Vapor chamber and manufacturing method thereof

Abstract

According to the present invention, a vapor chamber may be provided comprising: an upper housing made of a non-metallic material, comprising an upper bonding surface and an upper seating portion formed on at least a part of the upper bonding surface; a lower capillary force generating portion; a lower housing made of a non-metallic material, comprising a lower bonding surface and a lower seating portion formed on at least a part of the lower bonding surface; a head portion disposed on the upper seating portion and the lower seating portion; and an operating fluid provided inside the space formed by the upper housing and the lower housing.

Description

Technology Field

[0001] The present invention relates to a vapor chamber and a method for manufacturing the same, and specifically to a vapor chamber with reduced radio interference and a method for manufacturing the same. Background Technology

[0002] Generally, vapor chambers use high thermal conductivity metals such as silver, copper, and aluminum, and are usefully employed in various fields to cool heat-generating parts at specific locations in electronic products or to recover heat. Such vapor chambers consist of a plate-shaped housing made of metal material and a working fluid contained inside the housing.

[0003] When one side of the housing is heated, the working fluid inside the heated space evaporates, and the evaporated working fluid moves to the unheated space and condenses, so that the heat from the heated space is transferred in the form of the latent heat of the working fluid.

[0004] These vapor chambers can be constructed to be thin, allowing them to be used in small electronic devices, such as wireless communication devices. While conventional wireless communication devices did not use high frequencies, the increasing use of high frequencies due to rising data usage is causing radio interference caused by vapor chambers.

[0005] The background technology of the present invention is disclosed in Korean Registered Patent Publication No. 10-2407157 (Registered June 3, 2022; Title of Invention: Vapor Chamber with Efficient Heat Dissipation Structure). The problem to be solved

[0006] The objective of the present invention is to provide a vapor chamber with reduced radio interference.

[0007] Another objective of the present invention is to provide a method for manufacturing a vapor chamber with reduced radio interference. means of solving the problem

[0008] According to the present invention, a vapor chamber may be provided comprising: an upper housing made of a non-metallic material, comprising an upper bonding surface and an upper seating portion formed on at least a part of the upper bonding surface; a lower capillary force generating portion; a lower housing made of a non-metallic material, comprising a lower bonding surface and a lower seating portion formed on at least a part of the lower bonding surface; a head portion disposed on the upper seating portion and the lower seating portion; and an operating fluid provided inside the space formed by the upper housing and the lower housing.

[0009] Alternatively, the upper housing may include an upper capillary force generating part, and the capillary force generated in the upper capillary force generating part is configured to be less than or equal to the capillary force generated in the lower capillary force generating part, and at least one of the upper bonding surface and the lower bonding surface may be coated with silver.

[0010] Alternatively, the upper bonding surface and the lower bonding surface may be bonded with silver.

[0011] Alternatively, the upper housing includes an upper capillary force generating part, the width of the groove of the upper capillary force generating part is formed wider than the width of the groove of the lower capillary force generating part, and the upper bonding surface and the lower bonding surface can be bonded by a laser.

[0012] Alternatively, the upper seating portion may include a stopper in at least a portion of the section, the head portion may be positioned adjacent to the stopper, and the lower joining surface may include a guide, and the guide may contact at least a portion of the upper housing.

[0013] Alternatively, the lower joint surface may include a horizontal joint, and the horizontal joint may come into contact with the upper joint surface.

[0014] Alternatively, the lower joining surface includes a vertical joining portion and a vertical joining portion extending from the lower joining surface, and the vertical joining portion may contact at least a portion of the outer surface of the upper housing.

[0015] According to the present invention, a method for manufacturing a vapor chamber comprising an upper housing made of a non-metallic material including an upper joining surface and an upper seating portion formed on at least a part of the upper joining surface, a lower capillary force generating portion, a lower housing made of a non-metallic material including a lower joining surface and a lower seating portion formed on at least a part of the lower joining surface, and a tube including a head portion and a body portion, is provided, the method comprising the steps of joining the upper housing, the lower housing, and the tube, injecting an operating fluid into a space formed by the upper housing and the lower housing through the tube, discharging gas inside the upper housing and the lower housing through the tube, and removing the body portion of the tube.

[0016] In addition, the step of joining the upper housing, the lower housing, and the tube may include joining operations using silver.

[0017] In addition, the step of joining the upper housing, the lower housing, and the tube may include joining operations using a laser.

