Electronic device including support structure of printed circuit board

Abstract

According to one embodiment of the present invention, an electronic device comprises: a first printed circuit board; and a second printed circuit board facing the first printed circuit board and disposed on the first printed circuit board. The electronic device includes a first support member disposed on a first surface of the first printed circuit board. The electronic device includes a second support member disposed on a second surface of the second printed circuit board, facing the first printed circuit board, and configured to be in contact with a first support member by means of an external force applied to the electronic device. The electronic device includes an interposer between the first printed circuit board and the second printed circuit board that surrounds a region between the first surface and the second surface.

Description

Electronic device including a support structure for a printed circuit board

[0001] The present disclosure relates to an electronic device including a structure supporting a printed circuit board.

[0002] Small electronic devices, such as smartphones and tablet personal computers (PCs), may include a printed circuit board (PCB) on which electronic components are mounted to implement various functions of the electronic device. To reduce damage to the electronic components due to external impact, the electronic device may include a support structure that supports the printed circuit board.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable to the present disclosure.

[0004] In one embodiment, an electronic device may include a first printed circuit board. The electronic device may include a second printed circuit board disposed on the first printed circuit board. The electronic device may include a first support member disposed on a first surface of the first printed circuit board. The electronic device may include a second support member disposed on a second surface of the second printed circuit board. The second support member may face the first printed circuit board. The second support member may be spaced apart from the first support member. The second support member may be configured to contact the first support member based on an external force applied to the electronic device. The electronic device may include an interposer between the first printed circuit board and the second printed circuit board, the interposer surrounding an area between the first surface and the second surface.

[0005] In one embodiment, an electronic device may include a first printed circuit board. The electronic device may include a second printed circuit board facing the first printed circuit board and disposed on the first printed circuit board. The electronic device may include a first support member disposed on a first side of the first printed circuit board facing the second printed circuit board. The electronic device may include a second support member disposed on a second side of the second printed circuit board facing the first printed circuit board, the second support member being spaced apart from the first support member and facing the first support member so as to be contactable with the first support member. The electronic device may include a first set of electronic components disposed on the first side and a second set of electronic components disposed on the second side. The electronic device may include an interposer between the first printed circuit board and the second printed circuit board, the interposer surrounding a space between the first side and the second side. The sum of the length of the first support member extending from the first side toward the second side and the length of the second support member extending from the second side toward the first side may be greater than the sum of the length of one electronic component of the first set of electronic components extending from the first side toward the second side and the length of another electronic component of the second set of electronic components facing at least a portion of the one electronic component extending from the second side toward the first side.

[0006] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0007] FIG. 2 is a diagram illustrating an electronic device according to one embodiment.

[0008] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0009] Figure 4a is a partially exploded perspective view of an exemplary electronic device.

[0010] Figure 4b is a partial cross-sectional view of an exemplary electronic device.

[0011] FIG. 5A illustrates a portion of an exemplary electronic device in a first state.

[0012] FIG. 5b illustrates a portion of an exemplary electronic device in a second state.

[0013] Figures 6a, 6b, and 6c are partial cross-sectional views of an exemplary electronic device.

[0014] Figure 7 is a partial cross-sectional view of an exemplary electronic device.

[0015] FIG. 8A illustrates a portion of an exemplary electronic device having a plurality of support members arranged thereon.

[0016] Figure 8b is a circuit diagram for detecting an abnormal state of an electronic device.

[0017] FIG. 9A and FIG. 9B are flow charts illustrating the operation of a processor of an exemplary electronic device.

[0018] Figure 10 is a flowchart illustrating the operation of a processor of an exemplary electronic device.

[0019] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0020] FIG. 1 is a block diagram of an electronic device within a network environment, according to one embodiment.

[0021] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). According to one embodiment, at least one of these components (e.g., the connection terminal (178)) may be omitted, or one or more other components may be added to the electronic device (101). According to one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)). In some embodiments, the processor (120) may correspond to at least one processor (e.g., two or more processors).

[0022] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0023] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where artificial intelligence is performed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0024] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0025] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0026] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0027] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0028] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0029] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0030] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0031] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0032] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0033] A haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0034] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0035] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).

[0036] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0037] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0038] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0039] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas by, for example, the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. In one embodiment, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0040] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to one surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to another surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0041] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0042] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. According to one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0043] FIG. 2 is a diagram illustrating an electronic device according to one embodiment.

[0044] Referring to FIG. 2, an electronic device (101) according to one embodiment may include a housing (210) forming an exterior of the electronic device (101). For example, the housing (210) may include a front surface (200A), a rear surface (200B), and a side surface (200C) surrounding a space between the front surface (200A) and the rear surface (200B). According to one embodiment, the housing (210) may also refer to a structure forming at least a portion of the front surface (200A), the rear surface (200B), and / or the side surface (200C).

[0045] An electronic device (101) according to one embodiment may include a substantially transparent front plate (202). According to one embodiment, the front plate (202) may form at least a portion of the front surface (200A). According to one embodiment, the front plate (202) may include, for example, a glass plate including various coating layers, or a polymer plate, but embodiments of the present disclosure are not limited thereto.

[0046] An electronic device (101) according to one embodiment may include a substantially opaque back plate (211). According to one embodiment, the back plate (211) may form at least a portion of the back surface (200B). According to one embodiment, the back plate (211) may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.

[0047] An electronic device (101) according to one embodiment may include a side bezel structure (or side member) (218). According to one embodiment, the side bezel structure (218) may be combined with a front plate (202) and / or a rear plate (211) to form at least a portion of a side surface (200C) of the electronic device (101). For example, the side bezel structure (218) may form the entire side surface (200C) of the electronic device (101). In another example, the side bezel structure (218) may form the side surface (200C) of the electronic device (101) together with the front plate (202) and / or the rear plate (211).

[0048] In one embodiment, when the side surface (200C) of the electronic device (101) is partially formed by the front plate (202) and / or the rear plate (211), the front plate (202) and / or the rear plate (211) may include a region that extends seamlessly from its edge toward the rear plate (211) and / or the front plate (202). The extending region of the front plate (202) and / or the rear plate (211) may be located at both ends of a long edge of the electronic device (101), for example, but is not limited to the above-described example.

[0049] In one embodiment, the side bezel structure (218) may include a metal and / or a polymer. In one embodiment, the back plate (211) and the side bezel structure (218) may be formed integrally and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the back plate (211) and the side bezel structure (218) may be formed as separate components and / or may include different materials.

[0050] According to one embodiment, the electronic device (101) may include at least one of a display (201) (e.g., the display module (160) of FIG. 1), an audio module (203, 204, 207) (e.g., the audio module (170) of FIG. 1), a sensor module (e.g., the sensor module (176) of FIG. 1), a camera module (205, 212) (e.g., the camera module (180) of FIG. 1), a key input device (217) (e.g., the input module (150) of FIG. 1), a light-emitting element, and / or a connector hole (208). According to one embodiment, the electronic device (101) may omit at least one of the above components (e.g., the key input device (217) or the light-emitting element) or may additionally include other components.

[0051] In one embodiment, the display (201) may be visually exposed through a substantial portion of the front plate (202). For example, at least a portion of the display (201) may be visible through the front plate (202) forming the front surface (200A). In one embodiment, the display (201) may be disposed on the back surface of the front plate (202).

[0052] According to one embodiment, the outer shape of the display (201) may be formed to be substantially the same as the outer shape of the front plate (202) adjacent to the display (201). According to one embodiment, in order to expand the area where the display (201) is visually exposed, the gap between the outer shape of the display (201) and the outer shape of the front plate (202) may be formed to be substantially the same.

[0053] According to one embodiment, the display (201) (or the front surface (200A) of the electronic device (101)) may include a screen display area (201A). According to one embodiment, the display (201) may provide visual information to a user through the screen display area (201A). In the illustrated embodiment, when the front surface (200A) is viewed directly, the screen display area (201A) is depicted as being positioned on the inside of the front surface (200A) and spaced apart from the outer edge of the front surface (200A), but the embodiments of the present disclosure are not limited thereto. In another embodiment, when the front surface (200A) is viewed directly, at least a portion of an edge of the screen display area (201A) may substantially coincide with an edge of the front surface (200A) (or the front plate (202)).

[0054] In one embodiment, the screen display area (201A) may include a sensing area (201B) configured to acquire biometric information of the user. Here, the meaning of "the screen display area (201A) includes the sensing area (201B)" may be understood to mean that at least a portion of the sensing area (201B) may overlap the screen display area (201A). For example, the sensing area (201B) may be an area capable of displaying visual information by the display (201) like other areas of the screen display area (201A) and additionally capable of acquiring biometric information of the user (e.g., a fingerprint). In one embodiment, the sensing area (201B) may also be formed in the key input device (217).

[0055] In one embodiment, the display (201) may include an area where a first camera (205) is positioned. In one embodiment, an opening is formed in the area of ​​the display (201), and the first camera (205) (e.g., a punch hole camera) may be at least partially positioned within the opening so as to face the front (200A). In this case, the screen display area (201A) may surround at least a portion of an edge of the opening. In one embodiment, the first camera (205) (e.g., an under display camera (UDC)) may be positioned below the display (201) so as to overlap the area of ​​the display (201). In this case, the display (201) may provide visual information to the user through the area, and additionally, the first camera (205) may acquire an image corresponding to a direction facing the front (200A) through the area of ​​the display (201).

[0056] According to one embodiment, the display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer capable of detecting a magnetic field-type stylus pen.

[0057] According to one embodiment, the audio module (203, 204, 207) may include a microphone hole (203, 204) and a speaker hole (207).

[0058] According to one embodiment, the microphone holes (203, 204) may include a first microphone hole (203) formed in a portion of the side (200C) and a second microphone hole (204) formed in a portion of the rear (200B). A microphone for acquiring external sound may be placed inside the microphone holes (203, 204). The microphone may include multiple microphones to detect the direction of the sound.

[0059] According to one embodiment, the second microphone hole (204) formed in a portion of the rear surface (200B) may be positioned adjacent to the camera module (205, 212). For example, the second microphone hole (204) may acquire sound according to the operation of the camera module (205, 212). However, the embodiments of the present disclosure are not limited thereto.

