Motor base, voice coil motor, and manufacturing method for motor base

Abstract

The present invention provides a motor base, a voice coil motor, and a manufacturing method for the motor base. The motor base comprises a plurality of metal branches, an insulating seat injection-molded on the plurality of metal branches, and at least one first electronic assembly and a high-density integrated circuit module that are mounted on the insulating seat and are electrically connected to the metal branches; the high-density integrated circuit module comprises a rigid circuit board and a high-density integrated circuit soldered to the rigid circuit board; the rigid circuit board is provided with a plurality of conductive pieces arranged at intervals; the conductive pieces are electrically connected to the metal branches embedded in the insulating seat, so that the high-density integrated circuit is electrically connected to the first electronic assembly by means of the metal branches. The present invention can more rationally use the circuit layout space of the motor base, so that the high-density integrated circuit can realize richer control functions by using a larger space.

Description

Motor base, voice coil motor and manufacturing method thereof Technical Field

[0001] The present invention relates to the technical field of motor manufacturing, and in particular to a motor base, a voice coil motor and a manufacturing method thereof. Background Art

[0002] The voice coil motor is an important component used for camera focus and anti-shake. It usually includes driving components such as a motor base and a magnetic structure. The motor base is embedded with a metal circuit and a coil formed by winding or assembled by mounting. Driving components such as the magnetic structure are used to connect to the lens. They interact with the coil and drive the movement of the magnetic structure and lens by changing the DC current of the coil inside the motor.

[0003] The motor base can be applied to camera modules in mobile phones. Due to the thickness of mobile phones, horizontally placed mobile phone cameras can only have a small focal length, and the optical zoom capability is very limited. Periscope voice coil motors can effectively solve this problem. Unlike the traditional side-by-side arrangement of dual cameras, periscope voice coil motors place the original vertical cameras horizontally within the phone. A special optical prism refracts light into the lens group to achieve imaging, which can significantly increase the camera's focal length.

[0004] Compared to conventional voice coil motors, the structure of a periscope voice coil motor is relatively complex. In addition to a photosensitive component and an optical lens, it also includes a reflective element for changing the propagation direction of ambient light. For details, please refer to the Chinese invention patent application with publication number CN113328586A. The photosensitive component, optical lens, and reflective element all require position sensing for their movement in all directions. Therefore, to achieve more refined drive control, the periscope voice coil motor requires more sensing elements or computing processing to facilitate the processing of sensing signals, calculations, and feedback control of current magnitude. In addition, these structures all require drive or anti-shake control, resulting in the periscope voice coil motor requiring the installation of more sensors for position monitoring on the base and the installation of a processor (Central Processing Unit, CPU) or integrated circuit (IC) that provides more powerful computing control capabilities.

[0005] Conventional voice coil motors typically incorporate various integrated circuits (ICs). For example, the driver IC used to drive the coil is typically integrated with a Hall effect sensor. This restricts its placement to a centralized location and controls only a single sensor. If the voice coil motor requires more sensors to sense and control dynamics at a wider range of locations, more driver ICs with integrated Hall effect sensors are required. Furthermore, because conventional driver ICs can only be integrated in the same location as the sensors, there's no flexibility in sensor placement (the sensors and coils are relatively small, while the driver ICs are typically larger). Furthermore, the driver ICs can't be positioned in a more suitable and flexible location.

[0006] In the prior art, voice coil motors require fewer coils and sensors, and fewer control circuits for the coils and sensors. Therefore, the coils and sensors can be directly welded and integrated with the metal circuits within the base of the motor base in a more convenient manner (for example, the metal circuit within the base is formed by a single stamping process, then welded to the coil or sensor, and finally bent or arranged directly at the sensing position without bending). However, driver integrated circuits (Driver ICs) with the ability to control multiple coils or sensors require complex built-in computing and control functions, so more circuit structures are required, thus forming a new generation of high-density integrated circuits (HDICs). However, the metal circuits within the base of the prior art motor base are limited by the base size, and the circuit layout space is limited. At the same time, the metal circuits are also limited to a certain extent by the minimum size requirements of the stamping process for the metal circuits, resulting in the inability to integrate more metal circuits within the limited circuit layout space of the base. As a result, the circuit layout capabilities are no longer able to meet the requirements for the integrated layout of such high-density integrated circuits and the metal circuits within the base.

[0007] Therefore, it is necessary to provide a motor base and a voice coil motor having the same, which can more reasonably utilize the circuit layout space of the motor base, so that the control circuit of the high-density integrated circuit can utilize a larger space to achieve richer control functions.

[0008] Summary of the Invention

[0009] The present invention aims to solve at least one of the technical problems raised in the above-mentioned background technology, and proposes a motor base and a voice coil motor having the same, and a method for manufacturing the motor base, which can more reasonably utilize the circuit layout space of the motor base, so that the control circuit of the high-density integrated circuit can utilize a larger space to achieve richer control functions.

[0010] The technical solution adopted by the present invention to solve the problems of the prior art is:

[0011] A motor base includes a plurality of metal branches, an insulating base injection-molded on the plurality of metal branches, at least one first electronic component mounted on the insulating base and electrically connected to the metal branches, and a high-density integrated circuit module. The high-density integrated circuit module includes a rigid circuit board and a high-density integrated circuit soldered to the rigid circuit board. The rigid circuit board is provided with a plurality of spaced conductive sheets, which are electrically connected to the metal branches embedded in the insulating base, so that the high-density integrated circuit is electrically connected to the first electronic component through the metal branches.

[0012] Furthermore, the high-density integrated circuit has at least eight solder points, the rigid circuit board has at least eight solder pads corresponding to the at least eight solder points and is welded and fixed thereto, the rigid circuit board forms a number of circuits electrically connecting the corresponding solder pads and the conductive sheets, and the conductive sheets of the rigid circuit board are welded and fixed to the metal branches in the insulating base.

[0013] Furthermore, the first electronic component includes a first sensing element and a first coil with a position sensing function, and the first sensing element and the first coil are directly welded to the corresponding metal branch. The high-density integrated circuit module is electrically connected to the first sensing element and the first coil through the metal branch, and then outputs a control signal to control the current to drive the first coil after realizing the sensing function according to the first sensing element.

[0014] Furthermore, at least one end of a portion of the metal branches is provided with solder feet arranged at intervals around the periphery of the rigid circuit board, and the conductive sheet is arranged on the periphery of the rigid circuit board and is welded and fixed to the corresponding solder feet.

[0015] Furthermore, the insulating base is inwardly recessed to form a mounting groove, the high-density integrated circuit module is accommodated in the mounting groove, and at least part of the soldering feet of the metal branch are embedded in one side or periphery of the mounting groove.

[0016] Furthermore, a platform is formed on the periphery of the mounting groove, and the mounting groove includes a recessed portion recessed from the platform, and the rigid circuit board is accommodated in the recessed portion.

