Connecting member and electronic device comprising same

Abstract

An electronic device according to an embodiment of the present disclosure may comprise: a housing including at least one first conductive portion segmented along at least a portion of a sidewall and a second conductive portion disposed on the inner side of the sidewall and spaced apart from the first conductive portion; a connecting member electrically connecting the first conductive portion to the second conductive portion; and a printed circuit board disposed inside the housing and electrically connected to the first conductive portion through the connecting member. The connecting member may include a first metal layer configured to have at least a portion bonded to the first conductive portion, a second metal layer configured to have at least a portion bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer.

Description

Connecting member and electronic device including same

[0001] One embodiment of the present invention relates to a connecting member and an electronic device including the same.

[0002] Thanks to remarkable advancements in information and communication technology and semiconductor technology, the proliferation and use of various electronic devices is rapidly increasing. In particular, recent electronic devices are being developed to enable portable communication.

[0003] Electronic devices can refer to devices that perform specific functions according to the programs installed on them, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio / video devices, desktop / laptop computers, and car navigation systems. For example, these electronic devices can output stored information as audio or video. As the integration of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes more widespread, a single electronic device, such as a mobile communication terminal, can now be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.

[0004] An electronic device according to one embodiment of the present disclosure may include a housing including at least one first conductive portion segmented along at least a portion of a side wall, and a second conductive portion disposed within the side wall and spaced apart from the first conductive portion, a connecting member electrically connecting the first conductive portion and the second conductive portion, and a printed circuit board disposed within the housing and electrically connected to the first conductive portion through the connecting member. The connecting member may include a first metal layer at least a portion of which is configured to be bonded to the first conductive portion, a second metal layer at least a portion of which is configured to be bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer.

[0005] An electronic device according to one embodiment of the present disclosure may include a housing including at least one first conductive portion segmented along at least a portion of a sidewall, and a second conductive portion disposed within the sidewall and spaced apart from the first conductive portion, a connecting member electrically connecting the first conductive portion and the second conductive portion, and a printed circuit board disposed within the housing and electrically connected to the first conductive portion through the connecting member. The connecting member may include a first metal layer configured to have at least a portion thereof bonded to the first conductive portion, a second metal layer configured to have at least a portion thereof bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer. The first metal layer may be configured to be bonded to the first conductive portion through at least one of laser bonding and ultrasonic bonding, and the second metal layer may be configured to be bonded to the second conductive portion through at least one of laser bonding and ultrasonic bonding.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to various embodiments.

[0007] FIG. 2 is a drawing illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure.

[0008] FIG. 3 is a drawing illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0009] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0010] FIG. 5 is a drawing showing an unfolded state of an electronic device according to one embodiment of the present disclosure, with internal components mounted thereon.

[0011] FIG. 6 is a drawing showing a conductive portion and a connecting member of a housing according to one embodiment of the present disclosure.

[0012] FIGS. 7A and 7B are perspective views showing the front and rear sides of a connecting member according to one embodiment of the present disclosure.

[0013] FIG. 8A is a drawing showing a state before a conductive portion of a housing and a connecting member are coupled according to one embodiment of the present disclosure.

[0014] FIGS. 8b and 8c are drawings showing the appearance of a conductive portion of a housing and a connecting member after they are combined, according to one embodiment of the present disclosure.

[0015] FIG. 9a is a drawing showing a state before a housing and a connecting member are combined according to one embodiment of the present disclosure.

[0016] FIG. 9b is a drawing showing the appearance after the housing and the connecting member are combined according to one embodiment of the present disclosure.

[0017] Fig. 10 is a cross-sectional view showing a state in which a connecting member and a housing are combined, cut along line A-A' of Fig. 7a.

[0018] FIGS. 11A, 11B and 11C are cross-sectional views of a connecting member cut along line A-A' of FIG. 7B according to one embodiment of the present disclosure.

[0019] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to various embodiments.

[0020] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (101) (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0021] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor), or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0022] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0023] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0024] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0025] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0026] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0027] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0028] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (101) (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0029] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0030] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (101) (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0031] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (101) (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0032] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0033] The camera module (180) can capture still images and moving images. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0034] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0035] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0036] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (101) (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (101) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0037] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (101) (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0038] The antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device (101)). According to one embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and the external electronic device (101) through the selected at least one antenna. According to some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0039] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0040] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0041] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (101) (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service by itself, request one or more external electronic devices (101) to perform the function or at least a part of the service. One or more external electronic devices (101) that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0042] The electronic device (101) according to various embodiments disclosed in this document may be a device of various forms. The electronic device (101) may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device (101) according to the embodiments of this document is not limited to the aforementioned devices.

[0043] The various embodiments of this document and the terminology used herein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish the corresponding components from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as being "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0044] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0045] Various embodiments of the present document may be implemented as software (e.g., a program) including one or more instructions stored in a storage medium (e.g., built-in memory or external memory) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0046] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0047] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0048] FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to one embodiment of the present disclosure. FIG. 3 is a diagram illustrating a folded state of an electronic device according to one embodiment of the present disclosure.

[0049] Referring to FIGS. 2 and 3, the electronic device (101) may include a housing (201), a hinge cover (240) covering a foldable portion of the housing (201), and a display (230) disposed within a space formed by the housing (201). According to one embodiment, a surface on which a screen output from the display (230) is exposed is defined as a front surface of the electronic device (101) (e.g., a first front surface (210a) and a second front surface (220a)). A surface opposite to the front surface is defined as a rear surface of the electronic device (101) (e.g., a first rear surface (210b) and a second rear surface (220b)). In addition, a surface surrounding a space between the front surface and the rear surface is defined as a side surface of the electronic device (101) (e.g., a first side surface (210c) and a second side surface (220c)). The side of the electronic device (101) may be at least one side of the first housing (210) or the second housing (220). The electronic device (101) of FIGS. 2 and 3 may be referred to as a foldable electronic device, a portable electronic device, or a portable foldable electronic device. According to one embodiment, the housing (201) may be referred to as a foldable housing. The display (230) may be referred to as a “flexible display.”