[0018] Additionally, the upper housing includes an upper capillary force generating part, and the width of the groove of the upper capillary force generating part is formed wider than the width of the groove of the lower capillary force generating part, and at least one of the upper bonding surface and the lower bonding surface may be coated with silver.

[0019] Additionally, the upper seating portion includes a stopper, the head portion is positioned adjacent to the stopper, and the lower joining surface includes a guide, and the guide can contact at least a part of the upper housing.

[0020] Additionally, the step of discharging gas inside the housing may include the operation of forming a vacuum inside the upper housing and the lower housing. Effects of the invention

[0021] According to the present invention, a vapor chamber can be provided that reduces the degree of interference with radio waves in a wireless communication device while maintaining cooling performance.

[0022] In addition, according to the present invention, a method for manufacturing a vapor chamber that reduces the degree of interference with radio waves in a wireless communication device while maintaining cooling performance can be provided. Brief explanation of the drawing

[0023] FIG. 1a is a perspective view of a vapor chamber according to one embodiment of the present invention, FIG. 1b is an exploded perspective view of a vapor chamber according to one embodiment of the present invention, and FIG. 1c is a plan view of an upper housing and a lower housing of a vapor chamber according to one embodiment of the present invention. FIG. 2a is a cross-sectional view of a vapor chamber cut perpendicular to the longitudinal direction according to one embodiment of the present invention, and FIG. 2b is a cross-sectional view of a vapor chamber cut perpendicular to the longitudinal direction according to another embodiment of the present invention. FIG. 3 is a flowchart of a method for manufacturing a vapor chamber according to one embodiment of the present invention. Specific details for implementing the invention

[0024] Hereinafter, a vapor chamber according to the present invention and a method for manufacturing the same will be described with reference to the attached drawings.

[0025] In this process, the thickness of lines or the size of components depicted in the drawings may be exaggerated for the sake of clarity and convenience of explanation. Furthermore, the terms described below are defined considering their functions in the present invention, and these may vary depending on the intentions or conventions of the user or operator. Therefore, the definitions of these terms should be based on the content throughout this specification.

[0027] FIG. 1a is a perspective view of a vapor chamber according to one embodiment of the present invention, FIG. 1b is an exploded perspective view of a vapor chamber according to one embodiment of the present invention, and FIG. 1c is a plan view of an upper housing and a lower housing of a vapor chamber according to one embodiment of the present invention.

[0028] Referring to FIGS. 1a, 1b, and 1c, according to one embodiment, the vapor chamber (1) may include at least a portion of the housing (10) and the tube (20). The thickness of the vapor chamber (1) may be about 1 mm to about 10 mm. The size and thickness of the vapor chamber (1) may vary depending on the design of the electronic product in which the vapor chamber (1) is mounted. The vapor chamber (1) may be placed in contact with or adjacent to a heat-generating element in the electronic product. As the vapor chamber (1) is placed in contact with or adjacent to a heat-generating element, the temperature rise of the electronic product can be suppressed.

[0029] According to one embodiment, the housing (10) of the vapor chamber (1) may include at least a portion of an upper housing (110), a lower housing (120), and a tube (20). At least a portion of the tube (20) may be removed during the manufacturing process of the vapor chamber (1). A description of the manufacturing process of the vapor chamber (1) will be provided later, together with the description of FIG. 4.

[0030] According to one embodiment, the upper housing (110) and the lower housing (120) may be made of a non-metallic material. According to one embodiment, the upper housing (110) and the lower housing (120) may be made of a non-metallic material including glass, carbon, and ceramic. Since the upper housing (110) and the lower housing (120) are made of a non-metallic material, the vapor chamber (1) may not interfere with radio waves used for communication of the electronic product even when mounted on the electronic product. Accordingly, the vapor chamber (1) may not interfere with radio waves while maintaining cooling performance.

[0031] According to one embodiment, a working fluid (not shown) may be disposed inside a housing (10). The working fluid (not shown) may be heated and vaporized (evaporated) in a part of the vapor chamber (1) in contact with a heat-generating element, and may be liquefied in a part where no heat is generated. As such, as the working fluid vaporizes (evaporates) and liquefies, heat generated from a heat-generating element in a narrow area of ​​the electronic product can be conducted to a wide area. Accordingly, cooling can be achieved on the heat-generating element of the electronic product. The working fluid (not shown) may be a fluid including water, ammonia, ethanol, Novec 7000 (a product of Novec 7000 3M™), etc. According to one embodiment, the working fluid (not shown) may be a material with a low dielectric constant (or dielectric constant).