[0017] Furthermore, the platform is provided with recesses corresponding to the soldering feet of the metal branch, the soldering feet are embedded in the corresponding recesses to be exposed outside the insulating base, and partition blocks are formed between two adjacent recesses.

[0018] Furthermore, the conductive sheet of the rigid circuit board and the corresponding solder feet are arranged opposite to each other along the length or width direction of the solder feet and are soldered and connected to each other through solder paste.

[0019] Furthermore, the surfaces of the rigid circuit board where the conductive sheet and the solder feet are soldered to each other are located in the same plane.

[0020] Furthermore, the conductive sheets of the rigid circuit board and the corresponding solder feet are stacked along the thickness direction of the solder feet and are soldered to each other.

[0021] Furthermore, a via hole is provided on the rigid circuit board, the circuit is formed on opposite sides of the rigid circuit board and is electrically connected through the via hole, and the conductive sheet is located on one side of the rigid circuit board and is electrically connected to the corresponding circuit on the other side of the rigid circuit board through the via hole.

[0022] Furthermore, the rigid circuit board is a ceramic substrate or a rigid printed circuit board or an integrally formed part of an etched circuit and a plastic base.

[0023] Furthermore, when the rigid circuit board is a ceramic substrate, the surfaces of opposite sides of the ceramic substrate are plated to form the conductive sheet and the circuit electrically connected to the conductive sheet, and the line width of the circuit is greater than or equal to 20 microns and less than or equal to 70 microns.

[0024] Furthermore, the high-density integrated circuit and the rigid circuit board are fixed by welding with a first solder paste, and the conductive sheet of the rigid circuit board and the metal branch are fixed by welding with a second solder paste. The melting point of the first solder paste is greater than the melting point of the second solder paste. The high-density integrated circuit and the rigid circuit board, as well as the rigid circuit board and the metal branch, are all fixed by welding with reflow soldering.

[0025] Furthermore, the rigid circuit board is electrically connected to a plurality of capacitor elements.

[0026] Furthermore, the insulating base includes at least two separately arranged insulating blocks that are injection molded on the metal branch once and an insulating base body that is injection molded on the insulating blocks and the metal branch twice, and the high-density integrated circuit module and the first electronic component are respectively arranged on at least two of the insulating blocks.

[0027] Furthermore, the insulating base includes a horizontally arranged bottom and a first side wall and a second side wall that are vertically and oppositely arranged. The insulating block includes a first insulating block and a second insulating block that are embedded in the first side wall at intervals, and a third insulating block that is embedded in the second side wall and opposite to the second insulating block. The high-density integrated circuit module is fixed to the first insulating block, and the second insulating block and the third insulating block are both provided with the first electronic component.

[0028] Furthermore, the insulating block also includes a fourth insulating block embedded in the second side wall and spaced apart from the third insulating block, a second electronic component is installed on the fourth insulating block, at least part of the metal branch is provided with a welding end exposed to the fourth insulating block, the welding end is electrically connected to the second electronic component, the second electronic component includes a second coil and a sensing chip arranged at the center position of the second coil for controlling the operation of the second coil, and the high-density integrated circuit module is arranged opposite to the second electronic component.

[0029] The present invention provides a voice coil motor, comprising the motor base and a first optical module matched with the motor base and located at the first electronic component. The first optical module is fixed with an optical element and comprises a first magnetic element matched with the first electronic component.

[0030] The present invention also provides another voice coil motor, comprising the motor base and a second optical module cooperating with the motor base and located at the second electronic component, wherein the second optical module comprises a second magnetic element cooperating with the second electronic component.

[0031] The present invention also provides a method for manufacturing the motor base, comprising the following steps:

[0032] S1, providing a plurality of metal branches;

[0033] S2, injection molding at least a portion of the insulating base on the metal branch;

[0034] S3, installing at least one first electronic component on the insulating base and electrically connecting it to the metal branch;

[0035] S4, providing a rigid circuit board, wherein the rigid circuit board is provided with a plurality of conductive sheets arranged at intervals, soldering the high-density integrated circuit to the rigid circuit board to form a high-density integrated circuit module, and electrically connecting the conductive sheets arranged on the rigid circuit board to the metal branches embedded in the insulating base, so that the high-density integrated circuit is electrically connected to the first electronic component through the metal branches.

[0036] Furthermore, in the manufacturing method of the motor base:

[0037] In S1, in an initial state, the plurality of metal branches are arranged horizontally;

[0038] In S2, three separately arranged first insulating blocks, second insulating blocks, and third insulating blocks are injection-molded at the metal branch at one time to form a portion of the insulating base, wherein the first insulating block, the second insulating block, and the third insulating block are all arranged horizontally;

[0039] In S3, the first electronic component is horizontally mounted on the second insulating block and the third insulating block and directly welded to the corresponding metal branch;

[0040] In S4, the high-density integrated circuit module is horizontally mounted on the first insulating block, and the conductive sheet of the rigid circuit board is welded to the corresponding metal branch.

[0041] Furthermore, the manufacturing method of the motor base further includes the following steps:

[0042] S5, bending the metal branch so that the first insulating block, the high-density integrated circuit module mounted on the first insulating block, the second insulating block, the third insulating block, and the first electronic component mounted on the second insulating block and the third insulating block are all transformed from a horizontal position to a vertical position;

[0043] S6, performing secondary injection molding on the metal branch, the first insulating block, the second insulating block and the third insulating block to obtain an insulating seat body, thereby forming the insulating base.

[0044] Beneficial effects of the present invention:

[0045] The motor base integrates a high-density integrated circuit (IC), which is connected to the first electronic assembly via a metal branch. Compared to the existing split-type control method that uses multiple driver ICs to control multiple electronic components separately, the motor base uses a single IC to simultaneously control multiple electronic components, replacing the split-type control method of the prior art with integrated control. This allows the IC to achieve a richer range of control functions. The IC module can be integrated or separated from the electronic component it controls. This means that the IC module is not limited to being located adjacent to the controlled electronic component. This arrangement allows the IC module and the electronic component to be dispersed, achieving a more flexible spatial layout. Furthermore, the IC is independently placed on a rigid circuit board, making it more suitable for integrating complex circuits without burdening the spatial arrangement of the metal branches within the insulating base. This allows for more efficient utilization of the circuit layout space within the motor base, further improving the control capabilities of the motor base and the voice coil motor incorporating it, and enabling the IC to utilize a larger space to achieve a richer range of control functions. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] The objectives, technical solutions and beneficial effects of the invention described above can be achieved through the following drawings:

[0047] FIG1 is a schematic diagram of the three-dimensional structure of a motor base according to a first embodiment of the present invention.

[0048] FIG. 2 is a perspective view of the motor base shown in FIG. 1 from another perspective.

[0049] FIG3 is a schematic structural diagram of the motor base without the insulating base according to the first embodiment of the present invention.

[0050] FIG4 is an enlarged view of part of the structure in FIG3 .

[0051] FIG5 is an enlarged view of point A in FIG4 .

[0052] FIG6 is an exploded view of part of the structure in FIG3 .

