Recessed heat sink with a discernible component as part of a device enclosure
A finned heat sink with identifiable components addresses the issue of excessive TIM and inefficient heat dissipation in enclosures by reducing material usage and enhancing thermal management, thus lowering costs and preventing thermal throttling.
Patent Information
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- SK HYNIX NAND PRODUCT SOLUTIONS CORP
- Filing Date
- 2024-09-03
- Publication Date
- 2025-05-01
AI Technical Summary
Existing enclosures require excessive amounts of thermal interface material (TIM) and lack efficient heat dissipation, especially as electrical components become smaller and thinner, leading to increased costs and thermal throttling risks.
The use of a finned heat sink with identifiable components, featuring protrusions and recessed elements, reduces TIM requirements and enhances heat dissipation by increasing surface area and incorporating recognizable images, such as logos, within standardized enclosures.
This design minimizes TIM usage, lowers production costs, and improves heat dissipation, reducing thermal throttling risks while maintaining mechanical and electrical protection for circuit systems.
Smart Images
Figure TWG2TA001007416_001 
Figure TWG2TA001007416_002 
Figure TWG2TA001007416_003
Abstract
Description
[Technical Field]
[0001] This disclosure relates to a heat sink, and more specifically, to a finned heat sink for an enclosure. [Previous Technology]
[0002] and [Summary of the Invention]
[0003] According to this disclosure, an enclosure, a method for manufacturing an enclosure, and an apparatus including an enclosure are provided to reduce the amount of thermal interface material (TIM) required within the enclosure and to provide heat dissipation by using a heat sink with identifiable components. The identifiable components of the heat sink may be distinguishable and may be presented as identifiable images. For example, the identifiable components may be presented as a company logo to distinguish the enclosure from other housings used to enclose the circuitry of the device. The enclosure may include a first outer surface, a second outer surface opposite to the first outer surface, and a heat sink disposed on the first outer surface to facilitate heat dissipation of the enclosure. The enclosure, the method for manufacturing the enclosure, and the apparatus including the enclosure facilitate heat transfer from the heat-generating circuitry to the first and second outer surfaces while reducing the amount of TIM disposed between the first outer surface and the circuitry. The TIM is disposed in a TIM layer, each of which is thermally conductive and disposed between the circuitry and the first and second outer surfaces. The TIM layer is used to transfer heat generated from the circuitry to the first and second outer surfaces. A heat sink disposed on the first outer surface includes: a plurality of protrusions, each extending outward from the first outer surface; and an identifiable member that protrudes from the first outer surface and is recessed from the plurality of protrusions. The identifiable member of the heat sink can also be visually distinguishable from the protrusions (e.g., the plurality of protrusions). Additionally, an enclosure is formed to enclose the circuitry between the first and second outer surfaces, and the circuitry is configured to be closer to the second outer surface than the first outer surface. The enclosure disclosed herein, apparatus, and method are provided to reduce the amount of TIM material required within the enclosure and to provide a heat sink for heat dissipation of the enclosure and an identifiable member for presenting a distinguishable image.
Implementation Method
[0010] According to this disclosure, enclosures, methods for manufacturing enclosures, and apparatuses including enclosures are provided to reduce the amount of thermal interface material (TIM) required within the enclosure and to provide heat dissipation by using heat sinks with identifiable components that can be used to present an identifiable image. In some specific examples, a first outer surface and a second outer surface form the enclosure enclosing the circuit system disclosed herein. The enclosure disclosed herein can be any suitable housing for enclosing a circuit system of any suitable form factor. In some specific examples, the enclosures and apparatuses disclosed herein have standardized sizes and dimensions. In some apparatuses, the electrical components mounted on the circuit system have become smaller or thinner, and the circuit system is configured in a standardized-size enclosure for mounting on a rack or shelf. In such apparatuses, more TIM is required to thermally couple the electrical components of the circuit system to the enclosure. The heat sink disposed on the first outer surface of the enclosure disclosed herein includes recessed or lowered surfaces to reduce the amount of TIM required between the first outer surface and the circuitry. The recessed or lowered surfaces of the heat sink also allow for the formation of protrusions within the heat sink. In some specific embodiments, each of the protrusions of the heat sink may extend to a standardized size or to a degree permissible by dimensional tolerances. Reducing the amount of TIM disposed within the enclosure lowers the overall cost of configuring the enclosure.
