded state) as shown in FIG. 12, the hinge cover (1130) may be exposed to the outside between the first housing structure (1110) and the second housing structure (1120). For example, when the electronic device (11) is in an intermediate state (e.g., between an unfolded state and a folded state) in which the first housing structure (1110) and the second housing structure (1120) are folded with a certain angle, the hinge cover (1130) may be partially exposed to the outside between the first housing structure (1110) and the second housing structure (1120). The exposed area of ​​the hinge cover (1130) in the intermediate state may be smaller than the exposed area of ​​the hinge cover (1130) in the fully folded state. In one embodiment, the hinge cover (1130) may include a curved surface, and the curved surface may form one side of the electronic device (11) in the folded state.

[0198] According to various embodiments, the display (1200) may mean a display in which at least some area can be deformed into a flat or curved surface. In one embodiment, referring to FIG. 11, the display (1200) may include a folding portion (1203), a first portion (1201) located on one side (e.g., to the right of the folding portion (1203)) with respect to the folding portion (1203), and a second portion (1202) located on the other side (e.g., to the left of the folding portion (1203). The folding portion (1203) may be a portion that bends when the electronic device (11) changes from an unfolded state to a folded state.

[0199] According to various embodiments, the division of the display (1200) shown in FIG. 11 is exemplary, and the display (1200) may be divided into multiple regions (e.g., four or more or two) depending on the structure or function. For example, in the embodiment shown in FIG. 11, the regions of the display (1200) may be divided by a folding portion (1203) extending parallel to the y-axis or a folding axis (A), but in other embodiments, the display (1200) may be divided into regions based on a different folding portion (e.g., a folding portion parallel to the x-axis) or a different folding axis (e.g., a folding axis parallel to the x-axis).

[0200] According to one embodiment, the first part (1201) and the second part (1202) of the display (1200) may have a shape that is symmetrical overall with respect to the folding part (1203). According to one embodiment, the first part (1201), unlike the second part (1202), may include a notch that is cut according to the presence of a component placement area (1114), but in other areas, may have a shape that is symmetrical with respect to the second part (1202) and the folding part (1203). For example, the first part (1201) and the second part (1202) may include a part that has a shape that is symmetrical with respect to the folding part (1203) and a part that has a shape that is asymmetrical with respect to the folding part (1203).

[0201] According to one embodiment, the angle or distance formed by the first housing structure (1110) and the second housing structure (1120) may vary depending on the unfolded state, folded state, or intermediate state of the foldable housing (1100). Hereinafter, the operation of the first housing structure (1110) and the second housing structure (1120) according to the unfolded state or folded state of the electronic device (11) and each area of ​​the display (1200) will be described.

[0202] According to one embodiment, when the electronic device (11) is in an unfolded state (see FIG. 11), the first direction (①) to which the first surface (1101) of the first housing structure (1110) faces and the third direction (③) to which the third surface (1103) of the second housing (1120) faces may be the same. For example, in the unfolded state, the first surface (1101) of the first housing structure (1110) and the third surface (1103) of the second housing structure (1120) may be positioned to face the same direction (e.g., the direction to which the front (1100a) of the electronic device (11) faces) at an angle of about 180 degrees. When the electronic device (11) is unfolded, the surface of the first part (1201) and the surface of the second part (1202) of the display (1200) may be facing in the same direction (e.g., the direction in which the front (1100a) of the electronic device (11) faces) at an angle of about 180 degrees. When unfolded, the folding part (1203) of the display (1200) may form a plane with the first part (1201) and the second part (1202).

[0203] In one embodiment, when the electronic device (11) is in a folded state (see FIG. 12), the first housing structure (1110) and the second housing structure (1120) may be positioned to face each other. For example, in the folded state, the first surface (1101) of the first housing structure (1110) and the third surface (1103) of the second housing (1120) may face each other. In the folded state, the surface of the first part (1201) of the display (1200) and the surface of the second part (1202) may face each other, forming a narrow angle (e.g., between about 0 and 10 degrees). In the folded state, the folding part (1203) may be formed as a curved surface having at least a portion having a predetermined curvature.

[0204] In one embodiment, when the electronic device (11) is in an intermediate state between an unfolded state and a folded state (not shown), the first housing structure (1110) and the second housing structure (1120) may be arranged at a certain angle to each other. In the intermediate state, the first surface (1101) of the first housing structure (1110) and the third surface (1103) of the second housing structure (1120), or the surface of the first part (1201) and the second part (1202) of the display (1200), may form an angle that is larger than in the folded state and smaller than in the unfolded state. In the intermediate state, the folding part (1203) may be formed of a curved surface having at least a portion of a certain curvature, and the curvature may be smaller than in the folded state.

[0205] FIG. 13 is an unfolded perspective view of the electronic device (11) of FIG. 11 or 12 according to one embodiment.

[0206] Referring to FIG. 13, in one embodiment, the electronic device (11) may include a display unit (12), a support member assembly (13), a substrate unit (1350), a first housing structure (1110), a second housing structure (1120), a first rear cover (1180), or a second rear cover (1190). In this document, the display unit (12) may be referred to as a display module or a display assembly.

[0207] The display unit (12) may include, for example, a display (1200) and one or more plates or layers (1240) on which the display (1200) is placed. In one embodiment, the plate (1240) may be positioned between the display (1200) and the support member assembly (13). The display (1200) may be positioned on at least a portion of one surface of the plate (1240) (e.g., the upper surface with respect to FIG. 13). The plate (1240) may be formed in a shape corresponding to the display (1200). For example, a portion of the plate (1240) may be formed in a shape corresponding to the notch (1204) of the display (1200).

[0208] According to various embodiments (not shown), the display unit (12) may further include a digitizer for detecting an electronic pen (not shown). The digitizer may be coupled to or located adjacent to the back surface of the display (1200).

[0209] According to one embodiment, the support member assembly (13) may include a first support member (1310), a second support member (1320), a hinge structure (1301) positioned between the first support member (1310) and the second support member (1320), a hinge cover (1130) covering the hinge structure (1301) when viewed from the outside, and a wiring member (1330) (e.g., a flexible printed circuit board (FPC)) crossing the first support member (1310) and the second support member (1320).

[0210] According to one embodiment, the support member assembly (13) may be positioned between the plate (1240) and the substrate portion (1350). For example, the first support member (1310) may be positioned between the first portion (1201) of the display (1200) and the first substrate (e.g., the first printed circuit board (PCB)) (1351). The second support member (1320) may be positioned between the second portion (1202) of the display (1200) and the second substrate (e.g., the second printed circuit board) (1352).

[0211] According to one embodiment, at least a portion of a wiring member (1330) and a hinge structure (1301) may be located inside the support member assembly (13). The wiring member (1330) may be positioned in a direction (e.g., x-axis direction) across the first support member (1310) and the second support member (1320). The wiring member (1330) may be positioned in a direction (e.g., x-axis direction) perpendicular to the folding axis (e.g., y-axis or folding axis (A) of FIG. 11) of the folding portion (1203) of the display (1200).

[0212] According to one embodiment, the substrate portion (1350) may include a first substrate (1351) located on the side of the first support member (1310) and a second substrate (1352) located on the side of the second support member (1320). The first substrate (1351) and the second substrate (1352) may be located inside a space formed by the support member assembly (13), the first housing structure (1110), the second housing structure (1120), the first rear cover (1180), and the second rear cover (1190). Components for implementing various functions of the electronic device (11) may be located on the first substrate (1351) and the second substrate (1352).

[0213] According to one embodiment, the first housing structure (1110) and the second housing structure (1120) can be assembled to be coupled to both sides of the support member assembly (13) while the display unit (12) is coupled to the support member assembly (13). According to various embodiments, the first housing structure (1110) and the second housing structure (1120) can be slid on both sides of the support member assembly (13) and coupled to the support member assembly (13).

[0214] In one embodiment, the first housing structure (1110) may include a first rotational support surface (1112), and the second housing structure (1120) may include a second rotational support surface (1122) corresponding to the first rotational support surface (1112). The first rotational support surface (1112) and the second rotational support surface (1122) may include a curved surface corresponding to a curved surface included in the hinge cover (1130).

[0215] In one embodiment, when the electronic device (11) is in an unfolded state (see FIG. 11), the first rotational support surface (1112) and the second rotational support surface (1122) may cover the hinge cover (1130), and the hinge cover (1130) may not be exposed to the rear of the electronic device (11) or may be exposed minimally. When the electronic device (11) is in a folded state (see FIG. 12), the hinge cover (1130) may be exposed as much as possible between the first rotational support surface (1112) and the second rotational support surface (1122).

[0216] FIG. 14a is a cross-sectional view of the electronic device (11) of FIG. 11 according to one embodiment when it is in an unfolded state. FIG. 14b is a cross-sectional view of the electronic device (11) of FIG. 12 according to one embodiment when it is in a folded state.

[0217] Referring to FIGS. 14a and 14b, in one embodiment, the electronic device (11) may include a first housing structure (1110) comprising a first surface (1101) and a second surface (1102), a second housing structure (1120) comprising a third surface (1103) and a fourth surface (1104), a hinge structure (1301), a display (1200), a sub-display (1193), a first loop antenna radiator (1401), a second loop antenna radiator (1402), a third loop antenna radiator (1403), or a fourth loop antenna radiator (1404). The structure regarding the first housing structure (1110) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4. The structure regarding the second housing structure (1120) and the various elements located therein may be similar to or substantially identical to the structure of FIG. 4.

[0218] According to one embodiment, the first loop antenna radiator (1401) is a loop antenna radiator implemented by forming an opening (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) located in a first part (1201) of the display (1200), and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5.

[0219] According to one embodiment, the third loop antenna radiator (1403) is a loop antenna radiator implemented by forming an opening (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) located in the second part (1202) of the display (1200), and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5.

[0220] According to one embodiment, the fourth loop antenna radiator (1404) is a loop antenna radiator implemented by forming an opening (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) located in the sub-display (1193), and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5.

[0221] According to one embodiment, the second loop-shaped antenna radiator (1402) may be located near the second surface (1102) inside the first housing structure (1110) and may include at least a portion of the third antenna structure (403) of FIG. 3 or 4.

[0222] Referring to FIG. 14b, in one embodiment, when the electronic device (11) is in a folded state, the first surface (1101) and the third surface (1103) may face each other, and the first loop antenna radiator (1401) and the third loop antenna radiator (1403) may be positioned between the second loop antenna radiator (1402) and the fourth loop antenna radiator (1404).

[0223] FIG. 15 is a block diagram relating to the electronic device (11) of FIG. 14a or 14b according to various embodiments.

[0224] Referring to FIG. 15, in one embodiment, the electronic device (11) may include a first loop antenna radiator (1401), a second loop antenna radiator (1402), a third loop antenna radiator (1403), a fourth loop antenna radiator (1404), a wireless communication circuit (1520), a processor (1530), a memory (1540), a sensor (1550), or a switch (or switch circuit) (1560).

[0225] Referring to FIGS. 14a and 15, in one embodiment, the first loop antenna radiator (1401), the third loop antenna radiator (1403), or the fourth loop antenna radiator (1404) may include a loop extending from one end (e.g., the first connection point (FP) in FIG. 5) electrically connected to a switch (1560) to the other end (e.g., the second connection point (GP) in FIG. 5) electrically connected to ground (G). The second loop-type antenna radiator (1402) may include a loop (e.g., a coil) extending from one end (e.g., the first end (381a) or the third end (382a) in FIG. 3) electrically connected to a switch (1560) to the other end (e.g., the second end (381b) or the fourth end (382b) in FIG. 3) electrically connected to ground (G). Ground (G) may include a ground plane located, for example, in the substrate unit (1350) of FIG. 13.

[0226] According to one embodiment, a wireless communication circuit (1520) (e.g., the wireless communication module (192) of FIG. 1) may be implemented to transmit and / or receive a signal of a selected or designated frequency band through a first loop antenna radiator (1401), a second loop antenna radiator (1402), a third loop antenna radiator (1403), or a fourth loop antenna radiator (1404). According to one embodiment, the signal may be a first signal of a frequency of about 13.56 MHz for NFC, or a second signal of a frequency of about 300 kHz or less (e.g., about 70 kHz) for MST. It may be referred to as an antenna device (or antenna system) including a first loop antenna radiator (1401), a second loop antenna radiator (1402), a third loop antenna radiator (1403), a fourth loop antenna radiator (1404), a wireless communication circuit (1520), a ground (G), and electrical paths between them.

[0227] According to one embodiment, the switch (or switching circuit) (1560) may include a first terminal (1561), a second terminal (1562), a third terminal (1563), a fourth terminal (1564), or a fifth terminal (1565). The first terminal (1561) may be electrically connected to a wireless communication circuit (1520). The second terminal (1562) may be electrically connected to a first loop-type antenna radiator (1401). The third terminal (1563) may be electrically connected to a second loop-type antenna radiator (1402). The fourth terminal (1564) may be electrically connected to a third loop-type antenna radiator (1403). The fifth terminal (1565) may be electrically connected to a fourth loop-type antenna radiator (1404). Under the control of the processor (1530), the switch (1560) can electrically connect the first terminal (1561) to one of the second terminal (1562), the third terminal (1563), the fourth terminal (1564), and the fifth terminal (1565).