[0032] According to one embodiment, an upper capillary force generating part (111) and a lower capillary force generating part (112) may be disposed on the lower surface of the upper housing (110) and the upper surface of the lower housing (120).

[0033] According to one embodiment, the upper capillary force generating part (111) may be disposed on the lower surface of the upper housing (110). The upper capillary force generating part (111) may be formed as a groove with a size of micrometers (μm). According to one embodiment, the width (W1) of the upper capillary force generating part (111) may be approximately 20 μm to approximately 100 μm. The upper capillary force generating part (111) is formed as a groove so that capillary force can act with a liquid working fluid disposed inside the housing (10). As capillary force acts between the upper capillary force generating part (111) and the liquid working fluid, the liquid working fluid may move to a part of the upper housing (110) corresponding to a location adjacent to the heating element of the electronic product. According to one embodiment, the direction in which the groove of the upper capillary force generating part (111) is disposed may be configured to be parallel to the longitudinal direction of the vapor chamber (1). According to another embodiment, the direction in which the grooves of the upper capillary force generating part (111) are arranged may be configured to be perpendicular to the longitudinal direction of the vapor chamber (1). According to yet another embodiment, the grooves of the upper capillary force generating part (111) may be configured in a grid shape.

[0034] According to one embodiment, the lower capillary force generating part (121) may be disposed on the upper surface of the lower housing (120). The upper capillary force generating part (121) may be formed as a groove with a size of micrometers (μm). The width (W2) of the lower capillary force generating part (121) may be approximately 20 μm to approximately 100 μm. The lower capillary force generating part (121) is formed as a groove so that capillary force can act with a liquid working fluid disposed inside the housing (10). As capillary force acts between the lower capillary force generating part (121) and the liquid working fluid, the liquid working fluid may move to a part of the lower housing (120) corresponding to a location adjacent to the heating element of the electronic product. According to one embodiment, the direction in which the groove of the lower capillary force generating part (121) is disposed may be configured to be parallel to the longitudinal direction of the vapor chamber (1). According to another embodiment, the direction in which the grooves of the lower capillary force generating part (121) are arranged may be configured to be perpendicular to the longitudinal direction of the vapor chamber (1). According to yet another embodiment, the grooves of the lower capillary force generating part (121) may be configured in a grid shape.

[0035] According to one embodiment, the width (W1) of the groove of the upper capillary force generating part (111) and the width (W2) of the groove of the lower capillary force generating part (121) may be formed to be the same. According to one embodiment, the width (W1) of the groove of the upper capillary force generating part (111) and the width (W2) of the groove of the lower capillary force generating part (121) may be formed differently. For example, the width (W1) of the groove of the upper capillary force generating part (111) may be formed to be larger than the width (W2) of the groove of the lower capillary force generating part (121).

[0036] According to another embodiment, the width (W1) of the groove in the upper capillary force generating part (111) may be formed to be larger than the width (W2) of the groove in the lower capillary force generating part (121). Accordingly, the capillary force generated in the lower capillary force generating part (121) may be greater than the capillary force generated in the upper capillary force generating part (111). Additionally, the lower housing (120) in which the lower capillary force generating part (121) is formed may be positioned closer to the heat source than the upper housing (110). Accordingly, the working fluid provided inside the housing (10) may vaporize (evaporate) in the lower capillary force generating part (121) and condense in the upper capillary force generating part (111).

[0037] According to one embodiment, the upper capillary force generating part (111) can function as a condensing part, and the lower capillary force generating part (121) can function as an evaporating part.

[0038] In FIG. 1c, the upper capillary force generating part (111) and the lower capillary force generating part (121) are shown as straight lines. According to another embodiment, the upper capillary force generating part (111) and the lower capillary force generating part (121) may be configured in various forms, such as radial or slit-shaped forms in which a part of the straight line is cut off. In addition, to reduce the pressure drop caused by the flow of fluid, the shape of the cross-section of the upper capillary force generating part (111) and the lower capillary force generating part (121) may be configured in various ways depending on the location of the vapor chamber (1).

[0039] The upper capillary force generating part (111) and the lower capillary force generating part (121) can be implemented in the form of micromosts. The upper capillary force generating part (111) and the lower capillary force generating part (121) can be composed of a microporous structure formed by sintering powder made of non-metal.