[0050] According to one embodiment, the housing (201) may include a first housing (210), a second housing (220) rotatable with respect to the first housing (210), a first rear cover (280), and a second rear cover (290). The housing (201) of the electronic device (101) is not limited to the shape and combination shown in FIGS. 2 and 3, and may be implemented by other shapes or combinations and / or combinations of parts. For example, in one embodiment, the first housing (210) and the first rear cover (280) may be formed integrally, and the second housing (220) and the second rear cover (290) may be formed integrally.

[0051] According to one embodiment, the first housing (210) is connected to a hinge structure (e.g., the hinge assembly (202) of FIG. 4) and may include a first front surface (210a) facing a first direction and a first rear surface (210b) facing a second direction opposite to the first direction. The second housing (220) is connected to the hinge assembly (202) and includes a second front surface (220a) facing a third direction and a second rear surface (220b) facing a fourth direction opposite to the third direction, and may rotate about the hinge assembly (202) with respect to the first housing (210). Accordingly, the electronic device (101) may be variable between a folded state and an unfolded state. The electronic device (101) may have the first front side (210a) facing the second front side (220a) in a folded state, and the third direction may be the same as the first direction in an unfolded state. In the following, unless otherwise stated, the directions are described based on the unfolded state of the electronic device (101).

[0052] According to one embodiment, the first housing (210) and the second housing (220) are arranged on both sides with respect to the folding axis (A) as the center, and may have an overall symmetrical shape with respect to the folding axis (A). As described below, the angle or distance between the first housing (210) and the second housing (220) may vary depending on whether the state of the electronic device (101) is in an unfolded state, a folded state, or an intermediate state. According to one embodiment, the second housing (220) additionally includes a sensor area (224) in which sensors (e.g., a front camera) are arranged, but may have a mutually symmetrical shape in other areas.

[0053] According to one embodiment, the folding axis (A) may be a plurality of parallel folding axes (e.g., two). In the present disclosure, the folding axis (A) is provided along the longitudinal direction (Y-axis direction) of the electronic device (101), but the direction of the folding axis (A) is not limited thereto. For example (not shown), the electronic device (101) may include a folding axis (A) extending along the width direction (e.g., X-axis direction).

[0054] According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be attached. For example, the electronic device (101) may include a magnetic body configured to attach the digital pen to a side of the first housing (210) or a side of the second housing (220). According to one embodiment, the electronic device (101) may include a structure into which a digital pen can be inserted. For example, a hole (not shown) into which the digital pen can be inserted may be formed in a side of the first housing (210) or a side of the second housing (220) of the electronic device (101).

[0055] According to one embodiment, at least a portion of the first housing (210) and the second housing (220) may be formed of a metallic or non-metallic material having a rigidity of a size selected to support the display (230). At least a portion formed of the metallic material may provide a ground plane of the electronic device (101) and may be electrically connected to a ground line formed on a printed circuit board (e.g., the board portion (260) of FIG. 4).

[0056] According to one embodiment, the sensor area (224) may be formed to have a predetermined area adjacent to one edge or one corner of the second housing (220). However, the arrangement, shape, and size of the sensor area (224) are not limited to the illustrated example. For example, in another embodiment, the sensor area (224) may be provided in another corner of the second housing (220) or in any area between the upper and lower corners or in the first housing (210). In one embodiment, components for performing various functions built into the electronic device (101) may be exposed to the front of the electronic device (101) through the sensor area (224) or through one or more openings provided in the sensor area (224). In various embodiments, the components may include various types of sensors. The sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.

[0057] According to one embodiment, the first rear cover (280) is disposed on one side of the folding axis (A) on the rear surface of the electronic device (101) and may have, for example, a substantially rectangular periphery, and the periphery may be wrapped by the first housing (210). Similarly, the second rear cover (290) is disposed on the other side of the folding axis (A) on the rear surface of the electronic device (101) and may have the periphery wrapped by the second housing (220).

[0058] According to one embodiment, the first rear cover (280) and the second rear cover (290) may have substantially symmetrical shapes with respect to the folding axis (A axis). However, the first rear cover (280) and the second rear cover (290) do not necessarily have mutually symmetrical shapes, and in other embodiments, the electronic device (101) may include the first rear cover (280) and the second rear cover (290) of various shapes.

[0059] According to one embodiment, the first rear cover (280), the second rear cover (290), the first housing (210), and the second housing (220) may form a space in which various components (e.g., a printed circuit board or a battery) of the electronic device (101) may be placed. According to one embodiment, one or more components may be placed or visually exposed on the rear surface of the electronic device (101). For example, at least a portion of a sub-display (e.g., the sub-display (244) of FIG. 4) may be visually exposed through at least a portion of the first rear cover (280). In another embodiment, one or more components or sensors may be visually exposed through at least a portion of the second rear cover (290). In various embodiments, the sensor may include a proximity sensor and / or a camera module (206) (e.g., a rear camera).

[0060] According to one embodiment, a front camera exposed to the front of the electronic device (101) through one or more openings provided in the sensor area (224) or a camera module (206) exposed through at least a portion of the second rear cover (290) may include one or more lenses, image sensors, and / or image signal processors. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be arranged on one side of the electronic device (101).

[0061] According to one embodiment, the hinge cover (240) may be disposed between the first housing (210) and the second housing (220) to cover internal components (e.g., the hinge assembly (202) of FIG. 4). According to one embodiment, the hinge cover (240) may be covered by a portion of the first housing (210) and the second housing (220) or exposed to the outside, depending on the state of the electronic device (101) (flat state or folded state).

[0062] According to one embodiment, as illustrated in FIG. 2, when the electronic device (101) is in an unfolded state, the hinge cover (240) may be covered by the first housing (210) and the second housing (220) and may not be exposed. As another example, as illustrated in FIG. 3, when the electronic device (101) is in a folded state (e.g., a fully folded state), the hinge cover (240) may be exposed to the outside between the first housing (210) and the second housing (220). As another example, when the first housing (210) and the second housing (220) are in an intermediate state where they are folded at a certain angle, the hinge cover (240) may be partially exposed to the outside between the first housing (210) and the second housing (220). However, in this case, the exposed area may be less than that in the fully folded state. In one embodiment, the hinge cover (240) may include a curved surface.