[0053] FIG7 is a schematic structural diagram of the side of the high-density integrated circuit facing the rigid circuit board in FIG6 .

[0054] FIG8 is a schematic diagram of the structure of FIG3 without the insulating block.

[0055] FIG9 is an enlarged view of point B in FIG8 .

[0056] FIG10 is a three-dimensional view of FIG8 from another perspective.

[0057] FIG11 is an enlarged view of point C in FIG10 .

[0058] FIG. 12 is a schematic diagram of the three-dimensional structure of a motor base according to a second embodiment of the present invention.

[0059] FIG. 13 is a structural diagram of the motor base at the high-density integrated circuit module after removing the insulating base body according to the second embodiment of the present invention.

[0060] FIG14 is a structural diagram from another perspective after FIG13 removes the insulating block.

[0061] FIG15 is a structural diagram of FIG14 from another perspective.

[0062] FIG. 16 is a structural diagram of a motor base at a high-density integrated circuit module after removing the insulating base body according to the third embodiment of the present invention.

[0063] FIG17 is a structural diagram of FIG16 without the insulating block.

[0064] Explanation of the main component symbols: 100, 200, motor base; 10, metal branch; 101, solder foot; 11, first branch; 112, first connecting section; 113, 124, 152, pin; 12, second branch; 121, second extension section; 122, second connecting section; 123, second connecting section; 13, third branch; 131, third connecting section; 14, fourth branch; 141, fourth extension section; 142, fourth connecting section; 143, fourth connecting section; 15, fifth branch; 151, fifth connecting section; 20, insulating base; 21, insulating block; 211, first insulating block; 212, second insulating block; 213 , third insulating block; 214, fourth insulating block; 215, mounting groove; 2150, platform; 2152, recessed portion; 2153, opening; 216, pit; 217, partition block; 23, insulating seat; 231, bottom; 232, first side wall; 233, second side wall; 30, first electronic component; 31, first sensing element; 32, first coil; 40, high-density integrated circuit module; 41, rigid circuit board; 410, solder pad; 411, conductive sheet; 412, circuit; 416, via; 42, high-density integrated circuit; 421, solder joint; 50, second coil; 60, sensing chip; 70, capacitor element. DETAILED DESCRIPTION

[0065] The present invention will be described in further detail below with reference to the accompanying drawings of the embodiments.

[0066] Referring to Figures 1 to 3 , a motor base 100 provided in a first embodiment of the present invention includes a plurality of metal branches 10, an insulating base 20 injection-molded onto the plurality of metal branches 10, at least one first electronic component 30 disposed on the insulating base 20 and electrically connected to the metal branches 10, and a high-density integrated circuit module 40 disposed on the insulating base 20 and electrically connected to the first electronic component 30. In this embodiment, the insulating base 20 includes an insulating block 21 injection-molded onto the metal branches 10, and an insulating base body 23 injection-molded onto the insulating block 21 and the metal branches 10.

[0067] In this embodiment, the insulating base 23 is a three-dimensional frame structure. The insulating base 23 specifically includes a horizontally disposed bottom 231 and vertically opposed first and second side walls 232 and 233. The insulating blocks 21 are embedded in the first and second side walls 232 and 233. Multiple insulating blocks 21 can be provided as needed, each corresponding to one or more electronic components. The multiple electronic components constitute a first electronic assembly 30. In this embodiment, the insulating blocks 21 specifically include a first insulating block 211 and a second insulating block 212 embedded in the first side wall 232 at intervals, and a third insulating block 213 and a fourth insulating block 214 embedded in the second side wall 233 at intervals. The third insulating block 213 is opposite the second insulating block 212, and the fourth insulating block 214 is opposite the first insulating block 211.

[0068] It can be understood that in this embodiment, the number of insulating blocks 21 is four. However, the embodiments of the present invention are not limited to this. In actual application, the number of insulating blocks 21 can be further expanded based on the number of electronic components or the number of electronic component combinations.

[0069] It is understandable that in other embodiments, the insulating base 23 may only have a bottom 231 , ie, the first side wall 232 or the second side wall 233 or both are omitted. In this case, the insulating block 21 may be disposed on the bottom 231 .

[0070] In this embodiment, the first electronic component 30 disposed on the insulating block 21 includes at least two first sensing elements 31 with position sensing functions and at least two first coils 32. The at least two first sensing elements 31 and the at least two first coils 32 are disposed on the corresponding insulating block 21. The first sensing element 31 can be a Hall sensor (HS), and the first coil 32 can be a wound hollow coil or a patch-type flexible printed coil (FP coil). Specifically, in this embodiment, the number of first sensing elements 31 and first coils 32 is four, of which two first sensing elements 31 and two first coils 32 are mounted on the inner side surface of the second insulating block 212 facing the second sidewall 233, and the other two first sensing elements 31 and the other two first coils 32 are mounted on the inner side surface of the third insulating block 213 facing the first sidewall 232. The first sensing element 31 can be a Hall sensor component or an integrated circuit component including a Hall sensor. The four first sensing elements 31 are used to sense the position of the first optical module (e.g., a prism, not shown) in real time. The four first coils 32 are arranged in pairs opposite each other to drive the first optical module to rotate in two different axial directions. In this embodiment, a second electronic component (not shown) is also mounted on the fourth insulating block 214. The second electronic component includes a second coil 50 and a sensing chip 60 positioned at the center of the second coil 50 for controlling the operation of the second coil 50. At least a portion of the soldered ends (not shown) of the metal branch 10 are exposed through the fourth insulating block 214 to electrically connect to the second coil 50 and the sensing chip 60. The sensing chip 60 can be a Hall sensor component or an integrated circuit component containing a Hall sensor.

[0071] Referring to Figures 4 to 11 , the high-density integrated circuit module 40 of this embodiment primarily has a driving function and, therefore, may also be referred to as a driver integrated circuit module. It is used to drive or control at least one first sensing element 31 and at least one first coil 32. In this embodiment, the high-density integrated circuit module 40 is spaced apart from the first sensing element 31 and first coil 32 it drives, such that the high-density integrated circuit module 40 and the first electronic component 30 it drives are located on different insulating blocks 21. This achieves a separate arrangement of some of the first sensing elements 31 and first coil 32 from the high-density integrated circuit module 40. The high-density integrated circuit module 40 is disposed on an insulating base 20 and includes a high-density integrated circuit 42. The high-density integrated circuit 42 is electrically connected to a metal branch 10 embedded in the insulating base 20, thereby electrically connecting the high-density integrated circuit 42 to the first electronic component 30 via the metal branch 10. A traditional Hall sensor (HS) has four solder joints, and a traditional integrated circuit (IC) with an integrated Hall sensor has eight solder joints. The high-density integrated circuit 42 of the present invention is called a High Density Integrated Circuit (HDIC for short), which is a new generation of integrated circuit. It integrates more circuit structures and solder joints 421 internally, so that it can control or drive multiple or multiple electronic components on the motor base 100. The solder joints 421 (such as solder balls or solder pads) formed on its surface are arranged at a higher density than that of the Hall sensor and the integrated circuit, generally not less than eight, and twenty-seven in this embodiment, but there is no limit in other embodiments, for example, it can be ten, fifteen, twenty, etc.