[0060] According to one embodiment, the speaker hole (207) may include an external speaker hole (207) and a call receiver hole. The external speaker hole (207) may be formed in a part of the side surface (200C) of the electronic device (101). According to one embodiment, the external speaker hole (207) may be implemented as a single hole with the microphone hole (203). According to one embodiment, the call receiver hole may be formed in another part of the side surface (200C). For example, the call receiver hole may be formed on the opposite side of the external speaker hole (207) in the side surface (200C). For example, referring to the illustration in FIG. 2, the external speaker hole (207) may be formed in the side surface (200C) corresponding to the lower portion of the electronic device (101), and the call receiver hole may be formed in the side surface (200C) corresponding to the upper portion of the electronic device (101). However, the embodiments of the present disclosure are not limited thereto, and according to one embodiment, the call receiver hole may be formed at a location other than the side (200C). For example, the call receiver hole may be formed by a spaced space between the front plate (202) (or display (201)) and the side bezel structure (218).

[0061] According to one embodiment, the electronic device (101) may include at least one speaker configured to output sound to the outside of the housing through an external speaker hole (207) and / or a call receiver hole. For example, the speaker may include a piezo speaker configured to output audio by vibrating a diaphragm within the speaker using a piezoelectric element, but is not limited thereto.

[0062] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state. For example, the sensor module may include at least one of a proximity sensor, a heart rate monitor (HRM) sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0063] According to one embodiment, the camera module (205, 212) may include a first camera (205) positioned to face the front (200A) of the electronic device (101), and a second camera (212) positioned to face the rear (200B).

[0064] In one embodiment, the second camera (212) may include multiple cameras (e.g., dual cameras, triple cameras, or quad cameras). However, the second camera (212) is not necessarily limited to including multiple cameras and may include a single camera.

[0065] According to one embodiment, the first camera (205) and the second camera (212) may include one or more lenses, image sensors, and / or image signal processors.

[0066] In one embodiment, the electronic device (101) may include a flash (213) positioned to face the rear (200B). According to one embodiment, the flash (213) may include, for example, a light-emitting diode or a xenon lamp. According to one embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and image sensors may be positioned on one side of the electronic device (101).

[0067] According to one embodiment, the key input device (217) may be positioned on a side (200C) of the electronic device (101). According to one embodiment, the electronic device (101) may not include some or all of the key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (201).

[0068] According to one embodiment, a connector hole (208) may be formed on a side surface (200C) of the electronic device (101) so that a connector of an external device can be accommodated. A connection terminal (e.g., a connection terminal (178) of FIG. 1) electrically connected to the connector of the external device may be arranged within the connector hole (208). The electronic device (101) according to one embodiment may include an interface module (e.g., an interface (177) of FIG. 1) for processing an electrical signal transmitted and received through the connection terminal.

[0069] According to one embodiment, the electronic device (101) may include a light-emitting element. For example, the light-emitting element may be disposed on the front surface (200A) of the housing. The light-emitting element may provide status information of the electronic device (101) in the form of light. According to one embodiment, the light-emitting element may provide a light source that is linked to the operation of the first camera (205). For example, the light-emitting element may include an LED, an IR LED, and / or a xenon lamp.

[0070] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment.

[0071] In the following, redundant descriptions of configurations having the same reference numerals as the configurations described above are omitted.

[0072] Referring to FIG. 3, an electronic device (101) according to one embodiment may include a display (201), a front plate (202), a rear plate (211), a frame structure (240), a first printed circuit board (250), a second printed circuit board (252), a cover plate (260), and a battery (270) (e.g., battery (189) of FIG. 1).

[0073] According to one embodiment, the frame structure (240) may include an inner wall (241) forming an exterior of the electronic device (101) (e.g., side surface (200C) of FIG. 2) and a support structure (243) extending inwardly from the inner wall (241). According to one embodiment, the frame structure (240) may be disposed between the display (201) and the back plate (211). According to one embodiment, the inner wall (241) of the frame structure (240) may surround a space between the back plate (211) and the front plate (202) (and / or the display (201)), and the support structure (243) of the frame structure (240) may extend from the inner wall (241) within the space.

[0074] In one embodiment, the frame structure (240) may support or accommodate other components included in the electronic device (101). For example, a display (201) may be disposed on one side of the frame structure (240) facing one direction (e.g., +z direction), and the display (201) may be supported by a support structure (243) of the frame structure (240). For example, a first printed circuit board (250), a second printed circuit board (252), a battery (270), and a second camera (212) may be disposed on the other side of the frame structure (240) facing the opposite direction (e.g., -z direction). The first printed circuit board (250), the second printed circuit board (252), the battery (270), and the second camera (212) may be respectively mounted in recesses defined by an inner wall (241) of the frame structure (240) and / or the support structure (243).

[0075] According to one embodiment, the first printed circuit board (250), the second printed circuit board (252), and the battery (270) may be respectively coupled to the frame structure (240). For example, the first printed circuit board (250) and the second printed circuit board (252) may be fixedly disposed to the frame structure (240) through a coupling member such as a screw. For example, the battery (270) may be fixedly disposed to the frame structure (240) through an adhesive member (e.g., double-sided tape). However, the present invention is not limited to the above-described examples.

[0076] According to one embodiment, the cover plate (260) may be disposed between the first printed circuit board (250) and the back plate (211). According to one embodiment, the cover plate (260) may be disposed on the first printed circuit board (250). For example, the cover plate (260) may be disposed on a surface of the first printed circuit board (250) facing the -z direction.

[0077] According to one embodiment, the cover plate (260) may at least partially overlap the first printed circuit board (250) with respect to the z-axis. According to one embodiment, the cover plate (260) may cover at least a portion of the first printed circuit board (250). Through this, the cover plate (260) may protect the first printed circuit board (250) from physical impact or prevent detachment of a connector coupled to the first printed circuit board (250).

[0078] According to one embodiment, the cover plate (260) may be fixedly positioned on the first printed circuit board (250) via a joining member (e.g., a screw), or may be joined to the frame structure (240) together with the first printed circuit board (250) via the joining member.

[0079] According to one embodiment, the display (201) may be disposed between a frame structure (240) and a front plate (202). For example, the front plate (202) may be disposed on one side (e.g., in the +z direction) of the display (201), and the frame structure (240) may be disposed on the other side (e.g., in the -z direction).

[0080] According to one embodiment, the front plate (202) can be coupled with the display (201). For example, the front plate (202) and the display (201) can be adhered to each other through an optical adhesive member (e.g., optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0081] According to one embodiment, the front plate (202) may be coupled with a frame structure (240). For example, the front plate (202) may include an outer portion extending outside the display (201) when viewed in the z-axis direction, and may be adhered to the frame structure (240) through an adhesive member (e.g., double-sided tape) disposed between the outer portion of the front plate (202) and the frame structure (240) (e.g., inner wall (241)). However, the present invention is not limited to the above-described example.

[0082] According to one embodiment, the first printed circuit board (250) and / or the second printed circuit board (252) may be equipped with a processor (e.g., the processor (120) of FIG. 1), a memory (e.g., the memory (130) of FIG. 1), and / or an interface (e.g., the interface (177) of FIG. 1). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory (e.g., the volatile memory (132) of FIG. 1) or a nonvolatile memory (e.g., the nonvolatile memory (134) of FIG. 1). The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include a USB connector, an SD card / MMC (multimedia card) connector, or an audio connector. In one embodiment, the first printed circuit board (250) and the second printed circuit board (252) may be operatively or electrically connected to each other via a connecting member (e.g., a flexible printed circuit board).

[0083] In one embodiment, the battery (270) may power at least one component of the electronic device (101). For example, the battery (270) may include a rechargeable secondary battery or a fuel cell. At least a portion of the battery (270) may be disposed substantially coplanar with the first printed circuit board (250) and / or the second printed circuit board (252).

[0084] An electronic device (101) according to one embodiment may include an antenna module. According to one embodiment, the antenna module may be disposed between the rear plate (211) and the battery (270). The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna module may, for example, perform short-range communication with an external device or wirelessly transmit and receive power with an external device.

[0085] According to one embodiment, a first camera (205) (e.g., a front camera) may be positioned on at least a portion of a frame structure (240) (e.g., a support structure (243)) such that the lens can receive external light through a portion of the front plate (202) (e.g., the camera area (237)) (e.g., the front (200A) of FIG. 1).

[0086] In one embodiment, the second camera (212) (e.g., a rear camera) may be disposed between the frame structure (240) and the rear plate (211). In one embodiment, the second camera (212) may be electrically connected to the first printed circuit board (250) via a connecting member (e.g., a connector). In one embodiment, the second camera (212) may be disposed such that the lens can receive external light through the camera area (284) of the rear plate (211) of the electronic device (101).

[0087] According to one embodiment, the camera area (284) may be formed on a surface of the rear plate (211) (e.g., the rear surface (200B) of FIG. 1). According to one embodiment, the camera area (284) may be formed to be at least partially transparent so that external light may be incident on the lens of the second camera (212). According to one embodiment, at least a portion of the camera area (284) may protrude from the surface of the rear plate (211) by a predetermined height. However, the present invention is not limited thereto, and in another embodiment, the camera area (284) may form a plane substantially coextensive with the surface of the rear plate (211).

[0088] According to one embodiment, the housing (e.g., the housing (210) of FIG. 2) of the electronic device (101) may refer to a configuration or structure that forms at least a portion of the exterior of the electronic device (101). In this respect, at least a portion of the front plate (202), the frame structure (240), and / or the rear plate (211) that form the exterior of the electronic device (101) may be referred to as the housing (210) of the electronic device (101).

[0089] Figure 4a is a partially exploded perspective view of an exemplary electronic device. Figure 4b is a partial cross-sectional view of the exemplary electronic device.

[0090] Referring to FIGS. 4A and 4B, the electronic device (101) may include a first printed circuit board (410) (e.g., the first printed circuit board (250) of FIG. 3) and a second printed circuit board (420) (e.g., the second printed circuit board (252) of FIG. 3).