[0228] According to various embodiments, the switch (1560) may be included in a wireless communication circuit (1520) or a processor (1530).

[0229] According to one embodiment, the electronic device (11) may be implemented such that, based on the motion or orientation of the electronic device (11), a first loop antenna radiator (1401), a second loop antenna radiator (1402), a third loop antenna radiator (1403), or a fourth loop antenna radiator (1404) are optionally electrically connected to a wireless communication circuit (1520).

[0230] According to one embodiment, a memory (1540) (e.g., memory (130) of FIG. 1) may store instructions (e.g., program (140) of FIG. 1) for a processor (1530) (e.g., processor (120) of FIG. 1) to control an antenna device comprising a first loop antenna radiator (1401), a second loop antenna radiator (1402), a third loop antenna radiator (1403), and a fourth loop antenna radiator (1404).

[0231] According to one embodiment, the memory (1540) can store an unfolded / folded state detection instruction (1541), a direction detection instruction (1542), and / or a switch control instruction (1543).

[0232] According to one embodiment, the unfolded / folded state detection instruction (1541) may include routines that cause the processor (1530) to use the sensor (1550) to check the unfolded state (e.g., see FIG. 11) or folded state (e.g., see FIG. 12) of the electronic device (11).

[0233] According to one embodiment, the sensor (1550) may include a proximity sensor. For example, referring to FIG. 11, the proximity sensor may be located in a component placement area (1114) of the first housing structure (1110). When the electronic device (11) is in a folded state (e.g., see FIG. 12), the proximity sensor located in the first housing structure (1110) may output an electrical signal regarding the proximity of the second housing structure (1120) to a processor (1530).

[0234] According to another embodiment, the sensor (1550) may include a hall IC (integrated circuit). For example, referring to FIG. 11, the first housing structure (1110) may include a hall IC, and the second housing structure (1120) may include a magnet. When the electronic device (11) is in a folded state (e.g., see FIG. 12), the hall IC located in the first housing structure (1110) and the magnet located in the second housing structure (1120) may be aligned, and the hall IC may recognize the magnet and output an electrical signal to the processor (1530).

[0235] According to another embodiment, the sensor (1550) may include an image sensor. For example, referring to FIG. 11, the image sensor may be included in a front camera located in a component placement area (1114) of a first housing structure (1110). When the electronic device (11) is in a folded state (e.g., see FIG. 12), the image sensor located in the first housing structure (1110) may acquire image data regarding the second housing structure (1120), and the processor (1530) may determine the folded state of the electronic device (11) based on the image data.

[0236] According to various embodiments, the unfolded or folded state of the electronic device (11) can be detected by utilizing various other sensors.

[0237] In some embodiments, referring to FIG. 11, the first housing structure (1110) may include a first contact and the second housing structure (1120) may include a second contact. When the electronic device (11) is in a folded state (e.g., see FIG. 12), the first contact located in the first housing structure (1110) and the second contact located in the second housing structure may be physically in contact and energized, and the processor (1530) may determine the folded state based on this energization.

[0238] In one embodiment, the direction detection instruction (1542) may include routines that cause the processor (1530) to use the sensor (1550) to determine, based on the direction of gravity, the direction in which the first surface (1101) or the third surface (1103), or the second surface (1102) or the fourth surface (1104) are facing in the unfolded state of the electronic device (11) (see FIG. 14a). The direction detection instruction (1542) may include routines that cause the processor (1530) to use the sensor (1550) to determine, based on the direction of gravity, the direction in which the second surface (1102) or the fourth surface (1104) are facing in the folded state of the electronic device (11) (see FIG. 14b).

[0239] According to one embodiment, the switch control instruction (1543) may include a routine that causes the processor (1530) to control the switch (1560) based on the direction of the electronic device (11).

[0240] FIG. 16 illustrates the operation flow (1600) of the electronic device of FIG. 15 according to one embodiment. FIG. 17a and 17b are reference drawings regarding the operation flow of FIG. 16.

[0241] According to one embodiment, with reference to FIGS. 15 and 16, in operation 1601, the processor (1530) can determine whether the electronic device (11) is in an unfolded or folded state through the sensor (1550).

[0242] According to one embodiment, when the unfolded state of the electronic device (11) (see FIG. 14a) is confirmed, the processor (1530) can perform operation 1603. In operation 1603, the processor (1530) can confirm through the sensor (1550) a first case in which the first surface (1101) (or the third surface (1103)) faces in the direction of gravity, or a second case in which the second surface (1102) (or the fourth surface (1104)) faces in the direction of gravity.

[0243] According to one embodiment, with reference to FIG. 14a and 15, when a first case is identified in which the first surface (1101) (or the third surface (1103)) faces in the direction of gravity, the processor (1530) may electrically connect the first loop antenna radiator (1401) or the third loop antenna radiator (1403) to the wireless communication circuit (1520) in operation 1605. When the electronic device (11) is positioned so that the first surface (1101) faces in the direction of gravity, the first terminal (1561) and the second terminal (1562) of the switch (1560) may be electrically connected, or the first terminal (1561) and the fourth terminal (1564) of the switch (1560) may be electrically connected. This may be a flow of operation that considers a user experience of bringing an unfolded electronic device (11) close to an external electronic device underneath it in a mode relating to NFC or MST. In various embodiments, referring to FIG. 14a, in the first case, the first terminal (1561) may be electrically connected to the second terminal (1562) or the fourth terminal (1564) depending on the landscape or portrait view of the screen. The landscape view refers to when the first part (1201) and the second part (1202) of the display (1200) are arranged horizontally, and the portrait view may refer to when the first part (1201) and the second part (1202) of the display (1200) are arranged vertically.

[0244] According to one embodiment, with reference to FIG. 14a and 15, when a second case is identified in which the second surface (1102) (or the fourth surface (1104)) faces in the direction of gravity, the processor (1530) may electrically connect the second loop antenna radiator (1402) or the fourth loop antenna radiator (1404) to the wireless communication circuit (1520) in operation 1607. When the electronic device (11) is positioned so that the second surface (1102) faces in the direction of gravity, the first terminal (1561) and the third terminal (1563) of the switch (1560) may be electrically connected, or the first terminal (1561) and the fifth terminal (1565) of the switch (1560) may be electrically connected. This may be a flow of operation that considers a user experience of bringing an unfolded electronic device (11) close to an external electronic device underneath it in a mode relating to NFC or MST. In various embodiments, referring to FIG. 14a, in the second case, depending on the horizontal or vertical view of the screen, the first terminal (1561) may be electrically connected to the third terminal (1563) or the fifth terminal (1565).

[0245] According to one embodiment, when the folded state of the electronic device (11) (see FIG. 14b) is confirmed, the processor (1530) can perform operation 1609. In operation 1609, the processor (1530) can confirm through the sensor (1550) a third case in which the second side (1102) faces in the direction of gravity, or a fourth case in which the fourth side (1104) faces in the direction of gravity.

[0246] According to one embodiment, referring to FIG. 15 and 17a, when a third case is identified in which the electronic device (11) is positioned in a folded state such that the second side (1102) faces the direction of gravity, the processor (1530) may electrically connect the wireless communication circuit (1520) and the second loop antenna radiator (1402) in operation 1611. When the electronic device (11) is positioned such that the second side (1102) faces the direction of gravity, the first terminal (1561) and the third terminal (1563) of the switch (1560) may be electrically connected. This may be an operation flow that considers a user experience of bringing the electronic device (11) close to the external electronic device (1700) underneath it in a mode relating to NFC or MST. When the wireless communication circuit (1520) is electrically connected to the second loop-type antenna radiator (1402), the communication recognition area (11001) may be on the second surface (1102). When the communication recognition area (17001) of the second surface (1102) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (17001) of the external electronic device (1700), the electronic device (11) can exchange data with the external electronic device (1700) through the second loop-type antenna radiator (1402).

[0247] According to one embodiment, referring to FIG. 15 and 17b, when a fourth case is identified in which the electronic device (11) is positioned in a folded state such that the fourth side (1104) faces the direction of gravity, the processor (1530) may electrically connect the wireless communication circuit (1520) and the fourth loop antenna radiator (1404) in operation 1613. When the electronic device (11) is positioned such that the fourth side (1104) faces the direction of gravity, the first terminal (1561) and the fifth terminal (1565) of the switch (1560) may be electrically connected. This may be an operation flow that considers a user experience of bringing the electronic device (11) close to the external electronic device (1700) underneath it in a mode relating to NFC or MST. When the wireless communication circuit (1520) is electrically connected to the fourth loop antenna radiator (1404), the communication recognition area (11002) may be on the fourth side (1104). When the communication recognition area (11002) of the fourth side (1104) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (17001) of the external electronic device (1700), the electronic device (11) can exchange data with the external electronic device (1700) through the fourth loop antenna radiator (1404).

[0248] According to various embodiments, the processor (1530) may be implemented to store an unfolded / folded state detection instruction (1541), a direction detection instruction (1542), and / or a switch control instruction (1543). According to various embodiments, the processor (1530) may be implemented to include a first control unit that executes the unfolded / folded state detection instruction (1541), a second control unit that executes the direction detection instruction (1542), and / or a third control unit that executes the switch control instruction (1543).

[0249] Referring to FIG. 15, according to various embodiments, the electronic device (11) may further include a frequency adjustment circuit (or matching circuit) connected to an electrical path between the wireless communication circuit (1520) and a first loop antenna radiator (1401), an electrical path between the wireless communication circuit (1520) and a second loop antenna radiator (1402), an electrical path between the wireless communication circuit (1520) and a third loop antenna radiator (1403), and / or an electrical path between the wireless communication circuit (1520) and a fourth loop antenna radiator (1404). The frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance of an antenna device comprising the wireless communication circuit (1520) and an antenna radiator electrically connected thereto, in an unfolded or folded state, or shift the resonant frequency of the antenna device to a specified frequency or by a specified amount.

[0250] According to various embodiments, the technical concept of the present invention can be applied to an electronic device with an out-folding structure in which the screen folds outward.

[0251] FIG. 18a is a cross-sectional view of an electronic device (18) of an out-folding structure according to various embodiments when it is in an unfolded state. FIG. 18b is a cross-sectional view of the electronic device (18) of FIG. 18a when it is in a folded state according to various embodiments.

[0252] Referring to FIG. 18a and 18b, in one embodiment, the electronic device (18) may include a first housing structure (1810) including a first surface (1801) and a second surface (1802), a second housing structure (1820) including a third surface (1803) and a fourth surface (1804), a hinge structure (1830), a flexible display (1840), a first loop antenna radiator (1851), a second loop antenna radiator (1852), a third loop antenna radiator (1853), or a fourth loop antenna radiator (1854).

[0253] According to one embodiment, the flexible display (1840) may extend from the first surface (1801) to the third surface (1803). When the first housing structure (1810) and the second housing structure (1820) are folded through the hinge structure (1830) (see FIG. 18b), the second surface (1802) and the fourth surface (1804) may be positioned close to each other, and the flexible display (1840) extending from the first surface (1801) to the third surface (1803) may be visually exposed.

[0254] According to various embodiments, the structure regarding the first housing structure (1810) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4. The structure regarding the second housing structure (1820) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4.

[0255] According to one embodiment, the first loop antenna radiator (1851) is a loop antenna radiator implemented by forming an opening (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) located in a first part (1841) of a flexible display (1840) corresponding to a first housing structure (1810), and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5. According to various embodiments, the first loop antenna radiator (1851) may be referred to as the first antenna.

[0256] According to one embodiment, the third loop antenna radiator (1853) is a loop antenna radiator implemented by forming an opening (e.g., the first opening (431) of FIG. 3 or 4) in a conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) located in a second part (1842) of a flexible display (1840) corresponding to a second housing structure (1820), and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5. According to various embodiments, the third loop antenna radiator (1853) may be referred to as the third antenna.

[0257] According to one embodiment, the second loop-shaped antenna radiator (1852) may be located near the second surface (1802) inside the first housing structure (1810) and may include at least a portion of the third antenna structure (403) of FIG. 3 or 4. According to various embodiments, the second loop-shaped antenna radiator (1852) may be referred to as the second antenna.

[0258] According to one embodiment, the fourth loop antenna radiator (1854) may be located near the fourth surface (1804) inside the second housing structure (1820) and may include at least a portion of the third antenna structure (403) of FIG. 3 or 4. According to various embodiments, the fourth loop antenna radiator (1854) may be referred to as the fourth antenna.