[0063] According to one embodiment, the display (230) may be placed on a space formed by the housing (201). For example, the display (230) may be mounted on a recess formed by the housing (201) and may constitute most of the front surface of the electronic device (101). Accordingly, the front surface of the electronic device (101) may include the display (230), a portion of the first housing (210) adjacent to the display (230) and a portion of the second housing (220). The rear surface of the electronic device (101) may include a first rear cover (280), a portion of the first housing (210) adjacent to the first rear cover (280), a second rear cover (290), and a portion of the second housing (220) adjacent to the second rear cover (290).

[0064] In one embodiment, the display (230) may include a plurality of displays spaced apart from each other. For example, the display (230) may include a first display area (231) disposed on a first housing (210) and a second display area (232) disposed on a second housing (220). In one embodiment, the first display area (231) and the second display area (232) may rotate about a folding axis (A).

[0065] According to one embodiment, the display (230) may refer to a display in which at least a portion of the display can be transformed into a flat or curved surface. For example, the display (230) may be a foldable or flexible display. According to one embodiment, the display (230) may include a folding area (233), a first display area (231) arranged on one side (e.g., the left side of the folding area (233) illustrated in FIG. 2) with respect to the folding area (233), and a second display area (232) arranged on the other side (e.g., the right side of the folding area (233) illustrated in FIG. 2). However, the division of the areas of the display (230) is exemplary, and the display (230) may be divided into a plurality of areas (e.g., four or more or two) depending on the structure or function. For example, in the embodiment illustrated in FIG. 2, the display (230) may be divided into regions by a folding region (233) extending parallel to the Y-axis or a folding axis (A-axis), but in other embodiments, the display (230) may be divided into regions based on other folding regions (e.g., a folding region parallel to the X-axis) or other folding axes (e.g., a folding axis parallel to the X-axis). According to one embodiment, the display (230) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer (not shown) configured to detect a magnetic field-type stylus pen.

[0066] According to one embodiment, the first display area (231) and the second display area (232) may have an overall symmetrical shape centered on the folding area (233). According to one embodiment (not shown), the second display area (232), unlike the first display area (231), may include a cut notch depending on the presence of the sensor area (224), but may have a shape symmetrical with respect to the first display area (231) in other areas. In other words, the first display area (231) and the second display area (232) may include a portion having a symmetrical shape and a portion having an asymmetrical shape.

[0067] Hereinafter, the operation of the first housing (210) and the second housing (220) and each area of ​​the display (230) according to the state of the electronic device (101) (e.g., flat state or unfolded state and folded state) will be described.

[0068] According to one embodiment, when the electronic device (101) is in a flat state (e.g., FIG. 2), the first housing (210) and the second housing (220) may be arranged to face the same direction at a substantially 180-degree angle. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a 180-degree angle with each other and face the same direction (e.g., toward the front of the electronic device). The folding area (233) may form the same plane as the first display area (231) and the second display area (232).

[0069] According to one embodiment, when the electronic device (101) is in a folded state (e.g., FIG. 3), the first housing (210) and the second housing (220) may be arranged to face each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form a narrow angle (e.g., between 0 and 10 degrees) with each other and may face each other. The folding area (233) may be formed as a curved surface having at least a portion of a predetermined curvature.

[0070] According to one embodiment, when the electronic device (101) is in an intermediate state (not shown), the first housing (210) and the second housing (220) may be arranged at a certain angle with respect to each other. The surface of the first display area (231) of the display (230) and the surface of the second display area (232) may form an angle that is greater than the angle in the folded state and less than the angle in the unfolded state. The folding area (233) may be formed as a curved surface having at least a certain curvature, and the curvature at this time may be less than that in the folded state.

[0071] According to one embodiment, the key input device (217) may be disposed on the front side (e.g., the first side (210a) and the second side (220a)) of the foldable housing (201). According to one embodiment, the key input device (217) may be disposed on the side side (e.g., the first side (210c) and the second side (220ca)). In another embodiment, the electronic device (101) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (301).

[0072] FIG. 4 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0073] Referring to FIG. 4, the electronic device (101) may include a housing (201), a display (230), a hinge assembly (202), a battery (250), and a substrate (260). The housing (201) may include a first housing (210), a second housing (220), a first rear cover (280), and a second rear cover (290). The configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 4 may be all or part of the same as the configurations of the first housing (210), the second housing (220), the hinge cover (240), the first rear cover (280), and the second rear cover (290) of FIG. 2 and / or FIG. 3.

[0074] According to one embodiment, the first housing (210) and the second housing (220) can be assembled to each other so as to be coupled to both sides of the hinge assembly (202). According to one embodiment, the first housing (210) can include a first support area (212) capable of supporting a component of the electronic device (101) (e.g., the first circuit board (262) and / or the first battery (252)) and a first side wall (211) surrounding at least a portion of the first support area (212). The first side wall (211) can include a first side surface of the electronic device (101) (e.g., the first side surface (210c) of FIG. 2). According to one embodiment, the second housing (220) may include a second support area (222) capable of supporting a component of the electronic device (101) (e.g., a second circuit board (264) and / or a second battery (254)) and a second side wall (221) surrounding at least a portion of the second support area (222). The second side wall (221) may include a second side surface of the electronic device (101) (e.g., the second side surface (220c) of FIG. 2).

[0075] According to one embodiment, the first housing (210) may include a first waterproof member (219). The second housing (220) may include a second waterproof member (229). The first waterproof member (219) may be disposed in the first support area (212). The second waterproof member (229) may be disposed in the second support area (222).

[0076] According to one embodiment, the display (230) may include a first display area (231), a second display area (232), a folding area (233), and a sub-display (244). The configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 3 may be all or part of the same as the configuration of the first display area (231), the second display area (232), and the folding area (233) of FIG. 1 and / or FIG. 2.

[0077] According to one embodiment, the sub-display (244) can display a screen in a different direction from the display areas (231, 232). For example, the sub-display (234) can output a screen in a direction opposite to the first display area (231). According to one embodiment, the sub-display (234) can be disposed on the first rear cover (280).