[0091] In one embodiment, the second printed circuit board (420) may face the first printed circuit board (410). The second printed circuit board (420) may be disposed on the first printed circuit board (410). It should be understood that when an element is referred to as being "on" another element, it may be directly on the other element or there may be intervening elements between them. For example, within this document, "B disposed on A" may refer to "B disposed over A." For example, within this document, "B disposed on A" may refer to "B disposed under A." For example, within this document, "B disposed on A" may refer to "B faced away from A." For example, "the second printed circuit board (420) disposed on the first printed circuit board (410)" may refer to "the second printed circuit board (420) in contact with the first printed circuit board (410)". For example, "the second printed circuit board (420) disposed on the first printed circuit board (410)" may refer to "the second printed circuit board (420) facing and spaced apart from the first printed circuit board (410)". The structure in which the second printed circuit board (420) is disposed on the first printed circuit board (410) may be referred to as a PCB stack-up, but is not limited thereto.

[0092] For example, the second printed circuit board (420) may be spaced apart from the first printed circuit board (410). At least a portion of the second printed circuit board (420) may face the first printed circuit board (410). For example, at least a portion of the second printed circuit board (420) may overlap the first printed circuit board (410) when the first printed circuit board (410) is viewed from above. For example, a plurality of electronic components may be mounted on each of the first printed circuit board (410) and the second printed circuit board (420). At least a portion of the electronic components mounted on the first printed circuit board (410) may face at least a portion of the electronic components mounted on the second printed circuit board (420). Since at least a portion of the first printed circuit board (410) is spaced apart from the second printed circuit board (420), the electronic components arranged on the first printed circuit board (410) can be spaced apart from the electronic components arranged on the second printed circuit board (420).

[0093] According to one embodiment, the first printed circuit board (410) may include a first side (411) facing the second printed circuit board (420) and a third side (412) opposite the first side (411). The second printed circuit board (420) may include a second side (421) facing the first printed circuit board (410) and a fourth side (422) opposite the second side (421). For example, the first side (411) and the second side (421) may face each other. For example, the first side (411) may face away from the second side (421). For example, the first side (411) may be the side closest to the second printed circuit board (420) among all sides of the first printed circuit board (410). For example, the second side (421) may be the side closest to the first printed circuit board (410) among all sides of the second printed circuit board (420). For example, the third side (412) may be the side farthest from the second printed circuit board (420) among all sides of the first printed circuit board (410). For example, the fourth side (422) may be the side farthest from the first printed circuit board (410) among all sides of the second printed circuit board (420).

[0094] According to one embodiment, the electronic device (101) may further include a first set of electronic components (450) disposed on a first surface (411) of a first printed circuit board (410), and a second set of electronic components (460) disposed on a second surface (421) of a second printed circuit board (420). For example, at least some of the first set of electronic components (450) may receive power from a power management module (e.g., power management module (188) of FIG. 1) and / or a battery (e.g., battery (189) of FIG. 1) of the electronic device (101) through the first printed circuit board (410). For example, at least some of the second set of electronic components (460) may receive power from the power management module (188) and / or the battery (189) through the second printed circuit board (420). For example, since the first surface (411) faces the second surface (421), at least some of the first set of electronic components (450) mounted on the first surface (411) may face at least some of the second set of electronic components (460) mounted on the second surface (421). For example, since the first surface (411) is spaced apart from the second surface (421), each of the first set of electronic components (450) mounted on the first surface (411) may be spaced apart from the second set of electronic components (460) mounted on the second surface (421).

[0095] Although the electronic device (101) may include a first set of electronic components (450) and a second set of electronic components (460), the electronic device (101) may further include a third set of electronic components (e.g., the third set of electronic components (470) of FIG. 5A) positioned on a third side (412) of the first printed circuit board (410) and / or a fourth side (422) of the second printed circuit board (420). The third set of electronic components (470) may be spaced apart from the first set of electronic components (450) and the second set of electronic components (460). Furthermore, terms such as “first set” and “second set” may be used simply to distinguish the corresponding components from other components and thus do not limit the corresponding components on different sides (e.g., the number of the corresponding components). For example, the first set of electronic components (450) may include one or more electronic components disposed on the first surface (411). For example, the second set of electronic components (460) may include one or more electronic components disposed on the second surface (421).

[0096] According to one embodiment, the electronic device (101) may further include a third set of electronic components (470) disposed on at least a portion of a third side (412) opposite the first side (411) of the first printed circuit board (410) and a fourth side (422) opposite the second side (421) of the second printed circuit board (420). The first support member (510) and the second support member (520) may be disposed at positions corresponding to at least a portion of the third set of electronic components (470).

[0097] For example, at least some of the third set of electronic components (470) may overlap at least a portion of the first support member (510) when the first printed circuit board (410) is viewed from above (e.g., when viewed in the -z direction). For example, at least some of the third set of electronic components (470) may be arranged on substantially the same axis as the first support member (510) with respect to the x-axis and the y-axis. For example, at least some of the third set of electronic components (470) may overlap at least a portion of the second support member (520) when the second printed circuit board (420) is viewed from above (e.g., when viewed in the +z direction). For example, at least some of the third set of electronic components (470) may be arranged on substantially the same axis as the second support member (520) with respect to the x-axis and the y-axis. For example, the electronic device (101) may include a support area (530) that is relatively vulnerable to external impact. At least some of the third set of electronic components (470) may be disposed on the support area (530). The first support member (510) and the second support member (520) may be disposed at positions corresponding to at least some of the third set of electronic components (470) disposed on the support area (530) within the support area (530). At least some of the third set of electronic components (470) disposed on the support area (530) may have the greatest height relative to the z-axis among the electronic components disposed outside the space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the interposer (430). At least some of the third set of electronic components (470) may be electronic components that are relatively vulnerable to external impact due to deformation of the external structure of the electronic device (101) (e.g., the rear plate (211) of FIG. 2) caused by the external impact.The first support member (510) and the second support member (520) are positioned at positions corresponding to the relatively vulnerable electronic components, thereby reducing malfunction of the electronic components around the first support member (510) and the second support member (520) due to the external impact.

[0098] According to one embodiment, the electronic device (101) may further include an interposer (430) between the first printed circuit board (410) and the second printed circuit board (420), surrounding a space between the first side (411) of the first printed circuit board (410) and the second side (421) of the second printed circuit board (420). For example, the interposer (430) may separate the first printed circuit board (410) from the second printed circuit board (420). For example, the interposer (430) may be in contact with the first side (411) and the second side (421). For example, the interposer (430) can surround a first set of electronic components (450) disposed on a first surface (411) and a second set of electronic components (460) disposed on a second surface (421). By including the interposer (430), the electronic device (101) can provide space for the first set of electronic components (450) and the second set of electronic components (460) and reduce contact between the first set of electronic components (450) and the second set of electronic components (460).

[0099] According to one embodiment, a structure in which electronic components (e.g., a first set of electronic components (450), a second set of electronic components (460), and a third set of electronic components (470)) are arranged on a first surface (411), a second surface (421), a third surface (412), and a fourth surface (422), respectively, may be referred to as a 4-surface mounting structure of a printed circuit board. In the 4-surface mounting structure, since the first surface (411) and the second surface (421) face each other, at least some of the first set of electronic components (450) and at least some of the second set of electronic components (460) may come into contact with each other due to an external impact. The electronic device (101) may include a structure for reducing malfunction of at least some of the electronic components (450) of the first set and / or at least some of the electronic components (460) of the second set by causing at least some of the electronic components (450) of the first set to come into contact with each other. The structure for reducing the malfunction is described below in FIG. 5A.

[0100] Although the electronic device (101) may correspond to a device having a bar shape of FIG. 2 and FIG. 3, the shapes of the electronic device (101) are not limited to having a bar shape.

[0101] For example, an electronic device (101) may include a first housing and a second housing that is movable relative to the first housing. The electronic device (101) may include a flexible display (e.g., display (201) of FIG. 2) that includes a deformable region along the second housing that moves relative to the first housing. The flexible display may provide a variety of user experiences to a user by including a region that is at least partially rolled into the first housing or exposed outside the first housing along the second housing that moves relative to the first housing. The electronic device (101) including the flexible display including a deformable region along the second housing moving relative to the first housing may include a structure for reducing malfunction of at least some of the first set of electronic components (450) and / or at least some of the second set of electronic components (460) by causing at least some of the first set of electronic components (450) and at least some of the second set of electronic components (460) to come into contact with each other.

[0102] For example, an electronic device (101) may include a first housing, a second housing, and a hinge structure rotatably connecting the first housing and the second housing. The electronic device may include a flexible display including a deformable region extending upwardly across the hinge structure from the first housing to the second housing and positioned on the hinge structure. The electronic device (101) may provide a variety of user experiences to a user by including the hinge structure rotatably connecting the first housing and the second housing. The electronic device (101) including the flexible display including the deformable region disposed on the hinge structure may include a structure for reducing malfunction of at least some of the first set of electronic components (450) and / or at least some of the second set of electronic components (460) by causing at least some of the first set of electronic components (450) and at least some of the second set of electronic components (460) to come into contact with each other.

[0103] According to the above-described embodiment, the electronic device (101) includes a first printed circuit board (410) and a second printed circuit board (420) disposed on the first printed circuit board (410), thereby increasing space for electronic components mounted on the first printed circuit board (410) and / or the second printed circuit board (420) within the electronic device (101).

[0104] Figure 5a illustrates a portion of an exemplary electronic device in a first state. Figure 5b illustrates a portion of an exemplary electronic device in a second state.

[0105] Referring to FIGS. 5A and 5B, an electronic device (101) may include a first printed circuit board (410), and a second printed circuit board (420) facing the first printed circuit board (410) and spaced apart from the first printed circuit board (410). The electronic device (101) may further include an interposer (430) between the first printed circuit board (410) and the second printed circuit board (420), which surrounds a space between a first side (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second side (421) of the second printed circuit board (420) facing the first printed circuit board (410). The electronic device (101) may further include a first set of electronic components (450) arranged on the first surface (411), and a second set of electronic components (460) arranged on the second surface (421).