[0259] Referring to FIG. 18b, in one embodiment, when the electronic device (18) is in a folded state, the second surface (1802) and the fourth surface (1804) may face each other, and the second loop antenna radiator (1852) and the fourth loop antenna radiator (1854) may be positioned between the first loop antenna radiator (1851) and the third loop antenna radiator (1853).

[0260] According to various embodiments, the electronic device (18) may be implemented with components similar or identical to the electronic device (11) shown in FIG. 15 with respect to loop antenna radiators (1851, 1852, 1853, 1854). The electronic device (18) may perform the operation of selectively electrically connecting a loop antenna radiator corresponding to a side facing the direction of gravity to a wireless communication circuit depending on whether it is in an unfolded or folded state. This may be an operation flow that considers a user experience of bringing the electronic device (18), which has an out-folding structure where the screen folds outward, close to an external electronic device underneath.

[0261] FIG. 19 is a cross-sectional view of an electronic device (19) of a folding structure according to various embodiments when it is in an unfolded state.

[0262] Referring to FIG. 19, in one embodiment, the electronic device (19) may include a foldable housing (1900), a flexible display (1940), a first conductive layer (1950), a second conductive layer (1960), a first conductive support member (1970), or a second conductive support member (1980).

[0263] According to one embodiment, the foldable housing (1900) may include a folding portion (1930), a first portion (1910) and a second portion (1920) positioned between the folding portion (1930). The folding portion (1930) may be a portion that bends when the electronic device (19) changes from an unfolded state to a folded state.

[0264] According to various embodiments, the first part (1910) may be referred to by various other terms such as 'first housing part'. The second part (1920) may be referred to by various other terms such as 'second housing part'. The folding part (1930) is a flexible part that enables a folded state between the first part (1910) and the second part (1920), and may be referred to by various other terms.

[0265] According to one embodiment, the folding portion (1930) may be implemented as a structure (e.g., a hinge rail, or a hinge rail structure) in which a plurality of bars (or rails) extending in the y-axis direction are arranged from the first portion (1910) to the second portion (1920). According to various embodiments, the folding portion (1930) may be implemented as various other structures that can be bent while connecting the first portion (1910) and the second portion (1920). In the folded state of the electronic device (19), the folding portion (1930) may form a curve in which at least a portion has curvature.

[0266] According to various embodiments, the first part (1910) and / or the second part (1920) may refer to a part that is less flexible than the folding part (1930).

[0267] According to various embodiments, the folding portion (1930) may be formed of a material different from the first portion (1910) and / or the second portion (1920).

[0268] According to various embodiments, the foldable housing (1900) may be implemented substantially identically to the foldable housing (1100) of the electronic device (11) presented in FIGS. 11 and 13. For example, a first part (1910) of the foldable housing (1900) may include the first housing structure (1100) of FIG. 11. A second part (1920) of the foldable housing (1900) may include the second housing structure (1120) of FIG. 11. A folding part (1930) of the foldable housing (1900) may include the hinge cover (1130) and hinge structure (1301) of FIG. 13.

[0269] According to one embodiment, a first part (1910) of a foldable housing (1900) may include a first surface (1901) facing a first direction (①) and a second surface (1902) facing a second direction (②) opposite to the first direction (①). A second part (1920) of a foldable housing (1900) may include a third surface (1903) facing a third direction (③) and a fourth surface (1904) facing a fourth direction (④) opposite to the third direction (④).

[0270] According to one embodiment, the unfolded state of the electronic device (19) may refer to a fully unfolded state. In the unfolded state, for example, as in FIG. 19, the first surface (1901) of the first part (1910) and the third surface (1903) of the second part (1920) may form an angle of about 180 degrees.

[0271] According to one embodiment, the electronic device (19) may be implemented in an in-folding structure in which the screen folds inward. In this case, when the electronic device (19) is in a folded state, the first surface (1901) of the first part (1910) and the third surface (1903) of the second part (1920) may face each other. According to various embodiments, when the electronic device (19) is in a folded state, the first surface (1901) and the third surface (1903) may face each other by forming a narrow angle (e.g., between about 0 and 10 degrees).

[0272] According to another embodiment, the electronic device (19) may be implemented in an out-folding structure in which the screen folds outward. In this case, when the electronic device (19) is in a folded state, the second surface (1902) of the first part (1910) and the fourth surface (1904) of the second part (1920) may face each other. According to various embodiments, when the electronic device (19) is in a folded state, the second surface (1902) and the fourth surface (1904) may face each other by forming a narrow angle (e.g., between about 0 and 10 degrees).

[0273] According to various embodiments, the electronic device (19) may be in an intermediated state between an unfolded state and a folded state. According to some embodiments, the intermediated state of the electronic device (19) may be defined as a state included in the unfolded state or the folded state.

[0274] According to one embodiment, the first part (1910) may extend from the folding part (1930) by a first length (D1). The second part (1920) may extend from the folding part (1930) by a second length (D2). According to one embodiment, the first length (D1) and the second length (D2) may be substantially the same. In this case, the side (190c) of the first part (1910) (e.g., the first side (1100c) of FIG. 11) and the side (190d) of the second part (1920) (e.g., the second side (1100d) of FIG. 11) in the folded state of the electronic device (19) may be aligned with each other so that a side with a greater height than in the unfolded state of the electronic device (19) (see FIG. 19).

[0275] According to various embodiments (not shown), the first length (D1) may be formed larger than the second length (D2), in which case the first part (1910) may protrude relative to the second part (1920) in the folded state of the electronic device (19). According to some embodiments, the second length (D2) may be formed larger than the first length (D1), in which case the second part (1920) may protrude relative to the first part (1910) in the folded state of the electronic device (19).

[0276] According to various embodiments, when the electronic device (19) is implemented in an in-folding structure in which the screen folds inward, the first part (1910) may be extended to cover the side (190d) of the second part (1920) in the folded state of the electronic device (19) (see the dashed line of reference numeral 1910a).

[0277] According to various embodiments, when the electronic device (19) is implemented in an out-folding structure where the screen folds outward, the first part (1910) may be extended to cover the side (190d) of the second part (1920) in the folded state of the electronic device (19) (see the virtual line (e.g., dashed line at two points) shown in reference numeral 1910b).

[0278] According to one embodiment, the flexible display (1940) may extend from a first surface (1901) to a third surface (1903). The flexible display (1940) may include a third portion (1941) (e.g., the first portion (1201) of FIG. 11) that is visually exposed through the first surface (1901). The flexible display (1940) may include a fourth portion (1942) (e.g., the second portion (1202) of FIG. 11) that is visually exposed through the second surface (1902). The flexible display (1940) may include a fifth part (1943) (e.g., the folding part (1203) of FIG. 11) that is visually exposed through a fifth surface (1905) between the first surface (1901) and the second surface (1902).

[0279] According to various embodiments, the structure regarding the first part (1910) of the foldable housing (1900) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4.

[0280] According to one embodiment, the first conductive layer (1950) (e.g., the conductive layer (430) of FIG. 3, 4, or 5) may be located within a first portion (1910) of the foldable housing (1900). The first conductive layer (1950) may be located, for example, between a flexible display (1940) and a first conductive support member (1970). According to one embodiment, the first conductive layer (1950) may be located on the flexible display (1940).

[0281] According to one embodiment, the first conductive layer (1950) may include a first opening (1952) (e.g., the first opening (431) of FIG. 3, 4, or 5). The first conductive layer (1950) may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5). When the first conductive layer (1950) is electrically connected to the wireless communication circuit, at least a portion of the first conductive layer (1950) surrounding the first opening (1952) may function as a first antenna (1951). According to various embodiments, the first antenna (1951) is a loop-shaped antenna radiator implemented based on a first opening (431) in the conductive layer (430) of FIG. 3, 4, or 5, and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5.

[0282] According to one embodiment, the first conductive support member (1970) may be located at least partially between the first conductive layer (1950) and the second surface (1902). According to various embodiments, the first conductive support member (1970) may include a conductive portion (311a) included in the first support member (311) of FIG. 3 or 4.

[0283] According to various embodiments, the first conductive support member (1970) may include a third opening (1972) (e.g., the second opening (3112) of FIG. 3, 4, or 5) that overlaps at least partially with the first opening (1952) of the first conductive layer (1950) when viewed from above the first surface (1901). The third opening (1972) can reduce the degradation of radiation performance by reducing the electromagnetic influence that the first conductive support member (1970) exerts on the first antenna (1951) based on the first opening (1952) of the first conductive layer (1950).

[0284] According to various embodiments, the electronic device (19) may further include a non-conductive portion (e.g., the non-conductive portion (311b) of FIG. 3) that is coupled to the first conductive support member (1970). A portion of the non-conductive portion may be located at least partially in the third opening (1972) of the first conductive support member (1970). The non-conductive portion may be coupled to the first conductive support member (1970) and contribute to rigidity as a support member. According to various embodiments, the structure comprising the first conductive support member (1970) and the non-conductive portion may be the first support member (311) of FIG. 3.

[0285] According to one embodiment, the third opening (1972) of the first conductive support member (1970) may overlap the entire first opening (1952) of the first conductive layer (1950) when viewed from above the first surface (1901). According to various embodiments, the third opening (1972) may be formed at least partially along the edge (not shown) of the first opening (1952) when viewed from above the first surface (1901). The third opening (1972) prevents the first conductive support member (1970) from overlapping at least partially with the first opening (1952) of the first conductive layer (1950) when viewed from above the first surface (1901), thereby reducing the degradation of radiation performance for the first antenna (1951). When a radiating current is supplied to the first antenna (1951), the electromagnetic force generated by the first antenna (1951) can pass through the first opening (1952) and the third opening (1972) aligned therewith. The third opening (1972) prevents the magnetic flux from being reduced by the first conductive support member (1970), thereby ensuring the radiation performance of the first antenna (1951). If the magnetic flux is not reduced, the electromagnetic energy increases due to the increase in the inductance value, and thus the radiation performance can be improved. According to various embodiments, the third opening (1972) can be implemented in various forms such that, when viewed from above the first surface (1901), the first conductive support member (1970) does not overlap with the first opening (1952). For example, the third opening (1972) can be formed in the form of a through hole or a notch.

[0286] According to some embodiments, even if the third opening (1972) is not formed, if the radiation performance of the first antenna (1951) is secured above a critical level, the third opening (1972) may be omitted. In this case, the first conductive support member (1970) may be extended to replace the third opening (1972), and the rigidity as a support member may be increased.

[0287] According to various embodiments, the structure regarding the second part (1920) of the foldable housing (1900) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4.

[0288] According to one embodiment, the second conductive layer (1960) (e.g., the conductive layer (430) of FIG. 3, 4, or 5) may be located within a second part (1920) of the foldable housing (1900). The second conductive layer (1960) may be located, for example, between the flexible display (1940) and the second conductive support member (1980). According to one embodiment, the second conductive layer (1960) may be located on the flexible display (1940).

[0289] According to one embodiment, the second conductive layer (1960) may include a second opening (1962) (e.g., the first opening (431) of FIG. 3, 4, or 5). The second conductive layer (1960) may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5). When the second conductive layer (1960) is electrically connected to the wireless communication circuit, at least a portion of the second conductive layer (1960) surrounding the second opening (1962) may function as a second antenna (1961). According to various embodiments, the second antenna (1961) may be implemented as a loop-shaped antenna radiator based on the opening (431) in the conductive layer (430) of FIG. 3, 4, or 5, in a manner substantially identical to the first antenna structure (401) of FIG. 3, 4, or 5.

[0290] According to one embodiment, the second conductive support member (1980) may be located at least partially between the second conductive layer (1960) and the fourth surface (1904). According to various embodiments, the second conductive support member (1980) may include a conductive portion (311a) included in the first support member (311) of FIG. 3 or 4.

[0291] According to various embodiments, the second conductive support member (1980) may include a fourth opening (1982) (e.g., the second opening (3112) of FIG. 3, 4, or 5) that overlaps at least partially with the second opening (1962) of the second conductive layer (1960) when viewed from above on the third surface (1903). The fourth opening (1982) can reduce the degradation of radiation performance by reducing the electromagnetic influence that the second conductive support member (1980) exerts on the second antenna (1961) based on the second opening (1962) of the second conductive layer (1960).

[0292] According to various embodiments, the electronic device (19) may further include a non-conductive portion (e.g., the non-conductive portion (311b) of FIG. 3) that is coupled to the second conductive support member (1980). A portion of the non-conductive portion may be located at least partially in the fourth opening (1982) of the second conductive support member (1980). The non-conductive portion may be coupled to the second conductive support member (1980) and contribute to rigidity as a support member. According to various embodiments, the structure comprising the second conductive support member (1980) and the non-conductive portion may be the first support member (311) of FIG. 3.