[0078] In one embodiment, the battery (250) may include a first battery (252) disposed within the first housing (210) and a second battery (254) disposed within the second housing (220). In one embodiment, the first battery (252) may be connected to the first circuit board (262), and the second battery (254) may be connected to the second circuit board (264). In one embodiment, the battery (250) may supply power to at least one component of the electronic device (101). In one embodiment, the battery (250) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0079] In one embodiment, the substrate (260) may include a first circuit board (262) disposed within a first housing (210) and a second circuit board (264) disposed within a second housing (220). In one embodiment, the first circuit board (262) and the second circuit board (264) may be electrically connected by at least one flexible circuit board (266). In one embodiment, at least a portion of the flexible circuit board (266) may be disposed across the hinge assembly (202). In one embodiment, the first circuit board (262) and the second circuit board (264) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). Components for implementing various functions of the electronic device (101) can be placed on the first circuit board (262) and the second circuit board (264).

[0080] According to one embodiment, the electronic device (101) may include speakers (208a, 208b). According to one embodiment, the speakers (208a, 208b) may convert electrical signals into sound. According to one embodiment, the speakers (208a, 208b) may be disposed within a space formed by the first housing (210), the second housing (220), the first rear cover (280), and the second rear cover (290). According to one embodiment, the speakers (208a, 208b) may include an upper speaker (208a) positioned at the top (+Y direction) of the electronic device (101) and a lower speaker (208b) positioned at the bottom (-Y direction) of the electronic device (101). In the present disclosure, the speakers (208a, 208b) are illustrated as being positioned within one housing (e.g., the first housing (210) of FIG. 4), but this is an optional structure. For example, the speakers (208a, 208b) may be located within at least one of the first housing (210) or the second housing (220). The configuration of the speakers (208a, 208b) of FIG. 4 may be all or part of the same as the configuration of the sound output module (155) of FIG. 1.

[0081] In one embodiment, the electronic device (101) may include a rear member (270) (or rear case). In one embodiment, the rear member (270) may be disposed within a housing (201) (e.g., a second housing (220)). In one embodiment, the rear member (270) may accommodate at least one antenna (275).

[0082] According to one embodiment, the electronic device (101) may include an antenna (275). The antennas (275a, 275b) may include, for example, an ultra wide band (UWB) antenna (275a), a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna (275b). The antenna (275) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.

[0083] In one embodiment, an antenna structure may be formed by a portion or a combination of the housing (201). For example, the antenna (275) may include a communication antenna (275c) that is at least partially exposed to the exterior of the electronic device (101) and forms at least a portion of the exterior of the electronic device (101). The communication antenna (275c) may be used for communication with an external electronic device (e.g., Wi-Fi). The communication antenna (275c) may be connected to the upper portion (271a) or the lower portion (271b) of the rear member (270).

[0084] In the detailed description below, a configuration in which a pair of housings (or, "housings") are rotatably coupled by a hinge structure (or, "hinge structure") may be exemplified. However, it should be noted that this embodiment does not limit the electronic device according to various embodiments disclosed in the present document. For example, the electronic device according to various embodiments disclosed in the present document may include three or more housings, and "a pair of housings" in the embodiments disclosed below may mean "two housings rotatably coupled to each other among the three or more housings."

[0085] FIG. 5 is a drawing showing an unfolded state of an electronic device (101) according to one embodiment of the present disclosure, with internal components mounted thereon.

[0086] Referring to FIG. 5, the electronic device (101) may include a foldable housing (400) (hereinafter, referred to as the housing (400)) for accommodating components of the electronic device (101), a key input device (404), a printed circuit board (430), a battery (440), and a magnet (450). The electronic device (101) may further include an antenna structure, and at least one component of the antenna structure (e.g., a first conductive portion (401)) may be formed in one area of ​​the housing (400). The electronic device (101) may further include various components (e.g., a camera module) arranged within the housing (400).

[0087] The configuration of the housing (400), the key input device (404), the printed circuit board (430), and the battery (440) of FIG. 5 may be partially or entirely identical to the configuration of the housing (201), the key input device (217), the printed circuit board (260), and the battery (189) of FIGS. 1 to 4. The structure of FIG. 5 may be optionally combined with the structures of FIGS. 1 to 4.

[0088] According to one embodiment, with reference to FIG. 5, the housing (400) may be defined as either the first housing (the first housing (210) of FIG. 2) or the second housing (the second housing (220) of FIG. 2) of the foldable housing (400). However, the housing (400) is not limited to the foldable housing and may be designed in various ways.

[0089] According to one embodiment, the housing (400) may form an exterior of the electronic device (101) and may include a first conductive portion (401) that forms at least a portion of a sidewall of the electronic device (101). According to one embodiment, the first conductive portion (401) of the housing may form a border side of the electronic device (101) and may be responsible for the side appearance. According to one embodiment, at least one member may be disposed on the first conductive portion (401), which is an outer surface of the electronic device (101). For example, a plurality of key input devices (404) may be disposed on the first conductive portion (401) of the housing. According to one embodiment, the key input devices (404) may include a fingerprint recognition sensor function. However, instead of the fingerprint recognition sensor, various sensor modules (e.g., HRM sensors, etc.) may be replaced or disposed in parallel.

[0090] According to one embodiment, the side wall may include a first conductive portion (401) that is a conductive structure or a non-conductive structure.

[0091] According to one embodiment, the housing (400) may include a second conductive portion (402) that is disposed within a side wall and constitutes a support member surrounded by the side wall. The second conductive portion (402) may be configured to place internal components of an electronic device (101), such as a printed circuit board (430), and may protect and support the internal components. The second conductive portion (402) may be electrically connected to a printed circuit board (430) to be described later. The support member according to one embodiment may include the second conductive portion (402) as a conductive structure or a non-conductive structure.

[0092] According to one embodiment, the first conductive portion (401) includes a metal material, and at least a portion thereof can be used as an antenna. According to one embodiment, the first conductive portion (401) can be at least one antenna segmented along at least a portion of a side wall. At least one first conductive portion (401) that can be used as an antenna can be formed along a side wall of the housing (400) using a metal frame (e.g., 411, 412, 413, 414, 415, 416, 417, 418 of FIG. 5).