[0011] Embedded heat sinks configured in enclosures of standardized sizes and dimensions allow protrusions (e.g., fins or pins) to be formed within the heat sink to increase surface area, thereby improving heat dissipation of the enclosure. The heat sinks disclosed herein also include identifiable members configured within the protrusions of the heat sink, such that the identifiable members are distinguishable from the protrusions of the heat sink. In some specific examples, the identifiable members project outward from a first outer surface, similar to a protrusion. Identifiable members included within the heat sink may be recessed from the protrusion and may be visually distinctive or recognizable images (e.g., company logos or symbols).
[0012] The circuit system is disposed between the first outer surface and the second outer surface, and includes electrical components, at least one of which is a heat-generating electrical component. The heat-generating electrical component of the circuit system can be any suitable high-efficiency electrical component (e.g., an integrated circuit device, such as a memory controller). In some specific examples, the circuit system includes a printed circuit board (PCB), which may include multiple dielectric layers on which the electrical components can be mounted. In some specific examples, a TIM layer may be positioned between the circuit system and each of the first and second outer surfaces.
[0013] For the purposes of brevity and clarity, the features of this disclosure described herein are in the context of an enclosure with an embedded heat sink. However, the principles of this disclosure can be applied to any other suitable context in which an enclosure is used to enclose a heat-generating circuit system.
[0014] In some specific instances, the circuitry of the device may include any suitable controller, which may include any suitable processing chip (e.g., an application-specific integrated circuit (ASIC) chip) or processing core.
[0015] In some specific instances, the apparatus, enclosure and method of manufacturing the enclosure disclosed herein may include a circuit system that serves as a storage device system (e.g., an SSD storage system) including storage devices such as solid-state drives.
[0016] An SSD is a data storage device that uses integrated circuit components as memory to persistently store data. SSDs do not have moving mechanical parts, a feature that distinguishes them from traditional mechanical disks such as hard disk drives (HDDs) or floppy disks, which contain spinning platters and removable read / write heads. Compared to mechanical disks, SSDs are typically more resistant to physical shocks, operate quietly, and have shorter access times and less latency.
[0017] The subject matter of this disclosure can be better understood by referring to Figures 1 to 5.
[0018] Figures 1 and 2A to 2E show views (e.g., perspective views 200, 202, 204, 206 and 208) of an enclosure 100 having a heat sink 106 according to some specific embodiments of the present disclosure. The enclosure 100 includes a first outer surface 102, a second outer surface 104 and a heat sink 106 disposed on the first outer surface 102. The first outer surface 102 and the second outer surface 104 of the enclosure 100 are used to enclose a circuit system (not shown) disposed between the first outer surface 102 and the second outer surface 104.
[0019] FIG2A shows a top perspective view 200 of an enclosure (e.g., enclosure 100) having a heat sink 106. FIG2B and FIG2D each show a long side perspective view (e.g., left main side perspective view 202 and right main side perspective view 206) of the enclosure 100 having a first outer surface 102 and a second outer surface 104. FIG2C and FIG2E each show a short side perspective view (e.g., front secondary side perspective view 204 and rear secondary side perspective view 208) of the enclosure 100 having a first outer surface 102 and a second outer surface 104.
[0020] The first outer surface 102 opposite to the second outer surface 104 may include a groove in which a plurality of protrusions 108 are disposed. In some specific embodiments, the plurality of protrusions 108 of the heat sink 106 are one of a plurality of fins and a plurality of pins. In some specific embodiments, each of the plurality of protrusions 108 is parallel to the other protrusions. In some specific embodiments, each of the plurality of protrusions 108 is uniformly spaced from the other adjacent protrusions. In some specific embodiments, the plurality of protrusions 108 is non-uniformly spaced from the other adjacent protrusions. Although the protrusions 108 shown in FIG. 1 and FIG. 2A are configured to be parallel to the other adjacent protrusions 108, the plurality of protrusions 108 can be configured in any suitable heat sink pattern (e.g., radially arranged protrusions, concentrically arranged protrusions). The enclosure 100 may have a first outer surface 102, such that the first outer surface 102 and the heat sink 106 are a single piece. In some embodiments, the identifiable element 110 of the heat sink 106 is presented as an identifiable image among a plurality of protrusions 108. In some embodiments, each of the first outer surface 102 and the second outer surface 104 is thermally conductive to dissipate heat generated from the circuit system during operation.