[0293] According to one embodiment, the fourth opening (1982) of the second conductive support member (1980) may overlap the entire second opening (1962) of the second conductive layer (1960) when viewed from above the third surface (1903). According to various embodiments, the fourth opening (1982) may be formed at least partially along the edge (not shown) of the second opening (1962) when viewed from above the third surface (1903). The fourth opening (1982) prevents the second conductive support member (1980) from overlapping at least partially with the second opening (1962) of the second conductive layer (1960) when viewed from above the third surface (1903), thereby reducing the degradation of radiation performance for the second antenna (1961). When a radiating current is supplied to the second antenna (1961), the electromagnetic force generated by the second antenna (1961) can pass through the second opening (1962) and the fourth opening (1982) aligned therewith. The fourth opening (1982) ensures that the magnetic flux is not reduced by the second conductive support member (1980), thereby ensuring the radiation performance of the second antenna (1961). If the magnetic flux is not reduced, the electromagnetic energy increases due to the increase in the inductance value, thereby improving the radiation performance. According to various embodiments, the fourth opening (1982) can be implemented in various forms such that, when viewed from above the third surface (1903), the second conductive support member (1980) does not overlap with the second opening (1962). For example, the fourth opening (1982) can be formed in the form of a through hole or a notch.

[0294] According to some embodiments, even if the fourth opening (1982) is not formed, if the radiation performance of the second antenna (1961) is secured above a critical level, the fourth opening (1982) may be omitted. In this case, the second conductive support member (1980) may be extended to replace the fourth opening (1982), and the rigidity as a support member may be increased.

[0295] FIG. 20 is a cross-sectional view of the electronic device (19) of FIG. 19 according to one embodiment when it is in a folded state.

[0296] Referring to FIG. 20, in one embodiment, the electronic device (19) may be implemented in an out-folding structure in which the screen is folded outward. When the electronic device (19) is in a folded state, the second side (1902) and the fourth side (1904) may be positioned close to each other, and the flexible display (1940) extending from the first side (1901) to the third side (1903) may be visually exposed.

[0297] According to various embodiments, the electronic device (19) may perform the operation of selectively electrically connecting a first antenna (1951) or a second antenna (1961) corresponding to the side facing the direction of gravity in the folded state of the electronic device (19) to a wireless communication circuit. This may be an operation flow that considers a user experience of bringing the electronic device (19), which has an out-folding structure where the screen folds outward, close to an external electronic device underneath.

[0298] FIG. 21 is a block diagram relating to an electronic device (19) in which the electronic device (19) of FIG. 19 is implemented as an out-folding structure according to various embodiments.

[0299] Referring to FIG. 21, according to one embodiment, the electronic device (19) may include a first antenna (1951), a second antenna (1961), a wireless communication circuit (2120), a processor (2130), a memory (2140), a sensor (2150), or a switch (or switch circuit) (2160).

[0300] According to one embodiment, the first antenna (1951) and / or the second antenna (1961) may include a loop extending from one end (e.g., the first connection point (FP) in FIG. 5) electrically connected to the switch (2160) to the other end (e.g., the second connection point (GP) in FIG. 5) electrically connected to the ground (G). The ground (G) may include, for example, a ground plane located at the substrate assembly (1350) in FIG. 13.

[0301] According to one embodiment, a wireless communication circuit (2120) (e.g., the wireless communication module (192) of FIG. 1) may be implemented to transmit and / or receive a signal of a selected or designated frequency band through a first antenna (1951) or a second antenna (1961). According to one embodiment, the signal may be a first signal having a frequency of about 13.56 MHz for NFC, or a second signal having a frequency of about 300 kHz or less (e.g., about 70 kHz) for MST. An antenna device (or antenna system) may be referred to as including the first antenna (1951), the second antenna (1961), the wireless communication circuit (2120), ground (G), and electrical paths between them.

[0302] According to one embodiment, the switch (or switching circuit) (2160) may include a first terminal (2161), a second terminal (2162), or a third terminal (2163). The first terminal (2161) may be electrically connected to a wireless communication circuit (2120). The second terminal (2162) may be electrically connected to a first antenna (1951). The third terminal (2163) may be electrically connected to a second antenna (1961). Under the control of the processor (2130), the switch (2160) may electrically connect the first terminal (2161) to the second terminal (2162) or the third terminal (2163).

[0303] According to various embodiments, the switch (2160) may be included in a wireless communication circuit (2120) or a processor (2130).

[0304] According to one embodiment, the electronic device (19) may be implemented such that the first antenna (1951) or the second antenna (1961) is optionally electrically connected to the wireless communication circuit (2120) based on the motion or orientation of the electronic device (19).

[0305] According to various embodiments, the wireless communication circuit (2120) may include a first wireless communication circuit (2121) and a second wireless communication circuit (2122). According to one embodiment, the first wireless communication circuit (2121) may be located within a first part (1910) of the foldable housing (1900) shown in FIG. 19. The second wireless communication circuit (2122) may be located within a second part (1920) of the foldable housing (1900) shown in FIG. 19. When the switch (2160) electrically connects the first terminal (2161) to the second terminal (2162), the first wireless communication circuit (2121) may be electrically connected to the first antenna (1951). When the switch (2160) electrically connects the first terminal (2161) to the third terminal (2163), the second wireless communication circuit (2122) can be electrically connected to the second antenna (1961).

[0306] According to various embodiments, the wireless communication circuit (2120) may be located within the first part (1910) or the second part (1920) of the foldable housing (1900) shown in FIG. 19. For example, the wireless communication circuit (2120) may be located within the first part (1910) where the processor (2130) or memory (2140) is located. In this case, the second wireless communication circuit (2122) may be omitted, and the first wireless communication circuit (2121) may be electrically connected to the first antenna (1951) or the second antenna (1961) by a switch (2160).

[0307] According to one embodiment, the memory (2140) (e.g., memory (130) of FIG. 1) may store instructions (e.g., program (140) of FIG. 1) for a processor (2130) (e.g., processor (120) of FIG. 1) to control an antenna device including a first antenna (1951) and a second antenna (1961).

[0308] According to one embodiment, the memory (2140) may store an unfolded / folded state detection instruction (2141), a direction detection instruction (2142), and / or a switch control instruction (2143).

[0309] According to one embodiment, the unfolded / folded state detection instruction (2141) may include a routine that causes the processor (2130) to check the unfolded state (see FIG. 19) or folded state (see FIG. 20) of the electronic device (19) using a sensor (2150). According to various embodiments, the unfolded / folded state detection instruction (2141) may be implemented substantially identically to the unfolded / folded state detection instruction (1541) of FIG. 15, and a description of the detection method regarding the unfolded state or the folded state is omitted.

[0310] According to one embodiment, with reference to FIGS. 19 and 21, the direction detection instruction (2142) may include a routine in which a processor (2130) uses a sensor (2150) to determine, based on the direction of gravity, the direction in which the first side (1901) or the third side (1903), or the second side (1902) or the fourth side (1904) faces in the unfolded state of the electronic device (19) (see FIG. 19). With reference to FIGS. 20 and 21, the direction detection instruction (2142) may include a routine in which the sensor (2150) uses the second side (1901) or the third side (1903) faces in the folded state of the electronic device (19) (see FIG. 20) to determine, based on the direction of gravity.

[0311] According to one embodiment, the switch control instruction (2143) may include a routine that causes the processor (2130) to control the switch (2160) based on the direction of the electronic device (19).

[0312] FIG. 22 illustrates the operation flow (2200) of the electronic device of FIG. 21 according to one embodiment. FIG. 23a and 23b are reference drawings regarding the operation flow of FIG. 22 according to one embodiment.

[0313] According to one embodiment, with reference to FIGS. 21 and 22, in operation 2201, the processor (2130) can determine whether the electronic device (19) is in an unfolded or folded state through the sensor (2150).

[0314] According to one embodiment, with reference to FIGS. 20, 21, and 22, when the folded state of the electronic device (19) is confirmed, the processor (2130) can perform operation 2203. In operation 2203, the processor (2130) can confirm through the sensor (2150) a first case in which the first surface (1901) faces in the direction of gravity, or a second case in which the third surface (1903) faces in the direction of gravity.

[0315] According to one embodiment, with reference to FIGS. 21 and 23a, when a first case is identified in which an electronic device (19) is positioned in a folded state such that the first surface (1901) faces the direction of gravity, the processor (2130) may electrically connect the wireless communication circuit (2120) and the first antenna (1951) in operation 2205. When the electronic device (19) is positioned such that the first surface (1901) faces the direction of gravity, the first terminal (2161) and the second terminal (2162) of the switch (2160) may be electrically connected. This may be an operation flow that considers a user experience of bringing the electronic device (19) close to the external electronic device (2300) underneath it in a mode relating to NFC or MST. When the wireless communication circuit (2120) is electrically connected to the first antenna (1951), the communication recognition area (19001) may be on the first surface (1901). When the communication recognition area (19001) of the first surface (1901) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (23001) of the external electronic device (2300), the electronic device (19) can exchange data with the external electronic device (2300) through the first antenna (1951).

[0316] According to one embodiment, with reference to FIGS. 21 and 23b, when a second case is identified in which the electronic device (19) is positioned in a folded state such that the third side (1903) faces the direction of gravity, the processor (2130) may electrically connect the wireless communication circuit (2120) and the second antenna (1961) in operation 2207. When the electronic device (19) is positioned such that the third side (1903) faces the direction of gravity, the first terminal (2161) and the third terminal (2163) of the switch (2160) may be electrically connected. This may be an operation flow that considers a user experience of bringing the electronic device (19) close to the external electronic device (2300) underneath it in a mode relating to NFC or MST. When the wireless communication circuit (2120) is electrically connected to the second antenna (1961), the communication recognition area (19003) may be on the third side (1903). When the communication recognition area (19003) of the second side (1903) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (23001) of the external electronic device (2300), the electronic device (19) can exchange data with the external electronic device (2300) through the second antenna (1961).

[0317] According to various embodiments, with reference to FIGS. 19, 21, and 22, when the unfolded state of the electronic device (19) is confirmed, the processor (2130) may perform operation 2209. In operation 2209, the processor (2130) may electrically connect the first antenna (1951) or the second antenna (1961) to the wireless communication circuit (2120). In various embodiments, depending on the landscape or portrait view of the screen, the first terminal (2161) may be electrically connected to the second terminal (2162) or the third terminal (2163). Referring to FIG. 19, the horizontal view indicates when the third part (1941) and the fourth part (1942) of the flexible display (1940) are arranged horizontally, and the vertical view may indicate when the third part (1941) and the fourth part (1942) of the flexible display (1940) are arranged vertically. According to some embodiments, in operation 2209, the processor (2130) may control the switch (2160) to electrically connect both the first antenna (1951) and the second antenna (1961) to the wireless communication circuit (2120).

[0318] Referring to FIG. 21, in various embodiments, the processor (2130) may be implemented to store an unfolded / folded state detection instruction (2141), a direction detection instruction (2142), and / or a switch control instruction (2143). According to various embodiments, the processor (2130) may be implemented to include a first control unit that executes the unfolded / folded state detection instruction (2141), a second control unit that executes the direction detection instruction (2142), and / or a third control unit that executes the switch control instruction (2143).

[0319] Referring to FIG. 21, according to various embodiments, the electronic device (19) may further include a frequency adjustment circuit (or matching circuit) connected to an electrical path between the wireless communication circuit (2120) and the first antenna (1951), and / or an electrical path between the wireless communication circuit (2120) and the second antenna (1961). The frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance of an antenna device comprising the wireless communication circuit (2120) and an antenna electrically connected thereto, in an unfolded or folded state, or shift the resonant frequency of the antenna device to a specified frequency or by a specified amount.

[0320] FIG. 24 is a cross-sectional view of the electronic device (19) of FIG. 19 in a folded state according to another embodiment.

[0321] Referring to FIG. 24, in one embodiment, the electronic device (19) may be implemented in an in-folding structure in which the screen folds inward. When the electronic device (19) is in a folded state, the first surface (1901) and the third surface (1903) may be positioned close to each other, and the flexible display (1940) may not be visually exposed.

[0322] According to various embodiments, the electronic device (19) may further include a third antenna (2401) located within a first part (1910) of the foldable housing (1900) and / or a fourth antenna (2402) located in a second part (1920) of the foldable housing (1900). According to various embodiments, the structure regarding the first part (1910) of the foldable housing (1900) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4. The structure regarding the second part (1920) of the foldable housing (1900) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4.

[0323] According to one embodiment, the third antenna (2401) may be located near the second surface (1902) inside the first part (1910). For example, the third antenna (2401) may include at least a portion of the third antenna structure (403) of FIG. 3 or 4.

[0324] According to one embodiment, the electronic device (19) may further include a second display (2420) (e.g., the sub-display (1193) of FIG. 14a) located within a second part (1920) of the foldable housing (1900). The second display (2420) may be visually exposed through a fourth side (1904).

[0325] According to one embodiment, the electronic device (19) may include a third conductive layer (2430) (e.g., the conductive layer (430) of FIG. 3, 4, or 5) located within a second portion (1920) of the foldable housing (1900). The third conductive layer (2430) may be located between the flexible display (1940) and the second conductive support member (1980). According to one embodiment, the third conductive layer (2430) may be located on the second display (2420).