[0106] Hereinafter, redundant descriptions of the configurations described in FIGS. 4a and 4b are omitted.

[0107] Referring to FIGS. 5A and 5B, the electronic device (101) may include a first support member (510) disposed on a first surface (411) of a first printed circuit board (410) facing a second printed circuit board (420). The electronic device (101) may include a second support member (520) disposed on the second printed circuit board (420) and facing the first support member (510). The second support member (520) may be configured to come into contact with the first support member (510), for example, by an external force.

[0108] For example, the first support member (510) and the second support member (520) may be disposed within a space surrounded by the first surface (411), the second surface (421), and the interposer (430). The first support member (510) may be disposed on the second support member (520) within the space. For example, the first support member (510) may be separated from the second support member (520). For example, the first support member (510) may be attached to the first surface (411) so as to face the second support member (520). The second support member (520) may be attached to the second surface (421) so as to face the first support member (510).

[0109] The first state of the electronic device (101) may be a state in which the first support member (510) and the second support member (520) are spaced apart. For example, the first state may be a state in which the first support member (510) and the second support member (520) face each other and are spaced apart. For example, the first state may be a state in which the electronic device (101) includes a gap between the first support member (510) and the second support member (520).

[0110] For example, the electronic device (101) may include a supporting region (530) in which a first supporting member (510) and a second supporting member (520) are disposed. The supporting region (530) may include a portion of a first printed circuit board (410) connected to the first supporting member (510) and a portion of a second printed circuit board (420) connected to the second supporting member (520). The first state may be a state in which the supporting region (530) is not damaged. The first state may be a state in which a portion of the first printed circuit board (410) and / or a portion of the second printed circuit board (420) included in the supporting region (530) is not deformed. The first state may be a state in which a portion of the first printed circuit board (410) included in the supporting region (530) is not bent toward the second printed circuit board (420). The first state may be a state in which a portion of the second printed circuit board (420) included in the support area (530) is not bent toward the first printed circuit board (410). However, the first state is not limited thereto, and may include a plurality of states in which the first support member (510) and the second support member (520) do not come into contact.

[0111] The second state of the electronic device (101) may be a state in which the first support member (510) and the second support member (520) are in contact. For example, the second state may be a state in which the first support member (510) and the second support member (520) are connected. For example, the second state may be a state in which the electronic device (101) does not include a gap between the first support member (510) and the second support member (520).

[0112] For example, the second state may be a state in which at least a portion of the support area (530) where the first support member (510) and the second support member (520) are arranged is broken. For example, the second state may be a state in which the first support member (510) and the second support member (520) are in contact with each other by deforming a portion of the first printed circuit board (410) and / or a portion of the second printed circuit board (420) included in the support area (530). For example, the second state may be a state in which at least a portion of the first printed circuit board (410) included in the support area (530) is bent toward the second printed circuit board (420). For example, the second state may be a state in which at least a portion of the second printed circuit board (420) included in the support area (530) is bent toward the first printed circuit board (410). However, without being limited thereto, the second state may include a plurality of states in which at least a portion of the support area (530) is deformed and the first support member (510) and the second support member (520) come into contact.

[0113] For example, the first support member (510) and the second support member (520) may face each other. While the electronic device (101) changes from the first state to the second state, at least a portion of the support area (530) may be deformed by an external impact. For example, a portion of the first printed circuit board (410) included in the support area (530) may be bent toward the second printed circuit board (420). As the portion of the first printed circuit board (410) is bent, the first support member (510) may be moved toward the second support member (520). For example, a portion of the second printed circuit board (420) included in the support area (530) may be bent toward the first printed circuit board (410). By bending the part of the second printed circuit board (420), the second support member (520) can be moved toward the first support member (510). Since the first support member (510) and the second support member (520) are arranged to face each other, when at least a part of the support area (530) is deformed, the second support member (520) can be configured to come into contact with the first support member (510). For example, in the second state, the first support member (510) can support the second support member (520). By supporting the second support member (520), the first support member (510) can reduce the second printed circuit board (420) from being damaged by an external impact. For example, in the second state, the second support member (520) can support the first support member (510). The second support member (520) can reduce damage to the first printed circuit board (410) due to external impact by supporting the first support member (510).

[0114] According to one embodiment, the first support member (510) may overlap the second support member (520) when the first side (411) of the first printed circuit board (410) is viewed from above. For example, the first support member (510) may be positioned at a position corresponding to the second support member (520) within a space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the interposer (430). For example, one side of the first support member (510) facing the second printed circuit board (420) may face one side of the second support member (520) facing the first printed circuit board (410). The one side of the first support member (510) facing the second printed circuit board (420) may overlap with the one side of the second support member (520) facing the first printed circuit board (410) in a second state of the electronic device (101) in which the first support member (510) and the second support member (520) are in contact. The first support member (510) overlaps with the second support member (520) when the first side (411) of the first printed circuit board (410) is viewed from above, thereby reducing damage to the first printed circuit board (410) and / or the second printed circuit board (420) in the second state.

[0115] According to one embodiment, a length (d1) of the first support member (510) extending from the first side (411) toward the second side (421) may be greater than a length of each of the first set of electronic components (450) extending from the first side (411) toward the second side (421). A length (d2) of the second support member (520) extending from the second side (421) toward the first side (411) may be greater than a length of each of the second set of electronic components (460) extending from the second side (421) toward the first side (411).

[0116] For example, a length (d1) of the first support member (510) extending from the first face (411) toward the second face (421) may be greater than a maximum length of the first set of electronic components (450) extending from the first face (411) toward the second face (421). A length (d2) of the second support member (520) extending from the second face (421) toward the first face (411) may be greater than a maximum length of the second set of electronic components (460) extending from the second face (421) toward the first face (411). For example, a gap between the first support member (510) and the second support member (520) may be smaller than a gap between the first set of electronic components (450) and the second set of electronic components (460). Since the length (d1) of the first support member (510) is greater than the length of each of the electronic components (450) of the first set, and the length (d2) of the second support member (520) is greater than the length of each of the electronic components (460) of the second set, the electronic device (101) can reduce malfunction of the electronic components (450) of the first set and / or the electronic components (460) of the second set that occurs due to contact between the electronic components (450) of the first set and the electronic components (460) of the second set.

[0117] According to one embodiment, the first set of electronic components (450) can be spaced apart from the second set of electronic components (460) while the electronic device (101) changes from a first state in which the first support member (510) and the second support member (520) are spaced apart to a second state in which the first support member (510) and the second support member (520) are in contact. For example, since the length (d1) of the first support member (510) is greater than the maximum length of the first set of electronic components (450), and the length (d2) of the second support member (520) is greater than the maximum length of the second set of electronic components (460), the first set of electronic components (450) can be spaced apart from the second set of electronic components (460) within the second state. For example, in the second state, the first support member (510) supports the second face (421) through the second support member (520), and the second support member (520) supports the first face (411) through the first support member (510), so that the first set of electronic components (450) can be spaced apart from the second set of electronic components (460). The electronic device (101) can include the first support member (510) and the second support member (520) that prevent contact between the first set of electronic components (450) and the second set of electronic components (460). Accordingly, the electronic device (101) can reduce malfunction of the first set of electronic components (450) and / or the second set of electronic components (460) caused by contact between the first set of electronic components (450) and the second set of electronic components (460).

[0118] Although the electronic device (101) is described as including a first support member (510) and a second support member (520), it is not limited thereto. The electronic device (101) may include a plurality of support areas (e.g., support areas (530)) that are relatively susceptible to deformation by external impact. The electronic device (101) may include sets of support members (e.g., sets of support members (810) of FIG. 8A) that are arranged in each of the plurality of support areas and form pairs with each other. The arrangement of the plurality of support members in each of the plurality of support areas will be described below with reference to FIG. 8A.

[0119] According to one embodiment, the first support member (510) may include a first electrode (511). The second support member (520) may include a second electrode (521) configured to be in contact with the first electrode (511). For example, the first electrode (511) may form at least a portion of the first support member (510). The first electrode (511) may be exposed to the outside of the first support member (510). The second electrode (521) may form at least a portion of the second support member (520). Since the second electrode (521) is exposed to the outside of the second support member (520), the second electrode (521) may be configured to be in contact with the first electrode (511) of the first support member (510). For example, at least a portion of the second electrode (521) may be configured to contact at least a portion of the first electrode (511) because the portion of the second electrode (521) faces at least a portion of the first electrode (511). For example, the second electrode (521) may be spaced apart from the first electrode (511) in a first state of the electronic device (101) in which the first support member (510) and the second support member (520) are spaced apart. The second electrode (521) may be brought into contact with at least a portion of the first electrode (511) in a second state of the electronic device (101) in which the first support member (510) and the second support member (520) are in contact.

[0120] For example, the first electrode (511) may be electrically connected to the first printed circuit board (410). The second electrode (521) may be electrically connected to the second printed circuit board (420). The first electrode (511) may be in contact with the second electrode (521), thereby providing a conductive path for current from the first printed circuit board (410) to the second printed circuit board (420). The electronic device (101) may be configured to identify a second state of the electronic device (101) in which the first support member (510) and the second support member (520) are in contact through the current. Identifying the contact between the first support member (510) and the second support member (520) will be described later in FIG. 8A and below.

[0121] According to one embodiment, the first support member (510) including the first electrode (511) and / or the second support member (520) including the second electrode (521) may be referred to as an electronic element including at least one of a dummy cap and a capacitor. The first support member (510) and the second support member (520) include at least one of the dummy cap and the capacitor, thereby simplifying the process of arranging the first support member (510) and the second support member (520) on the first printed circuit board (410) and the second printed circuit board (420), respectively, and reducing malfunctions of electronic components around the first support member (510) and the second support member (520).

