INTEGRATED POWER SWITCHING DEVICE HEAT SINK

Abstract

An electrical assembly comprising a semiconductor die, a heat sink, and a housing. The semiconductor die includes a power semiconductor device with a plurality of terminals and a plurality of electrically conductive wires. Each of the conductive wires is electrically coupled to one of the associated terminals on the power semiconductor device. The heat sink has a base, a mounting, and a plurality of fins. The mounting extends from a first side of the base and is coupled to the semiconductor die. The fins are fixedly coupled to the base and extend from a second side of the base opposite the first side. The housing is formed from an electrically insulating material. One of the wires is unitarily and integrally formed with the mounting.

Description

ELECTRICAL ASSEMBLY HAVING A HEAT SINK FORMED ONE AND ONLY FROM A POWER SEMICONDUCTOR WIRE BACKGROUND OF THE INVENTION Cross-References to Related Applications

[0001] The present application is a request for continuation of the derivation in part of International Application No. PCT / US2020 / 029925 filed on April 24, 2020, which claims the benefit of U.S. Provisional Application No. 62 / 838,893 filed on April 25, 2019 and U.S. Provisional Application No. 62 / 904,199 filed on September 23, 2019, disclosures of which are incorporated by reference as set forth in detail herein. Technical Field of the Invention

[0002] The present invention relates to an electrical assembly or unit having a heat sink that is formed unitarily and integrally with a power semiconductor wire or conductor. Background of the Related Technique

[0003] This section provides background information, background or prior knowledge related to the present invention that is not necessarily the state of the art.

[0004] Although interest in electrifying vehicle drivelines, transmissions, or powertrains has increased, there are significant problems that must be overcome before vehicles with electrified drivelines substantially displace those drivelines powered, driven, or energized solely by internal combustion engines. Some of these problems include the cost of electrified drivelines, their size and how well they can be packaged within the available space in a vehicle, and the robustness of the electronics used to operate and control them. Summary of the Invention

[0005] This section provides a general summary of the invention, and is not a complete disclosure of its scope or all of its features.

[0006] In one embodiment, the present invention provides an electrical assembly comprising a semiconductor die, a plurality of electrically conductive wires, a heat sink, and a housing, cover, or enclosure. The semiconductor die comprises a power semiconductor device having a plurality of terminals. Each of the electrically conductive wires is electrically coupled to one of the associated terminals on the power semiconductor device. The heat sink is formed from an electrically and thermally conductive material and includes a base, a mounting or bracket, and a plurality of fins. The mounting or base extends from a first side of the base and is coupled to the semiconductor die. The fins are fixedly coupled to the base and extend from a second side of the base opposite the first side of the base. The housing is formed from a first electrically insulating material.One of the first cables in the plurality of cables is formed unitarily and integrally with the support. Ln / zznz / E / YiAi

[0007] In one embodiment, each of the wires that is not unitarily and integrally formed with the assembly or mount is electrically coupled to its associated terminal via a connecting or bonding wire or cable. In one embodiment, the semiconductor die is coupled to the assembly using at least one solder material and one sintering material. In one embodiment, the plurality of fins is unitarily and integrally formed with the base. In one embodiment, the electrically and thermally conductive material of which the heat sink is formed comprises at least one copper and one aluminum. In one embodiment, the base and the assembly are integrally formed. In one embodiment, the power semiconductor device comprises a field-effect transistor. In one embodiment, the field-effect transistor is a silicon metal oxide field-effect transistor. In one embodiment, at least a portion of each of the plurality of fins is cuboid or cube-shaped.In one embodiment, at least a portion or part of each of the plurality of fins is rod-shaped. In one embodiment, the plurality of fins is orthogonal to the wires. In one embodiment, the base of the heat sink has a first side that is wavy or corrugated and a second side opposite the first side, wherein the second side is linear. In one embodiment, a length of the plurality of fins increases from a first edge of the heat sink to a second edge of the heat sink. In one embodiment, the electrical assembly further includes an inverter assembly and a plurality of busbars, the inverter assembly being formed of a second electrically insulating material and defining a mounting flange, wherein a portion of the electrically conductive wires is received through the mounting flange and electrically and mechanically coupled to one of the associated busbars or distribution bars.In one form, the electrical assembly includes a stator, the stator having a motor winding, and wherein the heat sink is electrically coupled to the motor winding. / «nn ίη / ζζηζ / Ε / γίΛΐ