[0072] In this embodiment, the high-density integrated circuit module 40 specifically includes a rigid circuit board 41 disposed on the insulating base 20 and the high-density integrated circuit 42 soldered to the rigid circuit board 41. The rigid circuit board 41 is disposed on the insulating base 20 at a position away from the first electronic component 30. The rigid circuit board 41 is soldered to the metal branch 10 embedded in the insulating base 20, so that the high-density integrated circuit 42 is electrically connected to at least one first sensing element 31 and at least one first coil 32 through the metal branch 10.

[0073] In this embodiment, the high-density integrated circuit 42 is electrically connected to the plurality of first sensing elements 31 and the plurality of first coils 32 simultaneously via the metal branches 10. Specifically, in this embodiment, the high-density integrated circuit 42 is electrically connected to each of the four first sensing elements 31 and the four first coils 32 via the metal branches 10. The rigid circuit board 41 is disposed on the first insulating block 211 and is located on the inner side of the first insulating block 211 facing the second sidewall 233.

[0074] In this embodiment, three capacitor elements 70 are electrically connected to the rigid circuit board 41 of the high-density integrated circuit module 40 . The capacitor elements 70 can provide better filtering function for the high-density integrated circuit 42 .

[0075] It is understood that in this application, the high-density integrated circuit module 40 can be integrated with or separated from the sensing element or coil it controls. This means that the location of the high-density integrated circuit module 40 is not limited to being adjacent to the sensing element or coil it controls. This arrangement allows for a more dispersed placement of the high-density integrated circuit module 40 and the sensing element or coil, enabling a more flexible spatial layout and, in turn, enabling a more refined enhancement of the control capabilities of the motor base 100 and the voice coil motor incorporating it.

[0076] The rigid circuit board 41 is soldered to the metal branch 10 embedded in the insulating base 20. Specifically, at least one end of the metal branch 10 is provided with solder legs 101 spaced apart around the perimeter of the rigid circuit board 41. A plurality of solder pads 410 are provided in the central region of the rigid circuit board 41 for soldering and securing to solder joints 421 of the high-density integrated circuit 42. Conductive pads 411 are provided at intervals around the perimeter of the rigid circuit board 41. The rigid circuit board 41 forms a plurality of traces 412 electrically connecting the corresponding solder pads 410 and conductive pads 411. The conductive pads 411 are soldered to the corresponding solder legs 101, thereby achieving electrical connection with the metal branch 10. In this embodiment, the conductive pads 411 of the rigid circuit board 41 and the corresponding solder legs 101 are arranged opposite each other along the length or width of the solder legs 101 and are soldered to each other using solder paste. The circuits 412 are formed on opposite sides of the rigid circuit board 41 and are electrically connected through the vias 416. The conductive sheet 411 is located on one side of the rigid circuit board 41 and is electrically connected to the corresponding circuit 412 on the other side of the rigid circuit board 41 through the vias 416, thereby preventing the solder paste from creeping along the circuit 412 when the conductive sheet 411 and the solder foot 101 are soldered together using solder paste, which is commonly known as the solder creep phenomenon. In this embodiment, the conductive sheet 411 and the high-density integrated circuit 42 are located on the same side of the rigid circuit board 41; the conductive sheet 411 of the rigid circuit board 41 and the corresponding solder feet 101 are arranged relatively spaced apart along the length direction of the corresponding metal branch 10 and are soldered to each other by solder paste. That is, the solder feet 101 of the metal branch 10 and the corresponding conductive sheet 411 are arranged side by side, and the surfaces where the conductive sheet 411 of the rigid circuit board 41 and the solder feet 101 of the metal branch 10 are soldered to each other are located in the same plane, that is, the conductive sheet 411 and the corresponding solder feet 101 are flush with each other, which not only reduces the overall thickness of the welding point, but also makes it easier to observe the welding effect, prevents the occurrence of empty welding, and improves the yield rate. It is understood that in other embodiments, the solder leg 101 of the metal branch 10 and the corresponding conductive sheet 411 may be arranged side by side, and the surfaces where the solder leg 101 and the corresponding conductive sheet 411 are soldered to each other may form a certain step, that is, the solder leg 101 and the corresponding conductive sheet 411 are located on different planes along the thickness direction of the first sidewall 232. However, this approach will increase the thickness of the solder joint. In the present invention, the conductive sheet 411 may be a square or circular sheet structure formed on the surface of the rigid circuit board 41, or an arc-shaped structure formed within a circular or square through-hole of the rigid circuit board 41, thereby forming a conductive hole 416 together with the through-hole. In this case, the solder leg 101 of the metal branch 10 can be electrically connected to the conductive sheet 411 by inserting or pressing it into the conductive hole 416.

[0077] In this embodiment, the high-density integrated circuit 42 is secured to the rigid circuit board 41 by soldering using a first solder paste. The first solder paste is a high-temperature solder paste, such as a solder paste with a melting point greater than 221°C, for example, tin-lead solder paste Sn10Pb90 (melting point: 280-305°C); tin-antimony solder paste Sn90Sb10 (melting point: 245-255°C); tin-gold solder paste Au80Sn20 (melting point: 280°C); or tin-copper solder paste Sn-Cu3.0 (melting point: 227-320°C). The conductive sheet 411 of the rigid circuit board 41 is soldered to the solder foot 101 of the metal branch 10 using a second solder paste. The second solder paste is a medium-low temperature solder paste with a melting point lower than that of the high-temperature solder paste, such as a solder paste with a melting point of 221°C or less, for example, SAC305°C (melting point: 217-221°C) or SAC3507 (melting point: 217°C). Therefore, the first solder paste (high-temperature solder paste) and the second solder paste (low-temperature solder paste) have different materials and compositions. In specific applications, the difference in materials, compositions, and melting points can be measured and compared to determine the difference in solder paste used. Preferably, the high-density integrated circuit 42 and the rigid circuit board 41, as well as the rigid circuit board 41 and the metal branch 10, are both secured by reflow soldering.

[0078] In this embodiment, the inner side surface of the first insulating block 211 of the insulating base 20 is further recessed inward to form a mounting groove 215. The rigid circuit board 41 is received within the mounting groove 215, and at least a portion of the solder legs 101 of the metal branch 10 are embedded in a side or periphery of the mounting groove 215. A platform 2150 is further formed around the periphery of the mounting groove 215. The mounting groove 215 includes a recessed portion 2152 recessed from the platform 2150. The rigid circuit board 41 is received within the recessed portion 2152. The bottom of the recessed portion 2152 further defines an opening 2153 that communicates with the outside world. The rigid circuit board 41 communicates with the outside world through the opening 2153, thereby improving heat dissipation of the high-density integrated circuit module 40. The platform 2150 has recesses 216 corresponding to the solder legs 101 of the metal branch 10, exposing the solder legs 101. This facilitates soldering between the metal branch 10 and the rigid circuit board 41. A barrier 217 is formed between adjacent recesses 216 to prevent short circuits and overlap during soldering. In other embodiments, the mounting grooves 215 can be further filled with glue to encapsulate the dense integrated circuit module 40, providing both protection and enhanced waterproofing.