[0326] According to one embodiment, the fourth antenna (2402) may be implemented based on the third conductive layer (2430). For example, the third conductive layer (2430) may include a fifth opening (2432) (e.g., the first opening (431) of FIG. 3, 4, or 5). The third conductive layer (2430) may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5). When the third conductive layer (2430) is electrically connected to the wireless communication circuit, at least a portion of the third conductive layer (2430) surrounding the fifth opening (24332) may function as the fourth antenna (2402). According to various embodiments, the fourth antenna (2402) is a loop-shaped antenna radiator implemented based on a first opening (431) included in the conductive layer (430) of FIG. 3, 4, or 5, and can be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5.

[0327] According to one embodiment, the fourth opening (1982) of the second conductive support member (1980) may overlap at least partially with the fifth opening (2432) of the third conductive layer (2430). The fourth opening (1982) can reduce the degradation of radiation performance by reducing the electromagnetic influence that the second conductive support member (1980) exerts on the fourth antenna (2402) based on the fifth opening (2432) of the third conductive layer (2430).

[0328] According to various embodiments, the fourth opening (1982) of the second conductive support member (1980) is configured so that, when viewed from above the fourth surface (1904), the second conductive support member (1980) does not overlap at least partially with the fifth opening (2432) of the third conductive layer (2430), thereby reducing the degradation of radiation performance for the fourth antenna (2402). When a radiation current is supplied to the fourth antenna (2402), the electromagnetic force generated in the fourth antenna (2402) can pass through the fifth opening (2432) and the fourth opening (1982) aligned therewith. The fourth opening (1982) prevents the magnetic flux from being reduced by the second conductive support member (1980), thereby ensuring the radiation performance of the fourth antenna (2402). If the magnetic flux is not reduced, the electromagnetic energy is increased due to the increase in the inductance value, and the radiation performance can be improved. According to various embodiments, the fourth opening (1982) can be implemented in various forms such that, when viewed from above the fourth surface (1904), the second conductive support member (1980) does not overlap with the fifth opening (2432).

[0329] According to some embodiments, even if the fourth opening (1982) is not formed, if the radiation performance of the fourth antenna (2402) is secured above a critical level, the fourth opening (1982) may be omitted. In this case, the second conductive support member (1980) may be extended to replace the fourth opening (1982), and the rigidity as a support member may be increased.

[0330] According to some embodiments, the electronic device (19) may be implemented by omitting the second display (2420). In this case, the fourth antenna (2402) may be located near the fourth surface (1904) within the second part (1920) of the foldable housing (1900) and may be implemented by including at least a part of the third antenna structure (403) of FIG. 3 or 4.

[0331] According to some embodiments, the electronic device (19) may be implemented by omitting the first antenna (1951) and / or the second antenna (1961).

[0332] According to various embodiments, the electronic device (19) may be implemented with components similar or identical to the electronic device (11) shown in FIGS. 14a, 14b, and 15 with respect to the first antenna (1951), the second antenna (1961), the third antenna (2401), or the fourth antenna (2402). For example, the first antenna (1951) may be the first loop antenna radiator (1401) of FIGS. 14a, 14b, and 15. For example, the second antenna (1961) may be the third loop antenna radiator (1403) of FIGS. 14a, 14b, and 15. For example, the third antenna (2401) may be the second loop antenna radiator (1402) of FIGS. 14a, 14b, and 15. For example, the fourth antenna (2402) may be the fourth loop-type antenna radiator (1404) of FIGS. 14a, 14b, and 15. The electronic device (19) may perform the operation of selectively electrically connecting the antenna corresponding to the side facing the direction of gravity to a wireless communication circuit depending on whether it is in an unfolded or folded state (see FIGS. 16a, 17a, and 17b).

[0333] For example, the electronic device (19) may perform the operation of selectively electrically connecting a third antenna (2401) or a fourth antenna (2402) corresponding to the side facing the direction of gravity in the folded state of the electronic device (19) to a wireless communication circuit. This may be an operation flow that considers a user experience of bringing the electronic device (19), which has an in-folding structure where the screen folds inward, close to an external electronic device underneath.

[0334] FIG. 25 is a cross-sectional view of an electronic device (25) of an in-folding structure when it is in an unfolded state according to various embodiments.

[0335] Referring to FIG. 25, in one embodiment, the electronic device (25) may include a foldable housing (2500), a first display (2540), a second display (2550), a first antenna (2560), a conductive layer (2570), or a conductive support member (2580).

[0336] According to one embodiment, the foldable housing (2500) may include a folding portion (2530), a first portion (2510) and a second portion (2520) positioned between the folding portion (2530). The foldable housing (2500) may be substantially the same as, for example, the foldable housing (1900) of FIG. 19. For example, the folding portion (2530) may be the folding portion (1930) of FIG. 19. For example, the first portion (2510) may be the first portion (1910) of FIG. 19. For example, the second portion (2520) may be the second portion (1920) of FIG. 19. For example, the first part (2510) may include a first surface (2501) facing the first direction (①) (e.g., the first surface (1901) of FIG. 19), and a second surface (2502) facing the second direction (②) opposite to the first direction (①) (e.g., the second surface (1902) of FIG. 19). The second part (2520) may include a third surface (2503) facing the third direction (③) (e.g., the third surface (1903) of FIG. 19), and a fourth surface (2504) facing the fourth direction (④) opposite to the third direction (④) (e.g., the fourth surface (1904) of FIG. 19).

[0337] According to one embodiment, the first display (2540) may extend from the first surface (2501) to the third surface (2503). The first display (2540) may be, for example, the flexible display (1940) of FIG. 19.

[0338] According to one embodiment, the second display (2550) may be located within the second part (2520) of the foldable housing (2500) and may be visually exposed through the fourth side (2504). The second display (2550) may be, for example, the sub-display (1193) of FIG. 14a or 14b, or the second display (2420) of FIG. 24.

[0339] According to one embodiment, the first antenna (2560) may be located within a first portion (2510) of the foldable housing (2500). The first antenna (2560) may be located near a second surface (2502) within the first portion (2510). For example, the first antenna (2560) may include at least a portion of the third antenna structure (403) of FIG. 3 or 4. According to various embodiments, the first antenna (2560) may be the third antenna (2401) of FIG. 25.

[0340] According to various embodiments, the structure regarding the second part (2520) of the foldable housing (2500) and various elements located therein may be similar to or substantially identical to the structure of FIG. 4.

[0341] According to one embodiment, the conductive layer (2570) (e.g., the conductive layer (430) of FIG. 3, 4, or 5) may be located within a second part (2520) of the foldable housing (2500). The conductive layer (2570) may be located, for example, between a second display (2550) and a conductive support member (2580). According to one embodiment, the conductive layer (2570) may be located on the second display (2550).

[0342] According to one embodiment, the conductive layer (2570) may include a first opening (2572) (e.g., the first opening (431) of FIG. 3, 4, or 5). The conductive layer (2570) may be electrically connected to a wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5). When the conductive layer (2570) is electrically connected to the wireless communication circuit, at least a portion of the conductive layer (2570) surrounding the first opening (2572) may function as a second antenna (2571). According to various embodiments, the second antenna (2571) may be implemented as a loop-shaped antenna radiator based on the opening (431) in the conductive layer (430) of FIG. 3, 4, or 5, and may be implemented in substantially the same manner as the first antenna structure (401) of FIG. 3, 4, or 5. According to various embodiments, the second antenna (2571) may be the fourth loop antenna radiator (1404) of FIG. 14a or 14b, or the fourth antenna (2402) of FIG. 24.

[0343] According to one embodiment, the conductive support member (2580) may be located at least partially between the conductive layer (2570) and the first display (2540). According to various embodiments, the conductive support member (2580) may include a conductive portion (311a) included in the first support member (311) of FIG. 3 or 4.

[0344] According to various embodiments, the conductive support member (2580) may include a second opening (2582) (e.g., the second opening (3112) of FIG. 3, 4, or 5) that overlaps at least partially with the first opening (2572) of the conductive layer (2570) when viewed from above on the fourth surface (2404). The second opening (2582) can reduce the degradation of radiation performance by reducing the electromagnetic influence that the conductive support member (2580) exerts on the second antenna (2571) based on the first opening (2572) of the conductive layer (2570).

[0345] According to various embodiments, the electronic device (25) may further include a non-conductive portion (e.g., the non-conductive portion (311b) of FIG. 3) that is coupled to a conductive support member (2580). A portion of the non-conductive portion may be located at least partially in the second opening (2582) of the conductive support member (2580). The non-conductive portion may be coupled to the conductive support member (2580) and contribute to rigidity as a support member. According to various embodiments, the structure comprising the conductive support member (2580) and the non-conductive portion may be the first support member (311) of FIG. 3.

[0346] According to one embodiment, the second opening (2582) of the conductive support member (2580) may overlap the entirety of the first opening (2572) of the conductive layer (2570) when viewed from above the fourth surface (2404). The second opening (2582) may prevent the conductive support member (2580) from overlapping at least partially with the first opening (2572) of the conductive layer (2570) when viewed from above the fourth surface (2504), thereby reducing the degradation of radiation performance for the second antenna (2571). When a radiation current is supplied to the second antenna (2571), the electromagnetic force generated in the second antenna (2571) may pass through the first opening (2572) and the second opening (2582) aligned therewith. The second opening (2582) ensures that the magnetic flux is not reduced by the conductive support member (2580), thereby securing the radiation performance of the second antenna (2571). If the magnetic flux is not reduced, the electromagnetic energy increases due to the increase in the inductance value, and thus the radiation performance can be improved. According to various embodiments, the second opening (2582) can be implemented in various forms such that the conductive support member (2580) does not overlap with the first opening (2572) when viewed from above the fourth surface (2504). For example, the second opening (2582) can be formed in the form of a through hole or a notch.

[0347] According to some embodiments, even if the second opening (2582) is not formed, if the radiation performance of the second antenna (2571) is secured above a critical level, the second opening (2582) may be omitted. In this case, the conductive support member (2580) may be extended to replace the second opening (2582), and the rigidity as a support member may be increased.

[0348] FIG. 26 is a cross-sectional view of the electronic device (25) of FIG. 25 according to one embodiment when it is in a folded state.

[0349] Referring to FIG. 26, in one embodiment, when the electronic device (25) is in a folded state, the first surface (2501) and the third surface (2503) may be positioned close to each other, and the first display (2540) extending from the first surface (2501) to the third surface (2503) may not be visually exposed.

[0350] According to various embodiments, the electronic device (25) may perform the operation of selectively electrically connecting a first antenna (2560) or a second antenna (2571) corresponding to the side facing the direction of gravity in the folded state of the electronic device (25) to a wireless communication circuit. This may be an operation flow that considers a user experience of bringing the electronic device (25), which has an in-folding structure where the screen folds inward, close to an external electronic device underneath.

[0351] FIG. 27 is a block diagram relating to the electronic device (25) of FIG. 25 according to various embodiments.

[0352] Referring to FIG. 27, according to one embodiment, the electronic device (25) may include a first antenna (2560), a second antenna (2571), a wireless communication circuit (2720), a processor (2730), a memory (2740), a sensor (2750), or a switch (or switch circuit) (2760).

[0353] According to one embodiment, the second antenna (2571) may include a loop extending from one end (e.g., the first connection point (FP) in FIG. 5) electrically connected to the switch (2760) to the other end (e.g., the second connection point (GP) in FIG. 5) electrically connected to the ground (G). The ground (G) may include, for example, a ground plane located at the substrate assembly (1350) in FIG. 13.

[0354] According to one embodiment, a wireless communication circuit (2720) (e.g., the wireless communication module (192) of FIG. 1) may be implemented to transmit and / or receive a signal of a selected or designated frequency band through a first antenna (2560) or a second antenna (2571). According to one embodiment, the signal may be a first signal having a frequency of about 13.56 MHz for NFC, or a second signal having a frequency of about 300 kHz or less (e.g., about 70 kHz) for MST. An antenna device (or antenna system) may be referred to as including the first antenna (2560), the second antenna (2571), the wireless communication circuit (2720), ground (G), and electrical paths between them.

[0355] According to one embodiment, the switch (or switching circuit) (2760) may include a first terminal (2761), a second terminal (2762), or a third terminal (2763). The first terminal (2761) may be electrically connected to a wireless communication circuit (2720). The second terminal (2762) may be electrically connected to a first antenna (2560). The third terminal (2763) may be electrically connected to a second antenna (2571). Under the control of the processor (2730), the switch (2760) may electrically connect the first terminal (2761) to the second terminal (2762) or the third terminal (2763).

[0356] According to various embodiments, the switch (2760) may be included in a wireless communication circuit (2720) or a processor (2730).