[0008] In one form, the present invention provides a method for manufacturing a semiconductor package including a plurality of wires. The method includes: providing a heat sink formed of an electrically and thermally conductive material, the heat sink having a base, an assembly, and a plurality of fins, wherein the assembly extends from a first side of the base, the plurality of fins are fixedly coupled to the base and extend from a second side of the base opposite the first side of the base, and wherein one of the first plurality of wires is formed unitarily and integrally with the assembly; attaching or joining a semiconductor die including a power semiconductor device to the heat sink assembly, the power semiconductor device having a plurality of terminals;couple each of the cables that is not formed unitarily and integrally with the assembly to its associated terminal via a connecting cable; and encapsulate the semiconductor die and assembly with a housing or casing formed from a first electrically insulating material.

[0009] Other areas of applicability will become apparent from the description provided herein. The description and specific examples in this summary are for illustrative purposes only and are not intended to limit the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The drawings described in this document are for illustrative purposes only of certain embodiments and not of all possible implementations, and are not intended to limit the scope of the present invention. / «nn ίη / ζζηζ / Ε / γίΛΐ

[0011] Figures 1 and 2 are longitudinal section views of an exemplary electric drive module constructed in accordance with the teachings of the present invention;

[0012] Figures 3 and 4 are cross-sectional views of a portion or part of the electric drive unit of Figure 1, which illustrate the construction of a motor assembly in greater detail;

[0013] Figures 5 and 6 are cross-sectional views of a part of the electric drive unit of Figure 1;

[0014] Figure 7 is a perspective view of a portion of the motor assembly, which illustrates a portion of an inverter transparently and in greater detail;

[0015] Figures 8 and 9 are perspective views of a power semiconductor package having a plurality of rod-shaped fins and cube-shaped fins, respectively;

[0016] Figure 10 is a perspective view of a power semiconductor package with its housing or casing removed for clarity;

[0017] Figure 11 is an investor's perspective view;

[0018] Figures 12 to 15 are partial cross-sectional views of a busbar or distribution busbar;

[0019] Figure 16 is a perspective view of the inverter shown with an end plate; Ln / zznz / E / YiAi

[0020] Figure 17 is a cross-sectional view of a portion of the electric drive unit of Figure 1, illustrating a sensor assembly having a TMR sensor that is mounted on a tablet or control board and a magnet that is coupled to rotate with a rotor of the motor assembly;

[0021] Figure 18 is a perspective view of the electric drive unit of Figure 1;

[0022] Figure 19 is a rear perspective view of a portion of an electric drive unit housing of Figure 1;

[0023] Figure 20 is a perspective view of a portion of the electric drive unit of Figure 1 with the housing portion shown in Figure 18 removed;

[0024] Figure 21 is similar to that in Figure 19, but shows the electric drive unit with a portion of the transmission and differential assembly removed;

[0025] Figure 22 is similar to that in Figure 20, but shows another portion of the housing removed to better show a portion of the transmission;

[0026] Figure 23 is a cross-sectional view of a portion of the electric drive unit shown in Figure 21; and

[0027] Figures 24 to 45 are cross-sectional views of various portions of the electric drive unit of Figure 1, depicting the cooling and lubrication oil flow through various portions of the electric drive unit.

[0028] The corresponding reference numbers indicate the corresponding parts throughout the various views of the drawings. DETAILED DESCRIPTION OF THE INVENTION

[0029] With reference to Figures 1 and 2, an exemplary electric drive module constructed in accordance with the teachings of the present invention is generally designated by reference number 10. The electric drive module 10 includes a housing or casing assembly 12, an electric motor 14, a control unit 16, a transmission 18, a differential assembly 20, a pair of output shafts 22a and 22b, a pump 24, a heat exchanger 26 (Figure 5), and a filter 28.

[0030] The housing assembly 12 may house, enclose, cover, or protect the motor 14, control unit 16, transmission, and differential assembly 20. The electric motor 14 may be any type of electric motor and may have a stator 32 and a rotor 34. The stator 32 may include field windings or coils 36, while the rotor 34 may include a rotor shaft 38 that may be arranged within the stator 32 to rotate about a first axis of rotation 40.