[0079] In this embodiment, the rigid circuit board 41 can be a ceramic substrate, a rigid printed circuit board (RPCB), or an integrally formed component of etched circuits and a plastic base. Rigid printed circuit boards are primarily made by stacking copper foil and resin materials. Ceramic substrates can be formed using DPC or DBC processes to create single-layer ceramic substrates with two-layer circuits, or they can be formed using HTCC or LTCC processes to create multi-layer ceramic substrates with multiple layers (two or more layers).

[0080] In this embodiment, the plurality of metal branches 10 include a plurality of first branches 11 , a plurality of second branches 12 , a plurality of third branches 13 , a plurality of fourth branches 14 and a plurality of fifth branches 15 .

[0081] Multiple first branches 11 are embedded in the first side wall 232 in a side-by-side and spaced-apart manner along the height direction of the first side wall 232. The first branches 11 include a first connecting section 112. One end of the first connecting section 112 of the multiple first branches 11 forms a solder foot 101 that is soldered to the conductive sheet 411 on the rigid circuit board 41. The other end of the first connecting section 112 of the multiple first branches 11 forms a pin 113 exposed outside the first side wall 232 for connecting to an external circuit.

[0082] The second branch 12 includes a second extension section 121 embedded in the first sidewall 232, a second connecting section 122 embedded in the bottom 231, and a second connecting section 123 embedded in the second sidewall 233. The second extension section 121, the second connecting section 122, and the second connecting section 123 are connected in sequence. The free end of the second extension section 121 is provided with a solder foot 101 for soldering to the conductive sheet 411 on the rigid circuit board 41. The second connecting section 123 forms a pin 124 exposed outside the second sidewall 233 for connecting to an external circuit.

[0083] The third branch 13 and the first branch 11 are respectively arranged at opposite ends of the rigid circuit board 41. Several third branches 13 are embedded in the first side wall 232 in a side-by-side and spaced-apart manner. The third branch 13 includes a third connecting segment 131. One end of the third connecting segment 131 of several third branches 13 forms a solder foot 101 for soldering to the conductive sheet 411 on the rigid circuit board 41. The other end of the third connecting segment 131 of at least some of the third branches 13 forms a soldering end (not labeled) for soldering to the first sensing element 31 and the first coil 32 on the first side wall 232.

[0084] The fourth branch 14 includes a fourth extension section 141 embedded in the first sidewall 232, a fourth connecting section 142 embedded in the bottom 231, and a fourth connecting section 143 embedded in the second sidewall 233. The fourth extension section 141, the fourth connecting section 142, and the fourth connecting section 143 are connected in sequence. The free ends of the fourth extension sections 141 of several fourth branches 14 are provided with solder pins 101 for soldering to the conductive sheet 411 on the rigid circuit board 41. At least some of the fourth extension sections 141 are provided with soldering ends (not labeled) for soldering to the first sensing element 31 and the first coil 32 on the first sidewall 232. At least some of the fourth connecting sections 143 are provided with soldering ends (not labeled) for soldering to the first sensing element 31 and the first coil 32 on the second sidewall 233.

[0085] Multiple fifth branches 15 are embedded in the second side wall 233 in a spaced-apart manner along the height direction of the second side wall 233. The fifth branches 15 include fifth connecting segments 151. One end of the fifth connecting segments 151 of the multiple fifth branches 15 forms a pin 152 exposed outside the second side wall 233 for connecting to an external circuit. At least some of the fifth connecting segments 151 of the fifth branches 15 have welding ends (not marked) formed on them for welding to the second coil 50 and the sensing chip 60.

[0086] The four first sensing elements 31 of this embodiment are used to sense the position of the first optical module (for example, a prism) in real time. The four first coils 32 form two pairs for driving the first optical module to rotate in two different axial directions. The high-density integrated circuit 42 identifies the position of the first optical module from different orientations based on the signals output by the four first sensing elements 31, and determines the control value, including current intensity and direction, applied to the first coil 32 based on the identified position information to achieve the purpose of controlling the current and thereby driving the first coil 32. The determined control value is used to perform feedback control on the position of the first optical module, thereby achieving the function of optical image stabilization (OIS).

[0087] The sensing chip 60 located opposite the high-density integrated circuit module 40 is used to sense the position of the second optical module (such as a lens, not shown) and provide corresponding current to the corresponding coil based on the position information, thereby driving the lens to move to achieve the zoom or focus function.

[0088] It is understood that the present application is not limited to superimposing more sensing elements and coils having the same functions as the first sensing element 31 , the first coil 32 and the capacitor element 70 to expand the control capability of the motor base 100 .

[0089] The embodiment of the present invention further provides a method for manufacturing the motor base 100, comprising the following steps:

[0090] S1, providing a plurality of metal branches 10. In this embodiment, the plurality of metal branches 10 are formed on the same material strip. In an initial state, the plurality of metal branches 10 are arranged horizontally.

[0091] S2, injection molding at least a portion of the insulating base 20 on the metal branch 10; in this embodiment, multiple insulating blocks 21 are injection molded at the metal branch 10 at one time to form a portion of the insulating base 20. Specifically, the insulating blocks 21 include a first insulating block 211, a second insulating block 212, a third insulating block 213 and a fourth insulating block 214, which are all horizontal and spaced apart.

[0092] S3, install at least one first electronic component 30 on the insulating base 20 and electrically connect it to the metal branch 10; in this embodiment, the first electronic component 30 and the second electronic component are installed on the second insulating block 212, the third insulating block 213 and the fourth insulating block 214 corresponding to the insulating base 20 and directly welded to the corresponding metal branch 10.

[0093] S4. Provide a rigid circuit board 41. The rigid circuit board 41 is provided with a plurality of conductive sheets 411 arranged at intervals. A high-density integrated circuit 42 is soldered to the rigid circuit board 41 to form a high-density integrated circuit module 40. The conductive sheet 411 provided on the rigid circuit board 41 is electrically connected to the metal branch 10 embedded in the insulating base 20, so that the high-density integrated circuit 42 is electrically connected to the first sensing element 31 and the first coil 32 of the first electronic component 30 through the metal branch 10. Specifically, in this embodiment, the high-density integrated circuit module 40 is horizontally mounted on the first insulating block 211, and the conductive sheet 411 of the rigid circuit board 41 is soldered to the solder foot 101 of the metal branch 10 embedded in the first insulating block 211.