[0122] According to one embodiment, the first electrode (511) may extend in a first direction within the first support member (510). The second electrode (521) may extend in a second direction different from the first direction within the second support member (520). According to one embodiment, the first direction in which the first electrode (511) extends may be perpendicular to the second direction in which the second electrode (521) extends. For example, the first electrode (511) may extend in a direction parallel to the +x direction or the -x direction within the first support member (510). The second electrode (521) may extend in a direction parallel to the +y direction or the -y direction within the second support member (520). However, the present invention is not limited thereto. Since the direction in which the first electrode (511) extends is different from the direction in which the second electrode (521) extends, the electronic device (101) can reduce the contact area between the first electrode (511) and the second electrode (521). By reducing the contact area between the first electrode (511) and the second electrode (521), the electronic device (101) can reduce damage to the first electrode (511) and damage to the second electrode (521). According to one embodiment, the first electrode (511) may be arranged at both ends of the first support member (510). The second electrode (521) may be arranged at both ends of the second support member (520) so as to extend in a direction perpendicular to the direction in which the first electrode (511) extends. For example, the first electrode (511) may extend in a direction parallel to the major axis of the first support member (510). The second electrode (521) may extend in a direction parallel to the minor axis of the second support member (520) that overlaps the first support member (510). However, the present invention is not limited thereto.

[0123] In one embodiment, each of the first support member (510) and the second support member (520) may be deformable. For example, when the first printed circuit board (410) and / or the second printed circuit board (420) within the support area (530) is deformed, the first support member (510) may come into contact with the second support member (520). The first support member (510) may be deformed by the second support member (520). The second support member (520) may be deformed by the first support member (510). For example, the first support member (510) and the second support member (520) may include, but are not limited to, rubber. Since the first support member (510) and the second support member (520) are deformable, the electronic device (101) can reduce damage to the first printed circuit board (410) and / or the second printed circuit board (420) due to contact between the first support member (510) and the second support member (520). For example, contraction of the first support member (510) and the second support member (520) may occur due to an external force or an external impact.

[0124] According to the above-described embodiment, the electronic device (101) can reduce damage to the first printed circuit board (410) and the second printed circuit board (420) by including the first support member (510) and the second support member (520) configured to face the first support member (510) and make contact with the first support member (510). The first support member (510) and the second support member (520) can reduce contact between the first set of electronic components (450) on the first surface (411) and the second set of electronic components (460) on the second surface (421) by being configured to make contact with each other. The first support member (510) and the second support member (520) can provide various user experiences to the user of the electronic device (101) by including the first electrode (511) and the second electrode (521), respectively.

[0125] Figures 6a, 6b, and 6c are partial cross-sectional views of an exemplary electronic device.

[0126] Referring to FIGS. 6A, 6B, and 6C, an electronic device (101) may include a first printed circuit board (410), and a second printed circuit board (420) facing the first printed circuit board (410) and spaced apart from the first printed circuit board (410). The electronic device (101) may further include an interposer (430) between the first printed circuit board (410) and the second printed circuit board (420), which surrounds a space between a first side (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second side (421) of the second printed circuit board (420) facing the first printed circuit board (410). The electronic device (101) may further include a first set of electronic components (450) arranged on the first surface (411), and a second set of electronic components (460) arranged on the second surface (421).

[0127] Referring to FIG. 6A, the electronic device (101) may include a support member (610) between the first printed circuit board (410) and the second printed circuit board (420). For example, unlike FIGS. 5A and 5B, either the first support member (e.g., the first support member (510) of FIG. 5A) or the second support member (e.g., the second support member (520) of FIG. 5A) may be omitted. For example, the length (d3) of the support member (610) extending from the first side (411) toward the second side (421) may be greater than the sum of the maximum lengths of the electronic components included in the first set of electronic components (450) and the maximum lengths of the electronic components included in the second set of electronic components (460). For example, the support member (610) may come into contact with the first printed circuit board (410) and / or the second printed circuit board (420) as the first printed circuit board (410) and / or the second printed circuit board (420) are deformed by an external impact. The support member (610) is configured to support the first printed circuit board (410) and the second printed circuit board (420), thereby reducing the contact of the first set of electronic components (450) with the second set of electronic components (460).

[0128] Referring to FIGS. 6b and 6c, the electronic device (101) may include a first support member (510) disposed on a first surface (411) of a first printed circuit board (410) facing a second printed circuit board (420), and a second support member (520) disposed on a second surface (421) of the second printed circuit board (420) facing the first printed circuit board (410).

[0129] Referring to FIG. 6B, a portion of the first support member (510) may face a portion of the second support member (520). A remaining portion of the first support member (510) may face a second surface (421) of the second printed circuit board (420). A remaining portion of the second support member (520) may face a first surface (411) of the first printed circuit board (410). Since the portion of the first support member (510) faces the portion of the second support member (520), when the first printed circuit board (410) and / or the second printed circuit board (420) are deformed, the portion of the second support member (520) may come into contact with the portion of the second support member (520). According to one embodiment, the first support member (510) may include a first electrode (e.g., the first electrode (511) of FIG. 5A) on a portion facing the second support member (520). The second support member (520) may include a second electrode (e.g., the second electrode (521) of FIG. 5A) configured to contact the first electrode (511) on a portion facing the first support member (510). However, embodiments of the present disclosure are not limited thereto, and the electronic device (101) may include a first support member (510) and a second support member (520) configured to contact each other at least partially and forming a pair.

[0130] Referring to FIG. 6C, the size (s1) of the first support member (510) may be different from the size (s2) of the second support member (520). For example, the area where the first support member (510) is disposed may include the area where the second support member (520) is disposed when the first surface (411) is viewed from above. For example, when the first surface (411) is viewed from above, a portion of the first support member (510) may overlap the second support member (520). For example, a portion of the first support member (510) may face the second support member (520). According to one embodiment, the first support member (510) may include a first electrode (511) in a portion facing the second support member (520). The second support member (520) may include a second electrode (521) configured to be in contact with the first electrode (511). However, the present invention is not limited thereto, and in some embodiments, the electronic device (101) may include a first support member (510) and a second support member (520) that are different in size and form a pair. The first support member (510) and the second support member (520) may be configured to be in contact with each other.

[0131] According to the above-described embodiment, the electronic device (101) includes at least one support member (e.g., support member (610) of FIG. 6A, first support member (510) and second support member (520) of FIGS. 6B and 6C) that separates the first set of electronic components (450) and the second set of electronic components (460) from each other, thereby reducing contact between the first set of electronic components (450) on the first surface (411) and the second set of electronic components (460) on the second surface (421).

[0132] Figure 7 is a partial cross-sectional view of an exemplary electronic device.

[0133] Referring to FIG. 7, an electronic device (101) may include a first printed circuit board (410), and a second printed circuit board (420) facing the first printed circuit board (410) and spaced apart from the first printed circuit board (410). The electronic device (101) may further include an interposer (430) between a first side (411) of the first printed circuit board (410) facing the second printed circuit board (420) and a second side (421) of the second printed circuit board (420) facing the first printed circuit board (410). The electronic device (101) may further include a first set of electronic components (450) disposed on the first side (411), and a second set of electronic components (460) disposed on the second side (421).

[0134] According to one embodiment, the electronic device (101) may further include a third printed circuit board (710) disposed between the first printed circuit board (410) and the second printed circuit board (420) and spaced apart from the first support member (510) and the second support member (520). The electronic device (101) may further include a fourth set of electronic components (740) mounted on the third printed circuit board (710). For example, some of the fourth set of electronic components (740) may face the first side (411) of the first printed circuit board (410). Others of the fourth set of electronic components (740) may face the second side (421) of the second printed circuit board (420). The first support member (510) and the second support member (520) are configured to contact each other, thereby spacing the fourth set of electronic components (740) from the first set of electronic components (450) on the first surface (411) and / or the second set of electronic components (460) on the second surface (421).

[0135] According to one embodiment, the electronic device (101) may include a third printed circuit board (710) between the first printed circuit board (410) and the second printed circuit board (420), although embodiments of the present disclosure are not limited thereto. For example, the electronic device (101) may further include a fourth printed circuit board (720) disposed between the first printed circuit board (410) and the second printed circuit board (420) and spaced apart from the third printed circuit board (710). The electronic device (101) may further include a fifth set of electronic components (750) mounted on the fourth printed circuit board (720). The electronic device (101) may include interposers (431, 432, 433, 434) for electronic components (e.g., a first set of electronic components (450), a second set of electronic components (460), a fourth set of electronic components (740), a fifth set of electronic components (750)) between a first printed circuit board (410) and a second printed circuit board (420). The first support member (510) and the second support member (520) may be configured to contact each other (e.g., when an external force is applied). Accordingly, the first support member (510) and the second support member (520) may space the fifth set of electronic components (750) from the first set of electronic components (450) on the first surface (411) and / or the second set of electronic components (460) on the second surface (421). However, without being limited thereto, the electronic device (101) may include a first support member (510) and a second support member (520) configured to separate or move apart from each other a plurality of electronic components disposed on each of a plurality of printed circuit boards between a first printed circuit board (410) and a second printed circuit board (420).

[0136] According to one embodiment, the electronic device (101) may include a first support member (510) disposed on a first surface (411) of a first printed circuit board (410), and a second support member (520) disposed on a second surface (421) of a second printed circuit board (420) facing the first surface (411) and facing the first support member (510), but embodiments of the present disclosure are not limited thereto. The electronic device (101) may include a plurality of printed circuit boards in which electronic components are disposed to face each other, as illustrated in FIG. 7. The electronic device (101) may include a plurality of support members including the first support member (510) and the second support member (520) in order to reduce malfunction of the electronic components due to contact between the electronic components facing each other by an external impact. For example, the electronic device (101) may include support members disposed between the first printed circuit board (410) and the third printed circuit board (710) and facing each other at least partially to reduce contact between the first set of electronic components (450) and the fourth set of electronic components (740). For example, the electronic device (101) may include support members disposed between the first printed circuit board (410) and the fourth printed circuit board (720) and facing each other at least partially to reduce contact between the first set of electronic components (450) and the fifth set of electronic components (750). For example, the electronic device (101) may include support members disposed between the second printed circuit board (420) and the third printed circuit board (710) and facing each other at least partially to reduce contact between the second set of electronic components (460) and the fourth set of electronic components (740).For example, the electronic device (101) may include support members disposed between the second printed circuit board (420) and the fourth printed circuit board (720) and facing each other at least partially to reduce contact between the second set of electronic components (460) and the fifth set of electronic components (750). However, the present invention is not limited thereto. It should be noted that the electronic device (101) may include support members for spacing apart the electronic components facing each other, and the number and arrangement of the support members are not limited.