[0093] According to one embodiment, the antenna may be configured using single-band and / or multi-band antenna structures. As an example of communication bands that may be covered by the antenna, a typical antenna used in an electronic device (101) has a PIFA or a monopole radiator as its basic structure, and the volume and number of antennas to be mounted may be determined depending on the service frequency, bandwidth, and type. Typically, a low-frequency band (Low band) of 700 MHz to 900 MHz, a Mid BAND of 1700 MHz to 2100 MHz, and a low-frequency band (High band) of 2300 MHz to 2700 MHz are used as the main communication bands, and additionally, various wireless communication services such as BT, GPS, and WIFI can be used. As another example, service bands with similar frequency bands are grouped and designed to be separated into multiple antennas. For example, in the case of the first antenna (main antenna) that is in charge of Voice / Data communication (GPRS, WCDMA, LTE, etc.), which is the main communication of the device, it is located at the lower part of the electronic device (101) (e.g., -Y axis direction of FIG. 5) where there are few metal parts that hinder the performance of the antenna, and can implement a total of 24 bands, such as 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1, B2, B5, B8), LTE (B1, B2, B3, B4, B5, B7, B8, B12, B17, B18, B19, B20, B26, B38, B39, B40, B41). The electronic device (101) according to one embodiment can implement an antenna by bundling service bands with similar frequency bands across two areas.For example, 2G (GSM850, EGSM, DCS, PCS), WCDMA (B1, B2, B5, B8), LTE (B1, B2, B3, B4, B5, B8, B12, B17, B18, B19, B20, B26, B39) can be implemented on the first antenna (main antenna), and an antenna for LTE (B7, B38, B40, B41) can be designed on the second antenna (sub antenna).

[0094] According to one embodiment, the first conductive portion (401) may be arranged along the side wall. According to one embodiment, the first conductive portion (401) may include a first-first conductive portion (411, 412, 413, 414, 416, 417, 418) that overlaps at least one surface of the printed circuit board (430) and is physically connected to the printed circuit board (430), and a first-second conductive portion (415) that does not come into contact with the printed circuit board (430) and is therefore difficult to physically connect to the printed circuit board (430).

[0095] In one embodiment, the first-second conductive portion (415) and the second conductive portion (402) may be spaced apart from each other. For example, the first-second conductive portion (415) and the second conductive portion (402) may be formed integrally. In one embodiment, a non-conductive portion (Fig. 9a 403) may be disposed between the first-second conductive portion (401) and the second conductive portion (402). For example, the non-conductive portion (403) may be disposed between the first-second conductive portion (415) and the second conductive portion (402). For example, the non-conductive portion (403) may be disposed between the first-second conductive portion (415) and the first-first conductive portion (416). The non-conductive portion (403) may be, for example, an injection-molded product.

[0096] According to one embodiment, the electronic device (101) may include a printed circuit board (430) disposed on a support member. The printed circuit board (430) may include a first printed circuit board (431) positioned in an upper region within the housing (e.g., in the +Y-axis direction of FIG. 5) and a second printed circuit board (432) positioned in a lower region within the housing (e.g., in the -Y-axis direction of FIG. 5). According to one embodiment, the first-first conductive portions (411, 412, 413, 414, 416, 417, 418) may be disposed adjacent to the first printed circuit board (431) or the second printed circuit board (432). The first-first conductive portion (411, 412, 413, 414, 416, 417, 418) can be electrically connected to the first printed circuit board (431) or the second printed circuit board (432). For example, the first-first conductive portion (411, 412, 413, 414, 416, 417, 418) is connected to an antenna contact element, and the antenna contact element is connected to a multi-layer ceramic capacitor (MLCC) element or a varistor for preventing leakage current arranged on the first printed circuit board (430) or the second printed circuit board (430), thereby preventing the housing (400) from being corroded by leakage current.

[0097] According to one embodiment, the electronic device (101) may include a battery (440) disposed on a support member. The battery (440) may be disposed between a first printed circuit board (431) and a second printed circuit board (432). According to one embodiment, the battery (440) may be disposed adjacent to a first-second conductive portion (415) of the first conductive portion (401). According to one embodiment, the battery (440) may be in contact with the first-second conductive portion (415) on at least one surface. Since the first-second conductive portion (415) is disposed adjacent to the battery (440) rather than the printed circuit board (230), a physical connection with the printed circuit board (430) may be difficult. According to one embodiment of the present invention, the first-second conductive portion (415) may be connected to a second conductive portion (402) connected to the printed circuit board (430) via a connection member (420).

[0098] According to one embodiment, the magnets (450) may be arranged in each housing so that the foldable housing (400) can maintain the folded state by using the attractive force of the magnets (450) when the housing is folded. According to one embodiment, at least one magnet (450) may be arranged between a side wall of the housing and the battery (440). The magnets (450) may be arranged between the first-second conductive portion (415) of the first conductive portion (401) and the battery (440). Since the first-second conductive portion (415) is arranged adjacent to the magnets (450) and the battery (440) rather than the printed circuit board (230), it may be difficult in terms of arrangement to connect the magnets (450) and the battery (440) using a flexible printed circuit board to the printed circuit board (430). According to one embodiment of the present invention, the first-second conductive portion (415) can be connected to the second conductive portion (402) connected to the printed circuit board (430) through the connecting member (420).

[0099] According to one embodiment, the first-second conductive portion (415) may be disposed adjacent to a battery (440) disposed between the first printed circuit board (430) and the second printed circuit board (430). Since the first-second conductive portion (440) is not disposed adjacent to the first printed circuit board (430) or the second printed circuit board (430), physical connection may be difficult. According to one embodiment according to the present invention, the electronic device (101) may further include a connecting member (420) to prevent corrosion due to leakage current of the housing (400) including the first-second conductive portion (440).

[0100] Hereinafter, the configuration and structure of the connecting member (420) will be described in detail.

[0101] FIG. 6 is a drawing showing a conductive portion of a housing (400) and a connecting member (420) according to one embodiment of the present disclosure. FIG. 6 is a drawing excluding a non-conductive structure (e.g., the non-conductive portion (403) of FIG. 9A) for convenience of explanation. FIGS. 7A and 7B are perspective views showing the front and back of a connecting member (420) according to one embodiment of the present disclosure. FIG. 8A is a drawing showing a state before the conductive portion of the housing (400) and the connecting member (420) are coupled according to one embodiment of the present disclosure. FIGS. 8B and 8C are drawings showing a state after the conductive portion of the housing (400) and the connecting member (420) are coupled according to one embodiment of the present disclosure. FIG. 9A is a drawing showing a state before the housing (400) and the connecting member (420) are coupled according to one embodiment of the present disclosure. FIG. 9b is a drawing showing the appearance after the housing (400) and the connecting member (420) are combined according to one embodiment of the present disclosure. FIG. 10 is a drawing showing a cross-section of the connecting member (420) and the housing combined along the line A-A' of FIG. 7a.