[0094] S5, bend the metal branch 10 so that the insulating block 21, the high-density integrated circuit module 40, the first electronic component 30, and the second electronic component are all transformed from a horizontal position to a vertical position or positioned in a vertical plane. Specifically, in this embodiment, the metal branch 10 is bent so that the first insulating block 211 and the second insulating block 212 are positioned in the vertical plane where the first sidewall 232 is located, and the third insulating block 213 and the fourth insulating block 214 are positioned in the vertical plane where the second sidewall 233 is located.

[0095] S6 , performing secondary injection molding on the metal branch 10 and the insulating block 21 to obtain the insulating seat 23 , thereby forming the insulating base 20 .

[0096] The motor base 100 of this embodiment can be applied to a periscope voice coil motor, on which a high-density integrated circuit 42 is integrated. The high-density integrated circuit 42 is welded to a rigid circuit board 41 to form a high-density integrated circuit module 40. The rigid circuit board 41 is welded to a metal branch 10 embedded in the insulating base 20, so that the high-density integrated circuit 42 is electrically connected to the first sensing element 31 and the first coil 32 at the same time through the metal branch 10. Compared with the split control form of the prior art that uses multiple integrated circuits to control multiple Hall sensors respectively, the above-mentioned motor base 100 uses a high-density integrated circuit 42 to simultaneously control multiple or more electronic components, that is, integrated control is used instead of the split control of the prior art, so that the high-density integrated circuit 42 can achieve richer control functions to meet the needs of the periscope voice coil motor.

[0097] In addition, the high-density integrated circuit 42 is independently set on the rigid circuit board 41, which is more suitable for integrating complex circuits. It will not be limited by the circuit layout space of the metal branch 10 of the insulating base 20 and cannot realize the setting of complex control circuits. At the same time, it can also more reasonably utilize the circuit layout space of the motor base 100, so that electronic components such as coils and high-density integrated circuits 42 can be installed on the motor base 100 in a more reasonable spatial layout form, allowing the high-density integrated circuit 42 to utilize a larger space to achieve richer control functions.

[0098] Furthermore, in this embodiment, the high-density integrated circuit module 40 is welded and assembled with the metal branch 10 as an independent unit, which makes it easier to perform subsequent maintenance and component replacement.

[0099] Some prior art voice coil motor bases 100 use flexible printed circuit boards (FPCBs) to integrate coils, sensors, and other components. However, FPCBs not only have higher manufacturing costs but are also prone to deformation during assembly, making automated operation and assembly positioning inconvenient and resulting in poor reliability. The motor base 100 of this embodiment uses a rigid circuit board 41, which has a high structural strength and is less prone to deformation, making it more convenient for automated assembly and positioning. Furthermore, in prior art, to achieve miniaturization, the motor base 100 is typically smaller, resulting in thinner first and second side walls 232, 233. In this case, the metal branch 10 embedded in the first and second side walls 232, 233 not only ensures electrical continuity but also increases the strength of the first and second side walls 232, 233. When a circuit board needs to be installed, the motor base 100 will no longer have a metal branch 10 embedded in the circuit board, and further structures such as an installation groove 215 and an opening 2153 for installing the circuit board need to be provided, which greatly reduces the structural strength of the motor base 100. Therefore, in this embodiment, a rigid circuit board 41 with greater structural strength is used to increase the structural strength of the motor base 100 at the circuit board.

[0100] Furthermore, the rigid circuit board 41 preferably utilizes a ceramic substrate. Ceramic substrates offer excellent electrical insulation and high thermal conductivity, further enhancing the heat dissipation of the high-density integrated circuit module 40. Furthermore, the high-density integrated circuit 42 typically utilizes semiconductor materials such as SiC (silicon carbide) or GaN (gallium nitride), which have thermal expansion coefficients closer to those of the ceramic substrate. Consequently, their thermal expansion coefficients are similar, resulting in a more stable matching performance. Furthermore, when a ceramic substrate is preferred, the pads 410, conductive pads 411, and traces 412 thereon are preferably formed using a DPC process, whereby the pads 410, conductive pads 411, and traces 412 are electroplated onto the surface of the ceramic substrate. The line width of the circuit formed by stamping terminals is generally not less than 100 microns, and the line width of the circuit formed by rigid printed circuit boards (RPCBs) is generally not less than 70 microns. If the line width is reduced below 70 microns, the yield rate will be greatly reduced, and the cost will also be greatly increased. If the line width of the circuit using a ceramic substrate is greater than or equal to 20 microns and less than or equal to 70 microns, the minimum width can be 20 microns while ensuring the yield rate and cost. Therefore, the use of ceramic substrates can greatly improve the arrangement density and flexibility of the circuit. The material of the ceramic substrate can be selected from aluminum oxide or silicon nitride. Aluminum oxide has higher thermal conductivity, while silicon nitride has higher structural strength.

[0101] In this embodiment, the solder legs 101 of several metal branches 10 are arranged around the periphery of the rigid circuit board 41, reducing the extension path. This not only simplifies the structure of the metal branches 10 and reduces manufacturing costs, but also facilitates welding the conductive sheet 411 of the rigid circuit board 41 and the solder legs 101 of the metal branches 10, reducing manufacturing difficulty.

[0102] In this embodiment, the insulating base 20 is provided with a mounting groove 215 for accommodating the rigid circuit board 41, further improving the reliability of the installation of the rigid circuit board 41. Furthermore, a platform 2150 is formed around the periphery of the mounting groove 215. The mounting groove 215 includes a recessed portion 2152 recessed from the platform 2150. The rigid circuit board 41 is accommodated within the recessed portion 2152, which not only better positions the rigid circuit board 41 but also provides more space for the high-density integrated circuit 42. This allows the high-density integrated circuit module 40 to be fully accommodated within the mounting groove 215, further reducing the thickness of the motor base 100 and saving space, in line with the trend of miniaturization. The platform 2150 is provided with recesses 216 corresponding to the solder legs 101 of the metal branch 10, exposing the solder legs 101. This facilitates soldering between the metal branch 10 and the rigid circuit board 41, and a barrier 217 is formed between adjacent recesses 216 to prevent short circuits or overlap during soldering.

[0103] In this embodiment, the high-density integrated circuit 42 and the rigid circuit board 41 are fixed by welding using a first solder paste, namely a high-temperature solder paste, and the rigid circuit board 41 and the metal branch 10 are fixed by welding using a second solder paste, namely a medium-low temperature solder paste. The melting point of the high-temperature solder paste is greater than the melting point of the medium-low temperature solder paste, which can prevent the high-density integrated circuit 42 and the rigid circuit board 41 from melting and disconnecting when the high-density integrated circuit module 40 passes through the circuit board reflow furnace.

[0104] Referring to Figures 12 to 15 , a second embodiment of the present invention provides a motor base 200 having a structure substantially similar to that of the motor base 100 of the first embodiment, the difference primarily being the method of soldering the solder legs 101 of the metal branch 10 to the rigid circuit board 41. In this embodiment, the solder legs 101 of the metal branch 10 are located on the side of the rigid circuit board 41 facing away from the conductive sheet 411. The rigid circuit board 41 is provided with a via 416 through which the solder legs 101 of the metal branch 10 are electrically connected to the corresponding conductive sheet 411. In other words, in this embodiment, the solder legs 101 of the metal branch 10 are soldered to the corresponding conductive sheet 411 using a through-hole connection technique, which prevents solder creep during soldering of the conductive sheet 411 to the metal branch 10, thereby improving soldering quality.