[0040] According to one embodiment, a plurality of heat dissipation members (112) may be disposed on the upper surface of the upper housing (110). According to one embodiment, the heat dissipation members (112) may be formed as concave grooves facing the lower side from the upper surface of the upper housing (110). According to another embodiment, the heat dissipation members (112) may be formed in a shape protruding upward from the upper surface of the upper housing (110). The heat dissipation members (112) are disposed on the upper surface of the upper housing (110) so as to dissipate heat transferred to the upper housing (110) through a working fluid (not shown) to the outside of the vapor chamber (1). As the heat dissipation members (112) are disposed on the upper surface of the upper housing (110), the area of ​​the upper housing (110) may be increased, and accordingly, the heat dissipation performance of the vapor chamber (1) may be improved, and the cooling performance may also be improved.

[0041] According to one embodiment, an upper bonding surface (113) may be formed on the outer portion of the lower surface of the upper housing (110). The upper bonding surface (113) may be formed to protrude toward the lower side of the upper housing (110). At least a portion of the upper bonding surface (113) may be coated with silver (Ag). The upper bonding surface (113) may not come into contact with a working fluid (not shown) placed inside the housing (10).

[0042] According to one embodiment, a lower bonding surface (122) may be formed on the outer portion of the upper surface of the lower housing (120). The lower bonding surface (122) may be formed to protrude toward the upper side of the lower housing (120). At least a portion of the lower bonding surface (122) may be coated with silver (Ag). The lower bonding surface (122) may not come into contact with a working fluid (not shown) placed inside the housing (10).

[0043] According to one embodiment, the upper joining surface (113) and the lower joining surface (122) may be arranged to be in contact. As the upper joining surface (113) and the lower joining surface (122) come into contact, the working fluid (not shown) placed inside the housing (10) may be surrounded by the housing (10).

[0044] According to one embodiment, an upper seating portion (114) may be formed on at least a portion of the lower surface of the upper housing (110), and a lower seating portion (123) may be formed on at least a portion of the upper surface of the lower housing (120). The upper seating portion (114) and the lower seating portion (123) may be formed at corresponding positions. The upper seating portion (114) may be formed as a groove that is concavely formed upwards relative to the upper bonding surface (113). The lower seating portion (123) may be formed as a groove that is concavely formed downwards relative to the lower bonding surface (122). At least a portion of the tube (20) may be disposed between the upper seating portion (114) and the lower seating portion (123).

[0045] According to one embodiment, at least a portion of the tube (20) may be inserted inside the housing (10). The tube (20) may include a head portion (210) and a body portion (220). The tube (20) may be configured in a hollow form to allow material to move. According to one embodiment, the head portion (210) may be inserted inside the housing (10), and the body portion (220) may be placed outside the housing (10). The upper housing (110) and the lower housing (120) are combined, and the tube (20) may be placed between the upper seating portion (114) of the upper housing (110) and the lower seating portion (123) of the lower housing (120). Through the tube (20), an operating fluid (not shown) may be introduced into the housing (10), and air inside the housing (10) may be discharged to the outside of the housing (10). Accordingly, the space excluding the volume occupied by the working fluid (not shown) inside the housing (10) can be formed as a vacuum.

[0046] According to one embodiment, a stopper (115) may be formed on at least a portion of the upper seating portion (114). At least a portion of the stopper (115) may be formed to be bent so as to prevent the tube (20) from being excessively inserted into the housing (10).

[0048] FIG. 2a is a cross-sectional view of a vapor chamber cut perpendicular to the longitudinal direction according to one embodiment of the present invention, and FIG. 2b is a cross-sectional view of a vapor chamber cut perpendicular to the longitudinal direction according to another embodiment of the present invention.

[0049] The upper housing (110), upper capillary force generating part (111), upper bonding surface (113), lower housing (120), lower capillary force generating part (121), and lower bonding surface (122) illustrated in FIGS. 2a and 2b may be identical or similar to the upper housing (110), upper capillary force generating part (111), upper bonding surface (113), lower housing (120), lower capillary force generating part (121), and lower bonding surface (122) illustrated in FIGS. 1a to 1c. Therefore, descriptions of identical configurations may be omitted.

[0050] According to one embodiment, the width (W1) of the groove of the upper capillary force generating part (111) can be formed to be larger than the width (W2) of the groove of the lower capillary force generating part (111).

[0051] Referring to FIG. 2a, according to one embodiment, a guide (122-1) may be formed on the lower joint surface (122) inside the housing (10). The guide (122-1) may be configured to cover the joint between the upper housing (110) and the lower housing (120) when the upper housing (110) and the lower housing (120) are joined. As the guide (122-1) covers the joint between the upper housing (110) and the lower housing (120), the working fluid (not shown) may be prevented from being discharged to the outside.