[0102] Referring to FIGS. 6 to 10, the electronic device (101) may include a foldable housing (400) (hereinafter, referred to as the housing (400)) for accommodating components of the electronic device (101), and a connecting member (420). The electronic device (101) may further include an antenna structure, and at least one component of the antenna structure (e.g., a first conductive portion (401)) may be positioned in one area of ​​the housing (400). The electronic device (101) may further include various components (e.g., a camera module) arranged within the housing (400).

[0103] The configuration of the housing (400) of FIGS. 6 to 10 may be partially or entirely identical to the configuration of the housing (201) of FIGS. 1 to 4. The structure of FIGS. 6 to 10 may be optionally combined with the structure of FIG. 5.

[0104] In one embodiment, the connecting member (420) can be in contact with the first conductive portion (401) and the second conductive portion (402). The connecting member (420) can electrically connect the first conductive portion (401) and the second conductive portion (402). In one embodiment, the connecting member (420) can electrically connect the first-second conductive portion (415) of the first conductive portion (401) and the second conductive portion (402). For example, the connecting member (420) can be in contact with the end portion of the first-second conductive portion (415) in the -Y-axis direction.

[0105] According to one embodiment, the connecting member (420) may have a capacitor structure that can block DC current and pass AC current to prevent corrosion and design for electric shock due to leakage current of the first and second conductive portions (415). According to one embodiment, the connecting member (420) may be configured so that a voltage is applied between the first metal layer (421) and the second metal layer (423) by a radiation current, and a (-) charge and a (+) charge may be induced in the first metal layer (421) or the second metal layer (423), respectively. Electric energy may be stored by the electrical attraction between the first metal layer (421) and the second metal layer (423) resulting from this, so that the connecting member (420) may perform substantially the same function as a capacitor.

[0106] According to one embodiment, the connecting member (420) may include a first metal layer (421) configured to be at least partially bonded to the second conductive portion (402), a second metal layer (423) configured to be at least partially bonded to the first conductive portion (401), and a dielectric layer (422) disposed between the first metal layer (421) and the second metal layer (423).

[0107] According to one embodiment, the first metal layer (421) may include a first-first region (421a) in contact with the second conductive portion (402), and a first-second region (421b) laminated with the dielectric layer (422). The second metal layer (423) may include a second-first region (423a) in contact with the first conductive portion (401), and a second-second region (423b) laminated with the dielectric layer (422). The dielectric layer (422) may be disposed between the first-second region (421b) of the first metal layer (421) and the second-second region (423b) of the second metal layer (423).

[0108] According to one embodiment, the first metal layer (421) can be bonded to be electrically connected to the second conductive portion (402). For example, the first metal layer (421) can be bonded to be electrically connected to the second protrusion (402a) of the second conductive portion (402). The second protrusion (402a) of the second conductive portion (402) can be formed to protrude toward the -X-axis direction in which the first conductive portion (401) is located. For example, the first metal layer (421) can be bonded to the second conductive portion (402) through a bonding method such as laser bonding or ultrasonic bonding. For example, the 1-1 region (421a) of the first metal layer (421) can be bonded to the second conductive portion (402) through a bonding method such as laser bonding or ultrasonic bonding. The first metal layer (421) and the second conductive portion (402) are bonded through laser bonding or ultrasonic bonding, so that the function and shape of the electronic device (101) can be maintained even when an impact, such as a drop, is applied to the electronic device (101).

[0109] According to one embodiment, the second metal layer (423) can be bonded to be electrically connected to the first conductive portion (401). According to one embodiment, the second metal layer (423) can be bonded to be electrically connected to the 1-2 conductive portion (415). For example, the first metal layer (421) can be bonded to be electrically connected to the first protrusion (415a) of the 1-2 conductive portion (415). The first protrusion (415a) of the 1-2 conductive portion (415) can be formed to protrude toward the +X-axis direction where the second conductive portion (402) is located. For example, the second metal layer (423) can be bonded to the first conductive portion (401) through a bonding method such as laser bonding or ultrasonic bonding. For example, the second-1 region (423a) of the second metal layer (423) can be bonded to the first conductive portion (401) through a bonding method such as laser bonding or ultrasonic bonding. By bonding the first metal layer (421) and the second conductive portion (402) through laser bonding or ultrasonic bonding, the function and shape of the electronic device (101) can be maintained even when an impact, such as a drop, is applied to the electronic device (101).

[0110] According to one embodiment, the electric capacitance of the connecting member (420) may be determined by the permittivity of the dielectric layer (422) and the spacing and overlapping area of ​​the first metal layer (421) and the second metal layer (423). For example, the permittivity of the dielectric layer (422) according to one embodiment of the present invention may be about 1.0 (Fm) or more and 5.0 (Fm) or less. For example, the permittivity of the dielectric layer (422) according to one embodiment of the present invention may be about 3.0 (Fm). For example, the thickness of the dielectric layer (422) according to one embodiment of the present invention may be about 0.005 mm or more and 0.015 mm or less. For example, the thickness of the dielectric layer (422) according to one embodiment of the present invention may be about 0.01. mm. For example, the horizontal length (e.g., t1 in FIG. 9) or the vertical length (e.g., t2 in FIG. 9) of the laminated portion (e.g., the first-second region (421b) of the first metal layer (421), the dielectric layer (422), and the second-second region (423b) of the second metal layer (423)) of the connecting member (420) according to one embodiment of the present invention may be about 1 mm or more and 4 mm or less. For example, the horizontal length or the vertical length of the laminated portion (e.g., the first-second region (421b) of the first metal layer (421), the dielectric layer (422), and the second-second region (423b) of the second metal layer (423)) of the connecting member (420) according to one embodiment of the present invention may be about 2 mm.