[0137] According to one embodiment, the electronic device (101) may further include a third set of electronic components (470) positioned on a third side (412) of the first printed circuit board (410) and / or a fourth side (422) of the second printed circuit board (420). The third set of electronic components (470) may be positioned on the third side (412) and / or the fourth side (422) so as to be disposed outside a space surrounded by the first printed circuit board (410), the second printed circuit board (420), and the interposer (430). In order to protect the third set of electronic components (470) positioned outside the space from external impact, the electronic device (101) may further include at least one shield can (760) that covers at least a portion of the third set of electronic components (470). The electronic device (101) includes a first support member (510) and a second support member (520) within the space and includes at least one shield can (760) outside the space, thereby reducing damage to electronic components around the first printed circuit board (410) and the second printed circuit board (420) from external impact.

[0138] According to the above-described embodiment, the electronic device (101) includes support members (e.g., a first support member (510) and a second support member (520)) configured to separate from each other the electronic components (e.g., a fourth set of electronic components (740) and a fifth set of electronic components (750)) mounted on at least one printed circuit board (e.g., a third printed circuit board (710) and a fourth printed circuit board (720)) between the first printed circuit board (410) and the second printed circuit board (420) and the electronic components (e.g., a first set of electronic components (450) and a second set of electronic components (460)) mounted on the first surface (411) and the second surface (421), thereby reducing malfunction of the electronic components within the electronic device (101).

[0139] Fig. 8a illustrates a portion of an exemplary electronic device having a plurality of support members arranged therein. Fig. 8b is a circuit diagram for detecting an abnormal state of the electronic device.

[0140] Referring to FIGS. 8A and 8B, the electronic device (101) may include a first printed circuit board (e.g., the first printed circuit board (410) of FIG. 4A), and a second printed circuit board (e.g., the second printed circuit board (420) of FIG. 4A) facing the first printed circuit board (410) and spaced apart from the first printed circuit board (410). The electronic device (101) may further include an interposer (430) between the first printed circuit board (410) and the second printed circuit board (420), which surrounds a space between a first surface of the first printed circuit board (410) facing the second printed circuit board (420) (e.g., the first surface (411) of FIG. 4A) and a second surface of the second printed circuit board (420) facing the first printed circuit board (410) (e.g., the second surface (421) of FIG. 4A). The electronic device (101) may further include a first set of electronic components (e.g., the first set of electronic components (450) of FIG. 4B) disposed on the first surface (411), and a second set of electronic components (e.g., the second set of electronic components (460) of FIG. 4B) disposed on the second surface (421).

[0141] Referring to FIG. 8A, the electronic device (101) may include sets of support members (810). For example, the sets of support members (810) may include a first set of support members (811), a second set of support members (812), and a third set of support members (813). For example, each of the first set of support members (811), the second set of support members (812), and the third set of support members (813) may include two support members that are paired with each other (e.g., the first support member (510) and the second support member (520) of FIG. 5A). For example, the electronic device (101) may include a first support area (821) in which a first set of support members (811) are arranged, a second support area (822) in which a second set of support members (812) are arranged, and a third support area (823) in which a third set of support members (813) are arranged. Each of the support areas (821, 822, 823) may include a portion of the first printed circuit board (410) and a portion of the second printed circuit board (420).

[0142] For example, when a part of the first printed circuit board (410) and / or a part of the second printed circuit board (420) included in at least some of the support areas (821, 822, 823) is damaged, two paired support members included in at least some of the support areas (821, 822, 823) may come into contact with each other. Each of the two paired support members may include an electrode (e.g., the first electrode (511) of FIG. 5A and the second electrode (521) of FIG. 5B). The electronic device (101) may be configured to identify the degree of damage to at least some of the support areas (821, 822, 823) in which the two paired support members are disposed, through contact between the electrodes disposed on each of the two paired support members.

[0143] Referring to FIG. 8b, the electronic device (101) may include a processor (120), at least one breakage detection circuit (830), an analog to digital converting (ADC) port (840), and a VDD (850).

[0144] At least one damage detection circuit (830) may be included in the first printed circuit board (410). The at least one damage detection circuit (830) may be connected to electrodes disposed on the first printed circuit board (410) within the support areas (821, 822, 823), respectively. The electrodes disposed on the second printed circuit board (420) within the support areas (821, 822, 823), respectively, may be connected to the ground of the electronic device (101). For example, the at least one damage detection circuit (830) may include a first damage detection circuit (831), a second damage detection circuit (832), and a third damage detection circuit (833). The first damage detection circuit (831) may be connected to an electrode disposed on the first printed circuit board (410) within the first support area (821). The second breakage detection circuit (832) may be connected to an electrode disposed on a first printed circuit board (410) within a second support area (822). The third breakage detection circuit (833) may be connected to an electrode disposed on a first printed circuit board (410) within a third support area (823).

[0145] The ADC port (840) may be connected to at least one break detection circuit (830). The ADC port (840) may be configured to detect a change in the voltage of at least a portion of the at least one break detection circuit (830). For example, when pairs of electrodes within the first support area (821) come into contact, the voltage of the first break detection circuit (831) connected to at least a portion of the electrodes may change. For example, referring to FIG. 5A, the current flowing in the first electrode (511) may change when the first electrode (511) comes into contact with the second electrode (521). Since the current flowing in the first electrode (511) changes, the voltage of at least one break detection circuit (830) connected to the first electrode (511) may change. The ADC port (840) may be configured to detect a change in the voltage of at least one breakage detection circuit (830) connected to the ADC port (840), thereby measuring whether or not the support areas (821, 822, 823) in which the sets of support members (810) are respectively arranged are broken and / or the degree of breakage.

[0146] The VDD (850) may be connected to at least one failure detection circuit (830). The VDD (850) may be configured to provide a driving voltage to the at least one failure detection circuit (830). For example, the VDD (850) may provide a driving voltage to the at least one failure detection circuit (830) through a potential difference across each of the resistors (861, 862, 863).

[0147] The processor (120) may be configured to identify the degree of damage to the first printed circuit board (410) and / or the second printed circuit board (420) included in the support areas (821, 822, 823) through at least one damage detection circuit (830) and an ADC port (840).

[0148] According to one embodiment, the electronic device (101) may include a first support area (821), a second support area (822), and a third support area (823), but embodiments of the present disclosure are not limited thereto. The electronic device (101) may include a plurality of support areas in which the first printed circuit board (410) and / or the second printed circuit board (420) are relatively susceptible to damage. The electronic device (101) may be configured to identify at least a portion of the plurality of support areas that are damaged through at least one damage detection circuit (830) and an ADC port (840), thereby reducing damage to the electronic device (101).

[0149] According to the above-described embodiment, the electronic device (101) can reduce damage to the first printed circuit board (410) and the second printed circuit board (420) by including sets of support members (810) that form pairs in each of the support areas (821, 822, 823) that are relatively prone to damage to the first printed circuit board (410) and / or the second printed circuit board (420).

[0150] FIG. 9A and FIG. 9B are flow charts illustrating the operation of a processor of an exemplary electronic device.

[0151] The operations of FIGS. 9A and 9B may be performed by the electronic device (101) of FIGS. 5A and 5B. The electronic device (101) may further include a processor (e.g., the processor (120) of FIG. 1).

[0152] According to one embodiment, the processor (120) may be configured to identify contact between a first support member (e.g., the first support member (510) of FIG. 5A) and a second support member (e.g., the second support member (520) of FIG. 5A) via a first electrode (e.g., the first electrode (511) of FIG. 5A) and a second electrode (e.g., the second electrode (521) of FIG. 5A). For example, when the first support member (510) is in contact with the second support member (520), the first electrode (511) may be in contact with the second electrode (521). The above processor (120) may be configured to identify contact between the first support member (510) and the second support member (520) by detecting a change in voltage that occurs when the first electrode (511) and the second electrode (521) come into contact through an ADC port (e.g., the ADC port (840) of FIG. 8b).

[0153] In operation 901, the processor (120) may be configured to supply power to at least one electronic component around the first support member (510) and the second support member (520). For example, the processor (120) may be configured to supply power to at least a portion of the first set of electronic components (e.g., the first set of electronic components (450) of FIG. 5A) around the first support member (510). For example, the processor (120) may be configured to supply power to at least a portion of the second set of electronic components (e.g., the second set of electronic components (460) of FIG. 5A) around the second support member (520).

[0154] In operation 903, the processor (120) may be configured to identify whether the first support member (510) and the second support member (520) are in contact through the first electrode (511) and the second electrode (521). For example, the processor (120) may detect a change in voltage generated by the contact between the first electrode (511) and the second electrode (521) through at least one break detection circuit (e.g., at least one break detection circuit (830) of FIG. 8B) and an ADC port (840). The processor (120) may be configured to identify whether the first support member (510) and the second support member (520) are in contact through the change in voltage.

[0155] Referring to FIG. 9A, in operation 905, the processor (120) may bypass supplying power to at least one electronic component around the first support member (510) and the second support member (520) in response to contact between the first support member (510) and the second support member (520) identified through contact between the first electrode (511) and the second electrode (521). For example, due to an external impact, the first support member (510) may come into contact with the second support member (520). The processor (120) may bypass supplying power to at least one electronic component around the first support member (510) and the second support member (520) based on identifying the contact between the first support member (510) and the second support member (520), thereby reducing malfunction of the at least one electronic component.

[0156] Referring to FIG. 9B, in operation 907, the processor (120) may be configured to identify a contact time (t) between the first support member (510) and the second support member (520). For example, the processor (120) may identify a time at which a voltage changes through the ADC port (840) during contact between the first electrode (511) and the second electrode (521).

[0157] In operation 909, the processor (120) may be configured to identify whether the contact time (t) of the first support member (510) and the second support member (520) is less than the reference time (t1). For example, the processor (120) may identify whether the time for which the voltage changes through the ADC port (840) while the first electrode (511) and the second electrode (521) are in contact is less than the reference time (t1).