[0052] According to one embodiment, a horizontal joint (122-2) may be formed on the lower joint surface (122) on the outer side of the housing (10). The horizontal joint (122-2) may be a portion coated with silver (Ag). As the horizontal joint (122-2) is positioned, the airtightness of the housing (10), which is composed of an upper housing (110) and a lower housing (120), may be improved.

[0053] According to one embodiment, the upper housing (110) and the lower housing (120) may be brazed with silver (Ag). When the silver-coated horizontal joint (122-2) is brazed with silver (Ag), the airtightness of the housing (10) may be further improved.

[0054] According to one embodiment, the upper bonding surface (113) of the upper housing (110) and the lower bonding surface (122) of the lower housing (120) can be bonded by laser. As the upper housing (110) and the lower housing (120) are bonded by laser, the airtightness of the housing (10) can be improved.

[0055] Referring to FIG. 2b, according to another embodiment, a vertical coupling portion (122-21) may be formed on the lower joining surface (122) on the outer side of the housing (10). The vertical coupling portion (122-21) of the lower housing (120) may come into contact with the outer surface of the upper housing (110). As the vertical coupling portion (122-21) comes into contact with the outer surface of the upper housing (110) and the upper housing (110) and the lower housing (120) are joined, the bonding force between the upper housing (110) and the lower housing (120) may be improved.

[0056] According to one embodiment, a vertical joint (122-22) may be disposed on the inner upper portion of the vertical joint (122-21). The vertical joint (122-22) may be a portion coated with silver (Ag). As the vertical joint (122-22) is disposed, the airtightness of the housing (10) composed of the upper housing (110) and the lower housing (120) may be improved.

[0057] According to one embodiment, the upper bonding surface (113) of the upper housing (110) and the lower bonding surface (122) of the lower housing (120) can be bonded by laser. As the upper housing (110) and the lower housing (120) are bonded by laser, the airtightness of the housing (10) can be improved.

[0059] FIG. 3 is a flowchart of a method for manufacturing a vapor chamber according to one embodiment of the present invention.

[0060] According to one embodiment, a vapor chamber (1) can be manufactured by the following method. A step (S401 in FIG. 3) of joining and bonding an upper housing (110), a lower housing (120), and a tube (20) can be performed. The upper bonding surface (113) of the upper housing (110) and the lower bonding surface (122) of the lower housing (120) can be joined. A head portion (210) of the tube (20) can be placed between the upper seating portion (114) of the upper housing (110) and the lower seating portion (123) of the lower housing (120). The head portion (210) can be placed on the upper seating portion (114) of the upper housing (110) and the lower seating portion (122) of the lower housing (120). Prior to joining the upper housing (110) and the lower housing (120), silver (Ag) may be coated on at least a portion of the upper joining surface (113) and / or at least a portion of the lower joining surface (122). Alternatively, the operation of coating silver on at least a portion of the upper joining surface (113) and / or at least a portion of the lower joining surface (122) may be included. The upper housing (110) and the lower housing (120) may be joined by brazing with silver (Ag).

[0061] According to one embodiment, a step (S402 of FIG. 3) can be performed in which an operating fluid (not shown) is injected through the tube (20) while the upper housing (110), lower housing (120), and tube (20) are joined. The operating fluid can be injected into the housing (10) such that the volume of the operating fluid is smaller than the volume of the space inside the housing (10).

[0062] According to one embodiment, the gas in the space excluding the volume occupied by the working fluid within the housing (10) can be discharged through the tube (20) (S403 of FIG. 3). Accordingly, a vacuum can be formed inside the housing (10). As the air pressure inside the housing (10) is lowered, only the working fluid can be placed inside the housing (10). As the inside of the housing (10) is configured as a vacuum containing the working fluid or as a low air pressure, the working fluid can be easily vaporized (evaporated). Accordingly, the cooling performance, heat dissipation performance, and / or heat transfer performance of the vapor chamber (1) can be improved.

[0063] According to one embodiment, a step (S404 in FIG. 3) of removing at least a portion of the tube (20) coupled to the upper housing (110) and the lower housing (120) may be performed. According to one embodiment, the body portion (220) of the head portion (210) and the body portion (220) of the tube (20) may be removed. As the body portion (220) is removed, the hole formed in the tube (20) may be sealed. Accordingly, the pressure inside the housing (10) may be maintained at low or zero.