[0111] According to one embodiment, a portion of a housing (400) including a first conductive portion (401), a second conductive portion (402), and a non-conductive portion (403) coupled with a connecting member (420) may be formed with a recess (4200) corresponding to the shape of the connecting member (420). When the housing (400) including the first conductive portion (401), the second conductive portion (402), and the non-conductive portion (403) and the connecting member (420) are coupled, a front surface of the electronic device (101) (e.g., one side in the +Z-axis direction of FIG. 6) may be formed flat.

[0112] FIGS. 11A to 11C are cross-sectional views of a connecting member (420) cut along line A-A' of FIG. 7B according to one embodiment of the present disclosure.

[0113] Referring to FIGS. 11A to 11C, the electronic device (101) may include a foldable housing (400) (hereinafter, referred to as the housing (400)) for accommodating components of the electronic device (101), a key input device (404), a printed circuit board (430), a battery (440), and a magnet (450). The electronic device (101) may further include an antenna structure, and at least one component of the antenna structure (e.g., the first conductive portion (401)) may be located in one area of ​​the housing (400). The electronic device (101) may further include various components (e.g., a camera module) arranged within the housing (400).

[0114] The configuration of the housing (400), the key input device (404), the printed circuit board (430), and the battery (440) of FIGS. 11A to 11C may be partially or entirely identical to the configuration of the housing (201), the key input device (217), the printed circuit board (260), and the battery (189) of FIGS. 1 to 4. The structure of FIGS. 11A to 11C may be optionally combined with the structure of FIGS. 5 to 10.

[0115] According to one embodiment, referring to FIG. 11A, the dielectric layer (422a) constituting the connecting member (420) may be formed of a flexible copper clad layer (FCCL). For example, the dielectric layer (422a) may be formed of a double-sided flexible copper clad layer (FCCL). The flexible copper clad layer (FCCL) may be formed by a casting method for coating copper foil on a polyimide (PI) film, a sputtering method for depositing copper foil, or an electroless plating method. For example, the capacitance of the dielectric layer (422a) may be approximately 15 pF or more and 25 pF or less. For example, the capacitance of the dielectric layer (422a) may be approximately 20 pF. For example, the dielectric layer (422a) may have a thickness of approximately 15 μm or less. For example, the dielectric layer (422a) may have a thickness of approximately 12 μm or less. According to one embodiment, the dielectric layer (422a) may be attached to the first metal layer (421) and the second metal layer (423) through soldering (SMT). For example, the dielectric layer (422a) may be attached to a support member (not shown) disposed on the upper and lower surfaces through soldering (SMT), and the support member (not shown) may be connected to the first metal layer (421) and the second metal layer (423) through laser fusion.

[0116] According to one embodiment, referring to FIG. 11b, the dielectric layer (422b) constituting the connecting member (420) may be a film type. For example, the dielectric layer (422b) may have a thickness of approximately 40 μm or more and 60 μm or less. For example, the dielectric layer (422b) may have a thickness of approximately 50 μm. The capacitance of the dielectric layer (422b) according to the present embodiment (FIG. 11b) may be higher than the capacitance of the dielectric layer (422a) according to the above-described embodiment (FIG. 11a).

[0117] According to one embodiment, referring to FIG. 11c, the dielectric layer (422c) constituting the connecting member (420) may include metal sheets (4221, 4223) and a bonding sheet (4222) disposed between the metal sheets. The dielectric layer (422c) may be manufactured by a hot press method. For example, the dielectric layer (422c) may be manufactured by a hot press method in which compression is performed under a weight of 45 kg at a temperature of approximately 160 degrees. For example, the dielectric layer (422c) may have a thickness of approximately 10 μm or more and 20 μm or less.

[0118] An electronic device according to an embodiment of the present disclosure may include a housing including at least one first conductive portion segmented along at least a portion of a side wall (e.g., the first-second conductive portion (415) of FIG. 5), and a second conductive portion disposed inside the side wall and spaced apart from the first conductive portion, a connecting member electrically connecting the first conductive portion and the second conductive portion, and a printed circuit board disposed inside the housing and electrically connected to the first conductive portion through the connecting member. The connecting member may include a first metal layer configured to have at least a portion thereof bonded to the first conductive portion, a second metal layer configured to have at least a portion thereof bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer.

[0119] According to one embodiment, the first metal layer includes a 1-1 region (421a) in contact with the first conductive portion, and a 1-2 region (421b) laminated with the dielectric layer, the second metal layer includes a 2-1 region (423a) in contact with the second conductive portion, and a 2-2 region (423b) laminated with the dielectric layer, and the dielectric layer may be configured to be disposed between the 1-2 region of the first metal layer and the 2-2 region of the second metal layer.

[0120] In one embodiment, the connecting member may be configured to block DC current and pass AC current.

[0121] According to one embodiment, the housing may further include a recess (4200) formed in a shape corresponding to the shape of the connecting member at a position where the connecting member is coupled.

[0122] According to one embodiment, the connecting member may include a flexible copper clad layer (FCCL).

[0123] According to one embodiment, the dielectric layer of the connecting member may include a first metal sheet (4221) in contact with the first metal layer, a second metal sheet (4223) in contact with the second metal layer, and a bonding sheet (4222) disposed between the first metal sheet and the second metal sheet.

[0124] According to one embodiment, the housing may further include a non-conductive portion (403) disposed between the first conductive portion and the second conductive portion.

[0125] According to one embodiment, the printed circuit board may include a first printed circuit board (431) positioned in an upper region within the housing, and a second printed circuit board (432) positioned in a lower region within the housing.

[0126] According to one embodiment, the second conductive portion further includes a battery (440) disposed on the second conductive portion, wherein the battery may be disposed adjacent to the first conductive portion.

[0127] According to one embodiment, the device may further include a magnet (450) disposed between the first conductive portion and the battery.

[0128] In one embodiment, the second conductive portion may be configured to be electrically connected to the printed circuit board.

[0129] In one embodiment, the first conductive portion may be spaced apart from the printed circuit board.

[0130] According to one embodiment, the first metal layer may be configured to be bonded to the first conductive portion via at least one of laser bonding or ultrasonic bonding.