[0105] Referring to Figures 16 and 17 , a third embodiment of the present invention provides a motor base. Its structure is substantially similar to that of the motor base 100 of the first embodiment, differing primarily in the method for soldering the solder legs 101 of the metal branch 10 to the rigid circuit board 41. In this embodiment, the conductive sheet 411 of the rigid circuit board 41 and the corresponding solder legs 101 are stacked and soldered together along the thickness of the solder legs 101. However, this method increases the thickness of the solder joints and hinders the ability to detect dry solder joints.

[0106] It is understood that the rigid circuit board 41 is not limited to being placed on the insulating block 21 that is molded by a single injection molding. It can also be placed on the insulating base 23 that is molded by a secondary injection molding and welded to the metal branch 10 embedded in the insulating base 23. The rigid circuit board 41 can be placed not only on the side wall of the insulating base 23, but also on the bottom 231 of the insulating base 23. In this case, a mounting groove 215 can be formed inwardly on the inner surface of the insulating base 23, and the rigid circuit board 41 can be accommodated in the mounting groove 215. The structure of the mounting groove 215 can be the same as that of the first embodiment. In this embodiment, the manufacturing method of the motor base 100 may include the following steps:

[0107] S1, forming a plurality of independent metal branches 10 on the same material strip. In an initial state, the plurality of metal branches 10 are arranged horizontally;

[0108] S2, injection molding the insulating block 21 at the metal branch 10;

[0109] S3, secondary injection molding is performed on the metal branch 10 and the insulating block 21 to obtain the insulating base 23, thereby forming the insulating base 20, and then the rigid circuit board 41 of the high-density integrated circuit module 40 is horizontally installed on the bottom 231 of the insulating base 23, and welded to the metal branch 10 embedded in the insulating base 23.

[0110] In this embodiment, the rigid circuit board 41 is mounted on the insulating base 23 obtained by secondary injection molding, and the rigid circuit board 41 is horizontally mounted to the bottom 231 of the insulating base 23 to facilitate welding.

[0111] In the above embodiments, the insulating block 21 or the insulating base 23 is first formed by injection molding, and then the rigid circuit board 41 is mounted on the insulating block 21 or the insulating base 23. It is understood that in other embodiments, the rigid circuit board 41 may be first soldered to the metal branch 10, and then the insulating block 21 or the insulating base 23 may be formed by injection molding on the rigid circuit board 41 and the metal branch 10. In this case, the manufacturing method of the motor base 100 may include the following steps:

[0112] S1, forming a plurality of independent metal branches 10 on the same material strip. In an initial state, the plurality of metal branches 10 are arranged horizontally;

[0113] S2, soldering the rigid circuit board 41 of the high-density integrated circuit module 40 to the metal branch 10, and performing a primary injection molding of the insulating block 21 on the metal branch 10 and the rigid circuit board 41, so that the periphery of the rigid circuit board 41 is embedded in the insulating block 21, as shown in FIG16 . Then, performing a secondary injection molding of the insulating base 23 on the metal branch 10 and the insulating block 21, thereby forming the insulating base 20;

[0114] Alternatively, the rigid circuit board 41 of the high-density integrated circuit module 40 is soldered to the metal branch 10, the insulating block 21 is injection-molded on the metal branch 10, and the insulating base 23 is formed by injection molding on the metal branch 10, the insulating block 21, and the rigid circuit board 41. This forms the insulating base 20, so that the periphery of the rigid circuit board 41 is embedded in the insulating base 23.

[0115] Alternatively, the rigid circuit board 41 of the high-density integrated circuit module 40 is welded to the metal branch 10, and the insulating base 23 is injection molded on the metal branch 10 and the rigid circuit board 41 at one time, so that the periphery of the rigid circuit board 41 is embedded in the insulating base 23, thereby forming the insulating base 20. That is, the insulating base 23 can also be obtained by one-time injection molding.

[0116] In this embodiment, the high-density integrated circuit module 40 is first welded to the metal branch 10, and then the rigid circuit board 41 is embedded in the insulating base 23 or the insulating block 21 through injection molding technology during the molding process of the motor base 100, which can further omit the process or increase the reliability of the connection; and because the high-density integrated circuit module 40 is first welded to the metal branch 10 in this embodiment, the high-density integrated circuit module 40 can be conveniently set on the bottom 231 or side wall of the insulating base 23 in this embodiment, and the position of the high-density integrated circuit module 40 on the motor base 100 can be more flexibly arranged.

[0117] The present invention further provides a voice coil motor, comprising the motor base 100, 200, and a first optical module (not shown) located within and cooperating with the motor base 100, 200. The first optical module is located within the first electronic assembly 30 and includes a magnetic element (not shown) cooperating with the first electronic assembly 30. The magnetic element may be a magnet or a sensing magnet. The first optical module may include an optical element such as a prism.

[0118] The present invention further provides another voice coil motor, comprising the motor bases 100 and 200 described above, and a second optical module cooperating with the motor bases 100 and 200. The second optical module includes a second magnetic element located at and cooperating with a second electronic component. The magnetic element may be a magnet or a sensing magnet. The second optical module may include an optical element such as a lens.

[0119] It can be understood that the motor bases 100 and 200 are not limited to being used in periscope voice coil motors, but can also be used in other types of voice coil motors.

[0120] It is understood that the first electronic component 30 is not limited to including the first coil 32 and the first sensing element 31 of this embodiment, and may also include other types of electronic devices.

[0121] It can be understood that the number of the first coils 32 and the first sensing elements 31 is not limited to this embodiment, and they can also be set to other numbers as needed.

[0122] It is understood that the first electronic component 30 is not limited to being disposed on the insulating block 21 formed by one-step injection molding, but may also be disposed on the insulating base 23 at a position away from the rigid circuit board 41 .

[0123] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0124] The above-described embodiments merely illustrate the implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A motor base, It is characterized in that It includes a plurality of metal branches, an insulating base injection-molded on the plurality of metal branches, at least one first electronic component mounted on the insulating base and electrically connected to the metal branches, and a high-density integrated circuit module. The high-density integrated circuit module includes a rigid circuit board and a high-density integrated circuit soldered to the rigid circuit board. The rigid circuit board is provided with a plurality of conductive sheets arranged at intervals. The conductive sheets are electrically connected to the metal branches embedded in the insulating base, so that the high-density integrated circuit is electrically connected to the first electronic component through the metal branches.

2. The motor base according to claim 1, It is characterized in that The high-density integrated circuit has at least eight solder points, the rigid circuit board has at least eight solder pads that are welded and fixed corresponding to the at least eight solder points, the rigid circuit board forms a plurality of circuits that electrically connect the corresponding solder pads and the conductive sheet, and the conductive sheet of the rigid circuit board is welded and fixed to the metal branch in the insulating base.