[0021] In some specific examples, the circuit system includes a printed circuit board (PCB) having at least one electrical component, wherein any individual electrical component may generate heat during operation of the circuit system. In some specific examples, the PCB includes multiple dielectric layers on which at least one electrical component may be mounted. Any of the electrical components of the circuit system may be any suitable high-performance electrical component (e.g., an integrated circuit device, such as a memory controller).
[0022] It should be understood that although enclosure 100 depicts a specific instance of an enclosure according to this disclosure, having protrusions 108 of a specific size, shape, dimension, and orientation of heat sink 106 and specific identifiable members 110, any other suitable enclosure may be similarly implemented. For example, an enclosure may include any suitable identifiable member 110 within the heat sink 106 such that the identifiable member 110 is distinguishable from the protrusions among the plurality of protrusions 108. In some instances, the identifiable member 110 is recessed from the plurality of protrusions 108, and the identifiable member 110 is formed of a thermally conductive material. In some instances, the first outer surface 102 and the heat sink 106 including the plurality of protrusions 108 and the identifiable member 110 are monolithic.
[0023] For clarity and brevity, and not as a limitation, this disclosure is provided in the context of enclosure 100, its manufacture, and apparatus including enclosure 100, which provides the features and functionality disclosed herein. Enclosure 100 may be implemented at least in part with, for example, a server device or a storage device.
[0024] FIG3 shows an exemplary cross-sectional view of an enclosure 300 having a heat sink 106 according to some specific embodiments of the present disclosure. The enclosure 300 includes a first outer surface 102 and a second outer surface 104 opposite to the first outer surface 102, these outer surfaces being configured to enclose a circuit system 302. The heat sink 106 is disposed on the first outer surface 102 and includes a plurality of protrusions 108, each protrusion extending outward from the first outer surface 102. The plurality of protrusions 108 increase the total surface area of the first outer surface 102 from which heat generated by the circuit system 302 is dissipated. The increase in total surface area promotes further heat dissipation from the first outer surface 102, thereby reducing the possibility of thermal throttling or unsafe surface temperatures of the electrical components of the circuit system 302 during handling or maintenance of the enclosure 300. The heat sink 106 also includes an identifiable member 110 protruding from the first outer surface, the identifiable member 110 being recessed from each of the plurality of protrusions 108 and distinguishable from the plurality of protrusions 108.
[0025] In some specific examples, the first outer surface 102, the second outer surface 104, or both are formed by die casting, molding, or any other suitable process to form the enclosure 300 with a thermally conductive material (e.g., aluminum). The first outer surface 102 and the second outer surface 104 are thermally conductive to dissipate heat generated from the circuit system 302, which will be enclosed within the enclosure 300. In some specific examples, the enclosure has a standardized unit size (e.g., standardized dimension) defined by a rack or shelf to which the enclosure 300 is to be assembled. In such specific examples, the heat sink 106 of the first outer surface 102 includes a recess in the first outer surface 102 such that each of the plurality of protrusions 108 extends only to the extent permitted by the dimensional requirements of the standardized unit size.
[0026] Enclosure 300 encloses the circuit system 302 between a first outer surface 102 and a second outer surface 104. In some specific embodiments, the first outer surface 102 and the second outer surface 104 may be joined or solidly connected to form enclosure 300, within which the circuit system 302 is enclosed and disposed. Enclosure 300 provides mechanical and electrical protection for the circuit system 302 and improves heat dissipation from the circuit system 302. Improved heat dissipation reduces the likelihood of thermal throttling of any electrical component of the circuit system 302. The circuit system 302 may include a printed circuit board (PCB) and at least one electrical component that generates heat during operation of the circuit system 302.