[0158] In operation 911, the processor (120) may be configured to bypass powering at least one electronic component around the first support member (510) and the second support member (520) in response to identifying a contact time (t) of the first support member (510) and the second support member (520) that is less than a reference time (t1). For example, due to an external impact, the first support member (510) and the second support member (520) may come into temporary contact. While the first support member (510) and the second support member (520) are in contact for a contact time (t) that is less than a reference time (t1), the processor (120) may bypass powering at least one electronic component around the first support member (510) and the second support member (520). The processor (120) may be configured to supply power to the at least one electronic component while the first support member (510) and the second support member (520) are spaced apart.

[0159] In operation 913, the processor (120) may be configured to cut off power supply to at least one electronic component around the first support member (510) and the second support member (520) in response to identifying a contact time (t) greater than or equal to the reference time (t1). For example, at least a portion of the first printed circuit board (410) and / or the second printed circuit board (420) may be plastically deformed due to an external impact. The first support member (510) and the second support member (520) may be in contact for a contact time (t) greater than or equal to the reference time (t1) due to plastic deformation of the first printed circuit board (410) and / or the second printed circuit board (420). The processor (120) is configured to block power supply to at least one electronic component around the first support member (510) and the second support member (520) when the first support member (510) and the second support member (520) have a contact time (t) longer than the reference time (t1), thereby reducing damage to the electronic device (101) caused by the at least one electronic component.

[0160] According to the above-described embodiment, the processor (120) of the electronic device (101) is configured to identify contact between the first support member (510) and the second support member (520), thereby reducing malfunction of at least one electronic component around the first support member (510) and the second support member (520). The processor (120) is configured to identify contact time between the first support member (510) and the second support member (520), thereby reducing damage to the at least one electronic component and / or the electronic device (101) caused by the at least one electronic component.

[0161] Figure 10 is a flowchart illustrating the operation of a processor of an exemplary electronic device.

[0162] The operations of FIG. 10 may be performed by the electronic device (101) of FIGS. 5A and 5B. The electronic device (101) may further include a processor (e.g., the processor (120) of FIG. 1). Operation 1003 of FIG. 10 may correspond to operation 903 of FIGS. 9A and 9B, respectively. According to one embodiment, the electronic device (101) may further include a display (e.g., the display (201) of FIG. 2). The display (201) may be configured to provide visual information to a user.

[0163] In operation 1001, the processor (120) may be configured to supply power to the electronic device (101). For example, the processor (120) may supply power to the electronic device (101) via a power management module (e.g., power management module (188) of FIG. 1) and / or a battery (e.g., battery (189) of FIG. 1) of the electronic device (101).

[0164] In operation 1005, the processor (120) may be configured to store data related to the first printed circuit board (e.g., the first printed circuit board (410) of FIG. 4A) or the second printed circuit board (e.g., the second printed circuit board (420) of FIG. 4A) within the electronic device (101) in response to identifying contact between the first support member (e.g., the first support member (510) of FIG. 5A) and the second support member (e.g., the second support member (520) of FIG. 5A). For example, the processor (120) may store information related to damage of the first printed circuit board (410) and / or the second printed circuit board (420) within the electronic device (101) through the contact time (t) between the first support member (510) and the second support member (520). For example, the processor (120) may store information related to damage of the first printed circuit board (410) and / or the second printed circuit board (420) in the electronic device (101) through the amount of change in voltage identified through contact between the first electrode (e.g., the first electrode (511) of FIG. 5A) and the second electrode (e.g., the second electrode (521) of FIG. 5A). For example, the processor (120) may store data related to the first printed circuit board (410) or the second printed circuit board (420) in the memory (e.g., the memory (130) of FIG. 1) of the electronic device (101) in response to identifying contact between the first support member (510) and the second support member (520), but is not limited thereto. The processor (120) may be configured to store the information in a server (e.g., server (108) of FIG. 1) and / or another electronic device (e.g., electronic device (102), electronic device (104) of FIG. 1). For example, the electronic device (101) may provide a breakage history of the electronic device (101) based on the stored data related to the first printed circuit board (410) or the second printed circuit board (420).

[0165] In operation 1007, the processor (120) may be configured to identify whether data related to the first printed circuit board (410) or the second printed circuit board (420) exceeds a reference value (a). For example, the processor (120) may identify whether data related to damage to the first printed circuit board (410) and / or the second printed circuit board (420) exceeds the reference value (a) through a change in voltage identified through contact between the first electrode (511) and the second electrode (521). The processor (120) may be configured to store the data in the electronic device (101) based on the data being less than or equal to the reference value (a).

[0166] In operation 1009, the processor (120) may be configured to indicate through the display (201) that at least a portion of the first printed circuit board (410) and the second printed circuit board (420) is damaged based on data related to the first printed circuit board (410) or the second printed circuit board (420) exceeding a threshold value (a). For example, at least a portion of the data related to damage to the first printed circuit board (410) or the second printed circuit board (420) may exceed the threshold value (a). The processor (120) may notify the user through the display (201) that at least a portion of the first printed circuit board (410) and the second printed circuit board (420) is damaged based on at least a portion of the data exceeding the threshold value (a). However, without being limited thereto, the processor (120) may, based on at least some of the data exceeding the reference value (a), notify the user that at least some of the first printed circuit board (410) or the second printed circuit board (420) is damaged through an audio output module (e.g., the audio output module (155) of FIG. 1) and / or a speaker module (not shown).

[0167] According to the above-described embodiment, the electronic device (101) is configured to store data related to the first printed circuit board (410) and the second printed circuit board (420), thereby providing various user experiences to the user of the electronic device (101). The processor (120) of the electronic device (101) is configured to display through the display (201) that at least a portion of the first printed circuit board (410) and the second printed circuit board (420) is damaged, thereby reducing damage to the electronic device (101).

[0168] According to the above-described embodiment, an electronic device (e.g., an electronic device (101) of FIG. 1) may include a first printed circuit board (e.g., a first printed circuit board (410) of FIG. 4A). The electronic device may include a second printed circuit board (e.g., a second printed circuit board (420) of FIG. 4A) facing the first printed circuit board and disposed on the first printed circuit board. The electronic device may include a first support member (e.g., a first support member (510) of FIG. 5A) disposed on a first surface of the first printed circuit board facing the second printed circuit board (e.g., a first surface (411) of FIG. 4A). The electronic device may include a second support member (e.g., a second support member (520) of FIG. 5A) disposed on a second surface of the second printed circuit board facing the first printed circuit board (e.g., a second surface (421) of FIG. 4A), and spaced apart from the first support member and facing the first support member so as to be contactable with the first support member. The electronic device may include an interposer (e.g., an interposer (430) of FIG. 4A) between the first printed circuit board and the second printed circuit board, which surrounds a space between the first surface and the second surface. According to the above-mentioned embodiment, the electronic device may reduce damage to the first printed circuit board and the second printed circuit board by including the first support member and the second support member. The above-mentioned embodiment may have various effects including the above-mentioned effects.

[0169] According to one embodiment, the first support member may at least partially overlap the second support member when the first surface is viewed from above. According to the above-mentioned embodiment, the first support member may overlap the second support member, thereby reducing damage to the first printed circuit board and the second printed circuit board. The above-mentioned embodiment may have various effects, including the effects mentioned above.

[0170] An electronic device according to one embodiment may further include a first set of electronic components (e.g., the first set of electronic components 450 of FIG. 4B ) disposed on the first surface, and a second set of electronic components (e.g., the second set of electronic components 460 of FIG. 4B ) disposed on the second surface. A length of the first support member extending from the first surface toward the second surface (e.g., the length (d1) of FIG. 5A ) may be greater than a length of each of the first set of electronic components extending from the first surface toward the second surface. A length of the second support member extending from the second surface toward the first surface (e.g., the length (d2) of FIG. 5A ) may be greater than a length of each of the second set of electronic components extending from the second surface toward the first surface. According to the above-mentioned embodiment, the length of the first support member is greater than the length of each of the electronic components of the first set and the length of the second support member is greater than the length of each of the electronic components of the second set, so that the electronic device can reduce contact between the electronic components of the first set and the electronic components of the second set.

[0171] According to one embodiment, the first set of electronic components can be separated from the second set of electronic components while the electronic device changes from a first state in which the first support member and the second support member are separated to a second state in which the first support member and the second support member are in contact. According to the above-mentioned embodiment, the electronic device can separate the first set of electronic components from the second set of electronic components by including the first support member and the second support member.

[0172] An electronic device according to one embodiment may further include a third set of electronic components (e.g., the third set of electronic components (470) of FIG. 4A) disposed on at least a portion of a second surface (e.g., the second surface (421) of FIG. 4A) of the first printed circuit board opposite the first surface and a fourth surface (e.g., the fourth surface (422) of FIG. 4A) of the second printed circuit board opposite the second surface. The first support member and the second support member may be disposed at positions corresponding to at least some of the electronic components of the third set. According to the above-mentioned embodiment, the electronic device may reduce malfunctions of electronic components around the first support member and the second support member by including the first support member and the second support member disposed at positions corresponding to at least some of the electronic components of the third set.

[0173] According to one embodiment, the first support member may include a first electrode (e.g., the first electrode (511) of FIG. 5A). The second support member may include a second electrode (e.g., the second electrode (521) of FIG. 5A) configured to be in contact with the first electrode. According to the above-mentioned embodiment, the electronic device may be configured to identify contact between the first support member and the second support member by including the first electrode and the second electrode.

[0174] According to one embodiment, the first electrode may extend in a first direction within the first support member. The second electrode may extend in a second direction different from the first direction within the second support member. According to the above-mentioned embodiment, the first electrode may extend in a direction different from the direction in which the second electrode extends, thereby reducing damage to the first electrode and the second electrode due to contact with the second electrode.

[0175] According to one embodiment, each of the first support member and the second support member may be deformable. According to the above-mentioned embodiment, each of the first support member and the second support member may be deformable, thereby reducing damage to the first printed circuit board and the second printed circuit board.

[0176] According to one embodiment, the size of the first support member (e.g., size s1 of FIG. 6C) may be different from the size of the second support member (e.g., size s2 of FIG. 6C). According to the above-mentioned embodiment, the electronic device can reduce damage to the first printed circuit board and the second printed circuit board by having the size of the first support member be different from the size of the second support member.