[0357] According to one embodiment, the electronic device (25) may be implemented such that the first antenna (2560) or the second antenna (2571) is optionally electrically connected to the wireless communication circuit (2720) based on the motion or orientation of the electronic device (25).

[0358] According to various embodiments (not shown), the wireless communication circuit (2720) may include a first wireless communication circuit and a second wireless communication circuit. The first wireless communication circuit may be located within a first part (2510) of the foldable housing (2500) shown in FIG. 25. The second wireless communication circuit may be located within a second part (2520) of the foldable housing (2500) shown in FIG. 25. When the switch (2760) electrically connects the first terminal (2761) to the second terminal (2762), the first wireless communication circuit may be electrically connected to the first antenna (2560). When the switch (2760) electrically connects the first terminal (2761) to the third terminal (2763), the second wireless communication circuit may be electrically connected to the second antenna (2571).

[0359] According to one embodiment, the memory (2740) (e.g., memory (130) of FIG. 1) may store instructions (e.g., program (140) of FIG. 1) for a processor (2730) (e.g., processor (120) of FIG. 1) to control an antenna device including a first antenna (2560) and a second antenna (2571).

[0360] According to one embodiment, the memory (2740) can store an unfolded / folded state detection instruction (2741), a direction detection instruction (2742), and / or a switch control instruction (2743).

[0361] According to one embodiment, the unfolded / folded state detection instruction (2741) may include a routine that causes the processor (2730) to check the unfolded state (see FIG. 25) or folded state (see FIG. 26) of the electronic device (25) using a sensor (2750). According to various embodiments, the unfolded / folded state detection instruction (2741) may be substantially the same as the unfolded / folded state detection instruction (1541) of FIG. 15, and a description of the detection method regarding the unfolded state or the folded state is omitted.

[0362] According to one embodiment, with reference to FIGS. 26 and 27, the direction detection instruction (2742) may include a routine in which a processor (2730) uses a sensor (2750) to determine the direction in which the second side (2502) or the fourth side (2504) faces in a folded state of the electronic device (25) is facing based on the direction of gravity.

[0363] According to one embodiment, the switch control instruction (2743) may include a routine that causes the processor (2730) to control the switch (2760) based on the direction of the electronic device (25).

[0364] FIG. 28 illustrates the operation flow (2800) of the electronic device (25) of FIG. 27 according to one embodiment. FIG. 29a and 29b are reference drawings regarding the operation flow of FIG. 28 according to one embodiment.

[0365] According to one embodiment, with reference to FIGS. 27 and 28, in operation 2801, the processor (2730) can determine whether the electronic device (25) is in an unfolded or folded state through the sensor (2750).

[0366] According to one embodiment, with reference to FIGS. 26, 27, and 28, when the folded state of the electronic device (25) is confirmed, the processor (2730) can perform operation 2803. In operation 2803, the processor (2730) can confirm through the sensor (2750) a first case in which the second side (2502) faces the direction of gravity, or a second case in which the fourth side (2502) faces the direction of gravity.

[0367] According to one embodiment, with reference to FIG. 27, 28, and 29a, when a first case is identified in which an electronic device (25) is positioned in a folded state such that the second side (2502) faces the direction of gravity, the processor (2730) may electrically connect the wireless communication circuit (2720) and the first antenna (2560) in operation 2805. When the electronic device (25) is positioned such that the second side (2502) faces the direction of gravity, the first terminal (2761) and the second terminal (2762) of the switch (2760) may be electrically connected. This may be an operation flow that considers a user experience of bringing the electronic device (25) close to the external electronic device (2900) underneath it in a mode relating to NFC or MST. When the wireless communication circuit (2720) is electrically connected to the first antenna (2560), the communication recognition area (25001) may be on the second surface (2502). When the communication recognition area (25001) of the second surface (2502) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (2901) of the external electronic device (2900), the electronic device (25) can exchange data with the external electronic device (2900) through the first antenna (2560).

[0368] According to one embodiment, with reference to FIG. 27, 28, and 29a, when a second case is identified in which the electronic device (25) is positioned in a folded state such that the fourth side (2504) faces the direction of gravity, the processor (2730) may electrically connect the wireless communication circuit (2720) and the second antenna (2571) in operation 2807. When the electronic device (25) is positioned such that the fourth side (2504) faces the direction of gravity, the first terminal (2761) and the third terminal (2763) of the switch (2760) may be electrically connected. This may be an operation flow that considers a user experience of bringing the electronic device (25) close to the external electronic device (2900) underneath it in a mode relating to NFC or MST. When the wireless communication circuit (2720) is electrically connected to the second antenna (2571), the communication recognition area (25002) may be on the fourth side (2504). When the communication recognition area (25002) on the fourth side (2504) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (2901) of the external electronic device (2900), the electronic device (25) can exchange data with the external electronic device (2900) through the second antenna (2571).

[0369] According to various embodiments, with reference to FIG. 25, 27, and 28, when the unfolded state of the electronic device (25) is confirmed, the processor (2730) may perform operation 2809. In operation 2809, the processor (2730) may electrically connect the first antenna (2560) or the second antenna (2571) to the wireless communication circuit (2720). In various embodiments, depending on the landscape or portrait view of the screen, the first terminal (2761) may be electrically connected to the second terminal (2762) or the third terminal (2763). Referring to FIG. 25, the horizontal view indicates when the first surface (2501) and the third surface (2503) are arranged horizontally, and the vertical view may indicate when the first surface (2501) and the third surface (2503) are arranged vertically. According to some embodiments, in operation 2809, the processor (2730) may control the switch (2760) to electrically connect both the first antenna (2560) and the second antenna (2571) to the wireless communication circuit (2720).

[0370] Referring to FIG. 27, in various embodiments, the processor (2730) may be implemented to store an unfolded / folded state detection instruction (2741), a direction detection instruction (2742), and / or a switch control instruction (2743). According to various embodiments, the processor (2730) may be implemented to include a first control unit that executes the unfolded / folded state detection instruction (2641), a second control unit that executes the direction detection instruction (2742), and / or a third control unit that executes the switch control instruction (2743).

[0371] Referring to FIG. 27, according to various embodiments, the electronic device (25) may further include a frequency adjustment circuit (or matching circuit) connected to an electrical path between the wireless communication circuit (2720) and the first antenna (2560), and / or an electrical path between the wireless communication circuit (2720) and the second antenna (2571). The frequency adjustment circuit (e.g., a tuner or a passive element) may match the impedance of an antenna device comprising the wireless communication circuit (2720) and an antenna electrically connected thereto, in an unfolded or folded state, or shift the resonant frequency of the antenna device to a specified frequency or by a specified amount.

[0372] According to various embodiments, the technical concept of the present invention may be applied to an electronic device comprising a plurality of housing structures including an in-folding structure and / or an out-folding structure. The electronic device may perform the operation of selectively electrically connecting a loop-shaped antenna radiator corresponding to a surface facing the direction of gravity to a wireless communication circuit depending on whether it is in an unfolded or folded state.

[0373] FIG. 30 is a drawing relating to a wearable electronic device (3000) according to various embodiments.

[0374] Referring to FIG. 30, the wearable electronic device (3000) may be, for example, a watch-type electronic device. According to one embodiment, the wearable electronic device (3000) may include at least one component that performs substantially the same function as the component included in the electronic device (200) of FIG. 3 or 4, except that it differs in shape from the electronic device (200) of FIG. 3 or 4.

[0375] For example, the wearable electronic device (3000) may include a housing structure (e.g., housing (210) of FIG. 2a) comprising a front plate (e.g., front plate (202) of FIG. 3 or 4), a rear plate (e.g., rear plate (211) of FIG. 3 or 4), or a side bezel structure (e.g., side bezel structure (218) of FIG. 3 or 4). The housing structure may include a first surface (3010A) (e.g., first surface (210A) of FIG. 3 or 4), a second surface (3010B) facing opposite to the first surface (3010A) (e.g., second surface (210B) of FIG. 4), or a side (3010C) (e.g., side (210C) of FIG. 2a) that at least partially surrounds the space between the first surface (3010A) and the second surface (3010B). At least a portion of the first surface (3010A) may be formed by a front plate. At least a portion of the second surface (3010B) may be formed by a rear plate. At least a portion of the side (3010C) may be formed by a side bezel structure. The wearable electronic device (3000) may include a display (e.g., the display (201) of FIG. 3 or 4) positioned between the front plate and the rear plate and visually exposed through the front plate. The wearable electronic device (3000) may include a support member (e.g., the first support member (311) of FIG. 3 or 4) positioned between the display and the rear plate. The wearable electronic device (3000) may include a printed circuit board (e.g., a first printed circuit board (440) of FIG. 4) located between a support member and a rear plate, on which a wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) and a ground (e.g., a ground (G) of FIG. 5) are located. The wearable electronic device (3000) may include a battery (e.g., a battery (350) of FIG. 3) located between a support member and a rear plate. The wearable electronic device (3000) may further include various other elements.The wearable electronic device (3000) may include a first strap (or first watch strap) (3020) and a second strap (or second watch strap) (3030) connected to a side bezel structure. The first strap (3020) and the second strap (3030) may each be connected to both sides of the side bezel structure as a part that wraps around the user's wrist when the electronic device (3000) is worn on the user's wrist.

[0376] According to one embodiment, the wearable electronic device (3000) may include a conductive layer (e.g., a conductive layer (430) of FIG. 3 or 4) positioned on the display between the display (e.g., a display (201) of FIG. 4) and the back plate (e.g., a back plate (211) of FIG. 4). A support member (e.g., a first support member (311) of FIG. 3 or 4) may be positioned between the conductive layer and the back plate. According to one embodiment, the conductive layer may include a first opening (e.g., a first opening (431) of FIG. 3 or 4). A wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) may be electrically connected to the conductive layer and configured to transmit and / or receive a signal of a selected or designated frequency band through at least a portion of the conductive layer surrounding the first opening. According to one embodiment, the support member may include a second opening (e.g., the second opening (3112) of FIG. 3 or 4) that overlaps at least partially with the first opening. The second opening may reduce the degradation of radiation performance by reducing the electromagnetic influence that the support member exerts on an antenna structure (e.g., the first antenna structure (401) of FIG. 3 or 4) based on the first opening of the conductive layer. The signal of the selected or specified frequency band may, for example, have a frequency related to NFC or a frequency related to MST. According to one embodiment, the wearable electronic device (3000) may include the antenna device (500) of FIG. 5, the antenna device (900) of FIG. 9, or the antenna device (1000) of FIG. 10.

[0377] According to one embodiment, the wearable electronic device (3000) may include a loop antenna radiator (3011). The loop antenna radiator (3011) may include, for example, the first antenna structure (401) of FIG. 5. The loop antenna radiator (3011) may include the first antenna structure (401) and the second antenna structure (402) of FIG. 5. The loop antenna radiator (3011) may include a loop extending from one end electrically connected to a wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5) to the other end electrically connected to ground (e.g., ground (G) of FIG. 5). When the loop antenna radiator (3011) is electrically connected to a wireless communication circuit, the communication recognition area (3001) (e.g., the first communication recognition area (2001) of FIG. 2a) may be on the first surface (3010A). When the communication recognition area (3001) of the first surface (3010A) is brought within a critical distance (e.g., 100 mm as a maximum recognition distance) facing the communication recognition area (3101) of the external electronic device (3100), the wearable electronic device (3000) can exchange data with the external electronic device (3100) through the loop antenna radiator (3011).

[0378] According to various embodiments, the wearable electronic device (3000) of FIG. 30 can be implemented as various other forms of wearable electronic devices.

[0379] According to one embodiment of the present invention, an electronic device (e.g., the electronic device (200) of FIG. 4) may include a housing (e.g., the housing (210) of FIG. 2a) comprising a first surface (e.g., the first surface (210A) of FIG. 4) and a second surface facing away from the first surface (e.g., the second surface (210B) of FIG. 4). The electronic device may include a display (e.g., the display (201) of FIG. 3 or 4) that is at least partially accommodated in the housing and is visually exposed through the first surface. The electronic device may include a conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) that is positioned between the display and the second surface and includes a first opening (e.g., the first opening (431) of FIG. 3 or 4). The electronic device may include a support member (e.g., a first support member (311) of FIG. 3 or 4) positioned between the second surface and the conductive layer and including a conductive portion (e.g., a conductive portion (311a) of FIG. 3 or 4). The electronic device may include a wireless communication circuit (e.g., a wireless communication circuit (510) of FIG. 5) configured to transmit and / or receive a signal through an antenna (e.g., a first antenna structure (401) of FIG. 3 or 5) formed by at least a portion of the conductive layer surrounding the first opening, which is electrically connected to the conductive layer.

[0380] According to one embodiment of the present invention, the signal of the selected or specified frequency band may have a frequency of 13.56 MHz or 300 kHz or less.