[0031] The transmission 18 may include a planetary reduction 42, a shaft 44, and a transmission output gear 46. The planetary reduction may have a sun gear, which may be unitarily and integrally formed with the rotor shaft 38 to keep the pitch line speed as low as possible, a ring gear, which may be grounded or non-rotatingly coupled to the housing assembly 12, a planet carrier, and a plurality of planetary gears that may be periodically supported by the planetary carrier and that may mesh with both the sun gear and the ring gear. The sun gear, ring gear, and planetary gears may be helical gears.The shaft 44 can be mounted on a bearing or bushing assembly 60 that supports the shaft for rotation about the first axis of rotation 40 relative to the housing assembly 12. The output gear of the transmission 46 can be coupled (for example, formed as a unit and integrally with) the shaft 44 to rotate with it about the first axis of rotation 40.

[0032] The differential assembly 20 may include a final drive or transmission, or a differential input gear 70 and a differential. The differential input gear 70 may rotate about a second axis of rotation 80 and may mesh with the transmission output gear 46. In the example provided, the transmission output gear 46 and the differential input gear 70 are helical gears. The differential may be any type of differential mechanism that can provide rotational power to the output shafts 22a and 22b, while simultaneously (at least in one mode of operation) permitting speed differentiation between the output shafts 22a and 22b.In the example provided, the differential includes a differential housing, which is coupled to the differential input gear 70 to rotate with it, and a differential gear set having a plurality of differential pinions, which are coupled to the differential housing and are rotatable (with respect to the differential housing) about one or more pinion axes that are perpendicular to the second axis of rotation 80, and a pair of side gears that are mesh-meshed with the differential pinions and are rotatable about the second axis of rotation 80. Each of the output shafts 22a and 22b can be coupled to one of the associated side gears for rotation. In the example provided, the output shaft 22b is formed by two distinct components: a heel, tail, or output shaft 90 and a half-shaft 92. Output shaft 90 is driven or impulsively coupled to one of the associated side gears and extends between an associated gear and the half-shaft 92. It is supported by a bearing 94 in the housing assembly 12 for rotation about the second axis of rotation 80. Each of the output shafts 22a and the half-shaft 92 has a constant velocity joint 100 with a splined or grooved male stem. The grooved male stem of the constant velocity joint on output shaft 22a is received and non-rotationally coupled to one of the associated side gears. The grooved male stem of the constant velocity joint on half-shaft 92 is received and non-rotationally coupled to the output shaft 90.

[0033] In Figures 3 to 6, the control unit 16 includes a power terminal 200, one or more field capacitors 202, an inverter 204, and a controller 206. The power terminal 200 can be mounted on the housing assembly 12 and may have contacts or terminals (not shown) that can be permanently coupled to a respective power cable 210 to electrically couple the power cable 210 to the control unit 16. It will be appreciated that the electric motor 14 can be powered by means of multi-phase AC electrical power or energy, and as such, the power terminal 200 may have multiple contacts or terminals to allow the various power cables 210 to be coupled to the control unit 16.

[0034] Each field capacitor 202 electrically couples one of the power or feed wires 210 associated with the inverter 204. In the example provided, each field capacitor 202 is relatively small and is disposed in an annular space between the inverter 204 and the housing assembly 12. The annular space may be disposed adjacent to one end of a stator body 32 from which Ln / zznz / E / YiAi extend the field windings 36. Each field capacitor 202 can be mounted on the inverter 204.

[0035] With reference to Figures 3, 4, and 7 to 15, the inverter 204 may be an annular structure that can be mounted around or on the field windings 36 extending from the stator body 32. In the example provided, the inverter 204 includes a power semiconductor assembly 250 and a circuit board or tablet assembly 252. The power semiconductor assembly 250 may comprise a plurality of power semiconductor packages 262 and an inverter assembly 264.

[0036] The power semiconductor package 262 has a semiconductor die 266 that includes a power semiconductor device 268. The power semiconductor device 268 can be any suitable power semiconductor device, such as an insulated-gate bipolar transistor (IGBT). In the example provided, the power semiconductor device is a field-effect transistor 269, which can be either a metal-oxide-sulfur field-effect transistor (MOSFET) or a junction field-effect transistor (JFET). The power semiconductor package 262 has a plurality of terminals 270 and a plurality of electrically conductive wires 272a, 272b, 272c, 272d (collectively referred to hereafter as electrically conductive wires 272). Each of the electrically conductive wires 272 is electrically coupled to one of the associated terminals 270.