[0131] In one embodiment, the second metal layer may be configured to be bonded to the second conductive portion via at least one of laser bonding or ultrasonic bonding.

[0132] According to one embodiment, at least one key input device may be disposed on the first conductive portion.

[0133] An electronic device according to one embodiment of the present disclosure may include a housing including at least one first conductive portion segmented along at least a portion of a sidewall, and a second conductive portion disposed within the sidewall and spaced apart from the first conductive portion, a connecting member electrically connecting the first conductive portion and the second conductive portion, and a printed circuit board disposed within the housing and electrically connected to the first conductive portion through the connecting member. The connecting member may include a first metal layer configured to have at least a portion thereof bonded to the first conductive portion, a second metal layer configured to have at least a portion thereof bonded to the second conductive portion, and a dielectric layer disposed between the first metal layer and the second metal layer. The first metal layer may be configured to be bonded to the first conductive portion through at least one of laser bonding and ultrasonic bonding, and the second metal layer may be configured to be bonded to the second conductive portion through at least one of laser bonding and ultrasonic bonding.

[0134] In one embodiment, the connecting member may be configured to block DC current and pass AC current.

[0135] According to one embodiment, the first metal layer includes a 1-1 region (421a) in contact with the first conductive portion, and a 1-2 region (421b) laminated with the dielectric layer, the second metal layer includes a 2-1 region (423a) in contact with the second conductive portion, and a 2-2 region (423b) laminated with the dielectric layer, and the dielectric layer may be configured to be disposed between the 1-2 region of the first metal layer and the 2-2 region of the second metal layer.

[0136] According to one embodiment, the housing may further include a recess (4200) formed in a shape corresponding to the shape of the connecting member at a position where the connecting member is coupled.

[0137] According to one embodiment, the connecting member may include a flexible copper clad layer (FCCL).

[0138] When using a charger (e.g., a third-party fast charger) to charge an electronic device (101), if electrolyte (e.g., sweat, water) flows into the metal member of the electronic device (101) due to leakage current, oxidation (corrosion) of the metal member occurs, and the gas (e.g., h2 gas) generated during this process may push out the anodizing layer, causing an anodizing peeling phenomenon (leakage current corrosion phenomenon). To prevent this, the side wall housing including the fingerprint key and the support member can be separated. An antenna contact element is placed between a first conductive portion (401) (antenna) of a side wall on which a fingerprint key is arranged and a second conductive portion (402) constituting at least a portion of a support member, and a multilayer ceramic capacitor (MLCC) element or varistor for preventing leakage current after upper / lower or side contact is mounted on a printed circuit board (430) (PCB) to block the DC current between the second conductive portion (402) and the ground. However, blocking may be difficult in the case of an antenna that is not adjacent to the printed circuit board (430).

[0139] An electronic device (101) according to one embodiment of the present invention physically separates a first conductive portion (401) (antenna) and a second conductive portion (402) (support member) on which a fingerprint key is arranged, and electrically connects them through a connecting member (420) that has substantially the same function as a capacitor, thereby preventing electric shock and corrosion due to antenna performance and leakage current.

Claims

1. In electronic devices, A housing (400) comprising at least one first conductive portion (e.g., the first-second conductive portion (415) of FIG. 5) segmented along at least a portion of a side wall, and a second conductive portion (402) disposed within the side wall and spaced apart from the first conductive portion; A connecting member (420) electrically connecting the first conductive portion and the second conductive portion; and A printed circuit board (430) disposed within the housing and electrically connected to the first conductive portion through the connecting member; The above connecting member is, A first metal layer (421) configured to be at least partially bonded to the first conductive portion; A second metal layer (423) configured to be at least partially bonded to the second conductive portion; and An electronic device including a dielectric layer (422) disposed between the first metal layer and the second metal layer.

2. In paragraph 1, The above first metal layer is, It includes a first-first region (421a) in contact with the first challenging portion, and a first-second region (421b) laminated with the dielectric layer, The second metal layer is, It includes a 2-1 region (423a) in contact with the second challenging portion, and a 2-2 region (423b) laminated with the dielectric layer. An electronic device configured such that the dielectric layer is disposed between the first-2 region of the first metal layer and the second-2 region of the second metal layer.

3. In either of paragraphs 1 and 2, The above connecting member is an electronic device configured to block DC current and pass AC current.

4. In any one of paragraphs 1 to 3, An electronic device in which the housing further includes a recess (4200) formed in a shape corresponding to the shape of the connecting member at a position where the connecting member is coupled.

5. In any one of paragraphs 1 to 4, The above connecting member is an electronic device including a flexible copper clad layer (FCCL).

6. In any one of paragraphs 1 to 4, An electronic device in which the dielectric layer of the connecting member comprises a first metal sheet (4221) in contact with the first metal layer, a second metal sheet (4223) in contact with the second metal layer, and a bonding sheet (4222) disposed between the first metal sheet and the second metal sheet.

7. In any one of paragraphs 1 to 6, The above housing, An electronic device further comprising a non-conductive portion (403) disposed between the first conductive portion and the second conductive portion.

8. In any one of paragraphs 1 to 7, The above printed circuit board, A first printed circuit board (431) located in the upper region within the housing, and An electronic device comprising a second printed circuit board (432) positioned in a lower region within the housing.

9. In any one of paragraphs 1 to 8, Further comprising a battery (440) disposed on the second challenging portion, The above battery is an electronic device disposed adjacent to the first conductive portion.

10. In paragraph 9, An electronic device further comprising a magnet (450) disposed between the first conductive portion and the battery.

11. In any one of paragraphs 1 to 10, An electronic device wherein the second conductive portion is configured to be electrically connected to the printed circuit board.

12. In any one of paragraphs 1 to 11, The above first challenging portion is an electronic device spaced apart from the printed circuit board.

13. In any one of paragraphs 1 to 12, An electronic device wherein the first metal layer is configured to be bonded to the first conductive portion through at least one of laser bonding or ultrasonic bonding.

14. In any one of paragraphs 1 to 13, An electronic device wherein the second metal layer is configured to be bonded to the second conductive portion through at least one of laser bonding or ultrasonic bonding.

15. In any one of paragraphs 1 to 14, An electronic device having at least one key input device disposed in the first challenging portion.

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