[0381] According to one embodiment of the present invention, the conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4) may be electrically connected to the wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5) at a first location (e.g., the first connection point (FP) of FIG. 5) located near the first opening (e.g., the first opening (431) of FIG. 3 or 4). The conductive layer may be electrically connected to ground (e.g., ground (G) of FIG. 5) at a second location (e.g., the second connection point (GP) of FIG. 5) located near the first opening. The perimeter of at least a portion of the conductive layer extending from the first location to the second location (e.g., edge (E) of FIG. 5) may have a length (e.g., length (D) of FIG. 5) capable of forming a resonance of the frequency of the signal of the selected or designated frequency band.

[0382] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (200) of FIG. 3 or 4) may further include a printed circuit board (e.g., the first printed circuit board (440) of FIG. 5) located between the support member (e.g., the first support member (311) of FIG. 3 or 4) and the second surface (e.g., the second surface (210B) of FIG. 4), on which the wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5) and the ground (e.g., the ground (G) of FIG. 5) are located.

[0383] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (200) of FIG. 3 or 4) may further include a flexible conductive member (e.g., the first flexible conductive member (391), the second flexible conductive member (392) of FIG. 3) which is positioned between the support member (e.g., the first support member (311) of FIG. 3 or 4) and the printed circuit board (e.g., the first printed circuit board (440) of FIG. 4)) and electrically connects the first location (e.g., the first connection point (FP) of FIG. 5) of the wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5) and the conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4), or the ground (e.g., the ground (G) of FIG. 5) and the second location (e.g., the second connection point (GP) of FIG. 5).

[0384] According to one embodiment of the present invention, the conductive portion (e.g., the conductive portion (311a) of FIG. 3 or 4) may include a second opening (e.g., the second opening (3112) of FIG. 3 or 4) that overlaps at least partially with the first opening (e.g., the first opening (431) of FIG. 3 or 4).

[0385] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (200) of FIG. 3) may further include a battery (e.g., the battery (350) of FIG. 3). The battery may be located between the area where the first opening (e.g., the first opening (431) of FIG. 3 or 4) and the second opening (e.g., the second opening (3112) of FIG. 3 or 4) overlap and the second surface (e.g., the second surface (210B) of FIG. 4).

[0386] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (200) of FIG. 3 or 4) may further include a non-conductive material (e.g., a non-conductive portion (311b) of FIG. 3 or 4) disposed at least partially in the second opening (e.g., the second opening (3112) of FIG. 3 or 4).

[0387] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (200) of FIG. 4) may further include a conductive adhesive (e.g., the conductive material (409) of FIG. 4) positioned between the conductive layer (e.g., the conductive layer (430) of FIG. 4) and the conductive portion (e.g., the conductive portion (311a) of FIG. 4).

[0388] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (200) of FIG. 3 or 4) may further include at least one coil (e.g., the third antenna structure (403) of FIG. 3 or 4) which is positioned between the support member (e.g., the first support member (311) of FIG. 3) and the second surface (e.g., the second surface (210B) of FIG. 4) and is electrically connected to the wireless communication circuit (e.g., the wireless communication circuit (510) of FIG. 5) to transmit and / or receive a signal of the selected or specified frequency.

[0389] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (600) of FIG. 6) may further include a sensor (e.g., the sensor (650) of FIG. 6), a switch (e.g., the switch (660) of FIG. 6), a memory (e.g., the memory (640) of FIG. 6), and a processor (e.g., the processor (630) of FIG. 6). The switch may include a first terminal (e.g., the first terminal (661) of FIG. 6) electrically connected to the wireless communication circuit (e.g., the wireless communication circuit (620) of FIG. 6), a second terminal (e.g., the second terminal (662) of FIG. 6) electrically connected to the conductive layer (e.g., the conductive layer (430) of FIG. 3 or 4), and a third terminal (e.g., the third terminal (663) of FIG. 6) electrically connected to the at least one coil (e.g., the second loop antenna radiator (612) of FIG. 6). The memory may store instructions that, at execution, the processor controls the switch to electrically connect the first terminal and the second terminal when it is confirmed through the sensor that the first surface (e.g., the first surface (210A) of FIG. 4) is facing the direction of gravity, and controls the switch to electrically connect the first terminal and the third terminal when it is confirmed through the sensor that the second surface (e.g., the second surface (210B) of FIG. 4) is facing the direction of gravity.

[0390] According to one embodiment of the present invention, an electronic device (e.g., the electronic device (19) of FIG. 19) may include a foldable housing (e.g., the foldable housing (1900) of FIG. 19). The foldable housing may include a first housing portion (e.g., the first portion (1910) of FIG. 19) comprising a first surface (e.g., the first surface (1901) of FIG. 19) facing a first direction (e.g., the first direction (①) of FIG. 19), and a second surface (e.g., the first surface (1902) of FIG. 19) facing a second direction (e.g., the second direction (②) of FIG. 19) opposite to the first direction. The foldable housing may include a third surface (e.g., the third surface (1903) of FIG. 19) facing a third direction (e.g., the third direction (③) of FIG. 19), and a third surface (e.g., the third surface (1903) of FIG. 19) opposite to the third direction. The electronic device may include a second housing portion (e.g., the second portion (1920) of FIG. 19) comprising a fourth surface (e.g., the fourth surface (1904) of FIG. 19) facing in four directions (e.g., the fourth direction (④) of FIG. 19). The electronic device may include a flexible display (e.g., the flexible display (1940) of FIG. 19) extending from the first surface to the third surface. The electronic device may include a first conductive layer (e.g., the first conductive layer (1950) of FIG. 19) comprising a first opening (e.g., the first opening (1952) of FIG. 19) located within the first housing portion. The electronic device may include a second conductive layer (e.g., the second opening (1962) of FIG. 19) comprising a second opening located within the second housing portion. It may include a conductive layer (1960). The electronic device may include a first conductive support member (e.g., the first conductive support member (1970) of FIG. 19) located between the second surface and the first conductive layer.The electronic device may include a second conductive support member (e.g., the second conductive support member (1980) of FIG. 19) disposed between the fourth surface and the second conductive layer. The electronic device may include at least one wireless communication circuit (e.g., the wireless communication circuit (2120) of FIG. 21) electrically connected to the first conductive layer or the second conductive layer. The wireless communication circuit may be configured to transmit and / or receive a signal through a first antenna (e.g., the first antenna (1951) of FIG. 19 or 21) formed by at least a portion of the first conductive layer surrounding the first opening when electrically connected to the first conductive layer. The wireless communication circuit may be configured to transmit and / or receive a signal through a second antenna (e.g., the second antenna (1961) of FIG. 19 or 21) formed by at least a portion of the second conductive layer surrounding the second opening when electrically connected to the second conductive layer.

[0391] According to one embodiment of the present invention, the first conductive support member (e.g., the first conductive support member (1970) of FIG. 19) may include a third opening (e.g., the third opening (1972) of FIG. 19) that overlaps at least partially with the first opening (e.g., the first opening (1952) of FIG. 19).

[0392] According to one embodiment of the present invention, the second conductive support member (e.g., the second conductive support member (1980) of FIG. 19) may include a fourth opening (e.g., the fourth opening (1982) of FIG. 19) that overlaps at least partially with the second opening (e.g., the second opening (1962) of FIG. 19).

[0393] According to one embodiment of the present invention, the at least one wireless communication circuit (e.g., the wireless communication circuit (2120) of FIG. 21) may include a first wireless communication circuit (e.g., the first wireless communication circuit (2121) of FIG. 21) located within the first housing portion (e.g., the first portion (1910) of FIG. 19) and configured to transmit and / or receive the signal through the first antenna (e.g., the first antenna (1951) of FIG. 19 or 21). The at least one wireless communication circuit may include a second wireless communication circuit (e.g., the second wireless communication circuit (2122) of FIG. 21) located within the second housing portion (e.g., the second portion (1920) of FIG. 19) and configured to transmit and / or receive the signal through the second antenna (e.g., the second antenna (1961) of FIG. 19 or 21).

[0394] According to one embodiment of the present invention, in a folded state of the foldable housing (e.g., the foldable housing (1900) of FIG. 24), the first surface (e.g., the first surface (1901) of FIG. 19) may face the third surface (e.g., the third surface (1903) of FIG. 19).

[0395] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (19) of FIG. 24) may further include a third antenna (e.g., the third antenna (2401) of FIG. 24) located between the first conductive support member (e.g., the first conductive support member (1970) of FIG. 24) and the second surface (e.g., the second surface (1902) of FIG. 24) within the first housing portion (e.g., the first portion (1910) of FIG. 24). The electronic device may further include a fourth antenna (e.g., the fourth antenna (2402) of FIG. 24) located between the second conductive support member (e.g., the second conductive support member (1980) of FIG. 24) and the fourth surface (e.g., the fourth surface (1904) of FIG. 24) within the second housing portion (e.g., the electronic device (19) of FIG. 24). The at least one wireless communication circuit (e.g., the wireless communication circuit (1520) of FIG. 15) may be electrically connected to the third antenna or the fourth antenna in the folded state of the foldable housing to transmit and / or receive the signal.

[0396] According to one embodiment of the present invention, in a folded state of the foldable housing (e.g., the foldable housing (19) of FIG. 20), the second surface (e.g., the second surface (1902) of FIG. 20) may face the fourth surface (e.g., the fourth surface (1904) of FIG. 20).

[0397] According to one embodiment of the present invention, the at least one wireless communication circuit (e.g., the wireless communication circuit (2120) of FIG. 21) may be electrically connected to the first conductive layer (e.g., the first conductive layer (1950) of FIG. 21) or the second conductive layer (e.g., the second conductive layer (1960) of FIG. 21) in the folded state of the foldable housing.

[0398] According to one embodiment of the present invention, an electronic device (e.g., the electronic device (25) of FIG. 25) may include a foldable housing (e.g., the foldable housing (2500) of FIG. 25). The foldable housing may include a first housing portion (e.g., the first portion (2510) of FIG. 25) comprising a first surface (e.g., the first surface (2501) of FIG. 25) facing a first direction (e.g., the first direction (①) of FIG. 25), and a second surface (e.g., the second surface (2502) of FIG. 25) facing a second direction (e.g., the second direction (②) of FIG. 25) opposite to the first direction. The foldable housing may include a second housing portion (e.g., a second portion (2520) of FIG. 25) comprising a third surface (e.g., a third surface (2503) of FIG. 25) facing a third direction (e.g., a third direction (3) of FIG. 25)), and a fourth surface (e.g., a fourth surface (2504) of FIG. 25) facing a fourth direction (e.g., a fourth direction (4) of FIG. 25) opposite to the third direction. The electronic device may include a flexible display (e.g., a first display (2540) of FIG. 25) extending from the first surface to the third surface. The electronic device may include a conductive layer (e.g., a conductive layer (2570) of FIG. 25) comprising a first opening (e.g., a first opening (2572) of FIG. 25)) located within the second housing portion. The electronic device may include a conductive support member (e.g., a conductive support member (2580) of FIG. 25) located between the fourth surface and the first conductive layer. The electronic device may include a wireless communication circuit (e.g., a wireless communication circuit (2720) of FIG. 27) configured to transmit and / or receive a signal through a first antenna (e.g., a second antenna (2571) of FIG. 25) formed by at least a portion of the conductive layer surrounding the first opening when electrically connected to the conductive layer.

[0399] According to one embodiment of the present invention, the conductive support member (e.g., the conductive support member (2580) of FIG. 25) may include a second opening (e.g., the second opening (2582) of FIG. 25) that overlaps at least partially with the first opening (e.g., the first opening (2572) of FIG. 25).

[0400] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (25) of FIG. 25) may further include a second display (e.g., the second display (2550) of FIG. 25) located within the second housing portion (e.g., the second portion (252) of FIG. 25) and visually exposed through the fourth surface (e.g., the fourth surface (2504) of FIG. 25). The conductive layer (e.g., the conductive layer (2570) of FIG. 25) may be located at least partially between the conductive support member and the second display.

[0401] According to one embodiment of the present invention, the electronic device (e.g., the electronic device (25) of FIG. 25) may further include a second antenna (e.g., the first antenna (2560) of FIG. 25) located within the first housing portion (e.g., the first portion (2510) of FIG. 25). The wireless communication circuit (e.g., the wireless communication circuit (2720) of FIG. 27) may be electrically connected to the first antenna (e.g., the second antenna (2571) of FIG. 26) or the second antenna in a folded state (e.g., see FIG. 26) of the foldable housing (e.g., the foldable housing (2500) of FIG. 25).

[0402] According to one embodiment of the present invention, the electronic device, the display, the rear cover located opposite to the display, and the conductive layer for EMI (electromagnetic interference) shielding for the display may include a conductive layer located between the display and the rear cover and including an opening. The electronic device may include a communication circuit configured to transmit a signal passing through the display to the outside or receive from the outside through an antenna formed based on at least a portion of the conductive layer around the opening.