3. The motor base according to claim 1, It is characterized in that The first electronic component includes a first sensing element and a first coil with a position sensing function. The first sensing element and the first coil are directly welded to the corresponding metal branch. The high-density integrated circuit module is electrically connected to the first sensing element and the first coil through the metal branch, and then outputs a control signal to control the current to drive the first coil after realizing the sensing function according to the first sensing element.

4. The motor base according to claim 1, It is characterized in that At least one end of a portion of the metal branches is provided with solder feet arranged at intervals around the periphery of the rigid circuit board, and the conductive sheet is arranged on the periphery of the rigid circuit board and is fixed by welding to the corresponding solder feet.

5. The motor base according to claim 4, It is characterized in that The insulating base is inwardly recessed to form a mounting groove, the high-density integrated circuit module is accommodated in the mounting groove, and at least part of the soldering feet of the metal branch are embedded in one side or the periphery of the mounting groove.

6. The motor base according to claim 5, It is characterized in that A platform is formed at the periphery of the installation groove, and the installation groove includes a recessed portion recessed from the platform, and the rigid circuit board is accommodated in the recessed portion.

7. The motor base according to claim 6, It is characterized in that The platform is provided with a pit corresponding to the welding foot of the metal branch, and the welding foot is embedded in the corresponding pit to be exposed outside the insulating base, and a partition block is formed between two adjacent pits.

8. The motor base according to claim 5, It is characterized in that The conductive sheet of the rigid circuit board and the corresponding soldering foot are arranged opposite to each other along the length or width direction of the soldering foot and are soldered and connected to each other through solder paste.

9. The motor base according to claim 8, It is characterized in that The surfaces of the rigid circuit board where the conductive sheet and the soldering feet are soldered to each other are located in the same plane.

10. The motor base according to claim 5, It is characterized in that The conductive sheet of the rigid circuit board and the corresponding soldering feet are stacked along the thickness direction of the soldering feet and are connected to each other by soldering.

11. The motor base according to claim 2, It is characterized in that The rigid circuit board is provided with a via hole, the circuit is formed on two opposite sides of the rigid circuit board and is electrically connected through the via hole, and the conductive sheet is located on one side of the rigid circuit board and is electrically connected to the corresponding circuit on the other side of the rigid circuit board through the via hole.

12. The motor base according to claim 1, It is characterized in that The rigid circuit board is a ceramic substrate or a rigid printed circuit board or an integrally formed part of an etched circuit and a plastic base.

13. The motor base according to claim 12, It is characterized in that When the rigid circuit board is a ceramic substrate, the surfaces of the ceramic substrate on opposite sides are plated to form the conductive sheet and a circuit electrically connected to the conductive sheet, and the line width of the circuit is greater than or equal to 20 microns and less than or equal to 70 microns.

14. The motor base according to claim 1, It is characterized in that The high-density integrated circuit and the rigid circuit board are fixed by welding with a first solder paste, and the conductive sheet of the rigid circuit board and the metal branch are fixed by welding with a second solder paste. The melting point of the first solder paste is greater than the melting point of the second solder paste. The high-density integrated circuit and the rigid circuit board, as well as the rigid circuit board and the metal branch, are fixed by welding with reflow soldering.

15. The motor base according to claim 1, It is characterized in that The rigid circuit board is also electrically connected to a plurality of capacitor elements.

16. The motor base according to claim 1, It is characterized in that The insulating base includes at least two separately arranged insulating blocks which are once injection molded on the metal branch and an insulating seat body which is twice injection molded on the insulating blocks and the metal branch. The high-density integrated circuit module and the first electronic component are respectively arranged on at least two of the insulating blocks.

17. The motor base according to claim 16, It is characterized in that The insulating base includes a horizontally arranged bottom and a first side wall and a second side wall that are vertically and oppositely arranged. The insulating block includes a first insulating block and a second insulating block that are embedded in the first side wall at intervals, and a third insulating block that is embedded in the second side wall and opposite to the second insulating block. The high-density integrated circuit module is fixed to the first insulating block, and the second insulating block and the third insulating block are both provided with the first electronic component.

18. The motor base according to claim 17, It is characterized in that The insulating block also includes a fourth insulating block embedded in the second side wall and spaced apart from the third insulating block, a second electronic component is mounted on the fourth insulating block, at least part of the metal branch is provided with a welding end exposed to the fourth insulating block, the welding end is electrically connected to the second electronic component, the second electronic component includes a second coil and a sensing chip arranged at the center of the second coil for controlling the operation of the second coil, and the high-density integrated circuit module is arranged opposite to the second electronic component.

19. A voice coil motor, It is characterized in that It comprises the motor base as described in any one of claims 1-18 and a first optical module matched with the motor base and located at the first electronic component, wherein the first optical module is fixed with an optical element and comprises a first magnetic element matched with the first electronic component.

20. A voice coil motor, It is characterized in that The invention comprises the motor base as claimed in claim 18 and a second optical module matched with the motor base and located at the second electronic component, wherein the second optical module comprises a second magnetic element matched with the second electronic component.

21. A method for manufacturing the motor base according to claim 1, It is characterized in that The following steps are involved: S1, providing a plurality of metal branches; S2, injection molding at least a portion of the insulating base on the metal branch; S3, installing at least one of the first electronic components on the insulating base and electrically connecting the metal branch; S4, providing a rigid circuit board, wherein the rigid circuit board is provided with a plurality of the conductive sheets arranged at intervals, soldering the high-density integrated circuit to the rigid circuit board to form a high-density integrated circuit module, and electrically connecting the conductive sheets arranged on the rigid circuit board to the metal branches embedded in the insulating base, so that the high-density integrated circuit is electrically connected to the first electronic component through the metal branches.

22. The method for manufacturing the motor base according to claim 21, It is characterized in that In S1, in an initial state, the plurality of metal branches are arranged horizontally; In S2, three first insulating blocks, second insulating blocks and third insulating blocks which are separately arranged are injection-molded at the metal branch at one time to form a part of the insulating base, wherein the first insulating blocks, the second insulating blocks and the third insulating blocks are all arranged horizontally; In S3, the first electronic component is horizontally mounted on the second insulating block and the third insulating block and directly welded to the corresponding metal branch; In S4, the high-density integrated circuit module is horizontally mounted on the first insulating block, and the hard The conductive sheet of the circuit board is welded to the corresponding metal branch.

23. The method for manufacturing the motor base according to claim 22, It is characterized in that The following steps are also included: S5, bending the metal branch so that the first insulating block, the high-density integrated circuit module installed on the first insulating block, the second insulating block, the third insulating block, and the first electronic component installed on the second insulating block and the third insulating block are all transformed from a horizontal position to a vertical position; S6, performing secondary injection molding on the metal branch, the first insulating block, the second insulating block and the third insulating block to obtain an insulating seat body, thereby forming the insulating base.

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