[0027] In some specific embodiments, the enclosure includes a thermal interface material (TIM) layer 304 disposed between the circuit system 302 and each of the first outer surface 102 and the second outer surface 104 to facilitate efficient heat transfer from the circuit system to the thermally conductive enclosure 300. In some specific embodiments, the circuit system 302 is configured to be closer to the second outer surface 104 than the first outer surface 102. In some specific embodiments, a recess in the first outer surface 102 ensures that less TIM is required within the TIM layer 304 to transfer heat from the circuit system 302 to the first outer surface 102 compared to a first outer surface 102 without a recess in which a protrusion 108 is disposed. In some specific embodiments, the recess in the first outer surface 102 also allows a heat sink 106 to be formed within a standardized cell size of the enclosure 300. In some specific examples, the TIM layer 304 disposed between the first outer surface 102 and the circuit system 302 includes a first amount of TIM disposed between a recess in the first outer surface 102 and the circuit system 302, and a second amount of TIM disposed between a non-recessed portion of the first outer surface 102 and the circuit system 302, wherein the first amount of TIM is less than the second amount of TIM. The reduction in the amount of TIM material in the TIM layer 304 reduces the total cost of the enclosure 300 and related devices including the enclosure 300. In some specific examples, the TIM layer 304 can be any suitable thermally conductive material to facilitate heat transfer from the circuit system 302 to each of the first outer surface 102 and the second outer surface 104. Each of the TIM layers 304 is positioned to be in thermal contact with each of the circuit system 302 and each of the first outer surface 102 and the second outer surface 104, respectively.
[0028] Figure 4 shows an illustrative diagram of a device 400 according to some specific examples of the present disclosure, which includes an enclosure (e.g., enclosures 100 and 300) enclosing a circuit system 302. The device 400 includes an enclosure and a circuit system 302 disposed within the enclosure. Similar to enclosures 100 and 300, the enclosure includes a first outer surface 102, a second outer surface 104, and a heat sink 106 disposed on the first outer surface 102. In some specific examples, the heat sink 106 includes a plurality of protrusions 108 and identifiable members 110, the plurality of protrusions 108 providing improved enclosure heat dissipation for the device. When the circuit system 302 operates, heat is generated, which is transferred to the first outer surface 102 and the second outer surface 104, each of which dissipates the transferred heat into the air near the device 400.
[0029] Figure 5 shows a flowchart illustrating exemplary steps for manufacturing an enclosure with a heat sink according to some specific examples of this disclosure. In some specific examples, the mentioned enclosure, first outer surface, second outer surface, heat sink, plurality of protrusions, identifiable components, circuit system, and TIM layer may be implemented as enclosure 100, first outer surface 102, second outer surface 104, heat sink 106, plurality of protrusions 108, identifiable components 110, circuit system 302, and TIM layer 304, respectively. In some specific examples, process 500 may be modified, for example, by reconfiguring, changing, adding, and / or removing steps.
[0030] At step 502, a first outer surface and a second outer surface opposite to the first outer surface are formed, and a heat sink is disposed on the first outer surface. The heat sink includes a plurality of protrusions extending outward from the first outer surface to increase the total surface area from which heat generated by the circuitry is dissipated. The heat sink also includes an identifiable member protruding from the first outer surface, the identifiable member being recessed from and distinguishable from the plurality of protrusions. In some specific examples, the first outer surface, the second outer surface, or both are formed by die casting, molding, or any other suitable process to form an enclosure with a thermally conductive material (e.g., aluminum). Each of the first and second outer surfaces is thermally conductive to dissipate heat generated by the circuitry, which will be enclosed within the enclosure. In some specific examples, the enclosure has a standardized unit size or standardized dimensions and will be mounted in / on a rack or shelf. In such a specific example, the heat sink on the first outer surface is formed by including grooves in the first outer surface, such that each of the plurality of protrusions extends outward from the first outer surface. In such a specific example, each of the plurality of protrusions may extend only to the extent permitted by the standardized cell size.
[0031] At step 504, the circuit system is enclosed between the first outer surface and the second outer surface. In some specific embodiments, the first and second outer surfaces may be joined or solidly connected to form an enclosure in which the circuit system is enclosed and disposed. The circuit system is enclosed within the enclosure for mechanical and electrical protection of the circuit system and to improve heat dissipation generated by the circuit system. Improved heat dissipation reduces the possibility of thermal throttling of any electrical component of the circuit system. The circuit system may include a printed circuit board (PCB) and at least one electrical component that generates heat during operation of the circuit system. In some specific embodiments, the enclosure includes a TIM layer disposed between the circuit system and each of the first and second outer surfaces to facilitate efficient heat transfer from the circuit system to the thermally conductive enclosure.