[0403] According to one embodiment of the present invention, the electronic device may further include a support member positioned between the conductive layer and the rear cover and comprising a conductive portion. The conductive portion may include another opening that overlaps at least partially with the opening.

[0404] According to one embodiment of the present invention, the electronic device may further include a non-conductive material located at the other opening.

[0405] According to one embodiment of the present invention, the electronic device may further include a conductive adhesive located between the conductive layer and the conductive portion.

[0406] According to one embodiment of the present invention, the electronic device may further include a battery located between the support member and the rear cover. The opening of the conductive layer and the other opening of the support member may overlap at least partially with the battery.

[0407] According to one embodiment of the present invention, the electronic device may further include another antenna located between the conductive layer and the rear cover. When the other antenna is electrically connected to the communication circuit, it may transmit a signal passing through the rear cover to the outside or receive it from the outside.

[0408] According to one embodiment of the present invention, the antenna based on the opening or the other antenna may be optionally electrically connected to the communication circuit based on the motion or orientation of the electronic device.

[0409] According to one embodiment of the present invention, the signal may have a frequency of 13.56 MHz.

[0410] According to one embodiment of the present invention, an electronic device may include a display, and a first antenna and a second antenna positioned apart with a folding portion of the display, which transmit a signal passing through the display to the outside or receive it from the outside. The electronic device may include a communication circuit configured to be electrically connected to the first antenna or the second antenna in a folded state of the electronic device in which the display is folded outward.

[0411] According to one embodiment of the present invention, the first antenna or the second antenna may be optionally electrically connected to the communication circuit based on the motion or orientation of the electronic device in the folded state.

[0412] According to one embodiment of the present invention, the first antenna or the second antenna may be formed based on an opening included in a conductive layer located at least partially on the back surface of the display, and at least a part of the conductive layer around the opening.

[0413] According to one embodiment of the present invention, the electronic device may further include a support member that is positioned spaced apart from the display with the conductive layer in between and includes a conductive portion. The conductive portion may include another opening that overlaps at least partially with the opening.

[0414] According to one embodiment of the present invention, the electronic device may further include a non-conductive material located at the other opening.

[0415] According to one embodiment of the present invention, the electronic device may further include a conductive adhesive located between the conductive layer and the conductive portion.

[0416] According to one embodiment of the present invention, the electronic device may further include a battery positioned spaced apart from the display with the support member in between. The opening of the conductive layer and the other opening of the support member may overlap at least partially with the battery.

[0417] According to one embodiment of the present invention, the electronic device may further include a switching circuit configured to selectively electrically connect the first antenna or the second antenna to the communication circuit.

[0418] According to one embodiment of the present invention, the communication circuit may include the switching circuit.

[0419] According to one embodiment of the present invention, the signal may have a frequency of 13.56 MHz.

[0420] According to one embodiment of the present invention, an electronic device may include a communication circuit, a housing forming a first surface of the electronic device and a second surface facing in a direction different from the first surface, a display visually exposed through the first surface, and a plate positioned between the display and the second surface and comprising a conductive material. An opening is formed in the plate, and a portion of the plate surrounding the opening may form at least a portion of a first antenna. The electronic device may include a second antenna positioned to transmit or receive a signal in at least partially a different direction from the first antenna. The first antenna or the second antenna may be configured to be optionally electrically connected to the communication circuit, at least partially based on the folding state of the electronic device.

[0421] According to one embodiment of the present invention, the electronic device may further include a support member positioned between the plate and the second surface and comprising a conductive portion. Another opening may be formed in the conductive portion. The opening and the other opening may overlap at least partially when viewed in a direction substantially perpendicular to the first surface.

[0422] According to one embodiment of the present invention, a portable communication device may include a display, a communication circuit, and a plurality of antennas including a first antenna and a second antenna. At least one of the first antenna or the second antenna may transmit or receive a signal to or from the outside of the portable communication device through the display. The first antenna or the second antenna may be configured to be electrically connected to the communication circuit based at least partially on the folding state of the portable communication device.

[0423] According to one embodiment of the present invention, the electronic device may include a housing forming a first surface of the portable communication device and a second surface facing in a direction different from the first surface. The display may be visually exposed through the first surface. The electronic device may include a plate located between the first surface and the second surface and comprising a conductive material. An opening is formed in the plate, and a portion of the plate surrounding the opening may form the first antenna.

[0424] According to one embodiment of the present invention, the electronic device may include a support member positioned between the plate and the second surface and comprising a conductive material. Another opening may be formed in the support member. The opening and the other opening may overlap at least partially when viewed in a direction substantially perpendicular to the first surface.

[0425] According to one embodiment of the present invention, the second antenna may be positioned between the support member and the second surface.

[0426] According to various embodiments of the present invention, the electronic device may include a housing forming a first surface of the portable communication device and a second surface facing in a direction different from the first surface. The display may be visually exposed through the first surface. The first antenna may transmit or receive at least a portion of the signal to the outside through the first surface. The second antenna may transmit or receive at least a portion of the signal to the outside through the second surface.

[0427] According to one embodiment of the present invention, the first antenna and the second antenna can transmit or receive the signal to the outside through the display.

[0428] According to one embodiment of the present invention, when the portable communication device is at least partially outfolded such that the display has a first area facing a first direction and a second area facing a second direction different from the first direction, the communication circuit may be configured to transmit or receive at least a portion of the signal to the outside through the first area using the first antenna, and transmit or receive at least a portion of the signal to the outside through the second area using the second antenna.

[0429] According to one embodiment of the present invention, the first antenna or the second antenna may be configured to be optionally electrically connected to the communication circuit based further on the motion or posture of the portable communication device.

[0430] According to various embodiments of the present invention, the electronic device may include a housing forming a first surface of the portable communication device and a second surface different from the first surface. The display may be visually exposed through the first surface. The communication circuit may transmit or receive a signal to the outside through the display using the first antenna when the portable communication device is in a first folding state. The communication circuit may be configured to transmit or receive at least a portion of the signal to the outside through the second surface using the second antenna when the portable communication device is in a second folding state.

[0431] According to one embodiment of the present invention, a portable communication device may include a housing forming a first surface of the portable communication device and a second surface facing in a direction different from the first surface, a display visually exposed through the first surface, and a plate positioned between the display and the second surface and comprising a conductive material. A first opening is formed in the plate, and a portion of the plate surrounding the first opening may form at least a portion of an antenna. The electronic device may include a support member positioned between the plate and the second surface and comprising a conductive portion. A second opening may be formed in the conductive portion. The first opening and the second opening may overlap at least partially when viewed in a direction substantially perpendicular to the first surface.

[0432] According to one embodiment of the present invention, the electronic device may include another antenna located between the support member and the second surface.

[0433] According to one embodiment of the present invention, the antenna or the other antenna may be configured to be optionally electrically connected to the communication circuit based at least partially on the folding state of the portable communication device.

[0434] According to one embodiment of the present invention, a non-conductive material may be located in at least a portion of the second opening.

[0435] The embodiments of the present invention disclosed in this specification and drawings are merely specific examples provided to facilitate the explanation of the technical content according to the embodiments of the present invention and to aid in understanding the embodiments of the present invention, and are not intended to limit the scope of the embodiments of the present invention. Accordingly, the scope of the various embodiments of the present invention should be interpreted to include all modifications or variations derived based on the technical concept of the various embodiments of the present invention, in addition to the embodiments disclosed herein. Explanation of the symbols

[0437] 200: Electronic device 202: Front plate 211: Rear plate 218: Side member 311: First supporting member 361: Second support member 201: Display 410: 1st floor 411: Emitting layer 412: Optical layer 420: 2nd floor 430: Challenge Floor 431: The First Opening 3112: The 2nd Opening 409: Conductive material 341: First substrate assembly 440: 1st Printed Circuit Board 441: First shielding member 442: Second shielding member 403: Third antenna structure

Claims

Claim 1 An electronic device comprises: a display; a rear cover positioned opposite to the display; a conductive layer for electromagnetic interference (EMI) shielding for the display, positioned between the display and the rear cover and comprising a first opening; a first loop antenna comprising a radiated current flow path defined around the first opening in the conductive layer, comprising a feeding point and a grounding point, wherein the length of the edge extending from the feeding point to the grounding point along the edge of the first opening is formed to determine resonance at a selected or specified frequency; a support member positioned between the conductive layer and the rear cover and comprising a conductive portion; and a second loop antenna positioned between the support member and the rear cover and at least partially overlapping with the first opening when viewed from above the rear cover.An electronic device comprising a communication circuit, wherein the communication circuit is configured to transmit a signal passing through the display via the first loop antenna to the outside or receive from the outside, and is configured to transmit a signal passing through the rear cover via the second loop antenna to the outside or receive from the outside, wherein the first loop antenna or the second loop antenna is selectively electrically connected to the communication circuit based on the movement or orientation of the electronic device, and when the first loop antenna is electrically connected to the communication circuit, the radiated current flow path of the first loop antenna defined by the edge having the length forms an inductance value for the resonance at the selected or specified frequency, and the second opening is configured such that the second opening suppresses the magnetic flux of the electromagnetic field generated by the first loop antenna from being decelerated by the conductive part of the support member. Claim 2 delete Claim 3 An electronic device according to claim 1, further comprising a non-conductive material located in the second opening. Claim 4 An electronic device according to claim 1, further comprising a conductive adhesive positioned between the conductive layer and the conductive portion. Claim 5 The electronic device according to claim 1 further comprises a battery located between the support member and the rear cover, wherein the opening of the conductive layer and the second opening of the support member overlap at least partially with the battery. Claim 6 delete Claim 7 delete Claim 8 In claim 1, the signal is an electronic device having a frequency of 13.56 MHz. Claim 9 In an electronic device, a display; a support member configured to support the back surface of the display and including a conductive portion; a first antenna and a second antenna positioned spaced apart with a folding portion of the display between them, transmitting a signal passing through the display to the outside or receiving it from the outside; The electronic device includes a communication circuit configured to be electrically connected to the first antenna or the second antenna in a folded state in which the display is folded outward, wherein the first antenna is a loop antenna formed based on a first opening included in a conductive layer forming at least a portion of the back surface of the display, and a radiating current flow path defined around the first opening in the conductive layer, wherein the first antenna includes a feeding point and a grounding point, and the length of the edge extending from the feeding point to the grounding point along the edge of the first opening is formed to determine resonance at a selected or specified frequency, and when the first antenna is electrically connected to the communication circuit, the radiating current flow path of the first antenna defined by the edge having the length forms an inductance value for the resonance at the selected or specified frequency, and the second opening is included in which the conductive portion of the support member at least partially overlaps with the first opening of the conductive layer, and the second opening An electronic device configured to suppress the magnetic flux of the electromagnetic field generated by the first loop-type antenna from being decelerated by the conductive part of the support member. Claim 10 In claim 9, the first antenna or the second antenna is an electronic device that is optionally electrically connected to the communication circuit based on the motion or orientation of the electronic device in the folded state. Claim 11 delete Claim 12 delete Claim 13 An electronic device according to claim 9, further comprising a non-conductive material located in the second opening. Claim 14 An electronic device according to claim 9, further comprising a conductive adhesive located between the conductive layer and the conductive portion. Claim 15 In claim 9, the electronic device further comprises a battery positioned spaced apart from the display with the support member in between, wherein the first opening of the conductive layer and the second opening of the support member overlap at least partially with the battery. Claim 16 An electronic device according to claim 9, further comprising a switching circuit configured to selectively electrically connect the first antenna or the second antenna to the communication circuit. Claim 17 In claim 16, the communication circuit is an electronic device comprising the switching circuit. Claim 18 In claim 9, the signal is an electronic device having a frequency of 13.56 MHz. Claim 19 An electronic device comprises: a communication circuit; a housing forming a first surface of the electronic device and a second surface facing in a direction different from the first surface; a display visually exposed through the first surface; a plate positioned between the display and the second surface and comprising a conductive material, wherein a first opening is formed in the plate, and a portion of the plate surrounding the first opening forms at least a portion of a first antenna; and a second antenna positioned to transmit or receive a signal in at least partially a direction different from the first antenna. and includes a support member positioned between the plate and the second surface and including a conductive portion, wherein the first antenna or the second antenna is configured to be optionally electrically connected to the communication circuit based at least partially on the folding state of the electronic device, wherein the first antenna is a loop antenna including a radiating current flow path defined around the first opening in the plate, comprising a feeding point and a grounding point, wherein the length of the edge extending from the feeding point to the grounding point along the edge of the first opening is formed to determine resonance at a selected or specified frequency, and when the first antenna is electrically connected to the communication circuit, the radiating current flow path of the first antenna defined by the edge having the length forms an inductance value for the resonance at the selected or specified frequency, and the support member includes a second opening in which the conductive portion of the support member overlaps at least partially with the first opening, wherein the second opening allows the magnetic flux of the electromagnetic field generated by the first antenna to... An electronic device configured to suppress deceleration by the above-mentioned challenge portion. Claim 20 delete

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