[0037] The power semiconductor package 262 has a heat sink 274 made of an electrically and thermally conductive material, such as copper or aluminum. The heat sink 274 has a base 276, an assembly 278, and a plurality of fins 280. The assembly 278 extends from a first side 276a of the base 276 and is coupled to the die Ln / zznz / E / YiAi semiconductor 266. The plurality of fins 280 are fixedly coupled to the base 276 and extend from a second side 276b of the base 276 that is opposite the first side 276a of the base 276. The base 276 and the mounting or support 278 can be formed unitarily and integrally.

[0038] The power semiconductor package 262 has a housing 281 having a first side 281a and a second side 281b opposite the first side 281a of the housing 281. The housing, cover, or case 281 is formed from a first electrically insulating material, such as a resin material. The semiconductor die 266 and the mounting or mount 278 are encapsulated in the housing 281 during, for example, an overmolding process. The plurality of fins 280 extends from the second side 281b of the housing 281.

[0039] The plurality of fins 280 are fixedly coupled to (for example, formed unitarily and integrally with) the base 276. The fins 280 can be arranged in any desired orientation, such as orthogonal to the electrical conductor wires 272. In one form, the first side 276a has a wavy or corrugated shape, and the second side 276b has a linear (or substantially linear) shape. It should be understood that the first side 276a and the second side 276b can have various shapes and are not limited to the examples described herein. The length of the base 276 can increase gradually (or not gradually) from the first side 276a to the second side 276b. Similarly, the length of the fins 280 can increase gradually (or not gradually) from the first side 276a to the second side 276b (i.e., along the x-axis).The power semiconductor packages 262 of the power semiconductor assembly 250 can be arranged or arranged in an annular manner as shown in Figure 7. If desired, the fins 280 of a given power semiconductor package 262 ίη / ζζηζ / E / γίΛΐ make contact with a second side 281b of the housing 281 of a circumferentially adjacent power semiconductor package 262.

[0040] Each of the fins 280 of each heat sink 274 can have any desired shape. For example, some or all of the fins 280 can be rod-shaped, like the fins 280a shown in Figure 8, or they could be cuboid-shaped, like the fins 280b shown in Figure 9. It should be understood that the fins 280 can have other designs in other shapes and are not limited to the examples described here.

[0041] The semiconductor die 266 is coupled to the assembly 278 using a bonding material 282, which may be at least one of the solder materials and a sintering material. One of the electrical conductor wires 272 (for example, the electrical conductor wire 272a) is unitarily and integrally formed with the assembly 278. The remaining electrical conductor wires 272 (for example, the electrical conductor wires 272b, 272c, 272d) that are not unitarily and integrally formed with the assembly 278 are electrically coupled to an associated terminal 270 via a connecting or bonding wire 284.

[0042] The power semiconductor package 262 has phase lead protrusions 288, which can accept the phase leads 294 (Figure 3) from the field windings 36 (Figure 3) through them. The power semiconductor package 262 may also have an oil inlet port 296 (Figure 11).

[0043] A method for manufacturing the power semiconductor package 262 includes providing the heat sink 274 and attaching the semiconductor die 266 that includes the power semiconductor device 268 to the heat sink assembly 278. The method includes coupling each of the wires or conductors that are not unitarily and integrally formed with the assembly 278 (e.g., the electrically conductive wires 272b, 272c, 272d) to an associated terminal 270 via connecting or bonding wires 284 and encapsulating the semiconductor die 266 and the assembly 278 with the housing 281 using an overmolding process.

[0044] With reference to Figures 3, 4, 7, and 11 to 15, the inverter assembly 264 may be formed from a second electrically insulating material that is different from the first insulating material of the housing 281, such as a plastic material. The inverter assembly 264 may define a mounting flange 295 arranged circumferentially around the power semiconductor assembly 250. At least a portion of the electrical conductor wires 272 may be received through the mounting flange 295 and may be electrically and mechanically coupled to the circuit board assembly 252 through one or more conductor or distribution bars 297a, 297b, 297c, 297d (collectively referred to hereafter as conductor bars or distribution bars 297), such as a printed circuit board.The busbars 297 can be stacked against each other and electrically coupled to the electrical conductors 272, as well as to the phase conductors 294 of the stator field windings 36. The number of printed circuit boards depends on the thickness of the electrical traces or conductors of each printed circuit board and on the amount of current passing between each power semiconductor pack 262 and one of the associated field windings 36. The busbars 297 can be electrically isolated from each other by insulating spacers 298, so that each of the electrical conductors 272 is electrically and mechanically coupled to one of the busbars 297.