[0032] At step 506, the circuit system is configured to be closer to the second outer surface than the first outer surface. In some specific embodiments, the grooves on the first outer surface ensure that less TIM material is used within the TIM layer to transfer heat from the circuit system to the first outer surface compared to a first outer surface without grooves in which protrusions are configured. In some specific embodiments, the grooves on the first outer surface also allow heat sinks to be formed within the standardized cell size of the enclosure.
[0033] Unless otherwise expressly specified, the terms "a specific instance", "specific instance (embodiment)", "specific instances (embodiments)", "the specific instance", "these specific instances", "one or more specific instances", "some specific instances" and "a specific instance" mean "one or more (but not all) specific instances".
[0034] Unless otherwise expressly specified, the terms "including", "comprise", "have" and variations thereof mean "including but not limited to".
[0035] Unless otherwise expressly specified, the list of items does not imply any or all of the items being mutually exclusive.
[0036] Unless otherwise expressly specified, the terms "a / an" and "the" mean "one or more".
[0037] Unless otherwise expressly specified, devices communicating with each other need not be in constant communication with each other. In addition, devices communicating with each other may communicate directly or indirectly through one or more media.
[0038] The description of a specific instance of several components communicating with each other does not imply the need for all such components. Instead, a variety of components, chosen as appropriate, are described to illustrate a wide range of possible specific instances. Furthermore, although program steps, method steps, algorithms, or the like may be described sequentially, such programs, methods, and algorithms can be configured to operate in an alternating order. In other words, any sequence or order of describable steps does not necessarily indicate the need for steps to be executed in that order. The steps of the process described herein can be executed in any actual order. Moreover, some steps may be executed simultaneously.
[0039] When a single device or article is described herein, it will be apparent that more than one device / article (whether or not they cooperate) may be used in place of a single device / article. Similarly, when more than one device or article (whether or not they cooperate) is described herein, it will be apparent that a single device / article may be used in place of more than one device or article, or a different number of devices / articles may be used instead of the number of devices or programs shown. The functionality and / or features of a device may alternatively be embodied by one or more other devices that are not explicitly described as having such functionality / features. Therefore, other specific instances need not include the device itself.
[0040] At least some operations may be illustrated in the diagrams as events occurring in a certain order. In alternative concrete instances, some operations may be performed, modified, or removed in a different order. Furthermore, steps may be added to the logic described above while still conforming to the described concrete instance. Additionally, the operations described herein may occur sequentially or some operations may be processed in parallel. Moreover, operations may be executed by a single processing unit or by distributed processing units.
[0041] For illustrative and descriptive purposes, various specific examples have been presented in the foregoing description. It is not intended to be exhaustive or limited to the precise forms revealed. In light of the foregoing teachings, many modifications and variations are possible. [Simplified Explanation of the Diagram]
[0004] The following description includes a discussion of diagrams that illustrate specific implementations of the present disclosure as examples. The diagrams should be understood as examples, not as limitations. As used herein, references to one or more “specific examples” should be understood as describing a particular feature, structure, and / or characteristic included in at least one implementation. Therefore, phrases such as “in one specific example” or “in an alternative specific example” appearing herein describe various specific examples and implementations and do not necessarily refer to the same specific example. However, these phrases are not necessarily mutually exclusive.
[0005] [Figure 1] shows a perspective view of an enclosure with heat sinks according to some specific examples of the present disclosure;
[0006] [Figures 2A] to [Figures 2E] show exemplary plan and side views of enclosures according to some specific examples of this disclosure;
[0007] [Figure 3] shows an exemplary cross-sectional view of an enclosure with heat sinks according to some specific examples of the present disclosure;
[0008] [Figure 4] is an explanatory diagram showing an apparatus including an enclosure of a circuit system according to some specific examples of this disclosure;
[0009] [Figure 5] A flowchart illustrating exemplary steps for manufacturing an enclosure with heat sinks according to some specific examples of this disclosure.