[0065] Although the present invention has been described with reference to the embodiments illustrated in the drawings, this is merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible therefrom. Furthermore, the present invention may be used in other fields. Accordingly, the true technical scope of protection of the present invention should be determined by the claims below. Explanation of the symbols

[0066] 1: Vapor Chamber 10: Housing 110: Upper housing 111: Upper capillary force generating part W1: Width of the groove in the upper capillary force generating part 112: Heat dissipation unit 113: Upper joint surface 114: Upper seating part 115: Stopper 120: Lower housing 121: Lower capillary force generating part W2: Width of the groove in the lower capillary force generating part 122: Lower joint surface 122-1: Guide 122-2: Horizontal joint 122-21: Vertical joint 122-22: Vertical joint 123: Lower seating part 20: Tube 210: Head section 220: Torso

Claims

Claim 1 An upper housing comprising an upper bonding surface and an upper seating portion formed on at least a part of the upper bonding surface, and composed of a non-metallic material; a lower housing comprising a lower capillary force generating portion, a lower bonding surface and a lower seating portion formed on at least a part of the lower bonding surface, and composed of a non-metallic material; a head portion disposed on the upper seating portion and the lower seating portion; and a working fluid provided within a space formed by the upper housing and the lower housing, wherein the lower bonding surface comprises a guide, the guide contacts at least a part of the upper housing, the guide is disposed inside the housing, extends from the lower bonding surface, and covers a seam formed between the upper housing and the lower housing. Claim 2 In claim 1, the upper housing includes an upper capillary force generating part, the capillary force generated in the upper capillary force generating part is configured to be less than or equal to the capillary force generated in the lower capillary force generating part, and at least one of the upper bonding surface and the lower bonding surface is coated with silver, forming a vapor chamber. Claim 3 In paragraph 2, the upper joining surface and the lower joining surface are a vapor chamber joined with silver. Claim 4 In claim 1, the upper housing includes an upper capillary force generating part, the width of the groove of the upper capillary force generating part is formed wider than the width of the groove of the lower capillary force generating part, and the upper bonding surface and the lower bonding surface are laser-bonded vapor chambers. Claim 5 In claim 1, the upper seating portion includes a stopper in at least a portion of the section, and the head portion is a vapor chamber disposed adjacent to the stopper. Claim 6 In paragraph 5, the lower joint surface includes a horizontal joint, and the horizontal joint is a vapor chamber in contact with the upper joint surface. Claim 7 In claim 5, the lower joint surface includes a vertical joint portion and a vertical joint portion extending from the lower joint surface, and the vertical joint portion is a vapor chamber in contact with at least a portion of the outer surface of the upper housing. Claim 8 A method for manufacturing a vapor chamber comprising: an upper housing made of a non-metallic material including an upper joining surface and an upper seating portion formed on at least a part of the upper joining surface; a lower capillary force generating portion; a lower housing made of a non-metallic material including a lower joining surface and a lower seating portion formed on at least a part of the lower joining surface; and a tube including a head portion and a body portion, wherein the method comprises: joining the upper housing, the lower housing, and the tube; injecting an operating fluid into a space formed by the upper housing and the lower housing through the tube; discharging gas inside the upper housing and the lower housing through the tube; and removing the body portion of the tube, wherein, in the joining step, a guide formed on the lower joining surface contacts the inner surface of the upper housing, and the guide is disposed inside the housing and extends from the lower joining surface and covers a seam formed between the upper housing and the lower housing. Claim 9 In claim 8, the step of joining the upper housing, the lower housing, and the tube comprises a joining operation using silver, a method for manufacturing a vapor chamber. Claim 10 In claim 8, the step of joining the upper housing, the lower housing, and the tube comprises a joining operation using a laser, in a method for manufacturing a vapor chamber. Claim 11 A method for manufacturing a vapor chamber according to claim 8, wherein the upper housing includes an upper capillary force generating part, the width of the groove of the upper capillary force generating part is formed wider than the width of the groove of the lower capillary force generating part, and at least one of the upper bonding surface and the lower bonding surface is coated with silver. Claim 12 A method for manufacturing a vapor chamber according to claim 8, wherein the upper seating portion includes a stopper, and the head portion is positioned adjacent to the stopper. Claim 13 In claim 8, the step of discharging gas inside the housing comprises a method for manufacturing a vapor chamber that includes forming a vacuum inside the upper housing and the lower housing.

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