[0045] With reference to Figure 17, the controller 206 is configured to detect a rotational position of the rotor 34 relative to the stator 32 (Figure 1) and responsibly control the flow of electrical energy from the inverter 204 (Figure 3) to the field windings 36 (Figure 3) to rotate the magnetic field produced by the field windings 36 (Figure 3). The controller 206 may include a second circuit board assembly comprising a plurality of stacked printed circuit boards. The second printed circuit board assembly may have conventional hardware and control programming to operate the electric motor 14 (Figure 1) and a TMR 300 sensor that is configured to detect a rotational position of a magnetic field from a magnet 302 that is fixedly coupled to the rotor 34. The TMR 300 sensor and magnet 302 may optionally be used in place of a conventional encoder or resolution.Significantly, the 206 controller uses direct voltage or voltage traces on the various printed circuit boards and / or electrical conductor wires 272 instead of resistors to determine current flow.

[0046] Figure 18 shows that the housing assembly 12 has a pump mounting 310, a heat exchanger base 312, and a filter mounting 314. The pump 24 can be mounted on the pump mounting 310 and can circulate a suitable fluid around the electric drive module 10 to both lubricate and / or cool various components. In the example provided, the fluid is a suitable dielectric fluid, such as automatic transmission fluid. The heat exchanger 26 can be mounted on the heat exchanger base 312 and can be configured to receive a pressurized coolant, such as a water-glycol mixture, from an external source and to facilitate heat transfer from the dielectric fluid circulating in the electric drive module 10 to the pressurized coolant.A suitable filter, such as a 28 spin-on or threaded oil filter, can be mounted on the filter base 314 and can filter the dielectric fluid circulating within the electric drive module. Ln / zznz / E / YiAi

[0047] With reference to Figures 19 to 21, an inlet filter or screen 400 may be disposed in a portion or part of the housing assembly 12 that houses the differential input gear 70. The inlet filter or inlet 400 may receive dielectric fluid that can be returned to the low-pressure side of the pump 24. A containment dam 402 may be integrated into a cover 404 and a portion of the main housing 406 of the housing assembly 12 to protect the dielectric fluid being returned to the inlet filter 400 from the differential input gear 70. More specifically, the containment dam 402 may cause the dielectric fluid to accumulate in the vicinity of the inlet filter 400 and segregate the accumulated fluid from the (rotating) differential input gear 70.It will be appreciated that without the containment dam 402, the rotating differential input gear 70 would tend to draw the dielectric fluid away from the inlet filter 2400, which could prevent sufficient dielectric fluid from being returned to the low-pressure (inlet) side of pump 24. It will also be appreciated that separating the dielectric fluid from the rotating differential input gear 70 can reduce drag losses that would otherwise occur due to the rotation of the differential input gear through the dielectric fluid. The cover 404 may also include a tubular feed tube 410.

[0048] With reference to Figures 22 and 23, a deflector 420 can be mounted on the planetary carrier PC and can protect the planetary reduction 42 from dielectric fluid hanging, sliding, or shedding from other rotating components and / or cause the dielectric fluid to drain from the planetary reduction 42 in a desired manner.

[0049] In Figures 24 and 25, the dielectric fluid is received at the inlet filter 400 and conveyed to the low-pressure (inlet) side of the pump 24. The high-pressure dielectric fluid exits the pump 24 and travels through an internal gallery 430 in the housing 12 to an inlet passage at the base Ln / zznz / E / YiAi of heat exchanger 312, through heat exchanger 26, in or within an outlet passage of the base of heat exchanger 312, in an inlet passage of the base of filter 314, through filter 28, in an outlet passage in the base of filter 314 and another internal gallery 432 in housing 12.