Claims
1. An enclosure comprising: a first outer surface and a second outer surface opposite to the first outer surface; and a heat sink disposed on the first outer surface, the heat sink comprising: a plurality of protrusions extending outwardly from the first outer surface, and an identifiable member, wherein: The identifiable member protrudes from the first outer surface and is recessed from the plurality of protrusions, and the identifiable member is distinguishable from the plurality of protrusions; wherein: the enclosure is used to enclose the circuit system between the first outer surface and the second outer surface, and the circuit system is configured to be closer to the second outer surface than the first outer surface.
2. The enclosure as claimed in claim 1, wherein the first outer surface includes a groove in which the plurality of protrusions are disposed.
3. The enclosure as claimed in claim 2, further comprising a thermal interface material (TIM) layer disposed between the first outer surface and the circuit system, wherein a first amount of thermal interface material disposed between the recess and the circuit system is less than a second amount of thermal interface material disposed between the non-recessed portion of the first outer surface and the circuit system.
4. The enclosure as claimed in claim 1, wherein the plurality of protrusions comprises a plurality of fins.
5. The enclosure as claimed in claim 1, wherein the plurality of protrusions comprises a plurality of pins.
6. The enclosure as claimed in claim 1, wherein each of the plurality of protrusions is parallel to the other protrusions.
7. The enclosure as claimed in claim 1, wherein the heat sink and the first outer surface are a single piece.
8. The enclosure as requested in claim 1, wherein the identifiable component is presented as an identifiable image.
9. An apparatus comprising: a circuit system including electrical components; and an enclosure for enclosing the circuit system, the enclosure including: a first outer surface and a second outer surface opposite to the first outer surface, wherein the circuit system is enclosed between the first outer surface and the second outer surface, and the circuit system is configured to be closer to the second outer surface than the first outer surface; and a heat sink disposed on the first outer surface, the heat sink including: a plurality of protrusions extending outwardly from the first outer surface, and an identifiable member, wherein: The identifiable member protrudes from the first outer surface and is recessed from the plurality of protrusions, and the identifiable member is distinguishable from the plurality of protrusions.
10. The device of claim 9, wherein the first outer surface includes a groove in which the plurality of protrusions are disposed.
11. The apparatus of claim 10, further comprising a thermal interface material layer disposed between the first outer surface and the circuit system, wherein a first amount of thermal interface material disposed between the recess and the circuit system is less than a second amount of thermal interface material disposed between the non-recessed portion of the first outer surface and the circuit system.
12. The device of claim 9, wherein the plurality of protrusions comprises a plurality of fins.
13. The device of claim 9, wherein the plurality of protrusions comprises a plurality of pins.
14. The device of claim 9, wherein each of the plurality of protrusions is parallel to the other protrusions.
15. The apparatus of claim 9, wherein the heat sink and the first outer surface are monolithic.
16. The apparatus of claim 9, wherein the identifiable component is presented as an identifiable image.
17. A method for manufacturing an enclosure, the method comprising: forming a first outer surface and a second outer surface opposite to the first outer surface, wherein a heat sink is disposed on the first outer surface, the heat sink comprising: a plurality of protrusions extending outwardly from the first outer surface, and an identifiable member, wherein: The identifiable member protrudes from the first outer surface and is recessed from the plurality of protrusions, and the identifiable member is distinguishable from the plurality of protrusions; the circuit system is enclosed between the first outer surface and the second outer surface, and the circuit system is configured to be closer to the second outer surface than the first outer surface.
18. The method of manufacturing an enclosure as claimed in claim 17, wherein forming a first outer surface and a second outer surface opposite to the first outer surface includes forming a groove in which the plurality of protrusions are disposed.
19. The method of manufacturing an enclosure as claimed in claim 18, further comprising disposing a thermal interface material layer between the first outer surface and the circuit system, wherein a first amount of thermal interface material disposed between the recess and the circuit system is less than a second amount of thermal interface material disposed between the non-recessed portion of the first outer surface and the circuit system.
20. The method of manufacturing an enclosure as claimed in claim 17, wherein forming the first outer surface and the second outer surface opposite to the first outer surface comprises casting the first outer surface.
21. The method of manufacturing an enclosure as claimed in claim 17, wherein forming the first outer surface and the second outer surface opposite to the first outer surface comprises milling the first outer surface.
22. The method for manufacturing an enclosure as claimed in claim 17, wherein the identifiable component is presented as an identifiable image.