[0177] An electronic device according to one embodiment may further include a third printed circuit board (e.g., the third printed circuit board (710) of FIG. 7) disposed between the first printed circuit board and the second printed circuit board and spaced apart from the first support member and the second support member. According to the above-mentioned embodiment, the electronic device may further include the third printed circuit board to provide additional space for electronic components within the electronic device.

[0178] An electronic device according to one embodiment may further include a processor (e.g., processor 120 of FIG. 1). The first support member may include a first electrode. The second support member may include a second electrode configured to be in contact with the first electrode. The processor may be configured to identify contact between the first support member and the second support member through contact between the first electrode and the second electrode. According to the above-mentioned embodiment, the processor may be configured to identify contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0179] In one embodiment, the processor may be configured to supply power to at least one electronic component around the first support member and the second support member while the first support member is spaced from the second support member. The processor may be configured to bypass or cut off the supply of power to the at least one electronic component in response to contact between the first support member and the second support member identified through contact between the first electrode and the second electrode. In accordance with the above-mentioned embodiment, the processor may be configured to identify contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0180] In one embodiment, the processor may be configured to identify a contact time between the first support member and the second support member through contact between the first electrode and the second electrode. The processor may be configured to bypass power supply to the at least one electronic component around the first support member and the second support member in response to identifying the contact time being less than a reference time. The processor may be configured to block power supply to the at least one electronic component in response to identifying the contact time being greater than or equal to the reference time. In accordance with the aforementioned embodiment, the processor may be configured to identify the contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0181] An electronic device according to one embodiment may further include a processor. The processor may be configured to identify contact between the first support member and the second support member. The processor may be configured to store data related to the first printed circuit board or the second printed circuit board within the electronic device in response to identifying contact between the first support member and the second support member. According to the above-mentioned embodiment, the processor may be configured to identify contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0182] In one embodiment, the processor may be configured to provide information to a user indicating that at least a portion of the first printed circuit board and the second printed circuit board are damaged, based on at least a portion of the data. In accordance with the aforementioned embodiment, the processor may be configured to identify contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0183] In one embodiment, an electronic device may include a first printed circuit board. The electronic device may include a second printed circuit board disposed on the first printed circuit board, facing the first printed circuit board. The electronic device may include a first support member disposed on a first side of the first printed circuit board facing the second printed circuit board. The electronic device may include a second support member disposed on a second side of the second printed circuit board facing the first printed circuit board, spaced apart from the first support member and facing the first support member so as to be contactable with the first support member. The electronic device may include a first set of electronic components disposed on the first side and a second set of electronic components disposed on the second side. The electronic device may include an interposer between the first printed circuit board and the second printed circuit board, the interposer surrounding a space between the first side and the second side. The sum of the length of the first support member extending from the first side toward the second side and the length of the second support member extending from the second side toward the first side may be greater than the sum of the length of one electronic component of the first set of electronic components extending from the first side toward the second side and the length of another electronic component of the second set of electronic components facing at least a portion of the one electronic component extending from the second side toward the first side. According to the above-mentioned embodiment, the electronic device can reduce damage to the first printed circuit board and the second printed circuit board by including the first support member and the second support member.

[0184] According to one embodiment, a length of the first support member extending from the first side toward the second side may be greater than a length of each of the first set of electronic components extending from the first side toward the second side. A length of the second support member extending from the second side toward the first side may be greater than a length of each of the second set of electronic components extending from the second side toward the first side. According to the above-mentioned embodiment, since the length of the first support member is greater than a length of each of the first set of electronic components and the length of the second support member is greater than a length of each of the second set of electronic components, the electronic device can reduce contact between the first set of electronic components and the second set of electronic components.

[0185] An electronic device according to one embodiment may further include a processor. The first support member may include a first electrode. The second support member may include a second electrode configured to be in contact with the first electrode. The processor may be configured to identify contact between the first support member and the second support member through contact between the first electrode and the second electrode. According to the above-mentioned embodiment, the processor may be configured to identify contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0186] In one embodiment, the processor may be configured to supply power to at least one electronic component around the first support member and the second support member while the first support member is spaced from the second support member. The processor may be configured to bypass or block supplying power to the at least one electronic component in response to contact between the first support member and the second support member identified through contact between the first electrode and the second electrode. In accordance with the aforementioned embodiment, the processor may be configured to identify contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0187] In one embodiment, the processor may be configured to identify a contact time between the first support member and the second support member through contact between the first electrode and the second electrode. The processor may be configured to bypass power supply to the at least one electronic component around the first support member and the second support member in response to identifying the contact time being less than a reference time. The processor may be configured to block power supply to the at least one electronic component in response to identifying the contact time being greater than or equal to the reference time. In accordance with the aforementioned embodiment, the processor may be configured to identify the contact between the first support member and the second support member, thereby providing a variety of user experiences to a user of the electronic device.

[0188] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, electronic devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0189] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another component (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0190] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0191] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0192] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as included in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0193] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (101), First printed circuit board (250; 410); A second printed circuit board (252; 420) facing the first printed circuit board (250; 410) and positioned on the first printed circuit board (250; 410); A first support member (510) arranged on a first surface (411) of the first printed circuit board (250; 410); A second support member (520) disposed on a second surface (421) of the second printed circuit board (252; 420), the second support member (520) facing the first printed circuit board (250; 410), spaced apart from the first support member (510), and configured to come into contact with the first support member (510) based on an external force applied to the electronic device (101); and An interposer (430) is included between the first printed circuit board (250; 410) and the second printed circuit board (252; 420) surrounding the area between the first surface (411) and the second surface (421). Electronic device (101).

2. In paragraph 1, The above first support member (510) is When the first surface (411) is viewed from above, it at least partially overlaps the second support member (520). Electronic device (101).

3. In paragraph 1 or 2, A first set of electronic components (450) arranged on the first surface (411); and Further comprising a second set of electronic components (460) arranged on the second surface (421); The first support member (510) and the first set of electronic components (450) extend from the first side (411) toward the second side (421), The second support member (520) and the second set of electronic components (460) extend from the second face (421) toward the first face (411), The length (d1) of the first support member (510) is greater than the length of each of the electronic components (450) of the first set, The length (d2) of the second support member (520) is greater than the length of each of the second set of electronic components (460). Electronic device (101).

4. In paragraph 3, The first set of electronic components (450) above, While the electronic device (101) changes from a first state in which the first support member (510) and the second support member (520) are spaced apart to a second state in which the electronic device (101) is in contact with the first support member (510) and the second support member (520), the second set of electronic components (460) are spaced apart. Electronic device (101).

5. In any one of paragraphs 1 to 4, Further comprising a third set of electronic components (470) arranged on at least a portion of a third side (412) opposite the first side (411) of the first printed circuit board (250; 410) and a fourth side (422) opposite the second side (421) of the second printed circuit board (252; 420); The first support member (510) and the second support member (520) are, Positioned at a position corresponding to at least some of the electronic components (470) of the third set, Electronic devices.

6. In any one of paragraphs 1 to 5, The above first support member (510) is Containing a first electrode (511), The above second support member (520) is Including a second electrode (521) configured to be in contact with the first electrode (511). Electronic device (101).

7. In paragraph 6, The above first electrode (511) is, Extending in the first direction within the first support member (510), The above second electrode (521) is, Extending in a second direction different from the first direction within the second support member (520), Electronic device (101).

8. In any one of paragraphs 1 to 7, Each of the first support member (510) and the second support member (520) Transformable, Electronic device (101).

9. In any one of paragraphs 1 to 8, The size (s1) of the first support member (510) is Different from the size (s2) of the second support member (520) above, Electronic device (101).

10. In any one of paragraphs 1 to 9, A third printed circuit board (710) disposed between the first printed circuit board (250; 410) and the second printed circuit board (252; 420) and spaced apart from the first support member (510) and the second support member (520); Electronic device (101).

11. In any one of paragraphs 1 to 10, at least one processor (120); and Contains one or more memories (130) for storing instructions, The above first support member (510) is including a first electrode (511); The above second support member (520) is A second electrode (521) configured to be in contact with the first electrode (511); The above instructions, when individually or collectively executed by the at least one processor (120), cause the electronic device (101) to identify that the first support member (510) and the second support member (520) are in contact with each other based on the contact between the first electrode (511) and the second electrode (521). Electronic device (101).

12. In paragraph 11, The above instructions, when individually or collectively executed by the at least one processor (120), cause the electronic device (101) to: While the first support member (510) is separated from the second support member (520), power is supplied to at least one electronic component around the first support member (510) and the second support member (520); and Further causing, in response to the contact between the first support member (510) and the second support member (520) identified through the contact between the first electrode (511) and the second electrode (521), to bypass or cut off the supply of power to the at least one electronic component. Electronic device (101).

13. In paragraph 12, The above instructions, when individually or collectively executed by the at least one processor (120), cause the electronic device (101) to: The contact time between the first support member (510) and the second support member (520) is identified through the contact between the first electrode (511) and the second electrode (521); In response to identifying said contact time being less than a reference time, bypassing powering said at least one electronic component around said first support member (510) and said second support member (520); and Further causing power to be cut off to said at least one electronic component in response to identifying said contact time being greater than said reference time, Electronic device (101).

14. In any one of paragraphs 1 to 13, at least one processor (120); and A memory (130) comprising one or more storage media storing instructions, said instructions, when individually or collectively executed by said at least one processor (120), cause said electronic device (101) to: Identifying the contact between the first support member (510) and the second support member (520); and In response to identifying contact between the first support member (510) and the second support member (520), causing data related to the first printed circuit board (250; 410) or the second printed circuit board (252; 420) to be stored within the electronic device (101). Electronic device (101).

15. In paragraph 14, The above instructions, when individually or collectively executed by the processor (120), further cause the electronic device (101) to provide information to a user indicating that at least a portion of the first printed circuit board (250; 410) and the second printed circuit board (252; 420) are damaged, based on at least a portion of the data. Electronic device (101).

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