[0050] In Figures 26 and 27, the dielectric fluid exiting the internal gallery 432 can travel through a transfer tube 434 through the oil inlet port 296 in the end plate 290 and can enter an annular cavity 440 that is radially located between a central tubular projection 442 in the end plate 290 and the field windings 36. The central projection 442 can carry a seal or gasket that can be securely attached to the central projection 442 and the field windings 36. An annular space or gap 448 is formed between an axial end of the field windings 36 and an annular portion of the end plate 290. As noted above, the end plate 290 is fixedly attached and sealed to the inverter support 264.

[0051] Figure 28 shows that the dielectric fluid flows through the annular gap or space 448, through the fins 280 on the heat sinks 274, and through the axially formed passages 450 through the stator 32. While the fins 280 are represented here as perpendicular projections, it will be appreciated that the fins 280 could have a different design or shape (e.g., as diamond-shaped projections) to cause the flow of dielectric fluid passing through the fins 280 to move in both tangential and axial directions. Flow in this manner can be beneficial for rejecting more heat from the heat sinks 274 into the dielectric fluid and / or for producing a desired flow restriction that can aid in balancing the pressure of the cooling flow to the rotor. Accordingly, it will be appreciated that the dielectric fluid is introduced into the inverter 204, passes through the fins Ln / zznz / E / YiAi 280 in the heat sinks 274 that are electrically conductively coupled to the electrically conductive wires 272 to cool the inverter 204, and then enters the passages 450 in the stator 32 to cool the stator 32 as shown in Figure 29.

[0052] In Figures 30 and 31, the dielectric fluid exiting the stator 32 is collected in an annular cavity 460 at one end of the stator 32, which slows the velocity of the dielectric fluid. A portion of the dielectric fluid is returned to a sump (not shown) in the housing assembly 12, while other portions of the flow are directed to lubricate various other components. For example, the annular cavity 460 may be in fluid communication with a worm track or worm-type track 464.

[0053] With reference to Figures 32 to 34, the worm gear track 464 may have an outlet that can discharge the dielectric fluid into a bearing 470, which can support the differential housing 472 for rotation relative to the housing assembly 12, and / or into the coupling shaft 92, where the dielectric fluid can migrate to opposite axial ends of the coupling shaft 92 to lubricate the differential gear and bearing 94. Subsequently, the dielectric fluid can drain into the crankcase where it can flow to the inlet filter 400 (Figure 23).

[0054] In Figures 35 and 36, the annular cavity 460 may be in fluid communication with a passage 480 that provides a flow of dielectric fluid to a bearing 482 that supports the rotor shaft 38 relative to the housing assembly 12. The dielectric fluid that is discharged from the bearing 482 may leak or be seen between the housing assembly 12 and the rotor shaft 38 and may drain into the crankcase in the housing assembly 12. Ln / zznz / E / YiAi

[0055] With reference to Figures 27, 28, and 37, a portion of the dielectric fluid in the annular cavity 440 can be discharged into a bypass tube 500. The amount of fluid discharged into the bypass tube 500 is based on the pressure balance between the flow directed through the bypass tube 500 and the portion of the flow that travels through the inverter 204 and the stator 32.

[0056] Figure 38 represents the dielectric fluid when it is discharged from the annular cavity 440 and transferred through the bypass tube 500 to the feed tube 410 in the deck 404.

[0057] Figure 39 represents the bypass flow leaving the bypass tube 500, traveling through the feed tube 410 in the cover 404 and being fed to a heat exchanger 506 that is mounted inside the rotor shaft 38. The heat exchanger 506 receives the flow (inlet flow) of dielectric fluid along its axis of rotation, and then turns the flow at the opposite end of the rotor 34 so that the dielectric fluid flow flows concentrically around the inlet flow to the end of the rotor 34 that received the inlet flow of the dielectric fluid.

[0058] In Figures 40 and 41, the dielectric fluid outlet flow from the heat exchanger 506 on the rotor shaft 38 can be used, at least partially, to lubricate the various components (i.e., bearings, shafts, gear teeth) of the planetary reduction 42, as well as the bearings 60 supporting the transmission shaft 44. Note that the feed tube 410 in the housing 404 is received through an opening in the shaft 44. In the example provided, the feed tube 410 is a discrete component that is assembled to the housing 404. Ln / zznz / E / YiAi

[0059] Figures 42 to 45 show various dielectric fluid flows used to lubricate various other components within the electric drive or transmission module. i «nn Ln / zznz / E / YiAi

[0060] The foregoing description of the embodiments has been provided for illustrative and descriptive purposes. It is not intended to be exhaustive nor to limit the invention. The individual elements or features of a particular embodiment are not generally limited to that particular embodiment, but are, where applicable, interchangeable and may be used in a selected embodiment, even if not specifically shown or described. They may also be varied in many ways. Such variations should not be considered a departure from the invention, and all such modifications are intended to be included within the scope of the invention.

