Recessed heat sink with a discernible component as part of a device enclosure

USD1107668SActive Publication Date: 2025-12-30SK HYNIX NAND PRODUCT SOLUTIONS CORP
View PDF 24 Cites 0 Cited by

Patent Information

Application Number
US29/919815
Authority / Receiving Office
US · United States
Patent Type
Designs(United States)
Current Assignee / Owner
Filing Date
2023-12-06
Publication Date
2025-12-30
Estimated Expiration
2040-12-30

Smart Images

  • Figure USD1107668-D00000_ABST
    Figure USD1107668-D00000_ABST
Patent Text Reader
Need to check novelty before this filing date? Find Prior Art

Description

[0001] FIG. 1 is a front perspective view of a recessed heat sink with a discernible component as part of a device enclosure;

[0002] FIG. 2 is a front corner perspective view of the recessed heat sink with a discernible component as part of a device enclosure;

[0003] FIG. 3 is a top view of the recessed heat sink with a discernible component as part of a device enclosure;

[0004] FIG. 4 is a front view of the recessed heat sink with a discernible component as part of a device enclosure;

[0005] FIG. 5 is a back view of the recessed heat sink with a discernible component as part of a device enclosure;

[0006] FIG. 6 is a left-side view of the recessed heat sink with a discernible component as part of a device enclosure;

[0007] FIG. 7 is a right-side view of the recessed heat sink with a discernible component as part of a device enclosure; and,

[0008] FIG. 8 is a bottom view of the recessed heat sink with a discernible component as part of a device enclosure.

[0009] The dashed broken lines depict boundaries; each dashed line and the area within form no part of the claimed design.

Claims

The ornamental design for a recessed heat sink with a discernible component as part of a device enclosure as shown and described.

Citation Information

Patent Citations

  • Heat sinks for electronic enclosures

    US20070171614A1

  • Thermoelectric Device

    US20160035957A1

  • Surface mounted light fixture and heat dissipating structure for same

    US20200063947A1

  • Thermal management system and device

    US20220158273A1

  • heat sink

    CN304705117S