Claims

1. An electrical assembly comprising: a semiconductor die including a power semiconductor device, the power semiconductor device having a plurality of terminals; a plurality of electrically conductive wires, each of the electrically conductive wires being electrically coupled to one of the terminals of the power semiconductor device; a heat sink formed of an electrically and thermally conductive material, the heat sink having a base, an assembly, and a plurality of fins, wherein the assembly extends from a first side of the base and is coupled to the semiconductor die, wherein the plurality of fins is fixedly coupled to the base and extends from a second side of the base opposite the first side of the base; and a cover formed of a first electrically insulating material, wherein the semiconductor die and the assembly are encapsulated in the cover;where one of the first cables of the plurality is formed unitarily and integrally with the assembly.; 2. The electrical assembly according to claim 1, wherein each of the cables that is not unitarily and integrally formed with the assembly is electrically coupled to its associated one of the terminals through a connecting cable.

3. The electrical assembly according to claim 1, wherein the semiconductor die is coupled to the assembly using at least one of the soldering materials and a sintering material.

4. The electrical assembly according to claim 1, wherein the plurality of fins is formed unitarily and integrally with the base.

5. The electrical assembly according to claim 1, wherein the electrically and thermally conductive material of which the heat sink is formed comprises at least one of copper and one of aluminum.

6. The electrical assembly according to claim 1, wherein the base and the assembly are integrally formed.

7. The electrical assembly according to claim 1, wherein the power semiconductor device comprises a field-effect transistor.

8. The electrical assembly according to claim 7, wherein the field-effect transistor is a metal-oxide field-effect transistor.

9. The electrical assembly according to claim 1, wherein at least a portion of each of the plurality of fins has a cube shape.

10. The electrical assembly according to claim 1, wherein at least a portion of each of the plurality of fins has a rod shape.

11. The electrical assembly according to claim 1, wherein the plurality of fins is orthogonal to the cables.

12. The electrical assembly according to claim 1, wherein the base of the heat sink has a first side having a wavy shape and a second side opposite to the first side, and wherein the second side has a linear shape.

13. The electrical assembly according to claim 1, wherein a length of the plurality of fins increases from a first edge of the heat sink to a second edge of the heat sink.

14. The electrical assembly according to claim 1, further comprising an inverter assembly and a plurality of conductor bars, the inverter assembly being formed from a second electrically insulating material and defining a mounting flange, wherein a portion of the electrically conductive cables is received through the mounting flange and electrically and mechanically coupled to the associated conductor bars.

15. The electrical assembly according to claim 14, further comprising a stator, the stator having a motor winding, and wherein the heat sink is electrically coupled to the motor winding.

16. A method for manufacturing a semiconductor package including a plurality of wires, the method comprising: providing a heat sink formed of an electrically and thermally conductive material, the heat sink having a base, an assembly, and a plurality of fins, wherein the assembly extends from a first side of the base, wherein the plurality of fins are fixedly coupled to the base and extend from a second side of the base opposite the first side of the base, and wherein one of the first plurality of wires is formed unitarily and integrally with the assembly; attaching a semiconductor die including a power semiconductor device to the heat sink assembly, the power semiconductor device having a plurality of terminals;couple each of the cables that are not formed unitarily and integrally with the assembly to its associated terminal via a connecting cable; and encapsulate the semiconductor die and assembly with a housing formed from a first electrically insulating material.

17. The method according to claim 16, wherein the base and the support are formed as a single unit and integrally.

18. The method according to claim 16, wherein the plurality of fins is formed unitarily and integrally with the base.

19. The method according to claim 16, wherein the base of the heat sink has a first side having a wavy shape and a second side opposite to the first side, and wherein the second side has a linear shape.

20. The method according to claim 16, wherein a length of the plurality of fins increases from a first edge of the heat sink to a second edge of the heat sink.

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